JP5680773B1 - Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト - Google Patents
Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト Download PDFInfo
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- JP5680773B1 JP5680773B1 JP2014014702A JP2014014702A JP5680773B1 JP 5680773 B1 JP5680773 B1 JP 5680773B1 JP 2014014702 A JP2014014702 A JP 2014014702A JP 2014014702 A JP2014014702 A JP 2014014702A JP 5680773 B1 JP5680773 B1 JP 5680773B1
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- Prior art keywords
- ball
- core
- solder
- core ball
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- 229910000679 solder Inorganic materials 0.000 title claims description 90
- 239000006260 foam Substances 0.000 title claims description 6
- 238000007747 plating Methods 0.000 claims abstract description 127
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 44
- 229910052745 lead Inorganic materials 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 4
- 229910052770 Uranium Inorganic materials 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 34
- 238000005259 measurement Methods 0.000 description 19
- 239000000243 solution Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 14
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 11
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000012535 impurity Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 229910052776 Thorium Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 238000007654 immersion Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000005260 alpha ray Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000002285 radioactive effect Effects 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052699 polonium Inorganic materials 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- -1 silver ions Chemical class 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- LWFUFLREGJMOIZ-UHFFFAOYSA-N 3,5-dinitrosalicylic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1O LWFUFLREGJMOIZ-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 230000005262 alpha decay Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005255 beta decay Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical group [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53233—Copper alloys
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014014702A JP5680773B1 (ja) | 2014-01-29 | 2014-01-29 | Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト |
| KR1020150014259A KR101550560B1 (ko) | 2014-01-29 | 2015-01-29 | Cu 코어 볼, 땜납 이음, 폼 땜납 및 땜납 페이스트 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014014702A JP5680773B1 (ja) | 2014-01-29 | 2014-01-29 | Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP5680773B1 true JP5680773B1 (ja) | 2015-03-04 |
| JP2015140466A JP2015140466A (ja) | 2015-08-03 |
Family
ID=52684809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014014702A Active JP5680773B1 (ja) | 2014-01-29 | 2014-01-29 | Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5680773B1 (ko) |
| KR (1) | KR101550560B1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5935938B1 (ja) * | 2015-12-28 | 2016-06-15 | 千住金属工業株式会社 | 導電接合シートおよび導電接合シートの製造方法。 |
| KR20170125557A (ko) * | 2016-05-04 | 2017-11-15 | 덕산하이메탈(주) | 솔더볼, 이의 제조방법 및 이를 이용한 전자부품 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6199646A (ja) * | 1984-10-20 | 1986-05-17 | Tanaka Denshi Kogyo Kk | 半導体素子のボンデイング用銅線 |
| WO1995024113A1 (fr) * | 1994-03-01 | 1995-09-08 | Sumitomo Special Metals Company Limited | Boule en cuivre et procede de production de cette derniere |
| JP2007115857A (ja) * | 2005-10-20 | 2007-05-10 | Nippon Steel Chem Co Ltd | マイクロボール |
| JP2010282832A (ja) * | 2009-06-04 | 2010-12-16 | Hitachi Metals Ltd | 接合材料及びその製造方法、並びにそれを用いた実装方法 |
| WO2011118009A1 (ja) * | 2010-03-25 | 2011-09-29 | 田中電子工業株式会社 | 高純度Ｃｕボンディングワイヤ |
| JP2011206815A (ja) * | 2010-03-30 | 2011-10-20 | Hitachi Metals Ltd | 電子部品用複合ボールの製造方法 |
| WO2012120982A1 (ja) * | 2011-03-07 | 2012-09-13 | Jx日鉱日石金属株式会社 | α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ |
| JP5408401B1 (ja) * | 2013-06-19 | 2014-02-05 | 千住金属工業株式会社 | Ｃｕ核ボール |
| JP5435182B1 (ja) * | 2012-12-06 | 2014-03-05 | 千住金属工業株式会社 | Ｃｕボール |
-
2014
- 2014-01-29 JP JP2014014702A patent/JP5680773B1/ja active Active
-
2015
- 2015-01-29 KR KR1020150014259A patent/KR101550560B1/ko active IP Right Grant
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6199646A (ja) * | 1984-10-20 | 1986-05-17 | Tanaka Denshi Kogyo Kk | 半導体素子のボンデイング用銅線 |
| WO1995024113A1 (fr) * | 1994-03-01 | 1995-09-08 | Sumitomo Special Metals Company Limited | Boule en cuivre et procede de production de cette derniere |
| JP2007115857A (ja) * | 2005-10-20 | 2007-05-10 | Nippon Steel Chem Co Ltd | マイクロボール |
| JP2010282832A (ja) * | 2009-06-04 | 2010-12-16 | Hitachi Metals Ltd | 接合材料及びその製造方法、並びにそれを用いた実装方法 |
| WO2011118009A1 (ja) * | 2010-03-25 | 2011-09-29 | 田中電子工業株式会社 | 高純度Ｃｕボンディングワイヤ |
| JP2011206815A (ja) * | 2010-03-30 | 2011-10-20 | Hitachi Metals Ltd | 電子部品用複合ボールの製造方法 |
| WO2012120982A1 (ja) * | 2011-03-07 | 2012-09-13 | Jx日鉱日石金属株式会社 | α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ |
| JP5435182B1 (ja) * | 2012-12-06 | 2014-03-05 | 千住金属工業株式会社 | Ｃｕボール |
| JP5408401B1 (ja) * | 2013-06-19 | 2014-02-05 | 千住金属工業株式会社 | Ｃｕ核ボール |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150090858A (ko) | 2015-08-06 |
| JP2015140466A (ja) | 2015-08-03 |
| KR101550560B1 (ko) | 2015-09-04 |
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