JP5690606B2 - Electrical insulating resin sheet - Google Patents
Electrical insulating resin sheet Download PDFInfo
- Publication number
- JP5690606B2 JP5690606B2 JP2011026062A JP2011026062A JP5690606B2 JP 5690606 B2 JP5690606 B2 JP 5690606B2 JP 2011026062 A JP2011026062 A JP 2011026062A JP 2011026062 A JP2011026062 A JP 2011026062A JP 5690606 B2 JP5690606 B2 JP 5690606B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- electrically insulating
- resin layer
- sheet material
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims description 247
- 239000011347 resin Substances 0.000 title claims description 247
- 239000010410 layer Substances 0.000 claims description 81
- 239000000463 material Substances 0.000 claims description 56
- 229920006122 polyamide resin Polymers 0.000 claims description 28
- 239000004760 aramid Substances 0.000 claims description 26
- 229920003235 aromatic polyamide Polymers 0.000 claims description 26
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 11
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 11
- 229920000491 Polyphenylsulfone Polymers 0.000 claims description 9
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 9
- 238000003851 corona treatment Methods 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 5
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 5
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 5
- DDLUSQPEQUJVOY-UHFFFAOYSA-N nonane-1,1-diamine Chemical compound CCCCCCCCC(N)N DDLUSQPEQUJVOY-UHFFFAOYSA-N 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 claims 1
- 229920002492 poly(sulfone) Polymers 0.000 description 32
- -1 polyethylene Polymers 0.000 description 24
- 229920005992 thermoplastic resin Polymers 0.000 description 14
- 239000000203 mixture Substances 0.000 description 13
- 125000003118 aryl group Chemical class 0.000 description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 11
- 150000002430 hydrocarbons Chemical class 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010292 electrical insulation Methods 0.000 description 7
- 230000032798 delamination Effects 0.000 description 6
- 238000000635 electron micrograph Methods 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229930195734 saturated hydrocarbon Natural products 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229920000784 Nomex Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000004043 dyeing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000004763 nomex Substances 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JKABQGPYSRNZDY-UHFFFAOYSA-N ClC1(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C1(Cl)Cl Chemical compound ClC1(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C1(Cl)Cl JKABQGPYSRNZDY-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/30—Multi-ply
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
- B32B2307/5825—Tear resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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- Compositions Of Macromolecular Compounds (AREA)
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Description
本発明は、電気絶縁性樹脂シートに関する。 The present invention relates to an electrically insulating resin sheet.
従来、電気絶縁性樹脂シートとしては、様々なものが知られており、例えば、モーターにおける発熱体であるコイル線の周囲に配されて用いられるものなどが知られている。 Conventionally, various types of electrically insulating resin sheets are known. For example, those used by being arranged around a coil wire that is a heating element in a motor are known.
この種の電気絶縁性樹脂シートとしては、具体的には例えば、分子中に複数の芳香族炭化水素及び複数のスルフィド結合(−S−)を有するポリフェニレンスルフィド樹脂と、ビニル系共重合体とを含む電気絶縁性樹脂層のみを備えたものが知られている(特許文献1)。 Specifically, this type of electrically insulating resin sheet includes, for example, a polyphenylene sulfide resin having a plurality of aromatic hydrocarbons and a plurality of sulfide bonds (-S-) in the molecule, and a vinyl copolymer. The thing provided only with the electrically insulating resin layer containing is known (patent document 1).
しかしながら、斯かる電気絶縁性樹脂シートは、モーターのコイル線とコイル線との間等において要求される電気絶縁性としての耐トラッキング性を有するものの、コイル線などから発生する熱によって引張強度などが低下し得るものであり、耐熱性が必ずしも十分なものではないという問題がある。
また、斯かる電気絶縁性樹脂シートは、引裂き力に対して必ずしも十分な耐性を有するものではないという問題、即ち、樹脂シートに必要とされる力学的特性としての耐引裂き性が必ずしも優れるものではないという問題がある。
However, such an electrically insulating resin sheet has a tracking resistance as an electrical insulating property required between a coil wire of a motor and the like, but has a tensile strength or the like due to heat generated from the coil wire or the like. There is a problem that the heat resistance may not be sufficient.
In addition, such an electrically insulating resin sheet does not necessarily have sufficient resistance to tearing force, that is, it does not necessarily have excellent tear resistance as a mechanical property required for the resin sheet. There is no problem.
本発明は、上記問題点等に鑑みてなされたものであり、耐引裂き性及び耐熱性に優れた電気絶縁性樹脂シートを提供することを課題とする。 This invention is made | formed in view of the said problem etc., and makes it a subject to provide the electrically insulating resin sheet excellent in tear resistance and heat resistance.
本発明の電気絶縁性樹脂シートは、分子中に複数のスルホニル基と複数のエーテル結合と複数の芳香族炭化水素とを有するポリエーテルポリフェニルスルホン樹脂と、分子中に芳香族炭化水素を有するポリアミド樹脂と、を含む電気絶縁性樹脂層を備えた電気絶縁性樹脂シートであって、
前記電気絶縁性樹脂層は、1〜45重量%の前記ポリアミド樹脂を含み、前記ポリアミド樹脂が前記ポリエーテルポリフェニルスルホン樹脂中に分散した分散相を有しており、
前記電気絶縁性樹脂層の厚み方向切断面の294μm2面積範囲では、0.5μm以上の最短径を有する前記分散相の個数が10以下であることを特徴とする。
The electrically insulating resin sheet of the present invention includes a polyether polyphenylsulfone resin having a plurality of sulfonyl groups , a plurality of ether bonds, and a plurality of aromatic hydrocarbons in the molecule, and a polyamide having an aromatic hydrocarbon in the molecule. an electrically insulating resin sheet with an electrically insulating resin layer comprising a resin, a
The electrically insulating resin layer includes 1 to 45% by weight of the polyamide resin, and the polyamide resin has a dispersed phase dispersed in the polyether polyphenylsulfone resin.
In the 294 μm 2 area range of the cut surface in the thickness direction of the electrically insulating resin layer, the number of dispersed phases having a shortest diameter of 0.5 μm or more is 10 or less.
本発明に係る電気絶縁性樹脂シートは、少なくとも1種のシート材をさらに備え、該シート材が前記電気絶縁性樹脂層の少なくとも片面側に配されていることが好ましい。斯かる構成により、電気絶縁性樹脂シートの耐引裂き性及び耐熱性がより優れたものになるという利点がある。 The electrically insulating resin sheet according to the present invention preferably further includes at least one sheet material, and the sheet material is preferably disposed on at least one side of the electrically insulating resin layer. With such a configuration, there is an advantage that the tear resistance and heat resistance of the electrically insulating resin sheet are further improved.
本発明に係る電気絶縁性樹脂シートにおいては、前記シート材が不織布であることが好ましい。前記シート材が不織布であることにより、シート材と電気絶縁性樹脂層との間における層間剥離が抑制されるという利点がある。また、前記シート材が、湿式抄紙法により作製された紙であることが好ましい。
また、前記シート材が全芳香族ポリアミドを含んでいることが好ましく、全芳香族ポリアミド繊維を含む全芳香族ポリアミド紙であることがより好ましい。前記シート材が全芳香族ポリアミドを含んでいることにより、電気絶縁性樹脂シートの耐熱性がより優れたものになり得るという利点がある。
In the electrically insulating resin sheet according to the present invention, the sheet material is preferably a nonwoven fabric. When the sheet material is a nonwoven fabric, there is an advantage that delamination between the sheet material and the electrically insulating resin layer is suppressed. Moreover, it is preferable that the said sheet material is the paper produced by the wet papermaking method.
The sheet material preferably contains wholly aromatic polyamide, more preferably wholly aromatic polyamide paper containing wholly aromatic polyamide fibers. When the sheet material contains wholly aromatic polyamide, there is an advantage that the heat resistance of the electrically insulating resin sheet can be further improved.
本発明に係る電気絶縁性樹脂シートにおいては、前記シート材の少なくとも電気絶縁性樹脂層側にコロナ処理が施されていることが好ましい。コロナ処理が施されていることにより、シート材と電気絶縁性樹脂層との間における層間剥離が抑制されるという利点がある。 In the electrically insulating resin sheet according to the present invention, it is preferable that at least the electrically insulating resin layer side of the sheet material is subjected to corona treatment. By performing the corona treatment, there is an advantage that delamination between the sheet material and the electrically insulating resin layer is suppressed.
