JP6674538B2 - 冷却システム - Google Patents
冷却システム Download PDFInfo
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- JP6674538B2 JP6674538B2 JP2018516597A JP2018516597A JP6674538B2 JP 6674538 B2 JP6674538 B2 JP 6674538B2 JP 2018516597 A JP2018516597 A JP 2018516597A JP 2018516597 A JP2018516597 A JP 2018516597A JP 6674538 B2 JP6674538 B2 JP 6674538B2
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- 238000001816 cooling Methods 0.000 title claims description 95
- 239000007788 liquid Substances 0.000 claims description 146
- 239000003507 refrigerant Substances 0.000 claims description 145
- 230000001965 increasing effect Effects 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 15
- 230000020169 heat generation Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 7
- 239000000110 cooling liquid Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 5
- 230000005669 field effect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K11/00—Arrangement in connection with cooling of propulsion units
- B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L1/00—Supplying electric power to auxiliary equipment of vehicles
- B60L1/003—Supplying electric power to auxiliary equipment of vehicles to auxiliary motors, e.g. for pumps, compressors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2240/00—Control parameters of input or output; Target parameters
- B60L2240/10—Vehicle control parameters
- B60L2240/36—Temperature of vehicle components or parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
Description
図1および図2は、この発明の実施の形態1に係る冷却システムを示す構成図である。図1および図2は、発電源または駆動源となるモータ2を制御する電力変換装置1を冷却する冷却システム6を示している。冷却システム6は、発電源または駆動源となるモータ2を制御する電力変換装置1と、電力変換装置1およびモータ2の熱を奪う液冷媒配管5の中を流れる液冷媒を循環させるためのポンプ4と、電力変換装置1およびモータ2の熱を受熱した液冷媒を冷却するラジエータ3とを備えている。
上記実施の形態1では、ボス28の大きさについて言及しなかったが、この発明の実施の形態2では、液冷媒の流れ方向に対して、手前のボス32の大きさを大きくし、奥のボス33の大きさを小さくすることについて考える。
上記実施の形態1では、第4放熱部18のフィン実装密度について言及しなかったが、この発明の実施の形態3では、第4放熱部18のフィン実装密度を変えることについて考える。
上記実施の形態1では、第4放熱部18のフィンの材質について言及しなかったが、第4構成要素群13には、発熱量が異なる発熱体が実装されているため、この発明の実施の形態4では、図17において、発熱量が大きい発熱領域に実装されている第4放熱フィン29の材質をアルミニウムから銅とする。
上記実施の形態1〜4では、空気溜まりを抑制する機構を設けていないが、この発明の実施の形態5では、第1放熱部15と第4放熱部18との間に脱気用流路34を設けることについて考える。
Claims (6)
- 複数の構成要素を配置する配置板と、
前記複数の構成要素に対して、前記配置板の反対側に設けられ、前記複数の構成要素を冷却する液冷媒を流す液冷媒流路と、を備え、
前記液冷媒流路は、
前記液冷媒流路に対して垂直方向に配置され、前記液冷媒流路に前記液冷媒を流入させる液冷媒入口部と、
前記液冷媒流路に対して垂直方向に配置され、前記液冷媒流路から前記液冷媒を流出させる液冷媒出口部と、
複数のフィンが配置してあり、前記液冷媒が前記液冷媒入口部から前記液冷媒出口部へ最短で流れる第1領域と、
他の複数のフィンが配置してあり、前記第1領域とは異なる第2領域とを備え、
前記第2領域における前記他の複数のフィンのフィン実装体積比率は、前記第1領域における前記複数のフィンのフィン実装体積比より大きく、
前記第1領域における前記液冷媒入口部の近傍領域は、前記第1領域における前記液冷媒出口部の近傍領域よりも前記フィン実装体積比が小さい
冷却システム。 - 複数の構成要素を配置する配置板と、
前記複数の構成要素に対して、前記配置板の反対側に設けられ、前記複数の構成要素を冷却する液冷媒を流す液冷媒流路と、を備え、
前記液冷媒流路は、
前記液冷媒を流入させる液冷媒入口部に、前記複数のフィンの一部が配置されている第1放熱部と、
前記複数のフィンの他の一部が湾曲形状フィンとして配置されている第2放熱部と、
前記複数のフィンを実装しない第3放熱部と、
前記複数のフィンの実装密度が前記第1放熱部および前記第2放熱部よりも高い第4放熱部とを有し、
前記第3放熱部に対応する構成要素である第3構成要素群と前記第4放熱部に対応する構成要素である第4構成要素群とを接続するバスバーを固定する端子台および前記配置板には、固定用ネジ穴が、前記液冷媒流路まで貫通しているボスが形成されている
冷却システム。 - 前記ボスは、前記液冷媒の流れ方向に対して、手前のボスの大きさが大きくされ、奥のボスの大きさが小さくされている
請求項2に記載の冷却システム。 - 前記第4放熱部において、前記第4放熱部に対応する構成要素である第4構成要素群の各発熱体の発熱量に応じて、互いに異なるフィン実装密度が設定されている
請求項2または請求項3に記載の冷却システム。 - 前記液冷媒流路において、発熱量が大きい発熱領域に実装されている放熱部の材質を、その他の発熱領域に実装されている放熱部よりも熱伝導率の高い材質とする
