JP5685473B2 - Anisotropic conductive film, method for manufacturing bonded body, and bonded body - Google Patents

Description

  The present invention uses an anisotropic conductive film capable of electrically and mechanically connecting electronic components such as an IC chip and a liquid crystal panel (LCD panel) in a liquid crystal display (LCD), and the anisotropic conductive film. The present invention relates to a method for manufacturing a bonded body, and a bonded body obtained by the manufacturing method.

  Conventionally, as a means for connecting an electronic component to a substrate, a tape-like connection material in which a thermosetting resin in which conductive particles are dispersed is applied to a release film (for example, anisotropic conductive film (ACF)) ) Is used.

  This anisotropic conductive film can be used for various purposes including connecting a terminal of a flexible printed circuit board (FPC) or an IC chip to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used for bonding and electrically connecting the terminals.

  As the anisotropic conductive film, a film having a two-layer structure of a layer (ACF) in which conductive particles are dispersed and a layer (NCF; Non Conductive Film) in which conductive particles are not dispersed has been proposed. When this anisotropic conductive film is used, the terminals of electronic components such as IC chips enter the layer not containing conductive particles, and the conductive particles are sandwiched between the layers in which the conductive particles are dispersed. Electrically connected. For this reason, the number of conductive particles flowing between the terminals of the electronic component is reduced, and even if the amount of conductive particles is smaller than that of the single-layer structure, the ratio of conductive particles on the connection terminals (particle trapping) Rate) can be expected to improve.

As such an anisotropic conductive film having a two-layer structure, for example, the first layer has at least a film-forming resin and a thermosetting resin, and the glass of the film-forming resin in the first layer. The transition point is 80 ° C. or higher, the second layer has at least a film forming resin and a curing agent, and the glass transition point of the film forming resin in the second layer is −20 ° C. to 65 ° C. An anisotropic conductive film has been proposed (see Patent Document 1). In this proposed technique, as a specific example, an anisotropic conductive film having a two-layer structure in which the conductive particle-containing layer does not contain a curing agent and the insulating adhesive layer contains a curing agent has been studied. Yes.
However, this proposed technique has a problem in that the particle trapping rate is not sufficient because the conductive particles flow for a long time during pressure bonding.

Further, the epoxy resin (A) includes two layers of a first adhesive layer containing an epoxy resin (A) and an epoxy resin curing agent, and a second adhesive layer containing an epoxy resin (B), and the epoxy resin (A) is an epoxy resin. (B) An anisotropic conductive film has been proposed that has a longer gel time and does not contain an epoxy resin curing agent in the second adhesive layer or has a smaller amount of mixture than the first adhesive layer. (See Patent Document 2).
However, this proposed technique has a problem that the connection resistance increases because sufficient curing does not occur in the short-time pressure bonding.

  Therefore, in an anisotropic conductive film having a two-layer structure, an anisotropic conductive film that has an excellent particle trapping rate and a sufficiently low connection resistance can be obtained even after a short time pressure bonding, and a bonded body using the anisotropic conductive film. At present, it is required to provide a manufacturing method and a joined body obtained by the manufacturing method.

Japanese Patent Laying-Open No. 2005-197032 Japanese Patent Laid-Open No. 10-273628

  An object of the present invention is to solve the above-described problems and achieve the following objects. That is, the present invention provides an anisotropic conductive film that has an excellent particle capture rate and that can provide a sufficiently low connection resistance even in a short time, and a method for manufacturing a joined body using the anisotropic conductive film, and the manufacturing method. It aims at providing the joined_body | zygote obtained by these.

