JP5877327B2 - Screen printing device, failure cause analysis device in screen printing, and failure cause analysis method - Google Patents

Description

  The present invention relates to a screen printing apparatus that prints paste such as cream solder on a substrate, and an analysis apparatus and analysis method for a cause of defects in screen printing.

  In a component mounting process for mounting electronic components on a substrate, a screen printing operation for printing paste such as cream solder on the substrate is performed prior to component mounting. In recent years, with the miniaturization of electronic devices, small-sized resin substrates have come to be used in a wide range, and screen printing work for such small-sized substrates generally targets multiple substrates. In many cases, a plurality of small-sized individual substrates are held by a carrier (see Patent Document 1). In the prior art shown in this patent document example, the position recognition mark and the printed solder position are recognized for the carrier after solder printing, and the solder position deviation is based on the recognition result and the electrode position information on the individual substrate. Data is calculated for each individual substrate and fed forward to a subsequent process.

JP 2008-294033 A

  However, it is difficult to analyze the cause of defects in order to ensure the printing position accuracy when performing solder printing collectively for a plurality of individual substrates held by a carrier, including the above-described patent document examples. There was a problem. That is, during screen printing, it is desirable to align the electrodes formed on each individual substrate and the pattern holes formed on the screen mask as much as possible, but a plurality of individual pieces held by the carrier are required. When the substrate is a target, the positional deviation between the electrode and the pattern hole occurs due to multiple factors as described below.

  First, a resin substrate such as an FPC used as an individual substrate has a property of easily expanding and contracting due to a change with time after manufacture, and variations in electrode positions on the individual substrate are inevitable. In addition, since the work of holding the individual substrate on the carrier is often performed manually, the alignment accuracy at the time of holding is not guaranteed, and the position on the carrier differs for each individual substrate. When the carrier held on the positioning table is aligned with the screen mask in the screen printing apparatus, errors due to machine-specific machine differences cannot be avoided. For this reason, even if a print position deviation exceeding the allowable range is detected in the print inspection after screen printing, it is not possible to accurately analyze the cause of the print defect, There was a problem that it was difficult to plan properly.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a screen printing apparatus, an apparatus for analyzing the cause of defects in screen printing, and an analysis method capable of accurately analyzing the cause of defective printing position misalignment and properly planning countermeasures for defects. And

The screen printing apparatus according to the present invention is a screen printing apparatus that targets a plurality of individual substrates held by a carrier and collectively prints a paste for joining components on electrodes formed on these individual substrates. Then, by sliding a squeegee on the screen mask supplied with the paste, the paste is applied to each individual substrate of the carrier positioned and held by the substrate positioning portion through the pattern holes formed in the screen mask. A screen printing mechanism for printing, a mark recognition unit for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate, and the substrate positioning based on the recognition result of the mark recognition unit Position for aligning the carrier with respect to the screen mask by controlling the part Reference data used in alignment of the alignment control unit and the carrier, printing position data indicating a positional relationship between the pattern hole arrangement and the mask recognition mark, and the electrode and the position reference mark on the individual substrate A data storage unit that stores electrode position data indicating the positional relationship for each board type, and measurement of solder position deviation for each individual board obtained by solder inspection performed on each printed board A failure cause analysis processing unit for executing a failure cause analysis process for analyzing the cause of the defect with respect to the position deviation and outputting an analysis result based on the result, and the failure cause analysis processing unit is provided in the mark recognition unit. the screen and recognition control unit to recognize the position reference mark for a particular individual substrate, by the alignment control section based on the result of the recognition In the alignment processing unit for aligning the carrier with respect to the disk and the measurement result of the solder position deviation, if a position deviation outside the prescribed range predefined for the specific individual substrate is detected, the screen An analysis result indicating that the printing apparatus is caused by a misalignment of the carrier is output, and if a positional deviation outside the specified range is detected for each of the individual substrates other than the specific individual substrate, it is transferred to the carrier. The analysis result to the effect that is caused by misalignment of individual substrates, and if the variation range of the positional deviation on the same individual substrate exceeds the allowable range, the analysis result to the effect that the individual substrates are expanded or contracted And an analysis result output processing unit.

