JP6251687B2 - Adhesive composition for optical film and surface protective film - Google Patents
Adhesive composition for optical film and surface protective film Download PDFInfo
- Publication number
- JP6251687B2 JP6251687B2 JP2014552972A JP2014552972A JP6251687B2 JP 6251687 B2 JP6251687 B2 JP 6251687B2 JP 2014552972 A JP2014552972 A JP 2014552972A JP 2014552972 A JP2014552972 A JP 2014552972A JP 6251687 B2 JP6251687 B2 JP 6251687B2
- Authority
- JP
- Japan
- Prior art keywords
- meth
- sensitive adhesive
- pressure
- adhesive composition
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 37
- 239000012788 optical film Substances 0.000 title claims description 31
- 239000010408 film Substances 0.000 title claims description 29
- 239000000853 adhesive Substances 0.000 title claims description 22
- 230000001070 adhesive effect Effects 0.000 title claims description 22
- 230000001681 protective effect Effects 0.000 title claims description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 61
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 47
- -1 alkali metal salt Chemical class 0.000 claims description 38
- 239000004925 Acrylic resin Substances 0.000 claims description 33
- 229920000178 Acrylic resin Polymers 0.000 claims description 33
- 229920005862 polyol Polymers 0.000 claims description 21
- 150000003077 polyols Chemical class 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 16
- 229920001228 polyisocyanate Polymers 0.000 claims description 15
- 239000005056 polyisocyanate Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 150000008040 ionic compounds Chemical class 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 229910052783 alkali metal Inorganic materials 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 claims description 4
- 238000007334 copolymerization reaction Methods 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- YLLIGHVCTUPGEH-UHFFFAOYSA-M potassium;ethanol;hydroxide Chemical compound [OH-].[K+].CCO YLLIGHVCTUPGEH-UHFFFAOYSA-M 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- VBZBISQOWJYWCC-UHFFFAOYSA-N 2-(2-carboxypropan-2-yldiazenyl)-2-methylpropanoic acid Chemical compound OC(=O)C(C)(C)N=NC(C)(C)C(O)=O VBZBISQOWJYWCC-UHFFFAOYSA-N 0.000 description 1
- AGPIWTRJDSRFDH-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile;2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N.CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C AGPIWTRJDSRFDH-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 1
- SKKHNUKNMQLBTJ-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2C(OC(=O)C(=C)C)CC1C2 SKKHNUKNMQLBTJ-UHFFFAOYSA-N 0.000 description 1
- YHFGMFYKZBWPRW-UHFFFAOYSA-N 3-methylpentane-1,1-diol Chemical compound CCC(C)CC(O)O YHFGMFYKZBWPRW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 241001440267 Cyclodes Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000012648 alternating copolymerization Methods 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- WPKWPKDNOPEODE-UHFFFAOYSA-N bis(2,4,4-trimethylpentan-2-yl)diazene Chemical compound CC(C)(C)CC(C)(C)N=NC(C)(C)CC(C)(C)C WPKWPKDNOPEODE-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 125000004985 dialkyl amino alkyl group Chemical group 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- JCCAVOLDXDEODY-UHFFFAOYSA-N dimethyldiazene Chemical compound CN=NC JCCAVOLDXDEODY-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- YDEXUEFDPVHGHE-GGMCWBHBSA-L disodium;(2r)-3-(2-hydroxy-3-methoxyphenyl)-2-[2-methoxy-4-(3-sulfonatopropyl)phenoxy]propane-1-sulfonate Chemical compound [Na+].[Na+].COC1=CC=CC(C[C@H](CS([O-])(=O)=O)OC=2C(=CC(CCCS([O-])(=O)=O)=CC=2)OC)=C1O YDEXUEFDPVHGHE-GGMCWBHBSA-L 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Inorganic materials [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 125000005593 norbornanyl group Chemical group 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- TZYULTYGSBAILI-UHFFFAOYSA-M trimethyl(prop-2-enyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC=C TZYULTYGSBAILI-UHFFFAOYSA-M 0.000 description 1
- ZQYKGADTDCTWSZ-UHFFFAOYSA-N trimethyl-[(prop-2-enoylamino)methyl]azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CNC(=O)C=C ZQYKGADTDCTWSZ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
- C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/22—Catalysts containing metal compounds
- C08G18/24—Catalysts containing metal compounds of tin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4063—Mixtures of compounds of group C08G18/62 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/32—Compounds containing nitrogen bound to oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08K5/57—Organo-tin compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Paints Or Removers (AREA)
Description
本発明は、光学フィルム用粘着剤組成物及び表面保護フィルムに関するものである。 The present invention relates to an optical film pressure-sensitive adhesive composition and a surface protective film.
近年、光学部品・電子部品の分野で表面保護の目的でポリエチレン、ポリエステル、ポリプロピレン等の透明な保護シート（透明基材シート）と粘着剤とが積層された表面保護フィルムが多く用いられている。この表面保護フィルムは、粘着シートから離型フィルムを剥離する際、及び粘着シートを被着体から剥離する際に静電気が帯電してしまうと周辺のゴミが付着して光学部品・電子部品を汚してしまう問題がある。
そこで、帯電防止性を付与した粘着剤が開発されており、例えば、特許文献１及び２には、アクリル系共重合体に帯電防止剤としてポリエーテルポリオールを添加した粘着剤が開示されている。しかしながら、帯電防止剤としてポリエーテルポリオールを添加した粘着剤は、透明性に問題があり、品質保証の観点から透明性を要求される表面保護フィルムに使用できない。
また、特許文献３には、ポリエーテルポリオールをアクリルポリマーにグラフトさせることで、帯電防止性と透明性とを両立させた粘着剤が開示されている。しかしながら、この粘着剤は、酸価が高いことから、ＩＴＯフィルムのような腐食を嫌う光学部材への使用が難しいといった問題があった。In recent years, a surface protective film in which a transparent protective sheet (transparent substrate sheet) such as polyethylene, polyester, or polypropylene and an adhesive are laminated is often used for the purpose of surface protection in the field of optical parts and electronic parts. This surface protection film stains optical and electronic components when the static electricity is charged when the release film is peeled from the adhesive sheet and when the adhesive sheet is peeled off from the adherend. There is a problem.
Thus, pressure-sensitive adhesives having antistatic properties have been developed. For example, Patent Documents 1 and 2 disclose pressure-sensitive adhesives obtained by adding a polyether polyol as an antistatic agent to an acrylic copolymer. However, the pressure-sensitive adhesive to which polyether polyol is added as an antistatic agent has a problem in transparency, and cannot be used for a surface protective film requiring transparency from the viewpoint of quality assurance.
Patent Document 3 discloses an adhesive that achieves both antistatic properties and transparency by grafting a polyether polyol onto an acrylic polymer. However, since this pressure-sensitive adhesive has a high acid value, there is a problem that it is difficult to use it for an optical member that dislikes corrosion such as an ITO film.
本発明は、上記従来技術が有する問題に鑑み、帯電防止性及び透明性に優れ、被着体に対する汚染性及び腐食性が低い光学フィルム用粘着剤組成物、及び表面保護フィルムを提供することを目的とする。 The present invention provides an optical film pressure-sensitive adhesive composition and a surface protective film that are excellent in antistatic properties and transparency, and have low contamination and corrosion properties to adherends, in view of the problems of the above-described conventional techniques. Objective.
本発明者らは、光学フィルム用粘着剤組成物が抱える前記の問題点を背景にして、鋭意検討を重ねた結果、特定重量平均分子量の（メタ）アクリル系樹脂、特定数平均分子量のポリオキシアルキレンポリオール、ポリイソシアネート、イオン性化合物及びスズ系触媒を特定の重量割合で含む光学フィルム用粘着剤組成物が、良好な帯電防止性及び透明性、被着体に対する低い汚染性及び腐食性を示すことを見出し、この知見に基づいて本発明を完成した。 As a result of intensive studies on the background of the above-mentioned problems of the pressure-sensitive adhesive composition for optical films, the present inventors have obtained (meth) acrylic resins having a specific weight average molecular weight, polyoxy having a specific number average molecular weight. The pressure-sensitive adhesive composition for optical films containing alkylene polyol, polyisocyanate, ionic compound and tin-based catalyst in specific weight ratios exhibits good antistatic properties and transparency, low contamination and corrosion properties on the adherend. Based on this finding, the present invention has been completed.
