JP6487240B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board having a through conductor through which a high-frequency signal is transmitted.

As a wiring board on which electronic components such as a semiconductor element, a capacitive element, and a piezoelectric vibrator are mounted, an insulating substrate, a wiring layer provided on and inside the main surface of the insulating substrate, and an end portion of the wiring layer One having a through conductor connected to a portion is often used. The insulating substrate is made of a glass ceramic sintered body, an aluminum oxide sintered body, or the like, and includes a plurality of insulating layers stacked on each other. The through conductor penetrates at least part of the plurality of insulating layers in the thickness direction. Among the wiring layers, those provided on the lower surface of the insulating substrate include those that function as electrode pads that are electrically connected to an external electric circuit. The end portion of the through conductor is connected to the electrode pad. When the signal transmitted to the signal through conductor is a high-frequency signal, a plurality of ground through conductors are formed so as to surround the signal through conductor in order to adjust characteristic impedance in the signal through conductor. In this case, a part of the wiring layer provided inside the insulating substrate becomes a ground wiring layer, and a plurality of ground through conductors are connected thereto.

JP 2012-248797

However, the conventional wiring board as described above has a problem that mismatch of characteristic impedance is likely to occur between the signal through conductor and the signal electrode pad layer. That is, an unnecessary capacitance component is generated between the signal electrode pad and the ground wiring layer facing each other, and the characteristic impedance of the signal electrode pad tends to be lowered due to this capacitance. For this reason, the characteristic impedance cannot be matched between the signal electrode pad and the signal through conductor, and high-frequency signals are reflected near the signal electrode pad, which may deteriorate transmission characteristics.

To solve this problem, for example, an opening is provided in a part of the ground wiring layer to increase the distance in which the ground wiring layer and the signal electrode pad face each other. It is conceivable to reduce. In addition, a connection land is provided so as to project in the direction of the ground wiring layer in a part between the plurality of signal through conductors to increase the capacitance component, and the characteristic impedance of the signal through conductor is reduced to a part of the ground wiring layer. A means of suppressing an increase in size due to the provision of the opening is conceivable (see, for example, the above-mentioned Patent Document 1).

However, for higher frequency transmission in recent years, especially for transmission of high frequency signals in a band exceeding 40 GHz, there is a case where the characteristic impedance matching is insufficient even with the above configuration. Due to the difference in characteristic impedance, there is a possibility that a high-frequency signal will be abruptly reflected and transmission loss will increase.

As a result of studying the above problems, the inventor of the present invention has found that the difference in mutual characteristic impedance at the connection portion between the signal through conductor and the signal electrode pad contributes to the reflection of the high-frequency signal. As a result, it has been found that the sudden change in the temperature is the cause of the above problem, and the present invention has been completed.

That is, a wiring board according to one aspect of the present invention is formed on an insulating substrate including a plurality of insulating layers stacked on each other, a signal wiring layer formed inside or on the upper surface of the insulating substrate, and a lower surface of the insulating substrate. The signal electrode pad formed between the plurality of insulating layers and having a plurality of ground wiring layers having openings, and each of the plurality of insulating layers penetrating through the plurality of insulating layers in the thickness direction in the openings. A plurality of through conductors connected vertically, one end electrically connected to the signal wiring layer and the other end connected to the signal electrode pad, and the plurality of through conductors A signal conductor group including a plurality of connection lands provided; and a plurality of insulating layers penetrating through the plurality of insulating layers so as to surround the signal conductor group, and connected to the ground wiring layer outside the opening. Ground through A first opening of the ground wiring layer closest to the lower surface of the insulating substrate among the openings of the plurality of ground wiring layers is larger than the signal electrode pad in plan view, The plurality of first connection lands provided corresponding to the first opening among the plurality of connection lands are smaller than the first opening among the openings of the plurality of ground wiring layers. A second connection land provided corresponding to two openings, and a characteristic impedance of the signal conductor group and a characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad. The difference is the second opening
The distance between the plurality of through conductors and the plurality of ground through conductors in a plan view is gradually decreased from the side close to the signal electrode to the side close to the signal electrode pad. It gradually becomes smaller toward the side closer to the pad .

According to another aspect of the present invention, there is provided a wiring board including a plurality of insulating layers stacked on each other, a signal wiring layer formed inside or on the upper surface of the insulating board, and a lower surface of the insulating board. The signal electrode pad formed between the plurality of insulating layers and having a plurality of ground wiring layers having openings, and each of the plurality of insulating layers penetrating through the plurality of insulating layers in the thickness direction in the openings. A plurality of through conductors connected vertically, one end electrically connected to the signal wiring layer and the other end connected to the signal electrode pad, and the plurality of through conductors A signal conductor group including a plurality of connection lands provided; and a plurality of insulating layers penetrating through the plurality of insulating layers so as to surround the signal conductor group, and connected to the ground wiring layer outside the opening. Ground through conductor A first opening of the ground wiring layer closest to the lower surface of the insulating substrate among the openings of the plurality of ground wiring layers is larger than the signal electrode pad in plan view, and The plurality of first connection lands provided corresponding to the first openings in the connection lands are second openings smaller than the first openings in the openings of the plurality of ground wiring layers, respectively. A difference between a characteristic impedance of the signal conductor group and a characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad is larger than a second connection land provided corresponding to the portion. A plurality of the ground wiring layers having the first opening and gradually decreasing from the side close to the second opening toward the side close to the signal electrode pad, and a plurality of the first openings Size in plan view, the direction from the side closer to the second opening on the side closer to the signal electrode pad becomes progressively smaller.