The apparatus for analyzing the cause of defects in screen printing according to the present invention targets a plurality of individual substrates held by a carrier, and collectively prints a paste for joining components on electrodes formed on these individual substrates. In the screen printing apparatus, for analyzing the cause of the defect in the positional deviation based on the measurement result of the solder positional deviation for each individual board obtained by the solder inspection performed on the individual board after printing. A failure cause analysis device that executes failure cause analysis processing and outputs an analysis result, wherein the screen printing device is positioned and held on a substrate positioning unit by sliding a squeegee on a screen mask supplied with the paste. A screen mark for printing a paste on each individual substrate of the carrier formed through a pattern hole formed in the screen mask A mechanism, mark recognition means for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate, and controlling the substrate positioning unit based on the recognition result of the mark recognition means Thus, an alignment control unit that aligns the carrier with respect to the screen mask, and reference data used in the alignment of the carrier, the positional relationship between the pattern hole array and the mask recognition mark And a data storage unit that stores, for each substrate type, electrode position data indicating the positional relationship between the electrode on the individual substrate and the positional reference mark. a recognition control unit to recognize the position reference mark of the substrate, the alignment control based on the recognition result In the alignment processing unit for aligning the carrier with respect to the screen mask and the measurement result of the solder position deviation, if a position deviation outside the prescribed range prescribed in advance for the specific individual substrate is detected. For example, if an analysis result indicating that the screen printing apparatus is caused by a misalignment of the carrier is output, and a positional deviation outside the specified range is detected for individual substrates other than the specific individual substrate, , Output an analysis result to the effect that the individual substrate is misaligned with the carrier, and if the variation range of the positional deviation in the same individual substrate exceeds the allowable range, the effect is due to the expansion and contraction of the individual substrate And an analysis result output processing unit for outputting the analysis results.

The analysis method of the cause of defects in the screen printing of the present invention targets a plurality of individual substrates held in a carrier, and prints paste for joining components on electrodes formed on these individual substrates in a batch. In the screen printing apparatus, for analyzing the cause of the defect in the positional deviation based on the measurement result of the solder positional deviation for each individual board obtained by the solder inspection performed on the individual board after printing. A failure cause analysis method for executing a failure cause analysis process and outputting an analysis result, wherein the screen printing apparatus positions a substrate positioning portion by sliding a squeegee on a screen mask supplied with the paste. A screen for printing a paste on each individual substrate of the held carrier through a pattern hole formed in the screen mask A printing mechanism, mark recognition means for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate, and controlling the substrate positioning unit based on the recognition result of the mark recognition means An alignment control unit for aligning the carrier with respect to the screen mask, and reference data used in the alignment of the carrier, wherein the positional relationship between the pattern hole array and the mask recognition mark And a data storage unit for storing, for each substrate type, electrode position data indicating the positional relationship between the electrode on the individual substrate and the positional reference mark, and the mark recognition means has a specific individual piece. a recognition control step to recognize the position reference mark of the substrate, said alignment based on this recognition result In the alignment processing step of aligning the carrier with respect to the screen mask by the control unit and the measurement result of the solder positional deviation, a positional deviation outside the prescribed range predefined for the specific individual substrate is detected. If this is the case, an analysis result indicating that the screen printing apparatus is caused by a misalignment of the carrier is output, and a positional deviation outside the specified range is detected for the individual substrates other than the specific individual substrate. If this is the case, the analysis result indicating that the individual substrate is misaligned with the carrier is output, and if the variation range of the positional deviation on the same individual substrate exceeds the allowable range, it is caused by the expansion and contraction of the individual substrate And an analysis result output processing step for outputting an analysis result to the effect.

  According to the present invention, the mark reference means provided in the screen printing apparatus recognizes the position reference mark of a specific individual substrate, and based on the recognition result, the carrier is aligned with the screen mask and printing is executed. After measuring the solder misalignment state of each individual substrate, and if a misalignment outside the specified range predefined for a specific individual substrate is detected in the solder misalignment measurement result, the carrier by the screen printing apparatus The analysis result to the effect of the misalignment is output, and if a positional deviation outside the specified range is detected for individual substrates other than the specific individual substrate, the individual substrate to the carrier is detected. If an analysis result indicating that it is caused by misalignment is output, and the variation range of misalignment on the same individual substrate exceeds the allowable range, the expansion and contraction of the individual substrate By outputting an analysis result indicating that factors, to accurately analyze the cause of failure of printing positional deviation, it is possible to properly carry out the planning of the defect countermeasures.

