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JP5918075B2 - Rolled copper foil for producing graphene and method for producing graphene - Google Patents

Rolled copper foil for producing graphene and method for producing graphene Download PDF

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JP5918075B2
JP5918075B2 JP2012180655A JP2012180655A JP5918075B2 JP 5918075 B2 JP5918075 B2 JP 5918075B2 JP 2012180655 A JP2012180655 A JP 2012180655A JP 2012180655 A JP2012180655 A JP 2012180655A JP 5918075 B2 JP5918075 B2 JP 5918075B2
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喜寛 千葉
喜寛 千葉
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JX Nippon Mining and Metals Corp
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Description

本発明は、グラフェンを製造するための圧延銅箔、及びグラフェンの製造方法に関する。   The present invention relates to a rolled copper foil for producing graphene and a method for producing graphene.

グラファイトは平らに並んだ炭素6員環の層がいくつも積み重なった層状構造をもつが、その単原子層〜数原子層程度のものはグラフェン又はグラフェンシートと呼ばれる。グラフェンシートは独自の電気的、光学的及び機械的特性を有し、特にキャリア移動速度が高速である。そのため、グラフェンシートは、例えば、燃料電池用セパレータ、透明電極、表示素子の導電性薄膜、無水銀蛍光灯、コンポジット材、ドラッグデリバリーシステム(DDS)のキャリアなど、産業界での幅広い応用が期待されている。   Graphite has a layered structure in which a number of flat carbon 6-membered ring layers are stacked, and those having a single atomic layer to several atomic layers are called graphene or graphene sheets. Graphene sheets have unique electrical, optical and mechanical properties, and in particular have a high carrier moving speed. Therefore, graphene sheets are expected to have a wide range of applications in the industry, such as fuel cell separators, transparent electrodes, conductive thin films for display elements, mercury-free fluorescent lamps, composite materials, and drug delivery system (DDS) carriers. ing.

グラフェンシートを製造する方法として、グラファイトを粘着テープで剥がす方法が知られているが、得られるグラフェンシートの層数が一定でなく、大面積のグラフェンシートが得難く、大量生産にも適さないという問題がある。
そこで、シート状の単結晶グラファイト化金属触媒上に炭素系物質を接触させた後、熱処理することによりグラフェンシートを成長させる技術(化学気相成長(CVD)法)が開発されている(特許文献1)。この単結晶グラファイト化金属触媒としては、Ni、Cu、Wなどの金属基板が記載されている。
同様に,NiやCuの金属箔やSi基板上に形成した銅層上に化学気相成長法でグラフェンを製膜する技術が報告されている。なお,グラフェンの製膜は1000℃程度で行われる(非特許文献1)。
As a method of producing a graphene sheet, a method of peeling graphite with an adhesive tape is known, but the number of layers of the obtained graphene sheet is not constant, it is difficult to obtain a large area graphene sheet, and it is not suitable for mass production There's a problem.
Thus, a technique (chemical vapor deposition (CVD) method) has been developed in which a graphene sheet is grown by bringing a carbon-based material into contact with a sheet-like single crystal graphitized metal catalyst and then performing heat treatment (Patent Literature). 1). As this single crystal graphitized metal catalyst, a metal substrate of Ni, Cu, W or the like is described.
Similarly, a technique for forming graphene by chemical vapor deposition on a copper layer formed on a Ni or Cu metal foil or Si substrate has been reported. The graphene film is formed at about 1000 ° C. (Non-patent Document 1).

特開2009−143799号公報JP 2009-143799 A

SCIENCE Vol.324 (2009) P1312-1314SCIENCE Vol.324 (2009) P1312-1314

しかしながら、特許文献1のように単結晶の金属基板を製造することは容易でなく極めて高コストであり、又、大面積の基板が得られ難く、ひいては大面積のグラフェンシートが得難いという問題がある。一方,非特許文献1には、Cuを基板として使用することが記載されているが,Cu箔上では短時間にグラフェンが面方向に成長せず、Si基板上に形成したCu層を焼鈍で粗大粒として基板としている。これは、銅箔上にグラフェンの成長を妨げる段差が存在するためと考えられ、Cu層をSi基板上に形成する場合、グラフェンの大きさはSi基板サイズに制約され,製造コストも高い。一方、単結晶の銅箔は粒界が少ないものの、高コストであると共に寸法も限られてしまう。
従って、本発明は、大面積のグラフェンを低コストで生産可能なグラフェン製造用圧延銅箔及びそれを用いたグラフェンの製造方法の提供を目的とする。
However, as in Patent Document 1, it is not easy to manufacture a single crystal metal substrate, which is extremely expensive, and it is difficult to obtain a large-area substrate, and thus it is difficult to obtain a large-area graphene sheet. . On the other hand, Non-Patent Document 1 describes using Cu as a substrate, but graphene does not grow in the surface direction in a short time on a Cu foil, and the Cu layer formed on the Si substrate is annealed. The substrate is formed as coarse particles. This is thought to be because there is a step that hinders the growth of graphene on the copper foil. When the Cu layer is formed on the Si substrate, the size of the graphene is restricted by the size of the Si substrate, and the manufacturing cost is high. On the other hand, although a single crystal copper foil has few grain boundaries, it is expensive and has limited dimensions.
Accordingly, an object of the present invention is to provide a rolled copper foil for producing graphene capable of producing graphene having a large area at low cost and a method for producing graphene using the rolled copper foil.

本発明のグラフェン製造用圧延銅箔は、{001}正極点図において、α=20度、β=135度±3度における検出強度の最大値IAと、α=40度、β=240度±3度における検出強度の最大値IBとの比(IA/IB)が0.5以上1未満である。
又、本発明のグラフェン製造用圧延銅箔は、{001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満である。
The rolled copper foil for producing graphene of the present invention has a maximum value IA of detected intensity at α = 20 degrees, β = 135 degrees ± 3 degrees, α = 40 degrees, β = 240 degrees ± The ratio (IA / IB) of the detected intensity at 3 degrees to the maximum value IB (IA / IB) is 0.5 or more and less than 1.
Further, the rolled copper foil for producing graphene of the present invention has a maximum detected value IC of α = 20 degrees, β = 225 degrees ± 3 degrees, α = 40 degrees, β = 300 in the {001} positive electrode diagram. The ratio (IC / ID) of the detected intensity at the degree ± 3 degrees to the maximum value ID (IC / ID) is 0.5 or more and less than 1.

