JP5807757B2 - Work collection apparatus and method - Google Patents

Description

  The present invention relates to a workpiece collection apparatus and method.

  Small chip devices such as SAW filters and discrete semiconductors require a long time for processing one workpiece, and the frequency of workpiece replacement is low. For this reason, a manual dicing apparatus is used in which workpieces are manually carried in and out and only cutting is performed automatically.

  Patent Document 1 discloses a dicing apparatus in which an operator manually supplies and collects a work to and from a work table.

  On the other hand, Patent Documents 2 and 3 disclose dicing apparatuses that automatically supply and collect workpieces to and from a work table using a robot arm.

Japanese Patent Laid-Open No. 08-191731 JP 2000-173953 A JP-A 63-288642

  As in Patent Document 1, in a dicing apparatus that manually supplies and collects a workpiece to and from the work table, even if the machining is completed, the next machining cannot be started unless the operator replaces the workpiece. There is a drawback.

  In addition, when one operator is operating a plurality of dicing machines, there is a drawback in that if the processing end timing of each dicing machine overlaps, a waiting time for exchanging workpieces occurs and the operating efficiency decreases. is there.

  On the other hand, as in Patent Documents 2 and 3, the dicing apparatus that automatically supplies and collects the work to and from the work table requires a part for storing the work before processing and a part for storing the work after processing. There is a problem that the apparatus becomes larger. In particular, the conventional dicing apparatus has a disadvantage that a large storage space is required because the workpiece is stored in a horizontal state.

Further, in the conventional dicing apparatus, since the work surface of the workpiece is exposed and stored, there is a drawback that water droplets, mist, machining chips (sludge) and the like generated during the processing adhere to the processing surface. If such water droplets or sludge adheres to the processed surface, there is a problem that alignment errors are likely to occur.
In the conventional dicing apparatus, as shown in FIG. 26, the work W is removed by moving the frame in parallel upward, but the work W is also bent by the bending of the dicing film T. Is finally separated from the work table 224. Therefore, the electric charge concentrates in the approximate center of the work W that is in contact with the work table 224 until the end, causing damage to the work W.

This invention is made | formed in view of such a situation, and it aims at providing the workpiece collection | recovery apparatus and method which can prevent damage to a workpiece | work .

  Means for solving the problems are as follows.

  [1] A first aspect of the dicing apparatus is a dicing apparatus for cutting a work mounted on an annular frame via a dicing film. In the dicing apparatus, the work table on which the work is placed horizontally, and the work table Cutting means for cutting the mounted workpiece, a workpiece supply standby unit for stocking the workpiece before processing in an upright state with the surface to which the dicing film is attached facing the work table side, and The work supply means for supplying the work stocked in the work supply standby section to the work table, and the surface after the dicing film is pasted toward the work table side, and the work piece after processing in an upright state. A workpiece collection standby unit for stocking the workpiece, and the workpiece placed on the workpiece table is the workpiece A workpiece collection means for collecting the yield standby unit, characterized by comprising a.

  According to this aspect, the workpiece before processing is stocked in the workpiece supply standby section, and is supplied (placed) on the workpiece table by the workpiece supply means. Further, the processed workpiece is recovered from the work table by the workpiece recovery means and is stored in the workpiece recovery standby unit. As a result, the work replacement work can be automated and the operating efficiency can be improved. In addition, since the workpiece supply standby unit and the workpiece recovery standby unit stock the workpieces in an upright state, the storage space for the workpieces can be minimized. Thereby, the apparatus can be made compact. In addition, since the workpiece supply standby unit and the workpiece recovery standby unit store the workpiece with the surface on which the dicing film is attached facing the work table, it is possible to prevent sludge and the like from adhering to the processed surface of the workpiece. it can. As a result, occurrence of misalignment can be effectively prevented.

  [2] A second aspect of the dicing apparatus is the dicing apparatus according to the first aspect, further comprising work table moving means for moving the work table between a machining position and an exchange position, wherein the cutting means is Cutting the workpiece placed on the work table at the processing position, the workpiece supply means supplying the workpiece to the work table at the replacement position, and the workpiece recovery means at the replacement position. The work is collected from the work table.

  According to this aspect, the place where the workpiece is processed is separated from the place where the workpiece is exchanged. Thereby, the freedom degree of the layout of a workpiece | work supply standby part and a workpiece | work exchange standby part can be improved. Moreover, adhesion of sludge etc. can be prevented more effectively.

  [3] A third aspect of the dicing apparatus is that, in the first dicing apparatus, the workpiece supply standby unit and the workpiece recovery standby unit are arranged symmetrically with the work table positioned at the replacement position in between. It is characterized by that.

  According to this aspect, the workpiece supply standby unit and the workpiece recovery standby unit are arranged symmetrically across the work table located at the replacement position. Accordingly, it is possible to efficiently supply the work from the work supply standby unit to the work table and to collect the work from the work table to the work collection standby unit, and to reduce the size of the apparatus.

  [4] A fourth aspect of the dicing apparatus according to the third aspect is the dicing apparatus according to the third aspect, wherein the work supply means grips the work stocked in the work supply standby unit, and places the work on the work table. By rotating about a rotation axis parallel to the surface, the work is moved so as to be tilted toward the work table, and the work is placed on the work table.

  According to this aspect, the work stocked while standing in the work supply standby section is moved so as to be tilted toward the work table, and the work is supplied (placed) on the work table. Thereby, a workpiece | work can be supplied efficiently.

  [5] A fifth aspect of the dicing apparatus is the dicing apparatus according to the third or fourth aspect, wherein the work collection means grips the work placed on the work table and places the work on the work table. The workpiece is moved so as to be raised toward the workpiece collection standby unit by rotating about a rotation axis parallel to the placement surface, and the workpiece is collected in the workpiece collection standby unit. To do.

  According to this aspect, the work placed on the work table is moved so as to be raised toward the work collection standby unit, and the work is collected in the work collection standby unit. Thereby, a workpiece | work can be stood up simultaneously with collection | recovery and a workpiece | work can be collect | recovered efficiently. Further, since the workpiece is erected while gradually tilting, the cutting water or the like adhering to the surface can be dropped by its own weight toward the lower side in the tilt direction. Thereby, a workpiece | work can be collect | recovered, without dropping a water drop on a work table. Further, since the workpiece is erected while being inclined gradually, it is gradually peeled off from the end of the workpiece table, so that electrostatic damage to the workpiece can be prevented.

  [6] A sixth aspect of the dicing apparatus is the dicing apparatus according to the fifth aspect, wherein the dicing apparatus is detachably attached to the frame on which the work is mounted, and the work is erected on a horizontal surface. A workpiece holding member that can be placed on the workpiece, and the workpiece is stocked in a state in which the workpiece holding member is erected on the workpiece supply standby unit and in a state of being erected in the workpiece recovery standby unit. It is characterized by that.

  According to this aspect, by attaching the work holding member to the frame, the work can be placed upright on a horizontal surface. Thereby, a workpiece | work can be stocked in the state which stood up by the workpiece | work supply standby part and the workpiece | work collection standby part by simple structure.

  [7] According to a seventh aspect of the dicing apparatus, in the dicing apparatus according to the sixth aspect, the work holding member is configured by a pair of prismatic bars attached to both ends of the frame. A groove for holding the frame is formed on the inner surface, and an installation surface is formed on the outer surface.

  According to this aspect, the work holding member is composed of a pair of prismatic rods. Each bar is formed with a groove for holding the frame on the inner side surface, and the edge of the frame is fitted into the groove to be attached to the frame. In addition, each bar has an installation surface on the outer surface, and is placed on a horizontal surface with the mounting surface down, thereby holding the workpiece in a standing state on the horizontal surface. . As a result, the frame can be easily attached to and detached from the frame, and the workpiece can be easily held upright.

  [8] An eighth aspect of the dicing apparatus is the dicing apparatus according to any one of the first to seventh aspects, in which a cleaning liquid is sprayed onto the work surface of the workpiece stocked while standing on the workpiece recovery standby portion to perform cleaning. A cleaning means is further provided.

  According to this aspect, the processed workpiece collected in the workpiece collection standby unit can be washed. The workpiece is cleaned by spraying the cleaning liquid onto the processing surface, but since the work is standing, the sprayed cleaning liquid can be dropped by its own weight. Thereby, it can wash | clean efficiently. Further, since the work stands up with the surface on which the dicing film is attached facing the work table, the work can be cleaned without applying a cleaning solution to the work table.

  [9] According to a ninth aspect of the dicing apparatus, in the dicing apparatus according to the first to eighth aspects, a plurality of the workpieces are stocked in the workpiece supply standby unit, and the workpiece recovery standby unit includes A plurality of the workpieces are stocked.

  According to this aspect, a plurality of workpieces can be stocked in the workpiece supply standby unit, and a plurality of workpieces can be stocked in the workpiece collection standby unit. Thereby, a workpiece | work can be processed continuously. Even when a plurality of workpieces are stocked, each workpiece is stocked in an upright state, so that it can be stocked with a small installation space.

  [10] A first aspect of the dicing method is a dicing method in which a work mounted on an annular frame via a dicing film is placed on a work table, and the dicing film is attached by the cutting means. A step of waiting in a state where the workpiece before machining is raised with the surface to be directed toward the work table, a step of supplying the workpiece that has been in a standing state to the work table, and a supply to the work table A step of cutting the workpiece by the cutting means, a state in which the workpiece after the processing is collected from the work table, and the surface on which the dicing film is adhered is raised toward the work table side. And waiting for the workpiece.

  According to this aspect, the workpiece before processing is stocked in the workpiece supply standby section, and is supplied (placed) on the workpiece table by the workpiece supply means. Further, the processed workpiece is recovered from the work table by the workpiece recovery means and is stored in the workpiece recovery standby unit. As a result, the work replacement work can be automated and the operating efficiency can be improved. In addition, since the workpiece supply standby unit and the workpiece recovery standby unit stock the workpieces in an upright state, the storage space for the workpieces can be minimized. Thereby, the apparatus can be made compact. In addition, since the workpiece supply standby unit and the workpiece recovery standby unit store the workpiece with the surface on which the dicing film is attached facing the work table, it is possible to prevent sludge and the like from adhering to the processed surface of the workpiece. it can. As a result, occurrence of misalignment can be effectively prevented.

  [11] A dicing method according to a second aspect of the dicing method according to the first aspect further includes a step of injecting a cleaning liquid onto the processed workpiece that has been waiting in an upright state to perform cleaning. To do.

  According to this aspect, the processed workpiece collected in the workpiece collection standby unit can be washed. The workpiece is cleaned by spraying the cleaning liquid onto the processing surface, but since the work is standing, the sprayed cleaning liquid can be dropped by its own weight. Thereby, it can wash | clean efficiently. Further, since the work stands up with the surface on which the dicing film is attached facing the work table, the work can be cleaned without applying a cleaning solution to the work table.

According to the present invention, it is possible to prevent the workpiece from being damaged.