本発明に係る電気絶縁性樹脂シートは、電気絶縁用途で使用されることが好ましい。 The electrically insulating resin sheet according to the present invention is preferably used for electrical insulation.
本発明の電気絶縁性樹脂シートは、耐引裂き性及び耐熱性に優れているという効果を奏する。 The electrically insulating resin sheet of the present invention has an effect of being excellent in tear resistance and heat resistance.
以下、本発明に係る電気絶縁性樹脂シートの一実施形態について説明する。 Hereinafter, an embodiment of an electrically insulating resin sheet according to the present invention will be described.
本実施形態の電気絶縁性樹脂シートは、分子中に複数のスルホニル基を有するポリスルホン樹脂と該ポリスルホン樹脂以外の熱可塑性樹脂とを含む電気絶縁性樹脂層を備えた電気絶縁性樹脂シートであって、該電気絶縁性樹脂層は、前記ポリスルホン樹脂以外の熱可塑性樹脂が前記ポリスルホン樹脂中に分散した分散相を有しており、前記電気絶縁性樹脂層の厚み方向切断面の294μm2面積範囲では、0.5μm以上の最短径を有する前記分散相の個数が10以下であるものである。
前記電気絶縁性樹脂シートは、耐引裂き性がより優れたものになるという点で、少なくとも1種のシート材をさらに備え、該シート材が前記電気絶縁性樹脂層の少なくとも片面側に配されていることが好ましい。
The electrically insulating resin sheet of this embodiment is an electrically insulating resin sheet provided with an electrically insulating resin layer containing a polysulfone resin having a plurality of sulfonyl groups in the molecule and a thermoplastic resin other than the polysulfone resin. The electrically insulating resin layer has a dispersed phase in which a thermoplastic resin other than the polysulfone resin is dispersed in the polysulfone resin. In the 294 μm 2 area range of the cut surface in the thickness direction of the electrically insulating resin layer, The number of the dispersed phases having the shortest diameter of 0.5 μm or more is 10 or less.
The electrical insulating resin sheet is further provided with at least one sheet material in that the tear resistance is further improved, and the sheet material is disposed on at least one side of the electrical insulating resin layer. Preferably it is.
前記電気絶縁性樹脂層においては、前記ポリスルホン樹脂が連続相となっており、前記ポリスルホン樹脂以外の熱可塑性樹脂が、不連続な分散相となって前記ポリスルホン樹脂中に分散して含まれている。
前記分散相は、形状が特に限定されるものではなく、分散相の形状としては、真球状、扁球状、板状、針状等が挙げられる。
In the electrically insulating resin layer, the polysulfone resin is a continuous phase, and a thermoplastic resin other than the polysulfone resin is dispersed and contained in the polysulfone resin as a discontinuous dispersed phase. .
The shape of the dispersed phase is not particularly limited, and examples of the shape of the dispersed phase include true sphere, oblate shape, plate shape, and needle shape.
前記電気絶縁性樹脂層においては、厚み方向切断面の294μm2面積範囲で、0.5μm以上の最短径を有する前記分散相の個数が10以下である。
原則として、上記の294μm2面積範囲は、14μm×21μmの長方形の面積範囲である。なお、前記電気絶縁性樹脂層の厚みが14μm未満であること等により、14μm×21μm範囲の長方形の像が得られない場合は、294μm2面積範囲となるように長辺が21μmを超える長方形を設定し、斯かる長方形における像において、前記分散相の最短径を計測する。
In the electrically insulating resin layer, the number of the dispersed phases having the shortest diameter of 0.5 μm or more in the 294 μm 2 area range of the cut surface in the thickness direction is 10 or less.
In principle, the above-mentioned 294 μm 2 area range is a rectangular area range of 14 μm × 21 μm. Note that, by such the thickness of the electrically insulating resin layer is less than 14 [mu] m, if the rectangular image of 14 [mu] m × 21 [mu] m range is not obtained, the rectangle long sides so that 294Myuemu 2 area coverage is more than 21 [mu] m Set and measure the shortest diameter of the dispersed phase in the image in such a rectangle.
前記電気絶縁性樹脂層の厚み方向切断面は、電気絶縁性樹脂層の厚み方向に切断した面であれば特に限定されない。具体的には、例えば、後述する押出成形によって成形された電気絶縁性樹脂層の厚み方向切断面は、押出方向に沿って切断した厚み方向切断面であってもよく、押出方向と直交する方向に沿って切断した厚み方向切断面であってもよい。 The thickness direction cut surface of the electrically insulating resin layer is not particularly limited as long as it is a surface cut in the thickness direction of the electrically insulating resin layer. Specifically, for example, the thickness direction cut surface of the electrically insulating resin layer formed by extrusion molding described later may be a thickness direction cut surface cut along the extrusion direction, and is a direction orthogonal to the extrusion direction. It may be a cut surface along the thickness direction.
前記分散相は、所定の大きさの電気絶縁性樹脂層を樹脂包埋した後、研磨法によって前記電気絶縁性樹脂層の厚み方向切断面を作製し、染色処理及び導電処理を施すことにより、電界放射型走査電子顕微鏡(FE−SEM)による像において、様々な形状の不連続物となって見える。
前記分散相は、厚み方向切断面において、断面形状が様々なものになり得る。具体的には、分散相の断面形状としては、例えば、真円状、楕円状、長方形状等が挙げられる。
The dispersed phase is obtained by embedding a resin insulating resin layer having a predetermined size and then creating a cut surface in the thickness direction of the electrically insulating resin layer by a polishing method, and performing a dyeing process and a conductive process. It appears as discontinuities of various shapes in an image obtained by a field emission scanning electron microscope (FE-SEM).
The dispersed phase may have various cross-sectional shapes on the cut surface in the thickness direction. Specifically, examples of the cross-sectional shape of the dispersed phase include a perfect circle, an ellipse, and a rectangle.
具体的には例えば、ポリスルホン樹脂の連続相中に分散したポリアミド樹脂からなる分散相は、厚み方向切断面を実施例に記載された方法によって作製し、染色処理及び導電処理を施すことにより、電界放射型走査電子顕微鏡による像において、黒色の不連続物となって見える。 Specifically, for example, a dispersed phase composed of a polyamide resin dispersed in a continuous phase of a polysulfone resin is produced by producing a cut surface in the thickness direction by the method described in the Examples, and performing a dyeing process and a conductive process, thereby producing an electric field. It appears as a black discontinuity in the image taken by the radial scanning electron microscope.
そして、前記分散相の最短径は、5000倍率における電界放射型走査電子顕微鏡による上記範囲の長方形における像において、様々な形状を有する各不連続物に対して内接する最大円の直径により決定する。
具体的には、例えば、厚み方向切断面において、分散相の切断面形状が短辺に比して長辺が10倍以上あるような長方形である場合、その形状に内接する最大円の直径は、長方形の短辺の長さであることから、分散相の最短径は、この長方形の短辺長さとする。
The shortest diameter of the dispersed phase is determined by the diameter of the maximum circle inscribed in each discontinuous having various shapes in an image of a rectangle in the above range by a field emission scanning electron microscope at 5000 magnifications.
Specifically, for example, in the cut surface in the thickness direction, when the cut surface shape of the dispersed phase is a rectangle having a long side of 10 times or more compared to the short side, the diameter of the maximum circle inscribed in the shape is Since the length is the short side of the rectangle, the shortest diameter of the dispersed phase is the short side length of the rectangle.
前記電気絶縁性樹脂層においては、厚み方向切断面の294μm2面積範囲で、0.5μm以上の最短径を有する前記分散相の個数が10を超えると、電気絶縁性樹脂層の耐引裂き性及び耐熱性が不十分なものになるおそれがある。
前記電気絶縁性樹脂層においては、厚み方向切断面の294μm2面積範囲で、0.5μm以上の最短径を有する前記分散相の個数が0以上であり5以下であることが好ましく、0.5μm以上の最短径を有する前記分散相の個数が0であることがより好ましい。
In the electrically insulating resin layer, when the number of the dispersed phases having the shortest diameter of 0.5 μm or more in the 294 μm 2 area range of the cut surface in the thickness direction exceeds 10, the tear resistance of the electrically insulating resin layer and There is a risk of insufficient heat resistance.
In the electrically insulating resin layer, the number of the dispersed phases having the shortest diameter of 0.5 μm or more in the 294 μm 2 area range of the cut surface in the thickness direction is preferably 0 or more and 5 or less, preferably 0.5 μm. More preferably, the number of the dispersed phases having the shortest diameter is zero.
