JP6665979B2 - Electrical contact - Google Patents

Description

  The present invention relates to electrical contacts.

  In a probe card used for semiconductor inspection, as the pitch of IC chip terminals on a semiconductor substrate to be inspected becomes narrower, the pitch of probes, which are electrical contacts arranged on the probe card, is required to be narrower. . There are many probes that use the MEMS (microelectromechanical system) technology (see Patent Document 1) as probes corresponding to such a narrow pitch.

  At the time of semiconductor inspection, the probe comes into contact with the terminal of the IC chip, and electrical measurement is performed. One form of the terminal of the IC chip with which the probe is in contact is a cylindrical one, for example, a hemispherical solder layer formed at the tip of a cylindrical Cu. Non-Patent Document 1 below describes a probe corresponding to such a cylindrical terminal, and Patent Document 2 below describes a circuit board connected to a plurality of cylindrical terminals.

Japanese Patent No. 3378259 JP 2012-248740A

Very Small Pitch Micro Bump Array Probing (IEEE SW Test Workshop 2013)

  If the surface of the solder layer at the tip is damaged such as a dent when the probe comes into contact with the terminal of the cylindrical IC chip as described above, bubbles will be generated when the solder layer for mounting the IC chip on the substrate melts This causes a mounting failure.

  Then, the number of probes increases as the pitch of the probes becomes narrower, and as a result, the load acting on the terminals of the IC chip at the time of inspection by the probe card increases. Overdrive margin is large due to pressure, and stable contact is required.

  The present invention solves such a conventional problem by using a probe formed by using a polymer MEMS, and can realize a narrow pitch, a low needle pressure, a large overdrive margin, and a stable probe. It is an object to provide an electrical contact including: Further, by applying the structure of the electric contact, an electric contact including an interposer for connecting the electrodes of the columnar body on the IC and the wiring substrate and electrically connecting the substrate and the like to each other is realized.

  The electrical contact of the present invention is an electrical contact that electrically connects the terminal of the columnar body and the connection target, and includes a main body formed of a polymer, and a metal fixed to the main body. The main body portion has a guide portion at one end for guiding the terminal to the other end side, and has a connection portion connected to the connection object at the other end, the terminal portion Is provided, and at least two protrusions for holding an outer surface of the terminal are formed between the guide portion and the connection portion, and the conductive layer is And the connecting portion, and a slit is formed between at least two of the projecting portions.

  The guide portion is formed as a tapered portion inclined from one end of the main body portion toward the protruding portion.

  The main body is cylindrical, and a groove is formed in the main body along the slit.

  Alternatively, the guide portion and the protruding portion of the main body are divided along the slit.

  The connection portion has a base portion, and the base portion has a through electrode that connects the conductive layer and the connection target.

  A plurality of the electrical contacts are arranged such that ends of the guide portion and the connection portion are respectively flush with each other, and are connected to each other by a polymer.

  The two electrical contacts are coupled to each other such that the other end of the one electrical contact and the other end of the other electrical contact are integrated, and one of the electrical contacts The guide portion serves as one end, the guide portion of the other electrical contact serves as the other end, and the conductive layer of the one electrical contact and the conductive layer of the other electrical contact are provided. They are connected so as to be electrically connected to each other.

  A plurality of the electrical contacts are arranged such that the ends of the guides of the one electrical contact and the guides of the other electrical contact are respectively on the same plane, and are mutually separated by a polymer. Are combined.

  The protrusion can hold the terminal having a diameter of 10 to 50 μm.

  The electrical contact of the present invention is an electrical contact that electrically connects the terminal of the columnar body and the connection target, and includes a main body formed of a polymer, and a metal fixed to the main body. The main body portion has a guide portion at one end for guiding the terminal to the other end side, and has a connection portion connected to the connection object at the other end, the terminal portion Is provided, and at least two protrusions for holding an outer surface of the terminal are formed between the guide portion and the connection portion, and the conductive layer is And the connecting portion is formed so that a slit is formed between at least two of the protruding portions, so that even if the polymer portions come into contact with each other, there is no short circuit. It is possible to arrange at a narrower pitch than To the tip of the connection object can be holding without damaging the overdrive margin at low needle pressure when used as a probe is increased, it is possible to stable contact.

  The guide portion is formed as a tapered portion that is inclined from one end of the main body portion toward the protruding portion, so that the terminal can be smoothly guided to the other end side, and the contact can be smoothly performed. The operation can be performed.

  The main body portion is cylindrical, and a groove is formed along the slit, or the guide portion and the protruding portion of the main body portion are divided along the slit, thereby providing electrical connection. By using various arrangements, such as orthogonal arrangement and hexagonal arrangement, as the arrangement of the contacts, it is possible to realize an electrical contact that can be arranged at a narrower pitch or can be more stably contacted.

  A plurality of the electrical contacts are arranged such that ends of the guide portion and the connection portion are respectively on the same plane, and are connected to each other by a polymer. Contact is possible.

  The two electrical contacts are coupled to each other such that the other end of the one electrical contact and the other end of the other electrical contact are integrated, and one of the electrical contacts The guide portion serves as one end, the guide portion of the other electrical contact serves as the other end, and the conductive layer of the one electrical contact and the conductive layer of the other electrical contact are provided. By being connected so as to be electrically connected to each other, it is possible to use the electric contact as an interposer. At this time, if a defect is confirmed during use, it can be easily replaced. it can.

