JP5681937B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a semiconductor device and a method for manufacturing the same, and is particularly suitable for application to a semiconductor device using a gallium nitride (GaN) -based semiconductor.

  If high-value-added semiconductors can be obtained with high quality on low-priced dissimilar substrates, the industrial value is very high, and research and development have been conducted for a long time to realize this. In particular, in the growth of gallium arsenide (GaAs) -based semiconductor thin films on silicon (Si) substrates and GaN-based semiconductor thin films on sapphire substrates, relatively good semiconductor thin films have been obtained using so-called buffer layer technology and have already been put into practical use. It has become. However, in the conventional buffer layer technology, since the grown semiconductor thin film has a large number of defects and threading dislocations, it is limited to application to a limited device such as a light emitting diode (LED).

The technology that brought a new breakthrough to this situation is the selective area growth (SAG) technology. For example, A. Usui et al. Used a substrate obtained by growing a GaN layer on a sapphire substrate by applying a known buffer layer technology as a base substrate, and an insulating film made of silicon dioxide (SiO ₂ ) as a growth mask thereon. Threaded dislocations in the GaN layer are dramatically increased by arranging the GaN layer selectively in the stripe-free portion (window) and then growing the GaN layer laterally on the insulating film. (Non-patent document 1). This technique has already been attempted in 1982 in the growth of GaAs on a Si substrate (Non-patent Document 2). The purpose of this method is to block the propagation of threading dislocations from the underlying layer with an insulating film, and to reduce threading dislocations dramatically by lateral growth of the GaN layer on this insulating film. This method is often called ELO (Epitaxial Lateral Overgrowth).

  In addition, selective growth of GaN on a Si substrate with a thin AlGaN layer as an intermediate layer was already reported by Y. Kawaguchi et al. In 1988. According to this, ELO is basically possible, and GaN crystals An orientation relationship between the orientation and the underlying Si substrate is given (Non-Patent Document 3).

  A growth mask used when a GaN-based semiconductor is grown by the ELO method is generally composed of a striped mask portion having a width of 3 to 10 μm and a striped window having a width similar to that of the mask portion. ing. In this case, the GaN layer laterally grown from the window on the growth mask collides with the GaN layer laterally grown from the adjacent window, and covers the growth mask to form an integral GaN layer. In the GaN layer obtained in this way, in the window region, threading dislocations grow from the bottom surface, and the merged portion has many dislocations due to lattice mismatch. Therefore, these portions cannot be used as the active region of the device, and are on the stripe. A stripe-shaped active region must be formed in a limited region. Although this method has been tried to be applied to the production of a narrow stripe semiconductor laser, it has not been put into practical use.

A. Usui, H. Sunakawa, A. Sasaki, and A. Yamaguchi: Jpn. J. Appl. Phys., 36, L899 (1997) B-Y.Ysauer et.al.:Appl.Phys.Lett.,41,347 (1982) Y. Kawaguchi et.al., Jpn.J.Appl.Phys., 37 (1998) p.L966

  In general, since the base substrate and the semiconductor layer are made of different materials, their thermal expansion coefficients are different from each other. When the substrate temperature is returned to room temperature after the growth of the semiconductor layer, a compressive or tensile stress is generated in the upper semiconductor layer, and the entire substrate is Is greatly curved. For example, when a GaN layer is grown on the sapphire substrate by the ELO method, the substrate is convex upward. Conversely, when a GaN layer is grown on an Si substrate or a silicon carbide (SiC) substrate by the ELO method, the substrate is convex downward. This curvature of the substrate becomes very prominent as the semiconductor layer becomes thicker, and in a severe case, the semiconductor layer cracks. Further, the curvature of the substrate makes the lithography process for forming the element extremely difficult even if the semiconductor layer is not cracked. In addition, since the portion of the GaN layer on the insulating film with few threading dislocations is limited to a narrow region of about several μm in the prior art, only a stripe device having a width of several μm such as a semiconductor laser can be manufactured. It was.

The object of the present invention is to solve the above-mentioned problems of the prior art at once.
That is, the problem to be solved by the present invention is that an island-like GaN-based semiconductor layer made of high-quality semiconductor crystals can be grown on a heterogeneous substrate while suppressing the curvature of the substrate, and the GaN-based semiconductor layer is extremely thick. However, it is an object of the present invention to provide a semiconductor element that can suppress the occurrence of cracks and the like and can easily realize a large-area semiconductor element and a method for manufacturing the same.

In order to solve the above problems, the present invention provides:
A substrate made of a material different from a GaN-based semiconductor;
A growth mask provided directly or indirectly on the substrate and having one or more stripe-shaped openings;
One or more island-shaped GaN-based semiconductor layers grown in the (0001) plane orientation on the substrate using the growth mask,
The stripe-shaped opening of the growth mask extends in a direction parallel to the <1-100> direction of the GaN-based semiconductor layer.

In this semiconductor element, the growth mask is provided directly on the substrate made of a material different from that of the GaN-based semiconductor, that is, in direct contact, or indirectly through an intermediate layer made of the GaN-based semiconductor. Examples of substrates made of a material different from GaN-based semiconductors include sapphire substrates and Si substrates, but are not limited to these, and GaN-based semiconductor layers can be grown in the (0001) plane orientation. As long as it is any substrate. In this semiconductor element, typically, the side surface of the island-shaped GaN-based semiconductor layer has a (1-10α) plane (α is an arbitrary integer), an (11-2β) plane (β is an arbitrary integer) or these Or the side surface of the island-like GaN-based semiconductor layer includes a (1-10α) plane (α is an arbitrary integer). The growth mask is formed of an insulating film such as a SiO ₂ film or a SiN film. In a preferred example, the growth mask is respectively in a first direction parallel to the <11-20> direction of the GaN-based semiconductor layer and a second direction parallel to the <1-100> direction of the GaN-based semiconductor layer. A region between a plurality of stripe-shaped openings arranged periodically in the first period and the second period and extending in the second direction, and a pair of adjacent stripe-shaped openings in the first direction And auxiliary stripe-shaped openings provided so as to overlap each other by a predetermined distance from the opposite end portions of the pair of stripe-shaped openings adjacent to each other in the second direction. If necessary, an auxiliary stripe-shaped opening may not be provided. In another preferred example, the growth mask is periodically arranged in a first direction parallel to the <11-20> direction of the GaN-based semiconductor layer, and in the <1-100> direction of the GaN-based semiconductor layer. A plurality of stripe-shaped openings extending in a parallel second direction and periodically arranged in the first direction at the same period as the stripe-shaped opening and shifted by a half period with respect to the stripe-shaped opening. And a plurality of stripe-like openings extending in the second direction so as to overlap with the end portions of the stripe-like openings in the second direction by a predetermined distance. The GaN-based semiconductor layer is appropriately configured according to the semiconductor element, but is generally configured by two or more layers including at least one of an n-type layer, an undoped layer, and a p-type layer. Specifically, the layers constituting the GaN-based semiconductor layer are, for example, a GaN layer, an AlGaN layer, an AlGaInN layer, an InGaN layer, or the like. When the semiconductor element has a plurality of GaN-based semiconductor layers, the interval between adjacent island-shaped GaN-based semiconductor layers is generally 30 μm or less, preferably 10 μm or less, but is not limited thereto. Absent. In this semiconductor element, the number of electrodes corresponding to the type of the semiconductor element is provided at a predetermined portion. Examples of the semiconductor element include a Schottky diode, a light emitting diode, a semiconductor laser, a photodiode, and a transistor, but are not limited thereto.

In addition, this invention
Forming a growth mask having a plurality of stripe-shaped openings directly or indirectly on a substrate made of a material different from a GaN-based semiconductor;
Using the growth mask, a plurality of island-shaped GaN-based semiconductor layers are oriented in the (0001) plane on the substrate, and the <1-100> direction of the GaN-based semiconductor layer is the stripe-shaped opening of the growth mask. And a step of growing so as to extend in a direction parallel to the semiconductor device.

  In the invention of the method for manufacturing a semiconductor element, what has been described in relation to the invention of the semiconductor element is valid as long as the method is not contrary to the nature.

  In the manufacturing method of the semiconductor element, after a GaN-based semiconductor layer is grown on the substrate, a first support substrate is bonded to the upper surface side of the GaN-based semiconductor layer, and the first support substrate and the GaN-based semiconductor are bonded. The method may further include a step of peeling the layer from the substrate. In addition, after peeling the first support substrate and the GaN-based semiconductor layer from the substrate, one or more of the exposed surface of the GaN-based semiconductor layer may be provided. It may further include a step of forming an electrode. In the above semiconductor device manufacturing method, if necessary, the GaN-based semiconductor layer is grown on the substrate, and then the GaN-based semiconductor layer is bonded to the first support substrate on the upper surface side of the GaN-based semiconductor layer. The method further includes the step of forming one or a plurality of electrodes on the upper surface of the semiconductor layer, or the step of removing at least part, preferably almost all, most preferably all of the growth mask, or both of them. . Moreover, a conductor thin film or a conductor line is formed on the main surface of the first support substrate on the side bonded to the GaN-based semiconductor layer as necessary. In the method of manufacturing the semiconductor element, the first support substrate and the GaN-based semiconductor layer are peeled off from the substrate, if necessary, and then the second support substrate is bonded to the exposed surface side of the GaN-based semiconductor layer. It may have the process of carrying out. The first support substrate and the second support substrate are made of an elemental semiconductor, a compound semiconductor, a metal, an alloy, a nitride ceramic, an oxide ceramic, diamond, carbon, plastic, or the like, and a single layer structure made of these materials Or a multilayer structure. For bonding the first support substrate and the second support substrate, an adhesive metal such as solder, an organic adhesive, or the like can be used, and is selected as necessary.

In addition, this invention
Forming a growth mask having a plurality of stripe-shaped openings directly or indirectly on a substrate made of a material different from a GaN-based semiconductor;
Using the growth mask, a plurality of island-shaped GaN-based semiconductor layers are oriented in the (0001) plane on the substrate, and the <1-100> direction of the GaN-based semiconductor layer is the stripe-shaped opening of the growth mask. Growing so as to extend in a direction parallel to
Forming one or more first electrodes on the upper surface of the GaN-based semiconductor layer;
Removing at least a portion of the growth mask after forming the first electrode;
After removing at least a part of the growth mask, bonding a first support substrate to the top surface of the GaN-based semiconductor layer on which the first electrode is formed via an organic adhesive layer;
Peeling the first support substrate and the GaN-based semiconductor layer from the substrate;
Forming the one or more second electrodes on the exposed surface of the GaN-based semiconductor layer after peeling the first support substrate and the GaN-based semiconductor layer from the substrate;
And a step of peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the first support substrate.

  Typically, after forming the first electrode, substantially all of the growth mask, most preferably all, is removed. By doing so, the first support substrate and the GaN-based semiconductor layer can be easily separated from the substrate. The organic adhesive layer may be formed on one main surface of the first support substrate, or may be formed on the upper surface side where the first electrode of the GaN-based semiconductor layer is formed. Typically, after the second support substrate is attached to the second electrode side, the GaN-based semiconductor layer on which the first electrode and the second electrode are formed is peeled from the first support substrate. The first support substrate is made of an elemental semiconductor, a compound semiconductor, a metal, an alloy, a nitride ceramic, an oxide ceramic, diamond, carbon, plastic, or the like, and has a single layer structure made of these materials. It may have a multilayer structure. Typically, a dicing tape or a stretched tape is used as the second support substrate, but the second support substrate is not limited thereto. If necessary, after forming the second electrode, before peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the first support substrate, the entire surface including the second electrode The method further includes forming a metal layer. This metal layer can be used as a pad electrode. If necessary, after forming the metal layer, before separating the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the first support substrate, one or more GaN-based semiconductor layers The method further includes a step of forming a groove in the metal layer every time. As long as the other is not contrary to the nature, what has been described in relation to the invention of the semiconductor element and the method for manufacturing the semiconductor element is valid.

In addition, this invention
Forming a growth mask having a plurality of stripe-shaped openings directly or indirectly on a substrate made of a material different from a GaN-based semiconductor;
Using the growth mask, a plurality of island-shaped GaN-based semiconductor layers are oriented in the (0001) plane on the substrate, and the <1-100> direction of the GaN-based semiconductor layer is the stripe-shaped opening of the growth mask. Growing so as to extend in a direction parallel to
Forming one or more first electrodes on the upper surface of the GaN-based semiconductor layer;
Removing at least a portion of the growth mask after forming the first electrode;
Removing at least a portion of the growth mask and then peeling the GaN-based semiconductor layer on which the first electrode is formed from the substrate;
After the GaN-based semiconductor layer on which the first electrode is formed is peeled from the substrate, the first electrode side of the GaN-based semiconductor layer on which the first electrode is formed is connected to the first support substrate. A process of pressing and adhering to the first organic adhesive layer formed on one main surface;
Forming a sidewall spacer made of an insulator on the side surface of the GaN-based semiconductor layer;
After the GaN-based semiconductor layer having the sidewall spacer formed on the side surface is peeled off from the first support substrate by vacuum adsorption, a second organic adhesion formed on one main surface of the second support substrate Bonding a plurality of the GaN-based semiconductor layers to each other in a state of being close to each other via the sidewall spacer;
Forming one or a plurality of second electrodes on exposed surfaces of the plurality of GaN-based semiconductor layers bonded to the second organic-based adhesive layer of the second support substrate;
And a step of peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the second support substrate.

  Typically, after forming the first electrode, substantially all of the growth mask, most preferably all, is removed. By doing so, the GaN-based semiconductor layer on which the first electrode is formed can be easily peeled from the substrate. The method for peeling the GaN-based semiconductor layer on which the first electrode is formed from the substrate is not particularly limited. For example, the first electrode side of the GaN-based semiconductor layer on which the first electrode is formed is vacuum-adsorbed to form a substrate. It can peel by applying force in the direction away from. The first support substrate and the second support substrate are made of an elemental semiconductor, a compound semiconductor, a metal, an alloy, a nitride ceramic, an oxide ceramic, diamond, carbon, plastic, or the like, and a single layer structure made of these materials Or a multilayer structure. If necessary, after forming the second electrode, before peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the second support substrate, the entire surface including the second electrode The method further includes forming a metal layer. This metal layer can be used as a pad electrode. In addition, if necessary, after forming the metal layer, before separating the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the second support substrate, one or more GaN-based layers The method further includes forming a groove in the metal layer for each semiconductor layer. Furthermore, if necessary, after forming a groove in the metal layer, the surface on the metal layer side is affixed to a dicing tape or a stretched tape, and after peeling the second support substrate, the dicing tape or the stretched tape is stretched. Accordingly, the interval between the GaN-based semiconductor layers may be increased, and the GaN-based semiconductor layer on which the first electrode and the second electrode are formed may be mounted. As long as the other is not contrary to the nature, what has been described in relation to the invention of the semiconductor element and the method for manufacturing the semiconductor element is valid.

