JP5659807B2 - Roll-to-roll vacuum double-sided film forming equipment and double-sided metal base layered resin film manufacturing equipment - Google Patents

Description

  The present invention relates to a roll-to-roll vacuum double-sided film forming apparatus for forming a film on the long resin film with a vacuum film-forming mechanism while conveying a long resin film in a roll-to-roll system, The present invention relates to an apparatus for producing a resin film with a metal base layer in which the roll-to-roll system film forming apparatus is applied to the production of a resin film with a double-sided metal base layer. It can utilize suitably for manufacture of the resin film with a metal base layer which forms a metal film on both surfaces especially.

  Liquid crystal panels, notebook computers, digital cameras, mobile phones, etc. use a variety of flexible wiring boards obtained by coating a metal film on a heat-resistant resin film. A heat-resistant resin film with a metal film in which a metal film is formed on one surface or both surfaces of a heat-resistant resin film is used. The heat resistance resin film with a metal film is required to have flatness as the wiring pattern becomes finer and higher in density.

As a method for producing a heat-resistant resin film with a metal film as described above, conventionally, (1) a method of producing a metal foil by attaching it to a heat-resistant resin film with an adhesive,
(2) A method in which a metal foil is coated with a heat-resistant resin solution and then dried.
(3) A method of manufacturing a metal film by forming a metal film on a heat-resistant resin film by vacuum deposition (vacuum deposition, sputtering, ion plating, ion beam sputtering, etc.) or wet plating is known. ing.

  Further, as a third manufacturing method using a vacuum film formation method or a wet plating method, in Patent Document 1, a heat-resistant resin with a metal film is formed by using a sputtering method capable of forming a metal film having a low film formation speed but excellent adhesion. A method for producing a film is disclosed, and in Patent Document 2, a thin metal base layer is first formed using a sputtering method capable of forming a metal film having a low film formation rate but excellent adhesion, and then, Thus, a method of efficiently producing a heat-resistant resin film with a metal film by forming a thick metal film on the metal base layer using a wet plating method having a high film formation rate is disclosed.

  Patent Document 1 also discloses a method using two types of sputtering targets in order to further increase the adhesion of the metal film. That is, a method has been proposed in which a first metal thin film is first formed using nickel copper alloy as a sputtering target, and then a thick metal film is formed on the metal seed layer using copper or the like as a sputtering target. .

  Further, Patent Document 2 discloses a technique in which an electroplating method having a high film formation rate and a sputtering method having a low film formation rate are used in combination. The manufacturing method described in Patent Document 2 is widely used because the manufacturing method is superior to the method disclosed in Patent Document 1 using only the sputtering method.

  FIG. 1 shows the structure of a heat-resistant resin film with a metal film produced by a sputtering method and a wet plating method (electroplating method). A metal seed layer 301 and a metal base layer 302 are formed on the heat-resistant resin film 300 by a sputtering method, and a metal film 303 is formed by a wet plating method.

  Incidentally, there are two methods for forming the metal base layer 302 on both surfaces of the heat resistant resin film 300 by a vacuum film forming method such as a sputtering method. First, after the metal base layer 302 is formed on the first film-forming surface of the heat-resistant resin film 300, the metal base layer 302 is once taken out from the vacuum film-forming apparatus, and the heat-resistant resin film 1 is turned over and set to form the second film. The metal base layer 302 is formed on the surface, and the other method is to form the metal base layer 302 on the surface of the heat resistant resin film 300 shown in FIG. There is a method for forming the base layer 302. Patent Document 3 discloses a technique in which a magnetic thin film is continuously formed on both surfaces of a continuous polymer film by a sputtering method. Needless to say, the latter method of continuously performing the double-sided film formation does not wind up after the surface film formation and is not released to the atmosphere, so that the film formation characteristics are stabilized. However, since the continuous film forming apparatus described in Patent Document 3 includes an upward magnetic target and a downward magnetic target in order to perform double-sided film formation, the width of the target of the continuous film forming apparatus exceeds 50 cm and is enlarged. There are also problems such as maintenance of target replacement and control of the refrigerant flow rate inside the magnetic target, and a structure such as rotating the sputtering cathode with a motor is added when the target is replaced.

