JP6322469B2 - Substrate processing method - Google Patents

Description

  The present invention relates to a method for processing a substrate such as a glass substrate for display.

As a processing method of a glass substrate for a display used for a smart phone, a tablet terminal, a measuring device, or the like, there is a method of stacking and processing a plurality of glass substrates (for example, see Patent Documents 1 and 2). In addition, it is known to use a photocurable adhesive when laminating a plurality of glass substrates (see, for example, Patent Documents 2 and 3).
However, when an adhesive is used for laminating a plurality of glass substrates, there are the following problems.

(A) Since the surface of the glass substrate for display is usually coated with an organic film, if an adhesive is directly applied, it will block and cannot be peeled off after processing. Therefore, it is necessary to apply a primer coat to all glass substrates as a pretreatment, resulting in a decrease in productivity and an increase in cost.
(B) In order to prevent air bubbles from being generated between adjacent glass substrates, it is necessary to apply an extra adhesive. For this reason, when a plurality of glass substrates are laminated and bonded, excess adhesive protrudes from the outer peripheral portion of the stacked body. Since the protruding adhesive is discarded, material loss occurs and the cost increases.
(C) Since the thickness difference (variation) is large in the thickness of the adhesive layer and the thickness accuracy is poor, the processing accuracy is likely to be lowered.
(D) The printed pattern portion of a smartphone, tablet terminal or the like cannot be sufficiently irradiated with ultraviolet rays, and therefore, the cured portion of the adhesive layer is likely to vary. As a result, when the glass substrate is peeled from the adhesive layer, an adhesive residue remains on the glass substrate from which the uncured portion of the adhesive layer has been peeled off. When the adhesive residue is generated, a cleaning process and an inspection process are further required, resulting in a decrease in productivity and an increase in cost.
(E) After laminating a plurality of glass substrates, the glass substrate cannot be processed immediately. That is, since it is necessary to cure the adhesive layer by irradiating ultraviolet rays after laminating and bonding a plurality of glass substrates, the number of steps increases and the glass substrate cannot be processed smoothly. Further, since an expensive ultraviolet irradiation device or the like is required for curing the adhesive layer, the cost is increased.
(F) There is a possibility that health damage may occur when an organic solvent or the like used as an adhesive solvent enters the worker's body through breath or skin.

Japanese Patent Laid-Open No. 2001-2436 JP 2009-256125 A JP 2013-76077 A

  An object of the present invention is to provide a substrate processing method that is excellent in processing accuracy and safety, can be reduced in cost, and can efficiently process a substrate.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found a solution means having the following constitution and have completed the present invention.
(1) Laminating a plurality of substrates via a temperature-sensitive adhesive sheet that contains a pressure-sensitive adhesive and a side-chain crystalline polymer, and the adhesive strength decreases at a temperature equal to or higher than the melting point of the side-chain crystalline polymer; The step of obtaining the first laminate, the step of processing the first laminate to obtain the second laminate, and setting the temperature of the temperature-sensitive adhesive sheet to a temperature equal to or higher than the melting point of the side chain crystalline polymer Reducing the adhesive force of the temperature-sensitive adhesive sheet, and peeling each of the processed plurality of substrates constituting the second laminate from the temperature-sensitive adhesive sheet. .
(2) The substrate processing method according to (1), wherein the plurality of substrates are glass substrates.
(3) The substrate processing method according to (1) or (2), wherein the plurality of substrates are used for a display.
(4) Peeling each of the plurality of processed substrates from the thermosensitive adhesive sheet by immersing the second laminate in hot water having a temperature equal to or higher than the melting point of the side chain crystalline polymer. The substrate processing method according to any one of 1) to (3).
(5) The thermosensitive adhesive sheet further contains a foaming agent, and the temperature of the thermosensitive adhesive sheet is set to a temperature equal to or higher than the melting point of the side chain crystalline polymer and the foaming agent expands or foams. The substrate processing method according to any one of (1) to (3), wherein the adhesive force of the temperature-sensitive adhesive sheet is reduced.
(6) A temperature-sensitive adhesive layer that contains a pressure-sensitive adhesive and a side-chain crystalline polymer, and whose adhesive strength decreases at a temperature equal to or higher than the melting point of the side-chain crystalline polymer, is provided on both sides of the film-like substrate. Laminating a plurality of substrates via a temperature-sensitive double-sided adhesive tape, obtaining a first laminate, processing the first laminate to obtain a second laminate, and the temperature-sensitive double-sided adhesive Each of the processed plurality of substrates constituting the second laminated body by reducing the adhesive force of the thermosensitive double-sided adhesive tape by setting the temperature of the tape to a temperature equal to or higher than the melting point of the side chain crystalline polymer. Peeling from the temperature-sensitive double-sided pressure-sensitive adhesive tape.
(7) The thermosensitive adhesive layer further contains a foaming agent, the temperature of the thermosensitive double-sided adhesive tape is equal to or higher than the melting point of the side chain crystalline polymer, and the foaming agent expands or foams. The board | substrate processing method as described in said (6) which lowers | hangs the adhesive force of the said thermosensitive double-sided adhesive tape by making temperature.