前記電気絶縁性樹脂層の厚みは、特に限定されるものではなく、通常、1μm〜500μmである。 The thickness of the electrical insulating resin layer is not particularly limited, and is usually 1 μm to 500 μm.
前記ポリスルホン樹脂は、スルホニル基(−SO2−)を複数含む分子構造を有するものである。
該ポリスルホン樹脂としては、分子中に複数のエーテル結合(−O−)をさらに含むポリエーテルスルホン樹脂、又は、分子中に複数の芳香族炭化水素をさらに含むポリフェニルスルホン樹脂などが挙げられる。また、該ポリスルホン樹脂としては、分子中に複数のエーテル結合と複数の芳香族炭化水素とをさらに含むポリエーテルポリフェニルスルホン樹脂が挙げられる。
The polysulfone resin has a molecular structure including a plurality of sulfonyl groups (—SO 2 —).
Examples of the polysulfone resin include a polyethersulfone resin further including a plurality of ether bonds (—O—) in the molecule, or a polyphenylsulfone resin further including a plurality of aromatic hydrocarbons in the molecule. Moreover, as this polysulfone resin, the polyether polyphenyl sulfone resin which further contains a some ether bond and a some aromatic hydrocarbon in a molecule | numerator is mentioned.
前記ポリスルホン樹脂は、前記電気絶縁性樹脂層の成形性が良好なものになるとともに、前記電気絶縁性樹脂層の耐熱性がより優れたものになり得るという点で、前記ポリエーテルポリフェニルスルホン樹脂である。
The polysulfone resin, together with the formability of the electrically insulating resin layer is favorable, the electrically insulating in terms heat-resistant resin layer can become better ones, the polyether sulfone resin It is .
前記ポリエーテルポリフェニルスルホン樹脂としては、下記式(1)の分子構造を有するものが好ましい。 As said polyether polyphenyl sulfone resin, what has the molecular structure of following formula (1) is preferable.
前記ポリエーテルポリフェニルスルホン樹脂としては、市販されているものを用いることができ、例えば、BASF社製の「ウルトラゾーンEシリーズ」、ソルベイ社製の「レーデルAシリーズ」、住友化学社製の「スミカエクセルシリーズ」等が挙げられる。 As the polyether polyphenylsulfone resin, commercially available products can be used. For example, “Ultra Zone E Series” manufactured by BASF, “Radel A Series” manufactured by Solvay, “ "Sumika Excel series".
前記電気絶縁性樹脂層においては、前記ポリスルホン樹脂の含有割合が50重量%以上であることが好ましく、55重量%以上であることがより好ましく、70重量%以上であることがさらに好ましい。また、前記ポリスルホン樹脂の含有割合が99重量%以下であることが好ましく、90重量%以下であることがより好ましく、85重量%以下であることがさらに好ましく、80重量%以下であることが最も好ましい。
前記ポリスルホン樹脂の含有割合が50重量%以上であることにより、電気絶縁性樹脂層の耐熱性がより優れたものになるという利点がある。また、前記ポリスルホン樹脂の含有割合が90重量%以下であることにより、電気絶縁性樹脂層の耐トラッキング性がより優れたものになり得るという利点がある。
In the electrically insulating resin layer, the content of the polysulfone resin is preferably 50% by weight or more, more preferably 55% by weight or more, and further preferably 70% by weight or more. The content of the polysulfone resin is preferably 99% by weight or less, more preferably 90% by weight or less, still more preferably 85% by weight or less, and most preferably 80% by weight or less. preferable.
When the content ratio of the polysulfone resin is 50% by weight or more, there is an advantage that the heat resistance of the electrically insulating resin layer is further improved. Moreover, when the content rate of the said polysulfone resin is 90 weight% or less, there exists an advantage that the tracking resistance of an electrically insulating resin layer can become more excellent.
前記ポリスルホン樹脂以外の熱可塑性樹脂としては、ポリアミド樹脂;ビスフェノール類とエピクロルヒドリンとが反応してなるエポキシ基含有のポリヒドロキシポリエーテルフェノキシ樹脂;分子中に複数のオキシメチレン(−CH2O−)基を有するポリアセタール(POM)樹脂;分子中で芳香族炭化水素−エーテル結合の基本構造が繰り返されてなるポリフェニレンエーテル(PPE)樹脂などのポリフェニレンオキシド(PPO)樹脂;分子中で芳香族炭化水素−エーテル結合−芳香族炭化水素−ケトン結合の基本構造が繰り返されてなる芳香族ポリエーテルケトン(PEK)樹脂;分子中で芳香族炭化水素−エーテル結合−芳香族炭化水素−エーテル結合−芳香族炭化水素−ケトン結合の基本構造が繰り返されてなる芳香族ポリエーテルケトン(PEEK)樹脂;分子中に複数の芳香族炭化水素及び複数のスルフィド結合(−S−)を有するポリフェニレンスルフィド(PPS)樹脂;分子中に複数の芳香族炭化水素とイミド結合とエーテル結合とを有するポリエーテルイミド(PEI)樹脂;分子中に複数のイミド結合及び複数のアミド結合を有する熱可塑性ポリアミドイミド樹脂;ポリエチレン、ポリプロピレン、ポリシクロオレフィンなどのポリオレフィン樹脂;アクリロニトリルとブタジエンとスチレンとの共重合体(ABS樹脂)などの芳香族含有ビニル系樹脂;ポリエチレンナフタレート(PEN)樹脂、ポリブチレンテレフタレート(PBT)樹脂、ポリエチレンテレフタレート(PET)樹脂などのポリエステル樹脂;ポリカーボネート(PC)樹脂;液晶ポリマー(LCP)等が挙げられる。 Examples of the thermoplastic resin other than the polysulfone resin include a polyamide resin; an epoxy group-containing polyhydroxy polyether phenoxy resin formed by a reaction of bisphenols and epichlorohydrin; a plurality of oxymethylene (—CH 2 O—) groups in the molecule. A polyacetal (POM) resin having a structure: a polyphenylene oxide (PPO) resin such as a polyphenylene ether (PPE) resin in which the basic structure of an aromatic hydrocarbon-ether bond is repeated in the molecule; an aromatic hydrocarbon-ether in the molecule Aromatic polyether ketone (PEK) resin in which the basic structure of the bond-aromatic hydrocarbon-ketone bond is repeated; aromatic hydrocarbon-ether bond-aromatic hydrocarbon-ether bond-aromatic hydrocarbon in the molecule -Aromatic poly having the basic structure of ketone bond repeated -Terketone (PEEK) resin; polyphenylene sulfide (PPS) resin having a plurality of aromatic hydrocarbons and a plurality of sulfide bonds (-S-) in the molecule; a plurality of aromatic hydrocarbons, imide bonds and ether bonds in the molecule Polyetherimide (PEI) resin having a plurality of resins; Thermoplastic polyamideimide resin having a plurality of imide bonds and a plurality of amide bonds in the molecule; Polyolefin resin such as polyethylene, polypropylene, polycycloolefin; Copolymer of acrylonitrile, butadiene and styrene Aromatic-containing vinyl resins such as polymers (ABS resins); Polyester resins such as polyethylene naphthalate (PEN) resins, polybutylene terephthalate (PBT) resins, polyethylene terephthalate (PET) resins; Polycarbonate (PC) resins Liquid crystal polymer (LCP) and the like.
前記ポリスルホン樹脂以外の熱可塑性樹脂は、電気絶縁性樹脂層の耐引裂き性及び耐熱性がより優れたものになるという点で、前記ポリアミド樹脂である。
The thermoplastic resin other than the polysulfone resin is the polyamide resin in that the tear resistance and heat resistance of the electrically insulating resin layer are further improved.
前記ポリアミド樹脂は、少なくともポリアミン化合物とポリカルボン酸化合物とが脱水縮合により重合されてなるものである。 The polyamide resin is obtained by polymerizing at least a polyamine compound and a polycarboxylic acid compound by dehydration condensation.
前記ポリアミド樹脂としては、分子中に芳香族炭化水素を有するポリアミド樹脂、分子中に炭化水素として脂肪族炭化水素のみを複数有する脂肪族ポリアミド樹脂が挙げられる。なかでも、前記電気絶縁性樹脂層がより耐熱性に優れたものになり得るという点で、分子中に芳香族炭化水素を有するポリアミド樹脂が用いられる。
Examples of the polyamide resin include a polyamide resin having an aromatic hydrocarbon in the molecule and an aliphatic polyamide resin having only a plurality of aliphatic hydrocarbons as the hydrocarbon in the molecule. Especially, the polyamide resin which has an aromatic hydrocarbon in a molecule | numerator is used at the point that the said electrically insulating resin layer can become the thing excellent in heat resistance.
