JP6361906B2 - Wiring substrate manufacturing method and laminate with support material - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board and a laminate with a support material, and more particularly to a method for manufacturing a wiring board using a coreless method and a laminate with a support material used for the coreless method.

  In recent years, with the thinning of a wiring board, it is difficult to cope with a build-up method in which a copper-clad laminate is used as a core and multilayered. On the other hand, if a copper-clad laminate is not used as a core, it can cope with a reduction in thickness, but in this case, since rigidity is small, handling in the manufacturing process becomes difficult and workability is poor. Therefore, in order to cope with the reduction in thickness while ensuring workability, the manufacturing process is advanced halfway using a support material that does not constitute the wiring board itself as a product, and then the support material is separated until the final process. The so-called coreless method of manufacturing a wiring board by proceeding has come to be used.

  As such a coreless construction method, as shown in FIG. 1, a copper-clad laminate 8 is used as a support material 7, and on the copper foil A <b> 1 of the copper-clad laminate 8, a slightly smaller copper foil B <b> 2, prepreg B <b> 6 The copper foil C4 is arranged and configured in this order, and is heat-pressed to form the laminated body 11 with the support material in which the outer peripheral portion of the copper foil B2 is sealed with the prepreg B6, and further, the circuit, the interlayer connection, the insulating layer, etc. After forming and multilayering, the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14 to separate and remove the copper-clad laminate 8 which is the support material 7 from the laminated body 17. There is a method of manufacturing a wiring board from 17 (Patent Document 1).

  In addition, an ultra-thin copper foil with a carrier copper foil (thickness 1 to 5 μm) is laminated on the insulating resin with the ultra-thin copper foil on top, and then patterned copper plating on the ultra-thin copper foil on the surface , Prepreg and copper foil are placed on top of each other, laminated to form a laminated body with a support material, and further after forming an interlayer connection, between the ultrathin copper foil and the carrier copper foil, There is a method of separating and removing a laminate from an insulating resin that is a support material, and manufacturing a wiring board from the laminate (Patent Document 2).

Japanese Patent No. 5029911 Japanese Patent No. 4273895

  However, in the method of Patent Document 1, it is necessary to use a copper-clad laminate as a support material, and when separating the laminate and the support material, the margin to be cut and removed (outer peripheral portion) There is a problem in terms of material cost because it is as large as about 15 mm from the end.

  In the method of Patent Document 2, when forming a laminate with a support material, an ultrathin copper foil with a carrier copper foil is laminated on both sides of an insulating resin to be a support material, pattern copper plating is performed, and It is necessary to form a prepreg and a copper foil to form an interlayer connection, and there is a problem in workability because the number of times of lamination is large. In addition, since both the insulating resin as the support material and the carrier copper foil are separated and removed from the laminate as the product, there is a problem that the material is wasted.

  The present invention has been made in view of the above problems, and in the coreless construction method, a method for manufacturing a wiring board and a laminate with a support material that can reduce material cost by reducing the margin for cutting and removing, and that has good workability. provide.

In the present invention, a peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A, and further a prepreg B and a copper foil C are disposed and laminated on both sides. have a step (1) to form the body, the step (1), as the prepreg a, a method of manufacturing a wiring board to use a thinner than prepreg B. In addition, the present invention has a support material in which a peelable copper foil having copper foil A and copper foil B is disposed on both sides of the prepreg A, and the prepreg B and copper foil C are disposed on both sides and laminated. It is a laminated body , and is a laminated body with a support material in which the thickness of the prepreg A is thinner than that of the prepreg B.

  According to the present invention, in order to form a laminated body with a support material using a peelable copper foil having a copper foil A and a copper foil B, the copper foil A on the support material side and the base of the wiring board formed thereon Separation from the resulting laminate can be performed using the peelability of copper foil A and copper foil B. For this reason, when separating the support material and the laminate, it is not necessary to largely cut the entire outer peripheral portion of the laminate as in Patent Document 1, which is a conventional technique, and waste of materials and labor can be saved. Moreover, the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy.