It is sectional drawing of the electric contact of 1st Embodiment. It is a bottom view of the electric contact of a 1st embodiment. It is sectional drawing which shows the movement when an electric contact contacts an IC chip terminal. It is sectional drawing of the electric contact of 2nd Embodiment. It is a bottom view of the electric contact of a 2nd embodiment. It is a perspective view of the electric contact of a 2nd embodiment. It is a figure which shows the positional relationship of an electrical contact and an IC chip terminal, (a) is a top view of an IC chip terminal, (b) is a top view of an electrical contact. It is sectional drawing of the electric contact of 3rd Embodiment. It is a bottom view of the electric contact of a 3rd embodiment. It is a perspective view of an electric contact of a 3rd embodiment. It is a figure which shows the positional relationship of an electrical contact and an IC chip terminal, (a) is a top view of an IC chip terminal, (b) is a top view of an electrical contact. It is sectional drawing of the electric contact of 4th Embodiment. It is a bottom view of the electric contact of a 4th embodiment. It is a perspective view of the electric contact of a 4th embodiment. It is a figure which shows the positional relationship of an electrical contact and an IC chip terminal, (a) is a top view of an IC chip terminal, (b) is a top view of an electrical contact. It is sectional drawing of the electric contact of 5th Embodiment. It is a bottom view of the electric contact of a 5th embodiment. It is a perspective view of the electric contact of a 5th embodiment. It is sectional drawing which shows the state which the electric contact and the IC chip terminal contacted. It is sectional drawing of the electrical contact of 6th Embodiment. It is a bottom view of the electric contact of a 6th embodiment. It is a perspective view of the electric contact of a 6th embodiment. It is a horizontal sectional view showing the state where an electric contact and an IC chip terminal were in contact. It is sectional drawing of the electrical contact of 7th Embodiment. It is a bottom view of the electric contact of a 7th embodiment. It is sectional drawing of the electric contact of 8th Embodiment. It is a perspective view of the electric contact of an 8th embodiment. It is sectional drawing which shows the procedure of connecting a board | substrate using an electric contact as an interposer. It is sectional drawing of the electric contact of 9th Embodiment. It is a perspective view of the electric contact of a 9th embodiment. It is sectional drawing of the electric contact of 10th Embodiment. It is a perspective view of the electric contact of a 10th embodiment. It is the schematic which shows the example of use as an interposer of an electric contact.

  The electrical contact of the present invention will be described with reference to the drawings. First, the electrical contact 1 of the first embodiment will be described. FIG. 1 is a cross-sectional view of the electrical contact 1, FIG. 2 is a bottom view of the electrical contact 1, and the electrical contact 1 is used as a probe, and a first connection is shown. The IC chip terminal 11 of the wafer 10 as the object and the electrode 14 of the substrate 12 of the probe card as the second object to be connected are in contact with and electrically connected to each other.

  As shown in FIGS. 1 and 2, the electrical contact 1 of the present invention has a main body 3 and a second conductive layer 6 fixed to the main body 3, and the main body 3 has one end. It has a guide portion for guiding the IC chip terminal 11 to the other end side, and has a connection portion connected to the electrode 14 as the second connection object at the other end, and is guided by the guide portion. It has an internal space into which the IC chip terminal 11 is inserted. The main body 3 is provided with a protruding portion 4 that sandwiches a side surface of the IC chip terminal 11, which is a first connection target, between the guide portion and the connection portion. The connecting portion has a base portion 2 and a tapered portion 9 is provided as the guide portion. The base 2 and the main body 3 are formed by MEMS technology using a polymer. At the time of inspection, the electrical contact 1 is in contact with the outer surface of the pillar-shaped IC chip terminal 11 and is held therebetween, so that electrical connection is made.

  The base portion 2 has a columnar shape, and a through electrode 5 penetrating vertically is formed at the center. The upper surface of the base portion 2 is connected to the electrode 14 of the substrate 12 of the probe card. At this time, the electrical contact 1 is electrically connected to the substrate 12 of the probe card by the through electrode 5. Further, a first conductive layer 7 connected to the through electrode 5 is formed on a lower surface of the base portion 2.

  The main body 3 has a cylindrical shape, is disposed on the lower surface of the base 2, and has an upper end closed by the base 2 and an opening at the lower end. And the terminal of the inspection object is inserted into the internal space from the opening. Below the inner side surface of the main body 3, the protruding portion 4 that protrudes inward toward the central axis of the main body 3 is formed in an annular shape.

  Further, second conductive layers 6 are formed at four locations on the inner surface of the main body 3 at regular intervals by slits, and the second conductive layer 6 is formed on the inner surface of the main body 3. The portion extending from the lower end to the upper end through the protruding portion 4 and a portion formed on the surface of the protruding portion 4 serves as a contact 8 that contacts the outer surface of the inspection object. On the inner side surface of the main body 3, four places where the second conductive layer 6 is not formed by the slit are present at equal intervals, and a groove is formed in this portion to form a groove. By partially reducing the thickness, the main body 3 can be easily deformed.

  The upper end of the second conductive layer 6 is connected to the first conductive layer 7, whereby the through electrode 5, the first conductive layer 7, and the second conductive layer 6 are electrically connected to each other. Connected, so that the contacts 8 are electrically connected to the substrate of the probe card.

  As shown in FIG. 1, the tapered portion 9 is formed at the lower end of the inner surface of the main body portion 3 as the guide portion so as to be inclined toward the protruding portion 4 and spread outwardly downward. ing. The terminal of the inspection object is smoothly guided into the internal space of the main body 3 by the tapered portion 9. The second conductive layer 6 is also formed on a part of the tapered portion 9.

  As described above, the base 2 and the main body 3 are formed of a polymer using the MEMS technology. Various materials can be used as the polymer material. For example, an acrylic resin or the like is used. The through electrode 5 and the first conductive layer 7 are formed of a conductive member, and the second conductive layer 6 is formed of a conductive material among the conductive members to improve the contact with the IC chip terminal 11. Use good metals and alloys. For example, Rh, Pt, Re, Ir, Os, Pd, or an alloy thereof is used.