The top view which shows schematic structure of 1st Embodiment of the dicing apparatus with which this invention was applied . The front view which shows schematic structure of 1st Embodiment of the dicing apparatus with which this invention was applied . Plan view of workpiece supply device Front view of workpiece supply device Illustration of workpiece supply operation Illustration of workpiece recovery operation The front view which shows the structure of the principal part of 2nd Embodiment of the dicing apparatus with which this invention was applied . The front view which shows the structure of the principal part of 3rd Embodiment of the dicing apparatus with which this invention was applied . Top view of jig The front view which shows the structure of the principal part of 4th Embodiment of the dicing apparatus with which this invention was applied . The front view which shows the structure of the principal part of 5th Embodiment of the dicing apparatus with which this invention was applied . The front view which shows the structure of the principal part of 6th Embodiment of the dicing apparatus with which this invention was applied . The top view which shows the structure of the principal part of 6th Embodiment of the dicing apparatus with which this invention was applied . The front view which shows schematic structure of the external appearance of 7th Embodiment of the dicing apparatus with which this invention was applied . The perspective view which shows the external appearance of the dicing apparatus to which this invention was applied Schematic diagram of the processing part of the dicing machine Schematic diagram of the processing part of the dicing machine Schematic diagram of the processing part of the dicing machine Partial sectional view of the processing part of the dicing machine Partial enlarged view of the processing part of the dicing machine Schematic diagram of cleaning device and drainage device for dicing machine The figure explaining the state of the workpiece | work W when removing the processed workpiece | work of a dicing apparatus The figure explaining the state of the workpiece | work W when removing the processed workpiece | work of a dicing apparatus Schematic of a modification of the processing part of the dicing machine Schematic of a modification of the processing part of the dicing machine The figure explaining the mode of the workpiece | work W when removing the processed workpiece | work of the conventional dicing apparatus. The figure explaining the mode of the workpiece | work W when removing the processed workpiece | work of the conventional dicing apparatus.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
[Constitution]
FIG. 1 is a plan view showing a schematic configuration of a first embodiment of a dicing apparatus to which the present invention is applied . FIG. 2 is a front view showing a schematic configuration of the first embodiment of the dicing apparatus to which the present invention is applied .

  The dicing apparatus 10 according to the present embodiment processes the workpiece W mounted on the frame F. The workpiece W is, for example, a semiconductor wafer.

  The dicing apparatus 10 according to the present embodiment mainly includes a work table 20 on which a workpiece W is placed, a processing unit 30 that processes the workpiece W, a workpiece supply standby unit 40 that stocks the workpiece W before processing, and a processing A workpiece recovery standby unit 50 that stocks the subsequent workpiece W, a workpiece supply device 60 that supplies the workpiece W stocked in the workpiece supply standby unit 40 to the workpiece table 20, and a workpiece recovery of the processed workpiece W from the workpiece table 20. The workpiece collection device 70 collects in the standby unit 50 and a controller (not shown) that controls the overall operation.

  The frame F on which the workpiece W is mounted is formed in an annular shape by a thin plate material. On the outer periphery of the frame F, straight portions are formed on the front, rear, left and right. The front and rear straight portions are formed in parallel to each other. Further, the left and right straight portions are formed in parallel to each other. The front and rear straight portions and the left and right straight portions are formed orthogonal to each other. Further, a notch is formed in the straight line portion on the front side. The inner periphery of the frame F is formed with a circle.

  A dicing film T is attached inside the frame F. The dicing film T has an adhesive surface formed on one surface.

  The workpiece W is mounted on the frame F by being placed on the adhesive surface of the dicing film T.

  Note that the work W is mounted on the frame F by attaching the back surface to the dicing film T when the processing surface (surface to which the blade is applied during processing) is the front surface.

  The work table 20 is formed in a disk shape. The work placement surface 21 of the work table 20 is installed horizontally.

  The workpiece placement surface 21 of the workpiece table 20 includes a workpiece placement portion 21A on which a portion of the workpiece W of the workpiece W mounted on the frame F is placed, and a frame placement portion 21B on which the portion of the frame F is placed. It consists of. The workpiece placement portion 21A is formed in a disc shape, and the frame placement portion 21B is formed in a ring shape on the outer periphery of the workpiece placement portion 21A. The workpiece placement portion 21A is formed higher than the frame placement portion 21B by the thickness of the frame F.

  A plurality of suction holes (not shown) are formed in the workpiece placement surface 21. Air is sucked from the suction holes by a suction mechanism (not shown). The work placed on the work table 20 is sucked and held on the work table 20 by sucking air from the suction holes.

  A work table drive motor 22 is disposed below the work table 20. The work table 20 is connected to the output shaft 22A of the work table drive motor 22. The output shaft 22A of the work table drive motor 22 is disposed vertically. The output shaft 22 </ b> A of the work table drive motor 22 is connected to the center of the lower surface of the work table 20. The work table 20 rotates by driving the work table drive motor 22.

  The work table drive motor 22 is installed on the X-axis table 23. The X axis table 23 is slidably provided on a pair of guide rails 24. The pair of guide rails 24 are laid horizontally on the main body frame 12 of the dicing apparatus 10. The X-axis table 23 is driven by a feed mechanism (for example, a feed screw mechanism) (not shown) and reciprocates on the guide rail 24.

  The moving direction of the work table 20 is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction. In addition, an axis orthogonal to the plane (horizontal plane) formed by the X axis and the Y axis is defined as the Z axis.

  The work table 20 reciprocates between the machining position and the exchange position by moving the X-axis table 23 in the X-axis direction by a feed mechanism (not shown). Moreover, it rotates by driving the work table drive motor 22.

  The processing unit 30 processes the workpiece W moved to the processing position by the work table 20. The processing unit 30 mainly includes a pair of spindle units 31A and 31B, a pair of imaging units 32A and 32B, and a spindle unit feed mechanism (not shown).

  The pair of spindle units 31A and 31B is installed above the work table 20 located at the machining position. Each spindle unit 31A, 31B is arranged on a straight line parallel to the Y-axis so that the main shafts 31a, 31b provided at the tips face each other.

  Each spindle unit 31A, 31B incorporates a motor (not shown), and is driven by this motor to rotate the main shafts 31a, 31b.

  Blades 33A and 33B are attached to the main shafts 31a and 31b. The blades 33A and 33B are formed in a disc shape, and a cutting blade is formed on the outer periphery thereof.

  The imaging units 32A and 32B are attached to the spindle units 31A and 31B via brackets 34A and 34B. Each imaging unit 32A, 32B images the surface of the workpiece W cut by each blade 33A, 33B. Based on the images picked up by the image pickup units 32A and 32B, alignment processing, evaluation of the processing state, and the like are performed.

  A spindle unit moving feed mechanism (not shown) reciprocates each spindle unit 31A, 31B in a direction (Y-axis direction) perpendicular to the moving direction (X-axis direction) of the work table 20, and each spindle unit 31A, 31B is moved back and forth in a direction orthogonal to the work placement surface 21 (XY plane (horizontal plane)) of the work table 20.

  Each spindle unit 31A, 31B is index fed by moving in the Y-axis direction. Further, each spindle unit 31A, 31B moves in the Z-axis direction, thereby moving forward and backward with respect to the workpiece W placed on the work table 20, and can bring the blades 33A, 33B into contact with the workpiece W. .

  The workpiece W is cut when the rotating blades 33A and 33B are brought into contact with the surface. Then, the workpiece W is cut or grooved along the planned cutting line by bringing the blades 33A and 33B into contact with the predetermined cutting planned line (street), and divided into chips.

  The workpiece supply standby unit 40 stocks the workpiece W before processing. The workpiece collection standby unit 50 stocks the processed workpiece W. The workpiece supply standby unit 40 and the workpiece recovery standby unit 50 are arranged on the left and right sides with the workpiece table 20 positioned at the exchange position (in FIG. 2, the workpiece supply standby unit 40 is arranged on the left side, and the workpiece on the right side. A collection standby unit 50 is disposed).

  In the workpiece supply standby unit 40 and the workpiece recovery standby unit 50, the workpiece W is stocked in an upright state.

  At this time, in the workpiece supply standby unit 40, the workpiece W is stocked in a posture standing upright with respect to the workpiece placement surface 21 (horizontal plane) of the workpiece table 20 (the back surface of the workpiece W is in contact with the workpiece placement surface 21. Stocked in parallel posture.) The workpiece W is stocked in a posture parallel to the moving direction (X-axis direction) of the work table 20 (the back surface of the workpiece W is stocked in a posture parallel to the XZ plane). Further, the workpiece W is stocked in a posture in which the surface (back surface) to which the dicing film T is attached is directed to the work table side. In this way, when the work W is stocked in an upright position with the surface (back surface) to which the dicing film T is attached facing the work table, the mist generated in the processing section 30 is processed on the work surface (front surface). ) Can be prevented.

  Similarly, in the workpiece collection standby unit 50, the workpiece W is stocked in a posture that stands vertically with respect to the workpiece placement surface 21 (horizontal plane) of the workpiece table 20 (the back surface of the workpiece W is in contact with the workpiece placement surface 21. Stocked in parallel posture.) The workpiece W is stocked in a posture parallel to the moving direction (X-axis direction) of the work table 20 (the back surface of the workpiece W is stocked in a posture parallel to the XZ plane). Further, the workpiece W is stocked in a posture in which the surface (back surface) to which the dicing film T is attached is directed to the work table side. In this way, when the work W is stocked in an upright position with the surface (back surface) to which the dicing film T is attached facing the work table, the mist generated in the processing section 30 is processed on the work surface (front surface). ) Can be prevented.

  The workpiece supply device 60 supplies the workpiece W before processing stocked in the workpiece supply standby unit 40 to the workpiece table 20.

  FIG. 3 is a plan view of the workpiece supply apparatus. FIG. 4 is a front view of the workpiece supply device.

  The workpiece supply device 60 mainly includes a workpiece supply motor 61, a workpiece supply arm 62, and a workpiece supply gripper 63.

  The work supply motor 61 is attached to the main body frame 12 of the dicing apparatus 10. The output shaft 61A of the work supply motor 61 is installed in parallel with the moving direction (X-axis direction) of the work table 20.

  The workpiece supply arm 62 is attached to the output shaft 61 </ b> A of the workpiece supply motor 61. At this time, the workpiece supply arm 62 is attached orthogonal to the output shaft 61 </ b> A of the workpiece supply motor 61. The work supply arm 62 is composed of a cylinder, and extends and contracts in a direction perpendicular to the output shaft 61A of the work supply motor 61 (extends and contracts in a plane parallel to the ZY plane).

  The workpiece supply gripper 63 is attached to the tip of the workpiece supply arm 62. The workpiece supply gripper 63 is provided with a pair of gripping claws 63A and 63A that can be freely opened and closed. The pair of gripping claws 63A, 63A are formed in a plate shape and are disposed in parallel with the output shaft 61A of the work supply motor 61 (disposed in parallel with the moving direction (X-axis direction) of the work table 20). . The pair of gripping claws 63A, 63A are driven by a driving means (not shown) to translate in a direction away from each other and a direction approaching each other, and open and close the interval.

  A positioning plate 63B is disposed between the pair of gripping claws 63A and 63A. The positioning plate 63B is formed in a prismatic shape, and a flat contact surface 63b is formed at the tip. The contact surface 63b is formed in parallel with the output shaft 61A of the work supply motor 61 (formed in parallel with the movement direction (X-axis direction) of the work table 20).

  The workpiece supply device 60 is configured as described above. The operation of the workpiece supply device 60 is as follows.

  When the workpiece supply motor 61 is driven, the workpiece supply arm 62 swings. The workpiece supply arm 62 is driven by the workpiece supply motor 61 to move between a predetermined “pre-processing workpiece receiving position” and “pre-processing workpiece delivery position”.

