JP5929947B2 - 吸着パッド、ロボットハンドおよびロボット - Google Patents
吸着パッド、ロボットハンドおよびロボット Download PDFInfo
- Publication number
- JP5929947B2 JP5929947B2 JP2014039080A JP2014039080A JP5929947B2 JP 5929947 B2 JP5929947 B2 JP 5929947B2 JP 2014039080 A JP2014039080 A JP 2014039080A JP 2014039080 A JP2014039080 A JP 2014039080A JP 5929947 B2 JP5929947 B2 JP 5929947B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- suction pad
- robot
- suction
- pad portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
2 基台
3 昇降部
4 第1関節部
5 第1アーム
6 第2関節部
7 第2アーム
8 第3関節部
10 ハンド
11 プレート支持部
12 プレート
12a 吸気孔
12b 孔部
12c 環状壁部
12d 貫通孔
13、13’、13A、13B 吸着パッド
13a パッド部
13aa 接触部
13ab 主面部
13ac 吸気孔
13b 固定部
13ba 貫通孔
13bb 先割れピン部
13c 支持部
14 真空路
15 シール部材
20 制御装置
30 上位装置
C 規定位置にあるウェハの中心
CC 同一円周
SC 締結部材
W ウェハ
ax−c 中心軸線
d 離間距離
Claims (8)
- 被吸着物を吸着するパッド部と、
前記パッド部から離間した位置で該パッド部を挟んで対向するように設けられ、前記パッド部の固定端となる1対の固定部と、
前記パッド部および前記固定部の離間距離よりも長い延べ長さをそれぞれ有し、前記パッド部の中心軸線上の周縁端から前記固定部までをそれぞれ連結する1対の支持部と
を備え、
前記パッド部は、
規定位置にある前記被吸着物の中心から放射状に伸びる方向に対して前記中心軸線方向が略直交する向きとなるように配置されること
を特徴とする吸着パッド。 - 前記支持部は、
前記パッド部の外周に沿って設けられ、一端が前記周縁端の一方に、他端が前記周縁端の他方の側にある前記固定部へそれぞれ連結されること
を特徴とする請求項1に記載の吸着パッド。 - 前記パッド部は、略円状に形成され、
前記支持部は、
前記パッド部の半円周に沿うように設けられること
を特徴とする請求項2に記載の吸着パッド。 - 前記支持部のそれぞれは、
同一円周上に設けられること
を特徴とする請求項3に記載の吸着パッド。 - 前記パッド部は、
略オーバル形状に形成され、
前記支持部は、
前記パッド部の長軸線を前記中心軸線として設けられること
を特徴とする請求項2に記載の吸着パッド。 - 前記支持部は、
前記周縁端と該周縁端の側にある前記固定部とを連結し、平面視で蛇行形状を含むこと
を特徴とする請求項1に記載の吸着パッド。 - 請求項1〜6のいずれか一つに記載の吸着パッド
を備えることを特徴とするロボットハンド。 - 請求項7に記載のロボットハンド
を備えることを特徴とするロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014039080A JP5929947B2 (ja) | 2014-02-28 | 2014-02-28 | 吸着パッド、ロボットハンドおよびロボット |
US14/620,186 US20150246447A1 (en) | 2014-02-28 | 2015-02-12 | Suction pad, robot hand and robot |
TW104105120A TW201540444A (zh) | 2014-02-28 | 2015-02-13 | 吸盤、機械手及機器人 |
KR1020150027444A KR20150102720A (ko) | 2014-02-28 | 2015-02-26 | 흡착 패드, 로봇 핸드 및 로봇 |
CN201510092095.9A CN104875212A (zh) | 2014-02-28 | 2015-02-28 | 吸盘、机器人手及机器人 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014039080A JP5929947B2 (ja) | 2014-02-28 | 2014-02-28 | 吸着パッド、ロボットハンドおよびロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015160306A JP2015160306A (ja) | 2015-09-07 |
JP5929947B2 true JP5929947B2 (ja) | 2016-06-08 |
Family
ID=53943014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014039080A Expired - Fee Related JP5929947B2 (ja) | 2014-02-28 | 2014-02-28 | 吸着パッド、ロボットハンドおよびロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150246447A1 (ja) |
JP (1) | JP5929947B2 (ja) |
KR (1) | KR20150102720A (ja) |
CN (1) | CN104875212A (ja) |
TW (1) | TW201540444A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10319623B2 (en) | 2017-05-30 | 2019-06-11 | Canon Kabushiki Kaisha | Conveyance hand, conveyance apparatus, lithography apparatus, manufacturing method of article, and holding mechanism |
Families Citing this family (19)
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---|---|---|---|---|
JP6486140B2 (ja) * | 2015-02-25 | 2019-03-20 | キヤノン株式会社 | 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法 |
