JP6146801B2 - Wiring board and electronic device - Google Patents

Description

  The present invention relates to a wiring board having a multilayer wiring structure and an electronic device in which an electronic element is connected to the wiring board.

  It has become clear that the propagation characteristics of electromagnetic waves can be controlled by periodically arranging conductor patterns having a specific structure (hereinafter referred to as metamaterials). Among metamaterials, a material that can inhibit the propagation of electromagnetic waves in a specific frequency band is called an electromagnetic band gap (EBG) structure. Patent Documents 1 and 2 disclose a technique for suppressing the propagation of electromagnetic noise inside the wiring board and reducing unnecessary resonance and radiation by introducing this EBG structure into the wiring board.

  For example, FIG. 4, a so-called mushroom-type EBG structure in which a plurality of island-shaped conductor elements are arranged in a layer between two conductor planes facing each other, and each of the island-shaped conductor elements is connected to the conductor plane by vias, and The modification is shown. Patent Document 2 also shows an example in which an EBG structure is arranged on a wiring board.

US Patent Application Publication No. 2005/0195051 JP 2006-302986 A

  However, when the EBG structure is introduced into an actual wiring board, the conductor elements must be arranged avoiding signal wiring and other patterns on the wiring board, so that a sufficient number of conductor elements are provided on the entire wiring board. It is difficult to arrange them uniformly. In particular, when a limited number of conductor elements are arranged in a part of the wiring board, unnecessary resonance can be excited, and it is difficult to obtain an electromagnetic noise suppression effect.

  The present invention has been made in view of the above circumstances. An object of the present invention is to provide a wiring board that can sufficiently reduce the emission of electromagnetic noise even with a limited number of conductor elements.

According to the present invention,
A wiring board having at least a first layer, a second layer, and a third layer,
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided so as to overlap the first conductor in plan view, and the second conductor and a third conductor electrically connected by a third connecting member are disposed,
Wherein the third layer, in the region overlapping the first conductor in a plan view, on the outer edge of each of the two points, such as the mutual distance is maximum, a quarter of a wavelength at the frequency of a certain electromagnetic noise each of the first region at a distance of less than 1, the second conductor are arranged one by at least one,
The second conductor and the first conductor or the third conductor are electrically connected by a second connecting member ;
A wiring board is provided in which the first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic bandgap structure .

According to the present invention,
Having at least a first layer, a second layer, and a third layer;
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided so as to overlap the first conductor in plan view, and the second conductor and a third conductor electrically connected by a third connecting member are disposed,
Wherein the third layer of the realm overlapping the first conductor in a plan view, from each of the two points, such as the mutual distance is maximum on the outer edge, a quarter of a wavelength at the frequency of a certain electromagnetic noise of each of the first region at a distance of less than 1, the second conductor are arranged one by at least one,
The second conductor and the first conductor or the third conductor are electrically connected by a second connecting member ;
The first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic band gap structure ;
There is provided an electronic device including an electronic element connected to the wiring board via the first and second terminals.

  According to the present invention, electromagnetic noise radiated from a wiring board can be sufficiently reduced even with a limited number of conductor elements.

It is a figure which shows the structure of the wiring board which concerns on 1st embodiment. It is a top view of the C layer of the wiring board shown in FIG. It is a top view of the B layer of the wiring board shown in FIG. It is a top view of the A layer of the wiring board shown in FIG. It is a figure which illustrates about various forms of an EBG structure. It is a figure which shows the other structure of the wiring board which concerns on 1st embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

<First embodiment>
Hereinafter, a wiring board according to a first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing a configuration of a wiring board 100 according to the first embodiment. FIG. 1A is an example of a plan view of the wiring board 100 according to the present embodiment. FIG. 1B is a cross-sectional view taken along line AA ′ in FIG. FIG. 1C is a cross-sectional view taken along line B-C in FIG. A wiring substrate 100 shown in FIG. 1 is a multilayer substrate including at least an A layer 110 (second layer), a B layer 120 (third layer), and a C layer 130 (first layer). The A layer 110 includes a second conductor plane 111 (third conductor). The B layer 120 includes a conductor element 122 (second conductor). The C layer 130 includes a first conductor plane 131 (first conductor). In the present embodiment, as shown in FIG. 1C, the conductor element 122 and the first conductor plane 131 are electrically connected via a connection member 123 (second connection member). Note that the wiring board 100 may include a layer other than the three layers described above. For example, an insulating layer may be located between the layers, or another layer may be located.