Structure explanatory drawing of the electronic component mounting system in which the screen printing apparatus of one embodiment of this invention was incorporated The block diagram which shows the structure of the screen printing apparatus of one embodiment of this invention Explanatory drawing of the board | substrate recognition and mask recognition by the screen printing apparatus of one embodiment of this invention Structure explanatory drawing of the multi-chamfer board | substrate used as the production object of the screen printer of one embodiment of this invention The block diagram which shows the structure of the printing inspection apparatus in the electronic component mounting system of one embodiment of this invention Flow chart of failure cause analysis processing in screen printing according to an embodiment of the present invention The flowchart which shows the output content of the analysis result of the cause of defect in the screen printing of one embodiment of this invention Explanatory drawing of the analysis result of the defect cause in the screen printing of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the overall configuration of the electronic component mounting system 1 will be described with reference to FIG. In FIG. 1, an electronic component mounting system 1 is an electronic component mounting apparatus, and includes a printing device M1 (screen printing device), a print inspection device M2, and electronic component mounting devices M3 and M4 that constitute an electronic component mounting line 1a. Each device is connected by a communication network 2 and the whole is controlled by a management computer 3.

  The electronic component mounting system 1 mounts an electronic component on a multi-sided substrate 4 having a plurality of individual substrates 41 (see FIG. 4) by solder bonding by using the plurality of electronic component mounting apparatuses. It has the function to manufacture. That is, the printing apparatus M1 screen-prints the solder paste for joining electronic components on the electrodes of the board. The print inspection apparatus M2 inspects the printed state of the printed solder paste. The electronic component mounting apparatuses M3 and M4 mount the electronic components on the individual substrate 41 on which the solder paste is printed.

  Next, the configuration of each device will be described. First, the configuration of the printing apparatus M1 will be described with reference to FIG. The printing apparatus M1 includes a screen printing mechanism 6 for performing screen printing, a substrate positioning unit 7, and a control / analysis unit 9 having a function of controlling each of these units and analyzing a cause of defective printing position deviation. Signals can be exchanged with other devices and the management computer 3 via the communication unit 8 connected to the communication network 2. The screen printing mechanism 6 includes a screen mask 12 and a squeegee unit 13, and the substrate positioning unit 7 includes a positioning table 10, a substrate holding unit 11, and a table driving unit 14.

  The substrate holding part 11 disposed on the positioning table 10 holds the substrate 4 by being sandwiched from both sides by the clamper 11a. A screen mask 12 (see FIG. 3B) having a configuration in which a mask plate 12b is stretched on a mask frame 12a is disposed above the substrate holding unit 11, and the individual substrate 41 is printed on the screen mask 12. Pattern holes 12e (see FIG. 4) corresponding to the portions are provided. By driving the positioning table 10 by the table driving unit 14, the substrate 4 moves relative to the screen mask 12 in the horizontal direction and the vertical direction.

  A camera unit 20 is disposed between the lower surface of the screen mask 12 and the upper surface of the substrate 4 held by the substrate holding unit 11 so as to be horizontally movable in the X and Y directions by a camera moving mechanism (not shown). Yes. As shown in FIG. 3A, the camera unit 20 includes a substrate recognition camera 20a for imaging the substrate 4 from above and a mask recognition camera 20b for imaging the screen mask 12 from the lower surface side. .

  As shown in FIG. 3B, a print target area 12d for the substrate 4 is set on the screen mask 12, and a mask recognition mark 12c is formed at a diagonal position of the print target area 12d. Yes. As shown in FIG. 3C, the substrate 4 to be printed is a multi-sided substrate, and a plurality of individual substrates 41 (three in this case) to be printed are held on a plate-like carrier 40 serving as a base. It has a configuration. An adhesive sticking surface is formed on the surface of the carrier 40, and the individual substrate 41 made of a resin substrate can be detachably attached and held. When the individual substrate 41 is mounted on the carrier 40, the individual substrate 41 is pressed against the attachment surface of the carrier 40 in a state of being aligned by positioning means such as a positioning pin provided on the carrier 40.