  Further, when the workpiece supply arm 62 composed of a cylinder is expanded and contracted, the workpiece supply gripper 63 moves back and forth between a predetermined “gripping position” and “retracted position”.

  Further, when the workpiece supply gripper 63 is driven, the gripping claws 63A and 63A of the workpiece supply gripper 63 are opened and closed.

  In FIG. 4, the broken line indicates a state in which the workpiece supply arm 62 is located at the workpiece receiving position before processing. A solid line shows a state in which the workpiece supply arm 62 is located at the workpiece delivery position before processing. As shown in the figure, when the workpiece supply arm 62 is positioned at the workpiece receiving position before processing, the workpiece supply arm 62 is in a vertically standing posture. Further, when the workpiece supply arm 62 is located at the workpiece transfer position before processing, the workpiece supply arm 62 is in a horizontally tilted posture.

  When the workpiece supply arm 62 is positioned at the workpiece receiving position before processing, the workpiece supply gripper 63 is positioned in the workpiece supply standby unit 40. The workpiece W is stocked in the workpiece supply standby unit 40 by being gripped by the workpiece supply gripper 63 located in the workpiece supply standby unit 40.

  When the workpiece supply arm 62 is positioned at the workpiece receiving position before processing, the contact surface 63b of the positioning plate 63B provided in the workpiece supply gripper 63 is in a horizontal posture. The workpiece W is gripped by the workpiece supply gripper 63 with a linear portion formed on the outer periphery of the frame F being brought into contact with the contact surface 63b. Thereby, the workpiece W is positioned with respect to the workpiece supply gripper 63. At this time, the workpiece W is gripped by the workpiece supply gripper 63 so that the surface (back surface) to which the dicing film T is attached faces the workpiece table 20 side.

  The workpiece W gripped by the workpiece supply gripper 63 is held in an upright posture with respect to the workpiece mounting surface 21 of the workpiece table 20 (the back surface of the workpiece W is held in a posture parallel to the workpiece mounting surface 21. .) The workpiece W is held in a posture parallel to the moving direction (X-axis direction) of the work table 20. Further, the work W is held in a posture in which the surface (back surface) to which the dicing film T is attached is directed to the work table side.

  When the workpiece supply motor 61 is driven to swing the workpiece supply arm 62 and move the workpiece supply arm 62 to the workpiece delivery position before processing, the workpiece W rotates about the output shaft 61A of the workpiece supply motor 61. To do. At this time, the workpiece W gradually tilts from a vertically standing state and moves so as to fall down. And it stops in a horizontal attitude | position, with the surface where the dicing film T was stuck down.

  When supplying the workpiece W to the workpiece table 20, the workpiece table 20 is positioned at the replacement position, and the workpiece supply arm 62 is moved from the workpiece before receiving machining position to the workpiece delivering position before machining. Thereby, the work W gripped by the work supply gripper 63 is placed on the work placement surface 21 of the work table 20.

  When the workpiece W is placed on the placement surface of the workpiece table 20, the workpiece supply gripper 63 opens the gripping claws 63A and 63A to release the workpiece W. When the grip of the workpiece supply gripper 63 is released, the workpiece supply arm 62 contracts and the workpiece supply gripper 63 moves to the retracted position. As a result, the gripping claws 63A and 63A are detached from the frame F. Thus, the supply of the workpiece W is completed. Thereafter, the workpiece supply motor 61 is driven, and the workpiece supply arm 62 moves to the workpiece receiving position before processing. Furthermore, the workpiece supply arm 62 extends and the workpiece supply gripper 63 moves to the gripping position. This makes it possible to stock workpieces W to be processed next.

  The workpiece collection device 70 collects the processed workpiece W from the workpiece table 20 to the workpiece collection standby unit 50.

  The configuration of the workpiece collection device 70 is the same as that of the workpiece supply device 60 (mainly composed of a workpiece collection motor 71, a workpiece collection arm 72, and a workpiece collection gripper 73). Accordingly, only the operation of the workpiece collection device 70 will be described here.

  When the workpiece collection motor 71 is driven, the workpiece collection arm 72 swings. The workpiece recovery arm 72 is driven by the workpiece recovery motor 71 and moves between a predetermined “post-processing workpiece receiving position” and a “post-processing workpiece delivery position”.

  Further, when the workpiece collection arm 72 formed of a cylinder is expanded and contracted, the workpiece collection gripper 73 moves forward and backward between a predetermined “gripping position” and “retracted position”.

  Further, when the workpiece collection gripper 73 is driven, the gripping claws 73A and 73A of the workpiece collection gripper 73 are opened and closed.

  In FIG. 2, the broken line indicates a state where the workpiece collection arm 72 is positioned at the workpiece receiving position after processing. A solid line indicates a state in which the workpiece collection arm 72 is located at the workpiece delivery position after processing. As shown in the figure, when the workpiece collection arm 72 is positioned at the workpiece delivery position after processing, the workpiece collection arm 72 is in a vertically standing posture. Further, when the workpiece collecting gripper 73 is located at the workpiece receiving position after processing, the workpiece collecting gripper 73 is in a horizontally tilted posture.

  When collecting the workpiece W from the workpiece table 20, first, the workpiece collection arm 72 is contracted, and the workpiece collection gripper 73 is retracted to the retracted position. Next, the workpiece collection motor 71 is driven, and the workpiece collection arm 72 is moved to the workpiece receiving position after processing.

  When the workpiece collection arm 72 is positioned at the workpiece receiving position after processing, the workpiece collection arm 72 assumes a horizontal posture. Further, the workpiece collection gripper 73 is arranged to face the frame F of the workpiece W held on the workpiece table 20. When the workpiece collection arm 72 is extended in this state and the workpiece collection gripper 73 is moved to the gripping position, the frame F of the workpiece W placed on the workpiece table 20 is fitted between the pair of gripping claws 73A and 73A. Include. Further, the linear portion of the frame F contacts the contact surface 73b of the positioning plate 73B. When the workpiece collection gripper 73 is driven in this state and the gripping claws 73A and 73A are closed, the frame F is sandwiched between the gripping claws 73A and 73A, and the workpiece W is gripped by the workpiece collection gripper 73.

  When the frame F of the workpiece W is gripped by the workpiece collection gripper 73, the adsorption of the workpiece W by the workpiece table 20 is released. Thereafter, the workpiece collection motor 71 is driven, and the workpiece collection arm 72 is rotated to the workpiece delivery position after processing. At this time, the work W moves so as to get up while gradually tilting from the state of lying down horizontally. Then, it stops in a vertically standing posture.

  When the workpiece collection arm 72 moves to the workpiece delivery position after processing, the workpiece collection gripper 73 is positioned in the workpiece collection standby unit 50. The workpiece W is held in this state. As a result, the processed workpiece W is stocked in the workpiece collection standby unit 50. At this time, the workpiece W gripped by the workpiece collection gripper 73 is held in an upright posture with respect to the workpiece placement surface 21 of the workpiece table 20 (the back surface of the workpiece W is parallel to the workpiece placement surface 21). Held in posture.) The workpiece W is held in a posture parallel to the moving direction (X-axis direction) of the work table 20. Further, the work W is held in a posture in which the surface (back surface) to which the dicing film T is attached is directed to the work table side.

[Action]
Next, a method for processing the workpiece W by the dicing apparatus 10 according to the present embodiment will be described.

  The operation of the entire apparatus is controlled by a controller (not shown).

  In the initial state, the work table 20 is located at the replacement position. Further, the workpiece supply arm 62 of the workpiece supply device 60 is positioned at the workpiece receiving position before processing, and the workpiece supply gripper 63 is positioned at the gripping position. Further, the workpiece collection arm 72 of the workpiece collection device 70 is located at the workpiece delivery position after processing, and the workpiece collection gripper 73 is located at the gripping position.

  Since the workpiece supply arm 62 is positioned at the workpiece receiving position before processing, the workpiece supply gripper 63 is positioned in the workpiece supply standby unit 40. In addition, the workpiece collection gripper 73 is positioned in the workpiece collection standby unit 50 when the workpiece collection arm 72 is positioned at the workpiece delivery position after processing.

  First, the workpiece W before processing is stocked in the workpiece supply standby unit 40. This operation is performed manually by the operator. The operator causes the workpiece supply gripper 63 located in the workpiece supply standby unit 40 to grip the workpiece W before processing, and stocks the workpiece W before processing in the workpiece supply standby unit 40.

  At this time, the operator causes the workpiece supply gripper 63 to grip the workpiece W by bringing the linear portion of the frame F on which the workpiece W is mounted into contact with the contact surface 63b of the positioning plate 63B of the workpiece supply gripper 63. As a result, the workpiece W is positioned and the workpiece supply gripper 63 is gripped.

  Further, the operator causes the workpiece supply gripper 63 to grip the workpiece W with the surface (back surface) to which the dicing film T is attached facing the work table side.

  The workpiece W stocked in the workpiece supply standby unit 40 as described above is stocked in a posture standing upright with respect to the workpiece placement surface 21 of the workpiece table 20 as shown in FIG. Further, the work W is stocked in a posture parallel to the moving direction of the work table 20. Furthermore, the workpiece W is stocked in a posture in which the surface on which the dicing film T is attached is directed to the work table side.

  Thereafter, when a processing start command from the operator is input to the controller, the processing is started.

  First, the workpiece supply motor 61 is driven, and the workpiece supply arm 62 moves from the unprocessed workpiece receiving position to the unprocessed workpiece delivery position. Thereby, the work W is placed on the work table 20 as shown in FIG.

  When the workpiece W is placed on the workpiece table 20, the workpiece W gripping by the workpiece supply gripper 63 is released. Then, as shown in FIG. 5C, the work supply arm 62 contracts, and the work supply gripper 63 retracts to the retracted position. As a result, the workpiece supply gripper 63 is detached from the workpiece W placed on the workpiece table 20.

  Thereafter, the workpiece supply motor 61 is driven, and the workpiece supply arm 62 moves to the workpiece receiving position before processing. Then, the workpiece supply arm 62 extends and the workpiece supply gripper 63 moves to the workpiece gripping position. As a result, as shown in FIG. 5D, the workpiece supply gripper 63 is positioned in the workpiece supply standby unit 40, and the workpiece W to be processed next can be stocked.

  When the work W is placed on the work table 20, the suction mechanism of the work table 20 is activated. Thereby, the work W is sucked and held on the work table 20.

  Thereafter, the work table 20 moves to the processing position and is diced by the processing unit 30. That is, the rotating blades 33A and 33B are applied along the planned cutting line, and are cut or grooved along the planned cutting line. Thereby, it divides | segments into a chip | tip.

  When machining is completed, the work table 20 moves to the replacement position. The workpiece collection device 70 collects the workpiece W from the workpiece table 20. This process is performed as follows.

  As shown to Fig.6 (a), the workpiece | work collection | recovery arm 72 is located in the workpiece delivery position after a process. Moreover, the workpiece | work collection | recovery gripper 73 is located in a workpiece | work holding position.

  First, the workpiece recovery arm 72 is retracted, and the workpiece recovery gripper 73 is retracted to the retracted position. When the workpiece collection gripper 73 is retracted, the workpiece collection motor 71 is next driven, and the workpiece collection arm 72 moves to the workpiece receiving position after processing.

  When the workpiece collection arm 72 is positioned at the workpiece receiving position after processing, as shown in FIG. 6B, the workpiece collection arm 72 is in a horizontal posture. In addition, the workpiece collection gripper 73 is disposed to face the frame F of the workpiece W placed on the workpiece table 20.

