JP6578759B2 - Break device - Google Patents

Description

  The present invention relates to a semiconductor substrate breaker made of a brittle material such as glass, silicon, or ceramic. In particular, the present invention relates to a breaking device that cuts a semiconductor substrate along a scribe line processed on the surface thereof to cut out a unit product such as a chip.

  In general, in the step of cutting a chip from a semiconductor substrate to be a mother substrate, first, a cutter wheel or a laser is scribed along a planned scribe line on the surface of the semiconductor substrate to thereby scribe lines in the X and Y directions perpendicular to each other ( Cracks). Then, the semiconductor substrate is divided into square chips by pressing the break bar from the opposite surface of the scribe line with a break device to bend the substrate (see Patent Document 1 and Patent Document 2).

  In many cases, the semiconductor substrate cut by the breaker is held by a resin dicing tape 2 attached to a circular dicing frame 1 as shown in FIG. On the upper surface or back surface of the semiconductor substrate W, scribe lines S that are orthogonal to each other are processed in the preceding scribe process. FIG. 1B shows a case where the scribe line S is provided on the upper surface of the semiconductor substrate W, and the protective film 3 is attached to the upper surface side of the semiconductor substrate W. FIG. 1C shows a case where the scribe line S is provided on the lower surface of the semiconductor substrate W, and the protective film 3 is attached to the upper surface side of the semiconductor substrate W.

At the time of the break, the semiconductor substrate W of FIG. 1B is reversed so that the processed surface of the scribe line S faces downward, as shown in FIG. It is placed on the table 4 so as to be positioned between the pair of receiving blades 6 and 6.
Further, as shown in FIG. 8, the semiconductor substrate W of FIG. 1C is arranged on the table 4 so that the scribe line S is positioned between the left and right receiving blades 6 and 6 in the same posture.
Thereafter, the break bar 7 ′ is pushed downward from the upper side toward the scribe line S to bend the substrate W by the three-point bending between the receiving blades 6, 6 and penetrate the cracks in the scribe line S in the thickness direction of the substrate. Let me divide. The protective film 3 described above is for preventing the semiconductor substrate W from coming into direct contact with the break bar 7 ′ or the receiving blade 6 when being cut.

JP-A-2015-70135 JP 2004-39931 A

When cutting with a break bar, if the amount of pushing into the board is large, the board will bend and the cutting edges will come into contact with each other, leading to chipping on the cutting edges, or the protective film may be broken and scratch the board surface. There are things to do. On the other hand, if the pushing amount is small, inconveniences such as occurrence of a part that is not divided due to insufficient bending of the substrate occur, and therefore it is necessary to ensure an appropriate pushing amount of the break bar.
However, the appropriate range of the push-in amount is narrow, for example, 200 to 300 μm in a semiconductor substrate W having a thickness of 1 mm, and the numerical value is fine, and adjustment is required. In addition, when the thickness of the semiconductor substrate W, the dicing tape 2 and the protective film 3 varies with respect to the specified thickness, the position where the pushing start position of the break bar 7 ′ is in contact with the surface of the dicing tape 2 or the protective film 3 Therefore, the amount of pushing into the semiconductor substrate W increases and decreases unnecessarily, and it cannot be divided cleanly.

  Therefore, in view of the above-described conventional problems, the present invention provides a break device that can maintain an appropriate push amount of a break bar without being affected by variations in the thickness of a semiconductor substrate, a protective film, and a dicing tape. With the goal.

  In order to achieve the above object, the present invention takes the following technical means. That is, according to the present invention, any one surface of a semiconductor substrate having a scribe line formed on its surface is covered with a protective film, and the other surface is bonded to a dicing tape, and the semiconductor substrate is bent by pressing with a break bar. A breaker that divides the semiconductor substrate along the scribe line, a table on which the semiconductor substrate is placed together with a protective film and a dicing tape, and an upper surface of the semiconductor substrate placed on the table The optical displacement meter that measures the surface height of the protective film or dicing tape on the side, and the measured numerical value obtained by the displacement meter are analyzed, and the measured numerical value is relative to the indentation start position of the break bar. If there is blurring, adjust the preset push-in amount of the breakbar by the blurring amount. , And wherein the breaking apparatus comprising a control unit of a computer for vertical movement of the break bar.

  In the above invention, the zero point that is the measurement reference value of the displacement meter is set as the push start position of the break bar, and the blur amount from the zero point obtained by measurement is adjusted to the prescribed push amount of the break bar. It is good.