本発明は、以下の（１）〜（１０）で示される。
（１）（Ａ）（メタ）アクリル系樹脂 ６５〜８５質量％と、（Ｂ）ポリオキシアルキレンポリオール １０〜３０質量％と、（Ｃ）ポリイソシアネート １．０〜５．０質量％と、（Ｄ）イオン性化合物 ０．２〜１．０質量％と、（Ｅ）スズ系触媒 ０．００５〜０．１質量％とを含む光学フィルム用粘着剤組成物であって、（Ａ）（メタ）アクリル系樹脂の重量平均分子量が１０万〜６０万であり、且つ（Ｂ）ポリオキシアルキレンポリオールの数平均分子量が５００〜１５００であることを特徴とする光学フィルム用粘着剤組成物。
（２）前記（Ａ）（メタ）アクリル系樹脂が、共重合成分として水酸基含有（メタ）アクリル系モノマーを０．５〜１０ｍｏｌ％含むことを特徴とする（１）に記載の光学フィルム用粘着剤組成物。
（３）前記水酸基含有（メタ）アクリル系モノマーが、２−ヒドロキシエチル（メタ）アクリレートであることを特徴とする（２）に記載の光学フィルム用粘着剤組成物。
（４）前記（Ａ）（メタ）アクリル系樹脂が、共重合成分としてメチル（メタ）アクリレートを１５〜５０ｍｏｌ％含むことを特徴とする（１）〜（３）の何れか一項に記載の光学フィルム用粘着剤組成物。
（５）酸価が０〜５ｍｇＫＯＨ／ｇであることを特徴とする（１）〜（４）の何れか一項に記載の光学フィルム用粘着剤組成物。
（６）前記（Ｄ）イオン性化合物が、アルカリ金属塩であることを特徴とする（１）〜（５）の何れか一項に記載の光学フィルム用粘着剤組成物。
（７）前記（Ｅ）スズ系触媒が、ジオクチル錫ジラウレートであることを特徴とする（１）〜（６）の何れか一項に記載の光学フィルム用粘着剤組成物。
（８）透明基材上の片面に、（１）〜（７）の何れか一項に記載の光学フィルム用粘着剤組成物を硬化させて得られる粘着剤層が形成されていることを特徴とする表面保護フィルム。
（９）表面固有抵抗値が、１．０×１０10Ω／□以下であり且つヘイズが１．２以下であることを特徴とする（８）に記載の表面保護フィルム。
（１０）前記透明基材が、厚さ５〜２００μｍの、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、ポリスチレン、ポリイミド、ポリビニルアルコール、ポリ塩化ビニル又はセルロースであることを特徴とする（８）又は（９）に記載の表面保護フィルム。The present invention is shown by the following (1) to (10).
(1) (A) (meth) acrylic resin 65-85% by mass, (B) 10-30% by mass of polyoxyalkylene polyol, (C) polyisocyanate 1.0-5.0% by mass, ( D) A pressure-sensitive adhesive composition for an optical film comprising 0.2 to 1.0% by mass of an ionic compound and (E) 0.005 to 0.1% by mass of a tin-based catalyst, wherein (A) (meta A pressure-sensitive adhesive composition for an optical film, wherein the acrylic resin has a weight average molecular weight of 100,000 to 600,000 and (B) the polyoxyalkylene polyol has a number average molecular weight of 500 to 1500.
(2) The adhesive for an optical film according to (1), wherein the (A) (meth) acrylic resin contains 0.5 to 10 mol% of a hydroxyl group-containing (meth) acrylic monomer as a copolymerization component. Agent composition.
(3) The pressure-sensitive adhesive composition for an optical film as described in (2), wherein the hydroxyl group-containing (meth) acrylic monomer is 2-hydroxyethyl (meth) acrylate.
(4) The (A) (meth) acrylic resin contains 15 to 50 mol% of methyl (meth) acrylate as a copolymerization component, as described in any one of (1) to (3) An adhesive composition for optical films.
(5) The pressure-sensitive adhesive composition for optical films according to any one of (1) to (4), wherein the acid value is 0 to 5 mgKOH / g.
(6) The pressure-sensitive adhesive composition for optical films according to any one of (1) to (5), wherein the (D) ionic compound is an alkali metal salt.
(7) The pressure-sensitive adhesive composition for optical films according to any one of (1) to (6), wherein the (E) tin-based catalyst is dioctyltin dilaurate.
(8) A pressure-sensitive adhesive layer obtained by curing the pressure-sensitive adhesive composition for optical films according to any one of (1) to (7) is formed on one surface of a transparent substrate. A surface protective film.
(9) The surface protective film according to (8), wherein the surface specific resistance value is 1.0 × 10 10 Ω / □ or less and the haze is 1.2 or less.
(10) In (8) or (9), the transparent base material is polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride or cellulose having a thickness of 5 to 200 μm. The surface protective film as described.
本発明によれば、帯電防止性及び透明性に優れ、被着体に対する汚染性及び腐食性が低い光学フィルム用粘着剤組成物、及び表面保護フィルムを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, it is excellent in antistatic property and transparency, and can provide the adhesive composition for optical films, and the surface protection film with low pollution and corrosion property with respect to a to-be-adhered body.
以下、本発明を詳細に説明する。
本発明の光学フィルム用粘着剤組成物は、（Ａ）（メタ）アクリル系樹脂と、（Ｂ）ポリオキシアルキレンポリオールと、（Ｃ）ポリイソシアネートと、（Ｄ）イオン性化合物と、（Ｅ）スズ系触媒とを含むものである。
本発明における（メタ）アクリル系樹脂とは、アクリル系樹脂又はメタクリル系樹脂をいい、また、（メタ）アクリレートとは、アクリレート又はメタクリレートをいう。なお、（メタ）アクリレート系樹脂は、全構成モノマーの８０ｍｏｌ％以上が（メタ）アクリレート系モノマーであるポリマーを指す。Hereinafter, the present invention will be described in detail.
The pressure-sensitive adhesive composition for an optical film of the present invention comprises (A) (meth) acrylic resin, (B) polyoxyalkylene polyol, (C) polyisocyanate, (D) ionic compound, and (E). A tin-based catalyst.
In the present invention, (meth) acrylic resin refers to acrylic resin or methacrylic resin, and (meth) acrylate refers to acrylate or methacrylate. In addition, (meth) acrylate type resin refers to the polymer whose 80 mol% or more of all the structural monomers are (meth) acrylate type monomers.
