JP6589151B2 - Photocurable resin composition and high refractive resin cured body - Google Patents
Photocurable resin composition and high refractive resin cured body Download PDFInfo
- Publication number
- JP6589151B2 JP6589151B2 JP2015227074A JP2015227074A JP6589151B2 JP 6589151 B2 JP6589151 B2 JP 6589151B2 JP 2015227074 A JP2015227074 A JP 2015227074A JP 2015227074 A JP2015227074 A JP 2015227074A JP 6589151 B2 JP6589151 B2 JP 6589151B2
- Authority
- JP
- Japan
- Prior art keywords
- compound
- meth
- acrylate
- resin composition
- photocurable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims description 37
- 239000011347 resin Substances 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 title claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 75
- -1 acrylate compound Chemical class 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000003999 initiator Substances 0.000 claims description 9
- 239000002105 nanoparticle Substances 0.000 claims description 9
- 238000000016 photochemical curing Methods 0.000 claims description 9
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 7
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 230000001588 bifunctional effect Effects 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 77
- 229940126062 Compound A Drugs 0.000 description 34
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 34
- SFHYNDMGZXWXBU-LIMNOBDPSA-N 6-amino-2-[[(e)-(3-formylphenyl)methylideneamino]carbamoylamino]-1,3-dioxobenzo[de]isoquinoline-5,8-disulfonic acid Chemical compound O=C1C(C2=3)=CC(S(O)(=O)=O)=CC=3C(N)=C(S(O)(=O)=O)C=C2C(=O)N1NC(=O)N\N=C\C1=CC=CC(C=O)=C1 SFHYNDMGZXWXBU-LIMNOBDPSA-N 0.000 description 18
- 239000000047 product Substances 0.000 description 18
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 17
- 238000001723 curing Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 7
- 230000008719 thickening Effects 0.000 description 7
- 239000005062 Polybutadiene Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 229920002857 polybutadiene Polymers 0.000 description 6
- 229920001195 polyisoprene Polymers 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- XTBMLAUOYNOIMZ-UHFFFAOYSA-N (2-phenylphenyl) 2-ethoxyprop-2-enoate Chemical compound C(C)OC(C(=O)OC1=C(C=CC=C1)C1=CC=CC=C1)=C XTBMLAUOYNOIMZ-UHFFFAOYSA-N 0.000 description 2
- IBPADELTPKRSCQ-UHFFFAOYSA-N 9h-fluoren-1-yl prop-2-enoate Chemical compound C1C2=CC=CC=C2C2=C1C(OC(=O)C=C)=CC=C2 IBPADELTPKRSCQ-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- KGKGPRMMQUSEBC-UHFFFAOYSA-N (3-ethoxy-2-phenylphenyl) prop-2-enoate Chemical compound C(C=C)(=O)OC1=C(C(=CC=C1)OCC)C1=CC=CC=C1 KGKGPRMMQUSEBC-UHFFFAOYSA-N 0.000 description 1
- SKJCKYVIQGBWTN-UHFFFAOYSA-N (4-hydroxyphenyl) methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=C(O)C=C1 SKJCKYVIQGBWTN-UHFFFAOYSA-N 0.000 description 1
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- IHGSAQHSAGRWNI-UHFFFAOYSA-N 1-(4-bromophenyl)-2,2,2-trifluoroethanone Chemical compound FC(F)(F)C(=O)C1=CC=C(Br)C=C1 IHGSAQHSAGRWNI-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- ACMIJDVJWLMBCX-PXAZEXFGSA-N 4-[(3ar,6ar)-2,3,3a,4,6,6a-hexahydro-1h-pyrrolo[2,3-c]pyrrol-5-yl]-6-fluoro-n-methyl-2-(2-methylpyrimidin-5-yl)oxy-9h-pyrimido[4,5-b]indol-8-amine Chemical compound CNC1=CC(F)=CC(C2=C(N3C[C@@H]4NCC[C@@H]4C3)N=3)=C1NC2=NC=3OC1=CN=C(C)N=C1 ACMIJDVJWLMBCX-PXAZEXFGSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- UIZLQMLDSWKZGC-UHFFFAOYSA-N cadmium helium Chemical compound [He].[Cd] UIZLQMLDSWKZGC-UHFFFAOYSA-N 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- VCEXCCILEWFFBG-UHFFFAOYSA-N mercury telluride Chemical compound [Hg]=[Te] VCEXCCILEWFFBG-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- HWJHZLJIIWOTGZ-UHFFFAOYSA-N n-(hydroxymethyl)acetamide Chemical compound CC(=O)NCO HWJHZLJIIWOTGZ-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- CKFBFQHBUCDOHL-UHFFFAOYSA-N phenoxy(phenyl)methanol Chemical compound C=1C=CC=CC=1C(O)OC1=CC=CC=C1 CKFBFQHBUCDOHL-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 1
- YQMLDSWXEQOSPP-UHFFFAOYSA-N selanylidenemercury Chemical compound [Hg]=[Se] YQMLDSWXEQOSPP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- QXKXDIKCIPXUPL-UHFFFAOYSA-N sulfanylidenemercury Chemical compound [Hg]=S QXKXDIKCIPXUPL-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
本発明は、光硬化性樹脂組成物及び前記光硬化性樹脂組成物を光硬化してなる高屈折性樹脂硬化体に関する。 The present invention relates to a photocurable resin composition and a highly refractive resin cured product obtained by photocuring the photocurable resin composition.
光学部品に幅広く用いられている、光硬化性樹脂を光硬化させて得られる光硬化プラスチックは、光学部品の薄肉化、高解像度化の観点から、小さな曲率で光の進路を制御するために、光硬化性樹脂の高屈折率化が重要な課題となる。 In order to control the path of light with a small curvature, the photo-curing plastic obtained by photo-curing photo-curing resin, which is widely used in optical parts, is used to reduce the thickness of optical parts and increase the resolution. Increasing the refractive index of the photocurable resin is an important issue.
光硬化性樹脂の高屈折率化を達成するために、フェニルフェノールエトキシアクリレートを配合する(例えば、特許文献1)、光硬化性樹脂にフルオレン骨格を有する2官能(メタ)アクリレートを配合する(例えば、特許文献2)、これらの光硬化性樹脂に更に無機粒子を配合する(例えば、特許文献3)等の方法が開示されている。 In order to achieve a high refractive index of the photocurable resin, phenylphenol ethoxyacrylate is blended (for example, Patent Document 1), and bifunctional (meth) acrylate having a fluorene skeleton is blended in the photocurable resin (for example, , Patent Document 2), and a method of further blending inorganic particles with these photocurable resins (for example, Patent Document 3) is disclosed.
しかし、特許文献1及び2に開示された光硬化性樹脂は、高屈折率化する一方で、粘度が増大するため、光学部品の工業的な大量高速生産性の観点から課題を有する。
また、高屈折化を改善するために、これらの光硬化性樹脂に無機粒子を配合すると、更に高粘度化してしまうため、工業的に取り扱うには溶剤を用いて粘度を下げる必要があり、溶剤の混入を回避しなければならない立体的な光学部品の製造に課題がある。
However, the photocurable resins disclosed in Patent Documents 1 and 2 have a problem from the viewpoint of industrial mass high-speed productivity of optical components because the viscosity increases while the refractive index is increased.
In addition, when inorganic particles are added to these photocurable resins in order to improve high refraction, the viscosity is further increased. Therefore, it is necessary to lower the viscosity using a solvent for industrial handling. There is a problem in the manufacture of a three-dimensional optical component that must be avoided.
本発明は、溶剤を配合しなくても低粘度で、かつ屈折率が向上した光硬化性樹脂組成物、及び、
当該光硬化性樹脂組成物を光硬化して得られる高屈折性樹脂硬化体を提供することを課題とする。
The present invention is a photocurable resin composition having a low viscosity and improved refractive index without blending a solvent, and
It is an object to provide a highly refractive resin cured body obtained by photocuring the photocurable resin composition.