請求項1に記載のグラフェン製造用圧延銅箔において、{001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満であることが好ましい。
{001}正極点図において、α=20度、β=135度±3度における検出強度の最大値IAが1以上であることが好ましい。
{001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICが1以上であることが好ましい。
{001}正極点図において、α=40度、β=240度±3度における検出強度の最大値IBが11以下であることが好ましい。
JIS-H3100に規格するタフピッチ銅、JIS−H3100に規格する無酸素銅、JIS−H3510に規格する無酸素銅、又は前記タフピッチ銅若しくは前記無酸素銅に対してSn及びAgの群から選ばれる1種以上の元素を合計で0.0001質量%以上0.05質量%以下含有する組成からなることが好ましい。
表面の圧延平行方向及び圧延直角方向の60度光沢度が共に130%以上、かつ圧延平行方向及び圧延直角方向の表面粗さRaが0.20μm以下であることが好ましい。
In the rolled copper foil for producing graphene according to claim 1, in the {001} positive electrode diagram, the maximum value IC of detected intensity at α = 20 degrees, β = 225 degrees ± 3 degrees, α = 40 degrees, β = It is preferable that the ratio (IC / ID) to the maximum value ID of the detected intensity at 300 ° ± 3 ° is 0.5 or more and less than 1.
In the {001} positive electrode diagram, it is preferable that the maximum value IA of the detected intensity at α = 20 degrees and β = 135 degrees ± 3 degrees is 1 or more.
In the {001} positive electrode diagram, it is preferable that the maximum value IC of the detected intensity at α = 20 degrees and β = 225 degrees ± 3 degrees is 1 or more.
In the {001} positive electrode diagram, it is preferable that the maximum value IB of the detected intensity at α = 40 degrees and β = 240 degrees ± 3 degrees is 11 or less.
1 selected from the group of Sn and Ag for tough pitch copper standardized to JIS-H3100, oxygen-free copper standardized to JIS-H3100, oxygen-free copper standardized to JIS-H3510, or the tough pitch copper or oxygen-free copper. The composition preferably contains a total of 0.0001% by mass or more and 0.05% by mass or less of seed or more elements.
It is preferable that the 60-degree glossiness in the rolling parallel direction and the rolling perpendicular direction is both 130% or more and the surface roughness Ra in the rolling parallel direction and the rolling perpendicular direction is 0.20 μm or less.

本発明のグラフェンの製造方法は、前記グラフェン製造用圧延銅箔を用い、所定の室内に、加熱した前記グラフェン製造用圧延銅箔を配置すると共に水素ガスと炭素含有ガスを供給し、前記グラフェン製造用圧延銅箔表面にグラフェンを形成するグラフェン形成工程と、前記グラフェンの表面に転写シートを積層し、前記グラフェンを前記転写シート上に転写しながら、前記グラフェン製造用圧延銅箔をエッチング除去するグラフェン転写工程と、を有する。


The method for producing graphene of the present invention uses the rolled copper foil for producing graphene, arranges the heated rolled copper foil for producing graphene in a predetermined chamber, supplies hydrogen gas and a carbon-containing gas, and produces the graphene A graphene forming step of forming graphene on the surface of the rolled copper foil , and a transfer sheet is laminated on the surface of the graphene, and the rolled copper foil for producing graphene is removed by etching while transferring the graphene onto the transfer sheet And a graphene transfer step.


本発明によれば、大面積のグラフェンを低コストで生産可能とする圧延銅箔が得られる。   ADVANTAGE OF THE INVENTION According to this invention, the rolled copper foil which can produce a large area graphene at low cost is obtained.

{001}正極点の模式図である。It is a schematic diagram of a {001} positive electrode point. 本発明の実施形態に係るグラフェンの製造方法を示す工程図である。It is process drawing which shows the manufacturing method of the graphene which concerns on embodiment of this invention. グラフェン製造用圧延銅箔を製造する際の、最終冷間圧延時の油膜当量と厚みの関係を示す図である。It is a figure which shows the relationship between the oil film equivalent at the time of the last cold rolling, and thickness at the time of manufacturing the rolled copper foil for graphene manufacture.

以下、本発明の実施形態に係るグラフェン製造用圧延銅箔及びグラフェンの製造方法について説明する。なお、本発明において%とは、特に断らない限り、質量%を示すものとする。   Hereinafter, the rolled copper foil for graphene manufacture which concerns on embodiment of this invention, and the manufacturing method of graphene are demonstrated. In the present invention, “%” means “% by mass” unless otherwise specified.

<銅箔の組成>
銅箔としては、JIS-H3100(合金番号:C1100)に規格するタフピッチ銅(TPC)、又はJIS-H3510(合金番号:C1011)若しくはJIS−H3100(合金番号:C1020)に規格する無酸素銅(OFC)を用いることができる。上記TPC又はOFCを用いることで、銅箔が比較的高純度となり、後述する所定の結晶方位となりやすい。
なお、銅箔の純度が99.999%を超える高純度の場合、常温で軟化し、圧延集合組織の制御が困難であり、後述する所定の結晶方位となり難いという傾向にある。
<Composition of copper foil>
As copper foil, tough pitch copper (TPC) standardized to JIS-H3100 (alloy number: C1100), or oxygen-free copper standardized to JIS-H3510 (alloy number: C1011) or JIS-H3100 (alloy number: C1020) OFC). By using the TPC or OFC, the copper foil has a relatively high purity and tends to have a predetermined crystal orientation described later.
In addition, when the purity of the copper foil exceeds 99.999%, it tends to soften at room temperature, it is difficult to control the rolling texture, and it is difficult to achieve a predetermined crystal orientation described later.

又、これらタフピッチ銅又は無酸素銅に対し、Sn及びAgの群から選ばれる1種以上の元素を合計で0.050質量%以下含有する組成を用いることもできる。上記元素を含有すると、銅箔の強度が向上し適度な伸びを有すると共に、上記元素を含有しない場合に比べて結晶方位をより適切なものにすることが出来る。上記元素の含有割合が合計で0.050質量%を超えると強度は更に向上するものの、伸びが低下して加工性が悪化すると共に結晶方位が適切にならない場合がある。より好ましくは上記元素の含有割合が合計で0.04質量%以下であり、更に好ましくは合計で0.03質量%以下であり、最も好ましくは合計で0.02質量%以下である。
なお、上記元素を合計した含有割合の下限は特に制限されないが、例えば0.0001質量%を下限とすることができる。上記元素の含有割合が0.0001質量%未満であると、含有割合が小さいためその含有割合を制御することが困難になる場合がある。好ましくは、上記元素の含有割合の下限値は0.001質量%以上、より好ましくは0.003質量%以上、更に好ましくは0.004質量%以上、最も好ましくは0.005質量%以上である。また、結晶方位に大きな影響を与えない範囲(例えば濃度で0.1質量%以下)で、Ag、Sn、Ni、Si、P、Mg、Zr、Cr、Mn、Co、Zn、Ti、V及びBの群から選ばれる1種以上の元素を添加してもよいが、添加元素はこれらに限られない。
Moreover, the composition which contains 0.050 mass% or less of 1 or more types of elements chosen from the group of Sn and Ag with respect to these tough pitch copper or oxygen free copper can also be used. When the element is contained, the strength of the copper foil is improved and the copper foil has an appropriate elongation, and the crystal orientation can be made more appropriate as compared with the case where the element is not contained. If the total content of the above elements exceeds 0.050% by mass, the strength is further improved, but the elongation is lowered to deteriorate the workability and the crystal orientation may not be appropriate. More preferably, the content ratio of the above elements is 0.04% by mass or less in total, more preferably 0.03% by mass or less, and most preferably 0.02% by mass or less in total.
In addition, although the minimum of the content rate which totaled the said element is not restrict | limited in particular, 0.0001 mass% can be made into a minimum, for example. When the content ratio of the element is less than 0.0001% by mass, it may be difficult to control the content ratio because the content ratio is small. Preferably, the lower limit of the content ratio of the element is 0.001% by mass or more, more preferably 0.003% by mass or more, still more preferably 0.004% by mass or more, and most preferably 0.005% by mass or more. . Further, Ag, Sn, Ni, Si, P, Mg, Zr, Cr, Mn, Co, Zn, Ti, V, and the like within a range that does not greatly affect the crystal orientation (for example, concentration is 0.1 mass% or less). One or more elements selected from the group B may be added, but the additive elements are not limited to these.

