JP6682963B2 - Method for manufacturing multilayer wiring board and laminated board for peeling - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer wiring board having an extremely thin plate used for a semiconductor element mounting package, and a peeling laminated board used for the manufacturing.

  In recent years, advances in mobility and space saving have been accelerating, and wiring boards for mounting semiconductor elements and chips are becoming smaller and thinner, along with environmental measures and cost reduction. In addition to high integration, semiconductor packages are required to meet high demands in various aspects such as product integration, mobility, reliability and performance.

  In the semiconductor package field, further growth of flip chip ball grid arrays (FCBGA) is expected. Moreover, the growth of package-on-package (POP) is remarkable, and the development of through vias corresponding to the high integration of three-dimensional packaging is being continued every day.

  As in the past, the flip chip package has been shifting from wire bond to flip chip in the mounting technology for processors and wireless devices due to its electrical characteristics and miniaturization. Regarding package substrates, many high-end devices have already been switched from wire bonding to flip chips, and miniaturization of bump pitch is being pursued further from the viewpoint of mounting density on chips.

  Further, there is an increasing demand for a miniaturized package such as a so-called chip size package (CSP; Chip Size / Scale Package) having a size substantially equal to that of a semiconductor chip. On the other hand, the wiring which can be formed with a high yield by the subtractive method of forming the wiring by etching has a conductor width (L) / conductor gap (S) of about 50 μm / 50 μm.

  When the wiring has a finer conductor width / conductor gap = 35 μm / 35 μm, a relatively thin electroless metal plating layer is formed on the surface of the base material, a plating resist is formed thereon, and electrolytic metal plating is performed. A semi-additive method is required in which a conductor is formed to have a required thickness, and after the resist is removed, the thin metal plating layer is removed by soft etching.

  As a technique therefor, in Patent Document 1, a prepreg is sandwiched between two sheets of easily peelable sheets with easily peelable metal foil, which are laminated and cured to produce a laminated substrate for peeling, and the laminated layer for peeling. An interlayer insulating resin layer and a wiring pattern are sequentially built up on both surfaces of the substrate to form a multilayer structure. Then, the multilayer structure formed on both sides of the peeling laminated substrate is separated by separating the sheet with the easily peelable metal foil of the peeling laminated substrate to have fine wiring, and the multilayer wiring having an extremely thin plate thickness. Techniques for manufacturing a substrate are disclosed.

  In the technique of Patent Document 1, a peelable laminated substrate is manufactured by laminating a peelable sheet with a peelable metal foil on a prepreg and bonding it to a supporting substrate centered on the insulating resin material of the prepreg cured. However, since the sheet with the easily peelable metal foil is only loosely embedded in the surface layer of the laminated substrate for peeling, the peeling boundary of the sheet with the easily peelable metal foil is easily peeled due to the stress of manufacturing the multilayer wiring board. There is a problem that the end of the attached sheet is peeled off from the surface of the peeling laminated substrate, the peeling interface of the end face of the easily peelable metal foil-exposed sheet is exposed, and the peeling interface is peeled off during the production, resulting in defective production.

  In addition, since the boundary line for peeling is shallow from the surface layer of the laminated substrate for peeling, the chemical solution penetrates from the surface layer of the laminated substrate for peeling and reaches the boundary line for peeling, and the easily peelable sheet with metal foil peels off from the boundary line. was there.

  Further, in Patent Document 2, it is possible to solve the problem that the sheet with the easily peelable metal foil of the peeling laminated substrate peels off during the production due to the stress in the manufacturing process of the multilayer wiring board, and to improve the manufacturing yield of the multilayer wiring board. Made it happen.

JP, 2011-119501, A JP, 2014-146761, A

  As a specific measure of Patent Document 2, a wiring board in which a sheet with an easily peelable metal foil composed of a base material and a peelable metal layer is installed with the metal layer exposed on the surface, and the sheet with the easily peelable metal foil is provided. Is smaller than the size of the wiring board, the frame surrounding the sheet with the easily peelable metal foil is made of an insulating resin material, and the resin thin film covering the edge of the surface of the metal layer, the frame, and the surface of the base material are A peeling laminated substrate is used which has an insulating resin material covering the same and forms an easily peelable metal foil-wrapped sheet.

  However, the carrier copper foil layer and the thin copper foil layer of the easily peelable sheet with metal foil do not have sufficient connection strength because of their roles. Prior to the step of separating the multilayer wiring structure formed on the laminated substrate for peeling by peeling the sheet with the easily peelable metal foil due to stress and handling in the manufacturing process, the thin copper foil of the sheet with the easily peelable metal foil It was a problem that the layer peeled off from the carrier copper foil layer. Once the substrate has been peeled off, it cannot be repaired and must be discarded. This problem has caused a decrease in yield.

  An object of the present invention is to solve the problem of peeling of the easily peelable metal foil-attached sheet of the peeling laminated substrate due to stress in the intermediate step of manufacturing a multilayer wiring board using the peeling laminated substrate, and the connection strength is originally sufficient. The carrier copper foil layer and the thin copper foil layer are not to have sufficient physical connection strength. Accordingly, it is an object to eliminate the problem that the thin copper foil layer is peeled off from the carrier copper foil layer during manufacturing, and to improve the yield of the multilayer wiring board.

