JP5891544B2 - Resin sealing device - Google Patents

Description

  The present invention relates to a resin sealing device for transfer molding a workpiece.

There is a growing need for high-quality transfer molding of large-capacity workpieces such as in-vehicle ECUs and MCM devices. In addition, in an electronic module such as an in-vehicle ECU, electronic components are mounted on both sides of a circuit board, and in particular, a discrete component such as an aluminum capacitor cannot apply a large resin pressure (for example, 1 MPa or more). .
Therefore, there is a need to perform resin molding with different resin characteristics in the same package such as low pressure molding and high pressure molding with higher resin pressure, resin elasticity, sealing material and the like depending on the work.

  In addition, when transfer molding a package with a large amount of resin, since the resin is pumped into the cavity recess through the pot, runner, and gate, the molding margin increases and mold wear easily progresses. Arise.

In addition to the first plunger that injects molten resin into the cavity, the transfer mold device that resin molds a relatively large capacity work is provided with a second plunger that is pushed back by the resin pressure of excess resin overflowing from the cavity. Therefore, a configuration in which the height of the protrusion formed on the package portion is suppressed has been proposed (see Patent Document 1).
Also, as a resin sealing device that eliminates variations in injection pressure due to multiple plungers and completes resin filling in a short time, a main drive device that drives multiple plungers in the housing together with the housing individually The structure which provided the auxiliary drive device which drives a plunger is proposed (refer patent document 2).

JP 2002-299358 A Japanese Patent Laid-Open No. 11-207773

  However, the transfer molding apparatus disclosed in Patent Documents 1 and 2 cannot transfer a large-capacity workpiece with high quality. In addition, it is difficult to realize electronic parts such as aluminum capacitors that require low pressure molding and high pressure molding with a higher resin pressure by molding the same package. Therefore, resin molds having different resin characteristics cannot be performed.

  The present invention solves the above-mentioned problems of the prior art and provides a highly versatile resin sealing apparatus capable of performing transfer molding under optimum conditions according to various workpieces having a relatively large capacity and the same or different resin characteristics. It is to provide.

In order to achieve the above object, the present invention comprises the following arrangement.
A cavity recess is formed on at least one clamping surface, and a plurality of pots in which a pair of cavity inserts for clamping a workpiece supplied in alignment with the cavity recess and a plunger are respectively housed so as to be movable up and down are assembled. A pair of center inserts formed with a resin path to be fed out from the pair, a pair of mold chases that respectively support the cavity insert and the center insert, a pair of mold bases that respectively support the pair of mold chases, A multi-plunger unit having a plurality of plungers each assembled in a plurality of pots so as to be movable up and down, wherein the multi-plunger unit sends at least resin in the pot at a first timing in accordance with a workpiece. And later second timing Sending with a plunger driving section for driving the second plunger, the plunger driving section, the first plunger the first by pushing plate with a coil spring for biasing supporting said first plunger is raised The second plunger is operated at a second timing that is later than the first timing by operating at the timing, and the push plate is further lifted together with the support plate that supports the second plunger. It is characterized by that.
According to the above configuration, a multi-plunger unit, the resin in the pot by the first plunger and out feeding at a first timing by the spring force of the coil spring provided in the push plate by pressing the plate is raised, When the push plate is further raised integrally with the support plate , the resin in the pot is sent out by the second plunger at the second timing later than that, so that the resin pressure and the resin supply amount of each pot are the same or different. Therefore, transfer molding can be performed under optimum conditions corresponding to various workpieces having a relatively large capacity and the same or different resin characteristics.

Resin having the same or different resin characteristics may be used for the resin supplied to the cavity recess before mold clamping and the resin supplied into the pot.
In this case, in the case of a resin having the same resin characteristics, a large-capacity package can be efficiently resin-molded. When the resin characteristics are different, resin filling (low pressure molding and high pressure molding) that matches the device conditions of the electronic component mounted on the workpiece can be realized at the same time.

