JP6268865B2 - Inspection method, inspection system, and inspection substrate - Google Patents

Description

  The present invention relates to an inspection method, an inspection system, and an inspection substrate, and more particularly to an inspection method, an inspection system, and an inspection substrate for an optical transmission module including a plurality of light emitting elements and a plurality of light receiving elements.

  As an invention related to a conventional inspection method, for example, an optoelectronic circuit board described in Patent Document 1 is known. The optoelectronic circuit board includes a first optical module, a second optical module, and a circuit board. The first optical module includes a first light emitting element and a first light receiving element, and is mounted on a circuit board. The second optical module includes a second light emitting element and a second light receiving element, and is mounted on a circuit board. The circuit board is provided with a first optical waveguide that connects the first light emitting element and the second light receiving element, and a second optical waveguide that connects the second light emitting element and the first light receiving element. It has been. In addition, a branch optical waveguide branches from the first optical waveguide, and a merged optical waveguide branches from the second optical waveguide.

  In the optoelectronic circuit board as described above, the first light emitting element is output by causing the first light emitting element to output the inspection optical signal and determining whether or not the inspection optical signal has been output from the branch optical waveguide. The first light emitting element can be inspected. Further, by inputting an inspection optical signal to the converging optical waveguide and determining whether or not the first light receiving element has received the inspection optical signal, the second optical waveguide and the first light receiving element are Inspection can be performed.

  By the way, in the optoelectronic circuit board described in Patent Document 1, one inspection apparatus is required to inspect the first system composed of the first light emitting element, the second light receiving element, and the first optical waveguide. One inspection device is required to inspect the second system composed of the two light emitting elements, the first light receiving element, and the second optical waveguide. That is, in order to inspect the first system and the second system simultaneously, two inspection devices are required. Further, as the number of systems increases, the number of inspection devices required increases accordingly. As a result, inspection facilities increase.

JP 2008-225185 A

  Accordingly, an object of the present invention is to provide an inspection method, an inspection system, and an inspection board capable of inspecting an optical transmission module having a plurality of transmission / reception systems without increasing inspection facilities.

  An inspection method according to an aspect of the present invention is an inspection method for an optical transmission module that includes a plurality of transmission units including light emitting elements and a plurality of reception units including light receiving elements, and is connected to one end of an optical transmission path. In addition, all the transmission units and all the reception units included in at least one of the optical transmission modules are alternately connected in series by optical transmission lines and electrical wiring, and are located at one end. An inspection electrical signal is input to the transmission unit, and an inspection electrical signal output from the reception unit located at the other end is received.

  An inspection system according to an aspect of the present invention is included in an optical transmission module including a plurality of transmission units including a light emitting element and a plurality of reception units including a light receiving element, and at least one of the optical transmission modules. All the transmitting units and all the receiving units are connected in series alternately by optical transmission lines and electric wiring, and the transmitting unit located at one end is made to input an electrical signal for inspection, And an inspection device that receives an electrical signal for inspection output from the receiving unit located at the other end.

An inspection substrate according to an aspect of the present invention includes a plurality of transmission units including light emitting elements and a plurality of reception units including light receiving elements, and is used for inspection of an optical transmission module connected to one end of an optical transmission path. A mounting portion to which the optical transmission module is attached, a first external terminal, the predetermined transmission portion of the optical transmission module to be attached to the mounting portion, and the first external terminal. A first electrical wiring to be connected, a second external terminal, a second electrical wiring for connecting the predetermined receiving part of the optical transmission module attached to the attachment part and the second external terminal, A plurality of third electrics that combine and connect the transmitting unit and the receiving unit except for the predetermined transmitting unit and the predetermined receiving unit of the optical transmission module mounted on the mounting unit. It comprises a line, and characterized.

  According to the present invention, it is possible to inspect an optical transmission module including a plurality of transmission / reception systems without increasing inspection equipment.

