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JP5934138B2 - Compressed resin sealing method and compressed resin sealing device for electronic parts - Google Patents

Compressed resin sealing method and compressed resin sealing device for electronic parts Download PDF

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Publication number
JP5934138B2
JP5934138B2 JP2013083493A JP2013083493A JP5934138B2 JP 5934138 B2 JP5934138 B2 JP 5934138B2 JP 2013083493 A JP2013083493 A JP 2013083493A JP 2013083493 A JP2013083493 A JP 2013083493A JP 5934138 B2 JP5934138 B2 JP 5934138B2
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resin
lower mold
mold cavity
substrate
electronic component
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JP2014207302A (en
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高瀬　慎二
慎二 高瀬
佳久 川本
佳久 川本
衛 砂田
衛 砂田
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Towa Corp
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Towa Corp
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Priority to JP2013083493A priority Critical patent/JP5934138B2/en
Priority to KR1020140008955A priority patent/KR101610456B1/en
Priority to CN201410039543.4A priority patent/CN104103530B/en
Priority to TW103107135A priority patent/TWI592279B/en
Publication of JP2014207302A publication Critical patent/JP2014207302A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)

Description

この発明は、所謂、圧縮成形方法を用いて大形基板上に装着した多数個の電子部品（半導体チップ）を樹脂により一括して封止成形（樹脂モールド）する樹脂封止方法及び樹脂封止装置の改良に関する。   The present invention relates to a resin sealing method and a resin sealing in which a large number of electronic components (semiconductor chips) mounted on a large substrate using a so-called compression molding method are collectively sealed (resin mold) with a resin. It relates to the improvement of the device.

大形基板上の電子部品を一括して樹脂封止する方法としては、圧縮成形方法が知られている。
この圧縮成形方法を行うための装置は、図８に概略図示するように、少なくとも上型１と下型２とから成る圧縮成形用型を備えており、該上下両型１・２を適宜な型開閉機構を介して相対的に接合・離反するように配設している。
そして、このような樹脂封止装置を用いて大形基板３上の電子部品４を一括して樹脂封止するには、次のようにして行われる。
まず、図８(1) に示すように、上型１に大形基板３をその電子部品４の装着面が下向きとなる状態で供給セットすると共に、下型２のキャビティ５内に樹脂材料６を供給して加熱する。
次に、図８(2) に示すように、型開閉機構を介して上下両型１・２を型締めすることにより、上型１にセットした大形基板３上の電子部品４を下型キャビティ５内の溶融樹脂材料６ａ中に浸漬する。
この型締時において、下型２の上面が大形基板３の周縁部を押圧することになる。そして、この状態で、下型２のキャビティ底面部材５ａを上動させて下型キャビティ５内の溶融樹脂材料６ａを所定の樹脂圧にて押圧（圧縮成形）することにより、下型キャビティ５の形状に対応して成形されるパッケージ内に電子部品４を一括して樹脂封止することができる。
なお、大形の基板として、現状では、直径 300ｍｍの円形基板や、約95ｍｍ× 260ｍｍ程度の短冊状基板等が用いられているが、これよりも更に大形となる基板、例えば、 500ｍｍ角以上の大形基板を用いてその電子部品を樹脂により一括して封止成形できるようにすることが望まれている。 A compression molding method is known as a method for collectively resin-sealing electronic components on a large substrate.
As shown schematically in FIG. 8, the apparatus for performing this compression molding method is provided with a compression molding die comprising at least an upper die 1 and a lower die 2, and the upper and lower dies 1 and 2 are appropriately arranged. It arrange | positions so that it may join / separate relatively via a mold opening / closing mechanism.
Then, the resin sealing of the electronic components 4 on the large substrate 3 by using such a resin sealing device is performed as follows.
First, as shown in FIG. 8 (1), the large substrate 3 is supplied and set on the upper mold 1 with the mounting surface of the electronic component 4 facing downward, and the resin material 6 is placed in the cavity 5 of the lower mold 2. Supply and heat.
Next, as shown in FIG. 8 (2), the upper and lower molds 1 and 2 are clamped via a mold opening / closing mechanism, whereby the electronic component 4 on the large substrate 3 set on the upper mold 1 is moved to the lower mold. It is immersed in the molten resin material 6a in the cavity 5.
During the mold clamping, the upper surface of the lower mold 2 presses the peripheral edge of the large substrate 3. In this state, the cavity bottom member 5a of the lower mold 2 is moved upward to press the molten resin material 6a in the lower mold cavity 5 with a predetermined resin pressure (compression molding). The electronic components 4 can be collectively resin-sealed in a package molded according to the shape.
Currently, circular substrates with a diameter of 300 mm, strip-shaped substrates of about 95 mm × 260 mm, etc. are used as large substrates, but substrates that are larger than this, for example, 500 mm square or more It is desired that the electronic components can be collectively encapsulated with a resin using a large-sized substrate.

また、下型キャビティ５内に供給する樹脂材料６としては、顆粒状樹脂をそのままの状態で供給すること等が開示されている。   Further, as the resin material 6 to be supplied into the lower mold cavity 5, it is disclosed that granular resin is supplied as it is.

ところで、大形基板３における樹脂封止範囲は大面積となるため、下型キャビティ５内への樹脂供給量の設定作業等が面倒で手数を要すると云った問題がある。
例えば、一部の電子部品が欠落した状態の大形基板については、その欠落状態を検知・検出すると共に、これに対応して増量した顆粒樹脂等を供給する必要があり、従って、そのための検知・検出機構や樹脂量調節機構等の付属機器類の設置が必須となる。
また、予め、所定形状に成形したシート状樹脂（シート状の樹脂材料）を用いる場合においては、電子部品の欠落に対応して樹脂材料を追加するための樹脂量調節作業を行うことは困難である。 By the way, since the resin sealing range in the large substrate 3 has a large area, there is a problem that the setting operation of the resin supply amount into the lower mold cavity 5 is troublesome and requires a lot of work.
For example, for large substrates with some electronic components missing, it is necessary to detect and detect the missing state and supply an increased amount of granular resin, etc. corresponding to this.・ Installation of accessories such as a detection mechanism and resin amount adjustment mechanism is essential.
In addition, when using a sheet-shaped resin (sheet-shaped resin material) molded in advance in a predetermined shape, it is difficult to perform a resin amount adjustment operation for adding a resin material in response to a missing electronic component. is there.

また、大形基板３における樹脂封止範囲は大面積であると共に、これに対応して、圧縮成形用型の下型キャビティ５も大面積となる。このため、下型キャビティ５内の全域に樹脂材料を均等に供給して充填させておくことにより、大形基板３の樹脂封止範囲における各部位において均等な樹脂封止成形作用を行うようにする必要がある。
下型キャビティ５内の全域に樹脂材料を均等に供給して充填させておくことができない場合は、キャビティ底面部材５ａを上動させて下型キャビティ５内の溶融樹脂材料６ａを押圧しながら該溶融樹脂材料６ａを該下型キャビティ５内の全域に流動させて充填させる必要がある。しかしながら、この場合は、キャビティ底面部材５ａの押圧力によって下型キャビティ５内を流動する溶融樹脂材料６ａが電子部品４のワイヤを変形させ、或は、これを断線する等のワイヤスイープが発生し易く、また、溶融樹脂材料６ａ中に空気を巻き込んでボイドを形成したり、樹脂中のフィラーの不均等な分散が発生して樹脂材料としての機能を低下させる等の樹脂成形上の問題がある。
更に、下型キャビティ５内に供給した樹脂量の過不足に基因して、下型キャビティ５の形状に対応して成形されるパッケージに未充填状態が発生したり、下型キャビティ５内において所定の樹脂圧が得られず、また、パッケージの厚みを所定の均等厚さに成形することができない等の樹脂成形上の重大な問題がある。 Further, the resin sealing range in the large substrate 3 is a large area, and the lower mold cavity 5 of the compression molding die is also correspondingly large. For this reason, the resin material is uniformly supplied and filled in the entire area of the lower mold cavity 5 so as to perform an even resin sealing molding operation in each part in the resin sealing range of the large substrate 3. There is a need to.
If the resin material cannot be uniformly supplied and filled throughout the lower mold cavity 5, the cavity bottom member 5 a is moved upward to press the molten resin material 6 a in the lower mold cavity 5. The molten resin material 6a needs to flow and be filled throughout the lower mold cavity 5. However, in this case, the molten resin material 6a flowing in the lower mold cavity 5 is deformed by the pressing force of the cavity bottom member 5a, or the wire of the electronic component 4 is deformed or a wire sweep is generated. Further, there are problems in resin molding such as formation of voids by entraining air in the molten resin material 6a, and non-uniform dispersion of fillers in the resin to reduce the function as a resin material. .
Further, due to excess or deficiency of the amount of resin supplied into the lower mold cavity 5, an unfilled state may occur in the package molded corresponding to the shape of the lower mold cavity 5, or a predetermined amount may be set in the lower mold cavity 5. The resin pressure cannot be obtained, and there is a serious problem in resin molding such that the thickness of the package cannot be molded to a predetermined uniform thickness.

特開２００６−１２０８８０号公報（第５頁の段落〔0013〕、図１（１）等を参照）Japanese Unexamined Patent Publication No. 2006-120880 (see paragraph [0013] on page 5, FIG. 1 (1), etc.)

本発明は、圧縮成形方法を用いて大形基板上に装着した多数個の電子部品を樹脂により一括して封止成形する場合において、キャビティ内に供給する樹脂量の計量や調節作業を省略化することができ、また、キャビティ内における溶融樹脂材料の流動作用に基因するワイヤスイープ等の発生を効率良く防止することができ、また、キャビティ内において所定の樹脂圧を得ることができ、更に、パッケージの厚さを所定の厚みに成形することができる電子部品の圧縮樹脂封止方法とこの方法を実施するための圧縮樹脂封止装置を提供することを目的とする。   The present invention eliminates the need for measuring and adjusting the amount of resin supplied into the cavity when a large number of electronic components mounted on a large substrate are collectively molded with resin using a compression molding method. Generation of wire sweep or the like due to the flow of molten resin material in the cavity can be efficiently prevented, and a predetermined resin pressure can be obtained in the cavity. It is an object of the present invention to provide a compressed resin sealing method for an electronic component capable of forming a package with a predetermined thickness and a compressed resin sealing device for carrying out this method.

上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止方法は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられ且つ離型フィルムを被覆したキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、前記上下両型を閉じる型締工程が、前記下型キャビティ内の余剰樹脂を前記下型キャビティの外部へ流出させる余剰樹脂の外部流出段階と、この余剰樹脂の外部流出段階を経た後に前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて前記基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含み、前記余剰樹脂の外部流出段階では、この余剰樹脂が前記上下両型間に構成される狭い間隙を通して前記下型キャビティ部の周囲に設けた余剰樹脂の収容部内に案内されるように設定し、また、前記樹脂封止段階では、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定したことを特徴とする。   In order to achieve the above-described object, the electronic component compression resin sealing method according to the present invention supplies a substrate to the upper mold surface using at least an electronic component compression molding mold comprising an upper mold and a lower mold. And the mounting surface side of the electronic component is engaged downward, and the resin material provided in the cavity provided on the lower mold surface and coated with the release film is heated and melted, The upper and lower molds are closed and the electronic component of the substrate on the upper mold side is immersed in the molten resin material in the lower mold cavity. Next, a predetermined resin is applied to the molten resin material in the lower mold cavity. An electronic component compression resin sealing method for collectively sealing and molding electronic components mounted on the substrate with resin by applying pressure, wherein a mold clamping step for closing both the upper and lower molds is performed by the lower mold Excess resin in the cavity An electronic component on the substrate by applying a predetermined resin pressure to the molten resin material in the lower mold cavity after the external resin flowing out of the lower mold cavity and the excess resin flowing out of the lower mold cavity A resin sealing step of collectively molding resin sealing, and in the outflowing step of the surplus resin, the surplus resin passes around the lower mold cavity through a narrow gap formed between the upper and lower molds. It is set so as to be guided into the provided surplus resin container, and in the resin sealing stage, the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping positions of the upper and lower molds Is set to be equal to the interval of the thickness of the package for resin-sealing the electronic components on the substrate.