  The electrical contact 1 of the present invention can be elastically deformed at the time of inspection because the main body 3 is formed of a polymer. Since the Young's modulus of the polymer is about 1/30 to about 1/120 as compared with the metal used for the member of the conventional probe, the electric contact 1 of the present invention is larger than the conventional electric contact. Also, the deformation amount becomes large. Furthermore, the second conductive layer 6 is formed not on the entire inner surface of the main body 3 but on a part thereof, so that the main body 3 is easily elastically deformed.

  The operation at the time of inspection of the electrical contact 1 will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a state in which the connection portion of the electric contact 1 is connected and fixed to the electrode 14 of the substrate 12 of the probe card by using the solder 13. Then, a cross-sectional view of a state where the IC chip terminals 11 to be inspected are arranged on the wafer 10 is shown.

  As shown in FIG. 3A, the probe card is positioned so that the electrical contact 1 is located above the IC chip terminal 11. Thereafter, the wafer 10 is moved upward to perform overdrive, and the IC chip terminals 11 are inserted from the openings of the main body 3 of the electrical contact 1. At this time, since the outer circumference of the IC chip terminal 11 is larger than the inner circumference of the contact 8 of the electrical contact 1, when the contact 8 comes into contact with the IC chip terminal 11, the contact becomes as shown in FIG. As shown in the drawing, the main body 3 is elastically deformed by the force of pushing the main body 3 outward by the IC chip terminal 11.

  Then, as shown in FIG. 3B, the electric contact 1 holds the outer surface of the IC chip terminal 11 by the protruding portion 4 and makes contact with the contact 8 so that a force is applied from above. Since it is not a structure to add, low stylus pressure is realized. Further, there is a space between the upper end of the IC chip terminal 11 and the base 2 of the electrical contact 1, and a sufficient margin during overdrive can be secured. Further, the electrical contact 1 is in contact with the outer surface of the IC chip terminal 11 at the contact point 8, and the scrub also functions sufficiently.

  As described above, in the electrical contact 1 of the present invention, the base portion 2 and the main body portion 3 are formed of a polymer using MEMS technology, and the protrusion 4 contacts the outer surface of the IC chip terminal 11. The use of a structure that allows the pitch to be narrowed enables a low contact pressure, a large overdrive margin, and stable contact. The electrical contact 1 can also correspond to a terminal pitch of 50 μm or less, which is narrower than the conventional one.

  Although the main body 3 of the electrical contact 1 has been described as having a cylindrical shape, the main body 3 may have any shape as long as it can hold the IC chip terminal 11 and has a polygonal cylindrical shape. It is also possible to change the number. In addition, the shape of the protruding portion 4 can be appropriately changed. The protrusion 4 may be formed to have a size that can hold the IC chip terminal 11 having a diameter of 10 to 50 μm.

  Next, an electrical contact 21 of the second embodiment will be described. As shown in FIGS. 4 to 6, the electrical contacts 21 are arranged at a predetermined interval, while the electrical contacts 1 of the first embodiment have the cylindrical main body 3. It has a main body 23 composed of two columnar bodies to be formed.

  The electrical contact 21 has a base portion 22 serving as a connection portion formed of a polymer by MEMS technology and two main portions 23 of a columnar body. The two main body portions 23 are arranged on the lower surface of the base portion 22 so as to face each other.

  The base portion 22 is a plate-like body that connects the two main body portions 23 to each other at predetermined intervals and has ends penetrating therethrough at the center thereof. A first conductive layer 27 connected to the through-electrode 25 is formed on the lower surface of 22.

  The main body portion 23 extends downward from the base portion 22 and has a shape in which an outer surface and an inner surface are formed of curved surfaces, and the two main body portions 23 face each other at a predetermined interval. Are located. At the lower end of the inner surface of the main body 23, a tapered portion 29 is formed as a guide portion which is inclined outward. Further, a protruding portion 24 protruding inward toward the center axis of the main body 23 is formed above the tapered portion 29 on the inner side surface of the main body 23.

  A second conductive layer 26 extending from the tapered portion 29 at the lower end to the upper end through the protruding portion 24 is formed on the inner side surface of the main body portion 23, and the second conductive layer 26 is The portion formed on the surface of the portion 24 serves as a contact 28 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 26 is connected to the first conductive layer 27, whereby the through electrode 25, the first conductive layer 27, and the second conductive layer 26 are electrically connected to each other. Connected, so that the contacts 28 are electrically connected to the probe card substrate. The same material as that of the electrical contact 1 of the first embodiment is used for the material of the through electrode 25, the first conductive layer 27, and the second conductive layer 26.

  As shown in FIGS. 4 to 6, the electrical contact 21 according to the second embodiment has an outer surface of the IC chip terminal 11 and a contact 28 because the two main bodies 23 are separated from each other. In this case, the main body 23 is easily elastically deformed, has a lower needle pressure, has a large overdrive margin, and can realize stable contact.

  Further, the electric contact 21 of the second embodiment has a substantially rectangular cross section, and when the IC chip terminals 11 are arranged orthogonally as shown in FIG. By arranging the long sides of the cross section along the direction of the widest interval, the size can be increased, and more stable contact can be secured. In order to correspond to the arrangement of the IC chip terminals 11 as shown in FIG. 7A, the electric contacts 21 are arranged as shown in FIG. 7B. At this time, the space between the adjacent electrical contacts 21 is wide in the diagonal direction as indicated by a dashed line. Therefore, as shown in FIG. 7B, the electrical contacts 21 are arranged so that the two main bodies 23 are located in diagonal directions to secure a space in which the main bodies 23 are deformed. Therefore, the space in the orthogonal direction between the adjacent electrical contacts 21 can be reduced, and accordingly, the size of the electrical contacts 21 can be increased or the pitch can be reduced. Becomes

  Next, an electrical contact 31 according to a third embodiment will be described. As shown in FIGS. 8 to 10, the electric contact 31 has a base portion 32 serving as a connection portion and a main body portion 33 of three pillars, which are formed from a polymer by MEMS technology. The three main body parts 33 are arranged at equal intervals on the lower surface of the base part 32.

