JP6030938B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as a “wafer”) is divided into semiconductor chips (pieces) into a predetermined shape, and an adhesive sheet having a size straddling the pieces. (Original sheet) is affixed, the original sheet is cleaved, and a sheet having a size corresponding to each piece is attached to each piece (for example, see Patent Document 1).

JP 2009-81333 A

  However, in the conventional apparatus described in Patent Document 1, a laser beam is irradiated between each piece for cutting the original sheet, so that a very large and precise device is required, and the apparatus is large. And there is a disadvantage that the control becomes complicated.

  The objective of this invention is providing the sheet sticking apparatus and sheet sticking method which can cleave an original sheet, without causing the enlargement of an apparatus and complication of control.

In order to achieve the above object, a sheet sticking device of the present invention is a sheet sticking device for sticking a sheet to a piece disposed with a predetermined gap, on one surface of a plurality of pieces. A support means for supporting the sheet pasted body with the original sheet straddled across from the original sheet side, and a release sheet having a size straddling the plurality of piece-like bodies are attached to the other surface of the piece-like body A pasting means, a pasting means for pasting the original sheet and the peeling sheet located in the gap by deforming at least one of the original sheet and the peeling sheet toward the gap, and the peeling The structure which is equipped with the peeling means which cleaves the said original sheet | seat by peeling the sheet | seat for use from the said piece body is employ | adopted.

On the other hand, the sheet sticking method of the present invention is a sheet sticking method in which a sheet is stuck on a piece disposed with a predetermined gap, and an original sheet is stuck across one surface of a plurality of pieces. A step of supporting the sheet pasted body from the original sheet side, a step of pasting a release sheet having a size straddling the plurality of strips on the other surface of the strips, and the gap By deforming at least one of the original sheet and the peeling sheet, the step of bonding the original sheet and the peeling sheet located in the gap, and the peeling sheet are peeled from the piece. Thus , a configuration is provided that includes a step of cleaving the original sheet .

  According to the present invention as described above, the size corresponding to the piece-like body can be obtained by simply bonding the original sheet located in the gap between the piece-like body and the release sheet and peeling the release sheet from the piece-like body. Since the sheet can be affixed to each piece, the increase in size and complexity of the control can be suppressed.

  At this time, if at least one of the original sheet and the release sheet is softened, the original sheet and the release sheet are easily bonded.

The side view of the sheet sticking apparatus which concerns on embodiment of this invention. Operation | movement explanatory drawing of embodiment. The figure which shows the example of mounting of a piece-like body.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the following embodiments, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, when viewed from the front side of FIG. 1 parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis, “down” being the opposite direction, and “left” being the X axis. In the arrow direction, “right” is the opposite direction, “front” is the arrow direction of the Y axis, and “rear” is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 1 includes a sheet AS1 (see FIG. 2C) on a semiconductor chip CP (hereinafter sometimes simply referred to as “chip”) CP as a piece disposed with a predetermined gap SP. ), And supporting means 2 for supporting, from the original sheet AS side, the sheet application body SB to which the original sheet AS is applied across the lower surface CPB as one surface of the plurality of chips CP. Affixing means 3 for affixing a peeling sheet PS having a size over a plurality of chips CP to an upper surface CPT as the other surface of the chip CP, and a presser for pressing the peeling sheet PS from the upper surface CPT side of the chip CP The means 5, the softening means 6 comprising heating means such as a coil heater and an infrared heater for softening at least one of the original sheet AS and the peeling sheet PS, and the gap SP Then, by deforming at least one of the original sheet AS and the release sheet PS, the bonding means 7 for bonding the original sheet AS and the release sheet PS located in the gap SP, and the release sheet PS are formed into chips CP. The peeling means 8 which peels from is provided. The plurality of chips CP are formed by cutting the wafer into a lattice shape, and have a substantially circular shape as a whole. Further, as the sheet AS1, a heat-sensitive adhesive sheet having a single-layer structure made of only an adhesive is employed.

  The support means 2 includes a suction table 21 having a support surface 22 that supports the sheet sticking body SB, and a decompression pump such as a decompression pump or a vacuum ejector connected to an intake / exhaust hole (not shown) provided on the support surface 22 via a pipe 24. Means 23. Note that the support surface 22 is subjected to non-adhesion treatment by silicon coating or the like.

The affixing means 3 includes a feeding means 30 for feeding the peeling sheet PS having a width wider than the front and rear widths of the plurality of chips CP having a generally circular shape, and a peeling sheet PS fed by the feeding means 30 for the chip CP. And pressing means 40 for pressing and sticking to the upper surface CPT. Note that the adhesive force at which the peeling sheet PS adheres to the original sheet AS is set to be weaker than the adhesive force at which the original sheet AS adheres to the chip CP.
The feeding means 30 includes a pinch roller 34 that sandwiches the peeling sheet PS between a support roller 31 that supports the peeling sheet PS and a driving roller 33 that is driven by a rotation motor 32 as a driving device, a guide roller 35, And a collection roller 37 that is driven by a rotation motor 36 as a drive device and collects the peeling sheet PS.
The pressing means 40 is rotatably supported by a linear motion motor 43 as a drive device supported by a first slider 42 of a linear motor 41 as a drive device and a bracket 45 supported by an output shaft 44 of the linear motion motor 43. The pressing roller 46 is provided.

