JP6699784B2 - Laminated body, method of manufacturing conductive substrate using the same, method of manufacturing electronic device, and transfer tool - Google Patents

Description

  The present invention relates to a laminate having a porous conductive layer, a method for manufacturing a conductive substrate using the same, a method for manufacturing an electronic device, and a transfer tool used in the method for manufacturing the conductive substrate.

  Conventionally, as a method of forming a metal layer as a conductive layer or a decorative layer on a substrate, for example, a method using a transfer sheet is known (see Patent Documents 1 to 5).

  Patent Document 1 proposes a method of forming an antenna terminal portion using a metal vapor deposition layer transfer sheet in which a protective layer, a metal vapor deposition layer, and an adhesive layer are laminated on a base material. In the case of the metal vapor deposition layer as in Patent Document 1, heat resistance is required for the underlying layer of the metal vapor deposition layer. Therefore, when an inexpensive general-purpose plastic film such as a PET film is used as the base material, there is a problem that the film forming process, metal species, film thickness, etc. are limited due to low heat resistance. The heat resistance is secured by forming such as. On the other hand, a substrate having high heat resistance such as a polyimide film, a PEN film, or a glass film can be used as the substrate, but these substrates are expensive and are suitable for the substrate of the transfer sheet to be peeled and removed. It cannot be said that

  Patent Document 2 has a release sheet as a base material, an insulating layer provided on the release sheet, and a metal foil arranged in contact with the insulating layer, and the metal foil is used for the release sheet. There has been proposed a transfer metal foil sheet attached by an electrostatic attraction generated between the transfer layer and the insulating layer. In the case of the metal foil as disclosed in Patent Document 2, there is a problem that the adhesiveness to the base material is low, and the adhesiveness is secured by forming a resin layer such as an insulating layer on the base material.

  Patent Document 3 uses a thermal transfer film having a resin film, a metal foil provided on the surface of the resin film via an adhesive, and a thermosetting adhesive coated on the metal foil. Manufacture of a metal foil fuse in which a transfer metal mold having a convex fuse element pattern is used to transfer a metal foil onto an insulating substrate through a thermosetting adhesive onto the pattern of the fuse metal element of the transfer metal mold. A law has been proposed. Also in this case, the adhesion between the resin film and the metal foil is secured by providing the metal foil on the surface of the resin film via an adhesive.

  By the way, the transfer sheet is also required to have foil breakability. However, since the vapor-deposited metal layer and the metal foil have ductility, burrs are generated at the time of transfer and there is a problem that the foil is not easily cut. Further, in the metal vapor deposition layer, the crystal grains may grow large, and in that case, the foil cutting property naturally deteriorates. In addition, in order to improve the foil cutting property, a method has been proposed in which a transfer sheet is sandwiched between molds having irregularities, and stress is applied to the transfer sheet before cutting, but the transfer is complicated.

  In addition, since metal generally has high thermal conductivity, heat is likely to diffuse in the metal vapor deposition layer or metal foil, energy required for transfer tends to increase, and the shape of the transfer sheet may be distorted.

  Further, when transferring the transfer sheet to the transfer target, in order to adhere the metal vapor deposition layer or metal foil and the transfer target, for example, when using a heat sealing agent such as a thermoplastic resin as an adhesive layer, thermoplastic Heat above the glass transition temperature of the resin. At this time, thermal transfer is realized because the adhesive force between the transferred material and the metal vapor deposition layer or metal foil is larger than the adhesive force between the substrate and the metal vapor deposition layer or metal foil. In this case, since there is a limit to adjusting the above-mentioned adhesion force only with the heat sealing agent, the adhesion force between the transferred material and the metal vapor deposition layer or metal foil is determined by the adhesion between the substrate and the metal vapor deposition layer or metal foil. In order to make it larger than the force, it has been proposed to form fine irregularities such as roughening the contact surface of the metal vapor deposition layer or the adhesive layer of the metal foil, but the process becomes complicated.

  In Patent Document 4, a donor element in which a light absorption layer and a metal nanoparticle layer are laminated on a donor substrate as a base material is used, the donor element and a receiving substrate are arranged in contact with each other, and a laser is irradiated from the donor element side. Then, a method of forming a pattern of an electric conductor on a receiving substrate by annealing and transferring the metal nanoparticle layer has been proposed. However, in this method, since the metal nanoparticles are used as the conductive material, the electrical resistance at the interface between the particles is a problem, and in order to achieve the desired conductivity, it is necessary to anneal the metal nanoparticles at a high temperature. is necessary. Therefore, the base material needs to withstand the high heat of laser annealing, the base material is limited, and it becomes difficult to use an inexpensive general-purpose plastic film. Further, an expensive base material having high heat resistance must be used as the base material to be peeled and removed, resulting in high cost.

On the other hand, in Patent Document 5, a transfer sheet in which a sintered body layer of metal ultrafine particles is formed on a substrate is used to burn metal ultrafine particles to each other on a transfer substrate having an adhesive layer formed on the surface thereof. A method of forming a wiring pattern composed of a binding layer has been proposed. In this method, the ultrafine metal particles can be used for sintering even at a relatively low temperature.
However, the ultrafine metal particles may be reduced in conductivity due to being oxidized, and the conductivity may be lowered when the sintered body layer of the ultrafine metal particles is transferred to the substrate to be transferred.

  As described above, in the method of forming a metal layer using a transfer sheet, the transfer process is complicated, and there is a concern that the conductivity of the metal layer may decrease due to heating during transfer and distortion of the transfer sheet may occur. Therefore, there is a demand for a transfer sheet capable of forming a metal layer having good conductivity by a simple method.

Although not an invention related to a transfer sheet, Patent Document 6 discloses an invention in which a tape-shaped adhesive is placed on a circuit board by heating using a transfer tool. Further, Patent Document 6 discloses that conductive particles are dispersed in the adhesive to electrically connect the wirings when a plurality of circuit boards are bonded together. However, the adhesive of Patent Document 6 has a high resistance, and it is difficult to transfer it to a transfer target and use it as a conductive layer such as wiring.
In addition, although it is not an invention relating to a transfer sheet, Patent Document 7 discloses that in a transfer tool used for a correction tape, an anisotropic conductive tape is applied instead of the correction tape so that an anisotropic conductive tape is formed on a circuit board. The invention of forming a film is disclosed. However, the anisotropic conductive film in Patent Document 7 is one which exhibits conductivity by thermocompression bonding a pair of circuit boards through the anisotropic conductive film, and is formed on the circuit board. It is difficult to use the anisotropic conductive film itself as a conductive layer such as wiring in a circuit board.
Therefore, Patent Documents 6 and 7 do not disclose formation of a conductive layer pattern using a transfer tool.

JP, 2007-324641, A JP-A-7-101198 JP-A-5-314888 Japanese Patent Publication No. 2008-541481 JP-A-2004-247572 JP, 2004-210524, A JP, 2009-238676, A

  The present invention has been made in view of the above problems, excellent foil cutting property, excellent transferability, a laminate capable of transferring a porous conductive layer having good conductivity, a conductive substrate using the same The main object of the present invention is to provide a manufacturing method, a manufacturing method of an electronic device, and a transfer tool used in the manufacturing method of the conductive base material.

  In order to achieve the above object, the present invention has a substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesive layer formed on the porous conductive layer. To provide a laminate.

In the present invention, the resin contained in the pressure-sensitive adhesive layer can be allowed to enter the inside of the pores of the porous conductive layer. Therefore, the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer can be enhanced, and excellent transferability can be obtained.
Further, in the present invention, since a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, heating is not required when the laminate is transferred onto the transferred substrate, and the porous conductive layer is oxidized by oxidation. It is possible to suppress deterioration of conductivity and distortion of the laminate.
Further, in the present invention, since it has the porous conductive layer, brittleness is imparted, and good foil cutability and resolution can be obtained. In addition, since the porous conductive layer can be formed by sintering metal particles at a low temperature, it does not damage the base material, it is not necessary to use a base material with high heat resistance, and a base material with low heat resistance is used. Wood can also be used.
Moreover, a conductive base material can be easily produced by using the laminate of the present invention.

  In the above invention, the base material is preferably a resin base material. As described above, in the present invention, a base material having low heat resistance can be used, and it is very useful in that an inexpensive general-purpose plastic resin base material can be used.

  In the above invention, it is preferable that the porous conductive layer contains a metal. This is because the metal particles can be sintered at a lower temperature to form the porous conductive layer.

  In the above invention, a protective layer may be formed between the substrate and the porous conductive layer. After the transfer, the protective layer can protect the porous conductive layer. Moreover, the porous conductive layer can be insulated by using the insulating protective layer.

  In the above invention, it is preferable that the laminate has a strip shape. This is because the pattern of the pressure-sensitive adhesive layer and the porous conductive layer can be easily formed on the transferred substrate.

  The present invention is characterized by comprising a preparation step of preparing the above-mentioned laminated body, and a transfer step of transferring the pressure-sensitive adhesive layer and the porous conductive layer of the above-mentioned laminated body onto the transferred substrate by applying pressure. A method for manufacturing a conductive substrate is provided.

  In the present invention, since the above-mentioned laminated body is used, foil cutting property, resolution and transferability are excellent. Further, it is possible to obtain a porous conductive layer having good conductivity even after transfer. Further, the conductive base material can be easily manufactured.

  In the above invention, it is preferable that, in the transferring step, the patterns of the pressure sensitive adhesive layer and the porous conductive layer are transferred onto the transfer target substrate by applying pressure using the belt-shaped laminate. A conductive base material having a pattern of a porous conductive layer can be easily produced for a transfer target base material.