また、上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止方法は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられたキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、前記上下両型を閉じる型締工程が、前記下型キャビティ内の余剰樹脂を前記下型キャビティの外部へ流出させる余剰樹脂の外部流出段階と、この余剰樹脂の外部流出段階を経た後に前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて前記基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含み、前記余剰樹脂の外部流出段階では、この余剰樹脂が前記上下両型間に構成される狭い間隙を通して前記下型キャビティ部の周囲に設けた余剰樹脂の収容部内に案内されるように設定し、また、前記樹脂封止段階では、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定したことを特徴とする。   Further, in order to achieve the above-described object, a compression resin sealing method for an electronic component according to the present invention uses a compression molding mold for an electronic component comprising at least an upper mold and a lower mold, and a substrate is placed on the upper mold surface. And is attached with the mounting surface side of the electronic component facing downward, and the resin material supplied in the cavity provided on the lower mold surface is heated and melted. Close the mold and close the electronic component of the substrate on the upper mold side in the molten resin material in the lower mold cavity, and then apply a predetermined resin pressure to the molten resin material in the lower mold cavity To compress and mold the electronic components mounted on the substrate in a lump with a resin, and the depth of the lower mold cavity is resin-sealed. Package thickness for The mold clamping process is performed so that the upper and lower molds are set to be equal to each other, and the excess resin in the lower mold cavity flows out to the outside of the lower mold cavity, and the excess resin flows out to the outside. A resin sealing step in which a predetermined resin pressure is applied to the molten resin material in the lower mold cavity after the step and the electronic components on the substrate are collectively sealed with the resin, and the excess resin flows out to the outside. In the step, the surplus resin is set to be guided into a surplus resin container provided around the lower mold cavity through a narrow gap formed between the upper and lower molds, and the resin sealing step Then, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of both the upper and lower molds is equal to the package thickness for resin-sealing the electronic component of the substrate. Characterized by being configured.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加える前記樹脂封止段階において、その成形圧力が０．２９４２ＭＰａ以上となる低圧での圧縮樹脂封止成形を行うように設定したことを特徴とする。   Further, in the method for compressing a resin for compressing an electronic component according to the present invention, the molding pressure is 0.2942 MPa or more in the resin sealing step of applying a predetermined resin pressure to the molten resin material in the lower mold cavity. It is characterized in that it is set so as to perform compression resin sealing molding.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記下型キャビティ内に供給する樹脂材料が、所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料であって、平面から見た前記下型キャビティの形状に対応し且つ前記下型キャビティ内に嵌合させて供給することができる形状として成形したシート状樹脂であることを特徴とする。   Also, in the compressed resin sealing method for electronic parts according to the present invention, the resin material supplied into the lower mold cavity is a sheet-like resin material having a required shape retaining property by flattening a required amount of resin. The sheet-shaped resin is formed into a shape that corresponds to the shape of the lower mold cavity as viewed from above and can be fitted into the lower mold cavity and supplied.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記下型キャビティ内に供給する樹脂材料が、所要量の樹脂を平坦化して供給される樹脂材料であることを特徴とする。   In the compressed resin sealing method for an electronic component according to the present invention, the resin material supplied into the lower mold cavity is a resin material supplied by planarizing a required amount of resin.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記樹脂材料が、顆粒状の樹脂材料、粉末状の樹脂材料、液状の樹脂材料、ペースト状の樹脂材料から選択される樹脂材料であることを特徴とする。   Further, in the compression resin sealing method for an electronic component according to the present invention, the resin material is a resin material selected from a granular resin material, a powder resin material, a liquid resin material, and a paste resin material. It is characterized by being.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記離型フィルム上に所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料を載置し、この状態で、下型キャビティ内に前記離型フィルムを被覆させることにより、前記離型フィルムを被覆した下型キャビティ内に所要の保形性を備えるシート状の樹脂材料を供給することを特徴とする。   Further, in the compressed resin sealing method of an electronic component according to the present invention, a sheet-shaped resin material having a required shape retaining property is placed on the release film by flattening a required amount of resin, and in this state By coating the release film in the lower mold cavity, a sheet-like resin material having a required shape retaining property is supplied into the lower mold cavity coated with the release film.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記下型に設けたキャビティ部を含む前記下型面に離型フイルムを張設し、前記離型フイルムを介して下型キャビティ内に所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料を供給することを特徴とする。   Further, in the method for sealing an electronic component with compressed resin according to the present invention, a release film is stretched on the lower mold surface including the cavity portion provided in the lower mold, and the inside of the lower mold cavity is interposed via the release film. A sheet-like resin material having a required shape retaining property is supplied by flattening a required amount of resin.

また、上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止装置は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられ且つ離型フィルムを被覆したキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、前記上下両型を閉じる型締時において、前記上下両型間に、前記下型キャビティ内の溶融樹脂材料の一部となる余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙を構成し、また、前記下型キャビティ部の周囲に前記狭い間隙を通して連通させた前記余剰樹脂の収容部を配置し、更に、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定して構成したことを特徴とする。   Also, an electronic component compression resin sealing device according to the present invention for achieving the above-described object uses a substrate for forming an electronic component compression molding comprising at least an upper die and a lower die on the upper die surface. And the electronic component is mounted with the mounting surface side facing downward, and the resin material provided in the cavity provided on the lower mold surface and coated with the release film is heated to melt, The upper and lower molds are closed and the electronic component of the substrate on the upper mold side is immersed in the molten resin material in the lower mold cavity, and then the molten resin material in the lower mold cavity is predetermined. An electronic component compression resin sealing device that collectively seals and molds the electronic components mounted on the substrate with a resin by applying the resin pressure of Between the upper and lower molds, the front A narrow gap is formed to allow excess resin, which is part of the molten resin material in the lower mold cavity, to flow out of the lower mold cavity, and communicated through the narrow gap around the lower mold cavity. The surplus resin container is disposed, and the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of the upper and lower molds is resin-sealed. It is characterized in that it is set so as to be equal to the interval of the package thickness.

また、上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止装置は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型キャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、前記上下両型を閉じる型締時において、前記上下両型間に、前記下型キャビティ内の溶融樹脂材料の一部となる余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙を構成し、また、前記下型キャビティ部の周囲に前記狭い間隙を通して連通させた前記余剰樹脂の収容部を配置し、更に、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定して構成したことを特徴とする。   Also, an electronic component compression resin sealing device according to the present invention for achieving the above-described object uses a substrate for forming an electronic component compression molding comprising at least an upper die and a lower die on the upper die surface. And is attached with the mounting surface side of the electronic component facing downward, and the resin material supplied into the lower mold cavity is heated and melted, and then the upper and lower molds are closed with mold clamping Then, the electronic component of the substrate on the upper mold side is immersed in the molten resin material in the lower mold cavity, and then a predetermined resin pressure is applied to the molten resin material in the lower mold cavity. An electronic component compression resin sealing device for collectively sealing and molding electronic components mounted on a resin with a depth of the lower mold cavity, a package thickness for resin sealing the electronic components on the substrate Is equal to When closing the upper and lower molds, the excess resin that becomes a part of the molten resin material in the lower mold cavity flows out of the lower mold cavity between the upper and lower molds. A narrow gap is formed, and the surplus resin accommodating portion communicated through the narrow gap is disposed around the lower mold cavity portion, and further, the lower mold cavity at the final clamping position of both the upper and lower molds is arranged. It is characterized in that the distance between the bottom surface and the electronic component mounting surface of the substrate is set to be equal to the interval of the package thickness for resin-sealing the electronic component of the substrate.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙が、前記下型の型面と前記基板における電子部品の装着面との両者間に構成した前記下型キャビティと余剰樹脂の収容部とを連通させる樹脂通路であって、前記下型キャビティから余剰樹脂の収容部に向かって浅くなるような傾斜面を備えていることを特徴とする。   In the electronic component compression resin sealing device according to the present invention, a narrow gap for allowing the excess resin to flow out of the lower mold cavity has a mold surface of the lower mold and a mounting surface of the electronic component on the substrate. And a resin passage that communicates the lower mold cavity and the surplus resin accommodating portion formed between the two and the slant surface so as to become shallower from the lower mold cavity toward the surplus resin accommodating portion. It is characterized by that.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙が、前記下型キャビティと前記基板における電子部品の装着面との両者間に構成されると共に、前記余剰樹脂の収容部が、前記狭い間隙及び前記狭い間隙と前記下型キャビティの周囲に配置した樹脂漏防止用部材との間の空間部として設けられていることを特徴とする。   Further, in the compression resin sealing device for an electronic component according to the present invention, a narrow gap for allowing the excess resin to flow out of the lower mold cavity is formed between the lower mold cavity and the mounting surface of the electronic component on the substrate. The space between the narrow gap and the narrow gap and the resin leakage preventing member disposed around the lower mold cavity is provided between the two and the excess resin container. It is characterized by.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記樹脂漏防止用部材が、前記上下両型の型締時における前記上下両型の型面間の距離を規制するための位置決部材を兼ねていることを特徴とする。   Also, the electronic component compression resin sealing device according to the present invention is such that the resin leakage prevention member is positioned to regulate the distance between the upper and lower mold surfaces when the upper and lower molds are clamped. It also serves as a member.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記下型が、キャビティ底面部材とキャビティ側面部材とに分割した構成を備えると共に、前記キャビティ底面部材とキャビティ側面部材とを相対的に上下動可能に嵌合させて構成したことを特徴とする。   In the electronic component compression resin sealing device according to the present invention, the lower mold includes a configuration in which the lower mold is divided into a cavity bottom member and a cavity side member, and the cavity bottom member and the cavity side member are relatively disposed. It is characterized by being configured to be vertically movable.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記下型が、キャビティ底面部とキャビティ側面部とを一体に形成した構成を備えることを特徴とする。   Moreover, the compressed resin sealing device for electronic parts according to the present invention is characterized in that the lower mold has a configuration in which a cavity bottom surface portion and a cavity side surface portion are integrally formed.

本発明に係る電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置によれば、所要量の樹脂を平坦化して所要の保形性を備えると共に、下型キャビティの形状に対応して成形したシート状樹脂を用いることにより、事実上、下型キャビティ内の全域に樹脂材料を均等に供給して充填させることができる。
従って、下型キャビティ内におけるシート状樹脂の加熱溶融化作用と、その溶融樹脂材料に対する押圧（加圧）作用とを該下型キャビティの各部位において均等な条件下で行うことが可能となるため、各電子部品の樹脂封止成形品の品質を均等化することができる。 According to the compressed resin sealing method and the compressed resin sealing device of the electronic component according to the present invention, a required amount of resin is flattened to have a required shape retaining property, and molded according to the shape of the lower mold cavity. By using the sheet-like resin, the resin material can be effectively supplied and filled throughout the entire area of the lower mold cavity.
Accordingly, it is possible to perform the heat-melting action of the sheet-like resin in the lower mold cavity and the pressing (pressing) action on the molten resin material under equal conditions in each part of the lower mold cavity. The quality of the resin-sealed molded product of each electronic component can be equalized.

また、定量で定型化したシート状樹脂を用いることができるので、下型キャビティ内に供給する樹脂量の計量や調節と云った樹脂計量・調節作業を省略化することができる。   Further, since a sheet-shaped resin that is fixed in quantity can be used, resin measurement and adjustment operations such as measurement and adjustment of the amount of resin supplied into the lower mold cavity can be omitted.

また、下型キャビティ内におけるシート状樹脂の加熱溶融化作用と、その溶融樹脂材料に対する押圧作用とを低圧で行うことが可能となるので、下型キャビティ内における溶融樹脂材料の流動作用を防止、若しくは、抑制することができる。
即ち、下型キャビティ内の溶融樹脂材料に対する押圧作用を低速度で、且つ、低圧にて行うことにより、溶融樹脂材料の流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。
例えば、少なくとも、成形圧力０．２９４２ＭＰａ以上（３ｋｇｆ／ｃｍ2以上）の低圧にて下型キャビティ内の溶融樹脂材料を押圧することができる。
なお、〔ＭＰａ〕単位への換算は、括弧内表記の工学気圧（単位：ｋｇｆ／ｃｍ2）の数値について、１ｋｇｆ／ｃｍ2＝０．０９８０６６５ＭＰａで計算し、数字を四捨五入して４桁とした。 In addition, since it becomes possible to perform the heat-melting action of the sheet-shaped resin in the lower mold cavity and the pressing action on the molten resin material at a low pressure, the flow action of the molten resin material in the lower mold cavity is prevented. Or it can be suppressed.
That is, by performing the pressing action on the molten resin material in the lower mold cavity at a low speed and a low pressure, it is possible to efficiently prevent the occurrence of wire sweep or the like due to the flow action of the molten resin material.
For example, the molten resin material in the lower mold cavity can be pressed at a low pressure of at least a molding pressure of 0.2942 MPa or more (3 kgf / cm 2 or more).
In addition, the conversion to [MPa] unit is calculated with 1 kgf / cm 2 = 0.0980665 MPa for the numerical value of engineering pressure (unit: kgf / cm 2 ) indicated in parentheses, and rounded off to four digits. .

また、定量で定型化したシート状樹脂を用いることによって、下型キャビティ内の全域に亘る樹脂材料の供給作用と、該シート状樹脂の加熱溶融化作用と、該溶融樹脂材料に対する低速度且つ低圧による押圧作用との相乗作用によって、下型キャビティ内における溶融樹脂材料の流動作用に基因するワイヤスイープ等の発生を、より効率良く防止することができる。   In addition, by using a fixed amount of sheet-shaped resin, a resin material supplying action over the entire area of the lower mold cavity, a heat-melting action of the sheet-shaped resin, a low speed and low pressure with respect to the molten resin material Due to the synergistic action with the pressing action due to, it is possible to more efficiently prevent the occurrence of wire sweep or the like due to the flow action of the molten resin material in the lower mold cavity.

また、下型キャビティ内の余剰樹脂80ｂを下型キャビティの外部へ流出させる余剰樹脂80ｂの外部流出段階と、この余剰樹脂80ｂの外部流出段階を行った後に下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて大形基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含む上下両型の型締工程を行うことにより、下型キャビティ内に所要量の溶融樹脂材料を、より効率良く且つ確実に充填させることができる。   Further, after performing an external outflow stage of the surplus resin 80b that causes the surplus resin 80b in the lower mold cavity to flow out of the lower mold cavity, and an external outflow stage of the surplus resin 80b, the molten resin material in the lower mold cavity is predetermined. The required amount of melting is achieved in the lower mold cavity by performing both upper and lower mold clamping processes, including the resin sealing step of applying the resin pressure of the resin and molding the electronic components on the large substrate together. The resin material can be filled more efficiently and reliably.

また、下型キャビティ内の溶融樹脂材料に対する押圧作用を低速度で、且つ、低圧にて行うことができる。このため、圧縮樹脂封止装置に関していえば、総力としての大きな型締力を必要とせず、基板の大形化に対応することができ、圧縮樹脂封止装置の構成を簡素化或は簡略化することが可能となる。従って、この簡素化或いは簡略化した装置にて、大形基板上に装着した多数個の電子部品を、定量で定型化した（所要の保形性を備えた）シート状樹脂にて、下型キャビティ内の溶融樹脂材料に対する押圧作用を低速度で、且つ、低圧で、一括して封止成形することができる。   Further, the pressing action against the molten resin material in the lower mold cavity can be performed at a low speed and at a low pressure. For this reason, when it comes to the compression resin sealing device, it does not require a large mold clamping force as a total force, and can cope with an increase in the size of the substrate. It becomes possible to do. Therefore, with this simplified or simplified device, a large number of electronic components mounted on a large substrate are quantitatively standardized (with the required shape retention) and the lower mold The pressing action on the molten resin material in the cavity can be collectively molded at a low speed and at a low pressure.