<銅箔の厚み>
銅箔の厚みは特に制限されないが、一般的には5〜150μmである。さらに、ハンドリング性を確保しつつ、後述するエッチング除去を容易に行うため、銅箔基材の厚みを12〜50μmとすると好ましい。銅箔基材の厚みが12μm未満であると、破断し易くなってハンドリング性に劣る場合があり、厚みが50μmを超えるとエッチング除去がし難くなる場合がある。
なお、図3に示すように、銅箔の厚みと、銅箔を冷間圧延して製造する際の油膜当量との間に一定の関係がある。なお、最終冷間圧延の最終パスの油膜当量と、最終パスの1つ前のパスの油膜当量がいずれも、最終的な圧延銅箔の板厚に対して以下の関係式を満たす必要がある。ここで、図3の●は、後述する実施例における銅箔の厚みと油膜当量との関係を示し、×は後述する比較例における銅箔の厚みと油膜当量との関係を示す。そして、図3において、各実施例を囲む4つの線分で囲まれた平行四辺形状の内部領域が、好ましい結晶方位を有する銅箔を製造するために適した銅箔の厚みと油膜当量との関係を表す。具体的には、14500≦油膜当量≦24500、かつ、0.0006×油膜当量+1≦(銅箔の厚み)≦0.0006×油膜当量+38、で表される関係式を満たす。
銅箔の厚みと油膜当量が上記関係式を満たせば、圧延銅箔が以下のように所定の結晶方位を有するようになる。
<Copper foil thickness>
The thickness of the copper foil is not particularly limited, but is generally 5 to 150 μm. Furthermore, it is preferable to set the thickness of the copper foil base to 12 to 50 μm in order to easily perform etching removal described later while ensuring handling properties. When the thickness of the copper foil base material is less than 12 μm, it may be easily broken and may have poor handling properties, and when the thickness exceeds 50 μm, it may be difficult to remove by etching.
In addition, as shown in FIG. 3, there is a certain relationship between the thickness of the copper foil and the oil film equivalent when the copper foil is cold rolled. It should be noted that both the oil film equivalent of the final pass of the final cold rolling and the oil film equivalent of the pass immediately before the final pass must satisfy the following relational expression with respect to the final thickness of the rolled copper foil: . Here, ● in FIG. 3 indicates the relationship between the thickness of the copper foil and the oil film equivalent in the examples described later, and x indicates the relationship between the thickness of the copper foil and the oil film equivalent in the comparative example described later. In FIG. 3, the parallelogram-shaped inner region surrounded by the four line segments surrounding each example has a copper foil thickness and an oil film equivalent suitable for producing a copper foil having a preferred crystal orientation. Represents a relationship. Specifically, the relational expression represented by 14500 ≦ oil film equivalent ≦ 24500 and 0.0006 × oil film equivalent + 1 ≦ (thickness of copper foil) ≦ 0.0006 × oil film equivalent + 38 is satisfied.
If the thickness of the copper foil and the oil film equivalent satisfy the above relational expression, the rolled copper foil comes to have a predetermined crystal orientation as follows.

<{001}正極点図>
本発明者らは、圧延銅箔上にグラフェンを均一に成長させるための因子について検討し、圧延集合組織の制御が重要であることを見出した。
すなわち、本発明の第1の発明に係るグラフェン製造用圧延銅箔は、{001}正極点図において、α=20度、β=135度±3度における検出強度の最大値IAと、α=40度、β=240度±3度における検出強度の最大値IBとの比(IA/IB)が0.5以上1未満である。また、(IA/IB)の値は好ましくは0.5以上0.99以下、より好ましくは0.5以上0.97以下、より好ましくは0.5以上0.95以下、より好ましくは0.55以上0.90以下、より好ましくは0.60以上0.90以下、最も好ましくは0.65以上0.89以下である。
図1は、圧延銅箔の{001}正極点図の模式図を示す。一般的な圧延銅箔の{001}正極点図においては、上述の検出強度の最大値IA及びIC(後述)で規定したα、βの範囲にほとんどピークが見られず、検出強度の最大値IB及びID(後述)で規定したα、βの範囲に高いピークが現れる傾向にある。そして、{001}正極点図において特定のα、βにおける検出強度が高いと、グラフェンを均一に成長させるのが困難であることが判明した。これは、特定のα、βで検出強度が高いと、銅箔上にグラフェンの成長を妨げる特定の結晶方位が存在するためと考えられる。
<{001} Positive Point Diagram>
The present inventors have examined factors for uniformly growing graphene on a rolled copper foil and have found that control of the rolling texture is important.
That is, the rolled copper foil for producing graphene according to the first invention of the present invention has a detected intensity maximum value IA at α = 20 degrees, β = 135 degrees ± 3 degrees, and α = The ratio (IA / IB) of the detected intensity maximum value IB at 40 degrees and β = 240 degrees ± 3 degrees (IA / IB) is 0.5 or more and less than 1. The value of (IA / IB) is preferably 0.5 or more and 0.99 or less, more preferably 0.5 or more and 0.97 or less, more preferably 0.5 or more and 0.95 or less, and more preferably 0.00. It is 55 or more and 0.90 or less, more preferably 0.60 or more and 0.90 or less, and most preferably 0.65 or more and 0.89 or less.
FIG. 1 shows a schematic diagram of a {001} positive electrode diagram of rolled copper foil. In the {001} positive pole figure of a general rolled copper foil, there is almost no peak in the range of α and β defined by the above-mentioned maximum values IA and IC (described later) of the detected intensity, and the maximum value of the detected intensity High peaks tend to appear in the range of α and β defined by IB and ID (described later). And it became clear that it was difficult to grow graphene uniformly when the detected intensity at specific α and β was high in the {001} positive electrode diagram. This is considered to be because when the detection intensity is high at specific α and β, there is a specific crystal orientation that prevents the growth of graphene on the copper foil.

