JP6340693B2 - Substrate holding device, contact exposure device, and proximity exposure device - Google Patents

Description

  The present invention relates to a substrate holding apparatus, a contact exposure apparatus, and a proximity exposure apparatus, and more particularly, a substrate holding apparatus capable of adsorbing and holding with good flatness even if the substrate has warpage or deformation, and the like. The present invention relates to a contact exposure apparatus and a proximity exposure apparatus.

In order to respond to the demand for miniaturization of mobile devices, etc., in semiconductor mounting technology, the integrated circuit is densified by wafer level packaging, and the chip on which the integrated circuit is mounted is three-dimensionally laminated. Die cutting of stacked chips
) And then into individual pieces. When manufacturing such a chip, exposure is performed in a state where an integrated circuit or electrical wiring mounted on a wafer is covered with a resin (polyamideimide or the like), but it is necessary to thermally cure the resin. When the substrate is sucked and held by the holding device, the holding force and the flatness may be lowered.

  Conventionally, it has a mounting surface on which a plurality of partial protrusions are formed on the entire surface, on which a substrate is mounted, and the recesses around the protrusions are sucked down from the atmospheric pressure to adsorb the back surface of the substrate. A substrate suction device and an exposure device are disclosed (for example, see Patent Document 1). In Patent Document 1, the distribution of the convex portion is made dense around the concave portion of the mounting surface that is open to the atmospheric pressure between the mounting surface and the substrate, so that the warp when the substrate is adsorbed, particularly effective. The warp that occurs in the adjacent part between the part where the attractive adsorption force works and the part that does not work is made as small as possible.

  In addition, since the support unit that supports the substrate at a plurality of locations includes a plurality of support members made of spheres that are in point contact or line contact with the substrate, it is easy to match the substrate to the focal plane. A substrate holder and an exposure apparatus that cause little damage are known (see, for example, Patent Document 2).

Japanese Patent Laid-Open No. 10-50810 JP 11-330216 A

  By the way, in Patent Document 1, the suction holes formed in the respective recesses (annular) and arranged in the radial direction are connected to a vacuum source through one sleeve-like hole extending in the radial direction in the holder, The pressure inside the recess is reduced to adsorb the back surface of the substrate, suppressing deterioration of flatness that tends to occur in the adjacent part between the part that receives the vacuum suction force and the part that does not receive the vacuum, and warping caused by vacuum suction The amount of deflection is suppressed. However, in the case of a substrate having warpage or deformation, the degree of vacuum cannot be sufficiently increased, and the flatness may not be sufficiently corrected.

  Further, Patent Document 2 supports the substrate in a state of point contact or line contact with the support member, reduces the possibility that dust is interposed between the support member and the substrate, and deteriorates local flatness. Although the mounting surface is prevented from being damaged, there is a problem that the structure of the support member is complicated and the cost is increased.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a substrate holding apparatus and contact exposure that can correct the flatness of a substrate having warpage or deformation with a relatively simple configuration. An apparatus and a proximity exposure apparatus are provided.