1 is an external perspective view of an optical transmission module according to an embodiment of the present invention. It is a disassembled perspective view of the receptacle which concerns on one Embodiment of this invention. FIG. 3 is an external perspective view of the receptacle of FIG. 2 viewed from the negative direction side in the z-axis direction. It is a cross-section figure of an optical transmission module. It is a block diagram of the inspection system of an optical transmission module. It is a lineblock diagram of an inspection board of an inspection system. It is a block diagram of an inspection system. It is a lineblock diagram of the inspection system concerning the 1st modification. It is a block diagram of the test | inspection board | substrate which concerns on a 2nd modification. It is a block diagram of the test | inspection system which concerns on a 3rd modification.

  The optical transmission module inspection method, inspection system, and inspection substrate according to an embodiment of the present invention will be described below.

(Configuration of optical transmission module)
Hereinafter, configurations of a receptacle and an optical transmission module according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of an optical transmission module 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the receptacle 20 according to the embodiment of the present invention. 3 is an external perspective view of the receptacle 20 of FIG. 2 as viewed from the negative direction side in the z-axis direction. FIG. 4 is a cross-sectional structure diagram of the optical transmission module 10.

  Note that the vertical direction of the light transmission module 10 is defined as the z-axis direction, and the direction along the long side of the light transmission module 10 when viewed in plan from the z-axis direction is defined as the x-axis direction. Furthermore, the direction along the short side of the optical transmission module 10 is defined as the y-axis direction. The x axis, the y axis, and the z axis are orthogonal to each other.

  As shown in FIG. 1, the optical transmission module 10 includes a receptacle 20 and a plug 40. The plug 40 is connected to the receptacle 20.

  As shown in FIG. 2, the receptacle 20 includes a metal cap 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a mounting substrate 22, a sealing resin 24, and a drive circuit 26.

  As shown in FIG. 2, the mounting substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Hereinafter, the main surface on the positive side in the z-axis direction of the mounting substrate 22 is referred to as a front surface, and the main surface on the negative direction side in the z-axis direction of the mounting substrate 22 is referred to as a back surface. Further, as shown in FIG. 3, external electrodes E <b> 1 to E <b> 13 are provided on the back surface of the mounting substrate 22.

  The external electrode E1 is provided at the center of the back surface of the mounting substrate 22 and is an electrode that is kept at the ground potential. The external electrodes E2 to E7 are arranged in this order from the negative direction side in the x-axis direction to the positive direction side along the long side on the positive direction side in the y-axis direction of the back surface of the mounting substrate 22. The external electrodes E8 to E13 are arranged in this order from the negative direction side in the x-axis direction to the positive direction side along the long side of the back surface of the mounting substrate 22 on the negative direction side in the y-axis direction. The external electrodes E1 to E13 are in contact with the lands of the circuit board when the optical transmission module 10 is mounted on the circuit board.

  The light receiving element array 50 and the light emitting element array 100 are provided so as to be arranged in this order from the negative direction side in the y axis direction to the positive direction side in the vicinity of the center of the surface of the mounting substrate 22 in the x axis direction. The light emitting element array 50 is a semiconductor element including two diodes 50a and 50b that convert an electrical signal into an optical signal. The light receiving element array 100 is a semiconductor element including two photodiodes 100a and 100b that convert an optical signal into an electric signal.

  In addition, the drive circuit 26 is provided on the front side of the x-axis direction with respect to the light receiving element array 50 and the light emitting element array 100 on the surface of the mounting substrate 22. The drive circuit 26 is a semiconductor circuit element (IC) for driving the light receiving element array 50 and the light emitting element array 100.

  As shown in FIG. 2, the drive circuit 26 has a rectangular shape having long sides parallel to the y-axis direction when viewed in plan from the z-axis direction. The drive circuit 26 and the light receiving element array 50 are connected by wire bonding via a wire. The drive circuit 26 and the light emitting element array 100 are connected by wire bonding via a wire.