このようなことから、本発明の第1の発明に係るグラフェン製造用圧延銅箔においては、圧延銅箔の{001}正極点図において、比較的強度が低いとされるIAの値を高くし、一般に最も強度が高いとされるIBの値をなるべく小さくすることで、特定のα、βで検出強度を小さくするようにしている。これにより、原子配列がグラフェン成長に最適化となると考えられる。   Therefore, in the rolled copper foil for producing graphene according to the first invention of the present invention, in the {001} positive electrode diagram of the rolled copper foil, the value of IA, which is considered to be relatively low, is increased. In general, the detection intensity is decreased at specific α and β by reducing the value of IB, which is generally considered to have the highest intensity, as much as possible. Thereby, it is considered that the atomic arrangement is optimized for graphene growth.

又、本発明の第2の発明に係るグラフェン製造用圧延銅箔は、{001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満である。(IC/ID)の値は好ましくは0.5以上0.97以下、より好ましくは0.5以上0.95以下、より好ましくは0.55以上0.90以下、より好ましくは0.60以上0.87以下、最も好ましくは0.65以上0.85以下である。
本発明の第2の発明に係るグラフェン製造用圧延銅箔においても、圧延銅箔の{001}正極点図において、比較的強度が低いとされるICの値を高くし、一般に最も強度が高いとされるIDの値をなるべく小さくすることで、特定のα、βで検出強度を小さくするようにしている。これにより、原子配列がグラフェン成長に最適化となると考えられる。
なお、本発明の第1の発明に係るグラフェン製造用圧延銅箔においても、{001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満であることが好ましい。(IC/ID)の値は好ましくは0.5以上0.97以下、より好ましくは0.5以上0.95以下、より好ましくは0.55以上0.90以下、より好ましくは0.60以上0.87以下、最も好ましくは0.65以上0.85以下である。
Further, the rolled copper foil for producing graphene according to the second aspect of the present invention has a maximum detected value IC of α = 20 degrees, β = 225 degrees ± 3 degrees, and α = The ratio (IC / ID) to the maximum value ID of the detection intensity at 40 degrees and β = 300 degrees ± 3 degrees is 0.5 or more and less than 1. The value of (IC / ID) is preferably 0.5 or more and 0.97 or less, more preferably 0.5 or more and 0.95 or less, more preferably 0.55 or more and 0.90 or less, and more preferably 0.60 or more. 0.87 or less, most preferably 0.65 or more and 0.85 or less.
Also in the rolled copper foil for producing graphene according to the second invention of the present invention, in the {001} positive electrode diagram of the rolled copper foil, the IC value, which is considered to be relatively low, is increased, and generally the highest strength is obtained. By reducing the ID value to be as small as possible, the detection intensity is reduced at specific α and β. Thereby, it is considered that the atomic arrangement is optimized for graphene growth.
Also in the rolled copper foil for producing graphene according to the first invention of the present invention, in the {001} positive electrode diagram, the maximum value IC of the detected intensity at α = 20 degrees, β = 225 degrees ± 3 degrees, and α It is preferable that the ratio (IC / ID) to the maximum value ID of the detected intensity at = 40 degrees and β = 300 degrees ± 3 degrees is 0.5 or more and less than 1. The value of (IC / ID) is preferably 0.5 or more and 0.97 or less, more preferably 0.5 or more and 0.95 or less, more preferably 0.55 or more and 0.90 or less, and more preferably 0.60 or more. 0.87 or less, most preferably 0.65 or more and 0.85 or less.

(IA/IB)又は(IC/ID)が0.5未満であると、IB又はIDの値が、対応するIA又はICの値より大きくなり過ぎ、特定のα、βで検出強度を低くすることが困難となり、グラフェンの成長を妨げる銅箔上の特定の結晶方位を低減できない。一方、(IA/IB)又は(IC/ID)が1を超えると、IB又はIDの値が、対応するIA又はICの値より小さくなり過ぎ、特定のα、βで検出強度を低くすることが困難となり、グラフェンの成長を妨げる銅箔上の特定の結晶方位を低減できない。   When (IA / IB) or (IC / ID) is less than 0.5, the value of IB or ID becomes too larger than the corresponding value of IA or IC, and the detection intensity is lowered at specific α and β. And the specific crystal orientation on the copper foil that hinders the growth of graphene cannot be reduced. On the other hand, when (IA / IB) or (IC / ID) exceeds 1, the value of IB or ID becomes too smaller than the corresponding value of IA or IC, and the detection intensity is lowered with specific α and β. The specific crystal orientation on the copper foil that hinders the growth of graphene cannot be reduced.

IAが1以上であることが好ましく、ICが1以上であることが好ましい。比較的強度が低いとされるIA及びICの値を1以上に制御することで、特定のα、βで検出強度が小さくなり、原子配列がグラフェン成長に最適となると考えられる。
なお、IAは2.8〜8.0であることがより好ましく、2.8〜6.0であることがさらに好ましく、2.8〜5.5であることがより好ましく、2.8〜4.3であることが最も好ましい。IAの値がこれらの範囲内である場合、グラフェンのシート抵抗値が低い傾向にあるからである。
また、ICは2.7〜8.0であることがより好ましく、2.8〜6.0であることがさらに好ましく、2.8〜5.7であることがより好ましく、2.8〜4.3であることが最も好ましい。ICの値がこれらの範囲内である場合、グラフェンのシート抵抗値が低い傾向にあるからである。
また、IBが11以下であることが好ましい。IBを11以下に制御することで、特定のα、βで検出強度が小さくなり、原子配列がグラフェン成長に最適となると考えられる。なお、IBは1.0〜10.0であることが好ましく、1.0〜8.0であることが好ましく、1.0〜6.0であることが好ましく、2.0〜5.0であることが好ましく、2.0〜4.7であることが最も好ましい。IBの値がこれらの範囲内である場合、グラフェンのシート抵抗値が低い傾向にあるからである。
IA is preferably 1 or more, and IC is preferably 1 or more. By controlling the values of IA and IC, which are considered to be relatively low in intensity, to 1 or more, it is considered that the detection intensity decreases at specific α and β, and the atomic arrangement is optimal for graphene growth.
The IA is more preferably 2.8 to 8.0, further preferably 2.8 to 6.0, more preferably 2.8 to 5.5, and 2.8 to Most preferably, it is 4.3. This is because when the value of IA is within these ranges, the sheet resistance value of graphene tends to be low.
The IC is more preferably 2.7 to 8.0, further preferably 2.8 to 6.0, more preferably 2.8 to 5.7, and more preferably 2.8 to 6.0. Most preferably, it is 4.3. This is because when the IC value is within these ranges, the sheet resistance value of graphene tends to be low.
Moreover, it is preferable that IB is 11 or less. By controlling IB to 11 or less, it is considered that the detection intensity becomes small at specific α and β, and the atomic arrangement is optimal for graphene growth. The IB is preferably 1.0 to 10.0, preferably 1.0 to 8.0, preferably 1.0 to 6.0, and 2.0 to 5.0. It is preferable that it is, and it is most preferable that it is 2.0-4.7. This is because when the value of IB is within these ranges, the sheet resistance value of graphene tends to be low.

