JP6061220B2 - LED lighting device - Google Patents
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Description
本発明は、屋外の支柱等に取り付けられるＬＥＤ照明装置に関し、特に放熱性に優れたＬＥＤ照明装置に関する。 The present invention relates to an LED lighting device attached to an outdoor column or the like, and more particularly to an LED lighting device having excellent heat dissipation.
近年、環境意識の高まりから、省電力化に優れたＬＥＤ素子を光源に使用したＬＥＤ照明装置が盛んに用いられるようになってきており、屋外の支柱等に取り付けられる道路灯、駐車場灯、防犯灯などにも使用されるようになってきている。一方、このような屋外灯には、高輝度のＬＥＤ素子が使用されるため、点灯時ＬＥＤ素子が高温になり、明るさ低下や、使用可能時間が短くなる等の問題が生じるため、ＬＥＤ素子の放熱を改善した照明器具が開発されている。 In recent years, with increasing environmental awareness, LED lighting devices using LED elements with excellent power savings as light sources have been actively used, such as road lights, parking lot lights, It is also used for security lights. On the other hand, such outdoor lamps use high-luminance LED elements, so that when the LED elements are turned on, the LED elements become hot, causing problems such as reduced brightness and shorter usable time. Lighting fixtures with improved heat dissipation have been developed.
特許文献１に記載されている道路用照明器具では、金属製の取付板と、前記取付板の一端部側に配置されるＬＥＤユニットと、前記取付板の他端部側に配置される電源ユニットと、本体外側から内側に臨むように取り付けられる金属製のアームとを備え、前記取付板は、前記アームに固定されている。
また特許文献２に記載されているＬＥＤ照明灯では、複数個のＬＥＤ素子を有するＬＥＤ光源体と、前記ＬＥＤ光源体が取り付けられた放熱体とを備えており、前記放熱体の全長が蛍光灯規格に対応して設定されており、前記放熱体の長手方向両端部に、既存の蛍光灯器具のソケット部に係脱可能な端子状係合部を有している。
In the road lighting apparatus described in Patent Document 1, a metal mounting plate, an LED unit disposed on one end side of the mounting plate, and a power supply unit disposed on the other end side of the mounting plate And a metal arm attached so as to face the inside from the outside of the main body, and the attachment plate is fixed to the arm.
Further, the LED illumination lamp described in Patent Document 2 includes an LED light source body having a plurality of LED elements and a heat radiating body to which the LED light source body is attached, and the total length of the heat radiating body is a fluorescent lamp. It is set in accordance with the standard, and has a terminal-like engagement portion that can be engaged with and disengaged from a socket portion of an existing fluorescent lamp fixture at both longitudinal ends of the radiator.
しかしながら、特許文献１に記載されている道路灯では、金属製の取付板の片面にＬＥＤユニットが取り付けられ、その裏面に電源ユニットが取り付けられるため、ＬＥＤユニットから、電源ユニットに熱が伝導し、電源ユニットにある電子部品を劣化させる虞がある。
特許文献２に記載されているＬＥＤ照明灯においても、同公報の段落００２４や、図１から図４に示されているように、ＬＥＤ光源体が取り付けられた放熱体の裏側に点灯回路が取り付けられているため、ＬＥＤ素子からの熱が点灯回路に伝熱しやすく、電子部品の劣化を招く虞がある。
However, in the road light described in Patent Document 1, since the LED unit is attached to one side of the metal mounting plate and the power unit is attached to the back side, heat is conducted from the LED unit to the power unit, There is a risk of deteriorating electronic components in the power supply unit.
Also in the LED illuminating lamp described in Patent Document 2, the lighting circuit is attached to the back side of the heat radiating body to which the LED light source body is attached as shown in paragraph 0024 of FIG. 1 and FIG. 1 to FIG. Therefore, the heat from the LED element is likely to be transferred to the lighting circuit, which may cause deterioration of the electronic component.