Means for solving the problems are as follows. That is,
<1> An anisotropic conductive film for anisotropically conductively connecting a terminal of a substrate and a terminal of an electronic component,
An insulating adhesive layer containing an acrylic resin;
Having conductive particles, an acrylic resin, and a conductive particle-containing layer containing a polymerization initiator,
Of the insulating adhesive layer and the conductive particle-containing layer, only the conductive particle-containing layer contains the polymerization initiator.
<2> The anisotropic conductive film according to <1>, wherein the polymerization initiator is an organic peroxide.
<3> The anisotropic conductive film according to <2>, wherein the organic peroxide has a one-minute half-life temperature of 90.0 ° C. to 154.0 ° C.
<4> From <2> to <3>, the content of the organic peroxide in the conductive particle-containing layer is 3% by mass to 8% by mass with respect to the resin component in the conductive particle-containing layer. It is an anisotropic conductive film in any one.
<5> The anisotropic conductive film according to any one of <1> to <4> is provided on a terminal of the substrate, and the conductive particle-containing layer of the anisotropic conductive film is in contact with the terminal of the substrate. Pasting process to paste,
A placing step of placing an electronic component on the anisotropic conductive film;
A heating and pressing step of heating and pressing the electronic component with a heating and pressing member,
A method for manufacturing a joined body, wherein the terminals of the substrate and the terminals of the electronic component are anisotropically conductively connected.
<6> A joined body produced by the method for producing a joined body according to <5>.

  According to the present invention, the anisotropic conductive film that can solve the above-described problems and can achieve the above-described object, has an excellent particle capture rate, and can obtain a sufficiently low connection resistance even in a short time is provided. The manufacturing method of the conjugate | zygote using an anisotropic conductive film and the conjugate | zygote obtained by this manufacturing method can be provided.

FIG. 1 is a schematic view of the anisotropic conductive film of the present invention. FIG. 2A is a schematic view for explaining the method for producing a joined body of the present invention. FIG. 2B is a schematic view for explaining the method of manufacturing the joined body of the present invention. FIG. 2C is a schematic view for explaining the method for producing a joined body according to the present invention.

(Anisotropic conductive film)
The anisotropic conductive film of this invention has an insulating contact bonding layer and an electroconductive particle content layer at least, and also has another member as needed.
Only the conductive particle-containing layer of the insulating adhesive layer and the conductive particle-containing layer contains a polymerization initiator.
The anisotropic conductive film is an anisotropic conductive film that connects a terminal of a substrate and a terminal of an electronic component in an anisotropic conductive connection.
There is no restriction | limiting in particular as a structure of the said anisotropic conductive film, Although it can select suitably according to the objective, The two-layer structure which consists of the said insulating contact bonding layer and the said electroconductive particle content layer is preferable.

<Insulating adhesive layer>
The insulating adhesive layer contains at least an acrylic resin, and further contains other components as necessary. However, the insulating adhesive layer does not contain a polymerization initiator.

-Acrylic resin-
There is no restriction | limiting in particular as said acrylic resin, According to the objective, it can select suitably, For example, an acrylic compound, liquid acrylate etc. are illustrated, Specifically, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate , Phosphate group-containing acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2 , 2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tri Black decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, epoxy acrylate. In addition, what made the said acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.
There is no restriction | limiting in particular as content of the said acrylic resin in the said insulating contact bonding layer, According to the objective, it can select suitably.

-Other ingredients-
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, film forming resin, a silane coupling agent, etc. are mentioned.

--- Film-forming resin--
There is no restriction | limiting in particular as said film formation resin, According to the objective, it can select suitably, For example, a phenoxy resin, an epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide Examples thereof include resins and polyolefin resins. The film forming resin may be used alone or in combination of two or more. Among these, phenoxy resin is particularly preferable from the viewpoints of film formability, processability, and connection reliability.
The said phenoxy resin is resin synthesize | combined from bisphenol A and epichlorohydrin, Comprising: What was synthesize | combined suitably may be used and a commercial item may be used.
There is no restriction | limiting in particular as content of the said film formation resin in the said insulating contact bonding layer, According to the objective, it can select suitably.

--Silane coupling agent--
The silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include an epoxy silane coupling agent, an acrylic silane coupling agent, a thiol silane coupling agent, and an amine silane. A coupling agent etc. are mentioned.
There is no restriction | limiting in particular as content of the said silane coupling agent in the said electroconductive particle content layer, According to the objective, it can select suitably.