  The base portion 32 has a columnar shape, and a through electrode 35 penetrating vertically is formed at the center, and a circular first electrode connected to the through electrode 35 is formed on a lower surface of the base portion 32. A conductive layer 37 is formed.

  The main body portion 33 extends downward from the base portion 32 and has a shape in which an outer surface and an inner surface are formed of curved surfaces. At the lower end of the inner side surface of the main body portion 33, a tapered portion 39 which is inclined outward is formed as a guide portion. Further, above the tapered portion 39 on the inner side surface of the main body 33, a protruding portion 34 protruding inward toward the central axis of the main body 33 is formed.

  A second conductive layer 36 extending from the tapered portion 39 at the lower end to the upper end through the protruding portion 34 is formed on the inner side surface of the main body portion 33. The second conductive layer 36 is The portion formed on the surface of the contact 34 serves as a contact 38 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 36 is connected to the first conductive layer 37, so that the through electrode 35, the first conductive layer 37, and the second conductive layer 36 are electrically connected to each other. Connected, so that the contacts 38 are electrically connected to the probe card substrate. The same material as that of the electrical contact 1 of the first embodiment is used for the material of the through electrode 35, the first conductive layer 37, and the second conductive layer 36.

  As shown in FIG. 10, the electrical contact 31 of the third embodiment has the three main portions 33 arranged separately from each other, so that the outer surface of the IC chip terminal and the contact 38 are in contact with each other. In this case, the main body 33 is easily elastically deformed, has a lower stylus pressure, and has a large overdrive margin. Further, as compared with the electric contact 21 of the second embodiment, since the contacts 38 are provided in three places, stable contact can be realized.

  Further, as shown in FIG. 11A, when the IC chip terminals 11 are arranged in hexagons, the electrical contact 31 of the third embodiment has the widest interval between the adjacent IC chip terminals 11. By arranging the main body portion 33 at a location, the size can be increased, and an arrangement for ensuring more stable contact can be selected. In order to correspond to the arrangement of the IC chip terminals 11 as shown in FIG. 11A, the electric contacts 31 are arranged as shown in FIG. 11B. At this time, the space between the adjacent electrical contacts 31 has a wider space in six directions (space indicated by a dashed-dotted circle). Therefore, the electrical contacts 31 are arranged such that the three main bodies 33 are located in three of the six directions, so that a space in which the main body 33 is deformed can be secured. Therefore, the space in the lateral direction of the adjacent electrical contact 31 can be reduced, and the horizontal pitch of the electrical contact 31 can be reduced accordingly.

  Next, an electrical contact 41 according to a fourth embodiment will be described. As shown in FIGS. 12 to 14, the electric contact 41 is configured such that the main body 43 is formed of four columnar bodies divided at a portion where a slit where the second conductive layer 46 is not formed is formed. ing.

  As shown in FIGS. 12 to 14, the electric contact 41 has a base portion 42 serving as a connection portion and four main portions 43 formed of a polymer by MEMS technology. The four body portions 43 are arranged at equal intervals on the lower surface of the base portion 42.

  The base portion 42 has a columnar shape, and a through electrode 45 penetrating vertically is formed at the center, and a circular first electrode connected to the through electrode 45 is formed on a lower surface of the base portion 42. A conductive layer 47 is formed.

  The main body portion 43 extends downward from the base portion 42, and has a shape in which an outer surface and an inner surface are formed of curved surfaces. As described above, the four pillars are arranged at equal intervals. It has a shape. At the lower end of the inner surface of the main body 43, a tapered portion 49 is formed as a guide portion which is inclined outward. Further, above the tapered portion 49 on the inner surface of the main body 43, a protruding portion 44 protruding inward toward the central axis of the main body 43 is formed.

  A second conductive layer 46 extending from the tapered portion 49 at the lower end to the upper end through the protruding portion 44 is formed on the inner side surface of the main body 43. The portion formed on the surface of the portion 44 serves as a contact 48 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 46 is connected to the first conductive layer 47, so that the through electrode 45, the first conductive layer 47, and the second conductive layer 46 are electrically connected to each other. Connected, so that the contacts 48 are electrically connected to the substrate of the probe card. The materials of the through electrode 45, the first conductive layer 47, and the second conductive layer 46 are the same as those of the other embodiments.

  As shown in FIG. 14, the electrical contact 41 of the fourth embodiment has four main bodies 43 separated from each other, so that when the outer surface of the IC chip terminal comes into contact with the contact 48, In other words, the main body 43 is easily elastically deformed, has a lower stylus pressure, and has a large overdrive margin. Further, as in the first embodiment, since the contacts 48 are provided at four positions, stable contact can be realized.

  Further, as shown in FIG. 15A, when the IC chip terminals 11 are orthogonally arranged, the electric contact 41 of the fourth embodiment is located at the position where the IC chip terminals 11 are at the widest interval. By arranging the main body 43, the size can be increased, and more stable contact can be secured. In order to correspond to the arrangement of the IC chip terminals 11 as shown in FIG. 15A, the electric contacts 41 are arranged as shown in FIG. At this time, the space between the adjacent electrical contacts 41 has a large diagonal space indicated by a dashed-dotted circle. Therefore, by arranging the electric contacts 41 so that the four main portions 43 are located in diagonal directions, a space in which the main portions 43 can be deformed can be secured. The space in the orthogonal direction of the electrical contacts 41 can be reduced, and accordingly, the size of the electrical contacts 41 can be increased or the pitch can be reduced.