  In the above invention, in the transferring step, the first pressure-sensitive adhesive layer and the first pressure-sensitive adhesive layer are formed by pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate onto the transfer-receiving substrate. Forming a laminated portion in which the porous conductive layer and the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated, and further subjecting the laminated portion to at least one of heat treatment and pressure treatment. Accordingly, a connecting step of electrically connecting the first porous conductive layer and the second porous conductive layer may be included. Since it is possible to electrically connect the first porous conductive layer and the second porous conductive layer in the pressed region in the above-mentioned laminated portion, it is possible to easily form the laminated porous conductive layers in the conductive base material. Can be conducted by any method.

  The present invention provides a method for manufacturing an electronic device, which has a conductive base material manufacturing step of manufacturing a conductive base material by the method for manufacturing a conductive base material described above.

  In the present invention, since the conductive substrate is produced by the above-described method for producing a conductive substrate, it is possible to form a porous conductive layer having good conductivity. Further, for example, when forming a pattern of the porous conductive layer, a high resolution pattern can be formed. Moreover, when a strip-shaped laminate is used, the pattern of the porous conductive layer can be easily formed.

  The present invention is a transfer tool used for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the belt-shaped laminate described above onto a substrate to be transferred by using the laminate described above. The laminate, an unwind reel that unwinds the pressure-sensitive adhesive layer of the laminate outside, and the pressure-sensitive adhesive layer and the porous conductive layer of the laminate that are unwound from the unwind reel. A transfer head that pressurizes and transfers to the transfer target material, a take-up reel that winds up the base material after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, the unwind reel and the take-up reel And a interlocking mechanism for interlocking with each other to provide a transfer tool.

  In the present invention, by using the transfer tool of the present invention, the pattern of the porous conductive layer can be easily formed on the transferred substrate by using the above-mentioned strip-shaped laminate in the method for producing the conductive substrate. can do.

  The laminate of the present invention is excellent in foil cutting property and transferability, and has an effect that it is possible to transfer a porous conductive layer having good conductivity.

It is a schematic sectional drawing which shows an example of the laminated body of this invention. It is process drawing which shows an example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the other example of the laminated body and electroconductive base material of this invention. It is a schematic sectional drawing which shows the other example of the laminated body and electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a schematic sectional drawing which shows the other example of the laminated body and electroconductive base material of this invention. It is process drawing which shows the other example of the manufacturing method of the electroconductive base material of this invention. It is a figure explaining the pattern of the porous conductive layer in the transcription|transfer material of Example 5 and Example 6.

  The details of the laminate, the method for producing a conductive base material, the method for producing an electronic device, and the transfer tool according to the present invention will be described below.

A. Laminated body The laminated body of the present invention has a substrate, a porous conductive layer formed on the substrate, and a pressure-sensitive adhesive layer formed on the porous conductive layer. Is.

The laminate of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic sectional view showing an example of the laminated body of the present invention. As illustrated in FIG. 1, the laminate 1 includes a base material 2, a porous conductive layer 3 formed on the base material 2, and a pressure-sensitive adhesive layer 4 formed on the porous conductive layer 3. Have

  2A to 2C are process diagrams showing an example of a method for producing a conductive base material using the laminate of the present invention, which is an example using the laminate illustrated in FIG. First, as shown in FIG. 2A, the laminate 1 and the transferred substrate 11 are prepared. Next, as shown in FIG. 2B, the pressure-sensitive adhesive layer 4 of the laminated body 1 and the transferred substrate 11 are arranged in contact with each other, and pressure is applied from the laminated body 1 side. After that, as shown in FIG. 2C, the base material 2 is peeled off. As a result, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the transfer target substrate 11 in the pressure-bonded region, and the conductive substrate 10 is obtained.

  3A to 3C are process diagrams showing another example of the method for producing a conductive base material using the laminate of the present invention, which is an example using the laminate shown in FIG. First, as shown in FIG. 3A, the laminate 1 and the transferred substrate 11 are prepared. Next, as shown in FIG. 3B, the pressure-sensitive adhesive layer 4 of the laminated body 1 and the transferred substrate 11 are arranged in contact with each other, and pressure is applied from the laminated body 1 side. At this time, it is partially pressure-bonded by the relief plate 12 or the like. After that, as shown in FIG. 3C, the base material 2 side is peeled off. As a result, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred to the substrate 11 to be transferred in the pressure-bonded region, and the conductive substrate 10 having the pattern of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 is formed. can get.

4A and 4B are process diagrams showing another example of the method for producing a conductive base material using the laminate of the present invention. Further, FIGS. 4A and 4B are examples in which a transfer tool having a belt-shaped laminated body is used. Further, FIG. 4B is a schematic plan view of the portion A of FIG. 4A viewed from the porous conductive layer 3 side. First, as shown in FIG. 4A, the strip-shaped laminate 1 and the transfer substrate 11 are prepared. Next, using the transfer tool 20, the pressure-sensitive adhesive layer 4 of the laminate 1 and the transfer target substrate 11 are arranged in contact with each other, and the transfer tool 20 is moved in a predetermined direction while applying pressure from the laminate 1 side. To do. At this time, the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 are transferred onto the transferred base material 11 along the moving direction of the transfer tool 20, and the base material 2 is peeled off. Thereby, as shown in FIGS. 4A and 4B, the patterns of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 can be transferred onto the transferred substrate 11.
The transfer tool 20 will be described later.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can be allowed to enter inside the pores of the porous conductive layer, not only the surface area where the porous conductive layer and the pressure-sensitive adhesive layer are bonded is increased, The anchor effect can enhance the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer. Therefore, when the laminate of the present invention is transferred to the transferred substrate, the pressure-sensitive adhesive layer and the porous conductive layer can be satisfactorily transferred to the transferred substrate, and excellent transferability can be obtained. it can.

  Further, as will be described later, in the porous conductive layer, since the metal particles are sintered and fused to each other, the region where the component derived from the adhesive layer enters inside the pores of the porous conductive layer is also conductive. Contribute to. Therefore, the adhesiveness with the adhesive layer can be enhanced without lowering the conductivity.

  Further, in the present invention, since a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, heating is not required when the laminate is transferred onto the transferred substrate, and therefore, the porous conductive layer It is possible to suppress a decrease in conductivity due to oxidation and distortion of the laminate.

  Further, in the present invention, since the porous conductive layer is porous and thus imparts brittleness, unlike the conventional vapor deposition layer, burrs are less likely to occur during transfer and large crystal grains are not included. Therefore, good foil breakability can be obtained. Further, as illustrated in FIGS. 3(a) to 3(c), when the patterns of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate of the present invention are transferred to the transferred substrate, they are transferred with good resolution. be able to.

  Here, it is known that the metal particles are sintered at a low temperature when the particle size is reduced. In the present invention, by utilizing the property that when such metal particles become nanoparticles, they are sintered at a temperature significantly lower than the melting point of the metal particles, the metal particles are sintered at a low temperature to form a porous conductive layer. Can be formed. Therefore, it is not necessary to use a base material having high heat resistance, which does not damage the base material, and a base material having low heat resistance can be used. In particular, it is very useful in that an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used.

  Further, in the present invention, the porous conductive layer can be formed, for example, by applying a metal particle dispersion liquid containing metal particles on a base material and baking the metal particle dispersion liquid. A conductive layer can be obtained. Therefore, it is not necessary to form another layer on the base material or perform surface treatment for improving the adhesion.

  Further, since the porous conductive layer can be formed on the transferred substrate by transferring the laminate of the present invention to the transferred substrate, a porous conductive layer is conventionally formed as the transferred substrate. It is also possible to use a substrate that has been difficult to do. Therefore, an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate or a conductive substrate having a porous conductive layer formed on a paper substrate can be obtained. Furthermore, it is also possible to form a porous conductive layer on the transfer-receiving substrate, which is a three-dimensional object.

  Further, since the porous conductive layer in the present invention is porous, it can exhibit high resistance to bending. Therefore, when the substrate has flexibility, it can be transferred to the substrate to be transferred while giving the laminate a high curvature.

  Hereinafter, each component of the laminate of the present invention will be described.

1. Porous conductive layer The porous conductive layer in the present invention is formed on a substrate.

  Here, the porous conductive layer means a conductive layer having a large number of holes, and has a larger surface area than a conductive layer having the same volume and having no holes.

Examples of the conductive material forming the porous conductive layer include metals and metal oxides. The conductive material forming the porous conductive layer may be one kind or two or more kinds.
Of these, metals are preferable. This is because the metal particles can be sintered at a lower temperature to form a porous conductive layer.

Examples of the metal include gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium and lead. Among them, silver and copper are preferable from the viewpoint of conductivity and cost. The metal may be one kind or two or more kinds.
Examples of the metal oxide include indium tin oxide and antimony-doped tin oxide.

  The shape of the pores in the porous conductive layer is not particularly limited as long as the constituents derived from the adhesive layer can enter into at least some of the pores. At least the surface of the porous conductive layer on the side of the adhesive layer preferably has a communication hole in which a large number of holes are connected to each other.

The porosity of the porous conductive layer is not particularly limited as long as it can be adjusted appropriately within a range where both conductivity and adhesion can be compatible. Specifically, the porosity of the porous conductive layer is preferably in the range of 5% to 50%, more preferably in the range of 10% to 45%, and particularly preferably 15% to 40%. It is preferably within the range. If the porosity is too large, the adhesion between the porous conductive layer and the base material may decrease. Further, if the porosity is too small, the above-mentioned effect due to the component derived from the adhesive layer entering the inside of the pores of the porous conductive layer may not be sufficiently obtained.
The porosity of the porous conductive layer represents a portion where the material forming the porous conductive layer does not exist, and also includes a portion where components derived from the adhesive layer are mixed.