  When the workpiece collection arm 72 moves to the workpiece receiving position after processing, the workpiece collection gripper 73 is driven, and the interval between the pair of gripping claws 73A and 73A is widened. Thereafter, the workpiece collection arm 72 is extended, and the workpiece collection gripper 73 moves toward the workpiece W held on the workpiece table 20.

  When the workpiece collection arm 72 is extended, the frame F of the workpiece W placed on the workpiece table 20 is fitted between the pair of gripping claws 73A and 73A as shown in FIG. 6C. Further, the linear portion of the frame F contacts the contact surface 73b of the positioning plate 73B. Thereafter, the workpiece collection gripper 73 is driven, and the frame F closes the gripping claws 73A and 73A. As a result, the frame F is sandwiched between the gripping claws 73 </ b> A and 73 </ b> A, and the workpiece W is gripped by the workpiece collection gripper 73.

  When the frame F of the workpiece W is gripped by the workpiece collection gripper 73, the adsorption of the workpiece W by the workpiece table 20 is released.

  When the adsorption of the work table 20 is released, the work collection motor 71 is driven, and the work collection arm 72 rotates to the work delivery position after processing. As a result, the workpiece W moves to the workpiece collection standby unit 50. At this time, the work W moves so as to get up while gradually tilting from the state of lying down horizontally. Then, it stops in a vertically standing posture. Thus, by collecting the workpiece W from the work table 20 while gradually tilting the workpiece W, the workpiece W can be gradually peeled off from the end of the workpiece table 20 and collected. Thereby, the electrostatic damage of the workpiece | work W can be prevented.

  Thus, the collection of the workpiece W is completed. The workpiece W waits in a state of being gripped by the workpiece collection gripper 73. As a result, the processed workpiece W is stocked in the workpiece collection standby unit 50. At this time, the workpiece W gripped by the workpiece collection gripper 73 is held in an upright posture with respect to the workpiece placement surface 21 of the workpiece table 20 (the back surface of the workpiece W is parallel to the workpiece placement surface 21). Held in posture.) The workpiece W is held in a posture parallel to the moving direction (X-axis direction) of the work table 20. Further, the work W is held in a posture in which the surface (back surface) to which the dicing film T is attached is directed to the work table side.

  The operator collects the workpiece W stocked in the workpiece collection standby unit 50. Thereby, the processing of one workpiece W is completed.

  As described above, after supplying the workpiece W to the workpiece table 20, the workpiece supply arm 62 of the workpiece supply device 60 moves to the workpiece receiving position before processing, and can hold the workpiece W to be processed next. . The operator causes the workpiece supply gripper 63 to hold the workpiece W to be processed next while the workpiece W supplied to the workpiece table 20 is being processed by the processing unit 30. As a result, the workpiece to be processed next can be stocked in the workpiece supply standby unit 40. Thereby, the processing of the next workpiece W can be started continuously after the processing of the workpiece W currently being processed. The operator collects the workpiece W stocked in the workpiece collection standby unit 50 from the workpiece collection standby unit 50 before the machining of the workpiece W currently being machined is completed. Thereby, the workpiece | work W can be collect | recovered continuously.

  By performing the work W supply operation and the recovery operation by the operator at the same timing, the dicing apparatus can be operated efficiently. That is, by collecting the new workpiece W in the workpiece supply standby unit 40 simultaneously with the collection of the workpiece W after processing, the operator can perform the workpiece W supply operation and the recovery operation without waste.

  Further, since the work W supply operation and the work collection operation by the operator can be performed during the processing of the work W, the available time can be widened. Therefore, even when a plurality of dicing apparatuses are operated, they can be operated efficiently without stopping the operation of each apparatus.

  Moreover, since the workpiece | work W stocked by the workpiece | work supply waiting | standby part 40 and the workpiece | work collection | recovery waiting | standby part 50 is stocked in the standing state, it can be stocked in space saving. Moreover, since the workpiece | work W is stocked with the surface to which the dicing film T was stuck facing toward the worktable side, it can also prevent that mist etc. adhere to a process surface.

  As described above, according to the dicing apparatus 10 of the present embodiment, the workpiece W is efficiently processed with a compact configuration by stocking the workpiece W before processing and the workpiece W after processing upright. be able to.

  Further, when the workpiece W is collected from the workpiece table 20, the workpiece W is gradually separated from the end of the workpiece table 20 and collected, so that electrostatic damage to the workpiece W can be prevented.

  In addition, when collect | recovering the workpiece | work W in this way, it is preferable to peel the workpiece | work W from the work table 20, spraying ion between the work table 20 and the dicing film T. FIG. In this case, an ionizer is installed in the vicinity of the work table 20 located at the exchange position so that ions can be emitted toward the work table 20.

[Second Embodiment]
FIG. 7 is a front view showing a configuration of a main part of a second embodiment of the dicing apparatus to which the present invention is applied .

  As shown in the figure, the dicing apparatus according to the present embodiment is provided with a workpiece cleaning device 80 for cleaning the workpiece W after processing in the workpiece recovery standby section 50.

  The workpiece cleaning apparatus 80 cleans the workpiece W by injecting a cleaning liquid toward the workpiece W after processing stocked in the workpiece collection standby unit 50. The cleaning liquid is ejected from the cleaning liquid nozzle 82. The cleaning liquid nozzle 82 is installed obliquely above the workpiece W stocked in a posture standing on the workpiece collection standby unit 50. The cleaning liquid nozzle 82 injects the cleaning liquid toward the work W from obliquely above the work W stocked in a posture standing on the work collection standby unit 50. Since the cleaning liquid flows down along the workpiece W, the cleaning liquid is not applied to the work table 20.

  In this way, by providing the workpiece recovery standby unit 50 with the workpiece cleaning device 80, the workpiece W after processing can be cleaned, and the workpiece W in a clean state can be recovered.

  Note that the work cleaning apparatus 80 may further include an air nozzle that injects air. The air nozzle is also installed so as to inject air toward the workpiece W from obliquely above the workpiece W. By spraying air from the air nozzle after spraying the cleaning liquid onto the workpiece W, water droplets remaining on the workpiece W can be removed by air, and the workpiece W can be recovered in a dried state.

[Third Embodiment]
FIG. 8 is a front view showing a configuration of a main part of a third embodiment of the dicing apparatus to which the present invention is applied .

  The dicing apparatus according to the present embodiment is different from the dicing apparatus according to the first embodiment in the forms of a workpiece supply standby unit, a workpiece recovery standby unit, a workpiece supply device, and a workpiece recovery device. Therefore, only this difference will be described here.

  As shown in FIG. 8, in the dicing apparatus according to the present embodiment, a workpiece W is attached to a jig 90 and processed.

  FIG. 9 is a plan view of the jig. As shown in the figure, the jig 90 includes a left side portion 90A for gripping the left end portion of the frame F on which the workpiece W is mounted, a right side portion 90B for gripping the right end portion of the frame F, and a rear end portion of the frame F. And a rear side portion 90 </ b> C for gripping and is formed in a U-shape as a whole. The left side portion 90A and the right side portion 90B are formed to be parallel to each other, and the left and right side portions 90A, 90B and the rear side portion 90C are formed to be orthogonal to each other.

  Grooves are formed in the inner periphery of each side of the jig 90. The workpiece W is attached to the jig 90 by fitting the outer peripheral portion of the frame F into this groove.

  The outer periphery of each side portion of the jig 90 is formed flat. The jig 90 can be erected by placing the outer peripheral surface of each side portion on a horizontal surface.

  As shown in FIG. 8, the workpiece supply stand 40 for stocking the workpiece W before processing is provided with a workpiece processing table 42 before processing for mounting the workpiece W attached to the jig 90. The workpiece mounting table 42 before processing has a jig mounting surface 44 for mounting the jig 90 on the upper surface portion. The jig placement surface 44 is formed horizontally. A jig placement groove 46 into which the jig 90 is fitted is formed on the jig placement surface 44 in parallel with the movement direction (X-axis direction) of the work table 20. The jig 90 is placed on the jig placement surface 44 in a state where the jig 90 is fitted in the jig placement groove 46 and is erected.

  When the jig 90 to which the workpiece W is attached is placed on the workpiece mounting table 42 before processing, the workpiece W stands upright perpendicularly to the workpiece mounting surface 21 of the workpiece table 20. 42. Further, the workpiece W is placed on the pre-work workpiece placing table 42 in a posture parallel to the moving direction of the work table 20.

  In addition, when mounting the jig 90 on the workpiece mounting table 42 before processing, the jig 90 is mounted with the surface of the workpiece W held on the inner peripheral portion to which the dicing film T is attached facing the work table side.

  As shown in FIG. 8, the workpiece collection stand 52 for stocking the processed workpiece W is provided with a post-processing workpiece mounting table 52 for mounting the workpiece W attached to the jig 90. In the post-processing workpiece mounting table 52, a jig mounting surface 54 for mounting the jig 90 is formed on the upper surface portion. The jig placement surface 54 is formed horizontally. A jig placement groove 56 into which the jig 90 is fitted is formed on the jig placement surface 54 in parallel with the movement direction (X-axis direction) of the work table 20. The jig 90 is placed on the jig placement surface 54 in a state where the jig 90 is fitted in the jig placement groove 56 and is raised.

  When the jig 90 to which the workpiece W is attached is placed on the workpiece mounting table 52 after machining, the workpiece W is placed in a posture standing upright with respect to the workpiece placing surface 21 of the workpiece table 20. 52. In addition, the workpiece W is placed on the workpiece mounting table 52 after being processed in a posture parallel to the moving direction of the workpiece table 20.

  The workpiece W placed on the unprocessed workpiece placing table 42 via the jig 90 is placed on the work table 20 together with the jig 90 by the workpiece feeding device 60.

  The workpiece supply device 60 is composed of, for example, a robot hand. The workpiece supply device 60 grips the jig 90 and lifts the workpiece W to a predetermined height, and then rotates the workpiece W around an axis X1 parallel to the moving direction of the workpiece table 20. Is placed on the work table 20. That is, the workpiece W is transferred to the work table 20 so as to be tilted toward the work table 20 from a vertically standing state.

  Further, the processed workpiece W is recovered by the workpiece recovery device 70 to the workpiece recovery standby unit 50 together with the jig 90. The workpiece collection device 70 is constituted by a robot hand, for example. The workpiece collection device 70 grips the jig 90 and rotates the workpiece W about an axis X2 parallel to the moving direction of the workpiece table 20 so that the workpiece W is processed from the workpiece table 20 onto the workpiece mounting table 52. To be transferred to. That is, the workpiece W is transferred from the workpiece table 20 onto the workpiece mounting table 52 after being processed so as to be gradually tilted from the horizontally laid state.

  According to the dicing apparatus 10 of the present embodiment configured as described above, the workpiece W stocked in the workpiece supply standby unit 40 and the workpiece recovery standby unit 50 can be made independent. Thereby, supply and collection | recovery work of the workpiece | work W can be performed easily. That is, the workpiece W can be supplied simply by attaching the workpiece W before processing to the jig 90 and placing it on the workpiece mounting table 42 before processing. Moreover, since the workpiece | work W after a process collect | recovers only the workpiece | work W mounted in the workpiece mounting base 52 after a process with the jig | tool, it can collect | recover easily.