  According to the present invention, the processing accuracy and safety are excellent, the cost can be reduced, and the substrate can be processed efficiently.

(A)-(c) is process drawing which shows the board | substrate processing method which concerns on 1st Embodiment of this invention. It is a schematic explanatory drawing which shows the temperature sensitive adhesive sheet used for the board | substrate processing method which concerns on 1st Embodiment of this invention. It is a schematic explanatory drawing which shows the temperature sensitive double-sided adhesive tape used for the board | substrate processing method which concerns on 3rd Embodiment of this invention.

<Substrate processing method>
(First embodiment)
Hereinafter, the substrate processing method according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

  As shown in FIG. 1 and FIG. 2, in this embodiment, a temperature-sensitive adhesive sheet (hereinafter sometimes referred to as “adhesive sheet”) 1 is used for processing a plurality of substrates 11 </ b> A. The pressure-sensitive adhesive sheet 1 of the present embodiment is a base material-less pressure-sensitive adhesive sheet. The sheet is not limited to a sheet shape, and is a concept including a sheet shape or a film shape as long as the effects of the present embodiment are not impaired. The pressure-sensitive adhesive sheet 1 of this embodiment contains a pressure-sensitive adhesive and a side chain crystalline polymer.

  The pressure-sensitive adhesive is a tacky polymer, and specific examples thereof include natural rubber adhesives, synthetic rubber adhesives, styrene / butadiene latex-based adhesives, acrylic adhesives, and the like. Of these, acrylic adhesives are preferred.

  As a monomer constituting the acrylic adhesive, for example, an alkyl group having 1 to 12 carbon atoms such as 2-ethylhexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate and the like. (Meth) acrylates having a hydroxyalkyl group such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxyhexyl (meth) acrylate, and the like. You may use 1 type or in mixture of 2 or more types. (Meth) acrylate means acrylate or methacrylate.

  Specific examples of the composition of the acrylic adhesive include a copolymer obtained by polymerizing 2-ethylhexyl acrylate, methyl acrylate and 2-hydroxyethyl acrylate. Moreover, it is preferable to polymerize each monomer mentioned above in the ratio which makes 2-ethylhexyl acrylate 42-62 weight part, methyl acrylate 30-50 weight part, and 2-hydroxyethyl acrylate 3-13 weight part.

  A reactive polysiloxane compound can be copolymerized with the acrylic adhesive. The reactive polysiloxane compound means a polysiloxane compound having a reactive functional group and having a siloxane bond in the main chain. Examples of the functional group showing reactivity include a group having an ethylenically unsaturated double bond such as vinyl group, allyl group, (meth) acryl group, (meth) acryloyl group and (meth) acryloxy group; epoxy group (glycidyl) Group and an epoxycycloalkyl group), mercapto group, carbinol group, carboxyl group, silanol group, phenol group, amino group, hydroxyl group and the like. A commercially available product can be used as the reactive polysiloxane compound, and specific examples include one-end reactive silicone oil “X-22-174DX” manufactured by Shin-Etsu Chemical Co., Ltd. When copolymerizing a reactive polysiloxane compound, 42-62 parts by weight of 2-ethylhexyl acrylate, 30-50 parts by weight of methyl acrylate, 3-13 parts by weight of 2-hydroxyethyl acrylate, and reactive polysiloxane It is preferable to polymerize the compound at a ratio of 3 to 13 parts by weight.