  Next, an electrical contact 51 according to a fifth embodiment will be described. As shown in FIGS. 16 to 18, the electric contacts 51 are formed in such a manner that the electric contacts 1 of the first embodiment are embedded at predetermined intervals in through holes of a substrate 50 made of a polymer. Have been.

  The electrical contact 51 has a base portion 52 serving as a connection portion and a main body portion 53, and the main body portion 53 is provided with a protruding portion 54 for holding the inspection object. As shown in FIG. 16, the base portion 52 has a through electrode 55 penetrating vertically in the center, the upper surface is flush with the upper surface of the substrate 50, and the upper end of the through electrode 55 is It is in a state of being exposed on the upper surface of. Further, a first conductive layer 57 connected to the through electrode 55 is formed on a lower surface of the base portion 52.

  The main body 53 has a cylindrical shape, is disposed on the lower surface of the base 52, and has an opening at the lower end. Below the inner surface of the main body 53, the protruding portion 54 protruding inward is provided. It is formed in an annular shape. Further, at four locations on the inner side surface of the main body 53, second conductive layers 56 extending from the lower end to the upper end through the protrusions 54 are formed at equal intervals, and the second conductive layers 56 are formed. The portion formed on the surface of the projection 54 serves as a contact 58 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 56 is connected to the first conductive layer 57, so that the through electrode 55, the first conductive layer 57, and the second conductive layer 56 are electrically connected to each other. Connected, so that the contacts 58 are electrically connected to the probe card substrate.

  At the lower end of the inner side surface of the main body 53, a tapered portion 59 is formed as a guide portion and extends outwardly downward. The second conductive layer 56 is also formed on a part of the tapered portion 59.

  As shown in FIGS. 16 to 18, the electrical contacts 51 of the present embodiment include a plurality of electrical contacts 51 formed at predetermined intervals on the substrate 50 made of a polymer. The upper surfaces of the base portions 52 are arranged so as to be located on the same plane, and the adjacent electric contacts 51 are connected by a polymer. The polymer constituting the substrate 50 and the base portion 52 and the main body portion 53 made of a polymer are integrated with each other, and when a cylindrical terminal of an IC chip comes into contact with the electric contact 51, the polymer is adjacent to the electric contact 51. It is possible to ensure that the main bodies 53 of the electric contacts 51 do not contact each other.

  The operation at the time of inspection of the electrical contact 51 will be described with reference to FIG. FIG. 19 is a cross-sectional view of the electric contact 51 at the time of inspection, and the substrate 50 on which the electric contact 51 is formed is fixed to the substrate 12 of the probe card using the solder 13. The IC chip terminals 11 to be inspected are arranged on the wafer 10.

  The positioning of the probe card is performed so that the electrical contact 51 is located above the IC chip terminal 11. Thereafter, the wafer 10 is moved upward to perform overdrive, and the IC chip terminals 11 are inserted through openings of the main body 53 of the electrical contact 51. At this time, since the outer periphery of the IC chip terminal 11 is larger than the inner periphery of the contact 58 of the electrical contact 1, when the contact 58 comes into contact with the IC chip terminal 11, as shown in FIG. A force acts on the protruding portion 54 via the contact 58 by the IC chip terminal 11, and the electrical contact 51 is elastically deformed.

  At this time, since there is no space between the adjacent electrical contacts 51, the electrical contacts 51 are deformed as shown in FIG. Is mainly absorbed by the space located above the protrusion 54. As described above, since the electric contacts 51 are arranged in the substrate 50 made of a polymer, the electric contacts 51 can cope with a narrower pitch and reduce the low stylus pressure as in the other embodiments. As a result, a sufficient margin during overdrive can be secured. Further, the electric contact 51 is in contact with the outer surface of the IC chip terminal 11 at the contact point 58, and the scrub also functions sufficiently.

  Next, an electrical contact 61 according to a sixth embodiment will be described. As shown in FIGS. 20 to 22, the electric contacts 61 are such that the electric contacts 41 according to the fourth embodiment are embedded at predetermined intervals in through holes of a substrate 60 made of a polymer. The electrical contact 51 of the fifth embodiment has a shape in which a portion of the main body 53 where the second conductive layer 56 is not formed is cut out.

  The electrical contact 61 has a base portion 62 serving as a connection portion and four main body portions 63. The four main body portions 63 are arranged at equal intervals on the lower surface of the base portion 62 in the through hole. As shown in FIG. 20, a through electrode 65 is formed in the center of the base portion 62 so as to penetrate vertically. The upper surface of the base portion 62 is flush with the upper surface of the substrate 60. 60 is exposed on the upper surface. Further, a first conductive layer 67 connected to the through electrode 65 is formed on a lower surface of the base portion 62.

  The main body 63 has a shape extending downward from the base 62 and having an inner surface formed of a curved surface. At the lower end of the inner side surface of the main body 63, a tapered portion 69 inclined outward is formed as a guide. Further, above the tapered portion 69 on the inner side surface of the main body 63, a protruding portion 64 protruding inward toward the central axis of the main body 63 is formed.

  A second conductive layer 66 extending from the tapered portion 69 at the lower end to the upper end through the protruding portion 64 is formed on the inner side surface of the main body 63, and the second conductive layer 66 is The portion formed on the surface of the portion 64 serves as a contact 68 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 66 is connected to the first conductive layer 67, so that the through electrode 65, the first conductive layer 67, and the second conductive layer 66 are electrically connected to each other. Connected, so that the contacts 68 are electrically connected to the substrate of the probe card. The materials of the through electrode 65, the first conductive layer 67, and the second conductive layer 66 are the same as those of the other embodiments.