  The double-sided film forming apparatus (2-can roll) shown in FIG. 2 will be described. This double-sided film forming apparatus is equipped with a load lock mechanism capable of exchanging films without opening the film forming chamber to the atmosphere. Between the unwinding roll chamber 1 and the first film forming chamber 3, when the unwinding roll chamber 1 is released to the atmosphere, a heat-resistant resin film 26 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 2 with a mechanism is provided. The first film formation chamber 3 and the second film formation chamber 11 are connected by a connection chamber 8. Between the winding roll chamber 9 and the second film forming chamber 11, when the winding roll chamber 9 is released to the atmosphere, a heat-resistant resin film 26 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 10 with a mechanism is provided. The heat-resistant resin film 26 unwound from the unwinding roll 27 is formed on the first film forming surface on the can roll 5 in the first film forming chamber 3 by the sputtering method from the sputtering cathodes 22, 23, 24, 25. Subsequently, the film is formed on the second film formation surface on the can roll 13 in the second film formation chamber 11 by the sputtering method from the sputtering cathodes 17, 18, 19, and 20, and is taken up by the take-up roll 21. The unwinding roll 27 and the winding roll 21 maintain the tension balance of the heat resistant resin film 26 by torque control of the servo motor, and the long heat resistant resin is removed from the unwinding roll 21 by the rotation of the two can rolls 5 and 13. The film 26 is unwound and wound on the take-up roll 21. Drive rolls 4, 6, 14, and 12 and free rolls 28, 7, 15, and 16 that change the transport direction are arranged on the transport path from the unwind roll 27 to the take-up roll 21. You may arrange | position a tension | tensile_strength sensor roll between a drive roll, a free roll, an unwinding roll, and a winding roll.

  Next, the double-sided film forming apparatus (4 can roll) shown in FIG. 3 will be described. This double-sided film forming apparatus is also equipped with a load lock mechanism that enables film replacement without releasing the film forming chamber to the atmosphere. Between the unwinding roll chamber 100 and the first film forming chamber 102, when the unwinding roll chamber 101 is released to the atmosphere, a heat-resistant resin film 142 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 101 with a mechanism is provided. The second film formation chamber 106 and the fourth film formation chamber 114 are connected by a connection chamber 111. Between the winding roll chamber 112 and the fourth film forming chamber 114, when the winding roll chamber 112 is released to the atmosphere, a heat-resistant resin film 142 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 113 with a mechanism is provided. The heat resistant resin film 142 unwound from the unwinding roll 143 is formed on the first film-forming surface on the can roll 104 in the first film-forming chamber 102 by sputtering from the sputtering cathodes 139, 138, 140, 141. Subsequently, a film is formed on the first film formation surface on the can roll 108 in the second film formation chamber 106 by the sputtering method from the sputtering cathodes 133, 134, 135, 136, and the can roll in the third film formation chamber 118. A film is formed by sputtering on the second film formation surface on 120 from the sputtering cathodes 124, 125, 126, and 127, and then the sputtering cathode 129 is formed on the second film formation surface on the can roll 116 in the fourth film formation chamber 114. , 128, 130, 131 are formed by sputtering and wound on a winding roll 132. It is. The unwinding roll 143 and the winding roll 132 maintain the tension balance of the heat-resistant resin film 142 by the torque control of the servo motor, and are long from the unwinding roll 143 by the rotation of the four can rolls 104, 108, 116, 120. The heat-resistant resin film 142 is unwound and wound on the winding roll 132. Drive rolls 103, 105, 107, 109, 115, 117, 119, 121 and free rolls 137, 110, 122, 123 that change the transport direction are arranged on the transport path from the unwinding roll 143 to the winding roll 132. ing. You may arrange | position a tension | tensile_strength sensor roll between a drive roll, a free roll, an unwinding roll, and a winding roll.

  However, in the method shown in FIG. 2 and FIG. 3, the winding roll chamber is arranged at the center of the apparatus, so that the heat-resistant resin film, which is a heavy material, cannot be easily taken out. Further, when the apparatus shown in FIGS. 2 and 3 is installed in a clean room, it is inevitable to install a film forming chamber that generates a large amount of dust during cleaning in the creel room.