The above object of the present invention can be achieved by the following constitution.
(1) A substrate holding device that holds a substrate by suction onto a substrate holding unit,
The substrate holding unit includes a plurality of recesses independent of each other on a substrate mounting surface on which the substrate is mounted,
A vacuum mechanism capable of sucking the air in each recess downward and independently reducing the pressure in each recess ;
In the case of the substantially convex substrate in which the central portion of the substrate tends to be separated from the substrate mounting surface, the decompression mechanism sucks and holds the entire suction range of the substrate, and then sucks in the concave portion in the center. In this state, the substrate is adsorbed at a portion other than the central concave portion, and further, the pressure in each concave portion is sequentially reduced from the central concave portion toward the outer peripheral concave portion. An apparatus for holding a substrate, wherein the substrate holding unit is held by suction .
(2) A substrate holding device that holds the substrate by suction onto the substrate holding unit,
The substrate holding unit includes a plurality of recesses independent of each other on a substrate mounting surface on which the substrate is mounted,
A vacuum mechanism capable of sucking the air in each recess downward and independently reducing the pressure in each recess;
In the case of the substantially convex shaped substrate in which the central portion of the substrate tends to be separated from the substrate mounting surface, the decompression mechanism moves from the concave portion on the outer peripheral side of the substrate holding portion toward the concave portion in the center. The pressure in each of the recesses is sequentially reduced and the substrate is sucked and held on the substrate holding part, and then the center of the substrate holding part is removed from the outer side recess while maintaining the suction in the center recess. The suction of the substrate is sequentially released toward the concave portion, and further, the pressure in each concave portion is successively reduced again from the central concave portion toward the concave portion on the outer peripheral side, so that the substrate becomes the substrate holding portion. holding device board characterized in that retaining suction.
(3) The substrate holding device according to (1) or (2) , wherein the substrate mounting surface is configured by a plurality of annular convex portions arranged substantially concentrically in a plan view.
(4) Each of the pressure reducing mechanisms includes at least one suction hole that opens to each of the recesses in order to suck the air in each of the recesses.
4. The substrate holding device according to any one of (1) to (3), wherein a total opening area of the suction holes in each of the recesses is changed according to a size of an adsorption area of each of the recesses.
(5) The substrate holding device according to any one of (1) to (4) ,
A mask holding unit for holding a mask having a pattern to be exposed on the lower surface and holding a cover glass on the upper surface side;
A pressurizing mechanism for increasing the pressure in a sealed space defined by the mask holding unit, the mask, and the cover glass;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
An adhesion exposure apparatus, wherein the pressure of the sealed space is increased to press the mask against the substrate while being bent toward the substrate, and the substrate is held by the substrate holder.
(6) The mask includes a convex portion that presses the substrate on a lower surface of the mask on the substrate side and in a region other than the pattern,
The contact exposure apparatus according to (5) , wherein the convex portion is pressed against the substrate and is held by the substrate holder.
(7) The substrate holding device according to any one of (1) to (4) ,
A mask holding unit for holding a mask having a pattern to be exposed on the lower surface;
A sealing member that surrounds the mask and the substrate and is provided between the mask holding unit and the substrate holding unit;
A pressurizing mechanism for increasing the pressure in a sealed space surrounded by the mask, the mask holding unit, the substrate holding unit, and the sealing member;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
A proximity exposure apparatus, wherein the substrate is held by the substrate holder by increasing the pressure in the sealed space.
(8) The substrate holding device according to any one of (1) to (4) ,
A mask holding part for holding a mask having a pattern to be exposed and having a hollow part into which gas can be injected on the lower surface;
A gas supply mechanism for supplying gas to the hollow portion of the mask;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
A proximity exposure apparatus, wherein the flatness of the mask is adjusted by adjusting the pressure of the hollow portion of the mask by the gas supply mechanism.

According to the substrate holding device of the present invention, the substrate holding unit includes a plurality of independent recesses on the substrate mounting surface on which the substrate is mounted, and sucks air in each recess downward, In the case of a substantially convex substrate that has a decompression mechanism that can independently decompress the pressure in the recess, and the central part of the substrate tends to be separated from the substrate mounting surface, the decompression mechanism attracts the entire adsorption range of the substrate. After holding, or gradually reducing the pressure in each recess from the recess on the outer peripheral side of the substrate holding part toward the center recess, the substrate is sucked and held on the substrate holding part, and then sucked in the center recess. While maintaining, the suction of the substrate other than the central concave portion is released, and further, the pressure in each concave portion is sequentially reduced from the central concave portion toward the concave portion on the outer peripheral side, and the substrate is sucked and held on the substrate holding portion. . For this reason, in the case of a substantially convex substrate in which the central portion of the substrate tends to be separated from the substrate mounting surface , the substrate is divided into each concave portion and sucked independently, with a relatively simple configuration, warping and A substrate having deformation or the like can be sucked and held with good flatness.

  Further, according to the contact exposure apparatus of the present invention, the above-described substrate holding device, a mask holding unit that holds a mask having a pattern to be exposed on the lower surface and a cover glass on the upper surface side, and a mask holding unit, A pressure mechanism for increasing the pressure in the sealed space defined by the mask and the cover glass; and a pressure exposure mechanism disposed on the opposite side of the substrate with respect to the mask, and applying pattern exposure light to the substrate through the mask. The illumination optical system for irradiating, and by pressing the mask against the substrate while increasing the pressure in the sealed space, the substrate is held on the substrate holding portion, so that the substrate is more reliably supported. Can be held by the substrate holder, and exposure can be performed with high accuracy.