  The drive circuit 26 includes two reception circuits 26a and 26b that receive electrical signals input from outside the optical transmission module 10 and drive the diodes 50a and 50b, respectively. Each of the receiving circuits 26a and 26b converts a differential transmission type balanced signal into a single-ended transmission type unbalanced signal and outputs the converted signal to the diodes 50a and 50b. The receiving circuit 26a and the diode 50a constitute the transmitting unit 101a, and the receiving circuit 26b and the diode 50b constitute the transmitting unit 101b.

  The drive circuit 26 includes two transmission circuits 26c and 26d that output electric signals output from the photodiodes 100a and 100b to the outside of the optical transmission module 10, respectively. Each of the transmission circuits 26c and 26d converts the unbalanced signal of the single-end transmission system into a balanced signal of the differential transmission system and outputs it. The receiving circuit 26c and the photodiode 100a constitute the receiving unit 102a, and the receiving circuit 26d and the photodiode 100b constitute the receiving unit 102b.

  The receiving circuit 26a is connected to the external electrodes E2 and E3. The receiving circuit 26b is connected to the external electrodes E5 and E7. The transmission circuit 26c is connected to the external electrodes E11 and E13. The transmission circuit 26d is connected to the external electrodes E8 and E9.

  As shown in FIG. 2, the sealing resin 24 has a substantially rectangular parallelepiped shape, and is provided in a half region on the positive direction side in the x-axis direction on the surface of the mounting substrate 22. Thereby, the sealing resin 24 covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.

  As shown in FIGS. 2 and 4, the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24 so as to cover substantially the entire surface of the mounting substrate 22 and the sealing resin 24. The positioning member 200 is a member for positioning the plug 40 described later and optically coupling the optical fibers 60a to 60d described later with the diodes 50a and 50b and the photodiodes 100a and 100b. It is comprised by the resin of.

  Further, the positioning member 200 is provided with concave portions D1, D2 and convex lenses 230a, 230b, 250a, 250b. The recesses D1 and D2 are respectively provided on the surface of the positioning member 200 on the positive side in the z-axis direction, and overlap the light-emitting element array 50 and the light-receiving element array 100 when viewed in plan from the z-axis direction. Furthermore, the concave portion D1 overlaps the optical axes of the optical fibers 60a and 60b connected to the plug 40 described later when viewed in plan from the x-axis direction. The recess D2 overlaps the optical axes of the optical fibers 60c and 60d connected to the plug 40 described later when viewed in plan from the x-axis direction. Further, as shown in FIG. 4, the recesses D1 and D2 are V-shaped when viewed in plan from the y-axis direction.

  The inner peripheral surfaces on the negative side in the x-axis direction of the recesses D1 and D2 are total reflection surfaces R1 and R2, respectively. The total reflection surfaces R1 and R2 are parallel to the y axis as shown in FIG. Further, the total reflection surfaces R1 and R2 are inclined 45 ° counterclockwise with respect to the z-axis when viewed from the negative side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than the refractive index of air. Accordingly, the laser beams B1 and B2 emitted from the diodes 50a and 50b of the light emitting element array 50 to the positive direction side in the z-axis direction are incident on the positioning member 200 and are moved to the negative direction side in the x-axis direction by the total reflection surface R1. The light is totally reflected and travels through the plug 40 to the optical fibers 60a and 60b. On the other hand, laser beams B3 and B4 emitted from the optical fibers 60c and 60d to the positive side in the x-axis direction are incident on the positioning member 200 through the plug 40, and are moved to the negative direction side in the z-axis direction by the total reflection surface R2. The light is totally reflected and proceeds to the light receiving element array 100.

  As shown in FIG. 4, the convex lenses 230 a and 230 b are provided on the surface of the positioning member 200 on the negative direction side in the z-axis direction. The convex lenses 230a and 230b overlap the diodes 50a and 50b of the light emitting element array 50 when viewed in plan from the z-axis direction. As a result, the convex lenses 230a and 230b face the diodes 50a and 50b and are positioned on the optical paths of the laser beams B1 and B2. Further, the convex lenses 230a and 230b have a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed in a plane perpendicular to the z-axis. Accordingly, the laser beams B1 and B2 emitted from the light emitting element array 50 are condensed or collimated by the convex lenses 230a and 230b.