According to this invention, the crystallinity of the island-shaped GaN-based semiconductor layer grown laterally on the growth mask from the stripe-shaped opening of the growth mask is extremely high, and a GaN-based semiconductor layer made of a high-quality semiconductor crystal can be obtained. it can. In addition, when a plurality of island-shaped GaN-based semiconductor layers are grown, they are formed in a state of being separated from each other, that is, isolated, so that the tensile stress or compressive stress generated in each GaN-based semiconductor layer is the GaN-based semiconductor layer. It is limited only within the semiconductor layer, and other GaN-based semiconductor layers are not affected by these tensile stresses or compressive stresses. Further, since the growth mask and the GaN-based semiconductor layer are not chemically bonded, the stress in the GaN-based semiconductor layer can be relieved by the slip that occurs at the interface between the growth mask and the GaN-based semiconductor layer. In addition, since there is a gap between the island-shaped GaN-based semiconductor layers, the entire substrate on which the plurality of island-shaped GaN-based semiconductor layers are grown is flexible and easily deforms when an external force is applied. Can bend. Therefore, even if the substrate is warped, curved or deformed slightly, it can be easily corrected by a small external force, and the substrate can be handled by vacuum chucking. The process can be executed easily. As described above, an island-like GaN-based semiconductor layer made of a high-quality semiconductor crystal can be grown while suppressing the curvature of the substrate, and even if the GaN-based semiconductor layer is extremely thick, the occurrence of cracks can be suppressed. A semiconductor device having an area can be easily realized.
In addition, a semiconductor element in which electrodes are formed on both surfaces of a GaN-based semiconductor layer can be easily manufactured.

It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a top view which shows an example of the growth mask used in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a top view which shows the other example of the growth mask used in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a basic diagram for demonstrating the 2nd method for preventing coalescence of GaN-type semiconductor layers in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a basic diagram for demonstrating the 3rd method for preventing coalescence of GaN-type semiconductor layers in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a basic diagram for demonstrating the 3rd method for preventing coalescence of GaN-type semiconductor layers in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. It is a basic diagram for demonstrating the 4th method for preventing coalescence of GaN-type semiconductor layers in the manufacturing method of the GaN-type semiconductor element by 1st Embodiment of this invention. 3 is a drawing-substituting photograph showing a scanning electron microscope image of the surface of a GaN-based semiconductor layer grown using the growth mask shown in FIG. 2 in the method for manufacturing a GaN-based semiconductor device according to the first embodiment of the present invention. It is a drawing substitute photograph which shows the scanning electron microscope image of the surface of the GaN-type semiconductor layer grown using the growth mask in which the auxiliary | assistant stripe window is not formed. It is a top view which shows the growth mask formed in order to measure the change of the amount of horizontal growth by the angle from the <11-20> direction of the longitudinal direction of the stripe window in GaN (0001) plane growth. It is a basic diagram which shows the result of having measured the change of the amount of horizontal growth by the angle from the <11-20> direction of the longitudinal direction of the stripe window in GaN (0001) plane growth. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky diode by the 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky diode by the 2nd Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the GaN-type Schottky diode by the 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky diode by the 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky diode by the 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of GaN-type MISFET by 5th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. It is a drawing substitute photograph which shows the scanning electron microscope image of the surface of the GaN-type semiconductor layer peeled from the base substrate in the manufacturing method of the GaN-type semiconductor element by 7th Embodiment of this invention. FIG. 25 is a drawing-substituting photograph showing a scanning electron microscope image in which the end and center of the GaN-based semiconductor layer shown in FIG. 24 are enlarged. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky diode by the 8th Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the large area power GaN-type Schottky diode by 9th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type light emitting diode by 11th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the 2 terminal / 3 terminal GaN-type compound semiconductor element by 12th Embodiment of this invention. FIG. 30 is a schematic diagram illustrating an equivalent circuit of the two-terminal / three-terminal GaN-based composite semiconductor element illustrated in FIG. 29. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 13th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 13th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 13th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 13th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the semiconductor element by 14th Embodiment of this invention.

Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described.
First Embodiment A GaN-based semiconductor device and a method for manufacturing the same according to a first embodiment will be described.
In the first embodiment, as shown in FIG. 1A, first, a plurality of stripe-shaped openings (hereinafter referred to as stripe windows) 12a on the base substrate 11 and, if necessary, in addition thereto A growth mask 12 having a plurality of auxiliary stripe openings (hereinafter referred to as auxiliary stripe windows) to be described later is formed. As the base substrate 11, for example, a GaN-based semiconductor layer such as a GaN layer is placed in the (0001) plane orientation on a substrate made of a material different from the GaN-based semiconductor, such as a C-plane sapphire substrate or a (111) -plane oriented Si substrate. A grown one may be used, or a C-plane sapphire substrate may be used as it is. The thickness of a GaN-based semiconductor layer such as a GaN layer grown on a C-plane sapphire substrate or a (111) -oriented Si substrate is, for example, 1 to 2 μm, but is not limited thereto. The growth mask 12 is formed, for example, by forming an insulating film such as a SiO ₂ film on the base substrate 11 by, for example, a plasma chemical vapor deposition (CVD) method, and then performing photolithography using the SiO ₂ film using a predetermined photomask. And it can form by patterning by an etching. The thickness of the SiO ₂ film is, for example, 0.3 μm, but is not limited to this. The shape and arrangement of the stripe window 12a and auxiliary stripe window of the growth mask 12 will be described later.

Next, as shown in FIG. 1B, a GaN-based semiconductor layer 13 is grown in an island shape in the (0001) plane orientation by vapor phase growth, for example, metal organic chemical vapor deposition (MOCVD), using the growth mask 12. . In this case, first, a GaN-based semiconductor is selectively grown on the surface of the base substrate 11 exposed in the stripe window 12a, and subsequently grown laterally on the growth mask 12, whereby the GaN-based semiconductor layer 13 is grown on the growth mask 12. To do. During this growth, the growth is stopped before the island-shaped GaN-based semiconductor layer 13 collides with the adjacent island-shaped GaN-based semiconductor layer 13. The number of stripe windows 12a from which one island-like GaN-based semiconductor layer 13 is grown can be determined as necessary. FIG. 1B shows the case where one island-like GaN-based semiconductor layer 13 grows from one stripe window 12a, but one island-shaped GaN-based semiconductor layer 13 is formed from two or more stripe windows 12a. May be grown. The GaN-based semiconductor layer 13 is composed of two or more layers including at least one of an n-type layer, an undoped layer, and a p-type layer, depending on the GaN-based semiconductor element to be manufactured.
Next, the island-like GaN-based semiconductor layers 13 thus grown on the growth mask 12 are processed as necessary, and further necessary electrodes (not shown) are formed.
Thereafter, the base substrate 11 on which the element structure is formed as described above is made into a chip so that, for example, one island-like GaN-based semiconductor layer 13 is included in one chip, and a target GaN-based semiconductor element is manufactured. To do.

Details of the growth mask 12 will be described. Two examples of the growth mask 12 are shown in FIGS.
The growth mask 12 shown in FIG. 2 is parallel to the first direction parallel to the <11-20> direction of the (0001) plane GaN-based semiconductor layer 13 and to the <1-100> direction of the GaN-based semiconductor layer 13. A plurality of stripe windows 12a are arranged periodically in the second direction at periods p ₁ and p ₂ and extend in the second direction. The growth mask 12 further includes opposite end portions of a pair of adjacent stripe windows 12a in the second direction on a bisector of a region between the pair of adjacent stripe windows 12a in the first direction. The auxiliary stripe windows 12b are provided so as to overlap each other by the length q. As will be described later, the auxiliary stripe window 12b is used to prevent the GaN-based semiconductor layer 13 from rising at both ends in the <1-100> direction. The length of the stripe window 12a is a, the width is b, the length of the auxiliary stripe window 12b is c, and the width is d. A portion of the growth mask 12 other than the stripe window 12a and the auxiliary stripe window 12b becomes a mask portion 12c. The length a of the stripe window 12a is 200 to 2000 μm, the width b is 2 to 20 μm, the period p ₁ of the stripe window 12a is 6 to 120 μm, the period p ₂ is 505 to 1050 μm, and the length of the auxiliary stripe window 12b. c is approximately given by ((p ₂ −a) + (p ₁ −b−d) ÷ tan 30 °). For example, a = 800 μm, b = 5 μm, d = 5 μm, p ₁ = 55 μm, p ₂ = When it is 810 μm, it is 80 to 90 μm. The width d is the same as the width b, for example. The width of the mask portion 12c is, for example, 50 μm because it is p ₁ −b, and the overlapping length q of the auxiliary stripe window 12b and the stripe window 12a is (p ₁ −b−d) ÷ tan 30 ° ÷ 2, so that In the case of setting, it is 35 to 40 μm.

The growth mask 12 shown in FIG. 3 is periodically arranged with a period p ₁ in a _first direction parallel to the <11-20> direction of the (0001) plane oriented GaN-based semiconductor layer 13. A plurality of stripe windows 12a extending in a second direction parallel to the <1-100> direction. The growth mask 12 further has the same period p ₁ as that of the stripe window 12a in the first direction and the stripe window in order to prevent the GaN-based semiconductor layer 13 from rising at both ends in the <1-100> direction as will be described later. periodically arranged shifted by half period p _1/2 with respect to 12a, a plurality of stripe windows 12a extending in the second direction so as to overlap only end the length r of the second direction of the stripe windows 12a Have For example, the length a of the stripe window 12a is 200 to 2000 μm, the width b is 2 to 20 μm, the period p ₁ of the stripe window 12a is 6 to 120 μm, and the width of the mask portion 12c is p ₁ −b, for example. For example, when p ₁ = 55 μm and b = 5 μm, it is 50 μm. Since the overlapping length r of the end portions of the stripe window 12a is (p ₁ −bd) ÷ tan 30 ° / 2, for example, when p ₁ = 55 μm, b = 5 μm, d = 5 μm, 35-40 μm. It is.

When the GaN-based semiconductor layer 13 is grown using the growth mask 12 shown in FIG. 2 or FIG. 3, the following effects can be obtained.
Although details will be described later, in the (0001) plane growth of a GaN-based semiconductor, the lateral growth rate in the direction parallel to the plane is the largest in the <11-20> direction and the smallest in the <1-100> direction. In the growth mask 12 shown in FIG. 2 or FIG. 3, since the longitudinal direction of the stripe window 12a is the <1-100> direction, the growth rate of the GaN-based semiconductor is low at both ends of the stripe window 12a. The island-shaped GaN-based semiconductor layers 13 facing each other in the> direction do not merge, and the island-shaped GaN-based semiconductor layers 13 can be separated. At this time, the size of the island-shaped GaN-based semiconductor layer 13 in the <1-100> direction is substantially equal to the length a of the stripe window 12a.

On the other hand, since the lateral growth rate from the stripe window 12a in the <11-20> direction is very high, it is necessary to prevent the island-like GaN-based semiconductor layers 13 in the <11-20> direction from being combined. In the first method for that purpose, the distance between the stripe window 12a in the <11-20> direction and the stripe window 12a, that is, the width (p ₁ -b) of the mask portion 12c in the <11-20> direction is designed. The width of the GaN-based semiconductor layer 13 is made larger than the width in the <11-20> direction. In this method, the side surface in the direction orthogonal to the <11-20> direction of the GaN-based semiconductor layer 13 is a (11-20) plane or an inclined (11-2β) plane (β is an arbitrary integer).

  In the second method, as shown in FIG. 4, the growth rate of the growth mask 12 in the portion immediately inside the both ends of the GaN-based semiconductor layer 13 designed in the <11-20> direction is the smallest <1- A zigzag stripe window 12a having sides in the direction equivalent to the 100> direction is formed. By doing so, the lateral growth rate of the GaN-based semiconductor layer 13 in the <11-20> direction can be significantly reduced, and the island-shaped GaN-based semiconductor layers 13 in the <11-20> direction are combined. Can be prevented. In this method, the side surfaces of both ends of the GaN-based semiconductor layer 13 in the <11-20> direction are zigzag (1-100) planes or inclined (1-10α) planes (α is an arbitrary integer).

  In the third method, as shown in FIG. 5, the growth rate is the smallest on the growth mask 12 in the portion immediately inside both ends of the GaN-based semiconductor layer 13 in the <11-20> direction design. The stripe window 12a is formed so as to have step-shaped sides alternately having straight portions parallel to the <100> direction and straight portions parallel to the <11-20> direction on both sides of the mask portion 12c. In this case, when the GaN-based semiconductor layer 13 is grown, as shown in FIG. 6, the GaN-based semiconductor layer 13 is formed in the linear portions parallel to the <1-100> direction on both sides of the mask portion 12 c of the stripe window 12 a. Although it grows in the <11-20> direction, it grows in the <11-20> direction at the angle where the linear part parallel to the <1-100> direction intersects the linear part parallel to the <11-20> direction. As a result, the slow growth (1-10α) plane (α is an arbitrary integer) appears dominantly at this angle, and as a result, the side surfaces of both ends of the GaN-based semiconductor layer 13 in the <11-20> direction are zigzag. (1-100) plane. In FIG. 5, the unevenness of the pair of opposite sides of the stripe window 12a on both sides of the mask portion 12c is shifted by a half cycle in the <1-100> direction. However, the shift amount is not particularly limited. For example, they may be shifted by one period in the <1-100> direction.

  In the third method, as shown in FIG. 7, in the growth mask 12, along the stripe window 12a extending in the <1-100> direction, a side parallel to the <1-100> direction and <11-20 A plurality of square or rectangular dot-shaped openings (hereinafter referred to as dot windows) 12d having sides parallel to the> direction are formed in the <1-100> direction, preferably at regular intervals, apart from each other. In this case, when the GaN-based semiconductor layer 13 is grown, the growth of the GaN-based semiconductor layer 13 is hindered at the position of the dot window 12d, and as a result, a slow-growing (1-10α) plane (α is an arbitrary integer). Appears dominantly.

  By the way, in the island-shaped GaN-based semiconductor layer 13 surrounded by the surface including the surface having a low growth rate, when the distance between the GaN-based semiconductor layer 13 and the GaN-based semiconductor layer 13 that faces the surfaces having a low growth rate are large The following inconvenience occurs. That is, in the mask portion 12c of the growth mask 12 in the region between the GaN-based semiconductor layer 13 and the GaN-based semiconductor layer 13, since the source gas is not consumed there, the gas concentration increases, and the GaN-based semiconductor layer 13 and the GaN-based semiconductor layer are increased. A concentration gradient is generated in the direction connecting 13, and a large amount of source gas is supplied to the edge portion of the GaN-based semiconductor layer 13 by diffusion due to the concentration gradient. As a result, the thickness of the edge portion of the GaN-based semiconductor layer 13 becomes larger than the other portions, resulting in a raised shape. More specifically, the source gas is not consumed in the mask portion 12c of the growth mask 12 in the region between the GaN-based semiconductor layer 13 and the GaN-based semiconductor layer 13 in the <1-100> direction where the growth rate is the lowest. Therefore, the gas concentration increases and a concentration gradient is generated in the <1-100> direction. Due to diffusion due to this concentration gradient, a large amount of source gas is supplied to the edge portion of the GaN-based semiconductor layer 13 in the <1-100> direction. As a result, the thickness of the edge portion in the <1-100> direction of the GaN-based semiconductor layer 13 becomes larger than the other portions, resulting in a raised shape. The specific rise of the edge portion of the GaN-based semiconductor layer 13 not only causes inconvenience in the structure of the GaN-based semiconductor element, but also hinders subsequent manufacturing processes such as photolithography.

