JP5772642B2 - Curable resin composition, cured film for display element, method for forming cured film for display element, and display element - Google Patents

Description

  The present invention relates to a curable resin composition, a cured film for a display element, a method for forming a cured film for a display element, and a display element.

  For electronic parts such as liquid crystal display elements, generally, cured films such as interlayer insulating films, spacers, protective films, and colored patterns for color filters are used. Since these cured films are exposed to high temperature conditions or various solvents such as a resist stripping solution in the manufacturing process of liquid crystal display elements, sufficient heat resistance, solvent resistance, etc. are required. Is done.

  As these compositions for forming a cured film, negative radiation-sensitive resin compositions are widely used from the viewpoints of high radiation sensitivity and high light transmittance of the resulting cured film (Japanese Patent Laid-Open No. 6-43643). Gazette and JP-A No. 2000-162769). In recent years, liquid crystal display devices are required to have a larger screen, higher brightness, thinner thickness, etc., and to shorten the manufacturing process time and cost. Therefore, further enhancement of sensitivity and resolution of the negative radiation sensitive resin composition is required. In addition, from the viewpoint of energy saving, it is also required to lower the temperature of the heating process in manufacturing the cured film and the liquid crystal display element.

  In response to the demand for higher sensitivity and higher resolution of the negative radiation-sensitive resin composition, several compositions containing an oxime ester photopolymerization initiator have been studied (Japanese Patent Publication No. 2004-534797 and (See Japanese Unexamined Patent Publication No. 2011-132215). Moreover, the composition containing the alkali-soluble resin which has an epoxy group, and the hardening accelerator of an epoxy is disclosed as a composition used for a low-temperature heating process (refer Unexamined-Japanese-Patent No. 2011-232659). However, none of these compositions can sufficiently cope with the low-temperature heating process, and it cannot be said that various properties such as light transmittance, light resistance and heat resistance of the formed cured film are sufficient.

JP-A-6-43643 JP 2000-162769 A JP-T-2004-534797 JP 2011-132215 A JP 2011-232659 A

  The present invention has been made based on the circumstances as described above, and its purpose is to have sufficient resolution and sensitivity, and is resistant even when a low-temperature heating process is used for producing a cured film for a liquid crystal display element. A curable resin composition capable of forming a cured film for a display element excellent in solvent resistance, heat resistance, development resistance, compression performance, transmittance, light resistance and voltage holding ratio, and a display element formed using the same A cured film, a method for forming the cured film, and a display element.

（式（１）中、Ｒ^１は、熱によって酸を発生する構造を有する基である。Ｒ^２は、光によってラジカルを発生する構造を有する基である。Ｒ^３及びＲ^４は、それぞれ独立して、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基、炭素数４〜２０の脂環式炭化水素基又はフェニル基である。ａ及びｂは、それぞれ独立して、１〜５の整数である。ｃ及びｄは、それぞれ独立して、０〜４の整数である。Ｘは、酸素原子、硫黄原子又はセレン原子である。） The invention made to solve the above problems is
[A] an alkali-soluble resin having an epoxy group (hereinafter also referred to as “[A] alkali-soluble resin”),
[B] a polymerizable compound having an ethylenically unsaturated bond (hereinafter also referred to as “[B] polymerizable compound”), and [C] a compound represented by the following formula (1) (hereinafter referred to as “[C] compound”) Is also called)
Is a curable resin composition.

(In Formula (1), R ¹ is a group having a structure that generates an acid by heat. R ² is a group having a structure that generates a radical by light. R ³ and R ⁴ are independent of each other. And an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group. And c and d are each independently an integer of 0 to 4. X is an oxygen atom, a sulfur atom or a selenium atom.)

  The said curable resin composition contains [A] alkali-soluble resin, [B] polymeric compound, and the [C] compound of the said specific structure. In the curable resin composition, the [C] compound is a compound having a structure that generates an acid by heat and a structure that generates a radical by light, so that it can be cured by heat or light. . As a result, in the curable resin composition, after radical polymerization in the exposure step, the acid generated in the heating step functions as a curing accelerator for the [A] alkali-soluble resin, and can further promote curing. The heating step for generating the acid is a low-temperature heating step that does not require a high-temperature heating of 230 ° C. or higher as in the post-exposure heating step for curing the conventional composition, and is preferable from the viewpoint of energy saving. . Moreover, the said curable resin composition has sufficient resolution and radiation sensitivity, and can form a fine and elaborate pattern easily.

（式（２）中、Ｒ^５は、水素原子、炭素数１〜１２のアルキル基、炭素数１〜６のフルオロアルキル基、フェニル基、トリル基、キシリル基、ナフチル基、アントリル基又はシクロへキシル基である。但し、上記Ｒ^５のアルキル基の有する水素原子の１つが水酸基で置換されていてもよい。Ｒ^６は、炭素数１〜１２のアルカンジイル基である。Ｒ^７は、−Ｏ−、−Ｓ−、−ＮＲ^８−、−ＮＲ^８ＣＯ−、−ＳＯ_２−、−ＣＳ−
、−ＯＣＯ−又は−ＣＯＯ−である。Ｒ^８は、水素原子又は炭素数１〜６のアルキル基である。
式（３）中、Ｒ^９は、水素原子、炭素数１〜１２のアルキル基、炭素数１〜６のフルオロアルキル基、フェニル基、トリル基、キシリル基、ナフチル基、アントリル基又はシクロへキシル基である。但し、上記Ｒ^９のアルキル基の有する水素原子の１つが水酸基で置換されていてもよい。Ｒ^１０は、２価の有機基である。Ｒ^１１は、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基、シアノ基、ベンジル基、フェネチル基、炭素数４〜２０の脂環式炭化水素基又はフェニル基である。但し、上記Ｒ^１１のフェニル基が有する水素原子の一部又は全部は、炭素数１〜１２のアルキル基又は炭素数１〜１２のアルコキシ基で置換されていてもよい。） R ¹ in the above formula (1) preferably contains a group represented by the following formula (2), and R ² contains a group represented by the following formula (3).

(In the formula (2), R ⁵ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or cyclohexane. A hydrogen atom of the alkyl group of R ⁵ may be substituted with a hydroxyl group, R ⁶ is an alkanediyl group having 1 to 12 carbon atoms, R ⁷ is — ^{O -, - S -, -} NR 8 -, - NR 8 CO -, - SO 2 -, - CS-
, -OCO- or -COO-. R ⁸ is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
In formula (3), R ⁹ is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or a cyclohexyl group. It is a group. However, one of the hydrogen atoms of the alkyl group of R ⁹ may be substituted with a hydroxyl group. R ¹⁰ is a divalent organic group. R ¹¹ is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a cyano group, a benzyl group, a phenethyl group, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group. However, some or all of the hydrogen atom of the phenyl group of said R ^11, which may be substituted with an alkyl group or an alkoxy group having 1 to 12 carbon atoms having 1 to 12 carbon atoms. )

  The group represented by the above formula (2) has a structure that generates an acid by heat. Moreover, the group containing the oxime ester structure represented by the above formula (3) can generate a radical by light irradiation. The said curable resin composition becomes easy to generate | occur | produce an acid with a heat | fever, and to generate | occur | produce a radical by light irradiation because the [C] compound has group of the said specific structure. As a result, the curable resin composition sufficiently satisfies the resolution and radiation sensitivity, and can form a cured film that is sufficiently excellent in solvent resistance and the like even in the cured film forming process even if a low-temperature heating process is used. it can.

R ⁵ in the formula (2) and R ⁹ in the formula (3) are preferably the same group. The compound [C] is produced by making R ⁵ in the above formula (2) and R ⁹ in the formula (3) the same group, which makes synthesis easier and eliminates the purification separation step and the like. Cost can be reduced. In addition, the curable resin composition containing such a [C] compound sufficiently satisfies the resolution and radiation sensitivity, and has a solvent resistance and the like even when a low-temperature heating step is used in the cured film forming step. Furthermore, the cured film which is excellent can be formed.

In the formula (1), a and b are 1, c and d are 0, R ⁵ in the formula (2) is a methyl group, R ⁶ is an ethylene group, R ⁷ is -O-, R ⁹ in the formula (3) and R ¹¹ is preferably a methyl group, and R ¹⁰ is preferably a carbonyl group. When the compound [C] is a compound having such a specific structure, the curable resin composition sufficiently satisfies the resolution and the radiation sensitivity, and is resistant even if a low-temperature heating step is used in the cured film forming step. A cured film having particularly excellent solvent properties can be formed.

[A] An alkali-soluble resin having an epoxy group is
(A1) a structural unit derived from a polymerizable compound having a carboxyl group (hereinafter also referred to as “(a1) structural unit”), and (a2) a structural unit derived from a polymerizable compound having an epoxy group (hereinafter referred to as “(a2) Also called “structural unit”)
It is preferable that it is a copolymer containing.

  [A] When alkali-soluble resin contains (a1) structural unit, the curable resin composition which optimizes the solubility with respect to aqueous alkali solution, and is excellent in a radiation sensitivity is obtained. Moreover, the [A] alkali-soluble resin contains the (a2) structural unit together with the (a1) structural unit, whereby curing due to the action of the acid generated by the [C] compound is further promoted.

（式（４）中、Ｒ^１２及びＲ^１３は、水素原子又はメチル基である。Ｒ^１４は、下記式（４−１）又は式（４−２）で表される基である。ｎは、１から６の整数である。）

（式（４−１）中、Ｒ^１５は、水素原子又はメチル基である。式（４−１）及び式（４−２）中、＊は、隣接する酸素原子に結合する部位を示す。） The curable resin composition is [B] a polymerizable compound having an ethylenically unsaturated bond (a3) a structural unit represented by the following formula (4) (hereinafter also referred to as “(a3) structural unit”). It is preferable to contain a polymer (hereinafter also referred to as “[B1] polymer”).

(In formula (4), R ¹² and R ¹³ are a hydrogen atom or a methyl group. R ¹⁴ is a group represented by the following formula (4-1) or formula (4-2). An integer from 1 to 6.)

(In Formula (4-1), R ¹⁵ represents a hydrogen atom or a methyl group. In Formula (4-1) and Formula (4-2), * represents a site bonded to an adjacent oxygen atom. )

  The said curable resin composition can improve the heat resistance etc. of the cured film for display elements obtained by containing the [B1] polymer containing a structural unit (a3) as a [B] polymeric compound. it can.

  The curable resin composition preferably further contains a [D] radical scavenger. The said curable resin composition is excellent in the stability at the time of a preservation | save by further containing a [D] radical scavenger.

  It is preferable that the said curable resin composition further contains a [E] coloring agent. When the curable resin composition further contains an [E] colorant, for example, a cured film for a display element as a colored pattern for a color filter or the like can be formed.

  The curable resin composition is preferable for forming a cured film for a display element. Moreover, the display element provided with the cured film for display elements formed from the said curable resin composition and this cured film for display elements is suitably contained in this invention.

The method for forming a cured film for a display element of the present invention is as follows.
(1) The process of forming a coating film on a board | substrate using the curable resin composition of this invention,
(2) A step of irradiating at least a part of the coating film with radiation,
(3) a step of developing the coating film irradiated with the radiation; and (4) a step of heating the developed coating film at a temperature of 200 ° C. or less.

  According to the forming method of the present invention, it is possible to form a cured film for a display element that is excellent in compression performance, transmittance, light resistance, voltage holding ratio, development resistance, heat resistance and solvent resistance.

  Here, both “radiation” and “light” are the same concept including visible light, ultraviolet light, far ultraviolet light, X-rays, charged particle beams, and the like.

  As described above, the curable resin composition of the present invention has sufficient resolution and sensitivity, and even when a low temperature heating process is used in the production of a cured film for a display element, solvent resistance, heat resistance, development A cured film for a display element that is excellent in resistance, compression performance, transmittance, light resistance, and voltage holding ratio can be formed. Therefore, the curable resin composition includes a color filter for display elements, an interlayer insulating film for arrays, a color filter for color separation of solid-state imaging elements, a color filter for organic EL display elements, a color filter for flexible displays such as electronic paper, It is suitable for a protective film for touch panel, a resist for photofabrication used for forming a metal wiring or metal bump, processing a substrate, and the like.