  In addition, the wiring board 100 may include holes, vias, and the like (not shown) as long as they do not contradict the configuration of the present invention. Further, in any one or more of the A layer 110, the B layer 120, and the C layer 130, signal lines may be arranged within a range that does not contradict the configuration of the present invention.

  Note that in FIG. 1B and the like, the electronic element 141 is indicated by a dotted line. This means that the electronic element 141 is not mounted. That is, a planned area for mounting the electronic element 141 is defined on the surface of the wiring board 100. The planned area is provided with a first terminal and a second terminal for connecting the wiring board 100 and the electronic element 141.

  The wiring board 100 includes a connection member 142 (first connection member) and a connection member 143 (third connection member). The connection member 142 electrically connects the first terminal and the first conductor plane 131. Thereby, when the electronic element 141 is connected, the electronic element 141 and the first conductor plane 131 located in the C layer 130 are electrically connected. The connection member 143 electrically connects the second terminal and the second conductor plane 111 located on the A layer 110. Thereby, when the electronic element 141 is connected, the electronic element 141 and the second conductor plane 111 positioned in the A layer 110 are electrically connected.

  In addition to this, the wiring board 100 may include a connection member that electrically connects the electronic element 141 and a plane or a line. An example of such a connection member is a connection member that is electrically connected to a signal line or the like. Here, the electronic element 141 is assumed to be an element such as an LSI (Large Scale Integration). The number of electronic elements 141 mounted on the wiring board 100 may be single or plural.

  FIG. 2 is a plan view of the C layer 130 of the wiring board 100 shown in FIG. The C layer 130 has a first conductor plane 131 made of a conductive material separated in an island shape.

  The first conductor plane 131 has a connection point that is electrically connected to the connection member 142 and the connection member 123. The first conductor plane 131 is a power plane or a ground plane. In addition, the 1st conductor plane 131 can take various shapes according to a prior art. The region where the first conductor plane 131 is not formed in the C layer 130 may be an insulator, a conductor, or a mixture thereof.

  FIG. 3 is a plan view of the B layer 120 of the wiring board 100 shown in FIG. In the present embodiment, the B layer 120 is located between the C layer 130 and the A layer 110. The B layer 120 has a conductor element arrangement region 121 (first region: a region indicated by oblique lines), which is a region where the conductor element 122 is arranged. This “conductor element arrangement region 121” has two points (points B and 120) at which the distance between the first conductor plane 131 and the first conductor plane 131 in the B layer 120 is maximized on the outer edge. C) is a region having a distance less than a quarter of the wavelength at the frequency of the noise to be suppressed. In FIG. 1C, the conductor element arrangement region 121 is shown as a region surrounded by a broken line. At least one or more conductor elements 122 are arranged in each of the conductor element arrangement regions 121. Thereby, it is possible to suppress the resonance generated in the first conductor plane 131 with a small number of conductor elements 122, and a sufficient electromagnetic noise suppressing effect can be obtained.

  The “noise to be suppressed” is, for example, noise generated by the clock frequency of the electronic element 141 and its harmonics and propagating from the electronic element 141 to the first conductor plane 131 via the connection member 142. Among such noises, noise in a frequency band used in wireless communication is a factor that degrades the performance of wireless communication, and thus suppression is particularly desired. Further, “the conductor element 122 is arranged in the conductor element arrangement region 121” means that at least a part of the conductor element 122 is located in the conductor element arrangement region 121. In order to suppress electromagnetic noise more accurately, it is desirable that all the conductor elements 122 are located in the conductor element arrangement region 121.

  The B layer 120 may be provided with a signal wiring (not shown) or the like, and a part thereof may extend into the conductor element arrangement region 121. Therefore, the conductor element 122 is arranged in an empty space inside the conductor element arrangement region 121 so as to avoid signal wiring and the like. Of course, the conductor element 122 may be additionally arranged in an area other than the conductor element arrangement area 121.