Japanese Patent No. 3447070 Japanese Patent No. 3570802 JP 2004-11023 A

  In view of the problems as described above, the present invention provides a roll-to-roll type vacuum double-sided film forming apparatus that performs double-sided film formation with excellent flatness and excellent productivity. is there. Specifically, an object of the present invention is to provide a roll-to-roll vacuum double-sided film forming apparatus that can efficiently attach and remove a long resin film and is easy to maintain.

  Therefore, in order to solve the above problems, the present inventor includes a load lock mechanism that is transported by a roll-to-roll system and that can shut off the unwinding roll chamber and the winding roll chamber from the film forming chamber. Roll-to-roll type vacuum double-sided film formation consisting of at least two can rolls with a structure in which a roll wrapped with a long resin film can be exchanged without releasing the atmosphere, and vacuum film forming means is arranged In the apparatus, a roll-to-roll type vacuum double-sided film forming apparatus in which the unwinding roll chamber and the winding roll chamber are arranged in the vertical direction, and the can roll is also arranged in the vertical direction, is used. Tried.

  That is, by arranging such an unwinding roll chamber and a winding roll chamber, and at least two or more can rolls above and below, the unwinding roll chamber and the winding roll chamber are arranged on the same outer wall surface of the apparatus. It becomes possible to attach and remove the film from the unwinding roll chamber and the winding roll chamber, and when installing in the clean room, only the unwinding roll chamber and the winding roll chamber are installed in the clean room, A film forming chamber that generates a large amount of dust during cleaning can be easily installed in a separate chamber from the unwinding roll chamber and the winding roll chamber.

  Therefore, the roll-to-roll type vacuum double-sided film forming apparatus of the present invention has found a film forming apparatus that efficiently forms a film on both sides of a long resin film. The present invention has been completed based on such technical knowledge.

That is, the first invention of the present invention conveys a long resin film unwound from an unwinding roll in an unwinding roll chamber via a film-forming chamber that can withstand a reduced pressure atmosphere by a roll-to-roll method, Conveys a long resin film in the film forming chamber with a load lock mechanism capable of winding up the winding roll in the winding roll chamber and blocking the atmosphere from the film forming chamber. In the film forming chamber on the road, in a roll-to-roll method film forming apparatus provided with two or more can rolls facing the vacuum film forming means and in which a refrigerant circulates,
It said take-up chamber and the unwinding chamber, and be distribution only to the outer wall of one side of the film forming chamber, and the unwinding chamber in the vertical direction of the film forming chamber is on the take-up chamber or The room that is arranged below and attaches the unwinding roll to the unwinding chamber and the room that takes out the winding roll from the winding chamber are different from the room in which the film forming chamber is installed and the atmosphere is released to the atmosphere. It is characterized by that.

In the second invention, the can roll of the first invention is arranged such that, among the two or more can rolls, the can roll closest to the unwinding roll is on the transport path of the long resin film, characterized in that in the position of the upper or lower than the closest can roll on the take-up roll.

In a third aspect of the present invention, the transport path of the long resin film according to the first or second aspect is formed on one surface of the long resin film by a vacuum film forming unit facing the can roll. Further, another vacuum film forming means facing another can roll is arranged at a position where film formation is performed on the other surface of the long resin film.

The fourth invention, the two or more can roll the third inventions First, etc. ho toward the downstream of the conveying path characterized in that it is the control of rotational speed is increased, a fifth invention the two or more can roll the third invention from the first, characterized in that said nearly as rotating speed toward the downstream of the conveyance path is delayed control is.

  A sixth invention is characterized in that the vacuum film forming means of the first to fifth inventions is a sputtering cathode.

  Further, the seventh invention is characterized in that the opening portion of the unwinding roll chamber and the winding roll chamber provided with the load lock mechanism of the first to sixth inventions is arranged in a clean room.

  The eighth invention is a double-sided metal base layer-attached film characterized in that a heat-resistant resin film with a metal base layer is formed by the roll-to-roll type vacuum double-sided film forming apparatus of the first to sixth inventions. It is a heat resistant resin film manufacturing apparatus.