（Ａ）（メタ）アクリル系樹脂
本発明における（Ａ）（メタ）アクリル系樹脂の重合に使用される（メタ）アクリル系モノマーとしては、特に限定はないが、カルボキシル基（化学式：−ＣＯＯＨ）を含有しないものが好ましい。（メタ）アクリル系モノマーの例としては、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−プロピル（メタ）アクリレート、イソプロピル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｔｅｒｔ−ブチル（メタ）アクリレート、イソブチル（メタ）アクリレート、ｎ−ヘキシル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、イソオクチル（メタ）アクリレート、ラウリル（メタ）アクリレート、イソデシル（メタ）アクリレート、ステアリル（メタ）アクリレート、トリデシル（メタ）アクリレート、イソステアリル（メタ）アクリレート等のアルキル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ノルボルニル（メタ）アクリレート、イソボルニル（メタ）アクリレート、ノルボルナニル（メタ）アクリレート、ジシクロペンテニル（メタ）アクリレート、ジシクロペンテニルオキシエチル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレート、ジシクロペンタニルオキシエチル（メタ）アクリレート、トリシクロデカンジメチロールジ（メタ）アクリレート等の環状アルキル（メタ）アクリレート、メトキシエチル（メタ）アクリレート、エトキシエチル（メタ）アクリレート、ブトキシエチル（メタ）アクリレート、２−メトキシエトキシエチル（メタ）アクリレート、２−エトキシエトキシエチル（メタ）アクリレート等のアルコキシアルキル（メタ）アクリレート、メトキシジエチレングリコール（メタ）アクリレート、エトキシジエチレングリコール（メタ）アクリレート、メトキシジプロピレングリコール（メタ）アクリレート等のアルコキシ（ポリ）アルキレングリコール（メタ）アクリレート、オクタフルオロペンチル（メタ）アクリレート等のフッ素化アルキル（メタ）アクリレート、Ｎ，Ｎ−ジメチルアミノエチル（メタ）アクリレート、Ｎ，Ｎ−ジエチルアミノエチル（メタ）アクリレート等のジアルキルアミノアルキル（メタ）アクリレート、（メタ）アクリルアミド、ダイアセトン（メタ）アクリルアミド等のアミド基含有（メタ）アクリレート、グリシジル（メタ）アクリレート等のエポキシ基含有（メタ）アクリレート、シリコーン変性（メタ）アクリレート、ポリエチレングリコールジ（メタ）アクリレート、ジエチレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、トリエチレングリコールジ（メタ）アクリレート、トリプロピレングリコールジ（メタ）アクリレート等の多官能性（メタ）アクリレート等が挙げられる。これらは、単独で使用してもよいし、２種類以上を組み合わせて使用してもよい。
（Ａ）（メタ）アクリル系樹脂と（Ｂ）ポリオキシアルキレンポリオールとの相溶性、すなわち光学フィルム用粘着剤組成物を硬化させて得られる粘着剤層の透明性を考慮すると、（Ａ）（メタ）アクリル系樹脂の共重合成分としてメチルアクリレート又はメチルメタクレートが１５〜５０ｍｏｌ％含まれることが好ましく、２５〜４５ｍｏｌ％含まれることがより好ましい。(A) (Meth) acrylic resin The (meth) acrylic monomer used in the polymerization of the (A) (meth) acrylic resin in the present invention is not particularly limited, but a carboxyl group (chemical formula: -COOH). What does not contain is preferable. Examples of (meth) acrylic monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, tert-butyl (meth) ) Acrylate, isobutyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate, stearyl (meth) acrylate, tridecyl Alkyl (meth) acrylates such as (meth) acrylate and isostearyl (meth) acrylate, cyclohexyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate , Norbornanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentanyloxyethyl (meth) acrylate, tricyclodecandi Cyclic alkyl (meth) acrylates such as methylol di (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, 2-methoxyethoxyethyl (meth) acrylate, 2-ethoxyethoxy Alkoxyalkyl (meth) acrylates such as ethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxy Alkoxy (poly) alkylene glycol (meth) acrylate such as dipropylene glycol (meth) acrylate, fluorinated alkyl (meth) acrylate such as octafluoropentyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N Dialkylaminoalkyl (meth) acrylates such as N, diethylaminoethyl (meth) acrylate, amide group-containing (meth) acrylates such as (meth) acrylamide, diacetone (meth) acrylamide, and epoxy groups such as glycidyl (meth) acrylate (Meth) acrylate, silicone-modified (meth) acrylate, polyethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate Examples thereof include polyfunctional (meth) acrylates such as relate, triethylene glycol di (meth) acrylate, and tripropylene glycol di (meth) acrylate. These may be used alone or in combination of two or more.
Considering the compatibility of (A) (meth) acrylic resin and (B) polyoxyalkylene polyol, that is, transparency of the pressure-sensitive adhesive layer obtained by curing the pressure-sensitive adhesive composition for optical films, (A) ( The copolymer component of the (meth) acrylic resin preferably contains 15 to 50 mol% of methyl acrylate or methyl methacrylate, and more preferably 25 to 45 mol%.
また、本発明における（Ａ）（メタ）アクリル系樹脂は、ポリイソシアネートを介してポリオキシアルキレンポリオールと反応させ一体化させることができる（透明性が向上する）という観点から、共重合成分として水酸基含有（メタ）アクリル系モノマーを含むことが好ましい。水酸基含有（メタ）アクリル系モノマーの例としては、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、１，３−ブタンジオール（メタ）アクリレート、１，４−ブタンジオール（メタ）アクリレート、１，６−ヘキサンジオール（メタ）アクリレート、３−メチルペンタンジオール（メタ）アクリレート等の水酸基含有（メタ）アクリレート等が挙げられる。中でも、共重合性及び反応性の点で、２−ヒドロキシエチル（メタ）アクリレートが好ましい。水酸基含有（メタ）アクリル系モノマーは、（Ａ）（メタ）アクリル系樹脂の共重合成分として０．５〜１０ｍｏｌ％含まれることが好ましく、０．６〜８．０ｍｏｌ％含まれることがより好ましい。 In addition, the (A) (meth) acrylic resin in the present invention can be integrated with a polyoxyalkylene polyol by reacting with a polyoxyalkylene polyol via a polyisocyanate (transparency is improved). It is preferable to contain a (meth) acrylic monomer. Examples of hydroxyl group-containing (meth) acrylic monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 1,3-butanediol (meth) acrylate , 1,4-butanediol (meth) acrylate, 1,6-hexanediol (meth) acrylate, hydroxyl group-containing (meth) acrylate such as 3-methylpentanediol (meth) acrylate, and the like. Among these, 2-hydroxyethyl (meth) acrylate is preferable in terms of copolymerizability and reactivity. The hydroxyl group-containing (meth) acrylic monomer is preferably contained in an amount of 0.5 to 10 mol%, more preferably 0.6 to 8.0 mol%, as a copolymer component of the (A) (meth) acrylic resin. .
また、本発明における（Ａ）（メタ）アクリル系樹脂には、重合性を損なわない範囲で、共重合成分としてその他の重合性モノマーを使用することができる。そのような重合性モノマーの例としては、アクリロニトリル、メタクリロニトリル、スチレン、α−メチルスチレン、酢酸ビニル、プロピオン酸ビニル、ステアリン酸ビニル、塩化ビニル、塩化ビニリデン、アルキルビニルエーテル、ビニルトルエン、ビニルピリジン、ビニルピロリドン、イタコン酸ジアルキルエステル、フマル酸ジアルキルエステル、アリルアルコール、アクリルクロライド、メチルビニルケトン、Ｎ−アクリルアミドメチルトリメチルアンモニウムクロライド、アリルトリメチルアンモニウムクロライド、ジメチルアリルビニルケトン等が挙げられる。 In the (A) (meth) acrylic resin in the present invention, other polymerizable monomers can be used as a copolymerization component as long as the polymerizability is not impaired. Examples of such polymerizable monomers include acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, vinyl propionate, vinyl stearate, vinyl chloride, vinylidene chloride, alkyl vinyl ether, vinyl toluene, vinyl pyridine, Examples include vinyl pyrrolidone, itaconic acid dialkyl ester, fumaric acid dialkyl ester, allyl alcohol, acrylic chloride, methyl vinyl ketone, N-acrylamidomethyltrimethylammonium chloride, allyltrimethylammonium chloride, dimethylallyl vinylketone and the like.
本発明における（Ａ）（メタ）アクリル系樹脂は、重量平均分子量が１０万〜６０万であることが必要であり、好ましくは１５万〜５０万、より好ましくは２０万〜４０万である。重量平均分子量が１０万より小さい場合には、凝集力が小さくなることにより、糊残りを生じる。一方、重量平均分子量が６０万より大きい場合には、（Ａ）（メタ）アクリル系樹脂と（Ｂ）ポリオキシアルキレンポリオールとの相溶性が悪くなり、得られる粘着剤層の透明性が悪くなる。
ここで重量平均分子量は、ゲル・パーミエーション・クロマトグラフィー（昭和電工株式会社製、ショウデックス（登録商標） ＧＰＣ−１０１）を用いて、下記条件にて常温で測定し、ポリスチレン換算にて算出されるものである。
カラム：昭和電工株式会社製、ショウデックス（登録商標） ＬＦ−８０４
カラム温度：４０℃
試料：共重合体の０．２質量％テトラヒドロフラン溶液
流量：１ｍｌ／分
溶離液：テトラヒドロフランThe (A) (meth) acrylic resin in the present invention is required to have a weight average molecular weight of 100,000 to 600,000, preferably 150,000 to 500,000, more preferably 200,000 to 400,000. When the weight average molecular weight is smaller than 100,000, the cohesive force becomes small, and an adhesive residue is generated. On the other hand, when the weight average molecular weight is larger than 600,000, the compatibility between the (A) (meth) acrylic resin and the (B) polyoxyalkylene polyol is deteriorated, and the transparency of the resulting pressure-sensitive adhesive layer is deteriorated. .