  Further, the number of conductor elements 122 provided in each conductor element arrangement region 121 is not particularly limited. The number of conductor elements 122 provided in each conductor element arrangement region 121 may be single or plural. When a plurality of conductor elements 122 are provided in the conductor element arrangement region 121, the conductor elements 122 may be repeatedly arranged periodically. For example, the conductor elements 122 may be arranged at predetermined intervals. A region of the B layer 120 where the conductor elements 122 are not arranged is an insulator and is insulated from the connection member 142. The conductor element 122 is electrically connected to the first conductor plane 131 via the connection member 123.

  In this embodiment, an example is shown in which all the conductor elements 122 are electrically connected to the first conductor plane 131 via the connection member 123, but the embodiment of the present invention is not limited to this. For example, all the conductor elements 122 may be electrically connected to the second conductor plane 111 via the connection member 123. Further, the conductor element 122 electrically connected to the first conductor plane 131 and the conductor element 122 electrically connected to the second conductor plane 111 may be mixed.

  4 is a plan view of the A layer 110 of the wiring board 100 shown in FIG. The second conductor plane 111 is a sheet-like conductor and is located on the A layer 110. Further, the second conductor plane 111 extends to a region on the A layer 110 facing the conductor element arrangement region 121. That is, the second conductor plane 111 and the conductor element 122 are opposed to each other with the insulator layer interposed therebetween. In each figure, the A layer 110 is shown as a layer positioned higher than the C layer 130, but the positional relationship between the A layer 110 and the C layer 130 is not limited to this. For example, the A layer 110 may be located in a lower layer than the C layer 130.

  The second conductor plane 111 is a power supply plane or a ground plane. That is, when the first conductor plane 131 is a power supply plane, the second conductor plane 111 is a ground plane. Further, when the first conductor plane 131 is a ground plane, the second conductor plane 111 is a power plane.

  The connection member 142 passes through the opening provided in the second conductor plane 111 without contacting the second conductor plane 111. In addition, the connection member 142 electrically connects the first terminal and the first conductor plane 131. That is, the connection member 142 is insulated from the second conductor plane 111. In the A layer 110, the region where the second conductor plane 111 is not formed may be an insulator, a conductor, or a mixture thereof.

  The wiring board 100 according to the present embodiment is configured as described above, so that the conductor element 122, the first conductor plane 131, the second conductor plane 111, and the connection member 123 form an EBG structure. A unit cell which is the smallest unit is configured.

  The EBG structure is adjusted by adjusting the distance between the conductor element 122 and the first conductor plane 131, the distance between the conductor element 122 and the second conductor plane 111, the thickness of the connection member 123, the mutual distance between the conductor elements 122, and the like. Can be set to a desired band. Thereby, the frequency of the electromagnetic wave noise to be suppressed can be included in the band cap band of the EBG structure.

  Here, the shapes and positions of the conductor element 122, the connecting member 123, the first conductor plane 131, and the second conductor plane 111 illustrated in FIGS. 1 to 4 are merely examples, and there are various types within a range in which the EBG structure can be configured. Can take form. Hereinafter, examples of various forms of the EBG structure will be described.

  FIG. 5 is a diagram illustrating various forms of the EBG structure. FIG. 5 focuses on the single conductor element 122 and enlarges the periphery thereof. Each structure illustrated in FIG. 5 constitutes a unit cell, and the wiring board 100 includes any one of these unit cells or a combination of a plurality of these unit cells.

  FIG. 5A is a top view of an example of the conductor element 122. The conductor element 122 shown here is a spiral transmission line formed in a planar direction. One end of the transmission line formed in the conductor element 122 shown in FIG. 5A is connected to the connection member 123, and the other end is an open end. FIG. 5B is a top view of another example of the conductor element 122. The conductor element 122a and the conductor element 122b illustrated here are two helical transmission lines formed in a planar direction. One end of each of the conductor elements 122a and 122b shown in FIG. 5B is connected to the connection member 123, and the other end of each is an open end. 5C to 5J are cross-sectional views in which main portions of the wiring board 100 including the conductor element 122 illustrated in FIGS. 5A and 5B are extracted.

  In FIG. 5C, the conductor element 122 is electrically connected to the first conductor plane 131 via the connection member 123.

  In FIG. 5D, the conductor element 122 is electrically connected to the second conductor plane 111 through the connection member 123.