請求項2から請求項4までのいずれか1項に記載の冷却システム。 - 前記液冷媒流路において、前記第1放熱部と前記第4放熱部との間に脱気用流路が設けられている
請求項2から請求項5までのいずれか1項に記載の冷却システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017051517 | 2017-03-16 | ||
JP2017051517 | 2017-03-16 | ||
PCT/JP2017/042079 WO2018168088A1 (ja) | 2017-03-16 | 2017-11-22 | 冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018168088A1 JPWO2018168088A1 (ja) | 2019-03-22 |
JP6674538B2 true JP6674538B2 (ja) | 2020-04-01 |
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ID=63522873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018516597A Active JP6674538B2 (ja) | 2017-03-16 | 2017-11-22 | 冷却システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10847441B2 (ja) |
JP (1) | JP6674538B2 (ja) |
CN (1) | CN110383470B (ja) |
DE (1) | DE112017007265T5 (ja) |
WO (1) | WO2018168088A1 (ja) |
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CN107924898B (zh) * | 2015-09-18 | 2020-10-27 | 株式会社T.Rad | 层叠型散热器 |
JP6663899B2 (ja) * | 2017-11-29 | 2020-03-13 | 本田技研工業株式会社 | 冷却装置 |
EP3761361B1 (en) * | 2018-10-05 | 2024-08-21 | Fuji Electric Co., Ltd. | Semiconductor device, semiconductor module and vehicle |
TWI673842B (zh) * | 2018-10-24 | 2019-10-01 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
EP3647709B1 (en) * | 2018-11-01 | 2021-07-21 | Hamilton Sundstrand Corporation | Heat exchanger device |
US11129310B2 (en) * | 2018-11-22 | 2021-09-21 | Fuji Electric Co., Ltd. | Semiconductor module, vehicle and manufacturing method |
JP6874823B1 (ja) * | 2019-12-26 | 2021-05-19 | 株式会社明電舎 | 冷却構造及びヒートシンク |
JP2021196087A (ja) * | 2020-06-10 | 2021-12-27 | 尼得科超▲しゅう▼科技股▲ふん▼有限公司 | 熱伝導部材及びそれを備えた冷却装置 |
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CN114980645A (zh) * | 2021-02-23 | 2022-08-30 | 日本电产艾莱希斯株式会社 | 电子部件模块 |
CN115175512A (zh) * | 2021-04-01 | 2022-10-11 | 日本电产艾莱希斯株式会社 | 流路模块、电力转换装置、马达装置和车辆 |
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WO2015137009A1 (ja) * | 2014-03-14 | 2015-09-17 | 富士電機株式会社 | 冷却器および該冷却器を有する半導体装置 |
US9837956B2 (en) * | 2014-04-01 | 2017-12-05 | King Fahd University Of Petroleum And Minerals | Heat exchanger for photovoltaic panels |
JP6360722B2 (ja) | 2014-05-30 | 2018-07-18 | Dowaメタルテック株式会社 | くし歯形放熱ピン部材を用いたパワー半導体の水冷用ピン付き放熱板 |
WO2016021565A1 (ja) * | 2014-08-06 | 2016-02-11 | 富士電機株式会社 | 半導体装置 |
JPWO2016194158A1 (ja) * | 2015-06-03 | 2017-12-14 | 三菱電機株式会社 | 液冷冷却器、及び液冷冷却器に於ける放熱フィンの製造方法 |
JP6109265B2 (ja) * | 2015-09-01 | 2017-04-05 | 三菱電機株式会社 | 冷媒流路付き電気機器 |
US10617035B2 (en) * | 2018-05-29 | 2020-04-07 | Raytheon Company | Additively manufactured structures for gradient thermal conductivity |
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2017
- 2017-11-22 WO PCT/JP2017/042079 patent/WO2018168088A1/ja active Application Filing
- 2017-11-22 CN CN201780087432.2A patent/CN110383470B/zh active Active
- 2017-11-22 JP JP2018516597A patent/JP6674538B2/ja active Active
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US10847441B2 (en) | 2020-11-24 |
US20190393133A1 (en) | 2019-12-26 |
WO2018168088A1 (ja) | 2018-09-20 |
CN110383470A (zh) | 2019-10-25 |
DE112017007265T5 (de) | 2019-11-28 |
CN110383470B (zh) | 2023-05-09 |
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