In order to prevent the non-uniformity of the thickness of the island-like GaN-based semiconductor layer 13 due to the specific rise of the edge portion described above, the GaN-based semiconductor layer 13 and the GaN-based semiconductor layer 13 are as close as possible, and the initial stage of growth. Therefore, it is necessary to prevent the in-plane non-uniformity of the source gas from occurring. For this reason, in the growth mask 12 shown in FIG. 2, adjacent to each other in the <1-100> direction on a bisector of a region between a pair of adjacent stripe windows 12a in the <11-20> direction. The auxiliary stripe window 12b is formed at the center of the region where the four end portions of the four stripe windows 12a are close to each other so that the end portions of the pair of stripe windows 12a overlap each other by the length q. In addition, the in-plane uniformity of the gas concentration is obtained by the consumption of the raw material gas due to the growth of the island-shaped GaN-based semiconductor layer 13 from the auxiliary stripe window 12b. Further, in the growth mask 12 shown in FIG. 3, the stripe windows 12a are arranged in the <11-20> direction so as to be shifted from each other by a half period p _1/2 , and the end portions of the stripe window 12a in the <1-100> direction are aligned with each other. Are overlapped by the length r, in other words, the stripe windows 12a arranged in the <11-20> direction so as to be shifted from each other by a half period p _1/2 are bitten by the length r in the <1-100> direction. Therefore, in-plane uniformity of gas concentration is obtained.

FIG. 8 shows a scanning electron microscope image (SEM image) of the surface of the GaN-based semiconductor layer 13, here the GaN layer, grown in an island shape by MOCVD using the growth mask 12 shown in FIG. 2. However, as the base substrate 11, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate was used. The growth mask 12 is formed by a SiO ₂ film having a thickness of 0.3 μm, the length a of the stripe window 12a is 800 μm, the width b is 5 μm, the period p ₁ of the stripe window 12a is 55 μm, the period p ₂ is 810 μm, and the mask portion The width 12c is 50 μm, the length c of the auxiliary stripe window 12b is 80 μm, the width d is 5 μm, the distance between the stripe window 12a in the <1-100> direction and the stripe window 12a is 10 μm, and the end of the stripe window 12a and the auxiliary The overlap length q with the stripe window 12b is 35 μm. The length c = 80 μm of the auxiliary stripe window 12b is obtained by dividing the width of 50 μm of the mask portion 12c by tan 30 °. The thickness of the GaN layer grown in an island shape is 5 μm. The GaN layer was grown at a temperature of 1100 ° C. and a pressure of 30 kPa. During the growth of this GaN layer, trimethylgallium (TMG) and ammonia (NH ₃ ) were used as source gases, and hydrogen (H ₂ ) and nitrogen (N ₂ ) were used as carrier gases. As shown in FIG. 8, a GaN-based semiconductor layer 13 grows in an elongated hexagonal island shape centering on each stripe window 12a, and a GaN-based semiconductor layer 13 in a diamond island shape centering on each auxiliary stripe window 12b. The swell at the edge portion in the <1-100> direction of the elongated hexagonal island-shaped GaN-based semiconductor layer 13 is suppressed. The arrow in FIG. 8 indicates the <1-100> direction. On the other hand, FIG. 9 shows an SEM image of the surface of the GaN-based semiconductor layer 13 grown in an island shape using the growth mask 12 not provided with the auxiliary stripe window 12b. As shown in FIG. 9, the edge portions at both ends in the <1-100> direction of the elongated hexagonal island-shaped GaN-based semiconductor layer 13 are raised.

  When one side surface of the island-shaped GaN-based semiconductor layer 13 is formed by a plane perpendicular to the <1-100> direction, the side surface growth stops as described above. When the interval is large, the thickness of the edge portion of the GaN-based semiconductor layer 13 in the <1-100> direction becomes large, which hinders the subsequent photolithography process. Therefore, it is necessary to make the interval between adjacent GaN-based semiconductor layers 13 as small as possible. According to experiments, the interval is 20 μm or less, preferably 10 μm or less.

Next, in the (0001) plane growth of a GaN-based semiconductor, the lateral growth rate in the direction parallel to the plane is the largest in the <11-20> direction and the smallest in the <1-100> direction. Explained.
As the base substrate, a C-plane sapphire substrate having a 2 μm thick GaN layer grown by MOCVD was used. Next, a 0.3 μm thick SiO ₂ film was formed on the base substrate by plasma CVD. Next, as shown in FIG. 10, stripe windows 12a having a length of 800 μm and a width of 20 μm were formed in a fan shape at an angle of 10 ° by photolithography and etching. The horizontal axis direction in FIG. 10 is an angle of 0 °. The direction of 0 ° is a direction in which the longitudinal direction of the stripe window 12a is the <11-20> direction, and is a direction in which GaN grows in the just <1-100> direction from the stripe window 12a. In this manner, the fan-shaped stripe window 12a formed on the base substrate is again introduced into the MOCVD apparatus, and a GaN layer is selectively grown from the stripe window 12a by the MOCVD method. The amount (length) was measured. The GaN layer was grown at a temperature of 1100 ° C. and a pressure of 30 kPa. During the growth of this GaN layer, TMG and NH ₃ were used as source gases, and H ₂ and N ₂ were used as carrier gases. The result is shown in FIG. The horizontal axis in FIG. 11 represents the angle of the longitudinal direction of the stripe window 12a from the GaN <11-20> direction, and the vertical axis represents the lateral growth amount on the growth mask 12. As shown in FIG. 11, when the angle from the <11-20> direction in the longitudinal direction of the stripe window 12a is 30 ° and 90 °, in other words, the longitudinal direction of the stripe window 12a is the <1-100> direction. In this case, the lateral growth amount of the GaN layer on the growth mask 12 in the <11-20> direction is about 14 μm. On the other hand, when the angles of the longitudinal direction of the stripe window 12a from the <11-20> direction are 0 ° and 60 °, in other words, the longitudinal direction of the stripe window 12a is the <11-20> direction. In this case, the lateral growth amount on the growth mask 12 in the <1-100> direction is as extremely small as about 3 μm. Therefore, it can be said that the GaN layer does not substantially grow in the <1-100> direction. The side surface of the GaN layer in the <1-100> direction tends to be inclined, and (1-10α) plane, α is between −2 and 2. α = 0 is the vertical plane. Therefore, when an island-shaped GaN-based semiconductor layer is grown, it can be defined by the (1-100) plane.

According to the first embodiment, the crystallinity of the GaN-based semiconductor layer 13 grown on the growth mask 12 from the plurality of stripe windows 12a of the growth mask 12 is very good. Further, since the plurality of island-shaped GaN-based semiconductor layers 13 are formed in a state of being separated from each other, the tensile stress or the compressive stress generated in each GaN-based semiconductor layer 13 during growth and return to room temperature is the GaN-based semiconductor layer. The other GaN-based semiconductor layers 13 are not affected by these tensile stresses or compressive stresses. Further, since the growth mask 12 and the GaN-based semiconductor layer 13 are not chemically bonded, the stress in the GaN-based semiconductor layer 13 can be relieved by a slip that occurs at the interface between the growth mask 12 and the GaN-based semiconductor layer 13. . In addition, since there is a gap between the island-shaped GaN-based semiconductor layers 13, the entire base substrate 11 on which the GaN-based semiconductor layer 13 is grown is flexible and easily deformed when an external force is applied, Can bend. Therefore, even if the base substrate 11 is warped, slightly curved, deformed, or the like, it can be easily corrected by a small external force, and the base substrate 11 can be handled by vacuum chucking. The manufacturing process of the semiconductor device can be easily performed.
As described above, the island-shaped GaN-based semiconductor layer 13 made of a high-quality semiconductor crystal can be grown while suppressing the curvature of the base substrate 11, and even if the GaN-based semiconductor layer 13 is extremely thick, generation of cracks and the like is suppressed. Therefore, a large-area GaN-based semiconductor element can be easily realized.

Second Embodiment A GaN-based Schottky diode according to a second embodiment and a method for manufacturing the same will be described.
First, as in the first embodiment, a growth mask 22 is formed on the base substrate 21 as shown in FIG. 12A. As the base substrate 21, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate was used. Similar to the growth mask 12 shown in FIG. 2, the growth mask 22 has a stripe window 22a and an auxiliary stripe window (not shown), and is directly at both ends of the GaN-based semiconductor layer in the <11-20> direction design. As shown in FIG. 4, the stripe window 22a of the inner growth mask 22 has a zigzag shape having sides in the direction equivalent to the <1-100> direction. For example, the growth mask 22 is formed of a SiO ₂ film having a thickness of 0.3 μm, the length a of the stripe window 22a is 800 μm, the width b is 5 μm, the period p ₁ of the stripe window 22a is 55 μm, the period p ₂ is 810 μm, The width of the mask portion is 50 μm, the length c of the auxiliary stripe window is 80 μm, the width d is 5 μm, the distance between the stripe window 22a and the stripe window 22a in the <1-100> direction is 5 μm, and the end portion of the stripe window 22a and the auxiliary portion The overlap length q with the stripe window 22b is 35 μm.

Next, as shown in FIG. 12B, an n ⁺ -type GaN layer 23 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane direction by MOCVD using the growth mask 22. The thickness of the n ⁺ -type GaN layer 23 is, for example, 8 μm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . The distance between the n ⁺ -type GaN layer 23 and the n ⁺ -type GaN layer 23 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 23 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. During the growth of the n ⁺ -type GaN layer 23, for example, TMG and NH ₃ were used as source gases, H ₂ and N ₂ were used as carrier gases, and silane (SiH ₄ ) diluted with nitrogen was used as an n-type dopant. . In this case, one island-like n ⁺ -type GaN layer 23 is grown from five stripe windows 22a. Also, two stripes window 12a on both sides of the <11-20> direction of these five stripes window 22a has a zigzag shape as shown in FIG. 4, <11 of the n ⁺ -type GaN layer 23 It serves to stop lateral growth in the -20> direction. Next, the growth pressure is increased to, for example, 80 kPa so as to promote the growth in the vertical direction, the crystal growth conditions are adjusted, and the n-type GaN layer 24 is grown on the n ⁺ -type GaN layer 23 by the MOCVD method. The n-type GaN layer 24 has a thickness of, for example, 5 μm and an impurity concentration of, for example, 1 × 10 ¹⁶ cm ⁻³ . Thus, after the n-type GaN layer 24 is grown, the entire interval between the n ⁺ -type GaN layer 23 and the n-type GaN layer 24 in the <11-20> direction is, for example, about 5 μm. As shown in FIG. 12B, the n ⁺ -type GaN layer 23 and the n-type GaN layer 24 are associated with the portion immediately above the stripe window 22a and the n ⁺ -type GaN layers 23 grown laterally from the adjacent stripe windows 22a. The threading dislocation 25 is formed in the part.

Next, as shown in FIG. 13A, after an insulating film, for example, a 1 μm thick SiO ₂ film 26 is formed on the entire surface by, eg, plasma CVD, the SiO ₂ film 26 is patterned into a predetermined shape by photolithography and etching. Then, the n-type GaN layer 24 is partially exposed. Next, the n-type GaN layer 24 is etched away by, for example, inductively coupled plasma (ICP) -reactive ion etching (RIE) using a chlorine-based etching gas, using the SiO ₂ film 26 thus patterned in a predetermined shape as a mask. The n ⁺ -type GaN layer 23 is exposed.

Next, as shown in FIG. 13B, after an ohmic metal film is formed on the entire surface by, for example, vacuum deposition, the ohmic metal film is patterned into a predetermined shape by photolithography and etching, and is exposed on the exposed n ⁺ -type GaN layer 23. An ohmic electrode 27 is formed on the substrate. Thereafter, for example, RTA (Rapid Thermal Annealing) at 800 ° C. for 30 seconds is performed to bring the ohmic electrode 27 into ohmic contact with the n ⁺ -type GaN layer 23. As the ohmic metal film, for example, a multilayer film of titanium (Ti) / aluminum (Al) / titanium (Ti) / gold (Au) is used in order from the bottom, and the thickness of each film is, for example, the first Ti film The thickness is 10 nm, the Al film is 300 nm, the third Ti film is 30 nm, and the Au film is 500 nm.

Next, the SiO ₂ film 26 is patterned into a predetermined shape by photolithography and etching, so that the n-type GaN layer 24 other than the threading dislocations 25 is partially exposed. Next, a metal film for forming a Schottky electrode is formed on the entire surface by, for example, a vacuum evaporation method while leaving a resist pattern (not shown) formed by photolithography as it is. Thereafter, the resist pattern is removed together with the Schottky electrode forming metal film formed thereon (lift-off). Thus, the Schottky electrode 28 is formed in contact with the n-type GaN layer 24. As the metal film for forming the Schottky electrode, for example, a two-layer film of nickel (Ni) / gold (Au) is used, and the thickness of each film is, for example, 50 nm for the Ni film and 1000 nm for the Au film. Since the Schottky electrode 28 is prevented from being in direct contact with the threading dislocation 25 by the SiO ₂ film 26, current leakage along the threading dislocation 25 can be prevented.

Next, as shown in FIG. 14, a pad electrode 29 made of Au is formed on the ohmic electrode 27, and a pad electrode 30 made of Au is formed on the Schottky electrode 28.
Thereafter, the base substrate 21 on which the diode structure is formed as described above is formed into a chip so that, for example, one island-shaped n ⁺ -type GaN layer 23 and an n-type GaN layer 24 are included in one chip. A GaN-based Schottky diode is manufactured.
According to the second embodiment, the same advantages as the first embodiment can be obtained in the GaN-based Schottky diode.

Third Embodiment A GaN-based Schottky diode and a method for manufacturing the same according to a third embodiment will be described.
First, as in the first embodiment, a growth mask 32 is formed on a base substrate 31 as shown in FIG. 15A. As the base substrate 31, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate was used. The growth mask 32 has a stripe window 32a and an auxiliary stripe window (not shown) in the same manner as the growth mask 12. For example, the growth mask 32 is formed by a SiO ₂ film having a thickness of 0.3 μm, the length a of the stripe window 32a is 1000 μm, the width b is 10 μm, the period p ₁ of the stripe window 32a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 32a in the <1-100> direction and the stripe window 32a is 10 μm, and the end portion of the stripe window 32a and the auxiliary portion The length q of the overlap with the stripe window 32b is 55 μm.

Next, an n ⁺ -type GaN layer 33 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 32. The thickness of the n ⁺ -type GaN layer 33 is, for example, 10 μm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . The distance between the n ⁺ -type GaN layer 33 and the n ⁺ -type GaN layer 33 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 33 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When the n ⁺ -type GaN layer 33 is grown, for example, TMG and NH ₃ are used as the source gas, H ₂ and N ₂ are used as the carrier gas, and SiH ₄ diluted with nitrogen is used as the n-type dopant. In this case, one island-like n ⁺ -type GaN layer 33 is grown from one stripe window 32a. Next, the n-type GaN layer 34 is grown on the n ⁺ -type GaN layer 33 by the MOCVD method by adjusting the crystal growth conditions so that the growth in the vertical direction is promoted. The n-type GaN layer 34 has a thickness of 5 μm, for example, and an impurity concentration of 1 × 10 ¹⁶ cm ⁻³ , for example. Thus, after the growth of the n-type GaN layer 34, the entire interval between the n ⁺ -type GaN layer 33 and the n-type GaN layer 34 in the <11-20> direction is, for example, about 5 μm. In the n ⁺ -type GaN layer 33 and the n-type GaN layer 34, threading dislocations are formed in a portion immediately above the stripe window 32a, but illustration thereof is omitted.