According to another aspect of the present invention, there is provided a wiring board including a plurality of insulating layers stacked on each other, a signal wiring layer formed inside or on the upper surface of the insulating board, and a lower surface of the insulating board. The signal electrode pad formed between the plurality of insulating layers and having a plurality of ground wiring layers having openings, and each of the plurality of insulating layers penetrating through the plurality of insulating layers in the thickness direction in the openings. A plurality of through conductors connected vertically, one end electrically connected to the signal wiring layer and the other end connected to the signal electrode pad, and the plurality of through conductors A signal conductor group including a plurality of connection lands provided; and a plurality of insulating layers penetrating through the plurality of insulating layers so as to surround the signal conductor group, and connected to the ground wiring layer outside the opening. Ground through conductor A first opening of the ground wiring layer closest to the lower surface of the insulating substrate among the openings of the plurality of ground wiring layers is larger than the signal electrode pad in plan view, and The plurality of first connection lands provided corresponding to the first openings in the connection lands are second openings smaller than the first openings in the openings of the plurality of ground wiring layers, respectively. A difference between a characteristic impedance of the signal conductor group and a characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad is larger than a second connection land provided corresponding to the portion. the person closer to the signal electrode pads rather smaller than the side closer to the second opening, through conductor located between the second opening and the first opening of the plurality of through-conductors Among In least part, the first connection land is not provided.

  According to the wiring board of one aspect of the present invention, the difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad is determined between the second opening of the ground wiring layer and the signal electrode pad. Since the side closer to the pad is smaller than the side closer to the second opening, it is possible to suppress a sudden change in characteristic impedance near the boundary between the signal conductor group and the signal electrode pad. Therefore, it is possible to improve the electrical signal transmission characteristics in the high frequency band.

  Therefore, it is possible to provide a wiring board excellent in high-frequency signal transmission characteristics in the signal conductor group connected to the signal electrode pad.

It is a principal part expanded sectional view which shows the wiring board of the 1st Embodiment of this invention. (A) is sectional drawing in the AA line of FIG. 1, (b) is sectional drawing in the BB line of FIG. It is a principal part expanded sectional view which shows the modification of the 1st Embodiment of this invention. It is a principal part expanded sectional view which shows the wiring board of the 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the wiring board of the 3rd Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the 3rd Embodiment of this invention. It is a principal part expanded sectional view which shows the wiring board of the 4th Embodiment of this invention. It is a principal part expanded sectional view which shows the wiring board of the 5th Embodiment of this invention. It is a principal part expanded sectional view which shows the wiring board of the 6th Embodiment of this invention. (A) is sectional drawing in the AA line of FIG. 9, (b) is sectional drawing in the BB line of FIG. It is a graph which shows the reflective characteristic of the wiring board of the Example of this invention, and the conventional wiring board.

Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the distinction between the upper and lower sides in the following description is for convenience, and does not specify the upper and lower sides when a wiring board or the like is actually used. The plurality of embodiments are not limited to being implemented separately, and may be implemented together.

(First embodiment)
FIG. 1 is an enlarged cross-sectional view showing a main part of a wiring board according to a first embodiment of the present invention. 2A is a cross-sectional view taken along line AA in FIG. 1, and FIG. 2B is a cross-sectional view taken along line BB in FIG.

  The wiring substrate 20 includes an insulating substrate 1 including a plurality of insulating layers 1a stacked on each other, a signal wiring layer 2 formed between the insulating layers 1a, a signal electrode pad 3 formed on the lower surface of the insulating substrate 1, A plurality of ground wiring layers 4 having openings (9a, 9b) formed between the plurality of insulating layers 1a and through the plurality of insulating layers 1a in the openings (9a, 9b), and above and below each other A plurality of penetrating conductors 8 connected to each other, a plurality of connecting lands (5a, 5b) provided between the plurality of penetrating conductors 8, and a plurality of penetrating conductors 8 and a plurality of connecting lands (5a, 5b) are surrounded. And a plurality of ground through conductors 7 connected to the ground wiring layer 4 outside the openings (9a, 9b).

  The plurality of through conductors 8 are connected to form a signal through conductor (no sign as a whole). The signal through conductor has one end electrically connected to the signal wiring layer 2 and the other end connected to the signal electrode pad 3. The signal through conductors and the connection lands (5a, 5b) form a signal conductor group that transmits a signal inside the insulating substrate 1 (the signal conductor group as a whole has no symbol). By disposing the grounding through conductor 7 so as to surround the signal through conductor and forming a pseudo-coaxial structure, discontinuity in characteristic impedance between the signal wiring layer 2 and the signal through conductor is reduced. In the example shown in FIG. 2, four grounding through conductors 7 surrounding the signal through conductors are arranged, but four or more grounding through conductors 7 may be arranged.

