JP5952526B2 - ワーク搬送システム - Google Patents
ワーク搬送システム Download PDFInfo
- Publication number
- JP5952526B2 JP5952526B2 JP2011022405A JP2011022405A JP5952526B2 JP 5952526 B2 JP5952526 B2 JP 5952526B2 JP 2011022405 A JP2011022405 A JP 2011022405A JP 2011022405 A JP2011022405 A JP 2011022405A JP 5952526 B2 JP5952526 B2 JP 5952526B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- workpiece
- frame member
- frame structure
- transfer chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
O1,O2,O3 垂直軸
1 搬送室
2 ロードポート
3 ワーク処理室
4 ワーク搬送装置
5 連結手段
6 床面
7 結合手段
1A フレーム構造体
1B カバー体
1C 弾性部材
11 第1フレーム部材
11a 切欠き
11b 開口
12 第2フレーム部材
12a 開口
121 縦フレーム
122 横フレーム
13 リブ
13a 端面
21 カセット(容器)
40 固定ベース
41 昇降ベース
42 下段アーム
43 上段アーム
44 ハンド
51 フレーム体
52 制振機構
61 通気床
61a 貫通孔
62 ダクト
63 支持部
71 引張ボルト
72 圧縮ボルト
Claims (3)
- ワーク搬送装置が配置される搬送室と、この搬送室に隣接して設けられ、ワーク収納用の容器が載置されるロードポートと、を備えたワーク搬送システムであって、
上記搬送室は、鋼材により構成されるフレーム構造体と、上記フレーム構造体の周縁部に取り付けられ、上記フレーム構造体と協働して内部空間を形成するカバー体と、を含み、
上記フレーム構造体は、床面に設置され、上記ワーク搬送装置が載置される第1フレーム部材と、この第1フレーム部材に対して起立状に設けられ、上記ロードポートを支持する第2フレーム部材と、を備え、
上記第2フレーム部材の上端部と、上記第1フレーム部材における上記第2フレーム部材から離間する端部とは、連結手段により連結され、かつ、当該連結手段は、上方に向かうにつれて上記第2フレーム部材に近づくように斜めに延びるフレーム体と、上記ワーク搬送装置から伝わる振動を抑制するための制振機構と、を備え、
上記カバー体は、上記フレーム構造体よりも軽量な材料で構成され、かつ、上記フレーム構造体における上記第2フレーム部材の周縁部に対して弾性部材を介して取り付けられており、
上記第2フレーム部材は、一対の縦フレームと、当該一対の縦フレームの上端どうしをつなぐ横フレームを有する矩形枠状とされており、
上記弾性部材は、上記一対の縦フレームおよび上記横フレームに沿って設けられ、
上記フレーム体は、水平面に対する傾斜角度が相対的に大きい下側部分と、上記下側部分よりも上方に位置し、水平面に対する傾斜角度が相対的に小さい上側部分と、を有し、上記下側部分と上記上側部分との間に上記制振機構が介在することを特徴とする、ワーク搬送システム。 - 上記第1フレーム部材と上記第2フレーム部材とは、リブを介して接合されている、請求項1に記載のワーク搬送システム。
- 上記第1フレーム部材は、床面を構成するコンクリート層に対して結合手段により固定される、請求項1または2に記載のワーク搬送システム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022405A JP5952526B2 (ja) | 2011-02-04 | 2011-02-04 | ワーク搬送システム |
US13/352,847 US20120201633A1 (en) | 2011-02-04 | 2012-01-18 | Workpiece transfer system and frame structure for transfer chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022405A JP5952526B2 (ja) | 2011-02-04 | 2011-02-04 | ワーク搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012164732A JP2012164732A (ja) | 2012-08-30 |
JP5952526B2 true JP5952526B2 (ja) | 2016-07-13 |
Family
ID=46600731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011022405A Expired - Fee Related JP5952526B2 (ja) | 2011-02-04 | 2011-02-04 | ワーク搬送システム |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120201633A1 (ja) |
JP (1) | JP5952526B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015186235A (ja) | 2014-03-26 | 2015-10-22 | ソニー株式会社 | イメージセンサ、および電子装置 |
JP5682721B1 (ja) * | 2014-03-31 | 2015-03-11 | ソニー株式会社 | 産業用ロボットおよびその架台ユニット |
CN112103206B (zh) * | 2019-06-17 | 2024-09-27 | 上海微电子装备(集团)股份有限公司 | 工件传输系统、工件传输方法及激光退火设备 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US3049680A (en) * | 1959-12-28 | 1962-08-14 | Litton Industries Inc | Microwave load isolators |
US4731915A (en) * | 1987-02-26 | 1988-03-22 | Holder Royce Z | Machinery support and method |
US5165651A (en) * | 1989-12-11 | 1992-11-24 | Apt, Inc. | Machine foundation and method for preparing or repairing a machine foundation |
JPH06219355A (ja) * | 1993-01-21 | 1994-08-09 | Miki Seisakusho:Kk | 自転車駐輪機 |
US5546873A (en) * | 1994-10-28 | 1996-08-20 | Steelcase Inc. | Furniture worksurface unit and method |
JP3332140B2 (ja) * | 1996-10-09 | 2002-10-07 | 有限会社新技研 | 構造物の制振方法 |
US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
WO2000055074A1 (en) * | 1999-03-18 | 2000-09-21 | Pri Automation, Inc. | Person-guided vehicle |
JP2001049781A (ja) * | 1999-08-10 | 2001-02-20 | Sekisui Chem Co Ltd | 床構造 |
US6520727B1 (en) * | 2000-04-12 | 2003-02-18 | Asyt Technologies, Inc. | Modular sorter |
US20020162938A1 (en) * | 2000-11-03 | 2002-11-07 | Applied Materials, Inc. | Facilities connection bucket for pre-facilitation of wafer fabrication equipment |
JP2003051451A (ja) * | 2001-08-03 | 2003-02-21 | Hitachi Kokusai Electric Inc | 基板処理装置 |
US7100340B2 (en) * | 2001-08-31 | 2006-09-05 | Asyst Technologies, Inc. | Unified frame for semiconductor material handling system |
US6827546B2 (en) * | 2002-08-19 | 2004-12-07 | Brooks-Pri Automation, Inc. | Modular frame for a wafer fabrication system |
US7467916B2 (en) * | 2005-03-08 | 2008-12-23 | Asm Japan K.K. | Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same |
JP4383419B2 (ja) * | 2006-03-10 | 2009-12-16 | 古河電気工業株式会社 | 骨格ブロック |
JP4606388B2 (ja) * | 2006-06-12 | 2011-01-05 | 川崎重工業株式会社 | 基板移載装置の搬送系ユニット |
US7738236B2 (en) * | 2007-01-12 | 2010-06-15 | The Boeing Company | Light weight system for lightning protection of nonconductive aircraft panels |
JP4896899B2 (ja) * | 2007-01-31 | 2012-03-14 | 東京エレクトロン株式会社 | 基板処理装置およびパーティクル付着防止方法 |
JP4585018B2 (ja) * | 2008-08-04 | 2010-11-24 | 住友重機械工業株式会社 | ステージ装置 |
JP5490395B2 (ja) * | 2008-10-07 | 2014-05-14 | 大日本スクリーン製造株式会社 | 基板処理装置及びその製造方法 |
-
2011
- 2011-02-04 JP JP2011022405A patent/JP5952526B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-18 US US13/352,847 patent/US20120201633A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2012164732A (ja) | 2012-08-30 |
US20120201633A1 (en) | 2012-08-09 |
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