Then, for example, after a plasma CVD method on the entire surface by an insulating film, for example, a thickness was formed an SiO ₂ film 35 of 1 [mu] m, the SiO ₂ film 35 is patterned into a predetermined shape by photolithography and etching, n-type GaN layer 34 Is partially exposed. Next, thus the n-type GaN layer 34 is etched away by ICP-RIE using, for example, a chlorine-based etching gas to the SiO ₂ film 35 which is patterned in a predetermined shape as a mask, as shown in FIG. 15B, n ⁺ -type The GaN layer 33 is exposed.

Next, for example, an ohmic metal film is formed on the entire surface by, for example, vacuum deposition, and then the ohmic metal film is patterned into a predetermined shape by photolithography and etching to form an ohmic electrode 36 on the exposed n ⁺ -type GaN layer 33. . Thereafter, RTA is performed at 800 ° C. for 30 seconds, for example, and the ohmic electrode 36 is brought into ohmic contact with the n ⁺ -type GaN layer 33. As the ohmic metal film, for example, a multilayer film of Ti / Al / Ti / Au is used in order from the bottom. The thickness of each film is, for example, 10 nm for the first Ti film, 300 nm for the Al film, and Ti for the third layer. The film is 30 nm and the Au film is 500 nm.

Next, the SiO ₂ film 35 is patterned into a predetermined shape by photolithography and etching, so that the n-type GaN layer 34 is partially exposed. Next, a metal film for forming a Schottky electrode is formed on the entire surface by, for example, a vacuum evaporation method while leaving a resist pattern (not shown) formed by photolithography as it is. Thereafter, the resist pattern is removed together with the Schottky electrode forming metal film formed thereon (lift-off). Thus, the Schottky electrode 37 is formed in contact with the n-type GaN layer 34. As the metal film for forming the Schottky electrode, for example, a Ni / Au bilayer film is used, and the thickness of each film is, for example, 50 nm for the Ni film and 500 nm for the Au film.

Next, a pad electrode 38 larger than the Schottky electrode 37 is formed on the Schottky electrode 37, and a pad electrode 39 is formed on the ohmic electrode 36.
Thereafter, the base substrate 31 on which the diode structure is formed as described above is formed into a chip so that, for example, one island-shaped n ⁺ -type GaN layer 33 and an n-type GaN layer 34 are included in one chip. A GaN-based Schottky diode is manufactured.
According to the third embodiment, the same advantages as the first embodiment can be obtained in the GaN-based Schottky diode.

Fourth Embodiment A GaN-based Schottky diode and a method for manufacturing the same according to a fourth embodiment will be described.
First, as shown in FIG. 16A, for example, an AlN film having a thickness of 5 nm and a GaN film having a thickness of 20 nm are alternately stacked on a Si substrate 41a having a (111) orientation, for example, having a thickness of about 1 μm. A growth mask 42 is formed on the base substrate 41 on which the AlN / GaN multilayer film 41b is grown in the same manner as in the first embodiment. The growth mask 42 has a stripe window 42 a and an auxiliary stripe window (not shown), like the growth mask 12. For example, the growth mask 42 is formed of a 0.3 μm thick SiO ₂ film, the length a of the stripe window 42 a is 1000 μm, the width b is 10 μm, the period p ₁ of the stripe window 42 a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 42a and the stripe window 42a in the <1-100> direction is 10 μm, and the end portion of the stripe window 42a and the auxiliary portion The length q of the overlap with the stripe window 42b is 55 μm.

Next, an n ⁺ -type GaN layer 43 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 42. The thickness of the n ⁺ -type GaN layer 43 is, for example, 8 μm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . The distance between the n ⁺ -type GaN layer 43 and the n ⁺ -type GaN layer 43 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 43 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When the n ⁺ -type GaN layer 43 is grown, for example, TMG and NH ₃ are used as the source gas, H ₂ and N ₂ are used as the carrier gas, and SiH ₄ diluted with nitrogen is used as the n-type dopant. In this case, one island-like n ⁺ -type GaN layer 43 is grown from one stripe window 42a. Next, the growth pressure is increased to, for example, 80 kPa so as to promote the growth in the vertical direction, the crystal growth conditions are adjusted, and the n-type GaN layer 44 is grown on the n ⁺ -type GaN layer 43 by the MOCVD method. The n-type GaN layer 44 has a thickness of, for example, 5 μm and an impurity concentration of, for example, 1 × 10 ¹⁶ cm ⁻³ . Thus, after the n-type GaN layer 44 is grown, the entire interval between the n ⁺ -type GaN layer 43 and the n-type GaN layer 44 in the <11-20> direction is, for example, about 5 μm. As shown in FIG. 16A, threading dislocations 45 are formed in the n ⁺ -type GaN layer 43 and the n-type GaN layer 44 immediately above the stripe window 42a.

Next, as shown in FIG. 16B, for example, an organic SOG (Spin on glass) liquid (not shown) is applied to fill the gap between the n ⁺ -type GaN layer 43 and the n-type GaN layer 44 and to flatten the surface. after ized, for example, after a plasma CVD method on the entire surface by an insulating film, for example, a thickness was formed an SiO ₂ film 46 of 1 [mu] m, the SiO ₂ film 46 is patterned into a predetermined shape by photolithography and etching, the threading dislocations 45 Only the upper portion of the SiO ₂ film 46 is left.

Next, a metal film for forming a Schottky electrode is formed on the entire surface by, for example, a vacuum evaporation method to form an upper electrode 47 as a Schottky electrode. As the metal film for forming the Schottky electrode, for example, a Ni / Au bilayer film is used, and the thickness of each film is, for example, 50 nm for the Ni film and 500 nm for the Au film.
Next, after the Si substrate 41a of the base substrate 41 is thinned to a thickness of, for example, about 50 to 100 μm by polishing or the like from the back surface side, the width of the Si substrate 41a corresponding to the stripe window 42a of the growth mask 42 has a width, for example. A stripe-shaped via hole 48 of about 20 μm is formed, and the AlN / GaN multilayer film 41 b at the bottom of the via hole 48 is exposed.

Next, the AlN / GaN multilayer film 41 b is removed through plasma etching using, for example, a chlorine-based etching gas through the via hole 48, and then the growth mask 42 is etched away through the via hole 48 to expose the n ⁺ -type GaN layer 43.
Next, an ohmic metal film is formed from the back surface side of the Si substrate 41a by, for example, a vacuum deposition method to form the lower electrode 49. As the ohmic metal film, for example, a Ti / Al / NiAu multilayer film is used.
Thereafter, the base substrate 41 on which the diode structure is formed as described above is formed into a chip so that, for example, one island-like n ⁺ -type GaN layer 43 and an n-type GaN layer 44 are included in one chip. A GaN-based Schottky diode is manufactured.

If necessary, the lower electrode 49 may be formed after the inside of the via hole 48 is completely filled by plating, for example, Au or Cu, and the surface on the back surface side of the Si substrate 41a is planarized. . Thus, by filling the via hole 48 with Au, Cu or the like, the thermal conductivity can be improved, and the temperature rise due to heat generation during the operation of the GaN-based Schottky diode can be suppressed.
According to the fourth embodiment, the same advantages as the first embodiment can be obtained in the GaN-based Schottky diode.

Fifth Embodiment A GaN-based MIS (metal-insulator-semiconductor) field effect transistor (FET) according to a fifth embodiment and a method for manufacturing the same will be described.
First, as shown in FIG. 17A, an AlN film having a thickness of, for example, 5 nm and a GaN film having a thickness of 20 nm are alternately stacked on a Si substrate 51a having a (111) plane orientation. A growth mask 52 is formed on the base substrate 51 on which the / GaN multilayer film 51b is grown in the same manner as in the first embodiment. The growth mask 52 has a stripe window 52 a and an auxiliary stripe window (not shown) as in the growth mask 12. For example, the growth mask 52 is formed of an SiO ₂ film having a thickness of 0.3 μm, the length a of the stripe window 52a is 1000 μm, the width b is 10 μm, the period p ₁ of the stripe window 52a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 52a in the <1-100> direction and the stripe window 52a is 10 μm, and the end portion of the stripe window 52a and the auxiliary portion The length q of the overlap with the stripe window 52b is 55 μm.

Next, an n ⁺ -type GaN layer 53 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 52. The n ⁺ -type GaN layer 53 has a thickness of 8 μm, for example, and an impurity concentration of 5 × 10 ¹⁸ cm ⁻³ , for example. The distance between the n ⁺ -type GaN layer 53 and the n ⁺ -type GaN layer 53 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 53 is performed at 1100 ° C. and 30 kPa, for example. When the n ⁺ -type GaN layer 53 is grown, for example, TMG and NH ₃ are used as source gases, H ₂ and N ₂ are used as carrier gases, and SiH ₄ diluted with nitrogen is used as an n-type dopant. In this case, one island-like n ⁺ -type GaN layer 53 is grown from one stripe window 52a. Next, the growth pressure is increased to, for example, 80 kPa so as to promote the growth in the vertical direction, the crystal growth conditions are adjusted, and the n-type GaN layer 54 is grown on the n ⁺ -type GaN layer 53 by the MOCVD method. The n-type GaN layer 54 has a thickness of 5 μm, for example, and an impurity concentration of 1 × 10 ¹⁶ cm ⁻³ , for example. Thus, after the growth of the n-type GaN layer 54, the entire interval between the n ⁺ -type GaN layer 53 and the n-type GaN layer 54 in the <11-20> direction is, for example, about 5 μm.

Next, as shown in FIG. 17B, following the growth of the n-type GaN layer 54, for example, a p ⁺ -type GaN layer 56 doped with magnesium (Mg) as a p-type impurity is grown on the entire surface. ^{The +} -type GaN layer 56 is patterned into a predetermined shape by photolithography and etching. The p ⁺ -type GaN layer 56 has a thickness of, for example, about 500 nm and an impurity concentration of, for example, 5 × 10 ¹⁹ cm ⁻³ . The growth of the p ⁺ -type GaN layer 56 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When the p ⁺ -type GaN layer 56 is grown, for example, TMG and NH ₃ are used as source gases, H ₂ and N ₂ are used as carrier gases, and bis (cyclopentadienyl) magnesium (Cp ₂ Mg) is used as a p-type dopant. ) Is used. The p ⁺ -type GaN layer 56 is etched by, for example, ICP-RIE using a chlorine-based etching gas.

Next, an n-type GaN layer 57 doped with Si as an n-type impurity is grown on the entire surface so as to cover the p ⁺ -type GaN layer 56 patterned into a predetermined shape by, for example, MOCVD, and subsequently the same n-type impurity. As a result, an n ⁺ -type GaN layer 58 doped with Si is grown. The thickness of the n-type GaN layer 57 is, for example, 1000 nm, the impurity concentration is, for example, 1 × 10 ¹⁷ cm ⁻³ , the thickness of the n ⁺ -type GaN layer 58 is, for example, 100 nm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . To do.
Next, after patterning the n-type GaN layer 57 and the n ⁺ -type GaN layer 58 into a predetermined shape by photolithography and etching, a part of the n ⁺ -type GaN layer 58 is removed by photolithography and etching. This etching is performed by, for example, ICP-RIE using a chlorine-based gas.

Next, after an insulating film such as a SiO ₂ film or a SiN film is formed on the entire surface by, for example, plasma CVD, the insulating film is patterned into a predetermined shape by photolithography and etching to insulate the n-type GaN layer 57 on the gate. A film 59 is formed. The thickness of the gate insulating film 59 is about 50 nm, for example.
Next, after a Ni film is formed on the entire surface by, for example, a vacuum deposition method, the Ni film is patterned into a predetermined shape by, for example, photolithography and etching to form the gate electrode 60 on the gate insulating film 59.

Next, after forming a Ti / Al / Au multilayer film on the entire surface by, for example, a vacuum deposition method, the Ti / Al / Au multilayer film is patterned into a predetermined shape by, for example, photolithography and etching to form an n ⁺ -type GaN layer 58. A source electrode 61 is formed thereon.
Next, after the Si substrate 51a of the base substrate 51 is thinned to a thickness of, for example, about 50 to 100 μm by polishing or the like from the back side, the width of the Si substrate 51a corresponding to the stripe window 52a of the growth mask 52 has a width, for example. A striped via hole 62 having a thickness of about 20 μm is formed, and the AlN / GaN multilayer film 51 b is exposed at the bottom of the via hole 62.

Next, the AlN / GaN multilayer film 51 b is removed by plasma etching using, for example, a chlorine-based etching gas through the via hole 62, and then the growth mask 52 is etched away through the via hole 62 to expose the n ⁺ -type GaN layer 53.
Next, an ohmic metal film is formed from the back surface side of the base substrate 51 by, for example, a vacuum evaporation method to form the drain electrode 63. As the ohmic metal film, for example, a Ti / Al / NiAu multilayer film is used.
Thus, the target GaN-based MISFET is manufactured.

If necessary, the n ⁺ -type GaN layer 58 can be replaced with, for example, an n-type AlGaN layer or a non-doped AlGaN layer.
Further, if necessary, the drain electrode 63 may be formed after the inside of the via hole 62 is completely filled by plating, for example, Au, Cu, etc., and the surface on the back surface side of the base substrate 51 is planarized. . Thus, by filling the inside of the via hole 62 with Au, Cu or the like, the thermal conductivity can be improved, and the temperature rise due to heat generation during the operation of the GaN-based MISFET can be suppressed.

The operation of this GaN-based MISFET will be described.
In this GaN-based MISFET, the n ⁺ -type GaN layer 58 is a source region, the n ⁺ -type GaN layer 53 is a drain region, and the n-type GaN layers 54 and 57 are channel regions. Under the n-type GaN layer 57 serving as a channel region, a high impurity concentration p ⁺ -type GaN layer 56 is provided. Since the n ⁺ -type GaN layer 58 is not formed immediately below the end of the gate electrode 60 on the source electrode 61 side, a depletion layer due to the p ⁺ -type GaN layer 56 spreads in the n-type GaN layer 57 as a channel region. . For this reason, this GaN-based MISFET has a normally-off structure. By applying a positive (+) bias voltage to the gate electrode 60, electrons are induced in the n-type GaN layer 57 near the interface with the gate insulating film 59 immediately below the gate electrode 60, and as a result, the source electrode 61. Since a channel is formed between the source electrode 61 and the drain electrode 63, the GaN-based MISFET is turned on, and a current flows between the source electrode 61 and the drain electrode 63. In this GaN-based MISFET, a high drain breakdown voltage can be obtained by the high energy barrier of the p ⁺ -type GaN layer 56. Further, since the high impurity concentration n ⁺ -type GaN layer 58 forms the source region, the source resistance can be reduced. In addition, although the thickness of the n-type GaN layer 54 under the p ⁺ -type GaN layer 56 is as thin as about 5 μm, the breakdown voltage of GaN is sufficiently large as 300 V / μm, so that a high drain breakdown voltage can be obtained. it can.
According to the fifth embodiment, the same advantages as in the first embodiment can be obtained in the GaN-based MISFET.

Sixth Embodiment In the sixth embodiment, a case where a C-plane sapphire substrate is used as the base substrate 31 in the GaN-based Schottky diode manufacturing method according to the third embodiment will be described.
First, as in the third embodiment, a growth mask 32 is formed directly on a C-plane sapphire substrate as the base substrate 31, as shown in FIG. 15A.
Next, the C-plane sapphire substrate thus formed with the growth mask 32 is introduced into an MOCVD apparatus, and, for example, maintained at 1100 ° C. for 5 minutes in a carrier gas composed of a mixed gas of H ₂ and N ₂ to clean the surface. I do.