本発明は、以上のような課題を解決するため鋭意検討した結果なされたものであり、ＬＥＤ素子で発生した熱を、点灯回路を構成する電子部品に伝熱させず、該電子部品の劣化を防ぎ、なおかつＬＥＤ素子で発生した熱を、照明装置の外部に効率的に放熱させることによって、明るさが低下せず、長寿命なＬＥＤ照明装置を提供するものである。 The present invention has been made as a result of intensive studies to solve the above-described problems. The heat generated in the LED elements is not transferred to the electronic components constituting the lighting circuit, and the electronic components are deteriorated. The present invention provides a long-life LED illuminating device that prevents the brightness from decreasing and efficiently dissipates heat generated in the LED element to the outside of the illuminating device.
請求項１に記載の発明にあたっては、ＬＥＤ素子を実装したＬＥＤ基板と、点灯回路基板と、を収容したＬＥＤランプ本体を、熱伝導性の取付手段で被取付体に取り付けるＬＥＤ照明装置において、前記ＬＥＤランプ本体の内部に、前記取付手段の一端側が挿入され、
前記取付手段の一端側に、前記ＬＥＤ基板が熱伝導可能に接合され、前記点灯回路基板が、前記取付手段から離して配置されていることを特徴とするものである。
In the invention according to claim 1, in the LED lighting device in which the LED lamp body in which the LED board on which the LED element is mounted and the lighting circuit board are accommodated is attached to the attached body by means of thermally conductive attachment. One end side of the attachment means is inserted inside the LED lamp body,
The LED board is joined to one end side of the attaching means so as to be capable of conducting heat, and the lighting circuit board is arranged apart from the attaching means.
請求項２に記載の発明にあたっては、前記ＬＥＤランプ本体の外殻は樹脂材料で形成されており、前記点灯回路基板は、樹脂製の電源ボックスに収容され、前記電源ボックスは、前記ＬＥＤランプ本体の外郭に取り付けられており、かつ前記電源ボックスと前記取付手段との間には、空間部が形成されていることを特徴とするものである。 In the invention according to claim 2, the outer shell of the LED lamp body is formed of a resin material, the lighting circuit board is accommodated in a resin power box, and the power box is connected to the LED lamp body. And a space portion is formed between the power supply box and the attachment means.
請求項３に記載の発明にあたっては、前記点灯回路基板と、前記電源ボックスの内壁面との間に空間部が形成されていることを特徴とするものである。 According to a third aspect of the present invention, a space is formed between the lighting circuit board and an inner wall surface of the power supply box.
請求項４に記載の発明にあたっては、前記電源ボックスに、通風用の貫通孔が形成されていることを特徴とするものである。 According to a fourth aspect of the present invention, the power supply box has a through hole for ventilation.
請求項１に記載の発明によれば、ＬＥＤ素子で発生した熱は、熱伝導性の取付手段に伝導し、ＬＥＤランプ本体の外に放熱され、かつ該点灯回路基板と取付手段の間には断熱するための空間があり、電子部品の熱劣化が防止されるので、明るさが低下せず、長寿命なＬＥＤ照明装置を提供できる。 According to the first aspect of the present invention, the heat generated in the LED element is conducted to the thermally conductive mounting means, radiated to the outside of the LED lamp body, and between the lighting circuit board and the mounting means. Since there is a space for heat insulation and thermal deterioration of the electronic components is prevented, the LED illumination device with a long life can be provided without reducing the brightness.
請求項２に記載の発明によれば、前記ＬＥＤランプ本体の樹脂製外殻に樹脂製電源ボックスが取り付けられており、なおかつ前記電源ボックスと前記取付手段との間には、断熱性の空間があるので、ＬＥＤで発生した熱が更に点灯回路基板には伝導しにくくなっており、電子部品の熱劣化が抑制される。 According to the invention described in claim 2, a resin power box is attached to the resin outer shell of the LED lamp body, and a heat insulating space is provided between the power box and the attachment means. As a result, the heat generated by the LEDs is more difficult to conduct to the lighting circuit board, and thermal degradation of the electronic components is suppressed.