  In the present invention, as described above, the peelable copper foil having the copper foil A and the copper foil B is disposed on both sides of the prepreg A, and the prepreg B and the copper foil C are further disposed on both sides and laminated. In addition to the step (1) of forming the laminate with support material, the step (2) of forming an interlayer connection hole from the copper foil C to the copper foil B of the laminate with support material, and with the support material By forming a copper plating on the interlayer connection hole and the copper foil B of the laminate, an interlayer connection for connecting the copper foil C and the copper foil B, and a conductor layer having the copper foil C and the copper plating, And a step (3) of forming a wiring board.

  According to the present invention, the laminate with a support material provides rigidity that can withstand handling in the manufacturing process, so that workability is greatly improved even when a wiring board that is required to be thin is manufactured. In addition, the so-called coreless method of manufacturing the wiring board by separating the supporting material and proceeding to the final process after the manufacturing process has been progressed halfway using a supporting material that does not constitute the wiring board itself as a product is easy. Become.

In step (1) or the supporting member-integrated laminate manufacturing method of the wiring substrate, as flop prepreg A, using a thinner than prepreg B. In other words, if the glass cloth of the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring board is based. This is advantageous when forming a fine circuit using B.

  In the step (1) of the method for producing a wiring board or the laminate with a support material, preferably, the size of the peelable copper foil is smaller than the prepregs A and B laminated on both sides of the peelable copper foil. Thereby, it can comprise so that prepreg A, B may protrude from the outer periphery of peelable, and it becomes possible to seal the edge part of peelable copper foil with resin of prepreg A, B. For this reason, it can control that copper foil A and copper foil B exfoliate by handling in a manufacturing process, etc., or a processing liquid enters between copper foil A and copper foil B, and workability improves. The prepregs A and B may be about 5 mm larger than the peelable copper foil. Therefore, when separating between the copper foil A and the copper foil B, the end portion may be cut by about 5 mm. There is little waste of material.

  In the step (1) of the method for producing a wiring board or the laminate with a support material, preferably, the peelable copper foil does not protrude from the prepregs A and B laminated on both sides of the peelable copper foil. Composed. This makes it possible to reliably cover the outer periphery of the peelable with the prepregs A and B. For this reason, workability | operativity improves.

  In the step (1) of the method for producing a wiring board or the laminate with a support material, preferably, the periphery of the three-layer peelable copper foil is sealed with prepregs A and B laminated on both sides of the peelable copper foil. (Sealed). Thereby, it can suppress reliably that copper foil A and copper foil B peel by handling in a manufacturing process, etc., or a process liquid enters between copper foil A and copper foil B, and workability | operativity improves. .

  According to the present invention, in the coreless construction method, it is possible to provide a method for manufacturing a wiring board and a laminate with a support material that can reduce material costs by reducing margins for cutting and removing, and that have good workability.

It is a flowchart showing a part of manufacturing method of the conventional wiring board. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment, or sectional drawing of the laminated body with a support material of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment, or sectional drawing of the laminated body with a support material of this Embodiment.

  A method for manufacturing a wiring board as an example of an embodiment of the present invention will be described below with reference to FIGS.

  In the method for manufacturing a wiring board according to the present embodiment, peelable copper foil 3 having copper foil A1 and copper foil B2 is arranged on both sides of prepreg A5, and prepreg B6 and copper foil C4 are arranged on both sides. And (1) forming the laminated body 11 with the support material, and (2) forming the interlayer connection hole 12 from the copper foil C4 of the laminated body 11 with the support material to the copper foil B2. By forming the copper plating 13 on the interlayer connection hole 12 and the copper foil B2 of the laminated body 11 with the support material, the interlayer connection 18 that connects the copper foil C4 and the copper foil B2, and the copper foil C4 and A step (3) of forming a conductor layer 19 having a copper plating 13.