  As shown in FIG. 4, the convex lenses 250 a and 250 b are provided on the surface of the positioning member 200 on the negative direction side in the z-axis direction. The convex lenses 250a and 250b overlap the photodiodes 100a and 100b of the light receiving element array 100 when viewed in plan from the z-axis direction. As a result, the convex lenses 250a and 250b face the photodiodes 100a and 100b and are positioned on the optical paths of the laser beams B3 and B4. Further, the convex lenses 250a and 250b have a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed in a plan view from a direction orthogonal to the z-axis. Accordingly, the laser beams B3 and B4 emitted from the optical fibers 60c and 60d are condensed or collimated by the convex lenses 250a and 250b.

  As shown in FIGS. 1 and 2, the metal cap 30 is manufactured by bending a single metal plate (for example, SUS301) into a U shape. That is, the metal cap 30 is configured such that the vicinity of the long side on both sides in the y-axis direction of a single rectangular metal plate is bent toward the negative side in the z-axis direction. Thereby, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction, the positive direction side in the y-axis direction, and the negative direction side in the y-axis direction. An opening A3 into which a plug 40 described later is inserted is formed on the negative side of the receptacle 20 in the x-axis direction, as shown in FIG.

  Next, the plug 40 will be described. The plug 40 includes a transmission side plug 42 and a reception side plug 46, and is made of, for example, an epoxy resin or a nylon resin. As shown in FIG. 1, the transmission side plug 42 is provided at one end of the optical fibers 60a and 60b, and the reception side plug 46 is provided at one end of the optical fibers 60c and 60d, as shown in FIG. Further, each of the transmission side plug 42 and the reception side plug 46 is L-shaped when viewed in plan from the z-axis direction. The transmission side plug 42 and the reception side plug 46 are inserted into the receptacle 20 through the opening A3. Thereby, as shown in FIG. 4, the optical fibers 60a to 60d, the diodes 50a and 50b, and the photodiodes 100a and 100b are optically coupled.

(Optical transmission module inspection system)
Next, an inspection system and an inspection method for the optical transmission module 10 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a configuration diagram of the inspection system 70 of the optical transmission module 10. FIG. 6 is a configuration diagram of the inspection board 72 of the inspection system 70. FIG. 7 is a block diagram of the inspection system 70. The x-axis direction, the y-axis direction, and the z-axis direction in FIGS. 5 and 6 coincide with the x-axis direction, the y-axis direction, and the z-axis direction in FIG.

  As shown in FIG. 5, the inspection system 70 includes an optical transmission module 10, optical fibers 60 e and 60 f, an inspection substrate 72, electric wirings 74 and 76, and an inspection device 98.

  As shown in FIG. 6, the inspection board 72 includes a board body 73, a mounting portion 75, wirings 78, 80, 82, 84, 86, 88, 90, 92 and external terminals T1 to T8.

  The board body 73 is a hexagonal plate-like circuit board and is made of, for example, glass epoxy. Hereinafter, the main surface on the positive side in the z-axis direction of the substrate body 73 is referred to as a front surface, and the main surface on the negative direction side in the z-axis direction of the substrate body 73 is referred to as a back surface. The external terminals T1 to T8 are provided on the outer edge of the substrate body 73.

  The attachment portion 75 is a rectangular region provided on the surface of the substrate body 73, and the light transmission module 10 is attached to the attachment portion 75. The attachment portion 75 includes external electrodes E21 to E33. Although not shown, the attachment portion 75 includes a member for fixing the optical transmission module 10.

