JP6580408B2 - Peeling method and peeling device - Google Patents
Peeling method and peeling device Download PDFInfo
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- JP6580408B2 JP6580408B2 JP2015150397A JP2015150397A JP6580408B2 JP 6580408 B2 JP6580408 B2 JP 6580408B2 JP 2015150397 A JP2015150397 A JP 2015150397A JP 2015150397 A JP2015150397 A JP 2015150397A JP 6580408 B2 JP6580408 B2 JP 6580408B2
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- peeled
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- 238000000034 method Methods 0.000 title description 15
- 239000002699 waste material Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 59
- 239000004065 semiconductor Substances 0.000 description 36
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000000926 separation method Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
- H01L2924/35121—Peeling or delaminating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明は、半導体ウエーハ等の板状部材に貼付されたシートを剥離する剥離方法および剥離装置に関する。 The present invention relates to a peeling method and a peeling apparatus for peeling a sheet attached to a plate-like member such as a semiconductor wafer.
半導体デバイスの製造工程においては、略円板形状である半導体ウエーハの表面に格子状に配置された分割予定ラインによって複数の領域が区画され、この区画された領域にＩＣ、ＬＳＩ等のデバイスを形成する。そして、該半導体ウエーハの裏面を研削装置にて研削し所定の厚みに形成した後に、ダイシング装置、レーザー加工装置等により分割予定ラインに沿って切断することによりデバイスが形成された領域を分割して個々の半導体デバイスを製造している。 In the manufacturing process of semiconductor devices, a plurality of regions are defined by division lines arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in these partitioned regions. To do. After the back surface of the semiconductor wafer is ground to a predetermined thickness by a grinding device, the device-formed region is divided by cutting along the planned division line by a dicing device, a laser processing device, or the like. Individual semiconductor devices are manufactured.
上記したＩＣ、ＬＳＩ等の半導体チップを小型化すべく、上記研削工程においては、半導体ウエーハ(板状部材）の裏面をできるだけ薄くすることが望まれており、研削する際に半導体ウエーハのデバイスが形成された表面を保護すべく粘着フィルム等からなる保護テープ（シート）を貼付するようになっている。 In order to reduce the size of semiconductor chips such as ICs and LSIs described above, it is desired that the back surface of the semiconductor wafer (plate-like member) be as thin as possible in the grinding process, and a semiconductor wafer device is formed during grinding. A protective tape (sheet) made of an adhesive film or the like is applied to protect the surface.
研削工程が終了したあとは、前記保護テープを半導体ウエーハから剥離させる必要があり、該保護テープの剥離方法としては、半導体ウエーハの表面に貼付された保護テープの端部に剥離用の接着テープを熱圧着し、該接着テープを引っ張り、該保護テープを半導体ウエーハから剥離させることが知られている（例えば、特許文献１、２を参照）。 After the grinding process is completed, it is necessary to peel off the protective tape from the semiconductor wafer. As a method for removing the protective tape, an adhesive tape for peeling is attached to the end of the protective tape affixed to the surface of the semiconductor wafer. It is known to thermocompression bond, pull the adhesive tape, and peel the protective tape from the semiconductor wafer (see, for example, Patent Documents 1 and 2).
上記した従来技術による保護テープの剥離装置では、保護テープが研削工程の際に生じる押圧力によって半導体ウエーハの表面に貼着されていることから、半導体ウエーハの表面から保護テープを剥離する際に強い粘着力を発揮する剥離用テープを保護テープに貼着して該剥離用テープを引っ張ることで保護テープを剥離する構成となっており、当該構成を実現するために、少なくとも剥離用テープの送り出し機構、剥離用テープの切断機構、剥離用テープの圧着機構が必要となり、構造が複雑になるという問題がある。さらに、上記したように、剥離用テープは強い粘着力が要求されるとともに、強固に貼着された保護テープの剥離工程に耐え得る強度が要求され、消耗品として用いられる当該剥離装置の剥離用テープのランニングコストが高くなるという問題も生じる。 In the above-described protective tape peeling apparatus according to the prior art, the protective tape is adhered to the surface of the semiconductor wafer by the pressing force generated during the grinding process, and thus strong when peeling the protective tape from the surface of the semiconductor wafer. It is configured to peel off the protective tape by sticking a peeling tape that exhibits adhesive strength to the protective tape and pulling the peeling tape, and in order to realize the configuration, at least a peeling tape feeding mechanism In addition, there is a problem that the structure of the structure becomes complicated because a cutting mechanism for the peeling tape and a pressure bonding mechanism for the peeling tape are required. Furthermore, as described above, the peeling tape is required to have a strong adhesive force, and is required to have a strength capable of withstanding the peeling process of the firmly attached protective tape, and for peeling of the peeling device used as a consumable. There is also a problem that the running cost of the tape becomes high.
また、上記の従来技術においては、保護テープの端部に剥離用テープを圧着して剥離を行った後、剥離後の保護テープを剥離装置の廃棄容器に廃棄する際、廃棄容器の側壁等に剥離用テープの粘着面が付着してしまい、廃棄容器の容量にまだ余裕があるにも関わらず剥離後の保護テープが廃棄容器の開口部を塞ぐことになり、廃棄容器の容量を十分に生かすことができないという問題がある。 Further, in the above prior art, after the peeling tape is pressure-bonded to the end of the protective tape and peeled off, when the protective tape after peeling is discarded in the waste container of the peeling device, Even though the adhesive surface of the peeling tape adheres and there is still room in the capacity of the waste container, the protective tape after peeling will block the opening of the waste container, making full use of the capacity of the waste container. There is a problem that can not be.
