JP6337707B2 - Power converter and method for manufacturing power converter - Google Patents

Description

  The present invention relates to a power conversion device having a semiconductor unit and a method for manufacturing the power conversion device.

  A power conversion device including a power conversion circuit such as a DC-DC converter circuit or an inverter circuit is used, for example, to generate drive power for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle. As such a power converter, there exists a thing shown by patent document 1, for example. The power conversion device of Patent Document 1 includes a circuit board on which electronic components are mounted, a connector for connecting the circuit board and an external device, a metal base to which the circuit board and the connector are fixed, a circuit board and a connector. And a covering cover. The circuit board and the connector are fixed by soldering, and the circuit board and the connector fixed to each other are fixed to the metal base by bonding.

JP 2010-258360 A

However, the power converter of Patent Document 1 has the following problems.
In the power converter of Patent Document 1, the circuit board is bonded and fixed to the metal base. Therefore, when the circuit board and the metal base are peeled off due to aging or failure, the circuit board moves due to external forces such as vibration, and the connection between the circuit board and the connector is damaged or the circuit board is damaged. May occur.
It is also conceivable to fasten and fix the circuit board to the metal base using screws or the like. However, if variations occur in the positional relationship between the connector fixing portion and the substrate fixing portion for fixing the connector and the circuit board on the metal base and the positional relationship between the circuit board and the connector fixed to each other by soldering, the circuit board and the connector When the circuit board is fixed to the metal base, stress is generated at the connection portion between the circuit board and the connector, which may cause a connection failure or damage to the circuit board.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device capable of improving assembly workability and durability, and a method for manufacturing the power conversion device.

One aspect of the present invention is a semiconductor unit including a semiconductor module containing a semiconductor element;
A connector having a connection terminal electrically connected to an external connector of an external device, and a fitting portion that is fitted to the external connector;
A control circuit board comprising a control circuit to which the control terminal of the semiconductor module and the connection terminal are electrically connected;
A housing for housing the semiconductor module and the control circuit board and fixing the connector in a state in which the fitting portion is exposed to the outside;
The control circuit board includes a connection terminal hole into which a connection terminal of the connector is inserted,
In the state before the control circuit and the connection terminal are connected, the connector connects the connector and the control circuit board to each other while maintaining the state where the connection terminal is inserted into the connection terminal hole. It has a substrate holder that is movably coupled ,
The connector and the case are bonded and fixed with an adhesive,
The connector includes an adhesive surface with the case,
The case includes an adherend surface along the adhesive surface, and an adhesive reservoir formed adjacent to the adherend surface,
The adhesive reservoir is configured to store the adhesive overflowing from the adhesive surface, and communicates with the outer space of the case .

Moreover, the other aspect of this invention is a method of manufacturing the said power converter device, Comprising:
The control circuit board and the connector are arranged in the case in a temporarily fixed state in which the board holding part is fixed,
Next, the control circuit board and the connector are fixed to the case,
Next, the control circuit board and the connection terminal of the control circuit board are fixed by soldering.

In the power conversion device, the connector and the control circuit board can be movably coupled to each other because the connector has the board holding portion. As a result, the connector and the control circuit board can be easily coupled and the stress at the connection portion can be reduced.
That is, the connector and the control circuit board can be coupled by the substrate holding part outside the case, and the coupling work can be easily performed without interfering with the case or other components in the case. It can be carried out.

  In addition, since the connector and the control circuit board are movably coupled to each other, even if variations occur in the dimensions of the case, by moving the connector and the control circuit board relative to each other, Can absorb the variation. Then, after the positions of the connector and the control circuit board are determined, the connection terminal and the control circuit can be connected. Therefore, it can suppress that the stress resulting from the variation in the position of the said connector and the said control circuit board, and the dimension of the said case acts on the connection part of the said connection terminal and the said control circuit.

  Further, in the method for manufacturing the power conversion device, the control circuit board and the connector are arranged in the case in a temporarily fixed state in which the control circuit board and the connector are fixed by the board holding portion. Therefore, temporary fixing between the control circuit board and the connector can be easily performed. Then, after fixing the control circuit board and the connector to the case, the control circuit and the connection terminal of the control circuit board are fixed by soldering. Thereby, it can suppress that the stress resulting from the variation of the position of the said connector and the said control circuit board, and the dimension of the said case acts on the connection part of the said connection terminal and the said control circuit. Therefore, it is possible to easily obtain a power conversion device having the above-described excellent operational effects.