  In FIG. 5E, the B layer 120 in which the conductor element 122 is formed has the C layer 130 in which the first conductor plane 131 is formed via the A layer 110 in which the second conductor plane 111 is formed. Opposite. The connection member 123 is electrically connected to the first conductor plane 131 and passes through the opening provided in the second conductor plane 111 in a state that is not in contact with the second conductor plane 111. The conductor element 122 faces the second conductor plane 111 and is electrically connected to the connection member 123 that has passed through the opening provided in the second conductor plane 111. In the opening provided in the second conductor plane 111 described here, the connection member 123 passes through the opening, and the conductor element 122 is disposed so as to face the opening. Therefore, noise leakage from the opening can be substantially prevented.

  In FIG. 5F, the B layer 120 in which the conductor element 122 is formed is the same as the A layer 110 in which the second conductor plane 111 is formed via the C layer 130 in which the first conductor plane 131 is formed. Opposite. The connection member 123 is electrically connected to the second conductor plane 111 and passes through the opening provided in the first conductor plane 131 without contacting the first conductor plane 131. The conductor element 122 faces the first conductor plane 131 and is electrically connected to the connection member 123 that has passed through the opening provided in the first conductor plane 131. In the opening provided in the first conductor plane 131 described here, the connection member 123 passes through the opening, and the conductor element 122 is disposed so as to face the opening. Therefore, noise leakage from the opening can be substantially prevented.

  The structure shown in FIGS. 5C to 5F is an open stub type EBG structure in which a microstrip line including the conductor element 122 functions as an open stub. Specifically, the connection member 123 forms an inductance. 5C and 5E, a conductor strip 122 is electrically coupled to the opposing second conductor plane 111 so that a microstrip line having the second conductor plane 111 as a return path is formed. Forming. 5D and 5F, a microstrip line using the first conductor plane 131 as a return path by electrically connecting the conductor element 122 to the opposing first conductor plane 131 is shown. Forming.

  The open stub type EBG structure can be expressed by an equivalent circuit in which a parallel plate is shunted by a series resonant circuit including the open stub and the inductance. The resonance frequency of the series resonance circuit provides the center frequency of the band gap. Therefore, the band gap band can be lowered by increasing the stub length of the open stub formed including the conductor element 122. In the case where the conductor element 122 has the configuration shown in FIG. 5A, a band gap is generated in one frequency band and its higher frequency band corresponding to one conductor element 122. In the case where the conductor element 122 has the configuration shown in FIG. 5B, the band gap is divided into two frequency bands corresponding to the lengths of the two conductor elements 122a and 122b and higher frequency bands thereof. Occurs.

  The plane (111 or 131) facing the conductor element 122 forming the microstrip line is preferably close. This is because the shorter the distance between the conductor element 122 and the opposing plane, the lower the characteristic impedance of the microstrip line and the wider the band gap band. However, even when the conductor element 122 is not brought close to the opposing plane, the essential effect of the present invention is not affected at all.

  FIGS. 5G to 5J are examples in which the connection member 123 is a through via.

  In FIG. 5G, the through via (connecting member 123) electrically connected to the conductor element 122 is electrically connected to the first conductor plane 131, and the opening of the second conductor plane 111 is opened to the second. The conductor plane 111 passes in a non-contact state. That is, the through via (connecting member 123) and the second conductor plane 111 are insulated.

  In FIG. 5H, the through via (connecting member 123) that is electrically connected to the conductor element 122 is electrically connected to the second conductor plane 111, and the opening of the first conductor plane 131 is opened to the first. The conductor plane 131 passes in a non-contact state. That is, the through via (connecting member 123) and the first conductor plane 131 are insulated.

  In FIG. 5 (I), the B layer 120 in which the conductor element 122 is formed has the C layer 130 in which the first conductor plane 131 is formed via the A layer 110 in which the second conductor plane 111 is formed. Opposite. The through via (connecting member 123) is electrically connected to the first conductor plane 131 and passes through the opening provided in the second conductor plane 111 in a non-contact manner with the second plane 111. ing. The conductor element 122 faces the second conductor plane 111 and is electrically connected to a through via (connecting member 123) that has passed through an opening provided in the second conductor plane 111.

  In FIG. 5J, the B layer 120 in which the conductor element 122 is formed is different from the A layer 110 in which the second conductor plane 111 is formed via the C layer 130 in which the first conductor plane 131 is formed. Opposite. The through via (connecting member 123) is electrically connected to the second conductor plane 111 and passes through the opening provided in the first conductor plane 131 in a non-contact manner with the first conductor plane 131. doing. The conductor element 122 faces the first conductor plane 131 and is electrically connected to a through via (connection member 123) that has passed through an opening provided in the first conductor plane 131.

