JP6728606B2 - Electronic device housing - Google Patents

Description

The present invention relates to a housing (electronic device housing) containing electronic device parts, and a housing such as an attache case and a carry case.

In recent years, in order to reduce the thickness and weight of electronic devices, improve portability, and prevent damage to components inside the electronic devices, the housing is required to have high rigidity. Specifically, when an electronic device is gripped with one hand and operated with the other hand, a biased load is applied when the electronic device is transported or when a monitor or the like is opened or closed, so a force in the torsion direction acts on the housing. .. Also, when the electronic device is accidentally dropped during transportation, the force in the twisting direction similarly acts. Therefore, the housing is required to have high torsional rigidity. Against this background, many techniques for increasing the rigidity of the housing have been proposed.

Specifically, Patent Document 1 enhances the rigidity of a cabinet structure of an electric device including a resin lower case having upper and lower electric device mounting surfaces and an upper case having a front wall overlapping the upper electric device mounting surface. The invention is described. Patent Document 2 describes an invention that enhances the rigidity of the housing of an electronic device by making the housing of the electronic device a structure in which the surfaces of two plates are selectively stuck and joined. Patent Document 3 describes an invention in which the rigidity of the housing of the electronic device is increased by bringing the tips of the ribs formed on the inner surface of the first housing into contact with the inner surface of the second housing.

JP, 10-150280, A JP-A-8-288681 JP, 2011-22848, A

However, in the invention described in Patent Document 1, since the housing is made of the resin material, it is not possible to provide a housing having a torsional rigidity of a size required in the market. In the invention described in Patent Document 1, it may be possible to form the housing with a metal plate. However, in the invention described in Patent Document 1, only the upper electrical device mounting surface of the resin lower case and the front wall of the upper case overlap with each other, and the members are not restrained from each other. Therefore, the housing is formed of a metal plate. Even if it does, it is not possible to provide a housing having the torsional rigidity required in the market. Further, when the housing is formed of a metal plate, the weight of the housing increases, and it is not possible to meet the needs of the market in terms of lightness.

In addition, in the invention described in Patent Document 2, the rigidity of the housing of the electronic device is increased by joining the inner plate to the entire surface of the outer plate. However, since the heat pipe flow path is formed by the inner plate being stretch-formed and the thickness of the plate becomes thin, the torsional rigidity required for the housing cannot be satisfied. Further, joining the inner plate to the entire surface of the outer plate is not an effective method for improving rigidity from the viewpoint of weight reduction, and it is unlikely that the outer plate has sufficient torsional rigidity.

Further, in the invention described in Patent Document 3, the tips of the ribs are only in contact with the inner surface of the housing. Therefore, according to the invention described in Patent Document 3, when twist occurs due to a large load applied to the housing, the tips of the ribs slide relative to the inner surface of the housing, It can suppress only the torsional deformation of the size of.

As described above, according to the conventional techniques for increasing the rigidity of the housing, it is not possible to impart high torsional rigidity to the housing while realizing thinning and weight saving and improvement of portability. Therefore, it has been expected to provide a technique capable of imparting a high torsional rigidity to the housing while realizing a thin structure and a light weight.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a housing capable of improving torsional rigidity while achieving reduction in thickness and weight and improvement of portability.

A housing according to a first aspect of the present invention includes a top cover, a bottom cover that is provided upright toward the top cover, and has a standing wall portion whose peripheral edge is joined to the top cover, A reinforcing member having an opening, the reinforcing member being arranged in a space defined by the top cover and the bottom cover, wherein the reinforcing member is joined to the bottom cover. However, it is characterized by being formed of a material having a thickness of 0.3 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.

A housing according to a first aspect of the present invention is characterized in that, in the above-mentioned invention, the reinforcing member is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs including reinforcing fibers and a matrix resin. ..

A housing according to a second aspect of the present invention includes a top cover, a bottom cover that is provided upright toward the top cover, and has a standing wall portion whose peripheral portion is joined to the top cover, A reinforcing member having an opening, the reinforcing member being arranged in a space defined by the top cover and the bottom cover, wherein the reinforcing member is joined to the bottom cover. Is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs composed of reinforcing fibers and a matrix resin.

In the case according to the present invention, in the above invention, the bottom cover is formed of a material having a thickness within a range of 0.1 mm to 0.8 mm and an elastic modulus within a range of 20 GPa to 120 GPa. It is characterized by being.

The housing according to the present invention is characterized in that, in the above-mentioned invention, the bottom cover is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs composed of reinforcing fibers and a matrix resin.

In the housing according to the present invention, in the above invention, the reinforcing member is joined to the bottom cover by heat welding.

Housing according to the present invention, in the above invention, the reinforcing member may peel load 60N / cm ² or more at 23 ° C., it becomes 5000N / cm ² within the following range and the peeling force at 200 ° C. It is characterized in that it is bonded to the bottom cover so as to be in a range of less than 60 N/cm ² .

In the case according to the present invention, in the above invention, the reinforcing member and the bottom cover are directly joined.

In the case according to the present invention, in the above invention, the projected area of the reinforcing member in the direction of the bottom cover or the top cover joined to the reinforcing member is the bottom surface to which the reinforcing member is joined. It is characterized in being in a range of 60% or more and 95% or less of the area of the cover or the top cover.

In the housing according to the present invention, in the above invention, the volume of the hollow structure formed by joining the reinforcing member to the bottom cover or the top cover is 55% or more and 95% or less of the volume of the space. It is characterized by being in the range of.

In the housing according to the present invention, in the above invention, in the hollow structure formed by joining the reinforcing member and the bottom cover or the top cover, the heat generating member is a surface of the reinforcing member on the hollow structure side. It is characterized by being arranged in.

According to the housing of the present invention, it is possible to improve the torsional rigidity while achieving a reduction in thickness and weight and an improvement in portability.

FIG. 1 is a perspective view showing a configuration of a housing which is an embodiment of the present invention. FIG. 2 is an exploded perspective view of the housing shown in FIG. FIG. 3 is a cross-sectional view showing an example of the configuration of the reinforcing member. FIG. 4 is a cross-sectional view showing an example of the configuration of the reinforcing member shown in FIG. FIG. 5 is a cross-sectional view showing an example of the configuration of the reinforcing member shown in FIG. FIG. 6 is a cross-sectional view showing an example of the configuration of the housing. FIG. 7 is a plan view and a cross-sectional view showing the configuration of another reinforcing member. FIG. 8 is a schematic diagram for explaining the method of the torsional rigidity test. FIG. 9 is a schematic diagram for explaining the method of the flexural rigidity test. FIG. 10 is a schematic diagram for explaining a peeling load test method. FIG. 11 is a schematic view showing the structure of the laminated body. FIG. 12 is a schematic diagram for explaining the press molding method. FIG. 13 is a schematic diagram for explaining the press molding method. FIG. 14 is a schematic diagram for explaining the method for manufacturing the housing. FIG. 15 is a cross-sectional view for explaining that the reinforcing member is heat-welded to the bottom cover of the tenth embodiment using the joining jig.