The porosity can be confirmed from a scanning electron microscope (SEM) image of a cross section of the porous conductive layer before the formation of the adhesive layer. Specifically, the area of the holes and the area of the porous conductive layer are calculated from the obtained SEM image, and the area of the holes is divided by the area of the porous conductive layer to obtain the porosity in the cross section. be able to. The porosity is calculated from the porous conductive layer excluding the base material, and the pores at the interface between the base material and the porous conductive layer are included in the porous conductive layer.
The porosity can also be confirmed from a scanning electron microscope (SEM) image of the cross section of the laminate. Specifically, the area of the pores, the area of the component derived from the adhesive layer, and the area of the porous conductive layer were calculated from the obtained SEM image, and the area of the hole and the area of the component derived from the adhesive layer were calculated. The porosity in the cross section can be obtained by dividing the total by the area of the porous conductive layer.
Similarly, the porosity is similarly obtained for a plurality of cross sections according to the size of the laminate, and the average value thereof is taken as the porosity of the porous conductive layer.
The porosity can be appropriately adjusted by the particle size of the metal particles used in the metal particle dispersion, the type of the dispersant, the firing conditions, etc. in the method for forming the porous conductive layer described below.

  The porous conductive layer 3 may be formed on the entire surface of the base material 2 as illustrated in FIG. 1, or may be formed in a pattern on the base material 2 as illustrated in FIG. Good. When the porous conductive layer 3 is formed in a pattern on the base material 2 as illustrated in FIG. 5A, even if the laminate 1 is not partially transferred, as shown in FIG. As illustrated, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11.

  The thickness of the porous conductive layer is about 0.01 μm to 50 μm, preferably 0.05 μm to 10 μm, and particularly preferably 0.1 μm to 5 μm.

As a method of forming the porous conductive layer, a method of applying a metal particle dispersion liquid containing metal particles on a base material and firing the applied solution is used.
In the specification of the application, metal particles include particles in an alloy state, particles of a metal compound, and the like, in addition to particles in a metal state.

The metal particles can be appropriately selected and used from the metal particles that generate conductivity after firing.
Examples of the metal forming the metal particles include gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, indium, gallium, germanium, zinc, titanium and lead. Among them, silver and copper are preferable from the viewpoint of conductivity and cost. The metal constituting the metal particles may be one type or two or more types. Further, a material in which two or more kinds of metals form a core-shell structure, a material in which the surface of metal particles is oxidized or nitrided, and the like may be used. The surface of the metal particles may be oxidized, or the inside thereof may be oxidized.
Examples of the metal compound that constitutes the particles of the metal compound include metal oxides, metal nitrides, metal hydrides, metal hydroxides, and organic metal compounds. It is preferable that these metal compounds are decomposed into a metal state during firing. For example, particles of a metal compound that exhibits conductivity when reduced, specifically, particles of a metal compound such as cuprous oxide, cupric oxide, silver oxide, copper nitride, and copper hydride can be mentioned. Examples of the metal oxide also include indium tin oxide and antimony-doped tin oxide.
The metal particles may be used alone or in combination of two or more.
Among them, particles in a metal state are preferable. This is because the particles in the metal state can be sintered at a lower temperature to form the porous conductive layer.

  The metal particles are preferably metal nanoparticles. That is, the porous conductive layer is preferably a sintered body of metal nanoparticles. This is because when the metal particle dispersion liquid containing the metal nanoparticles is applied and fired to form the porous conductive layer, the pore size and the crystal grain size can be controlled within a range suitable for foil cutting property. ..

The average particle diameter of the metal particles is preferably in the range of 1 nm to 200 nm, more preferably in the range of 2 nm to 150 nm, and particularly preferably in the range of 2 nm to 100 nm. When the average particle size is within the above range, the dispersion stability of the metal particle dispersion used when forming the porous conductive layer is good, and the conductivity when forming the porous conductive layer becomes good, Further, the melting point is kept low, sufficient sintering is possible, and high conductivity is obtained.
Here, the average particle diameter of the metal particles is the average primary particle diameter of the metal particles in the metal particle dispersion liquid described later, and can be measured from an image observed with a transmission electron microscope.

  As a method for preparing the metal particles, for example, a physical method obtained by pulverizing metal powder or metal oxide powder by a mechanochemical method; a CVD method, a vapor deposition method, a sputtering method, a thermal plasma method, a laser method, etc. A chemical dry method; a method called a chemical wet method such as a thermal decomposition method, a chemical reduction method, an electrolysis method, an ultrasonic method, a laser ablation method, a supercritical fluid method, a microwave synthesis method and the like can be mentioned.

  In order to obtain a metal particle dispersion liquid, the obtained metal particles are prepared by treating the metal particles with a protective agent such as a water-soluble polymer compound such as polyvinylpyrrolidone or a graft copolymerization polymer compound, a surfactant, a metal or a metal oxide. It is preferable to coat with a compound having a thiol group, an amino group, a hydroxyl group, or a carboxyl group capable of interacting with an object. Further, depending on the method of synthesizing the metal particles, the thermal decomposition product or oxide of the raw material may protect the particle surface and contribute to the dispersibility. In the case of a wet method such as a thermal decomposition method or a chemical reduction method, the reducing agent may act as it is as a protective agent for the metal particles. Further, in order to enhance the dispersion stability of the metal particle dispersion liquid, surface treatment of the metal particles is performed, or a dispersant comprising a polymer compound, an ionic compound, a surfactant, etc. is added to the metal particle dispersion liquid. You may.

  The dispersion medium used in the metal particle dispersion is not particularly limited as long as it disperses the metal particles, and for example, water or an organic solvent can be used. Examples of the organic solvent include alcohols, ketones, esters, ethers, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons and the like.

  If necessary, a viscosity modifier, a surface tension modifier, a stabilizer, or the like may be added to the metal particle dispersion liquid.

  The solid concentration of the metal particle dispersion is preferably in the range of 5% by mass to 95% by mass, in particular in the range of 10% by mass to 90% by mass, and particularly in the range of 15% by mass to 85% by mass. Preferably. When the solid content concentration is within the above range, sufficient conductivity is obtained, the viscosity is sufficiently low, and the coating of the metal particle dispersion liquid on the substrate is easy.

When applying the metal particle dispersion liquid on the base material, the metal particle dispersion liquid may be applied on the entire surface of the base material, or the metal particle dispersion liquid may be applied in a pattern on the base material.
Examples of the method for applying the metal particle dispersion liquid on the substrate include gravure printing, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, offset printing, flexographic printing, inkjet printing, and dispenser. Examples include printing. When the metal particle dispersion liquid is applied in a pattern on the substrate, gravure printing, flexographic printing, screen printing and inkjet printing are preferable from the viewpoint that fine patterning can be performed.

  After coating the metal particle dispersion liquid, drying may be performed by a usual method. For example, a drying method of heating for about 0.1 to 20 minutes at a temperature of about 80 to 140° C. using a general oven or the like can be mentioned. The thickness of the coating film after drying can be controlled by adjusting the coating amount and the average particle diameter of the metal particles, but is usually about 0.01 μm to 100 μm, preferably 0.1 μm to 50 μm. It is within the range.

As a method for firing the coating film of the metal particle dispersion liquid, any method capable of sintering the metal particles may be used, and a general firing method can be applied. For example, a method using heat treatment, light treatment, plasma treatment, etc. may be mentioned. By firing the coating film, a porous conductive layer made of a sintered body of metal particles can be obtained.
Examples of the heat treatment include hot plate heating, hot air heating, and hot pressing using a hot plate or hot roll.
Examples of the light treatment include laser treatment, ultraviolet lamp treatment, infrared lamp treatment, far infrared lamp treatment, and flash light lamp treatment.
The plasma treatment is a treatment in which a reducing gas such as hydrogen, carbon monoxide, ammonia, or alcohol is ionized into a plasma state to generate highly reactive active species. For example, electron cyclotron resonance (ECR) plasma is used. , Capacitively coupled plasma, inductively coupled plasma, atmospheric pressure plasma, microwave plasma, surface wave plasma generated by application of microwave energy, and the like. Of these, surface wave plasma treatment is preferable.
The above firing methods can be used in combination of two or more.

  The microwave surface wave plasma has the characteristics of high plasma density and low electron temperature, and it is possible to perform a baking treatment at low temperature and in a short time, and to form a dense and smooth porous conductive layer. You can With the surface wave plasma, a plasma having a uniform density within the surface is applied to the processing surface. As a result, compared to other firing methods, inhomogeneous films are less likely to be formed, such as in-plane sintering of metal particles, and grain growth can be prevented. A dense and smooth film can be obtained. Further, since it is not necessary to provide an electrode in the in-plane processing chamber, it is possible to prevent contamination of impurities originating from the electrode and prevent damage to the processing material due to abnormal discharge. Furthermore, when a resin base material is used, the resin base material is less damaged and other layers are also less damaged.

  Further, the microwave surface wave plasma is suitable for enhancing the adhesion of the porous conductive layer to the resin base material. The reason for this is presumed that microwave surface wave plasma is likely to generate polar functional groups such as hydroxyl groups and carboxyl groups at the interface between the substrate and the porous conductive layer. In particular, when plasma generated in a reducing gas atmosphere is used for the polyester substrate, the plasma of the gas having a reducing gas reacts with the ester bond of the substrate, and the interface side of the substrate is modified. It is presumed that the quality occurs and many reactive groups having high polarity are generated, so that the adhesion at the interface between the porous conductive layer and the substrate is improved. Therefore, the microwave surface wave plasma can be compared with the conventional method in which the substrate surface and the porous conductive layer are roughened by plasma treatment or the like to improve the adhesion with the porous conductive layer. It is excellent in that it has high adhesion to the layer.