  As shown in FIG. 20, since the adjacent electrical contacts 61 are connected to each other by a polymer as shown in FIG. The main body portion 63 can surely not come into contact with each other due to the presence of the polymer therebetween.

  The operation of the electrical contact 61 at the time of inspection will be described. When the IC chip terminal 11 is inserted through the opening of the electric contact 61, the contact 68 comes into contact with the IC chip terminal 11, and the electric contact 61 is elastically deformed. At this time, the deformation of the electrical contact 61 is absorbed by the space located above the protruding portion 64, similarly to the electrical contact 51 of the fifth embodiment. Further, since there is a cutout portion in the main body 63, the protruding portion 64 is further elastically deformed in the lateral direction from the state shown in FIG. 23A to the state shown in FIG. 23B. This makes it possible to cope with a narrower pitch, achieve a low stylus pressure, and sufficiently secure a margin during overdrive.

  Next, an electrical contact 71 according to a seventh embodiment will be described. As shown in FIGS. 24 and 25, the electrical contacts 71 are formed in such a manner that the electrical contacts 31 of the third embodiment are embedded at predetermined intervals in through holes of a substrate 70 made of a polymer. Have been.

  The electric contact 71 has a base portion 72 serving as a connection portion and three main body portions 73. The three main bodies 73 are arranged at equal intervals on the lower surface of the base 72 in the through hole. As shown in FIG. 24, a through electrode 75 penetrating vertically is formed at the center of the base portion 72, the upper surface is flush with the upper surface of the substrate 70, and the upper end of the through electrode 75 is 70 is exposed on the upper surface. Further, a first conductive layer 77 connected to the through electrode 75 is formed on the lower surface of the base 72.

  The main body portion 73 extends downward from the base portion 72 and has a shape in which an inner surface is formed of a curved surface. At the lower end of the inner side surface of the main body 73, a tapered portion 79 is formed as a guide portion, which is inclined outward. Further, a projecting portion 74 projecting inward is formed above the tapered portion 79 on the inner side surface of the main body portion 73.

  A second conductive layer 76 extending from the tapered portion 79 at the lower end to the upper end through the protruding portion 74 is formed on the inner side surface of the main body portion 73, and the second conductive layer 76 is The portion formed on the surface of the portion 74 becomes the contact point 78 that contacts the outer surface of the inspection object.

  The upper end of the second conductive layer 76 is connected to the first conductive layer 77, whereby the through electrode 75, the first conductive layer 77, and the second conductive layer 76 are electrically connected to each other. Connected, so that the contacts 78 are electrically connected to the probe card substrate. The same material as in the other embodiments is used for the material of the through electrode 75, the first conductive layer 77, and the second conductive layer 76.

  Since the electrical contacts 71 having such a structure are connected to each other by the polymer by the adjacent electrical contacts 71, the main body 73 of the adjacent electrical contacts 71 is located at the time of inspection. The presence of the polymer makes it possible to ensure that they do not come into contact with each other.

  The electric contact 71 deforms so as to be absorbed by the space located above the protrusion 74 at the time of inspection, and at the same time, the protrusion 74 elastically deforms in the lateral direction. This makes it possible to cope with a narrower pitch, achieve a low stylus pressure, and sufficiently secure a margin during overdrive.

  Next, a case where the electrical contact of the present invention is arranged between two substrates and used as an interposer for electrically connecting the two substrates to each other will be described. The electrical contact 81 of the eighth embodiment is an interposer having a structure based on the electrical contact 61 of the sixth embodiment in which a plurality of electrical contacts 61 are formed on a substrate 60 made of a polymer. In this structure, the main body portions 63 of the two electrical contacts 61 are connected to each other, and projecting portions are provided at both ends.

  As shown in FIGS. 26 and 27, an electrical contact 81 of the eighth embodiment has four main bodies 83 of columnar bodies separated from each other in a through hole 82 of a polymer substrate 180 at equal intervals. A first projection 88 and a second projection 89 are provided on the upper and lower portions of the main body 83, respectively. The first projecting portion 88 and the second projecting portion 89 correspond to the projecting portion 64 of the electrical contact 61 of the sixth embodiment.

  As shown in FIG. 27, the main body part 83 has a shape obtained by cutting off a part of a cylinder, the back surface is integrated with the polymer substrate 180, and the front part has a guide part at the upper end and the lower part, respectively. A first tapered portion 86 and a second tapered portion 87 which are inclined toward the inside of the through hole 82 are formed, and further connected to the first tapered portion 86 and the second tapered portion 87, respectively. The first projecting portion 88 and the second projecting portion 89 are formed so as to project toward the central axis.

  On the front surface of the main body 83, the first tapered portion 86 at the upper end extends downward through the first projecting portion 88, and reaches the second tapered portion 87 at the lower end through the second projecting portion 89. A conductive layer 80 is formed, and the conductive layer 80 has a portion formed on the surface of the first protrusion 88 in contact with an electrode of a columnar body of a substrate, which is a first connection target. The contact 84 and the portion formed on the surface of the second protrusion 89 become the second contact 85 that contacts the electrode of the substrate, which is the second connection target. In the main body 83, the first contact 84 and the second contact 85 are electrically connected to each other by the conductive layer 80, so that the electric contact 81 is disposed on the upper side of the second contact 85. It is possible to electrically connect the electrode of the substrate as the first connection object and the electrode of the substrate as the second connection object disposed below.

  Thus, the electrical contact 81 of the present invention is electrically connected to one electrode by contacting the four first contacts 84 or the second contacts 85 with the side surfaces of the columnar electrode. Structure. The first projecting portion 88 and the second projecting portion 89 are deformed when the columnar electrode is sandwiched, and the deformed state is different from the projecting portion of the electric contact in the form of a plurality provided on the polymer substrate of the present invention. Although the detailed description is omitted because they are the same, the first protruding portion 88 and the second protruding portion 89 are deformed up and down, and at the same time, are horizontally Also deform, ensuring a stable contact state. Thus, when the electric contact 81 of the present invention is used as an interposer, the contact resistance is stabilized.