本発明は、
〔1〕(メタ)アクリレート化合物、金属含有ナノ粒子及び光重合開始剤を含む光硬化性樹脂組成物であって、
前記(メタ)アクリレート化合物が、下記式(1):
The present invention
[1] A photocurable resin composition comprising a (meth) acrylate compound, metal-containing nanoparticles and a photopolymerization initiator,
The (meth) acrylate compound has the following formula (1):
前記(メタ)アクリレート化合物中、前記式(1)で表される化合物及び/又はベンジルアクリレートの合計含有量が60〜100質量%であり、
前記光硬化性樹脂組成物の屈折率が1.60以上である光硬化性樹脂組成物(以下、本発明1ともいう)、
〔2〕(メタ)アクリレート化合物、金属含有ナノ粒子及び光重合開始剤を含む光硬化性樹脂組成物であって、
前記(メタ)アクリレート化合物が、前項〔1〕記載の式(1)で表される化合物を含む光硬化性樹脂組成物(以下、本発明2ともいう)、及び、
〔3〕前項〔1〕又は〔2〕記載の光硬化性樹脂組成物を成形及び硬化してなる高屈折性樹脂硬化体(以下、本発明3ともいう)である。
In the (meth) acrylate compound, the total content of the compound represented by the formula (1) and / or benzyl acrylate is 60 to 100% by mass,
A photocurable resin composition having a refractive index of 1.60 or more (hereinafter also referred to as the present invention 1),
[2] A photocurable resin composition comprising a (meth) acrylate compound, metal-containing nanoparticles and a photopolymerization initiator,
The (meth) acrylate compound is a photocurable resin composition (hereinafter also referred to as the present invention 2) containing a compound represented by the formula (1) described in [1] above, and
[3] A highly refractive resin cured product (hereinafter also referred to as the present invention 3) obtained by molding and curing the photocurable resin composition according to [1] or [2].
本発明によれば、溶剤を配合しなくても低粘度で、かつ屈折率が向上した光硬化性樹脂組成物、及び、当該光硬化性樹脂組成物を成形し光硬化してなる高屈折性樹脂硬化体を提供することができる。 According to the present invention, a photocurable resin composition having a low viscosity and an improved refractive index without blending a solvent, and a high refractive index obtained by molding and photocuring the photocurable resin composition. A cured resin body can be provided.
〔本発明1〕
本発明1は、(メタ)アクリレート化合物(以下、化合物Aという)、金属含有ナノ粒子(以下、化合物Bという)及び光重合開始剤(以下、化合物Cという)を含む光硬化性樹脂組成物であって、
化合物Aが、式(1)で表される化合物(以下、化合物A1という)及び/又はベンジルアクリレート(以下、化合物A2という)を含み、
化合物A中、化合物A1及び/又は化合物A2の合計含有量が60〜100質量%であり、
光硬化性樹脂組成物の屈折率が1.60以上である。
[Invention 1]
Invention 1 is a photocurable resin composition comprising a (meth) acrylate compound (hereinafter referred to as Compound A), metal-containing nanoparticles (hereinafter referred to as Compound B) and a photopolymerization initiator (hereinafter referred to as Compound C). There,
Compound A includes a compound represented by Formula (1) (hereinafter referred to as Compound A1) and / or benzyl acrylate (hereinafter referred to as Compound A2),
In compound A, the total content of compound A1 and / or compound A2 is 60 to 100% by mass,
The refractive index of the photocurable resin composition is 1.60 or more.
(化合物A1)
化合物A1は、下記式(1):
(Compound A1)
Compound A1 is represented by the following formula (1):
化合物A1は、フェノキシベンジルアルコールと(メタ)アクリル酸のエステル又はそのオキシエチレン付加物であり、例えば、共栄社化学社より市販品(製品名「POB−A」)として入手できる。 Compound A1 is an ester of phenoxybenzyl alcohol and (meth) acrylic acid or an oxyethylene adduct thereof, and is available as, for example, a commercial product (product name “POB-A”) from Kyoeisha Chemical Co., Ltd.
化合物1はそれ自体の屈折率が高いだけでなく、本発明1の屈折率を更に向上するために化合物Bを本発明1に配合しても、本発明1の粘度の増大を抑制することができる。 Compound 1 not only has a high refractive index of itself, but even if compound B is added to the present invention 1 in order to further improve the refractive index of the present invention 1, the increase in the viscosity of the present invention 1 is suppressed. it can.
本発明1の硬化速度及び屈折率を向上する観点から、R1が水素及び/又はaが0〜2(好ましくは0〜1、より好ましくは0)である。 From the viewpoint of improving the curing rate and the refractive index of Invention 1, R 1 is hydrogen and / or a is 0 to 2 (preferably 0 to 1, more preferably 0).
(化合物A2)
化合物A2は、ベンジルアクリレートであり、例えば、日立化成社より市販品(製品名「FA-BZA」)として入手できる。
(Compound A2)
Compound A2 is benzyl acrylate and can be obtained, for example, as a commercial product (product name “FA-BZA”) from Hitachi Chemical.
化合物A2は、従前は光硬化性樹脂組成物の粘度抑制のために化合物Aにおける助剤として使用されてきたが、化合物Bと組み合わせて配合する場合は、化合物Aにおける主剤として使用すると、化合物Bを多量に配合しても本発明1の増粘を抑制するため、本発明1の屈折率の従前からは予想できないほど改善効果をもたらす。 The compound A2 has been used as an auxiliary agent in the compound A for the purpose of suppressing the viscosity of the photocurable resin composition. However, when compounded in combination with the compound B, the compound A2 is used as the main agent in the compound A. In order to suppress the thickening of the present invention 1 even if blended in a large amount, the effect of improving the refractive index of the present invention 1 is unpredictable from the past.
(化合物A1及びA2以外の化合物A)
化合物A1及びA2以外の化合物Aとしては、屈折率の高い(メタ)アクリレートとして知られるフルオレン骨格を有する2官能(メタ)アクリレート、フェニルフェノールエトキシアクリレートが好ましく使用できる。例えば、特許文献1及び2にこれらの詳細が記載されている。
(Compound A other than Compounds A1 and A2)
As the compound A other than the compounds A1 and A2, a bifunctional (meth) acrylate having a fluorene skeleton known as a (meth) acrylate having a high refractive index and phenylphenol ethoxyacrylate can be preferably used. For example, Patent Documents 1 and 2 describe these details.
本発明1の光硬化体である本発明3を光学部品中の構成材への接着強度を向上する観点から、本発明1には、(メタ)アクリレートモノマーを配合することが好ましい。 From the viewpoint of improving the adhesive strength of the invention 3 which is the photocured material of the invention 1 to the constituent material in the optical component, it is preferable that the invention 1 is blended with a (meth) acrylate monomer.
そのような(メタ)アクリレートモノマーとしては、速硬性及び低硬化収縮性を両立する観点も考慮すると、官能数の異なる(メタ)アクリレートを含むことが好ましく、単官能の(メタ)アクリレートと多官能の(メタ)アクリレートとを含むことがより好ましい。 As such a (meth) acrylate monomer, it is preferable to include (meth) acrylates having different functional numbers from the viewpoint of achieving both rapid curing and low curing shrinkage, and monofunctional (meth) acrylate and polyfunctional It is more preferable that (meth) acrylate of this is included.
単官能(メタ)アクリレートとしては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n−プロピル(メタ)アクリレート、i−プロピル(メタ)アクリレート、n−ブチル(メタ)アクリレート、i−ブチル(メタ)アクリレート、t−ブチル(メタ)アクリレート、2−メチルブチル(メタ)アクリレート、n−ペンチル(メタ)アクリレート、n−ヘキシル(メタ)アクリレート、n−ヘプチル(メタ)アクリレート、2−メチルヘキシル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、2−ブチルヘキシル(メタ)アクリレート、イソオクチル(メタ)アクリレート、イソペンチル(メタ)アクリレート、イソノニル(メタ)アクリレート、イソデシル(メタ)アクリレート、イソボルニル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェノキシ(メタ)アクリレート、n−ノニル(メタ)アクリレート、n−デシル(メタ)アクリレート、ラウリル(メタ)アクリレート、ヘキサデシル(メタ)アクリレート、ステアリル(メタ)アクリレート、モルホリン−4−イル(メタ)アクリレート等、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、2-(メタ)アクリロイロキシエチル-コハク酸が挙げられる。 Monofunctional (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) ) Acrylate, t-butyl (meth) acrylate, 2-methylbutyl (meth) acrylate, n-pentyl (meth) acrylate, n-hexyl (meth) acrylate, n-heptyl (meth) acrylate, 2-methylhexyl (meth) Acrylate, 2-ethylhexyl (meth) acrylate, 2-butylhexyl (meth) acrylate, isooctyl (meth) acrylate, isopentyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, isobornyl (meth) Acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenoxy (meth) acrylate, n-nonyl (meth) acrylate, n-decyl (meth) acrylate, lauryl (meth) acrylate, hexadecyl (meth) acrylate, stearyl ( (Meth) acrylate, morpholin-4-yl (meth) acrylate, etc. 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate , Tetrahydrofurfuryl (meth) acrylate, 2- (meth) acryloyloxyethyl-succinic acid.