CN105215097B (zh) * | 2015-10-10 | 2017-04-12 | 山东斯诺自动化设备有限公司 | 一种机器人自动折弯系统及方法 |
CN105215076A (zh) * | 2015-10-10 | 2016-01-06 | 山东省博兴县斯诺自动化设备有限公司 | 一种板材加工联合设备、自动化加工板材系统及加工方法 |
JP6594177B2 (ja) * | 2015-11-24 | 2019-10-23 | 平田機工株式会社 | ハンド部材およびハンド |
TWI565569B (zh) * | 2016-02-05 | 2017-01-11 | 南京瀚宇彩欣科技有限責任公司 | 吸著裝置、吸著系統及其應用 |
ITUB20161085A1 (it) * | 2016-02-26 | 2017-08-26 | Paola Ferrari | Dispositivo a depressione per la presa di articoli lastriformi. |
CN108666251B (zh) * | 2017-03-31 | 2020-11-20 | 上海微电子装备(集团)股份有限公司 | 硅片吸附装置、硅片传送装置、硅片传输系统及传送方法 |
JP2019010691A (ja) * | 2017-06-29 | 2019-01-24 | 日本電産サンキョー株式会社 | 産業用ロボットのハンドおよび産業用ロボット |
US20190131161A1 (en) * | 2017-10-27 | 2019-05-02 | Kla-Tencor Corporation | Substrate Handling Apparatus for Extreme Warped Wafers |
JP7187147B2 (ja) * | 2017-12-12 | 2022-12-12 | 東京エレクトロン株式会社 | 搬送装置のティーチング方法及び基板処理システム |
CN109051802A (zh) * | 2018-08-17 | 2018-12-21 | 浙江雅市晶科技有限公司 | 一种用于搬运基板的机械手 |
JP7131334B2 (ja) * | 2018-11-29 | 2022-09-06 | 株式会社安川電機 | 基板支持装置、基板搬送ロボットおよびアライナ装置 |
US11276593B2 (en) | 2019-07-22 | 2022-03-15 | Rorze Automation, Inc. | Systems and methods for horizontal wafer packaging |
JP7446144B2 (ja) * | 2019-09-17 | 2024-03-08 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
JP2021048322A (ja) * | 2019-09-19 | 2021-03-25 | 株式会社Screenホールディングス | 基板搬送装置および基板搬送方法 |
KR102455146B1 (ko) * | 2020-02-10 | 2022-10-17 | 주식회사 나노인 | 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법 |
EP4153386A4 (en) * | 2020-05-19 | 2024-06-05 | Jabil Inc. | APPARATUS, SYSTEM AND METHOD FOR A VARIABLE VARNISH END EFFECTOR |
JP7538635B2 (ja) | 2020-06-29 | 2024-08-22 | 京セラ株式会社 | 吸着パッド |
KR102424792B1 (ko) * | 2021-12-07 | 2022-07-22 | 권재천 | 정전기 방지 기능을 구비한 돔 형태의 건식 패드 구조체 |
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JP2015013357A (ja) * | 2013-07-08 | 2015-01-22 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
JP5861677B2 (ja) * | 2013-07-08 | 2016-02-16 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
JP5861676B2 (ja) * | 2013-07-08 | 2016-02-16 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
-
2014
- 2014-02-28 JP JP2014039080A patent/JP5929947B2/ja not_active Expired - Fee Related
-
2015
- 2015-02-12 US US14/620,186 patent/US20150246447A1/en not_active Abandoned
- 2015-02-13 TW TW104105120A patent/TW201540444A/zh unknown
- 2015-02-26 KR KR1020150027444A patent/KR20150102720A/ko not_active Application Discontinuation
- 2015-02-28 CN CN201510092095.9A patent/CN104875212A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10319623B2 (en) | 2017-05-30 | 2019-06-11 | Canon Kabushiki Kaisha | Conveyance hand, conveyance apparatus, lithography apparatus, manufacturing method of article, and holding mechanism |
Also Published As
Publication number | Publication date |
---|---|
KR20150102720A (ko) | 2015-09-07 |
US20150246447A1 (en) | 2015-09-03 |
TW201540444A (zh) | 2015-11-01 |
CN104875212A (zh) | 2015-09-02 |
JP2015160306A (ja) | 2015-09-07 |
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