また、分子中に芳香族炭化水素を有するポリアミド樹脂としては、分子中に炭化水素として芳香族炭化水素のみを複数有する芳香族ポリアミド樹脂、分子中に炭化水素として脂肪族炭化水素及び芳香族炭化水素の両方を有する半芳香族ポリアミド樹脂等が挙げられる。
分子中に芳香族炭化水素を有するポリアミド樹脂としては、電気絶縁性樹脂層の耐熱性に優れつつシート材と電気絶縁性樹脂層との間における層間剥離がより抑制され得るという点で、前記半芳香族ポリアミド樹脂が好ましい。
The polyamide resin having an aromatic hydrocarbon in the molecule includes an aromatic polyamide resin having only a plurality of aromatic hydrocarbons as a hydrocarbon in the molecule, an aliphatic hydrocarbon and an aromatic hydrocarbon as hydrocarbons in the molecule. And semi-aromatic polyamide resins having both of the above.
As the polyamide resin having an aromatic hydrocarbon in the molecule, it is possible to further suppress delamination between the sheet material and the electrically insulating resin layer while being excellent in heat resistance of the electrically insulating resin layer. Aromatic polyamide resins are preferred.
前記ポリアミド樹脂の重合において用いられる前記ポリアミン化合物としては、具体的には、例えば、ジアミン化合物が挙げられる。
該ジアミン化合物としては、直鎖状又は分岐鎖状の炭化水素基を含む脂肪族ジアミン、環状の飽和炭化水素基を含む脂環族ジアミン、芳香族炭化水素基を含む芳香族ジアミンなどが挙げられる。
Specific examples of the polyamine compound used in the polymerization of the polyamide resin include a diamine compound.
Examples of the diamine compound include aliphatic diamines containing linear or branched hydrocarbon groups, alicyclic diamines containing cyclic saturated hydrocarbon groups, and aromatic diamines containing aromatic hydrocarbon groups. .
前記脂肪族ジアミン、前記脂環族ジアミン、又は前記芳香族ジアミンとしては、例えば、下記式(2)で表されるものが挙げられる。なお、下記式(2)中のR1は、炭素数4〜12の脂肪族炭化水素基、若しくは環状飽和炭化水素を含む炭素数4〜12の脂環族炭化水素基を表しているか、又は、芳香族環を含む炭化水素基を表している。
H2N−R1−NH2 ・・・(2)
Examples of the aliphatic diamine, the alicyclic diamine, or the aromatic diamine include those represented by the following formula (2). R 1 in the following formula (2) represents an aliphatic hydrocarbon group having 4 to 12 carbon atoms or an alicyclic hydrocarbon group having 4 to 12 carbon atoms including a cyclic saturated hydrocarbon, or Represents a hydrocarbon group containing an aromatic ring.
H 2 N—R 1 —NH 2 (2)
前記脂肪族ジアミンとしては、電気絶縁性樹脂層の耐熱性に優れつつシート材と電気絶縁性樹脂層との間における層間剥離がより抑制され得るという点で、式(2)においてR1の炭素数が9のノナンジアミンが好ましく、1,9−ノナンジアミン及び2−メチル−1,8−オクタンジアミンを混合したものがより好ましい。
前記芳香族ジアミンとしては、フェニレンジアミン、キシリレンジアミンなどが挙げられる。
As the aliphatic diamine, R 1 carbon in the formula (2) is excellent in that the delamination between the sheet material and the electrically insulating resin layer can be further suppressed while being excellent in the heat resistance of the electrically insulating resin layer. Nonanediamine having a number of 9 is preferable, and a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine is more preferable.
Examples of the aromatic diamine include phenylenediamine and xylylenediamine.
前記ポリアミド樹脂の重合において用いられる前記ポリカルボン酸化合物としては、具体的には、例えば、ジカルボン酸化合物が挙げられる。
該ジカルボン酸化合物としては、直鎖状又は分岐鎖状の炭化水素基を含む脂肪族ジカルボン酸、環状の飽和炭化水素基を含む脂環族ジカルボン酸、芳香族炭化水素基を含む芳香族ジカルボン酸などが挙げられる。
Specific examples of the polycarboxylic acid compound used in the polymerization of the polyamide resin include a dicarboxylic acid compound.
Examples of the dicarboxylic acid compound include an aliphatic dicarboxylic acid containing a linear or branched hydrocarbon group, an alicyclic dicarboxylic acid containing a cyclic saturated hydrocarbon group, and an aromatic dicarboxylic acid containing an aromatic hydrocarbon group. Etc.
前記脂肪族ジカルボン酸、前記脂環族ジカルボン酸、又は前記芳香族ジカルボン酸としては、例えば、下記式(3)で表されるものが挙げられる。なお、下記式(3)中のR2は、炭素数4〜25の脂肪族炭化水素基、若しくは環状飽和炭化水素を含む炭素数4〜12の脂環族炭化水素基を表しているか、又は、芳香族環を含む炭化水素基を表している。
HOOC−R2−COOH ・・・(3)
Examples of the aliphatic dicarboxylic acid, the alicyclic dicarboxylic acid, or the aromatic dicarboxylic acid include those represented by the following formula (3). R 2 in the following formula (3) represents an aliphatic hydrocarbon group having 4 to 25 carbon atoms, or an alicyclic hydrocarbon group having 4 to 12 carbon atoms including a cyclic saturated hydrocarbon, or Represents a hydrocarbon group containing an aromatic ring.
HOOC-R 2 -COOH ··· (3 )
前記脂肪族ジカルボン酸としては、アジピン酸、セバシン酸などが挙げられる。
前記芳香族ジカルボン酸としては、テレフタル酸、メチルテレフタル酸、ナフタレンジカルボン酸などが挙げられ、該芳香族ジカルボン酸としては、前記ポリアミド樹脂の耐熱性がより優れたものになり得るという点で、テレフタル酸が好ましい。
Examples of the aliphatic dicarboxylic acid include adipic acid and sebacic acid.
Examples of the aromatic dicarboxylic acid include terephthalic acid, methyl terephthalic acid, and naphthalene dicarboxylic acid. As the aromatic dicarboxylic acid, terephthalic acid can be used because the heat resistance of the polyamide resin can be further improved. Acid is preferred.
前記ポリアミド樹脂は、上述したジアミン化合物の1種とジカルボン酸化合物の1種とが重合してなるものであってもよく、それぞれの化合物の複数種を組み合わせて重合してなるものであってもよい。また、要すれば、ジアミン化合物とジカルボン酸化合物以外のものがさらに重合されてなるものであってもよい。 The polyamide resin may be one obtained by polymerizing one kind of diamine compound and one kind of dicarboxylic acid compound, or may be one obtained by polymerizing a combination of plural kinds of each compound. Good. Further, if necessary, a material obtained by further polymerizing a compound other than the diamine compound and the dicarboxylic acid compound may be used.
前記ポリアミド樹脂としては、上述したように前記半芳香族ポリアミド樹脂が好ましく、該半芳香族ポリアミド樹脂としては、ジアミン化合物としての脂肪族ジアミンと、ジカルボン酸化合物としての芳香族ジカルボン酸とが重合してなるものがより好ましく、脂肪族ジアミンとしてのノナンジアミンと、芳香族ジカルボン酸としてのテレフタル酸とが重合してなるもの(PA9T)が特に好ましい。 As described above, the polyamide resin is preferably the semi-aromatic polyamide resin. As the semi-aromatic polyamide resin, an aliphatic diamine as a diamine compound and an aromatic dicarboxylic acid as a dicarboxylic acid compound are polymerized. More preferred are those obtained by polymerizing nonanediamine as an aliphatic diamine and terephthalic acid as an aromatic dicarboxylic acid (PA9T).