二官能(メタ)アクリレートとしては、ビスフェノールF―EO変性ジ(メタ)アクリレート、ビスフェノールA―EO変性ジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、ジシクロペンタジエン(メタ)アクリレート等が挙げられる。 Bifunctional (meth) acrylates include bisphenol F-EO-modified di (meth) acrylate, bisphenol A-EO-modified di (meth) acrylate, polypropylene glycol di (meth) acrylate, polyethylene glycol (meth) acrylate, and tricyclodecanedi. Examples include methylol di (meth) acrylate and dicyclopentadiene (meth) acrylate.
三官能(メタ)アクリレートとしては、トリメチロールプロパントリ(メタ)アクリレート、トリメチロールプロパンPO変性(メタ)アクリレート、イソシアヌル酸EO変性トリ(メタ)アクリレート等が挙げられる。 Examples of the trifunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, trimethylolpropane PO-modified (meth) acrylate, and isocyanuric acid EO-modified tri (meth) acrylate.
四官能以上の(メタ)アクリレートとしては、ジペンタエリスリトールペンタ(メタ)アクリレート、ペンタエリスリトールヘキサ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラアクリレート、多官能のポリウレタンを骨格に含む(メタ)アクリレート(以下、多官能ウレタン(メタ)アクリレートともいう)等が挙げられる。 As tetrafunctional or higher functional (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetraacrylate, polyfunctional polyurethane is included in the skeleton. (Meth) acrylate (hereinafter also referred to as polyfunctional urethane (meth) acrylate) and the like.
本発明1の光硬化体である本発明3の脆性を向上する観点から、本発明1には、(メタ)アクリレートオリゴマーを配合することが好ましい。 From the viewpoint of improving the brittleness of Invention 3 which is the photocured product of Invention 1, it is preferable to incorporate (meth) acrylate oligomer in Invention 1.
そのような(メタ)アクリレートオリゴマーとしては、速硬性及び低硬化収縮性の観点も考慮すると、好ましくはポリイソプレン、ポリブタジエン及びポリウレタンからなる群から選択される少なくとも1種を骨格に含む(メタ)アクリレートオリゴマーの少なくとも1種を含む。
(メタ)アクリレートオリゴマーは1種単独でも2種以上を組合せて使用できる。
As such (meth) acrylate oligomer, in view of fast curing and low cure shrinkage, (meth) acrylate preferably contains at least one selected from the group consisting of polyisoprene, polybutadiene and polyurethane in the skeleton. It contains at least one oligomer.
The (meth) acrylate oligomer can be used alone or in combination of two or more.
ポリイソプレンを骨格に含む(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリイソプレンとも呼ばれる。ポリイソプレンを骨格にもつ(メタ)アクリレートオリゴマーの重量平均分子量は、好ましくは1000〜100000であり、より好ましくは10000〜60000である。
ポリイソプレンを骨格にもつ(メタ)アクリレートオリゴマーの市販品として、例えば、クラレ社製の「UC−1」(重量平均分子量25000)が挙げられる。
The (meth) acrylate oligomer containing polyisoprene in the skeleton is also called (meth) acryl-modified polyisoprene. The weight average molecular weight of the (meth) acrylate oligomer having polyisoprene as a skeleton is preferably 1000 to 100,000, more preferably 10,000 to 60,000.
As a commercially available product of a (meth) acrylate oligomer having a polyisoprene as a skeleton, for example, “UC-1” (weight average molecular weight 25000) manufactured by Kuraray Co., Ltd. may be mentioned.
ポリブタジエンを骨格に含む(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリブタジエンとも呼ばれる。ポリブタジエンを骨格に含む(メタ)アクリレートオリゴマーの重量平均分子量は、好ましくは500〜100000であり、より好ましくは1000〜60000である。
ポリブタジエンを骨格に含む(メタ)アクリレートオリゴマーの市販品として、例えば、日本曹達社製の「TE2000」(重量平均分子量2000)が挙げられる。
The (meth) acrylate oligomer containing polybutadiene in the skeleton is also called (meth) acryl-modified polybutadiene. The weight average molecular weight of the (meth) acrylate oligomer containing polybutadiene in the skeleton is preferably 500 to 100,000, more preferably 1000 to 60,000.
Examples of commercially available (meth) acrylate oligomers containing polybutadiene in the skeleton include “TE2000” (weight average molecular weight 2000) manufactured by Nippon Soda Co., Ltd.
ポリウレタンを骨格に含む(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリウレタンとも呼ばれる。ポリウレタンを骨格に含む(メタ)アクリレートオリゴマーの重量平均分子量は、好ましくは1000〜100000であり、より好ましくは10000〜60000である。
ポリウレタンを骨格に含む(メタ)アクリレートオリゴマーの市販品として、例えば、根上工業社製の「UN−7700」が挙げられる。
The (meth) acrylate oligomer containing polyurethane in the skeleton is also called (meth) acryl-modified polyurethane. The weight average molecular weight of the (meth) acrylate oligomer containing polyurethane in the skeleton is preferably 1000 to 100,000, more preferably 10,000 to 60000.
As a commercial item of the (meth) acrylate oligomer containing a polyurethane in the skeleton, for example, “UN-7700” manufactured by Negami Kogyo Co., Ltd. may be mentioned.
(メタ)アクリレートオリゴマーは、これらの中でも、ポリイソプレン及びポリブタジエンからなる群から選択される少なくとも1種を骨格に含む(メタ)アクリレートオリゴマーが好ましい。 Among these, the (meth) acrylate oligomer is preferably a (meth) acrylate oligomer containing at least one selected from the group consisting of polyisoprene and polybutadiene in the skeleton.
なお、重量平均分子量は、GPCに基づいて測定されたものであり、好ましくは、以下の条件で測定される:
測定装置:島津製作所社製GPCシステム;
カラムの種類:有機溶媒系SECカラム(東ソー社製);
溶剤の種類:テトラヒドロフラン(THF)。
The weight average molecular weight is measured based on GPC, and is preferably measured under the following conditions:
Measuring device: GPC system manufactured by Shimadzu Corporation;
Column type: organic solvent SEC column (manufactured by Tosoh Corporation);
Solvent type: tetrahydrofuran (THF).
(化合物B)
化合物Bである金属含有ナノ粒子とは、平均粒径が1〜100nmの金属含有粒子である。
(Compound B)
The metal-containing nanoparticles that are compound B are metal-containing particles having an average particle diameter of 1 to 100 nm.
平均粒径は、化合物Bを分散できる溶媒で希釈して測定に適節な濃度にし、動的光散乱式粒径分布測定装置LB500(堀場製作所社製)で測定する。
みかけの算術平均粒子径の測定方法により測定して得られた算術平均粒子径を、化合物Bの平均粒径とした。
みかけの算術平均粒子径の算出において、原料であるナノ金属含有粒子の屈折率を入力し、溶媒の屈折率は、測定時の希釈溶媒のものを入力する。
表面修飾物等の影響は無視する。
サンプリング及び測定は、測定液調整後できるだけ速やかに行う。
The average particle size is diluted with a solvent capable of dispersing Compound B to a concentration suitable for measurement, and measured with a dynamic light scattering particle size distribution analyzer LB500 (manufactured by Horiba, Ltd.).
The arithmetic average particle diameter obtained by measuring the apparent arithmetic average particle diameter was used as the average particle diameter of Compound B.
In the calculation of the apparent arithmetic average particle diameter, the refractive index of the nanometal-containing particles as the raw material is input, and the refractive index of the solvent is that of the diluted solvent at the time of measurement.
Ignore the effects of surface modification.
Sampling and measurement should be performed as soon as possible after adjustment of the sample solution.
平均粒径は、例えばレーザー回折/散乱式粒度分布測定装置でも測定でき、具体的には株式会社堀場製作所製LA−920等を用いることができる。 The average particle diameter can be measured by, for example, a laser diffraction / scattering particle size distribution measuring apparatus, and specifically, LA-920 manufactured by Horiba, Ltd. can be used.
化合物Bの粒度分布は、上記測定方法で測定した場合に、単一のピークを示すものであることが好ましい。 The particle size distribution of Compound B preferably shows a single peak when measured by the above measurement method.
化合物Bの平均粒径は、本発明1の屈折率向上の観点から、
好ましくは3〜50nm、より好ましくは5〜30nm、更に好ましくは5〜15nmである。
From the viewpoint of improving the refractive index of the invention 1, the average particle size of the compound B is
Preferably it is 3-50 nm, More preferably, it is 5-30 nm, More preferably, it is 5-15 nm.