  According to the present invention, when the measured numerical value obtained by the displacement meter is analyzed, and the measured numerical value has blurring with respect to the break bar pushing start position, the blurring value is determined based on the preset prescribed pushing amount of the break bar. Since the break bar is pushed in by adjusting the amount, even if there are variations in the thickness of the semiconductor substrate, protective film, and dicing tape, the semiconductor substrate can be pushed in with an appropriate push amount without being affected by these. Can be divided. Thereby, it is possible to divide the substrate reliably and efficiently without the occurrence of chipping or damage in the cross section of the substrate due to excessive pressing of the break bar, or undivided due to insufficient pressing.

In the above invention, it is preferable that the displacement meter measures the surface of the semiconductor substrate through a protective film on the upper side.
As a result, even when convex structures such as solder bumps that are uneven at the micro level are provided between the upper surface of the semiconductor substrate and the protective film, the substrate can be inserted with an appropriate amount of pushing without being affected by this. Can be divided.

The perspective view and sectional drawing which show the semiconductor substrate used as the process target object in this invention. The schematic sectional drawing which shows the break mechanism part of the break apparatus which concerns on this invention. Explanatory drawing which shows the setting method of the zero point of the displacement meter in this invention, and the pushing start position of a break bar. The block diagram which shows the computer in the break apparatus of this invention. Explanatory drawing at the time of breaking another semiconductor substrate. Explanatory drawing at the time of breaking another semiconductor substrate. Sectional drawing which shows an example of the conventional break means. Sectional drawing which shows another example of the conventional break means.

  Hereinafter, the details of the present invention will be described based on the embodiments shown in the drawings. The semiconductor substrate W to be processed in this embodiment is mainly an image sensor semiconductor substrate, and its form is the same as that shown in FIG. Below, the break of the semiconductor substrate W of FIG.1 (c) is demonstrated.

  FIG. 2 is an explanatory view showing a breaking mechanism portion of the breaking device A according to the present invention, and includes a table 4 on which the semiconductor substrate W is placed together with the dicing frame 1. A space 5 is provided in the middle of the table 4, and a pair of left and right receiving blades 6, 6 are arranged in the space 5. The gap 6a formed between the receiving blades 6 and 6 extends in the front-rear direction (X direction) in FIG. 2, and is a long plate-like break bar 7 extending in the X direction above the center line of the gap 6a. Is provided.

  The break bar 7 is held by the frame 9 of the apparatus by a holding member 8 incorporating a lifting mechanism (not shown) such as a guide using a motor as a drive source, and is formed so as to be lifted and lowered toward the receiving blade 6. The break bar 7 and the receiving blade 6 together constitute a break mechanism. The break mechanism and the table 4 on which the semiconductor substrate W is placed are moved relative to each other so that a plurality of scribe lines S provided on the semiconductor substrate W can be sequentially separated by the break mechanism. Has been. In the present embodiment, a break mechanism composed of a break bar 7 and a receiving blade 6 is fixed so that the table 4 moves in the Y direction. As a matter of course, the table 4 may be stationary and the break mechanism may be moved in the Y direction.

  Further, a non-contact displacement meter 10 for measuring the surface height of the protective film 3 of the semiconductor substrate W to be divided is installed above the table 4. As the displacement meter 10, an optical displacement meter using reflected light is used.

A computer 11 attached to the breaker A is provided with a control unit 11 that analyzes the numerical data measured by the displacement meter 10 and adjusts the prescribed push-in amount of the break bar 7 based on the analysis result.
As shown in the block diagram of FIG. 4, the computer C includes an input unit 12 and a display unit 13 in addition to the control unit 11 described above. The control unit 11 is configured by computer hardware such as a CPU, a RAM, and a ROM, and in addition to the analysis processing of the measurement data by the displacement meter 10 described above, the movement of the table 4 and the break operation by the break bar 7, etc. Controls overall operations. The input unit 12 is used by the operator to input the setting of the specified pushing amount of the break bar 7 and various data and operation instructions to the break device A, and the display unit 13 displays a processing menu and an operation state. Is to do.

Next, the operation of the break device according to the present invention will be described.
First, as shown in FIG. 2, the semiconductor substrate W is placed on the table 4 together with the dicing frame 1. At this time, any one of the scribe lines S of the semiconductor substrate W is set at the center between the receiving blades 6 and 6. Then, the scribe line S is divided by lowering the break bar 7 to push the substrate surface and bending the semiconductor substrate W.