  Regarding the conditions of the microwave surface wave plasma, for example, the conditions described in Japanese Patent Application Laid-Open No. 2010-86825 can be applied.

The atmosphere at the time of firing is appropriately selected according to the type of conductive material forming the porous conductive layer.
When forming the metal-containing porous conductive layer, an atmosphere of an inert gas or a reducing gas is preferable, and a reducing gas is particularly preferable. In the case of a reducing gas atmosphere, the oxides existing on the surface of the metal particles are reduced and removed, and a porous conductive layer having good conductivity can be formed. Therefore, when forming a porous conductive layer that is a porous layer containing a metal, metal particles whose surface is oxidized or metal particles whose inside is oxidized can be used as the metal particles.

Examples of the reducing gas include hydrogen, carbon monoxide, ammonia, and a mixed gas thereof. Of these, hydrogen gas is preferable. Hydrogen gas is suitable for removing organic substances attached to the surface of the metal particles.
An inert gas such as nitrogen, helium, argon, neon, krypton, or xenon may be mixed with the reducing gas. In this case, there is an effect that plasma is easily generated.

  On the other hand, when the porous conductive layer containing a metal oxide is formed, an atmosphere containing an inert gas such as nitrogen or argon and, if necessary, oxygen may be used.

Furthermore, when forming a porous conductive layer containing copper, a method using hydrogen plasma or nitrogen plasma is preferable. In particular, by performing with hydrogen plasma, a specific resistance of about 3×10 ⁻⁶ Ω·cm to 3×10 ⁻⁵ Ω·cm can be obtained, and a porous conductive layer having good adhesion to a substrate is formed. Because you can.

The firing temperature may be any temperature at which the metal particles can be sintered, and is appropriately selected according to the type and particle diameter of the metal particles, the firing method and the like. Above all, the firing temperature is preferably lower than or equal to the heat resistant temperature of the base material, and when silver particles are taken as an example, the firing temperature is preferably within a range of 100°C to 150°C.
The firing time is appropriately selected according to the type of metal particles, the firing method and the like. For example, when the silver particles are baked by heat treatment, the baking time is preferably in the range of 10 minutes to 120 minutes, and more preferably in the range of 15 minutes to 40 minutes. Further, for example, when the copper particles are fired by hydrogen plasma, the firing time is preferably in the range of 1 minute to 10 minutes, and particularly preferably in the range of 2 minutes to 5 minutes.

2. Pressure-sensitive adhesive layer The pressure-sensitive adhesive layer in the present invention is formed on the porous conductive layer. The pressure-sensitive adhesive layer has a function of adhering the porous conductive layer and the substrate to be transferred when the laminate of the present invention is transferred to the substrate to be transferred.

  Examples of the material of the pressure-sensitive adhesive layer include a pressure-sensitive adhesive and a photosensitive resin whose adhesiveness or adhesiveness is reduced by light irradiation.

The pressure-sensitive adhesive is not particularly limited as long as it can bond the porous conductive layer and the transferred substrate, and is appropriately selected according to the type of the transferred substrate to which the laminate is transferred. It For example, a general pressure-sensitive adhesive used for transfer foil can be used. The pressure-sensitive adhesive may be used alone or in combination of two or more.
Any pressure-sensitive adhesive may be used as long as it exhibits tackiness or adhesiveness under pressure, and a curable resin that partially cures or a crosslinked rubber material may be used.
As the pressure-sensitive adhesive, specifically, acrylic resin, urethane resin, amide resin, epoxy resin, styrene-butadiene copolymer, natural rubber, casein, gelatin, rosin resin, terpene resin, phenol resin, styrene resin, A wide variety of known adhesives such as silicone resin, styrene resin, polyolefin, urethane resin, ionomer resin, vinyl chloride resin, vinyl acetate resin, vinyl chloride-vinyl acetate copolymer resin, polyester resin, polyamide resin can be used. .. The pressure-sensitive adhesive is preferably one that is not sticky at room temperature and exhibits tackiness or adhesiveness when pressed.

  As the photosensitive resin whose tackiness or adhesiveness is reduced by light irradiation, for example, ultraviolet rays, visible light, cured by irradiation with light having a specific wavelength such as infrared rays, the tackiness or adhesiveness is lowered, and, In the light non-irradiated portion, a material that can bond the porous conductive layer and the transferred substrate can be used. Specifically, known ones such as polyfunctional (meth)acrylic resin prescribed with photopolymerization initiator or epoxy resin prescribed with photoacid generator or photobase generator are widely used. it can. Alternatively, a solvent-diluted type, a W/O emulsion type, or a solvent-free non-sol type may be used. Such a photosensitive resin may be used alone or in combination of two or more kinds.

  Further, the pressure-sensitive adhesive layer may contain additives other than the pressure-sensitive adhesive. Examples of the additive include a dispersant, a filler, a plasticizer, an antistatic agent and the like.

  When a pressure-sensitive adhesive is used, the pressure-sensitive adhesive layer 4 may be formed on the entire surface of the base material 2 as illustrated in FIG. 1, or on the base material 2 as illustrated in FIG. It may be formed in a pattern. When the pressure-sensitive adhesive layer 4 is formed in a pattern on the base material 2 as shown in FIG. 6A, the laminated body 1 is shown in FIG. 6C without being partially transferred. Thus, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11.

When a photosensitive resin whose adhesiveness or adhesiveness is lowered by light irradiation is used, the adhesive layer 4 is usually formed on the entire surface of the base material 2 as illustrated in FIG. 7A.
7A to 7D are process diagrams showing another example of the method for producing a conductive base material using the laminate of the present invention, in which the pressure-sensitive adhesive layer 4 is tacky or adhesive by light irradiation. This is an example of using a photosensitive resin that reduces First, as shown in FIG. 7A, a laminated body 1 in which a porous conductive layer 3 and a pressure-sensitive adhesive layer 4 are sequentially laminated on a base material 2 is prepared, and a photomask 15 is provided on the pressure-sensitive adhesive layer 4. Light 16 is radiated in a pattern through the light-sensitive adhesive layer 4 to reduce the tackiness or adhesiveness of the pressure-sensitive adhesive layer 4 at the light-irradiated portion, thereby forming the low-bonding portion 4b. Next, as shown in FIGS. 7B to 7C, the pressure-sensitive adhesive layer 4 of the laminate 1 and the transferred substrate 11 are arranged so as to be in contact with each other, and are brought into close contact with each other. After that, as shown in FIG. 7D, the base material 2 side is peeled off. Since the pressure-sensitive adhesive layer 4 has the adhesive portion 4a which is a non-light-irradiated portion and the low adhesive portion 4b which is a light-irradiated portion and whose adhesiveness or adhesiveness is lowered, the pressure-sensitive adhesive layer 4 does not adhere to the transferred substrate 11 at the adhesive portion 4a. However, the low adhesion portion 4b has low adhesion to the transferred substrate 11. Therefore, when the base material 2 side is peeled off, the porous conductive layer 3 and the pressure-sensitive adhesive layer 4 are peeled off together with the base material 2 at the low adhesion portion 4b, and the transfer target base material 11 is adhered at the adhesion portion 4a to form a porous structure. The conductive layer 3 is transferred. Thereby, the conductive base material 10 having the pattern of the pressure sensitive adhesive layer 4 and the porous conductive layer 3 is obtained. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transferred substrate 11 without partially transferring the laminate 1.

  Examples of the method for forming the pressure-sensitive adhesive layer include a method in which a resin composition such as a pressure-sensitive adhesive or a photosensitive resin is applied on the porous conductive layer and dried. The method for applying the resin composition can be appropriately selected and applied from common application methods, for example, gravure printing, screen printing, spray coating, spin coating, comma coating, bar coating, knife coating, die coating, Offset printing, flexographic printing, inkjet printing, dispenser printing, etc. can be mentioned.

  The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as it is a thickness that allows foil breakage when transferring the laminate of the present invention to the transferred substrate, and the transfer method and the transferred substrate. It is appropriately selected depending on the type. Specifically, the thickness of the pressure-sensitive adhesive layer is preferably in the range of 0.1 μm to 50 μm, more preferably in the range of 0.5 μm to 25 μm. If the pressure-sensitive adhesive layer is too thin, the adhesiveness with the transferred substrate may become insufficient. If it is too thick, the pressure applied to the pressure-sensitive adhesive layer at the time of transferring the laminate of the present invention becomes too large, which may cause damage to the transferred substrate or the like. Further, for example, when the substrate to be transferred is a paper substrate, it may be difficult to transfer depending on the type of the paper substrate. In that case, from the viewpoint of transferability, the thickness of the pressure-sensitive adhesive layer is within the above range. Above all, it is preferably relatively thick.

  Further, as illustrated in FIG. 6B, the non-pressure sensitive adhesive layer 5 may be formed in a pattern on the pressure sensitive adhesive layer 4. Also in this case, the pattern of the porous conductive layer 3 can be transferred onto the transfer target substrate 11 as shown in FIG. 6C without partially transferring the laminate 1.