<Curable resin composition>
The radiation sensitive resin composition of this invention contains [A] alkali-soluble resin, [B] polymeric compound, and [C] compound. Moreover, the said curable resin composition can contain a [D] radical scavenger and a [E] colorant as a suitable component. Furthermore, the said curable resin composition may contain another arbitrary component, unless the effect of this invention is impaired. Hereinafter, each component will be described in detail.

<[A] alkali-soluble resin>
[A] The alkali-soluble resin is an alkali-soluble resin containing an epoxy group, and preferably contains (a1) structural unit and (a2) structural unit. [A] The alkali-soluble resin is also preferably a resin containing (a1) structural unit and (a3) structural unit. (A1) Structural unit and (a4) Structure represented by the following formula (2) A resin containing units is also preferred. In addition, [A] alkali-soluble resin may contain other structural units other than (a1) structural unit-(a4) structural unit, unless the effect of this invention is impaired.

  [A] The alkali-soluble resin can be synthesized by radical polymerization of a compound giving each structural unit in the presence of a polymerization initiator in a solvent. Hereinafter, the compound which gives each structural unit is explained in full detail. In addition, each compound may use 2 or more types together.

[(A1) Structural unit]
(A1) The structural unit is a structural unit derived from a polymerizable compound having a carboxyl group, and is a structural unit derived from at least one compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride. is there. (A1) Examples of compounds that give structural units include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, anhydrides of unsaturated dicarboxylic acids, mono [(meth) acryloyloxyalkyl] esters of polyvalent carboxylic acids, Examples thereof include mono (meth) acrylates of polymers having a carboxyl group and a hydroxyl group, unsaturated polycyclic compounds having a carboxyl group, and anhydrides thereof.

  Examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, and crotonic acid. Examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid and the like. As an anhydride of unsaturated dicarboxylic acid, the anhydride of the compound illustrated as said dicarboxylic acid, etc. are mentioned, for example. Examples of mono [(meth) acryloyloxyalkyl] esters of polyvalent carboxylic acids include mono [2- (meth) acryloyloxyethyl] succinate, mono [2- (meth) acryloyloxyethyl] phthalate, and the like. . Examples of the mono (meth) acrylate of a polymer having a carboxyl group and a hydroxyl group at both ends include ω-carboxypolycaprolactone mono (meth) acrylate. Examples of unsaturated polycyclic compounds having a carboxyl group and anhydrides thereof include 5-carboxybicyclo [2.2.1] hept-2-ene and 5,6-dicarboxybicyclo [2.2.1] hept. 2-ene, 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-carboxy -6-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2 .1] hept-2-ene anhydride and the like.

  Among these, monocarboxylic acid and dicarboxylic acid anhydrides are preferable, and (meth) acrylic acid and maleic anhydride are more preferable from the viewpoints of copolymerization reactivity, solubility in an aqueous alkali solution, and availability.

  [A] The content ratio of the (a1) structural unit in the alkali-soluble resin is preferably 5 mol% to 30 mol%, more preferably 10 mol% to 25 mol%, based on all structural units. (A1) By setting the content of the structural unit to 5 mol% to 30 mol%, [A] a curable resin composition that optimizes the solubility of the alkali-soluble resin in an alkaline aqueous solution and is excellent in radiation sensitivity is obtained. It is done.

[(A2) Structural unit]
(A2) The structural unit is a structural unit derived from a polymerizable compound having an epoxy group. Examples of the epoxy group include an oxiranyl group (1,2-epoxy structure) and an oxetanyl group (1,3-epoxy structure).

  Examples of the polymerizable compound having an oxiranyl group include glycidyl acrylate, 2-methylglycidyl methacrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, and glycidyl α-n-butyl acrylate. , Acrylic acid-3,4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7 -Epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3,4-epoxycyclohexyl methacrylate and the like.

Examples of the polymerizable compound having an oxetanyl group include 3- (acryloyloxymethyl) oxetane, 3- (acryloyloxymethyl) -2-methyloxetane, 3- (acryloyloxymethyl) -3-ethyloxetane, and 3- (acryloyl). Oxymethyl) -2-trifluoromethyloxetane, 3- (acryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (acryloyloxymethyl) -2-phenyloxetane, 3- (acryloyloxymethyl) -2,2 -Difluorooxetane, 3- (acryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (acryloyloxymethyl) -2,2,4,4-tetrafluorooxetane, 3- (2-acryloyloxyethyl) ) Oxetane, 3- ( 2-acryloyloxyethyl) -2-ethyloxetane, 3- (2-acryloyloxyethyl) -3-ethyloxetane, 3- (2-acryloyloxyethyl) -2-trifluoromethyloxetane, 3- (2-acryloyl) Oxyethyl) -2-pentafluoroethyloxetane, 3- (2-acryloyloxyethyl) -2-phenyloxetane, 3- (2-acryloyloxyethyl) -2,2-difluorooxetane, 3- (2-acryloyloxy) Ethyl) -2,2,4-trifluorooxetane, 3- (2-acryloyloxyethyl) -2,2,4,4-tetrafluorooxetane and other acrylic acid esters;
3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -2-methyloxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -2-trifluoromethyloxetane, 3- (methacryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (methacryloyloxymethyl) -2-phenyloxetane, 3- (methacryloyloxymethyl) -2,2-difluorooxetane, 3- (methacryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (methacryloyloxymethyl) -2,2,4,4-tetrafluorooxetane, 3- (2-methacryloyloxyethyl) oxetane, 3- (2-methacryloyloxyethyl) 2-ethyloxetane, 3- (2-methacryloyloxyethyl) -3-ethyloxetane, 3- (2-methacryloyloxyethyl) -2-trifluoromethyloxetane, 3- (2-methacryloyloxyethyl) -2- Pentafluoroethyloxetane, 3- (2-methacryloyloxyethyl) -2-phenyloxetane, 3- (2-methacryloyloxyethyl) -2,2-difluorooxetane, 3- (2-methacryloyloxyethyl) -2,2 , 4-trifluorooxetane, methacrylic acid esters such as 3- (2-methacryloyloxyethyl) -2,2,4,4-tetrafluorooxetane, and the like.

  Among these, glycidyl methacrylate, 2-methylglycidyl methacrylate, -6,7-epoxyheptyl methacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3, methacrylate 4-Epoxycyclohexyl is preferable from the viewpoints of copolymerization reactivity and improvement in solvent resistance of the cured film for display element.

  [A] The content ratio of the structural unit (a2) in the alkali-soluble resin is preferably 5 mol% to 60 mol%, more preferably 10 mol% to 50 mol%, based on all structural units. (A2) By setting the content ratio of the structural unit to 5 mol% to 60 mol%, a cured film for display element having excellent curability and the like can be formed.

[(A3) Structural unit]
(A3) The structural unit is a structural unit represented by the above formula (4). [A] When the alkali-soluble resin contains the (a3) structural unit, the curability of the resulting cured film for display element can be improved. Moreover, since compatibility with the [C] compound is improved, the [C] compound is uniformly dispersed, and the sensitivity at the time of forming a cured film for a display element can be improved.

In said formula (4), R < ¹² > and R <^13> are a hydrogen atom or a methyl group. R ¹⁴ is a group represented by the above formula (4-1) or formula (4-2). n is an integer of 1 to 6. In formula (4-1), R ¹⁵ represents a hydrogen atom or a methyl group. In formula (4-1) and formula (4-2), * represents a site bonded to an adjacent oxygen atom.

The structural unit (a3) is obtained, for example, by reacting a carboxyl group in the structural unit (a1) with an epoxy group in a polymerizable compound having an epoxy group to form an ester bond. For example, when a compound having (a1) structural unit is reacted with a compound such as (a2) glycidyl methacrylate or 2-methylglycidyl methacrylate to give a structural unit, the above formula is used. R ^{14 in} (4) is a group represented by the above formula (4-1). On the other hand, when a compound such as (a2) structural unit is reacted with a compound such as 3,4-epoxycyclohexylmethyl methacrylate, R ¹⁴ in the above formula (4) is represented by the above formula (4-2). It becomes the basis.

  [A] The content ratio of the structural unit (a3) in the alkali-soluble resin is preferably 5 mol% to 60 mol%, more preferably 10 mol% to 50 mol%, based on all structural units. (A3) By making the content rate of a structural unit into 5 mol%-60 mol%, the cured film for display elements which has the outstanding sclerosis | hardenability etc. can be formed.

[(A4) Structural unit]
(A4) The structural unit is a structural unit represented by the following formula (5). [A] When the alkali-soluble resin contains the (a4) structural unit, the heat resistance of the obtained cured film for a display element can be improved. In addition, since the compatibility with the [C] compound is improved, the [C] compound is uniformly dispersed, and the sensitivity at the time of forming a cured film for a display element can be increased.

In the above formula ^{(5), R 16} represents an alkyl group having 1 to 12 carbon atoms, a cyclohexyl group, a cyclopentyl group, a phenyl group, a tolyl group, a xylyl group, a naphthyl group or a benzyl group.

Examples of the alkyl group having 1 to 12 carbon atoms represented by R ¹⁶ include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group.

  (A4) Examples of compounds that give structural units include N-phenylmaleimide, N-cyclohexylmaleimide, N-tolylmaleimide, N-naphthylmaleimide, N-ethylmaleimide, N-hexylmaleimide, N-benzylmaleimide, and the like. .

  Among these, N-phenylmaleimide and N-cyclohexylmaleimide are preferable from the viewpoint of improving compatibility with the [C] compound.

  [A] The content ratio of the structural unit (a4) in the alkali-soluble resin is preferably 5 mol% to 30 mol%, more preferably 10 mol% to 25 mol%, based on all structural units. (A4) By making the content rate of a structural unit into 5 mol%-30 mol%, the heat resistance of the obtained cured film for display elements can be improved, and compatibility with the [C] compound is further improved.

  In addition, as [A] alkali-soluble resin, you may mix resin containing (a1) structural unit and (a2) structural unit, and resin containing (a1) structural unit and (a3) structural unit.

[Other structural units]
[A] The compound which gives other structural units other than (a1) structural unit to (a4) structural unit may be included as long as the effect of the present invention is not impaired by the alkali-soluble resin. Examples include acrylic acid esters, (meth) acrylic acid chain alkyl esters, (meth) acrylic acid cyclic alkyl esters, (meth) acrylic acid aryl esters, unsaturated aromatic compounds, conjugated dienes, and unsaturated compounds having a tetrahydrofuran skeleton. It is done.

  Examples of the (meth) acrylic acid ester having a hydroxyl group include 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 5-hydroxypentyl acrylate, 6-hydroxyhexyl acrylate, and methacrylic acid. Examples include 2-hydroxyethyl, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 5-hydroxypentyl methacrylate, 6-hydroxyhexyl methacrylate, and the like.

  Examples of the (meth) acrylic acid chain alkyl ester include methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, isodecyl methacrylate, methacrylic acid. N-lauryl acid, tridecyl methacrylate, n-stearyl methacrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, isodecyl acrylate , N-lauryl acrylate, tridecyl acrylate, n-stearyl acrylate, and the like.

Examples of the (meth) acrylic acid cyclic alkyl ester include cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decane-8-yl methacrylate, and tricyclomethacrylate [5. 2.1.0 ^2,6 ] decan-8-yloxyethyl, isobornyl methacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate, Examples include tricyclo [5.2.1.0 ^2,6 ] decan-8-yloxyethyl acrylate, isobornyl acrylate, and the like.

  Examples of the (meth) acrylic acid aryl ester include phenyl methacrylate, benzyl methacrylate, phenyl acrylate, and benzyl acrylate.

  Examples of the unsaturated aromatic compound include styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, and p-methoxystyrene.

  Examples of the conjugated diene include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene and the like.

  Examples of the unsaturated compound containing a tetrahydrofuran skeleton include tetrahydrofurfuryl (meth) acrylate, 2-methacryloyloxy-propionic acid tetrahydrofurfuryl ester, 3- (meth) acryloyloxytetrahydrofuran-2-one, and the like.