化合物Bとしては、金属、半導体または酸化金属等の態様が挙げられる。 Examples of the compound B include metal, semiconductor, metal oxide and the like.
化合物Bを構成する金属含有化合物としては、化合物A1及び/又は化合物A2と組み合わせたときの屈折率向上の観点から、好ましくは、
アルミニウム、カドミウム、セリウム、クロミウム、コバルト、銅、ガリウム、ゲルマニウム、金、インジウム、鉄、イリジウム、鉛、水銀、ニッケル、プラチナ、パラジウム、ケイ素、銀、錫、亜鉛、ジルコニウム、ヒ化アルミニウム、窒化アルミニウム、リン化アルミニウム、セレン化カドミウム、硫化カドミウム、テルル化カドミウム、ヒ化ガリウム、窒化ガリウム、リン化ガリウム、セレン化ガリウム、硫化ガリウム、ヒ化インジウム、リン化インジウム、窒化インジウム、セレン化インジウム、硫化インジウム、テルル化インジウム、セレン化鉛、硫化鉛、テルル化鉛、セレン化水銀、硫化水銀、テルル化水銀、セレン化亜鉛、硫化亜鉛、テルル化亜鉛、酸化アルミニウム、酸化カドミウム、酸化セリウム、酸化クロム、酸化コバルト、酸化インジウム、酸化インジウムスズ、酸化鉄、酸化鉛、酸化ニッケル、二酸化ケイ素、酸化スズ、酸化チタン、酸化亜鉛及び酸化ジルコニウムからなる群から選ばれる少なくとも1種の化合物、より好ましくは、
酸化スズ、酸化チタン、酸化亜鉛及び酸化ジルコニウムからなる群から選ばれる少なくとも1種の化合物、更に好ましくは、
酸化チタン及び酸化ジルコニウムからなる群から選ばれる少なくとも1種の化合物、更に好ましくは、酸化ジルコニウムである。
The metal-containing compound constituting the compound B is preferably from the viewpoint of improving the refractive index when combined with the compound A1 and / or the compound A2,
Aluminum, cadmium, cerium, chromium, cobalt, copper, gallium, germanium, gold, indium, iron, iridium, lead, mercury, nickel, platinum, palladium, silicon, silver, tin, zinc, zirconium, aluminum arsenide, aluminum nitride , Aluminum phosphide, cadmium selenide, cadmium sulfide, cadmium telluride, gallium arsenide, gallium nitride, gallium phosphide, gallium selenide, gallium sulfide, indium arsenide, indium phosphide, indium nitride, indium selenide, sulfide Indium, indium telluride, lead selenide, lead sulfide, lead telluride, mercury selenide, mercury sulfide, mercury telluride, zinc selenide, zinc sulfide, zinc telluride, aluminum oxide, cadmium oxide, cerium oxide, chromium oxide , Oxidized oxide DOO, indium oxide, indium tin oxide, iron oxide, lead oxide, nickel oxide, silicon dioxide, tin oxide, titanium oxide, at least one compound selected from the group consisting of zinc oxide and zirconium oxide, and more preferably,
At least one compound selected from the group consisting of tin oxide, titanium oxide, zinc oxide and zirconium oxide, more preferably
At least one compound selected from the group consisting of titanium oxide and zirconium oxide, more preferably zirconium oxide.
(化合物C)
化合物Cは、光重合開始剤(好ましくは、光ラジカル重合開始剤)であり、使用する光源の波長に対して活性を有するものが配合され、適切な活性種を発生させるものを用いる。また、光重合開始剤は1種類のみでも、2種類以上用いてもよい。
(Compound C)
Compound C is a photopolymerization initiator (preferably a photoradical polymerization initiator), and a compound that has activity with respect to the wavelength of the light source to be used is mixed to generate an appropriate active species. Moreover, only one type of photopolymerization initiator may be used, or two or more types may be used.
化合物Cは、インプリントを形成する基材や型越しに光照射するため、これらの基材や型が透過する波長に対して適時に選択する必要があるが、硬化速度が速く、樹脂との相溶性に優れ、硬化後の黄変が少ないものが好ましい。
硬化速度の速いものは、低エネルギー量の光線にて硬化出来るため、ロールtoロール方式などでの大量生産という観点で好ましい。
相溶性に優れるものは、結晶化などによる開始剤の析出が起き難く、また黄変が少ないものは、透明性に優れるなどの観点でそれぞれ好ましい。
Since compound C irradiates light through a substrate or a mold that forms an imprint, it is necessary to select the time appropriate for the wavelength that these substrate and mold transmit, but the curing speed is fast and Those having excellent compatibility and little yellowing after curing are preferred.
Those having a fast curing rate are preferable from the viewpoint of mass production by a roll-to-roll method or the like because they can be cured by a low energy light beam.
Those having excellent compatibility are preferably each from the viewpoints that precipitation of an initiator due to crystallization or the like hardly occurs, and those having little yellowing are excellent in transparency.
化合物Cとしては、BASF社の、
Irgacure184、Irgacure819等のIrgacure(登録商標)シリーズ、
Darocur1173等のDarocur(登録商標)シリーズ、
Lucirin TPO等のLucirin(登録商標)シリーズ、
ESACUR日本シイベルヘグナー社のESACURE 1001M(1−[4−ベンゾイルフェニルスルファニル]フェニル]−2−メチル−2−(4−メチルフェニルスルホニル)プロパン−1−オン等が挙げられる。
As compound C, BASF's,
Irgacure (registered trademark) series such as Irgacure 184, Irgacure 819,
Darocur (registered trademark) series such as Darocur 1173,
Lucirin (registered trademark) series such as Lucirin TPO,
Examples include ESACURE 1001M (1- [4-benzoylphenylsulfanyl] phenyl] -2-methyl-2- (4-methylphenylsulfonyl) propan-1-one manufactured by ESACUR Nippon Siebel Hegner.
(その他の化合物)
本発明1は化合物A、B及びC以外にも、本発明1の効果を損なわない範囲で他の化合物を含めることができる。
(Other compounds)
In addition to the compounds A, B and C, the present invention 1 can contain other compounds as long as the effects of the present invention 1 are not impaired.
他の化合物としては、化合物Aと光反応して重合しうる化合物を挙げることができ、例えば、エポキシ系オリゴマー、フェノール系樹脂、オキセタン化合物等が挙げられる。 Examples of other compounds include compounds that can be polymerized by photoreaction with compound A, and examples include epoxy oligomers, phenolic resins, oxetane compounds, and the like.
本発明1は、必要に応じて、各種の添加剤を任意成分として含むことができる。
例えば、酸化防止剤、紫外線吸収剤、光安定剤、シランカップリング剤、重合禁止剤、レベリング剤、界面活性剤、着色剤、保存安定剤、可塑剤、滑剤、フィラー、老化防止剤、濡れ性改良剤、離型剤等を含めることができる。
This invention 1 can contain various additives as an arbitrary component as needed.
For example, antioxidant, UV absorber, light stabilizer, silane coupling agent, polymerization inhibitor, leveling agent, surfactant, colorant, storage stabilizer, plasticizer, lubricant, filler, anti-aging agent, wettability Improving agents, release agents and the like can be included.
本発明1が溶剤を含む場合、例えば金型を用いたレンズなどを成型する場合や、2枚のガラスを接着する場合に、溶剤がそのまま硬化体中に残り硬化体の脆弱性を招かないように、本発明1は、硬化体の製造過程で揮発してしまう程度の溶剤量に抑えることが好ましく、溶剤を含まないことがより好ましい。 When the present invention 1 includes a solvent, for example, when molding a lens using a mold or when two glasses are bonded, the solvent remains in the cured body as it is so as not to cause brittleness of the cured body. In addition, the present invention 1 is preferably suppressed to an amount of solvent that volatilizes during the production process of the cured product, and more preferably does not contain a solvent.
(光硬化性樹脂組成物)
本発明1は、化合物A、化合物B及び化合物Cを含む光硬化性樹脂組成物であって、
化合物Aが、化合物A1及び/又は化合物A2を含み、
化合物A中、化合物A1及び/又は化合物A2の合計含有量が60〜100質量%であり、光硬化性樹脂組成抑制物1の屈折率が1.60以上である。
(Photocurable resin composition)
The present invention 1 is a photocurable resin composition comprising Compound A, Compound B and Compound C,
Compound A includes Compound A1 and / or Compound A2,
In the compound A, the total content of the compound A1 and / or the compound A2 is 60 to 100% by mass, and the refractive index of the photocurable resin composition inhibitor 1 is 1.60 or more.