Here, the weight average molecular weight is measured at room temperature under the following conditions using gel permeation chromatography (manufactured by Showa Denko KK, Showex (registered trademark) GPC-101), and is calculated in terms of polystyrene. Is.
Column: Showa Denko KK, Shodex (registered trademark) LF-804
Column temperature: 40 ° C
Sample: 0.2 mass% tetrahydrofuran solution of copolymer Flow rate: 1 ml / min Eluent: Tetrahydrofuran
また、本発明における（Ａ）（メタ）アクリル系樹脂のガラス転移温度（Ｔｇ）は、−８０〜０℃であることが好ましく、より好ましくは、−７０〜−１０℃である。Ｔｇが０℃より高い場合には、被着体への濡れが悪くなり好ましくない。一方、Ｔｇが−８０℃より低い場合には、凝集力が小さくなることにより、糊残りを生じる可能性があり好ましくない。なお、（Ａ）（メタ）アクリル系樹脂のＴｇは、用いるモノマー成分や組成比を適宜変えることにより調整することができる。
ここで、Ｔｇは、以下の方法から求められたものを指す。（Ａ）（メタ）アクリル系樹脂から１０ｍｇの試料を採取して、示差走査熱量計（ＤＳＣ）を用いて、１０℃／分の昇温速度で−８０℃から２００℃まで温度を変化させて示差走査熱量測定を行い、ガラス転移による吸熱開始温度をＴｇとする。なお、Ｔｇが２つ観察された場合には、２つのＴｇの平均値をとることとする。Moreover, it is preferable that the glass transition temperature (Tg) of (A) (meth) acrylic-type resin in this invention is -80-0 degreeC, More preferably, it is -70--10 degreeC. When Tg is higher than 0 ° C., the wetness to the adherend deteriorates, which is not preferable. On the other hand, when Tg is lower than −80 ° C., the cohesive force becomes small, which may cause adhesive residue, which is not preferable. In addition, Tg of (A) (meth) acrylic-type resin can be adjusted by changing suitably the monomer component and composition ratio to be used.
Here, Tg refers to that obtained from the following method. (A) A 10 mg sample was taken from the (meth) acrylic resin, and the temperature was changed from −80 ° C. to 200 ° C. at a rate of temperature increase of 10 ° C./min using a differential scanning calorimeter (DSC). Differential scanning calorimetry is performed, and the endothermic start temperature due to glass transition is defined as Tg. When two Tg's are observed, the average value of the two Tg's is taken.
本発明における（Ａ）（メタ）アクリル系樹脂の重合方法は特に制限されるものではなく、溶液重合、乳化重合、塊状重合、懸濁重合、交互共重合などの公知の方法により重合できる。中でも、溶液重合が特に好適である。
また、得られる共重合体は、ランダム共重合体、ブロック共重合体など何れでもよい。
（Ａ）（メタ）アクリル系樹脂の重合に際して用いられる重合開始剤は、特に限定されず、公知のものの中から適宜選択して使用することができる。例えば、２，２’−アゾビス（イソブチロニトリル）、２，２’−アゾビス（４−メトキシ−２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２−メチルブチロニトリル）、１，１’−アゾビス（シクロヘキサン−１−カルボニトリル）、２，２’−アゾビス（２，４，４−トリメチルペンタン）、ジメチル−２，２’−アゾビス（２−メチルプロピオネート）等のアゾ系重合開始剤；ベンゾイルパーオキサイド、ｔ−ブチルハイドロパーオキサイド、ジ−ｔ−ブチルパーオキサイド、ｔ−ブチルパーオキシベンゾエート、ジクミルパーオキサイド、１，１−ビス（ｔ−ブチルパーオキシ）３，３，５−トリメチルシクロヘキサン、１，１−ビス（ｔ−ブチルパーオキシ）シクロドデカン等の過酸化物系重合開始剤などの油溶性重合開始剤が好ましく例示される。これらの重合開始剤は、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。重合開始剤の使用量は、通常の使用量であればよく、例えば、モノマー１００質量部に対して０．０１〜５質量部程度の範囲から選択することができ、０．０２〜４質量部の範囲であることが好ましく、０．０３〜３質量部であることがより好ましい。The polymerization method of the (A) (meth) acrylic resin in the present invention is not particularly limited, and it can be polymerized by a known method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, or alternating copolymerization. Among these, solution polymerization is particularly preferable.
In addition, the obtained copolymer may be any of a random copolymer, a block copolymer, and the like.
(A) The polymerization initiator used in the polymerization of the (meth) acrylic resin is not particularly limited, and can be appropriately selected from known ones. For example, 2,2′-azobis (isobutyronitrile), 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile) 2,2′-azobis (2-methylbutyronitrile), 1,1′-azobis (cyclohexane-1-carbonitrile), 2,2′-azobis (2,4,4-trimethylpentane), dimethyl- Azo polymerization initiators such as 2,2′-azobis (2-methylpropionate); benzoyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-butyl peroxybenzoate, dicumyl Peroxide, 1,1-bis (t-butylperoxy) 3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclod An oil-soluble polymerization initiator such as a peroxide-based polymerization initiator such as decane is preferably exemplified. These polymerization initiators may be used alone or in combination of two or more. The usage-amount of a polymerization initiator should just be a normal usage-amount, for example, can be selected from the range of about 0.01-5 mass parts with respect to 100 mass parts of monomers, and is 0.02-4 mass parts It is preferable that it is the range of 0.03-3 mass parts.
なお、溶液重合では、各種の一般的な溶剤を用いることができる。このような溶剤としては、酢酸エチル、酢酸ｎ−プロピル、酢酸ｎ−ブチル等のエステル類、トルエン、ベンゼン等の芳香族炭化水素類、ｎ−ヘキサン、ｎ−ヘプタン等の脂肪族炭化水素類、シクロヘキサン、メチルシクロヘキサン等の脂環式炭化水素類、メチルエチルケトン、メチルイソブチルケトン等のケトン類などの有機溶剤が挙げられる。これらの溶剤は、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。 In solution polymerization, various common solvents can be used. Examples of such solvents include esters such as ethyl acetate, n-propyl acetate, and n-butyl acetate, aromatic hydrocarbons such as toluene and benzene, aliphatic hydrocarbons such as n-hexane and n-heptane, Examples thereof include organic solvents such as cycloaliphatic hydrocarbons such as cyclohexane and methylcyclohexane, and ketones such as methyl ethyl ketone and methyl isobutyl ketone. These solvents may be used alone or in combination of two or more.
また、本発明における（Ａ）（メタ）アクリル系樹脂の配合量としては、６５〜８５質量％であることが必要であり、より好ましくは７０〜８５質量％である。配合量が６５質量％より少ない場合には、被着体を汚染し、一方、配合量が８５質量％を超える場合には、十分な帯電特性が得られない。 Moreover, as a compounding quantity of (A) (meth) acrylic-type resin in this invention, it is required that it is 65-85 mass%, More preferably, it is 70-85 mass%. When the blending amount is less than 65% by mass, the adherend is contaminated. On the other hand, when the blending amount exceeds 85% by mass, sufficient charging characteristics cannot be obtained.