  As described above, according to the present invention, it is possible to provide a power conversion device that can improve assembly workability and durability, and a method for manufacturing a power conversion device that can be easily obtained.

Sectional drawing which shows the power converter device in Example 1. FIG. The top view which shows the power converter device in Example 1 (II arrow line view of FIG. 1). The top view which shows the connector in Example 1. FIG. The IV arrow line view in FIG. The V arrow directional view in FIG. The VI-VI arrow directional cross-sectional view in FIG. FIG. 3 is a partially enlarged view showing the temporarily fixed connector and the control circuit board in the first embodiment. FIG. 3 is a partial enlarged view showing a substrate holding part in Example 1. Explanatory drawing which shows the manufacture process of the power converter device in Example 1. FIG.

  In the power converter, the control circuit board has a control terminal hole through which the control terminal is inserted, and the control circuit and the control terminal are connected in a state where the control terminal is inserted into the control terminal hole. It is preferable that In this case, the control terminal can be easily inserted into the control terminal hole in a state where the connector and the control circuit board are coupled by the board holding portion.

Example 1
The Example concerning the said power converter device is described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 includes a semiconductor unit 2, a connector 3, a control circuit board 4, and a case 5.
The semiconductor unit 2 has a semiconductor module 21 containing a semiconductor element. The connector 3 includes a connection terminal 35 that is electrically connected to an external connector (not shown) of an external device, and a fitting portion 31 that is fitted to the external connector. The control circuit board 4 has a control circuit to which the control terminal 212 and the connection terminal 35 of the semiconductor module 21 are electrically connected. The case 5 accommodates the semiconductor module 21 and the control circuit board 4 and fixes the connector 3 with the fitting portion 31 exposed to the outside.
The control circuit board 4 includes a connection terminal hole 41 into which the connection terminal 35 of the connector 3 is inserted and arranged. The connector 3 moves between the connector 3 and the control circuit board 4 while maintaining the state where the connection terminal 35 is inserted and disposed in the connection terminal hole 41 before the control circuit and the connection terminal 35 are connected. It has the board | substrate holding | maintenance part 34 couple | bonded possible.

The power conversion device 1 of this example will be described in further detail.
In this example, the direction in which the semiconductor modules 21 of the semiconductor unit 2 are stacked is the stacking direction X, the direction in which the semiconductor unit 2 and the control circuit board 4 are aligned is the height direction Z, and the stacking direction X and the height direction Z The direction orthogonal to both of these will be described below as the lateral direction Y.
In the stacking direction X, the side on which the semiconductor unit 2 is disposed is defined as the front side, and the side on which the connector 3 is disposed is defined as the rear side. In the height direction Z, the side of the case 5 on which the control circuit board 4 is disposed is the upper side, and the opposite side is the lower side.

  As shown in FIGS. 1 and 2, the power conversion device 1 includes a semiconductor unit 2 and an electronic component 59 that constitute a part of the power conversion circuit, and a control circuit board 4 that controls the operation of the semiconductor module 21 of the semiconductor unit 2. A connector 3 connected to the control circuit of the control circuit board 4 and a case 5 for housing them are provided.

The case 5 is perpendicular to the stacking direction X and the lateral direction Y, respectively, and divides the space inside the outer peripheral wall 51 and four outer peripheral walls 51 surrounding the semiconductor unit 2, the electronic component 59 and the control circuit board 4. And a lid that covers an opening formed by at least one of the outer peripheral wall 51 and the divided wall portions 52, 53.
As shown in FIGS. 1, 2, and 6, an adhesive recess 512 for arranging the connector 3 is formed in the rear wall 511 disposed on the rear side among the four outer peripheral wall portions 51. . The inner peripheral surface of the bonding recess 512 is formed along the bonding surface 321 of the connector 3 and forms a bonded surface 513 bonded to the bonding surface 321 of the connector 3. Further, auxiliary recesses 514 formed along the flanges 322 of the connector 3 are formed at positions adjacent to both ends of the adherend surface 513. The auxiliary recess 514 is formed so that the dimension in the height direction Z is smaller than that of the adhesive recess 512.