The liquid resin or granular resin may be previously supplied onto the workpiece and set in the cavity recess and clamped to the pair of cavity inserts.
In this case, the liquid resin or granule resin supplied onto the workpiece has little flow, and it is sufficient to feed a predetermined amount of resin for applying the final resin pressure from the pot to the cavity recess by transfer molding. Can be stopped.

You may make it the said workpiece | work clamped by said pair of cavity insert in the state which one electronic component of the workpiece | work with which the electronic component was mounted on both surfaces of the circuit board was immersed in the resin fuse | melted in the cavity recessed part.
Thereby, an electronic component such as an aluminum capacitor that requires low pressure molding can be immersed in the molten resin in the cavity recess to perform low pressure molding of 1 MPa or less, and other electronic components can be transferred from the pot by transfer molding. High pressure molding can be performed by feeding a molten resin having a high resin pressure.

In the lower mold cavity recess formed in the lower mold cavity insert, it is preferable that a support pin for supporting the substrate portion of the workpiece is provided so as to be retractable.
According to this, even if the workpiece is an in-vehicle ECU or the like, the substrate can be resin-sealed by preventing the substrate from bending in the lower mold cavity recess.

There may be provided a lower mold plunger for sending resin to the lower mold cavity recess at the first timing and an upper mold plunger for feeding resin to the upper mold cavity recess at a second timing later than that.
In this case, the resin can be supplied in advance to the concave portion of the lower mold cavity and the work electronic parts can be immersed in the molten resin, and the molten resin is pumped from the pot to the concave portion of the upper mold cavity to obtain the final resin pressure. It can be sealed. Therefore, it is possible to simultaneously realize resin molding (low pressure molding and high pressure molding) in accordance with the device conditions of electronic components mounted on workpieces having different resin characteristics.

The first plunger is supported by a coil spring having a relatively long coil length, and the second plunger is supported by a coil spring having a relatively short coil length. It may be supported through the support plate .
Thereby , the resin pressure can be changed by supporting the first plunger and the second plunger on the coil springs having different restoring forces .

The plunger driving unit may be provided with a driving source for individually driving a plurality of plungers.
In this case, it is possible to perform resin molding with the same or different resin characteristics in accordance with various device conditions of the electronic component as the workpiece under the same or different conditions by the drive control of each drive source.

  As described above, it is possible to provide a highly versatile resin sealing apparatus capable of performing transfer molding under optimum conditions according to various workpieces having a relatively large capacity and the same or different resin characteristics.

It is principal part sectional drawing of a resin sealing device at the time of mold opening / closing, a lower mold top view, an upper mold top view, an insert sectional view including a lower mold plunger, and an insert sectional view including an upper mold plunger. It is lower mold insert sectional drawing which shows a resin supply form. It is insert cross-sectional explanatory drawing of the resin mold operation | movement using the resin sealing apparatus of FIG. It is principal part sectional drawing of the resin sealing device at the time of a lower mold plunger raising, a lower mold top view, an insert sectional view including a lower mold plunger, and an insert sectional view including an upper mold plunger. It is principal part sectional drawing of a resin sealing device at the time of an upper mold plunger raise, a lower mold top view, an insert sectional view including a lower mold plunger, and an insert sectional view including an upper mold plunger. It is principal part sectional drawing and the lower mold | type top view of the resin sealing apparatus which concerns on another example. It is principal part sectional drawing at the time of the workpiece clamp of the resin sealing apparatus which concerns on another example, and principal part sectional drawing at the time of a lower mold shaping | molding. It is principal part sectional drawing at the time of the upper mold | type shaping | molding following FIG. It is principal part sectional drawing of the resin sealing apparatus which concerns on another example, a lower mold top view, insert sectional drawing containing a lower mold plunger, and insert sectional drawing containing an upper mold plunger. It is a lower mold | type top view which concerns on another example. It is principal part sectional drawing and the lower mold | type top view of the resin sealing apparatus which concerns on another example. It is principal part sectional drawing and the lower mold | type top view of the resin sealing apparatus which concerns on another example.