請求項３の発明によれば、点灯回路基板で発生した熱が、対流と循環によって周囲の空間に放熱され、電気部品の温度上昇が抑制される。 According to invention of Claim 3, the heat which generate | occur | produced in the lighting circuit board is radiated by the surrounding space by a convection and a circulation, and the temperature rise of an electrical component is suppressed.
請求項４の発明によれば、電子部品で発生した熱で暖められた空気が上昇し、電源ボックスの上面に形成された貫通孔を通って、前記取付手段や、前記ＬＥＤランプ本体の外殻に達し放熱され、冷却された空気が下降し、電源ボックスの下面に形成された貫通孔を通って、該電源ボックスに流入し電子部品が冷却されるので、更に電子部品の温度上昇が抑制される。 According to the invention of claim 4, the air heated by the heat generated in the electronic component rises and passes through the through-hole formed in the upper surface of the power supply box, and the mounting means and the outer shell of the LED lamp body , The cooled air descends, passes through a through-hole formed in the lower surface of the power supply box, flows into the power supply box, and cools the electronic component, further suppressing the temperature rise of the electronic component. The
以下に本発明の好適な実施形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。図１は、本実施形態のＬＥＤ照明装置１００が被取付手段である支柱２００に取り付けられた外観図である。図２は、本実施形態に係わるＬＥＤ照明装置１００の外観斜視図である。図３は、本実施形態に係わるＬＥＤランプ本体１０の背面図である。図４は、本実施形態に係わるＬＥＤ照明装置１００のＸ−Ｘ線断面図である。図５は、本実施形態に係わる支持手段近傍のＸ−Ｘ線拡大断面斜視図である。図６は、本実施形態に係わる電源ボックス近傍のＹ−Ｙ線、Ｚ−Ｚ線拡大断面斜視図である。図７は、本実施形態に係わるＬＥＤ照明装置１００の分解斜視図である。 Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this. FIG. 1 is an external view in which the LED lighting device 100 according to the present embodiment is attached to a column 200 that is an attached means. FIG. 2 is an external perspective view of the LED lighting device 100 according to the present embodiment. FIG. 3 is a rear view of the LED lamp body 10 according to the present embodiment. FIG. 4 is a sectional view taken along line XX of the LED lighting device 100 according to the present embodiment. FIG. 5 is an enlarged cross-sectional perspective view along the line XX in the vicinity of the support means according to the present embodiment. FIG. 6 is an enlarged cross-sectional perspective view of the YY line and ZZ line near the power supply box according to the present embodiment. FIG. 7 is an exploded perspective view of the LED lighting device 100 according to the present embodiment.
本実施形態に係わるＬＥＤ照明装置１００は、被取付手段である屋外に設けられた支柱２００に取り付けて使用される防犯灯であり、ＬＥＤランプ本体１０と、該ＬＥＤランプ本体１０を、支柱２００へ取り付けるための取付手段であるアーム２０とを備えている。なお被取付体は、支柱に限らず壁面、枠体等であってもよい。 The LED lighting device 100 according to the present embodiment is a security light that is used by being attached to a support column 200 provided outdoors as an attached means. The LED lamp body 10 and the LED lamp body 10 are connected to the support column 200. And an arm 20 as attachment means for attachment. In addition, a to-be-attached body may be not only a support | pillar but a wall surface, a frame, etc.
ＬＥＤランプ本体１０の外郭は、下面開口の筐体１１と、該下面開口を覆う透光性カバー１２とから構成されている。
ＬＥＤランプ本体１０の内部には、複数のＬＥＤ素子１を実装したＬＥＤ基板２と、ＬＥＤ基板２を載置する支持板３と、電子部品４が実装された点灯回路基板５を内蔵した電源ボックス６とが、概略収容されている。
The outer periphery of the LED lamp main body 10 includes a housing 11 having a lower surface opening and a translucent cover 12 that covers the lower surface opening.