  Further, according to the proximity exposure apparatus of the present invention, the above-described substrate holding device, a mask holding unit that holds a mask having a pattern to be exposed on the lower surface, the mask and the substrate, and the mask holding unit and the substrate holding unit A mask, a mask holder, a substrate holder, a pressurizing mechanism for increasing the pressure in the sealed space surrounded by the seal member, and a mask opposite to the substrate. And an illumination optical system that irradiates the substrate with light for pattern exposure via a mask, and the substrate is held by the substrate holder by increasing the pressure in the sealed space, so that A board | substrate can be hold | maintained at a board | substrate holding part, and it can expose accurately.

  According to the proximity exposure apparatus of the present invention, the above-described substrate holding apparatus, a mask holding part for holding a mask having a pattern to be exposed and having a hollow part capable of injecting gas on the lower surface, and a mask A gas supply mechanism for supplying gas to the hollow portion of the substrate, and an illumination optical system that is disposed on the opposite side of the substrate with respect to the mask and that irradiates the substrate with light for pattern exposure through the mask. Since the flatness of the mask is adjusted by adjusting the pressure of the hollow portion of the mask by the mechanism, the flatness of the mask M can be changed in accordance with the flatness of the substrate W, and exposure is performed with high accuracy. Can do.

It is sectional drawing along the II line of FIG. 4 which shows the contact | adherence exposure apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing of the board | substrate as a to-be-exposed material. It is sectional drawing of a mask. It is a top view of the board | substrate holding | maintenance part shown in FIG. It is sectional drawing of the proximity exposure apparatus which concerns on 2nd Embodiment of this invention. It is sectional drawing of the proximity exposure apparatus which concerns on 3rd Embodiment of this invention. It is a top view of the board | substrate holding part which concerns on a modification. It is a principal part expanded sectional view of the mask which concerns on another modification.

  Hereinafter, a substrate holding apparatus, a contact exposure apparatus, and a proximity exposure apparatus according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
As shown in FIG. 1, a contact exposure apparatus 20 of the present embodiment includes a holding device 10 that holds a substrate W, a mask holding unit 22 that holds a mask M, a pressurizing mechanism 23, and an illumination optical system (not shown). .

  As shown in FIG. 2, in the substrate W, an integrated circuit 41 such as a CPU and a memory is formed on a silicon wafer 42, and the surface of the integrated circuit 41 is covered with a resin 43 such as polyamideimide. In the substrate W, the flatness of the surface may be unsatisfactory due to warpage that occurs when the resin 43 is thermally cured, or unevenness due to the height difference of the integrated circuit 41 or the like.

  Further, as shown in FIG. 3, the mask M is manufactured from a thin non-alkali glass plate or quartz glass plate having a thickness of about 0.3 to 0.7 mm, which has a small coefficient of thermal expansion and little warpage due to heat. A pattern P to be exposed is formed on the lower surface (substrate W side). Further, on the lower surface of the mask M, a resist adhesion preventing film 45 made of an antifouling film such as a fluorine resin film formed by coating a solvent in which a fluorine resin is used is provided.

  The substrate holding device 10 includes a substrate holding unit 21 that holds the substrate W, and a decompression mechanism 29. As shown in FIGS. 1 and 4, the substrate holding portion 21 has a larger diameter than, for example, a circular plate-like substrate W, is formed of a metal, a ceramic material, or the like, and a substrate placement surface on which the substrate W is placed. A plurality of annular convex portions 24a, 24b, and 24c are concentrically formed.

  Adjacent annular protrusions 24a, 24b, 24c are connected by four ribs 25 extending in the radial direction at 90 ° intervals. Further, a circular and hollow sealing member 27 made of an elastic material such as rubber is disposed on the upper surfaces of the annular convex portions 24a, 24b, and 24c. The heights of the annular protrusions 24a, 24b, 24c and the ribs 25 are preferably the same. Further, the sealing member 27 may be disposed on the upper surface of the rib 25.