  In addition, the operation | work which attaches the jig | tool 90 to the workpiece | work W before a process and the work which mounts the workpiece | work W attached to the jig | tool 90 on the workpiece | work mounting base 42 before a process is performed manually by an operator. Similarly, the operation of collecting the workpiece W placed on the workpiece mounting table 52 after processing is also manually performed by the operator.

  Moreover, in the said embodiment, although the workpiece | work supply apparatus and the workpiece | work collection | recovery apparatus are comprised with the robot hand, the means to supply and collect | recover the workpiece | work W is not limited to this.

  Further, in the above embodiment, the supply of the workpiece W and the recovery of the workpiece W are performed by separate apparatuses, but the supply and recovery of the workpiece W may be performed by one apparatus.

[Fourth Embodiment]
FIG. 10 is a front view showing the configuration of the main part of the fourth embodiment of the dicing apparatus to which the present invention is applied .

  The dicing apparatus according to the present embodiment is configured such that a plurality of workpieces W can be stocked in the workpiece supply standby unit 40 and the workpiece recovery standby unit 50 in the dicing apparatus according to the third embodiment.

  As shown in FIG. 10, the jig placement groove 46 is formed on the jig placement surface 44 of the work placement table 42 provided in the workpiece supply standby section 40 in a direction (Y A plurality of them are formed at a constant pitch in the axial direction.

  Further, on the jig placement surface 54 of the post-work workpiece placement table 52 provided in the workpiece collection standby section 50, the jig placement groove 56 is constant in the direction orthogonal to the movement direction of the work table 20 (Y-axis direction). A plurality of pitches are formed.

  As many jigs 90 are prepared as can be placed on each mounting table. Therefore, as many jigs 90 as the number of jig placement grooves formed on the jig placement surface are prepared.

  Each workpiece W before processing is attached to the jig 90 and placed on the jig mounting surface 44 of the workpiece mounting table 42 before processing. At this time, each workpiece W is placed on the jig placement surface 44 by fitting the jig 90 into the jig placement groove 46 formed on the jig placement surface 44. Each work W is placed with the surface on which the dicing film T is attached facing the work table.

  When placed on the jig placement surface 44, each workpiece W is placed on the pre-work workpiece placement table 42 in a posture that stands upright with respect to the workpiece placement surface 21 of the work table 20. The Each workpiece W is placed on the workpiece mounting table 42 before processing in a posture parallel to the moving direction of the workpiece table 20.

  The workpiece W placed on the unprocessed workpiece placing table 42 via the jig 90 is placed on the work table 20 together with the jig 90 by the workpiece feeding device 60. The workpiece supply device 60 is composed of, for example, a robot hand. The work supply device 60 supplies the work W to the work table 20 in order from the side closer to the work table 20. At this time, the workpiece supply device 60 grips the jig 90 and lifts the workpiece W to a predetermined height, and then translates horizontally to move the workpiece W horizontally to a predetermined workpiece rotation position. . Then, at the work rotation position, the work W is rotated about an axis X1 parallel to the moving direction of the work table 20, and placed on the work table 20. That is, the workpiece W is transferred to the work table 20 so as to be tilted toward the work table 20 from a vertically upright state at the work rotation position.

  Further, the processed workpiece W is recovered by the workpiece recovery device 70 to the workpiece recovery standby unit 50 together with the jig 90. The workpiece collection device 70 is constituted by a robot hand, for example. The workpiece collection device 70 places the jigs 90 of the workpiece W collected in order from the jig placement groove 56 located at a position away from the work table 20. At this time, the work collection device 70 rotates about an axis X <b> 2 parallel to the moving direction of the work table 20 to collect the work W from the work table 20. Then, the workpiece 90 is translated to the position of the jig placement groove 56 on which the jig 90 is placed, and the workpiece W is placed on the workpiece placement table 52 after processing.

  According to the dicing apparatus 10 of the present embodiment configured as described above, a plurality of workpieces W can be stocked in the workpiece supply standby unit 40 and the workpiece recovery standby unit 50. Thereby, the apparatus can be operated more efficiently.

  In addition, the operation | work which attaches the jig | tool 90 to the workpiece | work W before a process and the work which mounts the workpiece | work W attached to the jig | tool 90 on the workpiece | work mounting base 42 before a process is performed manually by an operator. Similarly, the operation of collecting the workpiece W placed on the workpiece mounting table 52 after processing is also manually performed by the operator.

  The number of workpieces W stocked in the workpiece supply standby unit 40 is arbitrary. Accordingly, only one sheet may be stocked. In this case, the operator inputs information on the number of workpieces W to be stocked into the controller. The controller controls the operations of the workpiece supply device 60 and the workpiece recovery device 70 according to the number of stocked workpieces W, and controls the supply and recovery of the workpieces W.

  Moreover, in the said embodiment, although the workpiece | work supply apparatus and the workpiece | work collection | recovery apparatus are comprised with the robot hand, the means to supply and collect | recover the workpiece | work W is not limited to this.

  Further, in the above embodiment, the supply of the workpiece W and the recovery of the workpiece W are performed by separate apparatuses, but the supply and recovery of the workpiece W may be performed by one apparatus.

[Fifth Embodiment]
FIG. 11 is a front view showing the configuration of the main part of the fifth embodiment of the dicing apparatus to which the present invention is applied .

  The dicing apparatus according to the present embodiment is configured such that a plurality of workpieces W can be stocked in the workpiece supply standby unit 40 and the workpiece recovery standby unit 50 without using the jig 90.

  As shown in FIG. 10, a work supply rack 48 is installed on the pre-work work mounting table 42 provided in the work supply standby unit 40. The work supply rack 48 is formed with a frame holding groove 48A for fitting the frame F on which the work W is mounted. The frame holding groove 48A is formed with substantially the same width as the frame F on which the work W is mounted, and is formed in parallel with the moving direction (X-axis direction) of the work table 20. A plurality of frame holding grooves 48A are formed at a constant pitch in a direction (Y-axis direction) orthogonal to the moving direction of the work table 20.

  Each workpiece W before processing is set in the workpiece supply rack 48 by fitting its frame F into the frame holding groove 48A. At this time, each work W is set in the work supply rack 48 with the surface on which the dicing film T is attached facing the work table. The workpiece W set on the workpiece supply rack 48 is set in a posture in which the workpiece W stands upright with respect to the workpiece mounting surface 21 of the workpiece table 20. Each workpiece W is placed on the workpiece mounting table 42 before processing in a posture parallel to the moving direction of the workpiece table 20.

  The workpiece W set in the workpiece supply rack 48 is placed on the workpiece table 20 by the workpiece supply device 60. The workpiece supply device 60 is composed of, for example, a robot hand. The work supply device 60 supplies the work W to the work table 20 in order from the side closer to the work table 20. At this time, the workpiece supply device 60 grips the frame F of the workpiece W, lifts the workpiece W to a predetermined height position, and then translates horizontally to horizontally move the workpiece W to a predetermined workpiece rotation position. Move. Then, at the work rotation position, the work W is rotated about an axis X1 parallel to the moving direction of the work table 20, and placed on the work table 20. That is, the workpiece W is transferred to the work table 20 so as to be tilted toward the work table 20 from a vertically upright state at the work rotation position.

  A workpiece collection rack 58 is installed on the post-work workpiece mounting table 52 provided in the workpiece collection standby unit 50. The work collection rack 58 is formed with a frame holding groove 58A for fitting the frame F on which the work W is mounted. The frame holding groove 58A is formed with substantially the same width as the frame F on which the work W is mounted, and is formed in parallel with the moving direction (X-axis direction) of the work table 20. A plurality of the frame holding grooves 58A are formed at a constant pitch in a direction (Y-axis direction) orthogonal to the moving direction of the work table 20.

  Each processed workpiece W is set in the workpiece collection rack 58 with the frame F fitted in the frame holding groove 58A. At this time, each work W is set in the work collection rack 58 with the surface on which the dicing film T is attached facing the work table. The workpiece W set in the workpiece collection rack 58 is set in a posture standing upright with respect to the workpiece placement surface 21 of the workpiece table 20. Each workpiece W is placed on the workpiece mounting table 42 before processing in a posture parallel to the moving direction of the workpiece table 20.

  The processed workpiece W is collected by the workpiece collection device 70 to the workpiece collection standby unit 50. The workpiece collection device 70 is constituted by a robot hand, for example. The workpiece collection device 70 places the workpieces W collected in order from the frame holding groove 58 </ b> A located away from the workpiece table 20. At this time, the work collection device 70 rotates about an axis X <b> 2 parallel to the moving direction of the work table 20 to collect the work W from the work table 20. Then, the workpiece W is moved in parallel to the position of the frame holding groove 58A where the workpiece W is placed, and the workpiece W is placed on the frame holding groove 58A.

  Also in the dicing apparatus of the present embodiment configured as described above, a plurality of workpieces W can be stocked in the workpiece supply standby unit 40 and the workpiece recovery standby unit 50. Thereby, the apparatus can be operated more efficiently.

  The operation of setting the workpiece W before processing on the workpiece supply rack 48 is performed manually by the operator. Similarly, the operator collects the workpiece W collected in the workpiece collection rack 58 manually by the operator.

  The number of workpieces W set in the workpiece supply rack 48 is arbitrary. Therefore, only one sheet can be set. In this case, the operator inputs information on the number of workpieces W to be set to the controller. The controller controls the operations of the workpiece supply device 60 and the workpiece recovery device 70 according to the number of stocked workpieces W, and controls the supply and recovery of the workpieces W.

  Moreover, in the said embodiment, although the workpiece | work supply apparatus and the workpiece | work collection | recovery apparatus are comprised with the robot hand, the means to supply and collect | recover the workpiece | work W is not limited to this.

  Further, in the above embodiment, the supply of the workpiece W and the recovery of the workpiece W are performed by separate apparatuses, but the supply and recovery of the workpiece W may be performed by one apparatus.

[Sixth Embodiment]
FIG. 12 is a front view showing the configuration of the main part of a sixth embodiment of the dicing apparatus to which the present invention is applied . FIG. 13 is a plan view showing the configuration of the main part of the sixth embodiment of the dicing apparatus to which the present invention is applied .

  In the dicing apparatus according to the present embodiment, supply and recovery of the workpiece W are performed by one workpiece supply and recovery device 100.

  The workpiece supply / recovery device 100 supplies the workpiece W attached to the jig 90 from the workpiece supply standby unit 40 to the workpiece table 20 and recovers the processed workpiece W from the workpiece table 20 to the workpiece recovery standby unit 50.

  The workpiece supply / recovery device 100 includes a first frame 102, a second frame 106 that is swingably supported by the first frame 102 via a first hinge 104, and a second frame 106 via a second hinge 108. A third frame 110 that is swingably supported, a first swing drive device 112 that swings the second frame 106, a second swing drive device 114 that swings the third frame 110, and a jig 90. And a pair of grippers 116 for gripping.

  The first frame 102, the second frame 106, and the third frame 110 are all formed in a prismatic shape (cuboid shape).

  The first frame 102 is horizontally installed on the main body frame 12 of the dicing apparatus 10. The first frame 102 is fixed to the main body frame 12 with a bolt or the like (not shown).

  The second frame 106 is installed on the first frame 102. One end (the right end in FIG. 12) of the second frame 106 is connected to one end (the right end in FIG. 12) of the first frame 102 via the first hinge 104.

  The first hinge 104 swings around an axis parallel to the moving direction (X-axis direction) of the work table 20. Therefore, the second frame 106 swings around an axis parallel to the moving direction (X-axis direction) of the work table 20.