  The external electrodes E21 to E33 are provided on the surface of the substrate body 73. The external electrode E21 is provided at the center of the attachment portion 75 and is an electrode that is kept at the ground potential. The external electrodes E22 to E27 are arranged in this order from the negative direction side in the x-axis direction to the positive direction side along the long side of the attachment portion 75 on the positive direction side in the y-axis direction. The external electrodes E28 to E33 are arranged in this order from the negative direction side in the x-axis direction to the positive direction side along the long side of the attachment portion 75 on the negative direction side in the y-axis direction.

  The wirings 78, 80, 82, 84, 86, 88, 90, 92 are provided on the surface of the substrate body 73, and are made of, for example, copper. The wiring 78 connects the external terminal T8 and the external electrode E28. The wiring 80 connects the external terminal T7 and the external electrode E29. The wiring 82 connects the external terminal T6 and the external electrode E31. The wiring 84 connects the external terminal T5 and the external electrode E33. The wiring 86 connects the external terminal T4 and the external electrode E27. The wiring 88 connects the external terminal T3 and the external electrode E25. The wiring 90 connects the external terminal T2 and the external electrode E23. The wiring 92 connects the external terminal T1 and the external electrode E22.

  As shown in FIG. 5, the electrical wiring 74 connects the external terminal T4 and the external terminal T5. As shown in FIG. 5, the electrical wiring 76 connects the external terminal T3 and the external terminal T6. The electrical wires 74 and 76 are, for example, conductive wires in which the periphery of the conductive wire is covered with an insulating film.

  The inspection device 98 generates a predetermined inspection signal Sig1, inputs the inspection signal Sig1 to the inspection substrate 72, and receives the inspection signal Sig1 output from the inspection substrate 72. Then, the inspection device 98 determines whether the optical transmission module 10 is good or defective based on the received inspection signal Sig1. The inspection device 98 is constituted by, for example, an error detector. Here, the inspection signal Sig1 is a balanced signal. Therefore, the inspection device 98 is connected to the external terminals T1 and T2 and the external terminals T7 and T8. The inspection signal Sig1 is input to the external terminals T1 and T2 and is output from the external electrodes T3 and T4. The signal Sig1 is received.

  The optical fiber 60e is configured by connecting the optical fiber 60a and the optical fiber 60c of FIG. The optical fiber 60f is configured by connecting the optical fiber 60b and the optical fiber 60d of FIG.

  In the inspection system 70 configured as described above, the light transmission module 10 is attached to the attachment portion 75. Thereby, the external electrodes E1 to E13 and the external electrodes E21 to E33 are in contact with each other. Therefore, all the transmission units 101a and 101b and all the reception units 102a and 102b included in the optical transmission module 10 are connected by the optical fibers 60e and 60f, the wirings 82, 84, 86, 88, 90, and 92 and the electrical wirings 74 and 76. Alternately connected in series. That is, as shown in FIG. 7, the transmission unit 101a, the reception unit 102a, the transmission unit 101b, and the reception unit 102b are connected in series in this order.

  More specifically, the transmission unit 101a is connected in series with the reception unit 102a by an optical fiber 60e. The receiving unit 102a includes external electrodes E11 and E13, external electrodes E31 and E33, wirings 82 and 84, external terminals T5 and T6, electrical wirings 74 and 76, external terminals T3 and T4, wirings 86 and 88, and external electrodes E25 and E27. The external electrodes E5 and E7 are connected to the transmitter 101b. The transmitter 101b is connected in series with the receiver 102b by an optical fiber 60f.

  Next, the operation of the inspection system 70 will be described. The inspection device 98 inputs an inspection signal Sig1 that is a balanced signal to the external terminals T1 and T2. Thereby, the receiving circuit 26a receives the test signal Sig1 of the balanced signal, converts the test signal Sig1 into an unbalanced signal, and outputs it to the diode 50a.

  The diode 50a converts the inspection signal Sig1, which is an unbalanced signal, into an optical signal and outputs the optical signal to the optical fiber 60e. The photodiode 100a receives the inspection signal Sig1 that is an optical signal, converts the inspection signal Sig1 that is an optical signal into an unbalanced signal, and outputs the unbalanced signal to the transmission circuit 26c. The transmission circuit 26 c converts the inspection signal Sig 1 that is an unbalanced signal into a balanced signal and outputs the balanced signal to the electrical wirings 74 and 76.