本発明によれば、板状部材に貼付されたシートを板状部材から剥離する剥離装置であって、該シートを貼付された板状部材を保持する保持面を有する保持テーブルと、該保持テーブルに保持された該板状部材の該シートの外周の少なくとも一部に針状部材の先端部を突き当て、該一部を該板状部材から剥離させ、該一部が剥離した該シートと該板状部材との間にエアーを吹き込み、該一部を含む拡大された剥離領域により形成される剥離起点部を生成する剥離起点部生成手段と、該剥離した剥離起点部を挟持する挟持手段と、該剥離起点部を挟持した該挟持手段を該保持テーブルに対して上方に離間させる離間手段と、上方に離間した該挟持手段の下方にて該板状部材から剥離した該シートの粘着面側に作用し該シートを該板状部材から剥離しつつ剥離方向に折り曲げる折り曲げローラと、該折り曲げローラと該保持テーブルとの少なくとも一方を該シートが該板状部材から剥離されるように該板状部材と並行な剥離方向に相対的に移動させる移動手段と、該移動手段の移動により該板状部材から該シートをすべて剥離させる剥離装置、が提供される。 According to the present invention, a peeling device for peeling a sheet affixed to a plate-like member from the plate-like member, the holding table having a holding surface for holding the plate-like member affixed with the sheet, and the holding table The tip of the needle-like member is abutted against at least a part of the outer periphery of the sheet of the plate-like member held on the sheet, the part is peeled off from the plate-like member, and the sheet from which the part is peeled off and the sheet Peeling start point generating means for blowing air between the plate-like members and generating a peeling starting point portion formed by the enlarged peeling region including the part; and clamping means for holding the peeled peeling starting point portion A separation means for separating the clamping means holding the peeling starting portion upward from the holding table; and an adhesive surface side of the sheet peeled from the plate-like member below the clamping means spaced upward Acting on the sheet and peeling the sheet from the plate member A folding roller that bends in the peeling direction while moving at least one of the folding roller and the holding table relatively in a peeling direction parallel to the plate member so that the sheet is peeled from the plate member. And a peeling device that peels all of the sheet from the plate-like member by the movement of the moving means.
上記剥離装置では、該板状部材から剥離された該シートを吸引保持するシート保持手段と、剥離後の前記シートを収容する廃棄容器と、を備え、該シート保持手段は、該シートを吸引保持した後、該廃棄容器の直上に移動し、該廃棄容器の直上にて吸引保持した該シートの吸引を解除し、該シートを該廃棄容器内に収容するように構成されていることが好ましい。 The peeling apparatus includes: a sheet holding unit that sucks and holds the sheet peeled from the plate-like member; and a waste container that stores the sheet after peeling. The sheet holding unit sucks and holds the sheet. after, it moves directly on the waste container, to release the suction of the sheet suction-holding immediately above the said waste container, it is preferable that the sheet is configured to be accommodated in the waste container.
本発明による剥離装置は、板状部材に貼付されたシートを板状部材から剥離する剥離装置であって、該シートを貼付された板状部材を保持する保持面を有する保持テーブルと、該保持テーブルに保持された該板状部材の該シートの外周の少なくとも一部に先端針状部材の先端部を突き当て該一部を剥離させ、該一部が剥離した該シートと該板状部材との間にエアーを吹き込み、該一部を含む拡大された剥離領域により形成される剥離起点部を生成する剥離起点部生成手段と、該剥離した剥離起点部を挟持する挟持手段と、該剥離起点部を挟持した該挟持手段を該保持テーブルに対して上方に離間させる離間手段と、上方に離間した該挟持手段の下方にて該板状部材から剥離した該シートの粘着面側に作用し該シートを該板状部材から剥離しつつ剥離方向に折り曲げる折り曲げローラと、該折り曲げローラと該保持テーブルとの少なくとも一方を該シートが該板状部材から剥離されるように該板状部材と並行な剥離方向に相対的に移動させる移動手段と、該移動手段の移動により該板状部材から該シートをすべて剥離させるように構成されているので、剥離用のテープの送り出し、切断、圧着機構が不要となり、高額な剥離用テープ等の消耗品を必要とせず、シートを板状部材から剥離する際のランニングコストを抑えることが可能となる。 A peeling device according to the present invention is a peeling device for peeling a sheet affixed to a plate-like member from the plate-like member, the holding table having a holding surface for holding the plate-like member affixed with the sheet, and the holding The sheet of the plate-like member held on the table is abutted against at least a part of the outer periphery of the sheet, the tip of the needle-like member is abutted, the part is peeled off, A separation start point generating means for generating a separation start portion formed by an enlarged separation region including the part, and a sandwiching means for sandwiching the separated separation start portion; and the separation start point A separation means for separating the clamping means sandwiching the portion upward with respect to the holding table, and acting on the adhesive surface side of the sheet peeled from the plate-like member below the clamping means spaced upward. The sheet is peeled off from the plate member. A folding roller that bends in the peeling direction, and a moving means that moves at least one of the folding roller and the holding table relatively in the peeling direction parallel to the plate member so that the sheet is peeled from the plate member. If, because the plate-like member by the movement of said moving means is configured so as to peel all the sheets, feeding of the tape for peeling, cutting, crimping mechanism becomes unnecessary, wasting, such as expensive peeling tape It is possible to suppress the running cost when the sheet is peeled off from the plate-like member without requiring a product.