According to the roll-to-roll type film forming apparatus of the present invention, the unwinding roll chamber and the winding roll chamber are disposed only on the outer wall surface on the same side of the film forming chamber, and In the vertical direction, the unwinding chamber is disposed above or below the winding chamber, and the film forming chamber is disposed between the unwinding chamber and the winding chamber. Therefore, the unwinding roll chamber and the winding roll chamber can be arranged in the same direction of the film forming chamber, and the film can be easily attached and detached from the unwinding roll chamber and the winding roll chamber. The roll-to-roll type film forming apparatus of the present invention has only the unwinding roll chamber and the winding roll chamber installed in a clean room, and the film forming chamber that generates a large amount of dust during cleaning includes an unwinding roll chamber and a winding roll chamber. Can be installed in a separate room, facilitating the maintenance of the clean room. Further, it is excellent in terms of maintenance and management such as maintenance of the film forming apparatus. As a result, the clean room where the unwind roll chamber and the take-up roll chamber, which require a high degree of cleanliness, can be reduced in area, and the clean room management cost can be reduced. Can be isolated from the dust and quality can be improved.
From these effects, a heat-resistant resin film with a double-sided metal base layer can be produced efficiently.

Sectional drawing which shows schematic structure of the heat resistant resin film with a metal film formed into a film by this invention. Explanatory drawing which shows schematic structure of the manufacturing apparatus (2 can roll) of the heat resistant resin film with a metal base layer which concerns on a prior art. Explanatory drawing which shows schematic structure of the manufacturing apparatus (4 can roll) of the heat resistant resin film with a metal base layer which concerns on a prior art. Explanatory drawing which shows schematic structure of the manufacturing apparatus (2 can roll) of the heat resistant resin film with a metal base layer which concerns on this invention. Explanatory drawing which shows schematic structure of the manufacturing apparatus (4 can roll) of the heat resistant resin film with a metal base layer which concerns on this invention. Explanatory drawing which shows schematic structure of the manufacturing apparatus (4 can roll) of the heat resistant resin film with a metal base layer which concerns on this invention. Explanatory drawing which shows schematic structure of the heat resistant resin film with a metal base layer which concerns on this invention.

The present invention conveys a long resin film unwound from an unwinding roll in an unwinding roll chamber via a film forming chamber that can withstand a reduced pressure atmosphere by a roll-to-roll method, and winds up the winding roll chamber. The unwinding roll chamber and the winding roll chamber have a load lock mechanism that can shut off the atmosphere from the film forming chamber, while being wound on a roll, and vacuum film formation is performed on the long resin film conveyance path in the film forming chamber. In a roll-to-roll type film forming apparatus provided with two or more can rolls facing the means and in which a refrigerant circulates, the unwinding chamber and the winding chamber are located on the same side of the film forming chamber. A roll-to-roll vacuum double-sided composition characterized in that it is arranged only on the outer wall surface and the unwinding chamber is arranged above or below the winding chamber in the vertical direction of the film forming chamber. It is a membrane device. The roll-to-roll type vacuum double-sided film forming apparatus of the present invention will be described by taking as an example a heat-resistant resin film manufacturing apparatus with a double-sided metal base layer in which metal films are formed on both sides of a long heat-resistant resin film among long resin films. To do.
1. Heat-resistant resin film with double-sided metal base layer As shown in FIG. 1, the heat-resistant resin film with double-sided metal base layer has a metal seed layer 301, a metal base layer 302, In this structure, the metal films 303 are stacked in this order.

  The metal seed layer 302 is preferably formed of a nickel-chromium alloy. The thickness of the metal seed layer is desirably 5 nm to 50 nm.

  When the thickness of the metal seed layer 301 made of a nickel-chromium alloy containing chromium as an additive element is less than 5 nm, a problem arises in the long-term adhesion of the metal seed layer 301 even after the subsequent processing steps. . Furthermore, if the thickness of the metal seed layer 301 is less than 5 nm, the wiring peel strength (adhesion between the wiring and the substrate) is remarkably lowered due to the penetration of the etching solution when the wiring is processed and the wiring part floating. This is not preferable because of the above problem. On the other hand, when the thickness of the metal seed layer 301 exceeds 50 nm, it is difficult to remove the metal seed layer 301 during processing of the wiring portion, and further, there is a case where the adhesion strength is reduced due to the occurrence of hair cracks or warpage. Therefore, it is not preferable. Further, if the layer thickness is greater than 50 nm, it is difficult to perform etching, which is not preferable.