  The receiving circuit 26b receives the balanced signal test signal Sig1, converts the test signal Sig1 into an unbalanced signal, and outputs the unbalanced signal to the diode 50b.

  The diode 50b converts the inspection signal Sig1 that is an unbalanced signal into an optical signal and outputs the optical signal to the optical fiber 60f. The photodiode 100b receives the inspection signal Sig1 that is an optical signal, converts the inspection signal Sig1 that is an optical signal into an unbalanced signal, and outputs the unbalanced signal to the transmission circuit 26d. The transmission circuit 26d converts the inspection signal Sig1 that is an unbalanced signal into a balanced signal and outputs the balanced signal. Thereby, the inspection device 98 receives the inspection signal Sig1, and determines whether the optical transmission module 10 is a good product or a defective product based on the inspection signal Sig1.

(effect)
According to the inspection system 70 and the inspection method configured as described above, the optical transmission module 10 including a plurality of transmission / reception systems can be inspected without increasing the inspection equipment. More specifically, in the inspection system 70, the transmission unit 101a, the reception unit 102a, the transmission unit 101b, and the reception unit 102b of the optical transmission module 10 are connected in series by an optical fiber and electrical wiring in this order. As a result, when the inspection device 98 inputs the inspection signal Sig1 to the transmission unit 101a, the inspection signal Sig1 passes through the transmission unit 101a, the reception unit 102a, the transmission unit 101b, and the reception unit 102b in this order, and again the inspection device 98. To enter. Therefore, when the optical transmission module 10 has a defect, the inspection signal Sig1 is not output, or an inspection signal Sig1 different from the input inspection signal Sig1 is output. Therefore, the inspection device 98 can determine whether the optical transmission module 10 is good or defective based on the inspection signal Sig1. Therefore, in the inspection system 70 and the inspection method, the optical transmission module 10 can be inspected by one inspection device 98.

(First modification)
Hereinafter, an inspection system 70a according to a first modification will be described with reference to the drawings. FIG. 8 is a configuration diagram of an inspection system 70a according to the first modification.

  The inspection system 70a is different from the inspection system 70 in that it further includes an inspection device 99. More specifically, the inspection device 99 is connected to the external terminals T7 and T8, and receives the inspection signal Sig1 output from the external terminals T7 and T8. The inspection device 99 is an oscilloscope, for example, and determines whether the optical transmission module 10 is good or defective based on the waveform of the inspection signal Sig1.

(Second modification)
Hereinafter, an inspection board 72a according to a second modification will be described with reference to the drawings. FIG. 9 is a configuration diagram of an inspection board 72a according to a second modification.

  The inspection board 72a is different from the inspection board 72 in that wirings 103 and 104 are provided instead of the external terminals T3 to T6 and the wirings 82, 84, 86, and 88. More specifically, the wiring 103 connects the external electrode E27 and the external electrode E33. The wiring 104 connects the external electrode E25 and the external electrode E31. Thereby, the wirings 103 and 104 connect the transmission unit 101b and the reception unit 102a. That is, in the inspection board 72a, the wirings 103 and 104 connect the transmitting unit 101b excluding the transmitting unit 101a and the receiving unit 102b located at both ends and the receiving unit 102a in combination.

  In the inspection board 72a configured as described above, the external terminals T3 to T6 and the electrical wirings 74 and 76 can be eliminated.

(Third Modification)
Hereinafter, an inspection system 70b according to a third modification will be described with reference to the drawings. FIG. 10 is a configuration diagram of an inspection system 70b according to a third modification.