  The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed. When the solution polymerization method is employed, the above-described monomer may be mixed in a solvent and stirred at about 40 to 90 ° C. for about 2 to 10 hours.

  The weight average molecular weight of the polymer obtained by polymerizing the above-described monomers, that is, the pressure-sensitive adhesive is preferably 35 to 650,000. Thereby, when peeling the adhesive sheet 1 from the processed board | substrate 11B, it can suppress that what is called an adhesive residue which the adhesive sheet 1 remains on the board | substrate 11B generate | occur | produces. Moreover, it can suppress that the cohesion force of the adhesive sheet 1 becomes high too much, and the adhesive force of the adhesive sheet 1 becomes low. The weight average molecular weight is a value obtained by measuring the polymer by gel permeation chromatography (GPC) and converting the obtained measurement value to polystyrene.

  On the other hand, the side chain crystalline polymer is a polymer having a melting point. The melting point is a temperature at which a specific portion of the polymer that was initially aligned in an ordered arrangement becomes disordered by an equilibrium process, and is measured at 10 ° C./min by a differential thermal scanning calorimeter (DSC). It shall mean the value obtained by measurement.

  The side-chain crystalline polymer is crystallized at a temperature lower than the melting point described above, and undergoes phase transition and exhibits fluidity at a temperature higher than the melting point. That is, the side chain crystalline polymer has temperature sensitivity that reversibly causes a crystalline state and a fluid state in response to a temperature change. Thereby, at the temperature below melting | fusing point, since the side chain crystalline polymer exists in a crystalline state, the adhesive sheet 1 can ensure adhesive force. Moreover, at the temperature more than melting | fusing point, when the side chain crystalline polymer shows fluidity | liquidity, the adhesiveness of the pressure-sensitive adhesive mentioned above can be inhibited, As a result, the adhesive force of the adhesive sheet 1 can be reduced. At this time, if an acrylic adhesive obtained by copolymerizing a reactive polysiloxane compound with a pressure-sensitive adhesive is used, in addition to a decrease in adhesive strength due to the side chain crystalline polymer, a release caused by the polysiloxane compound is also caused. Since moldability is added, the adhesive strength can be further reduced.

  The melting point of the side chain crystalline polymer is preferably 50 ° C. or higher. Thereby, since the side chain crystalline polymer is in a crystalline state at room temperature (23 ° C.), the pressure-sensitive adhesive sheet 1 can secure adhesive strength at room temperature, and as a result, workability can be improved. The upper limit of the melting point of the side chain crystalline polymer is preferably 70 ° C.

  The melting point described above can be adjusted by changing the composition of the side chain crystalline polymer. Examples of the monomer constituting the side chain crystalline polymer include (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, (meth) acrylate having an alkyl group having 1 to 6 carbon atoms, and a polar monomer. It is done.

  Examples of the (meth) acrylate having a linear alkyl group having 16 or more carbon atoms include 16 to 22 carbon atoms such as cetyl (meth) acrylate, stearyl (meth) acrylate, eicosyl (meth) acrylate, and behenyl (meth) acrylate. (Meth) acrylate having a linear alkyl group of, for example, (meth) acrylate having an alkyl group having 1 to 6 carbon atoms such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate Hexyl (meth) acrylate and the like, and examples of polar monomers include ethylenically unsaturated monomers having a carboxyl group such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid; 2-hydroxy Ethyl (meth) acrylate, 2-hydroxy Propyl (meth) acrylate, 2-hydroxyhexyl (meth) ethylenically unsaturated monomer having a hydroxyl group such as acrylate and the like, which may be used alone or in combination.

  The side chain crystalline polymer is preferably a polymer obtained by polymerizing a (meth) acrylate having a linear alkyl group having at least 16 carbon atoms among the above-described monomers. Each of the monomers described above is, for example, 30 to 100 parts by weight of (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, and 0 to 70 parts by weight of (meth) acrylate having an alkyl group having 1 to 6 carbon atoms. It is preferable to polymerize the polar monomer in a proportion of 0 to 10 parts by weight.