  As shown in FIG. 1, the dividing walls 52 and 53 include a front and rear dividing wall 52 formed orthogonal to the stacking direction X and two upper and lower dividing walls 53 formed orthogonal to the height direction Z. doing. As the upper and lower divided walls 53, a first upper and lower divided wall 531 formed forward from a position on the lower end side of the front and rear divided walls 52 and a second upper and lower divided wall formed rearward from a position on the upper end side of the front and rear divided walls 52 And a dividing wall 532.

  In this example, a space that is surrounded by the outer peripheral wall 51, the first upper and lower divided walls 531, and the front and rear divided walls 52 and below the upper end of the front and rear divided walls 52 is a unit arrangement space for housing the semiconductor unit 2. 56. The space surrounded by the outer peripheral wall 51, the second upper and lower divided walls 532, and the front and rear divided walls 52 is an electronic component placement space 57 for accommodating a capacitor as the electronic component 59. In the electronic component placement space 57, a lower lid 552 is disposed in a lower opening 542 formed by the outer peripheral wall 51 and the front and rear dividing walls 52. The space surrounded by the outer peripheral wall portion 51 and the second upper and lower dividing wall 532 is a board arrangement space 58 for accommodating the control circuit board 4. In the substrate arrangement space 58, an upper lid 551 is disposed in the upper opening 541 formed by the outer peripheral wall 51.

  In this example, the electronic component 59 arranged in the electronic component arrangement space 57 is a capacitor. However, the electronic component 59 is not limited to this and may be other electronic components 59 or a plurality of electronic components 59 arranged. Also good. Moreover, the distance between the connector 3 and the semiconductor unit 2 is increased by forming the electronic component arrangement space 57. In such a case, the assembly workability of the control circuit board 4 is likely to be deteriorated, but the deterioration of the workability can be suppressed by using the structure of the power conversion device 1 of this example.

As shown in FIGS. 1 and 2, the semiconductor unit 2 includes a plurality of semiconductor modules 21 and a plurality of cooling pipes 231 that cool the plurality of semiconductor modules 21 from both sides in the stacking direction X.
The semiconductor module 21 includes a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (MOS field effect transistor). The semiconductor module 21 includes a flat plate-like main body 211 formed by resin-molding a switching element, and main electrode terminals 213 and control terminals 212 protruding in opposite directions from the end surface of the main body 211. The semiconductor module 21 is stacked with the cooling pipe 231 so that the normal direction of the main surface of the flat plate-shaped main body 211 is the stacking direction X. The main electrode terminal 213 protrudes downward in the height direction Z, and the control terminal 212 protrudes upward in the height direction Z. The main electrode terminal 213 is connected to the electronic component 59 via the bus bar 22, and controlled power is input to and output from the semiconductor module 21 via the bus bar 22. The control terminal 212 is connected to the control circuit board 4 and receives a control current for controlling the switching element. Two semiconductor modules 21 are arranged in parallel between the pair of cooling pipes 231.

  The cooling pipe 231 is connected to another adjacent cooling pipe 231 through a connecting pipe 234 at both ends in the longitudinal direction (lateral direction Y). The refrigerant introduction pipe 232 and the refrigerant discharge pipe 233 are connected to both ends in the horizontal direction Y of the cooling pipe 231 disposed at one end in the stacking direction X. The cooler 23 is configured by the cooling pipe 231, the connecting pipe 234, the refrigerant introduction pipe 232, and the refrigerant discharge pipe 233. The cooler 23 is made of a metal such as aluminum.

  The refrigerant introduction pipe 232 and the refrigerant discharge pipe 233 are provided so as to protrude forward from the front surface of the cooling pipe 231 disposed at the front end of the semiconductor unit 2. The cooling medium introduced from the refrigerant introduction pipe 232 passes through the connection pipe 234 as appropriate, is distributed to each cooling pipe 231 and circulates in the longitudinal direction (lateral direction Y). The cooling medium exchanges heat with the semiconductor module 21 while flowing through each cooling pipe 231. The cooling medium whose temperature has been increased by heat exchange passes through the connecting pipe 234 on the downstream side as appropriate, is guided to the refrigerant discharge pipe 233, and is discharged. Examples of the cooling medium include natural refrigerants such as water and ammonia, water mixed with ethylene glycol-based antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohol-based alcohols such as methanol and alcohol. A refrigerant such as a refrigerant or a ketone-based refrigerant such as acetone can be used.