本発明1は、本発明1の増粘を抑制しつつ屈折率を向上する観点と、光学部品中の構成材への接着強度及び脆性を向上する観点とから、
化合物A中、化合物A1及び/又は化合物A2の合計含有量は、好ましくは60〜90質量%、より好ましくは65〜80質量%、更に好ましくは65〜75質量%であり、
化合物A中、化合物A1及び/又は化合物A2以外の他の化合物Aとしては、好ましくは(メタ)アクリレートモノマー及び/又は(メタ)アクリレートオリゴマーである。
The present invention 1 is from the viewpoint of improving the refractive index while suppressing the thickening of the present invention 1, and from the viewpoint of improving the adhesive strength and brittleness to the constituent material in the optical component,
In the compound A, the total content of the compound A1 and / or the compound A2 is preferably 60 to 90% by mass, more preferably 65 to 80% by mass, still more preferably 65 to 75% by mass,
In the compound A, the compound A other than the compound A1 and / or the compound A2 is preferably a (meth) acrylate monomer and / or a (meth) acrylate oligomer.
化合物A1と化合物A2を併用する場合は、化合物A1と化合物A2の質量比(A1/A2)は、好ましくは10/90〜90/10、より好ましくは20/80〜80/20、更に好ましくは30/70〜70/30、更に好ましくは40/60〜60/40である。 When the compound A1 and the compound A2 are used in combination, the mass ratio (A1 / A2) between the compound A1 and the compound A2 is preferably 10/90 to 90/10, more preferably 20/80 to 80/20, still more preferably 30/70 to 70/30, more preferably 40/60 to 60/40.
本発明1の増粘を抑制しつつ屈折率を向上する観点から、
化合物A100質量部に対して、化合物Bは、好ましくは30〜90質量部、より好ましくは40〜80質量部、更に好ましくは50〜70質量部である。
From the viewpoint of improving the refractive index while suppressing the thickening of the present invention 1,
Compound B is preferably 30 to 90 parts by mass, more preferably 40 to 80 parts by mass, and still more preferably 50 to 70 parts by mass with respect to 100 parts by mass of compound A.
本発明1の硬化体の常態強度、耐久強度及び硬化性の観点から、
化合物A100質量部に対して、化合物Cは、好ましくは0.1〜10質量部、より好ましくは0.5〜7質量部、更に好ましくは0.7〜3質量部である。
From the viewpoint of normal strength, durability strength and curability of the cured product of the present invention 1,
The compound C is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 7 parts by mass, and still more preferably 0.7 to 3 parts by mass with respect to 100 parts by mass of the compound A.
本発明1の増粘を抑制しつつ屈折率を向上する観点と、本発明1の硬化体の常態強度、耐久強度及び硬化性の観点とから、
本発明1中、化合物A、化合物B及び化合物Cの合計含有量は、好ましくは70〜100質量%、より好ましくは80〜100質量%、更に好ましくは90〜100質量%、更に好ましくは95〜100質量%である。
From the viewpoint of improving the refractive index while suppressing the thickening of the present invention 1, and from the viewpoint of the normal strength, durability strength and curability of the cured product of the present invention 1,
In the present invention 1, the total content of Compound A, Compound B and Compound C is preferably 70 to 100% by mass, more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
本発明1は、化合物A、化合物B及び化合物Cを上述した好適態様を考慮して、
屈折率が1.60以上に調整され、好ましくは1.61以上に調整され、より好ましくは1.62以上に調整される。
This invention 1 considers the suitable aspect which mentioned above the compound A, the compound B, and the compound C,
The refractive index is adjusted to 1.60 or more, preferably 1.61 or more, and more preferably 1.62 or more.
本発明1は、化合物A、化合物B及び化合物Cを上述した好適態様を考慮して、
粘度が、好ましくは10〜10000mPa・s、より好ましくは20〜5000mPa・s、更に好ましくは50〜4000mPa・sに調整される。
〔本発明2〕
本発明2は、(メタ)アクリレート化合物(以下、化合物A'という)、金属含有ナノ粒子(以下、化合物B'という)及び光重合開始剤(以下、化合物C'という)を含む光硬化性樹脂組成物(以下、光硬化性樹脂組成物2という)であって、化合物A'が、化合物A1を含む。
This invention 1 considers the suitable aspect which mentioned above the compound A, the compound B, and the compound C,
The viscosity is preferably adjusted to 10 to 10000 mPa · s, more preferably 20 to 5000 mPa · s, and still more preferably 50 to 4000 mPa · s.
[Invention 2]
The present invention 2 is a photocurable resin comprising a (meth) acrylate compound (hereinafter referred to as compound A ′), a metal-containing nanoparticle (hereinafter referred to as compound B ′) and a photopolymerization initiator (hereinafter referred to as compound C ′). It is a composition (hereinafter referred to as photocurable resin composition 2), and the compound A ′ contains the compound A1.
本発明2の増粘を抑制しつつ屈折率を向上する観点から、本発明2は、上述した本発明1の態様を含む。 From the viewpoint of improving the refractive index while suppressing the thickening of the present invention 2, the present invention 2 includes the above-described aspect of the present invention 1.
本発明2では、化合物A'が化合物A1以外の(メタ)アクリレート化合物で構成されている場合に、化合物A1を含めることで、本発明2の粘性を低減し屈折率を向上することができる。 In the present invention 2, when the compound A ′ is composed of a (meth) acrylate compound other than the compound A1, the viscosity of the present invention 2 can be reduced and the refractive index can be improved by including the compound A1.
本発明2では、化合物A'中の化合物A1以外の(メタ)アクリレート化合物として、化合物A2を含むことが好ましく、化合物A2並びに(メタ)アクリレートモノマー及び/又は(メタ)アクリレートオリゴマーを含むことがより好ましい。 In the present invention 2, the compound A2 is preferably included as a (meth) acrylate compound other than the compound A1 in the compound A ′, and more preferably includes the compound A2 and a (meth) acrylate monomer and / or a (meth) acrylate oligomer. preferable.
本発明1は化合物A、B及びC以外にも、本発明1の効果を損なわない範囲で他の化合物を含めることができる。
他の化合物としては、本発明1に含めることができる他の化合物を例示することができる。
In addition to the compounds A, B and C, the present invention 1 can contain other compounds as long as the effects of the present invention 1 are not impaired.
Examples of the other compound include other compounds that can be included in the present invention 1.
本発明2では、化合物A'中、化合物A1の含有量は、好ましくは10〜90質量%、より好ましくは20〜85質量%、更に好ましくは40〜80質量%であり、更に好ましくは60〜80質量%であり、更に好ましくは65〜75質量%である。 In the present invention 2, the content of the compound A1 in the compound A ′ is preferably 10 to 90% by mass, more preferably 20 to 85% by mass, still more preferably 40 to 80% by mass, and further preferably 60 to It is 80 mass%, More preferably, it is 65-75 mass%.
本発明2では、化合物A'中の化合物A1以外の(メタ)アクリレート化合物として、化合物A2を含むことが好ましく、化合物A2並びに(メタ)アクリレートモノマー及び/又は(メタ)アクリレートオリゴマーを含むことがより好ましい。 In the present invention 2, the compound A2 is preferably included as a (meth) acrylate compound other than the compound A1 in the compound A ′, and more preferably includes the compound A2 and a (meth) acrylate monomer and / or a (meth) acrylate oligomer. preferable.
本発明2の増粘を抑制しつつ屈折率を向上する観点から、化合物A'100質量部に対して、化合物B'は、好ましくは30〜90質量部、より好ましくは40〜80質量部、更に好ましくは50〜70質量部である。 From the viewpoint of improving the refractive index while suppressing the thickening of the present invention 2, the compound B ′ is preferably 30 to 90 parts by mass, more preferably 40 to 80 parts by mass with respect to 100 parts by mass of the compound A ′. More preferably, it is 50-70 mass parts.
本発明2の硬化体の常態強度、耐久強度及び硬化性の観点から、化合物A'100質量部に対して、化合物C'は、好ましくは0.1〜10質量部、より好ましくは0.5〜7質量部、更に好ましくは0.7〜3質量部である。 From the viewpoint of normal strength, durability strength and curability of the cured product of the present invention 2, the compound C ′ is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 100 parts by mass of the compound A ′. -7 parts by mass, more preferably 0.7-3 parts by mass.