また、上記剥離装置は、該板状部材から剥離された該シートを吸引保持するシート保持手段と、剥離後の該シートを収容する廃棄容器を備え、該シート保持手段は、該シートを吸引保持した後、該廃棄容器の直上に移動し、該廃棄容器の直上にて吸引保持した該シートの吸引を解除し、該シートを該廃棄容器内に収容する廃棄手段を備えることが好ましい。本発明で利用される剥離装置では、剥離用テープ等の粘着性を有する消耗品を用いないため、廃棄容器に該シートを収納する際に廃棄容器の入口部や、内側側面に付着するおそれがなく、シート保持手段により容易に該シートを廃棄容器の底から重ねるように廃棄すること可能となり、廃棄容器の容量を十分に生かすことができる。 The peeling device includes a sheet holding means for sucking and holding the sheet peeled from the plate-like member, and a waste container for storing the sheet after peeling. The sheet holding means sucks and holds the sheet. after, it moves directly on the waste container, to release the suction of the sheet suction-holding immediately above the said waste container, it is preferable that the sheet comprises discarding means for housing in the waste container. Since the peeling device used in the present invention does not use sticky consumables such as a peeling tape, there is a risk of adhering to the inlet portion or the inner side surface of the waste container when the sheet is stored in the waste container. Therefore, the sheet can be easily discarded by the sheet holding means so as to overlap the bottom of the disposal container, and the capacity of the disposal container can be fully utilized.
以下、本発明に従って構成された剥離装置の好適な実施形態について、添付図面を参照して詳細に説明する。 Preferred embodiments of the configured exfoliation device according to the present invention will be described in detail with reference to the accompanying drawings.
図１には、本発明に従って構成された剥離装置１の一実施形態の斜視図が示されている。図示の実施形態における剥離装置１は、静止基台２、保持テーブル機構３、シート保持手段４、折り曲げローラ移動手段５、剥離起点部生成手段６、及び廃棄容器７を具備している。 FIG. 1 shows a perspective view of one embodiment of a peeling device 1 constructed in accordance with the present invention. The peeling apparatus 1 in the illustrated embodiment includes a stationary base 2, a holding table mechanism 3, a sheet holding means 4, a folding roller moving means 5, a peeling start point generating means 6, and a waste container 7.
前記保持テーブル機構３は、図に示すように、静止基台２上に矢印Ｘで示す剥離加工送り方向（剥離方向）に沿って配設された２本のガイドレール３１、３１と、該２本のガイドレール３１、３１上に摺動自在に配設された移動基台３２と、ガイドレール３１、３１に沿って該移動基台３２の下面のナット部に係合するボールねじ軸３３と、該ボールねじ軸３３の一端側にて該ボールねじ軸３３を回転自在に支持する軸受３４と、他端側にて該ボールねじ軸３３を回転させ該移動基台３２をＸ方向で往復動自在に移動させるためのパルスモータ３５と、から構成される。 As shown in the figure, the holding table mechanism 3 includes two guide rails 31, 31 disposed on the stationary base 2 along the peeling process feeding direction (peeling direction) indicated by an arrow X, A movable base 32 slidably disposed on the guide rails 31, 31, and a ball screw shaft 33 that engages with a nut portion on the lower surface of the movable base 32 along the guide rails 31, 31. A bearing 34 that rotatably supports the ball screw shaft 33 at one end side of the ball screw shaft 33, and the ball screw shaft 33 is rotated at the other end side to reciprocate the moving base 32 in the X direction. And a pulse motor 35 for freely moving.
該移動基台３２は、該移動基台３２上に配設された円筒状のテーブル本体３６と、該テーブル本体３６の上面に配設された吸着チャック３７と、を具備している。吸着チャック３７は、ポーラスセラミックスによって形成され図示しない吸引手段に接続されており、該吸着チャック３７の表面にて適宜負圧が生じるようになっている。従って、吸着チャック３７上に載置された本発明の板状部材を構成する半導体ウエーハ１０は、図示しない吸引手段を作動することにより吸着チャック３７上に吸引保持される。 The moving base 32 includes a cylindrical table main body 36 disposed on the moving base 32 and an adsorption chuck 37 disposed on the upper surface of the table main body 36. The suction chuck 37 is formed of porous ceramics and is connected to suction means (not shown) so that a negative pressure is appropriately generated on the surface of the suction chuck 37. Accordingly, the semiconductor wafer 10 constituting the plate member of the present invention placed on the suction chuck 37 is sucked and held on the suction chuck 37 by operating a suction means (not shown).
図１、図２（ａ）〜（ｃ）に示すように、シート保持手段４は静止基台２に配設されており、該静止基台２に立設された第１エアーシリンダー４１と、該第１エアーシリンダー４１から伸びた軸４２により支持される保持ベース４３とを有している。該保持ベース４３には、上面に立設された第２エアーシリンダー４４と、該第２エアーシリンダー４４から保持ベース４３の下面側に貫通し、第２エアーシリンダー４４の進退自在な軸４５に支持されるシート保持板４６と、該保持ベース４３上に配設され、端部に挟持片４８ａを具備し水平方向に進退自在な軸を備えた第３エアーシリンダー４７と、前記保持ベース４３の下面側で、該挟持片４８ａと対向する位置に配置され、挟持片４８ａとともに挟持手段４８を構成する挟持片４８ｂと、が配設されている。 As shown in FIGS. 1 and 2A to 2C, the sheet holding means 4 is disposed on the stationary base 2, and a first air cylinder 41 erected on the stationary base 2, And a holding base 43 supported by a shaft 42 extending from the first air cylinder 41. The holding base 43 is supported by a second air cylinder 44 standing on the upper surface and a shaft 45 that penetrates from the second air cylinder 44 to the lower surface side of the holding base 43 and can be moved forward and backward. A sheet holding plate 46, a third air cylinder 47 provided on the holding base 43, having a clamping piece 48a at its end and having a shaft that can be advanced and retracted horizontally, and a lower surface of the holding base 43 On the side, a clamping piece 48b that is disposed at a position facing the clamping piece 48a and that constitutes the clamping means 48 together with the clamping piece 48a is disposed.