Examples of the material of the non-pressure-sensitive adhesive layer include a thermoplastic resin that does not melt at a temperature at which the adhesive layer melts, a thermosetting resin, a photocurable resin, and the like.
The thickness of the non-pressure-sensitive adhesive layer may be any thickness as long as it can bond the pressure-sensitive adhesive layer and the transferred substrate when transferring the laminate of the present invention to the transferred substrate. It is appropriately selected depending on the method, the type of the transferred substrate and the like. Specifically, the thickness of the non-pressure sensitive adhesive layer is preferably in the range of 100 nm to 3 μm.
Examples of the method for forming the non-pressure-sensitive adhesive layer include a method in which the resin composition is applied in a pattern on the pressure-sensitive adhesive layer, dried, and optionally cured. As a coating method of the resin composition, a general coating method can be appropriately selected and applied.

3. Substrate The substrate used in the present invention supports the above-mentioned porous conductive layer and pressure-sensitive adhesive layer.
The substrate is not particularly limited as long as it can form the porous conductive layer, and examples thereof include an inorganic substrate such as a glass substrate and a ceramic substrate, a metal substrate, a resin substrate, and a paper substrate. A material or the like can be used.
Among them, the base material is preferably a resin base material. In the present invention, as will be described later, since it is possible to sinter the metal particles at a low temperature to form the porous conductive layer, it is necessary to use a base material that does not damage the base material and has high heat resistance. Alternatively, a substrate having low heat resistance can be used. In particular, it is very useful in that an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used.

  A general resin base material can be used as the resin base material. Suitable specific examples of the resin base material include polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, polycarbonate, polyetherimide, epoxy resin, phenol resin, glass. -Epoxy resins, polyphenylene ethers, acrylic resins, polyolefins such as polyethylene and polypropylene, polycycloolefins such as polynorbornene, and resin films such as liquid crystalline polymer compounds. Among them, a resin substrate of inexpensive general-purpose plastic such as polyethylene terephthalate is preferable.

  The base material may have flexibility or rigidity, and is appropriately selected according to the method of transferring the laminate of the present invention to the transfer target material, and the like. Above all, it is preferable that the substrate has flexibility. The porous conductive layer described above is porous and exhibits high resistance to bending. Therefore, when the base material has flexibility, it can be transferred to the transferred base material while giving a high curvature to the laminate. Further, for the above-mentioned reason, the resin base material having flexibility is more preferable.

In addition, a release layer may be formed on the surface of the substrate, or a release treatment may be applied. This is because the base material and the porous conductive layer or the protective layer can be easily peeled off.
Examples of the material for the release layer include a fluorine-based release agent, a silicone-based release agent, and a wax-based release agent. Examples of the method of forming the release layer include a method of applying a release agent by a coating method such as dip coating, spray coating, or roll coating.
Further, examples of the mold release treatment include surface treatments such as fluorine treatment and silicone treatment.

  The thickness of the base material is not particularly limited, but in the case of an inorganic base material, it is generally about 0.1 mm to 10 mm, preferably 0.5 mm to 5 mm. On the other hand, in the case of a resin base material, the thickness of the base material is usually about 1.0 μm to 1000 μm. When the thickness of the resin base material is within the above range, the deformation of the base material is suppressed when forming the porous conductive layer, and it is preferable in terms of shape stability of the porous conductive layer to be formed. It is suitable in terms of flexibility when performing the machining process continuously.

4. Other configurations The laminate of the present invention may have other configurations, if necessary, in addition to the above-mentioned substrate, porous conductive layer and pressure-sensitive adhesive layer. For example, an antistatic layer, a heat-resistant protective layer, a scratch-resistant layer, a slipping layer and the like may be provided on the surface of the substrate opposite to the surface on which the porous conductive layer is formed. Further, a protective layer may be formed between the base material and the porous conductive layer. Hereinafter, the protective layer will be described.

(Protective layer)
In the present invention, as illustrated in FIG. 8A, the protective layer 6 may be formed between the base material 2 and the porous conductive layer 3. As shown in FIG. 8B, the protective layer 6 becomes the outermost layer of the conductive base material 10 after the porous conductive layer 3 is transferred from the laminate 1 to the transfer target material 11, The porous conductive layer 3 can be protected from abrasion, light, chemicals and the like. Moreover, the porous conductive layer can be insulated by using the insulating protective layer.

The material of the protective layer may be any material that can protect the porous conductive layer and has an insulating property, and examples thereof include an ultraviolet curable resin and an electron beam curable resin. Moreover, the protective layer may further contain a filler.
A protective film may be used as the protective layer.

Examples of the method of forming the protective layer include a method of applying a curable resin composition on a base material and drying the composition. Examples of the method of applying the curable resin composition include a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, and a gravure reverse roll coating method.
When a protective film is used as the protective layer, the base material and the protective film can be bonded together via the weak adhesive layer. It is preferable that when the base material is peeled off, the weak adhesion layer can peel off the weak adhesion layer together with the base material.

  The thickness of the protective layer is preferably in the range of 0.5 μm to 30 μm, more preferably in the range of 3 μm to 15 μm. When the thickness of the protective layer is within the above range, excellent physical properties such as high hardness, scratch resistance, chemical resistance and stain resistance can be obtained, and further excellent moldability and shape followability can be obtained. it can.

5. Form The form of the laminate of the present invention is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer can be transferred onto the transferred substrate, and examples thereof include a sheet shape and a belt shape.
Above all, in the present invention, it is preferable that the laminate has a strip shape. This is because the porous conductive layer can be easily formed in a desired wiring pattern on the transferred substrate. In this case, the base material is preferably flexible.

When the form of the laminate is strip-like, the line width of the laminate can be appropriately selected according to the application and is not particularly limited, but within a range of 0.5 mm to 50 mm, and particularly within a range of 1.0 mm to 30 mm. In particular, it is preferably in the range of 1.0 mm to 10 mm.
When the line width is within the above range, the transfer tool of the known correction tape can be applied to the transfer tool of the laminate, and the porous conductive layer on the transferred substrate can be easily formed into a desired wiring pattern. This is because it can be formed.

  The strip-shaped laminate can be obtained, for example, by forming a pressure-sensitive adhesive layer and a porous conductive layer on a strip-shaped base material. Further, the strip-shaped laminated body can be obtained by cutting the sheet-shaped laminated body with a predetermined line width.

6. Applications The laminate of the present invention can be used for producing a conductive base material as described later, and for example, a printed wiring board, an electromagnetic wave shielding material, an antenna, a power semiconductor, a noise filter, a capacitor electrode, electrodes for various sensors ( Touch sensor, biosensor, temperature sensor, gas sensor, optical sensor, pressure sensor, flow sensor), electrode for display, electrode for solar cell, IC card, RFID, etc. ..
Further, the laminated body of the present invention can be used as an electromagnetic wave shield layer for preventing unauthorized reading of information recorded in a non-contact type IC card and a conductive layer for modulating a resonance frequency. For example, it is possible to attach a porous conductive layer to a part of the card, transport the card in a non-readable state, and scratch and remove the entire pressure-sensitive adhesive layer at the time of use. Since the laminate of the present invention has the porous conductive layer, it can be easily peeled off by scratching by controlling the adhesive force of the pressure-sensitive adhesive layer.
The laminate of the present invention can also be used for forming designs, designs, characters, etc. that make use of the color and gloss of the porous conductive layer.

B. Manufacturing Method of Conductive Base Material The manufacturing method of the conductive base material of the present invention comprises a preparatory step of preparing the above-mentioned laminate, the pressure-sensitive adhesive layer of the laminate and the porous conductive material on the transferred substrate. And a transfer step of transferring the layer by pressurizing the layer.

  2(a) to (c), FIG. 3(a) to (c), FIG. 4(a), and (b) are process diagrams showing an example of the method for producing a conductive base material of the present invention. 2(a) to 2(c), 3(a) to 3(c), 4(a) and 4(b) are described in detail in the above "A. Laminated body". The description is omitted.

  In the present invention, since the resin contained in the pressure-sensitive adhesive layer can be allowed to enter inside the pores of the porous conductive layer, not only the surface area where the porous conductive layer and the pressure-sensitive adhesive layer are bonded is increased, The anchor effect can enhance the adhesion between the porous conductive layer and the pressure-sensitive adhesive layer. Therefore, in the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer can be satisfactorily transferred to the transferred substrate, and excellent transferability can be obtained.

  Further, in the present invention, since a pressure-sensitive adhesive or a pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer, heating is not required at the time of transferring the laminate onto the transfer substrate, and the porous conductive layer It is possible to suppress a decrease in conductivity and distortion of the laminated body due to the oxidation of.

  Further, in the present invention, since the porous conductive layer is porous and thus imparts brittleness, unlike the conventional vapor deposition layer, burrs are less likely to occur during transfer and large crystal grains are not included. Therefore, good foil breakability can be obtained. Furthermore, as illustrated in FIGS. 3A to 3C, when the patterns of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the transferred substrate, it is possible to transfer them with good resolution. it can. In addition, by using a belt-shaped laminate as illustrated in FIGS. 4A and 4B, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer can be easily formed on the transfer target substrate by using a transfer tool. Can be transcribed.

  Further, in the present invention, since it is possible to sinter the metal particles at a low temperature to form the porous conductive layer, it is not necessary to use a highly heat-resistant substrate as the substrate of the laminate, and the heat resistance is low. Substrates can also be used. In particular, an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate can be used. Therefore, the manufacturing cost can be reduced.