  The ground wiring layer 4 and the ground through conductor 7 are conductive paths through which a current having a reference potential (ground potential or the like) flows. The signal wiring layer 2, the signal electrode pad 3, and the signal through conductor are, for example, an electronic component (not shown) mounted on the wiring board 20 and another electronic component mounted on an external circuit board (not shown). This is a conductive path for transmitting and receiving a high-frequency signal to (not shown). Conductive paths having different potentials are not connected to each other. For connection with such an electronic component or the like, the signal wiring layer 2 includes a portion extending to an exposed surface such as the main surface of the insulating substrate 1. The connection lands (5a, 5b) form a part of the conductive path, but have a function other than this. This function will be described later.

  For example, an electrode of an electronic component such as a semiconductor element mounted on the upper surface (not shown) of the wiring board 20 is electrically connected to the signal wiring layer 2, and the electric signal is transmitted to the signal through conductor and the connection land (5a, 5b). ) To the signal electrode pad 3. In this case, the signal wiring layer 2 may include those provided on the upper surface of the insulating substrate 1. The signal electrode pad 3 is electrically and mechanically connected to the external circuit board by a conductive connecting material such as a solder ball. By this connection, the electronic component and the external circuit board are electrically connected.

  The insulating substrate 1 is a base portion for mounting electronic components as described above, for example. The insulating substrate 1 is also a base portion for disposing the signal wiring layer 2, the signal electrode pad 3, the signal conductor group, and the ground through conductor group in a state where they are electrically insulated from each other. The insulating substrate 1 includes a plurality of insulating layers 1a stacked on each other. In addition to the insulating layer 1a, the insulating substrate 1 may include auxiliary parts (not shown) such as a coating layer that covers the outer surface of the insulating layer 1a.

  The plurality of insulating layers 1a are, for example, a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. It consists of a ceramic sintered material or an organic material.

  The insulating substrate 1 is produced, for example, by laminating and firing a plurality of ceramic green sheets each serving as an insulating layer 1a. For example, when the insulating layer 1a is made of a glass ceramic sintered body, the ceramic green sheet is prepared by kneading a raw material powder mainly composed of silicon oxide, boron oxide, aluminum oxide and the like together with an organic solvent and an organic binder. The slurry can be prepared and formed into a sheet by a method such as a doctor blade method or a lip coater method.

  The ground through conductor 7 and the signal through conductor (each of the plurality of through conductors 8) are formed of a metal material such as copper, silver, palladium, gold, tungsten, molybdenum, or manganese. The material constituting the grounding through conductor 7 and the through conductor 8 may be a plurality of types of compositions or alloys of these metal materials, and an inorganic composition (such as a main component of the insulating layer 1a) different from the metal material. ) May be mixed. These metal materials are formed through the insulating layer 1a in the form of a metallized conductor, for example, integrally fired with the insulating substrate 1, and are electrically connected between the upper and lower insulating layers 1a (of the insulating layer 1a). (Conduction in the thickness direction).

  For example, in the example of FIG. 1, the signal wiring layer 2 and the signal electrode pad 3 positioned above and below with a plurality of insulating layers 1 a interposed therebetween are electrically connected to each other by a plurality of through conductors 8 (signal through conductors). Has been. In addition, a plurality of ground wiring layers 4 positioned above and below with a plurality of insulating layers 1 a interposed therebetween are electrically connected to each other by a plurality of ground through conductors 7.

  If the ground through conductor 7 and the signal through conductor are made of, for example, copper, a copper metal paste is filled in a through hole formed in advance in a ceramic green sheet laminate to be the insulating substrate 1, and the ceramic green It can be formed by co-firing with a sheet. The through hole of the ceramic green sheet can be formed by mechanical punching using a metal pin or drilling such as laser processing. In this case, the plurality of ceramic green sheets may be stacked and fired after the through holes are formed and the metal paste is filled in each of the plurality of ceramic green sheets to be the plurality of insulating layers 1a. . Further, after laminating at least a part of the plurality of ceramic green sheets, the plurality of laminated ceramic green sheets may be combined to form a through hole and fill with a metal paste.

  The signal electrode pad 3, the ground wiring layer 4, the first connection land 5a and the second connection land 5b are made of the same metal material (copper or the like) as that for forming the ground through conductor 7 and the signal through conductor. It can be formed by printing the paste on the surface of the ceramic green sheet to be the insulating layer 1a by a method such as screen printing and co-firing.

  The signal wiring layer 2, the signal electrode pad 3, the ground wiring layer 4, the first connection land 5 a and the second connection land 5 b are formed in a pattern such as a linear shape, a circular shape, an elliptical shape, or a rectangular shape in a plan view. Yes. Further, each size (area in plan view) is appropriately set according to each function and the like. For example, the signal wiring layer 2 is provided in a line shape (a line shape having a width) in order to form a fine circuit between the plurality of insulating layers 1a, and the ground wiring layer 4 is provided with a ground potential stability or the like. For this purpose, a relatively large pattern (so-called solid pattern or the like) is provided.

  The openings (9a, 9b) of the ground wiring layer 4 are portions where a plurality of through conductors 8 are respectively provided, and are portions through which signal through conductors penetrate. The ground wiring layer 4 and the signal through conductor (through conductor 8) are electrically insulated from each other by the openings (9a, 9b).