前記電気絶縁性樹脂層においては、前記ポリスルホン樹脂以外の熱可塑性樹脂の含有割合が1重量%以上であり、5重量%以上であることが好ましく、15重量%以上であることがさらに好ましい。また、前記ポリスルホン樹脂以外の熱可塑性樹脂の含有割合が45重量%以下であり、40重量%以下であることが好ましく、30重量%以下であることがさらに好ましい。
前記ポリスルホン樹脂以外の熱可塑性樹脂の含有割合が1重量%以上であることにより、電気絶縁性樹脂層の耐トラッキング性がより優れたものになり得るという利点がある。また、前記ポリスルホン樹脂以外の熱可塑性樹脂の含有割合が45重量%以下であることにより、電気絶縁性樹脂層の耐熱性がより優れたものになり得るという利点がある。
Wherein the electrical insulating resin layer state, and are content 1 wt% or more of the thermoplastic resin other than the polysulfone resin is preferably 5 wt% or more, more preferably 15 wt% or more. Further, the content ratio of the polysulfone resin other than the thermoplastic resin Ri der 45 wt% or less, preferably 40 wt% or less, more preferably 30 wt% or less.
When the content of the thermoplastic resin other than the polysulfone resin is 1% by weight or more, there is an advantage that the tracking resistance of the electrically insulating resin layer can be further improved. Moreover, when the content rate of thermoplastic resins other than the said polysulfone resin is 45 weight% or less, there exists an advantage that the heat resistance of an electrically insulating resin layer can become more excellent.
前記電気絶縁性樹脂層には、本発明の効果を損ねない範囲において、種々の添加剤が配合されていても良い。
該添加剤としては、例えば、アルキルフェノール樹脂、アルキルフェノール−アセチレン樹脂、キシレン樹脂、クマロン−インデン樹脂、テルペン樹脂、ロジンなどの粘着付与剤、ポリブロモジフェニルオキサイド、テトラブロモビスフェノールAなどの臭素系難燃剤、塩素化パラフィン、パークロロシクロデカンなどの塩素系難燃剤、リン酸エステル、含ハロゲンリン酸エステルなどのリン系難燃剤、ホウ素系難燃剤、三酸化アンチモンなどの酸化物系難燃剤、水酸化アルミニウム、水酸化マグネシウムなどの水和金属化合物、フェノール系、リン系、硫黄系の酸化防止剤、シリカ、クレー、炭酸カルシウム、炭酸バリウム、炭酸ストロンチウム、酸化アルミ、酸化マグネシウム、窒化硼素、窒化珪素、窒化アルミニウムといった無機フィラー、熱安定剤、光安定剤、紫外線吸収剤、滑剤、顔料、架橋剤、架橋助剤、シランカップリング剤、チタネートカップリング剤などの一般的なプラスチック用配合成分などが挙げられる。また、芳香族ポリアミド繊維、数nm〜数百nmの粒径のモンモリロナイトなどが挙げられる。これら添加剤は、前記ポリスルホン樹脂と前記ポリスルホン樹脂以外の熱可塑性樹脂とを含む樹脂混合物100重量部に対して、例えば0.1〜5重量部用いることができる。
Various additives may be blended in the electrically insulating resin layer as long as the effects of the present invention are not impaired.
Examples of the additive include alkylphenol resins, alkylphenol-acetylene resins, xylene resins, coumarone-indene resins, terpene resins, rosin and other tackifiers, brominated flame retardants such as polybromodiphenyl oxide and tetrabromobisphenol A, Chlorinated flame retardants such as chlorinated paraffin and perchlorocyclodecane, phosphorus flame retardants such as phosphate esters and halogen-containing phosphate esters, boron flame retardants, oxide flame retardants such as antimony trioxide, aluminum hydroxide Hydrated metal compounds such as magnesium hydroxide, phenolic, phosphorus, sulfur antioxidants, silica, clay, calcium carbonate, barium carbonate, strontium carbonate, aluminum oxide, magnesium oxide, boron nitride, silicon nitride, nitride Inorganic fibers such as aluminum Chromatography, heat stabilizers, light stabilizers, UV absorbers, lubricants, pigments, crosslinking agents, crosslinking aids, silane coupling agents, such as general plastic compounding ingredients such as titanate coupling agents. Moreover, aromatic polyamide fibers, montmorillonite having a particle size of several nm to several hundred nm, and the like can be mentioned. These additives can be used in an amount of, for example, 0.1 to 5 parts by weight with respect to 100 parts by weight of the resin mixture containing the polysulfone resin and a thermoplastic resin other than the polysulfone resin.
次に、前記電気絶縁性樹脂シートの具体例として、前記電気絶縁性樹脂層の両面側にシート材が配された電気絶縁性樹脂シートを挙げ、図面を参照しながら詳しく説明する。 Next, as a specific example of the electrically insulating resin sheet, an electrically insulating resin sheet in which sheet materials are arranged on both sides of the electrically insulating resin layer will be described and described in detail with reference to the drawings.
図1は、前記電気絶縁性樹脂層2の両面側にシート材3が配された電気絶縁性樹脂シートを厚み方向に切断した断面を模式的に示した断面図である。
図1に示すように、斯かる電気絶縁性樹脂シート1は、シート状の電気絶縁性樹脂層2を介して、複数のシート材3が貼り合わされている。
FIG. 1 is a cross-sectional view schematically showing a cross section obtained by cutting an electric insulating resin sheet in which a sheet material 3 is disposed on both sides of the electric insulating resin layer 2 in the thickness direction.
As shown in FIG. 1, such an electrically insulating resin sheet 1 has a plurality of sheet materials 3 bonded together with a sheet-like electrically insulating resin layer 2 interposed therebetween.
前記シート材3は、シート状のものであれば特に限定されない。また、厚みが特に限定されるものではなく、通常、10〜100μmである。また、前記シート材3は、図1に示すように、通常、電気絶縁性樹脂シートに2枚備えられている。 The sheet material 3 is not particularly limited as long as it is a sheet. Moreover, thickness is not specifically limited, Usually, it is 10-100 micrometers. In addition, as shown in FIG. 1, the sheet material 3 is usually provided in two sheets of an electrically insulating resin sheet.
前記シート材3としては、例えば、不織布、紙、又はフィルム等が挙げられる。前記シート材3としては、電気絶縁性樹脂シートの耐引裂き性がより優れたものになり得るという点で、不織布又は紙が好ましい。 Examples of the sheet material 3 include a nonwoven fabric, paper, or a film. The sheet material 3 is preferably a non-woven fabric or paper in that the tear resistance of the electrically insulating resin sheet can be improved.
前記シート材3としては、湿式抄紙法により作製されたもの(湿式不織布等)、大気中で乾式法により作製されたもの(乾式不織布等)などが挙げられる。
前記シート材3としては、電気絶縁性樹脂シートの耐引裂き性がより優れたものになり得るという点で、湿式抄紙法により作製された紙が好ましい。
Examples of the sheet material 3 include those prepared by a wet papermaking method (wet nonwoven fabric and the like), and those prepared by a dry method in the air (dry nonwoven fabric and the like).
The sheet material 3 is preferably paper produced by a wet papermaking method in that the electrical insulating resin sheet can be more excellent in tear resistance.
前記シート材3の材質としては、ポリアミド、ポリエステルなどの合成高分子化合物、セルロースなどの天然高分子化合物等が挙げられ、電気絶縁性樹脂シートの耐引裂き性がより優れたものになり得るという点で、ポリアミドが好ましい。 Examples of the material of the sheet material 3 include synthetic polymer compounds such as polyamide and polyester, natural polymer compounds such as cellulose, and the like, and the tear resistance of the electrically insulating resin sheet can be further improved. Polyamide is preferred.
該ポリアミドとしては、構成モノマーの全てが芳香族炭化水素を有する全芳香族ポリアミド、構成モノマーの全てが脂肪族炭化水素のみを有する脂肪族ポリアミド、構成モノマーの一部が芳香族炭化水素を有する半芳香族ポリアミドなどが挙げられ、電気絶縁性樹脂シートの耐引裂き性がより優れたものになり得るという点で、全芳香族ポリアミドが好ましい。即ち、前記シート材3は、前記全芳香族ポリアミドを含んでいることが好ましい。 The polyamide includes a wholly aromatic polyamide in which all of the constituent monomers have aromatic hydrocarbons, an aliphatic polyamide in which all of the constituent monomers have only aliphatic hydrocarbons, and a semi-aromatic in which some of the constituent monomers have aromatic hydrocarbons. Examples include aromatic polyamides, and wholly aromatic polyamides are preferable in that the electrical insulating resin sheet can be more excellent in tear resistance. That is, it is preferable that the sheet material 3 contains the wholly aromatic polyamide.
