JP5638440B2 - Printed circuit board - Google Patents

Description

  The present invention relates to a printed circuit board on which an electrolytic capacitor is mounted.

  In a printed circuit board on which an electrolytic capacitor is mounted, the electrolytic solution may be leaked to the outside due to the electrolytic capacitor rupturing or opening a hole for some reason, or due to a sealing failure. When the electrolyte leaks out, if the electrolyte flows out and adheres to the printed circuit board, ion migration may occur, resulting in insulation failure. At this time, it could not be said that there is no possibility of secondary problems such as smoke and fire depending on the voltage applied to the part that causes insulation failure.

  As an improvement measure, there has been disclosed an electrolytic capacitor liquid leakage detection circuit that detects insulation deterioration due to leakage of an electrolytic capacitor by a leakage current (Patent Document 1).

Japanese Utility Model Publication No. 7-43235

  However, in the above conventional technique, a liquid leakage detection circuit for detecting insulation deterioration due to liquid leakage with a leakage current must be provided near the electrolytic capacitor on the printed circuit board, and the cost for configuring the circuit There are problems such as securing the space for installing and installing circuits. Furthermore, it is sufficient that the leaked liquid flows into the detection circuit unit and can be detected well, but there is a problem that the leak current cannot be detected when it flows through a portion where the detection circuit is not arranged.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a printed circuit board in which an electrolytic solution leaking from an electrolytic capacitor is prevented from flowing out and adhering onto a printed board.

  In order to solve the above-described problems and achieve the object, the present invention includes a printed circuit board, a pair of lead terminals, an electrolytic capacitor mounted on the printed circuit board via the pair of lead terminals, and a bottom surface portion. A non-conductive member having a rising portion rising from the bottom surface portion and a pair of slits for guiding the pair of lead terminals and inserting the bottom surface portion between the printed board and the electrolytic capacitor. And

  According to the present invention, there is an effect that it is possible to prevent the occurrence of secondary troubles such as smoke and fire caused by liquid leakage of the electrolytic capacitor without taking up space on the printed circuit board at low cost.

FIG. 1 is a perspective view showing an appearance of a printed circuit board according to a first embodiment of the present invention. FIG. 2 is a side view of the printed circuit board according to the first embodiment. FIG. 3 is a perspective view showing the configuration of the second embodiment of the printed circuit board according to the present invention. FIG. 4 is a perspective view showing a configuration of a non-conductive sheet of Embodiment 3 of the printed circuit board according to the present invention. FIG. 5 is a diagram showing a mounted state of the printed circuit board and the electrolytic capacitor in the printed circuit board according to the fourth embodiment of the present invention. FIG. 6 is a diagram illustrating a configuration of a non-conductive sheet according to the fourth embodiment. FIG. 7 is a side view of the printed circuit board according to the fourth embodiment. FIG. 8 is a side view of a printed circuit board having a structure in which the non-conductive sheet is also usually located on the lower surface of the capacitor.

  Embodiments of a printed circuit board according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an appearance of a printed circuit board according to a first embodiment of the present invention. FIG. 2 is a side view of the printed circuit board according to the first embodiment.

  The non-conductive member 1 is formed, for example, by bending a rectangular non-conductive sheet into a U-shape, and has a bottom surface portion 1a and a side surface portion 1b as a rising portion rising from the bottom surface portion 1a. Here, the non-conductive sheet is flexible and uses a sheet (PVC or the like) with a crease mold, and folds so as to return to its original shape even when stretched.

  A slit 1c is formed from the end of one side surface portion 1b to the center of the bottom surface portion 1a. The slits 1c are formed in parallel with a slit width matched to the diameter of the lead terminal 2b of the corresponding electrolytic capacitor 2 and at a pitch interval of the lead terminals 2b, and are finished near the center of the bottom surface portion 1a. In the present embodiment, two sets of the parallel slits 1c are provided so as to correspond to the two electrolytic capacitors 2 described above.

  On the other hand, the electrolytic capacitor 2 is already mounted (soldered) on the printed circuit board 3, and a gap larger than the thickness of the nonconductive member 1 is left between the electrolytic capacitor body 2 a and the printed circuit board 3. Yes. The end of the side surface portion 1b on the side having the slit 1c of the nonconductive member 1 is inserted into the gap between the electrolytic capacitor body 2a and the printed board 3, and each of the two lead terminals 2b of the electrolytic capacitor 2 is connected to the nonconductive member. 1 through two slits 1c. Since the slit 1c continues to the bottom surface portion 1a, the non-conductive member 1 has the bottom surface portion 1a sandwiched between the electrolytic capacitor body 2a and the printed board 3, and the side surface portion 1b covers the side surface of the electrolytic capacitor body 2a. (See FIG. 2). Since the bottom surface portion 1a of the nonconductive member 1 is sandwiched between the electrolytic capacitor 2 and the printed board 3, the nonconductive member 1 is placed on the printed board 3 on which the electrolytic capacitor 2 has been mounted without using an adhesive or the like. Can be fixed.