なお、{001}正極点測定は、X線ディフラクトメータを用い、銅箔表面について反射法で行う。但し、反射法では、試料面に対するX線の入射角が浅くなると測定が困難になるため、実際に測定できる角度範囲は正極点図上で0°≦α≦75°、0°≦β≦360°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸、β:前記回転軸に平行な軸)となる。
又、集合組織を有しない状態(すなわち結晶方位がランダムである状態)を1として正極点図上の集合組織の強度を規格化する。結晶方位がランダムである状態として、銅粉末試料の{001}正極点測定を行い、これを1とする。
In addition, {001} positive electrode point measurement is performed by the reflection method about the copper foil surface using an X-ray diffractometer. However, in the reflection method, measurement becomes difficult when the incident angle of the X-ray with respect to the sample surface becomes shallow. Therefore, the angle ranges that can be actually measured are 0 ° ≦ α ≦ 75 ° and 0 ° ≦ β ≦ 360 on the positive electrode diagram. ° (where α is an axis perpendicular to the rotational axis of the diffraction goniometer defined in the Schulz method, β is an axis parallel to the rotational axis).
Also, the strength of the texture on the positive point diagram is normalized by assuming that the texture has no texture (that is, the crystal orientation is random) as 1. Assuming that the crystal orientation is random, a {001} positive electrode point measurement of a copper powder sample is performed, and this is set to 1.

<銅箔の60度光沢度>
銅箔表面の圧延平行方向及び圧延直角方向の60度光沢度(JIS Z 8741)が共に130%以上であることが好ましい。
後述するように、本発明のグラフェン製造用圧延銅箔を用いてグラフェンを製造した後、銅箔から転写シートへグラフェンを転写する必要があるが、銅箔の表面が粗いと転写がし難く、グラフェンが破損する場合があることがわかった。そこで、銅箔の表面凹凸が平滑であることが好ましい。
なお、圧延平行方向及び圧延直角方向の60度光沢度の上限は特に制限されないが、500%未満とすれば銅箔基材の製造時に圧延加工度等の製造条件を厳密に規定しなくてもよく、製造の自由度が高くなるので好ましい。又、圧延平行方向及び圧延直角方向の60度光沢度の上限は実用上、800%程度である。
又、このように転写シートへグラフェンを転写し易くするため、圧延平行方向の銅箔表面の算術平均粗さRaが0.20μm以下であることが好ましい。
<60 degree gloss of copper foil>
It is preferable that both the 60-degree glossiness (JIS Z 8741) of the copper foil surface in the rolling parallel direction and the rolling perpendicular direction is 130% or more.
As described later, after producing graphene using the rolled copper foil for producing graphene of the present invention, it is necessary to transfer graphene from the copper foil to the transfer sheet, but it is difficult to transfer if the surface of the copper foil is rough, It was found that graphene might break. Therefore, it is preferable that the surface unevenness of the copper foil is smooth.
In addition, the upper limit of 60 degree glossiness in the rolling parallel direction and the direction perpendicular to the rolling direction is not particularly limited, but if it is less than 500%, it is not necessary to strictly define the production conditions such as the degree of rolling work when producing the copper foil base material. It is preferable because the degree of freedom in manufacturing is high. Further, the upper limit of 60 degree gloss in the rolling parallel direction and the direction perpendicular to the rolling is practically about 800%.
In order to facilitate the transfer of graphene to the transfer sheet in this way, the arithmetic average roughness Ra of the copper foil surface in the rolling parallel direction is preferably 0.20 μm or less.

以上のように規定したグラフェン製造用圧延銅箔を用いることで、大面積のグラフェンを低コストで、かつ高い歩留りで生産することができる。   By using the rolled copper foil for producing graphene defined as described above, large-area graphene can be produced at low cost and with high yield.

<グラフェン製造用圧延銅箔の製造>
本発明の実施形態に係るグラフェン製造用圧延銅箔は、例えば以下のようにして製造することができる。まず、所定の組成の銅インゴットを製造し、熱間圧延を行った後に冷間圧延を行い、その後、焼鈍と冷間圧延を繰り返し、圧延板を得る。この圧延板を焼鈍して再結晶させ,所定の厚みまで最終冷間圧延して銅箔基材を得る。
ここで、最終冷間圧延において、最終パスの油膜当量と、最終パスの1つ前のパスの油膜当量がいずれも、最終的な圧延銅箔の板厚に対して上述の関係式を満たす(図3参照)。なお、最終パスの油膜当量と、最終パスの1つ前のパスの油膜当量とは同じ値である必要はない。圧延銅箔は一般に油潤滑のもと高速で加工され、潤滑油膜が厚くなるほどせん断帯変形が支配的になりやすい。また、銅箔の板厚が厚いほど、圧延時の銅箔の変形速度が大きくなる傾向にある。そして、せん断帯の存在の程度と、圧延時の銅箔の変形速度との影響により銅箔の結晶方位が所定の範囲内になると考えられる。
そして、圧延銅箔が所定の結晶方位を有すると、当該圧延銅箔の表面においてグラフェンの成長が促進されると考えられる。
<Manufacture of rolled copper foil for graphene production>
The rolled copper foil for producing graphene according to the embodiment of the present invention can be produced, for example, as follows. First, a copper ingot having a predetermined composition is manufactured, and after hot rolling, cold rolling is performed, and then annealing and cold rolling are repeated to obtain a rolled sheet. The rolled sheet is annealed and recrystallized, and finally cold-rolled to a predetermined thickness to obtain a copper foil base material.
Here, in the final cold rolling, the oil film equivalent of the final pass and the oil film equivalent of the pass immediately before the final pass both satisfy the above relational expression with respect to the final thickness of the rolled copper foil ( (See FIG. 3). Note that the oil film equivalent of the final pass and the oil film equivalent of the pass immediately before the final pass do not have to be the same value. The rolled copper foil is generally processed at high speed under oil lubrication, and the shear band deformation tends to become dominant as the lubricating oil film becomes thicker. Moreover, it exists in the tendency for the deformation | transformation speed of the copper foil at the time of rolling to become large, so that the board | plate thickness of copper foil is thick. Then, it is considered that the crystal orientation of the copper foil falls within a predetermined range due to the influence of the presence of the shear band and the deformation speed of the copper foil during rolling.
And when rolled copper foil has a predetermined crystal orientation, it is thought that the growth of graphene is promoted on the surface of the rolled copper foil.