また、前記シート材3としては、電気絶縁性樹脂シートの耐引裂き性がさらに優れたものになり得るという点で、全芳香族ポリアミド繊維を含む全芳香族ポリアミド紙がさらに好ましい。即ち、全芳香族ポリアミド繊維を用いて湿式抄紙法により作製された全芳香族ポリアミド紙がさらに好ましい。 The sheet material 3 is more preferably a wholly aromatic polyamide paper containing wholly aromatic polyamide fibers in that the tear resistance of the electrically insulating resin sheet can be further improved. That is, a wholly aromatic polyamide paper produced by a wet papermaking method using a wholly aromatic polyamide fiber is more preferable.
前記全芳香族ポリアミド紙としては、例えば、アミド基以外がベンゼン環で構成された、フェニレンジアミンとフタル酸との縮合重合物(全芳香族ポリアミド)を繊維化し、繊維化した全芳香族ポリアミド繊維を主たる構成材として形成されたものが挙げられる。
前記全芳香族ポリアミド紙は、力学的特性に優れ、電気絶縁性樹脂シートの製造工程におけるハンドリングが良好であるという点で、坪量が5g/m2以上であることが好ましい。坪量が5g/m2以上であることにより、力学的強度の不足が抑制され電気絶縁性樹脂シートの製造中に破断しにくいという利点がある。
なお、前記全芳香族ポリアミド紙には、本発明の効果を損なわない範囲において他の成分を加えることができ、該他の成分としては、ポリフェニレンスルフィド繊維、ポリエーテルエーテルケトン繊維、ポリエステル繊維、アリレート繊維、液晶ポリエステル繊維、ポリエチレンナフタレート繊維などの有機繊維、又は、ガラス繊維、ロックウール、アスベスト、ボロン繊維、アルミナ繊維などの無機繊維が挙げられる。
前記全芳香族ポリアミド紙としては、例えば、デュポン社より商品名「ノーメックス」で市販されているもの等を用いることができる。
Examples of the wholly aromatic polyamide paper include, for example, a wholly aromatic polyamide fiber obtained by fiberizing a condensation polymerization product (fully aromatic polyamide) of phenylenediamine and phthalic acid, which includes a benzene ring except for an amide group. Are formed as the main constituent material.
The wholly aromatic polyamide paper is excellent in mechanical properties and preferably has a basis weight of 5 g / m 2 or more in terms of good handling in the production process of the electrically insulating resin sheet. When the basis weight is 5 g / m 2 or more, there is an advantage that the mechanical strength is prevented from being insufficient and is not easily broken during the production of the electrically insulating resin sheet.
In addition, other components can be added to the wholly aromatic polyamide paper as long as the effects of the present invention are not impaired. Examples of the other components include polyphenylene sulfide fibers, polyether ether ketone fibers, polyester fibers, and arylates. Examples thereof include organic fibers such as fibers, liquid crystal polyester fibers, and polyethylene naphthalate fibers, or inorganic fibers such as glass fibers, rock wool, asbestos, boron fibers, and alumina fibers.
Examples of the wholly aromatic polyamide paper include those commercially available from DuPont under the trade name “NOMEX”.
前記シート材3の電気絶縁性樹脂層2側には、コロナ処理が施されていることが好ましい。該コロナ処理が施されていることにより、シート材と電気絶縁性樹脂層との間における層間剥離がより抑制され得るという利点がある。
前記コロナ処理は、電気絶縁性樹脂層2と接するシート材3の一方の面に放電処理を行い、極性を持つカルボキシル基や水酸基を生成させ荒面化する処理である。前記コロナ処理としては、従来公知の一般的な方法を採用することができる。
The sheet material 3 is preferably subjected to a corona treatment on the electrically insulating resin layer 2 side. By performing the corona treatment, there is an advantage that delamination between the sheet material and the electrically insulating resin layer can be further suppressed.
The corona treatment is a treatment in which one surface of the sheet material 3 in contact with the electrical insulating resin layer 2 is subjected to a discharge treatment to generate polar carboxyl groups and hydroxyl groups to roughen the surface. As the corona treatment, a conventionally known general method can be employed.
前記電気絶縁性樹脂シートは、電気絶縁性の指標となる耐トラッキング試験のCTI値が175V以上であることが好ましい。なお、耐トラッキング試験は、実施例に記載された方法によって行う。 The electrically insulating resin sheet preferably has a CTI value of 175 V or more in a tracking resistance test that serves as an index of electrical insulation. The tracking resistance test is performed by the method described in the examples.
前記電気絶縁性樹脂シートは、耐引裂き性の指標となる端裂抵抗値が100N/20mm以上であることが好ましい。なお、端裂抵抗値の測定は、実施例に記載された方法によって行う。 The electrically insulating resin sheet preferably has an end tear resistance value of 100 N / 20 mm or more as an index of tear resistance. The end resistance value is measured by the method described in the examples.
前記電気絶縁性樹脂シートは、220℃で1250時間を経た後の引張強度の強度残率が60%以上であることが好ましい。なお、強度残率は、実施例に記載された方法によって求める。 The electrical insulating resin sheet preferably has a tensile strength remaining ratio of 60% or more after 1250 hours at 220 ° C. The residual strength rate is obtained by the method described in the examples.
前記電気絶縁性樹脂シートは、前記電気絶縁性樹脂層及び前記シート材の各凝集破壊力より、前記電気絶縁性樹脂層と前記シート材との間の層間接着力が大きいことにより、前記電気絶縁性樹脂層と前記シート材との間で層間剥離しないように構成されていることが好ましい。 The electrical insulating resin sheet has the interlayer insulating force between the electrical insulating resin layer and the sheet material greater than the cohesive failure force of the electrical insulating resin layer and the sheet material, and thus the electrical insulation. It is preferable that it is comprised so that delamination may not be carried out between an adhesive resin layer and the said sheet | seat material.
続いて、前記電気絶縁性樹脂シートの製造方法について説明する。 Then, the manufacturing method of the said electrically insulating resin sheet is demonstrated.
前記電気絶縁性樹脂シートに備えられている前記電気絶縁性樹脂層は、ポリスルホン樹脂と該ポリスルホン樹脂以外の熱可塑性樹脂とを所定温度に加熱しながら混合した樹脂混合物を、従来公知の一般的な方法によってシート状に成形することにより作製することができる。具体的には、例えば、ポリスルホン樹脂と該ポリスルホン樹脂以外の熱可塑性樹脂とを、ニーダー、加圧ニーダー、混練ロール、バンバリーミキサー、二軸押し出し機などの一般的な混合手段によって加熱しながら混合して樹脂混合物とし、該樹脂混合物をT−ダイを取り付けた押出機によってシート状に押し出すこと等により作製することができる。
また、例えば、2枚のシート材を備えた電気絶縁性樹脂シートは、2枚のシート材で電気絶縁性樹脂層を挟み込んだ状態のものを押圧することなどにより製造することができる。
The electric insulating resin layer provided in the electric insulating resin sheet is a conventionally known general mixture of a resin mixture obtained by mixing a polysulfone resin and a thermoplastic resin other than the polysulfone resin while heating to a predetermined temperature. It can be produced by molding into a sheet by a method. Specifically, for example, a polysulfone resin and a thermoplastic resin other than the polysulfone resin are mixed while being heated by a general mixing means such as a kneader, a pressure kneader, a kneading roll, a Banbury mixer, or a twin screw extruder. The resin mixture can be prepared by extruding the resin mixture into a sheet by an extruder equipped with a T-die.
In addition, for example, an electrically insulating resin sheet provided with two sheet materials can be manufactured by pressing a sheet in which an electrically insulating resin layer is sandwiched between two sheet materials.
詳しくは、前記電気絶縁性樹脂シートの製造においては、ポリスルホン樹脂と該ポリスルホン樹脂以外の熱可塑性樹脂との粘度差がより小さくなる温度でこれらの樹脂を混合し、斯かる温度で混合した樹脂混合物をシート状の電気絶縁性樹脂層に成形することにより、作製された電気絶縁性樹脂層において、上述したポリスルホン樹脂以外の熱可塑性樹脂の分散相の粒子径を小さくすることができ、従って、最短径が0.5μm以上の分散相の個数を少なくすることができる。 Specifically, in the production of the electrical insulating resin sheet, these resins are mixed at a temperature at which the difference in viscosity between the polysulfone resin and a thermoplastic resin other than the polysulfone resin becomes smaller, and the resin mixture is mixed at such a temperature. In the sheet-like electrically insulating resin layer, the particle diameter of the dispersed phase of the thermoplastic resin other than the polysulfone resin described above can be reduced in the produced electrically insulating resin layer. The number of dispersed phases having a diameter of 0.5 μm or more can be reduced.