  The third frame 110 is installed on the second frame 106. One end (left end in FIG. 12) of the third frame 110 is connected to one end (left end in FIG. 12) of the second frame 106 via the second hinge 108.

  The second hinge 108 swings around an axis parallel to the moving direction (X-axis direction) of the work table 20. Therefore, the third frame 110 swings around an axis parallel to the moving direction (X-axis direction) of the work table 20.

  The first swing driving device 112 is configured by a cylinder, and swings the second frame 106 with respect to the first frame 102. The second frame 106 can be erected vertically from a horizontally lying state by driving the first swing driving device 112.

  The second swing driving device 114 is formed of a cylinder and swings the third frame 110 with respect to the second frame 106. The third frame 110 can be erected vertically from a horizontally lying state by driving the second swing driving device 114.

  The pair of grippers 116 grip the jig 90. The jig 90 is provided with a pair of gripping portions 90D on the rear side portion 90C. The gripper 116 grips a grip portion 90 </ b> D provided on the rear side portion 90 </ b> C of the jig 90.

  The workpiece supply / recovery device 100 is configured as described above. FIG. 12 shows a basic posture of the workpiece supply / recovery device 100. In this state, the third frame 110 is placed on the second frame 106 to be in a horizontal posture, and the second frame 106 is placed on the first frame 102 to be in a horizontal position. Become posture. In this state, the jig 90 held by the gripper 116 is placed together with the workpiece W on the work table 20 positioned at the replacement position.

  When the second swing driving device 114 is driven from the basic posture to raise the third frame 110, the jig 90 is transferred to the workpiece supply standby unit 40 and processed in the workpiece supply standby unit 40. It is mounted on the previous work mounting table 42.

  Further, when the first swing driving device 112 is driven from the basic posture to raise the second frame 106, the jig 90 is transferred to the workpiece collection standby unit 50 and provided in the workpiece collection standby unit 50. After the machining, the workpiece is placed on the workpiece placing table 52.

  The supply and recovery of the work W to the work table 20 using the work supply / recovery device 100 is performed as follows.

  First, the operator attaches the jig 90 to the workpiece W. Then, the jig 90 to which the work W is attached is placed on the pre-work work placing table 42 of the work supply standby unit 40.

  The operator places the jig 90 in a predetermined position on the pre-working workpiece mounting table 42 in a posture in which the surface (back surface) on which the dicing film T is stuck is directed to the work table side and is vertically raised.

  Thereby, the setting of the workpiece W to be processed is completed. Thereafter, when the start of machining is instructed, first, the second swing driving device 114 is driven, and the third frame 110 stands vertically. Thereby, the jig 90 can be held by the gripper 116.

  When the gripper 90D of the jig 90 is gripped by the gripper 116, the second swing driving device 114 is driven, and the third frame 110 swings and assumes a horizontal posture. Thereby, the work W is placed on the work table 20.

  When the workpiece W is placed on the workpiece table 20, the gripping by the gripper 116 is released. Then, the suction mechanism of the work table 20 is operated, and the work W is sucked and held on the work table 20. Thereafter, the workpiece W is conveyed to the processing unit 30 and processed.

  When the machining is completed and the work table 20 returns to the replacement position, the gripper 116 is driven, and the grip portion 90D of the jig 90 is gripped by the gripper 116. And the adsorption | suction of the workpiece | work W by the workpiece | work table 20 is cancelled | released.

  When the suction of the work table 20 is released, the first swing driving device 112 is driven, and the second frame 106 swings together with the third frame 110 to stand vertically. As a result, the processed workpiece W is placed on the processed workpiece mounting table 52 of the workpiece collection standby unit 50 together with the jig 90.

  When the workpiece W is mounted on the workpiece mounting table 52 after processing, the gripping by the gripper 116 is released. Thereafter, the first swing driving device 112 is driven, and the second frame 106 swings together with the third frame 110 to return to the basic posture.

  As described above, according to the dicing apparatus of the present embodiment, the workpiece W can be supplied and recovered by one workpiece supply and recovery device 100.

[Seventh Embodiment]
FIG. 14 is a front view showing a schematic external configuration of a seventh embodiment of the dicing apparatus to which the present invention is applied .

  As shown in the figure, the entire dicing apparatus 10 is covered with a housing 14. A supply port 16 and a recovery port 18 for the workpiece W are formed in the front portion of the housing 14. The supply port 16 and the recovery port 18 are arranged symmetrically with the processing unit 30 and are covered with openable and closable covers 16A and 18A. Further, the front of the processing unit 30 is also covered with an openable / closable cover 30A. The covers 16A, 18A, and 30A are formed to be transparent so that the inside can be observed.

  The supply port 16 for the workpiece W is communicated with the workpiece supply standby unit 40. When the workpiece W is stocked in the workpiece supply standby unit 40, it is performed through the supply port 16.

  The work W collection port 18 communicates with the work collection standby unit 50. The processed workpiece W stocked in the workpiece collection standby unit 50 is taken out through the collection port 18.

  Thus, by forming the workpiece W supply port 16 and the recovery port 18 in the front portion of the housing 14, the operator can easily supply and recover the workpiece W.

[Eighth Embodiment]
FIG. 15 is a perspective view showing a schematic configuration of the appearance of an eighth embodiment of a dicing apparatus 200 to which the present invention is applied .

  The dicing apparatus 200 mainly includes an operation / display unit 211, a monitor television 212, a controller 213, a cover 214, a processing unit 220, and the like.

  The operation / display unit 211 includes a display unit on which switches for operating each unit of the dicing apparatus 200 are displayed, and a touch panel.

  The monitor television 212 is a liquid crystal panel capable of color display, for example. On the monitor television 212, an image picked up by the image pickup means 223 is displayed.

  The controller 213 is a part that controls the overall operation of the dicing apparatus 200. The controller 213 includes a microprocessor, a memory, an input / output circuit, and the like, and is stored inside the gantry of the dicing apparatus 200. The controller 213 operates each unit of the dicing apparatus 200 according to the operation of the operation / display unit 211.

  The cover 214 is formed of a transparent resin so that the inside of the processed part 220 can be observed. In addition, the cover 214 is provided so as to cover the processing unit 220 in order to prevent splashes and mist from being scattered around the processing.

  The processing unit 220 is a part that performs grooving or cutting on the workpiece. The processing unit 220 mainly includes a pair of high-frequency motor built-in spindles 221, a blade 222 attached to each spindle 221, a pair of imaging means 223, a single work table 224, and a jig attached to the work W. 226.

  The pair of spindles 221 are arranged opposite to each other and rotated at a high speed of 30,000 rpm to 60,000 rpm. A blade 222 and a wheel cover (not shown) are attached to the tip of the spindle 221. The spindle 221 is index-fed in the Y direction orthogonal to the arrow X direction in the figure by a feed mechanism (not shown).

  The blade 222 is formed in a thin disk shape, and performs grooving and cutting of the workpiece W. The blade 222 may be an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, or a resin blade bonded with a resin. A cutting nozzle and a cleaning nozzle (not shown) are provided in the vicinity of the blade 222, and cutting water and cleaning water are supplied to the processing point from the nozzle.

  The pair of imaging means 223 images the surface of the workpiece W to be cut by each blade 222 in order to evaluate the alignment and processing state of the workpiece. The imaging means 223 is configured with a microscope, an illumination device, a CCD camera, and the like.

  The spindle 221 and the imaging unit 223 are disposed at the tip of a Z table that is driven in the Z direction by a driving unit (not shown). The Z table is disposed on a Y table that is driven in the Y direction by a driving unit (not shown). Therefore, the blade 222 and the imaging unit 223 are driven in the Y direction and the Z direction.

  The work table 224 holds the work W by suction. The workpiece W is mounted on the frame F. In addition, a jig 226 is attached and sucked and held on the work table 224.

  The frame F is an annular member formed of resin or the like, and a dicing film T is attached so as to cover the annular interior. The workpiece W is mounted on the frame F by the workpiece W being attached to the adhesive surface of the dicing film T. Hereinafter, the adhesive surface of the dicing film T, that is, the surface to which the workpiece W is attached is defined as the front surface, and the side that is not the adhesive surface of the dicing film T is defined as the back surface.

  The work table 224 is connected to a θ table (not shown) connected to an X table (not shown) placed on a machine base (not shown) fixed inside the dicing apparatus 200.

  The workpiece W attracted and fixed to the upper surface of the workpiece table 224 is rotated by θ by the θ table. The work W attracted and fixed to the upper surface of the work table 224 is moved in the X direction by the X table being guided by an X guide (not shown) and moved in the X direction by a drive mechanism (not shown).

  The work table 224 is provided with two pins 225. Two cutouts are formed in the frame F, and the workpiece W is positioned by bringing the cutouts into contact with the pins 225.

  The jig 226 is attached to the work W while sandwiching both ends of the frame F. As shown in FIGS. 16, 17, and 18, the jig 226 is provided with two square bar-like members facing each other. The dicing apparatus 200 is provided with at least two sets of jigs 226. In FIG. 16, one set of jigs 226 is arranged substantially parallel to the work table 224, that is, arranged in a substantially horizontal direction, and the other jigs 226 are arranged adjacent to the work table 224 in a substantially vertical direction. It is installed. The jig 226 is movable between a substantially horizontal direction (horizontal placement) and a substantially vertical direction (vertical placement) by rotating about the rotation shaft 227. Two rotating shafts 227 are provided so as to be adjacent to the jig 226 and adjacent to the work table 224.

  The frame F is attached to and detached from the jig 226 placed horizontally at the position indicated by the solid line in FIGS. This position is the workpiece replacement position. The frame F is a ring-shaped member, and a dicing film T is attached from the back surface so as to cover the inside of the ring of the frame F. The workpiece W is adhered to the adhesive surface (that is, the surface) of the dicing film T. The frame F is clamped by the jig 226 so that the back surface faces the work table 224 side. It is preferable to provide a reverse insertion prevention mechanism on the jig 226 or the frame F so that the work W is not held between the jig 226 in the reverse direction (so that the surface faces the work table 224). As the reverse insertion prevention mechanism, a convex portion formed on the frame F and a groove that can be fitted to the convex portion formed in the groove 231 of the jig 226 can be applied.

  The jig 226 that holds the frame F at the workpiece replacement position is connected to a rotation shaft 227 disposed on the workpiece supply standby section 228 on the left side (−y side) of the workpiece table 224 in FIG. , And a position where the jig 226 is vertically placed adjacent to the left side of the work table 224 from a position where it is horizontally placed on the work table 224 by rotating about the rotation shaft 227. The jig 226 is moved to the side. This position is the workpiece standby position. Since the waiting workpiece is set up and stored in this way, a large space is not required, and the workpiece can be efficiently stored in a very narrow area.

  In the workpiece standby position, as shown in FIGS. 16 and 17, the frame F is sandwiched by the jig 226 so that the adhesive surface of the dicing film T, that is, the workpiece W is exposed outward. Therefore, the wafer surface can be protected from mist jumping from the workpiece processing position (detailed later).

  In FIG. 16, the jig 226 placed vertically on the work supply standby unit 228 on the left side (−y side) of the work table 224 functions as a weight of the jig 226 in the vertically upward direction, and is vertically lowered (−z Direction). At the workpiece standby position, the jig 226 is positioned by contacting the reference surface of the rotation shaft 227 (see FIG. 16). Further, at the workpiece standby position, the jig 226 in the vertically upward direction functions as a weight, and therefore the frame F sandwiched between the jigs 226 is also moved vertically downward (−z direction) by gravity. As shown in FIG. 15, the frame F has straight portions formed at both ends. As shown in FIG. 19, the frame F comes into contact with the bottom surface 231 a of the groove 231, so that the frame F becomes a jig. Positioned relative to H.226.