  Of the openings (9a, 9b) of the plurality of ground wiring layers 4, at least the first opening 9a of the ground wiring layer 4 closest to the lower surface of the insulating substrate 1 is formed larger than the signal electrode pad 3 in plan view. Yes. This increases the distance in which the ground wiring layer 4 and the signal electrode pad 3 face each other in plan view. As this distance increases, the capacitance component of the signal electrode pad 3 (capacitance generated in the signal electrode pad 3 between the opposing ground wiring layer 4) decreases. As a result, the transmission efficiency of signals having a frequency of less than 20 GHz propagating through the signal conductor group is improved.

  In addition, each opening (9a, 9b) of the ground wiring layer 4 has a first opening in a plan view in a portion (for example, the upper side in FIG. 1) where the distance from the signal electrode pad 3 is larger than that of the first opening 9a. A second opening 9b that is smaller than the portion 9a is included. Since the second opening 9b is relatively small, a portion where the signal wiring layer 2 and the ground wiring layer 4 are opposed to each other becomes large, so that the characteristic impedance of the signal wiring layer 2 can be easily adjusted. (The strip wiring structure can be formed up to a relatively small second opening 9b.) Further, on the upper side (upper part) of the second opening 9b, the distance between the signal through conductor and the ground through conductor 7 is made smaller. Can do. Therefore, in this portion, a capacitive component is more effectively generated in the signal through conductor, and the characteristic impedance is effectively reduced. This makes it easier to match the characteristic impedance between the signal wiring layer 2 inside the insulating substrate 1 and the upper signal through conductor.

  The distance between the first opening 9a and the second opening 9b is appropriately determined according to conditions such as the size of the characteristic impedance to be set, the frequency of the signal transmitted to the signal conductor group, and the thickness of the insulating substrate 1. You only have to set it.

  The connection lands (5a, 5b) are mechanically and electrically connected to the through conductor 8. The connection lands (5a, 5b) are formed to extend outward from the through conductor 8, that is, in a direction approaching the ground wiring layer 4 between the insulating layers 1a. As a result, the distance from the electromagnetic point of view between the through conductor 8 and the ground wiring layer 4 is further reduced, and the capacitance component generated between the through conductor 8 and the ground wiring layer 4 is improved. In other words, the connection lands (5a, 5b) are for obtaining the same effect as when the diameter of the through conductor 8 (signal through conductor formed by connecting a plurality of through conductors 8) is increased electromagnetically. It is.

  The plurality of connection lands (5a, 5b) are provided to correspond to the first opening 9a (below the second opening 9b) and to the upper side from the second opening 9b. And a second connection land 5b provided. The first connection land 5a is more than the second connection land 5b provided corresponding to the second opening 9b smaller than the first opening 9a among the openings (9a, 9b) of the plurality of ground wiring layers 4. large. A plurality of first connection lands 5a are formed between the first opening 9a and the second opening 9b. In addition, the plurality of first connection lands 5a increase in size in plan view from the second opening 9b toward the first opening 9a. By providing the plurality of first connection lands 5a in this way, the difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad 3 between the second opening 9b and the signal electrode pad 3 can be expressed as a signal. The side closer to the electrode pad 3 can be made smaller than the second opening 9b side. That is, the capacitance component of the signal conductor group increases toward the signal electrode pad 3, and the characteristic impedance can be reduced. That is, regarding the wiring board 20 of this embodiment, the difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad 3 between the second opening 9b and the signal electrode pad 3 is The closer side is smaller than the closer side to the second opening 9b. Therefore, since the characteristic impedance can be prevented from abruptly changing at the connection portion between the signal electrode pad 3 and the signal conductor group (for example, the signal through conductor), the reflection of the electric signal is particularly suppressed and transmitted in a high frequency band of 40 GHz or more. Characteristics can be improved.

  Therefore, it is possible to provide a wiring board excellent in high-frequency signal transmission characteristics in the signal through conductor connected to the signal electrode pad 3.

A specific example is as follows. The characteristic impedance on the second opening 9b side of the signal conductor group is matched to the characteristic impedance (differential impedance) of the signal wiring layer 2 in, for example, a differential line (details will be described later) structure including a pair of signal conductor groups. It is set to about 100Ω. On the other hand, the characteristic impedance (differential impedance) of the signal electrode pad 3 is small, for example, about 85 to 95Ω due to the influence of the capacitance component generated between the signal electrode pad 3 and the ground wiring layer 4. In this case, the characteristic impedance (differential impedance) of the signal conductor group is adjusted to be about 100Ω on the second opening 9b side and about 85 to 95Ω on the signal electrode pad 3 side. . The characteristic impedance (differential impedance) of the signal conductor group or the like can be measured by, for example, TDR (Time Domain Reflectometry) measurement in which a reflected wave is measured by connecting a measurement point of the characteristic impedance (differential impedance) to an oscilloscope. . Moreover, since the magnitude | size in planar view of the some 1st connection land 5a differs mutually, the outer periphery of the some 1st connection land 5a in planar perspective does not overlap. Therefore, it is possible to prevent delamination (adhesion failure) from occurring in the vicinity of the plurality of first connection lands 5a. That is, if the outer periphery of the plurality of first connection lands 5a overlaps, the pressure at the time of stacking the green sheet laminate as the insulating substrate 1 concentrates only on the outer periphery, and the plurality of first connection lands 5a. There is a possibility that no laminating pressure is applied to the outer side, and the insulating layers 1a are not in close contact with each other, resulting in voids after firing. On the other hand, the lamination pressure can be dispersed by preventing the outer circumferences of the plurality of first connection lands 5a from overlapping each other. In other words, even in the portion where the first connection land 5a is provided, it is possible to press the plurality of insulating layers 1a (green sheet laminate) evenly. Therefore, it is easier to improve the adhesion between the layers than the conventional wiring board.