  In such a state, if the electrolytic capacitor 2 is ruptured or the electrolyte leaks due to a sealing failure, the leaked liquid is It can be prevented from flowing out and adhering to the printed circuit board 3 by being stopped by the letter-shaped non-conductive member 1. Thereby, the secondary malfunction by the electrolyte which leaked from the electrolytic capacitor 2 can be suppressed, and the safety | security of a printed circuit board can be improved.

  Further, when the printed circuit board 3 is used upright, the leaked liquid flows down along the side surface portion 1b of the non-conductive member 1 positioned below, but the height of the side surface portion 1b (bottom surface portion 1a). When the distance from the end to the end is appropriately set, it is possible to prevent the electrolytic solution leaking from the electrolytic capacitor 2 from being applied to the printed circuit board 3 or the mounted component on the printed circuit board 3.

  Therefore, even if a liquid leakage detection circuit is not provided, ion migration (insulation failure) occurs between the charged parts on the printed circuit board 3 due to the liquid leaked from the electrolytic capacitor 2 and, in the worst case, smoke and ignition are caused. The following problems can be prevented.

  Since the liquid leaking from the electrolytic capacitor 2 only needs to be stopped, the nonconductive member 1 may be formed by bending a nonconductive sheet into an L shape depending on the place of use. For example, when the electrolytic capacitor 2 is disposed in the vicinity of the end of the printed circuit board 3, even if the side surface portion 1b is L-shaped provided only on one of the bottom surface portions 1a, the electrolytic solution is printed on the printed circuit board. 3 can be prevented from spreading. Further, when the width of the non-conductive member 1 is narrower than the width of the printed circuit board 3, the electrolyte solution adheres to the printed circuit board 3 by providing the side surface part on the side where the side surface part 1 b is not provided. The effect to prevent can be heightened.

Embodiment 2. FIG.
FIG. 3 is a perspective view showing the configuration of the second embodiment of the printed circuit board according to the present invention. In the present embodiment, the electrolytic capacitor 2 is placed on the printed board 3 so as to be laid, and the lead terminals are bent 90 degrees in the middle and soldered to the printed board 3. Also in this case, as in the first embodiment, the non-conductive member 1 is attached to the slit 1c through the lead terminal 2b of the electrolytic capacitor 2.

  According to the present embodiment, it is possible to prevent a dead space from being generated above the printed circuit board 3 when the height dimension of the electrolytic capacitor 2 is large. Therefore, it is possible to reduce the thickness of an electronic device on which the printed circuit board according to this embodiment is mounted.

Embodiment 3 FIG.
FIG. 4 is a perspective view showing a configuration of a non-conductive member of Embodiment 3 of the printed circuit board according to the present invention. In the present embodiment, one of the pair of slits 1c obtained by extending the slit 1c provided in the nonconductive member 1 to a predetermined position in parallel from the end of the bottom surface portion 1a is terminated there, but the other is further drawn in an arc. After extending (for example, at a position rotated by 90 °), the process is terminated.

  At the time of mounting, when the lead terminal 2b is passed through the slit 1c, the lead terminal 2b is continuously passed through the other slit 1c by rotating the non-conductive member 1 around the end of the slit 1c. If the arc-shaped slit 1c reaches a position of 90 °, the rotation of the nonconductive member 1 is also 90 °.

  In this case, the non-conductive member 1 is not only sandwiched between the electrolytic capacitor 2 and the printed circuit board 3, but also rotated in order to remove the lead terminal 2b from the slit 1c. Since movement is necessary, the non-conductive member 1 cannot easily come out between the printed circuit board 3 and the electrolytic capacitor 2 and can be prevented from being displaced during use.

  As in the first embodiment, when the width of the nonconductive member 1 is narrower than the width of the printed circuit board 3, the printed circuit board is provided by providing a side surface on the side where the side surface 1b is not provided. The effect of preventing the electrolytic solution from adhering to 3 can be enhanced.

Embodiment 4 FIG.
FIG. 5 is a diagram showing a mounted state of the printed circuit board and the electrolytic capacitor in the printed circuit board according to the fourth embodiment of the present invention. FIG. 6 is a diagram illustrating a configuration of a non-conductive member according to the fourth embodiment. This embodiment is a mounting method used when mounting a thick electrolytic capacitor having a height restriction on a printed circuit board and not falling within the height restriction just by being placed on its side. The mounting position of the electrolytic capacitor 2 on the printed circuit board 3 is cut out so that the hole 4 is opened, and the electrolytic capacitor 2 is embedded in the hole 4 so as to be embedded in half, thereby suppressing the height.