  20 is an enlarged view of a portion A in FIG. As shown in FIG. 20, the jig 226 mainly includes a rectangular parallelepiped (square bar-shaped) main body 230 having a groove 231 formed in the longitudinal direction, and an elastic member 232. The elastic member 232 urges the frame F toward the side surface 231b of the groove 231 by the elastic force in a state where the linear portion of the frame F is in contact with the bottom surface 231a of the groove 231. As a result, the frame F is positioned on the jig 226 and held between the jigs 226 in a state where the frame F stands substantially vertically.

  In FIG. 16, the jig 226 placed vertically at the workpiece standby position is composed of a rotating shaft 227 disposed in the workpiece supply standby section 228 on the left side (−y side) of the workpiece table 224 and a connecting member (not shown) such as a gripper. ) And the jig 226 is moved from the workpiece standby position to the workpiece replacement position by pivoting about the pivot shaft 227.

  As shown in FIG. 18, the jig 226 is translated in the X direction from the workpiece replacement position by a moving means (not shown), and is disposed on the work table 224 in a substantially horizontal direction. This position is a workpiece machining position. At the workpiece machining position, the workpiece W is sucked and held on the work table 224 by a suction unit (not shown), and the workpiece W is machined.

  Since the jig 226 and the frame F are positioned at the workpiece standby position, the jig 226 and the frame are moved to the left side of FIG. 16 (-y) when rotated from the workpiece standby position to the workpiece replacement position (work processing position). Side) is positioned relative to the reference. Therefore, by disposing the work table 224 and the pin 225 with the jig 226 on the left as a reference, the work W can be positioned and placed on the work table 224 with high accuracy, and the work for finely adjusting the work W can be reduced. It can be omitted.

  After the workpiece machining, the jig 226 is translated from the workpiece machining position to the workpiece exchange position by a moving means (not shown). At this time, the jig 226 is connected to a rotating shaft 227 disposed on the work collection standby part 229 on the right side (+ y side) of the work table 224 in FIG. 16 by a connecting member (for example, a gripper) (not shown). By rotating the jig 226 about the rotation shaft 227, the jig 226 is moved from the position horizontally placed on the work table 224 to the position vertically placed adjacent to the work table 224. In the case shown in FIG. 16, the horizontally placed jig 226 is moved vertically adjacent to the work collection standby unit 229 on the right side (+ y side) of the work table 224 as shown by a dotted line in FIG. Placed. This position is a workpiece end standby position. Thus, since the workpiece after standing is stored upright, a large space is not required, and the workpiece can be efficiently stored in a very narrow area. At this time, the workpiece W is exposed to the outside.

  The dicing apparatus 200 is provided with a camera and a barcode reader (not shown).

  The camera has a frame F that is disposed substantially vertically (in FIG. 16, the frame F that is sandwiched between jigs 226 placed vertically on the work supply standby unit 228 on the left side (−y side) of the work table 224. Take a picture of the work mounted on). Thereby, the shape of the workpiece | work W can be recognized and simple alignment can be performed previously. In order to make it easier for the camera to recognize the shape of the workpiece W, a backlight for illuminating the workpiece W from the back may be provided.

  A barcode (not shown) is affixed to the surface of the frame F. The bar code reader is sandwiched by a jig 226 placed vertically on a work supply standby unit 228 on the left side (-y side) of the work table 224 in FIG. Read the barcode on frame F). Thereby, the kind etc. of the workpiece | work W can be discriminate | determined before a process. Note that what is affixed to the frame F is not limited to a barcode. For example, an RFID tag may be attached. In this case, an RFID tag reader may be provided instead of the barcode reader. Further, the type of the work W may be determined by photographing the barcode with a camera without providing a barcode reader. Further, the barcode or RFID tag may be affixed to the frame F or may be affixed to the adhesive surface of the dicing film T.

  The dicing device 200 is provided with a cleaning device and a drain device. As shown in FIG. 21, the cleaning device and the drainage device clean the workpiece W at the workpiece end standby position as necessary. Since the workpiece W is exposed to the outside, the cleaning device and the drainage device are also disposed outside the jig 226 at the workpiece end standby position.

  The cleaning device mainly includes a nozzle 233, and pure water is sprayed onto the workpiece W from the tip of the nozzle 233. The drainage device mainly includes a water storage unit 234, a mesh filter 235, a wall 236, and a skirt 237. The pure water supplied to the work W falls vertically downward by gravity and is guided to the water storage unit 234 by the skirt 237. The wall 236 is detachably disposed to prevent water from leaking to the outside when pure water is sprayed from the tip of the nozzle 233 to the work W, and guides waste water hitting the wall 236 to the water storage unit 234. Waste water stored in the water storage unit 234 is drained to the outside of the dicing apparatus 200 through the mesh filter 235.

  In the present embodiment, the workpiece is stored in a standing state at the workpiece end standby position. Therefore, the sludge can be efficiently washed away with a small amount of water, and the waste liquid containing the washed sludge can be efficiently discharged to the drainage mechanism. As a result, the wafer surface can be easily and efficiently cleaned without providing a separate wafer cleaning section or the like as in the cited document 1, and can be simply stored in the cleaned state. Can do. Further, the space required for the storage can be stored in a very narrow space.

  Next, a dicing method using the dicing apparatus 200 will be described.

  First, the operator rotates the cover 214 upward to open, and the frame F is clamped by the jig 226 at the workpiece replacement position. Further, the jig 226 is rotated from the workpiece replacement position to the workpiece standby position by operating the switch of the operation / display unit 211. This operation is repeated by the number of jigs 226. Thereby, the frame F is clamped by all of the plurality of jigs 226, and all the jigs are disposed at the workpiece standby position, and the setting of the workpiece W to the dicing apparatus 200 is completed.

  When the operator closes the cover 214, the jig 226 holding the frame F on which the workpiece W to be processed is sandwiched is rotated from the workpiece standby position to the workpiece replacement position. For example, among the jigs 226 at the workpiece standby position, the jig 226 disposed adjacent to the workpiece machining position is rotated and translated, and the other jig 226 is placed vertically at the workpiece standby position. Then, the jig 226 is moved.

  Thereafter, the jig 226 holding the frame F on which the workpiece W to be processed is sandwiched is translated from the workpiece replacement position to the workpiece processing position. That is, the jig 226 is moved in the x direction (−x direction in FIG. 16), the notch of the frame F is brought into contact with the pin 225, and the frame F is placed on the work table 224. Thereby, the workpiece W is positioned.

  Since the frame F and the jig 226 are positioned downward at the workpiece standby position, when the frame F and the jig 226 are rotated, the frame F and the jig 226 are moved to the reference surface (see FIG. 16) of the rotation shaft 227 and the bottom surface of the groove 231. Positioning is performed with reference to 231a. Since the pin 225 is disposed on the work table 224 with reference to the reference surface of the rotation shaft 227, the jig 226 is simply moved in the x direction without fine adjustment after the jig 226 is rotated. The cutout of the frame F can be brought into contact with the pin 225. As a result, after placing the work on the work table, it is possible to eliminate the labor and fine adjustment mechanism for further finely adjusting the work by further shifting the work.

  When the workpiece W is positioned, the workpiece W is vacuum-sucked to the workpiece table 224. Next, the X table is moved in the −x direction, and the workpiece W is moved below the imaging unit 223. Then, the pattern formed on the surface is imaged by the imaging means 223, and the image is displayed on the monitor television. Here, the operator operates the switch of the operation / display unit 211 while aligning the workpiece W while viewing the image displayed on the monitor television.

  When the alignment is completed, the X table is moved in the + x direction, and the workpiece W is moved to the workpiece machining position. By operating the switch of the operation / display unit 211, grooving or cutting is performed by the blade 222 rotating at high speed and the cutting movement by the X table. During processing, cutting water is supplied from the cutting nozzle to the processing point, and cleaning water is supplied from the cleaning nozzle. When one line is processed, the blade 222 is indexed in the Y direction, positioned at the next line to be processed, and this line is also processed by cutting movement by the X table. When such operations are repeated and machining of all lines in one direction of the workpiece W is completed, the θ table rotates the workpiece W by 90 degrees, and machining is performed in accordance with a line orthogonal to the previous line.

  As shown in FIGS. 16, 17, and 18, the spare work W is sandwiched between the jigs 226 so that the back surface faces inward. That is, the workpiece W at the workpiece standby position is separated from the workpiece processing position by the dicing film T. Therefore, the cutting water, the cleaning water, and the mist supplied at the time of processing do not adhere to the spare workpiece, and an alignment error does not occur.

  When all processing is complete, the indicator lamp flashes to indicate the completion of processing. Here, the operator images the processed part of the workpiece W with the imaging unit 223 as necessary, and removes the workpiece W from the workpiece table 224 after observing the processed state.

  The workpiece W is removed by operating the switch of the operation / display unit 211 by the operator. A horizontally placed jig 226 is rotated around a rotation shaft (not shown) disposed in the workpiece collection standby unit 229 on the right side (+ y side) of the work table 224. When the jig 226 is rotated, ions are sprayed onto the work table 224 and the dicing film T by the ionizer 238. When the horizontally placed jig 226 is rotated, as shown in FIG. 22, the jig 226 on the left side (−y side) of the work table 224 in the pair of jigs 226 is moved to the right side of the work table 224 ( + Y side) moves along a circular arc centered on a rotation axis (not shown) disposed in the workpiece collection standby portion 229.

  Since the dicing film T is bent, the dicing film T is gradually lifted from the left side (−y side) of the work table 224 as the jig 226 on the left side (−y side) of the work table 224 moves in an arc shape. Is gradually peeled off from the left side (−y side).

  The ions sprayed by the ionizer 238 neutralize static electricity generated between the work table 224 and the dicing film T and neutralize the static electricity. In the present embodiment, since the jig 226 on the left side (−y side) of the work table 224 is lifted, the ionizer 238 sprays ions from the left side (−y side) of the work table 224. Therefore, the dicing film T gradually floats from the left side (−y side) of the work table 224, and the electric charge moves from the left side to the right side of the work table 224 along the contact portion between the dicing film T and the work table 224.

  In the conventional dicing apparatus, as shown in FIG. 26, the workpiece W is removed by moving the frame in parallel upward. However, the workpiece W is also bent by the bending of the dicing film T, and the workpiece W is abbreviated. The center finally leaves the worktable 224. Therefore, the electric charge concentrates in the approximate center of the work W that is in contact with the work table 224 until the end, causing damage to the work W. On the other hand, in the dicing apparatus 200, since the workpiece W is gradually peeled from the left side (−y side) and the charge is removed by the ionizer 238, the electric charge does not concentrate at one central position. Therefore, charge concentration at the center of the workpiece W can be prevented, and electrostatic breakdown of the workpiece W can be suppressed. In addition, problems such as damage to the dicing film T due to static electricity can be prevented.