  In order to achieve the above-mentioned object, the present invention is a peeling laminated substrate used in an intermediate step of manufacturing a multilayer wiring board, wherein an easily peelable metal having a thin metal foil layer and a carrier metal foil layer outside a supporting substrate. A foiled sheet is disposed, the thin metal foil layer is directed to the side opposite to the support substrate, and an insulating resin material layer is provided outside the thin metal foil layer. A thin metal foil penetrating via hole hole penetrating a metal foil layer to reach the carrier metal foil layer, and an interlayer connection via hole hole penetrating the insulating resin material to reach the thin metal foil layer, the thin metal foil penetrating A laminated substrate for peeling, wherein the via hole hole and the interlayer connection via hole hole are filled with the same metal.

  The present invention prevents a sheet with an easily peelable metal foil from peeling during manufacturing due to stress in the manufacturing process of a multilayer wiring board by manufacturing a multilayer wiring board using the laminated substrate for peeling of this structure, There is an effect that the manufacturing yield of the wiring board can be improved.

Further, the present invention is the above-mentioned laminated substrate for peeling, wherein the size of the sheet with the easily peelable metal foil is smaller than the size of the supporting substrate, and the outside of the region of the sheet with the easily peelable metal foil is made of an insulating resin material. The edge of the easily peelable metal foil sheet is enclosed by a structure in which an insulating resin material of the frame portion and a resin thin film covering the edge of the easily peelable metal foil sheet are integrally connected to each other. It is a laminated substrate for peeling characterized by having an enclosed structure.

  Further, the present invention is the above-described peeling laminated substrate, wherein the supporting substrate is a substrate having metal foils on both sides.

Further, the present invention, on the outer surface of the support substrate, a sheet with an easily peelable metal foil in which a thin metal foil layer is releasably laminated on a carrier metal foil layer, is adhered with the thin metal foil layer facing outward, A step of laminating an insulating resin material on the outer surface of the sheet with an easily peelable metal foil, forming a thin metal foil through via hole hole that penetrates the insulating resin material and the thin metal foil layer to reach the thin metal foil layer, and A step of forming an interlayer connection via hole hole penetrating an insulating resin material to reach the carrier metal foil layer, and manufacturing a peeling laminated substrate in which the thin metal foil through via hole hole and the interlayer connection via hole hole are filled with a metal plating layer And a step of forming a pattern of a wiring pattern, a thin copper foil penetrating filled via hole and an interlayer connection filled via hole by etching the metal plating layer of the peeling laminated substrate, and A step of forming a multilayer wiring structure in which a plurality of sets of resin insulating layers and interlayer connection filled via holes are built up on the outer surface of the peeling laminated substrate; and a peripheral portion of the peeling laminated substrate including the thin copper foil penetrating filled via holes. A step of exposing a cross section of the easily peelable metal foil-clad sheet to a cut surface by cutting by machining, and then peeling the multilayer wiring structure from the easily peelable metal foil-clad sheet, And a method for manufacturing a multilayer wiring board.

Further, the present invention is the method for manufacturing a multilayer wiring board as described above, wherein the step of forming the thin metal foil through via hole hole and the interlayer connection via hole hole comprises:
Forming a thin metal foil penetrating via hole hole reaching the thin metal foil layer through the insulating resin material;
Removing the thin metal foil layer on the bottom surface of the thin metal foil through via hole hole by quick etching to expose the carrier metal foil layer on the bottom surface of the thin metal foil through via hole hole;
A method of manufacturing a multilayer wiring board, comprising a step of forming an interlayer connection via hole hole that penetrates the insulating resin material and reaches the thin metal foil layer.

Further, the present invention is a method for manufacturing the above multilayer wiring board,
The step of adhering the sheet with the easily peelable metal foil to the outer surface of the supporting substrate, and laminating the insulating resin material on the outer surface of the sheet with the easily peelable metal foil,
A semi-cured insulating resin sheet is overlaid on the outer surface of the support substrate, the sheet with the easily peelable metal foil smaller in size than the support substrate is overlaid on the outer surface of the semi-cured insulating resin sheet, and a lamination process is performed by heating and pressing. By that,
The sheet with the easily peelable metal foil is bonded to the supporting substrate with an insulating resin material obtained by curing the semi-cured insulating resin sheet,
And, the outside of the area of the sheet with the easily peelable metal foil is surrounded by a frame portion made of an insulating resin material, and the insulating resin material of the frame portion and the resin thin film covering the edge portion of the sheet with the easily peelable metal foil are integrally formed. A multilayer wiring board comprising a step of forming a structure for wrapping an edge portion of the sheet with an easily peelable metal foil by a connected structure and a step of laminating an insulating resin material on an outer surface of the sheet with the easily peelable metal foil. Is a manufacturing method.