（Ｂ）ポリオキシアルキレンポリオール
本発明における（Ｂ）ポリオキシアルキレンポリオールとしては、エーテル基を有すポリマーポリオールであれば特に限定されず、公知のポリマーポリオールが適宜使用できる。（Ｂ）ポリオキシアルキレンポリオールの例としては、ポリエチレングリコール、ポリプロピレングリコール、ポリテトラメチレンエーテルグリコール及びこれらの誘導体又は共重合体等が挙げられる。中でも、（メタ）アクリル系樹脂との相溶性を調整しやすいという理由で、ポリプロピレングリコールが好ましい。これらは、単独で使用してもよいし、２種以上を混合して使用してもよい。(B) Polyoxyalkylene polyol The (B) polyoxyalkylene polyol in the present invention is not particularly limited as long as it is a polymer polyol having an ether group, and known polymer polyols can be used as appropriate. Examples of (B) polyoxyalkylene polyols include polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, and derivatives or copolymers thereof. Among these, polypropylene glycol is preferable because it is easy to adjust the compatibility with the (meth) acrylic resin. These may be used alone or in combination of two or more.
本発明における（Ｂ）ポリオキシアルキレンポリオールは、数平均分子量が５００〜１５００であることが必要であり、好ましくは８００〜１２００である。数平均分子量が１５００を超える場合には、粘着剤層の透明性が悪くなる。一方、数平均分子量が５００より小さい場合には、糊残りを生じる可能性があり好ましくない。数平均分子量はＧＰＣ（ゲル・パーミエーション・クロマトグラフィー）により測定して得られたものをいう。 The number average molecular weight of the (B) polyoxyalkylene polyol in the present invention is required to be 500 to 1500, and preferably 800 to 1200. When the number average molecular weight exceeds 1500, the transparency of the pressure-sensitive adhesive layer is deteriorated. On the other hand, when the number average molecular weight is smaller than 500, there is a possibility that adhesive residue may be generated, which is not preferable. The number average molecular weight is obtained by measuring by GPC (gel permeation chromatography).
また、本発明における（Ｂ）ポリオキシアルキレンポリオールの配合量としては、１０〜３０質量％であることが必要であり、より好ましくは１５〜２５質量％である。配合量が１０質量％より少ない場合には、十分な帯電特性が得られず、一方、配合量が３０質量％を超える場合には、被着体を汚染する。 Moreover, as a compounding quantity of (B) polyoxyalkylene polyol in this invention, it is required that it is 10-30 mass%, More preferably, it is 15-25 mass%. When the blending amount is less than 10% by mass, sufficient charging characteristics cannot be obtained. On the other hand, when the blending amount exceeds 30% by mass, the adherend is contaminated.
（Ｃ）ポリイソシアネート
本発明における（Ｃ）ポリイソシアネートとしては、芳香族系、脂肪族系、脂環式系等のポリイソシアネートが挙げられる。（Ｃ）ポリイソシアネートの例としては、１，４−テトラメチレンジイソシアネート、１，６−ヘキサメチレンジイソシアネート（ＨＤＩ）、２−メチル−１，５−ペンタンジイソシアネート、３−メチル−１，５−ペンタンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、イソホロンジイソシアネート、シクロヘキシルジイソシアネート、トリレンジイソシアネート（ＴＤＩ）、水素添加トリレンジイソシアネート、ジフェニルメタンジイソシアネート、水素添加ジフェニルメタンジイソシアネート、ポリフェニルメタンポリイソシアネート、キシレンジイソシアネート、水素添加キシレンジイソシアネート、テトラメチルキシリレンジイソシアネート、ノルボルネンジイソシアネート、ナフタレンジイソシアネート、トリメチロールプロパン／トリレンジイソシアネート３量体付加物、トリメチロールプロパン／ヘキサメチレンジイソシアネート３量体付加物、ヘキサメチレンジイソシアネートのイソシアヌレート体などのイソシアネート付加物、ポリエーテルポリイソシアネート、ポリエステルポリイソシアネート等が挙げられる。これらは、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。(C) Polyisocyanate Examples of (C) polyisocyanate in the present invention include aromatic, aliphatic and alicyclic polyisocyanates. Examples of (C) polyisocyanate include 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate (HDI), 2-methyl-1,5-pentane diisocyanate, 3-methyl-1,5-pentane diisocyanate. , Trimethylhexamethylene diisocyanate, isophorone diisocyanate, cyclohexyl diisocyanate, tolylene diisocyanate (TDI), hydrogenated tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, polyphenylmethane polyisocyanate, xylene diisocyanate, hydrogenated xylene diisocyanate, tetramethylxylylene Diisocyanate, norbornene diisocyanate, naphthalene diisocyanate, Examples include methylolpropane / tolylene diisocyanate trimer adduct, trimethylolpropane / hexamethylene diisocyanate trimer adduct, isocyanate adducts such as hexamethylene diisocyanate isocyanurate, polyether polyisocyanate, polyester polyisocyanate, and the like. . These may be used alone or in combination of two or more.
また、本発明における（Ｃ）ポリイソシアネートの配合量としては、１．０〜５．０質量％であることが必要であり、より好ましくは２．０〜４．０質量％である。配合量が１．０質量％より少ない場合には、十分な凝集力が得られず、一方、配合量が５．０質量％を超える場合には粘着層が固くなりすぎて被着体への濡れ性が悪くなる。 Moreover, as a compounding quantity of (C) polyisocyanate in this invention, it is required that it is 1.0-5.0 mass%, More preferably, it is 2.0-4.0 mass%. When the blending amount is less than 1.0% by mass, sufficient cohesive force cannot be obtained. On the other hand, when the blending amount exceeds 5.0% by mass, the adhesive layer becomes too hard and adheres to the adherend. The wettability becomes worse.
（Ｄ）イオン性化合物
本発明に用いられる（Ｄ）イオン性化合物としては、アニオンとカチオンとからなる、２５℃で液体状、又は固体状のイオン性化合物が挙げられる。具体的には、アルカリ金属塩、イオン性液体（２５℃で液体状）、界面活性剤等が挙げられる。中でも、被着体を汚染しにくいという理由で、アルカリ金属塩が好ましい。
アルカリ金属塩としては、リチウム、ナトリウム、カリウム等のアルカリ金属カチオンと、アニオンとからなる化合物が挙げられ、具体的には、塩化ナトリウム、塩化カリウム、塩化リチウム、過塩素酸リチウム、塩素酸カリウム、硝酸カリウム、硝酸ナトリウム、炭酸ナトリウム、チオシアン酸ナトリウム、ＬｉＢｒ、ＬｉＩ、ＬｉＢＦ4、ＬｉＰＦ6、ＬｉＳＣＮ、酢酸ナトリウム、アルギン酸ナトリウム、リグニンスルホン酸ナトリウム、トルエンスルホン酸ナトリウム、ＬｉＣＦ3ＳＯ3、Ｌｉ（ＣＦ3ＳＯ2）2Ｎ、Ｌｉ（Ｃ2Ｆ5ＳＯ2）2Ｎ、Ｌｉ（ＣＦ3ＳＯ2）3Ｃ等が挙げられる。これらのアルカリ金属塩は、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。(D) Ionic Compound As the (D) ionic compound used in the present invention, a liquid or solid ionic compound composed of an anion and a cation at 25 ° C. may be mentioned. Specific examples include alkali metal salts, ionic liquids (liquid form at 25 ° C.), surfactants and the like. Of these, alkali metal salts are preferred because they are less likely to contaminate the adherend.
Examples of the alkali metal salt include compounds comprising an alkali metal cation such as lithium, sodium and potassium and an anion. Specifically, sodium chloride, potassium chloride, lithium chloride, lithium perchlorate, potassium chlorate, potassium nitrate, sodium nitrate, sodium carbonate, sodium thiocyanate, LiBr, LiI, LiBF 4, LiPF 6, LiSCN, sodium acetate, sodium alginate, sodium lignin sulfonate, sodium toluene sulfonate, LiCF 3 SO 3, Li ( CF 3 SO 2) 2 N, Li (C 2 F 5 SO 2) 2 N, Li (CF 3 SO 2) 3 C and the like. These alkali metal salts may be used alone or in combination of two or more.