As shown in FIGS. 3 to 7, the connector 3 includes an outer peripheral member 30 formed by molding a resin, and a plurality of connection terminals 35 made of metal having electrical conductivity and disposed in the outer peripheral member 30. Have.
The outer peripheral member 30 is fixed to connect the fitting portion 31 disposed so as to be exposed to the outside of the case 5, the inner member 33 disposed on the inner side of the case 5, and the fitting portion 31 and the inner member 33. Part 323. The fitting portion 31 is formed in a rectangular tube shape that is substantially rectangular when viewed from the stacking direction X and extends in the stacking direction X. A connection terminal 35 is disposed inside the fitting portion 31. By connecting an external connector of an external device to the fitting portion 31, the external device and the connection terminal 35 are electrically connected.

The fixed portion 323 has a substantially rectangular plate shape when viewed from the front-rear direction, the fitting portion 31 is formed on the rear side end surface, and the inner member 33 is formed on the front side end surface. The fixing portion 323 is a main body provided with an insertion hole 324 through which a fixing screw for fixing the connector 3 to the case 5 is inserted, and an adhesive surface 321 formed along the adherend surface 513 of the adhesive recess 512 in the case 5. Part 32 and a flange part 322 extending from both ends of the bonding surface 321. The connection terminal 35 is fixed at the fixing portion 323.
The insertion hole 324 is formed so as to sandwich the fitting portion 31 in the lateral direction Y when viewed from the rear side.
When viewed from the stacking direction X, the main body 32 has a substantially trapezoidal shape and is formed so as to protrude to the front side. Further, the flange portion 322 is formed so as to extend in the lateral direction Y from both end portions of the bonding surface 321 in the main body portion 32.

  The inner member 33 includes a prismatic base portion 331 extending from the fixed portion 323 toward the front side, a tip portion 332 further extending from the base portion 331 toward the front side, and the lateral direction Y of the tip portion 332. And substrate holding portions 34 formed on both sides. The front end portion 332 is formed so as to cover both sides and the lower side of the connection terminal 35 in the lateral direction Y, and the front and upper sides are open. One substrate holding part 34 is formed on each end face of the front end part 332 on both sides in the lateral direction Y. The substrate holding part 34 has a root part 341 formed so as to extend outward from the end face, and an engaging part 342 extending upward from the root part 341. An engaging claw 343 formed so as to protrude outward is formed at the distal end portion 332 of the engaging portion 342.

  As shown in FIG. 7, the plurality of connection terminals 35 include a board-side connection part 351 erected upward on the inner side of the front end part 332 of the inner member 33, and a rear side from the lower end of the board-side connection part 351. And a bent external side connection portion 352.

  As shown in FIGS. 1 and 2, the control circuit board 4 is formed in a rectangular plate shape when viewed from above, and has a control circuit (not shown) for controlling the semiconductor module 21. Yes. The control circuit board 4 is arranged such that the longitudinal direction is the stacking direction X. A connection terminal hole 41 through which the connection terminal 35 is inserted is formed at a position on the rear end side of the control circuit board 4, and a control terminal hole 42 through which the control terminal 212 is inserted at a position on the front end side. Is formed. The connection terminal 35 and the control terminal 212 are electrically connected to the control circuit by soldering the connection terminal hole 41 and the control terminal hole 42 in a state where the connection terminal 35 and the control terminal 212 are inserted.