Inside the LED lamp main body 10 is a power supply box containing an LED substrate 2 on which a plurality of LED elements 1 are mounted, a support plate 3 on which the LED substrate 2 is mounted, and a lighting circuit substrate 5 on which electronic components 4 are mounted. 6 is generally accommodated.
アーム２０は鋼板を使用して、該アーム２０の断面が、アーム下面２１と２つのアーム側面２２、２３とからなるコの字形状で、被取付手段にヘの字状に屈曲するように成形されている。図１に示すように、アーム２０の一端側は、該アーム２０の開口部が上側を向くように、ＬＥＤランプ本体１０挿入されて固定され、他端側は、簡易取付金具２１０を使用して支柱２００に取り付けられる。 The arm 20 is made of a steel plate, and the cross section of the arm 20 is formed in a U shape including an arm lower surface 21 and two arm side surfaces 22 and 23, and is bent so as to be bent in a U shape on the mounting means. Has been. As shown in FIG. 1, the LED lamp body 10 is inserted and fixed at one end side of the arm 20 so that the opening of the arm 20 faces upward, and a simple mounting bracket 210 is used at the other end side. Attached to the column 200.
筐体１１は、ポリブチレンテレフタレート樹脂を用いて、細長い船形に成形されている。この筐体１１には、支柱２００に取り付けた時に、被照射面となる路面と対向する側に、略直方体形状の枠体で囲われた開口面が形成されている。また図３に示すように、支柱２００に対向する筐体１１の背面側の外殻には、アーム２０の断面形状に対応した上側にコの字が向いたコ字形の貫通スリット１３（図３の斜線部分）が備えられている。
アーム２０は、貫通スリット１３に、アーム２０の先端部が挿入されて、ＬＥＤランプ本体１０に固定される。本実施形態では、アーム２０は、筐体１１の長手方向の半分程度まで挿入されているが、全長に渡るように挿入されていてもよい。
The casing 11 is formed into a long and narrow ship shape using polybutylene terephthalate resin. The housing 11 is formed with an opening surface surrounded by a substantially rectangular parallelepiped frame on the side facing the road surface that is the irradiated surface when attached to the support column 200. Further, as shown in FIG. 3, the outer shell on the back side of the casing 11 facing the support column 200 has a U-shaped through slit 13 (FIG. 3) with a U-shape facing upward corresponding to the cross-sectional shape of the arm 20. The shaded portion of FIG.
The arm 20 is fixed to the LED lamp body 10 by inserting the tip of the arm 20 into the through slit 13. In the present embodiment, the arm 20 is inserted up to about half of the longitudinal direction of the housing 11, but may be inserted over the entire length.
透光性カバー１２は、ポリカーボネート樹脂を使用して船形に成形され、ＬＥＤ基板２を覆うように、筐体１１に取り付けられている。 The translucent cover 12 is formed into a ship shape using a polycarbonate resin, and is attached to the housing 11 so as to cover the LED substrate 2.
ＬＥＤ素子１としては公知の種々のＬＥＤを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのＬＥＤ素子を用いている。またチップオンボード型のＬＥＤモジュールを使用してもよい。 As the LED element 1, various known LEDs can be used. In this embodiment, a high-luminance type LED element that emits white light for illumination is used. A chip-on-board type LED module may be used.
ＬＥＤ基板２は、長尺の平板で公知のガラスエポキシ基板、金属基板、セラミックス基板等のプリント基板が用いられる。本実施形態では、電気絶縁樹脂で被覆された金属基板からなるプリント基板が用いられ、片面にＬＥＤ素子１が実装されている。更に各ＬＥＤ素子１を覆うように、ＬＥＤ基板２上に、所望の配光が得られるように複数のレンズ７が配置され、レンズ固定部材８で固定されている。 The LED substrate 2 is a long flat plate and a known printed circuit board such as a glass epoxy substrate, a metal substrate, or a ceramic substrate is used. In the present embodiment, a printed circuit board made of a metal substrate coated with an electrically insulating resin is used, and the LED element 1 is mounted on one side. Further, a plurality of lenses 7 are arranged on the LED substrate 2 so as to obtain a desired light distribution so as to cover each LED element 1 and are fixed by a lens fixing member 8.