  The component composition of the metal seed layer 301 is required to have a chromium ratio of 5 to 40% by weight from the viewpoint of heat resistance and corrosion resistance, and a more desirable chromium ratio is 12 to 22% by weight. That is, when the chromium content is less than 5% by weight, the heat resistance is lowered, whereas when the chromium content exceeds 40% by weight, it is difficult to remove the metal seed layer 301 during the processing of the wiring portion. This is not preferable. Furthermore, other transition metal elements such as molybdenum and vanadium can be appropriately added to the nickel-chromium alloy in accordance with the purpose and characteristics in order to improve heat resistance and corrosion resistance. Note that the composition of the metal seed layer is determined in consideration of improvement in corrosion resistance and insulation reliability and workability of the wiring portion.

  The thickness of the metal base layer 303 is desirably 50 nm to 1000 nm or less, and more desirably 50 nm to 500 nm. Copper is used for the metal base layer.

  The metal film 303 is formed on the surface of the metal base layer 302 as necessary. The metal film 303 is preferably formed of copper because it is processed by wiring and becomes a conductor. The thickness including the metal base layer 301 and the metal film 303 is preferably 10 nm to 12 μm. Note that the thickness of the metal film 303 can be appropriately selected according to a wiring pattern forming method described later, and it can be appropriately selected that the metal film 303 is not provided.

  Resin selected from polyimide film, polyamide film, polyamideimide film, polyester film, polytetrafluoroethylene film, polyphenylene sulfide film, polyethylene naphthalate film or liquid crystal polymer film as the heat resistant resin film The film is preferable because it has flexibility as a flexible substrate with a metal film, strength required for practical use, and electrical insulation suitable as a wiring material.

  The manufacturing procedure of the heat resistant resin film with a metal base layer is as follows. The metal seed layer 301 is formed on the surface of the heat resistant resin film 300 and the metal base layer 302 is formed on the surface of each metal seed layer 301 by sputtering. A layered heat-resistant resin film is manufactured, and subsequently, a metal film 303 is formed on the surface of each metal base layer 302 by a wet plating method. As the wet plating method, a known electroless plating method or electrolytic plating method can be used, and a plurality of wet plating methods may be combined.

2. Film Forming Apparatus The roll-to-roll type vacuum double-sided film forming apparatus of the present invention can be applied as means for forming a metal seed layer and a metal base layer on both sides of a long resin film.
The film forming apparatus according to the present invention is arranged on a conveyance path between a roll and a roll of a long resin film and is opposed to the outer periphery of the can roll, in which a coolant circulates inside the water-cooled temperature-controlled interior. And a sputter sputtering cathode in which a coolant circulates. Since sputtering film formation is performed in a state where a long resin film is wound around a can roll, thermal damage of the heat-resistant resin film due to plasma during film formation can be reduced.

  In addition, the tension roll of the resin film is maintained by the torque control of the servo motor in the unwinding roll and the winding roll, and the long resin film is unwound from the unwinding roll by the rotation of the can roll, so that the winding roll It is wound up.

3. Heat-resistant resin film manufacturing apparatus with double-sided metal base layer The heat-resistant resin film manufacturing apparatus with double-sided metal base layer of the present invention will be described in detail with reference to FIGS. 4, 5, and 6. The heat-resistant resin film manufacturing apparatus with a double-sided metal base layer shown in FIG. 4 of the present invention includes two can rolls facing a sputtering sputtering cathode that is a vacuum film forming means, and corresponds to the conventional apparatus shown in FIG. On the other hand, the heat-resistant resin film manufacturing apparatus with double-sided metal base layer shown in FIGS. 5 and 6 of the present invention includes four can rolls and corresponds to the conventional apparatus shown in FIG.