前記シート保持板４６は内部が中空に構成され、下面には図示しない微孔が全面に多数設けられており、第２エアーシリンダー４４とシート保持板４６とを連結する軸内部を介してシート保持板４６内部を吸引可能に構成され、前記微孔を介してシート保持板下面に負圧を生じさせることが可能となっている。 The sheet holding plate 46 has a hollow interior, and a plurality of fine holes (not shown) are provided on the entire bottom surface. The sheet holding plate 46 holds the sheet through the shaft connecting the second air cylinder 44 and the sheet holding plate 46. The inside of the plate 46 is configured to be suckable, and a negative pressure can be generated on the lower surface of the sheet holding plate through the fine holes.
前記保持ベース４３は、前記第１エアーシリンダー４１により進退可能に駆動される軸４２とともに上下動可能に構成され、さらに、図２（ｂ）中の矢印で示されるように、該軸４２を中心にして水平方向に回転可能になっている。なお、該保持ベース４３をガイドレール３１、３１上に位置する図２（ａ）の位置から、図２（ｂ）に示す位置に向け時計方向に回転させることで、前記シート保持板４６を静止基台２の傍らに設置された廃棄容器７の直上に移動させることができる。 The holding base 43 is configured to be movable up and down together with a shaft 42 that is driven to move forward and backward by the first air cylinder 41. Further, as shown by an arrow in FIG. And can be rotated horizontally. The holding base 43 is rotated in the clockwise direction from the position shown in FIG. 2A located on the guide rails 31 to the position shown in FIG. It can be moved directly above the waste container 7 installed beside the base 2.
前記折り曲げローラ移動手段５は、図３に示すように、門型形状をなす支持フレーム５１により構成され、該支持フレーム５１は、支持基台２上のガイドレール３１、３１に沿って間隔を置いて並設された柱部５２、５２と、該柱部５２、５２の上端を連結する支持部５３と、該支持部５３の案内孔５４に沿って該支持部５３内に内蔵された図示しない駆動機構により移動せしめられる折り曲げローラ５５と、を具備している。当該折り曲げローラ５５は、長手方向の軸中心に回転可能であり、少なくとも半導体ウエーハ１０に貼着され本発明のシートを構成する保護テープ１１の直径よりも長く、また、剥離後の保護テープの粘着面が付着しないようにその表面にはフッ素樹脂がコーティングされている。 As shown in FIG. 3, the folding roller moving means 5 is constituted by a support frame 51 having a gate shape, and the support frame 51 is spaced along the guide rails 31 and 31 on the support base 2. Column portions 52 and 52 arranged side by side, a support portion 53 that connects the upper ends of the column portions 52 and 52, and a guide hole 54 of the support portion 53, which is built in the support portion 53 (not shown). And a folding roller 55 that is moved by a driving mechanism. The folding roller 55 is rotatable about the longitudinal axis, is at least longer than the diameter of the protective tape 11 which is adhered to the semiconductor wafer 10 and forms the sheet of the present invention, and the adhesive of the protective tape after peeling. The surface is coated with fluororesin so that the surface does not adhere.
前記剥離起点部生成手段６は、図４に示すように、第４エアーシリンダー６１と、該第４エアーシリンダー６１から伸びて進退自在で高さ方向における位置を微調整可能な軸６２と、アーム部材６３と、該アーム部材６３の先端部に設けられ、先端針状部材６５と、エアーノズル６６とを備えた先端部材６４、から構成されている。当該構成により、先端部材６４は、上下に移動可能に構成され、その高さ位置が調整されることにより該板状部材上の保護テープの高さに針状部材の先端部が位置づけ可能に構成されている。また、エアーノズル６６は、第４エアーシリンダー６１、軸６２を介してエアーが供給され、必要に応じてエアーを噴出可能に構成されている。 As shown in FIG. 4, the peeling start point generating means 6 includes a fourth air cylinder 61, a shaft 62 that extends from the fourth air cylinder 61, can be moved forward and backward, and whose position in the height direction can be finely adjusted, and an arm It comprises a member 63 and a tip member 64 provided at the tip of the arm member 63 and provided with a tip needle-like member 65 and an air nozzle 66. With this configuration, the tip member 64 is configured to be movable up and down, and the tip position of the needle-like member can be positioned at the height of the protective tape on the plate-like member by adjusting the height position thereof. Has been. In addition, the air nozzle 66 is configured to be supplied with air via the fourth air cylinder 61 and the shaft 62 so that the air can be ejected as necessary.
廃棄容器７は、図１に記載されているように、静止基台２のシート保持手段４の傍に配置されており、上方が解放された円筒状に形成され、略円形状にカットされて使用される保護テープ１１より一回り大きく形成されており、本発明の剥離装置により剥離される該保護テープ１１を容器内に積層可能に構成されている。 As shown in FIG. 1, the disposal container 7 is arranged near the sheet holding means 4 of the stationary base 2 and is formed in a cylindrical shape with the upper part opened, and is cut into a substantially circular shape. The protective tape 11 is formed to be slightly larger than the protective tape 11 to be used, and is configured so that the protective tape 11 peeled off by the peeling device of the present invention can be laminated in a container.
図示の実施形態における剥離装置１は、以上のように構成されており、その作用について図５ないし１７を参照しながら説明する。なお、図５ないし１５は、図１の剥離装置１の要部側面図であり、動作を分かり易く説明するため静止基台２、支持フレーム５１、第１エアーシリンダー４１、第４エアーシリンダー６１、モータ３５等、作動説明上直接的に関与しない構成は、適宜省略している。 The peeling apparatus 1 in the illustrated embodiment is configured as described above, and the operation thereof will be described with reference to FIGS. 5 to 15 are side views of the main part of the peeling apparatus 1 shown in FIG. 1. In order to easily explain the operation, the stationary base 2, the support frame 51, the first air cylinder 41, the fourth air cylinder 61, Configurations that are not directly involved in the operation description, such as the motor 35, are omitted as appropriate.