<[A] Method for synthesizing alkali-soluble resin>
[A] The alkali-soluble resin can be synthesized by copolymerizing the above-mentioned predetermined monomer in the presence of a polymerization initiator in a solvent. [A] Solvents used in the polymerization reaction for synthesizing the alkali-soluble resin include, for example, alcohol, glycol ether, ethylene glycol alkyl ether acetate, diethylene glycol monoalkyl ether, diethylene glycol dialkyl ether, dipropylene glycol dialkyl ether, propylene glycol mono Examples include alkyl ether, propylene glycol alkyl ether acetate, propylene glycol monoalkyl ether propionate, ketone, ester and the like.

  [A] As the polymerization initiator used in the polymerization reaction for synthesizing the alkali-soluble resin, those generally known as radical polymerization initiators can be used. Examples of the radical polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), 2,2′-azobis- (4-methoxy-2). , 4-dimethylvaleronitrile) and the like.

  [A] In the polymerization reaction for producing the alkali-soluble resin, a molecular weight modifier can be used to adjust the molecular weight. Examples of the molecular weight modifier include halogenated hydrocarbons such as chloroform and carbon tetrabromide; mercaptans such as n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, and thioglycolic acid; Xanthogens such as xanthogen sulfide and diisopropylxanthogen disulfide; terpinolene, α-methylstyrene dimer and the like.

  [A] As a weight average molecular weight (Mw) of alkali-soluble resin, 1,000-30,000 are preferable and 5,000-20,000 are more preferable. [A] By making Mw of alkali-soluble resin into the said specific range, the sensitivity and developability of the said curable resin composition can be improved. In addition, Mw and number average molecular weight (Mn) of the polymer in this specification were measured by gel permeation chromatography (GPC) under the following conditions.

Apparatus: GPC-101 (Showa Denko)
Column: GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804 combined with mobile phase: tetrahydrofuran Column temperature: 40 ° C.
Flow rate: 1.0 mL / min Sample concentration: 1.0 mass%
Sample injection volume: 100 μL
Detector: Differential refractometer Standard material: Monodisperse polystyrene

<[B] Polymerizable compound>
[B] The polymerizable compound contained in the curable resin composition is not particularly limited as long as it is a polymerizable compound having an ethylenically unsaturated bond. For example, ω-carboxypolycaprolactone mono (meth) acrylate, ethylene Glycol (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (Meth) acrylate, bisphenoxyethanol full orange (meth) acrylate, dimethylol tricyclodecane di (meth) acrylate, 2-hydroxy-3- (meth) acryloyloxypropyl methacrylate, 2- (2′-vinyloxy) Toxi) ethyl (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate In addition to tri (2- (meth) acryloyloxyethyl) phosphate, ethylene oxide-modified dipentaerythritol hexaacrylate, succinic acid-modified pentaerythritol triacrylate, etc., it has a linear alkylene group and an alicyclic structure, and A urethane obtained by reacting a compound having two or more isocyanate groups with a compound having one or more hydroxyl groups in the molecule and having 3 to 5 (meth) acryloyloxy groups. ) Acrylate compounds, and the like.

[B] Examples of commercially available polymerizable compounds include Aronix M-400, M-402, M-405, M-450, M-1310, M-1600, M-1960, and M. -7100, M-8030, M-8060, M-8100, M-8100, M-8530, M-8560, M-9050, Aronix TO-756, TO-1450, TO-1382 (above, Toagosei)
KAYARAD DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120, MAX-3510 (above, Nippon Kayaku Co., Ltd.);
Viscoat 295, 300, 360, GPT, 3PA, 400, 802 (Osaka Organic Chemical Industries, Ltd.);
As a urethane acrylate compound, New Frontier R-1150 (Daiichi Kogyo Seiyaku Co., Ltd.);
KAYARAD DPHA-40H, UX-5000 (Nippon Kayaku Co., Ltd.);
UN-9000H (Negami Kogyo Co.);
Aronix M-5300, M-5600, M-5700, M-210, M-220, M-240, M-270, M-6200, M-305, M-309, M M-310, M-315 (above, Toagosei Co., Ltd.);
KAYARAD HDDA, KAYARAD HX-220, HX-620, R-526, R-167, R-604, R-684, R-551, R-712, UX-2201, UX-2301 UX-3204, UX-3301, UX-4101, UX-6101, UX-7101, UX-8101, UX-0937, MU-2100, MU-4001 (above, Nippon Kayaku Co., Ltd.);
Art Resin UN-9000PEP, UN-9200A, UN-7600, UN-333, UN-1003, UN-1255, UN-6060PTM, UN-6060P (Negami Industrial Co., Ltd.);
SH-500B biscoat 260, 312 and 335HP (above, Osaka Organic Chemical Industry Co., Ltd.).

  Moreover, [B1] polymer is mentioned as a [B] polymeric compound.

  [B1] The polymer is a copolymer containing (a3) structural units. In addition, (a3) structural unit is a structural unit represented by the said Formula (4), and is the same structural unit as the (a3) structural unit in [A] alkali-soluble resin. Accordingly, the (a3) structural unit in the [B1] polymer is also the same as in the [A] alkali-soluble resin, for example, the carboxyl group in the monomer giving the structural unit (a1) and the structural unit (a2). It can be obtained by reacting with an epoxy group in a monomer that gives an ester to form an ester bond. For the detailed description of the (a3) structural unit, the description of the (a3) structural unit in the [A] alkali-soluble resin can be applied.

  (A3) 5 mass%-90 mass% are preferable with respect to the structural unit which has a carboxyl group in a copolymer, and 15 mass%-70 mass% are more preferable. By setting it as the said range, the reactivity with a copolymer, the sclerosis | hardenability of an insulating film, etc. improve more.

  [B1] The polymer may contain a structural unit derived from an unsaturated monomer other than the structural unit (a3). Examples of the structural unit derived from the other unsaturated monomer include a structural unit having an oxetanyl group, a structural unit having an alkyl group, a structural unit having a maleimide skeleton, and a structural unit containing a tetrahydrofuran skeleton.

Examples of the monomer that gives a structural unit having an oxetanyl group include 3- (acryloyloxymethyl) oxetane, 3- (acryloyloxymethyl) -2-methyloxetane, 3- (acryloyloxymethyl) -3-ethyloxetane, 3- (acryloyloxymethyl) -2-phenyloxetane, 3- (2-acryloyloxyethyl) oxetane, 3- (2-acryloyloxyethyl) -2-ethyloxetane, 3- (2-acryloyloxyethyl) -3 -Acrylic esters such as ethyl oxetane and 3- (2-acryloyloxyethyl) -2-phenyloxetane;
3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -2-methyloxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -2-phenyloxetane, 3- (2-methacryloyloxyethyl) oxetane, 3- (2-methacryloyloxyethyl) -2-ethyloxetane, 3- (2-methacryloyloxyethyl) -3-ethyloxetane, 3- (2-methacryloyloxyethyl) -2 -Methacrylic acid esters such as phenyloxetane and 3- (2-methacryloyloxyethyl) -2,2-difluorooxetane.

As a monomer that gives a structural unit having an alkyl group, for example, (meth) acrylic acid chain alkyl ester, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, t-methacrylic acid t- Examples include butyl, 2-ethylhexyl methacrylate, isodecyl methacrylate, n-lauryl methacrylate, tridecyl methacrylate, and n-stearyl methacrylate.
Examples of cyclic alkyl esters of methacrylic acid include cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decane-8-yl methacrylate, and tricyclomethacrylate [5.2.1.0]. ^2,6 ] decan-8-yloxyethyl, isobornyl methacrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, acrylic acid Isodecyl, n-lauryl acrylate, tridecyl acrylate, n-stearyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate Tricycloacrylate [5.2.1. ^2,6] decan-8-yl oxy ethyl, and the like isobornyl acrylate.
Examples of the (meth) acrylic acid chain aryl ester include phenyl methacrylate, benzyl methacrylate, phenyl acrylate, and benzyl acrylate.

As a monomer that gives a structural unit having a maleimide skeleton, for example, as a maleimide compound, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N- (4-hydroxyphenyl) maleimide, N- (4-hydroxy) Benzyl) maleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate, N- (9- Acridinyl) maleimide and the like.

  Examples of the monomer that gives a structural unit containing a tetrahydrofuran skeleton include tetrahydrofurfuryl methacrylate, 2-methacryloyloxy-propionic acid tetrahydrofurfuryl ester, 3- (meth) acryloyloxytetrahydrofuran-2-one, and the like. .

Among these monomer compounds, benzyl methacrylate, methyl methacrylate, t-butyl methacrylate, n-lauryl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, 2-methylcyclohexyl acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, and tetrahydrofurfuryl methacrylate are preferable from the viewpoint of copolymerization reactivity and solubility in an aqueous alkali solution. In addition, these compounds may be used independently and may mix and use 2 or more types.

  [B1] The content of structural units derived from other unsaturated monomers in the polymer is preferably 10 mol% to 80 mol%.

([B1] Polymer Synthesis Method)
[B1] A polymer is obtained by polymerizing, for example, a monomer that has a carboxyl group (a1) and a monomer that gives another structural unit, if necessary, in a solvent in the presence of a polymerization initiator. To synthesize a polymer having a carboxyl group. Into the polymer solution, (a2) a polymerizable compound containing an epoxy group that gives a structural unit is added, and if necessary, in the presence of a suitable catalyst, preferably in a solution containing a polymerization inhibitor, under heating. For a predetermined time. Examples of the catalyst include tetrabutylammonium bromide. Examples of the polymerization inhibitor include p-methoxyphenol. The reaction temperature is preferably 70 ° C to 100 ° C. The reaction time is preferably 8 hours to 12 hours.

  Among these, [B] polymerizable compounds include [B1] polymer, a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, succinic acid-modified pentaerythritol triacrylate, trimethylolpropane triacrylate, tripenta. It is preferably a mixture of erythritol octaacrylate and tripentaerythritol heptaacrylate. [B] By using the polymerizable compound as the specific compound, the sensitivity of the curable resin composition and the heat resistance of the formed cured film for display element can be compatible at a high level.

  [B] A polymeric compound can be used individually or in mixture of 2 or more types. As content of the [B] polymeric compound in the said curable resin composition, 10 mass parts-700 mass parts are preferable with respect to 100 mass parts of [A] alkali-soluble resin, and 20 mass parts-600 mass parts are. More preferred. [B] By setting the content of the polymerizable compound in the above specific range, the curable resin composition has a cured film for display elements having sufficient heat resistance, solvent resistance, and voltage holding ratio even at a low exposure amount. Can be formed.

<[C] Compound>
[C] A compound is a compound denoted by the above-mentioned formula (1). Since the compound [C] is a compound having a structure that generates an acid by heat and a structure that generates a radical by light, the curable resin composition can be cured by heat or light. As a result, after the curable resin composition is radically polymerized in the exposure step, the acid generated in the heating step functions as a curing accelerator for the [A] alkali-soluble resin, and can further promote curing. The heating step for generating the acid is a low-temperature heating step that does not require a high-temperature heating of 230 ° C. or higher as in the post-exposure heating step for curing the conventional composition, and is preferable from the viewpoint of energy saving. .

In the above formula (1), R ¹ is a group having a structure that generates an acid by heat. R ² is a group having a structure that generates radicals by light. R ³ and R ⁴ are each independently an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group. a and b are each independently an integer of 1 to 5; c and d are each independently an integer of 0 to 4. X is an oxygen atom, a sulfur atom or a selenium atom.

The group having a structure that generates an acid by heat represented by R ¹ is not particularly limited as long as it is a group that is not cleaved by light and hydrolyzes by heating to generate an acid. It preferably contains a group represented by the above formula (2).

In the above formula (2), R ⁵ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or cyclohexane. Xyl group. However, one of the hydrogen atoms of the alkyl group of R ⁵ may be substituted with a hydroxyl group. R ⁶ is an alkanediyl group having 1 to 12 carbon atoms. R ⁷ is —O—, —S—, —NR ⁸ —, —NR ⁸ CO—, —SO ₂ —, —CS—, —OCO— or —COO—. R ⁸ is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Examples of the alkyl group having 1 to 12 carbon atoms represented by R ⁵ include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and an octyl group. Of these, a methyl group and an ethyl group are preferable, and a methyl group is more preferable.

Examples of the C1-C6 fluoroalkyl group represented by R ⁵ include a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a perfluoroethyl group, and the like. Of these, a trifluoromethyl group is preferred.