[First embodiment]
Hereinafter, preferred embodiments of a resin sealing device according to the present invention will be described in detail with reference to the accompanying drawings.
First, the principal part structure of a resin sealing device is demonstrated with reference to FIG. 1 (A)-(E). As the workpiece, a circuit board 2 (resin board, ceramic board, etc.) such as an in-vehicle ECU on which electronic components 1 are mounted on both sides of the board will be described as an example.

  In FIG. 1A, an upper mold cavity insert 4 and an upper mold center insert 5 (upper mold pot insert) are assembled to an upper mold chase 6 (mold chase). The upper mold chase 6 is supported by an upper mold base 7 (mold base). There may be cavity inserts on both sides of the center insert. In the following, a cavity insert on only one side will be illustrated and described for easy understanding.

  As shown in FIG. 1C, the upper mold cavity insert 4 is formed with an upper mold cavity recess 4a and upper mold runner gates 4b connected to the upper mold cavity recess 4a. The upper mold center insert 5 is for an upper mold runner 5a connected to the upper mold runner gate 4b, an upper mold cull 5b linked to the upper mold runner 5a, and a lower mold cavity disposed between the upper mold cull 5b. An upper mold runner 5d connected to the upper mold cull 5c and the lower mold cavity recess 9a connected thereto is formed.

  In FIG. 1A, a lower mold cavity insert 9 and a lower mold center insert 10 (lower mold pot insert) are assembled to a lower mold chase 11 (mold chase). The lower chase 11 is supported by a lower mold base 12 (mold base). In addition, an ejector pin plate 13 in which an ejector pin (not shown) is formed upright is provided between the lower die chase 11 and the lower die base 12. The ejector pin is retracted flush with the lower mold cavity recess in the mold clamp state, and protrudes from the lower mold cavity recess at the same time as the mold is opened to release the molded product.

Further, as shown in FIG. 1B, the lower mold cavity insert 9 is formed with a lower mold cavity recess 9a and a lower mold runner gate 9b continuous therewith at one location. A substrate mounting portion 9c having a shallower recess depth is formed around the lower mold cavity recess 9a.
The lower mold center insert 10 is formed with a lower mold runner 10a that connects the upper mold runner 5d and the lower mold runner gate 9b to the upper mold center insert 5. The lower mold center insert 10 is provided with a lower mold pot 14 and upper mold pots 15 on both sides thereof.

  In FIG. 1A, a multi-plunger unit 16 is provided below the lower mold center insert 10. A lower mold plunger 14a is inserted and assembled in the lower mold pot 14, and an upper mold plunger 15a is inserted and assembled in the upper mold pot 15.

  The plunger drive unit 17 is provided with a support plate 17a that supports the upper mold plunger 15a and a push plate 17b that supports the lower mold plunger 14a. The lower mold plunger 14 a is supported via a coil spring 18. The upper mold plunger 15a is fixed to the support plate 17a. The support plate 17a is supported so as to be movable toward and away from the push plate 17b. The push plate 17b is lifted and lowered by being transmitted by a drive source (not shown) such as an electric motor. A stopper portion 17c is provided on the opposing surface of the push plate 17b facing the support plate 17a.

  As will be described later, the plunger drive unit 17 feeds at least the resin in the lower mold pot 14 at a first timing by the lower mold plunger 14a (first plunger) according to the workpiece, and the resin in the upper mold pot 15 Is driven by the upper mold plunger 15a (second plunger) at a second timing later than that.

  The mold mold is provided with cavity recesses on the clamp surfaces of the upper mold and the lower mold, but a cavity recess may be formed on at least one of the clamp surfaces. Further, the multi-plunger unit 16 drives a plunger that drives at least a first plunger that sends out the resin in the pot at a first timing and a second plunger that sends out the resin in the pot at a second timing later than the first plunger. If it is provided with a portion, further plungers may be driven at different timings.