更に、型締工程における樹脂封止段階において、上下両型の型締め最終位置における下型キャビティの底面と大形基板における電子部品の装着面との間隔が、大形基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定したことにより、キャビティ内において所定の樹脂圧を得ることができると共に、パッケージの厚さを所定の厚みに成形することができる。従って、前述した簡素化或いは簡略化した圧縮樹脂封止装置を用いて、下型キャビティ内で成形されるパッケージの厚さの精度（ばらつき）を向上させることができる。   Further, in the resin sealing step in the mold clamping process, the distance between the bottom surface of the lower mold cavity and the mounting surface of the electronic component on the large substrate at the final mold clamping position of both the upper and lower molds is such that the electronic component on the large substrate is sealed with resin. By setting to be equal to the interval of the package thickness for stopping, a predetermined resin pressure can be obtained in the cavity, and the thickness of the package can be formed to a predetermined thickness. Therefore, the accuracy (variation) of the thickness of the package molded in the lower mold cavity can be improved by using the simplified or simplified compressed resin sealing device described above.

本発明の第一実施例に係る圧縮樹脂封止装置の全体構成を示す一部切欠正面図で、上下両型の型開状態を概略的に示している。BRIEF DESCRIPTION OF THE DRAWINGS It is a partially notched front view which shows the whole structure of the compression resin sealing apparatus which concerns on 1st Example of this invention, and has shown the mold open state of both upper and lower mold | types schematically. 図１に対応する圧縮樹脂封止装置の一部切欠正面図で、上下両型の型締状態を概略的に示している。FIG. 2 is a partially cutaway front view of the compression resin sealing device corresponding to FIG. 1, schematically showing both upper and lower mold clamping states. 図１に対応する圧縮樹脂封止装置の要部を示しており、図３(1) はその下型における均等加圧手段の一部切欠拡大正面図、図３(2) はその均等加圧手段を更に拡大して示す一部切欠拡大正面図である。Fig. 3 shows the main part of the compression resin sealing device corresponding to Fig. 1, Fig. 3 (1) is a partially cut-away front view of the uniform pressurizing means in the lower mold, and Fig. 3 (2) is the uniform pressurization. It is a partially notched enlarged front view showing the means further enlarged. 図１に対応する圧縮樹脂封止装置の要部を示しており、図４(1) はその上下両型の型開時における樹脂成形部の拡大縦断面図、図４(2) はその上下両型の型締時における樹脂成形部の拡大縦断面図である。The main part of the compression resin sealing device corresponding to FIG. 1 is shown. FIG. 4 (1) is an enlarged vertical sectional view of the resin molding part when the upper and lower molds are opened, and FIG. It is an expanded vertical sectional view of the resin molding part at the time of mold clamping of both types. 図４に対応する樹脂成形部の要部を示しており、図５(1) はその要部の拡大縦断面図、図５(2) はその要部の平面図である。The main part of the resin molding part corresponding to FIG. 4 is shown, FIG. 5 (1) is an enlarged vertical sectional view of the main part, and FIG. 5 (2) is a plan view of the main part. 本発明の第二実施例に係る圧縮樹脂封止装置の要部を示しており、図６(1) はその上下両型の型開時における樹脂成形部の縦断面図、図６(2) はその上下両型の型締時における樹脂成形部の縦断面図である。The main part of the compression resin sealing device according to the second embodiment of the present invention is shown. FIG. 6 (1) is a longitudinal sectional view of the resin molding part when the upper and lower molds are opened, and FIG. 6 (2). These are the longitudinal cross-sectional views of the resin molding part at the time of mold clamping of the upper and lower mold | types. 本発明の第三実施例に係る圧縮樹脂封止装置の要部を示しており、図７(1) はその上下両型の型開時における樹脂成形部の縦断面図、図７(2) はその上下両型の型締時における樹脂成形部の縦断面図である。FIG. 7 (1) shows the main part of the compression resin sealing device according to the third embodiment of the present invention, and FIG. 7 (1) is a longitudinal sectional view of the resin molding part when the upper and lower molds are opened, FIG. These are the longitudinal cross-sectional views of the resin molding part at the time of mold clamping of the upper and lower mold | types. 従来の圧縮樹脂封止装置の要部を概略的に示しており、図８(1) はその上下両型の型開時における樹脂成形部の縦断面図、図８(2) はその上下両型の型締時における樹脂成形部の縦断面図である。FIG. 8 (1) is a vertical sectional view of a resin molding part when the upper and lower molds are opened, and FIG. 8 (2) is the upper and lower parts of the conventional compression resin sealing device. It is a longitudinal cross-sectional view of the resin molding part at the time of mold clamping.

以上、図に示す本発明の実施例について説明する。   The embodiment of the present invention shown in the drawings will be described above.

図１乃至図５は本発明の第一実施例であって、図１及び図２はその圧縮樹脂封止装置の全体構成を示しており、また、図３乃至図５はその要部を示している。   FIGS. 1 to 5 show a first embodiment of the present invention. FIGS. 1 and 2 show the overall configuration of the compression resin sealing device, and FIGS. 3 to 5 show the main parts thereof. ing.

また、この圧縮樹脂封止装置はその各構成部材をプレスフレーム（ホールドフレーム）にて保持させる構成のものを示している。
即ち、枠形のプレスフレーム20における上端部の下面側に圧縮成形用の上型31を配置すると共に、該上型31の下方位置には、後述する型開閉機構50によって上下動可能に設けた圧縮成形用の下型32を配置しており、この上型31及び下型32は圧縮成形用型30を構成している。 In addition, this compression resin sealing device has a configuration in which each constituent member is held by a press frame (hold frame).
That is, an upper die 31 for compression molding is disposed on the lower surface side of the upper end portion of the frame-shaped press frame 20, and provided below the upper die 31 so as to be movable up and down by a die opening / closing mechanism 50 described later. A lower mold 32 for compression molding is disposed, and the upper mold 31 and the lower mold 32 constitute a compression molding mold 30.

また、上型31は、プレスフレーム20における上端部の下面側に固着した上型ベース31ａと、該上型ベース31ａの下面側に固着した上型ホールドブロック31ｂと、該上型ホールドブロック31ｂに支持させた基板セットブロック31ｃと、該基板セットブロック31ｃに内装した上型加熱用ヒータ31ｄとを備えている。
また、上型31の型面（下面）には、基板セットブロック31ｃの外方周囲に配置すると共に、後述する下型32の型面（図例では、キャビティ側面部材32ｄの上面）に接合させて上下両型（31・32）の型面間と該上下両型の外部との内外通気を遮断させるためのシール部材31ｅを備えており、更に、上型ホールドブロック31ｂと基板セットブロック31ｃとの間には、該両ブロック（31ｂ・31ｃ）間の通気を遮断させるためのシール部材31ｆを備えている。
なお、上型31には、その型面（下面）に大形基板70を供給し且つその電子部品71の装着面側を下向きとして係着させるための適宜な係着手段（図示なし）を設けている。
また、上型31には、後述する上下両型（31・32）の型締時（図２参照）に、シール部材31ｅにてシール（通気遮断）した該上下両型の型面間と真空ポンプとの間を適宜な吸気経路を介して連通接続させた真空引機構（図示なし）を配設している。 The upper mold 31 includes an upper mold base 31a fixed to the lower surface side of the upper end portion of the press frame 20, an upper mold hold block 31b fixed to the lower surface side of the upper mold base 31a, and an upper mold hold block 31b. A supported substrate set block 31c and an upper die heater 31d provided in the substrate set block 31c are provided.
In addition, the upper mold 31 is disposed on the outer surface of the substrate set block 31c on the mold surface (lower surface), and is bonded to the mold surface of the lower mold 32 to be described later (in the illustrated example, the upper surface of the cavity side member 32d). And a sealing member 31e for blocking internal / external ventilation between the mold surfaces of the upper and lower molds (31, 32) and the outside of the upper and lower molds, and an upper mold holding block 31b and a substrate set block 31c. A sealing member 31f is provided between the two blocks (31b, 31c) to block the ventilation between the blocks.
The upper mold 31 is provided with appropriate engaging means (not shown) for supplying the large substrate 70 to the mold surface (lower surface) and engaging the mounting surface side of the electronic component 71 downward. ing.
Further, the upper die 31 has a vacuum between the upper and lower die surfaces sealed by a seal member 31e when the upper and lower die (31, 32) described later (see FIG. 2) are clamped (see FIG. 2). A vacuum evacuation mechanism (not shown) is provided in communication with the pump via an appropriate intake path.

また、下型32は、プレスフレーム20の下端部に配置した後述する型開閉機構50における可動プラテン52上に配設している。
即ち、下型32は、型開閉機構50の可動プラテン52上に固着した下型ベース32ａと、該下型ベース32ａの上面側に固着した下型ホールドブロック32ｂと、該下型ホールドブロック32ｂに支持させたキャビティ底面部材32ｃと、該キャビティ底面部材32ｃの外方周囲に嵌合させたキャビティ側面部材32ｄと、下型ベース32ａとキャビティ側面部材32ｄとの間に介在させて該キャビティ側面部材32ｄを上方へ弾性押動させるように設けた弾性部材32ｅと、キャビティ底面部材32ｃに内装した下型加熱用ヒータ32ｆとを備えている。
従って、下型32が、キャビティ底面部材32ｃとキャビティ側面部材32ｄとに分割した構成を備えており、また、キャビティ底面部材32ｃとキャビティ側面部材32ｄとを相対的に上下動可能に嵌合させて構成している。
また、キャビティ底面部材32ｃとキャビティ側面部材32ｄとの間には、該両者間の通気を遮断させるためのシール部材32ｇを備えている。 Further, the lower mold 32 is disposed on a movable platen 52 in a mold opening / closing mechanism 50 described later disposed at the lower end portion of the press frame 20.
That is, the lower mold 32 includes a lower mold base 32a fixed on the movable platen 52 of the mold opening / closing mechanism 50, a lower mold hold block 32b fixed on the upper surface side of the lower mold base 32a, and the lower mold hold block 32b. A cavity bottom member 32c that is supported, a cavity side member 32d fitted to the outer periphery of the cavity bottom member 32c, and a cavity side member 32d interposed between the lower mold base 32a and the cavity side member 32d. Is provided with an elastic member 32e provided so as to be elastically pushed upward, and a lower mold heater 32f provided in the cavity bottom surface member 32c.
Therefore, the lower mold 32 has a configuration in which the cavity bottom surface member 32c and the cavity side surface member 32d are divided, and the cavity bottom surface member 32c and the cavity side surface member 32d are fitted so as to be relatively movable up and down. It is composed.
Further, a seal member 32g is provided between the cavity bottom surface member 32c and the cavity side surface member 32d to block the ventilation between the two.

また、大形基板用のキャビティ部を備えた圧縮成形型においては、上下両型（31・32）の型締圧力が該上下両型の周辺部で大きく且つその中央部で小さくなり、その結果、上下両型（31・32）の中央部が膨らんだ状態で上下両型（31・32）が弯曲して変形する。
そこで、圧縮成形用型30には、後述する上下両型（31・32）の型締時において該上下両型の弯曲変形を防止するための弯曲変形防止部材を兼ねる均等加圧手段40を備えている。
また、この均等加圧手段40は、図例においては、上型31についての均等加圧手段41と、下型32についての均等加圧手段42とを備えた場合を例示している。 In addition, in a compression mold having a cavity for a large substrate, the clamping pressure of both the upper and lower molds (31, 32) is large at the periphery of the upper and lower molds and small at the center, and as a result Both the upper and lower molds (31, 32) are bent and deformed in a state where the central parts of the upper and lower molds (31, 32) are swollen.
Therefore, the compression molding die 30 is provided with a uniform pressurizing means 40 that also serves as a bending deformation preventing member for preventing bending deformation of both the upper and lower molds (31, 32), which will be described later. ing.
In the illustrated example, the uniform pressure means 40 includes a uniform pressure means 41 for the upper mold 31 and a uniform pressure means 42 for the lower mold 32.

即ち、上型均等加圧手段41は、上型ホールドブロック31ｂと基板セットブロック31ｃとの間に設けた上型水平空間部41ａと、該上型水平空間部41ａ内に装設した圧力媒体44を導入するための弾性収容体41ｂと、該圧力媒体44による加圧力を調節するための加圧力調節機構43と、該加圧力調節機構43と弾性収容体41ｂとを連通接続させるための連通経路41ｃとを備えている。
また、下型均等加圧手段42は、下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に設けた下型水平空間部42ａと、該下型水平空間部42ａ内に装設した圧力媒体44を導入するための弾性収容体42ｂと、該圧力媒体44による加圧力を調節するための加圧力調節機構43と、該加圧力調節機構43と弾性収容体42ｂとを連通接続させるための連通経路42ｃとを備えている。 That is, the upper mold uniform pressurizing means 41 includes an upper mold horizontal space portion 41a provided between the upper mold hold block 31b and the substrate set block 31c, and a pressure medium 44 installed in the upper mold horizontal space portion 41a. An elastic container 41b for introducing pressure, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and a communication path for connecting the pressure adjusting mechanism 43 and the elastic container 41b to each other 41c.
The lower mold uniform pressurizing means 42 includes a lower mold horizontal space portion 42a provided between the lower mold hold block 32b and the cavity bottom surface member 32c, and a pressure medium 44 installed in the lower mold horizontal space portion 42a. An elastic container 42b for introducing pressure, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and a communication path for connecting the pressure adjusting mechanism 43 and the elastic container 42b in communication. 42c.

上記した圧力媒体としては、流体（例えば、エアや不活性ガス等の気体、或は、水等の不活性水溶液や油類等の液体）を用いることが可能である。
例えば、圧力媒体として低熱伝導性のシリコーンオイルを用いることができる。
この場合は、圧力媒体としての機能を備えるのみならず、その断熱機能にて消費電力の低減化を図ることができる。 As the above-described pressure medium, a fluid (for example, a gas such as air or an inert gas, or an inert aqueous solution such as water or a liquid such as oil) can be used.
For example, a low thermal conductivity silicone oil can be used as the pressure medium.
In this case, not only a function as a pressure medium is provided, but also the heat insulation function can reduce power consumption.

なお、図例においては、上型均等加圧手段41と下型均等加圧手段42との加圧力調節機構43を兼用させている場合を例示しているが、上型均等加圧手段41及び下型均等加圧手段42の夫々に対応する専用の加圧力調節機構を配設するようにしてもよい。   In the illustrated example, the case where the pressurization adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means 42 are combined is illustrated, but the upper mold uniform pressurizing means 41 and A dedicated pressure adjusting mechanism corresponding to each of the lower mold uniform pressurizing means 42 may be provided.