R ⁵ is preferably an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, or a phenyl group, more preferably a methyl group, an ethyl group, a trifluoromethyl group, or a phenyl group, and further a methyl group. preferable.

Examples of the alkanediyl group having 1 to 12 carbon atoms represented by R ⁶ include a methylene group, an ethylene group, a propylene group, a butylene group, a propylene group, and a hexylene group. Among these, a methylene group and an ethylene group are preferable, and a methylene group is more preferable.

The alkyl group having 1 to 6 carbon atoms represented by R ^8, for example a methyl group, an ethyl group, a propyl group, a butyl group.

R ⁸ is preferably a hydrogen atom.

R ⁷ is preferably —O—, —S—, —SO ₂ —, —NHCO—, —SO ₂ —, —OCO— or —COO—, and more preferably —O—.

As the group having a structure that generates radicals by the light represented by R ² , hydrolysis is not caused by heat, and radicals are generated by light irradiation such as an exposure process in forming a cured film for a display element. Although it will not specifically limit if it is group, It is preferable to include group represented by the said Formula (3). Since the group represented by the above formula (3) has an oxime ester structure, an alkyl radical is easily generated by light irradiation.

In the above formula (3), R ⁹ is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or cyclohexane. Xyl group. However, one of the hydrogen atoms of the alkyl group of R ⁹ may be substituted with a hydroxyl group. R ¹⁰ is a divalent organic group. R ¹¹ is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a cyano group, a benzyl group, a phenethyl group, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group. However, some or all of the hydrogen atom of the phenyl group of said R ^11, which may be substituted with an alkyl group or an alkoxy group having 1 to 12 carbon atoms having 1 to 12 carbon atoms.

Examples of the alkyl group having 1 to 12 carbon atoms and the fluoroalkyl group having 1 to 6 carbon atoms represented by R ⁹ include an alkyl group having 1 to 12 carbon atoms and a fluoroalkyl having 1 to 6 carbon atoms represented by R ^5. Examples thereof include the same groups as those exemplified as the group.

R ⁹ is preferably an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms and a phenyl group, more preferably a methyl group, an ethyl group, a trifluoromethyl group and a phenyl group, and further a methyl group. preferable.

Examples of the divalent organic group represented by R ¹⁰ include —CO—, —O—, —S—, —NR ⁸ —, —NR ⁸ CO—, —SO ₂ —, —CS—, —OCO—. , -COO- and the like. Of these, -CO- is preferred.

Examples of the alkyl group having 1 to 12 carbon atoms represented by R ¹¹ include the same groups as those exemplified as the alkyl group having 1 to 12 carbon atoms represented by R ⁹ . Of these, a methyl group and an ethyl group are preferable, and a methyl group is more preferable.

Examples of the alkoxy group having 1 to 12 carbon atoms represented by R ¹¹ include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentoxy group, a hexyloxy group, and an octyloxy group.

Examples of the alicyclic hydrocarbon group having 4 to 20 carbon atoms represented by R ¹¹ include a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, a norbornyl group, an adamantyl group, and the like.

The alkyl group having 1 to 12 carbon atoms and the alkoxy group having 1 to 12 carbon atoms in which part or all of the hydrogen atoms of the phenyl group represented by R ¹¹ may be substituted include these groups represented by R ^11. And the same groups as those exemplified above.

R ¹¹ is preferably an alkyl group having 1 to 12 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group.

  As said a and b, 1-3 are preferable from a viewpoint that a synthesis | combination is easy, and 1 is more preferable. As said c and d, from a viewpoint that a synthesis | combination is similarly easy, 0-2 are preferable and 0 is more preferable.

  X is preferably a sulfur atom.

As the compound [C], R ⁵ in the above formula (2) and R ⁹ in the formula (3) are preferably the same group. When these groups are the same, the acetylation step can be made one step in the synthesis of the [C] compound, and it can be produced at low cost without the need for separation and purification. As said same group, a methyl group, an ethyl group, a trifluoromethyl group, and a phenyl group are preferable, and a methyl group is more preferable. In addition, as the [C] compound, a and b in the above formula (1) are 1, and c and d are 0 from the viewpoint of excellent curing promotion effect of the curable resin composition and easy synthesis. In the formula (2), R ⁵ is a methyl group, R ⁶ is an ethylene group, R ⁷ is —O—, R ⁹ and R ¹¹ in the formula (3) are methyl groups, and R ¹⁰ is a carbonyl group. Is more preferable.

  Examples of the compound [C] include compounds represented by the following formulas.

  Of the compounds represented by the above formula, compounds represented by formulas (C-1) to (C-3) are preferred, and a compound represented by (C-1) is more preferred.

  Taking the compound represented by the above formula (C-1) (hereinafter also referred to as “(C-1) compound”) as an example, the function of the [C] compound in the curable resin composition will be specifically described. To do.

  The compound (C-1) has an oxime ester bond acetyl group (above 1) and an ester bond acetyl group (above 2) in one molecule. In this compound, the acetyl group of the oxime ester 1 is decomposed by exposure as shown in the following formula to generate a methyl radical. This radical contributes to a radical crosslinking reaction such as an acrylic group, and accelerates the curing of the curable resin composition.

  This compound further generates acetic acid after radical generation by hydrolysis of the above-mentioned 2 parts by heating. This acetic acid is considered to function as a curing accelerator for the crosslinking reaction of the epoxy group in the resin. Thus, the (C-1) compound can be said to be a new type of polymerization initiator having radical generating ability and epoxy curing promoting ability.

<Method for Synthesizing [C] Compound>
The [C] compound in the present invention can be synthesized according to a conventionally known method. For example, it can be synthesized as follows.

  4-Mercaptophenol is dissolved in N, N-dimethylformamide, potassium carbonate and 4-ethanoylfluorobenzene are added thereto, and the mixture is heated and stirred at 40 ° C. to 100 ° C. for 2 hours to 10 hours in a nitrogen atmosphere to obtain a salt. . This is dissolved in N, N-dimethylformamide, potassium carbonate and 2-bromoethanol are added, and the mixture is heated and stirred at 40 ° C. to 100 ° C. for 2 hours to 10 hours in a nitrogen atmosphere. Get things. This crude product and concentrated hydrochloric acid are dissolved in N, N-dimethylformamide, isobutyl nitrite is added, and the mixture is stirred at room temperature for 2 to 10 hours to obtain a precursor compound of the [C] compound. The compound [C] can be obtained by adding triethylamine to a toluene solution of this precursor compound and dropping acetyl chloride or the like.

  [C] As content of a compound, 0.1 mass part-15 mass parts are preferable with respect to 100 mass parts of [A] alkali-soluble resin, and 1 mass part-10 mass parts are more preferable. By making content of [C] compound into the said specific range, the sensitivity of the said curable resin composition, the transmittance | permeability of the cured film for display elements, etc. can be improved more.

<[C ′] Photopolymerization Initiator>
The curable resin composition may contain one or more [C ′] photopolymerization initiators in addition to the [C] compound.

  [C ′] Photopolymerization initiators include, for example, thioxanthone compounds, acetophenone compounds, biimidazole compounds, triazine compounds, O-acyloxime compounds, onium salt compounds, benzoin compounds, benzophenone compounds, α -Diketone compounds, polynuclear quinone compounds, diazo compounds, imide sulfonate compounds and the like. Among these, [C ′] photopolymerization initiator contains at least one selected from the group consisting of thioxanthone compounds, acetophenone compounds, biimidazole compounds, triazine compounds, and O-acyloxime compounds. It is preferable to do.

  Examples of the thioxanthone compound include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone and the like can be mentioned.

  Examples of acetophenone compounds include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl). Examples include butan-1-one and 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) butan-1-one.

  Examples of the biimidazole compound include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2, 4-dichlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2,4,6-trichlorophenyl) -4,4 ′, 5 Examples include 5'-tetraphenyl-1,2'-biimidazole. In addition, when using a biimidazole-type compound as a photoinitiator, it is preferable at the point which can improve a sensitivity to use a hydrogen donor together. The hydrogen donor means a compound that can donate a hydrogen atom to a radical generated from a biimidazole compound by exposure. Examples of the hydrogen donor include mercaptan-based hydrogen donors such as 2-mercaptobenzothiazole and 2-mercaptobenzoxazole; 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, and the like. An amine-type hydrogen donor is mentioned. In the present invention, hydrogen donors can be used alone or in combination of two or more, but one or more mercaptan hydrogen donors and one or more amine hydrogen donors are used in combination. It is preferable in that the sensitivity can be further improved.

  Examples of triazine compounds include 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2- [2- (5-methyl). Furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s- Triazine, 2- [2- (4-diethylamino-2-methylphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl]- 4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-ethoxystyryl) ) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-n- butoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine.

  Examples of the O-acyloxime compounds include 1,2-octanedione, 1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime), and ethanone-1- [9-ethyl-6- (2 -Methylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime), ethanone-1- [9-ethyl-6- (2-methyl-4-tetrahydrofuranylmethoxybenzoyl) -9H-carbazole -3-yl] -1- (O-acetyloxime), ethanone-1- [9-ethyl-6- {2-methyl-4- (2,2-dimethyl-1,3-dioxolanyl) methoxybenzoyl}- 9H-carbazol-3-yl] -1- (O-acetyloxime) and the like.

  [C ′] The content of the photopolymerization initiator is preferably 0.01 parts by mass to 60 parts by mass and more preferably 1 part by mass to 55 parts by mass with respect to 100 parts by mass of the [A] alkali-soluble resin. By setting the content of the [C ′] photopolymerization initiator in the specific range, curing by exposure can be sufficiently obtained, and adhesion with the substrate can be appropriately ensured.

<[D] radical scavenger>
The curable resin composition contains a [D] radical scavenger in order to prevent the bond breakage of the compound due to radicals or peroxides. Examples of such compounds include radical scavengers such as compounds having a hindered phenol structure and compounds having a hindered amine structure, and peroxide decomposing agents such as compounds having an alkyl phosphite structure and compounds having a thioether structure. .

  Since the curable resin composition contains the [D] radical scavenger, it is possible to capture radicals generated during exposure or heating, and to decompose peroxides generated by oxidation. It is possible to prevent the breakage of molecular bonds. As a result, a cured film for a display element such as an interlayer insulating film obtained from the curable resin composition can exhibit excellent light resistance and heat resistance. In addition, since the curable resin composition uses the radical scavenger or peroxide decomposer having the above specific structure as the [D] radical scavenger, the radiation sensitivity of the composition even if these are added. Can be prevented from decreasing the transmittance and voltage holding ratio of the cured film obtained from the composition.

Examples of the compound having a hindered phenol structure include pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], thiodiethylenebis [3- (3,5-di-). tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, tris- (3,5-di-tert-butyl-4-hydroxy Benzyl) -isocyanurate, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, N, N′-hexane-1,6 -Diylbis [3- (3,5-di-tert-butyl-4-hydroxyphenylpropionamide), 3,3 ' 3 ′, 5 ′, 5′-hexa-tert-butyl-a, a ′, a ′-(mesitylene-2,4,6-triyl) tri-p-cresol, 4,6-bis (octylthiomethyl) -O-cresol, 4,6-bis (dodecylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate, hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3,5-tris [(4-tert-butyl-3-hydroxy-2,6-xylin) methyl]- 1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5 -Triazine- -Ylamine) phenol, 2,5-di-tert-butylhydroquinone, 2,6-di-tert-butylhydroquinone, 2-tert-butylhydroquinone, 2,5-di-tert-butylphenol, 2,6-di- Examples include tert-butylphenol and 2-tert-butylphenol.

  Examples of commercially available compounds having the hindered phenol structure include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-70 and ADK STAB. AO-80, ADK STAB AO-330 (above, manufactured by ADEKA), sumizer GM, sumizer GS, sumizer MDP-S, sumizer BBM-S, sumizer WX-R, sumiser Z-80, IR NO.10, IR NO.10, IR NO. IRGANOX 1098, IRGANOX 1135, IRGANOX 1330, IRGANOX 1726, IRGA OX1425WL, IRGANOX1520L, IRGANOX245, IRGANOX259, IRGANOX3114, IRGANOX565, IRGAMOD295 (manufactured by Ciba Japan Co., Ltd.), Yoshinox BHT, Yoshinox BB, Yoshinox 2246G, Yoshinox 425, Yoshinox 250, 17 314 (above, manufactured by API Corporation) and the like.