当該剥離装置１において、半導体ウエーハ１０に貼着された保護テープ１１を剥離する剥離工程を開始するに当たり、先ず、図５に示すように、保持テーブル機構３のガイドレール３１、３１上で移動基台３２を待機位置（図中右側）で待機させるとともに、シート保持板４６は第２エアーシリンダー４４により最上位位置に引き上げられている。また、折り曲げローラ５５はエアーノズル６６よりも移動基台３２の待機位置側に位置づけられている。 In starting the peeling process for peeling off the protective tape 11 attached to the semiconductor wafer 10 in the peeling apparatus 1, first, as shown in FIG. 5, the moving base on the guide rails 31, 31 of the holding table mechanism 3. While the stand 32 is made to stand by at the stand-by position (right side in the figure), the sheet holding plate 46 is pulled up to the uppermost position by the second air cylinder 44. Further, the bending roller 55 is positioned on the standby position side of the moving base 32 with respect to the air nozzle 66.
図５、６に示されているように、先ず、保護テープ１１が表面に貼着された半導体ウエーハ１０を移動基台３２のテーブル本体３６の吸着チャック３７上に載置する。この時、吸着チャック３７裏側の空間と図示しない吸引手段が連結されていることによりポーラスセラミックスにて表裏間で通気可能に形成された吸着チャック３７上に負圧が発生せしめられ、半導体ウエーハ１０は吸着チャック３７上に吸引固定される。 As shown in FIGS. 5 and 6, first, the semiconductor wafer 10 having the protective tape 11 attached to the surface thereof is placed on the suction chuck 37 of the table main body 36 of the moving base 32. At this time, since the space on the back side of the suction chuck 37 and a suction means (not shown) are connected, a negative pressure is generated on the suction chuck 37 formed of porous ceramics so that air can flow between the front and back surfaces. It is fixed on the suction chuck 37 by suction.
半導体ウエーハ１０を吸着チャック３７上に固定した後、パルスモータ３５を駆動しボールねじ軸３３を回転させることにより、該移動基台３２を図６の待機位置からガイドレール３１に沿ってシート保持手段４及び剥離起点部生成手段６の下方に移動させる。この際、半導体ウエーハ１０に貼着された保護テープ１１の外周端部の僅かに外側部分が剥離起点部生成手段６における先端針状部材６５の先端の直下になるように位置づけられる（図７を参照）。 After the semiconductor wafer 10 is fixed on the suction chuck 37, the pulse motor 35 is driven to rotate the ball screw shaft 33, whereby the movable base 32 is moved from the standby position in FIG. 4 and the peeling start point generation means 6 are moved below. At this time, the slightly outer portion of the outer peripheral end portion of the protective tape 11 attached to the semiconductor wafer 10 is positioned so as to be directly below the tip of the tip needle-like member 65 in the peeling start point generation means 6 (see FIG. 7). reference).
（第１の剥離工程）
半導体ウエーハ１０の外周端部の僅かに外側部分が剥離起点部生成手段６の先端針状部材６５の直下に位置づけられた後、第４エアーシリンダー６１を作動し先端針状部材６５の先端部を半導体ウエーハ１０の保護テープ１１の外周端部に近接する位置まで降下させる（図８を参照）。
(First peeling step)
After the slightly outer portion of the outer peripheral end portion of the semiconductor wafer 10 is positioned immediately below the tip needle-like member 65 of the peeling start point generating means 6, the fourth air cylinder 61 is operated to move the tip portion of the tip needle-like member 65. The semiconductor wafer 10 is lowered to a position close to the outer peripheral end of the protective tape 11 (see FIG. 8).
先端針状部材６５の先端が半導体ウエーハ１０の保護テープ１１の外周部分に近接するように、該保護テープ１１の表面高さに合わせて該先端針状部材６５の先端部の高さを微調整し、該先端部が近接した状態で該移動基台をわずかに図中右方に移動させることにより、該先端針状部材６５の先端が該保護テープ１１の外周部分に突き当てる（図９を参照）。なお、図９に示すように保護テープ１１の周方向外側から該先端部を突き当てるようにしてもよいが、該保護テープ１１の外周部分の上方から該先端部を突き当てるようにすることも可能である。 The height of the tip of the tip needle-like member 65 is finely adjusted according to the surface height of the protection tape 11 so that the tip of the tip needle-like member 65 is close to the outer peripheral portion of the protection tape 11 of the semiconductor wafer 10. Then, by moving the moving base slightly to the right in the drawing with the tip close to the tip, the tip of the tip needle-like member 65 abuts against the outer peripheral portion of the protective tape 11 (see FIG. 9). reference). In addition, as shown in FIG. 9, you may make it abut against this front-end | tip part from the circumferential direction outer side of the protective tape 11, but you may make it abut against this front-end | tip part from the upper part of the outer peripheral part of this protective tape 11. Is possible.
そして、該先端部が該保護テープ１１の外周部分に突き当たった後、該第４エアーシリンダー６１を作動させて、該先端針状部材６５を僅かに上昇させると共に該移動基台をさらに右方に移動させることで、該保護テープ１１の外周部分の一部が良好に剥離させられる。 And after this front-end | tip part contact | abutted the outer peripheral part of this masking tape 11, this 4th air cylinder 61 is operated, this front-end | tip needle-shaped member 65 is raised a little, and this movement base is further to the right side. By moving, a part of the outer peripheral portion of the protective tape 11 is peeled off satisfactorily.