例えば、2種の異なる樹脂がそれぞれ分散相及び連続相となって存在する樹脂混合物においては、分散相の大きさと2種の異なる樹脂の粘度との関係に関して、下記に示す関係式(4)が知られている。 For example, in a resin mixture in which two different types of resins exist as a dispersed phase and a continuous phase, the following relational expression (4) is established with respect to the relationship between the size of the dispersed phase and the viscosity of the two different types of resins. Are known.
上記の関係式(4)からも認識できるように、2種の樹脂の粘度差(ηD/ηm)を小さくするほど分散相の粒子径を小さくすることができる。また、樹脂を混合するときのせん断速度を大きくすることによっても、分散相の粒子径を小さくすることができる。 As can be recognized from the relational expression (4), the particle diameter of the dispersed phase can be reduced as the difference in viscosity (η D / η m ) between the two resins is reduced. Also, the particle diameter of the dispersed phase can be reduced by increasing the shear rate when the resin is mixed.
より具体的には、例えば、ポリエーテルポリフェニルスルホン樹脂とポリアミド樹脂(PA9T)とを含む電気絶縁性樹脂層を成形する場合、310℃〜340℃の温度範囲において、高温になるほど、ポリエーテルポリフェニルスルホン樹脂とポリアミド樹脂とのメルトフローレート(MFR)の差が大きくなる。従って、例えば、各樹脂を340℃で混合するよりも310℃で混合する方が、これら2種の樹脂の粘度差を小さくすることができ、ポリアミド樹脂の分散相の粒子径を小さくすることができる。即ち、最短径が0.5μm以上の分散相の個数を少なくすることができる。 More specifically, for example, when an electrically insulating resin layer containing a polyether polyphenylsulfone resin and a polyamide resin (PA9T) is molded, the higher the temperature in the temperature range of 310 ° C to 340 ° C, The difference in melt flow rate (MFR) between the phenylsulfone resin and the polyamide resin is increased. Therefore, for example, mixing each resin at 310 ° C. rather than mixing at 340 ° C. can reduce the viscosity difference between these two types of resins and reduce the particle size of the dispersed phase of the polyamide resin. it can. That is, the number of dispersed phases having a shortest diameter of 0.5 μm or more can be reduced.
前記電気絶縁性樹脂シートは、電気絶縁性を有する点を利用して、例えば、自動車などにおけるモーター用の電気絶縁用シート、変圧器(トランス)用の電気絶縁用シート、バスバー用の電気絶縁用シートなどにおいて使用することができる。 The electrical insulating resin sheet uses an electrical insulating point, for example, an electrical insulation sheet for a motor in an automobile, an electrical insulation sheet for a transformer (transformer), and an electrical insulation for a bus bar. It can be used in sheets and the like.
本実施形態の電気絶縁性樹脂シートは、上記例示の通りであるが、本発明は、上記例示の電気絶縁性樹脂シートに限定されるものではない。
また、一般の電気絶縁性樹脂シートにおいて用いられる種々の態様を、本発明の効果を損ねない範囲において、採用することができる。
The electrically insulating resin sheet of the present embodiment is as illustrated above, but the present invention is not limited to the electrically insulating resin sheet illustrated above.
Moreover, the various aspects used in a general electrically insulating resin sheet can be employed as long as the effects of the present invention are not impaired.
例えば、上記実施形態では、図1において、シート状の電気絶縁性樹脂層の両面側にそれぞれ1枚のシート材が配されてなる電気絶縁性樹脂シートについて説明したが、本発明はこのような実施形態に限定されるものではなく、シート状の電気絶縁性樹脂層の片面側のみに1枚のシート材が配されてなるものであってもよい。また、シート状の電気絶縁性樹脂層のみを備えたものであってもよい。 For example, in the above embodiment, the electrical insulating resin sheet in which one sheet material is disposed on each side of the sheet-like electrical insulating resin layer in FIG. 1 has been described. It is not limited to the embodiment, and one sheet material may be disposed only on one side of the sheet-like electrically insulating resin layer. Alternatively, only a sheet-like electrically insulating resin layer may be provided.
次に実施例を挙げて本発明をさらに詳しく説明するが、本発明はこれらに限定されるものではない。 EXAMPLES Next, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these.
(実施例1)
先ず、下記の原料を用意した。
・ポリスルホン樹脂:ポリエーテルポリフェニルスルホン樹脂(PES)樹脂
(分子中にスルホニル基、エーテル結合、及び芳香族炭化水素を複数含む)
(ソルベイ社製 商品名「レーデルA−300A」)を用いた。
・ポリアミド樹脂:ポリアミド樹脂(PA9T)
(分子中にテレフタル酸単位とノナンジアミン単位とを複数含む)
(クラレ社製 商品名「ジェネスタN1000A」)
次に、PES樹脂及びPA樹脂がPES/PA=80/20の重量比になるように、2軸混練機(テクノベル社製)を用いて310℃で混合し、樹脂混合物を調製した。
続いて、樹脂混合物を押出成形により310℃で100μm厚のシート状に成形して電気絶縁性樹脂層を形成し、シート状の電気絶縁性樹脂層のみからなる電気絶縁性樹脂シートを製造した。
Example 1
First, the following raw materials were prepared.
・ Polysulfone resin: Polyether polyphenylsulfone resin (PES) resin (including multiple sulfonyl groups, ether bonds, and aromatic hydrocarbons in the molecule)
(Product name “Radel A-300A” manufactured by Solvay) was used.
・ Polyamide resin: Polyamide resin (PA9T)
(Contains multiple terephthalic acid units and nonanediamine units in the molecule)
(Kuraray brand name “Genesta N1000A”)
Next, the PES resin and the PA resin were mixed at 310 ° C. using a twin-screw kneader (manufactured by Technobel) so that the weight ratio of PES / PA = 80/20 was obtained to prepare a resin mixture.
Subsequently, the resin mixture was formed into a sheet having a thickness of 100 μm at 310 ° C. by extrusion molding to form an electrically insulating resin layer, and an electrically insulating resin sheet consisting only of the sheet-like electrically insulating resin layer was manufactured.
(実施例2)
320℃で樹脂混合物を調製し、320℃で押出成形した点以外は、実施例1と同様にして、シート状の電気絶縁性樹脂層のみからなる電気絶縁性樹脂シートを製造した。
(Example 2)
An electrically insulating resin sheet consisting only of a sheet-like electrically insulating resin layer was produced in the same manner as in Example 1 except that a resin mixture was prepared at 320 ° C. and extruded at 320 ° C.
(実施例3)
330℃で樹脂混合物を調製し、330℃で押出成形した点以外は、実施例1と同様にして、シート状の電気絶縁性樹脂層のみからなる電気絶縁性樹脂シートを製造した。
(Example 3)
An electrically insulating resin sheet consisting only of a sheet-like electrically insulating resin layer was produced in the same manner as in Example 1 except that a resin mixture was prepared at 330 ° C. and extruded at 330 ° C.
(実施例4)
一方、2枚の全芳香族ポリアミド紙(デュポン社製 商品名「ノーメックスT410」厚み50μm)をシート材として用意した。さらに、それぞれのシート材の電気絶縁性樹脂層と接する側の面には、コロナ処理を施した。コロナ処理は、機器としてPILLAR TECHNOLOGIES社製「500シリーズ」を用いて、大気圧下で、出力500W、処理速度4m/分、試料幅0.4mの条件により行った。
そして、実施例1の電気絶縁性樹脂層の両面側に2枚の全芳香族ポリアミド紙を配置した状態のものを2枚の金属板で挟み、350℃に加熱した熱プレス機を用いて、圧力200N/cm2で60秒間プレスし、電気絶縁性樹脂層の両面側に2枚のシート材を備えた約200μm厚の電気絶縁性樹脂シートを製造した。
Example 4
On the other hand, two wholly aromatic polyamide papers (trade name “NOMEX T410”, thickness 50 μm, manufactured by DuPont) were prepared as sheet materials. Furthermore, the corona treatment was performed on the surface of each sheet material in contact with the electrically insulating resin layer. The corona treatment was performed under the conditions of an output of 500 W, a treatment speed of 4 m / min, and a sample width of 0.4 m under atmospheric pressure using “500 series” manufactured by PILLAR TECHNOLOGIES as an instrument.