  As shown in FIG. 4B, a plurality of parts bonding electrodes 43 are formed on the individual substrate 41, and as shown in FIG. 4A, within the print target area 12d of the screen mask 12. A plurality of pattern holes 12e are formed corresponding to the arrangement positions of the electrodes 43 in a state where the plurality of individual substrates 41 are held at predetermined positions of the carrier 40. A pair of position reference marks 41 a are formed at diagonal positions of the individual substrates 41, and when the individual substrates 41 are correctly mounted at the regular positions of the carrier 40, the individual substrates 41 are arranged. The relative positional relationship between the position reference mark 41 a and the substrate recognition mark 4 a of the carrier 40 is known from the print position data for the substrate 4.

  By moving the camera unit 20 by driving the camera moving mechanism, the mask recognition mark 12c formed on the screen mask 12 and the substrate recognition mark 4a formed on the carrier 40 shown in FIGS. Images can be taken by the camera 20b and the board recognition camera 20a. The recognition result is processed by the recognition processing unit 18 to detect the positions of the mask recognition mark 12c and the substrate recognition mark 4a, and the entire position of the carrier 40 is detected.

  Further, the position of the individual substrate 41 is individually detected by recognizing the position by imaging the position reference mark 41a of each individual substrate 41 by the substrate recognition camera 20a. Therefore, the camera unit 20, a camera moving mechanism (not shown) and the recognition processing unit 18 constitute mark recognition means for recognizing the mask recognition mark 12 c formed on the screen mask 12 and the position reference mark 41 a formed on the individual substrate 41. .

  A squeegee unit 13 is disposed above the screen mask 12. The squeegee unit 13 includes an elevating and pressing mechanism 13b that elevates and lowers the squeegee 13c with respect to the screen mask 12 and presses the squeegee 13c with a predetermined printing pressure, and a squeegee moving mechanism 13a that horizontally moves the squeegee 13c. The elevation pressing mechanism 13 b and the squeegee moving mechanism 13 a are driven by the squeegee driving unit 15.

  By sliding the squeegee 13c at a predetermined speed on the screen mask 12 to which the solder paste 5 is supplied in a state where the substrate 4 is in contact with the lower surface of the screen mask 12, the solder paste 5 passes through the pattern holes 12e. Printing is performed on the electrodes 43 of the individual substrates 41 on the upper surface of the carrier 40 positioned and held by the substrate positioning unit 7. In other words, in the present embodiment, the screen printing mechanism 6 screen-prints the solder paste 5 for joining components on the electrodes 43 formed on the individual substrates 41 in batch for a plurality of individual substrates 41. It has become.

  The control unit 17 includes a printing control unit 17a and an alignment control unit 17b, and the above-described printing operation is performed by the control unit 17 controlling the squeegee driving unit 15 and the table driving unit 14. That is, the squeegee 13c controls the squeegee driving unit 15 to perform the squeegeeing operation by the squeegee 13c. Then, the alignment control unit 17b controls the substrate positioning unit 7 based on the recognition result of the mark recognition means described above, so that the carrier 40 is aligned with the screen mask 12.

  The data storage unit 16 stores print position data 16a and electrode position data 16b referred to in the above-described control. The printing position data 16a is data indicating the positional relationship between the pattern hole 12e array and the mask recognition mark 12c. The electrode position data 16b is data indicating the positional relationship between the electrode 43 and the position reference mark 41a on the individual substrate 41, and all of these data are stored for each substrate type.

  The data storage unit 16 stores analysis data 16c used for analysis of the cause of the printing position misalignment, and is further acquired by the solder inspection for the printed circuit board 41 by the print inspection apparatus M2. The measurement result of the solder position deviation for each individual substrate 41 is stored. The failure cause analysis processing unit 19, which constitutes the control / analysis unit 9 (failure cause analysis device) together with the data storage unit 16, the control unit 17, and the recognition processing unit 18, measures the solder position deviation stored in the data storage unit 16. Based on the result, a failure cause analysis process for analyzing the cause of the failure is executed and an analysis result is output.