支持板３は、長尺形状のアルミニウム製の平板が使用され、図７に示すように、ＬＥＤ基板載置面３１と、該ＬＥＤ基板載置面の３辺から透光性カバー側に延出した３面３２とからなる下方開口の箱体として成形されている。ＬＥＤ基板載置面３１にＬＥＤ基板２が接合され、図５に示したように該支持板３の短辺側の一端が、アーム下面２１の先端部に接合され、図示していないネジで固定されている。
ＬＥＤ素子１で発生した熱は、筐体１１が樹脂製で熱伝導性が小さいので、主に高熱伝導性の支持板３を通って、同様に高熱伝導性のアーム２０に伝導し、ＬＥＤランプ本体１０の外に放熱される。また透光性カバー１２側に延出した３面３２によって、支持板３の放熱面積が増加しており、ＬＥＤ素子１の放熱性が増している。
The support plate 3 is a long aluminum flat plate, and as shown in FIG. 7, extends from the LED substrate placement surface 31 and the three sides of the LED substrate placement surface to the translucent cover side. It is formed as a box having a lower opening made up of three surfaces 32. The LED substrate 2 is bonded to the LED substrate mounting surface 31, and one end on the short side of the support plate 3 is bonded to the tip of the arm lower surface 21 as shown in FIG. Has been.
Since the housing 11 is made of resin and has low thermal conductivity, the heat generated in the LED element 1 is conducted mainly to the high thermal conductivity arm 20 through the high thermal conductivity support plate 3 and the LED lamp. Heat is radiated outside the main body 10. In addition, the heat radiation area of the support plate 3 is increased by the three surfaces 32 extending toward the translucent cover 12, and the heat radiation performance of the LED element 1 is increased.
点灯回路基板５は、平板状のプリント基板であり、ＬＥＤ基板２と平行になるように、電源ボックス６に収納されている。
電源ボックス６は略直方体のポリブチレンテレフタレート製のボックスで、点灯回路基板５が載置される電源ボックス本体６１と、電源ボックス蓋体６２とから構成されている。該電源ボックス６は、図５に示すように、アーム下面２１と、透光性カバー１２との間で、支柱２００に近い側に配置されている。すなわち、支柱２００に近い側の筐体１１の長手方向３分の１程度の部分に、電源ボックス６が配置され、残りの３分の２程度の部分に支持板３が配置されている。なお電源ボックス本体６１は、筐体１１の上面内壁から起立された電源ボックス固定ボス１４に設けられた孔に、図示していないネジで固定されている。
The lighting circuit board 5 is a flat printed board, and is housed in the power supply box 6 so as to be parallel to the LED board 2.
The power supply box 6 is a substantially rectangular polybutylene terephthalate box, and includes a power supply box body 61 on which the lighting circuit board 5 is placed and a power supply box lid 62. As shown in FIG. 5, the power supply box 6 is disposed between the arm lower surface 21 and the translucent cover 12 on the side close to the support column 200. That is, the power supply box 6 is arranged in a portion of about 1/3 in the longitudinal direction of the casing 11 on the side close to the support column 200, and the support plate 3 is arranged in the remaining about 2/3. The power supply box body 61 is fixed to a hole provided in the power supply box fixing boss 14 erected from the upper inner wall of the housing 11 with a screw (not shown).
