JP6620041B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket for electrically connecting an electrical component and a wiring board by accommodating the electrical component and being fixed to the wiring board.

  As a conventional electrical component socket, an electrical component (for example, an IC (Integrated Circuit) package, etc.) having an external connection terminal on the bottom surface is accommodated and fixed to the wiring substrate. There are known devices that are electrically connected to perform various tests on electrical components (see, for example, Patent Document 1). In such a socket for electrical components, a floating plate that accommodates electrical components on the upper surface of the socket body disposed on the upper surface of the wiring board is provided facing the wiring substrate, and is located at a position corresponding to the connection terminal of the electrical component. When the floating plate in which the vertical through hole is formed is translated downward along with the electrical component toward the wiring board, the contact pin extending upward from the wiring board is connected to the connection terminal of the electrical component through the through hole of the floating plate. The curved portion formed on the contact pin is elastically deformed by contact.

JP 2015-122284 A

  However, in the socket for electric parts described in Patent Document 1, the electric parts provided on the two substantially parallel terminal surfaces facing the connection terminals with the outside are substantially perpendicular to the two terminal surfaces and the wiring board. Therefore, it is difficult to accommodate various tests that require the electrical component to be carried out in the housed state.

  In view of the above, the present invention addresses such problems, and the electrical component provided on two substantially parallel terminal surfaces facing the outside connection terminals outwards is substantially vertical between the two terminal surfaces and the wiring board. An object of the present invention is to provide an electrical component socket that can be accommodated.

  In order to solve such a problem, an electrical component socket according to the present invention accommodates an electrical component provided on two substantially parallel terminal surfaces facing a connection terminal to the outside, and opens downward. A socket body that is formed in a substantially box shape and disposed above the wiring board, and is attached to the inside of the socket body, and the two terminal surfaces and the wiring board are substantially perpendicular to each other through an opening formed in the upper part of the socket body. A housing groove in which an electrical component is housed and a through hole corresponding to the position of the connection terminal in a vertical direction substantially perpendicular to the two terminal surfaces on the inner surface of the housing groove; A movable substrate arranged opposite to the two terminal surfaces on both sides and configured to be movable in parallel in the vertical direction, and attached to the movable substrate and extending linearly in the vertical direction through the through hole of the container Connection terminal and A first conductive contact formed so as to be elastically displaced in the vertical direction by touching, and attached to the movable substrate while being electrically connected to the first conductive contact through the movable substrate. And a second conductive contact formed so as to be in sliding contact with a fixed conductive contact extending upward from the wiring board in accordance with the parallel movement.

  According to the electrical component socket of the present invention, electrical components provided on two substantially parallel terminal surfaces facing outwardly connecting terminals are accommodated with the two terminal surfaces and the wiring board being substantially vertical. be able to.

It is a top view which shows an example of the IC socket which concerns on 1st Embodiment. It is a front view of the IC socket. It is sectional drawing which follows the AA line of FIG. 1 regarding the IC socket. FIG. 4 is a partially enlarged view showing a portion D of FIG. 3 in an enlarged manner with respect to the IC socket. It is the elements on larger scale which expand and show the C section of FIG. 1 regarding the IC socket. It is sectional drawing which shows typically the probe pin used for the IC socket. It is sectional drawing which shows the state which the movable unit in FIG. 3 left | separated from the container regarding the IC socket. It is the elements on larger scale which expand and show the E section of FIG. 7 regarding the IC socket. It is sectional drawing which follows the BB line of FIG. 1 regarding the IC socket. It is sectional drawing which follows the BB line of FIG. 1 regarding the modification of the same IC socket. It is explanatory drawing explaining the conveyance property of the IC socket. It is sectional drawing which follows the BB line of FIG. 1 regarding accommodation preparation operation of the press means of the IC socket. It is a center sectional view showing the pressing means of the IC socket according to the second embodiment. It is explanatory drawing which illustrates an IC package, (a) is a terminal surface of one side, (b) is an outer surface other than a terminal surface, (c) has shown the terminal surface of the other side.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.
1-12 shows an example of the socket for electrical components which concerns on 1st Embodiment.
The electrical component socket is, for example, an IC socket 2 that electrically connects the IC package 100 and the wiring substrate 200 by being fixed to the upper surface of the wiring substrate 200 while accommodating the IC package 100 as an electrical component. The IC package 100 is used for various tests.