The specified push amount of the break bar 7 from when the break bar 7 contacts the protective film 3 on the surface of the semiconductor substrate W and starts to be pushed into the semiconductor substrate W until the semiconductor substrate W is bent and the scribe line S is divided. Is previously input to the computer C. For example, when the thickness of the semiconductor substrate W is 1 mm, the thickness of the protective film 3 is 0.03 mm, and the thickness of the dicing tape 2 is 0.1 mm, 250 μm is set as the specified pushing amount. However, the thickness of the semiconductor substrate W, the dicing tape 2 and the protective film 3 may vary from product lot to product lot, and if the thickness changes, an optimal push-in amount cannot be obtained.
In the present invention, before the semiconductor substrate W is placed on the table 4 and divided, the surface height of the protective film 3 attached to the semiconductor substrate W is measured by the displacement meter 10, and the height of the protective film 3 is determined by the break bar 7. If there is a shake (difference) with respect to the push start position (the zero point of the displacement meter), the control unit 11 of the computer C adjusts the specified push amount by the shake amount. As a result, the break can always be made with the optimum pushing amount.

The pushing start position of the break bar 7 and the zero point of the displacement meter 10 can be set by the following method, for example.
As shown in FIG. 3A, a touch sensor 14 having the same height as the position at which the break bar 7 comes into contact with the surface of the protective film 3 and starts to be pushed in is installed on the table 4, and the light beam of the displacement meter 10. Is applied to the top surface 14 a of the touch sensor 14 to set the zero point of the displacement meter 10. Next, as shown in FIG. 3B, the tip of the break bar 7 is brought into contact with the top surface 14 a of the touch sensor 14 to determine the push start position of the break bar 7. That is, the pushing start position of the break bar 7 on the surface of the protective film 3 becomes the zero point of the displacement meter 10. Further, the substantial lifting amount of the break bar 7 is a value obtained by adding the specified pushing amount L2 to the distance L1 from the position waiting upward to the pushing start position.

FIG. 5 shows a case where the semiconductor substrate W shown in FIG. 1B is divided. In this embodiment, the dicing frame 1 is inverted and the scribe line S and the protective film 3 are placed on the lower side. Since it is mounted on the blade 6 and the table 4, the dicing tape 2 is on the upper side.
Accordingly, the displacement meter 10 measures the surface of the dicing tape 2, and the zero point of the displacement meter 10 and the pushing start position of the break bar 7 are set to the surface height of the dicing tape 2.

FIG. 6 shows another example of a semiconductor substrate to be broken. The semiconductor substrate W is provided with a convex structure 15 such as a solder bump on the upper surface, and the surface thereof is covered with the protective film 3. The structures 15 such as solder bumps are uneven at the micro level, and the height varies. This variation also affects the surface of the protective film 3. Therefore, in this case, the displacement meter 10 is not measured on the surface of the protective film 3, but the height is measured on the surface of the semiconductor substrate W through the protective film 3. Thereby, the zero point of the displacement meter 10 and the pushing start position of the break bar 7 are set to the surface height of the semiconductor substrate W. Further, the protective film 3 is made of a transparent material that transmits the light beam of the displacement meter 10, and the optical refractive index of the protective film 3 is affected by the measured value of the displacement meter at the time of measurement. It is necessary to calculate and correct the measured value.
Also in this case, as in the previous embodiment, if there is a blur at the zero point of the displacement meter 10 by measurement, the surface height of the protective film 3 is increased or decreased by adjusting the specified pushing amount of the break bar 7 by the blur amount. Regardless of the variation in thickness, the optimum amount of pushing can be obtained.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and can be appropriately modified and changed within the scope of achieving the object and not departing from the scope of the claims. Is possible.

  INDUSTRIAL APPLICABILITY The present invention is used in a breaking device that includes a protective film on one surface and divides a semiconductor substrate having the other surface attached to a dicing tape with a break bar.

A break device C computer S scribe line W semiconductor substrate 1 dicing frame 2 dicing tape 3 protective film 4 table 6 receiving blade 7 break bar 10 displacement meter 11 control unit

Claims (3)

Any one surface of the semiconductor substrate having a scribe line formed on the surface thereof is covered with a protective film, and the semiconductor substrate having the opposite surface attached to the dicing tape is bent by pressing with a break bar. A breaking device for dividing a substrate along the scribe line,
A table for placing the semiconductor substrate together with a protective film and a dicing tape;
A displacement meter of an optical system for measuring a surface height of a protective film or a dicing tape on the upper surface side of the semiconductor substrate placed on the table;
When the measured numerical value obtained by the displacement meter is analyzed, and the measured numerical value is blurred with respect to the pushing start position of the break bar, the predetermined specified pushing amount of the break bar is set by the amount of the shaking. A break device comprising a control unit of a computer that adjusts and moves the break bar up and down.   A zero point that is a measurement reference value of the displacement meter is set as a push start position of the break bar, and a blur amount from the zero point obtained by measurement is adjusted to a specified push amount of the break bar. Item 4. The break device according to Item 1.   The break device according to claim 1, wherein the displacement meter measures the surface of the semiconductor substrate through a protective film on the upper side.

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