  Specific examples of the composition of the side chain crystalline polymer include a copolymer obtained by polymerizing behenyl acrylate, stearyl acrylate, methyl acrylate and acrylic acid. Further, each of the above-described monomers is polymerized at a ratio of 35 to 45 parts by weight of behenyl acrylate, 30 to 40 parts by weight of stearyl acrylate, 15 to 25 parts by weight of methyl acrylate, and 1 to 10 parts by weight of acrylic acid. Is preferred.

  The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed. When the solution polymerization method is employed, the above-described monomer may be mixed in a solvent and stirred at about 40 to 90 ° C. for about 2 to 10 hours.

  The weight average molecular weight of the side chain crystalline polymer is preferably 3,000 to 30,000. Thereby, it is possible to suppress the occurrence of adhesive residue when the pressure-sensitive adhesive sheet 1 is peeled from the substrate 11B. Moreover, when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the adhesive strength of the adhesive sheet 1 can be sufficiently reduced. The weight average molecular weight is a value obtained by measuring the side chain crystalline polymer by GPC and converting the obtained measurement value into polystyrene.

  The side chain crystalline polymer is preferably blended at a ratio of 0.5 to 10 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive in terms of solid content. Thereby, when a side chain crystalline polymer shows fluidity | liquidity at the temperature more than melting | fusing point, the adhesive force of the adhesive sheet 1 can fully be reduced.

  Various additives such as a cross-linking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber can be added to the pressure-sensitive adhesive sheet 1 of the above-described embodiment. It is preferable to add an agent. Examples of the crosslinking agent include isocyanate compounds. The crosslinking agent is preferably added at a ratio of 0.1 to 10 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive in terms of solid content. Thereby, the cohesion force of the adhesive sheet 1 can be improved moderately, and it can suppress that adhesive residue generate | occur | produces.

  As thickness of the adhesive sheet 1 of this embodiment, it is preferable that it is 10-200 micrometers, and it is more preferable that it is 20-100 micrometers.

  Moreover, as shown in FIG. 2, the adhesive sheet 1 of this embodiment has the separators 2 and 2 laminated | stacked on the single side | surface 1a and the other surface 1b of the adhesive sheet 1. As shown in FIG. Thereby, the single side | surface 1a and the other surface 1b of the adhesive sheet 1 can each be protected.

  Examples of the separators 2 and 2 include a film made of polyethylene, polyethylene terephthalate or the like, and a release agent such as silicone or fluorine applied to the surface of the film. Moreover, as thickness of each of the separators 2 and 2, it is preferable that it is 10-110 micrometers. The separators 2 and 2 may have the same composition, thickness, or the like, or may be different.

  In the substrate processing method of the present embodiment using the adhesive sheet 1 described above, first, as shown in FIG. 1A, a plurality of substrates 11 </ b> A are stacked via the adhesive sheet 1 to obtain the first laminate 10. . That is, in this embodiment, since the adhesive sheet 1 is used for stacking the plurality of substrates 11A, the above-described problems caused by the adhesive can be solved. Specifically, there is no need for pretreatment (primer coating) of the substrate 11A, and the lead time can be shortened. Moreover, generation | occurrence | production of the material loss by using an excess adhesive agent can be suppressed. A decrease in processing accuracy due to poor thickness accuracy of the adhesive layer can be suppressed. The use of the pressure-sensitive adhesive sheet 1 can usually improve the thickness accuracy by an order of magnitude over the adhesive layer. Specifically, when the adhesive is used, the thickness difference of the first laminate 10 becomes a maximum of 100 μm, whereas when the adhesive sheet 1 is used, the thickness difference of the first laminate 10 can be suppressed to a maximum of 30 μm. . An expensive device such as an ultraviolet irradiation device is not required. After laminating the plurality of substrates 11A, the substrate 11A can be processed immediately, and the tact time can be shortened. Occurrence of health damage due to organic solvents can be suppressed. The number of processes and cost can be reduced.

  A desired substrate can be adopted as the substrate 11A, and is not particularly limited, but is preferably a glass substrate, and is preferably for a display.