本発明2の増粘を抑制しつつ屈折率を向上する観点と、本発明2の硬化体の常態強度、耐久強度及び硬化性の観点とから、
本発明1中、化合物A'、化合物B'及び化合物C'の合計含有量は、好ましくは70〜100質量%、より好ましくは80〜100質量%、更に好ましくは90〜100質量%、更に好ましくは95〜100質量%である。
From the viewpoint of improving the refractive index while suppressing the thickening of the present invention 2, and from the viewpoint of normal strength, durability strength and curability of the cured product of the present invention 2,
In the present invention 1, the total content of compound A ′, compound B ′ and compound C ′ is preferably 70 to 100% by mass, more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably. Is 95 to 100% by mass.
本発明1は、化合物A'、化合物B'及び化合物C'を上述した好適態様を考慮して、
屈折率が、好ましくは1.60以上に調整され、より好ましくは1.61以上に調整され、更に好ましくは1.62以上に調整される。
In the present invention 1, in consideration of the preferred embodiments described above for Compound A ′, Compound B ′ and Compound C ′,
The refractive index is preferably adjusted to 1.60 or more, more preferably adjusted to 1.61 or more, and further preferably adjusted to 1.62 or more.
本発明1は、化合物A、化合物B及び化合物Cを上述した好適態様を考慮して、
粘度が、好ましくは10〜10000mPa・s、より好ましくは20〜5000mPa・s、更に好ましくは50〜4000mPa・sに調整される。
This invention 1 considers the suitable aspect which mentioned above the compound A, the compound B, and the compound C,
The viscosity is preferably adjusted to 10 to 10000 mPa · s, more preferably 20 to 5000 mPa · s, and still more preferably 50 to 4000 mPa · s.
〔本発明3〕
本発明3は、本発明1又は本発明2を硬化してなる高屈折性樹脂硬化体である。
[Invention 3]
The present invention 3 is a highly refractive resin cured product obtained by curing the present invention 1 or the present invention 2.
本発明3は、本発明1又は本発明2を後述する好適成形及び硬化の条件を考慮して、屈折率が、好ましくは1.64以上、より好ましくは1.65以上に調整されることが好ましい。 In the invention 3, the refractive index is preferably adjusted to 1.64 or more, more preferably 1.65 or more in consideration of the conditions of suitable molding and curing described later in the invention 1 or the invention 2. preferable.
本発明3は、本発明1又は本発明2を目的に応じた形状に成形して、その成形体に光を照射して硬化反応により硬化させて製造できる。 The present invention 3 can be produced by molding the present invention 1 or the present invention 2 into a shape suitable for the purpose, irradiating the molded body with light and curing it by a curing reaction.
本発明3は、例えば、三次元的硬化体、硬化膜、硬化パターンなどの一次元又は二次元的硬化体、点又はドット状硬化体などであってもよい。 The present invention 3 may be, for example, a one-dimensional or two-dimensional cured body such as a three-dimensional cured body, a cured film, or a cured pattern, or a dot or dot-shaped cured body.
本発明1又は本発明2の成形は、例えば、基材上で本発明1又は本発明2の膜状体を形成させたり、用途に応じた型枠に充填して立体成形させたりしてよい。 The molding of the present invention 1 or the present invention 2 may be performed, for example, by forming the film-like body of the present invention 1 or the present invention 2 on a base material, or filling a mold according to the application to form a three-dimensional mold. .
基材上で本発明1又は本発明2の膜状体を形成させる方法としては、例えば、フローコーティング法、スピンコーティング法、スプレーコーティング法、スクリーン印刷法、キャスト法、バーコーティング法、カーテンコーティング法、ロールコーティング法、グラビアコーティング法、ディッピング法、スリット法などを挙げることができる。 Examples of the method for forming the film-like body of the present invention 1 or 2 on a substrate include, for example, a flow coating method, a spin coating method, a spray coating method, a screen printing method, a casting method, a bar coating method, and a curtain coating method. , Roll coating method, gravure coating method, dipping method, slit method and the like.
本発明3が膜状又はシート状の場合、本発明3の厚みは、硬化体の用途に応じて、0.01μm〜10mm程度であることが好ましく、例えば、
フォトレジストの場合、0.05〜10μmであることが好ましく、0.1〜5μmであることがより好ましく、
プリント配線基板の場合、10μm〜5mmであることが好ましく、100μm〜1m mであることがより好ましく、
光学薄膜の場合、0.1〜100μmであることが好ましく、0.3〜50μmであることがより好ましい。
When the present invention 3 is in the form of a film or a sheet, the thickness of the present invention 3 is preferably about 0.01 μm to 10 mm, depending on the use of the cured body.
In the case of a photoresist, it is preferably 0.05 to 10 μm, more preferably 0.1 to 5 μm,
In the case of a printed wiring board, it is preferably 10 μm to 5 mm, more preferably 100 μm to 1 mm,
In the case of an optical thin film, it is preferably 0.1 to 100 μm, and more preferably 0.3 to 50 μm.
レンズ用途の本発明3の場合、本発明3は、両面が凸型の傾斜となる形状もしくは片面が凸型の傾斜でもう片面がガラスなどの基材と密着してなる形態であることが好ましい。 In the case of the present invention 3 for lens use, the present invention 3 is preferably in a form in which both surfaces have a convex inclination or a form in which one surface is a convex inclination and the other surface is in close contact with a substrate such as glass. .
照射又は露光する光は、光重合開始剤によって、例えば、紫外線、可視光線などであってよいが、本発明3の色味を抑制し透明性を向上する、好ましくは無色透明性を向上する観点から、紫外線がより好ましい。 The light to be irradiated or exposed may be, for example, ultraviolet light or visible light, depending on the photopolymerization initiator, but the color tone of the present invention 3 is suppressed to improve transparency, and preferably to improve colorless transparency. Therefore, ultraviolet rays are more preferable.
速硬性及び本発明3の色味を抑制し透明性を向上する、好ましくは無色透明性を向上する観点から、光の波長は、150〜450nmであることが好ましく、200〜400nmであることが更に好ましく、300〜400nmであることが更に好ましい。 From the viewpoint of improving the transparency by suppressing the fast curing and the color of the present invention 3, and preferably improving the colorless transparency, the wavelength of light is preferably 150 to 450 nm, and preferably 200 to 400 nm. More preferred is 300 to 400 nm.
硬化反応を十分に進行させる観点から、照射光量は、塗膜の厚みにより異なるが、1500〜10000mJ/cm2であることが好ましく、2000〜9000mJ/cm2であることがより好ましく、3000〜9000mJ/cm2であることが更に好ましく、4000〜7000mJ/cm2であることが更に好ましい。 From the viewpoint of sufficiently proceed the curing reaction, irradiation light amount varies depending on the thickness of the coating film is preferably 1500~10000mJ / cm 2, more preferably 2000~9000mJ / cm 2, 3000~9000mJ / Cm 2 is more preferable, and 4000 to 7000 mJ / cm 2 is more preferable.
光源としては、露光する光線の種類に応じて選択でき、例えば、紫外線の場合は、低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、重水素ランプ、ハロゲンランプ、レーザー光(ヘリウム−カドミウムレーザー、エキシマレーザーなど)などを用いることができる。 The light source can be selected according to the type of light beam to be exposed. For example, in the case of ultraviolet rays, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a deuterium lamp, a halogen lamp, laser light (helium-cadmium laser, Excimer laser etc.) can be used.
成形された本発明1又は本発明2は、必要に応じて、光照射後、又は光照射とともに加熱が行われるが、光照射後に行われる場合が多い。
加熱温度は、60〜250℃であることが好ましく、100〜200℃であることがより好ましく、
加熱時間は、1分〜2時間であることが好ましく、10分〜1時間であることがより好ましく、20分〜1時間であることが更に好ましく、30分〜1時間であることが更に好ましい。
The molded invention 1 or invention 2 is heated after light irradiation or with light irradiation as necessary, but is often performed after light irradiation.
The heating temperature is preferably 60 to 250 ° C, more preferably 100 to 200 ° C,
The heating time is preferably 1 minute to 2 hours, more preferably 10 minutes to 1 hour, further preferably 20 minutes to 1 hour, and further preferably 30 minutes to 1 hour. .
パターンや画像を形成する場合(例えば、プリント配線基板などを製造する場合)、基材上に形成した塗膜をパターン露光してもよく、このパターン露光は、レーザー光の走査により行ってもよく、フォトマスクを介して光照射することにより行ってもよい。 When a pattern or an image is formed (for example, when a printed wiring board is manufactured), the coating film formed on the substrate may be subjected to pattern exposure, and this pattern exposure may be performed by scanning with a laser beam. Alternatively, light irradiation may be performed through a photomask.