  A method for connecting the substrates using the electrical contacts 81 will be described. First, the electrical contacts 81 are connected from above the first substrate 181. Then, as shown in FIG. 28A, the cylindrical first electrode 182 of the first substrate 181 is inserted into the through hole 82, and the second protrusion 89 of the electrical contact 81 is moved to the second position. The electrical connection is ensured by holding the side surface of the one electrode 182 and contacting the second contact 85 with the side surface.

  Next, the second substrate 183 is connected from above the electrical contact 81. Then, as shown in FIG. 28B, the cylindrical second electrode 184 of the second substrate 183 is inserted into the through hole 82, and the first projecting portion 88 of the electrical contact 81 is moved to the first position. By holding the side surfaces of the two electrodes 184 and the first contact 84 contacting the side surfaces, electrical connection is ensured. In the state of FIG. 28B, the first electrode 182 and the second electrode 184 are electrically connected to each other by the first contact 84, the second contact 85, and the conductive layer 80. In this state, the first substrate 181 and the second substrate 183 are electrically connected to each other via the electrical contact 81.

  Although the method of connecting the substrates to each other using the electric contact 81 of the present invention as an interposer has been described, the electric contact 81 of the present invention can be used for various electric connections. For example, as shown in FIG. 33A, it is also possible to arrange between a plurality of memories 110 and connect the memories 110 to each other. Further, as shown in FIG. 33B, the memories 110 can be connected to each other, and at the same time, can be used to connect the memory 110 to the CPU 120. Further, as shown in FIG. 33C, when disposing the CPU 120 and the memory 110 on one interposer substrate 130, the memories 110 are connected to each other, and at the same time, the interposer substrate 130, the CPU 120, , Can be used for connection between the interposer substrate 130 and the memory 120, respectively. Further, as shown in FIG. 33 (d), it can be used when the CPU 120 and the memory 110 are respectively arranged on one printed circuit board 140.

  As described above, the electrical contact 81 of the present invention can be used as an interposer for electrical connection of various members. In this case, it is possible to simultaneously connect a plurality of columnar electrodes without using solder. Therefore, it is possible to stably and reliably connect a large number of electrodes, and if a defect occurs after the connection, the electrode can be easily replaced, so that it can be easily dealt with.

  Then, as shown in FIG. 33, by using the electrical contact 81 of the present invention as an interposer for a laminated member, it is possible to greatly improve the reduction in yield quality due to the conventional lamination. Further, it is also possible to omit the usual electrical characteristic inspection (wafer inspection) in a wafer state before stacking and mounting.

  Next, an electric contact 91 of a ninth embodiment using the electric contact of the present invention as an interposer will be described. As shown in FIGS. 29 and 30, the ninth electrical contact 91 is disposed in the through-hole 92 of the polymer substrate 190 such that the two main bodies 93 of the columnar bodies separated from each other face each other. A first projection 98 and a second projection 99 are provided on the upper and lower portions of the main body 93, respectively.

  The main body portion 93 has a shape obtained by cutting off a part of a cylinder, the back surface is integrated with the polymer substrate 190, and the front portion has an upper end and a lower end, each of which serves as a guide portion. A first tapered portion 96 and a second tapered portion 97 inclined toward the center are formed, and further connected to the first tapered portion 96 and the second tapered portion 97, respectively, and project toward the central axis of the through hole 92. The first projecting portion 98 and the second projecting portion 99 are formed in such a manner.

  On the front surface of the main body portion 93, the first tapered portion 96 at the upper end extends downward through the first projecting portion 98 and reaches the second tapered portion 97 at the lower end through the second projecting portion 99. A conductive layer 90 is formed, and the conductive layer 90 has a portion formed on the surface of the first protrusion 98 in contact with a first columnar electrode of a substrate as a first connection target. The portion formed on the surface of the second protrusion 99 serves as the contact 94, and serves as a second contact 95 that contacts the electrode of the columnar body of the substrate, which is the second connection target. In the main body 93, the first contact 94 and the second contact 95 are electrically connected to each other by the conductive layer 90, whereby the electric contact 91 electrically connects the substrates to each other. Can be connected.

  As described above, in the electric contact 91 of the present invention, the first protrusion 98 or the second protrusion 99 sandwiches the side surface of the electrode of the columnar body, and the two first contacts 94 or the second contacts 95 is a structure that is electrically connected by contacting the side surface, whereby a stable contact state can be ensured and the contact resistance is stabilized. Further, since the electric contact 91 can simultaneously connect a plurality of electrodes without using solder, it is possible to stably and reliably connect a large number of electrodes, and a failure occurs after the connection. In such a case, it can be easily exchanged, so that it can be easily dealt with.

  By using the electrical contact 91 as an interposer for laminated members, it is possible to greatly improve the yield quality due to lamination, which has conventionally occurred, and to improve the wafer state before lamination and mounting. Can be omitted.

  As shown in FIG. 30, the electrical contacts 91 of the present embodiment are arranged such that the two main body portions 93 are laterally aligned in the adjacent through holes 92, but the arrangement may be changed as appropriate. For example, it is also possible to arrange the main body 93 in a state of being inclined by 60 degrees from the state of FIG.

  Next, an electric contact 101 according to a tenth embodiment using the electric contact of the present invention as an interposer will be described. As shown in FIGS. 31 and 32, a tenth electrical contact 101 has three main bodies 103 of columnar bodies separated from each other in a through hole 102 of a polymer substrate 200 at equal intervals. A first projection 108 and a second projection 109 are provided on an upper portion and a lower portion of the main body 103, respectively.