  Examples of the compound having a hindered amine structure include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (2,2,6,6-tetramethyl-4-piperidyl) succinate, bis ( 1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (N-octoxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (N-benzyloxy-2, 2,6,6-tetramethyl-4-piperidyl) sebacate, bis (N-cyclohexyloxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6) -Pentamethyl-4-piperidyl) 2- (3,5-di-t-butyl-4-hydroxybenzyl) -2-butylmalonate, bis (1-acroyl-2, , 6,6-tetramethyl-4-piperidyl) 2,2-bis (3,5-di-t-butyl-4-hydroxybenzyl) -2-butylmalonate, bis (1,2,2,6, 6-pentamethyl-4-piperidyl) decandioate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, 4- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyl Oxy] -1- [2- (3- (3,5-di-t-butyl-4-hydroxyphenyl) propionyloxy) ethyl] -2,2,6,6-tetramethylpiperidine, 2-methyl-2 -(2,2,6,6-tetramethyl-4-piperidyl) amino-N- (2,2,6,6-tetramethyl-4-piperidyl) propionamide, tetrakis (2,2,6,6- Tetramethyl-4 Piperidyl) 1,2,3,4-butane tetracarboxylate, tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) 1,2,3,4-butane tetracarboxylic compounds such rate;

  N, N ′, N ″, N ′ ″-tetrakis- [4,6-bis- [butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino]- Triazin-2-yl] -4,7-diazadecane-1,10-diamine, dibutylamine and 1,3,5-triazine.N, N′-bis (2,2,6,6-tetramethyl-4- Piperidyl) -1,6-hexamethylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine polycondensate, dibutylamine, 1,3,5-triazine and N, N Polycondensate with '-bis (2,2,6,6-tetramethyl-4-piperidyl) butylamine, poly [{(1,1,3,3-tetramethylbutyl) amino-1,3,5- Triazine-2,4-diyl} {(2,2,6,6-teto Methyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], 1,6-hexanediamine-N, N′-bis (2,2,6 , 6-tetramethyl-4-piperidyl) and morpholine-2,4,6-trichloro-1,3,5-triazine, poly [(6-morpholino-s-triazine-2,4- A piperidine ring such as diyl) [(2,2,6,6-tetramethyl-4-piperidyl) imino] -hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]]. High molecular weight HALS bonded plurally through a triazine skeleton; polymer of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 1,2,3,4-butanetetra Rubonic acid, 1,2,2,6,6-pentamethyl-4-piperidinol and 3,9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro [5 , 5] Polymer types such as a compound in which a piperidine ring is bonded via an ester bond, such as a mixed esterified product with undecane.

  As the compound having the hindered amine structure, for example, ADK STAB LA-52, ADK STAB LA57, ADK STAB LA-62, ADK STAB LA-67, ADK STAB LA-63P, ADK STAB LA-68LD, ADK STAB LA-77, ADK STAB LA-82, ADK STAB LA-87 (manufactured by ADEKA), sumilizer 9A (manufactured by Sumitomo Chemical), CHIMASSORB 119FL, CHIMASSORB 2020FDL, CHIMASSORB 944FDL, TINUVIN 622LD, TINUVIN 144, TINUVIN 765 .

  Examples of the compound having an alkyl phosphite structure include tris (nonylphenyl) phosphite, tris (p-tert-octylphenyl) phosphite, tris [2,4,6-tris (α-phenylethyl)] phosphite, Tris (p-2-butenylphenyl) phosphite, bis (p-nonylphenyl) cyclohexyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, di (2,4-di-tert- Butylphenyl) pentaerythritol diphosphite, 2,2′-methylenebis (4,6-di-t-butyl-1-phenyloxy) (2-ethylhexyloxy) phosphorus, distearyl pentaerythritol diphosphite, 4, 4'-isopropylide-diphenol alkyl phosphite, teto Latridecyl-4,4'-butylidene-bis (3-methyl-6-tert-butylphenol) diphosphite, tetrakis (2,4-di-tert-butylphenyl) -4,4'-biphenylene phosphite, 2,6- Di-tert-butyl-4-methylphenyl phenyl pentaerythritol diphosphite, 2,6-tert-butyl-4-methylphenyl phenyl pentaerythritol diphosphite, 2,6-di-tert-butyl- 4-ethylphenyl stearyl pentaerythritol diphosphite, di (2,6-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, 2,6-di-tert-amyl-4-methylphenyl phenyl・ Pentaerythritol diphosphite That.

  As a compound having a structure as an alkyl phosphite, for example, ADK STAB PEP-4C, ADK STAB PEP-8, ADK STAB PEP-8W, ADK STAB PEP-24G, ADK STAB PEP-36, ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB 1522, ADK STAB 1178, ADK STAB 1500, ADK STAB C, ADK STAB 135A, ADK STAB 3010, ADK STAB TPP (manufactured by ADEKA), IRGAFOS 168 (manufactured by Ciba Japan), and the like.

  Examples of the compound having a thioether structure include dilauryl thiodipropionate, ditridecyl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, pentaerythritol tetrakis (3-lauryl thiopropionate), Pentaerythritol tetrakis (3-octadecylthiopropionate), pentaerythritol tetrakis (3-myristylthiopropionate), pentaerythritol tetrakis (3-stearylthiopropionate), and the like.

  As a compound having a thioether structure, for example, ADK STAB AO-412S, ADK STAB AO-503 (manufactured by ADEKA), Sumizer TPL-R, Sumizer TPM, Sumizer TPS, Sumizer TP-D, Sumitizer MB Chemical Corporation), IRGANOXPS800FD, IRGANOXPS802FD (above, manufactured by Ciba Japan), DLTP, DSTP, DMTP, DTTP (above, manufactured by API Corporation), and the like.

  In addition, these compounds can be used individually or in mixture of 2 or more types.

  In the curable resin composition of the present invention, the content of the [D] radical scavenger is preferably 0.1 parts by mass or more and 10 parts by mass or less, more preferably 100 parts by mass of the polymer [A]. Is 0.5 parts by mass or more and 5 parts by mass or less, and more preferably 1.5 parts by mass or more and 3 parts by mass or less. [A] It was obtained from the curable resin composition while maintaining the radiation sensitivity of the curable resin composition by having the content of the [D] radical scavenger in the above range with respect to 100 parts by mass of the polymer. The transmittance, voltage holding ratio, light resistance and heat resistance of the cured film and the like can be further improved.

<[E] Colorant>
It is preferable that the said curable resin composition further contains a [E] coloring agent. When the curable resin composition further contains an [E] colorant, for example, a cured film for a display element as a colored pattern for a color filter or the like can be formed.

  [E] The colorant is not particularly limited as long as it has colorability, and colors and materials can be appropriately selected according to the use of the color filter. As the colorant, for example, any of pigments, dyes, and natural pigments can be used. However, pigments and dyes are preferable because color filters are required to have high color purity, luminance, contrast, and the like. In this invention, a coloring agent can be used individually or in mixture of 2 or more types.

  The pigment may be either an organic pigment or an inorganic pigment, and examples of the organic pigment include compounds classified as pigments in the color index (CI; issued by The Society of Dyers and Colorists). Specifically, those having the following color index (CI) names are mentioned.

C. I. Pigment Yellow 12, 13, 14, 17, 20, 24, 31, 55, 83, 93, 109, 110, 138, 139, 150, 153, 154, 155, 166, 168, 180, 211;
C. I. Pigment Orange 5, 13, 13, 24, 34, 36, 38, 40, 43, 46, 49, 61, 64, 68, 70, 71, etc. 72, 73, 74;
C. I. Pigment Red 1, 2, 2, 5, 17, 31, 32, 41, 122, 123, 144, 149, 166, 168, 170, 171, 175, 176, 177, 178, 179, 180, 185, 187, 202, 206, 207, 209, 214, 220, 221, 224, 242, 243, 254, 255, 262, 264, 272;
C. I. Pigment Violet 1, 19, 23, 29, 32, 36, 38;
C. I. Pigment Blue 15, 15: 3, 15: 4, 15: 6, 60, 80;
C. I. Pigment Green 7, 36, 58;
C. I. Pigment Brown 23 and 25;
C. I. Pigment black 1, 7 and the like.

  Examples of the inorganic pigment include titanium oxide, barium sulfate, calcium carbonate, zinc white, lead sulfate, yellow lead, zinc yellow, red bean (red iron oxide (III)), cadmium red, ultramarine blue, bitumen, and chromium oxide green. , Cobalt green, amber, titanium black, synthetic iron black, carbon black and the like.

  In the present invention, the pigment may be purified and used by a recrystallization method, a reprecipitation method, a solvent washing method, a sublimation method, a vacuum heating method, or a combination thereof. Moreover, the pigment surface may be modified with a resin if desired. Examples of the resin that modifies the particle surface of the pigment include vehicle resins described in JP-A No. 2001-108817, and various commercially available resins for dispersing pigments. As a resin coating method on the carbon black surface, for example, methods described in JP-A-9-71733, JP-A-9-95625, JP-A-9-124969 and the like can be employed. The organic pigment is preferably used by refining primary particles by so-called salt milling. Examples of the salt milling method include the method disclosed in Japanese Patent Application Laid-Open No. 08-179111.

  As the dye, known dyes can be used as long as they are soluble in an organic solvent, and examples thereof include oil-soluble dyes, acid dyes or derivatives thereof, direct dyes, and modern dyes. Specifically, those having the following color index (CI) names are mentioned.

C. I. Solvent Yellow 4, 14, 15, 23, 24, 38, 62, 63, 68, 82, 88, 94, 98, 99, 162, 179;
C. I. Solvent Red 45, 49, 125, 130;
C. I. Solvent Orange 2, 7, 11, 15, 15, 26, 56;
C. I. Solvent Blue 35, 37, 59, 67;
C. I. Acid Yellow 1, 3, 7, 9, 11, 17, 17, 25, 29, 34, 36, 38, 40, 42, 54, 65, the same 72, 73, 76;
C. I. Acid Red 91, 92, 97, 114, 138, 151;
C. I. Acid Orange 51, 63;
C. I. Acid Blue 80, 83, 90;
C. I. Acid Green 9, 16, 25, 27 and the like.

  [E] By using a dye as a colorant, it is possible to achieve high brightness and high contrast that cannot be achieved with a pigment alone. However, when a dye is used as a colorant [E] in a conventional radiation-sensitive resin composition, alkali developability, pixel heat resistance, solvent resistance, and the like may be significantly deteriorated. According to the radiation-sensitive resin composition, a radiation-sensitive resin composition having good alkali developability can be obtained even when a dye is used as the [E] colorant.

  [E] The content of the colorant is usually 5% by mass to 70% in the solid content of the curable resin composition from the viewpoint of forming a pixel having high luminance and excellent color purity or a black matrix having excellent light shielding properties. % By mass, preferably 5% by mass to 60% by mass.

<Other optional components>
The curable resin composition is a range that does not impair the effects of the present invention other than [A] alkali-soluble resin, [B] polymerizable compound, [C] compound, [D] radical scavenger, and [E] colorant. If necessary, it may contain other optional components such as an adhesion assistant, a surfactant, an epoxy compound, and a storage stabilizer. These other optional components may be used alone or in combination of two or more. Hereinafter, each component will be described in detail.

[Adhesion aid]
Adhesion aids can be used to improve the adhesion between the resulting cured film and the substrate. As the adhesion assistant, a functional silane coupling agent having a reactive functional group such as a carboxyl group, a methacryloyl group, a vinyl group, an isocyanate group, or an oxiranyl group is preferable. For example, trimethoxysilylbenzoic acid, γ-methacryloxypropyltri Examples include methoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the like. .

  The content of the adhesion assistant is preferably 20 parts by mass or less and more preferably 15 parts by mass or less with respect to 100 parts by mass of [A] alkali-soluble resin. When the content of the adhesion assistant exceeds 20 parts by mass, there is a tendency that development residue tends to occur.

[Surfactant]
A surfactant can be used to further improve the film-forming property of the curable resin composition. Examples of the surfactant include a fluorine-based surfactant and a silicone-based surfactant.