  Further, when the relatively large first opening 9a is continuously formed between the plurality of insulating layers 1a (ground wiring layer 4), the ground wiring layer 4 (the outer periphery of the first opening 9a) on the same plane is formed. ) And the first connection land 5a (clearance) increases. Therefore, in the clearance portion where the conductor layer is not formed, such as the ground wiring layer 4 and the first connection land 5a, the thickness of the green sheet laminate is relatively smaller than the other portions by the thickness of the conductor layer. Therefore, it is difficult to apply a stacking pressure in this clearance portion, and delamination may easily occur. In order to reduce such a possibility, the first connection land 5a is preferably 50-60% or more of the first opening 9a in plan view. In addition, a coating layer (not shown) made of the same material as that of the insulating layer 1a is formed in the clearance portion with the same thickness as the conductor layer, for example, and the above-described means for leveling the thickness of the green sheet laminate is used. May be.

  FIG. 3 is an enlarged sectional view of an essential part showing a modification of the first embodiment of the present invention. In FIG. 3, the same parts as those in FIG. In the wiring board 20 of the modified example of the first embodiment, the first connection land 5a is provided at least in a part of the plurality of layers of the plurality of insulating layers 1a between the first opening 9a and the second opening 9b. Layers that are not arranged are included. Other parts are the same as those of the wiring board 20 of the first embodiment described above. In the wiring board 20 of the modified example of the first embodiment, description of the same parts as those of the wiring board 20 of the first embodiment will be omitted.

In particular, when the thickness of the insulating substrate 1 is small, or when the thickness of the plurality of insulating layers 1a is relatively small, it is assumed that the first connection land 5a is completely insulated from the second opening 9b to the first opening 9a. If it arrange | positions between the layers 1a, the signal electrode pad 3 will become easy to become convex shape by the difference in the shrinkage | contraction amount at the time of baking of the insulating layer 1a and a signal conductor group. Therefore, for example, when mounting using the solder ball as the conductive connecting material, the solder ball cannot be fixed on the signal electrode pad 3 and is likely to roll, which may cause electrical connection failure. There is. Even in such a case, the signal electrode pad is provided by providing a layer in which the first connection land 5a is not disposed in at least a part between the plurality of insulating layers 1a between the first opening 9a and the second opening 9b. The flatness of 3 can be made good (high). Further, it is possible to level the thickness of the green sheet laminate as described in the first embodiment, reduce the variation in the lamination pressure, and prevent delamination.

(Second Embodiment)
FIG. 4 is an enlarged cross-sectional view showing a main part of a wiring board according to a second embodiment of the present invention. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. In the wiring board 20 of the second embodiment, the size of the signal through conductor increases in plan view from the second opening 9b toward the signal electrode pad 3. Other parts are the same as those of the wiring board 20 of the first embodiment described above. In the wiring board 20 of the second embodiment, the description of the same parts as those of the wiring board 20 of the first embodiment is omitted.

  In this embodiment, since the through conductor 8 has a larger size in plan view from the second opening 9b toward the signal electrode pad 3, the inductance component of the signal conductor group is directed toward the signal electrode pad 3. A structure that gradually decreases and gradually decreases the characteristic impedance can be obtained. That is, also in this embodiment, the difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad 3 is smaller on the side closer to the signal electrode pad 3 than on the side closer to the second opening 9b.

  Therefore, the wiring board 20 of the second embodiment can also suppress a rapid change in characteristic impedance at the boundary between the signal conductor group and the signal electrode pad 3, and can improve the transmission characteristics of electric signals in the high frequency band. Can be improved.

(Third embodiment)
FIG. 5 is an enlarged cross-sectional view showing a main part of a wiring board according to a third embodiment of the present invention. 5, parts similar to those in FIG. 1 are denoted by the same reference numerals. In the wiring board 20 of the third embodiment, the size of the first connection land 5a and the signal through conductor in plan view increases from the second opening 9b toward the signal electrode pad 3. Other parts are the same as those of the wiring board 20 of the first embodiment described above. In the wiring board 20 of the third embodiment, the description of the same parts as those of the wiring board 20 of the first embodiment is omitted. The wiring board of the third embodiment can also be regarded as an example in which the first and second embodiments are combined.

  In this embodiment, since the first connection land 5a increases in size in plan view from the second opening 9b toward the signal electrode pad 3, the capacitance component of the signal conductor group gradually increases, and further, the signal penetration As the conductor increases in size in plan view from the second opening 9b toward the signal electrode pad 3, the inductance component of the signal conductor group gradually decreases. With the structure as in this embodiment, the capacitance component of the signal conductor group gradually increases toward the signal electrode pad 3 and the characteristic impedance gradually decreases.