Further, the present invention is a method for manufacturing the above multilayer wiring board,
The step of adhering the sheet with the easily peelable metal foil to the outer surface of the supporting substrate, and laminating the insulating resin material on the outer surface of the sheet with the easily peelable metal foil,
The semi-cured insulating resin sheet is sandwiched between two sheets of the easily peelable metal foil, and the laminated sheet is heated and pressed to form two sheets of the easily peelable metal foil with the semi-cured insulating resin sheet. Adhere with cured insulating resin material,
And, the outside of the area of the sheet with the easily peelable metal foil is surrounded by a frame portion made of an insulating resin material, and the insulating resin material of the frame portion and the resin thin film covering the edge portion of the sheet with the easily peelable metal foil are integrally formed. A multilayer wiring board comprising a step of forming a structure for wrapping an edge portion of the sheet with an easily peelable metal foil by a connected structure and a step of laminating an insulating resin material on an outer surface of the sheet with the easily peelable metal foil. Is a manufacturing method.

  The present invention provides a plurality of thin copper layers on the peripheral portion of a peeling laminated substrate formed by laminating a sheet with an easily peelable metal foil in which a thin metal foil layer is peelably laminated on a carrier metal foil layer on the outer surface of a supporting substrate. Multilayer wiring using a peeling laminated substrate in which a foil through-hole filled via hole is formed and the carrier metal foil layer and the thin metal foil layer on the periphery of the sheet with the easily peelable metal foil are bonded and fixed by the thin copper foil through via hole. Produce a substrate.

  Thereby, it is possible to prevent the easily peelable sheet with metal foil from peeling off during the manufacturing process due to the stress in the manufacturing process of the multilayer wiring board, and to improve the manufacturing yield of the multilayer wiring board.

  That is, the thin copper foil penetrating filled via hole formed in the sheet with the easily peelable metal foil suppresses the peeling of the thin metal foil layer, so that the sheet with the easily peelable metal foil can be prevented from peeling during the production of the multilayer wiring board. Further, the peripheral portion including the thin copper foil penetrating filled via hole of the sheet with the easily peelable metal foil is cut off by machining to expose the cross section of the sheet with the easily peelable metal foil, and the sheet with the easily peelable metal foil can be peeled off. As described above, the present invention has an effect that it is possible to impart the selectivity of peelability of the sheet with the easily peelable metal foil.

(A) It is a top view before the metal plating process of the laminated substrate for peeling of the 1st Embodiment of this invention. (B) It is a sectional side view of the AA 'part of FIG. 1 (a). (C) It is a sectional side view after the metal plating process of the laminated substrate for peeling of the first embodiment of the present invention. (A)-(c) It is a schematic sectional drawing (the 1) explaining the manufacturing process of the wiring board of the 1st Embodiment of this invention. (D)-(f) It is a schematic sectional drawing (the 2) explaining the manufacturing process of the wiring board of the 1st Embodiment of this invention. (G)-(h) It is a schematic sectional drawing (the 3) explaining the manufacturing process of the wiring board of the 1st Embodiment of this invention. (I) ~ (j) is a schematic cross-sectional view (No. 4) explaining the manufacturing process of the wiring board of the first embodiment of the present invention. (K) ~ (l) is a schematic sectional view (No. 5) for explaining the manufacturing process of the wiring board according to the first embodiment of the present invention.

<First Embodiment>
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The plan view of FIG. 1 (a) shows the laminated substrate 10 for peeling according to the first embodiment, and FIG. 1 (b) shows a sectional view of the AA ′ portion side. FIG. 1C is a side sectional view of the laminated substrate for peeling 10 of the present invention in which the thin copper foil through via hole hole 22a is filled with a metal plating layer 23 to form a thin copper foil through filled via hole 24a.

(Easy peeling sheet 13 with metal foil)
The sheet 13 with easily peelable metal foil is a sheet 13 with easily peelable metal foil having a multi-layer structure in which a plurality of metal layers are laminated in a peelable manner. The sheet 13 with the easily peelable metal foil includes, for example, a metal layer of a carrier copper foil layer 13a having a thickness of 10 μm to 35 μm (for example, 18 μm) and a metal layer of a thin copper foil layer 13b having a thickness of 1 μm to 8 μm (for example, 5 μm). A peelable metal foil in which the layers are peelably laminated is used.

  As a means for releasably laminating the thin copper foil layer 13b from the carrier copper foil layer 13a, a method of releasably adhering with an adhesive or another releasable laminating method is used.

  As shown in the side sectional view of FIG. 1B, a sheet 13 with an easily peelable metal foil is adhered to the outer surface of the support substrate 1 with an insulating resin material 12. Here, the size of the sheet 13 with the easily peelable metal foil provided on the peeling laminated substrate 10 is made smaller than the size of the supporting substrate 1. As a result, the peeling laminated substrate 10 in which the frame portion 14 made of the insulating resin material 12 is formed in the portion surrounding the sheet 13 with the easily peelable metal foil is manufactured.

  At that time, the edge portion of the easily peelable metal foil-attached sheet 13 near the surface of the frame portion 14 of the peeling laminated substrate 10 is covered with the resin thin film. The resin thin film is connected to the insulating resin material 12 of the frame portion 14, and the insulating resin material 12 of the frame portion 14 is integrally connected to the insulating resin material 12 for adhering the support substrate 1 and the sheet 13 with the easily peelable metal foil. The sheet 13 with the easily peelable metal foil is wrapped around.

  The insulating resin material 12 having the integrated structure has an effect of preventing the thin copper foil layer 13b of the easily peelable sheet 13 with metal foil from being peeled from the carrier copper foil layer 13a.