  The failure cause analysis processing unit 19 includes processing functions of a recognition control processing unit 19a, an alignment processing unit 19b, an analysis execution processing unit 19c, and an analysis result output processing unit 19d. The recognition control processing unit 19a sets the position reference mark 41a of the individual substrate 41 used as a reference for alignment when positioning the carrier 40 with respect to the specific individual substrate 41, that is, the screen mask 12, to the mark recognition means. Recognize.

  The alignment processing unit 19b aligns the carrier 40 with respect to the screen mask 12 by the alignment control unit 17b based on the recognition result. Based on the measurement result of the solder position deviation obtained by the solder inspection in which the board 4 on which the screen printing has been executed in the state of alignment in this way is inspected by the print inspection apparatus M2, the analysis execution processing unit 19c causes the failure. The calculation for the analysis process is executed. The analysis result output processing unit 19d performs a process of outputting the executed analysis result.

  Next, the print inspection apparatus M2 will be described with reference to FIG. In FIG. 5, the print inspection apparatus M2 includes a print inspection unit 21 for executing a print inspection. The print inspection unit 21 captures a printed substrate 4 that has been transported by the transport rail 22 and is transported and positioned at the inspection position by the substrate transport positioning unit 24 by using the camera 23, so that the printed individual substrate 41 is targeted. Perform solder inspection.

  A camera 23 is disposed above the substrate 4 held on the transport rail 22, and the result of imaging by the camera 23 is recognized by the recognition processing unit 28, thereby inspecting the printing state of the solder paste 5, that is, Whether or not the solder paste 5 is correctly printed with a prescribed amount of solder on the electrode 43 to be printed is determined for each individual substrate 41. In this solder inspection, the amount of solder position deviation for each individual substrate 41 is measured, and the measurement result is output to the printing apparatus M1. Then, in the printing apparatus M1, based on the measurement result of the solder misalignment, a defect cause analysis process for analyzing the cause of the misalignment is executed.

  The camera 23 can be moved in a horizontal plane by camera moving means (not shown), and an arbitrary position of the substrate 4 can be inspected for each individual substrate 41. The recognition result by the recognition processing unit 28 is determined by the inspection processing unit 27 using the determination data stored in the inspection data storage unit 26 and is output for each individual board 41 as solder inspection result data. The output solder inspection result data and the measurement result of the solder position deviation are transferred to the management computer 3 and other devices via the communication unit 29 and the communication network 2. The inspection control unit 25 controls the inspection operation by controlling the substrate transport positioning unit 24 and the camera 23.

  Next, a failure cause analysis process in screen printing executed by the printing apparatus M1 will be described with reference to the flowcharts of FIGS. First, as a print preparation operation, a plurality of individual substrates 41 are held on the carrier 40 (ST1). Next, the carrier 40 holding the individual substrate 41 is carried into the printing apparatus M1, and is held by the substrate holding unit 11 (ST2). Thereafter, the mark recognition means recognizes the mask recognition mark 12c and the position reference mark 41a of the specific individual substrate 41 specified in advance (ST3) (recognition control processing step).

  Based on the recognition result, the carrier 40 is aligned with the screen mask 12 (ST4) (alignment processing step). Here, the amount of displacement of the position reference mark 41a of the specific individual substrate 41 used as the alignment reference with respect to the normal position is obtained from the recognition result, and the entire carrier 40 is corrected by this amount of displacement to form the screen mask 12. Align with respect to. That is, as an alignment target, alignment is performed so that the electrode 43 of the specific individual substrate 41 coincides with the corresponding pattern hole 12 e in the screen mask 12. Next, the screen printing mechanism 6 is driven to execute solder printing (ST5), and the solder paste 5 is printed on the electrode 43 through the pattern hole 12e.

  Thereafter, the board 4 after the solder printing is carried into the printing inspection apparatus M2, and the solder inspection is executed. This solder inspection is performed by imaging each individual substrate 41 with the substrate recognition camera 20a. First, the position reference mark 41a is recognized for each individual substrate 41 to detect the position (ST6), and the detected position reference mark is detected. The solder position deviation is measured with reference to the position 41a (ST7). That is, as shown in FIG. 8, the positional deviation amount d (i) with respect to the normal position of the solder paste 5 printed on each electrode 43 of the individual substrate 41 is measured. Then, the acquired measurement result of the solder position deviation is transmitted to the printing apparatus M 1 and stored in the data storage unit 16.