  The main body 103 has a back surface integrated with the polymer substrate 200, and has a first tapered portion 106 inclined toward the inside of the through hole 102 serving as a guide portion at an upper end and a lower end at the front, respectively. A second tapered portion 107 is formed, and further connected to the first tapered portion 106 and the second tapered portion 107, respectively, so that the first projecting portion 108 and the second Two projections 109 are formed.

  On the front face of the main body 103, the first tapered portion 106 at the upper end extends downward through the first protruding portion 108, and reaches the second tapered portion 107 at the lower end through the second protruding portion 109. A conductive layer 100 is formed, and a portion of the conductive layer 100 formed on the surface of the first protrusion 108 serves as a first contact 104, and a portion formed on the surface of the second protrusion 109. Becomes the second contact point 105. In the main body 103, the first contact 104 and the second contact 105 are electrically connected to each other by the conductive layer 100, so that the electric contact 101 electrically connects the substrates. .

  As described above, in the electric contact 101 of the present invention, the first protrusion 108 or the second protrusion 109 sandwiches the side surface of the electrode of the columnar body, and the three first contacts 104 or the second contacts 105 is a structure that is electrically connected by contacting the side surface, whereby a stable contact state can be ensured and contact resistance is stabilized. Further, since the electrical contact 101 can simultaneously connect a plurality of columnar electrodes without using solder as an interposer, it is possible to stably and reliably connect a large number of electrodes, and In the case where a defect occurs after connection, it can be easily replaced and can be easily dealt with.

  By using the electrical contact 101 as an interposer for a laminated member, it is possible to greatly improve the yield quality due to lamination, which has conventionally occurred, and to improve the wafer state before lamination. Can be omitted.

  When the electric contact of the present invention is used as an interposer, a plurality of through-holes are provided in a polymer substrate, and a main body having a first protruding portion and a second protruding portion for holding a side surface of a columnar electrode in the through-hole. By forming the part, it is possible to eliminate the decrease in the yield of the laminated product due to the connection failure that occurred at the time of solder connection, improve the quality, and easily replace even if the connection failure occurs Therefore, an effect of facilitating the response is produced.

1, 21, 31, 41, 51, 61, 71 Electrical contact 2, 22, 32, 42, 52, 62, 72 Base 3, 23, 33, 43, 53, 63, 73 Main body 4, 24 , 34, 44, 54, 64, 74 projecting parts 5, 25, 35, 45, 55, 65, 75 penetrating electrodes 6, 26, 36, 46, 56, 66, 76 second conductive layers 7, 27, 37, 47, 57, 67, 77 First conductive layer 8, 28, 38, 48, 58, 68, 78 Contact 9, 29, 39, 49, 59, 69, 79 Tapered portion 10 Wafer 11 IC chip terminal 12 Substrate 13 Solder 14 electrode 50, 60, 70 substrate 80, 90, 100 conductive layer 81, 91, 101 electrical contact 82, 92, 102 through hole 83, 93, 103 main body 84, 94, 104 first contact 85, 95, 105 No. Contact 86,96,106 first tapered portion 87,97,107 second tapered portion 88,98,108 first protrusion 89,99,109 second protrusion 110 Memory 120 CPU
130 interposer substrate 140 printed substrate 180, 190, 200 polymer substrate 181 first substrate 182 first electrode 183 second substrate 184 second electrode

Claims (10)

An electrical contact for electrically connecting the columnar terminal and the connection target,
A main body formed of a polymer, and a conductive layer made of a metal fixed to the main body,
The main body has a guide at one end for guiding the terminal to the other end, a connection at the other end connected to the connection object, and an internal space into which the terminal is inserted. And at least two protruding portions for holding an outer surface of the terminal are integrally formed between the guide portion and the connection portion,
The conductive layer is formed on a surface of the protruding portion and on an inner side surface of the main body, and the conductive layer on a surface of the protruding portion is electrically connected to the connection portion. An electrical contact, wherein a portion where the conductive layer is not formed is provided on a side surface.   The electrical contact according to claim 1, wherein the guide portion is formed as a tapered portion inclined from one end of the main body portion toward the protruding portion.   The electrical contact according to claim 1, wherein the main body is cylindrical. The electrical contact according to claim 3, wherein a groove is formed in a portion of the inner surface of the main body where the conductive layer is not formed. The said main- body part is divided | segmented into at least two, The said main-body part, the said protrusion part, and the said conductive layer are each formed in the divided part, The said main body part is characterized by the above-mentioned. Electrical contacts.   6. The electric device according to claim 1, wherein the connection portion has a base portion, and the base portion has a through electrode connecting the conductive layer and the connection target. 7. Contact.   7. The electrical contact according to claim 1, wherein the plurality of electrical contacts are arranged such that ends of the guide portion and the connection portion are respectively on the same plane, and are connected to each other by a polymer. An electrical contact according to claim 1.   Two of the electrical contacts are coupled to each other such that the other end of the one electrical contact and the other end of the other electrical contact are integrated; The guide portion serves as one end, the guide portion of the other electrical contact serves as the other end, and the conductive layer of the one electrical contact and the conductive layer of the other electrical contact are provided. The electrical contact according to any one of claims 1 to 6, wherein the electrical contact is coupled so as to be electrically connected to each other.   A plurality of the electrical contacts are arranged such that the ends of the guides of the one electrical contact and the guides of the other electrical contact are respectively on the same plane, and are mutually separated by a polymer. 9. The electrical contact according to claim 8, wherein the electrical contact is coupled.   The electrical contact according to any one of claims 1 to 9, wherein the protrusion can hold the terminal having a diameter of 10 to 50 m.