  According to the above configuration, the multi-plunger unit 16 delivers the resin in the lower mold pot 14 at the first timing and the resin in the upper mold pot 15 at the second timing later than that. Since the upper mold plunger 15a is driven, the resin pressure and the resin supply amount of each pot are the same or different, and transfer molding is performed under optimum conditions according to various workpieces having the same or different resin characteristics with a relatively large capacity. be able to.

  As shown in FIGS. 1D and 1E, a support pin 19 that supports the circuit board 2 is provided in the lower mold cavity recess 9a formed in the lower mold cavity insert 9 so as to be retractable. As shown in FIG. 1B, four support pins 19 are provided in the vicinity of the corner portions at the four locations of the lower mold cavity recess 9a. The support pins 19 support the circuit board 2 when clamping the mold mold into which the workpiece has been carried in, and the lower mold until the final resin pressure is applied to the upper mold cavity recess 4a and the lower mold cavity recess 9a. It is retracted from the cavity 9a. According to this, even if the workpiece is an in-vehicle ECU or the like, the circuit board 2 can be resin-sealed while preventing the circuit board 2 from bending in the lower mold cavity recess 9a.

The resin supplied to the lower mold cavity recess 9a and the resin supplied to the lower mold pot 14 and the upper mold pot 15 may be either resins having the same or different resin characteristics.
In this case, in the case of a resin having the same resin characteristics, a large-capacity package can be efficiently resin-molded. When the resin characteristics are different, resin filling (low pressure molding and high pressure molding) that matches the device conditions of the electronic component mounted on the workpiece can be realized at the same time.

As shown in FIG. 2, the liquid resin or granule resin 20 is supplied in advance to the work (circuit board 2) and set on the board mounting portion 9c (see FIG. 1B) of the lower mold 8. The upper mold cavity insert 4 and the lower mold cavity insert 9 may be clamped. In addition, liquid resin or granule resin 20 is supplied in advance to the lower mold cavity recess 9a before the work is supplied.
In this case, the liquid resin or granule resin 20 supplied onto the work has little flow, and it is sufficient to feed a predetermined resin amount for applying the final resin pressure from the pot to the cavity recess by transfer molding. It can be sealed.

Next, an example of the resin molding operation will be described with reference to FIGS.
FIG. 3A shows a state where the mold is opened. At this time, the support pin 19 protrudes into the lower cavity cavity 9a of the lower cavity insert 9.
In this state, as shown in FIG. 3B, the granular resin 20 (or liquid resin) is supplied into the lower mold cavity recess 9 a and the lower mold pot 14. Although not shown, the granular resin 20 (or liquid resin) is also supplied to the upper mold pot 15.

In FIG. 3C, the resin 20 in the lower mold cavity recess 9a and the lower mold pot 14 is melted by preheating by a heater (not shown) built in the lower mold 8.
In this state, the circuit board 2 which is a work is positioned and placed on the board placing portion 9c (see FIG. 1B). At this time, as shown in FIG. 3D, the circuit board 2 is set so that an aluminum capacitor suitable for low-pressure molding in the electronic component 1 is immersed in the resin 20 in the lower cavity cavity 9a. Since the circuit board 2 is supported by the support pins 19 even if it has a relatively large size, it does not bend.

  Next, as shown in FIGS. 3E and 3F, the circuit board 2 is clamped by the upper mold 3 and the lower mold 8 (mold mold), and the plunger driving unit 17 is operated to release the resin from the lower mold pot 14. 20 is filled into the lower mold cavity recess 9a (FIG. 4C), and the resin 20 is filled from the upper mold pot 15 into the upper mold cavity recess 4a (FIG. 4D).