  The structures shown in FIGS. 5G to 5J are modifications of the open stub type EBG structure in which a microstrip line including the conductor element 122 functions as an open stub. Specifically, the connection member 123 forms an inductance. 5 (G) and 5 (I), the conductor element 122 is electrically coupled to the opposing second conductor plane 111, whereby the second conductor plane 111 serves as a return path. Is forming. 5H and 5J, the conductor element 122 is electrically coupled to the opposing first conductor plane 131, so that the first conductor plane 131 serves as a return path. Is forming. One end of the microstrip line is an open end and is configured to function as an open stub.

  Similarly to the open stub type EBG structure, the structure shown in FIGS. 5G to 5J can be expressed by an equivalent circuit in which a parallel plate is shunted by a series resonance circuit including the open stub and the inductance. it can. The resonance frequency of the series resonance circuit provides the center frequency of the band gap. Therefore, the band gap band can be lowered by increasing the stub length of the open stub formed including the conductor element 122. In the case where the conductor element 122 has the configuration shown in FIG. 5A, a band gap is generated in one frequency band and its higher frequency band corresponding to one conductor element 122. In the case where the conductor element 122 has the configuration shown in FIG. 5B, the band gap is divided into two frequency bands corresponding to the lengths of the two conductor elements 122a and 122b and higher frequency bands thereof. Occurs.

  The plane (111 or 131) facing the conductor element 122 forming the microstrip line is preferably close. This is because the shorter the distance between the conductor element 122 and the opposing plane, the lower the characteristic impedance of the microstrip line and the wider the band gap band. However, even when the conductor element 122 is not brought close to the opposing plane, the essential effect of the present invention is not affected at all.

  By adopting the configuration shown in FIGS. 5G to 5J, it is possible to manufacture the EBG structure on the first and second parallel plates using the through via as the connection member 123. Normally, non-through vias are stacked after processing the vias for each layer, whereas through vias, all layers are stacked, then through holes are formed with a drill and the inner surface of the through hole is plated. Therefore, the manufacturing cost can be reduced as compared with the case of using a non-through via.

  In addition, although the case where the shape of the said transmission line is helical is illustrated in FIG. 5, the shape is not limited to this. The shape of the transmission line may be, for example, a linear shape or a meander shape.

  Further, FIG. 1 shows an example in which one B layer 120 is provided on the wiring board 100, but a plurality of B layers 120 may be provided. The wiring board 100 provided with a plurality of B layers 120 can take a configuration in which various EBG structure configurations shown in FIGS. 5C to 5J are mixed. For example, as shown in FIG. 6, the EBG structure shown in FIG. 5C is formed in part, and the EBG structure shown in FIG. 5F is formed in the other part. it can. FIG. 6 is a diagram showing another configuration of the wiring board 100 according to the first embodiment. Here, when the wiring board 100 is viewed in a plan view, like the wiring board 100 shown in FIG. 1, it appears that the conductor elements 122 are arranged in each conductor element arrangement region 121. That is, in this case as well, two points (points B and B) having the maximum distance from each other on the outer edge in the regions facing each other in the plan view of the first conductor plane 131 when the B layers 120 are viewed comprehensively. From the point C), at least one or more conductors are arranged in each of the conductor element arrangement regions 121 (first regions: regions indicated by hatching in the drawing) that are regions less than a quarter of the wavelength at the noise frequency to be suppressed. Element 122 (second conductor) is disposed. Therefore, the effect of the present invention can also be obtained by the wiring board 100 as shown in FIG.

  Next, the effect of this embodiment will be described with reference to FIG.

  As shown in FIG. 1, in the case of the wiring board 100 in which the electronic element 141 and the first conductor plane 131 are electrically connected via the connecting member 142, the electronic element 141 is connected to the first through the connecting member 142. Electromagnetic noise is propagated to a region sandwiched between the first conductor plane 131 and the second conductor plane 111. At this time, the length of the longest portion in the shape of the first conductor plane 131 (a line segment connecting two points selected so that the distance between them is maximum on the outer edge of the first conductor plane 131) is an electromagnetic wave. When it approximately matches an integral multiple of the length of one half of the wavelength of the noise, a resonance state occurs and a standing wave is generated. Since this standing wave has an antinode with the maximum electric field in the vicinity of the two points on the outer edge of the first conductor plane 131, there is a possibility that electromagnetic noise may be radiated to the space due to the same effect as the patch antenna. is there.