  As shown in FIG. 14, the IC package 100 accommodated in the IC socket 2 is formed in, for example, a substantially rectangular parallelepiped shape, and two substantially parallel outer surfaces are connected to a terminal surface 102 b on which connection terminals 102 a to the outside are disposed. The terminal portion 102 is provided on the lower side. In addition, the IC package 100 has a semiconductor circuit unit 104 electrically connected to the connection terminal 102 a via a conductor formed on the inner or outer surface above the terminal unit 102. The semiconductor circuit unit 104 includes, for example, a solid-state imaging device (not shown) such as a charge-coupled device (CCD) image sensor or a complementary metal-oxide-semiconductor (CMOS) image sensor. As will be described later, the IC package 100 is accommodated in the IC socket 2 with the semiconductor circuit portion 104 facing upward and the terminal portion 102 facing downward. Is formed so as to face upward. For example, the two terminal surfaces 102b of the IC package 100 may be formed so as to be substantially perpendicular to the light receiving surface of the solid-state imaging device.

  The IC package 100 accommodated in the IC socket 2 has an external shape as long as it has a terminal portion 102 provided on two lower and substantially parallel terminal surfaces 102b facing the external connection terminal 102a outward. Is not limited to a substantially rectangular parallelepiped shape, and may have various other shapes, and the semiconductor circuit unit 104 may include other various electronic components instead of or in addition to the solid-state imaging device.

  As shown in FIGS. 1 to 3, the IC socket 2 includes a socket body 4 formed in a substantially box shape that opens downward, and a substantially plate-like attachment 6. The attachment 6 is overlapped and fixed at a predetermined position on the upper surface of the wiring board 200 by a fastener (not shown) such as a screw, and the socket body 4 is attached to the upper surface of the attachment 6 as described later. 200 is disposed above. By attaching the socket body 4 to the attachment 6, the lower opening 4 a that opens downwardly of the socket body 4 is covered with the substantially plate-like attachment 6, and an internal space S 1 is formed between the socket body 4 and the attachment 6. Is done. In addition, an upper opening 4b that connects the internal space S1 and the outside is formed in a part of the upper surface of the socket body 4. In addition, the material of each part in IC socket 2 shall be comprised with the material provided with the electrical insulation unless it demonstrates in particular.

  The attachment 6 includes an attachment / detachment mechanism 6A for attaching the socket body 4 in a detachable manner. Although the attachment / detachment mechanism 6A is not limited, for example, the attachment 6 is urged by an elastic member 6A1 such as a torsion coil spring with respect to the key-like protrusion 4c provided on the outer surface of the socket body 4. The rotating claw 6A2 that engages with the key-shaped protrusion 4c and the rotating claw 6A2 are forcibly rotated in the direction opposite to the biased direction, thereby engaging the key-shaped protrusion 4c with the rotating claw 6A2. And an operation lever 6A3 to be released. In addition, the attachment 6 is electrically connected to a predetermined terminal (not shown) of the wiring board 200 by soldering or the like, and one end of the attachment 6 is a conductive fixing pin (the other end extends upward from the wiring board 200). The fixed conductive contact 6B is fixedly supported integrally.

  A housing 8 that houses the IC package 100 through the upper opening 4b of the socket body 4 is disposed in the internal space S1. The container 8 extends downward from the upper opening 4b of the socket body 4 through the internal space S1, and is fixed to the bridging member 4d spanned between the inner side surfaces of the socket body 4 below the internal space S1. It is attached inside.

  In the upper end portion of the housing 8, the IC package 100 is housed in a state where the two terminal surfaces 102 b and the wiring board 200 are substantially vertical, with the semiconductor circuit portion 104 facing upward and the terminal portion 102 facing downward. A receiving groove 80 is formed. The accommodation groove 80 is formed so that a gap is formed between the accommodation IC package 100 and the accommodation IC package 100. Such a gap is formed when, for example, the IC socket 2 is turned upside down in a state in which movable parts by driving means and pressing means described later are not in contact with or in contact with the accommodated IC package 100. May be set to such an extent that is discharged.

  4 and 5, in the state where the IC package 100 is housed in the housing groove 80, the housing groove 80 is mainly located in the upper housing groove 82 where the semiconductor circuit portion 104 is located and the terminal portion 102 is mainly located. The lower receiving groove 84 is divided into two inner side surfaces (terminal facing surfaces) 84a facing the terminal surface 102b in the first direction D1, which is a vertical direction substantially perpendicular to the terminal surface 102b. Have. In addition, the lower housing groove 84 has at least one inner surface (laterally opposed surface) facing the other outer surface other than the two terminal surfaces 102b in the second direction D2, which is a horizontal direction orthogonal to the first direction D1. 84b. Of these, the laterally opposed surface 84b is a lateral reference that serves as a positioning reference for the IC package 100 in the second direction D2 when the outer surface other than the two terminal surfaces 102b of the IC package 100 abuts by pressing means described later. It has a surface.