Next, for example, after the temperature is lowered to 550 ° C., NH ₃ and TMG are supplied, and an amorphous GaN layer having a thickness of about 30 nm is grown.
Next, the temperature is raised to 1150 ° C. while flowing NH ₃ , and this temperature is maintained for 10 minutes. Then, TMG and SiH ₄ are supplied at a temperature of, for example, 1050 to 1100 ° C., and the n ⁺ -type GaN layer 33 and the n-type GaN layer 33 are supplied. A GaN layer 34 is grown. By doing so, the island-shaped n ⁺ -type GaN layer 33 and the n-type GaN layer 34 can be grown.
The subsequent steps are the same as those in the third embodiment.
According to the sixth embodiment, in addition to the same advantages as those of the third embodiment, since the C-plane sapphire substrate itself can be used as the base substrate 31, a GaN layer is formed on the C-plane sapphire substrate. There is no need for growth, the manufacturing process of the GaN-based Schottky diode can be simplified correspondingly, and the manufacturing cost of the GaN-based Schottky diode can be reduced.

Seventh Embodiment A method for manufacturing a GaN-based semiconductor device according to the seventh embodiment will be described.
In the seventh embodiment, as in the first embodiment, as shown in FIG. 18A, the GaN-based semiconductor layer 13 is formed on the base substrate 11 using the growth mask 12 shown in FIG. After growing in an island shape in the (0001) plane orientation, a necessary first electrode 14 is formed on the upper surface of the GaN-based semiconductor layer 13 (hereinafter referred to as “first surface 13a”). The material of the first electrode 14 and the method of forming the first electrode 14 are selected as necessary. The material of the first electrode 14 is either an ohmic electrode or a Schottky electrode, or the conductivity of the uppermost layer of the GaN-based semiconductor layer 13 with which the first electrode 14 contacts. It is appropriately selected according to the mold. Specifically, the first electrode 14 uses, for example, a multilayer film of Ni / Au / Ni in order from the bottom, and the thickness of each film is, for example, 5 nm for the first Ni film, 500 nm for the Au film, The second Ni film is 100 nm. In addition, the first electrode 14 is formed by forming a metal film or an alloy film for forming the first electrode 14 on the entire surface by, for example, a vacuum deposition method or a sputtering method, and then using the metal film or the alloy film as a photo film. It is formed by patterning into a predetermined shape by lithography and etching. In FIG. 18A, the first electrode 14 is formed in a portion excluding the peripheral portion of the first surface 13a of the GaN-based semiconductor layer 13, for example, a portion 6 μm or more inside from the edge. You may form in the 13th 1st surface 13a whole.

Next, as shown in FIG. 18B, the growth mask 12 is removed by a wet etching method or the like. For example, when the growth mask 12 is made of an SiO ₂ film, the growth mask 12 is removed by wet etching using buffered hydrofluoric acid. The removal of the growth mask 12 is not essential, but is effective for improving the yield of separation of a GaN-based semiconductor layer 13 described later.

  Next, as shown in FIG. 19, a first support substrate 16 having an adhesive metal 15 formed on one main surface is prepared, and the adhesive metal 15 of the first support substrate 16 is placed on the base substrate 11. The GaN-based semiconductor layer 13 is opposed to the first electrode 14 formed on the first surface 13a. As the bonding metal 15, solder can be used. More specifically, for example, an Au / Sn solder thin film is used. Examples of the first support substrate 16 include elemental semiconductors such as Si, compound semiconductors such as SiC, GaAs, GaP, AlN, GaN, and ZnO, various metals, alloys, nitride ceramics, and oxide ceramics. , Diamond, carbon, plastic and the like can be used, and is selected as necessary. A typical example of the first support substrate 16 is a Si substrate.

  Next, as shown in FIG. 20, the bonding metal 15 of the first support substrate 16 is brought into contact with the first electrode 14 formed on the GaN-based semiconductor layer 13 on the base substrate 11, and heating is performed in this state. Then, the bonding metal 15 is melted to be welded to the first electrode 14. In this way, the first support substrate 16 is bonded to the first electrode 14 formed on the first surface 13 a of the GaN-based semiconductor layer 13 on the base substrate 11. For example, when an Au / Sn solder thin film is used as the bonding metal 15 and the first electrode 14 is formed of a multilayer metal film including the above-described Ni film, Au film, and Ni film thereon, the first support substrate The adhesive metal 15 is heated to about 250 ° C. while being in contact with the first electrode 14, so that the adhesive metal 15 is melted and welded to the first electrode 14. The first support substrate 16 is bonded to the substrate.

  Next, as shown in FIG. 21, the base substrate 11 and the first support substrate 16 integrated by bonding as described above are peeled between the base substrate 11 and the GaN-based semiconductor layer 13. Specifically, for example, the base substrate 11 and the GaN-based semiconductor layer 13 are separated by applying ultrasonic waves to the integrated base substrate 11 and the first support substrate 16 for stimulation. Alternatively, a part of the end surfaces of the base substrate 11 and the first support substrate 16 integrated with each other is stimulated by applying a mechanical force so that the base substrate 11 and the GaN-based semiconductor layer 13 are separated. May be. Thus, the surface of the GaN-based semiconductor layer 13 exposed by peeling between the base substrate 11 and the GaN-based semiconductor layer 13 is referred to as a second surface 13b.

  Next, as shown in FIG. 22, the necessary second electrode 17 is formed on the second surface 13 b of the GaN-based semiconductor layer 13. The material of the second electrode 17 and the method of forming the second electrode 17 are selected as necessary. The material of the second electrode 17 is that the second electrode 17 is an ohmic electrode or a Schottky electrode, or the conductivity of the uppermost layer of the GaN-based semiconductor layer 13 with which the second electrode 17 contacts. It is appropriately selected according to the mold. Specifically, the second electrode 17 uses, for example, a Ti / Al / Au multilayer film in order from the bottom, and the thickness of each film is, for example, 5 nm for the Ti film, 45 nm for the Al film, and 10 nm. The second electrode 17 is formed by forming a metal film or an alloy film for forming the second electrode 17 on the entire surface by, for example, a vacuum deposition method or a sputtering method, and then using the metal film or the alloy film as a photo film. It is formed by patterning into a predetermined shape by lithography and etching. In FIG. 22, the second electrode 17 is formed on the entire second surface 13 b of the GaN-based semiconductor layer 13, but a portion excluding the peripheral portion of the second surface 13 b of the GaN-based semiconductor layer 13. For example, you may form in the part inside 6 micrometers or more from an edge. If the second electrode 17 is an ohmic electrode, a second electrode 17 is formed on the second surface 13b of the GaN-based semiconductor layer 13 as necessary, and then a laser is applied to the second electrode 17. By performing laser annealing by irradiating with light, the second electrode 17 can be brought into ohmic contact with the GaN-based semiconductor layer 13 with lower resistance. For example, when the second electrode 17 is made of a multilayer metal film having a total thickness of 50 nm made of the above-described Ti film, Al film, and Au film, the light of the multilayer metal film is obtained by using laser light having a wavelength of 266 nm. Since the transmittance is about 20% and the laser beam is sufficiently absorbed, the interface between the GaN-based semiconductor layer 13 and the second electrode 17 can be sufficiently heated, and sufficient laser annealing can be performed. it can.

  Next, as shown in FIG. 23, a second support substrate 18 in which an adhesive metal (not shown) is formed on one main surface is prepared, and the adhesive metal of the second support substrate 18 is a first metal. The second electrode 17 is brought into contact with the second electrode 17 formed on the second surface 13b of the GaN-based semiconductor layer 13 on the supporting substrate 16 and heated in this state to melt the bonding metal. And weld. In this way, the second support substrate 18 is bonded to the second electrode 17 formed on the second surface 13 b of the GaN-based semiconductor layer 13 on the first support substrate 16. For example, when an Au / Sn solder thin film is used as the bonding metal and the second electrode 14 is made of the above-described Ni film, Au film and a multilayer metal film made of the Ni film thereon, the second support substrate 18 is used. The adhesive metal is heated to about 250 ° C. in contact with the second electrode 17, so that the adhesive metal is melted and welded to the second electrode 17. The support substrate 18 is bonded. As the metal for bonding, solder can be used. More specifically, for example, an Au / Sn solder thin film is used. As the second support substrate 18, as with the first support substrate 16, for example, an elemental semiconductor such as Si, a compound semiconductor such as SiC, GaAs, GaP, AlN, GaN, and ZnO, various metals, and alloys , Nitride-based ceramics, oxide-based ceramics, diamond, carbon, plastics, etc. can be used, and they are selected as necessary. Is preferred. A typical example of the second support substrate 18 is a Cu plate (thickness is, for example, 1 mm) formed by Au plating and an Au / Sn solder thin film, or an AlN ceramic substrate in which a metal line is formed. is there.

  Thus, as shown in FIG. 23, the two-terminal GaN-based semiconductor device in which the first electrode 14 is formed on the first surface 13a of the GaN-based semiconductor layer 13 and the second electrode 17 is formed on the second surface 13b. Specifically, the GaN-based diode is formed in a state of being sandwiched between the first support substrate 16 and the second support substrate 18. The first electrode 14 and the second electrode 17 are an anode or a cathode. This GaN-based diode is a pn junction diode or a Schottky diode. In the pn junction diode, both the first electrode 14 and the second electrode 17 are ohmic electrodes, and in the Schottky diode, the first electrode 14 and the second electrode 17 are used. One of them is a Schottky electrode, and the other is an ohmic electrode. The distance between the first support substrate 16 and the second support substrate 18 is, for example, about 20 μm.

FIG. 24 shows an example of an SEM image of the surface on the GaN-based semiconductor layer 13 side on the first support substrate 16 after the base substrate 11 is peeled off. However, as the base substrate 11, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate was used. As the GaN-based semiconductor layer 13, a GaN layer was grown. As the growth mask 12, a mask having the same pattern as that shown in FIG. 3 was used. The growth mask 12 is formed of a SiO ₂ film having a thickness of 0.3 μm formed by a plasma CVD method. The length a of the stripe window 12a is 1200 μm, the width b is 5 μm, the period p ₁ of the stripe window 12a is 85 μm, and the mask portion The width 12c is 80 μm, and the overlapping length r of the end portions of the stripe window 12a is 65 μm. An Si substrate was used as the first support substrate 16, and an Au / Sn solder thin film was formed thereon as the bonding metal 15. In growing the GaN layer, first, a low-temperature GaN buffer layer (not shown) was grown on the base substrate 11 on which the growth mask 12 was formed by a conventionally known technique. Specifically, a low temperature GaN buffer layer having a thickness of 30 nm was grown at a temperature of 530 ° C. using TMG and NH ₃ as source gases and H ₂ and N ₂ as carrier gases by MOCVD. Thereafter, the supply of TMG was stopped. For example, after the temperature was raised to 1150 ° C., TMG was supplied again, and GaN was grown at a pressure of 30 kPa. Thus, a GaN layer was grown in an island shape. The thickness of this GaN layer is 15 μm. As shown in FIG. 24, a group of striped island-shaped GaN layers that appear by peeling can be seen. FIG. 25A shows an enlarged view of the end portion of the striped island-shaped GaN layer of FIG. 24, and FIG. 25B shows an enlarged view of the central portion of the island-shaped GaN layer.

The results of examining the degree of peeling of the GaN-based semiconductor layer 13 from the base substrate 11 by variously changing the width b of the stripe window 12a and the width of the mask portion 12c of the growth mask 12 shown in FIG. The growth mask 12 was formed of a 0.3 μm thick SiO ₂ film formed by plasma CVD. The base substrate 11, the GaN-based semiconductor layer 13, the growth conditions of the GaN-based semiconductor layer 13, the first support substrate 16, and the bonding metal 15 are the same as those of the sample shown in FIG. On the first surface 13a of the GaN layer as the GaN-based semiconductor layer 13, a Ni / Au / Ni multilayer film is used as the first electrode 14 (the thickness of each film is 5 nm for the first Ni film, and the Au film) 500 nm, and the second Ni film is 100 nm). The distance between the striped GaN layer as the GaN-based semiconductor layer 13 and the adjacent striped GaN layer was set to about 5 to 8 μm. When the period p ₁ is 10 μm or less, adjacent GaN layers are likely to be combined with each other. Therefore, in order to prevent this, a portion as shown in FIG. The width b of the stripe window 12a was changed to five levels of 1 μm, 3 μm, 5 μm, 10 μm, and 20 μm, and the width of the mask portion 12c was changed to six levels of 3 μm, 5 μm, 10 μm, 50 μm, 80 μm, and 100 μm.

  The number of striped GaN layers peeled from the sapphire substrate as the base substrate 11 was counted, and the ratio to the total number was measured. Table 1 shows the results. In addition, the shaded area in Table 1 is a part where no experiment was conducted.

  From Table 1, it can be seen that when the width b of the stripe window 12a is 20 μm, the GaN layer can hardly be peeled off. This is because the adhesion strength of the Ni / Au / Ni multilayer film as the first electrode 14 to the first surface 13a of the GaN layer and the adhesion strength between the sapphire substrate and the GaN layer in the stripe window 12a having a width b of 20 μm It is considered that this is because the latter is stronger than the former. Since the width of the striped GaN layer is practically 300 μm or less, it can be said that the width b of the stripe window 12 a is desirably 20 μm or less. Table 1 also shows that the GaN layer cannot be peeled off when the width of the mask portion 12c is smaller than the width b of the stripe window 12a. From this, it can be said that it is desirable that (the width b of the stripe window 12a / the width of the mask portion 12c) ≦ 1 in the growth mask 12.

  According to the seventh embodiment, in addition to the same advantages as those of the first embodiment, the following various advantages can be obtained. That is, the first support substrate 16 is bonded to the first surface 13 a of the GaN-based semiconductor layer 13 grown on the base substrate 11, and the first support substrate 16 and the GaN-based semiconductor layer 13 are removed from the base substrate 11. After peeling, the second support substrate 18 is bonded to the second surface 13 b of the GaN-based semiconductor layer 13. Therefore, for example, by using a high thermal conductivity substrate as the second support substrate 18, the heat dissipation of the two-terminal GaN-based semiconductor element sandwiched between the first support substrate 16 and the second support substrate 18. Can be greatly improved, and a high heat dissipation two-terminal GaN-based semiconductor element can be realized.