  After the workpiece W is peeled from the workpiece table 224, the jig 226 is moved from the workpiece machining position to the workpiece replacement position, and then the jig 226 is moved by the rotation shaft 227 on the right side (+ y side) of the jig 226. It is rotated. When the jig 226 is rotated, as shown in FIG. 23, the frame F, the dicing film T, and the workpiece W are rotated together with the arcuate movement of the left side (−y side) jig 226. To do. Accordingly, as shown in FIG. 23, water drops of cutting water and cleaning water left on the work W drop toward the jig 226 on the right side (+ y side) of the work table 224. The dropped water droplet is guided to the water storage section 234 through the skirt 237 (see FIG. 21). Thereby, it is possible to prevent water droplets from falling on the work table 224.

  In the conventional dicing apparatus, as shown in FIG. 27, since the frame F moves in a lateral direction while being inclined, water drops on the work W fall on the work table 224, and a problem occurs in the next processing. there's a possibility that. On the other hand, in the dicing apparatus 200, since water drops on the workpiece W fall toward the jig 226, the water drops do not fall on the work table 224, and no trouble occurs during the next processing.

  When the jig 226 is completely turned, the jig 226 is moved to the workpiece end standby position. At the workpiece end standby position, the workpiece W is cleaned by the cleaning device and the drainage device as necessary. All of the water used for cleaning the work W is also stored in the water storage unit 234, and water drops do not adhere to the work table 224, the work W at the work standby position, or the like.

In the dicing apparatus 200 according to the present embodiment, if the operator does not replace the workpiece W even after a predetermined time has elapsed after the machining is finished, the controller 213 moves the workpiece W at the workpiece machining position to the workpiece. The workpiece is moved to the end standby position, the spare workpiece W at the workpiece standby position is disposed on the workpiece table 224, and machining is performed.

  First, the processed workpiece W is removed from the workpiece table 224 by the same method as when the operator operates and instructs the switch of the operation / display unit 211. Thereafter, the jig 226 including the processed workpiece W is moved from the workpiece processing position to the workpiece end standby position via the workpiece replacement position. Thereafter, the jig 226 at the workpiece standby position is rotated around the rotation shaft 227 disposed in the workpiece supply standby section 228 on the left side (−y side) of the workpiece replacement position and moved to the workpiece replacement position. The Thereafter, the jig 226 is moved in the x direction (−x side in FIG. 16), and the notch of the frame F is brought into contact with the pin 225. As a result, the spare workpiece W sandwiched between the jigs 226 placed vertically at the workpiece standby position is placed on the workpiece table 224 in a positioned state. Thereby, the spare workpiece W can be machined. Therefore, even when the operator cannot immediately replace the processed workpiece after the processing is completed, it is possible to perform the processing efficiently without wasting time from the end of the processing to the work replacement operation. .

  When the processing of the spare workpiece W is completed, the lamp for informing the completion of the processing of the indicator lamp blinks. First, the operator rotates the workpiece W (see the dotted lines in FIGS. 16 and 17) that is first processed and vertically placed at the workpiece end standby position to the workpiece replacement position, and then moves the frame from the jig 226 to the frame at the workpiece replacement position. Remove F. Thereafter, the spare work W machined immediately before is removed from the work table 224, moved from the work machining position to the work exchange position, and the frame F is removed from the jig 226 at the work exchange position.

  As described above, according to the present embodiment, a spare work is arranged in advance, and when the operator cannot perform the work replacement work after the machining is finished, the spare work is machined. Therefore, it is possible to perform machining efficiently without wasting time until the workpiece exchange operation is performed.

  Further, according to the present embodiment, since the jig for holding the spare work is vertically placed, the wafer is stored and waited in a very narrow space without taking up a standby space for the spare work. Can be made. Further, by providing a camera, a bar code reader or the like that enables simple alignment before processing the spare workpiece, these incidental facilities can be omitted.

  Further, according to the present embodiment, since the spare work W is sandwiched between the jigs 226 so as to face the opposite side of the work table, the cutting water, cleaning water, and the mist supplied at the time of machining are used as the spare work. Does not adhere to. Therefore, it is possible to prevent the spare work W from becoming dirty and causing problems in alignment and processing. Furthermore, it is possible to prevent water droplets used for workpiece machining from dropping onto the workpiece table and causing problems in machining the next workpiece.

  Further, according to the present embodiment, when removing the processed workpiece from the work table, the jig is rotated about the rotation axis to lift one side, so that static electricity is generated at the center of the workpiece W. Accumulation of the workpiece can be prevented. Furthermore, since the charge is eliminated by the ionizer, problems due to static electricity such as electrostatic breakdown of the workpiece can be prevented.

  Moreover, according to this Embodiment, since a jig | tool waits in a substantially vertical state, the workpiece | work can be simply aligned using the self-weight of a workpiece | work and a jig | tool, ie, gravity. Therefore, it is not necessary to provide a mechanism for aligning the frame, for example, a complicated mechanism for sliding the workpiece. Further, since fine adjustment of the work is not required, the frame can be set at a precise mounting position by a very simple method.

  In the present embodiment, the spare work and the processed work are arranged upright substantially vertically, but the vertical placement direction is not limited to substantially vertical. If there is no space in the process and there is a space, it may be placed vertically in an inclined state at any angle other than the horizontal direction (for example, a desired angle of 45 °, 60 °, etc.).

  Further, in the present embodiment, the jig 226 is rotated around the rotation shaft 227, whereby the vertical arrangement position (work standby position or work end standby position) and the horizontal arrangement position (workpiece) However, the method of moving the jig 226 between the vertical arrangement position and the horizontal arrangement position is not limited to this. As shown in FIG. 24, the jig 226 is rotated around the rotation shaft 227, and the jig 226 is translated in the horizontal direction by a driving means (not shown), so that the vertical arrangement position and the horizontal direction are changed. You may move the jig | tool 226 between these arrangement | positioning positions.

  In this embodiment, as shown in FIGS. 16 and 17, two sets of jigs 226 are arranged. However, as long as there are two or more sets, any number of jigs 226 may be arranged. . For example, if three jigs 226 are provided, as shown in FIG. 25, one set of jigs 226 for clamping the workpieces W for processing and two sets of jigs for clamping the spare workpieces W are provided. A tool 226 is disposed. One set of jigs 226 that sandwich the workpiece W for processing is disposed at the workpiece replacement position, and two sets of jigs 226 that sandwich the spare workpiece W are disposed side by side at the workpiece standby position. When the processing is finished, the jig 226 that holds the processed workpiece W is rotated to the workpiece end standby position, and the spare workpiece W (preliminary workpiece A) disposed adjacent to the workpiece table 224 is clamped. The tool 226 is rotated from the workpiece standby position to the workpiece exchange position, moved from the workpiece exchange position to the workpiece machining position, and the spare workpiece A is placed on the workpiece table 224. The jig 226 that holds (preliminary workpiece B) is translated. When the processing of the preliminary workpiece A is completed, the jig 226 that clamps the first workpiece W at the workpiece end standby position is translated, and the jig 226 that clamps the preliminary workpiece A is rotated to the workpiece end standby position. Then, the jig 226 that holds the preliminary work B is rotated from the work standby position to the work replacement position, and is moved from the work replacement position to the work machining position, so that the preliminary work B is placed on the work table 224. As a result, a plurality of spare workpieces can be arranged in the dicing apparatus.

  Further, in the present embodiment, a description is given of an example of a both-end supported structure in which both ends of the frame F are clamped by one set of jigs 226. It is good.

  In the present embodiment, the bottom surface 231a of the groove 231 is a flat surface, and the straight portion of the flat frame F is brought into contact with the flat surface to position the frame F. However, the positioning is flat. It is not limited to the case where it is performed using. For example, a mountain and a valley may be formed around the frame F, and a peak of the mountain may be brought into contact with the bottom surface 231a of the groove 231, or a mountain and a valley may be formed on the bottom surface 231a of the groove 231. The frame F may be brought into contact, or peaks and valleys may be formed in both the frame F and the groove 231 so that the peaks are brought into contact with each other. At this time, since it is only necessary to maintain the positional accuracy of the peak of the mountain, the labor of processing can be saved as compared with the case of maintaining the accuracy of the entire plane. Further, even if dust is caught between the frame F and the bottom surface 231a of the groove 231, the dust can be released to the valley portion, so that problems such as tilting of the frame can be prevented and alignment can be performed accurately. Can do.

  Moreover, although this Embodiment demonstrated the manual dicing apparatus as an example, it is applicable also to the full auto dicing apparatus which performs carrying in and out of a workpiece | work, and a process automatically.

  DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus, 12 ... Main body frame, 14 ... Housing, 16 ... Supply port, 16A ... Cover, 18 ... Collection port, 18A ... Cover, 20 ... Work table, 21 ... Work placement surface, 21A ... Work placement part , 21B: frame mounting section, 22: work table drive motor, 22A: output shaft, 23: X-axis table, 24: guide rail, 30: processing section, 30A: cover, 31A, 31B: spindle unit, 31a, 31b ... Spindle, 32A, 32B ... Imaging unit, 34A, 34B ... Bracket, 40 ... Work supply standby section, 42 ... Pre-work workpiece placement table, 44 ... Jig placement surface, 46 ... Jig placement groove, 48 ... Workpiece Supply rack, 48A ... frame holding groove, 50 ... work collection standby part, 52 ... work placement table after processing, 54 ... jig placement surface, 56 ... jig placement groove, 58 Work collection rack, 58A ... Frame holding groove, 60 ... Work supply device, 61 ... Work supply motor, 61A ... Output shaft, 62 ... Work supply arm, 63 ... Work supply gripper, 63A ... Grip claw, 63B ... Positioning plate, 63b ... Contact surface, 70 ... Work collection device, 71 ... Work collection motor, 72 ... Work collection arm, 73 ... Work collection gripper, 73A ... Grip claw, 783B ... Positioning plate, 73b ... Contact surface, 80 ... Work cleaning device , 82 ... Cleaning liquid nozzle, 90 ... Jig, 90 A ... Left side part, 90 B ... Right side part, 90 C ... Rear side part, 100 ... Work supply and recovery device, 102 ... First frame, 104 ... First hinge, 106 ... Second Frame 108 108 Second hinge 110 Third frame 112 First swing driving device 114 Second swing driving device 116 Gripper 2 DESCRIPTION OF SYMBOLS 0 ... Dicing apparatus 211 ... Operation / display part 212 ... Monitor television, 213 ... Controller, 214 ... Cover, 220 ... Processing part, 221 ... Spindle, 222 ... Blade, 223 ... Imaging means, 224 ... Work table, 225 ... Pins, 226... Jig, 227... Rotating shaft, 230... Main body part, 213... Groove, 231 a. Mesh filter, 236 ... wall, 237 ... skirt, 238 ... ionizer, W ... work, F ... frame, T ... dicing film

Claims (2)

A bendable film is attached to the inside of an annular frame having an inner diameter larger than the outer diameter of the work, and a table for holding the work mounted on the film, the surface having the film attached thereto A workpiece recovery device that recovers the workpiece from a table that holds the workpiece by suction,
By gripping the frame, by gradually tilting Rukoto the frame, the film gradually lifted from one side of the table, the mounted the work on the film, the via the film table Work collection device to collect from. A bendable film is attached to the inside of an annular frame having an inner diameter larger than the outer diameter of the work, and a table for holding the work mounted on the film, the surface having the film attached thereto A workpiece collection method for collecting the workpiece from a table that holds and holds the workpiece,
By gripping the frame, by gradually tilting Rukoto the frame, the film gradually lifted from one side of the table, the mounted the work on the film, the via the film table Work collection method to collect from.

Images