  Further, as shown in FIG. 4, the lower receiving groove 84 has a seat surface 84 c against which the received IC package 100 abuts by its own weight, and this seat surface 84 c is an upper and lower position serving as a positioning reference for the IC package 100 in the vertical direction. It has a direction reference plane. The vertical position of the seating surface 84c is appropriately set so that incident light on the solid-state imaging device of the semiconductor circuit unit 104 is not blocked by the housing 8 or the socket body 4 in a state where the IC package 100 is housed. In the present embodiment, the seat surface 84 c is a surface with which the bottom surface 102 c of the IC package 100 abuts by its own weight, but can be formed according to the shape of the IC package 100. For example, when the IC package 100 has a flange extending outward from the outer surface, a seating surface in contact with the flange may be formed in the accommodation groove 80.

  In the terminal facing surface 84a of the lower housing groove 84, the IC package 100 is overlapped with the connection terminal 102a of the IC package 100 in the first direction D1 in the state where the IC package 100 is positioned in the second direction D2 and the vertical direction in the lower housing groove 84. A hole 84d is formed. That is, in a state where the IC package 100 is positioned in the second direction D2 and the vertical direction in the lower housing groove 84, when the probe pin described later is passed through the through hole 84d in the first direction D1, the probe pin is connected to the connection terminal. A through hole 84d is formed so as to be in contact with 102a.

  One end of the through hole 84d is in contact with the connection terminal 102a of the IC package 100, and the other end is a probe pin (first conductive contact) extending linearly in the first direction D1 toward the outside of the housing 8. 10 is inserted. As schematically shown in FIG. 6, the probe pin 10 is composed of a conductive member, and is inserted into both ends of the cylindrical barrel 10a and the cylindrical barrel 10a so as to have a sliding pair relationship. The two plungers (the first plunger 10b and the second plunger 10c) and the two plungers provided between the two plungers inside the cylindrical barrel 10a are arranged in the direction of the axis L of the cylindrical barrel 10a (that is, the first direction). D1) and an elastic member 10d for biasing. Here, it is assumed that the first plunger 10b contacts the connection terminal 102a of the IC package 100 through the through hole 84d.

  As shown particularly in FIGS. 3 and 4, the probe pin 10 is fixedly supported by a substantially plate-like pin holder 12 as a support member. A pair of pin holders 12 are arranged on both sides of the housing 8 in the internal space S1 so as to face the two terminal surfaces 102b of the housed IC package 100, and are configured to be movable in parallel in the first direction D1. . The pin holder 12 is formed with an insertion hole 12a through which the probe pin 10 extending linearly in the first direction D1 is inserted. The probe pin 10 is inserted into the insertion hole 12a and the cylindrical barrel 10a is fitted into the pin holder 12. As a result, the probe pin 10 is fixedly supported by the pin holder 12. In addition, a plurality of (for example, two) guide shafts 14 extending through the internal space S1 in the first direction D1 and having both ends fixed to the socket body 4 are inserted into the pin holder 12, whereby the pin holder 12 slides along the guide shaft 14 while moving in parallel in the first direction D1.

  A movable substrate 16 that translates in the first direction D1 together with the pin holder 12 is overlapped and fixed to a surface of the pin holder 12 facing the container 8 in an opposite direction by a fastener 16a such as a screw. 10 is attached to the movable substrate 16. When the movable substrate 16 is fixed to the pin holder 12, the second plunger 10c of the probe pin 10 is formed on the movable substrate 16 while being relatively elastically displaced in the first direction D1 with respect to the cylindrical barrel 10a. It is in electrical contact with a predetermined terminal (not shown).

  A conductive sliding pin (second conductive contact) 18 that is in sliding contact with the fixed pin 6B according to the parallel movement of the movable substrate 16 is attached to the lower portion of the movable substrate 16, and the sliding pin 18 is The second plunger 10c of the probe pin 10 is electrically connected to a predetermined terminal (not shown) on the movable substrate 16 with which the second plunger 10c contacts via a conductor formed inside or on the outer surface of the movable substrate 16. Although the shape of the sliding pin 18 is not limited, the sliding pin 18 may be formed so as to extend linearly in the first direction D1 while being attached to the movable substrate 16. Note that the fixing pin 6B of the attachment 6 may be formed as a probe pin whose contact portion is elastically displaced in the vertical direction in order to suppress contact failure in sliding contact with the sliding pin 18.