  Further, as shown in FIGS. 2 and 8, an engaged hole 43 through which the board holding part 34 is inserted and the engaging claw 343 engages is formed at a position corresponding to the board holding part 34 in the connector 3. ing. In a state where the engaging portion 342 of the substrate holding portion 34 is inserted and disposed in the engaged hole 43, the connector 3 and the control circuit substrate 4 maintain the state where the connection terminal 35 is inserted and disposed in the connection terminal hole 41. The connector 3 and the control circuit board 4 are movably coupled to each other. The movable distance in the axial direction of the engaging portion 342 is the length dimension of the engaging portion 342, and the movable distance in the direction orthogonal to the axial direction of the engaging portion 342 is the length of the engaged hole 43. The diameter can be appropriately set by adjusting the diameter. Moreover, the shape of the board | substrate holding | maintenance part 34 shows an example, and the structure which couple | bonds various connectors 3 and the control circuit board 4 so that a movement is mutually possible can be used besides this.

Next, with reference to FIG. 9, the manufacturing method of the above-mentioned power converter device 1 is demonstrated.
First, the semiconductor unit 2 and the electronic component 59 are arranged in the unit arrangement space 56 and the electronic component arrangement space 57 in the case 5, respectively.
Then, the control circuit board 4 is held by the board holding portion 34 of the connector 3. At this time, the connector 3 and the control circuit board 4 are movably fixed to each other while maintaining the state where the connection terminal 35 is inserted and disposed in the connection terminal hole 41.

  Next, the connector 3 and the control circuit board 4 fixed by the board holding part 34 are arranged in the case 5. At this time, the bonding surface 321 of the connector 3 and the bonded surface 513 of the rear wall 511 are bonded and fixed, and the control terminal 212 of the semiconductor module 21 is inserted into the control terminal hole 42 of the control circuit board 4. When the connector 3 is bonded to the case 5, the adhesive may protrude from between the bonding surface 321 and the bonded surface 513, but it flows between the flange 322 and the case 5, and both are bonded to each other. There is no protrusion.

  Next, the control circuit board 4 is fastened and fixed to the case 5 with screws (not shown). Then, the connection terminal 35 and the control terminal 212 are fixed to the control circuit board 4 by soldering. Note that as a means for fixing the control circuit board 4 to the case 5, adhesion or the like may be considered, but it is preferable to use fastening with screws in order to fix the control circuit board 4 more stably.

Next, the effect of this example is demonstrated.
The power conversion device 1 can connect the connector 3 and the control circuit board 4 movably to each other because the connector 3 has the board holding part 34. As a result, the connector 3 and the control circuit board 4 can be easily coupled and the stress at the connection portion can be reduced.
That is, since the connector 3 and the control circuit board 4 can be coupled by the board holding part 34 outside the case 5, the coupling work can be easily performed without interfering with the case 5 and other components in the case 5. It can be carried out.

  Further, since the connector 3 and the control circuit board 4 are movably coupled to each other, even if the dimensions of the case 5 vary, the dimensions of the case 3 can be reduced by moving the connector 3 and the control circuit board 4 relative to each other. Can absorb the variation. Then, after the positions of the connector 3 and the control circuit board 4 are determined, the connection terminal 35 and the control circuit can be connected. Therefore, it can suppress that the stress resulting from the variation in the position of the connector 3 and the control circuit board | substrate 4, and the dimension of case 5 acts on the connection part of the connection terminal 35 and a control circuit.

  The control circuit board 4 has a control terminal hole 42 through which the control terminal 212 is inserted, and the control circuit and the control terminal 212 are connected in a state where the control terminal 212 is inserted into the control terminal hole 42. . Therefore, the control terminal 212 can be easily inserted into the control terminal hole 42 in a state where the connector 3 and the control circuit board 4 are coupled by the board holding portion 34.

  The connector 3 and the case 5 are bonded and fixed. The connector 3 includes a main body 211 having an adhesive surface 321 with the case 5, and a flange 322 extending from both ends of the adhesive surface 321. The case 5 has an adhesive recess 512 that forms an adherend surface 513 along the adhesive surface 321, and an auxiliary recess that is formed along the flange 322 adjacent to both ends of the adherend surface 513. 514. Therefore, even if the adhesive overflows from between the adhesive surface 321 and the adherend surface 513, the adhesive enters between the flange 322 and the auxiliary recess 514, and both are bonded. Therefore, it can suppress that an adhesive material leaks outside, and can suppress generation | occurrence | production of the malfunction resulting from the leakage of an adhesive agent, such as an external appearance defect.