油膜当量は下記式で表される。
油膜当量={(圧延油粘度、40℃の動粘度[cSt])×(通板速度[mpm]+ロール周速度[mpm])}/{(ロールの噛み込み角[rad])×(材料の降伏応力[kg/mm2])}で求められる。
油膜当量を25,000以下とするためには、低粘度の圧延油を用いたり、通板速度を遅くしたりする等、公知の方法を用いればよい。
The oil film equivalent is represented by the following formula.
Oil film equivalent = {(rolling oil viscosity, kinematic viscosity at 40 ° C. [cSt]) × (feeding speed [mpm] + roll peripheral speed [mpm])} / {(roll biting angle [rad]) × (material Yield stress [kg / mm 2 ])}.
In order to set the oil film equivalent to 25,000 or less, a known method such as using a low-viscosity rolling oil or slowing the sheet passing speed may be used.

<グラフェンの製造方法>
次に、図2を参照し、本発明の実施形態に係るグラフェンの製造方法について説明する。
まず、室(真空チャンバ等)100内に、上記した本発明のグラフェン製造用圧延銅箔10を配置し、グラフェン製造用圧延銅箔10をヒータ104で加熱すると共に、室100内を減圧又は真空引きする。そして、ガス導入口102から室100内に炭素含有ガスGを水素ガスと共に供給する(図2(a))。炭素含有ガスGとしては、一酸化炭素、メタン、エタン、プロパン、エチレン、アセチレン等が挙げられるがこれらに限定されず、これらのうち1種又は2種以上の混合ガスとしてもよい。又、グラフェン製造用圧延銅箔10の加熱温度は炭素含有ガスGの分解温度以上とすればよく、例えば1000℃以上とすることができる。又、室100内で炭素含有ガスGを分解温度以上に加熱し、分解ガスをグラフェン製造用圧延銅箔10に接触させてもよい。このとき、グラフェン製造用圧延銅箔10を加熱することで、グラフェン製造用圧延銅箔10の表面に分解ガス(炭素ガス)が接触し、グラフェン製造用圧延銅箔10の表面にグラフェン20を形成する(図2(b))。
<Graphene production method>
Next, referring to FIG. 2, a method for producing graphene according to an embodiment of the present invention will be described.
First, the rolled copper foil 10 for producing graphene of the present invention described above is placed in a chamber (vacuum chamber or the like) 100, the rolled copper foil 10 for producing graphene is heated by the heater 104, and the inside of the chamber 100 is depressurized or vacuumed. Pull. Then, the carbon-containing gas G is supplied from the gas inlet 102 into the chamber 100 together with the hydrogen gas (FIG. 2A). Examples of the carbon-containing gas G include carbon monoxide, methane, ethane, propane, ethylene, acetylene, and the like. However, the carbon-containing gas G is not limited to these, and may be one or two or more mixed gases. Further, the heating temperature of the rolled copper foil 10 for producing graphene may be set to be equal to or higher than the decomposition temperature of the carbon-containing gas G, for example, 1000 ° C. or higher. Alternatively, the carbon-containing gas G may be heated to a decomposition temperature or higher in the chamber 100 and the decomposition gas may be brought into contact with the rolled copper foil 10 for producing graphene. At this time, by heating the rolled copper foil 10 for producing graphene, the decomposition gas (carbon gas) contacts the surface of the rolled copper foil 10 for producing graphene, and the graphene 20 is formed on the surface of the rolled copper foil 10 for producing graphene. (FIG. 2B).

そして、グラフェン製造用圧延銅箔10を常温に冷却し、グラフェン20の表面に転写シート30を積層し、グラフェン20を転写シート30上に転写する。次に、この積層体をシンクロール120を介してエッチング槽110に連続的に浸漬し、グラフェン製造用圧延銅箔10をエッチング除去する(図2(c))。このようにして、所定の転写シート30上に積層されたグラフェン20を製造することができる。
さらに、グラフェン製造用圧延銅箔10が除去された積層体を引き上げ、グラフェン20の表面に基板40を積層し、グラフェン20を基板40上に転写しながら、転写シート30を剥がすと、基板40上に積層されたグラフェン20を製造することができる。
And the rolled copper foil 10 for graphene manufacture is cooled to normal temperature, the transfer sheet 30 is laminated | stacked on the surface of the graphene 20, and the graphene 20 is transcribe | transferred on the transfer sheet 30. FIG. Next, this laminated body is continuously immersed in the etching tank 110 through the sink roll 120, and the rolled copper foil 10 for producing graphene is removed by etching (FIG. 2C). Thus, the graphene 20 laminated on the predetermined transfer sheet 30 can be manufactured.
Furthermore, when the laminated body from which the rolled copper foil 10 for producing graphene is removed is pulled up, the substrate 40 is laminated on the surface of the graphene 20, and the transfer sheet 30 is peeled off while transferring the graphene 20 onto the substrate 40, The graphene 20 laminated on the substrate can be manufactured.

転写シート30としては、各種樹脂シート(ポリエチレン、ポリウレタン等のポリマーシート)を用いることができる。グラフェン製造用圧延銅箔10をエッチング除去するエッチング液としては、例えば硫酸溶液、過硫酸ナトリウム溶液、過酸化水素、及び過硫酸ナトリウム溶液又は過酸化水素に硫酸を加えた溶液を用いることができる。又、基板40としては、例えばSi、 SiC、Ni又はNi合金を用いることができる。   As the transfer sheet 30, various resin sheets (polymer sheets such as polyethylene and polyurethane) can be used. As an etching solution for etching and removing the rolled copper foil 10 for producing graphene, for example, a sulfuric acid solution, a sodium persulfate solution, hydrogen peroxide, a sodium persulfate solution, or a solution obtained by adding sulfuric acid to hydrogen peroxide can be used. As the substrate 40, for example, Si, SiC, Ni, or Ni alloy can be used.

<試料の作製>
表1に示す組成の銅インゴットを製造し、熱間圧延を行った後に冷間圧延を行い、300〜800℃の温度に設定した焼鈍炉での焼鈍と冷間圧延を繰り返して1〜2mm厚の圧延板を得た。この圧延板を300〜800℃の温度に設定した焼鈍炉で焼鈍して再結晶させ,表1の厚みまで最終冷間圧延し、銅箔を得た。
<Preparation of sample>
A copper ingot having the composition shown in Table 1 was manufactured, hot-rolled and then cold-rolled, and annealing and cold rolling in an annealing furnace set at a temperature of 300 to 800 ° C. were repeated to obtain a thickness of 1 to 2 mm. A rolled plate was obtained. This rolled sheet was annealed and recrystallized in an annealing furnace set at a temperature of 300 to 800 ° C., and finally cold-rolled to the thickness shown in Table 1 to obtain a copper foil.

ここで、最終冷間圧延の最終パス及び最終パスの1つ前のパスの油膜当量を表1に示す値に調整した。
油膜当量は下記式で表される。
(油膜当量)={(圧延油粘度、40℃の動粘度;cSt)×(圧延速度;m/分)}/{(材料の降伏応力;kg/mm2)×(ロール噛込角;rad)}
Here, the oil film equivalent of the final pass of the final cold rolling and the pass before the final pass was adjusted to the values shown in Table 1.
The oil film equivalent is represented by the following formula.
(Oil film equivalent) = {(rolling oil viscosity, kinematic viscosity at 40 ° C .; cSt) × (rolling speed; m / min)} / {(yield stress of material; kg / mm 2 ) × (roll biting angle; rad )}

<光沢度の測定>
各実施例及び比較例の銅箔の最終冷間圧延後の表面の60度光沢度を測定した。
60度光沢度は、JIS−Z8741に準拠した光沢度計(日本電色工業製、商品名「PG-1M」)を使用して測定した。なお、表中のG60RD,G60TDはそれぞれ圧延平行方向、圧延直角方向の60度光沢度である。
<Measurement of glossiness>
The 60-degree glossiness of the surface after the final cold rolling of the copper foils of the examples and comparative examples was measured.
The 60 degree glossiness was measured using a gloss meter (trade name “PG-1M” manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS-Z8741. In the table, G60 RD and G60 TD are 60 degree glossinesses in the rolling parallel direction and the rolling perpendicular direction, respectively.

<表面粗さRaの測定>
各実施例及び比較例の銅箔の最終冷間圧延後の表面粗さRaを測定した。
表面粗さRaは、接触粗さ計(小坂研究所製、商品名「SE−3400」)を使用してJIS B0601に準拠した算術平均粗さ(Ra;μm)として測定した。測定基準長さ0.8mm、評価長さ4mm、カットオフ値0.8mm、送り速さ0.1mm/秒の条件で圧延方向と平行に測定位置を変えて10回行ない、10回の測定での平均値を求めた。
<Measurement of surface roughness Ra>
The surface roughness Ra after the final cold rolling of the copper foils of the examples and comparative examples was measured.
The surface roughness Ra was measured as an arithmetic average roughness (Ra; μm) based on JIS B0601 using a contact roughness meter (trade name “SE-3400” manufactured by Kosaka Laboratory Ltd.). The measurement position is changed 10 times in parallel with the rolling direction under the conditions of a measurement standard length of 0.8 mm, an evaluation length of 4 mm, a cut-off value of 0.8 mm, and a feed rate of 0.1 mm / second. The average value of was obtained.

<{001}正極点測定>
{001}正極点測定は、X線ディフラクトメータタ(株式会社リガク製 RINT2500)を用い、各実施例及び比較例の最終冷間圧延後の銅箔表面について反射法で行った。但し、反射法では、試料面に対するX線の入射角が浅くなると測定が困難になるため、実際に測定できる角度範囲は正極点図上で0°≦α≦75°、0°≦β≦360°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸、β:前記回転軸に平行な軸)となる。
又、集合組織を有しない状態(すなわち結晶方位がランダムである状態)を1として正極点図上の集合組織の強度を規格化した。結晶方位がランダムである状態として、銅粉末試料の{001}正極点測定を行い、これを1とした。
なお、X線照射条件として、Cu管球を使用し、管電圧40kV、管電流100mAとし、シュルツの反射法にて{001}正極点図を測定した。
<{001} positive electrode point measurement>
The {001} positive electrode point measurement was performed by a reflection method on the copper foil surface after the final cold rolling in each example and comparative example using an X-ray diffractometer (RINT2500, manufactured by Rigaku Corporation). However, in the reflection method, measurement becomes difficult when the incident angle of the X-ray with respect to the sample surface becomes shallow. Therefore, the angle ranges that can be actually measured are 0 ° ≦ α ≦ 75 ° and 0 ° ≦ β ≦ 360 on the positive electrode diagram. ° (where α is an axis perpendicular to the rotational axis of the diffraction goniometer defined in the Schulz method, β is an axis parallel to the rotational axis).
In addition, the strength of the texture on the positive point diagram was normalized by assuming that the texture has no texture (that is, the crystal orientation is random) as 1. With the crystal orientation being random, a {001} positive electrode point measurement of a copper powder sample was performed and this was set to 1.
As the X-ray irradiation conditions, a Cu tube was used, the tube voltage was 40 kV, the tube current was 100 mA, and a {001} positive point diagram was measured by the Schulz reflection method.

<グラフェンの製造>
各実施例のグラフェン製造用圧延銅箔(縦横100X100mm)を真空チャンバーに設置し、1000℃に加熱した。真空(圧力:0.2Torr)下でこの真空チャンバーに水素ガスとメタンガスを供給し(供給ガス流量:10〜100cc/min)、銅箔を1000℃まで30分で昇温した後、1時間保持し、銅箔表面にグラフェンを成長させた。
各実施例について、上記条件でグラフェンの製造を10回行い、グラフェンのシート抵抗を測定すると共に、グラフェンの製造歩留りを評価した。
グラフェンのシート抵抗は、10個の上記サンプルについて銅箔表面のグラフェンをPETフィルムに転写した後、4端子法によりグラフェンの抵抗値(シート抵抗:Ω/sq)を測定し、平均値を求めた。グラフェンの抵抗値が600Ω/sq以下であれば実用上問題はない。
グラフェンの製造歩留りは、10個の上記サンプルについて銅箔表面のグラフェンの有無を原子間力顕微鏡(AFM)で観察して評価した。AFMにより、表面全体にうろこ状の凹凸が観察されたものをグラフェンが製造されたものとみなし、10回の製造のうちグラフェンが製造された回数により以下の基準で歩留を評価した。評価が○であれば実用上問題はない。
○:10回の製造のうち、4回以上グラフェンが製造された
×:10回の製造のうち、グラフェンが製造された回数が3回以下
<Manufacture of graphene>
The rolled copper foil for producing graphene of each example (length and width: 100 × 100 mm) was placed in a vacuum chamber and heated to 1000 ° C. Hydrogen gas and methane gas are supplied to this vacuum chamber under vacuum (pressure: 0.2 Torr) (supply gas flow rate: 10 to 100 cc / min), and the copper foil is heated to 1000 ° C. in 30 minutes and then held for 1 hour. Then, graphene was grown on the copper foil surface.
About each Example, manufacture of graphene was performed 10 times on the said conditions, the sheet resistance of graphene was measured, and the manufacture yield of graphene was evaluated.
Regarding the sheet resistance of graphene, the graphene resistance value (sheet resistance: Ω / sq) was measured by a four-terminal method after graphene on the surface of the copper foil was transferred to a PET film for the above 10 samples, and the average value was obtained. . If the graphene resistance is 600 Ω / sq or less, there is no practical problem.
The production yield of graphene was evaluated by observing the presence or absence of graphene on the surface of the copper foil with an atomic force microscope (AFM) for the ten samples. The case where scaly irregularities were observed on the entire surface by AFM was regarded as the production of graphene, and the yield was evaluated according to the following criteria based on the number of times graphene was produced out of 10 productions. If the evaluation is ○, there is no practical problem.
○: Graphene was manufactured 4 times or more out of 10 times of manufacture ×: Graphene was manufactured 3 times or less out of 10 times of manufacture

得られた結果を表1に示す。   The obtained results are shown in Table 1.

表1から明らかなように、(IA/IB)及び(IC/ID)が0.5以上1未満である各実施例の場合、グラフェンのシート抵抗が低く、グラフェンの製造歩留も優れていた。なお、各実施例の場合、検出強度の最大値IA及びICが共に1以上であり、検出強度の最大値IBが11以下であった。   As is clear from Table 1, in each example where (IA / IB) and (IC / ID) were 0.5 or more and less than 1, the sheet resistance of graphene was low, and the production yield of graphene was also excellent. . In each of the examples, the maximum detection intensity values IA and IC were both 1 or more, and the maximum detection intensity value IB was 11 or less.

一方、最終冷間圧延の油膜当量と板厚とが、上述の関係式の範囲から外れた各比較例の場合、(IA/IB)及び(IC/ID)がいずれも0.5未満又は1以上となり、グラフェンのシート抵抗が高く、グラフェンの製造歩留も劣った。   On the other hand, in the case of each comparative example in which the oil film equivalent and the plate thickness of the final cold rolling are out of the range of the above relational expression, (IA / IB) and (IC / ID) are both less than 0.5 or 1 Thus, the sheet resistance of graphene is high, and the production yield of graphene is also inferior.

10 グラフェン製造用圧延銅箔
20 グラフェン
30 転写シート
10 Rolled copper foil for graphene production 20 Graphene 30 Transfer sheet

Claims (9)

{001}正極点図において、α=20度、β=135度±3度における検出強度の最大値IAと、α=40度、β=240度±3度における検出強度の最大値IBとの比(IA/IB)が0.5以上1未満であるグラフェン製造用圧延銅箔。   {001} In the positive pole figure, the maximum value IA of the detected intensity at α = 20 degrees and β = 135 degrees ± 3 degrees and the maximum value IB of the detected intensity at α = 40 degrees and β = 240 degrees ± 3 degrees A rolled copper foil for producing graphene having a ratio (IA / IB) of 0.5 or more and less than 1. {001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満であるグラフェン製造用圧延銅箔。   In the {001} positive pole figure, the maximum value IC of the detected intensity at α = 20 degrees and β = 225 degrees ± 3 degrees and the maximum value ID of the detected intensity at α = 40 degrees and β = 300 degrees ± 3 degrees A rolled copper foil for producing graphene having a ratio (IC / ID) of 0.5 or more and less than 1. {001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICと、α=40度、β=300度±3度における検出強度の最大値IDとの比(IC/ID)が0.5以上1未満である請求項1に記載のグラフェン製造用圧延銅箔。   In the {001} positive pole figure, the maximum value IC of the detected intensity at α = 20 degrees and β = 225 degrees ± 3 degrees and the maximum value ID of the detected intensity at α = 40 degrees and β = 300 degrees ± 3 degrees The rolled copper foil for producing graphene according to claim 1, wherein the ratio (IC / ID) is 0.5 or more and less than 1. {001}正極点図において、α=20度、β=135度±3度における検出強度の最大値IAが1以上である請求項1〜3のいずれかに記載のグラフェン製造用圧延銅箔。   The rolled copper foil for producing graphene according to any one of claims 1 to 3, wherein the maximum value IA of the detected intensity at α = 20 degrees and β = 135 degrees ± 3 degrees in the {001} positive electrode diagram. {001}正極点図において、α=20度、β=225度±3度における検出強度の最大値ICが1以上である請求項1〜4のいずれかに記載のグラフェン製造用圧延銅箔。   The rolled copper foil for producing graphene according to any one of claims 1 to 4, wherein the maximum value IC of the detected intensity at α = 20 degrees and β = 225 degrees ± 3 degrees is 1 or more in the {001} positive electrode diagram. {001}正極点図において、α=40度、β=240度±3度における検出強度の最大値IBが11以下である請求項1〜5のいずれかに記載のグラフェン製造用圧延銅箔。   The rolled copper foil for producing graphene according to any one of claims 1 to 5, wherein in the {001} positive electrode diagram, the maximum value IB of detected intensity at α = 40 degrees and β = 240 degrees ± 3 degrees is 11 or less. JIS-H3100に規格するタフピッチ銅、JIS−H3100に規格する無酸素銅、JIS−H3510に規格する無酸素銅、又は前記タフピッチ銅若しくは前記無酸素銅に対してSn及びAgの群から選ばれる1種以上の元素を合計で0.0001質量%以上0.05質量%以下含有する組成からなる請求項1〜6のいずれかに記載のグラフェン製造用圧延銅箔。   1 selected from the group of Sn and Ag for tough pitch copper standardized to JIS-H3100, oxygen-free copper standardized to JIS-H3100, oxygen-free copper standardized to JIS-H3510, or the tough pitch copper or oxygen-free copper. The rolled copper foil for producing graphene according to any one of claims 1 to 6, comprising a composition containing at least 0.0001 mass% and not more than 0.05 mass% of elements of at least seeds. 表面の圧延平行方向及び圧延直角方向の60度光沢度が共に130%以上、かつ圧延平行方向及び圧延直角方向の表面粗さRaが0.20μm以下である請求項1〜7のいずれかに記載のグラフェン製造用圧延銅箔。   The 60 degree glossiness in the rolling parallel direction and the rolling perpendicular direction on the surface is both 130% or more, and the surface roughness Ra in the rolling parallel direction and the rolling perpendicular direction is 0.20 µm or less. Rolled copper foil for graphene production. 請求項1〜8のいずれかに記載のグラフェン製造用圧延銅箔を用いたグラフェンの製造方法であって、
所定の室内に、加熱した前記グラフェン製造用圧延銅箔を配置すると共に水素ガスと炭素含有ガスを供給し、前記グラフェン製造用圧延銅箔表面にグラフェンを形成するグラフェン形成工程と、
前記グラフェンの表面に転写シートを積層し、前記グラフェンを前記転写シート上に転写しながら、前記グラフェン製造用圧延銅箔をエッチング除去するグラフェン転写工程と、を有するグラフェンの製造方法。
A method for producing graphene using the rolled copper foil for producing graphene according to any one of claims 1 to 8,
A graphene forming step of arranging the heated rolled copper foil for producing graphene in a predetermined chamber and supplying a hydrogen gas and a carbon-containing gas and forming graphene on the surface of the rolled copper foil for producing graphene,
A graphene transfer process comprising: laminating a transfer sheet on a surface of the graphene; and transferring the graphene onto the transfer sheet, and etching and removing the rolled copper foil for manufacturing graphene.
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