図６に示すように、電源ボックス固定ボス１４の軸長と、アーム２０の先端側が挿入されるアーム先端挟持部１５との厚みとによって、アーム２０と、電源ボックス６との間には、第１の空間部Ａが形成されており、電源ボックス６は、アーム２０に直接接触しないようになっている。
なお、電源ボックス６の位置は、アーム下面２１と、筐体１１の上面内壁との間に位置していてもよく、また点灯回路基板５と電源ボックス６とが逆に配置されていてもよい。その場合も電源ボックス６は、アーム２０に接触しないように固定される。
As shown in FIG. 6, there is a difference between the arm 20 and the power supply box 6 between the arm 20 and the power supply box 6 depending on the axial length of the power supply box fixing boss 14 and the thickness of the arm front end clamping portion 15 into which the front end side of the arm 20 is inserted. 1 space part A is formed, and the power supply box 6 does not contact the arm 20 directly.
The position of the power supply box 6 may be located between the arm lower surface 21 and the inner wall of the upper surface of the housing 11, and the lighting circuit board 5 and the power supply box 6 may be disposed in reverse. . Also in this case, the power supply box 6 is fixed so as not to contact the arm 20.
また、電源ボックス本体６１の上面内壁から点灯回路基板支持突起６３が４隅に形成されており（図６、図７に一部が示されている）、点灯回路基板４と、電源ボックス本体６１との間に第２の空間Ｂが形成されている。
これらの第１の空間部Ａと、第２の空間部Ｂと、樹脂製の電源ボックス６と、該電源ボックス６が樹脂製筐体１１に固定されていることによって、ＬＥＤ素子１で発生した熱が、点灯回路基板５に実装された電子部品４に伝導されず、電子部品４の温度上昇が抑制されている。また電子部品４は、空間部Ａ、空間部Ｂ、及び電源ボックス６内の空間に放熱されるので、温度上昇が抑えられている。
Further, lighting circuit board support protrusions 63 are formed at four corners from the inner wall of the upper surface of the power supply box body 61 (parts are shown in FIGS. 6 and 7), and the lighting circuit board 4 and the power supply box body 61 are provided. A second space B is formed between the two.
The first space portion A, the second space portion B, the resin power supply box 6, and the power supply box 6 fixed to the resin housing 11 cause the LED element 1. The heat is not conducted to the electronic component 4 mounted on the lighting circuit board 5, and the temperature rise of the electronic component 4 is suppressed. Moreover, since the electronic component 4 is radiated to the space A, the space B, and the space inside the power supply box 6, the temperature rise is suppressed.
また、アーム２０の下側に電源ボックス６を配置し、更に電源ボックス本体６１の上側外壁と、電源ボックス蓋体６２の下側外壁に図示していない貫通孔を形成することによって、電子部品４で発生した熱で暖められた空気が上昇し、電源ボックス本体６１の前記貫通孔を通ってアーム２０に達し放熱し、冷却された空気が下降し、電源ボックス蓋体６２の前記貫通孔を通って、電源ボックス６に流入し電子部品４が冷却されるので、更に電子部品４の温度上昇が抑制される。 Further, the power supply box 6 is disposed below the arm 20, and a through hole (not shown) is formed in the upper outer wall of the power supply box main body 61 and the lower outer wall of the power supply box lid 62, so that the electronic component 4 is provided. The air warmed by the heat generated in the air rises, reaches the arm 20 through the through hole of the power supply box body 61 and dissipates heat, and the cooled air descends and passes through the through hole of the power supply box lid 62. Then, the electronic component 4 flows into the power supply box 6 and is cooled, so that the temperature rise of the electronic component 4 is further suppressed.
このように、本発明の伝熱経路によって、ＬＥＤ素子１で発生した熱は、電子部品４に伝わることなく、ＬＥＤランプ本体１０の外に放熱される。また電子部品４で発生した熱は対流によって放熱される。それによって、明るさが低下せず、長寿命なＬＥＤ照明装置１００を提供することができる。 Thus, the heat generated in the LED element 1 is dissipated outside the LED lamp body 10 without being transmitted to the electronic component 4 by the heat transfer path of the present invention. The heat generated in the electronic component 4 is radiated by convection. Thereby, it is possible to provide the LED lighting device 100 having a long life without reducing the brightness.