パターン露光により生成した非照射領域(未露光部)を現像剤で現像(又は溶解)することによりパターン又は画像を形成できる。
露光後に被膜を加熱する場合、現像工程は、加熱工程の前に行ってもよく、加熱工程の後で行ってもよい。
A pattern or an image can be formed by developing (or dissolving) a non-irradiated region (unexposed portion) generated by pattern exposure with a developer.
When the coating is heated after the exposure, the development step may be performed before the heating step or after the heating step.
これらの方法は、小さな露光量でも、基材上に、精細で高精度のパターンを形成できるため、精密なパターンを必要とする用途、例えば、電子機器のプリント配線基板などの製造に適している。 Since these methods can form a fine and high-precision pattern on a base material even with a small exposure amount, they are suitable for applications that require a precise pattern, for example, printed wiring boards for electronic devices. .
光学薄膜を形成する場合には、本発明1又は本発明2を、基材上に複数層形成してもよい。
また、基材上に他の機能層などを形成した後、その機能層の上に、本発明1又は本発明2で形成された層を形成してもよい。
When an optical thin film is formed, a plurality of layers of the present invention 1 or the present invention 2 may be formed on a substrate.
Moreover, after forming another functional layer etc. on a base material, you may form the layer formed by this invention 1 or this invention 2 on the functional layer.
基材の材質は、用途に応じて選択され、例えば、プリント配線基板や光学薄膜の場合には、シリコン、ガリウム砒素、窒化ガリウム、炭化シリコンなどの半導体、アルミニウム、銅などの金属、酸化ジルコニウム、酸化チタン、P Z T などのセラミック、透明無機材料(ガラス、石英、フッ化マグネシウム、フッ化カルシウムなど)、透明樹脂(ポリメチルメタクリレート、ポリメチルアクリレート、ポリスチレンなど) などが用いられる。 The material of the base material is selected according to the application. For example, in the case of a printed wiring board or an optical thin film, a semiconductor such as silicon, gallium arsenide, gallium nitride, or silicon carbide, a metal such as aluminum or copper, zirconium oxide, Ceramics such as titanium oxide and PZT, transparent inorganic materials (glass, quartz, magnesium fluoride, calcium fluoride, etc.), transparent resins (polymethyl methacrylate, polymethyl acrylate, polystyrene, etc.), etc. are used.
本発明3は、屈折率1.6以上の高屈折率を有しうるため、フレネルレンズ、レンチキュラーレンズ、プリズムレンズ、マイクロレンズ等の各種レンズ、液晶ディスプレイなどの反射防止膜の高屈折率層、反射板などの光学薄膜、光ファイバーのコア材、クラッド材、光導波路、ホログラム等の各種光学材料等の光学用途に使用することが好ましく、フレネルレンズ、レンチキュラーレンズ、プリズムレンズ、マイクロレンズ等の各種レンズに使用することがより好ましい。 Since the present invention 3 can have a high refractive index of 1.6 or higher, various lenses such as a Fresnel lens, a lenticular lens, a prism lens, and a microlens, a high refractive index layer of an antireflection film such as a liquid crystal display, It is preferably used for optical applications such as optical thin films such as reflectors, optical fiber core materials, clad materials, optical waveguides, holograms, etc., and various lenses such as Fresnel lenses, lenticular lenses, prism lenses, micro lenses, etc. It is more preferable to use it.
〔化合物原料〕
(1)化合物A1:式(1)で表される化合物(R1が水素で、a=0)(POB−A、共栄社化学社)
(2)化合物A2:ベンジルアクリレート(FA-BZA、日立化成社)
(3)化合物a1(化合物A1及びA2以外の化合物A又はA'):エトキシo−フェニルフェノールアクリレート(A−LEN−10、共栄社化学社)
(4)化合物a2(化合物A1及びA2以外の化合物A又はA'):フルオレンアクリレート(EA−0200、大阪ガスケミカル社)
(5)化合物a3(化合物A1及びA2以外の化合物A又はA'):フルオレンアクリレート配合品(EA−F5710、大阪ガスケミカル社)
(6)化合物B又はB':酸化ジルコニウムナノ粒子(平均粒径11nm)70wt%MEK分散液(AX−ZP−153−A、日本触媒社)
(7)化合物C又はC':1−ヒドロキシ−シクロヘキシル−フェニル−ケトン(I−184、BASF社)
Compound raw materials
(1) Compound A1: Compound represented by formula (1) (R 1 is hydrogen, a = 0) (POB-A, Kyoeisha Chemical Co., Ltd.)
(2) Compound A2: benzyl acrylate (FA-BZA, Hitachi Chemical Co., Ltd.)
(3) Compound a1 (Compound A or A ′ other than Compounds A1 and A2): Ethoxy o-phenylphenol acrylate (A-LEN-10, Kyoeisha Chemical Company)
(4) Compound a2 (Compound A or A ′ other than Compounds A1 and A2): Fluorene acrylate (EA-0200, Osaka Gas Chemical Company)
(5) Compound a3 (compound A or A ′ other than compounds A1 and A2): fluorene acrylate compounded product (EA-F5710, Osaka Gas Chemical Company)
(6) Compound B or B ′: Zirconium oxide nanoparticles (average particle diameter 11 nm) 70 wt% MEK dispersion (AX-ZP-153-A, Nippon Shokubai Co., Ltd.)
(7) Compound C or C ′: 1-hydroxy-cyclohexyl-phenyl-ketone (I-184, BASF)
〔光硬化性樹脂組成物〕
表1に記載の光硬化性樹脂組成物の組成になるように、化合物A、AX−ZP−153−A及び化合物Cを、合計質量が100〜300gとなるように秤量して、容器(材質SUS316製、容量700ml)に充填し、80℃、大気圧下でスリーワンモーター(新東科学
[Photocurable resin composition]
To obtain the composition of the photocurable resin composition shown in Table 1, Compound A, AX-ZP-153-A and Compound C were weighed so that the total mass was 100 to 300 g, and the container (material) Filled into SUS316, 700ml capacity, Three One Motor (Shinto Kagaku) at 80 ° C under atmospheric pressure
なお、AX−ZP−153−Aを配合する場合、光硬化性樹脂組成物をエバポレーター(N-N、HVC-2000 EYELA社製)を用い、20Torr、60℃の条件にて1hエバポレーションを行い、メチルエチルケトンを揮発させた。 In addition, when mix | blending AX-ZP-153-A, 1 h evaporation is performed on the conditions of 20 Torr and 60 degreeC using the evaporator (N-N, the product made by HVC-2000 EYELA) for the photocurable resin composition. Then, methyl ethyl ketone was volatilized.
実施例1、2−1、2−2及び3が本発明1であり本発明2である。 Examples 1, 2-1, 2-2 and 3 are Invention 1 and Invention 2.
〔高屈折性樹脂硬化体〕
表1記載の実施例及び比較例の光硬化性樹脂組成物(0.3g)を、PETフィルム1(パナック社製、品名ルミラー100T60、厚さ100μm)に塗布し、塗付された光硬化性樹脂組成物の厚みが0.1mmになるように上からPETフィルム2(パナック社製、品名ルミラー100T60、厚さ100μm)で被覆し、メタルハライドランプ(アイグラフィックス社製ECS−301)にて波長365nmの光を6000mJ/cm2照射して光硬化体を得た。
[High refractive resin cured product]
The photocurable resin compositions (0.3 g) of the examples and comparative examples shown in Table 1 were applied to a PET film 1 (manufactured by Panac, product name Lumirror 100T60, thickness 100 μm) and applied. The resin composition is coated with a PET film 2 (Panac Corporation, product name Lumirror 100T60, thickness 100 μm) from the top so that the thickness of the resin composition is 0.1 mm, and the wavelength with a metal halide lamp (ECS-301, Eye Graphics Co., Ltd.). Photocured material was obtained by irradiation with 365 nm light at 6000 mJ / cm 2 .
これらの光硬化体を、さらに、熱風乾燥器内で120℃、30分の加熱処理を行って光硬化してなる0.1mm厚の硬化体を得た。 These photocured bodies were further heat-treated in a hot air dryer at 120 ° C. for 30 minutes to obtain photocured 0.1 mm thick cured bodies.
実施例1、2−1、2−2及び3の光硬化性樹脂組成物を光硬化してなる高屈折性樹脂硬化体が本発明3である。 The highly refractive resin cured product obtained by photocuring the photocurable resin compositions of Examples 1, 2-1, 2-2 and 3 is Invention 3.
〔粘度の測定条件〕
表1記載の実施例及び比較例の光硬化性樹脂組成物について、E型粘度計(東機産業社製RE−105U)を用いて25℃で測定した。
[Measurement conditions for viscosity]
About the photocurable resin composition of the Example of Table 1, and a comparative example, it measured at 25 degreeC using the E-type viscosity meter (Toki Sangyo Co., Ltd. RE-105U).