  Moreover, in the manufacturing method of the power converter device 1 of this example, the control circuit board 4 and the connector 3 are arranged in the case 5 in a temporarily fixed state in which the control circuit board 4 and the connector 3 are fixed by the board holding portion 34. Therefore, temporary fixing between the control circuit board 4 and the connector 3 can be easily performed. And after fixing the control circuit board 4 and the connector 3 to the case 5, the control circuit of the control circuit board 4 and the connection terminal 35 are fixed by soldering. Thereby, it can suppress that the stress resulting from the variation in the position of the connector 3 and the control circuit board | substrate 4, and the dimension of case 5 acts on the connection part of the connection terminal 35 and a control circuit. Therefore, it is possible to easily obtain the power conversion device 1 having the above-described excellent operational effects.

  Further, when the control circuit board 4 and the connector 3 are arranged in the case 5, the control terminal 212 is inserted into the control terminal hole 42 and the control circuit board 4 is fixed to the case 5. Are fixed by soldering. Therefore, the stress at the connection portion between the control circuit and the control terminal 212 can be reduced.

  As described above, according to this example, it is possible to provide a power conversion device 1 that can improve assembly workability and durability, and a method for manufacturing the power conversion device 1 that can be easily obtained.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor unit 21 Semiconductor module 3 Connector 31 Fitting part 35 Connection terminal 4 Control circuit board 5 Case

Claims (5)

A semiconductor unit (2) comprising a semiconductor module (21) incorporating a semiconductor element;
A connector (3) comprising a connection terminal (35) electrically connected to an external connector of an external device, and a fitting portion (31) fitted to the external connector;
A control circuit board (4) comprising a control circuit to which the control terminal (212) of the semiconductor module (21) and the connection terminal (35) are electrically connected;
And a case (5) in which the semiconductor module (21) and the control circuit board (4) are accommodated and the connector (3) is fixed in a state where the fitting portion (31) is exposed to the outside. And
The control circuit board (4) includes a connection terminal hole (41) into which the connection terminal (35) of the connector (3) is inserted,
The connector (3) maintains a state in which the connection terminal (35) is inserted into the connection terminal hole (41) before the control circuit and the connection terminal (35) are connected. However, it has a board holding part (34) for movably coupling the connector (3) and the control circuit board (4) to each other ,
The connector (3) and the case (5) are bonded and fixed with an adhesive,
The connector (3) includes an adhesive surface (321) with the case (5),
The case (5) has an adherend surface (513) along the adherend surface (321) and an adhesive reservoir formed adjacent to the adherend surface (513).
The adhesive reservoir is configured to store the adhesive overflowing from the adhesive surface (321), and communicates with the outer space of the case (5). Conversion device (1).   The control circuit board (4) has a control terminal hole (42) through which the control terminal (212) is inserted, and the control terminal (212) is inserted through the control terminal hole (42). The power converter (1) according to claim 1, characterized in that a control circuit and the control terminal (212) are connected.   The connector (3) and the case (5) are bonded and fixed. The connector (3) includes a main body (32) having an adhesive surface (321) with the case (5), and the above-described case (5). The case (5) has a flange (322) extending from both ends of the bonding surface (321), and the case (5) is bonded to form a bonded surface (513) along the bonding surface (321). It has a recessed part (512) and the auxiliary recessed part (514) formed adjacent to the both ends of the said to-be-adhered surface (513) along the said collar part (322), It is characterized by the above-mentioned. Item 3. The power conversion device (1) according to item 1 or 2. It is a method of manufacturing the power converter device (1) according to any one of claims 1 to 3,
The control circuit board (4) and the connector (3) are arranged in the case (5) in a temporarily fixed state in which the board holding part (34) is fixed,
Next, the control circuit board (4) and the connector (3) are fixed to the case (5),
Subsequently, the control circuit of the control circuit board (4) and the connection terminal (35) are fixed by soldering, The method for manufacturing the power conversion device (1),   When the control circuit board (4) and the connector (3) are arranged in the case (5), the control terminal (212) is inserted into the control terminal hole (42) of the control circuit board (4). 5. The power conversion according to claim 4, wherein after the control circuit board (4) is fixed to the case (5), the control circuit and the control terminal (212) are fixed by soldering. Manufacturing method of apparatus (1).

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