The pressing means 5 includes a pressing plate 53 supported by an output shaft 52 of a direct acting motor 51 as a driving device.
The pasting means 7 is composed of a pressurizing means such as a pressurizing pump or a turbine connected to an intake / exhaust hole (not shown) provided on the support surface 22 via a pipe 71, and the softening means 6 is arranged in the middle of the pipe 71. The heated gas can be ejected from an intake / exhaust hole (not shown).

  The peeling means 8 includes a frame 82 supported by an output shaft (not shown) of a linear motion motor 81 as a drive device supported by the second slider 47 of the linear motor 41 and a rotation as a drive device supported by the frame 82. A peeling roller 84 driven by a motor 83 and a pinch roller 85 for sandwiching the peeling sheet PS between the peeling roller 84 are provided.

In the above sheet sticking apparatus 1, a procedure for sticking the sheet AS1 to each chip CP will be described.
First, the operator sets the peeling sheet PS as shown in FIG. 1 while the first and second sliders 42 and 47 of the linear motor 41 are stopped at the positions shown by the solid lines in FIG. Thereafter, when an operation start signal is input via an operation panel (not shown), a sheet sticking body forming unit (not shown) is driven to stick the original sheet AS across the lower surfaces CPB of the plurality of chips CP, Form body SB. Next, when the conveying means (not shown) places the sheet sticking body SB on the support surface 22 of the suction table 21, the supporting means 2 drives the decompression means 23 and sucks and holds the sheet sticking body SB through the intake / exhaust holes (not shown).
Next, after the pressing means 40 drives the linear motion motor 43 and the linear motor 41 to lower the pressing roller 46, the first slider 42 is moved to the position indicated by the two-dot chain line in FIG. PS is stuck on the upper surface CPT of each chip CP.

Next, after the pressing means 5 drives the linear motion motor 51 and the pressing plate 53 is lowered to press the peeling sheet PS from above as shown in FIG. Stop driving.
Thereafter, the softening means 6 and the bonding means 7 are driven, and the gas ejected by the bonding means 7 is heated by the softening means 6 as hot air as shown in FIG. Spray on the original sheet AS from the pores. Thereby, the original sheet AS located in the gap SP is deformed toward the peeling sheet PS, and the original sheet AS and the peeling sheet PS are bonded. When the original sheet AS enters the gap SP, the original sheet AS also adheres to four side surfaces CPS orthogonal to the XY plane of each chip CP.

Next, after the softening means 6 and the bonding means 7 stop driving, the support means 2 drives the decompression means 23 and sucks and holds the sheet paste SB, and then the pressing means 5 drives the linear motion motor 51 and presses it. The plate 53 is raised.
Thereafter, the peeling means 8 drives the linear motion motor 81 and the rotation motor 83 to lower the frame 82 and then rotates the peeling roller 84. At the same time, the pressing means 40 drives the linear motor 41, and the second The slider 47 is moved to a position indicated by a two-dot chain line in FIG. As a result, as shown in FIG. 2C, the peeling sheet PS is peeled from the upper surface CPT of the chip CP, and the original sheet AS portion adhered to the peeling sheet PS between the chips CP is defined as a sheet removal portion AS2. Cleavage (removal) accompanying the release sheet PS. The original sheet AS from which the sheet removal portion AS2 has been removed is affixed to the chip CP as a sheet AS1 that is affixed to the lower surface CPB and the side surfaces CPS of the chip CP.

Thereafter, after the peeling means 8 stops driving the rotation motor 83, the linear motion motor 81 is driven to raise the frame 82, and the pressing means 40 drives the linear motion motor 43 to raise the pressure roller 46. .
Next, the chip CP to which the sheet AS1 is attached is conveyed by a pick-up device, a conveying device or the like (not shown). When a die attach film is used as the sheet AS1, for example, the chip CP is heated and mounted on the substrate BD from the lower surface CPB side as shown in FIG. In this case, since the lower part of the sheet AS1 is deformed by heat and bonded to the substrate BD in a spread state, the bonding area increases, and the chip CP can be firmly mounted on the substrate BD. Further, when a cover resin is used as the sheet AS1, for example, as shown in FIG. 3B, the chip CP is mounted on the substrate BD with the five surfaces covered with an adhesive ADA.