There is no restriction | limiting in particular as average thickness of the said insulating contact bonding layer, Although it can select suitably in relation to the thickness of the electroconductive particle content layer mentioned later, 5 micrometers-25 micrometers are preferable, and 8 micrometers-20 micrometers are more preferable. . When the average thickness is less than 5 μm, the resin filling rate between the terminals may be reduced, and when it exceeds 25 μm, connection failure may be caused.
Here, the said average thickness is an average value at the time of measuring the thickness of five places of the said insulating contact bonding layers arbitrarily.

<Conductive particle-containing layer>
The conductive particle-containing layer contains at least conductive particles, an acrylic resin, and a polymerization initiator, and further contains other components as necessary.

-Conductive particles-
There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, a metal particle, a metal covering resin particle, etc. are mentioned.
As said metal particle, nickel, cobalt, silver, copper, gold | metal | money, palladium etc. are mentioned, for example. These may be used individually by 1 type and may use 2 or more types together. Among these, nickel, silver, and copper are preferable. In order to prevent these surface oxidations, particles having gold or palladium on the surface may be used. Furthermore, you may use what gave the insulating film with the metal protrusion and organic substance on the surface.
Examples of the metal-coated resin particles include particles in which the surface of the resin core is coated with any metal of nickel, copper, gold, and palladium. Similarly, particles having gold or palladium on the outermost surface may be used. Furthermore, you may use what gave the insulating film with the metal protrusion and organic substance on the surface.
There is no restriction | limiting in particular as the coating method of the metal to the said resin core, According to the objective, it can select suitably, For example, an electroless-plating method, sputtering method, etc. are mentioned.
The material for the resin core is not particularly limited and may be appropriately selected depending on the intended purpose. For example, styrene-divinylbenzene copolymer, benzoguanamine resin, cross-linked polystyrene resin, acrylic resin, styrene-silica composite resin, etc. Is mentioned.
There is no restriction | limiting in particular as content of the said electroconductive particle in the said electroconductive particle content layer, According to the wiring pitch of a circuit member, a connection area, etc., it can adjust suitably.

-Acrylic resin-
There is no restriction | limiting in particular as said acrylic resin, According to the objective, it can select suitably, For example, the thing similar to the said acrylic resin described in description of the said insulating contact bonding layer etc. are mentioned.
There is no restriction | limiting in particular as content of the said acrylic resin in the said electroconductive particle content layer, According to the objective, it can select suitably.

-Polymerization initiator-
The polymerization initiator is not particularly limited as long as it can polymerize the acrylic resin, and can be appropriately selected according to the purpose. The polymerization initiator generates free radicals by heat or light. Is preferred.
The polymerization initiator that generates free radicals by heat or light is preferably an organic peroxide, and has a half-life temperature of 90.0 ° C. to 154.0 ° C. for 1 minute from the viewpoint of better connection resistance and particle capture rate. Some organic peroxides are more preferred.
In order to perform bonding in 10 seconds or less, it is preferable that the half-life temperature for 1 minute is 154.0 ° C. or less. If the 1-minute half-life temperature is less than 90.0 ° C., storage may be difficult.
Examples of the polymerization initiator that generates free radicals by heat include organic peroxides and azo compounds. Examples of the organic peroxide include benzoyl peroxide, tertiary butyl peroxide, di-2-ethylhexyl peroxydicarbonate, dilauroyl peroxide, 1,1-di (t-butylperoxy) cyclohexane, and the like. Is mentioned. Examples of the azo compound include 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile) (V-65), 2 , 2′-azobisisobutyronitrile (AIBN), 2,2′-azobis (2-methylbutyronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), 2,2′-azobis [ 2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide], dimethyl 2,2′-azobis (2-methoxypropionate) and the like. These may be used individually by 1 type and may use 2 or more types together.
Examples of the polymerization initiator that generates a free radical by light include alkylphenone, benzoin, benzophenone, dicarbonyl compound, thioxanthone, acylphosphine oxide, and derivatives thereof. These may be used individually by 1 type and may use 2 or more types together.
There is no restriction | limiting in particular as content of the said polymerization initiator in the said electroconductive particle content layer, Although it can select suitably according to the objective, 1 mass% with respect to the resin component of the said electroconductive particle content layer. -12% by mass is preferable, 1% by mass to 10% by mass is more preferable, and 3% by mass to 8% by mass is particularly preferable. When the content is less than 1% by mass, the curing rate of the anisotropic conductive film may decrease. When the content exceeds 12% by mass, the insulating adhesive layer does not flow efficiently, and the particle capture rate. May decrease.
Here, the resin component refers to a component excluding the conductive particles in the conductive particle-containing layer, and examples thereof include organic materials such as the acrylic resin, the polymerization initiator, a film-forming resin described later, and a silane coupling agent. Ingredients.