（剥離起点部生成工程）
該保護テープ１１の該一部が剥離された後、図１０に示すように、該先端部分６４が上昇させられるとともに、エアーノズル６６から高圧エアーを噴射することにより、該先端針状部材６５の先端部から該保護テープ１１の外周部分が離反し、該保護テープ１１の外周部分において先に剥離した該一部を含む剥離領域が拡大し、後述する挟持手段４８にて挟持するのに適する剥離起点部１２が生成される。なお、剥離起点部生成工程における該保持ベース４３の高さは、当該剥離起点部１２がエアーノズル６６からの高圧エアーにより剥離されたときに、該剥離起点部１２が該保持ベース４３に設けられた挟持手段４８の挟持片４８ａ、４８ｂ間に収まるように調整される。なお、前記エアーノズル６６により高圧エアーを噴射して剥離領域を拡大する際に、上記した第１の剥離工程により使用した先端針状部材６４をさらに突き当ててもよい。このようにして剥離起点部が好適に生成される。
(Peeling origin generation process)
After the part of the protective tape 11 is peeled off, as shown in FIG. 10, the tip end portion 64 is raised, and high-pressure air is jetted from the air nozzle 66, whereby the tip needle-like member 65. The outer peripheral portion of the protective tape 11 is separated from the front end portion, and the peeling region including the part that has been peeled off first in the outer peripheral portion of the protective tape 11 is expanded, and peeling is suitable for being held by the clamping means 48 described later. A starting point portion 12 is generated. Note that the height of the holding base 43 in the peeling start point generation step is such that the peeling start point 12 is provided on the holding base 43 when the peeling start point 12 is peeled off by high-pressure air from the air nozzle 66. The holding means 48 is adjusted so as to fit between the holding pieces 48a and 48b. Note that when the high pressure air is jetted from the air nozzle 66 to enlarge the peeling region, the tip needle-like member 64 used in the first peeling step may be further abutted. In this way, the peeling start point is suitably generated.
（最終剥離工程）
前記保護テープ１１の外周端部がエアーノズル６６からの高圧エアーにより持ち上げられると、該移動基台３２の待機位置方向への移動を一旦停止し、第３エアーシリンダー４７の作動により挟持部材４８ａを挟持部材４８ｂ側に移動させて、剥離した保護テープ１１の外周端部を挟持手段４８により挟持する（図１１を参照）。そして、第１エアーシリンダー４１を作動させることにより、挟持手段４８の下方に折り曲げローラ５５を進入させることが可能な程度にシート保持手段４全体を上方に移動させる。
(Final peeling process)
When the outer peripheral end of the protective tape 11 is lifted by high-pressure air from the air nozzle 66, the movement of the moving base 32 toward the standby position is temporarily stopped, and the holding member 48a is moved by the operation of the third air cylinder 47. It moves to the clamping member 48b side, and the outer peripheral end part of the peeled protective tape 11 is clamped by the clamping means 48 (see FIG. 11). Then, by operating the first air cylinder 41, the entire sheet holding unit 4 is moved upward to such an extent that the folding roller 55 can enter under the clamping unit 48.
前記シート保持手段４を上方に移動させ、移動基台３２を待機方向に移動させながら、前記門型の支持フレーム５１の支持部５３の案内孔５４に沿って折り曲げローラ５５をシート保持手段４側に移動させる（図１２を参照）。なお、折り曲げローラ５５は、保護テープ１１の半導体ウエーハ１０に対する粘着面側に当接しながら剥離を進行させるため、長手方向の軸中心に回転可能で、且つ接触する保護テープ１１の粘着面が付着しないようにその表面にはフッ素樹脂がコーティングされている。 While the sheet holding means 4 is moved upward and the moving base 32 is moved in the standby direction, the folding roller 55 is moved along the guide hole 54 of the support portion 53 of the portal-type support frame 51 on the sheet holding means 4 side. (See FIG. 12). Since the folding roller 55 advances the peeling while contacting the adhesive surface side of the protective tape 11 with respect to the semiconductor wafer 10, the folding roller 55 can rotate about the axis in the longitudinal direction and the adhesive surface of the protective tape 11 that is in contact does not adhere. Thus, the surface is coated with a fluororesin.
本実施形態では、半導体ウエーハ１０上の保護テープ１１は、剥離する方向（図中左方）に１８０度折り曲げられているが（図１３を参照）、当該折り曲げ角度は、必ずしも１８０度である必要はない。しかし、半導体ウエーハ１０は裏面が研削されて極めて薄い板状に形成されるものであり、当該折り曲げ角度が小さいと保護テープ１１の剥離時に半導体ウエーハ１０の割れ、破損等を引き起こす恐れがあり、できるだけ１８０度、もしくは、それに近い角度で折り曲げられることが好ましい。 In this embodiment, the protective tape 11 on the semiconductor wafer 10 is bent 180 degrees in the peeling direction (left side in the figure) (see FIG. 13), but the bending angle is not necessarily 180 degrees. There is no. However, the semiconductor wafer 10 is formed into a very thin plate shape by grinding the back surface. If the bending angle is small, the semiconductor wafer 10 may be cracked or damaged when the protective tape 11 is peeled off. It is preferable to bend at an angle of 180 degrees or close thereto.
折り曲げローラ５５がシート保持板４６下面の図中左方側他端部まで移動すると、半導体ウエーハ１０から保護テープ１１が完全に剥離される（図１４を参照）。このようにして最終剥離工程が完了する。 When the folding roller 55 moves to the other end on the left side of the lower surface of the sheet holding plate 46 in the drawing, the protective tape 11 is completely peeled from the semiconductor wafer 10 (see FIG. 14). In this way, the final peeling process is completed.