また、本発明における（Ｄ）イオン性化合物の配合量としては、０．２〜１．０質量％であることが必要であり、より好ましくは０．３〜０．８質量％である。配合量が０．２質量％より少ない場合には、十分な帯電特性が得られず、一方、配合量が１．０質量％を超える場合には、被着体を汚染する。 Moreover, as a compounding quantity of (D) ionic compound in this invention, it is required that it is 0.2-1.0 mass%, More preferably, it is 0.3-0.8 mass%. When the blending amount is less than 0.2% by mass, sufficient charging characteristics cannot be obtained. On the other hand, when the blending amount exceeds 1.0% by mass, the adherend is contaminated.
（Ｅ）スズ系触媒
本発明における（Ｅ）スズ系触媒としては、ジブチル錫ジラウレート、ジブチル錫ジエチルヘキソエート、ジオクチル錫ジラウレート等が挙げられる。中でも、（Ｃ）ポリイソシアネートの硬化性が良好で且つ安全性が高いという理由で、ジオクチル錫ジラウレートが好ましい。(E) Tin-based catalyst Examples of the (E) tin-based catalyst in the present invention include dibutyltin dilaurate, dibutyltin diethylhexoate, and dioctyltin dilaurate. Of these, dioctyltin dilaurate is preferred because (C) the polyisocyanate has good curability and high safety.
また、本発明における（Ｅ）スズ系触媒の配合量としては、０．００５〜０．１質量％であることが必要であり、より好ましくは０．０１〜０．０５質量％である。配合量が０．００５質量％より少ない場合には、十分な凝集力が得られず、一方、配合量が０．１質量％を超える場合には、（メタ）アクリル系樹脂の安定性が悪くなりポットライフが短くなる。 Moreover, as a compounding quantity of the (E) tin-type catalyst in this invention, it is required to be 0.005-0.1 mass%, More preferably, it is 0.01-0.05 mass%. When the blending amount is less than 0.005% by mass, sufficient cohesive force cannot be obtained. On the other hand, when the blending amount exceeds 0.1% by mass, the stability of the (meth) acrylic resin is poor. The pot life will be shortened.
本発明の光学フィルム用粘着剤組成物は、酸価が０〜５ｍｇＫＯＨ／ｇであることが好ましく、０〜１ｍｇＫＯＨ／ｇであることがより好ましく、０〜０．３ｍｇＫＯＨ／ｇであることが更により好ましく、０〜０．１ｍｇＫＯＨ／ｇであることが最も好ましい。酸価が５ｍｇＫＯＨ／ｇより高いと、ＩＴＯフィルム等の腐食を嫌う材料に対して使用が困難になる。なお、組成物の酸価はＪＩＳ Ｋ００７０に準拠して測定した値である。例えば、以下のように測定する。
精密天秤で１００ｍｌ三角フラスコに試料約２ｇ程度を精秤し、これにエタノール／ジエチルエーテル＝１／１（質量比）の混合溶媒１０ｍｌを加えて溶解する。更に、この容器に指示薬としてフェノールフタレインエタノール溶液を１〜３滴添加し、試料が均一になるまで充分に撹拌する。これを、０．１Ｎ水酸化カリウム−エタノール溶液で滴定し、指示薬のうすい紅色が３０秒間続いたときを、中和の終点とする。その結果から下記の一般式（１）を用いて得た値を、組成物の酸価とする。The pressure-sensitive adhesive composition for an optical film of the present invention preferably has an acid value of 0 to 5 mgKOH / g, more preferably 0 to 1 mgKOH / g, and further preferably 0 to 0.3 mgKOH / g. More preferably, 0 to 0.1 mg KOH / g. If the acid value is higher than 5 mgKOH / g, it is difficult to use it for materials that are susceptible to corrosion, such as ITO films. The acid value of the composition is a value measured according to JIS K0070. For example, measurement is performed as follows.
About 2 g of a sample is precisely weighed into a 100 ml Erlenmeyer flask with a precision balance, and 10 ml of a mixed solvent of ethanol / diethyl ether = 1/1 (mass ratio) is added and dissolved therein. Further, 1 to 3 drops of phenolphthalein ethanol solution is added to this container as an indicator, and the mixture is sufficiently stirred until the sample becomes uniform. This is titrated with a 0.1N potassium hydroxide-ethanol solution, and the end point of neutralization is taken when the indicator is light red for 30 seconds. The value obtained from the result using the following general formula (1) is defined as the acid value of the composition.
上式中、Ｂは、０．１Ｎ水酸化カリウム−エタノール溶液の使用量（ｍｌ）であり、ｆは、０．１Ｎ水酸化カリウム−エタノール溶液のファクターであり、Ｓは、試料の採取量（ｇ）である。 In the above formula, B is the amount (ml) of 0.1N potassium hydroxide-ethanol solution used, f is the factor of 0.1N potassium hydroxide-ethanol solution, and S is the amount of sample collected ( g).
また、本発明の光学フィルム用粘着剤組成物には、透明性を損なわない範囲で、公知の各種添加剤を必要に応じて添加してもよい。添加剤としては、可塑剤、表面潤滑剤、レベリング剤、軟化剤、酸化防止剤、老化防止剤、光安定剤、紫外線吸収剤、重合禁止剤、ベンゾトリアゾール系等の光安定剤、リン酸エステル系及びその他の難燃剤、界面活性剤のような帯電防止剤等が挙げられる。 Moreover, you may add various well-known additives to the adhesive composition for optical films of this invention as needed in the range which does not impair transparency. Additives include plasticizers, surface lubricants, leveling agents, softeners, antioxidants, antioxidants, light stabilizers, UV absorbers, polymerization inhibitors, benzotriazole-based light stabilizers, phosphate esters System and other flame retardants, and antistatic agents such as surfactants.
また、本発明の光学フィルム用粘着剤組成物は、塗工時の粘度調整を目的として有機溶媒を用いて希釈してもよい。使用できる有機溶媒としては、例えば、メチルエチルケトン、アセトン、酢酸エチル、テトラヒドロフラン、ジオキサン、シクロヘキサノン、ｎ−へキサン、トルエン、キシレン、ｎ−プロパノール、イソプロパノール、酢酸ｎ−プロピル等が挙げられる。これらの有機溶媒は、単独で使用してもよいし、２種以上を混合して使用してもよい。 Moreover, you may dilute the adhesive composition for optical films of this invention using an organic solvent for the purpose of the viscosity adjustment at the time of coating. Examples of the organic solvent that can be used include methyl ethyl ketone, acetone, ethyl acetate, tetrahydrofuran, dioxane, cyclohexanone, n-hexane, toluene, xylene, n-propanol, isopropanol, and n-propyl acetate. These organic solvents may be used alone or in combination of two or more.
本発明の表面保護フィルムは、透明基材上の片面に、上記した光学フィルム用粘着剤組成物を硬化させて得られる粘着剤層が形成されているものである。粘着剤層の厚みは、通常、３〜１００μｍであり、好ましくは５〜５０μｍである。
透明基材としては、例えば、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、ポリスチレン、ポリイミド、ポリビニルアルコール、ポリ塩化ビニル、セルロース等を挙げることができる。透明基材の厚みは、通常、５〜２００μｍ、好ましくは１０〜１００μｍ程度である。
なお、透明基材の片面には、必要に応じて、シリコーン系、フッ素系、長鎖アルキル系等の離型剤による離型処理及び防汚処理、酸処理、アルカリ処理、プライマー処理、コロナ処理、プラズマ処理、紫外線処理等の易接着処理を施すこともできる。
また、透明基材としては、帯電防止処理されているものがより好ましく用いられる。透明基材に施される帯電防止処理としては特に限定されないが、一般的に用いられる透明基材の少なくとも片面に帯電防止層を設ける方法や透明基材に帯電防止剤を練り込む方法を用いることができる。In the surface protective film of the present invention, a pressure-sensitive adhesive layer obtained by curing the above-described pressure-sensitive adhesive composition for optical films is formed on one side of a transparent substrate. The thickness of the pressure-sensitive adhesive layer is usually 3 to 100 μm, preferably 5 to 50 μm.