Hereinafter, with reference to FIGS. 1 to 7, a housing according to a first embodiment of the present invention will be described. The housing of the present invention may be used in attaché cases, carry cases, electronic equipment housings containing electronic equipment parts, and more specifically, speakers, displays, HDDs, laptop computers, mobile phones. , Digital still cameras, PDAs, plasma displays, televisions, lighting, refrigerators, and game machines. Among them, preferred are clamshell type personal computers and tablet type personal computers, which require high torsional rigidity and are lightweight and thin. Used.

FIG. 1 is a perspective view showing a configuration of a housing which is a first embodiment of the present invention. As shown in FIG. 1, a housing 1 according to a first embodiment of the present invention includes a bottom cover 2 having a rectangular shape in plan view, a reinforcing member 3 joined to the bottom cover 2 and having an opening, and a plan view. The top cover 4 having a rectangular shape is provided as a main component. In the following, the direction parallel to the short sides of the bottom cover 2 and the top cover 4 is the x direction, the direction parallel to the long sides of the bottom cover 2 and the top cover 4 is the y direction, and the direction perpendicular to the x direction and the y direction. This direction is defined as the z direction (vertical direction).

FIG. 2 is an exploded perspective view of the housing 1 shown in FIG. As shown in FIG. 2, the bottom cover 2 includes a flat surface portion 21 that is parallel to the xy plane and has a rectangular shape in plan view, and a standing wall portion 22 that is erected from the peripheral edge portion of the flat surface portion 21 in the +z direction. I have it. The thickness of the member forming the bottom cover 2 is preferably in the range of 0.1 mm or more and 0.8 mm or less. The elastic modulus of the member forming the bottom cover 2 is preferably in the range of 20 GPa or more and 120 GPa or less.

Further, the bottom cover 2 is preferably formed of either a metal material or a fiber-reinforced composite material, and may be formed by combining these. From the viewpoint of exhibiting high torsional rigidity, it is desirable that the bottom cover 2 be a seamless member made of the same material. From the viewpoint of productivity, the flat portion 21 having a simple shape is formed by using a metal material or a fiber reinforced composite material having high mechanical characteristics, and the standing wall portion 22 having a complicated shape and the joint portion are excellent in formability. The resin material may be formed by injection molding or the like.

As the metal material, it is desirable to use a light metal material such as an aluminum alloy, a magnesium alloy, or a titanium alloy. As the aluminum alloy, Al-Cu-based A2017, A2024, Al-Mn-based A3003, A3004, Al-Si-based A4032, Al-Mg-based A5005, A5052, A5083, Al-Mg-Si-based A6061, A6063, Al-Zn-based A7075 and the like can be exemplified. Examples of the magnesium alloy include Mg—Al—Zn-based AZ31, AZ61, and AZ91. As the titanium alloy, Ti corresponding to 11 to 23 kinds of alloys added with palladium or alloys added with cobalt and palladium, 50 kinds (α alloy), 60 kinds (α-β alloy), and 80 kinds (β alloy) -6Al-4V etc. can be illustrated.

Fibers such as carbon fiber, glass fiber, aramid fiber, boron fiber, PBO fiber, high-strength polyethylene fiber, alumina fiber, and silicon carbide fiber can be used as the reinforcing fiber used in the fiber-reinforced composite material. Two or more kinds may be mixed and used. These reinforcing fibers can be used as fiber structures such as long fibers aligned in one direction, single tows, woven fabrics, knits, non-woven fabrics, mats and braids.

Examples of the matrix resin include thermosetting resins such as epoxy resin, phenol resin, benzoxazine resin, and unsaturated polyester resin, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene na Polyester resin such as phthalate and liquid crystal polyester, polyolefin such as polyethylene (PE), polypropylene (PP) and polybutylene, styrene resin and urethane resin, polyoxymethylene (POM), polyamide (PA), polycarbonate (PC), polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified PPE, polyimide (PI), polyamideimide (PAI), polyetherimide (PEI) , Polysulfone (PSU), modified PSU, polyethersulfone (PES), polyketone (PK), polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), polyarylate (PAR), Thermosetting resins such as polyether nitrile (PEN), phenolic resins, and phenoxy resins can be used. From the viewpoint of productivity and mechanical properties, it is desirable to use a thermosetting resin, and above all, it is desirable to use an epoxy resin. From the viewpoint of moldability, it is preferable to use a thermoplastic resin, among them, a polyamide resin from the viewpoint of strength, a polycarbonate resin from the viewpoint of impact resistance, a polypropylene resin from the viewpoint of lightness, and a heat resistance viewpoint. It is desirable to use a polyphenylene sulfide resin. Further, the resin may be used not only as a matrix resin of the fiber reinforced composite material but also as a bottom cover, a top cover or a reinforcing member made of the resin itself.

In the present invention, it is desirable to use the prepreg composed of the reinforcing fiber and the matrix resin as a material for each member from the viewpoint of handleability such as lamination. It is desirable to use a unidirectional continuous fiber prepreg from the viewpoint of high mechanical properties and design flexibility, and it is desirable to use a woven prepreg from the viewpoint of isotropic mechanical properties and formability. Further, it may be constituted by a laminated body of these prepregs.

The reinforcing member 3 has an opening. Specifically, the reinforcing member 3 includes a flat surface portion 31 that is parallel to the xy plane and has a rectangular shape in plan view, and a standing wall portion 32 that is erected from the peripheral portion of the flat surface portion 31 in the −z direction. ing. Electronic devices may be mounted on the surface of the flat surface portion 31 of the bottom cover 2 that faces the flat surface portion 21. The reinforcing member 3 is joined to the bottom cover 2 in a state where the hollow structure S1 is formed between the flat portion 31 and the flat portion 21 of the bottom cover 2 by joining the flat portion 21 of the bottom cover 2. The “reinforcing member having an opening” here refers to a shape having an opening in a part of the reinforcing member, and includes a flat surface portion and a standing wall portion as shown in FIGS. 3(a) and 3(b). A member having a surface connecting them or a member having a curved surface may be used. Further, an example of the reinforcing member having an opening is, as shown in FIG. 3C, a flat surface portion, a standing wall portion standing on the peripheral portion of the flat surface portion, and a joint portion extending from the peripheral portion of the standing wall portion. Or a reinforcing member having a curved surface portion and a joint portion extending from a peripheral portion of the curved surface portion.