  The wiring board of the present embodiment is configured to be able to solve the above problem. That is, in the present embodiment, the conductor element arrangement is located at a distance less than a quarter of the wavelength of the electromagnetic noise from each of the two points selected so as to maximize the distance between each other on the outer edge of the first conductor plane 131. In the region 121, at least one EBG structure formed including the conductor element 122 is disposed. By controlling the impedance between the first conductor plane 131 and the second conductor plane 111 to be inductive in a desired band, the EBG structure develops a band gap in the band. The impedance between the first conductor plane 131 and the second conductor plane 111 shows inductance at a distance less than a quarter of the wavelength from the place where the unit cell of the EBG structure is arranged, and is further away from it. Capacitance is shown by the impedance conversion effect at the position. Therefore, the propagation of electromagnetic waves is suppressed at a location less than a quarter of the wavelength from the location where the unit cell is arranged, and it cannot become an antinode of standing waves. The wiring board of the present embodiment has two points selected so that the distance between each other is maximized on the outer edge of the first conductor plane 131 by arranging at least one EBG structure in the conductor element arrangement region 121. It is configured so that the vicinity does not become an antinode of standing waves. As described above, the wiring board according to the present embodiment can suppress the first conductor plane 131 from operating in the same manner as the patch antenna and radiating electromagnetic noise to the space.

  Therefore, according to the present embodiment, by arranging a limited number of conductor elements at suitable locations on the wiring board, a sufficient number of conductor elements are uniformly arranged to avoid signal wiring and other patterns. Even in an actual wiring board that is difficult to do, electromagnetic noise radiation can be effectively reduced.

  In addition, by including the frequency of noise generated from the electronic element 141 in the band gap band of the EBG structure configured in the present embodiment, a higher noise suppression effect can be obtained.

  In the electronic device in which the electronic element 141 is mounted at a predetermined position of the wiring board 100 according to the present embodiment, the same function and effect can be realized. The means for mounting the electronic element 141 at a predetermined position of the wiring board 100 of the present embodiment can be realized according to the prior art.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

Hereinafter, examples of the reference form will be added.
1.
A wiring board having at least a first layer, a second layer, and a third layer,
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided opposite to the first conductor, and the second terminal and a third conductor electrically connected by a third connection member are disposed,
In the third layer, a quarter of the wavelength at the frequency of the electromagnetic noise to be suppressed is selected from each of two points where the distance from each other is maximized on the outer edge in the region facing the first conductor in plan view. At least one second conductor provided to face at least one of the first conductor and the third conductor in the first region at a distance of less than 1.
A wiring board in which the second conductor and the first conductor or the third conductor are electrically connected by a second connecting member.
2.
1. A wiring board according to claim 1,
The first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic bandgap structure, and the electromagnetic bandgap structure is a frequency of electromagnetic noise to be suppressed. Wiring board that includes the band gap.
3.
1. Or 2. A wiring board according to claim 1,
The wiring board, wherein the second conductor is linear, one end is connected to the second connecting member, and the other end is an open end.
4).
The wiring board according to any one of claims 1 to 3,
The third layer is a wiring board located in a region sandwiched between the first layer and the second layer.
5).
1. To 3. A wiring board according to any one of
The third layer is located outside a region sandwiched between the first layer and the second layer;
The second connecting member passes through an opening provided in the first conductor or the third conductor in a state of non-contact with the first conductor or the third conductor, and the second conductor and the third conductor A wiring board for electrically connecting a conductor or the first conductor.
6).
1. To 3. A wiring board according to any one of
The third layer is disposed at least one in each of a region sandwiched between the first layer and the second layer and a region sandwiched between the first layer and the second layer,
The second conductor is a wiring board disposed in the first region when the plurality of third layers are viewed in plan view.
7).
Having at least a first layer, a second layer, and a third layer;
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided opposite to the first conductor, and the second terminal and a third conductor electrically connected by a third connection member are disposed,
In the third layer, a quarter of the wavelength at the frequency of the electromagnetic noise to be suppressed is selected from each of two points where the distance from each other is maximized on the outer edge in the region facing the first conductor in plan view. At least one second conductor provided to face at least one of the first conductor and the third conductor in the first region at a distance of less than 1.
A wiring board in which the second conductor and the first conductor or the third conductor are electrically connected by a second connecting member;
An electronic element connected to the wiring board via the first and second terminals;
Including electronic devices.
8).
7). An electronic device according to claim 1,
The first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic bandgap structure, and the electromagnetic bandgap structure is a frequency of electromagnetic noise to be suppressed. An electronic device that includes a band gap.
9.
7). Or 8. An electronic device according to claim 1,
The electronic device, wherein the second conductor is linear, one end is connected to the second connecting member, and the other end is an open end.
10.
7). To 9. An electronic device according to any one of
The third layer is an electronic device located in a region sandwiched between the first layer and the second layer.
11.
7). To 9. An electronic device according to any one of
The third layer is located outside a region sandwiched between the first layer and the second layer;
The second connecting member passes through an opening provided in the first conductor or the third conductor in a state of non-contact with the first conductor or the third conductor, and the second conductor and the third conductor An electronic device for electrically connecting a conductor or the first conductor.
12
7). To 9. An electronic device according to any one of
The third layer is disposed at least one in each of a region sandwiched between the first layer and the second layer and a region sandwiched between the first layer and the second layer,
The second conductor is an electronic device arranged in the first region when the plurality of third layers are viewed in a plan view.