  In other words, a circular groove 26a which is a concave portion of the present invention is formed at the center of the annular convex portion 24a, and the annular groove 26b is formed between the annular convex portions 24a and 24b and between the annular convex portions 24b and 24c. , 26c are formed. The annular grooves 26b and 26c are further divided into four by four ribs 25 extending in the radial direction to form arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 which are the recesses of the present invention. The circular groove 26a and the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 are independent of each other.

  At the bottom of the circular groove 26a and the four divided annular grooves 26b and 26c (arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4), suction holes 28 are formed downward, and pressure reducing mechanisms 29 such as vacuum pumps are respectively provided. It is connected to the. The decompression mechanism 29 sucks the air in the circular grooves 26a and the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 downward, so that the substrate W placed on the substrate holding portion 21, the circular grooves 26a, and A space surrounded by the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 is set to a negative pressure, and the substrate W is uniformly adsorbed and held in the circular groove 26a and the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4.

The pressure reducing mechanism 29 connected to the circular groove 26a and each of the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 can be independently controlled. Each pressure in the inside is controlled independently.
The circular groove 26a and the circular arc grooves 26b1 to 26b4 and 26c1 to 26c4 may be appropriately grouped.
Further, the suction holes 28 formed in the grooves 26a, 26b1 to 26b4, 26c1 to 26c4 may be configured by pipes facing the grooves 26a, 26b1 to 26b4, 26c1 to 26c4.
The substrate holding unit 21 is configured to be able to move the substrate W up and down by pins (not shown) or the like.

  In such a substrate holding device 10, after the substrate W is placed on the substrate holding unit 21, the pressure in the circular groove 26 a and the annular grooves 26 b and 26 c is negatively held by the pressure reducing mechanism 29 to hold the substrate W by suction. To do.

  Specifically, as shown in FIG. 1, in the case of a substantially concave substrate W in which the peripheral portion of the substrate W tends to be separated from the substrate mounting surface, the decompression mechanism 29 is arranged at the center of the substrate holding unit 21. The pressure is gradually reduced from the circular groove 26 a toward the outer peripheral annular grooves 26 b and 26 c, and the substrate W is sucked and held on the substrate holding portion 21 from the center of the substrate holding portion 21 toward the peripheral portion. Thereby, the substrate W can be sucked and held with good flatness.

  Although not shown, in the case of a substantially convex substrate W in which the central portion of the substrate W tends to be separated from the substrate mounting surface, the decompression mechanism 29 is provided with an annular groove 26c ( The pressure is gradually reduced from the arc-shaped grooves 26c1 to 26c4) toward the central circular groove 26a, and the substrate is held by suction to the substrate holding portion 21 from the outer peripheral side of the substrate W. Thereby, first, after the outer peripheral side of the substrate W that is close to the upper surface of the substrate holding portion 21 is adsorbed by the annular groove 26c (arc-shaped grooves 26c1 to 26c4), the substrate W is sequentially adsorbed toward the center. Adsorb and hold the entire surface. As a result, it is possible to suck the substrate W having a shape that is difficult to be sucked from the central circular groove 26 a that is separated from the upper surface of the substrate holding portion 21.

  However, in this state, adsorption strain may remain on the adsorbed substrate W, so that the adsorption in the annular grooves 26b and 26c is performed while maintaining the adsorption in the circular groove 26a in the center. After releasing the suction strain in order of the annular groove 26b, the pressure is reduced again toward the annular groove 26c on the outer peripheral side, and the entire surface of the substrate W is suction-held on the substrate holding portion 21. Thereby, the substrate W can be sucked and held on the substrate holding portion 21 in a state where there is no suction strain and the flatness is good.

  If the pressure in the circular groove 26a and each of the arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 is independently controlled according to the deformed shape such as strain of the substrate W, the flatness of the substrate W can be further increased. Can be adjusted. For example, the flatness of the sucked area is measured by a sensor (not shown), and the pressure in the corresponding suction groove is adjusted by the decompression mechanism 29 so that the flatness is equal to or less than an allowable value. Next, the same operation is repeated in adjacent suction areas, and sequentially performed over the entire surface of the substrate W, so that the substrate holding portion 21 is sucked and held with good flatness.