  In the film forming apparatus of the present invention, the unwinding chamber and the winding chamber are disposed only on the outer wall on one side of the film forming chamber, and the unwinding is performed in the vertical direction of the film forming chamber. The chamber is arranged above or below the winding chamber. 4, 5, and 6, which are examples of the film forming apparatus of the present invention, the film forming chambers are arranged such that the unwinding chamber and the winding chamber are arranged only on the outer wall on one side of the film forming chamber. Yes. 2 and 3, which are conventional film forming apparatuses, have a layout in which a film forming chamber is disposed between the unwinding chamber and the winding chamber, and is disposed only on the outer wall on one side of the film forming chamber. Not been. In the conventional film forming apparatus shown in FIGS. 2 and 3, the film forming chambers are arranged so as to sandwich the take-up roll chamber because of the conveyance path for forming the film on both sides of the long heat-resistant resin film. . 4, 5, and 6, the film forming apparatus of the present invention has a configuration in which the unrolling roll chamber and the winding roll chamber are moved up and down by making the arrangement of the can rolls in the film forming chamber three-dimensional. As a result, the unwinding roll chamber and the winding roll chamber can be arranged only on the outer wall on one side of the film forming chamber. By arranging the unwinding chamber, the winding chamber, and the film forming chamber of the film forming apparatus of the present invention, the heat-resistant resin film as a raw material and the heat-resistant resin film with a metal base layer as a product are applied to the film forming apparatus. Easy to carry in and out. Furthermore, it is possible to install the unwinding chamber and the winding chamber after film formation and the film forming chamber in separate rooms (clean rooms), and maintain and manage the clean room where the unwinding chamber and the winding chamber are installed. It will facilitate and contribute to the improvement of product quality.

  The heat-resistant resin film manufacturing apparatus with a double-sided metal base layer of the present invention will be described in detail with reference to FIG. 4 provided with two can rolls. This apparatus is equipped with a load lock mechanism capable of exchanging a long heat-resistant resin film without releasing the film formation chamber to the atmosphere. Between the unwinding roll chamber 51 and the first film forming chamber 54, when the unwinding roll chamber 51 is released to the atmosphere, a load that interrupts the vacuum and the atmosphere by sandwiching a long heat-resistant resin film 53 with macaroni packing (hollow packing). A differential pressure chamber 52 with a lock mechanism is provided. The first film formation chamber 54 and the second film formation chamber 71 are connected by an opening or a slit roller (not shown). The material and shape of the first film formation chamber 54 and the second film formation chamber 71 may be appropriately selected as long as they can withstand pressure reduction conditions such as sputtering method film formation. In addition, when the first film forming chamber 54 and the second film forming chamber 71 are assembled in blocks for each film forming chamber, the film forming chambers of the existing film forming apparatus in which only one can roll is arranged are connected. Thus, it becomes possible to assemble a roll-to-roll vacuum double-sided film forming apparatus, and to reduce the cost of the apparatus. Between the winding roll chamber 73 and the second film forming chamber 71, when the winding roll chamber 73 is released to the atmosphere, a long heat-resistant resin film 53 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 72 with a load lock mechanism is provided. The long heat-resistant resin film 26 unwound from the unwinding roll 53 is sputtered from the sputtering cathodes 62, 61, 60, 59 to the first film-forming surface on the can roll 56 in the first film-forming chamber 54. After film formation, the film is formed on the second film formation surface on the can roll 69 in the second film formation chamber 71 by the sputtering method from the sputtering cathodes 64, 65, 66, and 67, and taken up by the take-up roll 74. . The unwinding roll 75 and the winding roll 74 maintain the tension balance of the long heat-resistant resin film 53 by controlling the torque of the servo motor, and the long heat-resistant resin film 53 is rotated from the unwinding roll 75 by the rotation of the two can rolls 56 and 69. The conductive resin film 53 is unwound and wound on a winding roll 74. Drive rolls 55, 57, 68, and 70 and free rolls 58 and 63 that change the transport direction are arranged in the transport path from the unwind roll 75 to the take-up roll 74. You may arrange | position a tension | tensile_strength sensor roll between a drive roll, a free roll, an unwinding roll, and a winding roll.