  As shown in FIG.2 and FIG.3, in the process (1) of the manufacturing method of the wiring board of this Embodiment, the peelable copper foil 3 which has the copper foil A1 and the copper foil B2 is provided on both sides which pinched | interposed the prepreg A5. The prepreg B6 and the copper foil C4 are further arranged and laminated on both sides to form a laminated body 11 with a support material. Specifically, the prepreg A5, the peelable copper foil 3, the prepreg B6, and the copper foil C4 are prepared, and the peelable copper foil 3, the prepreg B6, and the copper foil C4 are arranged in this order on both sides of the prepreg A5, and these materials are heated. Adhere by pressing. The peelable copper foil 3 is a copper foil having a two-layer structure in which a physically peelable copper foil B2 is provided on one side of a copper foil A1 serving as a carrier. The peelable copper foil 3 may be a known copper foil with a carrier used in a wiring board. In the manufacturing method of the wiring board of the present embodiment, the prepreg A5 and the copper foil A (carrier) of the peelable copper foil 3 laminated on both sides thereof become the support material 7, and the upper layer side from the copper foil B2 of the peelable copper foil 3 is It becomes the laminated body 17 which becomes the base of a wiring board. The support material 7 is used only during the manufacturing process, but is not used as a material constituting the wiring board as a product. As the prepregs A5 and B6, an insulating material generally used in a wiring board can be used, and examples thereof include a glass cloth impregnated with an epoxy resin or a polyimide resin. As copper foil C4, the copper foil generally used for a wiring board can be used. Lamination means that the insulating resin in the prepreg is melted and cured by heating and pressing with a hot press, and the copper foil is bonded.

  Thus, in the manufacturing method of the wiring board of this Embodiment, in order to form the laminated body with a support material using the peelable copper foil which has the copper foil A and the copper foil B, the copper foil A by the side of a support material and Separation from the laminate on which the wiring board is formed can be performed using the peelability of the copper foil A and the copper foil B. For this reason, when separating the support material and the laminate, it is not necessary to largely cut the entire outer peripheral portion of the laminate as in Patent Document 1, which is a conventional technique, and waste of materials and labor can be saved. Moreover, the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy. Therefore, in the coreless construction method, it is possible to provide a method for manufacturing a wiring board that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.

  As shown in FIG. 4, in the process (2) of the manufacturing method of the wiring board of this Embodiment, the interlayer connection hole 12 from the copper foil C4 of the laminated body 11 with a support material to the copper foil B2 is formed. Specifically, an opening is provided at a predetermined location of the interlayer connection hole 12 by etching in the copper foil C4 by a conformal mask method, and the opening is irradiated with a laser to remove the prepreg B6. The interlayer connection hole 12 is a hole for forming the interlayer connection 18 by conducting the copper foil C4 and the copper foil B2 disposed on both sides of the prepreg B6 that is an insulating material. As a method for forming the interlayer connection hole 12, in addition to the above-described conformal mask method, a direct laser method in which the copper foil C4 and the prepreg B6 are removed without providing an opening in the copper foil C4 may be used. .

  As shown in FIG. 5, in the process (3) of the manufacturing method of the wiring board of this Embodiment, by forming the copper plating 13 on the interlayer connection hole 12 and the copper foil C4 of the laminated body 11 with the support material, An interlayer connection 18 for connecting the copper foil C4 and the copper foil B2 and a conductor layer 19 having the copper foil C4 and the copper plating 13 are formed. Specifically, the interlayer connection hole 12 formed in the step (2) is filled with the copper plating 13, and the copper plating 13 is also formed on the surface of the copper foil C4 to form the conductor layer 19. That is, in the present embodiment, the conductor layer 19 is formed of two layers of the copper foil C4 and the copper plating 13.

  As shown in FIG. 6, in step (4) of the manufacturing method of the wiring board of the present embodiment, the laminate 17 including the copper foil B <b> 2 is separated from the copper foil A <b> 1 that is the support material 7. Specifically, since the copper foil A1 which is a part of the support material 7 and the copper foil B2 which is a part of the laminate 17 which is the basis of the wiring board have releasability, they can be easily peeled off. can do. Even when the insulating resin of the prepregs A5 and B6 flows out and is cured at the end of the laminated body 11 with the support material by lamination using a hot press, for example, at the cutting line 14 in FIG. Separation is possible by cutting about 5 mm at the end (outer periphery) of the laminate 11 with material. For this reason, there is little waste of material compared with the past.