  Next, based on the stored measurement result of the solder position deviation, the failure cause analysis processing unit 19 performs failure cause analysis processing (ST8). In this analysis process, the cause of misalignment is estimated based on the solder misalignment state in which the carrier 40 and the screen mask 12 are aligned with reference to a specific individual substrate 41 designated in advance. The analysis results are output in three ways according to the criteria shown in FIG. 8 (ST9) (analysis result output processing step).

  Here, the significance of the specific individual substrate 41 used in the failure cause analysis process will be described. As described above, since the specific individual substrate 41 is used as an alignment reference when aligning the carrier 40 with respect to the screen mask 12, the plurality of individual substrates 41 constituting the substrate 4 are viewed as a whole. In this case, the individual substrate 41 is meant such that the printing position shift in each electrode 43 is the smallest overall.

  Several methods can be used to define the specific individual substrate 41. For example, as the simplest method, among the plurality of individual substrates 41 constituting the substrate 4, the individual pieces that are determined to show the average mounting position deviation state of these individual substrates 41 to the carrier 40. The substrate 41 may be found by visual observation, and the individual substrate 41 may be a specific individual substrate 41.

  Further, in a more strict sense, when it is desired to minimize the printing misregistration as a whole, a specific individual substrate 41 is determined based on the result of performing the misregistration amount calculation simulation for each individual substrate 41. May be. That is, the positions of the position reference marks 41 a and the electrodes 43 are measured for all of the plurality of individual substrates 41 mounted on the carrier 40, and any one of the plurality of individual substrates 41 is set as a specific individual substrate 41. An average value of the amount of misalignment when alignment is performed is obtained. The individual substrate 41 that gives the result that the average value becomes the smallest is taken as a specific individual substrate 41 as an alignment reference.

  An execution example of the failure cause analysis processing will be described with reference to FIGS. Here, among the three individual substrates 41 (1) (2) (3) mounted on the carrier 40, the individual substrate 41 (2) located at the center is the specific individual substrate 41 (2) described above. ) * Indicates an example specified. As shown in FIG. 7, it is first determined whether or not a positional deviation outside a prescribed range defined in advance for a specific individual substrate 41 (2) * is detected in the measurement result of the solder positional deviation (ST11).

  In the example shown here, as shown in FIG. 8A, the positional deviation amounts d1 (i) at the plurality of electrodes 43 of the specific individual substrate 41 (2) * are stored in the data storage unit 16 as analysis data 16c. Therefore, it is determined that a positional deviation outside the predefined range for the individual substrate 41 (2) * has been detected. In this case, since the positional deviation outside the specified range has occurred in the individual substrate 41 (2) * which is the positioning reference, this positional deviation is a misalignment of the carrier 40 to the screen mask 12 by the printing apparatus M1. An analysis result to the effect of the above is output (ST12). Corresponding to the analysis result, the printing apparatus M1 displays a warning or a display prompting a correction process for machine parameters when driving the substrate positioning unit 7.

  Next, when the determination of (ST11) is NO, it is determined whether or not a positional deviation outside the specified range is detected for the individual substrates 41 other than the specific individual substrate 41 (2) *. (ST13). In the example shown here, as shown in FIG. 8B, the positional deviation amounts d2 (i) of the plurality of electrodes 43 of the individual substrate 41 (1) other than the specific individual substrate 41 (2) * are defined in advance. Therefore, it is determined that a positional deviation outside the predetermined range is detected for the individual substrates 41 (1) other than the specific individual substrate 41 (2) *.

  In this case, since the individual substrate 41 (2) * used as the positioning reference is correctly printed, it is not considered to be a defect due to a misalignment of the carrier 40 with the screen mask 12, and the carrier 40 An analysis result indicating that the individual substrate 41 (1) is misaligned is output (ST14). Corresponding to the analysis result, a warning display prompting confirmation of the suitability of the work method in the work process of mounting the individual substrate 41 on the carrier 40 and a corresponding instruction display such as prompting numerical calculation of the process capability are displayed. Made.