In addition, according to the seventh embodiment, it is not necessary to use a laser lift technique conventionally used as a method for peeling a sapphire substrate after a GaN-based semiconductor layer is grown on the sapphire substrate. There are no various problems when using the lift-off technique. That is, in the laser lift-off technology, a laser beam having a wavelength of 266 nm oscillated by a pulsed high-power laser is irradiated from the sapphire substrate side, and the GaN-based semiconductor layer is formed to a depth of several hundred nm from the interface between the sapphire substrate and the GaN-based semiconductor layer. Due to the absorption, the temperature of the portion is rapidly increased to a high temperature to cause thermal decomposition, and the sapphire substrate is peeled off at the interface between the sapphire substrate and the GaN-based semiconductor layer by the pressure of the generated nitrogen (N ₂ ) gas. Although this laser lift-off technology is effective for locally peeling the sapphire substrate, there is a difficulty in controlling the pressure of the generated nitrogen gas. Due to the non-uniformity in the plane of the sapphire substrate and the non-uniform push-up effect caused by the local increase in pressure, the GaN-based semiconductor layer is cracked or broken. For this reason, it was difficult to peel off the sapphire substrate over the entire area irradiated with the laser light while keeping the GaN-based semiconductor layer intact. In contrast, according to the seventh embodiment, the base substrate 11 such as a sapphire substrate is easily peeled from the GaN-based semiconductor layer 13 over the entire surface of the base substrate 11 while keeping the GaN-based semiconductor layer 13 intact. There is no such problem so you can. Further, in the laser lift-off technology, it is necessary to use an expensive pulse high-power laser, but according to the seventh embodiment, it is not necessary to use such a pulse high-power laser. The manufacturing cost of the element can be reduced.

Eighth Embodiment A method of manufacturing a longitudinal conduction type GaN-based Schottky diode according to the eighth embodiment will be described.
First, as shown in FIG. 26, a growth mask 32 similar to the growth mask 12 shown in FIG. 3 is formed on the base substrate 31.

Next, an n ⁺ -type GaN layer 33 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 32. In this case, one island-like n ⁺ -type GaN layer 33 is grown from one stripe window 32a. The distance between the n ⁺ -type GaN layer 33 and the n ⁺ -type GaN layer 33 is, for example, about 10 μm. The n ⁺ -type GaN layer 33 is grown at, for example, a temperature of 1100 ° C. and a pressure of 30 kPa mainly composed of a lateral growth mode. When the n ⁺ -type GaN layer 33 is grown, for example, TMG and NH ₃ are used as the source gas, H ₂ and N ₂ are used as the carrier gas, and SiH ₄ diluted with nitrogen is used as the n-type dopant. By controlling the source gas supply conditions (for example, the ratio between the supply amount of TMG and the supply amount of NH ₃ ), for example, the thickness of the n ⁺ -type GaN layer 33 with respect to the width of the n ⁺ -type GaN layer 33 is 70 μm. The thickness is about 15 μm. The impurity concentration of the n ⁺ -type GaN layer 33 is set to 1 × 10 ¹⁸ cm ⁻³ , for example.

Next, the supply amount of SiH ₄ is decreased, the growth pressure is set to 60 kPa, for example, and the TMG supply amount is increased, for example, twice, and an n ⁺ -type GaN layer is grown by MOCVD under growth conditions mainly composed of vertical growth. An n-type GaN layer 34 is grown on 33. The n-type GaN layer 34 has a thickness of 5 μm, for example, and an impurity concentration of 3 × 10 ¹⁶ cm ⁻³ , for example. After the n-type GaN layer 34 is grown in this way, the protruding distance of the n-type GaN layer 34 in the lateral direction from the side surface of the n ⁺ -type GaN layer 33 is about 4 μm on one side. In the n ⁺ -type GaN layer 33 and the n-type GaN layer 34, threading dislocations are formed in a portion immediately above the stripe window 32a.

Then, for example, after a plasma CVD method on the entire surface by an insulating film, for example, a thickness was formed an SiO ₂ film 35 of 1 [mu] m, the SiO ₂ film 35 is patterned into a predetermined shape by photolithography and etching, n-type GaN layer 34 A stripe-like SiO ₂ film 35 is formed on the peripheral portion in the range of about 5 μm from the side surface of the n-type GaN layer 34 on the upper surface and the portion having a width of 8 μm immediately above the stripe window 32a. The SiO ₂ film 35 is provided to serve as a field plate for reducing electric field concentration at the end of a Schottky electrode 37 described later.

Next, a metal film for forming a Schottky electrode is formed on the entire surface by, for example, a vacuum deposition method, and then the metal film is patterned into a predetermined shape by photolithography and etching. As this metal film, a multilayer film of Ni / Au / Ni / Au (the thickness of each film is 20 nm for the first Ni film, 100 nm for the first Au film, 20 nm for the second Ni film, 2 nm The layer Au film was 500 nm). Thus, the Schottky electrode 37 is formed in contact with the n-type GaN layer 34 in the opening of the SiO ₂ film 35. Here, the second Ni film in the Ni / Au / Ni / Au multilayer film is Sn from the Au / Sn solder thin film used as the bonding metal 15 formed on one main surface of the first support substrate 16. It is provided as a barrier layer for preventing the diffusion of.

Thereafter, as in the seventh embodiment, the first support substrate 16 on which the bonding metal 15 is formed is bonded, the base substrate 31 is peeled off, and the second support substrate 18 on which the bonding metal is formed. The target GaN-based Schottky diode is manufactured by performing processes such as bonding. In the GaN-based Schottky diode manufactured in this way, a Schottky electrode 37 is formed on one surface of the n-type GaN layer 34, and an ohmic electrode is formed on one surface of the n ⁺ -type GaN layer 33. Therefore, in this GaN-based Schottky diode, a current flows between the Schottky electrode 37 and the ohmic electrode in the stacking direction of the n ⁺ -type GaN layer 33 and the n-type GaN layer 34, in other words, in the vertical direction. That is, this GaN-based Schottky diode is of the vertical conduction type.

  According to the eighth embodiment, the longitudinal conduction type GaN-based Schottky diode can obtain the same advantages as those of the seventh embodiment.

Ninth Embodiment A method for manufacturing a large area power GaN Schottky diode according to a ninth embodiment will be described.
First, as shown in FIG. 27, a growth mask 71 is formed on a base substrate (not shown). The growth mask 71 has a stripe window 71a similar to the stripe window 12a of the growth mask 12 shown in FIG. 2 for each rectangular chip region 72 that finally becomes one element. One chip region 72 includes a plurality of, for example, 600 stripe windows 71a in the <11-20> direction. For example, the length a of the stripe window 71a is 1200 μm, the width b is 1 μm, the width of the mask portion 71c is 3 μm, and the period p ₁ of the stripe window 71a is 4 μm. In this case, for example, the size of the chip region 72 is 2400 μm in the <11-20> direction and 1300 μm in the <1-100> direction. In this case, in the growth mask 71, in addition to the stripe window 71a, the island-shaped GaN-based semiconductor layers 13 grown from each stripe window 71a along the pair of opposite sides of the chip region 72 adjacent to each other are <11-20> has a coalescence prevention window 71d for preventing coalescence in the direction. The coalescence prevention window 71d is formed on one side of a window having the same shape as the stripe window 71a, for example, at a pitch of 20 μm, and has a size having sides parallel to the <11-20> direction and the <1-100> direction. The rectangular window of s ₁ × s ₂ (for example, s ₁ = 4 μm, s ₂ = 10 μm) is provided. An interval between the coalescence prevention windows 71d formed along a pair of opposite sides of the chip regions 72 adjacent to each other is, for example, 15 μm.

Next, an n ⁺ -type GaN layer 73 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 71. The growth of the n ⁺ -type GaN layer 73 is performed, for example, at a temperature of 1100 ° C. and a pressure of 60 kPa, which is a growth mode in which the growth proceeds in both the vertical direction and the horizontal direction. In this case, the n ⁺ -type GaN layers 73 grown from the stripe windows 71a in each chip region 72 are combined to obtain one large n ⁺ -type GaN layer 73 as a whole. During the growth of the n ⁺ -type GaN layer 73, for example, TMG and NH ₃ were used as source gases, H ₂ and N ₂ were used as carrier gases, and SiH ₄ diluted with nitrogen was used as an n-type dopant. The impurity concentration of the n ⁺ -type GaN layer 73 is, eg, 1 × 10 ¹⁸ cm ⁻³ . For example, when the thickness of the n ⁺ -type GaN layer 73 reached 10 μm, the supply amount of SiH ₄ was decreased, and the n-type GaN layer was grown to a thickness of about 8 μm. The impurity concentration of the n-type GaN layer is, for example, 1 × 10 ¹⁶ cm ⁻³ .

The reason why the coalescence prevention window 71d inhibits the growth of the n ⁺ -type GaN layer 73 in the <11-20> direction is essentially the same as in the case of using the growth mask 12 shown in FIG. That is, a {1-100} plane having a slow growth rate is formed on the n ⁺ -type GaN layer 73 starting from the coalescence prevention window 71d. The {1-100} plane is inclined 30 ° or 90 ° with respect to the {11-20} plane and has a triangular shape as shown in FIG. 27, so that the growth stops. As a result, as shown in FIG. 27, the n ⁺ -type GaN layer 73 and the n-type GaN layer between the adjacent chip regions 72 are separated from each other via the element isolation band portion.

Thereafter, in the same manner as in the seventh embodiment, the first support substrate 16 formed with the bonding metal 15 is bonded, the base substrate is peeled off, and the second support substrate 18 formed with the bonding metal is formed. A target large-area power GaN-based Schottky diode is manufactured by performing a process such as bonding. In the large-area power GaN-based Schottky diode thus manufactured, a Schottky electrode is formed on one surface of the n-type GaN layer 74 and an ohmic electrode is formed on one surface of the n ⁺ -type GaN layer 73. Therefore, in this large-area power GaN Schottky diode, a current flows between the Schottky electrode and the ohmic electrode in the stacking direction of the n ⁺ -type GaN layer 73 and the n-type GaN layer, in other words, in the vertical direction. That is, this large-area power GaN-based Schottky diode is of the longitudinal conduction type.

  According to the ninth embodiment, the same advantage as that of the seventh embodiment can be obtained in the longitudinal conduction type large-area power GaN-based Schottky diode.

Tenth Embodiment A method for manufacturing a GaN-based Schottky diode according to the tenth embodiment will be described.
First, an AlN film having a thickness of 30 nm and a GaN film having a thickness of 20 nm, for example, are sequentially grown at a temperature of, for example, 1100 ° C. by MOCVD, for example, on a Si substrate 41a having a (111) orientation similar to that of the fourth embodiment. Then, the growth mask 42 is formed on the base substrate thus obtained in the same manner as in the first embodiment. The growth mask 42 has a stripe window 42a and an auxiliary stripe window (not shown) similarly to the growth mask 12 of the first embodiment. For example, the growth mask 42 is formed of a 0.3 μm thick SiO ₂ film, the length a of the stripe window 42 a is 1000 μm, the width b is 10 μm, the period p ₁ of the stripe window 42 a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 42a and the stripe window 42a in the <1-100> direction is 10 μm, and the end portion of the stripe window 42a and the auxiliary portion The length q of the overlap with the stripe window 42b is 55 μm.

Next, an n ⁺ -type GaN layer 43 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 42. The thickness of the n ⁺ -type GaN layer 43 is, for example, 8 μm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . The distance between the n ⁺ -type GaN layer 43 and the n ⁺ -type GaN layer 43 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 43 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When the n ⁺ -type GaN layer 43 is grown, for example, TMG and NH ₃ are used as the source gas, H ₂ and N ₂ are used as the carrier gas, and SiH ₄ diluted with nitrogen is used as the n-type dopant. In this case, one island-like n ⁺ -type GaN layer 43 is grown from one stripe window 42a. Next, the growth pressure is increased to, for example, 80 kPa so as to promote the growth in the vertical direction, the crystal growth conditions are adjusted, and the n-type GaN layer 44 is grown on the n ⁺ -type GaN layer 43 by the MOCVD method. The n-type GaN layer 44 has a thickness of, for example, 5 μm and an impurity concentration of, for example, 1 × 10 ¹⁶ cm ⁻³ . Thus, after the n-type GaN layer 44 is grown, the entire interval between the n ⁺ -type GaN layer 43 and the n-type GaN layer 44 in the <11-20> direction is, for example, about 5 μm. As shown in FIG. 16A, threading dislocations 45 are formed in the n ⁺ -type GaN layer 43 and the n-type GaN layer 44 immediately above the stripe window 42a.

  Thereafter, a Schottky electrode (not shown) is formed on the n-type GaN layer 44, and the first support substrate 16 on which the bonding metal 15 is formed is formed in the same manner as in the seventh embodiment. A target GaN-based Schottky diode is manufactured by performing processes such as bonding, peeling of the base substrate, and bonding of the second support substrate on which the bonding metal is formed.

  According to the tenth embodiment, the same advantages as in the seventh embodiment can be obtained in the GaN-based Schottky diode.

Eleventh Embodiment A method for manufacturing a GaN-based light emitting diode according to the eleventh embodiment will be described.
First, as in the first embodiment, a growth mask 82 is formed on a base substrate 81 as shown in FIG. As the base substrate 81, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate is used. The growth mask 82 has a stripe window 82 a and an auxiliary stripe window (not shown), like the growth mask 12. For example, the growth mask 82 is formed of a 0.3 μm thick SiO ₂ film, the length a of the stripe window 82a is 1000 μm, the width b is 10 μm, the period p ₁ of the stripe window 82a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 32a in the <1-100> direction and the stripe window 32a is 10 μm, and the end portion of the stripe window 32a and the auxiliary portion The length q of the overlap with the stripe window 32b is 55 μm.

Next, an n ⁺ -type GaN layer 83 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane direction by MOCVD using the growth mask 82. The thickness of the n ⁺ -type GaN layer 83 is, for example, 10 μm, and the impurity concentration is, for example, 5 × 10 ¹⁸ cm ⁻³ . The distance between the n ⁺ -type GaN layer 83 and the n ⁺ -type GaN layer 83 is, for example, about 10 μm. The growth of the n ⁺ -type GaN layer 83 is performed at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When growing the n ⁺ -type GaN layer 83, TMG and NH ₃ are used as source gases, H ₂ and N ₂ are used as carrier gases, and SiH ₄ diluted with nitrogen is used as an n-type dopant. In this case, one island-like n ⁺ -type GaN layer 83 is grown from one stripe window 32a. Next, the n-type GaN layer 84 is grown on the n ⁺ -type GaN layer 83 by the MOCVD method by adjusting the crystal growth conditions so that the growth in the vertical direction is promoted. The n-type GaN layer 84 has a thickness of, for example, 5 μm and an impurity concentration of, for example, 1 × 10 ¹⁶ cm ⁻³ . Thus, after the n-type GaN layer 84 is grown, the overall interval between the <11-20> direction of the n ⁺ -type GaN layer 83 and the n-type GaN layer 84 is, for example, about 5 μm. In the n ⁺ -type GaN layer 83 and the n-type GaN layer 84, threading dislocations are formed in a portion immediately above the stripe window 82a, but illustration thereof is omitted.

Subsequently, the light emitting layer 85 and the p ⁺ -type GaN layer 86 having, for example, an InGaN / GaN multiple quantum well structure (MQW) are grown on the n-type GaN layer 84 by MOCVD. Since the thickness of the light emitting layer 85 is generally 50 nm or less and the thickness of the p ⁺ -type GaN layer 86 is very thin, for example, about 100 nm, the light-emitting layer 85 and the n ⁺ -type GaN layer 84 of the p ⁺ -type GaN layer 86 Side growth is almost negligible.

Next, an insulating film, for example, a SiO ₂ film 35 having a thickness of 1 μm, is formed on the entire surface by, for example, plasma CVD, and this SiO ₂ film 87 is patterned into a predetermined shape by photolithography and etching to form a p ⁺ -type GaN layer. 86 is partially exposed.