  Next, the resin insulating layer 21 is formed on the outer surface of the sheet 13 with the easily peelable metal foil of the peeling laminated substrate 10. Next, a thin copper foil penetrating via hole 22a reaching the sheet 13 with the easily peelable metal foil is formed by penetrating the resin insulating layer 21 by a laser beam for drilling, and the thin copper foil layer 13b exposed at the bottom of the hole is subjected to quick etching. Then, the thin copper foil penetrating via hole hole 22a reaching the carrier copper foil layer 13a is formed.

(Thin copper foil penetrating filled via hole 24a)
Next, the outer surface of the peeling laminated substrate 10 is covered with the resin insulating layer 21. Next, as shown in the plan view of FIG. 1A and the side sectional view of FIG. 1B, a plurality of adjacent thin copper foil through-hole holes are formed on the outer peripheral portion of the sheet 13 with easily peelable metal foil. 22a is formed. In the plan view of FIG. 1A, a plurality of thin copper foil through via holes 22a reaching the sheet 13 with easily peelable metal foil are formed in a zigzag pattern on the resin insulating layer 21 on the peeling laminated substrate 10. . By arranging the thin copper foil through via holes 22a in a zigzag pattern, one thin copper foil through via hole 22a can be adjacent to at least four thin copper foil through via holes 22a.

  As shown in FIG. 1 (c), the thin copper foil through via hole hole 22 a is a laser drilling device on the peeling laminated substrate 10, and a hole reaching the sheet 13 with easily peelable metal foil is drilled to form the thin copper foil through via hole hole 22 a. And the thin copper foil layer 13b of the sheet 13 with the easily peelable metal foil exposed at the bottom of the hole is removed by quick etching to expose the carrier copper foil layer 13a.

Next, the metal plating layer 23 is filled into the thin copper foil through via hole hole 22a by copper plating to form a copper foil through filled via hole 24a, and the thin copper of the sheet 13 with the easily peelable metal foil is formed at the copper foil through filled via hole 24a. The foil layer 13b and the carrier copper foil layer 13a thereunder are connected.

  As shown in FIG. 1C, a multilayer wiring board is manufactured using the peeling laminated board 10 in which the copper foil penetrating filled via holes 24a are formed, so that the sheet 13 with easily peelable metal foil in the manufacturing process of the multilayer wiring board is manufactured. There is an effect that the thin copper foil layer 13b can be effectively prevented from peeling from the carrier copper foil layer 13a.

  The bonding effect of the thin copper foil layer 13b of the sheet 13 with the easily peelable metal foil and the carrier copper foil layer 13a by the copper foil penetrating filled via hole 24a is the insulating resin of the frame portion 14 that surrounds the edge of the sheet 13 with the easily peelable metal foil. The material 12 and the sheet 13 with the easily peelable metal foil work together with the peeling prevention effect of the sheet 13 with the easily peelable metal foil by the structure in which the resin thin film covering the edge portion of the sheet 13 with the easily peelable metal foil works together. There is an effect that can be effectively prevented.

(Production method)
Hereinafter, a method for manufacturing the multilayer wiring board 50 according to the first embodiment of the present invention will be described with reference to FIGS. 2 to 6.

  The multilayer wiring board 50 of the present embodiment has a configuration as shown in FIG. 6 (l), and as shown in FIG. 5 (j), the coreless multilayer wiring board 50 is formed on the upper and lower layers of the peeling laminated board 10. Form in layers. Then, the multilayer wiring substrate 50 of the upper layer and the lower layer is separated from the peeling laminated substrate 10.

(Step 1: Step of laminating a sheet with easily peelable metal foil on a supporting substrate)
A supporting substrate 1 having a size of 610 × 510 mm is prepared. The supporting substrate 1 is a substrate having a thickness of 0.04 mm to 0.4 mm, and a copper having a copper foil 11 having a thickness of 18 μm on both surfaces and made of a material obtained by impregnating a reinforcing fiber made of glass, polyimide, liquid crystal or the like with an organic resin. A stretched laminate is used.

  As the organic resin material forming the support substrate 1, an organic resin mainly composed of epoxy type, acrylic type, urethane type, epoxy acrylate type, phenol epoxy type, polyimide type, polyamide type, cyanate type, liquid crystal type is used. it can. It is also possible to use a substrate in which the organic resin contains a filler such as silica, a butyl organic material, or calcium carbonate.

  Next, as shown in FIG. 2A, a half of a prepreg or a resin film having the same size as the support substrate 1 in a plan view and having a size of 610 × 510 mm around the support substrate 1 is formed. The cured insulating resin sheet 12a is overlaid. Then, on the outer side thereof, a sheet 13 with an easily peelable metal foil having a size smaller than the semi-cured insulating resin sheet 12a and having a size of 600 × 500 mm and a thin copper foil layer 13b laminated on a carrier copper foil layer 13a is formed. Layers 13b are stacked facing outward.

  Then, the release film F is laminated on the outer side of the sheet 13 with the easily peelable metal foil, and a semi-curing on the outer side of the support substrate 1 is performed as shown in FIG. The insulating resin sheet 12a is cured to form the insulating resin material 12, and the laminated substrate 10 for peeling in which the sheet 13 with the easily peelable metal foil is integrated on the outer surface is manufactured.