  In the above embodiment, the circular substrate W is described as being sucked and held by the circular substrate holding unit 21. However, the substrate W is rectangular so that chips can be efficiently created during dicing. Also good. In this case, the substrate mounting surface is composed of a plurality of convex portions arranged in a rectangular shape in plan view, and the suction area is a rectangular central portion and a rectangular annular concave portion arranged around the central portion. The annular recess may be divided by a rib.

  The number and size of the circular grooves 26a and the respective arc-shaped grooves 26b1 to 26b4 and 26c1 to 26c4 are determined so that the amount of bending of the substrate W attracted and held by the substrate holding portion 21 is equal to or less than the allowable amount of bending. The width and the number of divisions in the circumferential direction of 26a and annular grooves 26b and 26c are determined. The amount of bending of the substrate W can be calculated by calculation from the rigidity of the substrate W, the pressure (negative pressure) of the circular groove 26a and the annular grooves 26b and 26c, the width of the circular groove 26a and the annular grooves 26b and 26c, and the like.

  In the mask holding part 22, the mask M is airtightly fixed to the lower surface 22a, and the cover glass 30 is airtightly fixed to the upper surface 22b so as to cover the opening of the mask holding part 22. Thereby, the sealed space 31 closed from the outside by the mask holding part 22, the mask M, and the cover glass 30 is defined. A ventilation hole 32 communicating with the sealed space 31 is formed in the mask holding part 22, and the ventilation hole 32 is connected to the pressurizing mechanism 23.

  The pressurizing mechanism 23 is configured by a blower pump or the like, and increases the pressure in the sealed space 31 by controlling the pressure of air supplied from the pressurizing mechanism 23.

  In the contact exposure apparatus 20 configured as described above, after the substrate W is first placed on the substrate holding portion 21, the pressure in the circular groove 26 a and the annular grooves 26 b and 26 c is reduced to a negative pressure by the decompression mechanism 29. Adsorb and hold W. At this time, the warpage and deformation of the substrate W can be corrected by independently controlling the pressure in the circular groove 26a and the annular grooves 26b and 26c.

Next, air is supplied from the pressurizing mechanism 23 to increase the pressure in the sealed space 31 to bend the mask M toward the substrate W, and then the mask holding unit 22 is lowered to press the mask M against the substrate W. . Here, since the mask M is designed to be flexible because it is thin, it can closely follow the surface shape of the upper surface of the substrate W. Further, since the resist adhesion preventing film 45 is provided on the mask M, contamination of the mask M can be suppressed even if the mask M is adhered to the substrate W. Thereby, the substrate W can be reliably held by the substrate holding part 21. Then, by irradiating the substrate W with light for pattern exposure through the mask M by the illumination optical system, exposure with high accuracy can be performed.
Note that the mask M can be held on the substrate W without positive pressure in the sealed space 31.

  As described above, according to the substrate holding apparatus 10 of this embodiment, the substrate holding unit 21 has the plurality of independent grooves 26a, 26b, and 26c on the substrate mounting surface on which the substrate W is mounted. And a decompression mechanism 29 that sucks air in the grooves 26a, 26b, and 26c downward and can independently reduce the pressure in the grooves 26a, 26b, and 26c. , 26b, and 26c and sucked independently, and the substrate W having warpage or deformation can be sucked and held with good flatness.

  Further, since the substrate mounting surface is constituted by a plurality of annular convex portions 24a, 24b, and 24c arranged in a substantially concentric shape in a plan view, in particular, the circular substrate W can be attracted and held satisfactorily.

  Further, when the peripheral portion of the substrate W is a substantially concave substrate in which the decompression mechanism 29 tends to be separated from the substrate mounting surface, the arc-shaped groove 26b1 on the outer peripheral side from the circular groove 26a in the center of the substrate holding portion 21 is provided. The pressure in each of the grooves 26a, 26b1 to 26b4, 26c1 to 26c4 is sequentially reduced toward 26b4, 26c1 to 26c4, and the substrate W is sucked and held on the substrate holding part 21. Thereby, even if the substrate W has a substantially concave shape, it can be reliably sucked and held with good flatness.