  The inspection system 70b is different from the inspection system 70 in that two inspection boards 72 on which the optical transmission module 10 is mounted are connected in series. More specifically, the external terminals T7 and T8 of the lower inspection board 72 in FIG. 10 are connected to the external terminals T1 and T2 of the upper inspection board 72 in FIG. As a result, all the transmission units and all the reception units included in the two optical transmission modules 10 are alternately connected in series by the optical fiber and the electrical wiring. As a result, the inspection device 98 can simultaneously determine whether the two optical transmission modules 10 are good or defective. In the inspection system 70b, three or more inspection substrates 72 may be connected in series.

  The inspection system 70b as described above is suitable for inspection of the optical transmission module 10 having a high yield rate.

(Other embodiments)
The inspection method, inspection system, and inspection substrate according to the present invention are not limited to the inspection method, inspection systems 70, 70a, 70b, and inspection substrates 72, 72a described in the above embodiment, and can be changed within the scope of the gist thereof.

  In the inspection system 70b, a plurality of optical transmission modules 10 may be mounted on one inspection substrate 72 instead of using a plurality of inspection substrates 72.

  The present invention is useful for an inspection method, an inspection system, and an inspection board, and is particularly excellent in that an optical transmission module including a plurality of transmission / reception systems can be inspected without increasing the inspection equipment.

T1 to T8 External terminal 10 Optical transmission module 20 Receptacle 26 Drive circuit 26a, 26b Reception circuit 26c, 26d Transmission circuit 40 Plug 50 Light receiving element array 50a, 50b Diode 60a-60f Optical fiber 70, 70a, 70b Inspection system 72, 72a Inspection board 73 Substrate body 74, 76 Electrical wiring 75 Mounting portion 78, 80, 82, 84, 86, 88, 90, 92, 103, 104 Wiring 98, 99 Inspection device E1-E13, E21-E33 External electrode 100 Light emitting element array 100a , 100b Photodiode 101a, 101b Transmitter 102a, 102b Receiver

Claims (5)

An inspection method for an optical transmission module comprising a plurality of transmission units including a light emitting element and a plurality of reception units including a light receiving element, and connected to one end of an optical transmission path,
All the transmission units included in at least one or more of the optical transmission modules and all the reception units are alternately connected in series by optical transmission lines and electrical wiring,
An inspection electrical signal is input to the transmitting unit located at one end, and an electrical test signal output from the receiving unit located at the other end is received;
Inspection method characterized by The transmitter includes a receiving circuit that receives an electric signal input from outside the optical transmission module and drives the light emitting element,
The receiver includes a transmission circuit that outputs an electrical signal output from the light receiving element to the outside of the optical transmission module;
A plurality of receiving circuits and a plurality of transmitting circuits provided in one optical transmission module are configured by one IC;
The inspection method according to claim 1. Connecting all the transmission units and all the reception units included in one optical transmission module alternately in series by optical transmission lines and electrical wiring;
The inspection method according to claim 1, wherein: An optical transmission module comprising a plurality of transmitters including light emitting elements and a plurality of receivers including light receiving elements;
A connection unit that connects all the transmission units and all the reception units included in at least one or more of the optical transmission modules alternately in series by optical transmission lines and electrical wiring; and
An inspection device that inputs an electrical signal for inspection to the transmission unit located at one end, and receives an electrical signal for inspection output from the reception unit located at the other end;
Having
Inspection system characterized by An inspection board that includes a plurality of transmission units including a light emitting element and a plurality of reception units including a light receiving element, and is used for inspection of an optical transmission module connected to one end of an optical transmission path,
A mounting portion to which the light transmission module is mounted;
A first external terminal;
First electrical wiring for connecting the predetermined transmission unit of the optical transmission module attached to the attachment unit and the first external terminal;
A second external terminal;
A second electrical wiring for connecting the predetermined receiving portion of the optical transmission module attached to the attachment portion and the second external terminal;
A plurality of third electrical wirings connecting and connecting the transmitting unit and the receiving unit except for the predetermined transmitting unit and the predetermined receiving unit of the optical transmission module mounted on the mounting unit;
Having
Inspection board characterized by.

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