〔屈折率の測定条件〕
実施例及び比較例の光硬化性樹脂組成物並びに実施例及び比較例の光硬化性樹脂組成物を光硬化してなる硬化体の、25℃における波長589nmの光に対する屈折率を、アッベ屈折率計(2T:アタゴ社製)で測定した。
[Measurement conditions for refractive index]
The refractive index with respect to the light of wavelength 589nm in 25 degreeC of the hardening body formed by photocuring the photocurable resin composition of an Example and a comparative example, and the photocurable resin composition of an Example and a comparative example, Abbe refractive index It was measured with a total (2T: manufactured by Atago Co., Ltd.).
表1に結果を示す。 Table 1 shows the results.
化合物A1及びA2以外の(メタ)アクリレートでは、化合物Bを含まない場合でも、光硬化性樹脂組成物の粘度が大きい(比較例3及び4)。 In (meth) acrylates other than compounds A1 and A2, even when compound B is not included, the viscosity of the photocurable resin composition is large (Comparative Examples 3 and 4).
化合物Bを一定割合含む場合、
比較例1−1の光硬化性樹脂組成物は屈折率が1.60未満であり、
比較例1−2の光硬化性樹脂組成物は粘度が相対的に大きいのに対して、
実施例1の光硬化性樹脂組成物は屈折率が1.60以上あり、粘度も相対的に低いレベルに抑制されている。
When containing a certain proportion of compound B,
The photocurable resin composition of Comparative Example 1-1 has a refractive index of less than 1.60,
The photocurable resin composition of Comparative Example 1-2 has a relatively large viscosity,
The photocurable resin composition of Example 1 has a refractive index of 1.60 or more, and the viscosity is suppressed to a relatively low level.
実施例1並びに比較例1−1及び1−2に対して、化合物Bを増量すると、
実施例2−1は、屈折率が大きく増加するが粘度の増加は抑制され、
実施例2−2も、屈折率が1.60以上となるが粘度の増加は抑制されるのに対して、
比較例2は、粘度の増加が抑制されない。
When the amount of compound B is increased with respect to Example 1 and Comparative Examples 1-1 and 1-2,
In Example 2-1, the refractive index greatly increases, but the increase in viscosity is suppressed,
In Example 2-2, the refractive index is 1.60 or more, but the increase in viscosity is suppressed.
In Comparative Example 2, an increase in viscosity is not suppressed.
Claims (2)
前記(メタ)アクリレート化合物が、下記式(1):
前記(メタ)アクリレート化合物中、前記式(1)で表される化合物の含有量が60〜100質量%であり、
前記金属含有ナノ粒子が酸化ジルコニウム含有ナノ粒子であり、
前記光硬化性樹脂組成物の屈折率が1.666以上である光硬化性樹脂組成物(但し、前記光硬化性樹脂組成物は、シリコーン骨格を有する光硬化性化合物のモノマー、オリゴマー、プレポリマー及びマクロモノマーから選ばれる少なくとも1種の化合物、並びに、式(2)で表されるフルオレン骨格を有する二官能(メタ)アクリレー化合物:
(式(2)中、R 1 及びR 2 は、同一又は異なって、水素原子又はメチル基、a及びbは、それぞれ1〜4の整数を表す。)を含まない)。 A photocurable resin composition comprising a (meth) acrylate compound, metal-containing nanoparticles and a photopolymerization initiator,
The (meth) acrylate compound has the following formula (1):
In the (meth) acrylate compound, the content of the compound represented by the formula (1) is 60 to 100% by mass,
The metal-containing nanoparticles are zirconium oxide-containing nanoparticles;
A photocurable resin composition having a refractive index of 1.666 or more (provided that the photocurable resin composition is a monomer, oligomer, or prepolymer of a photocurable compound having a silicone skeleton) And at least one compound selected from the group consisting of macromonomers, and a bifunctional (meth) acrylate compound having a fluorene skeleton represented by the formula (2):
(In formula (2), R 1 and R 2 are the same or different and do not include a hydrogen atom or a methyl group, and a and b each represent an integer of 1 to 4) .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015227074A JP6589151B2 (en) | 2015-11-19 | 2015-11-19 | Photocurable resin composition and high refractive resin cured body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015227074A JP6589151B2 (en) | 2015-11-19 | 2015-11-19 | Photocurable resin composition and high refractive resin cured body |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019049240A Division JP6784416B2 (en) | 2019-03-18 | 2019-03-18 | Photocurable resin composition and high-refractive resin cured product |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017095556A JP2017095556A (en) | 2017-06-01 |
JP6589151B2 true JP6589151B2 (en) | 2019-10-16 |
Family
ID=58817823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015227074A Active JP6589151B2 (en) | 2015-11-19 | 2015-11-19 | Photocurable resin composition and high refractive resin cured body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6589151B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6767170B2 (en) * | 2016-05-31 | 2020-10-14 | 三洋化成工業株式会社 | Active energy ray-curable composition |
CN113214692B (en) * | 2021-05-21 | 2022-07-19 | 武汉工程大学 | High-refraction resin composition and preparation method thereof |
CN113372744B (en) * | 2021-05-21 | 2022-07-19 | 武汉工程大学 | High-refractive-index acrylic optical material and preparation method and application thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5427012B2 (en) * | 2009-12-17 | 2014-02-26 | 共栄社化学株式会社 | Resin composition for optical materials |
KR102040799B1 (en) * | 2011-05-13 | 2019-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Benzyl (meth)acrylate monomers suitable for microstructured optical films |
CN103987688B (en) * | 2011-12-09 | 2017-05-24 | 株式会社日本触媒 | Compound, metal oxide particles, and method for producing same and use of same |
JP6039911B2 (en) * | 2012-03-27 | 2016-12-07 | 株式会社巴川製紙所 | Anisotropic optical film for polarizing plate and method for producing the same |
US9360591B2 (en) * | 2012-09-20 | 2016-06-07 | 3M Innovative Properties Company | Microstructured film comprising nanoparticles and monomer comprising alkylene oxide repeat units |
-
2015
- 2015-11-19 JP JP2015227074A patent/JP6589151B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017095556A (en) | 2017-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6108740B2 (en) | Optical element and optical element manufacturing method | |
KR102460223B1 (en) | Transparent substrate having anti-glare and anti-reflection properties and method for manufacturing the same | |
TWI465466B (en) | Hardened composition and hardened product thereof | |
WO2013161767A1 (en) | Optical device | |
JP6116651B2 (en) | Photo-curable resin composition for imprint molding, imprint molding cured body, and production method thereof | |
JP2011168003A (en) | Pattern manufacturing method | |
WO2015046134A1 (en) | Curable composition for optical imprinting and pattern forming method | |
JP2011235571A (en) | Method of manufacturing micropattern and substrate with micropattern | |
WO2015019941A1 (en) | Curable composition containing semiconductor nanoparticles, cured article, optical material, and electronic material | |
JP6589151B2 (en) | Photocurable resin composition and high refractive resin cured body | |
TW201736476A (en) | Curable composition and cured product | |
JP2016109983A (en) | Laminate with high refractive index pattern, composition for forming high refractive index pattern, and method for forming high refractive index pattern | |
JP6784416B2 (en) | Photocurable resin composition and high-refractive resin cured product | |
JP5763796B2 (en) | Fine pattern manufacturing method | |
JPWO2019167461A1 (en) | Photocurable composition for imprint containing polymer | |
KR102542864B1 (en) | Laminated base material, cover glass, touch panel, and method for manufacturing laminated base material | |
WO2021065317A1 (en) | Transfer film, method for producing laminate, laminate, touch panel sensor, and touch panel | |
JPWO2019073718A1 (en) | Transmission filter and immersion exposure equipment | |
JPWO2014115689A1 (en) | Optical element, optical system, and imaging apparatus | |
WO2019142528A1 (en) | Method for manufacturing concave-convex structure, laminate to be used in method for manufacturing concave-convex structure, and method for manufacturing said laminate | |
TWI540151B (en) | Photopolymerizable composition and optical sheet | |
JP5374921B2 (en) | Transparent fine particle dispersion, fine particle-containing transparent resin composition, fine particle-containing transparent resin, and optical member | |
Shin et al. | Fabrication of contact lens containing high‐performance wire grid polarizer | |
JP6507683B2 (en) | Resin composition and optical member | |
JP6442198B2 (en) | Antiglare antireflection film, method for producing antiglare antireflection film, polarizing plate, and image display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180312 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190319 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190816 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190820 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6589151 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |