JP5995771B2 - Manufacturing method of electromagnetic wave shielding molded product - Google Patents

Description

  The present invention relates to a method for producing an electromagnetic wave shielding molded article in which a conductive sheet having an electromagnetic wave shielding function is integrally laminated on the surface of a resin molded article main body having a three-dimensional shape.

  Patent Document 1 discloses a method of manufacturing an electromagnetic wave shielding molded product by integrally molding a molded product body made of plastic and a metal foil in a molding die. In this method of manufacturing an electromagnetic wave shielding molded article, first, a metal foil is punched into a shape in which a rectangular parallelepiped folded box having no upper surface portion is developed on a plane. At this time, each portion of the metal foil that forms the raised surface portion is provided with an allowance for bonding with the raised surface portion adjacent to one side. Next, the punched metal foil is bent to raise each of the vertical surfaces from the four sides of the rectangular bottom surface, and the adjacent vertical surfaces are bonded to each other with an adhesive using an adhesive margin. Make a solid shape. Thereafter, a three-dimensional metal foil is set on the convex shape of the molding die, and plastic is injected and injected into the molding die, so that the metal foil and the molded product body made of plastic are inseparably combined.

Japanese Patent Laid-Open No. 03-230918

However, as disclosed in Patent Document 1, when the adjacent vertical surfaces are bonded to each other with an adhesive allowance to form the metal foil in a three-dimensional shape, the metal foil is placed in a molding die in which the three-dimensional metal foil is set. When plastic is injected, there is a risk that the bonding margin may be peeled off by the injection pressure of the plastic. Sonaruto, molding portion which can not be sufficiently shielded cuts the conductive sheet enters the flop la stick between adjacent standing surface (release unit) would have been formed, the electromagnetic wave conductive sheet is generated, it is manufactured The electromagnetic wave shielding performance of the product deteriorates.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an electromagnetic wave shielding molded article excellent in electromagnetic wave shielding performance by preventing the formation of cuts in the conductive sheet. There is to do.

  In order to achieve the above object, according to the present invention, the planar conductive sheet is formed into a three-dimensional shape without bonding using a bonding margin by providing a folding portion.

Specifically, the present invention is directed to a method of manufacturing the integrally laminated electromagnetic wave shielding molded product conducting sheet having an electromagnetic wave shielding function to the surface of the formed molded article body that having a three-dimensional shape, the following The solution is taken.

That is, according to the first invention, a conductive sheet having one surface formed of a resin layer is prepared as a conductive sheet, and the conductive sheet is provided with a fold portion so that the conductive sheet is a bottom portion. a three-dimensional shape having a standing surface portion rising from the bottom portion, to set the conductive sheet of the three-dimensional shape to the molding surface of the mold, after which the molten resin into the cavity while closing mold mold The molded product body is molded by injection, and when the molded product body is molded, the resin layer of the conductive sheet is melted at the temperature of the molten resin, and the folded portion of the conductive sheet is injected by the molten resin injection pressure. the by close contact with the standing surface, and their flaps and trailing surface portion, characterized in that the obtained bonded electromagnetic wave shielding molded article with a resin layer.

  According to a second aspect of the present invention, in the method for manufacturing an electromagnetic wave shielding molded article according to the first aspect, the conductive sheet is formed by laminating a mesh layer made of at least one of metal fibers and organic fibers covered with metal and a resin layer. When the three-dimensional conductive sheet having a structure is set on the mold molding surface of the mold, the resin layer side of the conductive sheet is brought into contact with the mold molding surface, and the mold is closed with the mold closed. The molded product body is formed on the mesh layer side of the conductive sheet by injecting molten resin into the cavity where the mesh layer of the conductive sheet is exposed.

  According to a third invention, in the method for manufacturing an electromagnetic wave shielding molded article according to the first invention, the conductive sheet has a structure in which a metal thin film and a resin layer are laminated, and the three-dimensional conductive sheet is formed into a mold. When set on the mold forming surface, the resin layer side of the conductive sheet is brought into contact with the mold forming surface, and the molten resin is injected into the cavity where the metal thin film of the conductive sheet is exposed with the mold closed. By doing so, the molded product main body is formed on the metal thin film side of the conductive sheet.

  According to a fourth invention, in the method for manufacturing an electromagnetic wave shielding molded article according to the second invention, the resin layer of the conductive sheet is made of the same resin as the molten resin injected into the cavity of the molding die.

  According to the first aspect of the present invention, the planar conductive sheet is formed into a three-dimensional shape by providing a folded portion without bonding utilizing an adhesive margin that causes a break, and the three-dimensional conductive sheet is formed into a molding surface. By injecting the molten resin into the cavity with the mold closed after setting, an electromagnetic shielding molded product in which the conductive sheet is integrally laminated on the surface of the molded product body is obtained. Even if it receives, a cut | interruption is not formed in a conductive sheet and it can prevent that the location which cannot fully shield electromagnetic waves in a conductive sheet in a manufacture process generate | occur | produces. Therefore, an electromagnetic wave shielding molded product having excellent electromagnetic wave shielding performance can be realized.

Further, according to the first invention, since the resin layer of the conductive sheet melts at the temperature of the molten resin injected into the cavity of the mold, the folded portion is raised by the injection pressure of the molten resin in the mold. The two can be bonded to each other when closely attached. Thereby, it can prevent that a folding part peels from an elevation part.

  According to the second invention, the conductive sheet has a structure in which a mesh layer and a resin layer are laminated, and the molded product body is formed by injection molding of a molten resin on the mesh layer side of the conductive sheet. Since the mesh layer is located between the resin layer and the resin molded product main body, the resin layer and the molded product main body function as a protective layer, and the mesh layer can be prevented from being damaged or rusted. . In addition, when a three-dimensional conductive sheet set in a mold is held on the mold surface by negative pressure (vacuum adsorption) by suction, the conductive sheet is more conductive than the structure in which the conductive sheet is the mesh layer itself. The conductive sheet can be firmly held by suitably applying a negative pressure force to the conductive sheet.

Further, according to the second invention, the folded portion has a structure in which the mesh layer of the overlapped portion is opposed to the inside, so that the folded portion is disposed between the fibers constituting the opposed mesh layer. A certain resin layer melts and penetrates and penetrates into the mesh layer, and the overlapping portion of the conductive sheet in the folded portion can be bonded together with the molding of the molded product body, and the gap can be eliminated in the folded portion. .

  According to the third invention, the conductive sheet has a structure in which a metal thin film and a resin layer are laminated, and the conductive sheet is provided with an electromagnetic wave shielding function by the metal thin film. Compared with the case where the electromagnetic wave shielding function is realized, the electromagnetic wave shielding performance of the conductive sheet can be improved. In addition, since the molded product body is formed by injection molding of molten resin on the metal thin film side of the conductive sheet, the metal thin film is positioned between the resin layer and the resin molded product body. The molded product body functions as a protective layer, and can prevent the metal thin film from being scratched or rusted.

  According to the fourth invention, the molten resin injected into the cavity of the molding die enters between the fibers constituting the mesh layer and penetrates into the layer, and the molded product main body is molded integrally with the mesh layer. Since the adhesiveness of the interface of the molded article main body integrated with the mesh layer and the resin layer of the conductive sheet is improved, the conductive sheet can be prevented from being peeled from the molded article main body.

FIG. 1 is a perspective view showing an electromagnetic wave shielding molded product according to an embodiment of the present invention. FIG. 2A is a cross-sectional view taken along the line II-II in FIG. FIG. 2B is an enlarged view of a portion surrounded by B in FIG. FIG. 3 is a development view of the conductive sheet according to the embodiment of the present invention. Fig.4 (a) is a perspective view which shows the solid-shaped electroconductive sheet prepared in the manufacturing method of the electromagnetic wave shielding molded article which concerns on embodiment of this invention. FIG. 4B is a cross-sectional view taken along line BB in FIG. Fig.5 (a) is sectional drawing of the location corresponding to FIG.4 (b) which shows the state which set the electroconductive sheet to the shaping | molding die in the manufacturing method of the electromagnetic wave shielding molded article which concerns on embodiment of this invention. FIG.5 (b) is sectional drawing in the BB line of Fig.5 (a). Fig.6 (a) is sectional drawing which shows the state which closed the shaping | molding die in the manufacturing method of the electromagnetic wave shielding molded article which concerns on embodiment of this invention. FIG. 6B is a cross-sectional view taken along line BB in FIG. Fig.7 (a) is an enlarged view of the part enclosed by VII-A of Fig.6 (a). FIG. 7B is a cross-sectional view corresponding to FIG. 7A showing a state in which molten resin is injected and filled into the cavity of the molding die in the method for manufacturing an electromagnetic wave shielding molded product according to the present embodiment. FIG. 8 is an enlarged view of a portion surrounded by VIII in FIG. FIG. 9 is an enlarged cross-sectional view of a portion corresponding to FIG. 2B showing an electromagnetic wave shielding molded product according to Modification 2 of the embodiment of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. The following embodiments are essentially preferable examples, and are not intended to limit the scope of the present invention, its application, or its use.

  An electromagnetic wave shielding molded article 1 according to this embodiment is shown in FIGS. 1 and 2A, 2B. FIG. 1 is a perspective view of an electromagnetic wave shielding molded product 1. FIG. 2A is a cross-sectional view taken along the line II-II in FIG. FIG. 2B is an enlarged view of a portion surrounded by B in FIG.

  The electromagnetic wave shielding molded product 1 constitutes a part of a case that houses, for example, a battery mounted on an electric vehicle and a control device that controls the battery, and shields the electromagnetic waves emitted from the battery and the control device so as not to leak to the outside. To do. As shown in FIG. 1, the electromagnetic wave shielding molded product 1 is formed in a rectangular parallelepiped box shape with one side opened, and has an accommodation space s inside, and an electromagnetic wave shielding function is provided on the inner surface of the resin molded product main body 3. The electroconductive sheet 5 which has this is provided with the structure laminated | stacked integrally.

  The molded product body 3 is made of, for example, polypropylene (PP), modified polypropylene, polyphenylene sulfide (PPS), polyethylene (PE), polystyrene (PS), polyamide (PA), polyacetal (POM), acrylonitrile / butadiene / styrene (ABS). ), Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and the like. The molded product main body 3 has the same shape as the electromagnetic wave shielding molded product 1, and forms the main body of the molded product 1.

  The conductive sheet 5 includes a rectangular bottom surface portion 5 a corresponding to the bottom surface of the molded product body 3, and four standing surface portions 5 b erected from the four sides of the bottom surface portion 5 a and corresponding to the side wall surfaces of the molded product body 3. It is formed in a three-dimensional shape having And between the adjacent standing surface parts 5b, the folding part 5c folded in the inside of the electroconductive sheet 5, ie, the accommodation space s side, is provided. The folded portions 5c are respectively provided at locations corresponding to the four corners of the molded product body 3, and as will be described in detail later, are the key points for making the planar conductive sheet 5 into a three-dimensional shape. As shown in FIG. 2 (a), each folded portion 5c is in close contact with the upright surface portion 5b located on one side from the inside, and the raised surface portion 5b is reduced to the molded product body 3.

  This conductive sheet 5 has a structure in which a mesh layer 7 and a resin layer 9 are laminated as shown in FIG. The mesh layer 7 is formed by weaving a metal-coated organic fiber 7a into a plain weave of about 25 mesh with a wire diameter of 30 μm, for example, and realizes an electromagnetic wave shielding function on the conductive sheet 5. The organic fiber 7a coated with this metal is made of, for example, silver (Ag) or copper on an organic fiber made of polypropylene (PP), polyamide (PA), acrylic or the like by a method such as electrolysis or electroless plating, vapor deposition or sputtering. A metal layer made of (Cu), gold (Au), nickel (Ni), indium (In) or the like is formed to a thickness of about 1 μm, for example.

  The resin layer 9 is made of the same resin as that of the molded product main body 3 and is located on the accommodation space s side of the electromagnetic wave shielding molded product 1 to constitute the inner surface of the molded product 1. On the other hand, the mesh layer 7 is located between the resin layer 9 and the molded product body 3 and is integrated with the molded product body 3. The mesh layer 7 is made of, for example, aluminum (Al), iron (Fe), copper (Cu), nickel (Ni), gold (Au), silver (Ag), or the like, instead of the organic fiber 7a coated with metal. The metal fibers may be knitted, or may be configured by knitting these two types of fibers (organic fiber 7a coated with metal and metal fiber).

  The manufacturing process of the electromagnetic wave shielding molded article 1 is shown in FIGS. The electromagnetic wave shielding molded product 1 is manufactured in the following manner.

  First, a planar conductive sheet 5 ′ having an electromagnetic wave shielding function as shown in FIG. 3 is prepared. The conductive sheet 5 ′ is formed in a shape obtained by cutting corner portions of a rectangular sheet. The conductive sheet 5 ′ is provided with fold lines 101 and 103 that define the constituent portions 5a ′ of the bottom surface portion 5a, the constituent portions 5b ′ of the respective elevating surface portions 5b, and the constituent portions 5c ′ of the folding portions 5c. . In FIG. 3, a fold line 101 indicated by a broken line is a valley fold line, and a fold line 103 indicated by a one-dot chain line is a mountain fold line.

  Then, the conductive sheet 5 ′ is folded according to the folding lines 101 and 103, and the folded portions 5c are formed at the four corners of the conductive sheet 5 ′ so that the conductive sheet 5 ′ is formed as shown in FIG. , (B), without using an adhesive, a three-dimensional shape having a rectangular bottom surface portion 5a and rising surface portions 5b rising from the four sides of the bottom surface portion 5a is formed. In the present embodiment, when the conductive sheet 5 is formed in a three-dimensional shape as described above, the folding portion 5 c is provided so that the resin layer 9 of the conductive sheet 5 is positioned inside the mesh layer 7. Each folding part 5c provided in this way has a structure in which the mesh layer 7 of the overlapped part faces inward.

  Next, the three-dimensional conductive sheet 5 is set in a mold 105 as shown in FIGS. 5 (a) and 5 (b). The mold 105 includes a first mold 109 having a convex mold surface 107 and a second mold 115 having a concave mold surface 113 that faces the convex mold surface 107 in a closed state. And. The conductive sheet 5 of the present embodiment is set so as to cover the convex mold forming surface 107. When the conductive sheet 5 is set on the convex mold surface 107, the resin layer 9 of the conductive sheet 5 is located on the convex mold surface 107 side and comes into contact with the mold surface 107.

  The convex mold forming surface 107 has a shape that fits in a space surrounded by the upright surface portion 5b of the three-dimensional conductive sheet 5, a rectangular flat front end surface 107a, and four sides of the front end surface 107a. Are formed by four side end faces 107b extending vertically from each other, and a base end face 107c extending outward from the end opposite to the tip end face 107a of each side end face 107b.

  The tip surface 107 a of the convex mold forming surface 107 is in contact with substantially the entire bottom surface portion 5 a of the set conductive sheet 5. Further, each side end face 107b of the convex mold forming surface 107 is in contact with the rising surface portion 5b of the set conductive sheet 5 or opposed with a slight gap. Then, the base end surface 107 c of the convex mold forming surface 107 comes into contact with the tip of the upright surface portion 5 b of the set conductive sheet 5. In addition, each folded portion 5c of the conductive sheet 5 is formed such that when the sheet 5 is set on the convex mold forming surface 107, the side end surface 107b of the convex mold forming surface 107 and the vertical surface portion 5b of the sheet 5 are provided. Between the side end surfaces 107b of the convex mold forming surface 107.

  After the conductive sheet 5 is set on the convex molding surface 107 as described above, air is sucked from a vacuum hole 108 opened on the front end surface 107a of the convex molding surface 107, and the bottom surface of the conductive sheet 5 is obtained. By adsorbing the portion 5 a to the vacuum hole 108, the conductive sheet 5 is held on the convex mold surface 107 by a negative pressure force, so-called vacuum adsorption. At this time, since the conductive sheet 5 of the present embodiment has a structure in which the mesh layer 7 and the resin layer 9 are laminated, for example, compared to a configuration in which the conductive sheet 5 is the mesh layer 7 itself. When the negative pressure force is suitably applied, the convex mold surface 107 can be firmly held.

  Subsequently, as shown in FIGS. 6A and 6B, the first molding die 109 and the second molding die 115 in which the conductive sheet 5 is set on the convex molding surface 107 are closed. A cavity 117 is formed between the conductive sheet 5 set on the convex molding surface 107 and the concave molding surface 113 of the second molding die 115. The mesh layer 7 of the conductive sheet 5 is exposed in the cavity 117 of the mold 105. Further, at this stage, each folded portion 5c of the conductive sheet 5 is in a state in which the tip side is partly separated from the elevation surface portion 5b as shown in FIG.

  With the mold 105 closed in this manner, the molten resin R, which is the same resin as the resin layer 9 of the conductive sheet 5, is fed from the gate 119 opened to the concave mold forming surface 113 to the cavity 117. The molten resin R is injected and filled throughout the cavity 117. At this time, as shown in FIG. 7 (b), each folded portion 5c of the conductive sheet 5 is pressed and brought into close contact with the vertical surface portion 5b by the injection pressure of the molten resin R, and the molten resin R filled in the cavity 117 is obtained. It will be in a state reduced to. As shown in FIG. 8, the molten resin R enters between the fibers 7 a constituting the mesh layer 7 and penetrates into the layer 7, and is in close contact with the resin layer 9 of the conductive sheet 5.

  Then, after a while, the molten resin R filled in the cavity 117 was cooled and solidified by the mold temperatures of the first mold 109 and the second mold 115 to be integrated with the mesh layer 7 of the conductive sheet 5. The molded product body 3 in a state is molded into the cavity 117. Thereafter, the first molding die 109 and the second molding die 115 are opened, and the molded product body 3 in which the conductive sheet 5 is integrally laminated on the inner surface is removed from the molding die 105 and taken out, and the second molding is performed. The electromagnetic wave shielding molded product 1 is obtained by cutting off the gate solid residue remaining on the gate 119 of the mold 115 and solidifying and adhering to the molded product body 3.

-Effect of the embodiment-
According to this embodiment, the planar conductive sheet 5 is formed into a three-dimensional shape by providing the folding portion 5c without bonding using the bonding allowance that causes a break, and the three-dimensional conductive sheet 5 is formed into a convex shape. After the mold molding surface 107 is set, the molten resin R is injected into the cavity 117 in a state where the mold 105 is closed, whereby the conductive sheet 5 is integrally laminated on the surface of the molded product body 3. Since the molded product 1 is obtained, no cuts are formed in the conductive sheet 5 even when the injection pressure of the molten resin R is applied, and there are places where the electromagnetic wave cannot be sufficiently shielded in the conductive sheet 5 during the manufacturing process. Can be prevented. Therefore, the electromagnetic wave shielding molded article 1 having excellent electromagnetic wave shielding performance can be realized.

  Further, according to this embodiment, the conductive sheet 5 has a structure in which the mesh layer 7 and the resin layer 9 are laminated, and the molded product main body is formed by injection molding of the molten resin R on the mesh layer 7 side of the conductive sheet 5. 3 is formed, the mesh layer 7 is positioned between the resin layer 9 and the resin molded product body 3, and the resin layer 9 and the molded product body 3 function as a protective layer. 7 can be prevented from being scratched or rusted.

  Further, according to this embodiment, since the resin layer 9 is made of the same resin as the molten resin R injected into the cavity 117 of the mold 105, the molded product body 3 and the conductive sheet 5 integrated with the mesh layer 7 are used. The adhesion of the interface with the resin layer 9 is improved, and the conductive sheet 5 can be prevented from being peeled off from the molded product body 3.

-Modification 1 of embodiment-
In the above embodiment, the resin layer 9 of the conductive sheet 5 is made of the same resin as the resin constituting the molded product body 3, that is, the molten resin R injected into the cavity 117 of the mold 105. The resin layer 9 of the conductive sheet 5 is made of a low melting point resin that melts at the temperature of the molten resin R.

  Specifically, the molten resin R injected into the cavity 117 of the mold 105 in this modification is, for example, polyamide (PI), polyacetal (POM), acrylonitrile / butadiene / styrene (ABS), polyethylene terephthalate (PET). ), A relatively high melting point resin such as polybutylene terephthalate (PBT). On the other hand, the resin layer 9 of the conductive sheet 5 is made of a resin having a relatively low melting point such as polypropylene (PP), polyethylene (PE), polystyrene (PS), or the like.

  Since the resin layer 9 made of such a low melting point resin melts at the temperature of the molten resin R injected into the cavity 117 of the mold 105, the folding portion 5 c in the mold 105 is at the injection pressure of the molten resin R. Both can be bonded together when they are in close contact with the vertical surface portion 5b. Thereby, it can prevent that the folding part 5c peels from the standing surface part 5b to the accommodation space s side of the electromagnetic wave shielding molded product 1.

  In addition, the resin layer 9 on the outside melts and enters between the fibers 7a constituting the mesh layer 7 facing each other in the folded portion 5c, and penetrates into the mesh layer 7, and the conductive sheet in the folded portion 5c. The superposed portion 5 can also be bonded together with the molding of the molded product body 3, and a gap can be eliminated in the folded portion 5 c.

-Modification 2 of embodiment-
FIG. 9 shows an enlarged cross-sectional view of the electromagnetic wave shielding molded product 1 according to the second modification. FIG. 9 shows a cross-sectional structure of the portion corresponding to FIG. In the above embodiment, the conductive sheet 5 has a structure in which the mesh layer 7 and the resin layer 9 are laminated. However, in this modification, as shown in FIG. The metal thin film 11 and the resin layer 9 are laminated. The metal thin film 11 is, for example, a foil such as aluminum (Al), iron (Fe), copper (Cu), nickel (Ni), gold (Au), silver (Ag), etc., and the conductive sheet 5 has an electromagnetic wave shielding function. Is realized.

  When manufacturing the electromagnetic wave shielding molded product 1 according to this modification, the conductive sheet 5 made into a three-dimensional shape by the same operation as in the above embodiment is set on the convex molding surface 107 of the first molding die 109. At that time, the resin layer 9 of the conductive sheet 5 is brought into contact with the convex mold forming surface 107 and the mold 105 is closed, and the metal thin film 11 of the conductive sheet 5 is melted into the cavity 117 exposed. By injecting the resin R, the molded product body 3 is formed on the metal thin film 11 side of the conductive sheet 5.

  According to this modification, the conductive sheet 5 has a structure in which the metal thin film 11 and the resin layer 9 are laminated, and the metal thin film 11 realizes an electromagnetic wave shielding function on the conductive sheet 5. Thus, the electromagnetic wave shielding performance of the conductive sheet 5 can be improved as compared with the case where the conductive sheet 5 has an electromagnetic wave shielding function.

  Further, according to this modification, the molded product main body 3 is formed by injection molding of the molten resin R on the metal thin film 11 side of the conductive sheet 5 so that the metal thin film 11 is formed of the resin layer 9 and the resin molded product main body. 3, the resin layer 9 and the molded product body 3 function as a protective layer, so that the metal thin film 11 can be prevented from being scratched or rusted.

  In the above embodiment and its modifications 1 and 2, the electromagnetic wave shielding molded product 1 has been described by taking as an example a structure in which the conductive sheet 5 is integrally laminated on the inner surface of the molded product body 3, but the present invention is Not limited to this, the electromagnetic wave shielding molded product 1 may have a structure in which the conductive sheet 5 is integrally laminated on the outer surface of the molded product body 3.

  The electromagnetic wave shielding molded product 1 having this structure can be manufactured using, for example, the mold 105 in which the vacuum hole 108 is provided in the second mold 115 and the gate 119 is provided in the first mold 109. In order to manufacture the electromagnetic wave shielding molded product 1 in which the conductive sheet 5 is integrally laminated on the outer surface of the molded product main body 3 using the molding die 105, first, the conductive material formed into a three-dimensional shape by the same operation as the above embodiment. The conductive sheet 5 is set on the concave molding surface 107 of the second molding die 115, and the conductive sheet 5 is vacuum-sucked and held by the vacuum holes 108 opened in the concave molding surface 113. Next, the second molding die 115 on which the conductive sheet 5 is set and the first molding die 109 having the convex mold molding surface 107 are closed, and the conductive sheet held on the concave mold molding surface 107. A cavity 117 is formed between the first mold 109 and the convex mold surface 107 of the first mold 109. Then, with the mold 105 closed in this manner, the molten resin R is injected and filled into the cavity 117 from the gate 119 opened in the convex mold forming surface 107, and the molten resin R is cooled and solidified. After the molded product main body 3 is molded, the molded product main body 3 in which the conductive sheet 5 is integrally laminated on the outer surface is removed from the mold, and the gate residual solid is cut out to obtain the electromagnetic wave shielding molded product 1.

  Thus, when manufacturing the electromagnetic wave shielding molded product 1 in which the conductive sheet 5 is integrally laminated on the outer surface of the molded product body 3, the mesh layer 7 is replaced with the resin molded product body 3 and the resin layer 9. From the viewpoint of preventing the mesh layer 7 from being scratched and generating rust, the mesh layer 7 of the conductive sheet 5 is more than the resin layer 9 when forming the conductive sheet 5 into a three-dimensional shape. The folding portion 5c is provided so as to be positioned on the inner side, and when the conductive sheet 5 is set on the concave mold molding surface 113, the resin layer 9 of the conductive sheet 5 is positioned on the concave mold molding surface 113 side. It is preferable to mold the molded product main body 3 on the mesh layer 7 side of the conductive sheet 5 by bringing the molten resin R into contact with the mold forming surface 113 and injecting the molten resin R into the cavity 117 where the mesh layer 7 is exposed.

  Further, in FIG. 4 referred to in the above-described embodiment, the conductive sheet 5 in a state where each of the raised surface portions 5b stands upright with respect to the bottom surface portion 5a is illustrated. The seat 5 may be formed in a three-dimensional shape in a state where each of the upright surface portions 5b is slightly inclined outward with respect to the bottom surface portion 5a.

  Furthermore, in the said embodiment, although planar electroconductive sheet 5 'was made into the three-dimensional shape by providing the folding part 5c without using an adhesive agent, when the shape of the folding part 5c is easy to collapse, for example, When the conductive sheet 5 ′ has a three-dimensional shape, the superposed portion in the folded portion 5 c may be adhered with an adhesive.

  In addition, in the said embodiment, although the electromagnetic wave shielding molded product 1 formed in the rectangular parallelepiped box shape by which one side was open | released was mentioned as an example, this invention is not limited to this, A bottomed cylindrical shape and one side are The present invention can also be applied to electromagnetic wave shielding molded articles having various three-dimensional shapes such as other released polyhedral box shapes.

  As described above, the present invention is useful for a method for manufacturing an electromagnetic wave shielding molded product, and is particularly suitable for a method for manufacturing an electromagnetic wave shielding molded product that is required to have excellent electromagnetic wave shielding performance.

R Molten resin 1 Electromagnetic wave shielding molded product 3 Molded product main body 5 Solid conductive sheet 5 ′ Planar conductive sheet 5a Bottom surface portion 5b Elevated surface portion 5c Folding portion 7 Mesh layer 9 Resin layer 11 Metal thin film 105 Mold 107 Convex mold surface 117 cavity

Claims (4)

A method for producing an electromagnetic wave shielding molded article (1) in which a conductive sheet (5 ′) having an electromagnetic wave shielding function is integrally laminated on the surface of a molded article body (3) having a three-dimensional shape,
As the conductive sheet (5 ′), a conductive sheet (5 ′) having one surface formed by the resin layer (9) is prepared,
By providing the conductive sheet (5 ′) with a fold (5c), the conductive sheet (5 ′) is raised from the bottom surface (5a) and the bottom surface (5a). a three-dimensional shape having bets,
Set the three-dimensional conductive sheet (5) on the molding surface (107) of the molding die (105),
Thereafter, by injecting molten resin (R) into the cavity (117) in a state where the mold (105) is closed, the molded product body is molded,
When the molded product body (3) is molded, the resin layer (9) is melted at the temperature of the molten resin (R), and the folded portion (5c) is formed by the injection pressure of the molten resin (R). The electromagnetic wave shielding molded article (1) in which the folded portion (5c) and the raised surface portion (5b) are bonded to each other with the resin layer (9) in close contact with the raised surface portion (5b). A method for producing an electromagnetic wave shielding molded product. In the manufacturing method of the electromagnetic wave shielding molded article according to claim 1,
It said conductive sheet (5) has a structure in which the mesh layer (7) and the resin layer composed of at least one (9) and are stacked among the organic fibers coated with metal fibers and metal,
When the three-dimensional conductive sheet (5) is set on the molding surface (107) of the molding die (105), the resin layer (9) side of the conductive sheet (5) is placed on the molding surface ( 107) and injecting the molten resin (R) into the cavity (117) where the mesh layer (7) of the conductive sheet (5) is exposed with the mold (105) closed. The method for producing an electromagnetic wave shielding molded product, comprising molding the molded product body (3) on the mesh layer (7) side of the conductive sheet (5). In the manufacturing method of the electromagnetic wave shielding molded article according to claim 1,
Said conductive sheet (5), the resin layer and the metal thin film (11) (9) and has a stacked structure,
When the three-dimensional conductive sheet (5) is set on the molding surface (107) of the molding die (105), the resin layer (9) side of the conductive sheet (5) is placed on the molding surface ( 107) and injecting the molten resin (R) into the cavity (117) where the metal thin film (11) of the conductive sheet (5) is exposed with the mold (105) closed. The method for producing an electromagnetic wave shielding molded product, comprising molding the molded product body (3) on the metal thin film (11) side of the conductive sheet (5). In the manufacturing method of the electromagnetic wave shielding molded article according to claim 2,
The method for producing an electromagnetic wave shielding molded article, wherein the resin layer (9) is made of the same resin as the molten resin (R) injected into the cavity (117) of the mold (105).

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