(Release film F)
In the step of FIG. 2 (a), the release film F sandwiched between the press plate made of stainless steel of the vacuum laminating press at the time of the vacuum laminating press is a resin material such as polyphenylene sulfide or polyimide and stainless steel, brass or the like. A film made of a composite material in which the above metal material is combined is used.

  Regarding the heat shrinkage rate of the release film F, the release film F having a heat shrinkage rate of 0.01 to 0.9% is used at the temperature at which the heat and pressure treatment is performed. Further, the release film F is used in which the rate of decrease in elongation of the release film F after the heat and pressure treatment is 30% or less before the heat and pressure treatment.

  The form of the release film F is made of a resin material having a thickness of 10 to 200 μm, and in particular, the surface of the release film F is subjected to a roughening treatment so that the average roughness Ra defined in JIS B0601 is 300 nm or more and 1500 nm or less. A release film F that has been subjected to (matting treatment) is used.

  In the step of FIG. 2A, the semi-cured insulating resin sheet 12a adjusted to be resin rich is laid on the outer side of the support substrate 1, the easily peelable metal foil sheet 13 is laid on the outer side, and the average roughness is placed on the outer side. A release film F having a surface roughening treatment (mat treatment) of Ra of 300 nm or more and 1500 nm or less is superposed, sandwiched between press plates, and laminated using a vacuum lamination press device that heats and presses with the press plates to form a laminated substrate. 100 is manufactured.

  At that time, due to the effect of the matte treatment of the surface of the release film F, the insulating resin material 12 of the frame portion 14 is connected onto the edge portion of the surface of the thin copper foil layer 13b of the sheet 13 with easily peelable metal foil. Forming a thin resin film.

  In order to properly form this resin thin film, the mat treatment on the surface of the release film F, the degree of resin richness of the semi-cured insulating resin sheet 12a, and the heating / pressurizing conditions of the vacuum laminating press are adjusted. Thereby, the heated and pressurized resin material of the semi-cured insulating resin sheet 12a appropriately flows out onto the edge portion of the surface of the thin copper foil layer 13b, and onto the edge portion of the surface of the thin copper foil layer 13b. The insulating resin material 12 forms a resin thin film having a thickness of 3 μm or less and a width of 0.1 mm or more and 10 mm or less.

  This resin thin film is connected to the insulating resin material 12 of the frame portion 14, and the boundary line of the peeling interface between the carrier copper foil layer 13a and the thin copper foil layer 13b of the sheet 13 with the easily peelable metal foil is insulated resin material. It has the effect of embedding in 12 to protect it. That is, the resin thin film is connected to the insulating resin material 12 of the frame portion 14, and the insulating resin material 12 of the frame portion 14 is integrally connected to the insulating resin material 12 that covers the inner surface of the carrier copper foil layer 13a and is easily peeled off. The sheet 13 with metal foil is wrapped.

  As a result, the chemical penetrates from the surface side of the thin copper foil layer 13b into the boundary between the sheet 13 with the easily peelable metal foil and the frame portion 14, and reaches the boundary line of the peeling interface of the sheet 13 with the easily peelable metal foil. There is an effect that can prevent. In addition, it is possible to prevent the carrier copper foil layer 13a and the thin copper foil layer 13b of the sheet 13 with easily peelable metal foil from peeling at the boundary of peeling due to stress in the subsequent manufacturing process, and to prevent manufacturing defects due to the peeling. There is an effect that can be prevented.

  In particular, when the width of the resin thin film is 0.1 mm or more, the effect of protecting the boundary line at the peeling interface of the resin sheet with the easily peelable metal foil becomes stronger. It is desirable to adjust the manufacturing conditions so that the resin thin film covers the sheet 13 with the easily peelable metal foil in a width of 0.5 μm or more and 5 mm or less.

  On the surface of the resin thin film and the surface of the insulating resin material 12 of the frame portion 14, the roughness of the average roughness Ra of the mat-treated release film F of 300 nm or more and 1500 nm or less is transferred. This has the effect of increasing the adhesion between the metal plating layer to be formed later and the surface of the resin thin film and the surface of the insulating resin material 12 of the frame portion 14.

  Here, when the average roughness Ra is less than 300 nm, the adhesive force developed is weak, and the metal plating layer provided on the surface of the insulating resin material 12 peels off during the process. Further, when the average roughness Ra is larger than 1500 nm, the insulating resin material 12 which becomes the convex portion is easily detached, and the detached material causes a reduction in the yield during the process.

  When the support substrate 1 having the copper foils 11 on both sides and the semi-cured insulating resin sheets 12a are laminated on the outer sides of the both sides, they are sandwiched between the easily peelable metal foil-attached sheets 13 and laminated. When the board 100 is manufactured, the laminated board 100 is reinforced by the copper foil 11.

  Further, the thermal expansion coefficient of the surface of the laminated substrate 100 is matched with the thermal expansion coefficient of copper by the copper foil 11, and the copper wiring pattern 4 formed on the surface of the laminated substrate 100 and the thermal expansion coefficient of the surface of the laminated substrate 100 are The difference is reduced, and the thermal stress generated at the interface between the laminated substrate 100 and the wiring pattern 4 due to the heat treatment in the manufacturing process can be reduced.