  Further, since the pressure-sensitive adhesive layer and the porous conductive layer are transferred onto the transfer-receiving substrate, it is possible to use, as the transfer-receiving substrate, a substrate which has been conventionally difficult to form a porous conductive layer. .. Therefore, an inexpensive general-purpose plastic resin substrate such as polyethylene terephthalate or a conductive substrate having a porous conductive layer formed on a transfer substrate such as a paper substrate can be obtained. Furthermore, it is also possible to form a porous conductive layer on the transfer-receiving substrate, which is a three-dimensional object. In addition, the conductive base material can be easily manufactured by simply pressing and transferring the pressure-sensitive adhesive layer and the porous conductive layer onto the transfer target material.

  Hereinafter, each step in the method for producing a conductive substrate of the present invention will be described.

1. Preparation Step The preparation step in the present invention is a step of preparing the above-mentioned laminated body.
The laminated body is described in detail in the above “A. Laminated body”, and thus the description thereof is omitted here.

2. Transfer Step The transfer step in the present invention is a step of transferring the pressure-sensitive adhesive layer and the porous conductive layer of the above-mentioned laminate on the transferred substrate by applying pressure.

  The substrate to be transferred is not particularly limited as long as it can transfer by applying pressure to the porous conductive layer via the pressure-sensitive adhesive layer, and is appropriately selected depending on the application of the conductive substrate. Selected. For example, a resin base material, a paper base material, a glass base material, a ceramics base material, a metal base material and the like can be mentioned.

  As a method for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate onto the transfer-receiving substrate by pressure, a method of adhering the pressure-sensitive adhesive layer at a predetermined position on the transfer-receiving substrate is used. The method is not particularly limited as long as it is available, and examples thereof include a method using a roller or a stamp and a method for pressing.

  In addition, as illustrated in FIGS. 3A to 3C, when the patterns of the pressure-sensitive adhesive layer and the porous conductive layer are transferred onto the transfer target substrate under pressure, a transfer method is, for example, Examples thereof include a method of using a relief plate and a method of drawing a laminate using a protrusion such as a needle.

  When the pressure-sensitive adhesive layer and the porous conductive layer are transferred by pressure onto the transfer-receiving substrate, the patterns of the pressure-sensitive adhesive layer and the porous conductive layer may be transferred by pressing on the transfer-receiving substrate. Good. It is possible to obtain a conductive base material in which a pattern of the porous conductive layer is formed on the transferred base material.

When the patterns of the pressure-sensitive adhesive layer and the porous conductive layer are pressed and transferred onto the transfer-receiving substrate, the method using a relief plate or a needle may be applied as described above. The laminated body 1 in which the pressure-sensitive adhesive layer 4 illustrated in a) is formed in a pattern in advance may be used, and the pressure-sensitive adhesive layer 4 illustrated in FIG. You may use the laminated body 1 in which the layer 5 was formed in the pattern.
In addition, in the case of transferring the pattern of the porous conductive layer onto the transfer target material by applying pressure, in addition to the above, a belt-shaped laminate may be used as shown in FIG. You may use the laminated body 1 by which the porous electroconductive layer 3 illustrated in 5 (a) was previously formed in pattern.

  After adhering the pressure-sensitive adhesive layer of the laminate to the transferred substrate, the pressure-sensitive adhesive layer was usually adhered to the transferred substrate by physically separating the laminate from the substrate side. The substrate can be peeled from the porous conductive layer in the region.

  In the present invention, when a flexible base material is used as the base material of the laminate, the base material is separated from the porous conductive layer by physically separating the laminate from the base material side while bending the base material. This is preferable since it can be easily transferred to a three-dimensional object having a complicated shape such as a curved surface, a stepped shape, and a cornered shape.

3. Connection Step In the present invention, in the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the transfer target material by applying pressure to transfer the first layer, as shown in FIG. A pressure sensitive adhesive layer 4c, a first porous conductive layer 3a, and a second pressure sensitive adhesive layer 4d and a second porous conductive layer 3b are laminated to form a laminated portion X, and a pressure P is applied to the laminated portion X. Therefore, as shown in FIG. 9B, a connection step of electrically connecting the first porous conductive layer 3a and the second porous conductive layer 3b may be included.
9A and 9B are process diagrams showing an example of a connecting process in the method for producing a conductive base material of the present invention. Although not shown, the first porous conductive layer and the second porous conductive layer can be electrically connected to each other by heating the laminated portion.

  Since it is possible to electrically connect the first porous conductive layer and the second porous conductive layer in the pressed region in the above-mentioned laminated portion, it is possible to easily form the laminated porous conductive layers in the conductive base material. Can be conducted by any method. More specifically, since the first porous conductive layer and the second porous conductive layer are porous, they are included in the second pressure-sensitive adhesive layer within the porous film by pressing the laminated portion. Resin can be introduced, and the first porous conductive layer and the second porous conductive layer can be contacted and electrically connected.

  Further, in the present invention, although not shown, the first porous conductive layer and the second porous conductive layer may be electrically connected in the entire area of the above-described laminated portion, and as shown in FIG. 9(b). The one porous conductive layer 3a and the second porous conductive layer 3b may be electrically connected in a part of the laminated portion X. In this case, the second pressure-sensitive adhesive layer can be used as the insulating layer of the first porous conductive layer and the second porous conductive layer in the unpressurized region of the laminated portion.

  The first pressure-sensitive adhesive layer and the first porous conductive layer may be formed on the entire area of the transfer target substrate, or may be formed in a predetermined pattern. Further, the second pressure-sensitive adhesive layer and the second porous conductive layer may be formed on the entire area of the transfer-receiving substrate or may be formed in a predetermined pattern.

  In the present invention, the first porous conductive layer and the second porous conductive layer can be electrically connected by subjecting the laminated portion to at least one of heat treatment and pressure treatment. The laminated portion may be subjected to heat treatment, pressure treatment, or both heat treatment and pressure treatment.

  The pressure treatment method for the laminated portion is not particularly limited as long as it is a method capable of electrically connecting the first porous conductive layer and the second porous conductive layer, and for example, the second porous conductive layer There is a method of pressing with a predetermined pressure from the side, for example, a method of pressing with a roller, a stamp, a press, a relief plate, a needle-shaped one, or a pen point-shaped one. In particular, a method of applying a lateral shearing force such as pressing with a roller or rubbing with a needle-shaped object to draw is preferable because the pressure-sensitive adhesive is softened by the shearing force and easily transferred.

  Examples of the heat treatment method for the laminated portion include a heating roller, a hot stamp, a heat press, a needle-shaped or pen-tip-shaped spot heating from the second conductive layer side, and heating by electromagnetic waves such as infrared rays and lasers.

  As a method of performing both the pressure treatment and the heat treatment of the laminated portion at the same time, for example, a method of heating the laminated portion by rubbing the surface of the laminated portion when pressure is applied can be mentioned.

C. Method for Manufacturing Electronic Device The method for manufacturing an electronic device according to the present invention is characterized by having a conductive base material manufacturing step for manufacturing a conductive base material by the above-described conductive base material manufacturing method. ..

In the present invention, since the conductive substrate is produced by the above-described method for producing a conductive substrate, it is possible to form a porous conductive layer having good conductivity. Further, for example, when forming a pattern of the porous conductive layer, a high resolution pattern can be formed.
Further, in the present invention, since the conductive base material is manufactured by the above-described method for manufacturing the conductive base material, the manufacturing cost can be reduced.

  The steps in the method for manufacturing an electronic device of the present invention will be described below.

1. Conductive Base Material Making Step The conductive base material making step in the present invention is a step of making a conductive base material by the above-described conductive base material manufacturing method.
Since the method for producing the conductive base material has been described in detail in the above “B. Method for producing the conductive base material”, the description thereof is omitted here.

2. Other Steps The electronic device manufacturing method of the present invention may include other steps, if necessary, in addition to the conductive base material manufacturing step. Other steps are appropriately selected according to the electronic device.

3. Electronic Device As the electronic device in the present invention, for example, a printed wiring board, an electromagnetic wave shielding material, an antenna, a power semiconductor, a noise filter, a capacitor electrode, various sensor electrodes (touch sensor, biosensor, temperature sensor, gas sensor, optical sensor) , Pressure sensor, flow sensor), display electrode, solar cell electrode, IC card, RFID and the like.
When the electronic device of the present invention is, for example, a non-contact type IC card, the porous conductive layer is an electromagnetic wave shield layer for preventing unauthorized reading of information recorded on the non-contact type IC card, and a resonance frequency. Can be used as a conductive layer for modulating the. Further, in this case, it is possible to temporarily apply the porous conductive layer to the non-contact type IC card and then scratch and remove it together with the pressure-sensitive adhesive layer. Since the non-contact type IC card has the porous conductive layer, it can be easily peeled off by scratching by controlling the adhesive force of the pressure-sensitive adhesive layer.

D. Transfer Tool The transfer tool of the present invention is used for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the belt-shaped laminate described above onto the substrate to be transferred by using the laminate described above. The above-mentioned laminate, the unwinding reel that unwinds the pressure-sensitive adhesive layer of the laminate outside, the pressure-sensitive adhesive layer and the porosity of the laminate that are drawn from the unwind reel. Head for transferring a conductive conductive layer onto the substrate to be transferred by transferring, a take-up reel for winding up the substrate after transfer of the pressure-sensitive adhesive layer and the porous conductive layer, an unwind reel, and An interlocking mechanism that rotates the take-up reel in an interlocking manner is provided.