  Therefore, also in the wiring board 20 of the third embodiment, a sudden change in characteristic impedance at the boundary between the signal conductor group and the signal electrode pad 3 can be suppressed, and electric signal transmission characteristics in the high frequency band can be reduced. Can be improved. Moreover, such an effect can also be obtained more effectively.

FIG. 6 is an enlarged cross-sectional view of a main part showing a modification of the third embodiment of the present invention. In FIG. 6, the same parts as those in FIG. In the wiring board 20 of the modified example of the third embodiment, in each layer of the plurality of insulating layers 1a between the second opening 9b and the signal electrode pad 3,
The signal penetrating conductor has such a shape that the second opening 9b side is small and the signal electrode pad 3 side is large in plan view. In other words, the side surface of each of the plurality of through conductors 8 is inclined or curved. Other parts are the same as those of the wiring board 20 of the third embodiment described above. In the wiring board 20 of the modification of the third embodiment, the description of the same parts as the wiring board 20 of the third embodiment is omitted.

  In this embodiment, in each layer of the plurality of insulating layers 1a between the second opening 9b and the signal electrode pad 3, the through conductor 8 has a shape in which the second opening 9b side is small and the signal electrode pad 3 side is large in plan view. Therefore, the size of the signal through conductor in plan view can be gradually increased from the second opening 9 b toward the signal electrode pad 3. For this reason, the inductance component of the signal conductor group can be gradually reduced as compared with the third embodiment, and therefore the characteristic impedance can be gradually and more smoothly reduced. In other words, a configuration effective for further improving the transmission characteristics of electric signals in the high frequency band can be obtained.

  Note that the smoother reduction of the characteristic impedance means that the amount of reduction of the characteristic impedance per unit length along the length direction of the signal through conductor becomes smaller.

  As a method for forming the through conductor 8 in a plan view so that the second opening 9b side is small and the signal electrode pad 3 side is large, for example, when forming a through hole of a ceramic green sheet to be the insulating layer 1a, a laser is used. For example, a method of changing the processing focus or output may be used.

(Fourth embodiment)
FIG. 7 is an enlarged cross-sectional view showing a main part of a wiring board according to a fourth embodiment of the present invention. In FIG. 7, the same parts as those in FIG. In the example of FIG. 7, the plurality of ground through conductors 7 are arranged so as to gradually approach the signal through conductor from the upper side to the lower side. That is, the distance in plan view between the plurality of through conductors 8 and the plurality of ground through conductors 7 gradually decreases from the side close to the second opening 9b toward the side close to the signal electrode pad 3. The rest is the same as in the first embodiment. Explanation of the same matter is omitted.

  Also in this case, the capacitance component of the signal conductor group gradually increases toward the signal electrode pad 3, and the characteristic impedance can be gradually decreased. Therefore, a rapid change in characteristic impedance between the signal conductor group and the signal electrode pad 3 can be suppressed.

(Fifth embodiment)
FIG. 8 is an enlarged cross-sectional view showing a main part of a wiring board according to a fifth embodiment of the present invention. In FIG. 8, parts similar to those in FIG. In the example of FIG. 8, a plurality of ground wiring layers 4 each having a first opening 9a are provided between the plurality of insulating layers 1a. Further, the first wiring is so arranged that the distance between the ground wiring layer 4 (the outer periphery of the first opening 9a) and each of the plurality of through conductors 8 (that is, the signal through conductor) gradually approaches from the upper side to the lower side. The opening size of the opening 9a is gradually reduced. That is, this wiring board 20 has a plurality of ground wiring layers 4 having the first openings 9a, and the size of the plurality of first openings 9a in plan view is from the side close to the second openings 9b. It gradually becomes smaller toward the side closer to the signal electrode pad 3. The rest is the same as in the first embodiment. Explanation of the same matter is omitted.

Also in this case, the capacitance component of the signal conductor group gradually increases toward the signal electrode pad 3, and the characteristic impedance can be gradually decreased. Therefore, a rapid change in characteristic impedance between the signal conductor group and the signal electrode pad 3 can be suppressed.

(Sixth embodiment)
FIG. 9 is an enlarged cross-sectional view showing a main part of a wiring board according to a sixth embodiment of the present invention. 10A is a cross-sectional view taken along line AA in FIG. 9, and FIG. 10B is a cross-sectional view taken along line BB in FIG. In FIGS. 9 and 10, the same parts as those in FIG.

  9 and FIG. 10, the signal conductor group has a pair of signal through conductors. Correspondingly, the ground wiring layer 4 closest to the lower surface of the insulating substrate 1 is provided with one first opening 9a through which a pair of signal penetration conductors penetrates side by side. A pair of second openings 9b through which the signal through conductors penetrate are provided in the ground wiring layer 4.

  The pair of signal through conductors are respectively connected to a pair of second connection lands 5b provided in a pair of second openings 9b in the same plane. In addition, the pair of signal through conductors is further paired within the first opening 9a as described above in the same plane below (the ground wiring layer 4 closest to the lower surface of the insulating substrate 1). It is connected to the connection land 5a. The rest is the same as in the first embodiment. Explanation of the same matter is omitted.