Examples of the transparent substrate include polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, and cellulose. The thickness of the transparent substrate is usually about 5 to 200 μm, preferably about 10 to 100 μm.
In addition, on one side of the transparent substrate, if necessary, release treatment and antifouling treatment with a release agent such as silicone, fluorine, long chain alkyl, acid treatment, alkali treatment, primer treatment, corona treatment Further, easy adhesion treatment such as plasma treatment or ultraviolet treatment can be performed.
Further, as the transparent substrate, those subjected to antistatic treatment are more preferably used. The antistatic treatment applied to the transparent substrate is not particularly limited, but a method of providing an antistatic layer on at least one side of a commonly used transparent substrate or a method of kneading an antistatic agent on the transparent substrate is used. Can do.
なお、本発明の表面保護フィルムにおける粘着剤層の形成には、公知のコーティング法（塗工法）を用いることが可能であり、慣用のコーター、例えば、グラビヤロールコーター、リバースロールコーター、キスロールコーター、ディップロールコーター、バーコーター、ナイフコーター、スプレーコーター、コンマコーター、ダイレクトコーター等を用いてコーティングすることができる。 In addition, in the formation of the pressure-sensitive adhesive layer in the surface protective film of the present invention, a known coating method (coating method) can be used. Conventional coaters such as gravure roll coaters, reverse roll coaters, kiss roll coaters Coating can be performed using a dip roll coater, bar coater, knife coater, spray coater, comma coater, direct coater or the like.
本発明の表面保護フィルムには、必要に応じて粘着面を保護する目的で粘着剤層表面にセパレーターを貼り合わせることが可能である。セパレーターを構成する基材としては紙やプラスチックフィルムがあるが、表面平滑性に優れる点からプラスチックフィルムが好適に用いられる。そのフィルムとしては、上記した粘着剤層を保護し得るフィルムであれば特に限定されず、例えば、ポリエチレンフィルム、ポリプロピレンフィルム、ポリエチレンテレフタレートフィルム、ポリブテンフィルム等が挙げられる。 In the surface protective film of the present invention, a separator can be bonded to the surface of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface as necessary. As a base material constituting the separator, there are paper and plastic film, but a plastic film is preferably used from the viewpoint of excellent surface smoothness. The film is not particularly limited as long as it can protect the above-mentioned pressure-sensitive adhesive layer, and examples thereof include a polyethylene film, a polypropylene film, a polyethylene terephthalate film, and a polybutene film.
上記のように構成した本発明の表面保護フィルムは、粘着面の表面固有抵抗値が１．０×１０10Ω／□以下で且つヘイズが１．２以下であるので、静電気が発生しやすいプラスチック製品などに用いられる。中でも、液晶ディスプレイなどに用いられる偏光板、波長板、位相差板、光学補償フィルム、反射シート、輝度向上フィルムなどの光学部材表面を保護する目的で用いられる表面保護フィルムとして好適に用いることができる。Since the surface protective film of the present invention configured as described above has a surface specific resistance value of an adhesive surface of 1.0 × 10 10 Ω / □ or less and a haze of 1.2 or less, it is a plastic that easily generates static electricity. Used for products. Among them, it can be suitably used as a surface protective film used for the purpose of protecting the surface of an optical member such as a polarizing plate, a wave plate, a retardation plate, an optical compensation film, a reflection sheet, and a brightness enhancement film used for a liquid crystal display. .
以下に実施例及び比較例により本発明をより具体的に説明するが、本発明は、これらの例によって何ら限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples, but the present invention is not limited to these examples.
＜（メタ）アクリル系樹脂（Ａ−１）〜（Ａ−３）の合成＞
冷却管、窒素導入管、温度計及び撹拌装置を備えた反応容器に、酢酸ｎ−プロピル ５００質量部、２−エチルヘキシルアクリレート ２６５質量部（０．５３ｍｏｌ）、イソボルニルアクリレート ４１質量部（０．０７ｍｏｌ）、メチルメタクリレート １０５質量部（０．３９ｍｏｌ）、２−ヒドロキシエチルアクリレート ２質量部（０．００７ｍｏｌ）及び２，２’−アゾビス（イソブチロニトリル） ０．４質量部を入れ、窒素気流中で９５℃にて８時間重合を行い、ガラス転移温度−３０℃、重量平均分子量２５万の（メタ）アクリル系樹脂（Ａ−１）を得た。なお、（メタ）アクリル系樹脂のガラス転移温度及び重量平均分子量の測定は、先に述べた方法により行った。
また、（メタ）アクリル系樹脂（Ａ−２）及び（メタ）アクリル系樹脂（Ａ−３）は、使用するモノマーを表１のように変更した以外は（メタ）アクリル系樹脂（Ａ−１）と同様にして合成した。（メタ）アクリル系樹脂（Ａ−２）〜（Ａ−３）についても、ガラス転移温度及び重量平均分子量の測定を行った。結果を表１に示す。<Synthesis of (meth) acrylic resins (A-1) to (A-3)>
In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer and a stirring device, 500 parts by mass of n-propyl acetate, 265 parts by mass of 2-ethylhexyl acrylate (0.53 mol), 41 parts by mass of isobornyl acrylate (0. 07 mol), 105 parts by mass of methyl methacrylate (0.39 mol), 2 parts by mass of 2-hydroxyethyl acrylate (0.007 mol) and 0.4 parts by mass of 2,2′-azobis (isobutyronitrile) Polymerization was carried out at 95 ° C for 8 hours to obtain a (meth) acrylic resin (A-1) having a glass transition temperature of -30 ° C and a weight average molecular weight of 250,000. The glass transition temperature and the weight average molecular weight of the (meth) acrylic resin were measured by the method described above.
Moreover, (meth) acrylic resin (A-2) and (meth) acrylic resin (A-3) are (meth) acrylic resins (A-1) except that the monomers used are changed as shown in Table 1. ). The glass transition temperature and the weight average molecular weight were also measured for (meth) acrylic resins (A-2) to (A-3). The results are shown in Table 1.
＜実施例１〜２及び比較例１〜７＞
表２に示す組成で（メタ）アクリル系樹脂、ポリオキシアルキレンポリオール、ポリイソシアネート、イオン性化合物及びスズ系触媒を配合し、更に、酢酸エチルで固形分濃度を５０質量％に調節し、室温下でディスパーを用いて混合することで光学フィルム用粘着剤組成物溶液を得た。この溶液を、厚さ３８μｍのポリエチレンテレフタレート（ＰＥＴ）フィルムの片面に剥離処理が施されてなるセパレーターの剥離処理面上に、乾燥後の厚さが５０μｍとなるように流延塗布し、５０℃で５分間及び１１０℃で３分間、加熱乾燥させ、更に厚さ５０μｍのＰＥＴフィルムを貼り合せ、粘着シートを作製した。<Examples 1-2 and Comparative Examples 1-7>
(Meth) acrylic resin, polyoxyalkylene polyol, polyisocyanate, ionic compound and tin-based catalyst are blended with the composition shown in Table 2, and the solid content concentration is adjusted to 50% by mass with ethyl acetate. Then, a pressure-sensitive adhesive composition solution for an optical film was obtained by mixing using a disper. This solution was cast and applied on a release surface of a separator obtained by subjecting one side of a 38 μm-thick polyethylene terephthalate (PET) film to a release treatment so that the thickness after drying was 50 μm. For 5 minutes and at 110 ° C. for 3 minutes, and then a PET film having a thickness of 50 μm was bonded to prepare an adhesive sheet.
＜酸価＞
前記の方法で各組成物の酸価を測定した。結果を表２に示す。<Acid value>
The acid value of each composition was measured by the method described above. The results are shown in Table 2.