The bonding area on a plane parallel to the xy plane is preferably in the range of 10 cm ² or more and 100 cm ² or less. Specifically, when the joint area is less than 10 cm ² , and when a load accompanied by a large deformation is applied to the housing 1, the reinforcing member 3 is peeled from the bottom cover 2, and the original torsional rigidity cannot be exhibited. On the other hand, when the joint area is larger than 100 cm ^2, problems such as an increase in the weight of the housing 1 and a decrease in the volume of the hollow structure S1 occur as the joint area increases. Therefore, it is desirable that the bonding area be within a range of 10 cm ² or more and 100 cm ² or less.

The maximum value of the distance (height of the reinforcing member 3 from the flat surface portion 21) h between the flat surface portion 31 of the reinforcing member 3 and the flat surface portion 21 of the bottom cover 2 is in the range of 3 mm or more and 30 mm or less. Is desirable. In the present invention, the height h of the reinforcing member 3 is one of the factors that exert torsional rigidity. Therefore, when the maximum value of the distance h is less than 3 mm, the effect of the standing wall portion 32 in the housing 1 is small, and the original torsional rigidity cannot be exhibited. On the other hand, when the maximum value of the distance h is longer than 30 mm, it is necessary to increase the thickness of the standing wall portion 32, resulting in a problem that the weight of the housing 1 increases. Therefore, it is desirable that the maximum value of the distance h is within the range of 3 mm or more and 30 mm or less.

4 and 5 are cross-sectional views showing an example of the configuration of the reinforcing member 3 shown in FIG. As shown in FIG. 4A, the joint portion 33 may be provided so as to extend from the peripheral edge portion of the standing wall portion 32 in the outward direction parallel to the xy plane. Further, as shown in FIG. 4B, the joint portion 33 may be provided so as to extend from the peripheral edge portion of the standing wall portion 32 in an inward direction parallel to the xy plane. Further, as shown in FIGS. 5A and 5B, the angle α of the standing wall portion 32 with respect to the flat surface portion 21 of the bottom cover 2 (or the joint portion 33 of the reinforcing member 3) is 45° or more and 135° or less. It is desirable to be within the range. 5A shows a state in which the angle α of the standing wall portion 32 is an acute angle, and FIG. 5B shows a state in which the angle α of the standing wall portion 32 is an obtuse angle.

FIG. 6 is a cross-sectional view showing an example of the configuration of the housing. As shown in FIGS. 6A and 6B, the heat generating members D1 and D2 are arranged in a hollow structure S1 formed by joining the reinforcing member 3 and the bottom cover 2 or the top cover 4. .. The heat generating members D1 and D2 are preferably arranged on the surface of the reinforcing member 3 on the hollow structure S1 side. With such a configuration, the distance between the bottom cover 2 and the heat generating members D1 and D2 that the user of the electronic device touches can be increased, and the temperature rise of the bottom cover 2 can be suppressed. In the present specification, the "heat generating member" means a component that generates heat with the operation of the electronic device, and particularly refers to a member that causes a temperature increase of 10°C or more with the operation of the electronic device. Examples of such a heat generating member include an LED, a capacitor, an inverter, a reactor element, a thermistor element, a power transistor element, a motor, a CPU, and an electronic board on which these are mounted.

The flexural rigidity may be increased by disposing another reinforcing member in the hollow structure S1 formed between the flat surface portion 31 of the reinforcing member 3 and the flat surface portion 21 of the bottom cover 2. FIG. 7A is a plan view showing the configuration of another reinforcing member, and FIG. 7B is a sectional view taken along the line AA of FIG. 7A. As shown in FIGS. 7A and 7B, another reinforcing member 5 is a member arranged so as to extend in the x direction at the central portion in the y direction of the hollow structure S1, and is a flat surface portion of the bottom cover 2. 21 and the flat surface portion 31 of the reinforcing member 3. By integrating the flat surface portion 21 of the bottom surface cover 2 and the flat surface portion 31 of the reinforcing member 3 via another reinforcing member 5, the bottom surface cover 2 and the reinforcing member 3 are deformed in synchronization when a load is applied. Therefore, the flexural rigidity of the housing 1 can be improved. In addition, the standing wall portion 22 of the bottom cover 2 and the standing wall portion 32 of the reinforcing member 3 are integrated with another reinforcing member 5, so that the standing wall portions of the bottom cover 2 and the reinforcing member 3 are particularly the housing 1. It becomes difficult to deform inward, and the torsional rigidity of the housing 1 can be improved.

Note that another reinforcing member 5 is arranged so as to extend in the y direction at the central portion in the x direction of the hollow structure S1 as long as it is connected to the flat portion 21 of the bottom cover 2 and the flat portion 31 of the reinforcing member 3. Alternatively, the member may be a member arranged so as to extend in a diagonal direction of the hollow structure S1. Particularly, the other reinforcing member 5 is preferably arranged so as to pass through a position where the amount of deflection of the flat surface portion 21 of the bottom surface cover 2 increases when a load is applied in the thickness direction, and the arranged member is arranged. May be arranged in plurality and the members may intersect with each other. Further, it is desirable that the other reinforcing member 5 is formed of a shock absorbing material having excellent elasticity such as a resin material having an elastomer or a rubber component, a gel, and the like, so that not only the flexural rigidity but also the shock can be obtained. On the contrary, the effect can be exhibited.

In the present embodiment, the standing wall portion 32 may be omitted by forming the flat portion 31 into a curved member. In addition, an uneven shape may be formed on the plane portion 31 from the viewpoint of increasing rigidity and effectively utilizing the space. In the present embodiment, the reinforcing member 3 is joined to the bottom cover 2, but the reinforcing member 3 is joined to the top cover 4, and the space between the flat surface portion 31 of the reinforcing member 3 and the top cover 4 is reduced. Alternatively, the hollow structure S1 may be formed.

In the present embodiment, the joint portions 33 are formed on all of the four standing wall portions 32 formed on each side of the plane portion 31, but the joint portions 33 are formed on at least one of the four standing wall portions 32. Should be formed. Further, among the four standing wall portions 32, the joining portion 33 may be formed on two or more adjacent standing wall portions 32. Further, the area of the joint portion 33 formed on one standing wall portion 32 is preferably 1 cm ² or more. Further, the thickness of the member forming the reinforcing member 3 is within the range of 0.3 mm or more and 1.0 mm or less from the viewpoint of weight reduction and thickness reduction of the housing. The elastic modulus of the member forming the reinforcing member 3 is in the range of 20 GPa or more and 120 GPa or less.