  Next, the heat-resistant resin film manufacturing apparatus with a double-sided metal base layer of the present invention will be described in detail with reference to FIG. 5 having four can rolls. This apparatus is equipped with a load lock mechanism capable of exchanging a long heat-resistant resin film without releasing the film formation chamber to the atmosphere. Between the unwinding roll chamber 150 and the first film forming chamber 153, when the unwinding roll chamber 150 is released to the atmosphere, a long heat-resistant resin film 152 film is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 151 with a load lock mechanism is provided. The first film formation chamber 153, the second film formation chamber 157, the third film formation chamber 167, and the fourth film formation chamber 183 are connected by an opening or a slit roller (not shown). Between the winding roll chamber 185 and the fourth film forming chamber 183, when the winding roll chamber 185 is opened to the atmosphere, a long heat-resistant resin film 152 is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 184 with a lock mechanism is provided. The heat resistant resin film 152 unwound from the unwinding roll 187 is formed on the first film forming surface on the can roll 155 in the first film forming chamber 153 by sputtering from the sputtering cathodes 179, 180, 181, 182. Subsequently, a film is formed on the first film formation surface on the can roll 159 in the second film formation surface film formation chamber 157 by the sputtering method from the sputtering cathodes 161, 162, 163, and 164, and in the third film formation chamber 171. On the can roll 173, a film is formed on the second film formation surface by the sputtering method from the sputtering cathodes 167, 168, 169, 170, and then the second film formation is performed on the can roll 179 in the fourth film formation surface film formation chamber 185. A film is formed on the film surface by sputtering from sputtering cathodes 175, 176, 177, 178, and a winding roll It is taken up in 88. The unwinding roll 189 and the winding roll 188 maintain the tension balance of the heat-resistant resin film 152 by controlling the torque of the servo motor, and are long from the unwinding roll 189 by the rotation of the four can rolls 155, 159, 173, and 179. The heat-resistant resin film 152 is unwound and wound on the winding roll 188. The rotation speed of the can rolls 155, 159, 173, and 179 may be controlled so as to increase or decrease as the conveyance path of the long heat resistant resin film 152 moves downstream. This is because the heat-resistant resin film with a metal base layer tends to be stretched between the long heat-resistant resin film and the film formation conditions. Of course, if it is a heat-resistant resin film with a metal base layer that tends to shrink, the control may be set to a deceleration setting. Drive rolls 154, 156, 158, 160, 166, 172, 174, 180 and free rolls 160, 165 that change the transport direction are arranged in the transport path from the unwinding roll 189 to the winding roll 188. You may arrange | position a tension | tensile_strength sensor roll between a drive roll, a free roll, an unwinding roll, and a winding roll. Therefore, the film forming order of the heat-resistant resin film with double-sided metal base layer shown in FIG. 5 of the present invention is as follows: first film forming surface, first film forming surface, second film forming surface, second film forming surface become.