  In the case where the central portion of the substrate W is a substantially convex substrate in which the central portion of the substrate W tends to be separated from the substrate mounting surface, the decompression mechanism 29 is changed from the circular arc grooves 26c1 to 26c4 on the outer peripheral side of the substrate holding portion 21 to the central circular groove. 26a, the pressure in each of the grooves 26a, 26b1 to 26b4, 26c1 to 26c4 is successively reduced, and the substrate W is sucked and held on the substrate holding portion 21, and then the outer periphery of the circular groove 26a is maintained while being sucked. The suction of the substrate W is sequentially released from the circular arc grooves 26c1 to 26c4 on the side toward the central circular groove 26a, and further, the circular grooves 26a to 26c4 on the outer peripheral side are changed from the central circular groove 26a of the substrate holding portion 21. Then, the pressure in each of the grooves 26a, 26b1 to 26b4, 26c1 to 26c4 is sequentially reduced again, and the substrate W is sucked and held on the substrate holding portion 21. As a result, even if the substrate W has a substantially convex shape, it can be securely sucked and held with good flatness.

  In addition, the substrate mounting surface is configured by a plurality of annular convex portions arranged in a rectangular shape in plan view, so that the rectangular substrate W can be favorably held.

In the case of a substantially convex substrate in which the central portion of the substrate W tends to be separated from the substrate placement surface, the substrate W may be adsorbed by the following method. That is, first, when the entire adsorption range of the substrate W is adsorbed at a time, and the adsorbing can be performed, the adsorbing by the surrounding arc grooves 26b1 to 26b4 and 26c1 to 26c4 is performed while maintaining the adsorbing of the central circular groove 26a. Open. Thereafter, the pressure in each of the grooves 26b1 to 26b4 and 26c1 to 26c4 is sequentially reduced again toward the arc-shaped grooves 26c1 to 26c4 on the outer peripheral side, and the substrate W is sucked and held on the substrate holding portion 21. Good.
If the entire suction range of the substrate W cannot be sucked at once, a suction error is determined. In this case, a pressure gauge (not shown) may be provided in the central circular groove 26a, and the adsorption state may be confirmed by pressure.

  Furthermore, according to the contact exposure apparatus 20 of the present embodiment, the substrate holding apparatus 10 and the mask holding unit 22 that holds the mask M having the pattern to be exposed on the lower surface 22a and holds the cover glass 30 on the upper surface 22b side. And a pressurizing mechanism 23 for increasing the pressure in the sealed space 31 defined by the mask holding part 22, the mask M, and the cover glass 30; An illumination optical system that irradiates the substrate W with light for pattern exposure via the mask M, and increases the pressure in the sealed space 31 to deflect the mask M toward the substrate W. Since the substrate W is pressed and held by the substrate holding unit 21, the substrate W can be held more securely by the substrate holding unit 21 and exposure can be performed with high accuracy.

(Second Embodiment)
As shown in FIG. 5, the proximity exposure apparatus 60 of the present embodiment surrounds the mask M and the substrate W by holding the substrate 10, the mask holding unit 72 that holds the mask M, and the mask holding unit 72. Air is supplied through the sealing member 13 having a hollow cross section provided between the substrate holding portion 21 and the through-hole 33 formed in the mask holding portion 72, and the mask M, the mask holding portion 72, and the substrate holding portion 21 are supplied. And a pressurizing mechanism 61 for increasing the pressure in the sealed space 16 surrounded by the sealing member 13, and an illumination optical system (not shown).

  In the proximity exposure apparatus 60 of the present embodiment, unlike the contact exposure apparatus 20, exposure is performed by irradiating the mask M with exposure light in a state where the mask M and the substrate W face each other with a predetermined gap therebetween. Is called. That is, the substrate holding device 10 of the present invention can be applied not only to the contact exposure apparatus 20 but also to the proximity exposure apparatus 60. Further, in the proximity exposure apparatus 60, the pressure in the sealed space 16 is increased by the pressurizing mechanism 61, whereby the substrate W can be held by the substrate holding unit 21, and the substrate W can be more reliably held by the substrate holding unit. 21 and can be exposed accurately.