The reinforcing member 3 is preferably made of any one of the above-mentioned metal material and fiber-reinforced composite material, and the material can be selected according to the purpose of the reinforcing member 3. That is, from the viewpoint of exhibiting a high reinforcing effect, it is preferable to use a metal material or a fiber-reinforced composite material having a high elastic modulus, and from the viewpoint of heat dissipation, it is preferable to use a metal material having a high thermal conductivity and radio wave permeability. From the viewpoint of expressing (antenna property), it is preferable to use a resin or glass fiber reinforced composite material which is a non-conductive material, and from the viewpoint of expressing electromagnetic wave shielding property (radio wave shielding property), a metal which is a conductive material is used. A material or a carbon fiber composite material may be used. Furthermore, when the reinforcing member 3 is formed of a fiber-reinforced composite material, it is desirable that the reinforcing member 3 be formed of a laminated body of continuous fiber prepregs. Further, it is desirable that the ratio of the linear expansion coefficient of the reinforcing member 3 to the linear expansion coefficient of the bottom cover 2 to which the reinforcing member 3 is joined is within a range of 0.1 or more and 10 or less.

Further, it is desirable that the reinforcing member 3 be joined to the flat surface portion 21 of the bottom cover 2 by heat welding. 23 peel load at ℃ is 60N / cm ² or more, it is desirable in the 5000N / cm ² within the range, 100 N / cm ² or more, and more preferably in the 5000N / cm ² within the following ranges. Examples of the heat welding method include an insert injection method, an outsert injection method, a vibration welding method, an ultrasonic welding method, a laser welding method, and a hot plate welding method. Further, in this case, it is desirable that the peeling load at 200° C. of the bonding surface between the reinforcing member 3 and the flat portion 21 is less than 60 N/cm ² . The peeling load at 200° C. is more preferably 30 N/cm ² or less.

Further, the peeling load is preferably less than 60 N/cm ^{2 at} 180° C., and it is preferable from the viewpoint of disassembling adhesion that the peeling load can be easily peeled off in a lower temperature region. However, when the temperature for disassembling becomes low, the reinforcing member may peel off when used as a housing due to a temperature rise accompanying the operation of electronic components and the temperature of the usage environment. Therefore, it is desirable that the reinforcing member is bonded with high adhesive strength in the temperature range where the housing is used, and that the reinforcing member can be easily peeled off in the temperature range where the case is disassembled. Therefore, the peeling load at 80 ℃ 60N / cm ² or more, and more preferably in the 5000N / cm ² within the following ranges.

The peeling load at 200°C is preferably as low as possible, and most preferably 10 N/cm ² or less. The preferred because the lower limit as low peel force at 200 ° C. is not particularly limited, but is preferably 0N / cm ² or more, because sometimes inferior in handling properties too low, with 1N / cm ² or more More preferably. With such a configuration, it becomes possible to exhibit disassembly adhesiveness with which the reinforcing member 3 can be easily removed, and the repair and recycling of the electronic device can be facilitated. Further, the reinforcing member 3 and the bottom cover 2 to which the reinforcing member 3 is joined are formed of a fiber reinforced composite material, and a thermoplastic resin is provided on at least one joining portion of the reinforcing member 3 and the bottom cover 2, and the reinforcing member 3 It is desirable that the bottom cover 2 and the bottom cover 2 are joined together via a thermoplastic resin.

As a method of providing a thermoplastic resin at the joint portion, a reinforcing member 3 and a bottom cover 2 to which the reinforcing member 3 is joined by using a fiber reinforced sheet (prepregoo sheet) using a thermoplastic resin as a matrix resin or a ceiling A method of molding the surface cover 4 may be used. If the molded product obtained by this method has a high proportion of the thermoplastic resin on the surface, it is possible to have a wide bonding area at the time of bonding, and the degree of freedom in selecting the bonding location becomes high. preferable. From the viewpoint of mechanical properties of each member, a fiber-reinforced composite material using a thermosetting resin as a matrix resin is preferable, and as a method for providing a thermoplastic resin to such a member, heating the thermoplastic resin is used. Examples of the method include applying a melted product obtained by melting the resin or a solution of a thermoplastic resin dissolved in a solvent to provide the thermoplastic resin on the fiber-reinforced composite material. When molding and curing a fiber reinforced sheet (prepreg sheet) using a thermosetting resin as a matrix resin, a film or nonwoven fabric made of a thermoplastic resin is laminated on the surface as the outermost layer of the fiber reinforced sheet (prepreg sheet). A method of heating and pressure molding the laminated body can be exemplified.

Further, it is desirable that the reinforcing member 3 and the bottom cover 2 or the top cover 4 be directly joined. By using the fiber-reinforced composite material having the thermoplastic resin at the joint portion of the reinforcing member 3 and/or the bottom cover 2 or the top cover 4 that is adhered to the reinforcing member 3, there is no need to use an adhesive other than each member, Since it becomes possible to directly join the respective members, it is possible to suppress an increase in weight of the housing 1. A suitable method for directly joining the reinforcing member 3 and the bottom cover 2 or the top cover 4 is to use a thermoplastic resin as the outermost layer of a fiber reinforced sheet (prepreg sheet) using a thermosetting resin as a matrix resin. This is a method of using a laminate in which a film or a nonwoven fabric is laminated on the surface, and the thermoplastic resin used here can be selected from the group of thermoplastic resins exemplified as the matrix resin.

Preferably, it is preferable to select a thermoplastic resin having a melting point lower than the molding temperature for molding and curing a fiber reinforced sheet (prepreg sheet) in which the matrix resin is a thermosetting resin. Although the lower limit of the melting point of the thermoplastic resin is not particularly limited, it is preferably 80° C. or higher, more preferably 100° C. or higher, from the viewpoint of exhibiting heat resistance when the housing of the present invention is applied to an electronic device. The form of the thermoplastic resin is not particularly limited, and examples thereof include films, continuous fibers, woven fabrics, particles, and non-woven fabrics, but from the viewpoint of handleability during molding work, the form of the film or non-woven fabric is preferred. .. By selecting such a resin, the thermoplastic resin is melted at the time of molding, and the thermoplastic resin is formed on the surface of the molded product so as to spread like a film. It becomes possible to impregnate the reinforcing fibers to form a strong thermoplastic resin layer and to exhibit high peeling strength. At least one of the reinforcing member 3 and the bottom cover 2 or the top cover 4 joined with the reinforcing member 3 obtained by these methods may be used, but a thermoplastic resin is provided in both joining members of the joined members. Is preferred. Further, it is desirable that the thermoplastic resins to be provided are selected from substantially the same thermoplastic resins.