  Next, when the determination in (ST13) is NO, it is determined whether or not the variation range of the positional deviation in the same individual substrate 41 exceeds the allowable range (ST15). In the example shown here, as shown in FIG. 8C, the positional deviation amount d3 (i) (j) in the plurality of electrodes 43 of the individual substrate 41 (3) is in the reverse direction, and the variation range of the positional deviation amount. Exceeds the allowable range stored in the data storage unit 16 as the analysis data 16c. Therefore, it is determined that the variation range of the positional deviation in the same individual substrate 41 (3) exceeds the allowable range.

  In this case, the individual substrate 41 (2) * used as the positioning reference is correctly printed, and further, it does not correspond to the misalignment of the individual substrate 41 (1) to the carrier 40. An analysis result indicating that the expansion / contraction of the substrate 41 (3) is caused is output (ST16). Corresponding to this analysis result, feedback indicating the consideration of expansion / contraction allowance in the design of the screen mask 12 and corresponding instruction display such as prompting numerical calculation of the process capability on the expansion / contraction management surface of the individual substrate 41 Is made.

  In the above embodiment, an example in which the solder position deviation is measured in the solder inspection by the print inspection apparatus M2 has been described. However, the measurement of the solder position deviation may be performed in the printing apparatus M1. In this case, the solder position deviation is measured by performing recognition processing on the result of imaging the substrate 4 by the substrate recognition camera 20a after solder printing. That is, in this example, the printing apparatus M1 has a configuration including an inspection unit that performs a solder inspection.

  Further, in the present embodiment, an example is shown in which the control / analysis unit 9 as a failure cause analysis device is incorporated in the printing apparatus M1, but the function of the control / analysis unit 9 shown in FIG. You may make it provide. In this case, the screen printing mechanism, mark recognition means, and alignment control unit of the printing apparatus M1 are controlled by the function of the control / analysis unit 9 as the failure cause analysis apparatus provided in the printing inspection apparatus M2. Then, a screen printing operation for the purpose of analyzing the cause of the defect is executed.

  The screen printing apparatus of the present invention and the failure cause analysis apparatus and analysis method in screen printing have the effect that the cause of failure of the printing misalignment can be accurately analyzed, and countermeasures for failure can be made appropriately, This is useful in the field of printing in which paste is printed on a substrate by screen printing, and in the field of printing inspection in which the printed state of printed paste is inspected.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 4 Board | substrate 5 Solder paste 6 Screen printing mechanism 7 Board | substrate positioning part 9 Control / analysis part (analysis apparatus of defect cause)
DESCRIPTION OF SYMBOLS 12 Screen mask 12a Mask frame 12b Mask plate 13 Squeegee part 40 Carrier 41 Single board | substrate 41a Position reference mark 43 Electrode M1 Printing apparatus M2 Printing inspection apparatus M3 Electronic component mounting apparatus

Claims (5)