  The transfer tool of the present invention will be described with reference to the drawings. FIG. 4A is a schematic view showing an example of the transfer tool of the present invention. The transfer tool 20 shown in FIG. 4A includes a laminate 1, an unwind reel 21 that unwinds the pressure-sensitive adhesive layer 4 of the laminate 1 on the outside, and a laminate 1 that is unwound from the unwind reel 21. A transfer head 22 that pressurizes and transfers the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 onto the substrate 11 to be transferred, and the substrate 2 after the transfer of the pressure-sensitive adhesive layer 4 and the porous conductive layer 3 is wound. It has a take-up reel 23 and an interlocking mechanism 24 that rotates the take-up reel 21 and the take-up reel 23 in an interlocking manner. The take-up reel 21 is rotatably supported by a support shaft 25, and the take-up reel 23 is rotatably supported by a support shaft 26. The transfer head 22 is composed of a plate-shaped member whose front end on the transfer substrate 11 side is thin, and has a flange 27 for preventing the stacking transfer body 1 from coming off the transfer head. The interlocking mechanism 24 is formed so as to rotate at the same angular speed as the take-up reel 21 and the first gear 24a formed so as to rotate at the same angular speed as the take-up reel 23. And a second gear 24b having a smaller number of teeth than the first gear 24a. The laminated body 1, the unwinding reel 21, the transfer head 22, the winding reel 23, and the interlocking mechanism 24 are housed in a case 28. The case 28 has a guide pin 29 for disposing the laminated body 1 at a predetermined position in the case 28.

  In the present invention, by using the transfer tool of the present invention, the pattern of the porous conductive layer can be easily formed on the transferred substrate by using the above-mentioned strip-shaped laminate in the method for producing the conductive substrate. can do.

  Hereinafter, details of the transfer tool used in the present invention will be described.

1. Laminated body The laminated body used in the present invention has a strip shape. The details of the laminated body can be the same as those described in the above-mentioned section "A. Laminated body", and thus the description thereof is omitted here.

2. Unwinding Reel The unwinding reel used in the present invention unwinds with the adhesive layer of the laminate above.
The unwinding reel is not particularly limited as long as it can be unwound with the pressure-sensitive adhesive layer side of the laminate being the outer side, and it can be the same as that used for a general transfer tool, and therefore the description here will be made. Is omitted. The take-up reel is usually rotatably supported by a support shaft.

3. Transfer Head The transfer head used in the present invention transfers the pressure-sensitive adhesive layer and the porous conductive layer of the laminate, which are pulled out from the unwinding reel, onto the transfer target substrate.

  The transfer head is not particularly limited as long as the pressure-sensitive adhesive layer and the porous conductive layer of the laminate can be transferred onto the transfer target substrate, and for example, a taper shape in which the tip on the transfer target substrate side is gradually thinned It has a plate-shaped member and a roller member for pressing. Further, the transfer head may further have a flange for preventing the stacking transfer body from coming off from the transfer head. The form and material of the transfer head can be the same as the configuration of a general transfer tool. For example, the transfer head described in Japanese Patent Application Laid-Open No. 2009-238676 can be used.

4. Take-up reel The take-up reel used in the present invention is for taking up the base material after the transfer of the adhesive layer and the porous conductive layer.
The take-up reel is not particularly limited as long as it can wind up the base material after transfer of the adhesive layer and the porous conductive layer, and can be the same as that used for a general transfer tool, The description here is omitted. The take-up reel is usually rotatably supported by a support shaft.

5. Interlocking Mechanism The interlocking mechanism used in the present invention rotates the unwinding reel and the winding reel in an interlocking manner.

  The interlocking mechanism is not particularly limited as long as the take-up reel and the take-up reel can be interlocked and rotated so that the laminate has a certain tension so as not to loosen between the take-up reel and the take-up reel. For example, a first gear that is formed to rotate at the same angular speed as the take-up reel and a first gear that is formed to rotate at the same angular speed as the take-up reel are used by being meshed with the first gear. May also be an interlocking mechanism having a second gear with a small number of teeth. Further, it may be an interlocking mechanism having an unwinding pulley coaxially provided with the unwinding reel, a winding pulley coaxially provided with the winding reel, an unwinding pulley, and a belt connecting the unwinding pulley.

6. Case In the transfer tool of the present invention, the above-mentioned laminated body, the unwinding reel, the winding reel, and the interlocking mechanism are usually arranged in a case. Further, the case may have a guide pin, a guide roll, etc. for arranging the laminated body at a predetermined position in the case. The case may be the same as that used in a general transfer tool, and therefore the description thereof is omitted here.

7. Others In the present invention, the transfer tool may be configured by disposing a laminated body instead of the correction tape of the known transfer tool used for the correction tape or the like.

8. Use The transfer tool of the present invention can be suitably used when transferring the wiring pattern of the pressure-sensitive adhesive layer and the porous conductive layer onto the transfer-receiving substrate in the above-mentioned method for producing a conductive substrate.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, has substantially the same configuration as the technical idea described in the scope of the claims of the present invention, and has the same operational effect It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Synthesis Example 1: Synthesis of copper particles]
In a 200 ml three-necked flask, 10.0 g of copper hydroxide (manufactured by Wako Pure Chemical Industries), 34.5 g of decanoic acid (Lunack 10-98 manufactured by Kao), and 18.5 g of propylene glycol monomethyl ether (PGME) were weighed out. .. The mixture was heated to 100° C. with stirring and maintained at that temperature for 20 minutes. After that, 41.3 g of 3-ethoxypropylamine (manufactured by Koei Chemical Industry Co., Ltd.) was added, and the mixture was heated and stirred at 100° C. for 10 minutes. The mixture was cooled to 10° C. using an ice bath, and then a solution prepared by dissolving 10.0 g of hydrazine monohydrate in 18.5 g of PGME (manufactured by Kanto Kagaku Co., Ltd.) in an ice bath was added, followed by 10 minutes. It was stirred. Then, the reaction solution was heated to 100° C. and maintained at that temperature for 10 minutes. After cooling to 30° C., 66 g of hexane was added. After centrifugation, the supernatant was removed. The precipitate was washed with hexane to obtain copper particles.
When the obtained copper particles were observed with a transmission electron microscope (TEM), the average primary particle size was 65 nm.

[Preparation Example 1: Preparation of copper particle dispersion]
40 parts by mass of the copper particles obtained in Synthesis Example 1, 4 parts by mass of Solsperse 41000 (manufactured by Lubrizol) as a polymer dispersant, and 56 parts by mass of propylene glycol monomethyl ether (PGME) were mixed, and a paint shaker (manufactured by Asada Iron Works). Then, as a preliminary dispersion, 2 mm zirconia beads were dispersed for 1 hour, and as a main dispersion, 0.1 mm zirconia beads were dispersed for 2 hours to obtain a copper particle dispersion.

[Production Example 1: Preparation of conductive film A]
A copper film dispersion is applied to a PET film (trade name: Cosmo Shine A4100, manufactured by Toyobo, film thickness 100 μm) using a bar coater #4, and dried with a warm air dryer at 80° C. for 3 minutes to give a film with a red copper luster. Got After that, while introducing hydrogen gas at an introduction pressure of 20 Pa, using a microwave surface wave plasma processing apparatus (MSP-1500, manufactured by Micro Denshi Co., Ltd.), it was baked at a microwave output of 450 W for 240 seconds to form a porous conductive layer. The obtained conductive film A was obtained.

[Production Example 2: Production of conductive film B]
Nano Ag ink (trade name MDot CF107, manufactured by Mitsuboshi Belting Co., Ltd.) is diluted with pentanediol by 40%, and then applied to a PET film (trade name, Cosmoshine A4100, manufactured by Toyobo, film thickness 100 μm) using a bar coater #4 and heated. It was dried and baked at 120° C. for 30 minutes with an air dryer to obtain a conductive film B having a silver luster and a porous conductive layer.

[Production Example 3: Preparation of conductive film C]
Copper was deposited on a PET film (trade name: Cosmo Shine A4100, manufactured by Toyobo, film thickness 100 μm) by a sputtering method to obtain a conductive film C having a conductive layer.

[Evaluation]
(Measurement of sheet resistance value of porous conductive layer and conductive layer)
The electroconductivity of the porous electroconductive layer and the electroconductive layer was evaluated by measuring the sheet resistance value by the 4-probe method using a surface resistance meter (“Loresta GP” manufactured by Dia Instruments Co., Ltd., PSP type probe). The sheet resistance values of the porous conductive layers of the conductive films A and B were both 0.20 Ω/□, and the sheet resistance value of the conductive layer of the conductive film C was 0.08 Ω/□.

(Measurement of thickness of porous conductive layer and conductive layer)
The film thickness of the porous conductive layer and the conductive layer was evaluated as follows. Regarding the produced conductive films A and B, carbon was sequentially laminated on the porous conductive layer as a protective layer by a vacuum vapor deposition method, and platinum was sputtered, and then FIB (focused ion beam, FB-2100 manufactured by Hitachi High-Tech) was used. After stacking tungsten by using the above, a cross section of the porous conductive layer was prepared. After that, the cross section of the porous conductive layer was observed with the substrate tilted at 45° using SEM (S-4800 manufactured by Hitachi High-Tech), and the film thickness was measured from the SEM image. The film thickness was measured at 10 locations in the SEM image measured at a magnification of 30 k to 40 k, and after correcting the inclination, the average value was taken as the film thickness. The film thickness of the conductive layer of the conductive film C was also evaluated in the same manner as for the porous conductive layer. The thickness of the porous conductive layer of conductive film A was 400 nm, the thickness of the porous conductive layer of conductive film B was 380 nm, and the thickness of the porous conductive layer of conductive film C was 400 nm. From these results, it was found that the conductive film A had a volume resistance value of 8.0 μΩ·cm, the conductive film B had a volume resistance value of 7.6 μΩ·cm, and the conductive film C had a volume resistance value of 3.0 μΩ·cm. It was

(Measurement of porosity of porous conductive layer and conductive layer)
The porosity of the porous conductive layer and the conductive layer was measured as follows. In the SEM image obtained in the film thickness measurement, the area of the holes and the area of the copper were calculated, and the area of the holes was divided by the area of the porous copper layer to obtain the porosity in the cross section. It was The porosity of the porous conductive layer of the conductive film A was 35%, the porosity of the porous conductive layer of the conductive film B was 30%, and the porosity of the conductive layer of the conductive film C was 0%.