In the present specification, “disassembly adhesiveness” includes not only the fact that the reinforcing member 3 can be easily removed but also the fact that the reinforcement member 3 can be re-adhered. For this purpose, a thermoplastic resin may be added, but it is preferable that the resin can be re-bonded without increasing the weight of the thermoplastic resin. Further, the peeling load upon re-bonding is preferably 50% or more of the original peeling load, and more preferably 70% or more. The dismantling adhesive of the present invention joins the characteristics of thermoplastic resin, that is, the point that the resin is melted by heating and the mechanical characteristics are lowered, and the characteristic that the resin exhibits high original mechanical characteristics when it is solidified at cooling or at room temperature. This was achieved by adapting the technology.

Further, the flat portion 31 and the standing wall portion 32 of the reinforcing member 3 can be provided with an opening portion in the range where the torsional rigidity of the present invention is improved. With such a structure, it corresponds to an electronic component or a top cover 4 arranged in a space other than the hollow structure S1 partitioned by the electronic component built in the hollow structure S1, the bottom cover 2 and the top cover 4. It becomes possible to arrange a wiring cable for connecting to a display, a keyboard and the like. From the viewpoint of heat dissipation, it is preferable that the openings are arranged to improve the flow of air, for example, the standing walls 32 facing each other. These openings are preferably 30% or less of the surface area of the reinforcing member 3, and more preferably 15% or less from the viewpoint of torsional rigidity.

The top cover 4 is joined to the peripheral portion of the standing wall portion 22 of the bottom cover 2. In FIG. 1, the top cover 4 has a smooth plate shape, but it may have a curved surface or a plate shape having irregularities. The top cover 4 may be made of the same material and have the same shape as the bottom cover 2, and even if the reinforcing member 3 is partitioned by the bottom cover 2 and the top cover 4, a plurality of reinforcing members 3 are arranged and joined in the space. Of course, with such a configuration, it is possible to obtain the housing 1 having high rigidity on both surfaces. Moreover, the top cover 4 may be an electronic device component such as a liquid crystal display or a keyboard, and by adopting such a configuration, it can be applied to a laptop computer or a tablet computer.

As is apparent from the above description, the housing 1 according to the first embodiment of the present invention is provided with the top cover 4 and the top cover 4 upright, and the peripheral edge portion is joined to the top cover 4. The reinforcing member 3 is provided with a bottom cover 2 having a standing wall portion 21 formed therein, and a reinforcing member 3 having an opening arranged in a space S1 defined by the top cover 4 and the bottom cover 2. A material joined to the bottom cover 2, in which the reinforcing member 3 has a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less. It is characterized by being formed by. As a result, it is possible to improve the torsional rigidity and the flexural rigidity while achieving a reduction in thickness and weight and an improvement in portability.

In addition, the housing 1 according to the second embodiment of the present invention includes a top cover 4 and a standing wall portion 21 that is provided upright toward the top cover 4 and has a peripheral edge portion joined to the top cover 4. The bottom cover 2 is provided, and the reinforcing member 3 having an opening, which is arranged in the space S1 defined by the top cover 4 and the bottom cover 2, is provided, and the reinforcing member 3 is joined to the bottom cover 2. In the housing, the reinforcing member 3 is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs composed of reinforcing fibers and a matrix resin. As a result, it is possible to improve the torsional rigidity and the flexural rigidity while achieving a reduction in thickness and weight and an improvement in portability.

The hollow member S1 may be formed by forming the reinforcing member 3 with a member having an opening and joining the reinforcing member 3 to the bottom cover 2 or the top cover 4. In this case, the projected area of the reinforcing member 3 in the direction of the bottom cover 2 or the top cover 4 to which the reinforcing member 3 is joined is the projected area of the bottom cover 2 or the top cover 4 to which the reinforcing member 3 is joined. It is desirable that the range of 60% or more and 95% or less is adjusted. The position of the reinforcing member 3 is not particularly limited, but it is preferable that the reinforcing member 3 is located at a uniform position from the center position of the bottom cover 2 or the top cover 4, and by adopting such a position, the x direction or the y direction. The torsional rigidity to the can is made isotropic. Further, from the viewpoint of effectively utilizing a space other than the hollow structure S1 among the spaces partitioned by the bottom cover 2 and the top cover 4, the reinforcing member 3 is provided on either the bottom cover 2 or the top cover 4. You may send it.

More specifically, when the projected area of the reinforcing member 3 is less than 60% of the area of the bottom cover 2 or the top cover 4 to which the reinforcing member 3 is joined, the standing wall, which is one of the factors that develop the torsional rigidity of the present invention. The part is formed at a position close to the center position of the bottom cover 2 or the top cover 4, which causes a problem that the original torsional rigidity cannot be expressed. On the other hand, when the projected area S of the reinforcing member 3 is larger than 95% of the area of the bottom surface cover 2 or the top surface cover 4 to which the reinforcing member 3 is joined, high torsional rigidity can be exhibited, but other than the hollow structure S1. Since the space is reduced, it becomes difficult to dispose electronic components and wiring for configuring an electronic device, and it becomes difficult to adapt as a housing. Therefore, the projected area in the direction of the bottom cover 2 or the top cover 4 to which the reinforcing member 3 is joined is 60% or more of the area of the bottom cover 2 or the top cover 4 to which the reinforcing member 3 is joined, It is desirable to be within the range of 95% or less.

At this time, the shape of the projection surface of the reinforcing member 3, that is, the shape of the flat surface portion 31 is not particularly limited, but may be a circular shape or a polygonal shape other than the rectangular shape, and from the viewpoint of exhibiting high flexural rigidity, the bottom cover 2 and/or the shape of the top cover 4 is preferred. Specifically, the shape of the projection surface of the reinforcing member 3 is preferably rectangular. Further, from the viewpoint of effectively utilizing the hollow structure S1 and the space other than the hollow structure S1, the shape of the projection surface of the reinforcing member 3 is preferably a shape that matches the shape of the electronic component to be loaded. Further, from the viewpoint of exhibiting isotropic rigidity with respect to any load, the shape of the projection surface of the reinforcing member 3 is preferably a shape symmetrical with respect to the x-direction and/or y-direction axes.