The resin filling operation will be described with reference to FIGS.
In FIG. 4 (A), the plunger drive part 17 raises the pushing plate 17b first, when the drive source which is not shown in figure operates. The push plate 17b moves up until the stopper portion 17c hits the support plate 17a. At this time, only the lower mold plunger 14a rises in the lower mold pot 14 at the first timing via the coil spring 18 in FIGS. 4 (A) and 4 (B), and as shown in FIG. The molten resin 20 in the pot is filled into the lower mold cavity recess 9a through the upper mold cull 5c, the upper mold runner 5d, and the lower mold runner gate 9b. The resin pressure to be filled is low pressure molding of 1 MPa or less. Since the resin 20 is supplied to the lower mold cavity recess 9a in advance, the electronic component 1 such as an aluminum capacitor is immersed in the molten resin 20 in the lower mold cavity recess 9a, so that the resin molding is performed with a resin pressure that matches the device conditions. can do.
Further, as shown in FIG. 4D, the upper mold plunger 15a is in a standby state while the upper mold pot 15 is filled with the resin 20.

  Next, when the plunger driving portion 17 continues to rise while the pushing plate 17b is in contact with the stopper portion 17c or the supporting plate 17a, the plunger driving portion 17 pushes the supporting plate 17a together. Accordingly, as shown in FIGS. 5A and 5B, the upper plunger 15a is raised at the second timing later than the lower plunger 14a, and the upper die 5b and the upper die 5b are moved upward as shown in FIG. The molten resin 20 in the upper mold pot 15 is filled into the upper mold cavity recess 4a through the mold runner 5a and the upper mold runner gate 4b. The resin pressure to be filled is high pressure molding corresponding to a final resin pressure greater than 1 MPa. The support pins 19 projecting into the lower mold cavity recess 9a and supporting the circuit board 2 are retracted from the lower mold cavity recess 9a after being filled with the lower mold resin and before curing. Further, as shown in FIG. 5C, the lower plunger 14a in the lower mold pot 14 is in a stopped state while being raised.

  As a result, the electronic component 1 that requires low pressure molding such as an aluminum capacitor can be immersed in the molten resin 20 in the lower mold cavity recess 9a to perform low pressure molding of 1 MPa or less. High pressure molding can be performed by pressure-feeding the molten resin 20 having a higher resin pressure from the lower mold pot 14 and the upper mold pot 15 by molding. Therefore, resin filling (low pressure molding and high pressure molding) that matches the device conditions of electronic components mounted on workpieces having different resin characteristics can be realized simultaneously.

  Further, the circuit board 2 constituting the workpiece may be provided with through-holes communicating with the cavity recesses formed in the upper mold cavity insert 4 and the lower mold cavity insert 9, respectively. In this case, it is not necessary to form gates on both of the upper mold cavity insert 4 and the lower mold cavity insert 9, and the molten tree is filled in each cavity recess through the through hole in the cavity recess. Wear can be reduced. In this case, the resin filled in the cavity recesses of the upper mold and the lower mold may have different types of resin characteristics and conditions, but resins having the same resin characteristics and conditions are preferable.

[Second Embodiment]
Next, another configuration of the resin sealing device will be described with reference to FIG. In addition, the same number is attached | subjected to the same member as 1st Example, and description shall be used.
As shown in FIG. 6A, the lower mold center insert 10 has lower mold pots 14 assembled at two locations, and the upper mold pot 15 is assembled between the lower mold pots 14. ing. A lower mold plunger 14 a is inserted into the lower mold pot 14, and an upper mold plunger 15 a is inserted into the upper mold pot 15. In the plunger drive unit 17, the two lower mold plungers 14 a are supported by the push plate 17 b via the coil spring 18. The upper mold plunger 15a is fixed to the support plate 17a.

In FIG. 6B, a lower mold runner 10a is formed in the lower mold center insert 10, and a lower mold runner gate 9b communicating with the lower mold runner gate 9b is formed. For example, when the work forms a large-capacity package in which the electronic component 1 is integrated on the circuit board 2, such a configuration is adopted when the amount of resin filled in the lower mold cavity recess 9 a is increased by low-pressure molding. Can do.
In addition, although the present Example illustrated the case where there were two lower mold pots and one upper mold pot, the number of pots and plungers can be further increased.