There is no restriction | limiting in particular as average thickness of the said electroconductive particle content layer, Although it can select suitably by the relationship with the average particle diameter of the said electroconductive particle and the thickness of the said insulating contact bonding layer, 2 micrometers-10 micrometers are sufficient. 4 μm to 10 μm is preferable. When the average thickness is less than 2 μm, the conductive particles may not be sufficiently filled between the terminals of the substrate and the terminals of the electronic component, and when it exceeds 10 μm, connection failure may be caused.
Moreover, it is preferable that the average thickness of the said electroconductive particle content layer is thinner than the average thickness of the said insulating contact bonding layer from the point that a particle capture rate is more excellent.
Here, the said average thickness is an average value at the time of measuring the thickness of five places of the said electroconductive particle content layer arbitrarily.

-Other ingredients-
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, film forming resin, a silane coupling agent, etc. are mentioned. Examples of the film-forming resin and the silane coupling agent include those similar to the film-forming resin and the silane coupling agent described in the description of the insulating adhesive layer.

<Board>
The substrate is not particularly limited as long as it is a substrate having terminals, which is an object of anisotropic conductive connection using the anisotropic conductive film, and can be appropriately selected according to the purpose. , ITO glass substrate, flexible substrate, rigid substrate and the like.
There is no restriction | limiting in particular as a magnitude | size, a shape, and a structure of the said board | substrate, According to the objective, it can select suitably.

<Electronic parts>
The electronic component is not particularly limited as long as the electronic component is an object of anisotropic conductive connection using the anisotropic conductive film, and can be appropriately selected according to the purpose. A chip, a TAB tape, a liquid crystal panel, etc. are mentioned. Examples of the IC chip include a liquid crystal screen control IC chip in a flat panel display (FPD).

  Since the anisotropic conductive film of the present invention does not contain a polymerization initiator in the insulating adhesive layer, in the anisotropic conductive connection, when the electronic component placed on the anisotropic conductive film is pushed in The insulating adhesive layer flows efficiently in a short time. Then, the insulating adhesive layer flows between the terminals of the electronic component, and the number of conductive particles flowing between the terminals of the electronic component decreases. As a result, the number of conductive particles in contact with the terminal is increased, and the particle capture rate is improved. In addition, since the insulating adhesive layer does not contain a polymerization initiator, the insulating adhesive layer is not cured even when heated and pressed at a low speed, and the conductive particles in the conductive particle-containing layer are not cured. It can be pushed in sufficiently and a sufficient connection resistance can be obtained. Furthermore, since the number of conductive particles flowing between the terminals of the electronic component is reduced, it is possible to cope with fine pitch (narrow pitch) anisotropic conductive connection.

(Manufacturing method of joined body and joined body)
The manufacturing method of the joined body of the present invention includes at least a pasting step, a placing step, and a heating and pressing step, and further includes other steps as necessary.
In the manufacturing method of the bonded body, the bonded body is manufactured by anisotropically connecting the terminal of the substrate and the terminal of the electronic component.
The joined body of the present invention is produced by the method for producing a joined body of the present invention.