また、下型32を上下動させて上型31と下型32とを開閉（型締め或は型開き）するための
型開閉機構50は、次のように構成されている。
即ち、圧縮成形用型30の下方位置となるプレスフレーム20の下部にベース51を固着すると共に、ベース51と該ベースの上方位置に設けた可動プラテン52とをリンク機構（トグル機構）によって連結し、更に、該リンクをサーボモータ53によって駆動することにより上下両型（31・32）の型開閉を行うよう構成している。
詳述すると、サーボモータ53とベース51の中心位置に回転可能に立設させたスクリュウ軸54とは、サーボモータ53の出力軸53ａとスクリュウ軸54の下端プーリー53ｂとの間に架設したベルト53ｃを介して連結させている。
また、スクリュウ軸54にはナット部材55を螺装しており、スクリュウ軸54を回転させることによってナット部材55が上下方向へ移動するように設けている。そして、このナット部材55にベース51と可動プラテン52とを連結するリンクを係合させることにより、ナット部材55の上下動に伴って可動プラテン52を上下動させるように設けている。
なお、ベース51と可動プラテン52との間を連結するリンクは、第１リンク板56ａと、第２リンク板56ｂ及び第３リンク板56ｃとから構成している。
そして、軸51ａを介してベース51と第２リンク板56ｂの下端とを軸支し、また、軸52ａを介して可動プラテン52と第３リンク板56ｃの上端とを軸支し、また、軸52ｂを介して第２リンク板56ｂの上端と第３リンク板56ｃの下端とを軸支する。
また、第１リンク板56ａの一端をナット部材55に軸支すると共に、第１リンク板56ａの他端を第２リンク板56ｂにおける中間位置（軸51ａと軸52ｂとの中間位置）に軸支させている。このため、第１リンク板56ａは、ナット部材55の上下動による駆動力を第２リンク板56ｂと第３リンク板56ｃに伝達するための駆動リンクとして作用することになる。
従って、サーボモータ53にてスクリュウ軸54を回転させることにより、ナット部材55、及び、第１リンク板56ａ・第２リンク板56ｂ・第３リンク板56ｃを介して可動プラテン52を上下動させて上下両型（31・32）の型開閉を行うことができる。 A mold opening / closing mechanism 50 for opening / closing (mold clamping or mold opening) the upper mold 31 and the lower mold 32 by moving the lower mold 32 up and down is configured as follows.
That is, the base 51 is fixed to the lower part of the press frame 20 which is the lower position of the compression molding die 30, and the base 51 and the movable platen 52 provided at the upper position of the base are connected by a link mechanism (toggle mechanism). Further, the link is driven by a servo motor 53 to open and close both upper and lower molds (31, 32).
More specifically, the servo shaft 53 and the screw shaft 54 installed so as to be rotatable at the center position of the base 51 are a belt 53c installed between the output shaft 53a of the servo motor 53 and the lower end pulley 53b of the screw shaft 54. It is connected via.
Further, a nut member 55 is screwed on the screw shaft 54, and the nut member 55 is provided so as to move in the vertical direction by rotating the screw shaft 54. Then, by engaging the nut member 55 with a link that connects the base 51 and the movable platen 52, the movable platen 52 is moved up and down as the nut member 55 moves up and down.
The link connecting the base 51 and the movable platen 52 includes a first link plate 56a, a second link plate 56b, and a third link plate 56c.
The base 51 and the lower end of the second link plate 56b are pivotally supported via the shaft 51a, and the movable platen 52 and the upper end of the third link plate 56c are pivotally supported via the shaft 52a. The upper end of the second link plate 56b and the lower end of the third link plate 56c are pivotally supported via 52b.
Further, one end of the first link plate 56a is pivotally supported by the nut member 55, and the other end of the first link plate 56a is pivotally supported by an intermediate position (intermediate position between the shaft 51a and the shaft 52b) of the second link plate 56b. I am letting. For this reason, the first link plate 56a acts as a drive link for transmitting the driving force generated by the vertical movement of the nut member 55 to the second link plate 56b and the third link plate 56c.
Therefore, by rotating the screw shaft 54 by the servo motor 53, the movable platen 52 is moved up and down via the nut member 55, the first link plate 56a, the second link plate 56b, and the third link plate 56c. The upper and lower molds (31, 32) can be opened and closed.

なお、上記した型開閉機構50は、図例においては、トグル機構を用いた場合を例示したが、これに替えて、電動モータとスクリュージャッキ手段を採用した型開閉機構や油圧手段を採用した型開閉機構等を用い得ることは明らかである。   In the illustrated example, the above-described mold opening / closing mechanism 50 is exemplified by using a toggle mechanism, but instead of this, a mold opening / closing mechanism employing an electric motor and screw jack means and a mold employing a hydraulic means. Obviously, an opening / closing mechanism or the like can be used.

また、上下両型（31・32）の型面間には、図４及び図５に拡大図示するように、樹脂成形部33が構成される。
即ち、キャビティ底面部材32ｃの上面と、キャビティ側面部材32ｄの上面開口部とによって構成される凹所は樹脂成形用の下型キャビティ33ａとして設けられている。
また、図４に示すように、上下両型（31・32）を閉じる型締時（図４(2) 参照）において、該上下両型（31・32）間に、下型キャビティ33ａ内の溶融樹脂材料80ａの一部となる余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させるための狭い間隙33ｃを構成している。また、下型キャビティ33ａ部の周囲に狭い間隙33ｃを通して連通させた余剰樹脂80ｂの収容部33ｂを配置している（図５参照）。また、上下両型（31・32）の型締め最終位置における下型キャビティ33ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ33ｄの間隔と等しくなるように設定している。
更に、余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させるための狭い間隙33ｃは、下型キャビティ33ａと大形基板70における電子部品71の装着面との両者間に構成した下型キャビティ33ａと余剰樹脂80ｂの収容部33ｂとを連通させる樹脂通路となる。
また、上記狭い間隙33ｃは、下型キャビティ33ａから余剰樹脂80ｂの収容部33ｂに向かって浅くなるような傾斜面として設けている。このような傾斜面を用いることによって、余剰樹脂80ｂを収容部33ｂ内へ徐々に（低速で）流入させることができる。 Further, a resin molding portion 33 is formed between the upper and lower molds (31, 32) as shown in enlarged views in FIGS.
That is, a recess formed by the upper surface of the cavity bottom surface member 32c and the upper surface opening of the cavity side surface member 32d is provided as a lower mold cavity 33a for resin molding.
As shown in FIG. 4, when the upper and lower molds (31, 32) are closed (see FIG. 4 (2)), the lower mold cavity 33a is placed between the upper and lower molds (31, 32). A narrow gap 33c is formed for allowing excess resin 80b, which is a part of the molten resin material 80a, to flow out of the lower mold cavity 33a. In addition, an accommodating portion 33b of excess resin 80b communicated through a narrow gap 33c is disposed around the lower mold cavity 33a portion (see FIG. 5). In addition, the distance between the bottom surface of the lower mold cavity 33a and the mounting surface of the electronic component 71 on the large substrate 70 at the final clamping position of both the upper and lower dies (31, 32) allows the electronic component 71 on the large substrate 70 to be resin-sealed. Therefore, the distance is set to be equal to the interval of the package thickness 33d.
Further, the narrow gap 33c for allowing the excess resin 80b to flow out of the lower mold cavity 33a is formed between the lower mold cavity 33a and the lower mold cavity 33a formed between the mounting surface of the electronic component 71 on the large substrate 70. It becomes a resin passage which makes the accommodating part 33b of the excess resin 80b communicate.
The narrow gap 33c is provided as an inclined surface that becomes shallower from the lower mold cavity 33a toward the accommodating portion 33b of the excess resin 80b. By using such an inclined surface, the surplus resin 80b can be gradually introduced into the accommodating portion 33b (at a low speed).

なお、上記した圧縮樹脂封止装置には、下型32に設けた下型キャビティ33ａ部を含む下型面に離型フイルム60を張設するための離型フイルム供給セット機構（図示なし）を併設している。
更に、離型フイルム供給セット機構にて離型フイルム60を張設した下型キャビティ33ａ部にシート状樹脂80を供給するための樹脂供給セット機構（図示なし）を併設している。
また、このシート状樹脂80は、下型キャビティ33ａ部の形状に対応した類似形状に形成され、且つ、所要量の樹脂を平坦化して所要の保形性を備えている。
ここで、所要量とは、後述するように、下型キャビティ33ａ内において大形基板70上の電子部品71を所定厚みに一括して圧縮樹脂封止成形するための樹脂量と、該樹脂量に下型キャビティ33ａの外部へ流出させるための余剰樹脂量を加えた量を意味する。
より具体的には、例えば、大形基板上の電子部品71を断面 0.3ｍｍの厚さのパッケージ内に一括して圧縮樹脂封止成形する場合においては、断面 0.5ｍｍの厚さのシート状樹脂材料80を用いることが好ましい。 The above-described compression resin sealing device has a release film supply set mechanism (not shown) for tensioning the release film 60 on the lower mold surface including the lower mold cavity 33a provided in the lower mold 32. It is attached.
Further, a resin supply set mechanism (not shown) for supplying the sheet-like resin 80 to the lower mold cavity 33a portion where the release film 60 is stretched by the release film supply set mechanism is provided.
The sheet-like resin 80 is formed in a similar shape corresponding to the shape of the lower mold cavity 33a, and has a required shape retaining property by flattening a required amount of resin.
Here, the required amount is, as will be described later, a resin amount for collectively compressing and molding the electronic components 71 on the large substrate 70 to a predetermined thickness in the lower mold cavity 33a, and the resin amount Means the amount of excess resin added to the outside of the lower mold cavity 33a.
More specifically, for example, when the electronic component 71 on the large substrate is collectively molded into a package having a thickness of 0.3 mm by compression resin sealing, a sheet-like resin having a thickness of 0.5 mm is used. It is preferable to use the material 80.

以下、この圧縮樹脂封止装置を用いて、大形基板70上に装着した電子部品71を、樹脂（定量で定型化したシート状樹脂）により、一括して圧縮樹脂封止成形する場合について説明する。   In the following, a description will be given of a case where the electronic resin 71 mounted on the large substrate 70 is collectively compressed and sealed with a resin (a sheet-shaped resin fixed in quantity) using this compression resin sealing device. To do.

まず、型開閉機構50を介して、上下両型（31・32）の型開きを行う（図１参照）。
次に、この型開時において、適宜な係着手段（図示なし）を介して、上型31の型面（即ち、基板セットブロック31ｃの下面）に大形基板70を供給すると共に、その電子部品71の装着面側を下向きとして係着させる。
また、離型フイルム供給セット機構（図示なし）を介して、下型キャビティ33ａ部を含む下型32の型面（即ち、キャビティ底面部材32ｃ及びキャビティ側面部材32ｄの上面）に離型フイルム60を張設する。更に、離型フイルム60を張設した下型キャビティ33ａ部に、樹脂供給セット機構（図示なし）を介して、シート状樹脂80を供給する（図４参照）。
また、このシート状樹脂80はキャビティ底面部材32ｃに内装した下型加熱用ヒータ32ｆによって加熱溶融化される。
なお、定量で定型化したシート状樹脂は、予め、ロール巻きした離型フィルムを所要の長さに切断した離型フィルム（所謂、プリカットした離型フィルム）の上に載置した状態で、下型キャビティ内に供給セットすることができる。
例えば、まず、離型フィルム60の上にシート状樹脂80を載置した状態で、下型キャビティ33ａ部の開口部（型面）に当該シート状樹脂80の位置を合わせて載置し、次に、離型フィルム60を下型キャビティ33ａ内に引き込むで離型フィルムを下型キャビティ内に被覆させることにより、離型フィルム60を被覆した下型キャビティ33ａ内にシート状樹脂80を供給してセットすることができる。 First, the upper and lower molds (31, 32) are opened through the mold opening / closing mechanism 50 (see FIG. 1).
Next, when the mold is opened, the large substrate 70 is supplied to the mold surface of the upper mold 31 (that is, the lower surface of the substrate set block 31c) via an appropriate engaging means (not shown), and the electron The component 71 is engaged with the mounting surface side facing downward.
Further, the release film 60 is applied to the mold surface of the lower mold 32 including the lower mold cavity 33a (that is, the upper surfaces of the cavity bottom surface member 32c and the cavity side surface member 32d) via a release film supply set mechanism (not shown). Install. Further, the sheet-like resin 80 is supplied to the lower mold cavity 33a portion on which the release film 60 is stretched via a resin supply setting mechanism (not shown) (see FIG. 4).
The sheet-like resin 80 is heated and melted by the lower mold heater 32f built in the cavity bottom member 32c.
The sheet-shaped resin fixed in a fixed amount is placed in a state where it is placed on a release film (so-called pre-cut release film) obtained by cutting a rolled release film into a predetermined length in advance. The supply can be set in the mold cavity.
For example, first, in a state where the sheet-shaped resin 80 is placed on the release film 60, the position of the sheet-shaped resin 80 is placed on the opening (mold surface) of the lower mold cavity 33a, and then placed. Further, by drawing the release film 60 into the lower mold cavity 33a to coat the release film in the lower mold cavity, the sheet-like resin 80 is supplied into the lower mold cavity 33a coated with the release film 60. Can be set.

次に、均等加圧手段40を介して、加圧力調節機構43により所定の加圧力に調節された圧力媒体44を上型均等加圧手段41の弾性収容体41ｂ内及び下型均等加圧手段42の弾性収容体42ｂ内の夫々に導入することにより、上下両型（31・32）の型締時において該上下両型がその型締圧力によって弯曲変形されるのを防止する（図３参照）。
また、この均等加圧手段40による上下両型（31・32）の弯曲変形防止工程は、成形工程中において常時行うようにしてもよく、または、後述する上下両型（31・32）の型締工程に先行して行うようにしてもよく、或は、該型締工程と同時的に行うようにしてもよい。要するに、上下両型（31・32）の型締工程における型締圧力によって該上下両型が弯曲変形されるのを防止することができる時期を選定すればよい。 Next, the pressure medium 44 adjusted to a predetermined pressurizing force by the pressurizing force adjusting mechanism 43 through the uniform pressurizing means 40 is supplied to the elastic container 41b of the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means. By introducing them into each of the 42 elastic containers 42b, the upper and lower molds (31, 32) are prevented from being bent and deformed by the clamping pressure when the upper and lower molds (31, 32) are clamped (see FIG. 3). ).
Further, the bending deformation preventing process of the upper and lower molds (31, 32) by the uniform pressurizing means 40 may be performed at all times during the molding process, or the upper and lower molds (31, 32) described later. It may be performed prior to the clamping process, or may be performed simultaneously with the mold clamping process. In short, it is only necessary to select a time when it is possible to prevent the upper and lower molds from being bent and deformed by the clamping pressure in the mold clamping process of the upper and lower molds (31, 32).