  FIG. 6 is a perspective view showing the appearance of the non-conductive member 5 of the present embodiment. The non-conductive member 5 as a cover attached to the hole 4 so as to cover the electrolytic capacitor 2 disposed in the hole 4 is formed so as to be flexible by bending a non-conductive sheet. The side surface portion 5b (first side surface portion) rising from 5a is further bent halfway, and the end portion 5c (second side surface portion) is opened beyond the width of the bottom surface portion 5a.

  FIG. 7 is a side view of the printed circuit board according to the fourth embodiment. The non-conductive member 5 covers the electrolytic capacitor 2 mounted as shown in FIG. 5 by covering the electrolytic capacitor 2 with the bottom surface portion 5a and the side surface portion 5b as shown in FIG. 7, and further bending the side surface portion 5b. The extended end portion 5 c is mounted so as to protrude from the hole 4 of the printed circuit board 3 to the opposite side of the printed circuit board 3. Since the end portion 5 c is wider than the hole 4 on the printed circuit board 3, it functions as a stopper, and the nonconductive member 5 does not easily come out of the hole 4 on the printed circuit board 3. That is, the bottom surface portion 5a and the side surface portion 5b form a liquid stop portion to prevent the electrolyte solution leaking from the electrolytic capacitor 2 from adhering to the printed circuit board 3, and the end portion 5c forms a stopper by forming a stopper. 4 is prevented from falling off.

  With this configuration, even if liquid leakage from the electrolytic capacitor 2 occurs, it is possible to prevent the non-conductive member 5 from flowing out to the components mounted on the printed circuit board 3 and the front and back surfaces of the printed circuit board 3. Even when the printed circuit board 3 is stood and used so that A or B in FIG. 5 is on the upper side, the leaked liquid is transmitted from the back surface of the printed circuit board 3 through the bent end portion 5 c of the nonconductive member 5. Since it falls downward from a position having a certain distance, the possibility of adhering to the printed circuit board 3 is reduced.

  Further, as shown in FIG. 8, there is a non-conductive member 5 on the surface corresponding to the surface where the lead terminal of the electrolytic capacitor 2 is provided and the opposite surface (the surface located in the depth direction of the paper surface in FIG. 8). The structure is also effective. In this case, a slit for allowing the lead terminal to pass through may be formed in a portion covering the surface on which the lead terminal is provided.

DESCRIPTION OF SYMBOLS 1, 5 Nonelectroconductive member 1a, 5a Bottom surface part 1b, 5b Side surface part 1c Slit 2 Electrolytic capacitor 2a Electrolytic capacitor main body 2b Lead terminal 3 Printed circuit board 4 Hole 5c End part

Claims (8)

A printed circuit board,
An electrolytic capacitor having a pair of lead terminals and mounted on the printed circuit board via the pair of lead terminals;
And a bottom portion, and a pair of rising portions rising from both side ends of the bottom surface portion, a pair for inserting the bottom portion between the printed circuit board and the electrolytic capacitor by guiding the pair of lead terminals A non-conductive member provided so that the slit of the first end part of the pair of rising parts reaches the center of the bottom part ,
Equipped with a,
Wherein said bottom portion is inserted the other of the pair of upstanding portions of the non-conductive member, a Rukoto used to stand so as to be positioned below the electrolytic capacitor between the electrolytic capacitor and the printed circuit board Printed circuit board. The printed circuit board according to claim 1, wherein the non-conductive member is formed by bending a non-conductive sheet into a U-shape. 3. The printed circuit board according to claim 1, wherein the pair of slits are provided so as to reach a center of the bottom surface portion from an end portion of the rising portion. The pair of slits are provided in the bottom surface portion,
One of the pair of slits is parallel to the other end of the pair of slits until the other end point of the pair of slits, and the portion parallel to the other of the pair of slits is the other end of the pair of slits. The printed circuit board according to claim 1, wherein the printed circuit board extends in an arc shape centered at the end point. A printed circuit board on which a rectangular opening is formed ;
An electrolytic capacitor having a pair of lead terminals, mounted on the printed circuit board via the pair of lead terminals, and disposed in the opening;
The bottom part and a pair of rising parts rising from both side ends of the bottom part are bent into a U-shape, and the pair of rising parts are inserted into the gap between the edge of the opening and the electrolytic capacitor. Te a cover of non-conductive, which is mounted to the opening so as to cover the electrolytic capacitor,
Equipped with a,
The pair of one of the rising portion, the printed circuit board, characterized in Rukoto used to stand so as to be positioned below the electrolytic capacitor of the cover attached to the opening. The printed circuit board according to claim 5, wherein the cover is formed by bending a non-conductive sheet into a U-shape. The printed circuit board according to claim 6, wherein the non-conductive sheet is bent so that a stopper portion that prevents the non-conductive sheet from coming out of the opening extends from a tip of the rising portion . 8. The printed circuit board according to claim 5, wherein the electrolytic capacitor is installed in a state where the electrolytic capacitor is laid down and half embedded in the opening. 9.

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