  As shown in FIG. 7, the movable substrate 16 and the pin holder 12 including the probe pin 10 and the sliding pin 18 form a movable unit MU that can be integrally translated along the guide shaft 14 in the first direction D1. . The movable unit MU is moved in parallel toward the IC package 100 from both sides of the housing 8 by driving means described later, so that the first plunger 10b of the probe pin 10 passes through the through hole 84d and the terminal surfaces 102b on both sides. Then, the IC package 100 is clamped by elastically contacting the connection terminal 102a of the IC package 100.

  In the IC socket 2 of the present embodiment, an electrical signal directed from the connection terminal 102a of the IC package 100 to a predetermined terminal of the wiring board 200 is formed in the order of the probe pin 10-movable board 16-sliding pin 18-fixing pin 6B. The electrical connection between the movable unit MU and the fixed pin 6B, which is a fixed component, is realized by sliding contact with the slide pin 18. This is because when the probe pin 10 that is a movable unit MU or a movable part and the fixed pin 6B that is a fixed part are electrically connected by a flexible electric cable, the electric cable takes into account the parallel movement of the movable part. This is because the slack is provided in advance, and noise is generated in the electric signal due to reflection or the like at the curved portion where the slack is provided, and the high frequency characteristics of the electric signal may be deteriorated.

The IC socket 2 includes a drive unit 20 that translates the movable unit MU.
As shown in FIG. 1, as the driving means 20, the IC socket 2 applies an urging force in a direction in which the movable unit MU (movable substrate 16, pin holder 12, probe pin 10, sliding pin 18) is separated from the container 8. An elastic member 20A such as a spring is provided. For example, the elastic member 20A is arranged between the pair of opposing pin holders 12 so that the expansion and contraction direction coincides with the first direction D1, and both end portions of the elastic member 20A are notched in each pin holder 12 in the first direction D1. It may be held inside the bottomed groove 12b.

  Further, as the driving means 20, the IC socket 2 has a pair of camshafts 20 </ b> B that translate the movable unit MU toward the housing body 8 against the urging force of the elastic member 20 </ b> A. As particularly shown in FIGS. 3 and 7, the camshaft 20B has a cam 20B1 whose radius around the axis changes in accordance with the rotation angle, and this cam 20B1 is opposite to the housing 8 in the movable substrate 16. As shown in FIG. 1 and the like, both end portions in the axial direction are rotatably supported by the socket body 4 while being in contact with the side surface.

  As shown in FIGS. 1 and 2, an operation member 20C for rotating the camshaft 20B is attached to one end of the pair of camshafts 20B extending outward from the socket body 4 in opposite directions. When the operation member 20C is rotated, it contacts the socket body 4 in the upward direction, and the other end portion of the other camshaft 20B contacts the extended portion 20B2 extending outward from the socket body 4 in the downward direction. Thus, the rotation range of the camshaft 20B is regulated. As shown in FIG. 7, the relative angular relationship between the operation member 20 </ b> C and the cam shaft 20 </ b> B is such that the cam 20 </ b> B <b> 1 is at an angle at which the cam 20 </ b> B <b> 1 contacts the movable substrate 16 when the operation member 20 </ b> C contacts the socket body 4. The movable unit MU (movable substrate 16, pin holder 12, probe pin 10, slide pin 18) is farthest from the housing 8. On the other hand, as shown in FIG. 3, when the operating member 20C of one camshaft 20B comes into contact with the extended portion 20B2 of the other camshaft 20B, the cam 20B1 has an angle at which the cam 20B1 comes into contact with the movable substrate 16. The radius is set to the maximum (Rmax) so that the movable unit MU is closest to the container 8.

  When the radius of the cam 20B1 in contact with the movable substrate 16 is the maximum radius (Rmax) at which the movable unit MU is closest to the container 8, the first plunger 10b of the probe pin 10 and the connection terminal 102a of the IC package 100 are in contact with each other. When the contact pressure is within a predetermined pressure range, and when the movable unit MU has a minimum radius (Rmin) that is farthest from the container 8, the first plunger 10b of the probe pin 10 is, for example, a through-hole as shown in FIG. It is appropriately selected so as to be located outside the accommodation groove 80, such as inside 84d.

  As shown in FIG. 9, the IC socket 2 includes pressing means 22 that presses the IC package 100 in the second direction D2. By pressing the IC package 100 by the pressing means 22, the outer surface other than the two terminal surfaces 102 b of the IC package 100 is brought into contact with the laterally facing surface 84 b of the housing groove 80, and the second package D 2 in the second direction D 2. The IC package 100 is positioned.