次に、図２に示すように、型開閉機構50を介して、下型32を上動させることにより、上下両型（31・32）の型締めを行う。
この上下両型（31・32）の型締めを行うと、上型31の型面に係着させた大形基板70上の電子部品71を、離型フイルム60を張設した下型キャビティ33ａ内の溶融樹脂材料80ａ中に浸漬させることができる。
次に、この下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えることにより、大形基板70上に装着した電子部品71を樹脂により一括して圧縮樹脂封止成形することができる。
なお、上記した上下両型（31・32）の型締時にシール部材31ｅにて該上下両型の型面間をシールすることができるため、真空引機構（図示なし）の真空ポンプを作動させて該型面間（下型キャビティ33ａ内）を減圧する、所謂、真空成形（減圧成形）を行うことができる。 Next, as shown in FIG. 2, the upper and lower molds (31, 32) are clamped by moving the lower mold 32 upward through the mold opening / closing mechanism 50.
When the upper and lower molds (31, 32) are clamped, the electronic component 71 on the large substrate 70 engaged with the mold surface of the upper mold 31 is placed in the lower mold cavity 33a in which the release film 60 is stretched. It can be immersed in the molten resin material 80a.
Next, by applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a, the electronic components 71 mounted on the large substrate 70 can be collectively compressed and sealed with resin. .
Since the upper and lower molds (31, 32) can be sealed with the sealing member 31e when the upper and lower molds (31, 32) are clamped, a vacuum pump of a vacuum drawing mechanism (not shown) is operated. Thus, so-called vacuum molding (decompression molding) can be performed in which the pressure between the mold surfaces (inside the lower mold cavity 33a) is reduced.

また、上記した上下両型（31・32）の型締工程において、下型キャビティ33ａ内の余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させる余剰樹脂の外部流出段階を行い、そして、この余剰樹脂80ｂの外部流出段階を経た後に、キャビティ底面部材32ｃを所定の高さ位置まで上動させることにより、下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えて大形基板70上の電子部品71を一括して樹脂封止成形する樹脂封止段階を行う。
該余剰樹脂80ｂの外部流出段階においては、上下両型（31・32）間に構成される狭い間隙33ｃを通して、余剰樹脂80ｂを下型キャビティ33ａ部の周囲に設けた余剰樹脂80ｂの収容部33ｂ内（図４及び図５参照）に案内する。
更に、該樹脂封止段階においては、上下両型（31・32）の型締め最終位置における下型キャビティ33ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ33ｄの間隔と等しくなるように設定しているため、下型キャビティ33ａ内において所定の樹脂圧を得ることができると共に、パッケージ厚さ33ｄを所定の厚みに成形することができる。 Further, in the mold clamping process of both the upper and lower molds (31, 32), the excess resin 80b in the lower mold cavity 33a is discharged to the outside of the lower mold cavity 33a. After the resin 80b has flowed out to the outside, the cavity bottom member 32c is moved up to a predetermined height position, thereby applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a and A resin sealing step is performed in which the electronic components 71 are collectively resin-sealed.
In the outflow stage of the surplus resin 80b, the surplus resin 80b is provided around the lower mold cavity 33a through the narrow gap 33c formed between the upper and lower molds (31, 32). It guides in (refer FIG.4 and FIG.5).
Further, in the resin sealing stage, the distance between the bottom surface of the lower mold cavity 33a and the mounting surface of the large substrate 70 on the electronic component 71 at the final clamping position of both the upper and lower molds (31, 32) is the large substrate 70. Since the electronic component 71 is set to be equal to the interval of the package thickness 33d for resin sealing, a predetermined resin pressure can be obtained in the lower mold cavity 33a, and the package thickness 33d can be reduced. It can be molded to a predetermined thickness.

即ち、このとき、上下両型（31・32）による型締作用と、キャビティ底面部材32ｃによる下型キャビティ33ａ内の溶融樹脂材料80ａに対する押圧作用とを行うことができる。
従って、該上下両型の型締作用及び該溶融樹脂材料80ａに対する押圧作用を低速度で且つ低圧にて行うことにより、上記した余剰樹脂80ｂの外部流出段階とこれに続く樹脂封止段階とを低速度で且つ低圧にて行うことができる。
更に、樹脂封止段階における上下両型（31・32）の型締め最終位置において大形基板70の電子部品71を所定厚さのパッケージ内にて樹脂封止することができるように関係付けている。このため、該上下両型の型締作用時及び該溶融樹脂材料80ａの押圧作用時に、下型キャビティ33ａ内における溶融樹脂材料80ａの流動作用を防止若しくは抑制することができるので、この溶融樹脂材料80ａの流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。 That is, at this time, the mold clamping action by the upper and lower molds (31, 32) and the pressing action on the molten resin material 80a in the lower mold cavity 33a by the cavity bottom member 32c can be performed.
Accordingly, by performing the clamping action of both the upper and lower molds and the pressing action against the molten resin material 80a at a low speed and a low pressure, the above-described external resin outflow stage and the subsequent resin sealing stage are performed. It can be performed at low speed and low pressure.
Further, the electronic components 71 of the large substrate 70 are related to each other so that they can be resin-sealed in a package having a predetermined thickness at the final clamping positions of the upper and lower molds (31, 32) in the resin sealing stage. Yes. For this reason, since the flow action of the molten resin material 80a in the lower mold cavity 33a can be prevented or suppressed during the mold clamping action of the upper and lower molds and the pressing action of the molten resin material 80a, the molten resin material Generation | occurrence | production of the wire sweep etc. resulting from the flow effect | action of 80a can be prevented efficiently.

なお、上記した樹脂封止段階における上下両型（31・32）の型締め最終位置、或は、該型締め最終位置における下型キャビティ33ａの底面位置の設定は、型開閉機構50によって下型32を上動させる限度（上死点）の位置と合致させるようにしてもよい（図２参照）。   The final mold clamping position of the upper and lower molds (31, 32) at the resin sealing stage described above, or the bottom position of the lower mold cavity 33a at the final mold clamping position is set by the mold opening / closing mechanism 50. You may make it correspond to the position of the limit (top dead center) which moves 32 up (refer to Drawing 2).

また、上記した樹脂封止段階における上下両型（31・32）の型締め最終位置、或は、該型締め最終位置における下型キャビティ33ａの底面位置の設定は、型開閉機構50によって上動する下型32、或は、キャビティ底面部材32ｃの所定の高さ位置を検知して該下型32、或は、キャビティ底面部材32ｃの上動作用を停止させる高さ位置制御機構（図示なし）を採用するようにしてもよい。   In addition, the mold closing mechanism 50 can be used to set the final clamping position of the upper and lower molds (31, 32) in the resin sealing stage or the bottom position of the lower mold cavity 33a at the final clamping position. A height position control mechanism (not shown) that detects a predetermined height position of the lower mold 32 or the cavity bottom member 32c and stops the upper movement of the lower mold 32 or the cavity bottom member 32c. May be adopted.

また、定量で定型化したシート状樹脂80を用いることによって、下型キャビティ33ａ内の全域に亘る樹脂材料の供給作用と、該シート状樹脂の加熱溶融化作用と、該溶融樹脂材料80ａに対する低速度且つ低圧による押圧作用との相乗作用によって、該下型キャビティ内における溶融樹脂材料の流動作用に基因するワイヤスイープ等の発生を、より効率良く防止することができる。   In addition, by using the sheet-shaped resin 80 that is fixed in a fixed amount, the resin material supplying action over the entire area of the lower mold cavity 33a, the heat-melting action of the sheet-shaped resin, and the low resistance to the molten resin material 80a. Due to the synergistic action with the pressing action by the speed and the low pressure, the occurrence of wire sweep or the like due to the flow action of the molten resin material in the lower mold cavity can be prevented more efficiently.

なお、上記した樹脂封止段階においては、例えば、成形温度160〜185℃で、成形圧力０．２９４１ＭＰａ以上（３ｋｇｆ／ｃｍ2以上）の低圧による圧縮樹脂封止成形が可能である。
また、樹脂封止段階において、均等加圧手段40を併用することにより、上下両型（31・32）の型締時における型締圧力によって該上下両型が弯曲変形されるのを防止することができる。
また、下型キャビティ33ａ内の余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させる余剰樹脂の外部流出段階を行い、この余剰樹脂80ｂの外部流出段階を経た後に、キャビティ底面部材32ｃを所定の高さ位置まで上動させることにより、下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えて大形基板70上の電子部品71を一括して樹脂封止成形することができる。
このとき、下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加え、且つ、キャビティ底面部材32ｃを所定の高さ位置まで上動させることができるので、大形基板70上に成形されるパッケージの厚さ33dの精度（ばらつき）を効率良く向上させることができる。 In the resin sealing step described above, for example, compression resin sealing can be performed at a molding temperature of 160 to 185 ° C. and a low pressure of a molding pressure of 0.2941 MPa or more (3 kgf / cm 2 or more).
Also, in the resin sealing stage, by using the uniform pressure means 40 together, the upper and lower molds (31, 32) can be prevented from being bent and deformed by the clamping pressure when the molds are clamped. Can do.
In addition, an excess resin 80b flowing out of the excess resin 80b in the lower mold cavity 33a to the outside of the lower mold cavity 33a is performed. After the excess resin 80b is discharged to the outside, the cavity bottom member 32c is moved to a predetermined height. By moving up to this position, a predetermined resin pressure is applied to the molten resin material 80a in the lower mold cavity 33a, and the electronic components 71 on the large substrate 70 can be collectively encapsulated.
At this time, a predetermined resin pressure can be applied to the molten resin material 80a in the lower mold cavity 33a, and the cavity bottom member 32c can be moved up to a predetermined height position, so that it is molded on the large substrate 70. The accuracy (variation) of the package thickness 33d can be improved efficiently.

この実施例の構成によれば、大形基板70上に装着した多数個の電子部品71を樹脂により一括して封止成形する場合において、下型キャビティ33ａ内に供給する樹脂量の計量や調節作業を省略化することができる。
また、キャビティ内における溶融樹脂材料80ａの流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。
また、下型キャビティ33ａ内において所定の樹脂圧を得ることができる。
また、電子部品71を樹脂封止するパッケージの厚さ33ｄを所定の厚みに成形することができる。
また、上型31についての均等加圧手段41と下型32についての均等加圧手段42とを備えたことにより、上下両型（31・32）の弯曲変形を防止することができるため、大形基板70上の電子部品71を樹脂により一括して封止成形する場合に有益である。
また、型開閉機構50にて上下両型（31・32）を型締し且つ下型キャビティ33ａ内の樹脂80ａを加圧する場合、下型32の均等加圧手段42を駆動することにより、下型水平空間部42ａに設けられた弾性収容体42ｂ内の圧力媒体44による均等加圧作用にて、弾性収容体42ｂの上に付設されたキャビティ底面部材32ｃを、そのキャビティ底面（先端面）を水平状態に保持した状態で上動させることができる（キャビティ底面部材32ｃを水平フローティング板として傾くことなく水平に持ち上げることができる）。
更に、上型加熱用ヒータ31ｄ及び下型加熱用ヒータ32ｆを上下両型（31・32）間における樹脂成形部33（下型キャビティ33ａ部）の近傍位置に配設したことにより、樹脂材料に対する熱効率を向上させることができる。 According to the configuration of this embodiment, when a large number of electronic components 71 mounted on the large substrate 70 are collectively sealed with resin, the amount of resin supplied to the lower mold cavity 33a is measured and adjusted. Work can be omitted.
Further, it is possible to efficiently prevent the occurrence of wire sweep or the like due to the flow action of the molten resin material 80a in the cavity.
In addition, a predetermined resin pressure can be obtained in the lower mold cavity 33a.
Further, the thickness 33d of the package for resin-sealing the electronic component 71 can be formed to a predetermined thickness.
Further, since the uniform pressure means 41 for the upper mold 31 and the uniform pressure means 42 for the lower mold 32 are provided, it is possible to prevent the upper and lower molds (31, 32) from being bent. This is useful when the electronic components 71 on the shaped substrate 70 are collectively encapsulated with resin.
Further, when both the upper and lower molds (31, 32) are clamped by the mold opening / closing mechanism 50 and the resin 80a in the lower mold cavity 33a is pressurized, by driving the uniform pressure means 42 of the lower mold 32, The cavity bottom surface member 32c provided on the elastic container 42b is applied to the cavity bottom surface (tip surface) by the uniform pressure action by the pressure medium 44 in the elastic container 42b provided in the mold horizontal space 42a. The cavity bottom member 32c can be lifted horizontally without being inclined as a horizontal floating plate.
Furthermore, the upper mold heater 31d and the lower mold heater 32f are disposed in the vicinity of the resin molding portion 33 (lower mold cavity 33a portion) between the upper and lower molds (31, 32). Thermal efficiency can be improved.

次に、本発明に係る第二実施例の形態を、図６に基づいて説明する。   Next, a second embodiment according to the present invention will be described with reference to FIG.

図６は本発明の第二実施例を示す圧縮樹脂封止装置であって、図６(1) はその上下両型の型開時における樹脂成形部の要部を、また、図６(2) はその上下両型の型締時における樹脂成形部の要部を示している。
第二実施例は、次の点において第一実施例のものと異なる。
なお、その他の点については、第一実施例のものと実質的に同じである。
従って、異なる点に関して説明すると共に、第一実施例のものと実質的に同じ構成部材については同じ符号を付して、説明の重複を避ける。 FIG. 6 shows a compression resin sealing device according to a second embodiment of the present invention. FIG. 6 (1) shows the main part of the resin molding part when the upper and lower molds are opened, and FIG. ) Shows the main part of the resin molded part when the upper and lower molds are clamped.
The second embodiment differs from that of the first embodiment in the following points.
Other points are substantially the same as those of the first embodiment.
Therefore, different points will be described, and substantially the same components as those in the first embodiment are denoted by the same reference numerals to avoid duplication of description.