(Third embodiment)
As shown in FIG. 6, the proximity exposure apparatus 60 of this embodiment includes a holding device 10 that holds a substrate W, a mask holding unit 73 that holds a mask M1, and an illumination optical system (not shown).
In the present embodiment, a mask M1 having a pattern to be exposed and having a hollow portion Mb into which gas can be injected is used. Then, the through hole 34 formed in the mask holding portion 73 and the hollow portion Mb of the mask M1 are communicated, and the gas is supplied to the hollow portion Mb of the mask M1 by the gas supply mechanism 62 to adjust the pressure of the hollow portion Mb. By performing (increasing or depressurizing), the flatness of the mask M1 can be adjusted. Therefore, the substrate W can be held by the substrate holding unit 21 with good flatness by the substrate holding device 10 similar to that of the first embodiment, and a gas is supplied to the hollow portion Mb of the mask M1. The flatness of the mask M1 can be changed in accordance with the flatness of the substrate W, and exposure can be performed with higher accuracy.

  Note that the present invention is not limited to the above-described embodiments and examples, and modifications, improvements, and the like can be made as appropriate.

  In the substrate holding part 21 of the above embodiment, one suction hole 28 having the same opening area is provided for each of the grooves 26a, 26b1 to 26b4 and 26c1 to 26c4. For example, at least one suction hole 28 is provided for each of the grooves 26a, 26b1 to 26b4 and 26c1 to 26c4. It arrange | positions for every groove | channel 26a, 26b1-26b4, 26c1-26c4, and the total opening area of the suction hole 28 in each groove | channel 26a, 26b1-26b4, 26c1-26c4 is the adsorption area of each groove | channel 26a, 26b1-26b4, 26c1-26c4. You may make it change according to the magnitude | size of.

Specifically, as shown in FIG. 7A, suction holes 28 having different opening areas may be arranged one by one in each of the grooves 26a, 26b1 to 26b4 and 26c1 to 26c4. In this case, the suction area increases in the order of the circular groove 26a, the arc-shaped grooves 26b1 to 26b4, and the arc-shaped grooves 26c1 to 26c4. The arc-shaped grooves 26c1 to 26c4 are increased in order.
Or as shown in FIG.7 (b), you may make it change the number of the suction holes 28 with the same opening area for every groove | channel 26a, 26b1-26b4, 26c1-26c4. In this case, the number of suction holes 28 is increased in the order of the circular groove 26a, the arc-shaped grooves 26b1 to 26b4, and the arc-shaped grooves 26c1 to 26c4.
In addition, what is necessary is just to change a piping diameter or the number of piping, when the suction hole 28 is comprised with piping. It is also possible to set the suction force appropriately by changing both the pipe diameter and the number of pipes.

For example, in the above-described embodiment, when the mask M is pressed against the substrate W, a portion where the mask M does not contact the substrate W may occur depending on the shape of the substrate W. For this reason, as shown in FIG. 8, the mask M may be provided with a convex portion Ma on the lower surface of the mask M corresponding to a portion that does not have the exposure pattern P and is difficult to contact the substrate W. In the figure, Pa indicates chrome plating for forming the exposure pattern P. Thus, when the mask M is pressed against the substrate W, the portion of the convex portion Ma that is difficult to contact with the substrate W is pressed and securely held by the substrate holder 21.
The convex portion Ma may be formed by bonding or the like after the pattern is baked on the mask M. Further, a resist adhesion preventing film 45 may be formed at the tip of the convex portion Ma to prevent adhesion of the resist. Further, the resist adhesion preventing film 45 may be provided on the entire lower surface of the mask including the convex portion Ma.