A screen printing apparatus that targets a plurality of individual substrates held by a carrier and collectively prints a component bonding paste on electrodes formed on these individual substrates,
A screen for printing the paste through the pattern holes formed in the screen mask on each individual substrate of the carrier positioned and held by the substrate positioning portion by sliding a squeegee on the screen mask supplied with the paste A printing mechanism;
Mark recognition means for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate;
An alignment control unit that aligns the carrier with respect to the screen mask by controlling the substrate positioning unit based on a recognition result of the mark recognition unit;
Reference data used in the alignment of the carrier, the printing position data indicating the positional relationship between the pattern hole array and the mask recognition mark, and the positional relationship between the electrode and the position reference mark on the individual substrate. A data storage unit for storing the electrode position data shown for each substrate type;
Executes failure cause analysis processing to analyze the cause of misalignment on the basis of the measurement result of solder misalignment for each individual substrate obtained by solder inspection performed on the individual substrate after printing. And a failure cause analysis processing unit that outputs the analysis result,
The defect cause analysis processing unit is configured to cause the mark recognition unit to recognize a position reference mark of a specific individual substrate;
An alignment processing unit to align said carrier relative to said screen mask by the positioning control section on the basis of this recognition result,
In the measurement result of the solder misalignment, if a misalignment outside the predetermined range for the specific individual substrate is detected, an analysis result indicating that the misalignment of the carrier by the screen printing apparatus is caused. Output,
If a positional deviation outside the specified range is detected for individual substrates other than the specific individual substrate, an analysis result indicating that the individual substrate is misaligned with the carrier is output,
A screen printing apparatus comprising: an analysis result output processing unit that outputs an analysis result indicating that the variation of the positional deviation in the same individual substrate exceeds an allowable range; .   The screen printing apparatus according to claim 1, further comprising an inspection unit that performs the solder inspection. In a screen printing apparatus that targets a plurality of individual substrates held by a carrier and collectively prints a paste for joining components on electrodes formed on these individual substrates. A defect that performs failure cause analysis processing to analyze the cause of a defect related to misalignment based on the measurement result of the solder misalignment for each individual board obtained by solder inspection executed as a target, and outputs the analysis result A cause analysis device,
The screen printing apparatus slides a squeegee on a screen mask supplied with the paste, thereby passing through pattern holes formed in the screen mask on each individual substrate of the carrier positioned and held by the substrate positioning unit. A screen printing mechanism for printing paste, a mark recognition unit for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate, and a recognition result of the mark recognition unit An alignment control unit that aligns the carrier with respect to the screen mask by controlling the substrate positioning unit, and reference data used in the alignment of the carrier, the array of the pattern holes and the mask Print position data indicating the positional relationship with the recognition mark and And an electrode position data indicating the positional relationship between the electrode and the position reference mark in the substrate pieces and a data storage unit for storing for each board type,
A recognition control processing unit for causing the mark recognition means to recognize a position reference mark of a specific individual substrate;
An alignment processing unit to align said carrier relative to said screen mask by the positioning control section on the basis of this recognition result,
In the measurement result of the solder misalignment, if a misalignment outside the predetermined range for the specific individual substrate is detected, an analysis result indicating that the misalignment of the carrier by the screen printing apparatus is caused. Output,
If a positional deviation outside the specified range is detected for individual substrates other than the specific individual substrate, an analysis result indicating that the individual substrate is misaligned with the carrier is output,
Screen printing characterized by comprising an analysis result output processing unit for outputting an analysis result indicating that due to expansion / contraction of the individual substrate if the variation range of the positional deviation on the same individual substrate exceeds an allowable range Failure cause analysis equipment. 4. The failure cause in screen printing according to claim 3, wherein an inspection device for performing the solder inspection is connected downstream of the screen printing device, and the inspection device also serves as the failure cause analysis device. Analysis device. In a screen printing apparatus that targets a plurality of individual substrates held by a carrier and collectively prints a paste for joining components on electrodes formed on these individual substrates. Defects that execute defect cause analysis processing to analyze the cause of defects with respect to misalignment based on the measurement results of solder misalignment for each individual board obtained by the solder inspection performed as a target, and output the analysis results A cause analysis method,
The screen printing apparatus slides a squeegee on a screen mask supplied with the paste, thereby passing through pattern holes formed in the screen mask on each individual substrate of the carrier positioned and held by the substrate positioning unit. A screen printing mechanism for printing paste, a mark recognition unit for recognizing a mask recognition mark formed on the screen mask and a position reference mark formed on the individual substrate, and a recognition result of the mark recognition unit An alignment control unit that aligns the carrier with respect to the screen mask by controlling the substrate positioning unit, and reference data used in the alignment of the carrier, the array of the pattern holes and the mask Print position data indicating the positional relationship with the recognition mark and And an electrode position data indicating the positional relationship between the electrode and the position reference mark in the substrate pieces and a data storage unit for storing for each board type,
A recognition control processing step for causing the mark recognition means to recognize a position reference mark of a specific individual substrate;
An alignment step that makes aligning the carrier with respect to the screen mask by the positioning control section on the basis of this recognition result,
In the measurement result of the solder misalignment, if a misalignment outside the predetermined range for the specific individual substrate is detected, an analysis result indicating that the misalignment of the carrier by the screen printing apparatus is caused. Output,
If a positional deviation outside the specified range is detected for individual substrates other than the specific individual substrate, an analysis result indicating that the individual substrate is misaligned with the carrier is output,
In the screen printing, including an analysis result output processing step of outputting an analysis result indicating that the variation result of the positional deviation in the same individual substrate exceeds the allowable range and is caused by expansion and contraction of the individual substrate. Defect cause analysis method.

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