即ち、図６(2) に示すように、余剰樹脂80ｂを下型キャビティ34ａの外部へ流出させるための狭い間隙34ｃが、下型32の型面（図例では、キャビティ側面部材32ｄの上面）と大形基板70における電子部品71の装着面との両者間に構成されている。
また、余剰樹脂の収容部34ｂが、狭い間隙34ｃ、及び、狭い間隙34ｃと下型キャビティ34ａの周囲に配置した樹脂漏防止用部材34との間の空間部として設けられている。
また、樹脂漏防止用部材34が、上下両型（31・32）の型締時における該上下両型の型面間の距離を規制するための位置決部材を兼ねている。 That is, as shown in FIG. 6 (2), the narrow gap 34c for allowing the excess resin 80b to flow out of the lower mold cavity 34a is the mold surface of the lower mold 32 (in the example shown, the upper surface of the cavity side member 32d). And the mounting surface of the electronic component 71 on the large substrate 70.
In addition, a surplus resin container 34b is provided as a narrow gap 34c and a space between the narrow gap 34c and the resin leakage prevention member 34 disposed around the lower mold cavity 34a.
Further, the resin leakage preventing member 34 also serves as a positioning member for regulating the distance between the upper and lower mold surfaces when the upper and lower molds (31, 32) are clamped.

樹脂漏防止用部材34は、その駆動機構（図示なし）からの動作信号35を受けて上下動するように設けている。そして、この樹脂漏防止用部材34の下端面を下型32の型面（即ち、離型フイルム60を張設したキャビティ側面部材32ｄの上面）に接合させて固定することにより、上下両型（31・32）の型締時における該上下両型の型面間を所定の距離に規制することができる。
従って、該樹脂漏防止用部材34における下端面の高さ位置を選定することにより、上記した狭い間隙34ｃの広狭調節を適宜に行うことができる。 The resin leakage prevention member 34 is provided so as to move up and down in response to an operation signal 35 from its drive mechanism (not shown). Then, the lower end surface of the resin leakage preventing member 34 is joined and fixed to the mold surface of the lower mold 32 (that is, the upper surface of the cavity side member 32d on which the release film 60 is stretched), whereby both upper and lower molds ( The distance between the upper and lower mold surfaces at the time of mold clamping of 31 and 32) can be restricted to a predetermined distance.
Therefore, by selecting the height position of the lower end surface of the resin leakage preventing member 34, the above-mentioned narrow adjustment of the narrow gap 34c can be appropriately performed.

第二実施例の構成においては、図６(2) に示す上下両型（31・32）の型締工程時に、下型キャビティ34ａ内の余剰樹脂80ｂを下型キャビティ34ａの外部へ流出させる余剰樹脂の外部流出段階を行い、そして、この余剰樹脂の外部流出段階を経た後に、キャビティ底面部材32ｃを所定の高さ位置まで上動させることにより、下型キャビティ34ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えて大形基板70上の電子部品71を一括して樹脂封止成形する樹脂封止段階を行う。
また、余剰樹脂の外部流出段階においては、上下両型（31・32）間に構成される狭い間隙34ｃを通して、余剰樹脂80ｂを下型キャビティ34ａ部の周囲に設けた余剰樹脂の収容部34ｂ内に案内するように設定し、更に、樹脂封止段階においては、上下両型（31・32）の型締め最終位置における下型キャビティ34ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ34ｄの間隔と等しくなるように設定しているため、下型キャビティ34ａ内において所定の樹脂圧を得ることができると共に、パッケージ厚さ34ｄを所定の厚みに成形することができる。 In the configuration of the second embodiment, the surplus resin 80b in the lower mold cavity 34a flows out of the lower mold cavity 34a during the mold clamping process of the upper and lower molds (31, 32) shown in FIG. 6 (2). After the resin outflow stage is performed, and after the surplus resin external outflow stage, the cavity bottom member 32c is moved up to a predetermined height position so that the molten resin material 80a in the lower mold cavity 34a has a predetermined height. A resin sealing step is performed in which the electronic components 71 on the large-sized substrate 70 are collectively resin-sealed and molded by applying the resin pressure.
Further, at the stage of surplus resin flowing out, the surplus resin 80b is passed through a narrow gap 34c formed between the upper and lower molds (31, 32) in the surplus resin containing section 34b provided around the lower mold cavity 34a. Further, in the resin sealing stage, the bottom surface of the lower mold cavity 34a at the final clamping position of both the upper and lower molds (31, 32) and the mounting surface of the electronic component 71 on the large substrate 70 Since the interval is set to be equal to the interval of the package thickness 34d for resin-sealing the electronic component 71 of the large substrate 70, a predetermined resin pressure can be obtained in the lower mold cavity 34a. At the same time, the package thickness 34d can be formed to a predetermined thickness.

第二実施例の構成によれば、樹脂漏防止用部材34が、上下両型（31・32）の型締時における該上下両型の型面間の距離を規制するための位置決部材を兼ねているため、例えば、所要の狭い間隙34ｃを設定する作業と、余剰樹脂80ｂの収容部34ｂを構成する作業とを同時的に行うことができる。
また、型締めした上下両型（31・32）の型面間に、余剰樹脂80ｂの収容部34ｂ、及び、該収容部34ｂと下型キャビティ34ａとを連通接続させるための狭い間隙34ｃを設定して構成することができるので、第一実施例において説明した傾斜面を備える狭い間隙33ｃ及び凹溝状の余剰樹脂収容部33ｂを削設して構成する必要がない。 According to the configuration of the second embodiment, the resin leakage preventing member 34 is provided with a positioning member for regulating the distance between the mold surfaces of the upper and lower molds (31, 32) during mold clamping. Therefore, for example, the operation of setting the required narrow gap 34c and the operation of configuring the accommodating portion 34b of the surplus resin 80b can be performed simultaneously.
In addition, between the mold surfaces of the clamped upper and lower molds (31, 32), there is set a housing portion 34b for excess resin 80b and a narrow gap 34c for connecting the housing portion 34b and the lower mold cavity 34a in communication. Therefore, it is not necessary to cut and configure the narrow gap 33c having the inclined surface described in the first embodiment and the groove-like surplus resin containing portion 33b.

次に、本発明に係る第三実施例の形態を、図７に基づいて説明する。   Next, the form of 3rd Example based on this invention is demonstrated based on FIG.

図７は本発明の第三実施例を示す圧縮樹脂封止装置であって、図７(1) はその上下両型の型開時における樹脂成形部の要部を、また、図７(2) はその上下両型の型締時における樹脂成形部の要部を示している。
第三実施例は、次の点において前各実施例のものと異なる。
なお、その他の点については、前各実施例のものと実質的に同じである。
従って、異なる点に関して説明すると共に、前各実施例のものと実質的に同じ構成部材については同じ符号を付して、説明の重複を避ける。 FIG. 7 shows a compression resin sealing device according to a third embodiment of the present invention. FIG. 7 (1) shows the main part of the resin molding part when the upper and lower molds are opened, and FIG. ) Shows the main part of the resin molded part when the upper and lower molds are clamped.
The third embodiment differs from the previous embodiments in the following points.
Other points are substantially the same as those of the previous embodiments.
Therefore, different points will be described, and substantially the same components as those of the previous embodiments will be denoted by the same reference numerals to avoid duplication of description.

即ち、図７に示すように、下型32が、キャビティ底面部（前各実施例のキャビティ底面部材32ｃ）とキャビティ側面部（前各実施例のキャビティ側面部材32ｄ）とを一体に形成した構成を備えている。なお、図７に示す実施例では、離型フィルム(60)は必ずしも用いる必要はないが、パッケージの離型性をより良くするために、離型フィルム(60)を用いても良い。   That is, as shown in FIG. 7, the lower mold 32 has a configuration in which a cavity bottom surface portion (cavity bottom surface member 32c of each previous embodiment) and a cavity side surface portion (cavity side surface member 32d of each previous embodiment) are integrally formed. It has. In the embodiment shown in FIG. 7, the release film (60) is not necessarily used, but the release film (60) may be used in order to improve the release property of the package.

また、図７(2) に示す上下両型（31・32）の型締め最終位置において、下型キャビティ36ａ内の溶融樹脂材料80ａを所定の樹脂圧により押圧して所定のパッケージ厚さ36ｄを成形することができるように設けられている。
例えば、下型32の型面（基板70における電子部品71の装着面）からキャビティ36ａの底面までのキャビティ36ａの深さを所定のパッケージの厚さ（間隔）36ｄに設定することができる。 Further, at the final clamping position of both the upper and lower molds (31, 32) shown in FIG. 7 (2), the molten resin material 80a in the lower mold cavity 36a is pressed with a predetermined resin pressure to obtain a predetermined package thickness 36d. It is provided so that it can be molded.
For example, the depth of the cavity 36a from the mold surface of the lower mold 32 (the mounting surface of the electronic component 71 on the substrate 70) to the bottom surface of the cavity 36a can be set to a predetermined package thickness (interval) 36d.

また、第一実施例のものと同様に、上下両型（31・32）の型面間には樹脂成形部36が構成されている。
即ち、下型32の型面（上面）に、樹脂成形用の下型キャビティ36ａを設けている。
また、上下両型（31・32）を閉じる型締時（図７(2) 参照）において、該上下両型（31・32）間に、下型キャビティ36ａ内の溶融樹脂材料80ａの一部となる余剰樹脂80ｂを下型キャビティ36ａの外部へ流出させるための狭い間隙36ｃを構成している。
また、下型キャビティ36ａ部の周囲に狭い間隙36ｃを通して連通させた余剰樹脂80ｂの収容部36ｂを配置している。
また、上下両型（31・32）の型締め最終位置における下型キャビティ36ａの底面と大形基板70における電子部品71の装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ36ｄの間隔と等しくなるように設定している。
更に、余剰樹脂80ｂを下型キャビティ36ａの外部へ流出させるための狭い間隙36ｃは、下型キャビティ36ａと大形基板70における電子部品71の装着面との両者間に構成した下型キャビティ36ａと余剰樹脂80ｂの収容部36ｂとを連通させる樹脂通路となる。
また、上記狭い間隙36ｃは、下型キャビティ36ａから余剰樹脂80ｂの収容部36ｂに向かって浅くなるような傾斜面として設けている。 Further, as in the first embodiment, a resin molded portion 36 is formed between the mold surfaces of the upper and lower molds (31, 32).
That is, a lower mold cavity 36 a for resin molding is provided on the mold surface (upper surface) of the lower mold 32.
Further, when the upper and lower molds (31, 32) are closed (see FIG. 7 (2)), a part of the molten resin material 80a in the lower mold cavity 36a is interposed between the upper and lower molds (31, 32). A narrow gap 36c for allowing the excess resin 80b to flow out to the outside of the lower mold cavity 36a is formed.
In addition, an accommodating portion 36b of excess resin 80b communicated through a narrow gap 36c is disposed around the lower mold cavity 36a portion.
In addition, the distance between the bottom surface of the lower mold cavity 36a at the final clamping position of both the upper and lower molds (31, 32) and the mounting surface of the electronic component 71 on the large substrate 70 allows the electronic component 71 on the large substrate 70 to be resin-sealed. It is set to be equal to the interval of the package thickness 36d for stopping.
Further, the narrow gap 36c for allowing the excess resin 80b to flow out of the lower mold cavity 36a is formed between the lower mold cavity 36a and the lower mold cavity 36a formed between the mounting surface of the electronic component 71 on the large substrate 70. It becomes a resin passage which makes the accommodation part 36b of the excess resin 80b communicate.
The narrow gap 36c is provided as an inclined surface that becomes shallower from the lower mold cavity 36a toward the accommodating portion 36b of the excess resin 80b.

第三実施例の構成においては、図７(2) に示す上下両型（31・32）の型締工程時に、下型キャビティ36ａ内の余剰樹脂80ｂを下型キャビティ36ａの外部へ流出させる余剰樹脂の外部流出段階を行い、そして、この余剰樹脂の外部流出段階を経た後に、下型キャビティ36ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えて大形基板70上の電子部品71を一括して樹脂封止成形する樹脂封止段階を行う。
また、余剰樹脂の外部流出段階においては、上下両型（31・32）間に構成される狭い間隙36ｃを通して、余剰樹脂80ｂを下型キャビティ36ａ部の周囲に設けた余剰樹脂の収容部36ｂ内に案内するように設定し、更に、樹脂封止段階においては、上下両型（31・32）の型締め最終位置における下型キャビティ36ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ36ｄの間隔と等しくなるように設定しているため、下型キャビティ36ａ内において所定の樹脂圧を得ることができると共に、パッケージ厚さ36ｄを所定の厚みに成形することができる。 In the configuration of the third embodiment, surplus resin 80b in the lower mold cavity 36a flows out of the lower mold cavity 36a during the mold clamping process of the upper and lower molds (31, 32) shown in FIG. 7 (2). The resin outflow stage is performed, and after this excess resin outflow stage, a predetermined resin pressure is applied to the molten resin material 80a in the lower mold cavity 36a to collectively transfer the electronic components 71 on the large substrate 70. Then, a resin sealing step of resin sealing molding is performed.
Further, at the stage of surplus resin flowing out, the surplus resin 80b is placed in the surplus resin container 36b provided around the lower mold cavity 36a through a narrow gap 36c formed between the upper and lower molds (31, 32). Further, in the resin sealing stage, the bottom surface of the lower mold cavity 36a at the final clamping position of both the upper and lower molds (31, 32) and the electronic component 71 mounting surface of the large substrate 70 Since the interval is set to be equal to the interval of the package thickness 36d for resin-sealing the electronic component 71 of the large substrate 70, a predetermined resin pressure can be obtained in the lower mold cavity 36a. At the same time, the package thickness 36d can be formed to a predetermined thickness.