When the hollow member S1 is formed by joining the reinforcing member 3 to the bottom cover 2 or the top cover 4, the reinforcing member 3 is formed of a member having an opening, and the reinforcing member 3 of the bottom cover 2 is formed. The volume of the hollow structure S1 formed by is preferably 55% or more and 95% or less of the volume of the space defined by the bottom cover 2 and the top cover 4. More specifically, when the volume of the hollow structure S1 is less than 55% of the volume of the space defined by the bottom cover 2 and the top cover 4, the height of the standing wall portion, which is one of the factors that develops the torsional rigidity of the present invention. Is low and/or the projected area of the reinforcing member 3 is small, which causes a problem that the original torsional rigidity cannot be expressed. On the other hand, when the volume of the hollow structure S1 is larger than 95% of the volume of the space defined by the bottom cover 2 and the top cover 4, high torsional rigidity can be exhibited, but the space other than the hollow structure S1 is small. As a result, it becomes difficult to dispose electronic parts and wirings for constituting the electronic device, and it becomes difficult to adapt as a housing. Therefore, it is desirable that the volume of the hollow structure S1 be within a range of 55% or more and 95% or less of the volume of the space defined by the bottom cover 2 and the top cover 4.

Although the embodiments to which the invention made by the present inventors has been applied have been described above, the present invention is not limited to the description and the drawings that form part of the disclosure of the present invention according to the present embodiments. That is, all other embodiments, examples, operation techniques, and the like made by those skilled in the art based on this embodiment are included in the category of the present invention.

Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to the following examples.

<Evaluation/Measurement method>
(1) Torsional rigidity test As shown in FIG. 8A, one side of the housing 1 is fixed by a U-shaped fixing jig 100, and the other side opposite to the fixed one side is a supporting jig. After being fixed to the tester while being held by 101, as shown in FIG. 8( b ), the displacement amount of the housing 1 was measured when a load of 10 N was applied with the changing speed of the angle θ of 1°/min. The measured value was used as the torsional rigidity value of the housing.

(2) Flexural Rigidity Test As shown in FIG. 9, a casing was installed in a testing machine so that a load F could be applied from the bottom cover 2 or top cover 4 side to which a reinforcing member was joined. "Instron" (registered trademark) universal testing machine 4201 type (manufactured by Instron) was used as a testing machine. Using the indenter 102 with a diameter of 20 mm, press the center position of the housing 1 at a crosshead speed of 1.0 mm/min to measure the amount of deflection of the bottom cover 2 or the top cover 4 when a load of 100 N is applied, and measure it. The value was defined as the flexural rigidity value.

(3) Evaluation of flexural modulus The flexural modulus of materials used for the reinforcing member 3, the bottom cover 2, and the top cover 4 was evaluated according to the standard of ASTM D-790 (1997). Bending test pieces each having a width of 25±0.2 mm and a length of span L+20±1 mm so that the relationship between the width D and the thickness L was L/D=16 were obtained from the respective members obtained in Examples or Comparative Examples. In the case where the arbitrary direction was 0°, a test piece was prepared by cutting out 4 directions of 0°, +45°, −45°, and 90°. The number of measurements n was set to 5 in each direction, and the average value of all measured values (n=20) was taken as the bending elastic modulus. An "Instron" (registered trademark) universal tester Model 4201 (manufactured by Instron Co., Ltd.) was used as a testing machine, and a supporting span was measured at a thickness of 16 It was set to double and the flexural modulus was measured. The test was conducted under the conditions of a moisture content of the test piece of 0.1% by mass or less, an ambient temperature of 23° C., and a humidity of 50% by mass.

(4) Peeling load test of reinforcing member (23°C and 200°C)
The peeling load of the reinforcing member was evaluated based on the "test method for tensile adhesive strength of adhesive" defined in JIS K6849 (1994). As the test piece in this test, the case obtained in the example or the comparative example was used. At this time, in order to measure the peeling strength of the reinforcing member, the evaluation was performed in the state where there was no top cover or bottom cover to which the reinforcing member was not joined (before joining). Specifically, as shown in FIG. 10, the bottom cover 2 or the top cover 4 of the housing 1 was fixed by the fixing jig 103, and the reinforcing member 3 was fixed by the pulling jig 104. Then, a tensile load F was applied with each member fixed, and evaluation was performed until the reinforcing member 3 was peeled off or the tensile jig 104 was detached from the reinforcing member 4. The adhesive area at this time was calculated by measuring the width and length of the joint surface of the reinforcing member 3 before joining. When the bonding was partially performed, the areas were measured and added together to obtain the bonded area. The peeling load of the reinforcing member 3 was calculated from the obtained tensile load value and the joint area. Further, the peeling load of the reinforcing member 3 at 200° C. was set in the constant temperature bath together with the jig for fixing the housing 1, and the atmospheric temperature in the constant temperature bath was raised to 200° C. After the temperature was raised, the state was maintained for 10 minutes, and then a tensile load was applied in the same manner as in the peeling load test of the reinforcing member 3 for evaluation.

<Materials used>
The materials used for evaluation are shown below.

[Material 1]
"Torayca" prepreg P3252S-12 manufactured by Toray Industries, Inc. was prepared as the material 1. The properties of Material 1 are shown in Table 1 below.

[Material 2]
SCF183 EP-BL3 manufactured by Super Resin Industry Co., Ltd. was prepared as a material 2. The properties of Material 2 are shown in Table 1 below.

[Material 3]
Aluminum alloy A5052 was prepared as the material 3. The properties of Material 3 are shown in Table 1 below.

[Material 4]
Magnesium alloy AZ31 was prepared as Material 4. The properties of Material 4 are shown in Table 1 below.

[Material 5]
Titanium alloy Ti-6Al-4V was prepared as the material 5. The properties of Material 5 are shown in Table 1 below.

[Material 6]
90% by mass of polyamide 6 resin ("Amilan" (registered trademark) CM1021T manufactured by Toray Industries, Inc.) and a ternary copolymerized polyamide resin composed of polyamide 6/66/610 ("Amilan" (registered trademark) manufactured by Toray Industries, Inc.) CM4000) 10% by mass was used to prepare a thermoplastic resin film having a basis weight of 124 g/m ² , which was prepared as Material 6. The properties of Material 6 are shown in Table 1 below.

(Example 1)
Example 1-(1): Fabrication of Bottom Cover Seven sheets having a predetermined size were cut out from the material 1. Four of them were cut so that the fiber direction of the prepreg and the longitudinal direction (x direction in FIG. 1) were parallel to each other, and the other three were cut in the lateral direction (y direction in FIG. 1). I tried to be parallel. In this embodiment, the horizontal direction (y direction) is 0°, and as shown in FIG. 11, a prepreg sheet 105a having a fiber direction of 90° and a prepreg sheet 105b having a fiber direction of 0° are symmetrically laminated. A laminate consisting of 7 prepreg sheets was obtained.