  When each chip CP is removed from the support surface 22, the pressing means 40 drives the linear motor 41 with the peeling means 8 stopping the rotation motor 83, and the first and second sliders 42 and 47 are illustrated. 1 Return to the position indicated by the solid line. In synchronism with this movement, the feeding means 30 drives the rotation motors 32 and 36 to feed the peeling sheet PS from the support roller 31 and winds the peeling sheet PS to which the sheet removal portion AS2 is attached by the collection roller 37. Thereafter, the same operation as described above is repeated.

  According to the embodiment as described above, the original sheet AS located in the gap SP of the chip CP and the peeling sheet PS are bonded, and the peeling sheet PS is peeled off from the chip CP. Since the sheet AS1 having a size can be attached to each chip CP, an increase in size of the apparatus and a complicated control can be suppressed.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, an intake / exhaust hole (not shown) similar to that of the support means 2 is provided on the lower surface of the presser plate 53, and a decompression means such as a decompression pump or a vacuum ejector is connected to the intake / exhaust hole via a pipe, thereby Both of the sheets PS may be deformed toward the gap SP, or only the peeling sheet PS may be deformed toward the gap SP without providing the support means 2 with the intake / exhaust holes, the pipe 24, and the pressure reducing means 23. .
Further, the softening means 6 may not be provided, and when the peeling sheet PS is deformed, hot air is supplied from the intake and exhaust holes (not shown) provided on the lower surface of the pressing plate 53 as described above in the same manner as in the above embodiment. Both the original sheet AS and the peeling sheet PS may be softened, or only the peeling sheet PS may be softened without providing the softening means 6 connected to the support means 2.
Moreover, the bonding means 7 may eject liquid, a gel-like thing, etc. other than gas, and the member which protrudes from the support surface 22 as the bonding means 7 is used, and an original sheet | seat is used by the said member. AS may be adhered to the release sheet PS.
Furthermore, the decompression means 23 may employ a gas, liquid, gel, or the like that can be sucked by the bonding means 7.
Further, as the softening means 6, heating means such as a heater may be provided outside the suction table 21, and the original sheet AS may be heated from above or from the side, or the atmosphere of the original sheet AS may be heated. Good. In addition, when the original sheet AS and the release sheet PS are softened by other than heating, the softening means can appropriately adopt a configuration according to them, for example, the original sheet AS and the release sheet PS are cold, ultraviolet, When softening with a microwave or the like, a cold air blower, an ultraviolet irradiation device, a microwave irradiation device or the like can be employed as the softening means.

In addition, the material, type, shape, and the like of the original sheet AS, the peeling sheet PS, and the piece-like body in the present invention are not particularly limited. For example, the original sheet AS and the release sheet PS are not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a pressure-sensitive adhesive is used, the original sheet AS and There is no need to provide a heating means for heating the peeling sheet PS. In addition, the original sheet AS and the release sheet PS are, for example, those having three or more layers, such as those having an intermediate layer between the base sheet and the adhesive layer, and having a cover layer on the upper surface of the base sheet. Further, it may be a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without a layer. In addition, as a piece, for example, food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disc, a glass plate, a steel plate, a ceramic, a wooden plate, or a resin plate, Arbitrary forms of members and articles can also be targeted. In addition, the original sheet AS is replaced with a functional and intended reading, for example, any shape such as a label for information description, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming sheet, etc. Any sheet, film, tape or the like can be attached to any piece as described above.
Moreover, the peeling sheet PS may be an adhesive sheet, and may not be an adhesive sheet as long as the original sheet AS has adhesiveness.
Further, the width of the peeling sheet PS may be narrower than the front-rear width of the plurality of chips CP that are generally circular.
Further, the sheet AS1 may be attached only to the lower surface CPB without being attached to each side surface CPS of the chip CP.

  The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 2 ... Supporting means 3 ... Sticking means 6 ... Softening means 7 ... Bonding means 8 ... Peeling means AS ... Original sheet AS1 ... Sheet CP ... Semiconductor chip (single body)
PS ... Peeling sheet SB ... Sheet paste SP ... Gap

Claims (2)

A sheet sticking device for sticking a sheet to a piece disposed with a predetermined gap,
A supporting means for supporting the sheet sticking body on which the original sheet is stuck across one surface of the plurality of pieces, from the original sheet side;
A sticking means for sticking a peeling sheet having a size straddling the plurality of pieces to the other surface of the pieces;
Bonding means for bonding the original sheet and the release sheet positioned in the gap by deforming at least one of the original sheet and the release sheet toward the gap;
A sheet sticking apparatus comprising: a peeling unit that cleaves the original sheet by peeling the peeling sheet from the piece. A sheet sticking method for sticking a sheet to a piece disposed with a predetermined gap,
A step of supporting, from the original sheet side, a sheet patch in which the original sheet is affixed across one surface of the plurality of pieces,
A step of applying a release sheet having a size across the plurality of pieces to the other surface of the pieces;
Bonding at least one of the original sheet and the release sheet toward the gap to bond the original sheet and the release sheet located in the gap;
And a step of cleaving the original sheet by peeling the release sheet from the piece.

Images