第三実施例は、キャビティ底面部とキャビティ側面部とを一体に形成した下型32の構成を備えているため、上下両型（31・32）による型締作用と、下型キャビティ36ａ内の溶融樹脂材料80ａに対する押圧作用とを同時的に行うことができる。
従って、該上下両型の型締作用及び該溶融樹脂材料80ａに対する押圧作用を低速度で且つ低圧にて行うことにより、余剰樹脂80ｂの外部流出段階とこれに続く樹脂封止段階とを低速度で且つ低圧にて行うことができる。
更に、樹脂封止段階における上下両型（31・32）の型締め最終位置において大形基板70の電子部品71を所定厚さ36ｄのパッケージ内にて樹脂封止することができるように関係付けている。このため、上下両型（31・32）の型締作用時及び溶融樹脂材料80ａの押圧作用時に、下型キャビティ36ａ内における溶融樹脂材料80ａの流動作用を防止若しくは抑制して該溶融樹脂材料80ａの流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。 Since the third embodiment has the configuration of the lower mold 32 in which the cavity bottom surface portion and the cavity side surface portion are integrally formed, the mold clamping action by the upper and lower molds (31, 32), and the lower mold cavity 36a The pressing action on the molten resin material 80a can be performed simultaneously.
Accordingly, by performing the clamping action of both the upper and lower molds and the pressing action on the molten resin material 80a at a low speed and a low pressure, the excess outflow stage of the excess resin 80b and the subsequent resin sealing stage can be performed at a low speed. And at low pressure.
Further, the electronic parts 71 of the large substrate 70 are related to each other so as to be resin-sealed in a package having a predetermined thickness 36d at the final clamping positions of the upper and lower dies (31, 32) in the resin sealing stage. ing. Therefore, when the upper and lower molds (31, 32) are clamped and when the molten resin material 80a is pressed, the molten resin material 80a is prevented or suppressed in the lower mold cavity 36a by preventing or suppressing the flow of the molten resin material 80a. Generation | occurrence | production of the wire sweep etc. resulting from the flow effect | action of this can be prevented efficiently.

前記した各実施例では、電子部品の圧縮樹脂封止装置を用いて、大形基板上に装着した電子部品を、前記した定量で定型化したシート状樹脂により、一括して圧縮樹脂封止成形する場合について説明した。
しかしながら、本発明においては、例えば、プリカットした離型フィルムの上に所要量の種々の樹脂材料を平坦化した状態で（均等な厚さの状態で）載置し、その状態で、下型キャビティ内に当該樹脂材料を供給することができる。
また、本発明においては、例えば、離型フィルムを被覆した下型キャビティ内に（或いは、離型フィルムを被覆していない下型キャビティ内に）所要量の種々の樹脂材料を平坦化した状態で（均等な厚さの状態で）供給することができる。
また、前記した種々の樹脂材料として、顆粒状の樹脂材料（顆粒樹脂）、粉末状の樹脂材料（粉末樹脂）、液状の樹脂材料（液状樹脂）、ペースト状の樹脂材料、シート状の樹脂材料を用いることができる。
また、前記した種々の樹脂材料として、透明性を有する樹脂材料、半透明性を有する樹脂材料、不透明性を有する樹脂材料を用いることができる。 In each of the above-described embodiments, an electronic component mounted on a large-sized substrate using a compression resin sealing device for electronic components is collectively compressed resin-sealed with a sheet-shaped resin that is standardized by the above-described fixed amount. Explained when to do.
However, in the present invention, for example, a predetermined amount of various resin materials are placed on a pre-cut release film in a flattened state (with a uniform thickness), and in that state, the lower mold cavity The resin material can be supplied inside.
Further, in the present invention, for example, in a state where a required amount of various resin materials is flattened in a lower mold cavity covered with a release film (or in a lower mold cavity not covered with a release film). (With uniform thickness) can be supplied.
In addition, as the various resin materials described above, granular resin material (granular resin), powder resin material (powder resin), liquid resin material (liquid resin), paste resin material, sheet resin material Can be used.
Further, as the various resin materials described above, a resin material having transparency, a resin material having translucency, and a resin material having opacity can be used.

また、シート状の樹脂材料については、例えば、所要量の顆粒樹脂等の樹脂材料をカレンダーロール等で加熱してシート状に（平坦化状態に）成形して保形したものを、冷却して形成したものである。
なお、顆粒樹脂をその周面を加熱して溶融することにより、顆粒の周面を互いに接着させ、顆粒の状態を保持した状態で、所要量の樹脂量を有する顆粒樹脂全体を平坦化した状態で保形することができる（顆粒同士の間には隙間がある）。 In addition, for a sheet-like resin material, for example, a resin material such as a required amount of granular resin is heated with a calender roll or the like and formed into a sheet shape (in a flattened state), and then cooled. Formed.
In addition, by heating the peripheral surface of the granular resin and melting it, the peripheral surfaces of the granules are adhered to each other, and the entire state of the granular resin having the required amount of resin is flattened while maintaining the granular state. Can hold the shape (there is a gap between the granules).

また、本発明においては、プリカットした離型フィルムの上に、或いは、離型フィルムを被覆した下型キャビティ内に（離型フィルムを被覆していない下型キャビティ内に）、前記した種々の樹脂材料（顆粒樹脂、粉末樹脂等）を所要量、平坦化した状態で（均等な厚さに設定した状態で）供給することができる。例えば、所要量の顆粒樹脂或いは粉末樹脂を、樹脂材料の供給機構にて、一筆書きの状態で、下型キャビティ内に樹脂材料を平坦化した状態で撒くことができる。   In the present invention, the above-described various resins are provided on the precut release film or in the lower mold cavity coated with the release film (in the lower mold cavity not coated with the release film). A required amount of material (granular resin, powder resin, etc.) can be supplied in a flattened state (with a uniform thickness). For example, a required amount of granule resin or powder resin can be spread out in a state where the resin material is flattened in the lower mold cavity in a single stroke by a resin material supply mechanism.

また、本発明においては、プリカットした離型フィルムの上に、貫通孔を有するフレーム枠を載置し、フレーム枠の凹部内（貫通孔）に前記した種々の樹脂材料を平坦化した状態で供給することができる。この状態で、まず、下型面のキャビティ開口部の位置にフレーム枠の貫通孔を合致させ、次に、キャビティ内から空気を強制的に吸引排出することにより、キャビティ内に離型フィルムを引き込んで被覆させ、樹脂材料を落下させて供給することにより、下型キャビティ内に所要量の樹脂材料を平坦化した状態で供給して形成することができる。   In the present invention, a frame frame having a through hole is placed on a pre-cut release film, and the various resin materials described above are supplied in a flat state in the recess (through hole) of the frame frame. can do. In this state, first, the through hole of the frame frame is matched with the position of the cavity opening on the lower mold surface, and then the release film is drawn into the cavity by forcibly sucking and discharging air from the cavity. The resin material is dropped and supplied, so that a predetermined amount of the resin material can be supplied and formed in a flattened state in the lower mold cavity.

本発明は、まず、圧縮成形用の下型キャビティ内に樹脂材料（前記した種々の樹脂材料）を平坦化した状態で（均等な所要の厚さで）供給し、次に、圧縮成形時に、下型のキャビティ面と基板の電子部品装着面との間を、即ち、圧縮成形されるパッケージの厚さを、樹脂材料の均等な所要の厚さよりも薄くして設定し、下型キャビティ内の平坦化された樹脂材料を加圧することになる。
従って、下型キャビティ内の溶融樹脂材料は、下型キャビティの外部に隘路（狭い間隙）を通して流出することになり、下型キャビティ内の樹脂を低圧で加圧することができるものである。
なお、これは、隘路が樹脂材料で緩慢に閉鎖されるためと推測され、下型キャビティ内に所要の樹脂圧を低圧で加えることができる。 In the present invention, first, a resin material (various resin materials described above) is supplied into a lower mold cavity for compression molding in a flattened state (with a uniform required thickness), and then, at the time of compression molding, The space between the cavity surface of the lower mold and the electronic component mounting surface of the substrate, that is, the thickness of the package to be compression-molded is set to be thinner than the required uniform thickness of the resin material. The flattened resin material is pressurized.
Therefore, the molten resin material in the lower mold cavity flows out of the lower mold cavity through a bottleneck (narrow gap), and the resin in the lower mold cavity can be pressurized at a low pressure.
This is presumably because the bottleneck is slowly closed with a resin material, and a required resin pressure can be applied to the lower mold cavity at a low pressure.

20 プレスフレーム
30 圧縮成形用型
31 上型
31ａ 上型ベース
31ｂ 上型ホールドブロック
31ｃ 基板セットブロック
31ｄ 上型加熱用ヒータ
31ｅ シール部材
31ｆ シール部材
32 下型
32ａ 下型ベース
32ｂ 下型ホールドブロック
32ｃ キャビティ底面部材
32ｄ キャビティ側面部材
32ｅ 弾性部材
32ｆ 下型加熱用ヒータ
32ｇ シール部材
33 樹脂成形部
33ａ 下型キャビティ
33ｂ 余剰樹脂の収容部
33ｃ 狭い間隙
33ｄ パッケージ厚さ
34 樹脂漏防止用部材
34ａ 下型キャビティ
34ｂ 余剰樹脂の収容部
34ｃ 狭い間隙
34ｄ パッケージ厚さ
35 動作信号
36 樹脂成形部
36ａ 下型キャビティ
36ｂ 余剰樹脂の収容部
36ｃ 狭い間隙
36ｄ パッケージ厚さ
40 均等加圧手段
41 上型均等加圧手段
41ａ 上型水平空間部
41ｂ 弾性収容体
41ｃ 連通経路
42 下型均等加圧手段
42ａ 下型水平空間部
42ｂ 弾性収容体
42ｃ 連通経路
43 加圧力調節機構
44 圧力媒体
50 型開閉機構（トグル機構）
51 ベース
51ａ 軸
52 可動プラテン
52ａ 軸
53 サーボモータ
53ａ 出力軸
53ｂ プーリー
53ｃ ベルト
54 スクリュウ軸
55 ナット部材
56ａ 第１リンク
56ｂ 第２リンク
56ｃ 第３リンク
60 離型フイルム
70 大形基板
71 電子部品
80 シート状樹脂（シート状の樹脂材料）
80ａ 溶融樹脂材料
80ｂ 余剰樹脂 20 Press frame
30 Mold for compression molding
31 Upper mold
31a Upper mold base
31b Upper hold block
31c Board set block
31d Heater for upper die heating
31e Seal member
31f Seal member
32 Lower mold
32a Lower mold base
32b Lower hold block
32c Cavity bottom member
32d cavity side member
32e Elastic member
32f Lower heater
32g sealing material
33 Plastic molding part
33a Lower mold cavity
33b Housing for excess resin
33c Narrow gap
33d Package thickness
34 Material for preventing resin leakage
34a Lower mold cavity
34b Housing for excess resin
34c Narrow gap
34d Package thickness
35 Operation signal
36 Resin molding part
36a Lower mold cavity
36b Surplus resin container
36c narrow gap
36d Package thickness
40 Uniform pressure means
41 Upper mold uniform pressure means
41a Upper horizontal space
41b Elastic container
41c Communication route
42 Lower mold uniform pressure means
42a Lower mold horizontal space
42b Elastic container
42c Communication route
43 Pressure adjustment mechanism
44 Pressure medium
50-type opening / closing mechanism (toggle mechanism)
51 base
51a axis
52 Movable platen
52a axis
53 Servo motor
53a Output shaft
53b Pulley
53c belt
54 Screw shaft
55 Nut member
56a First link
56b Second link
56c 3rd link
60 Release film
70 Large board
71 Electronic components
80 Sheet resin (sheet resin material)
80a Molten resin material
80b Surplus resin

Claims (15)