Here, using the press molding device and a pair of molds 106 as shown in FIG. 12A, the obtained laminated body 107 was arranged in the pair of molds 106. At this time, the hot platen temperature of the press molding machine was set to 150° C., the mold was moved as shown in FIG. 12( b ), and the molding pressure was maintained at 1.0 MPa. .. Then, after 30 minutes, the molding die was opened and the molded product was taken out from the die. Trimming was performed so that the standing wall of the obtained molded product had a desired height to obtain a bottom cover.

Example 1-(2): Preparation of top cover A molded product was obtained in the same manner as in Example 1-(1), except that a mold having a smooth shape was obtained. Trimming was performed so that the dimensions of the obtained molded product would be the desired size, and a top cover was obtained.

Example 1-(3): Production of Reinforcing Member A molded product was obtained in the same manner as in Example 1-(1) except that the mold 106 shown in FIG. 13 was used. Trimming was performed so that the joint surface of the obtained molded product had a desired width to obtain a reinforcing member.

Example 1-(4): Fabrication of Case Each member obtained in Example 1-(1) to (3) was joined using an adhesive 108 as shown in FIG. The molding conditions and the evaluation results in Example 1 are shown in Table 2 below.

(Example 2)
A housing was obtained in the same manner as in Examples 1-(1) to (4), except that the reinforcing member made of the material shown in Table 2 was molded and used. The molding conditions and the evaluation results in Example 2 are shown in Table 2 below.

(Example 3)
A housing was obtained in the same manner as in Example 2 except that the bottom cover having the dimensions described in Table 2 was used. The molding conditions and the evaluation results in Example 3 are shown in Table 2 below.

(Example 4)
A housing was obtained in the same manner as in Examples 1-(1) to (4), except that the materials shown in Table 2 were used as the reinforcing member, the hot platen temperature was 220° C., and the molding pressure was 10 MPa. .. The molding conditions and evaluation results in Example 4 are shown in Table 2 below.

(Example 5)
A case was obtained in the same manner as in Examples 1-(1) to (4), except that the materials shown in Table 3 were used as the reinforcing member, the hot platen temperature was 200° C., and the molding pressure was 10 MPa. .. The molding conditions and evaluation results in Example 5 are shown in Table 3 below.

(Example 6)
A case was obtained in the same manner as in Examples 1-(1) to (4), except that the materials shown in Table 3 were used as the reinforcing member, the hot plate temperature was 240° C., and the molding pressure was 10 MPa. .. The molding conditions and evaluation results in Example 6 are shown in Table 3 below.

(Example 7)
A housing was obtained in the same manner as in Examples 1-(1) to (4), except that the reinforcing member having the dimensions described in Table 3 was molded and used. The molding conditions and the evaluation results in Example 7 are shown in Table 3 below.

(Example 8)
As another reinforcing member, 25 sheets of the material 1 were laminated such that a prepreg sheet of 0° and a prepreg sheet of 90° were alternately symmetrically laminated to have a thickness of 3 mm. In the same manner as in Example 1-(1), heating and pressing were performed with a press molding machine to obtain a molded product. The obtained molded product was processed to have a width of 7.2 mm to obtain another reinforcing member having the dimensions shown in Table 3. The obtained other reinforcing member was arranged as shown in FIG. 7 and joined with an adhesive, and otherwise the same as in Examples 1-(1) to (4) to obtain a housing. The molding conditions and evaluation results of Example 8 are shown in Table 3 below.

(Example 9)
A hot-melt resin (manufactured by Cemedine Co., Ltd.) obtained by melting the bottom cover and the reinforcing member obtained in the same manner as in Example 1-(1) and (2) with a hot melt applicator at 140° C. at the joint of the reinforcing member. HM712) was applied, and a reinforcing member was overlaid, a weight was placed on the reinforcing member, and the bonding was performed for 3 minutes as it was. A case was obtained in the same manner as in Examples 1-(1) to (4) except for the method of joining. The molding conditions and evaluation results of Example 9 are shown in Table 4 below.

(Example 10)
Example 10-(1): Fabrication of bottom cover A film having a thickness of 50 μm, which is made of a copolyamide resin (“Amilan (registered trademark)” CM8000 manufactured by Toray Industries, Inc.) on the surface on the side to be joined to the reinforcing member. Were laminated to obtain a laminated body. A bottom cover was obtained in the same manner as in Example 1-(1) except that the obtained laminate was used.

Example 10-(2): Production of top cover Similar to Example 10-(1), a copolyamide resin (“Amilan (registered trademark) manufactured by Toray Industries, Inc.” was formed on the surface to be the joint surface with the bottom cover. ) "CM8000) having a thickness of 50 μm was laminated to obtain a laminate. A top cover was obtained in the same manner as in Example 1-(2) except that the obtained laminate was used.

Example 10-(3): Fabrication of Reinforcing Member Similar to Example 10-(1), a copolyamide resin (“Amilan (registered trademark)” manufactured by Toray Industries, Inc.) was formed on the surface to be the joint surface with the bottom cover. A film having a thickness of 50 μm made of “CM8000” was laminated to obtain a laminate. A reinforcing member was obtained in the same manner as in Example 1-(3) except that the obtained laminate was used.

Example 10-(4): Fabrication of a case The reinforcing member obtained in Example 10-(3) of the bottom cover obtained in Example 10-(1) was overlaid on the joining form, and as shown in FIG. Using the joining jig 109, the joining jig 109 was placed in a press molding machine set to have a surface temperature of 180° C. and heated and pressed. After 1 minute, the bottom cover 2, the reinforcing member 3, and the joining jig 109 were taken out from the press machine and cooled. After 5 minutes, the joining jig 109 was removed to obtain an integrated product of the bottom cover 2 and the reinforcing member 3. Then, a housing was obtained in the same manner as in Examples 1-(1) to (4). The molding conditions and the evaluation results in Example 10 are shown in Table 4 below.

(Example 11)
A material was obtained in the same manner as in Example 4 except that the bottom cover and the top cover were prepared and used in the same manner as in Example 10. Each member was joined in the same manner as in Example 10-(4) to obtain a housing. The molding conditions and the evaluation results in Example 11 are shown in Table 4 below.

(Example 12)
A material was obtained in the same manner as in Example 8 except that the bottom cover, the top cover, and the reinforcing member were obtained in the same manner as in Example 10. Each member was joined in the same manner as in Example 10-(4) to obtain a housing. The molding conditions and the evaluation results in Example 12 are shown in Table 4 below.

(Examples 13 to 15)
A housing was obtained in the same manner as in Example 10 except that the reinforcing member having the dimensions shown in Table 5 was formed and used. The molding conditions and evaluation results in Examples 13 to 15 are shown in Table 5 below.