  As the fluorosurfactant, a compound having a fluoroalkyl group and / or a fluoroalkylene group in at least one of the terminal, main chain and side chain is preferable. Commercially available fluorosurfactants include, for example, Footent FT-100, -110, -140A, -150, -250, -251, -300, -310, -400S, Include Fantient FTX-218 and -251 (above, Neos).

  Examples of commercially available silicone surfactants include Torresilicone DC3PA, DC7PA, SH11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH-190, SH-193, SZ-6032, SF-8428, DC-57, DC-190, SH 8400 FLUID) (above, Toray Dow Corning Silicone).

  As content of surfactant, 1.0 mass part or less is preferable with respect to 100 mass parts of [A] alkali-soluble resin, and 0.7 mass part or less is more preferable. [F] When the content of the surfactant exceeds 1.0 part by mass, film unevenness is likely to occur.

[Storage stabilizer]
Examples of the storage stabilizer include sulfur, quinones, hydroquinones, polyoxy compounds, amines, nitronitroso compounds, and more specifically, 4-methoxyphenol, N-nitroso-N-phenylhydroxylamine aluminum, and the like. Is mentioned.

  As content of a preservation | save stabilizer, 3.0 mass parts or less are preferable with respect to 100 mass parts of [A] alkali-soluble resin, and 1.0 mass part or less is more preferable. When content of a storage stabilizer exceeds 3.0 mass parts, the sensitivity of the said curable resin composition may fall and a pattern shape may deteriorate.

<Method for preparing curable resin composition>
The curable resin composition is necessary in addition to suitable components such as [A] alkali-soluble resin, [B] polymerizable compound and [C] compound, [D] radical scavenger, and [E] colorant. Depending on the case, it is prepared by mixing other optional components at a predetermined ratio. The effective resin composition is preferably used in a solution state after being dissolved in an appropriate solvent.

  As a solvent used for the preparation of the curable resin composition, [A] alkali-soluble resin, [B] polymerizable compound, [C] compound, [D] radical scavenger, [E] colorant and other optional Those that dissolve or disperse the components uniformly and do not react with each component are used.

Examples of the solvent include, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, and ethylene glycol from the viewpoints of solubility of each component, reactivity with each component, ease of film formation, and the like. Mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol Monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl (Polyethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, etc. ) Alkylene glycol monoalkyl ethers;
Acetic acid ethylene glycol monomethyl ether, acetic acid ethylene glycol monoethyl ether, acetic acid ethylene glycol mono-n-propyl ether, acetic acid ethylene glycol mono-n-butyl ether, acetic acid diethylene glycol monomethyl ether, acetic acid diethylene glycol monoethyl ether, acetic acid diethylene glycol mono-n-propyl Acetic acid (poly) alkylene glycol monoalkyl ethers such as ether, diethylene glycol mono-n-butyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate ;
Other ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran;
Ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, diacetone alcohol (4-hydroxy-4-methylpentan-2-one), 4-hydroxy-4-methylhexane-2-one;
Diacetates such as propylene glycol diacetate, 1,3-butylene glycol diacetate, 1,6-hexanediol diacetate;
Lactic acid alkyl esters such as methyl lactate and ethyl lactate;
Ethyl acetate, n-propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate, n-pentyl formate, i-pentyl acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, N-butyl propionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutylpropionate, ethyl butyrate, n-propyl butyrate, i-propyl butyrate, n-butyl butyrate, ethyl hydroxyacetate, ethyl ethoxyacetate, Methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, Ethyl 2-hydroxy-2-methylpropionate, 2 Hydroxy-3-methyl-butyric acid methyl, other esters such as ethyl 2-oxo acid;
Aromatic hydrocarbons such as toluene and xylene;
Examples thereof include amides such as N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide and the like.

  Among these solvents, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, Cyclohexanone, 2-heptanone, 3-heptanone, 1,3-butylene glycol diacetate, 1,6-hexanediol diacetate, ethyl lactate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropionic acid Ethyl, 3-methyl-3-methoxybutylpropionate, n-butyl acetate, i-butyl acetate, n-amyl formate, vinegar i- amyl, n- butyl propionate, ethyl butyrate, i- propyl butyrate n- butyl, ethyl pyruvate are preferred. A solvent can be used individually or in mixture of 2 or more types.

  Furthermore, in order to improve the in-plane uniformity of the film thickness together with the above solvent, a high boiling point solvent can be used in combination. Examples of the high boiling point solvent include benzyl ethyl ether, di-n-hexyl ether, acetonyl acetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl acetate, ethyl benzoate, diethyl oxalate, malee Examples include diethyl acid, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol monophenyl ether acetate. The high boiling point solvent can be used alone or in combination of two or more.

  The content of the solvent is not limited, but the total concentration of each component excluding the solvent of the radiation-sensitive resin composition is 5% by mass from the viewpoint of applicability and stability of the obtained radiation-sensitive resin composition. The amount of ˜50% by mass is preferable, and the amount of 10% by mass to 40% by mass is more preferable. When the radiation-sensitive resin composition is prepared in a solution state, the solid content concentration (components other than the solvent in the composition solution) may be any concentration (for example, depending on the purpose of use, desired film thickness, etc. 5 mass% to 50 mass%). The more preferable solid content concentration varies depending on the method of forming the coating film on the substrate, which will be described later. The composition solution thus prepared can be used after being filtered using a Millipore filter or the like having a pore diameter of about 0.5 μm.

<Method for forming cured film for display element>
The curable resin composition is preferable for forming a cured film for a display element. Moreover, the cured film for display elements formed from the said optical resin composition is suitably contained in this invention.

The method for forming a cured film for a display element of the present invention is as follows.
(1) A step of forming a coating film on a substrate using the curable resin composition,
(2) A step of irradiating at least a part of the coating film with radiation,
(3) The process which develops the coating film irradiated with the said radiation, and (4) The process which heats the said developed coating film at the temperature of 180 degrees C or less.

  According to the formation method of the present invention, a cured film for a display element that is excellent in compression performance, transmittance, light resistance, voltage holding ratio, development resistance, heat resistance, and solvent resistance can be formed even by using a low temperature heating step. Hereinafter, each process is explained in full detail.

[Step (1)]
In this step, a transparent conductive film is formed on one side of the transparent substrate, and a coating film of the curable resin composition is formed on the transparent conductive film. Examples of the transparent substrate include glass substrates such as soda lime glass and alkali-free glass, and resin substrates made of plastics such as polyethylene terephthalate, polybutylene terephthalate, polyethersulfone, polycarbonate, and polyimide.

As the transparent conductive film provided on one surface of the transparent substrate, a NESA film (registered trademark of PPG, USA) made of tin oxide (SnO ₂ ), an ITO film made of indium oxide-tin oxide (In ₂ O ₃ -SnO ₂ ) Etc.

  When a coating film is formed by a coating method, the coating film is preferably formed by heating (pre-baking) the coated surface after coating the solution of the curable resin composition on the transparent conductive film. it can. As solid content concentration of the said curable resin composition solution used for the apply | coating method, 5 mass%-50 mass% are preferable, 10 mass%-40 mass% are more preferable, 15 mass%-35 mass% are especially preferable. As a coating method of the curable resin composition, for example, a spray method, a roll coating method, a spin coating method (spin coating method), a slit coating method (slit die coating method), a bar coating method, an ink jet coating method, or the like can be used. The method can be adopted. Of these, spin coating or slit coating is preferred.

  The prebaking conditions vary depending on the type of each component, the blending ratio, and the like, but are preferably 70 ° C. to 120 ° C. and about 1 to 15 minutes. The film thickness after pre-baking of the coating film is preferably 0.5 μm to 10 μm, and more preferably about 1.0 μm to 7.0 μm.

[Step (2)]
In this step, radiation is applied to at least a part of the formed coating film. At this time, when irradiating only a part of the coating film, for example, a method of irradiating through a photomask having a predetermined pattern can be used.

  Examples of radiation used for irradiation include visible light, ultraviolet light, and far ultraviolet light. Of these, radiation having a wavelength in the range of 250 nm to 550 nm is preferable, and radiation including ultraviolet light of 365 nm is more preferable.

Radiation dose (exposure dose), as a value measured by a luminometer intensity at a wavelength 365nm of the radiation emitted (OAI model 356, Optical Associates Ltd. ^{Inc.), 100J / m 2 ~5,000J} / m 2 is Preferably, 200 J / m ^{2 to} 3,000 J / m ² is more preferable.

The curable resin composition has a higher sensitivity than a conventionally known composition, and the desired film thickness even when the radiation dose is 700 J / m ² or less, and even 600 J / m ² or less. A cured film for a display element having a good shape, excellent adhesion and high hardness can be obtained.

[Step (3)]
In this step, the coated film after irradiation is developed to remove unnecessary portions and form a predetermined pattern. Examples of the developer used for development include aqueous solutions of alkaline compounds such as inorganic alkalis such as sodium hydroxide, potassium hydroxide and sodium carbonate, and quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. It is done. An appropriate amount of a water-soluble organic solvent such as methanol or ethanol and / or a surfactant may be added to the aqueous solution of the alkaline compound.

  The developing method may be any of a liquid filling method, a dipping method, a shower method, and the like, and the developing time is preferably about 10 seconds to 180 seconds at room temperature. Subsequent to the development processing, for example, washing with running water is performed for 30 seconds to 90 seconds, and then a desired pattern is obtained by air drying with compressed air or compressed nitrogen.

[Step (4)]
In this step, a cured film for display element is obtained by heating the obtained patterned coating film with a suitable heating device such as a hot plate or oven. As heating temperature, it is 250 degrees C or less normally, 200 degrees C or less is preferable, 180 degrees C or less is more preferable, 150 degrees C or less is further more preferable. According to the forming method, even when such a low-temperature heating step is used, since sufficient curing occurs due to the action of the acid generated from the [C] compound, curing for display elements excellent in heat resistance, solvent resistance, etc. A film can be formed. The heating time is, for example, about 5 to 30 minutes on a hot plate and about 30 to 180 minutes for an oven.

<Method for manufacturing display element>
A display element provided with the said cured film for display elements is also suitably contained in this invention. As a method for manufacturing a display element, first, a pair (two) of transparent substrates having a transparent conductive film (electrode) on one side is prepared, and the radiation-sensitive resin composition is formed on the transparent conductive film of one of the substrates. Is used to form a spacer and / or a protective film in accordance with the method described above. Subsequently, an alignment film having liquid crystal alignment ability is formed on the transparent conductive film and the spacer or protective film of these substrates. These substrates are arranged facing each other with a certain gap (cell gap) so that the liquid crystal alignment direction of each alignment film is orthogonal or antiparallel, with the surface on which the alignment film is formed inside. A liquid crystal is filled in the cell gap defined by the surface of the substrate (alignment film) and the spacer, and the filling hole is sealed to constitute a liquid crystal cell. Then, the display element of the present invention is bonded to both outer surfaces of the liquid crystal cell such that the polarizing direction is aligned or orthogonal to the liquid crystal alignment direction of the alignment film formed on one surface of the substrate. can get.

  As another method, a pair of transparent substrates on which a transparent conductive film, an interlayer insulating film, a protective film, a spacer, or both, and an alignment film are formed are prepared in the same manner as described above. After that, along the edge of one substrate, an ultraviolet curable sealant is applied using a dispenser, and then the liquid crystal is dropped in the form of fine droplets using a liquid crystal dispenser, and the two substrates are bonded together under vacuum. . Then, both the substrates are sealed by irradiating the sealing agent part with ultraviolet rays using a high-pressure mercury lamp. Finally, the display element of the present invention is obtained by attaching polarizing plates to both outer surfaces of the liquid crystal cell.

  Examples of the liquid crystal used in each of the above methods include nematic liquid crystal and smectic liquid crystal. In addition, as a polarizing plate used outside the liquid crystal cell, a polarizing film in which a polarizing film called an “H film” that absorbs iodine while stretching and aligning polyvinyl alcohol is sandwiched between cellulose acetate protective films, or an H film Examples thereof include a polarizing plate made of itself.

  EXAMPLES Hereinafter, although this invention is explained in full detail based on an Example, this invention is not interpreted limitedly by this Example.