少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられ且つ離型フィルムを被覆したキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
前記下型が、キャビティ底面部材とキャビティ側面部材とに分割した構成を備えるように設定し、さらに、前記キャビティ底面部材とキャビティ側面部材とを相対的に上下動可能に嵌合させて構成するように設定し、
前記上下両型を閉じる型締工程が、前記下型キャビティ内の余剰樹脂を前記下型キャビティの外部へ流出させる余剰樹脂の外部流出段階と、この余剰樹脂の外部流出段階を経た後に前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて前記基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含み、
前記余剰樹脂の外部流出段階では、この余剰樹脂が前記上下両型間に構成される狭い間隙を通して前記下型キャビティ部の周囲に設けた余剰樹脂の収容部内に案内されるように設定し、
また、前記樹脂封止段階では、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定したことを特徴とする電子部品の圧縮樹脂封止方法。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the lower die surface is attached to the lower die surface. The resin material provided in the cavity provided with the release film is heated and melted, and then the upper and lower molds are closed to close the electronic components on the substrate on the upper mold side. By immersing in the molten resin material in the mold cavity, and then applying a predetermined resin pressure to the molten resin material in the lower mold cavity, the electronic components mounted on the substrate are collectively sealed with resin. A compression resin sealing method for an electronic component to be molded,
The lower mold is set to have a configuration in which it is divided into a cavity bottom surface member and a cavity side surface member, and further, the cavity bottom surface member and the cavity side surface member are fitted together so as to be relatively movable up and down. Set to
After the mold clamping process for closing both the upper and lower molds, after passing through the excess resin in the lower mold cavity to the outside outflow stage of the excess resin and the outside resin outflow stage, the lower mold A resin sealing step in which a predetermined resin pressure is applied to the molten resin material in the cavity and the electronic components on the substrate are collectively resin-sealed,
In the outflow stage of the surplus resin, the surplus resin is set so as to be guided into the surplus resin accommodating portion provided around the lower mold cavity through a narrow gap formed between the upper and lower molds,
In the resin sealing step, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of the upper and lower molds is for resin sealing the electronic component of the substrate. A compression resin sealing method for an electronic component, characterized by being set to be equal to an interval of package thickness. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられたキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、
前記上下両型を閉じる型締工程が、前記下型キャビティ内の余剰樹脂を前記下型キャビティの外部へ流出させる余剰樹脂の外部流出段階と、この余剰樹脂の外部流出段階を経た後に前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて前記基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含み、
前記余剰樹脂の外部流出段階では、この余剰樹脂が前記上下両型間に構成される狭い間隙を通して前記下型キャビティ部の周囲に設けた余剰樹脂の収容部内に案内されるように設定し、さらに、前記狭い間隙が、前記下型キャビティから前記余剰樹脂の収容部に向かって浅くなるような傾斜面を備えているように設定し、
また、前記樹脂封止段階では、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定したことを特徴とする電子部品の圧縮樹脂封止方法。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the lower die surface is attached to the lower die surface. The resin material supplied in the provided cavity is heated and melted, and then the upper and lower molds are closed to clamp the electronic component of the substrate on the upper mold side with the molten resin in the lower mold cavity. Compressing the electronic components that are immersed in the material, and then encapsulating the electronic components mounted on the substrate together with the resin by applying a predetermined resin pressure to the molten resin material in the lower mold cavity A resin sealing method,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic components of the substrate,
After the mold clamping process for closing both the upper and lower molds, after passing through the excess resin in the lower mold cavity to the outside outflow stage of the excess resin and the outside resin outflow stage, the lower mold A resin sealing step in which a predetermined resin pressure is applied to the molten resin material in the cavity and the electronic components on the substrate are collectively resin-sealed,
In the outflow stage of the surplus resin, the surplus resin is set so as to be guided into a surplus resin housing provided around the lower mold cavity through a narrow gap formed between the upper and lower molds, and , The narrow gap is set so as to have an inclined surface that becomes shallower from the lower mold cavity toward the surplus resin container,
In the resin sealing step, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of the upper and lower molds is for resin sealing the electronic component of the substrate. A compression resin sealing method for electronic parts, characterized in that it is set to be equal to a package thickness. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられたキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、
前記上下両型を閉じる型締工程が、前記下型キャビティ内の余剰樹脂を前記下型キャビティの外部へ流出させる余剰樹脂の外部流出段階と、この余剰樹脂の外部流出段階を経た後に前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えて前記基板上の電子部品を一括して樹脂封止成形する樹脂封止段階とを含み、
前記余剰樹脂の外部流出段階では、この余剰樹脂が前記上下両型間に構成される狭い間隙を通して前記下型キャビティ部の周囲に設けた余剰樹脂の収容部内に案内されるように設定し、
また、前記狭い間隙が、前記下型の型面と前記基板における電子部品の装着面との間に構成されるように設定すると共に、前記余剰樹脂の収容部が、前記狭い間隙と前記下型キャビティの周囲に配置した樹脂漏防止用部材との間の空間部、及び、前記狭い間隙として構成されるように設定し、
また、前記樹脂封止段階では、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定したことを特徴とする電子部品の圧縮樹脂封止方法。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the lower die surface is attached to the lower die surface. The resin material supplied in the provided cavity is heated and melted, and then the upper and lower molds are closed to clamp the electronic component of the substrate on the upper mold side with the molten resin in the lower mold cavity. Compressing the electronic components that are immersed in the material, and then encapsulating the electronic components mounted on the substrate together with the resin by applying a predetermined resin pressure to the molten resin material in the lower mold cavity A resin sealing method,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic components of the substrate,
After the mold clamping process for closing both the upper and lower molds, after passing through the excess resin in the lower mold cavity to the outside outflow stage of the excess resin and the outside resin outflow stage, the lower mold A resin sealing step in which a predetermined resin pressure is applied to the molten resin material in the cavity and the electronic components on the substrate are collectively resin-sealed,
In the outflow stage of the surplus resin, the surplus resin is set so as to be guided into the surplus resin accommodating portion provided around the lower mold cavity through a narrow gap formed between the upper and lower molds,
Further, the narrow gap is set so as to be configured between the mold surface of the lower mold and the mounting surface of the electronic component on the substrate, and the surplus resin housing portion is formed between the narrow gap and the lower mold. Set to be configured as a space between the resin leakage prevention member arranged around the cavity and the narrow gap,
In the resin sealing step, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of the upper and lower molds is for resin sealing the electronic component of the substrate. A compression resin sealing method for electronic parts, characterized in that it is set to be equal to a package thickness. 前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加える前記樹脂封止段階において、その成形圧力が０．２９４２ＭＰａ以上となる低圧での圧縮樹脂封止成形を行うように設定したことを特徴とする請求項１から請求項３のいずれか一項に記載の電子部品の圧縮樹脂封止方法。 In the resin sealing step of applying a predetermined resin pressure to the molten resin material in the lower mold cavity, it is set to perform compression resin sealing molding at a low pressure at which the molding pressure is 0.2942 MPa or more. The compression resin sealing method for an electronic component according to any one of claims 1 to 3 . 前記下型キャビティ内に供給する樹脂材料が、所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料であって、平面から見た前記下型キャビティの形状に対応し且つ前記下型キャビティ内に嵌合させて供給することができる形状として成形したシート状樹脂であることを特徴とする請求項１から請求項３のいずれか一項に記載の電子部品の圧縮樹脂封止方法。 The resin material supplied into the lower mold cavity is a sheet-shaped resin material having a required shape retaining property by flattening a required amount of resin, and corresponds to the shape of the lower mold cavity as viewed from above. The compressed resin seal for an electronic component according to any one of claims 1 to 3, wherein the resin is a sheet-like resin molded into a shape that can be fitted and supplied into the lower mold cavity. Stop method. 前記下型キャビティ内に供給する樹脂材料が、所要量の樹脂を平坦化して供給される樹脂材料であることを特徴とする請求項１から請求項３のいずれか一項に記載の電子部品の圧縮樹脂封止方法。 4. The electronic component according to claim 1, wherein the resin material supplied into the lower mold cavity is a resin material supplied by planarizing a required amount of resin. 5. Compression resin sealing method. 前記樹脂材料が、顆粒状の樹脂材料、粉末状の樹脂材料、液状の樹脂材料、ペースト状の樹脂材料から選択される樹脂材料であることを特徴とする請求項６に記載の電子部品の圧縮樹脂封止方法。 7. The electronic component compression according to claim 6 , wherein the resin material is a resin material selected from a granular resin material, a powder resin material, a liquid resin material, and a paste resin material. Resin sealing method. 前記離型フィルム上に所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料を載置し、この状態で、下型キャビティ内に前記離型フィルムを被覆させることにより、前記離型フィルムを被覆した下型キャビティ内に所要の保形性を備えるシート状の樹脂材料を供給することを特徴とする請求項１に記載の電子部品の圧縮樹脂封止方法。   By flattening a required amount of resin on the release film and placing a sheet-like resin material having required shape retention, in this state, by covering the release film in the lower mold cavity, 2. The method of claim 1, wherein a sheet-like resin material having a required shape retaining property is supplied into a lower mold cavity coated with the release film. 前記下型に設けたキャビティ部を含む前記下型面に離型フィルムを張設し、前記離型フィルムを介して下型キャビティ内に所要量の樹脂を平坦化して所要の保形性を備えるシート状の樹脂材料を供給することを特徴とする請求項１に記載の電子部品の圧縮樹脂封止方法。 A release film is stretched on the lower mold surface including the cavity portion provided in the lower mold, and a required amount of resin is flattened in the lower mold cavity via the release film to provide the required shape retention. The method of claim 1, wherein a sheet-like resin material is supplied. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型面に設けられ且つ離型フィルムを被覆したキャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記下型が、キャビティ底面部材とキャビティ側面部材とに分割した構成を備えると共に、前記キャビティ底面部材とキャビティ側面部材とを相対的に上下動可能に嵌合させて構成し、
前記上下両型を閉じる型締時において、前記上下両型間に、前記下型キャビティ内の溶融樹脂材料の一部となる余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙を構成し、
また、前記下型キャビティ部の周囲に前記狭い間隙を通して連通させた前記余剰樹脂の収容部を配置し、
更に、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定して構成したことを特徴とする電子部品の圧縮樹脂封止装置。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the lower die surface is attached to the lower die surface. The resin material provided in the cavity provided with the release film is heated and melted, and then the upper and lower molds are closed to close the electronic components on the substrate on the upper mold side. By immersing in the molten resin material in the mold cavity, and then applying a predetermined resin pressure to the molten resin material in the lower mold cavity, the electronic components mounted on the substrate are collectively sealed with resin. A compression resin sealing device for electronic parts to be molded,
The lower mold has a configuration in which a cavity bottom member and a cavity side member are divided, and is configured by fitting the cavity bottom member and the cavity side member so as to be relatively movable up and down.
When closing the upper and lower molds, a narrow gap is formed between the upper and lower molds to allow excess resin that is part of the molten resin material in the lower mold cavity to flow out of the lower mold cavity. And
Further, the surplus resin containing portion communicated through the narrow gap around the lower mold cavity portion is disposed,
Further, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of both the upper and lower molds is equal to the package thickness interval for resin-sealing the electronic components on the substrate. A compression resin sealing device for an electronic component, characterized in that it is set to be configured. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型キャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、
前記上下両型を閉じる型締時において、前記上下両型間に、前記下型キャビティ内の溶融樹脂材料の一部となる余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙を構成し、
また、前記下型キャビティ部の周囲に前記狭い間隙を通して連通させた前記余剰樹脂の収容部を配置し、
また、前記狭い間隙が、前記下型キャビティから前記余剰樹脂の収容部に向かって浅くなるような傾斜面を備え、
更に、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定して構成したことを特徴とする電子部品の圧縮樹脂封止装置。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the inside of the lower die cavity The resin material supplied to is heated and melted, and then the upper and lower molds are closed and the electronic components of the substrate on the upper mold side are immersed in the molten resin material in the lower mold cavity. Then, by applying a predetermined resin pressure to the molten resin material in the lower mold cavity, an electronic component compression resin sealing device that collectively seals the electronic components mounted on the substrate with resin There,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic components of the substrate,
When closing the upper and lower molds, a narrow gap is formed between the upper and lower molds to allow excess resin that is part of the molten resin material in the lower mold cavity to flow out of the lower mold cavity. And
Further, the surplus resin containing portion communicated through the narrow gap around the lower mold cavity portion is disposed,
Further, the narrow gap is provided with an inclined surface that becomes shallower from the lower mold cavity toward the storage portion of the excess resin,
Further, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of both the upper and lower molds is equal to the package thickness interval for resin-sealing the electronic components on the substrate. A compression resin sealing device for an electronic component, characterized in that it is set to be configured. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、前記下型キャビティ内に供給された樹脂材料を加熱して溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記下型キャビティの深さを、前記基板の電子部品を樹脂封止するためのパッケージ厚さと等しくなるように設定し、
前記上下両型を閉じる型締時において、前記上下両型間に、前記下型キャビティ内の溶融樹脂材料の一部となる余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙を構成し、
また、前記下型キャビティ部の周囲に前記狭い間隙を通して連通させた前記余剰樹脂の収容部を配置し、
また、前記狭い間隙が、前記下型の型面と前記基板における電子部品の装着面との間に構成されると共に、前記余剰樹脂の収容部が、前記狭い間隙と前記下型キャビティの周囲に配置した樹脂漏防止用部材との間の空間部、及び、前記狭い間隙として構成され、
更に、前記上下両型の型締め最終位置における前記下型キャビティの底面と前記基板の電子部品装着面との間隔が、前記基板の電子部品を樹脂封止するためのパッケージ厚さの間隔と等しくなるように設定して構成したことを特徴とする電子部品の圧縮樹脂封止装置。 Using a compression molding die of an electronic component comprising at least an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward, and the inside of the lower die cavity The resin material supplied to is heated and melted, and then the upper and lower molds are closed and the electronic components of the substrate on the upper mold side are immersed in the molten resin material in the lower mold cavity. Then, by applying a predetermined resin pressure to the molten resin material in the lower mold cavity, an electronic component compression resin sealing device that collectively seals the electronic components mounted on the substrate with resin There,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic components of the substrate,
When closing the upper and lower molds, a narrow gap is formed between the upper and lower molds to allow excess resin that is part of the molten resin material in the lower mold cavity to flow out of the lower mold cavity. And
Further, the surplus resin containing portion communicated through the narrow gap around the lower mold cavity portion is disposed,
In addition, the narrow gap is configured between the lower mold surface and the electronic component mounting surface of the substrate, and the surplus resin container is disposed around the narrow gap and the lower mold cavity. It is configured as a space between the arranged resin leakage prevention member and the narrow gap,
Further, the distance between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final clamping position of both the upper and lower molds is equal to the package thickness interval for resin-sealing the electronic components on the substrate. A compression resin sealing device for an electronic component, characterized in that it is set to be configured. 前記余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙が、前記下型の型面と前記基板における電子部品の装着面との両者間に構成した前記下型キャビティと余剰樹脂の収容部とを連通させる樹脂通路であって、前記下型キャビティから余剰樹脂の収容部に向かって浅くなるような傾斜面を備えていることを特徴とする請求項１０に記載の電子部品の圧縮樹脂封止装置。 The lower mold cavity and the surplus resin accommodated between the lower mold surface and the mounting surface of the electronic component on the substrate have a narrow gap for allowing the excess resin to flow out of the lower mold cavity. 11. The compressed resin for electronic parts according to claim 10 , comprising a resin passage communicating with a portion, wherein the resin passage has an inclined surface that becomes shallower from the lower mold cavity toward a surplus resin housing portion. Sealing device. 前記余剰樹脂を前記下型キャビティの外部へ流出させるための狭い間隙が、前記下型キャビティと前記基板における電子部品の装着面との両者間に構成されると共に、前記余剰樹脂の収容部が、前記狭い間隙及び前記狭い間隙と前記下型キャビティの周囲に配置した樹脂漏防止用部材との間の空間部として設けられていることを特徴とする請求項１０に記載の電子部品の圧縮樹脂封止装置。 A narrow gap for allowing the excess resin to flow out of the lower mold cavity is configured between both the lower mold cavity and the mounting surface of the electronic component on the substrate, and the surplus resin containing portion is The compressed resin seal for an electronic component according to claim 10 , which is provided as a space between the narrow gap and the narrow gap and a resin leakage prevention member disposed around the lower mold cavity. Stop device. 前記樹脂漏防止用部材が、前記上下両型の型締時における前記上下両型の型面間の距離を規制するための位置決部材を兼ねていることを特徴とする請求項１２、又は、請求項１４に記載の電子部品の圧縮樹脂封止装置。 The resin leakage preventing member also serves as a positioning member for regulating a distance between the mold surfaces of the upper and lower molds when the upper and lower molds are clamped , or The compression resin sealing device of the electronic component according to claim 14 .
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