１：ＬＥＤ素子
２：ＬＥＤ基板
３：支持板、３１：ＬＥＤ基板載置面、３２：延出した３面
４：電子部品
５：点灯回路基板
６：電源ボックス、６１：電源ボックス本体、６２：電源ボックス蓋体
６３：点灯回路基板支持突起
７：レンズ
８：レンズ固定部材
１０：ＬＥＤランプ本体
１１：筐体
１２：透光性カバー
１３：貫通スリット
１４：電源ボックス固定ボス
１５：アーム先端挟持部
２０：アーム（取付手段）
２１：アーム下面
２２、２３：アーム側面
１００：ＬＥＤ照明装置
２００：支柱（被取付手段）
２１０：簡易取付金具
Ａ：第１の空間部
Ｂ：第２の空間部
1: LED element 2: LED substrate 3: support plate, 31: LED substrate mounting surface, 32: extended three surfaces 4: electronic component 5: lighting circuit substrate
6: power box 61: power box body 62: power box lid 63: lighting circuit board support protrusion 7: lens 8: lens fixing member 10: LED lamp body 11: housing 12: translucent cover 13: penetration Slit 14: Power supply box fixing boss 15: Arm tip clamping part 20: Arm (mounting means)
21: Arm lower surface 22, 23: Arm side surface 100: LED lighting device 200: Support column (attachment means)
210: Simple mounting bracket A: First space B: Second space
Claims (4)
前記ＬＥＤランプ本体の外殻は、下面が開口した筺体と、該下面開口を覆う透光性カバーとを有し、
前記ＬＥＤランプ本体を構成する筺体において、前記ＬＥＤランプ本体から前記透光性カバーを通して光が照射される方向である前記開口側を下方向として上下方向と規定し、前記上下方向に垂直な方向を左右方向と規定するとき、
前記取付手段が前記筺体の左右方向の一方側に固定され、前記点灯回路基板が前記ＬＥＤランプ本体の左右方向における一方側に配置され、前記ＬＥＤ基板が前記ＬＥＤランプ本体の左右方向の他方側に配置され、
前記ＬＥＤランプ本体の内部に、前記取付手段の一端側が挿入され、
前記取付手段の一端側に、前記ＬＥＤ基板が熱伝導可能に接合され、
前記点灯回路基板が、前記取付手段から離して配置されていることを特徴としたＬＥＤ照明装置。 In the LED lighting device for mounting the LED lamp body that houses the LED board mounted with the LED element and the lighting circuit board to a mounted body such as a column or a wall surface provided outdoors by a thermally conductive mounting means,
The outer shell of the LED lamp body has a housing whose bottom surface is open, and a translucent cover that covers the bottom surface opening,
In the casing constituting the LED lamp body, the opening side, which is the direction in which light is emitted from the LED lamp body through the translucent cover, is defined as the vertical direction, and the direction perpendicular to the vertical direction is defined as the vertical direction. When stipulating the horizontal direction,
The mounting means is fixed to one side in the left-right direction of the housing, the lighting circuit board is disposed on one side in the left-right direction of the LED lamp body, and the LED board is on the other side in the left-right direction of the LED lamp body. Arranged,
One end side of the attachment means is inserted into the LED lamp body,
The LED substrate is joined to one end side of the attachment means so as to be capable of conducting heat,
The LED lighting device, wherein the lighting circuit board is disposed apart from the attachment means.
前記点灯回路基板は、樹脂製の電源ボックスに収容され、
前記電源ボックスは、前記ＬＥＤランプ本体の外郭に取り付けられており、かつ前記電源ボックスと前記取付手段との間には、空間部が形成されていることを特徴とした請求項１に記載のＬＥＤ照明装置。 The outer shell of the LED lamp body is formed of a resin material,
The lighting circuit board is housed in a resin power box,
2. The LED according to claim 1, wherein the power supply box is attached to an outer periphery of the LED lamp main body, and a space is formed between the power supply box and the attachment means. Lighting device.
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