図１５に示されているように、剥離した保護テープ１１がシート保持板４６の下面に展開させられるとき、中空に形成され下面に微孔が設けられているシート保持板４６の内部を図示しない吸引手段により吸引し、剥離された保護テープ１１を吸引保持する。そして移動基台３２と折り曲げローラ５５は、剥離工程開始時に位置付けされる待機位置に移動させられるとともに、第３エアーシリンダー４７の作動により挟持手段４８ａを一方の挟持手段４８ｂから離反させ保護テープ１１の外周端部を解放する。 As shown in FIG. 15, when the peeled protective tape 11 is developed on the lower surface of the sheet holding plate 46, the inside of the sheet holding plate 46 that is formed in a hollow shape and has a microhole on the lower surface is not illustrated. The protective tape 11 that has been sucked and peeled off by the suction means is sucked and held. The moving base 32 and the folding roller 55 are moved to a standby position positioned at the start of the peeling process, and the third air cylinder 47 is operated to separate the holding means 48a from the one holding means 48b. Release the outer edge.
次に、図２、１６、１７により、前記剥離工程に続き、剥離した保護テープ１１を廃棄容器７に廃棄する廃棄工程について説明する。 Next, with reference to FIGS. 2, 16, and 17, a discarding process for discarding the peeled protective tape 11 in the disposal container 7 will be described following the peeling process.
前述したように、半導体ウエーハ１０から剥離された保護テープ１１は、シート保持板４６が静止基台２のガイドレール３１、３１の上方に位置付けられた状態で吸引保持されている。 As described above, the protective tape 11 peeled off from the semiconductor wafer 10 is sucked and held in a state where the sheet holding plate 46 is positioned above the guide rails 31 and 31 of the stationary base 2.
その状態から保護テープ１１をシート保持板４６に吸引保持させたまま、第１エアーシリンダー４１の軸４２を平面視時計回りに回転させて、静止基台２の傍らに配設された廃棄容器７の直上に該シート保持板４６を位置づける（図２（ｂ）、図１６を参照）。なお、図１６、１７は、静止基台２の廃棄容器を配設した側から見た側面図であり、説明の都合上、シート保持手段４と廃棄容器７のみを提示し、廃棄容器７は断面図としている。 From this state, the shaft 42 of the first air cylinder 41 is rotated clockwise in plan view while the protective tape 11 is sucked and held on the sheet holding plate 46, and the waste container 7 disposed beside the stationary base 2. The sheet holding plate 46 is positioned immediately above (see FIGS. 2B and 16). 16 and 17 are side views of the stationary base 2 as seen from the side where the disposal container is disposed. For convenience of explanation, only the sheet holding means 4 and the disposal container 7 are presented. It is a cross-sectional view.
シート保持板４６を廃棄容器７の直上に位置づけた後、第２エアーシリンダー４４を作動させて、シート保持板４６を廃棄容器７内に降下させる（図１７を参照）。当該降下させる際の下端位置は廃棄容器７内に設けた図示しないレベルセンサーを用いて廃棄した保護テープ１１の積層レベルに応じて適宜変化させてもよいし、廃棄した枚数をカウントしてカウントした枚数に応じて変化させてもよい。 After the sheet holding plate 46 is positioned immediately above the waste container 7, the second air cylinder 44 is operated to lower the sheet holding plate 46 into the waste container 7 (see FIG. 17). The lower end position at the time of lowering may be changed as appropriate according to the laminated level of the protective tape 11 discarded using a level sensor (not shown) provided in the disposal container 7, or the number of discarded sheets is counted and counted. It may be changed according to the number of sheets.
シート保持板４６を廃棄容器内に降下させた後、最下端においてシート保持板４６の下面の微孔からの吸引を停止し、保護テープ１１を落下させる。この際シート保持板４６の下面の微孔から空気を噴出させることにより保護テープ１１の離脱をより確実に実行させることができる。そして、廃棄容器７のレベルセンサーにより廃棄容器に積層される剥離後の保護テープ１１が廃棄容器に所定量溜まったことが検出された場合、あるいはカウントされた枚数が所定量に達した場合、廃棄容器７に溜まった保護テープ１１の廃棄を促すべく、当該剥離装置のオペレーターに知らせる警報音の発生、警報ランプの点灯などを実行する。 After the sheet holding plate 46 is lowered into the waste container, the suction from the minute holes on the lower surface of the sheet holding plate 46 is stopped at the lowermost end, and the protective tape 11 is dropped. At this time, the protective tape 11 can be removed more reliably by ejecting air from the micro holes on the lower surface of the sheet holding plate 46. When it is detected by the level sensor of the waste container 7 that the protective tape 11 after being peeled stacked on the waste container has accumulated in a predetermined amount, or when the counted number reaches a predetermined amount, In order to encourage the disposal of the protective tape 11 accumulated in the container 7, an alarm sound is generated to notify the operator of the peeling device, an alarm lamp is turned on, and the like.
本発明に基づく剥離装置は以上のように構成されており、保護テープの剥離を必要とする種々の分野にて幅広く利用されることが可能であり、取り扱いが容易で、剥離用のテープ等の消耗品を使用していないことから、当該剥離装置を複雑化することなく構成することができ、また、剥離した保護テープを効率よく廃棄容器に積層廃棄できることから、廃棄容器の容量を十分に生かすことができる。
なお、上記した本発明の実施形態では、板状部材を半導体ウエーハとしたが、これに限定されず、例えば、板状部材としてサファイヤ基板を採用し、該サファイヤ基板に対して保護テープを貼付したような場合等、表面にシート状の部材を貼付した板状部材を使用し、シート状の部材を剥離させるものであれば、本願発明を適用することができる。
The peeling device according to the present invention is configured as described above, and can be widely used in various fields that require peeling of the protective tape, is easy to handle, Since no consumables are used, the peeling device can be configured without complicating it, and since the peeled protective tape can be efficiently stacked and discarded in a waste container, the capacity of the waste container can be fully utilized. be able to.