  As shown in FIG. 7, in the process (5) of the manufacturing method of the wiring board of the present embodiment, the conductor layer 19 having the copper foil C4 and the copper plating 13 and the copper foil B2 are processed into a circuit, and the inner layer circuit 15 is formed. Form. Specifically, an etching resist generally used for manufacturing a wiring board is formed on the conductor layer 19 and the copper foil B2, and can be formed by a known subtractive method.

  As shown in FIG. 8, in the method for manufacturing a wiring board according to the present embodiment, prepreg C <b> 10 and copper foil D <b> 9 are sequentially arranged and laminated on inner layer circuit 15. Furthermore, an interlayer connection (not shown) is provided, and an upper layer circuit (not shown) is formed by performing plating and circuit processing.

  According to the method for manufacturing a wiring board of the present embodiment, the laminate 11 with a support material provides rigidity that can withstand handling in the manufacturing process, so even when manufacturing the wiring board 16 that is required to be thin, Workability is greatly improved. In addition, the manufacturing process is advanced halfway using the support material 7 that does not constitute the product wiring board 16 itself, and then the support material 7 is separated and then advanced to the final process to manufacture the wiring board 16. The construction method becomes easy.

  The laminated body with a support material which is an example of the embodiment of the present invention will be described below with reference to FIG.

  The laminated body 11 with a support material of this Embodiment arrange | positions the peelable copper foil 3 which has copper foil A1 and copper foil B2 on both sides which pinched | interposed the prepreg A5, and also has prepreg B6 and copper foil C4 on both sides. It is the laminated body 11 with a support material which has been arranged and laminated.

  According to the laminated body 11 with a support material of this Embodiment, since the laminated body 11 with a support material is formed using the peelable copper foil 3 having the copper foil A1 and the copper foil B2, the copper foil on the support material 7 side. Separation between A1 and the laminated body 17 serving as a base of the wiring board 16 formed thereon can be performed using the peelability of the copper foil A1 and the copper foil B2. For this reason, when separating the support material 7 and the laminated body 17, it is not necessary to cut the entire outer peripheral portion of the laminated body 17 as in the prior art, and material waste and labor can be saved. In addition, the peelable copper foil 3 having the copper foil A1 and the copper foil B2 is arranged on both sides of the prepreg A5, and the prepreg B6 and the copper foil C4 are further arranged on both sides to be laminated. And the laminated body 17 on which the wiring board 16 is based can be formed at the same time, which facilitates the configuration work. Therefore, in the coreless construction method, it is possible to provide a laminate with a support material that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.

  In the step (1) of the method for producing a wiring board of the above embodiment or the laminate with a support material, preferably, a prepreg A using a glass cloth thinner than the prepreg B is used. In other words, if the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring substrate is based. This is advantageous when forming a fine circuit.

  In the step (1) of the manufacturing method of the wiring board of the above embodiment or the laminated body with a support material, preferably, the size of the peelable copper foil 3 is on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is smaller than the prepregs A5 and B6 to be laminated. Thereby, it can comprise so that prepreg A5, B6 may protrude from the outer periphery of peelable copper foil 3, and it seals the edge part of peelable copper foil 3 with resin of prepreg A5, B6 (seal part 20 of FIG. 9B). Is possible. For this reason, it can suppress that copper foil A1 and copper foil B2 peel by handling in a manufacturing process, etc., or a process liquid etc. enter | penetrate between copper foil A1 and copper foil B2, and workability | operativity improves. In addition, since the prepregs A5 and B6 may be about 5 mm larger than the peelable copper foil 3, when separating between the copper foil A1 and the copper foil B2, the end may be cut by about 5 mm (FIG. 9C). Cutting line 14), cutting effort and material waste are small.