＜表面固有抵抗値＞
得られた粘着シートを４０×４０ｍｍの大きさに切断した後、これを温度２３℃及び相対湿度６５％の環境下に３時間放置し調湿した後、セパレーターを剥がしてＪＩＳ Ｋ６９１１に記載の方法で粘着面の表面固有抵抗を測定した。結果を表２に示す。なお、表面固有抵抗値が小さいほど帯電防止性能が高いことを意味する。<Surface specific resistance value>
After the obtained pressure-sensitive adhesive sheet is cut into a size of 40 × 40 mm, this is left to stand for 3 hours in an environment of a temperature of 23 ° C. and a relative humidity of 65%, and then the humidity is adjusted. Then, the separator is peeled off and the method described in JIS K6911 Then, the surface resistivity of the adhesive surface was measured. The results are shown in Table 2. In addition, it means that antistatic performance is so high that a surface specific resistance value is small.
＜透明性＞
得られた粘着シートを３０ｍｍ×３０ｍｍの大きさに切り取り、粘着シートのセパレーターを剥がし、ガラス板に貼り合わせたものを測定用サンプルとした。測定用サンプルについて、株式会社村上色彩技術研究所製「ＨＲ−１００型」を使用し、ヘイズメーター ＮＭ−１５０（株式会社村上色彩技術研究所製）を用いてヘイズの測定を行った。ヘイズ（％）は拡散透過率を全光線透過率で除し、１００を乗じて算出した。なお、ｎ数は３回とし、その平均値を採用した。全光線透過率（％）を測定した。結果を表２に示す。なお、ヘイズ値は値が小さいほど透明性が高いことを意味する。<Transparency>
The obtained pressure-sensitive adhesive sheet was cut into a size of 30 mm × 30 mm, the separator of the pressure-sensitive adhesive sheet was peeled off, and the sample was bonded to a glass plate was used as a measurement sample. About the sample for a measurement, haze was measured using Haze meter NM-150 (made by Murakami Color Research Laboratory Co., Ltd.) using "HR-100 type" by Murakami Color Technology Laboratory Co., Ltd. The haze (%) was calculated by dividing the diffuse transmittance by the total light transmittance and multiplying by 100. In addition, n number was made into 3 times and the average value was employ | adopted. Total light transmittance (%) was measured. The results are shown in Table 2. In addition, haze value means that transparency is so high that a value is small.
＜粘着シートの粘着力測定＞
得られた粘着シートを２５ｍｍ×１００ｍｍの大きさに切り取り、粘着シートのセパレーターを剥がし、粘着面（測定面）を試験板に貼付して、２ｋｇのゴムローラー（幅：約５０ｍｍ）を１往復させて、測定用サンプルを作製した。試験板としてガラス板を用いた。得られた測定用サンプルを、温度２３℃及び相対湿度５０％の環境下に２４時間放置した後、ＪＩＳ Ｚ０２３７に準じて、剥離速度３００ｍｍ／分で１８０°方向の引張試験を行い、粘着シートのガラス板に対する粘着力（Ｎ／２５ｍｍ）を測定した。得られた測定値を粘着力とした。結果を表２に示す。<Measurement of adhesive strength of adhesive sheet>
The obtained pressure-sensitive adhesive sheet is cut into a size of 25 mm × 100 mm, the separator of the pressure-sensitive adhesive sheet is peeled off, the pressure-sensitive adhesive surface (measurement surface) is attached to the test plate, and a 2 kg rubber roller (width: about 50 mm) is reciprocated once Thus, a measurement sample was prepared. A glass plate was used as a test plate. The obtained measurement sample was allowed to stand for 24 hours in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and then subjected to a tensile test in the 180 ° direction at a peeling rate of 300 mm / min in accordance with JIS Z0237. The adhesive force (N / 25 mm) to the glass plate was measured. The obtained measured value was defined as adhesive strength. The results are shown in Table 2.
＜被着体への汚染性＞
上で得られた粘着シートを５０ｍｍ×５０ｍｍの大きさに切り取り、セパレーターを剥がしガラス板に張り合わせた。このサンプルを７０℃で５日間放置した後、粘着シートを剥がしガラス表面への汚染性を目視で確認し、下記基準で評価した。結果を表２に示す。
○：貼り合せ前のガラス表面と比較して変化なし。
×：ガラス表面に糊残りが確認される。<Contamination to adherend>
The pressure-sensitive adhesive sheet obtained above was cut into a size of 50 mm × 50 mm, the separator was peeled off, and it was attached to a glass plate. After leaving this sample at 70 ° C. for 5 days, the pressure-sensitive adhesive sheet was peeled off, the contamination on the glass surface was visually confirmed, and the following criteria were evaluated. The results are shown in Table 2.
○: No change compared to the glass surface before bonding.
X: Adhesive residue is confirmed on the glass surface.
Claims (8)
（Ｂ）ポリオキシアルキレンポリオール １０〜３０質量％と、
（Ｃ）ポリイソシアネート １．０〜５．０質量％と、
（Ｄ）イオン性化合物 ０．２〜１．０質量％と、
（Ｅ）スズ系触媒 ０．００５〜０．１質量％と
を含む光学フィルム用粘着剤組成物であって、
（Ａ）（メタ）アクリル系樹脂が共重合成分として水酸基含有（メタ）アクリル系モノマーを０．５〜１０ｍｏｌ％含み且つその重量平均分子量が１０万〜６０万であり、且つ（Ｂ）ポリオキシアルキレンポリオールの数平均分子量が５００〜１５００である光学フィルム用粘着剤組成物であって、前記光学フィルム用粘着剤組成物の酸価が０〜５ｍｇＫＯＨ／ｇであることを特徴とする光学フィルム用粘着剤組成物。 (A) (meth) acrylic resin 65-85 mass%,
(B) 10-30 mass% of polyoxyalkylene polyol,
(C) Polyisocyanate 1.0 to 5.0 mass%,
(D) ionic compound 0.2-1.0 mass%,
(E) a tin-based catalyst, 0.005 to 0.1% by mass, and an optical film pressure-sensitive adhesive composition comprising:
(A) (meth) hydroxyl group-containing acrylic resin is a copolymer component (meth) weight average molecular weight of and its containing 0.5 to 10 mol% of an acrylic monomer is 100,000 to 600,000, and (B) poly a number average molecular weight of Ru der 500-1500 light optical film pressure-sensitive adhesive composition of polyoxyalkylene polyol, the acid value of the optical film pressure-sensitive adhesive composition characterized in that it is a 0~5mgKOH / g An adhesive composition for optical films .
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| JP2012276951 | 2012-12-19 | ||
| PCT/JP2013/077644 WO2014097719A1 (en) | 2012-12-19 | 2013-10-10 | Adhesive composition for optical film and surface-protective film |
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| JP6899339B2 (en) * | 2018-01-24 | 2021-07-07 | 日東電工株式会社 | Surface protective film and optical member with protective film |
| CN112752817A (en) * | 2018-09-26 | 2021-05-04 | 昭和电工株式会社 | Adhesive composition for surface protection sheet and surface protection sheet |
| CN113261091A (en) * | 2018-12-05 | 2021-08-13 | 琳得科株式会社 | Composite sheet for forming protective film and method for manufacturing semiconductor chip |
| CN111534248B (en) * | 2020-05-25 | 2023-04-21 | 中国乐凯集团有限公司 | Pressure-sensitive adhesive, preparation method thereof, surface protective film and element |
| CN113583282B (en) * | 2021-09-10 | 2023-01-17 | 中国科学技术大学先进技术研究院 | Antistatic optical film, preparation method thereof and display panel |
| WO2024080146A1 (en) * | 2022-10-14 | 2024-04-18 | 日東電工株式会社 | Adhesive composition, adhesive sheet and reinforcement film |
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| JP4562070B2 (en) * | 2004-05-14 | 2010-10-13 | 日東電工株式会社 | Adhesive composition, adhesive sheet, and surface protective film |
| KR100694445B1 (en) * | 2004-08-24 | 2007-03-12 | 주식회사 엘지화학 | Acrylic pressure sensitive adhesive having antistaic property |
| JP2010006980A (en) | 2008-06-27 | 2010-01-14 | Sanyo Chem Ind Ltd | Antistatic adhesive |
| JP5210078B2 (en) * | 2008-07-31 | 2013-06-12 | ビッグテクノス株式会社 | Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling |
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