  As the pressing means 22, the IC socket 2 is placed on the two terminal surfaces 102 b of the IC package 100 around the rotation shaft 22 </ b> A in the first direction D <b> 1 in the inner space S <b> 2 of the housing 8 that communicates with the housing groove 80. The rotating lever 22B is configured to be rotatable in a predetermined angle range within a substantially parallel plane. A part of the turning lever 22B is brought into contact with the IC package 100 from the opposite side to the laterally facing surface 84b across the IC package 100 by turning about the turning shaft 22A, thereby causing the IC package 100 to be second. A pressing portion 22B1 that presses in the direction D2 is formed.

  The rotation lever 22B is urged by two elastic members 22C such as springs in the rotation direction in which the pressing portion 22B1 abuts the IC package 100 in a state where the IC package 100 is accommodated in the accommodation groove 80. Thus, the pressing portion 22B1 presses the IC package 100 in the second direction D2. The two elastic members 22C are disposed, for example, inside the container 8 that communicates with the internal space S2. The biasing force applied to the rotating lever 22B by the two elastic members 22C sandwiches the IC package 100 between the pressing portion 22B1 of the rotating lever 22B and the laterally facing surface 84b of the receiving groove 80, whereby the probe pin 10 Even when the IC package 100 is not clamped by elastically contacting the connection terminals 102a of the IC package 100 from the terminal surfaces 102b on both sides through the through-holes 84d, the IC package 100 is set so as not to fall out of the IC socket 2. ing. The pressing portion 22B1 of the rotating lever 22B urged by the two elastic members 22C is located in the housing groove 80 when the IC package 100 is not housed in the housing groove 80. As shown in FIG. 10, even if the number of elastic members 22C is one, it is possible to bias the rotating lever 22B.

  Further, as the pressing means 22, the IC socket 2 has a shaft 22 </ b> D extending from the outside of the socket body 4 to the other part of the rotating lever 22 </ b> B other than the pressing portion 22 </ b> B <b> 1, and the shaft 22 </ b> D is axially connected to the socket body 4. Is slidably supported by the shaft. The other part of the rotation lever 22B forms an action part 22B2 that functions as an action point by contacting the tip of the shaft 22D, and the action part 22B2 is rotated by an axial force acting from the shaft 22D. The lever 22B is set at a position where a rotational torque can be applied against the urging force of the elastic member 22C. An operation knob 22E as a power point is attached to the extension 22D1 where the shaft 22D extends to the outside of the socket body 4.

  In addition, in order to make manufacture of the container 8 easy, the container 8 is comprised by two members (for example, board | plate material etc.) divided into 2 to the 1st direction D1, and the mating surface of two members is each 1st direction D1. The housing groove 80, the internal space S2, the space for arranging the elastic member, the insertion hole of the shaft 22D, and the like may be formed in a state where the two members are combined.

Next, a method for using the IC socket 2 will be described.
First, as shown in FIG. 11, a plurality of attachments 6 are prepared for one IC socket 2, the attachment 6 is fixed to the wiring board 200 in various tests in advance, and the fixing pins 6 </ b> B and predetermined terminals of the wiring board 200 are connected. Keep it electrically connected. When the test (test 1) of the IC package 100 is started, the socket body 4 is attached to the attachment 6 fixed to the wiring board 200 in the test 1 by the attaching / detaching mechanism 6A (arrow I).

  When the IC package 100 is accommodated in the IC socket 2, an accommodation preparation operation is performed as preparation for accommodation. As for the driving means 20, the operation member 20C is rotated upward until it comes into contact with the socket body 4 to the state shown in FIG. 7, and the first plunger 10b of the probe pin 10 is retracted from the accommodation groove 80 (see FIG. 8). As for the pressing means 22, as shown in FIG. 12, the operation lever 22E of the shaft 22D is pushed in the axial direction toward the socket body 4 and held (white arrow), so that the rotating lever 22B is made of two elastic members. The pressing portion 22B1 is retracted from the accommodation groove 80 by rotating against the urging force of 22C. Then, the IC package 100 is accommodated from the upper opening 4b of the socket body 4 to the accommodating groove 80 of the accommodating body 8 with the semiconductor circuit portion 104 facing upward and the terminal portion 102 facing downward. In this state, the bottom surface 102c of the IC package 100 is brought into contact with the seating surface 84c of the housing groove 80 to perform vertical positioning.

  After the IC package 100 is received in the receiving groove 80, a positioning and fixing operation for positioning and fixing the IC package 100 by the pressing means 22 is performed. That is, from the state of FIG. 12, the operation knob 22E of the shaft 22D is returned to the original position, the turning lever 22B is turned in the urging direction urged by the elastic member 22C, and the pressing portion 22B1 moves the IC package 100 to the first position. It pushes to 2 directions D2, and it is in the state of FIG. Thus, the IC package 100 is positioned in the second direction D2, and the IC package 100 is sandwiched between the pressing portion 22B1 of the rotation lever 22B and the laterally facing surface 84b of the receiving groove 80, and the receiving groove 80 The IC package 100 is fixed inside.