  In the step (1) of the method for manufacturing a wiring board of the above embodiment or the laminate with a support material, preferably, the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is configured not to protrude from the prepregs A5 and B6. Thereby, it becomes possible to reliably cover the outer periphery of the peelable copper foil 3 with the prepregs A5 and B6 (the seal portion 20 in FIG. 9B). For this reason, workability | operativity improves.

  In the step (1) of the method for manufacturing a wiring board according to the above embodiment or the laminated body with a support material, preferably, the periphery of the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9B. The prepregs A5 and B6 are sealed (seal part 20). Thereby, it can suppress reliably that copper foil A1 and copper foil B2 peel by handling in a manufacturing process, etc., or a process liquid enters between copper foil A1 and copper foil B2, and workability | operativity improves. .

  Examples of the present invention will be described below, but the present invention is not limited to the examples.

  As shown in FIG. 9A, as the prepreg A5, GEA-679FG (manufactured by Hitachi Chemical Co., Ltd., trade name, nominal thickness 30 μm), as the peelable copper foil 3, the carrier copper foil A1 having a thickness of 35 μm and the pole having a thickness of 3 μm. 3FD-P3 / 35 (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) on which thin copper foil B2 is bonded, and prepreg B6 as GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd., nominal thickness 60 μm), copper foil C4 MT-18S5DH (Mitsui Metal Mining Co., Ltd., trade name, thickness 5 μm) was constructed. Thus, as prepreg A5, what was thinner than prepreg B6 was used. Moreover, the size of the peelable copper foil 3 is about 5 mm smaller than the prepregs A5 and B6 laminated on both sides of the peelable copper foil 3, and the peelable copper foil 3 is made of the peelable copper foil 3 The prepregs A and B stacked on both sides of the prepreg were configured so as not to protrude.

  Next, as shown in FIG. 9B, the laminated body 11 with a support material was formed by heating and pressing with a hot press. At this time, the insulating resin of the prepreg A5 flowed out and hardened to the end portion of the laminated body 11 with the support material by lamination using a hot press, and the end portion of the peelable copper foil 3 was sealed (seal portion 20). .

  As shown in FIG. 9C, by removing the copper foil C4 of the laminated body 11 with the support material by etching, an opening for a conformal mask having a diameter of 60 to 80 μm is formed, and a laser is applied to the opening from which the copper foil C4 has been removed. Irradiation was performed to remove the prepreg B6 to form an interlayer connection hole 12.

  As shown in FIG. 9C, a copper plating process was performed, and the interlayer connection hole 12 was filled with a copper plating 13 using filled plating to form an interlayer connection 18 and a conductor layer 19.

  As shown in FIG. 9C, the end of the outer periphery of the laminated body 11 with the support material on which the interlayer connection 18 is formed is cut along the cutting line 14, and the laminated body 17 from between the copper foil A <b> 1 and the copper foil B <b> 2 of the peelable copper foil 3. Separated. At this time, the end of the laminated body 11 with the support body may be cut by about 5 mm, and there was little time and effort for cutting and waste of materials. The size of the laminated body 17 at this time was 600 mm long and 510 mm wide.

  As shown in FIG. 7, the inner layer circuit 15 was formed by circuit processing of the conductor layer 19 by etching.

  As shown in FIG. 8, on the inner layer circuit 15, as prepreg C10, GEA-679FG (manufactured by Hitachi Chemical Co., Ltd., product name; nominal thickness 30 μm), and as copper foil D9, MT-18S5DH (manufactured by Mitsui Mining & Smelting Co., Ltd.) , Product name (thickness: 5 μm) in this order, and heated and pressed with a hot press to bond the prepreg C10 and the copper foil D9 to produce the wiring board 16.