[Third embodiment]
Another example of the resin sealing device will be described with reference to FIGS. In addition, the same number is attached | subjected to the same member as 1st Example, and description shall be used. The plunger driving unit 17 may include a pressing plate 17b including coil springs with different elastic forces that bias and support a plurality of plungers.

  In FIG. 7A, the lower mold plunger 14a is supported on the push plate 17b by a coil spring 18a having a long coil length. In addition, the upper plunger 15a is supported on the push plate 17b by a coil spring 18b having a short coil length. The restoring force of the coil spring 18b is larger than the restoring force of the coil spring 18a. Each plunger is supported through the support plate 17a.

  FIG. 7A shows a state in which the workpiece (circuit board 2) is clamped by the upper mold 3 and the lower mold 8. FIG. Each of the lower mold pot 14 and the upper mold pot 15 is loaded with a resin 20 (tablet resin, granular resin, liquid resin, etc.) for molding at the final resin pressure. At this time, the coil springs 18a and 18b are compressed by the weight of the plunger and the resin.

  Next, in FIG. 7B, when the plunger driving portion 17 is operated to raise the pushing plate 17b, the coil spring 18a is compressed and the lower plunger 14a is raised at the first timing, The molten resin 20 in the mold pot 14 is filled into the lower mold cavity recess 9a at a low pressure. At this time, since the spring length of the coil spring 18b does not change, the upper mold plunger 15a is in a standby state.

  In FIG. 8, when the pushing plate 17b continues to rise further, the coil spring 18b is pushed and shrunk, and the upper mold plunger 15a rises at the second timing behind the first timing, and the molten resin in the upper mold pot 15 rises. 20 is filled in the upper mold cavity recess 4a with the final resin pressure increased. The raising operation of the push plate 17b stops at a position where the stopper portion 17c hits the support plate 17a. As described above, the resin pressure between the plurality of plungers may be changed using coil springs having different restoring forces.

[Fourth embodiment]
Another example of the resin sealing device will be described with reference to FIG. In addition, the same number is attached | subjected to the same member as 1st Example, and description shall be used. In this embodiment, as shown in FIGS. 9C and 9D, a case where a work molds only one surface of the circuit board 2 will be described. In the upper mold 3, the upper mold cavity insert 4 is not formed with a resin path in the upper mold center recess 5 a connected to the upper mold cavity recess 4 a. Further, since only the lower mold cavity recess 9a is provided, neither the upper mold pot 15 nor the upper mold plunger 15a is provided.
Although it is only the lower mold cavity 9a, it may be difficult to fill the resin depending on the electronic component 1 mounted on the substrate, and furthermore, there is a restriction of the resin pressure depending on the device conditions, so low pressure molding and higher high pressure molding are possible. It is necessary to mold separately. The resin 20 has the same resin characteristics, but may be different.

In FIG. 9A, the lower mold center insert 10 has a lower mold pot 14 and a lower mold plunger 14a assembled at three locations.
The plunger lower part 14a of the center part is supported by the pushing plate 17b via the coil spring 18 at the plunger drive part 17, and the lower part plunger 14a of the both sides is being fixed to the support plate 17a. In FIG. 9B, a lower mold runner 10a is formed in the lower mold center insert 10, and a lower mold runner gate 9b is formed in the lower mold cavity insert 9, and these communicate with the lower mold cavity recess 9a. In FIG. 9C, an upper mold cull 5c and an upper mold runner 5d are formed in the upper mold center insert 5 so as to communicate with the lower mold runner 10a.

  In FIG. 9A, when the plunger driving portion 17 is operated to raise the pushing plate 17b, the coil spring 18 is compressed and the lower plunger 14a in the center rises at the first timing, and the center The molten resin 20 in the lower mold pot 14 is filled into the lower mold cavity recess 9a at a low pressure. At this time, the lower plungers 14a on both sides are in a standby state.

  When the pushing plate 17b continues to rise further and the stopper portion 17c hits the support plate 17a, the lower mold plungers 14a on both sides rise at the second timing behind the first timing and melt in the lower mold pots 14 on both sides. The resin 20 is filled in the lower mold cavity recess 9a with the final resin pressure increased.