  After the IC package 100 is positioned and fixed, the driving means 20 performs a conduction operation to electrically connect the IC package 100 and the wiring board 200. That is, from the state of FIG. 7, the operating member 20C is rotated downward until it abuts against the extended portion 20B2 of the other camshaft 20B to the state of FIG. 3, and the first plunger 10b of the probe pin 10 and the IC package 100 are rotated. The connection terminal 102a is elastically contacted (see FIG. 4). Thereby, between the connection terminal 102a of the IC package 100 and the predetermined terminal of the wiring board 200, a conductive path is arranged in the order of the probe pin 10-movable substrate 16-sliding pin 18-fixing pin 6B (or the reverse order thereof). In this state, the test 1 of the IC package 100 is performed.

  As shown in FIG. 11, when the test 1 is completed, the socket body 4 is removed from the attachment 6 fixed to the wiring board 200 by the attaching / detaching mechanism 6A (arrow II). Since the IC package 100 is fixed in the receiving groove 80 by the pressing means 22 in the test 1, the socket body 4 is conveyed while the IC package 100 is stored, and the attachment 6 fixed to the wiring board 200 in the next test 2 is used. On the other hand, the socket body 4 is attached by the attaching / detaching mechanism 6A (arrow III).

  Further, according to the driving means 20, as described above, the IC package 100 is sandwiched by elastically contacting the first plunger 10b of the probe pin 10 from the terminal surfaces 102b on both sides to the connection terminal 102a of the IC package 100. Therefore, the IC package 100 may be fixed inside the accommodation groove 80 by the driving means 20 in addition to the pressing means 22 during the conveyance after the end of the test 1. Thereby, the IC package 100 can be fixed from the two directions of the first direction D1 and the second direction D2. On the other hand, in order to suppress the deterioration of the probe pin 10, after the end of the test 1, the operation member 20 </ b> C of the driving means 20 is rotated upward until it comes into contact with the socket main body 4 to the state of FIG. The first plunger 10b may be retracted from the accommodation groove 80 (see FIG. 8).

  When the IC package 100 is discharged from the IC socket 2, the same operation as the accommodation preparation operation may be performed on the driving unit 20 and the pressing unit 22. Since the accommodation groove 80 is formed so as to have a gap between the accommodation IC package 100 as described above, movable parts by the driving means 20 and the pressing means 22 which will be described later on the IC package 100. When the socket body 4 is turned upside down, the IC socket 2 can be discharged in a state where it is not in contact with or in contact with the socket.

  According to such an IC socket 2, the IC package 100 provided on the two substantially parallel terminal surfaces 102 b facing the external connection terminals 102 a outwardly, and the two terminal surfaces 102 b and the wiring board 200 are approximately vertical. The IC socket 2 can be accommodated in various tests that are required to be performed in the accommodated state.

  In the IC socket 2, a movable unit MU (movable substrate 16, pin holder 12, probe pin 10, sliding pin 18) that moves in parallel with respect to the two terminal surfaces 102 b of the IC package 100, and a fixed pin 6 </ b> B that is a fixed component, Since the electrical connection is realized by the sliding contact between the sliding pin 18 and the fixing pin 6B, not by the flexible electric cable, it is caused by the reflection or the like seen in the curved portion of the electric cable. Therefore, the high frequency characteristics of the electric signal can be kept at a good level.

  Since the IC socket 2 positions and fixes the IC package 100 in the vertical direction and the second direction D2 inside the accommodation groove 80 by the pressing means 22, the probe pin 10 is connected to the connection terminal 102a of the IC package 100. It becomes possible to contact the 1st plunger 10b stably, and the reliability of an electrical connection can be improved.

  The IC socket 2 can be separated into the socket body 4 and the attachment 6, and the IC package 100 can be fixed inside the accommodation groove 80 by at least the pressing means 22, so that the IC package 100 is accommodated in the accommodation groove 80. The socket body 4 can be transported as it is. If a plurality of attachments 6 are prepared for one IC socket 2 and the attachment 6 is fixed to the wiring board 200 in various tests in advance, the socket body 4 containing the IC package 100 can be wired in various tests. The attachment 6 fixed to the substrate 200 can be easily attached / detached by the attaching / detaching mechanism 6A. Therefore, it is not necessary to house the IC package 100 in a different IC socket 2 for each test, and work efficiency can be improved.