(Comparative example)
As shown in FIG. 1A, a copper-clad laminate 8 (manufactured by Hitachi Chemical Co., Ltd., trade name, MCL-E-679FG, overall thickness 0.2 mm, copper foil thickness 12 μm) is used as a support material. On the copper foil A1 of the laminated plate 8, a slightly smaller copper foil B2 (3EC-M3-VLP, manufactured by Furukawa Circuit Foil Co., Ltd., trade name, thickness 18 μm), prepreg B6 (GEA-679FG, manufactured by Hitachi Chemical Co., Ltd.) , Product name, nominal thickness 60um), copper foil C4 (MT-18S5DH, manufactured by Mitsui Mining & Smelting Co., Ltd., product name, thickness 5 μm). Next, as shown in FIG. 1B, a laminated body 11 with a support material in which the outer peripheral portion of the copper foil B <b> 2 was sealed with the prepreg A <b> 5 was formed by laminating using a hot press. Next, as shown in FIG. 1C, after forming the copper plating 13 to be the interlayer connection hole 12 and the interlayer connection 18, the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14. From 17, the copper-clad laminate 8 as the support material 7 was separated and removed. The size of the laminated body 17 at this time was 510 mm in length and 410 mm in width at the maximum. Next, a wiring board was manufactured from the laminate 17 in the same manner as in the example.

  The area ratio of the laminates produced in Examples and Comparative Examples after separation from the support material and the number of products obtained were compared. The results are shown in Table 1. When compared with the comparative example (conventional method), the examples increased in comparison with the area ratio and the number of products.

  The method for manufacturing a wiring board and the laminated body with a support material of the present invention are industrially effective because the material cost can be reduced by reducing the margin for cutting and removing in the coreless method, and the workability is good.

1: Copper foil A
2: Copper foil B
3: Peelable copper foil 4: Copper foil C
5: Prepreg A
6: Prepreg B
7: Support material 8: Copper-clad laminate 9: Copper foil D
10: Prepreg C
11: Laminated body with support material 12: Interlayer connection hole 13: Copper plating 14: Cutting line 15: Inner layer circuit 16: Wiring board 17: Laminate body 18: Interlayer connection 19: Conductive layer 20: Seal portion

Claims (9)

A peelable copper foil having a copper foil A and a copper foil B is arranged on both sides of the prepreg A, and a prepreg B and a copper foil C are arranged on both sides and laminated to form a laminated body with a support material. have a step (1), in the step (1), as a prepreg a, method for manufacturing a wiring board to use a thinner than prepreg B.   A peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A of claim 1, and a prepreg B and a copper foil C are further disposed on both sides and laminated. A step (1) of forming a body, a step (2) of forming an interlayer connection hole from the copper foil C to the copper foil B of the laminate with a support material, an interlayer connection hole of the laminate with a support material, and Forming a copper plating on the copper foil B, thereby forming an interlayer connection for connecting the copper foil C and the copper foil B, and a conductor layer having the copper foil C and the copper plating (3); The manufacturing method of the wiring board which has these. 3. The method of manufacturing a wiring board according to claim 1 or 2, wherein in step (1), the size of the peelable copper foil is smaller than the prepregs A and B arranged on both sides of the peelable copper foil. In Claim 1 in any one of Claim 1 to 3 , manufacture of the wiring board comprised so that a peelable copper foil may not protrude from the prepregs A and B laminated | stacked on both sides of this peelable copper foil in process (1). Method. In any one of claims 1 to 4, in step (1), around the peelable copper foil, the prepreg A laminated on both sides of the peelable copper foil, a manufacturing method of a wiring board is sealed by B. It is a laminate with a support material in which a peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A, and a prepreg B and a copper foil C are further disposed on both sides and laminated . A laminate with a support material, wherein the thickness of the prepreg A is thinner than that of the prepreg B. The laminate with a support material according to claim 6 , wherein the size of the peelable copper foil is smaller than that of the prepregs A and B disposed on both sides of the peelable copper foil. 8. The laminated body with a support material according to claim 6 or 7, wherein the peelable copper foil is configured not to protrude from the prepregs A and B laminated on both sides of the peelable copper foil. The laminated body with a support material according to any one of claims 6 to 8 , wherein the periphery of the peelable copper foil is sealed by the prepregs A and B laminated on both sides of the peelable copper foil.

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