<[A] Synthesis of alkali-soluble resin>
[Synthesis Example 1]
A flask equipped with a condenser and a stirrer is charged with 5 parts by mass of 2,2′-azobis- (2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol methyl ethyl ether, and subsequently (a1) a methacrylic compound giving a structural unit. 12 parts by weight of acid, (a2) 40 parts by weight of glycidyl methacrylate giving structural units, 20 parts by weight of styrene giving other structural units and tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate A solution containing the copolymer (A-1) was prepared by charging 28 parts by mass, purging with nitrogen, gradually increasing the temperature of the solution to 70 ° C., and maintaining the temperature for 5 hours for polymerization. (Solid concentration = 31.3%) was obtained. The copolymer (A-1) had Mw = 12,000.

<[B] Synthesis of Polymerizable Compound; Synthesis of Polymer Containing Structural Unit of Formula (4)>
[Synthesis Example 2]
A flask equipped with a condenser and a stirrer was charged with 4 parts by weight of 2,2′-azobisisobutyronitrile and 300 parts by weight of diethylene glycol methyl ethyl ether, and subsequently (a1) 23 parts by weight of methacrylic acid to give a structural unit, While charging 10 parts by weight of styrene to give other structural units, 32 parts by weight of benzyl methacrylate and 35 parts by weight of methyl methacrylate, and 2.7 parts by weight of α-methylstyrene dimer as a molecular weight regulator, The temperature of the solution was raised to 80 ° C., and this temperature was kept for 4 hours, and then raised to 100 ° C., and this temperature was kept for 1 hour for polymerization to obtain a solution containing a copolymer (solid content). Concentration = 24.9%). Mw of the obtained copolymer was 12,500. Next, 1.1 parts by mass of tetrabutylammonium bromide and 0.05 parts by mass of 4-methoxyphenol as a polymerization inhibitor were added to the solution containing the copolymer, and after stirring at 90 ° C. for 30 minutes in an air atmosphere, methacrylic acid was added. A copolymer (B-1) was obtained by adding 16 parts by mass of glycidyl and reacting at 90 ° C. for 10 hours (solid content concentration = 29.0%). Mw of the copolymer (B-1) was 14,200. Reprecipitation purification is carried out by adding the copolymer (B-1) dropwise to hexane, and the reprecipitation resin solid content is analyzed by ¹ H-NMR analysis for the reaction rate of glycidyl methacrylate ((a3) production rate of structural units). ) Was calculated. Integration between the peak derived from the methacrylic group of glycidyl methacrylate at around 6.1 ppm and 5.6 ppm and the proton of the aromatic ring around 6.8 ppm to 7.4 ppm derived from the structural unit of benzyl methacrylate in the copolymer From the comparison of the ratio, the reaction rate between glycidyl methacrylate and the carboxyl group in the copolymer was calculated. As a result, 96 mol% of the reacted glycidyl methacrylate reacted with the carboxyl group in the copolymer.

<Synthesis of [C] Compound; C-1>
[Synthesis Example 3]
(Step (1))
In a 200 mL three-necked flask, 5.0 g (39.6 mmol) of 4-mercaptophenol was weighed and dissolved in 30 mL of N, N-dimethylformamide. To this, 8.3 g (60 mmol) of potassium carbonate was added and stirred. Next, 4.0 g (26.2 mmol) of 4-ethanoylfluorobenzene was added, and the mixture was heated and stirred at 60 ° C. for 4 hours under a nitrogen atmosphere. The reaction solution is cooled to room temperature, and distilled water is added thereto to dissolve the generated salt. The reaction solution is transferred to a separatory funnel and extracted three times with 100 mL of toluene. This extract is separated. After collecting in a funnel and washing once with 100 g of distilled water, the organic solvent was distilled off under reduced pressure to obtain a crude product. This crude product was recrystallized and purified with n-hexane to obtain 6.4 g (yield 70%) of the precursor compound (1).

(Step (2))
4.5 g (17.4 mmol) of the precursor compound (1) obtained in step (1) was weighed out in a 200 mL three-necked flask and dissolved in 30 mL of N, N-dimethylformamide. To this, 5.5 g (40 mmol) of potassium carbonate was added and stirred. Subsequently, 2.49 g (20 mmol) of 2-bromoether was added, and the mixture was heated and stirred at 60 ° C. for 4 hours under a nitrogen atmosphere. The reaction solution is cooled to room temperature, and distilled water is added thereto to dissolve the generated salt. The reaction solution is transferred to a separatory funnel and extracted three times with 100 mL of toluene. This extract is separated. After collecting in a funnel and washing once with 100 g of distilled water, the organic solvent was distilled off under reduced pressure to obtain a crude product. The crude product was recrystallized and purified with n-hexane to obtain 3.8 g (yield 83%) of the precursor compound (2).

(Step (3))
In a 200 mL three-necked flask, 3.8 g (12.6 mmol) of the precursor compound (2) obtained in step (2) and 1.3 g (12.6 mmol) of concentrated hydrochloric acid were dissolved in 30 mL of N, N-dimethylformamide. . 1.93 g (18.7 mmol) of isobutyl nitrite was added and stirred at room temperature for 3.5 hours. After stirring, ethyl acetate and water were added to the reaction solution to separate oil and water, and the organic layer was washed with water. Hexane was added to the organic layer where the solid was deposited, and the mixture was filtered. The obtained solid was dried under reduced pressure to obtain 3.5 g (yield 92%) of the precursor compound (3).

(Step (4))
In a 200 mL three-necked flask equipped with a thermometer and a dropping funnel, 3.5 g (10.6 mmol) of the precursor compound (3) obtained in step (3) was weighed, and 100 mL of toluene was added and dissolved. Next, 4.0 g (40 mmol) of triethylamine was added to the reaction solution and stirred, and the solution temperature was adjusted to 0 ° C. Under a nitrogen atmosphere, 2.34 (30 mmol) of acetyl chloride was added dropwise over 10 minutes through a dropping funnel. After completion of dropping, the mixture was stirred at 22 ° C. for 3 hours. Distilled water was added to the reaction solution and extracted three times with 100 mL of toluene. The extract was collected in a separatory funnel and washed once with 100 g of distilled water, and then the organic solvent was distilled off under reduced pressure to obtain a crude product. . This crude product was recrystallized and purified with methanol to obtain 12.8 g (yield 96%) of the final product (C-1) represented by the above formula (C-1).
¹ H-NMR measurement (manufactured by Bruker, AVANCE 500 type) of the final product (C-1) was performed to confirm that the target compound was obtained. The analysis results were as follows.
¹ H-NMR (solvent: CDCl ₃ )
Chemical shift σ:
7.64 ppm (hydrogen on benzene ring, 2H),
7.32 ppm (hydrogen on benzene ring, 2H),
7.05 ppm (hydrogen on benzene ring, 2H),
6.50 ppm (hydrogen on benzene ring, 2H),
_{4.53ppm (-C H 2 -CH 2 -O-} , 2H),
_{4.25ppm (-CH 2 - CH 2 -O-} , 2H),
2.10 ppm (—O—C (═O) —CH ₃ , 3H)
2.04 ppm (—O—C (═O) —CH ₃ , 3H)
_{1.88ppm (-C (= N) -} CH 3, 3H)

[Synthesis Example 4]
A compound (C-2) represented by the above formula (C-2) was obtained in the same manner as in Synthesis Example 3 except that benzoyl chloride was used instead of acetyl chloride in Step (4).

[Synthesis Example 5]
A compound (C-3) represented by the above formula (C-3) was obtained in the same manner as in Synthesis Example 3 except that trifluoroacetic anhydride was used in place of acetyl chloride in Step (5).

<Preparation of curable resin composition>
The detail of each component used by the Example and the comparative example is shown below.

<[B] Polymerizable compound>
(B-1): Compound synthesized in Synthesis Example 2 (copolymer containing a structural unit represented by the above formula (4))
(B-2): Mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (KAYARAD DPHA, Nippon Kayaku Co., Ltd.)
(B-3): Succinic acid-modified pentaerythritol triacrylate (Aronix TO-756, Toagosei Co., Ltd.)
(B-4): Trimethylolpropane triacrylate (B-5): Biscoat 802 (mixture of tripentaerythritol octaacrylate and tripentaerythritol heptaacrylate, Osaka Organic Chemical Industry Co., Ltd.)

<[C] Compound>
Compounds represented by the above formulas (C-1) to (C-3)

<[C ′] Photopolymerization Initiator>
(C′-1): 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (Irgacure 907, Ciba Specialty Chemicals)
(C′-2): Ethanone-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime) (Irgacure OXE02, Ciba Specialty・ Chemicals)
(C′-3): 1,2-octanedione-1- [4- (phenylthio) -2- (O-benzoyloxime)] (Irgacure OXE01, Ciba Specialty Chemicals)
(C′-4): 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one

<[D] radical scavenger>
(D-1): 2,5-di-tert-butylhydroquinone,
(D-2): 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene (“Adeka Stub AO-330” manufactured by Adeka)
(D-3): 2,2′-methylenebis (4,6-di-t-butyl-1-phenyloxy) (2-ethylhexyloxy) phosphorus (“ADEKA STAB HP-10” manufactured by Adeka)
(D-4): Distearyl pentaerythritol diphosphite (“ADEKA STAB PEP-8” manufactured by ADEKA)
(D-5): Pentaerythritol tetrakis (3-laurylthiopropionate) (“ADEKA STAB AO-412S” manufactured by Adeka)

<[E] Colorant>
(E-1): C.I. I. Solvent Red 45
(E-2): C.I. I. Solvent Yellow 82

<[F] Adhesion aid>
(F-1): γ-glycidoxypropyltrimethoxysilane

<[G] Surfactant>
(G-1): Silicone surfactant (Toray Dow Corning Silicone Co., SH 8400 FLUID)
(G-2): Fluorosurfactant ("Fergent FTX-218" manufactured by Neos)

[Example 1]
[A] 100 parts by mass of the copolymer (A-1) as an alkali-soluble resin in terms of solid content, [B] 100 parts by mass of (B-2) as a polymerizable compound, (C) (C -1) 5 mass parts, (F-1) 5 mass parts as [F] adhesion assistant, and (G-1) 0.5 mass parts as [G] surfactant are mixed, solid content concentration After adding propylene glycol monomethyl ether acetate so as to be 30% by mass, a curable resin composition was prepared by filtering through a Millipore filter having a pore size of 0.5 μm.

[Examples 2 to 8 and Comparative Examples 1 to 3]
Each curable resin composition was prepared in the same manner as in Example 1 except that the components having the types and contents shown in Table 1 were mixed. In Table 1, “-” indicates that the corresponding component was not used.

[Example 9]
[A] 50 parts by mass of the copolymer (A-1) as an alkali-soluble resin in terms of solid content, [B] 55 parts by mass of (B-4) as a polymerizable compound, (C) (C -1) 5 parts by mass, (C'-4) 20 parts by mass and (C'-5) 5 parts by mass, (E-1) 27 parts by mass and (E-2) 8 parts by mass as a colorant Part, [F] 5 parts by mass of (F-1) as an adhesion aid, and (G-2) 0.5 parts by mass of [G] surfactant are mixed, and the solid content concentration becomes 20% by mass. Thus, propylene glycol monomethyl ether acetate was added to prepare a curable resin composition.

[Examples 10 to 11]
Each curable resin composition was prepared in the same manner as in Example 9 except that the components having the types and contents shown in Table 1 were mixed. In Table 1, “-” indicates that the corresponding component was not used.

<Evaluation>
The following evaluation was implemented using each curable resin composition. Specifically, for Examples 1 to 4 and Comparative Example 1, each curable resin composition was used to form a cured film for display element under the post-baking conditions described in Table 1, and the resolution as a spacer, Sensitivity and compression performance were evaluated. About Examples 5-8 and the comparative example 2, the cured film for display elements was formed using each curable resin composition, and the transmittance | permeability, light resistance, and voltage holding rate as an insulating film were evaluated. About Examples 9-11 and the comparative example 3, the cured film for display elements was formed using each curable resin composition, and the development tolerance as a coloring pattern, heat resistance, and solvent resistance were evaluated. Moreover, as Example 12 and Comparative Example 4, the curable resin compositions prepared in Example 1 and Comparative Example 1 were used, respectively, for display elements under the low-temperature post-baking conditions of 180 ° C. and 30 minutes shown in Table 1. A cured film was formed, and the resolution, sensitivity, and compression performance as a spacer were evaluated. These results are shown in Table 2.