Next, an example of the electrical component socket according to the second embodiment will be described. In addition, about the structure which is common in 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted as much as possible.
Similarly to the first embodiment, the electrical component socket according to the second embodiment is fixed to the upper surface of the wiring substrate 200 while accommodating the IC package 100 as an electrical component, so that the IC package 100 and the wiring substrate 200 are accommodated. Are used for various tests of the IC package 100.

  As shown in FIG. 9, the IC socket 2 in the first embodiment is provided with the pressing means 22 having the rotation lever 22B and the shaft 22D, whereas the IC socket 2 in the second embodiment is shown in FIG. The socket 40 is different in that the pressing means 42 is configured without using the rotating lever 22B.

  The IC socket 40 extends in the second direction D2 from the outside of the socket body 4 as a pressing means 42 for pressing the IC package 100 in the second direction D2, and is inserted into the housing 8 so as to sandwich the IC package 100 in the lateral direction. The shaft 42A is in contact with the IC package 100 from the side opposite to the facing surface 84b. The shaft 42A is pivotally supported by the socket body 4 so as to be slidable in the axial direction. The shaft 42 </ b> A is biased in a direction in which the shaft 42 </ b> A comes into contact with the IC package 100 by an elastic member 42 </ b> B such as a spring disposed in the socket body 4. With this urging force, the outer surface other than the two terminal surfaces 102b of the IC package 100 is brought into contact with the laterally facing surface 84b of the housing groove 80, thereby positioning the IC package 100 in the second direction D2. .

  As the pressing means 42, for example, when a spring is used for the elastic member 42B, this spring is inserted into the insertion groove 4e formed in the socket body 4 with the axial direction as the second direction D2, and from the outside of the socket body 4 The shaft 42A may be inserted into the center of the spring and brought into contact with the outer surface other than the terminal surface 102b of the IC package 100, and a flange 42A1 that contacts the IC package 100 side of the spring may be formed on the shaft 42A.

  The magnitude of the urging force by the elastic member 42B is set in the same manner as the elastic member 22C in the first embodiment, and the IC package 100 is accommodated in the accommodation groove 80 at the tip of the shaft 42A urged by the elastic member 42B. In the state where it is not, it is located in the accommodation groove 80.

  According to such an IC socket 40, the IC package 100 can be fixed inside the receiving groove 80 while reducing the number of parts of the pressing means 42 as compared with the pressing means 22 of the first embodiment. It is possible to achieve the same effect as that of the embodiment.

  In the first embodiment and the second embodiment, the IC sockets 2 and 40 are provided with the attachment 6. However, the present invention is not limited to this, and the IC package 100 is simply connected to the two terminal surfaces 102b and the wiring board 200. In the case where it is only necessary to be accommodated in a substantially vertical state, the attachment 6 may not be provided. When the IC sockets 2 and 40 do not include the attachment 6, the fixing pin 6 </ b> B is attached to the wiring board 200 by soldering or the like, and the internal space S is formed between the socket body 4 and the wiring board 200.

  In the first embodiment and the second embodiment, the guide shaft 14 is configured to pass through the pin holder 12, but the movable unit MU (movable substrate 16, pin holder 12, probe pin 10, slide pin 18) is the first. The guide shaft 14 may be configured to be inserted into at least one of the movable substrate 16 and the pin holder 12 as long as it can be translated in one direction D1.

  In the first embodiment and the second embodiment, both ends are elastically displaced with respect to the cylindrical barrel 10a as a first conductive contact that electrically connects the connection terminal 102a of the IC package 100 and the movable substrate 16. Although the both-end-displacement type probe pin 10 is used, the first conductive contact is not limited to this, and the first conductive contact is attached to the movable substrate 16 and extends linearly in the first direction D1, and the IC package 100 of the IC package 100 passes through the through hole 84d. What is necessary is just to be formed so that it may contact with the connecting terminal 102a and to elastically displace in the 1st direction D1. Therefore, as the first conductive contact, the contact portion that is electrically connected to the movable substrate 16 is fixed to the movable substrate 16 by soldering or the like, and the contact portion that contacts the connection terminal 102a of the IC package 100 is provided. It may be a one-side displacement type probe pin that is elastically displaced with respect to the cylindrical barrel 10a. In this case, the pin holder 12 may be omitted.

  In addition, when a one-side displacement type probe pin is used as the first conductive contact as described above, a connection portion that is electrically connected to the movable substrate 16 is connected from the movable substrate 16 to the container. 8 and may be in sliding contact with the fixed pin 6B extending upward from the wiring board 200. In this case, the sliding pin 18 can be omitted.