[Example 1-1: Transfer laminate 1]
A pressure-sensitive adhesive (Nippon Paper Industries Auroren 200MX) was applied on the copper surface of the conductive film A with a bar coater #4 and dried with a warm air dryer at 90° C. for 30 seconds. A pressure sensitive adhesive layer of about 1.5 μm was formed.

[Example 1-2: Transfer laminate 2]
A procedure similar to that of the transfer laminate 1 except that the pressure sensitive adhesive of the transfer laminate 1 was changed to a mixture of Nippon Paper Industries Auroren 200MX and Auroren 350MX at a weight ratio of 1:2. Then, a transfer laminate 2 was prepared.

[Example 1-3: Transfer laminate 3]
A transfer laminate 3 was produced in the same procedure as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to the conductive film B.

[Comparative Example 1: Transfer laminate 4]
A transfer laminate 4 was produced by the same procedure as the transfer laminate 1 except that the conductive film A of the transfer laminate 1 was changed to the conductive film C.

[Evaluation]
Regarding the transfer laminates 1 to 4, the pressure-sensitive adhesive-coated surface was placed on a commercially available high-quality paper, and the PET film was peeled off from the back surface by pressing with a resin spatula. The transferability was visually confirmed, and the sheet resistance value of the transfer product was measured. The results are shown in Table 1. The transferability in the table is represented by the ratio of the area of the conductive layer transferred to the transferred material to the area of the conductive layer of the transfer etc. laminate before transfer. The conductive layer that was not transferred remained in the transfer laminate.

[Example 2-1 to Example 2-3 and Comparative Example 2]
Regarding the transfer laminates 1 to 4, the laminate is cut into a width of 5 mm, a transfer tool including an unwind reel, a resin transfer head, and a take-up reel is prepared, and the transfer laminate is rolled into the unwind reel. Fixed. Subsequently, a commercially available high-quality paper was pressed with a transfer head so that the pressure-sensitive adhesive-coated surface of the transfer laminate came to the surface, the transferability thereof was visually confirmed, and the sheet resistance value of the transfer product was measured. The results are shown in Table 2.

[Examples 3-1 to 3-3 and Comparative Example 3]
Regarding the transfer laminates 1 to 4, a continuous pattern was drawn by pressing on a commercially available high-quality paper with a pen tip of a ballpoint pen from which the ink was removed so that the pressure-sensitive adhesive application surface of the transfer laminate came. The transferability was visually confirmed, and both ends of the pattern were measured with a tester to check the presence or absence of continuity. The results are shown in Table 3.

  In Comparative Example 3, the conductive layer in the transfer laminate 4 was partially transferred onto the high-quality paper which is the substrate to be transferred, but the conductive layer in the transfer laminate 4 could not be transferred onto the high-quality paper. It was

[Example 4-1 to Example 4-3]
Regarding transfer laminates 1 to 3, a commercially available cardboard-assembled package was packaged, and the ink was removed so that the pressure sensitive adhesive application surface of the transfer laminate was on the package surface. A continuous pattern was drawn so as to press the tip and make one round on the side surface of the package. Both ends of the pattern were measured with a tester to check the presence or absence of continuity. The results are shown in Table 4.

[Example 5]
Using the transfer laminate 1 of Example 2-1, a commercially available high-quality paper was pressed by a transfer head so that the pressure-sensitive adhesive-coated surface of the transfer laminate 1 came to the line of the porous conductive layer. The pattern was transferred. Further, the porous conductive layer is pressed by a transfer head so that the surface of the transfer laminate coated with the pressure-sensitive adhesive is placed on a commercially available high-quality paper so as to cross the line pattern of the transferred porous conductive layer. The line pattern was transferred. As shown in FIG. 10, a transfer product in which the line patterns of the porous conductive layers 31 and 32 intersect on a high-quality paper which is the transfer-receiving substrate 11 was produced. When a tester was applied to the ends Y and Z of the line patterns of the respective porous conductive layers 31 and 32 and examined, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were conductive.

[Example 6]
Regarding the transfer laminate 2 in Example 2-2, a transfer product in which the line patterns of the porous conductive layers 31 and 32 shown in FIG. 10 intersect was produced in the same manner as in Example 5. When a tester was applied to the ends Y and Z of the line patterns of the respective porous conductive layers 31 and 32 and examined, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were not conductive.
Further, as shown in FIG. 10, pressure was applied to the intersection X of the line patterns of the two porous conductive layers 31 and 32 using a rod made of silicone rubber. When the end portions Y and Z of the line patterns of the two porous conductive layers after pressurization were applied to a tester and checked, it was confirmed that the line patterns of the two porous conductive layers 31 and 32 were conductive. did.

[Example 7]
Adhesive patterns of two types of commercially available tape paste (dot liner petit (heart pattern), dot liner petit (star pattern), KOKUYO S&T) were copied onto the conductive film A to obtain a transfer laminate. Next, when the adhesive pattern surface of the above-mentioned transfer laminate was overlaid on a commercially available high-quality paper as a transfer base material and pressed by a resin spatula, a copper film was formed in a pattern (heart shape, star shape). I was able to transfer it.

1... Laminated body 2... Base material 3... Porous conductive layer 3a... 1st porous conductive layer 3b... 2nd porous conductive layer 4... Pressure-sensitive adhesive layer 4c... 1st pressure-sensitive adhesive layer 4d... 2nd pressure-sensitive Adhesive layer 6... Protective layer 10... Conductive substrate 11... Transferred substrate

Claims (13)

Base material,
A porous conductive layer formed on the substrate,
Have a said porous conductive layer pressure-sensitive adhesive layer formed on,
The porous conductive layer is a sintered body of metal nanoparticles,
Laminate the pressure-sensitive adhesive layer, wherein the porous conductive layer base material, characterized that you have been arranged in a pattern on the main surface of the opposite side. Base material,
  A porous conductive layer formed on the substrate,
  A pressure-sensitive adhesive layer formed on the porous conductive layer
  Have
  The porous conductive layer is a sintered body of metal nanoparticles,
  A laminate, wherein a non-pressure-sensitive adhesive layer is arranged in a pattern on the main surface of the pressure-sensitive adhesive layer opposite to the base material. Base material,
  A porous conductive layer formed on the substrate,
  A pressure-sensitive adhesive layer formed on the porous conductive layer
  Have
  The porous conductive layer is a sintered body of metal nanoparticles,
  A laminate, wherein the pressure-sensitive adhesive layer is a photosensitive resin whose tackiness or adhesiveness is reduced by light irradiation. The said base material is a resin base material, The laminated body in any one of Claim 1 to Claim 3 characterized by the above-mentioned.   The laminate according to any one of claims 1 to 4, wherein the porous conductive layer contains a metal.   A laminate according to any one of claims 1 to 5, wherein a protective layer is formed between the base material and the porous conductive layer.   The laminate according to any one of claims 1 to 6, wherein the laminate has a strip shape.   A preparatory step of preparing the laminate according to any one of claims 1 to 7;
  A transfer step in which the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the transferred substrate by applying pressure;
  A method for producing a conductive base material, comprising:   9. The transfer step, wherein the pattern of the pressure-sensitive adhesive layer and the porous conductive layer is pressed and transferred onto the transfer target substrate by using the belt-shaped laminate. A method for manufacturing a conductive substrate.   In the transfer step, the pressure-sensitive adhesive layer and the porous conductive layer of the laminate are transferred onto the substrate to be transferred by applying pressure to transfer the first pressure-sensitive adhesive layer and the first porous conductive layer, Forming a laminated portion in which the second pressure-sensitive adhesive layer and the second porous conductive layer are laminated,
  Furthermore, the method has a connection step of electrically connecting the first porous conductive layer and the second porous conductive layer by performing at least one of heat treatment and pressure treatment on the laminated portion. 10. The method for producing a conductive base material according to claim 8 or claim 9.   A method for manufacturing a conductive base material according to any one of claims 8 to 10, further comprising: a conductive base material manufacturing step for manufacturing a conductive base material. Method.   A transfer tool used for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the belt-shaped laminate on the substrate to be transferred using the laminate according to claim 7. ,
  The laminate,
  An unwinding reel that unwinds the pressure-sensitive adhesive layer of the laminate outside.
  A transfer head for transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate pulled out from the unwinding reel onto the transfer-receiving substrate by pressing;
  A take-up reel that winds the substrate after the transfer of the pressure-sensitive adhesive layer and the porous conductive layer,
  An interlocking mechanism that rotates the unwinding reel and the take-up reel in an interlocking manner
  A transfer tool comprising:   A base material, a porous conductive layer formed on the base material, and a pressure-sensitive adhesive layer formed on the porous conductive layer, wherein the porous conductive layer is formed by baking metal nanoparticles. A step of preparing a laminated body which is a united body,
  A transfer step of transferring the pressure-sensitive adhesive layer and the porous conductive layer of the laminate on a transfer substrate,
  Have
  In the transfer step, the pattern of the pressure-sensitive adhesive layer and the porous conductive layer of the laminate is transferred onto the transfer target substrate, the method for producing a conductive substrate.

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