<Paste process>
The sticking step is not particularly limited as long as it is a step of sticking the anisotropic conductive film on the terminal of the substrate so that the conductive particle-containing layer of the anisotropic conductive film is in contact with the terminal of the substrate. It can be appropriately selected depending on the purpose.
There is no restriction | limiting in particular as said board | substrate, According to the objective, it can select suitably, For example, the thing similar to the said board | substrate described in description of the said anisotropic conductive film of this invention etc. are mentioned.
The anisotropic conductive film is the anisotropic conductive film of the present invention.

<Installation process>
The placing step is not particularly limited as long as it is a step of placing an electronic component on the anisotropic conductive film, and can be appropriately selected according to the purpose.
In the placing step, the electronic component is placed on the insulating adhesive layer of the anisotropic conductive film.
At this time, anisotropic conductive connection is not performed.

<Heat pressing process>
The heating and pressing step is not particularly limited as long as it is a step of heating and pressing the electronic component with a heating and pressing member, and can be appropriately selected according to the purpose.
Examples of the heating and pressing member include a pressing member having a heating mechanism. Examples of the pressing member having the heating mechanism include a heat tool.
There is no restriction | limiting in particular as temperature of the said heating, Although it can select suitably according to the objective, 140 to 200 degreeC is preferable.
There is no restriction | limiting in particular as the pressure of the said press, Although it can select suitably according to the objective, 0.1 MPa-10 MPa are preferable.
There is no restriction | limiting in particular as time of the said heating and press, According to the objective, it can select suitably, For example, 0.5 second-120 second is mentioned.

  Through the above steps, the terminal of the substrate and the terminal of the electronic component can be anisotropically conductively connected, and a joined body can be manufactured.

An example of the anisotropic conductive film, the method for producing a joined body, and the joined body of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view of the anisotropic conductive film of the present invention. The anisotropic conductive film 1 includes a conductive particle-containing layer 2 and an insulating adhesive layer 3, and the conductive particle-containing layer 2 contains conductive particles 4.
2A to 2C are schematic views for explaining the method for manufacturing a joined body according to the present invention. First, an anisotropic conductive film is affixed on the substrate 5 having terminals 6 so that the conductive particle-containing layer 2 of the anisotropic conductive film is in contact with the terminals 6 (FIG. 2A). Subsequently, the electronic component 8 having the terminals 7 is placed on the insulating adhesive layer 3 of the attached anisotropic conductive film. At this point, the substrate 5 and the electronic component 8 are not yet anisotropically conductively connected (FIG. 2B). Then, the substrate 5 and the electronic component 8 are anisotropically conductively connected by heating and pressing the electronic component 8 from above the electronic component 8 with a heat pressing member (not shown) (FIG. 2C). Under the present circumstances, since the insulating contact bonding layer 3 of the anisotropic conductive film of this invention does not contain a polymerization initiator, it flows efficiently in a short time. Then, the insulating adhesive layer 3 flows between the terminals 7 of the electronic component 8, and the number of conductive particles 4 flowing between the terminals 7 of the electronic component 8 decreases. As a result, the number of the conductive particles 4 between the terminals 6 and 7 is increased, and a bonded body with an improved particle capture rate can be manufactured. Further, since the insulating adhesive layer 3 does not contain a polymerization initiator, the insulating adhesive layer 3 is not cured even when heating and pressing are performed at a low speed, and the conductive particles 4 of the conductive particle-containing layer 2 are not cured. Can be pushed in sufficiently, and a sufficient connection resistance can be obtained. Further, the number of the conductive particles 4 flowing between the terminals of the electronic component 8 is reduced, so that a joined body having a fine pitch (narrow pitch) can be manufactured.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

(Example 1)
<Preparation of anisotropic conductive film>
-Production of conductive particle-containing layer-
60 parts by mass of a phenoxy resin (product name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel-Cytec), and a silane coupling agent (product name: KBM-503, Adhesion composed of 2 parts by mass of Shin-Etsu Chemical Co., Ltd.) and 1 part by mass of a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) Conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed in the agent so that the particle density was 8,000 particles / mm ² . The dispersed compound was applied onto the release-treated PET so that the average thickness after drying was 8 μm, thereby preparing a conductive particle-containing layer.