  DESCRIPTION OF SYMBOLS 2,40 ... IC socket, 4 ... Socket body, 4a ... Lower opening, 4b ... Upper opening, 6 ... Attachment, 6A ... Detachment mechanism, 6B ... Fixed pin, 8 ... Housing, 80 ... Housing groove, 84a ... Opposite terminal Surface, 84b ... Lateral facing surface, 84d ... Through hole, 10 ... Probe pin, 10a ... Cylindrical barrel, 10b ... First plunger, 10c ... Second plunger, 12 ... Pin holder, 12a ... Insertion hole, 14 ... Guide Shaft, 16 ... movable substrate, 18 ... sliding pin, 20 ... driving means, 20A ... elastic member, 20B ... camshaft, 20C ... operating member, 22, 42 ... pressing means, 22A ... rotating shaft, 22B ... rotating Lever, 22B1 ... pressing part, 22B2 ... action part, 22C, 42B ... elastic member, 22D, 42A ... shaft, 100 ... IC package, 102a ... connection terminal, 102b ... terminal surface 104 ... semiconductor circuit portion, 200 ... wiring board

Claims (11)

An electrical component socket for accommodating an electrical component provided on two substantially parallel terminal surfaces facing a connection terminal with the outside,
A socket body that is formed in a substantially box shape that opens downward, and is disposed above the wiring board;
A receiving groove is formed in the socket body, and the receiving groove is formed to receive the electrical component with the two terminal surfaces and the wiring board being substantially vertical through an opening formed in an upper portion of the socket body. A container in which a through hole overlapping with the connection terminal in a vertical direction substantially perpendicular to the two terminal surfaces is formed on the inner surface of the container,
A movable substrate arranged on both sides of the container so as to face the two terminal surfaces, and configured to be movable in parallel in the vertical direction;
A first conductive contact attached to the movable substrate and extending linearly in the vertical direction and configured to be elastically displaced in the vertical direction in contact with the connection terminal through the through hole;
Attached to the movable substrate while being electrically connected to the first conductive contact through the movable substrate, and slides with a fixed conductive contact extending upward from the wiring substrate in accordance with the parallel movement of the movable substrate. A second conductive contact formed to contact;
A socket for electrical parts, comprising:   The electrical component includes a solid-state image sensor electrically connected to the connection terminal, and is formed so that a light receiving surface of the solid-state image sensor faces upward in a state of being accommodated in the accommodation groove. The socket for an electrical component according to claim 1.   The electrical component socket according to claim 2, wherein the two terminal surfaces are substantially perpendicular to the light receiving surface. An elastic member for applying an urging force to the movable substrate in a direction away from the container;
A camshaft that is rotatably supported by the socket body and that translates the movable substrate toward the container against the biasing force;
An operating member attached to the camshaft outside the socket body;
The socket for electrical parts according to claim 1, further comprising:   The apparatus further comprises pressing means for pressing the electrical component in a lateral direction perpendicular to the vertical direction so that the outer surface other than the two terminal surfaces of the electrical component contacts the inner surface of the receiving groove. The electrical component socket according to claim 1, wherein The pressing means is
A rotating lever configured to be rotatable in a plane substantially parallel to the two terminal surfaces in an inner space of the container that communicates with the housing groove, and a part of which is in contact with the electrical component;
A shaft that extends from the outside of the socket body to the other part of the rotating lever and is supported by the socket body so as to be slidable in the axial direction;
With
The turning lever is biased in a turning direction in which the part is in contact with the electrical component, and the shaft is rotated so that the turning lever rotates in a direction opposite to the turning direction. The electrical component socket according to claim 5, wherein the electrical component socket is in contact with the electrical component socket.   The pressing means is configured such that a shaft extending from the outer side of the socket body to the other outer surface is pivotally supported by the socket body so as to be slidable in the axial direction while being urged toward the electrical component. The electrical component socket according to claim 5, wherein   The first conductive contact is a probe pin whose both ends are elastically displaced in the vertical direction, and a cylindrical barrel of the probe pin is fixedly penetrated by a support member fixed to the container side of the movable substrate. The electrical component socket according to claim 1, wherein the electrical component socket is provided.   2. The electrical component socket according to claim 1, wherein the second conductive contact extends linearly in the vertical direction while being attached to the movable substrate. 3.   2. The electric component according to claim 1, wherein the fixed conductive contact is a probe pin in which at least a contact portion that is in sliding contact with the second conductive contact is elastically displaced in a vertical direction. socket.   11. The apparatus according to claim 1, further comprising an attachment having an attachment / detachment mechanism that integrally fixes and supports the fixed conductive contact and is capable of detachably attaching the socket body. Socket for electrical parts as described in 1.