Next, after forming an ohmic metal film on the entire surface by, for example, vacuum deposition, the metal film is patterned into a predetermined shape by photolithography and etching. Thus, the p-side electrode 88 is formed in contact with the p ⁺ -type GaN layer 86. As the ohmic metal film, for example, a Ni / Au bilayer film is used, and the thickness of each film is, for example, 50 nm for the Ni film and 500 nm for the Au film.

Thereafter, similarly to the seventh embodiment, the first support substrate 16 on which the bonding metal 15 is formed is bonded and the base substrate 81 is peeled off.
Next, for example, a ZnO thin film is formed as a transparent ohmic electrode on the surface of the n ⁺ -type GaN layer 83 exposed by peeling off the base substrate 81.
As described above, a target GaN-based light emitting diode can be manufactured.
According to the eleventh embodiment, the same advantages as those of the first and seventh embodiments can be obtained in the GaN-based light emitting diode.

A method for manufacturing the first 12 second terminal-3 terminal GaN-based compound semiconductor device according to an embodiment a twelfth embodiment of the.
First, as in the first embodiment, a growth mask 92 is formed on a base substrate 91 as shown in FIG. As the base substrate 91, for example, a substrate obtained by growing a GaN layer having a thickness of 2 μm on a C-plane sapphire substrate is used. The growth mask 92 has a stripe window 92a and an auxiliary stripe window (not shown) in the same manner as the growth mask 12. For example, the growth mask 92 is formed of a 0.3 μm thick SiO ₂ film, the length a of the stripe window 92a is 1000 μm, the width b is 5 μm, the period p ₁ of the stripe window 92a is 90 μm, the period p ₂ is 1010 μm, The width of the mask portion is 80 μm, the length c of the auxiliary stripe window is 120 μm, the width d is 10 μm, the distance between the stripe window 92a and the stripe window 92a in the <1-100> direction is 10 μm, and the end portion of the stripe window 92a and the auxiliary portion The length q of the overlap with the stripe window 92b is 55 μm.

Next, an n ⁺ -type GaN layer 93 doped with Si as an n-type impurity is grown in an island shape in the (0001) plane orientation by MOCVD using the growth mask 92. The thickness of the n ⁺ -type GaN layer 93 is, for example, 15 μm, and the impurity concentration is, for example, 1 × 10 ¹⁷ cm ⁻³ . The distance between the n ⁺ -type GaN layer 93 and the n ⁺ -type GaN layer 93 is, for example, about 5 to 10 μm. The n ⁺ -type GaN layer 93 is grown at a temperature of 1100 ° C. and a pressure of 30 kPa, for example. When the n ⁺ -type GaN layer 93 is grown, for example, TMG and NH ₃ are used as the source gas, H ₂ and N ₂ are used as the carrier gas, and SiH ₄ diluted with nitrogen is used as the n-type dopant. In this case, one island-like n ⁺ -type GaN layer 93 is grown from one stripe window 92a. Next, the n-type GaN layer 94 is grown on the n ⁺ -type GaN layer 93 by the MOCVD method by adjusting the crystal growth conditions so that the growth in the vertical direction is promoted. The n-type GaN layer 94 has a thickness of, for example, 4 μm and an impurity concentration of, for example, 1 × 10 ¹⁶ cm ⁻³ . The distance between the n ⁺ -type GaN layer 93 and the n-type GaN layer 94 in the <11-20> direction after the growth of the n-type GaN layer 94 is about 5 μm, for example. In the n ⁺ -type GaN layer 93 and the n-type GaN layer 94, threading dislocations are formed in a portion immediately above the stripe window 92a, but illustration thereof is omitted.

Subsequently, a p ⁺ -type GaN layer 95 is grown on the n-type GaN layer 94 by MOCVD. The p ⁺ -type GaN layer 95 has a thickness of, for example, about 500 nm and an impurity concentration of, for example, 1 × 10 ¹⁹ cm ⁻³ . Next, a portion of the p ⁺ -type GaN layer 95 immediately below the gate of a later-described three-terminal element (transistor) is removed by etching.

Next, an n-type GaN layer 96 and an AlGaN layer 97 are sequentially grown on the entire surface by MOCVD. The thickness of the n-type GaN layer 96 is, for example, about 800 nm, and the impurity concentration is, for example, 1 × 10 ¹⁷ cm ⁻³ . The thickness of the AlGaN layer 97 is, for example, 30 nm, and the Al composition is, for example, 0.25.

Next, in order to make the three-terminal element (transistor) an enhancement mode type, the AlGaN layer 97 in the gate portion is removed by dry etching. A two-dimensional electron gas is generated in the vicinity of the interface between the AlGaN layer 97 and the n-type GaN layer 96. By removing the AlGaN layer 97 in the gate portion in this way, the two-dimensional electron gas exists in the gate portion. The n-type GaN layer 96 under the gate is depleted due to the band pulling effect by the p ⁺ -type GaN layer 95.

Then, for example, after a plasma CVD method on the entire surface by an insulating film, for example, a thickness was formed an SiO ₂ film of 20 nm, patterning the SiO ₂ film by photolithography and etching into a predetermined shape. Thus, the gate insulating film 98 made of the SiO ₂ film is formed on the n-type GaN layer 96 in the gate portion.
Next, a metal film for forming a Schottky electrode is formed on the entire surface by, for example, a vacuum deposition method, and then the metal film is patterned into a predetermined shape by photolithography and etching. As this metal film, for example, a Ni / Au bilayer film (the thickness of each film is 50 nm for the first Ni film and 500 nm for the first Au film) is formed. Thus, the gate electrode 99 is formed on the gate insulating film 98.

Next, the n-type GaN layer 96 is patterned into a predetermined shape by photolithography and dry etching, and the p ⁺ -type GaN layer 95 is partially exposed.
Next, the p ⁺ -type GaN layer 95 in the portion immediately above the stripe window 92a of the growth mask 92 is removed by etching. This is because element separation is performed between the two-terminal element and the three-terminal element.

Next, after forming an ohmic metal film on the entire surface by, for example, vacuum deposition, the metal film is patterned into a predetermined shape by photolithography and etching. As this metal film, for example, a Ni / Au bilayer film (the thickness of each film is, for example, 50 nm for the first Ni film and 500 nm for the first Au film) is formed. Thus, the anode electrode 100 is formed on the p ⁺ -type GaN layer 95 in the two-terminal element portion, and the ohmic electrode 101 is in contact with the n-type GaN layer 96 on the p ⁺ -type GaN layer 95 in the three-terminal element portion. Is formed.

Next, after forming an ohmic metal film on the entire surface by, for example, vacuum deposition, the metal film is patterned into a predetermined shape by photolithography and etching. As this metal film, for example, a multilayer film of Ti / Al / Au (the thickness of each film is, for example, 5 nm for Ti film, 45 nm for Al film, and 10 nm for Au film) is formed. Thus, the source electrode 102 is formed on the ohmic electrode 101 and the AlGaN layer 97 in the three-terminal element portion. This three-terminal element is a vertical enhancement type insulated gate FET. The two-terminal element is a pn junction diode. FIG. 30 shows an equivalent circuit of this 2-terminal / 3-terminal GaN-based composite semiconductor element. As shown in FIG. 30, in terms of circuit, the drain of the enhancement type insulated gate FET and the anode of the pn junction diode are commonly connected. Since the source electrode 102 of the enhancement type insulated gate FET is in contact with the p ⁺ -type GaN layer 95, this portion is a diode.

Thereafter, as in the seventh embodiment, the first support substrate 16 on which the bonding metal 15 is formed is bonded, the base substrate 91 is peeled off, and the second support substrate 18 on which the bonding metal is formed. Glue. For example, an AlN substrate is used as the first support substrate 16. On the main surface of the AlN substrate, a line that contacts the anode electrode 100 of the pn junction diode in addition to the gate electrode 99 and the source electrode 102 is formed, and further, Au / Sn solder is about 1 μm. It is formed to a thickness. For example, an Au plated copper plate is used as the second support substrate 18. This Au plated copper plate is bonded to the surface of the n ⁺ -type GaN layer 93 exposed by peeling off the base substrate 91.
With the above, a two-terminal / three-terminal GaN-based composite semiconductor element is completed.

Note that the source electrode 102 and the anode electrode 100 may be integrally formed on the main surface of the AlN substrate as the first support substrate 16. In this way, a typical unit circuit of a power circuit can be configured by the 2-terminal / 3-terminal GaN-based composite semiconductor element.
According to the twelfth embodiment, the same advantages as the first and seventh embodiments can be obtained in the two-terminal / three-terminal GaN-based composite semiconductor element.

Thirteenth Embodiment A method for manufacturing a GaN-based semiconductor device according to a thirteenth embodiment will be described.
In the thirteenth embodiment, the process proceeds in the same manner as in the seventh embodiment until the process shown in FIG. 18B.

  Next, as shown in FIG. 31, a first support substrate 16 having an organic adhesive layer 111 formed on one main surface is prepared, and the organic adhesive layer 111 of the first support substrate 16 is attached to the base substrate 11. It is made to oppose with the 1st electrode 14 formed on the 1st surface 13a of the upper GaN-type semiconductor layer 13. FIG. As the organic adhesive layer 111, for example, a layer made of a thermoplastic resin can be used. Examples of the first support substrate 16 include elemental semiconductors such as Si, compound semiconductors such as SiC, GaAs, GaP, AlN, GaN, and ZnO, various metals, alloys, nitride ceramics, and oxide ceramics. , Diamond, carbon, plastic and the like can be used, and is selected as necessary. A typical example of the first support substrate 16 is a Si substrate.

  Next, as shown in FIG. 31, the organic adhesive layer 111 of the first support substrate 16 is pressed to the first electrode 14 formed on the GaN-based semiconductor layer 13 on the base substrate 11, and organic adhesive The layer 111 is made to reach the gap between the GaN-based semiconductor layers 13. For example, when the organic adhesive layer 111 made of a thermoplastic resin is used, the organic adhesive layer 111 is wetted in the gaps between the GaN-based semiconductor layers 13 by raising the temperature near the softening point of the resin. Can be made. Thus, as shown in FIG. 32, the first support substrate 16 is bonded to the first electrode 14 formed on the first surface 13a of the GaN-based semiconductor layer 13 on the base substrate 11.

  Next, as shown in FIG. 33A, the base substrate 11 and the first support substrate 16 integrated by bonding as described above are peeled between the base substrate 11 and the GaN-based semiconductor layer 13. Specifically, for example, the base substrate 11 and the GaN-based semiconductor layer 13 are separated by applying ultrasonic waves to the integrated base substrate 11 and the first support substrate 16 for stimulation. Alternatively, a part of the end surfaces of the base substrate 11 and the first support substrate 16 integrated with each other is stimulated by applying a mechanical force so that the base substrate 11 and the GaN-based semiconductor layer 13 are separated. May be.

  Next, as shown in FIG. 33B, the necessary second electrode 17 is formed on the second surface 13 b of the GaN-based semiconductor layer 13. The material of the second electrode 17 and the method of forming the second electrode 17 are selected as necessary. The material of the second electrode 17 is that the second electrode 17 is an ohmic electrode or a Schottky electrode, or the conductivity of the uppermost layer of the GaN-based semiconductor layer 13 with which the second electrode 17 contacts. It is appropriately selected according to the mold. Specifically, the second electrode 17 uses, for example, a Ti / Al / Au multilayer film in order from the bottom, and the thickness of each film is, for example, 5 nm for the Ti film, 45 nm for the Al film, and 10 nm. The second electrode 17 is formed by forming a metal film or an alloy film for forming the second electrode 17 on the entire surface by, for example, a vacuum deposition method or a sputtering method, and then using the metal film or the alloy film as a photo film. It is formed by patterning into a predetermined shape by lithography and etching. In this case, since the organic adhesive layer 111 is formed in the gap between the GaN-based semiconductor layers 13, no metal film or alloy film is formed on the side surfaces of the GaN-based semiconductor layer 13. Preferably, the second surface 13b of the GaN-based semiconductor layer 13 is cleaned before the metal film or alloy film for forming the second electrode 17 is formed, and the vertical conduction resistance is further increased. In order to reduce the thickness, the thickness of the GaN-based semiconductor layer 13 may be reduced by performing dry etching or the like from the second surface 13b side. In FIG. 33B, the second electrode 17 is formed on the entire second surface 13 b of the GaN-based semiconductor layer 13, but the portion excluding the peripheral portion of the second surface 13 b of the GaN-based semiconductor layer 13. For example, you may form in the part inside 6 micrometers or more from an edge. If the second electrode 17 is an ohmic electrode, a second electrode 17 is formed on the second surface 13b of the GaN-based semiconductor layer 13 as necessary, and then a laser is applied to the second electrode 17. By performing laser annealing by irradiating with light, the second electrode 17 can be brought into ohmic contact with the GaN-based semiconductor layer 13 with lower resistance. For example, when the second electrode 17 is made of a multilayer metal film having a total thickness of 50 nm composed of the above-described Ti film, Al film, and Au film, a pulse laser having a wavelength of 365 nm or less having a photon energy higher than the band gap of GaN. By irradiating the second electrode 17 with light and instantaneously heating the GaN-based semiconductor layer 13 in contact with the second electrode 17, the second electrode 17 has a lower resistance than the GaN-based semiconductor layer 13. Can make ohmic contact. Specifically, for example, a THG (third harmonic) pulse laser beam with a wavelength of 355 nm or a QHD (fourth harmonic) pulse laser beam with a wavelength of 266 nm using a YAG laser is used as the pulse laser beam with a wavelength of 365 nm or less. Can do.

  Next, as shown in FIG. 34A, a metal layer 112 is formed on the surface on the second electrode 17 side by vacuum vapor deposition, electrodeposition (plating), or the like. Although the thickness of this metal layer 112 is selected as needed, it is 3-30 micrometers, for example. As a material of the metal layer 112, for example, Au or Cu can be used. This metal layer 112 is used as a pad electrode.

  Next, the metal layer 112 is diced to form the grooves 113 so that the GaN-based semiconductor layers 13 can be easily separated from each other in a later step. The groove 113 is formed for each one or a plurality of GaN-based semiconductor layers 13 as necessary. In FIG. 34A, a groove 113 is formed for every three GaN-based semiconductor layers 13.

  Next, as shown in FIG. 34B, the metal layer 112 side is attached to the stretched tape 114, and the first support substrate 16 is peeled off. For example, when an organic adhesive layer 111 made of a thermoplastic resin is used, the first support substrate 16 is moved from the metal layer 112 side in a state where the organic adhesive layer 111 is softened by heating. By pulling away, the first support substrate 16 can be peeled off. Alternatively, if the organic adhesive layer 111 is solvent-soluble, the first support substrate 16 can be peeled off by dissolving the organic adhesive layer 111 by immersing it in a solvent. Thereafter, the GaN-based semiconductor layer 13 on which the first electrode 14 and the second electrode 17 are formed is peeled from the stretched tape 114.

As described above, a GaN-based semiconductor element in which the three GaN-based semiconductor layers 13 are integrated can be manufactured. This GaN-based semiconductor element is, for example, a GaN-based diode. The GaN-based diode is a pn junction diode or a Schottky diode. In the pn junction diode, both the first electrode 14 and the second electrode 17 are ohmic electrodes, and in the Schottky diode, the first electrode 14 and the second electrode 17 are used. One of them is a Schottky electrode, and the other is an ohmic electrode.
According to the thirteenth embodiment, advantages similar to those of the seventh embodiment can be obtained.