DESCRIPTION OF SYMBOLS 10 Substrate holding | maintenance apparatus 20 Contact | adherence exposure apparatus 21 Substrate holding | maintenance part 22,72,73 Mask holding | maintenance part 22a Lower surface 22b Upper surface 23 Pressurization mechanism 24a, 24b, 24c Annular convex part 26a Circular groove (concave part)
26b1 to 26b4, 26c1 to 26c4 arc-shaped grooves (recesses)
29 Depressurization mechanism 30 Cover glass 31 Sealed space 60 Proximity exposure device 61 Gas supply mechanism M, M1 Mask Ma Convex part Mb Hollow part W Substrate

Claims (8)

A substrate holding device that holds a substrate by suction onto a substrate holding unit,
The substrate holding unit includes a plurality of recesses independent of each other on a substrate mounting surface on which the substrate is mounted,
A vacuum mechanism capable of sucking the air in each recess downward and independently reducing the pressure in each recess ;
In the case of the substantially convex substrate in which the central portion of the substrate tends to be separated from the substrate mounting surface, the decompression mechanism sucks and holds the entire suction range of the substrate, and then sucks in the concave portion in the center. In this state, the substrate is adsorbed at a portion other than the central concave portion, and further, the pressure in each concave portion is sequentially reduced from the central concave portion toward the outer peripheral concave portion. An apparatus for holding a substrate, wherein the substrate holding unit is held by suction . A substrate holding device that holds a substrate by suction onto a substrate holding unit,
The substrate holding unit includes a plurality of recesses independent of each other on a substrate mounting surface on which the substrate is mounted,
A vacuum mechanism capable of sucking the air in each recess downward and independently reducing the pressure in each recess;
In the case of the substantially convex shaped substrate in which the central portion of the substrate tends to be separated from the substrate mounting surface, the decompression mechanism moves from the concave portion on the outer peripheral side of the substrate holding portion toward the concave portion in the center. The pressure in each of the recesses is sequentially reduced and the substrate is sucked and held on the substrate holding part, and then the center of the substrate holding part is removed from the outer side recess while maintaining the suction in the center recess. The suction of the substrate is sequentially released toward the concave portion, and further, the pressure in each concave portion is successively reduced again from the central concave portion toward the concave portion on the outer peripheral side, so that the substrate becomes the substrate holding portion. holding device board characterized in that retaining suction. The substrate mounting surface, the holding device substrate according to claim 1 or 2, characterized in that it is constituted by a plurality of annular convex portions arranged in substantially concentric circles in a plan view. The decompression mechanism includes at least one suction hole that opens in each of the recesses in order to suck air in each of the recesses,
The substrate holding device according to claim 1, wherein a total opening area of the suction holes in each of the recesses is changed according to a size of an adsorption area of each of the recesses. The substrate holding device according to any one of claims 1 to 4 ,
A mask holding unit for holding a mask having a pattern to be exposed on the lower surface and holding a cover glass on the upper surface side;
A pressurizing mechanism for increasing the pressure in a sealed space defined by the mask holding unit, the mask, and the cover glass;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
An adhesion exposure apparatus, wherein the pressure of the sealed space is increased to press the mask against the substrate while being bent toward the substrate, and the substrate is held by the substrate holder. The mask includes a convex-shaped portion that presses the substrate in a region other than the lower surface of the mask on the substrate side and the pattern,
The contact exposure apparatus according to claim 5 , wherein the convex shape portion presses the substrate to be held by the substrate holding portion. The substrate holding device according to any one of claims 1 to 4 ,
A mask holding unit for holding a mask having a pattern to be exposed on the lower surface;
A sealing member that surrounds the mask and the substrate and is provided between the mask holding unit and the substrate holding unit;
A pressurizing mechanism for increasing the pressure in a sealed space surrounded by the mask, the mask holding unit, the substrate holding unit, and the sealing member;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
A proximity exposure apparatus, wherein the substrate is held by the substrate holder by increasing the pressure in the sealed space. The substrate holding device according to any one of claims 1 to 4 ,
A mask holding part for holding a mask having a pattern to be exposed and having a hollow part into which gas can be injected on the lower surface;
A gas supply mechanism for supplying gas to the hollow portion of the mask;
An illumination optical system disposed on the opposite side of the substrate with respect to the mask and irradiating the substrate with light for pattern exposure via the mask;
With
A proximity exposure apparatus, wherein the flatness of the mask is adjusted by adjusting the pressure of the hollow portion of the mask by the gas supply mechanism.

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