-Production of insulating adhesive layer-
60 parts by mass of a phenoxy resin (product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel-Cytec), and a silane coupling agent (product name: KBM-503, A composition composed of 2 parts by mass) (manufactured by Shin-Etsu Chemical Co., Ltd.) was applied onto the peeled PET so that the average thickness after drying was 16 μm, and an insulating adhesive layer was produced.

  The conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film.

<Evaluation>
The following evaluation was performed about the obtained anisotropic conductive film. The results are shown in Table 1-1.

[Connection resistance]
When a current of 1 mA is passed by a four-terminal method using a digital multimeter (product number: digital multimeter 7555, manufactured by Yokogawa Electric Corporation) for a joined body produced by the following “normal evaluation” or “indentation evaluation” The connection resistance was measured.

-Normal evaluation-
As an evaluation substrate, COF (evaluation substrate, 50 μm pitch, Cu 8 μm thickness—Sn plating, 38 μm thickness—S′perflex substrate) and ITO coating glass (evaluation substrate, entire surface ITO coating, glass thickness 0.7 mm) ) To make anisotropic conductive connection.
Specifically, the anisotropic conductive film produced in Example 1 was slit to a width of 1.5 mm, and attached to the ITO coating glass so that the conductive particle-containing layer was in contact with the ITO coating glass.
After the COF was placed and temporarily fixed thereon, a heat tool having a width of 1.5 mm and a buffer material (Teflon having a thickness of 100 μm) was used for pressure bonding conditions of 180 ° C., 3.5 MPa, 6 seconds (tool speed of 10 mm / sec, An anisotropic conductive connection was made at a stage temperature of 40 ° C. to produce a joined body.

-Indentation evaluation-
In the above-mentioned normal evaluation, the same as the above-mentioned normal evaluation, except that the tool speed at the time of crimping was 1 mm / sec, the stage temperature was 100 ° C., and the anisotropic conductive connection was performed at the crimping conditions of 180 ° C. and 3.5 MPa for 6 seconds. Thus, a joined body was produced.

(Particle capture rate)
The particle capture rate was measured by the following method.
(1) First, the number of conductive particles in the conductive particle-containing layer before pressure bonding between the COF and the ITO coating glass was counted using a microscope.
(2) Next, the COF and the ITO coating glass were pressure-bonded under the same conditions as in the normal evaluation, and then the number of the conductive particles captured on the terminals was counted using a microscope. At this time, only the conductive particles that are clearly determined to be involved in the conduction are counted, and only the conductive particles existing at the end of the terminal or a part thereof protrudes from the terminal. The number of conductive particles and conductive particles that are not sufficiently crushed are not counted.
(3) Then, the ratio of the number of the conductive particles per unit area of the terminal before and after pressure bonding between the COF and the ITO coating glass, which was obtained by the above (1) and (2), was calculated. This ratio was defined as the particle capture rate.

(Example 2)
<Preparation of anisotropic conductive film>
In Example 1, except that the polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) of the conductive particle-containing layer was changed to 3 parts by mass. In the same manner as in Example 1, an anisotropic conductive film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.

Example 3
<Preparation of anisotropic conductive film>
In Example 1, except that the polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) of the conductive particle-containing layer was changed to 8 parts by mass. In the same manner as in Example 1, an anisotropic conductive film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.

Example 4
<Preparation of anisotropic conductive film>
In Example 1, except that the polymerization initiator of the conductive particle-containing layer was replaced with Perroyl L (Dilauroyl peroxide, manufactured by NOF Corporation), and the amount of the polymerization initiator was changed to 4 parts by mass. In the same manner, an anisotropic conductive film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-1.

(Example 5)
<Preparation of anisotropic conductive film>
In Example 4, anisotropic conductivity was conducted in the same manner as in Example 4 except that the polymerization initiator of the conductive particle-containing layer was changed to perloyl OPP (di-2-ethylhexyl peroxydicarbonate, manufactured by NOF Corporation). A film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.