  In the first laminate 10 of this embodiment, dummy materials 12 and 12 are further laminated at both ends in the lamination direction. Examples of the dummy material 12 include a glass substrate, but are not limited thereto.

  Next, the 1st laminated body 10 is processed and the 2nd laminated body 20 shown in FIG.1 (b) is obtained. Examples of the processing method include, but are not limited to, cutting, grinding, polishing, etching, and the like. In this embodiment, the 1st laminated body 10 is cut | disconnected, the several 2nd laminated body 20 is formed, and one of the several 2nd laminated bodies 20 is shown in FIG.1 (b). .

  Next, the temperature of the pressure-sensitive adhesive sheet 1 is set to a temperature equal to or higher than the melting point of the side chain crystalline polymer to reduce the pressure-sensitive adhesive force of the pressure-sensitive adhesive sheet 1, and each of the processed substrates 11B constituting the second laminate 20 Is peeled from the pressure-sensitive adhesive sheet 1. According to this embodiment, since the above-described pressure-sensitive adhesive sheet 1 is used, there is no variation in the cured portion due to curing of the adhesive layer, and thus the substrate 11B from which the uncured portion of the adhesive layer has been peeled off. Generation of adhesive residue remaining on the top can be suppressed. As a result, the cleaning process and the inspection process can be omitted, and the productivity can be improved and the cost can be reduced.

  In the present embodiment, the plurality of processed substrates 11B are peeled by immersing the second laminate 20 in warm water 30 having a temperature equal to or higher than the melting point of the side chain crystalline polymer, as shown in FIG. Do by. The temperature of the hot water 30 is not particularly limited as long as the temperature is equal to or higher than the melting point of the side chain crystalline polymer. As a specific example, when the melting point of the side chain crystalline polymer is 50 ° C., the temperature of the hot water 30 may be 50 ° C. or more. As immersion time of the 2nd laminated body 20 in the warm water 30, 3 to 5 minutes are preferable.

  In addition, you may peel the several board | substrate 11B processed by making the temperature of the adhesive sheet 1 into the temperature more than melting | fusing point of a side chain crystalline polymer with a heating means. Examples of the heating means include a heater.

(Second Embodiment)
Next, a substrate processing method according to the second embodiment of the present invention will be described. In the present embodiment, the pressure-sensitive adhesive sheet 1 further contains a foaming agent, and the pressure-sensitive adhesive sheet 1 is set to a temperature equal to or higher than the melting point of the side chain crystalline polymer and the foaming agent expands or foams. Reduces the adhesive strength.

  As the foaming agent, both general chemical foaming agents and physical foaming agents can be employed. Chemical foaming agents include pyrolytic and reactive organic foaming agents and inorganic foaming agents.

  Examples of the pyrolytic organic foaming agent include various azo compounds (such as azodicarbonamide), nitroso compounds (such as N, N′-dinitrosopentamethylenetetramine), and hydrazine derivatives [4,4′-oxybis (benzene). Sulfonyl hydrazide) and the like], semicarbazide compound (hydrazodicarbonamide and the like), azide compound, tetrazole compound and the like. Examples of the reactive organic foaming agent include isocyanate compounds.

  Examples of the thermal decomposition type inorganic foaming agent include bicarbonate / carbonate (sodium bicarbonate, etc.), nitrite / hydride, etc. Examples of the reaction type inorganic foaming agent include sodium bicarbonate and the like. The combination with an acid, the combination of hydrogen peroxide and yeast, the combination of zinc powder and an acid, etc. are mentioned.

  Examples of the physical foaming agent include organic physical foaming agents such as aliphatic hydrocarbons such as butane, pentane and hexane, chlorohydrocarbons such as dichloroethane and dichloromethane, and fluorochlorohydrocarbons such as chlorofluorocarbons; air, carbonic acid Examples thereof include inorganic physical foaming agents such as gas and nitrogen gas.