  Note that the support pins 19 that support the workpiece (circuit board 2) shown in FIG. 9C can be omitted. Further, as shown in FIG. 9D, a predetermined amount of granular resin or liquid resin 20 may be supplied in advance to the lower mold cavity recess 9a before the work is carried in, or may be omitted. .

  In the case of a product in which the workpiece is molded on one side, as shown in FIG. 10, a movable partition wall 21 that partitions the lower mold cavity recess 9 a of the lower mold cavity insert 9 may be provided so as to advance and retreat. In this case, the resin is filled in the molding area P surrounded by the electronic component 1 at the first timing first, and then the molding area Q is filled with the resin in the second timing, It is preferable to retract the movable partition wall 21 before the resin filling into the lower mold cavity recess 9a is completed.

Thereby, in the molding of the same package, the resin can be molded in a state of being divided into a plurality of molding areas P and Q by the movable partition wall 21, and the resin filling property matching the integration degree of the electronic component 1 which is a work is ensured. Can do.
In the above-described embodiment, the case where the lower mold cavity 9 is provided with the lower mold cavity recess 9a has been described. However, the present invention can be applied even when the upper mold 3 is provided with only the upper mold cavity recess 4a.

[Fifth embodiment]
Another example of the resin sealing device will be described with reference to FIG. In addition, the same number is attached | subjected to the same member as 4th Example, and description shall be used. In this embodiment, the cavity recesses provided in the upper mold 3 and / or the lower mold 8 may be supplied with resin from the resin paths corresponding to the plungers, respectively.
As shown in FIG. 11B, a plurality of lower cavity cavities 9a are formed on the clamping surface of the lower mold cavity insert 9, and each lower cavity cavity 9a is connected in series by a connection runner 9d. Are formed in three rows. A lower mold runner gate 9b is formed in the lower mold cavity recess 9a in the vicinity of the lower mold center insert 10. The lower mold center insert 10 is formed with a lower mold runner 10a connected to the lower mold runner gate 9b. The lower mold center insert 10 is formed with an upper mold cull 5c facing the lower mold pot 14 and an upper mold runner 5d connected to the lower mold runner 10a as in FIG. 9C.

  In FIG. 11A, the lower mold center insert 10 is provided with three lower mold pots 14 and lower mold plungers 14a at three locations according to the arrangement of the respective lower mold cavity recesses 9a. The configuration of the plunger drive unit 17 is a configuration in which the resin filling timing can be changed between the lower plunger 14a at the center and the lower plungers 14a on both sides, but the push plate 17b and the support plate 17a are integrated. The lower mold cavity row may be filled with the resin 20 at the same timing.

In addition, when it is desired to change the resin pressure according to the workpiece, for example, the lower plunger 14a in the center is first raised and filled with resin at a low pressure, and then the lower plunger 14a is raised on both sides to raise the resin. You may make it fill with the resin pressure higher than it.
Moreover, although the said Example demonstrated the workpiece | work to carry out the single-sided molding, the workpiece | work to carry out the double-sided molding in which the upper mold | type cavity insert 4 is provided in the upper mold | type cavity insert 4 may be sufficient.
Also in this case, resin molds having the same or different resin characteristics (resin pressure, resin elasticity, sealing material, etc.) can be performed depending on the cavity recess.

[Sixth embodiment]
Another example of the resin sealing device will be described with reference to FIG. In addition, the same number is attached | subjected to the same member as 5th Example, and description shall be used. In the present embodiment, the plunger drive unit 17 is provided with drive sources for individually driving a plurality of plungers.

  As shown in FIG. 12B, the mold has the same structure as the mold shown in FIG. 11B. The lower mold 3 is provided with a plurality of rows of lower mold cavity recesses 9a. The pot 14 and the lower mold plunger 14a are arranged to form a single-side mold type mold.