Fourteenth Embodiment A method for manufacturing a GaN-based semiconductor device according to the fourteenth embodiment will be described.
In the fourteenth embodiment, the process proceeds in the same manner as in the seventh embodiment until the process shown in FIG. 18B.

  Next, as shown in FIG. 35, the first electrode 14 side is vacuum-sucked by the vacuum tweezers 115, and the vacuum tweezers 115 is pulled away from the base substrate 11, whereby the GaN-based semiconductor layer 13 and the base substrate 11 are separated. The first electrode 14 is peeled off.

Next, as shown in FIG. 36, the GaN-based semiconductor layer 13 and the first electrode 14 vacuum-adsorbed by the vacuum tweezers 115 are transferred to another vacuum tweezers 116.
Next, as shown in FIG. 37, the GaN-based semiconductor layer 13 and the first electrode 14 that are vacuum-adsorbed by the vacuum tweezers 116 are transferred, and an organic-based adhesive formed on one main surface of the first support substrate 16 is transferred. Adhere to layer 111. The interval between the GaN-based semiconductor layers 13 is selected as necessary, and is, for example, about several μm to several tens of μm.

Next, as shown in FIG. 38A, after an insulating film such as a SiO ₂ film is formed on the entire surface by CVD or the like so as to cover the GaN-based semiconductor layer 13, this insulating film is formed on the first support substrate by RIE, for example. The sidewall spacer 117 made of an insulator is formed on the side surface of the GaN-based semiconductor layer 13 by etching in a direction perpendicular to the surface of 16.

  Next, as shown in FIG. 38B, the second surface 13 b side of the GaN-based semiconductor layer 13 is vacuum-adsorbed and transferred by the vacuum tweezers 115, and the organic formed on one main surface of the second support substrate 18. A plurality of GaN-based semiconductor layers 13 are arrayed by bonding to the system-based adhesive layer 118. In this case, the GaN-based semiconductor layers 13 are arranged in close contact with each other via the sidewall spacers 117 formed on the side surfaces thereof.

  Next, as shown in FIG. 39A, the necessary second electrode 17 is formed on the second surface 13b of the GaN-based semiconductor layer 13. The material of the second electrode 17 and the method of forming the second electrode 17 are selected as necessary. The material of the second electrode 17 is that the second electrode 17 is an ohmic electrode or a Schottky electrode, or the conductivity of the uppermost layer of the GaN-based semiconductor layer 13 with which the second electrode 17 contacts. It is appropriately selected according to the mold. Specifically, the second electrode 17 uses, for example, a Ti / Al / Au multilayer film in order from the bottom, and the thickness of each film is, for example, 5 nm for the Ti film, 45 nm for the Al film, and 10 nm. The second electrode 17 is formed by forming a metal film or an alloy film for forming the second electrode 17 on the entire surface by, for example, a vacuum deposition method or a sputtering method, and then using the metal film or the alloy film as a photo film. It is formed by patterning into a predetermined shape by lithography and etching. In this case, since the sidewall spacer 117 is formed in the gap between the GaN-based semiconductor layers 13, no metal film or alloy film is formed on the side surface of the GaN-based semiconductor layer 13. Preferably, the second surface 13b of the GaN-based semiconductor layer 13 is cleaned before the metal film or alloy film for forming the second electrode 17 is formed, and the vertical conduction resistance is further increased. In order to reduce the thickness, the thickness of the GaN-based semiconductor layer 13 may be reduced by performing dry etching or the like from the second surface 13b side. In FIG. 39A, the second electrode 17 is formed on the entire second surface 13b of the GaN-based semiconductor layer 13, but the portion excluding the peripheral portion of the second surface 13b of the GaN-based semiconductor layer 13 For example, you may form in the part inside 6 micrometers or more from an edge. If the second electrode 17 is an ohmic electrode, a second electrode 17 is formed on the second surface 13b of the GaN-based semiconductor layer 13 as necessary, and then a laser is applied to the second electrode 17. By performing laser annealing by irradiating with light, the second electrode 17 can be brought into ohmic contact with the GaN-based semiconductor layer 13 with lower resistance. For example, when the second electrode 17 is made of a multilayer metal film having a total thickness of 50 nm composed of the above-described Ti film, Al film, and Au film, a pulse laser having a wavelength of 365 nm or less having a photon energy higher than the band gap of GaN. By irradiating the second electrode 17 with light and instantaneously heating the GaN-based semiconductor layer 13 in contact with the second electrode 17, the second electrode 17 has a lower resistance than the GaN-based semiconductor layer 13. Can make ohmic contact. Specifically, for example, a THG (third harmonic) pulse laser beam with a wavelength of 355 nm or a QHD (fourth harmonic) pulse laser beam with a wavelength of 266 nm using a YAG laser is used as the pulse laser beam with a wavelength of 365 nm or less. Can do.

  Next, as shown in FIG. 39B, a metal layer 112 is formed on the surface on the second electrode 17 side by vacuum vapor deposition, electrodeposition (plating), or the like. Although the thickness of this metal layer 112 is selected as needed, it is 3-30 micrometers, for example. As a material of the metal layer 112, for example, Au or Cu can be used. This metal layer 112 is used as a pad electrode.

  Next, as shown in FIG. 40A, the metal layer 112 is diced to form grooves 113 so that the GaN-based semiconductor layers 13 can be easily separated from each other in a later step. The groove 113 is formed for each one or a plurality of GaN-based semiconductor layers 13 as necessary. In FIG. 40A, a groove 113 is formed for each GaN-based semiconductor layer 13.

  Next, as shown in FIG. 40B, the metal layer 112 side is attached to the stretched tape 114, and the second support substrate 18 is peeled off. For example, when an organic adhesive layer 118 made of a thermoplastic resin is used, the second support substrate 18 is moved from the metal layer 112 side while the organic adhesive layer 118 is softened by heating. By pulling apart, the second support substrate 18 can be peeled off. Alternatively, if the organic adhesive layer 118 is soluble in the solvent, the second support substrate 18 can be peeled by dissolving the organic adhesive layer 118 by immersing in the solvent. Thereafter, the GaN-based semiconductor layer 13 on which the first electrode 14 and the second electrode 17 are formed is peeled from the stretched tape 114.

As described above, a GaN-based semiconductor element using one GaN-based semiconductor layer 13 can be manufactured. This GaN-based semiconductor element is, for example, a GaN-based diode. The GaN-based diode is a pn junction diode or a Schottky diode. In the pn junction diode, both the first electrode 14 and the second electrode 17 are ohmic electrodes, and in the Schottky diode, the first electrode 14 and the second electrode 17 are used. One of them is a Schottky electrode, and the other is an ohmic electrode.
According to the fourteenth embodiment, advantages similar to those of the seventh embodiment can be obtained.

  Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications based on the technical idea of the present invention are possible.

For example, the numerical values, structures, materials, and the like given in the above-described embodiments are merely examples, and different numerical values, structures, materials, and the like may be used as necessary. Moreover, you may combine any 2 or more of 1st-14th embodiment as needed.
Further, for example, in the thirteenth embodiment, instead of forming the organic adhesive layer 111 on one main surface of the first support substrate 16, the process proceeds to the state shown in FIG. The organic adhesive layer 111 may be applied to the surface on the electrode 14 side by spin coating or the like. In this case, the first support substrate 16 is pressed onto the organic adhesive layer 111, irradiated with ultraviolet rays, and the organic adhesive layer 111 is solidified by curing (UV curing).

  11, 21, 31, 41, 51, 81, 91 ... base substrate, 12, 22, 32, 42, 52, 71, 82, 92 ... growth mask, 12a, 22a, 32a, 42a, 52a, 71a, 82a, 92a ... stripe window, 12b ... auxiliary stripe window, 12c ... mask portion, 13 ... GaN-based semiconductor layer, 14 ... first electrode, 15 ... metal for bonding, 16 ... first support substrate, 17 ... second electrode 18 ... second support substrate, 111, 118 ... organic adhesive layer, 114 ... stretched tape, 115,116 ... vacuum tweezers, 117 ... side wall spacer

Claims (16)

Forming a growth mask having a plurality of stripe-shaped openings directly or indirectly on a substrate made of a material different from a GaN-based semiconductor;
Using the growth mask, a plurality of island-shaped GaN-based semiconductor layers are oriented in the (0001) plane on the substrate, and the <1-100> direction of the GaN-based semiconductor layer is the stripe-shaped opening of the growth mask. Growing so as to extend in a direction parallel to
Forming one or more first electrodes on the upper surface of the GaN-based semiconductor layer;
Removing at least a portion of the growth mask after forming the first electrode;
After removing at least a part of the growth mask, bonding a first support substrate to the top surface of the GaN-based semiconductor layer on which the first electrode is formed via an organic adhesive layer;
Peeling the first support substrate and the GaN-based semiconductor layer from the substrate;
Forming the one or more second electrodes on the exposed surface of the GaN-based semiconductor layer after peeling the first support substrate and the GaN-based semiconductor layer from the substrate;
The GaN-based semiconductor layer in which the first electrode and the second electrode is formed is closed and a step of peeling from the first support substrate,
The growth mask has a first period in a first direction parallel to the <11-20> direction of the GaN-based semiconductor layer and in a second direction parallel to the <1-100> direction of the GaN-based semiconductor layer. And a plurality of stripe-shaped openings periodically arranged in the second period and extending in the second direction, and a region between the pair of adjacent stripe-shaped openings in the first direction. On the bisector, there are auxiliary stripe-shaped openings provided so as to overlap each other by a predetermined distance with the opposite end portions of the pair of stripe-shaped openings adjacent to each other in the second direction, Alternatively, the GaN-based semiconductor layer is periodically arranged in a first direction parallel to the <11-20> direction, and extends in a second direction parallel to the <1-100> direction of the GaN-based semiconductor layer. Multiple striped And the ends of the stripe-shaped openings in the second direction are periodically arranged at the same period as the stripe-shaped openings in the first direction and at a half cycle shift with respect to the stripe-shaped openings. And a plurality of stripe-shaped openings extending in the second direction so as to overlap with each other by a predetermined distance .   The side surface of the GaN-based semiconductor layer is formed by a (1-10α) plane (α is an arbitrary integer), (11-2β) plane (β is an arbitrary integer) or a crystallographically equivalent plane, or 2. The method of manufacturing a semiconductor device according to claim 1, wherein the side surface of the GaN-based semiconductor layer includes a (1-10α) plane (α is an arbitrary integer). 3. The semiconductor device according to claim 1, wherein the GaN-based semiconductor layer is composed of two or more layers including at least one of an n-type layer, an undoped layer, and a p-type layer. Method. 4. The method of manufacturing a semiconductor device according to claim 1, wherein after the GaN-based semiconductor layer is grown on the substrate, all of the growth mask is removed. After the second support substrate is attached to the second electrode side, the GaN-based semiconductor layer on which the first electrode and the second electrode are formed is peeled from the first support substrate. The manufacturing method of the semiconductor element as described in any one of Claims 1-4 characterized by the above-mentioned. After the second electrode is formed, the second electrode is included before the GaN-based semiconductor layer on which the first electrode and the second electrode are formed is peeled from the first support substrate. 6. The method of manufacturing a semiconductor element according to claim 1, further comprising a step of forming a metal layer on the entire surface. After forming the metal layer, before peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the first support substrate, one or more of the GaN-based semiconductors 7. The method of manufacturing a semiconductor element according to claim 6, further comprising a step of forming a groove in the metal layer for each layer. 6. The method of manufacturing a semiconductor element according to claim 5, wherein the second support substrate is a dicing tape or a stretched tape. Forming a growth mask having a plurality of stripe-shaped openings directly or indirectly on a substrate made of a material different from a GaN-based semiconductor;
Using the growth mask, a plurality of island-shaped GaN-based semiconductor layers are oriented in the (0001) plane on the substrate, and the <1-100> direction of the GaN-based semiconductor layer is the stripe-shaped opening of the growth mask. Growing so as to extend in a direction parallel to
Forming one or more first electrodes on the upper surface of the GaN-based semiconductor layer;
Removing at least a portion of the growth mask after forming the first electrode;
Removing at least a portion of the growth mask and then peeling the GaN-based semiconductor layer on which the first electrode is formed from the substrate;
After the GaN-based semiconductor layer on which the first electrode is formed is peeled from the substrate, the first electrode side of the GaN-based semiconductor layer on which the first electrode is formed is connected to the first support substrate. A process of pressing and adhering to the first organic adhesive layer formed on one main surface;
Forming a sidewall spacer made of an insulator on the side surface of the GaN-based semiconductor layer;
After the GaN-based semiconductor layer having the sidewall spacer formed on the side surface is peeled off from the first support substrate by vacuum adsorption, a second organic adhesion formed on one main surface of the second support substrate Bonding a plurality of the GaN-based semiconductor layers to each other in a state of being close to each other via the sidewall spacer;
Forming one or a plurality of second electrodes on exposed surfaces of the plurality of GaN-based semiconductor layers bonded to the second organic-based adhesive layer of the second support substrate;
And a step of peeling the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the second support substrate. The side surface of the GaN-based semiconductor layer is formed by a (1-10α) plane (α is an arbitrary integer), (11-2β) plane (β is an arbitrary integer) or a crystallographically equivalent plane, or 10. The method for manufacturing a semiconductor device according to claim 9, wherein the side surface of the GaN-based semiconductor layer includes a (1-10α) plane (α is an arbitrary integer). The growth mask has a first period in a first direction parallel to the <11-20> direction of the GaN-based semiconductor layer and in a second direction parallel to the <1-100> direction of the GaN-based semiconductor layer. And a plurality of stripe-shaped openings periodically arranged in the second period and extending in the second direction, and a region between the pair of adjacent stripe-shaped openings in the first direction. On the bisector, there are auxiliary stripe-shaped openings provided so as to overlap each other by a predetermined distance from the opposite end portions of the pair of stripe-shaped openings adjacent to each other in the second direction. 11. The method of manufacturing a semiconductor device according to claim 9, The growth mask is periodically arranged in a first direction parallel to the <11-20> direction of the GaN-based semiconductor layer, and a second direction parallel to the <1-100> direction of the GaN-based semiconductor layer. A plurality of stripe-shaped openings extending in the first direction and periodically arranged in the first direction with the same period as the stripe-shaped opening and with a half period shift with respect to the stripe-shaped opening, 11. A semiconductor device according to claim 9, further comprising a plurality of stripe-shaped openings extending in the second direction so as to overlap with a terminal portion of the stripe-shaped opening in a direction. Method. The GaN-based semiconductor layer is composed of two or more layers including at least one of an n-type layer, an undoped layer, and a p-type layer. A method for manufacturing a semiconductor device. The method of manufacturing a semiconductor device according to claim 9, wherein after the GaN-based semiconductor layer is grown on the substrate, all of the growth mask is removed. After the second electrode is formed, the second electrode is included before the GaN-based semiconductor layer on which the first electrode and the second electrode are formed is separated from the second support substrate. The method for manufacturing a semiconductor element according to claim 9, further comprising a step of forming a metal layer on the entire surface. After forming the metal layer, before separating the GaN-based semiconductor layer on which the first electrode and the second electrode are formed from the second support substrate, one or more of the GaN-based semiconductors 16. The method of manufacturing a semiconductor device according to claim 15, further comprising a step of forming a groove in the metal layer for each layer.