(Reference example 1)
A bottom cover and a reinforcing member were obtained in the same manner as in Example 12 except that the dimensions described in Table 5 were used. Electronic components were arranged in the hollow structure S1 and the space S3 formed by the bottom cover and the reinforcing member, and the joints were joined by the ultrasonic welding machine as in Example 30. In addition, a liquid crystal display was prepared as a top cover and joined to the bottom member with a double-sided tape. The molding conditions and evaluation results for the electronic device obtained in Reference Example 1 are shown in Table 5 below.

(Comparative Example 1)
A case was obtained in the same manner as in Examples 1-(1) to (4), except that the reinforcing member was not used. The molding conditions and evaluation results in Comparative Example 1 are shown in Table 6 below.

(Comparative example 2)
A housing was obtained in the same manner as in Comparative Example 1 except that a laminate obtained by stacking the materials 1 and 2 was used as the material for the bottom cover. The molding conditions and the evaluation results in Comparative Example 2 are shown in Table 6 below.

(Comparative example 3)
Comparative Example 3-(1): Manufacture of Bottom Cover A pair of metal molds was prepared by using a laminate obtained by laminating 10 sheets of the materials shown in Table 6, a press molding apparatus, and a pair of molds 106 as shown in FIG. The laminate was placed in the mold 106. At this time, the hot platen temperature of the press molding machine was set to 260° C., and pressure was applied while maintaining the molding pressure of 1.0 MPa. Then, after 10 minutes, cooling water was caused to flow through the hot plate of the press machine to start cooling. After the mold temperature reached 100° C. or lower, the mold was opened and the molded product was taken out of the mold. Trimming was performed so that the standing wall of the obtained molded product had a desired height to obtain a bottom cover.

Comparative Example 3-(2): Manufacture of Reinforcement Member and Top Cover A reinforcing member and a reinforcement member were prepared in the same manner as in Comparative Example 3-(1) except that the mold used was changed to have the dimensions shown in Table 6. I got a top cover.

Comparative Example 3-(3): Fabrication of Case The top cover was bonded using an adhesive in the same manner as in Example 1-(4), except that the obtained bottom cover and reinforcing member were used. The molding conditions and evaluation results in Comparative Example 3 are shown in Table 6 below.

[Evaluation]
It was confirmed that the casings obtained in the examples exhibit high torsional rigidity. Among them, Example 1 was a housing in which many electronic devices and the like could be mounted inside the hollow structure while exhibiting a very high torsional rigidity and having a high ratio of the hollow structure. It was confirmed that in Examples 8 and 12, not only the torsional rigidity but also the flexural rigidity was exhibited due to the effect of another reinforcing member. In addition, in Examples 9 to 12, since the top cover and the reinforcing member are joined by heat welding, the joint can be disassembled by heating while exhibiting high torsional rigidity and flexural rigidity. It is preferable from the viewpoint of recycling. In addition, in Examples 10 to 12, since the reinforcing member and the bottom cover are directly joined, the increase in weight is small compared to the case where an adhesive, a hot melt resin or the like is used, and it is preferable from the viewpoint of weight reduction. ..

Examples 3 and 4 are intended to reduce the thickness of each member, and contribute to the weight reduction and the thickness reduction of the housing while maintaining the torsional rigidity. Further, in Reference Example 1, as a method of utilizing the housing, electronic components are arranged in a hollow structure, and an electronic device is manufactured by using a liquid crystal display as a top cover. By satisfying the requirements of the present invention, it was confirmed that it is possible to provide a housing exhibiting high torsional rigidity and flexural rigidity.

On the other hand, Comparative Examples 1 and 2 were casings that were extremely weak against torsion and had a possibility of damaging the internal electronic components. Further, although Comparative Example 3 also uses the reinforcing member, it does not satisfy the requirements of the present invention, and it is impossible to exhibit a satisfactory torsional rigidity.

1 Case 2 Bottom Cover 3 Reinforcement Member 4 Top Cover 5 Another Reinforcement Member 21 Plane Part 22 Standing Wall Part 31 Plane Part 32 Standing Wall Part 33 Joint Part

Claims (11)

A plate-shaped top cover, a bottom cover that is erected toward the top cover, and has a standing wall portion whose peripheral portion is joined to the top cover, and the top cover and the bottom cover. disposed within the partitioned space, comprising a reinforcing member having an opening, and a an electronic device housing the reinforcing member forms a hollow structure by Rukoto joined to the bottom cover or top cover hand,
An electronic device housing, wherein the reinforcing member is formed of a material having a thickness of 0.3 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less. .. The electronic device housing according to claim 1, wherein the reinforcing member is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs including reinforcing fibers and a matrix resin. A plate-shaped top cover, a bottom cover that is erected toward the top cover, and has a standing wall portion whose peripheral portion is joined to the top cover, and the top cover and the bottom cover. disposed within the partitioned space, comprising a reinforcing member having an opening, and a an electronic device housing the reinforcing member forms a hollow structure by Rukoto joined to the bottom cover or top cover hand,
An electronic device housing, wherein the reinforcing member is formed of a fiber-reinforced composite material obtained by curing a laminate of prepregs including reinforcing fibers and a matrix resin. The electronic device housing according to claim 1 , wherein the top cover and the bottom cover have a rectangular shape in plan view . The electronic device housing according to any one of claims 1 to 4 , wherein a space other than the hollow structure in which electronic components and wirings can be arranged is provided in the space . The electronic device housing according to claim 1, wherein the reinforcing member is joined to the bottom cover or the top cover by heat welding. The reinforcing member 23 peel load at ° C. is 60N / cm ² or more, the 5000N / cm ² within the range, and, as the peeling force at 200 ° C. fall within a range of less than 60N / cm ² The electronic device housing according to any one of claims 1 to 6, wherein the electronic device housing is joined to the bottom cover or the top cover . The electronic device housing according to claim 1, wherein the reinforcing member is directly joined to the bottom cover or the top cover . The projected area of the reinforcing member in the direction of the bottom cover or the top cover joined to the reinforcing member is 60% or more of the area of the bottom cover or the top cover joined to the reinforcing member. , 95% or less, the electronic device housing according to any one of claims 1 to 8. The volume of the hollow structure formed by joining the reinforcing member to the bottom cover or the top cover is in the range of 55% or more and 95% or less of the volume of the space. The electronic device housing according to any one of 1 to 9. In a hollow structure formed by joining the reinforcing member and the bottom cover or the top cover, a heat generating member is disposed on a surface of the reinforcing member on the hollow structure side. The electronic device housing according to any one of Items 1 to 10.

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