  Also in this case, the capacitance component of the signal conductor group gradually increases toward the signal electrode pad 3, and the characteristic impedance can be gradually decreased. Therefore, a rapid change in characteristic impedance between the signal conductor group and the signal electrode pad 3 can be suppressed.

  Further, by providing the pair of first connection lands 5a in one first opening 9a, it is possible to more efficiently reduce the capacitance component generated between the signal electrode pad 3 and the ground wiring layer 4. Thus, it is possible to suppress a decrease in characteristic impedance in the signal electrode pad 3.

  In the sixth embodiment, for example, the pair of signal through conductors function as a differential line through which a differential signal is transmitted. Also in the transmission of differential signals, the transmission characteristics can be easily improved by suppressing the rapid change in characteristic impedance as described above.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the gist of the present invention, such as the examples shown in FIGS. For example, the present invention is not limited to the example in which the first embodiment and the second embodiment are implemented together (the third embodiment or the like), for example, any one of the first and second embodiments, the fourth, You may make it implement in combination with any of 5 and 6th Embodiment. In addition, the material of the plurality of insulating layers 1a may be partially different from others to adjust the relative dielectric constant of the insulating layer 1a so that the characteristic impedance of the signal conductor group can be adjusted more easily.

  In order to reduce the characteristic impedance of the signal conductor group toward the signal electrode pad 3, the capacitance component of the signal conductor group is increased toward the signal electrode pad 3, and the inductor component of the signal conductor group is directed toward the signal electrode pad 3. What is necessary is just to use the means of making it small. A specific example is an example of the above embodiment.

  FIG. 11 is a graph showing the reflection characteristics of the wiring board of the example of the present invention and the wiring board of the conventional example. With respect to the wiring board of the above example and the wiring board of the conventional example, the characteristic impedances of the signal wiring layer, the signal conductor group, and the signal electrode pad were measured by TDR measurement using an oscilloscope, and the reflection characteristics were calculated.

  FIG. 11 is a graph showing the reflection characteristics (Return Loss) according to the frequency (Frequency) of the transmitted signal in the wiring board of the example and the wiring board of the conventional example. In FIG. 11, the reflection characteristic of the wiring board of the example is indicated by a solid line, and the reflection characteristic of the wiring board of the conventional example is indicated by a broken line.

The implementation conditions are as follows. In both the examples and the conventional examples, the plurality of insulating layers were 8 layers, each made of a glass ceramic sintered body, the relative dielectric constant was about 5 to 6, and the thickness of each insulating layer was about 0.1 mm. The signal conductor group, the ground wiring layer, and the signal electrode pad were made of copper, and the signal electrode pad had a diameter of about 0.45 mm. The grounding through conductor was a cylindrical shape having a diameter of about 0.075 mm.

In addition, the pair of signal through conductors are respectively connected to the pair of second connection lands provided in the pair of circular second openings in the same plane, and in the same plane below the one, A differential line structure is connected to each of the pair of first connection lands in each of the first openings, and the characteristic impedance (differential impedance) is matched to 100Ω. Each of the pair of circular second openings has a diameter of 0.12 mm, and each of the pair of second connection lands has a diameter of 0.1 mm.

  The plurality of through conductors forming the signal through conductors are each 0.075 mm in diameter in the conventional wiring board, and are cylindrical in diameter of about 0.05 to 0.2 mm in the wiring board in the embodiment. The diameter of the through conductor was increased from the side close to the opening to the side close to the signal electrode pad. The number of penetrating conductors (the number of insulating layers provided with penetrating conductors) was five (5 layers) per signal penetrating conductor. The number of layers is four, and the number of first connection lands is four.

The first connection land has a diameter of 0.2 mm in the conventional wiring board, and a diameter of about 0.1 to 0.3 mm in the wiring board of the embodiment, and the signal electrode pad from the side close to the second opening. The diameter of the first connection land is increased toward the side closer to.

In the wiring boards of the example and the conventional example, the characteristic impedance (differential impedance) of the signal electrode pad was about 90Ω. In the conventional wiring board, the characteristic impedance (differential impedance) of the signal conductor group is constant at about 100Ω between the second opening and the signal electrode pad. On the other hand, in the wiring board of the embodiment, the characteristic impedance (differential impedance) of the signal conductor group is between the second opening and the signal electrode pad from the side close to the second opening to the signal electrode pad side. Gradually decreased from about 100Ω to about 90Ω, and was about 90Ω on the signal electrode pad side.