In FIG. 12A, the lower plunger 14a in the center of the plunger driving unit 17 is raised and lowered at the first timing by the first driving unit 22 (cylinder, electric motor, etc.), and the lower plungers on both sides thereof. 14a is moved up and down at a second timing by a second drive unit 23 (cylinder, electric motor, etc.). The first and second drive units 22 and 23 can be operated at the same timing.
In this case, the resin can be molded in accordance with various device conditions of the electronic component 1 under the same or different conditions by driving control of the drive sources 22 and 23.

  Although the above-described resin sealing apparatus has been described using a lower mold pot arrangement type mold, an upper pot arrangement mold may be used. Further, it can be arbitrarily set which of the upper mold 2 and the lower mold 3 is a fixed mold and which is a movable mold.

  DESCRIPTION OF SYMBOLS 1 Electronic component 2 Circuit board 3 Upper mold 4 Upper mold cavity insert 4a Upper mold cavity recessed part 4b Upper mold runner gate 5 Upper mold center insert 5b, 5c Upper mold cal 5a, 5d Upper mold runner 6 Upper mold chase 7 Upper mold base 8 Lower mold 9 Lower mold cavity insert 9a Lower mold cavity recess 9b Lower mold runner gate 9c Substrate mounting part 9d Connection runner 10 Lower mold center insert 10a Lower mold runner 11 Lower mold chase 12 Lower mold base 13 Ejector pin plate 14 Lower mold pot 14a Lower mold plunger 15 Upper mold pot 15a Upper mold plunger 16 Multi-plunger unit 17 Plunger drive section 17a Support plate 17b Pushing plate 17c Stopper section 18 Coil spring 19 Support pin 20 Resin 21 Movable partition wall 22 1st drive part 23 2nd drive part

Claims (7)

A cavity recess is formed in at least one of the clamping surfaces, and a pair of cavity inserts for clamping the workpiece supplied in alignment with the cavity recess;
A pair of center inserts in which a plurality of pots each containing a plunger that can be moved up and down are assembled, and a resin path that is fed out from each pot is formed;
A pair of mold chases that respectively support the cavity insert and the center insert;
A pair of mold bases that respectively support the pair of mold chases;
A multi-plunger unit having a plurality of plungers assembled so as to be movable up and down in the plurality of pots,
The multi-plunger unit includes a plunger driving unit that drives a first plunger that sends at least resin in the pot at a first timing and a second plunger that sends the resin at a second timing later than the first plunger according to a work,
The plunger driving unit causes the first plunger to operate at a first timing by raising a push plate provided with a coil spring that biases and supports the first plunger, and the push plate is moved to the second timing. A resin sealing device , wherein the second plunger is operated at a second timing that is later than the first timing by further rising together with a support plate that supports the plunger .   The resin sealing device according to claim 1, wherein the resin supplied to the cavity recess before mold clamping and the resin supplied into the pot are resins having the same or different resin characteristics.   3. The resin sealing device according to claim 1, wherein the resin sealing device is set in the cavity concave portion and is clamped to the pair of cavity inserts in a state in which liquid resin or granular resin is supplied on the workpiece in advance.   4. The workpiece according to claim 1, wherein the workpiece is clamped to the pair of cavity inserts in a state in which one of the workpieces on which the electronic components are mounted on both sides of the circuit board is immersed in a resin melted in the cavity recess. The resin sealing apparatus of any one of Claims.   The resin sealing according to any one of claims 1 to 4, wherein a support pin for supporting a substrate portion of the workpiece is provided in a lower mold cavity recess formed in the lower mold cavity insert. apparatus.   6. The apparatus according to claim 1, further comprising: a lower mold plunger that sends the resin to the lower mold cavity recess at the first timing; and an upper mold plunger that sends the resin to the upper mold cavity recess at a second timing later than the lower plunger. The resin sealing device according to item 1. The first plunger is supported by a coil spring having a relatively long coil length, and the second plunger is supported by a coil spring having a relatively short coil length. The resin sealing device according to any one of claims 1 to 6, wherein the resin sealing device is supported through the support plate .

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