(Step 2: Step of forming resin insulating layer 21)
Next, the resin insulation layers 21 are thermocompression-bonded to the upper and lower surfaces of the peeling laminated substrate 10 by vacuum lamination, roll lamination or a lamination press. For example, an epoxy resin having a thickness of 45 μm is vacuum laminated. When the glass epoxy resin is used, the peeling laminated substrate 10 is formed by stacking copper foils having an arbitrary thickness and thermocompressing them with a laminating press.

(Process 3: Process of forming via hole 22a through thin copper foil)
Next, as shown in FIG. 2C, a thin copper foil penetrates through the resin insulating layer 21 at the end of the peeling laminated substrate 10 to reach the thin copper foil layer 13b at the end of the sheet 13 with the easily peelable metal foil. The via hole 22a is formed by a laser beam for drilling. The thin copper foil through via hole 22a is formed by machining the outer hole diameter to about 80 μm and the hole bottom hole diameter to about 50 μm, and forming the inverted truncated cone shape with the outer hole diameter larger than the hole bottom diameter. To do.

(Process 4)
Next, the thin copper foil layer 13b of the sheet 13 with easily peelable metal foil exposed at the bottom of the through hole 22a for passing through the thin copper foil is removed by quick etching, and the thin copper foil is penetrated as shown in FIG. 3 (d). A laminated board is manufactured in which the carrier copper foil layer 13a of the sheet 13 with easily peelable metal foil is exposed at the bottom of the via hole 22a.

(Step 5: Step of forming interlayer connection via hole 22b)
Next, as shown in FIG. 3E, an interlayer connection via hole hole 22b reaching the thin copper foil layer 13b of the sheet 13 with easily peelable metal foil is formed in the resin insulating layer 21 by a laser beam for drilling.

(Modification 2)
As a modified example 2, the above steps 3 to 5 can be replaced with the following steps 3 ′ and 4 ′ to manufacture a laminated substrate.

(Process 3 ')
Drilling a thin copper foil through via hole hole 22a and an interlayer connection via hole hole 22b reaching the thin copper foil layer 13b of the sheet 13 with the easily peelable metal foil into the resin insulating layer 21 at the end of the sheet 13 with the easily peelable metal foil. It is formed by a laser beam.

(Process 4 ')
Next, the interlayer connection via hole hole 22b is protected by an etching resist pattern, and the thin copper foil layer 13b of the sheet 13 with the easily peelable metal foil exposed at the hole bottom of the thin copper foil through via hole hole 22a is removed by quick etching, A laminated board is manufactured in which the carrier copper foil layer 13a of the sheet 13 with an easily peelable metal foil is exposed at the bottom of the through hole 22a for the thin copper foil.

(Process 6: Plating process)
Next, electroless plating is performed on the wall surfaces of the thin copper foil penetrating via hole hole 22a and the interlayer connection via hole hole 22b of the peeling laminated substrate 10 and the surface of the resin insulating layer 21.

  Next, as shown in FIG. 3F, a metal plating layer 23 of electrolytic copper plating is formed on the outside of the electroless plating to form the thin copper foil through via hole hole 22a and the interlayer connection via hole hole 22b. Then, the laminated substrate 10 for peeling, which is filled with 23 to form the filled via hole 24a for the thin copper foil and the filled via hole 24b for the interlayer connection, is manufactured.

  The thin copper foil penetrating filled via hole 24a and the interlayer connection filled via hole 24b of the peeling laminated substrate 10 are formed in a truncated cone shape when the supporting substrate 1 side is the upper side and the outer side of the substrate is the lower side.

  Here, by filling the metal plating layer 23 into the thin copper foil penetrating via hole hole 22a, the thin copper foil penetrating filled via hole 24a formed by the filled metal plating layer 23 becomes There is an effect of connecting the thin copper foil layer 13b and the carrier copper foil layer 13a thereunder.

  Thereby, since the thin copper foil layer 13b at the end of the sheet 13 with the easily peelable metal foil of the peeling laminated substrate 10 and the carrier copper foil layer 13a are firmly connected, the peeling laminated substrate 10 is impacted in the process of the manufacturing process. Even if it receives, it is possible to avoid the problem that the sheet 13 with easily peelable metal foil is peeled from the edge.

As in the plan view of FIG. 1A, it is desirable that the thin copper foil through via hole holes 22a at the ends of the peeling laminated substrate 10 be arranged in a zigzag manner at the ends of the easily peelable metal foil-attached sheet 13. By doing so, the density of the filled via holes 24a for passing through the thin copper foil is increased, so that the effect of fixing the end portion of the sheet 13 with the easily peelable metal foil is increased, and the peeling laminated substrate 10 is easily peeled due to the stress of the subsequent manufacturing process. The effect of preventing peeling of the boundary surface between the thin copper foil layer 13b and the carrier copper foil layer 13a of the sheet 13 with metal foil can be increased, and manufacturing defects due to peeling of the interface can be prevented.

(Step 7: wiring pattern forming step)
Next, a photosensitive plating resist film is formed on the surface of the metal plating layer 23 by electrolytic copper plating, exposed and developed to form a pattern of an etching resist, which is protected by the etching resist to protect the metal plating layer 23. Etch the pattern.

  Next, the pattern of the etching resist is peeled off, and as shown in FIG. 4G, a wiring pattern and a pattern of the thin copper foil penetrating filled via hole 24a and the interlayer connection filled via hole 24b are formed on the resin insulating layer 21.