  Further, from the graph of the reflection characteristics shown in FIG. 11 calculated from this measurement result, in the wiring board of the example, the characteristic impedance (between the signal conductor group and the signal electrode pad) in the high frequency band where the frequency exceeds about 35 GHz. It was confirmed that the reflection characteristics were good by suppressing a rapid change in the differential impedance.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a .... Insulating layer 2 ... Signal wiring layer 3 ... Signal electrode pad 4 ... Ground wiring layer 5a ... First connection land 5b ... Second connection land 7 ... Grounding penetrating conductor 8 ... penetrating conductor 9a ··· first opening 9b ··· second opening
20 ... wiring board

Claims (8)

An insulating substrate including a plurality of insulating layers stacked on each other;
A signal wiring layer formed inside or on the upper surface of the insulating substrate;
A signal electrode pad formed on the lower surface of the insulating substrate;
A plurality of ground wiring layers formed between the plurality of insulating layers and having openings;
The opening has a plurality of through conductors that penetrate the plurality of insulating layers in the thickness direction and are connected to each other vertically, and has one end electrically connected to the signal wiring layer and the other end A signal conductor group including a signal through conductor connected to the signal electrode pad and a plurality of connection lands provided between the plurality of through conductors;
A plurality of grounding through conductors that pass through the plurality of insulating layers so as to surround the signal conductor group and are connected to the grounding wiring layer outside the opening,
Of the openings of the plurality of ground wiring layers, at least the first opening of the ground wiring layer closest to the lower surface of the insulating substrate is larger than the signal electrode pad in plan view,
Among the plurality of connection lands, the plurality of first connection lands provided corresponding to the first opening are smaller than the first opening among the openings of the plurality of ground wiring layers, respectively. Larger than the second connection land provided corresponding to the second opening,
The difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad is close to the signal electrode pad from the side close to the second opening. Gradually smaller toward the side,
The distance between the plurality of through conductors and the plurality of ground through conductors in plan view is gradually reduced from the side close to the second opening toward the side close to the signal electrode pad. substrate. An insulating substrate including a plurality of insulating layers stacked on each other;
A signal wiring layer formed inside or on the upper surface of the insulating substrate;
A signal electrode pad formed on the lower surface of the insulating substrate;
A plurality of ground wiring layers formed between the plurality of insulating layers and having openings;
The opening has a plurality of through conductors that penetrate the plurality of insulating layers in the thickness direction and are connected to each other vertically, and has one end electrically connected to the signal wiring layer and the other end A signal conductor group including a signal through conductor connected to the signal electrode pad and a plurality of connection lands provided between the plurality of through conductors;
A plurality of grounding through conductors that pass through the plurality of insulating layers so as to surround the signal conductor group and are connected to the grounding wiring layer outside the opening,
Of the openings of the plurality of ground wiring layers, at least the first opening of the ground wiring layer closest to the lower surface of the insulating substrate is larger than the signal electrode pad in plan view,
Among the plurality of connection lands, the plurality of first connection lands provided corresponding to the first opening are smaller than the first opening among the openings of the plurality of ground wiring layers, respectively. Larger than the second connection land provided corresponding to the second opening,
The difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad is close to the signal electrode pad from the side close to the second opening. Gradually smaller toward the side ,
A plurality of the ground wiring layers having the first opening are provided, and a plurality of the first openings have a size in plan view from a side close to the second opening to a side close to the signal electrode pad. wiring board you characterized in that gradually decreases Te. An insulating substrate including a plurality of insulating layers stacked on each other;
A signal wiring layer formed inside or on the upper surface of the insulating substrate;
A signal electrode pad formed on the lower surface of the insulating substrate;
A plurality of ground wiring layers formed between the plurality of insulating layers and having openings;
The opening has a plurality of through conductors that penetrate the plurality of insulating layers in the thickness direction and are connected to each other vertically, and has one end electrically connected to the signal wiring layer and the other end A signal conductor group including a signal through conductor connected to the signal electrode pad and a plurality of connection lands provided between the plurality of through conductors;
A plurality of grounding through conductors that pass through the plurality of insulating layers so as to surround the signal conductor group and are connected to the grounding wiring layer outside the opening,
Of the openings of the plurality of ground wiring layers, at least the first opening of the ground wiring layer closest to the lower surface of the insulating substrate is larger than the signal electrode pad in plan view,
Among the plurality of connection lands, the plurality of first connection lands provided corresponding to the first opening are smaller than the first opening among the openings of the plurality of ground wiring layers, respectively. Larger than the second connection land provided corresponding to the second opening,
The difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad between the second opening and the signal electrode pad is such that the side closer to the signal electrode pad is closer to the second opening. Smaller than the side closer to
The wiring board, wherein the first connection land is not provided in at least a part of the through conductors located between the first opening and the second opening among the plurality of through conductors. . The difference between the characteristic impedance of the signal conductor group and the characteristic impedance of the signal electrode pad gradually decreases from the side close to the second opening toward the side close to the signal electrode pad. Item 4. The wiring board according to Item 3 . Wherein the plurality of first connection lands claim each size in plan view, characterized in that it said gradually increases toward the near side from a side close to the second opening to the signal electrode pad 4 Wiring board as described in. Wherein the plurality of through-conductors, according to claim 4, each of the size in the plan view, the direction from the side closer to the second opening on the side closer to the signal electrode pad, characterized in that it gradually increases Wiring board. The distance between the plurality of through conductors and the plurality of ground through conductors in a plan view gradually decreases from the side close to the second opening toward the side close to the signal electrode pad. Item 5. The wiring board according to Item 4 . The comprises a plurality of the ground wiring layer having a first opening, the size in plan view of a plurality of said first opening, toward a side close to the second opening on the side closer to the signal electrode pad The wiring board according to claim 4 , wherein the wiring board is gradually reduced.

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