DESCRIPTION OF SYMBOLS 100 Wiring board 110 A layer 111 2nd conductor plane 120 B layer 121 Conductor element arrangement | positioning area 122 Conductor element 122a Conductor element 122b Conductor element 123 Connection member 130 C layer 131 1st conductor plane 141 Electronic element 142 Connection member 143 Connection member

Claims (7)

A wiring board having at least a first layer, a second layer, and a third layer,
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided so as to overlap the first conductor in plan view, and the second conductor and a third conductor electrically connected by a third connecting member are disposed,
Wherein the third layer, in the region overlapping the first conductor in a plan view, on the outer edge of each of the two points, such as the mutual distance is maximum, a quarter of a wavelength at the frequency of a certain electromagnetic noise each of the first region at a distance of less than 1, the second conductor are arranged one by at least one,
The second conductor and the first conductor or the third conductor are electrically connected by a second connecting member ;
The wiring board , wherein the first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic band gap structure . The wiring board according to claim 1,
Before SL EBG structure, the wiring board including the frequency of the certain electromagnetic noise in band gaps. The wiring board according to claim 1 or 2,
The wiring board, wherein the second conductor is linear, one end is connected to the second connecting member, and the other end is an open end. The wiring board according to any one of claims 1 to 3,
The third layer is a wiring board located in a region sandwiched between the first layer and the second layer. The wiring board according to any one of claims 1 to 3,
The third layer is located in a region outside the region sandwiched between the first layer and the second layer,
It said second connecting member, wherein the opening provided in the first conductor or the third conductor, passes by the first conductor or the third state conductor and insulated, and the second conductor, the first A wiring board for electrically connecting three conductors or the first conductor. The wiring board according to any one of claims 1 to 3,
Said third layer, said first layer and said second layer region sandwiched by, and at least one each disposed in each said first layer wherein the outer region of the region sandwiched between the second layer, of And
It said second conductor wiring substrate disposed on either of said first region of the plurality of the third layer. Having at least a first layer, a second layer, and a third layer;
A first terminal and a second terminal for connecting the electronic element;
In the first layer, at least one first conductor electrically connected to the first terminal by a first connecting member is disposed,
The second layer is provided so as to overlap the first conductor in plan view, and the second conductor and a third conductor electrically connected by a third connecting member are disposed,
Wherein the third layer of the realm overlapping the first conductor in a plan view, from each of the two points, such as the mutual distance is maximum on the outer edge, a quarter of a wavelength at the frequency of a certain electromagnetic noise of each of the first region at a distance of less than 1, the second conductor are arranged one by at least one,
The second conductor and the first conductor or the third conductor are electrically connected by a second connecting member ;
The first conductor, the second conductor, the third conductor, and the second connecting member constitute at least a part of an electromagnetic band gap structure ;
And an electronic device connected to the wiring board via the first and second terminals.

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