[Resolution (μm)]
Each curable resin composition solution was applied onto an alkali-free glass substrate with a spinner, and then prebaked on a hot plate at 100 ° C. for 2 minutes to form a coating film having a thickness of 4.0 μm. Subsequently, the exposure amount is set to 200 J / m ^{2 to} 1,000 J / M using a high-pressure mercury lamp through a photomask having a plurality of circular residual patterns with different sizes in the diameter range of ⁸ μm to ²⁰ μm. Irradiation was performed with variable amount in the range of m ² . Then, shower development was performed by discharging a 0.40 mass% potassium hydroxide aqueous solution at 23 ° C. with a developing pressure of 1 kgf / cm ² and a nozzle diameter of 1 mm, and pure water washing was performed for 1 minute. Further, a spacer pattern was formed by post-baking in an oven at 230 ° C. for 30 minutes. At this time, if a pattern was formed on a photomask of 12 μm or less, it was judged that the resolution was good. In Example 12 and Comparative Example 4, a pattern was formed under the same conditions as described above except that post-baking was performed at 180 ° C. for 30 minutes.

[Sensitivity (J / m ² )]
Except for using a photomask having a plurality of round residue patterns having a diameter of 15 μm, a round residue pattern was formed on the substrate in the same manner as in the resolution evaluation. The height of the circular residual pattern before and after development was measured using a laser microscope (VK-8500, Keyence Corporation). The residual film ratio (%) was determined from this value and the following formula.
Residual film ratio (%) = (height after development / height before development) × 100
The minimum exposure amount at which the remaining film ratio was 90% or more was defined as sensitivity (J / m ² ). When the exposure amount was 700 J / m ² or less, it was judged that the sensitivity was good.

[Compression performance]
By operating in the same manner as in the sensitivity evaluation described above, a circular residual pattern was formed on the substrate with an exposure amount at which the residual film ratio was 90% or more. This pattern was subjected to a compression test with a load of 40 mN using a 50 μm square planar indenter with a micro compression tester (Fischerscope H100C, Fisher Instruments), and the change in the amount of compressive displacement (μm) with respect to the load was measured. Further, the recovery rate (%) was calculated from the amount of displacement when a load of 40 mN and the amount of displacement when a load of 40 mN was removed. When the recovery rate was 90% or more and the amount of displacement at a load of 40 mN was 0.15 μm or less, it was judged that the compression performance was good.

[Transmissivity (%)]
The cured film for display element obtained by operating in the same manner as in the evaluation of the resolution, except that the exposure was performed at an exposure amount of 800 J / m ² without using a photomask, the transmittance at a wavelength of 400 nm was measured with a spectrophotometer ( The transmittance (%) was measured using a 150-20 type double beam (Hitachi, Ltd.). When the transmittance was 90% or more, it was judged that the transparency was good.

[Light resistance (%)]
A cured film for a display element was formed by operating in the same manner as the evaluation of the transmittance. About the obtained cured film for display elements, UV irradiation apparatus (UVX-02516S1JS01, USHIO, lamp; UVL-4001M3-N1) was irradiated with 500 kJ / m ² of UV light, and the remaining film ratio before and after irradiation was determined. Evaluated by seeking. When the remaining film ratio was 95% or more, it was judged that the light resistance (%) was good.

[Voltage holding ratio (%)]
After spin-coating each curable resin composition on a soda glass substrate on which a SiO ₂ film for preventing elution of sodium ions is formed on the surface and an ITO (indium-tin oxide alloy) electrode is deposited in a predetermined shape The film was pre-baked for 10 minutes in a clean oven at 90 ° C. to form a coating film having a thickness of 2.0 μm. Next, the coating film was exposed at an exposure amount of 500 J / m ² without using a photomask. Thereafter, the substrate is immersed in a developer composed of a 0.04 mass% potassium hydroxide aqueous solution at 23 ° C. for 1 minute, developed, washed with ultrapure water, air-dried, and further post-treated at 230 ° C. for 30 minutes. Baking was performed and the coating film was cured to form a permanent cured film. Next, the substrate on which this pixel is formed and the substrate on which the ITO electrode is simply deposited in a predetermined shape are bonded together with a sealant mixed with 0.8 mm glass beads, and then Merck liquid crystal (MLC6608) is injected. A liquid crystal cell was produced. Next, the liquid crystal cell was placed in a constant temperature layer at 60 ° C., and the voltage holding ratio of the liquid crystal cell was measured by a liquid crystal voltage holding ratio measuring system (VHR-1A type, Toyo Technica Co., Ltd.). The applied voltage at this time is a square wave of 5.5 V, and the measurement frequency is 60 Hz. Here, the voltage holding ratio is a value of (liquid crystal cell potential difference after 16.7 milliseconds / voltage applied at 0 milliseconds). If the voltage holding ratio of the liquid crystal cell is 90% or less, it means that the liquid crystal cell cannot hold the applied voltage at a predetermined level for a time of 16.7 milliseconds, and the liquid crystal cannot be sufficiently aligned. There is a high risk of causing “burn-in”.

<Formation of colored pattern>
Each curable resin composition was applied using a spin coater on a soda glass substrate on which a SiO ₂ film for preventing elution of sodium ions was formed on the surface. Next, prebaking was performed for 2 minutes on a hot plate at 90 ° C. to form a coating film having a film thickness of 2.5 μm after prebaking. After these substrates are cooled to room temperature, radiation containing 365 nm, 405 nm, and 436 nm is applied to the coating film through a photomask using a high-pressure mercury lamp at 100 J / m ² , 300 J / m ² , 500 J / m. ^2, exposed with an exposure amount of 700 J / ^{m 2} and 1,000 J / ^{m 2.} Thereafter, a developing solution (0.04 mass% potassium hydroxide aqueous solution at 23 ° C.) is discharged onto these substrates at a developing pressure of 1 kgf / cm ^{2 and a} nozzle diameter of 1 mm to perform shower development and 200 × on the substrates. A 200 μm colored pattern was formed. Further, post-baking was performed at 230 ° C. for 30 minutes to form a colored pattern.

[Development resistance]
The film thickness ratio before and after development in the formation of the colored pattern was calculated from the following formula.
Film thickness ratio before and after development = (film thickness after development / film thickness before development) × 100
This value is regarded as development resistance, and when it is 95% or more, “A” (determined as good), when it is less than 95%, or when some of the colored pattern is missing is determined as “B” (somewhat poor). ), The case where all the patterns were peeled off from the substrate was designated as “C” (determined as defective).

[Heat-resistant]
A colored pattern was formed in the same manner as in the formation of the colored pattern except that the exposure was performed at an exposure amount of 1,000 J / m ² . Further heating was performed at 180 ° C. for 30 minutes. The color change ΔEab ^* before and after additional heating was determined. This value is assumed to be resistance, and when ΔEab ^* is less than 3, “A” (determined as good), when 3 or more and less than 5, “B” (determined slightly good), when 5 or more “C” (determined as defective).

[Solvent resistance]
A colored pattern was formed by the same operation as in the evaluation of heat resistance. This substrate was immersed in N-methylpyrrolidone at 60 ° C. for 30 minutes. The case where the colored pattern was retained after the immersion and the N-methylpyrrolidone after the immersion was not colored at all was “A” (determined as good), and the N− after the immersion although the colored pattern was retained after the immersion. A case where the methylpyrrolidone is slightly colored is “B” (determined to be slightly good), a color pattern that is peeled off from the substrate after the immersion is observed, and a case where the N-methylpyrrolidone after the immersion is colored is “C” (determined as defective) ).

  As is clear from the results in Table 2, the curable resin composition has good resolution, sensitivity, compression performance, transmittance, light resistance, voltage holding ratio, development resistance, heat resistance and solvent resistance. It was.

  The curable resin composition of the present invention has sufficient resolution and sensitivity, and solvent resistance, heat resistance, development resistance, compression performance, transmission even when a low temperature heating process is used in the production of a cured film for a display element. A cured film for a display element having excellent rate, light resistance and voltage holding ratio can be formed. Therefore, the curable resin composition includes a color filter for display elements, an interlayer insulating film for arrays, a color filter for color separation of solid-state imaging elements, a color filter for organic EL display elements, a color filter for flexible displays such as electronic paper, It is suitable for a protective film for touch panel, a resist for photofabrication used for forming a metal wiring or metal bump, processing a substrate, and the like.

Claims (12)

[A] an alkali-soluble resin having an epoxy group,
[B] A curable resin composition containing a polymerizable compound having an ethylenically unsaturated bond, and [C] a compound represented by the following formula (1).

(In the formula (1), R ¹ is, have a structure capable of generating an acid by heat, .R ² is a group containing a group represented by the following formula (2), a structure that generates a radical by light R ³ and R ⁴ are each independently an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group. A and b are each independently an integer of 1 to 5. c and d are each independently an integer of 0 to 4. X is an oxygen atom, a sulfur atom or a selenium atom. .)

(In the formula (2), R ⁵ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or cyclohexane. A hydrogen atom of the alkyl group of R ⁵ may be substituted with a hydroxyl group, R ⁶ is an alkanediyl group having 1 to 12 carbon atoms, R ⁷ is — ^{O -, - S -, -} NR 8 -, - NR 8 CO -, - SO 2 -, - CS-, -OCO- or -COO- in which .R ⁸ is a hydrogen atom or 1 to 6 carbon atoms An alkyl group.) The curable resin composition according to claim 1 containing a group R ² that put in the equation (1) is represented by the following formula (3).

(In the formula (3), R ⁹ represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group, or cyclohexane. A hydrogen atom of the alkyl group represented by R ⁹ may be substituted with a hydroxyl group, R ¹⁰ is a divalent organic group, and R ¹¹ has 1 to 12 carbon atoms. An alkyl group having 1 to 12 carbon atoms, a cyano group, a benzyl group, a phenethyl group, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a phenyl group, provided that the phenyl group of R ¹¹ has Some or all of the hydrogen atoms may be substituted with an alkyl group having 1 to 12 carbon atoms or an alkoxy group having 1 to 12 carbon atoms. The curable resin composition according to claim 2, wherein R ⁵ in the above formula (2) and R ⁹ in the formula (3) are the same group. In the above formula (1), a and b are 1, c and d are 0, R ⁵ in the formula (2) is a methyl group, R ⁶ is an ethylene group, R ⁷ is -O-, R ⁹ in the formula (3) and The curable resin composition according to claim 2, wherein R ¹¹ is a methyl group and R ¹⁰ is a carbonyl group. [A] an alkali-soluble resin having an epoxy group,
The copolymer according to any one of claims 1 to 4, which is a copolymer comprising (a1) a structural unit derived from a polymerizable compound having a carboxyl group, and (a2) a structural unit derived from a polymerizable compound having an epoxy group. The curable resin composition described. [B] As a polymerizable compound having an ethylenically unsaturated bond,
(A3) Curable resin composition of any one of Claim 1-5 containing the polymer containing the structural unit represented by following formula (4).

(In formula (4), R ¹² and R ¹³ are a hydrogen atom or a methyl group. R ¹⁴ is a group represented by the following formula (4-1) or formula (4-2). An integer from 1 to 6.)

(In Formula (4-1), R ¹⁵ represents a hydrogen atom or a methyl group. In Formula (4-1) and Formula (4-2), * represents a site bonded to an adjacent oxygen atom. )   [D] The curable resin composition according to any one of claims 1 to 6, further comprising a radical scavenger.   [E] The curable resin composition according to any one of claims 1 to 7, further comprising a colorant.   The curable resin composition of any one of Claims 1-8 used for formation of the cured film for display elements. (1) The process of forming a coating film on a board | substrate using the curable resin composition of Claim 9,
(2) A step of irradiating at least a part of the coating film with radiation,
(3) A method for forming a cured film for a display element, comprising: a step of developing the coating film irradiated with the radiation; and (4) a step of heating the developed coating film at a temperature of 200 ° C. or less.   The cured film for display elements formed from the curable resin composition of Claim 9.   A display element provided with the cured film for display elements of Claim 11.