  As another foaming agent, a so-called microballoon foaming agent that is microencapsulated thermally expandable fine particles can be employed. The microballoon foaming agent is obtained by encapsulating a heat-expandable substance made of a solid, liquid, or gas inside a polymer shell made of a thermoplastic or thermosetting resin. In other words, the microballoon foaming agent includes a hollow polymer shell having an average particle size of micro order, and a heat-expandable substance enclosed in the polymer shell. The microballoon foaming agent expands in volume by 40 times or more by heating, and a foam in the form of closed cells is obtained. Therefore, the microballoon foaming agent has a characteristic that the expansion ratio is considerably larger than that of a normal foaming agent. As such a microballoon foaming agent, a commercially available product can be used. For example, “461DU20” and “551DU40” manufactured by EXPANCEL are suitable.

  The foaming agent is preferably blended in a proportion of 5 to 50 parts by weight and more preferably in a proportion of 10 to 30 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive in terms of solid content. . Thereby, when a foaming agent expand | swells thru | or foams, the adhesive force of the adhesive sheet 1 can fully be reduced.

  The temperature at which the blowing agent expands or foams is usually higher than the melting point of the side chain crystalline polymer. The temperature at which the foaming agent expands or foams is preferably 90 ° C. or higher.

  Although it does not specifically limit as an average particle diameter of a foaming agent, Usually, it is preferable that it is 5-50 micrometers, and it is more preferable that it is 5-20 micrometers. The average particle diameter is a value obtained by measurement with a particle size distribution measuring device.

In the present embodiment, when the plurality of substrates 11B processed by immersing the second laminate 20 in the warm water 30 is peeled off, the warm water 30 is at a temperature equal to or higher than the melting point of the side chain crystalline polymer and foamed. The temperature may be set so that the agent expands or foams. As a specific example, when the melting point of the side chain crystalline polymer is 50 ° C. and the temperature at which the blowing agent expands or foams is 90 ° C., the temperature of the hot water 30 may be 90 ° C. or higher. As immersion time of the 2nd laminated body 20 in the warm water 30, 3 to 5 minutes are preferable.
Since other configurations are the same as those of the substrate processing method according to the first embodiment described above, description thereof is omitted.

(Third embodiment)
Next, a substrate processing method according to a third embodiment of the present invention will be described in detail with reference to FIG.

  In the present embodiment, a temperature-sensitive double-sided pressure-sensitive adhesive tape (hereinafter sometimes referred to as “pressure-sensitive adhesive tape”) 3 shown in FIG. 3 is used instead of the above-described pressure-sensitive adhesive sheet 1 for processing the plurality of substrates 11A. . The pressure-sensitive adhesive tape 3 of this embodiment has temperature-sensitive pressure-sensitive adhesive layers 4 and 4 on both surfaces of a film-like substrate 5.

  The temperature-sensitive pressure-sensitive adhesive layers 4 and 4 of this embodiment contain a pressure-sensitive adhesive and a side chain crystalline polymer, and the adhesive strength decreases at a temperature equal to or higher than the melting point of the side chain crystalline polymer. The temperature-sensitive pressure-sensitive adhesive layers 4 and 4 may have the same composition or different from each other.

  In order to laminate the temperature-sensitive pressure-sensitive adhesive layers 4 and 4 on both surfaces of the substrate 5, for example, a coating solution in which a pressure-sensitive adhesive and a side chain crystalline polymer are added to a solvent is applied to both surfaces of the substrate 5 by a coater or the like. What is necessary is just to apply | coat and dry. Examples of the coater include a knife coater, a roll coater, a calendar coater, a comma coater, a gravure coater, and a rod coater.

  The thickness of each of the temperature sensitive pressure-sensitive adhesive layers 4 and 4 is preferably 10 to 100 μm, more preferably 10 to 50 μm, and further preferably 15 to 45 μm. The thicknesses of the temperature-sensitive pressure-sensitive adhesive layers 4 and 4 may be the same as or different from each other.

  On the other hand, the substrate 5 of the present embodiment is a film. The film shape is not limited to a film shape, and is a concept including a film shape or a sheet shape as long as the effects of the present embodiment are not impaired.

  Examples of the constituent material of the substrate 5 include polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, ethylene polypropylene copolymer, and polyvinyl chloride. Examples include synthetic resins, and among the exemplified synthetic resins, polyethylene terephthalate is preferable.