(Step 8: Step of forming resin insulating layer 31)
Next, as shown in FIG. 4H, the resin insulating layer 31 is formed on the thin copper foil penetrating filled via hole 24a, the interlayer connecting filled via hole 24b, and the wiring pattern by the same build-up process as in step 2.

(Step 9: Step of Forming Interlayer Connection Filled Via Hole 32)
Next, in the same manner as in step 5, a lower layer interlayer filled via hole 24b and a via hole hole reaching the wiring pattern layer are formed in the resin insulating layer 31 by a laser beam for punching.

  Next, as in step 6, the via hole is filled with a metal plating layer by copper plating.

  Next, as in step 7, the metal plating layer 23 is etched to form the wiring pattern and the interlevel connection filled via hole 32.

  By repeating this step 9, as shown in FIG. 4H, the resin insulation layer 21 and the interlayer connection filled via hole 32 of the resin insulation layer 21 and the interlayer connection filled via hole 24b and the wiring pattern of the peeling laminated substrate 10 are formed on the outer surface of the wiring pattern. A multi-layer wiring structure in which a set is built up in multiple layers is formed.

(Step 10: Solder resist pattern forming step)
Next, as shown in FIG. 5I, a solder resist pattern 41 is formed on the outer surfaces of the upper and lower multilayer wiring structures of the peeling laminated substrate 10.

(Step 11: Multilayer wiring structure separation step)
Next, an etching resist having a desired size is attached to the surfaces of the upper and lower multilayer wiring structures of the peeling laminated substrate 10, and the multilayer wiring structure and the peeling laminated substrate 10 are cut along a cutting line C in FIG. The peripheral part including the filled via hole 24a for thin copper foil is cut off, and the boundary line of peeling of the sheet 13 with easily peelable metal foil is exposed on the cut surface.

  Then, as shown in FIG. 5 (j), the carrier copper foil layer 13a and the thin copper foil layer 13b are separated from the exposed boundary line of the peeling of the sheet 13 with the easily peelable metal foil, and the upper and lower layers of the laminated substrate 10 for peeling are separated. Then, the multilayer wiring structure for the multilayer wiring board 50 is peeled off.

(Step 12: Step of removing thin copper foil layer 13b)
Next, the thin copper foil layer 13b of the multilayer wiring structure for the multilayer wiring board 50 separated as shown in FIG.
Are removed by quick etching.

  As a result, as shown in FIG. 6L, the upper bottom of the inverted truncated cone-shaped interlayer connection filled via hole 24b embedded in the resin insulating layer 21 having a diameter of 50 μm is exposed at the opening of the surface of the resin insulating layer 21. The multilayer wiring board 50 thus obtained is obtained.

  The diameter of the upper surface (upper bottom) of the interlayer connection filled via hole 24b exposed at the opening portion of the surface of the resin insulating layer 21 is about 50 μm, which is smaller than the diameter of the bottom bottom of the interlayer connection filled via hole 24b of 80 μm. The upper bottom of the inter-layer connection filled via hole 24b can be electrically connected to the high-density component terminals of the semiconductor integrated circuit chip having a pitch of about 130 μm with high reliability.

(Step 14: Plating step of connection terminal portion)
Next, electroless Ni plating of 3 μm or more is formed on the connection terminal portion exposed from the opening of the solder resist pattern 41 and the top and bottom surfaces of the interlevel connection filled via hole 24b to be the connection terminal, and electroless Pd plating is formed thereon. The electroless Au plating is formed to 0.03 μm or more.

  The electroless Au plating may be formed with a thickness of 1 μm or more. Further, it is also possible to pre-coat with solder.

  Alternatively, electrolytic Ni plating of 3 μm or more may be formed on the connection terminal portion, and electrolytic Au plating of 0.5 μm or more may be formed thereon. Further, in addition to metal plating, an organic rustproof film may be formed on the connection terminal portion.

(Outline processing process)
Next, the outer shape of the multi-layered wiring board 50 that has been attached on multiple sides is cut by processing it with a dicer or the like to obtain the individual pieces of the multilayer wiring board 50.

(Surface treatment plasma cleaning process)
Next, the surface of the multilayer wiring board 50 is subjected to surface treatment plasma cleaning for shipping.

DESCRIPTION OF SYMBOLS 1 ... Supporting substrate 10 ... Laminating substrate 11 for peeling ... Copper foil 12 ... Insulating resin material 12a ... Semi-cured insulating resin sheet 13 ... Sheet 13a with easily peelable metal foil ... Carrier copper foil layer 13b ... Thin copper foil layer 14 ... Frame portions 21, 31 ... Resin insulating layer 22a ... Thin copper foil through via hole hole (through via)
22b ... Interlayer connection via hole hole 23 ... Metal plating layer 24a ... Thin copper foil penetrating filled via hole 24b, 32 ... Interlayer connection filled via hole 41 ... Solder resist pattern 50 ... Multilayer wiring board C ... Cutting line F ... Release film

Claims (7)