And using a hot press machine heated at 350 ° C., sandwiched between two metal plates with two fully aromatic polyamide papers arranged on both sides of the electrically insulating resin layer of Example 1, The sheet was pressed at a pressure of 200 N / cm 2 for 60 seconds to produce an electrically insulating resin sheet having a thickness of about 200 μm having two sheet materials on both sides of the electrically insulating resin layer.
(比較例)
340℃で樹脂混合物を調製し、340℃で押出成形した点以外は、実施例1と同様にして、シート状の電気絶縁性樹脂層のみからなる電気絶縁性樹脂シートを製造した。
(Comparative example)
An electrically insulating resin sheet comprising only a sheet-like electrically insulating resin layer was produced in the same manner as in Example 1 except that a resin mixture was prepared at 340 ° C. and extruded at 340 ° C.
<電子顕微鏡観察用試料の作製>
各実施例及び比較例の電気絶縁性樹脂シートの電気絶縁性樹脂層から適当な大きさのサンプルを切り出し、これをエポキシ樹脂によって樹脂包埋し、研磨法によって、押出成形の押出方向に沿って切断した厚み方向切断面を作製した。
さらに、重金属系染色剤によって電子染色を施し、金属蒸着によって導電処理したものを電子顕微鏡観察用試料とした。
<Preparation of sample for electron microscope observation>
A sample of an appropriate size is cut out from the electrically insulating resin layer of the electrically insulating resin sheet of each example and comparative example, and this is embedded in an epoxy resin, and polished along the extrusion direction of the extrusion. A cut surface in the thickness direction was produced.
Further, a sample subjected to electron staining with a heavy metal dye and subjected to conductive treatment by metal deposition was used as an electron microscope observation sample.
<ポリアミド樹脂の分散相における最短径の測定>
電界放射型走査電子顕微鏡(FE−SEM)「日立社製 製品名S−4800」を用いて、加速電圧10kV、倍率5000倍の観察条件により、14μm(厚み方向)×21μm(押出方向MD)の長方形範囲において、作製した電子顕微鏡観察用試料を観察した。
黒色の不連続物となって見えるポリアミド樹脂の分散相のそれぞれについて、上述したように、各不連続物に対して内接する最大円の直径によって分散相の最短径を決定した。なお、斯かる測定においては、目視により各分散相を区別した。
<Measurement of shortest diameter in dispersed phase of polyamide resin>
Using a field emission scanning electron microscope (FE-SEM) “product name S-4800, manufactured by Hitachi, Ltd.”, the observation voltage was 10 kV and the magnification was 5000 times, and the measurement was 14 μm (thickness direction) × 21 μm (extrusion direction MD). In the rectangular range, the produced electron microscope observation sample was observed.
As described above, the shortest diameter of the dispersed phase was determined by the diameter of the largest circle inscribed in each discontinuous for each of the polyamide resin dispersed phases that appeared to be black discontinuities. In this measurement, each dispersed phase was distinguished visually.
各実施例及び比較例の電気絶縁性樹脂層における厚み方向切断面の電子顕微鏡写真を図2〜図6に示す。なお、図2〜図6は、それぞれ順に実施例1〜4及び比較例におけるものを示す。 The electron micrograph of the thickness direction cut surface in the electrically insulating resin layer of each Example and a comparative example is shown in FIGS. 2 to 6 show the examples in Examples 1 to 4 and the comparative example, respectively.
<耐熱性の評価>
製造した電気絶縁性樹脂シートにおける電気絶縁性樹脂層の流れ方向に沿って15mm幅で切断した試験サンプルを作製した。また、作製した試験サンプルを220℃に加熱した恒温槽に1250時間放置した。恒温槽に放置する前と後の試験サンプルについて、JIS C2151における「引張特性」に準じ、23℃において、200mm/分、標線100mmの試験条件で引張試験を行い、引張強度を測定した。そして、下記の式により、強度残率を算出した。
強度残率(%)={(放置後の引張強度)/(放置前の引張強度)}×100
<Evaluation of heat resistance>
A test sample cut at a width of 15 mm along the flow direction of the electrically insulating resin layer in the manufactured electrically insulating resin sheet was prepared. The prepared test sample was left in a thermostatic chamber heated to 220 ° C. for 1250 hours. About the test sample before and after leaving to stand in a thermostat, according to "tensile characteristic" in JISC2151, the tensile test was performed at 23 degreeC on the test conditions of 200 mm / min and a 100-mm mark, and measured the tensile strength. And the intensity | strength residual rate was computed by the following formula.
Strength remaining ratio (%) = {(Tensile strength after leaving) / (Tensile strength before leaving)} × 100
<耐引裂き性の評価>
JIS C2151における「端裂抵抗(B法)」に準じて、23℃において、電気絶縁性樹脂シートの縦方向(押出方向 MD)に沿って引裂くときの端裂抵抗値を測定した。
<Evaluation of tear resistance>
In accordance with “end tear resistance (Method B)” in JIS C2151, the end tear resistance value at the time of tearing along the longitudinal direction (extrusion direction MD) of the electrically insulating resin sheet was measured at 23 ° C.
<耐トラッキング性の評価>
JIS C2134に準じて、23℃において、CTI(Comparative Tracking Index)値を測定した。
<Evaluation of tracking resistance>
A CTI (Comparative Tracking Index) value was measured at 23 ° C. in accordance with JIS C2134.
各実施例及び各比較例における耐熱性(強度残率)、耐引裂き性(端裂抵抗値)、及び、耐トラッキング性(CTI値)の評価結果を表1に示す。 Table 1 shows the evaluation results of heat resistance (strength residual rate), tear resistance (end tear resistance value), and tracking resistance (CTI value) in each example and each comparative example.
本発明の電気絶縁性樹脂シートは、耐熱性と電気絶縁性とを要する電気絶縁用シートなどとして好適に用いられ得る。具体的には、例えば、モーターのコイル線の周囲に配される電気絶縁用シート材、トランス、バスバー、コンデンサ、ケーブル用の電気絶縁用シート材、又は、電子回路基板の絶縁膜などの用途に好適である。 The electrically insulating resin sheet of the present invention can be suitably used as an electrically insulating sheet that requires heat resistance and electrical insulation. Specifically, for example, an electrical insulating sheet material arranged around the coil wire of a motor, a transformer, a bus bar, a capacitor, an electrical insulating sheet material for a cable, or an insulating film of an electronic circuit board. Is preferred.
1:電気絶縁性樹脂シート、 2:電気絶縁性樹脂層、 3:シート材 1: electrically insulating resin sheet, 2: electrically insulating resin layer, 3: sheet material
Claims (14)
前記電気絶縁性樹脂層は、1〜45重量%の前記ポリアミド樹脂を含み、前記ポリアミド樹脂が前記ポリエーテルポリフェニルスルホン樹脂中に分散した分散相を有しており、
前記電気絶縁性樹脂層の厚み方向切断面の294μm2面積範囲では、0.5μm以上の最短径を有する前記分散相の個数が10以下である、電気絶縁性樹脂シート。 A polyether sulfone resin having a plurality of sulfonyl groups in the molecule and a plurality of ether linkages and a plurality of aromatic hydrocarbons, electrically insulating resin layer comprising a polyamide resin, a having an aromatic hydrocarbon in a molecule An electrically insulating resin sheet comprising:
The electrically insulating resin layer includes 1 to 45% by weight of the polyamide resin, and the polyamide resin has a dispersed phase dispersed in the polyether polyphenylsulfone resin.
Wherein in the 294Myuemu 2 area range in the thickness direction cross section of the electrically insulating resin layer, the number of the dispersed phase having a shortest diameter of more than 0.5μm is 10 or less, the electrically insulating resin sheet.
The electrically insulating resin sheet according to any one of claims 1 to 13 , which is used in an electrically insulating application.
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JP2011026062A JP5690606B2 (en) | 2011-02-09 | 2011-02-09 | Electrical insulating resin sheet |
PCT/JP2012/052675 WO2012108404A1 (en) | 2011-02-09 | 2012-02-07 | Electrically insulating resin sheet |
CN2012800082034A CN103354824A (en) | 2011-02-09 | 2012-02-07 | Electrically insulating resin sheet |
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CN114901758B (en) * | 2019-12-25 | 2023-05-23 | 京瓷株式会社 | Insulating resin |
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JPH11176245A (en) * | 1997-10-14 | 1999-07-02 | Furukawa Electric Co Ltd:The | Multi-layer insulated wire and transformer using it |
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