  The substrate 5 of the present embodiment may be either a single layer or a multilayer, and the thickness is preferably 5 to 250 μm, more preferably 12 to 188 μm, 25 More preferably, it is -125 micrometers. The surface of the substrate 5 may be subjected to surface treatment such as corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, primer treatment, etc., in order to improve adhesion to the temperature sensitive adhesive layers 4, 4. it can.

Moreover, the adhesive tape 3 of this embodiment further has the separators 2 and 2 laminated | stacked on the surfaces 4a and 4a of the temperature sensitive adhesive layers 4 and 4. FIG.
Since other configurations are the same as those of the substrate processing method according to the first and second embodiments described above, description thereof will be omitted.

(Fourth embodiment)
Next, a substrate processing method according to the fourth embodiment of the present invention will be described. In this embodiment, the above-mentioned pressure-sensitive adhesive tape 3 further contains a foaming agent, and the pressure-sensitive adhesive tape 3 has a temperature equal to or higher than the melting point of the side chain crystalline polymer and the foaming agent expands or foams. Reduces the adhesive strength. The foaming agents contained in each of the temperature sensitive pressure-sensitive adhesive layers 4 and 4 may have the same or different compositions.
Since other configurations are the same as those of the substrate processing method according to the first to third embodiments described above, the description thereof is omitted.

DESCRIPTION OF SYMBOLS 1 Temperature sensitive adhesive sheet 1a Single side | surface 1b Other side 2 Separator 3 Temperature sensitive double-sided adhesive tape 4 Temperature sensitive adhesive layer 4a Surface 5 Base material 10 1st laminated body 11A Substrate 11B Processed substrate 12 Dummy material 20 2nd Laminate 30 Hot water

Claims (5)

A plurality of substrates are laminated via a temperature-sensitive adhesive sheet containing a pressure-sensitive adhesive and a side-chain crystalline polymer, and the adhesive strength decreases at a temperature equal to or higher than the melting point of the side-chain crystalline polymer. Obtaining a body;
Processing the first laminate to obtain a second laminate;
The plurality of processed plurality constituting the second laminated body by reducing the adhesive force of the thermosensitive adhesive sheet by setting the temperature of the thermosensitive adhesive sheet to a temperature equal to or higher than the melting point of the side chain crystalline polymer. Separating each of the substrates from the thermosensitive adhesive sheet;
Wherein the plurality of substrates Ru glass substrate der for a display, the substrate processing method. Each of the plurality of substrates that are the processing is peeled from the temperature sensitive adhesive sheet by immersing the second laminate in warm water in the side chain a temperature above the melting point of the crystalline polymer, according to claim 1 Substrate processing method. The temperature-sensitive adhesive sheet further contains a foaming agent;
The temperature-sensitive adhesive sheet has a temperature equal to or higher than the melting point of the side chain crystalline polymer, and the foaming agent expands or foams to reduce the adhesive strength of the temperature-sensitive adhesive sheet. Or the board | substrate processing method of 2. A temperature-sensitive adhesive layer containing a pressure-sensitive adhesive and a side-chain crystalline polymer, and having a temperature-sensitive pressure-sensitive adhesive layer on both sides of the film-like substrate, the adhesive strength of which decreases at a temperature equal to or higher than the melting point of the side-chain crystalline polymer. Laminating a plurality of substrates via an adhesive double-sided adhesive tape to obtain a first laminate,
Processing the first laminate to obtain a second laminate;
The temperature-sensitive double-sided pressure-sensitive adhesive tape was processed at a temperature equal to or higher than the melting point of the side-chain crystalline polymer to reduce the adhesive force of the temperature-sensitive double-sided pressure-sensitive adhesive tape and constitute the second laminate. Peeling each of the plurality of substrates from the thermosensitive double-sided adhesive tape;
Wherein the plurality of substrates Ru glass substrate der for a display, the substrate processing method. The temperature-sensitive adhesive layer further contains a foaming agent;
The temperature of the temperature-sensitive double-sided pressure-sensitive adhesive tape is set to a temperature equal to or higher than the melting point of the side chain crystalline polymer, and the foaming agent expands or foams to reduce the adhesive force of the temperature-sensitive double-sided pressure-sensitive adhesive tape. Item 5. A substrate processing method according to Item 4 .

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