  A laminate substrate for peeling used in an intermediate step of manufacturing a multilayer wiring board, wherein a sheet with an easily peelable metal foil having a thin metal foil layer and a carrier metal foil layer is arranged outside a supporting substrate, and the thin metal foil layer is provided. Has a layer of an insulating resin material outside the thin metal foil layer and is directed to the side opposite to the supporting substrate, and the carrier metal foil layer penetrates the layer of the insulating resin material and the thin metal foil layer. A thin metal foil through via hole hole reaching, and an interlayer connection via hole hole reaching the thin metal foil layer through the insulating resin material, wherein the thin metal foil through via hole hole and the interlayer connection via hole hole are made of the same metal. A laminated substrate for peeling, which is filled.   The laminated substrate for peeling according to claim 1, wherein the size of the sheet with the easily peelable metal foil is smaller than the size of the support substrate, and the outside of the region of the sheet with the easily peelable metal foil is a frame portion made of an insulating resin material. A structure in which the edge of the easily peelable metal foil sheet is surrounded by a structure in which an insulating resin material of the frame portion and a resin thin film covering the edge of the easily peelable metal foil sheet are integrally connected. A laminated substrate for peeling, comprising:   The peeling laminated substrate according to claim 1 or 2, wherein the supporting substrate is a substrate having metal foils on both sides. On the outer surface of the support substrate, a sheet with an easily peelable metal foil in which a thin metal foil layer is releasably laminated on a carrier metal foil layer is adhered with the thin metal foil layer facing outward, and the sheet with the easily peelable metal foil is adhered. Laminating an insulating resin material on the outer surface of
An inter-layer connection via hole hole that penetrates the insulating resin material and the thin metal foil layer to form a thin metal foil penetrating via hole reaching the carrier metal foil layer, and penetrates the insulating resin material to reach the thin metal foil layer A step of forming
A step of manufacturing a peeling laminated substrate in which the thin metal foil through via hole hole and the interlayer connection via hole hole are filled with a metal plating layer,
A step of forming a pattern of a wiring pattern, a thin copper foil penetrating filled via hole, and an interlayer connection filled via hole by etching the metal plating layer of the peeling laminated substrate;
A step of forming a multilayer wiring structure in which a plurality of sets of resin insulating layers and interlayer connection filled via holes are built up on the outer surface of the peeling laminated substrate;
A step of exposing a cross section of the easily peelable metal foil-attached sheet to a cut surface by cutting a peripheral portion including the thin copper foil penetrating filled via hole of the peeling laminated substrate by machining;
Next, a method of manufacturing a multilayer wiring board, which comprises a step of peeling the multilayer wiring structure from the easily peelable sheet with metal foil. The method for manufacturing a multilayer wiring board according to claim 4 , wherein the step of forming the thin metal foil through via hole hole and the interlayer connection via hole hole comprises:
Forming a thin metal foil penetrating via hole hole reaching the thin metal foil layer through the insulating resin material;
Removing the thin metal foil layer on the bottom surface of the thin metal foil through via hole hole by quick etching to expose the carrier metal foil layer on the bottom surface of the thin metal foil through via hole hole;
A method of manufacturing a multilayer wiring board, comprising a step of forming an interlayer connection via hole hole that penetrates the insulating resin material and reaches the thin metal foil layer. A method for manufacturing a multilayer wiring board according to claim 4 or 5 , wherein
The step of adhering the sheet with the easily peelable metal foil to the outer surface of the supporting substrate, and laminating the insulating resin material on the outer surface of the sheet with the easily peelable metal foil,
A semi-cured insulating resin sheet is overlaid on the outer surface of the support substrate, the sheet with the easily peelable metal foil smaller in size than the support substrate is overlaid on the outer surface of the semi-cured insulating resin sheet, and a lamination process is performed by heating and pressing. By that,
The sheet with the easily peelable metal foil is bonded to the supporting substrate with an insulating resin material obtained by curing the semi-cured insulating resin sheet,
And, the outside of the area of the sheet with the easily peelable metal foil is surrounded by a frame portion made of an insulating resin material, and the insulating resin material of the frame portion and the resin thin film covering the edge portion of the sheet with the easily peelable metal foil are integrally formed. A step of forming a structure for wrapping an edge portion of the easily peelable metal foil-attached sheet with a connected structure;
A method for manufacturing a multilayer wiring board, comprising a step of laminating an insulating resin material on an outer surface of the sheet with an easily peelable metal foil. A method for manufacturing a multilayer wiring board according to claim 4 or 5 , wherein
The step of adhering the sheet with the easily peelable metal foil to the outer surface of the supporting substrate, and laminating the insulating resin material on the outer surface of the sheet with the easily peelable metal foil,
The semi-cured insulating resin sheet is sandwiched between two sheets of the easily peelable metal foil, and the laminated sheet is heated and pressed to form two sheets of the easily peelable metal foil with the semi-cured insulating resin sheet. Adhere with cured insulating resin material,
And, the outside of the area of the sheet with the easily peelable metal foil is surrounded by a frame portion made of an insulating resin material, and the insulating resin material of the frame portion and the resin thin film covering the edge portion of the sheet with the easily peelable metal foil are integrally formed. A step of forming a structure for wrapping an edge portion of the easily peelable metal foil-attached sheet with a connected structure;
A method for manufacturing a multilayer wiring board, comprising a step of laminating an insulating resin material on an outer surface of the sheet with an easily peelable metal foil.

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