In the above-described embodiment of the present invention, the plate member is a semiconductor wafer. However, the present invention is not limited to this. For example, a sapphire substrate is adopted as the plate member, and a protective tape is attached to the sapphire substrate. In such a case, the present invention can be applied if a plate-like member having a sheet-like member attached to the surface thereof is used and the sheet-like member is peeled off.
１：剥離装置
２：静止基台
３：保持テーブル機構（保持テーブル）
４：シート保持手段
５：折り曲げローラ移動手段
６：剥離起点部生成手段
７：廃棄容器
１０：半導体ウエーハ（板状部材）
１１：保護テープ(シート）
１２：剥離起点部
３１、３１：ガイドレール
３２：移動基台
３６：テーブル本体
４１：第１エアーシリンダー
４４：第２エアーシリンダー
４７：第３エアーシリンダー
４８：挟持部材
５５：折り曲げローラ
６１：第４エアーシリンダー
６４：先端部材
６５：先端針状部材
６６：エアーノズル
1: Peeling device 2: Stationary base 3: Holding table mechanism (holding table)
4: Sheet holding means 5: Bending roller moving means 6: Peeling start point generating means 7: Waste container 10: Semiconductor wafer (plate-like member)
11: Protective tape (sheet)
12: peeling start point 31, 31: guide rail 32: moving base 36: table body 41: first air cylinder 44: second air cylinder 47: third air cylinder 48: clamping member 55: bending roller 61: fourth Air cylinder 64: tip member 65: tip needle member 66: air nozzle
Claims (3)
該シートを貼付された板状部材を保持する保持面を有する保持テーブルと、該保持テーブルに保持された該板状部材の該シートの外周の少なくとも一部に針状部材の先端部を突き当て、該一部を該板状部材から剥離させ、該一部が剥離した該シートと該板状部材との間にエアーを吹き込み、該一部を含む拡大された剥離領域により形成される剥離起点部を生成する剥離起点部生成手段と、
該剥離した剥離起点部を挟持する挟持手段と、
該剥離起点部を挟持した該挟持手段を該保持テーブルに対して上方に離間させる離間手段と、上方に離間した該挟持手段の下方にて該板状部材から剥離した該シートの粘着面側に作用し該シートを該板状部材から剥離しつつ剥離方向に折り曲げる折り曲げローラと、
該折り曲げローラと該保持テーブルとの少なくとも一方を該シートが該板状部材から剥離されるように該板状部材と並行な剥離方向に相対的に移動させる移動手段と、
該移動手段の移動により該板状部材から該シートをすべて剥離させる剥離装置。 A peeling device for peeling a sheet affixed to a plate member from the plate member ,
A holding table having a holding surface for holding the plate-like member to which the sheet is affixed, and the tip of the needle-like member abuts against at least a part of the outer periphery of the sheet of the plate-like member held by the holding table The peeling starting point formed by the enlarged peeling region including the part, by peeling the part from the plate-like member and blowing air between the sheet and the plate-like member from which the part is peeled off Peeling start point generating means for generating a part;
Sandwiching means for sandwiching the peeled start point,
Separating means for separating the clamping means holding the peeling starting portion upward with respect to the holding table, and an adhesive surface side of the sheet peeled from the plate-like member below the clamping means spaced upward. A bending roller that acts and bends in the peeling direction while peeling the sheet from the plate-like member;
Moving means for relatively moving at least one of the folding roller and the holding table in a peeling direction parallel to the plate member so that the sheet is peeled from the plate member;
A peeling device that peels all of the sheet from the plate-like member by movement of the moving means.
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| JP2015150397A JP6580408B2 (en) | 2015-07-30 | 2015-07-30 | Peeling method and peeling device |
| TW105119566A TWI720992B (en) | 2015-07-30 | 2016-06-22 | Peeling device |
| KR1020160090555A KR102391268B1 (en) | 2015-07-30 | 2016-07-18 | Peeling method and peeling apparatus |
| CN201610607279.9A CN106409745B (en) | 2015-07-30 | 2016-07-28 | Peeling method and peeling apparatus |
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| JP6975056B2 (en) * | 2018-01-29 | 2021-12-01 | 株式会社ディスコ | Transport mechanism |
| JP7132742B2 (en) * | 2018-04-26 | 2022-09-07 | 株式会社ディスコ | Tape peeling device |
| JP6916223B2 (en) * | 2019-01-30 | 2021-08-11 | 日機装株式会社 | Peeling device |
| KR102369893B1 (en) * | 2021-09-29 | 2022-03-03 | 오토이엠 주식회사 | Insulation sheet attachment device for top frame used in electric vehicle battery case |
| CN115339219B (en) * | 2022-08-16 | 2024-03-19 | 迈为技术(珠海)有限公司 | Stripping device and stripping method thereof |
| CN115458468B (en) * | 2022-11-11 | 2023-03-24 | 扬州韩思半导体科技有限公司 | Semiconductor wafer laser cutting device and method |
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| JPH09309664A (en) * | 1996-05-20 | 1997-12-02 | Sony Corp | Protective sheet peeling method and peeling device used therefor |
| JP4204653B2 (en) * | 1997-06-20 | 2009-01-07 | リンテック株式会社 | Sheet peeling apparatus and method |
| CN1260779C (en) * | 2001-06-11 | 2006-06-21 | 日东电工株式会社 | Method and device for removing useless materials from semiconductor wafers |
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| JP4509666B2 (en) * | 2004-06-25 | 2010-07-21 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
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| TW201724337A (en) | 2017-07-01 |
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