(Example 6)
<Preparation of anisotropic conductive film>
In Example 1, except that the polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) of the conductive particle-containing layer was changed to 12 parts by mass. In the same manner as in Example 1, an anisotropic conductive film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.

(Example 7)
<Preparation of anisotropic conductive film>
In Example 1, an anisotropic conductive film was obtained in the same manner as in Example 1 except that the acrylic resin of the insulating adhesive layer was replaced with an acrylic resin (product name: U-4HA, manufactured by Shin-Nakamura Chemical Co., Ltd.). It was.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.

(Example 8)
<Preparation of anisotropic conductive film>
In Example 1, an anisotropic conductive film was prepared in the same manner as in Example 1 except that the acrylic resin of the conductive particle-containing layer was replaced with an acrylic resin (product name: U-4HA, manufactured by Shin-Nakamura Chemical Co., Ltd.). Obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-2.

(Comparative Example 1)
<Preparation of anisotropic conductive film>
-Production of conductive particle-containing layer-
60 parts by mass of a phenoxy resin (product name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel-Cytec), and a silane coupling agent (product name: KBM-503, Adhesion composed of 2 parts by mass of Shin-Etsu Chemical Co., Ltd. and 2 parts by mass of a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) Conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed in the agent so that the particle density was 8,000 particles / mm ² . The dispersed compound was applied onto the release-treated PET so that the average thickness after drying was 8 μm, thereby preparing a conductive particle-containing layer.

-Production of insulating adhesive layer-
60 parts by mass of a phenoxy resin (product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of an acrylic resin (product name: EB-600, manufactured by Daicel-Cytec), and a silane coupling agent (product name: KBM-503, A composition composed of 2 parts by mass of Shin-Etsu Chemical Co., Ltd. and 2 parts by mass of a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation). The product was coated on the peeled PET so that the average thickness after drying was 16 μm, and an insulating adhesive layer was produced.

The conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.

(Comparative Example 2)
<Preparation of anisotropic conductive film>
In Comparative Example 1, except that the polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) of the conductive particle-containing layer was changed to 6 parts by mass. In the same manner as in Comparative Example 1, an anisotropic conductive film was obtained.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.

(Comparative Example 3)
<Preparation of anisotropic conductive film>
In Comparative Example 1, a polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane, manufactured by NOF Corporation) for the conductive particle-containing layer and the insulating adhesive layer was polymerized. An anisotropic conductive film was obtained in the same manner as in Example 1 except that the agent was replaced with the agent (product name: perloyl L, dilauroyl peroxide, manufactured by NOF Corporation).
Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.

(Comparative Example 4)
<Preparation of anisotropic conductive film>
In Comparative Example 1, the conductive particle-containing layer does not contain a polymerization initiator, and the insulating adhesive layer polymerization initiator (product name: perhexa C, 1,1-di (t-butylperoxy) cyclohexane , Manufactured by NOF Corporation) was replaced with 4 parts by mass, and an anisotropic conductive film was obtained in the same manner as in Comparative Example 1.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.

(Comparative Example 5)
<Preparation of anisotropic conductive film>
-Production of conductive particle-containing layer-
50 parts by mass of a phenoxy resin (product name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by mass of an epoxy resin (product name: EP-828, manufactured by Mitsubishi Chemical Corporation), and a silane coupling agent (product name: KBM-503, Shin-Etsu) Conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) in an adhesive composed of 2 parts by mass and 2 parts by mass of imidazole curing agent (product name: Novacure 3941HP, manufactured by Asahi Kasei Chemicals) Was dispersed to a particle density of 8,000 particles / mm ² . The dispersed compound was applied onto the release-treated PET so that the average thickness after drying was 8 μm, thereby preparing a conductive particle-containing layer.

-Production of insulating adhesive layer-
50 parts by mass of a phenoxy resin (product name: YP70, manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by mass of an epoxy resin (product name: EP-828, manufactured by Mitsubishi Chemical Corporation), and a silane coupling agent (product name: KBM-503, Shin-Etsu) A compound composed of 2 parts by mass of Chemical Industries Co., Ltd. was applied onto the peeled PET so that the average thickness after drying was 16 μm, and an insulating adhesive layer was produced.

The conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 ° C. using a roll laminator to obtain an anisotropic conductive film.
Evaluation similar to Example 1 was performed. The results are shown in Table 1-3.

In Table 1-1 and Table 1-2, the 1-minute half-life temperature (° C.) of each polymerization initiator is as follows.
(A): 90.6 ° C., paroyl OPP
(B): 116.4 ° C., Parroyl L
(C): 153.8 ° C., perhexa C

From the results of Examples 1 to 8, the anisotropic conductive film of the present invention is a result that the connection resistance is sufficiently low and the particle trapping rate is excellent in both the normal evaluation and the indentation evaluation in which indentation is performed at a low speed. there were.
In particular, in Examples 2 to 4 in which the content of the polymerization initiator was 3% by mass to 8% by mass, both the connection resistance and the particle capture rate were more excellent. In particular, in Example 4 using Parroyl L having a 1-minute half-life temperature of 116.4 ° C., both the connection resistance and the particle trapping rate were particularly excellent.
In Example 6 in which the content of the polymerization initiator exceeds 8% by mass, the connection resistance at the time of indentation was slightly higher than those in Examples 2 to 4.

In Comparative Examples 1 to 3 containing a polymerization initiator in both the insulating adhesive layer and the conductive particle-containing layer, the fluidity of the insulating adhesive layer at the time of pressure bonding is low, and the particle trapping rate is low compared to the examples. As a result. In Comparative Example 3, the connection resistance during pressing was high.
Further, Comparative Example 4 containing the polymerization initiator only in the insulating adhesive layer does not contain the polymerization initiator in the conductive particle-containing layer, so that the conductive particles flow at the time of pressure bonding, resulting in a low particle capture rate. It was.
In Comparative Example 5 in which the binder is an epoxy resin, sufficient curing was not obtained in the short-time pressure bonding, resulting in a high connection resistance and a low particle capture rate.

  The anisotropic conductive film of the present invention is suitable for anisotropic conductive connection between a substrate and an electronic component because it has an excellent particle trapping rate and a sufficiently low connection resistance can be obtained even for a short time.

DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film 2 Conductive particle content layer 3 Insulating adhesive layer 4 Conductive particle 5 Base material 6 Terminal 7 Terminal 8 Electronic component

Claims (7)

An anisotropic conductive film for anisotropic conductive connection between a terminal of a substrate and a terminal of an electronic component,
An insulating adhesive layer containing an acrylic resin;
Having conductive particles, an acrylic resin, and a conductive particle-containing layer containing a polymerization initiator,
Of the insulating adhesive layer and the conductive particle-containing layer, only the conductive particle-containing layer contains the polymerization initiator.   The anisotropic conductive film according to claim 1, wherein the polymerization initiator is an organic peroxide.   The anisotropic conductive film according to claim 2, wherein the organic peroxide has a one-minute half-life temperature of 90.0 ° C to 154.0 ° C.   The content of the organic peroxide in a conductive particle content layer is 3 mass%-8 mass% with respect to the resin component in the said conductive particle content layer, The difference in any one of Claim 2 to 3 Isotropic conductive film. The average thickness of the conductive particle-containing layer is 2 μm to 10 μm,
The anisotropic conductive film in any one of Claim 1 to 4 whose average thickness of an insulating contact bonding layer is 5 micrometers-25 micrometers. A sticking step of attaching the anisotropic conductive film according to any one of claims 1 to 5 on the terminal of the substrate so that the conductive particle-containing layer of the anisotropic conductive film is in contact with the terminal of the substrate. When,
A placing step of placing an electronic component on the anisotropic conductive film;
A heating and pressing step of heating and pressing the electronic component with a heating and pressing member,
A method for manufacturing a joined body, wherein the terminals of the substrate and the terminals of the electronic component are anisotropically conductively connected. A joined body produced by the method for producing a joined body according to claim 6.

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