Next, the heat-resistant resin film manufacturing apparatus with double-sided metal base layer of the present invention will be described in detail with reference to FIG. 6 having four can rolls. This apparatus is equipped with a load lock mechanism capable of exchanging a long heat-resistant resin film without releasing the film formation chamber to the atmosphere. Between the unwinding roll chamber 200 and the first film forming chamber 203, when the unwinding roll chamber 200 is released to the atmosphere, a load that interrupts the vacuum and the atmosphere with a long heat-resistant resin film 202 sandwiched by macaroni packing (hollow packing) A differential pressure chamber 201 with a lock mechanism is provided. The first film formation chamber 203, the second film formation chamber 242, the third film formation chamber 241, and the fourth film formation chamber 237 are connected by an opening or a slit roller (not shown). Between the winding roll chamber 239 and the fourth film forming chamber 237, when the winding roll chamber 239 is released to the atmosphere, a long heat-resistant resin film 202 is sandwiched by macaroni packing (hollow packing) to block the vacuum and the atmosphere. A differential pressure chamber 238 with a lock mechanism is provided. The long heat-resistant resin film 202 unwound from the unwinding roll 241 is sputtered from the sputtering cathodes 211, 210, 209, 208 to the first film forming surface on the can roll 205 in the first film forming chamber 203. A film is formed, and then a film is formed on the second film-forming surface on the can roll 218 in the second film-forming surface film-forming chamber 242 by sputtering from the sputtering cathodes 214, 215, 216, and 217, and the third film-forming chamber is formed. On the can roll 227 in 241, a film is formed by sputtering from the sputtering cathodes 223, 224, 225, and 226 on the first film formation surface, and then on the can roll 235 in the fourth film formation surface film formation chamber 237. 2 Films are formed on the surface of the film by sputtering from the sputtering cathodes 230, 231, 232, and 233. It is wound in Le 240. The unwinding roll 241 and the winding roll 240 maintain the tension balance of the long heat-resistant resin film 202 by controlling the torque of the servo motor, and the unwinding roll 241 is rotated by the rotation of the four can rolls 205, 218, 227, and 235. The long heat-resistant resin film 202 is unwound and wound on the take-up roll 240. In the conveyance path from the unwinding roll 241 to the winding roll 240, driving rolls 204, 206, 213, 219, 222, 228, 234, 236 and free rolls 207, 212, 220, 221, 227, which change the conveyance direction, 229 is arranged. You may arrange | position a tension | tensile_strength sensor roll between a drive roll, a free roll, an unwinding roll, and a winding roll. Therefore, the film formation order of the heat-resistant resin film with double-sided metal base layer shown in FIG. 6 of the present invention is as follows: first film formation surface, second film formation surface, first film formation surface, second film formation surface become. Since the film thicknesses on both surfaces are alternately increased, the difference in film stress between both surfaces can be reduced, and a heat-resistant resin film with a metal base layer that suppresses warpage and undulation and has excellent flatness can be efficiently produced. That is, the transport path of the long heat resistant resin film 202 is formed on one surface of the long resin film by the sputtering cathodes 211, 210, 209, 208 facing the can roll 205 of the first film forming chamber 203. In the second film formation chamber 242, the sputtering cathodes 214, 215, 216, and 217 facing the can roll 218 are arranged at positions where film formation is performed on the other surface. Can do.
Furthermore, even if the length of the heat-resistant resin film with a metal base layer expands or contracts due to heat stress or thermal expansion of the heat-resistant resin film with a metal base layer, the rotation speed of the can roll must be set individually. Thus, it becomes possible to cope with the heat-resistant resin film with a metal base layer without excessive pulling or slackening.

The apparatus for producing a heat-resistant resin film with a double-sided metal base layer of the present invention may be provided with a pretreatment using a drying process by heating with a heater or an ion beam / plasma on both sides before film formation.
5. Metal film When the metal film is formed on the metal base layer of the obtained heat-resistant resin film with a metal base layer using a wet plating method, the electroplating process is performed alone, or the electroless plating process is performed as the primary plating. In some cases, wet plating methods such as electrolytic plating are combined as secondary plating. The wet plating process may employ various conditions of a conventional wet plating method.

Then, by further forming a metal film on the surface of the metal base layer of the heat resistant resin film with a metal base layer obtained by the film forming method of the present invention by a wet plating method, the difference in film stress on both sides is reduced. It becomes possible to obtain a heat resistant resin film with a metal base layer. The total of the metal seed layer and the metal base layer by the dry plating method (sputtering method) formed on the metal seed layer in this way and the metal layer (the metal base layer and the metal film) by the wet plating method, respectively. The thickness is preferably at most 20 μm.
6). Wiring pattern Using the heat-resistant resin film with a metal base layer thus obtained, a wiring pattern is individually formed on at least one surface of the heat-resistant resin film with a metal base layer. In addition, via holes for interlayer connection can be formed at predetermined positions and used for various purposes. More specifically, (1) the wiring pattern is individually formed and used on at least one surface of the heat resistant resin film with a metal base layer. (2) A via hole penetrating the heat resistant resin film is formed and used with the heat resistant resin film with a metal base layer on which the wiring pattern is formed. (3) In some cases, the via hole is filled with a conductive material to make the hole conductive.

As a method for forming the wiring pattern, a known subtractive method or semi-additive method can be used.
In the subtractive method, an unnecessary metal film, a metal base layer, and a metal seed layer of the heat resistant resin film with a metal base layer are removed by chemical etching to form a wiring pattern. Prepare a heat-resistant resin film with a metal base layer and form a photosensitive resist film by laminating screen printing or dry film on the metal film, and then expose and develop so that the resist film remains at the location of the wiring pattern. Pattern. Next, the metal film is selectively removed by etching with an etchant such as a ferric chloride solution, and then the resist film is removed to form a predetermined wiring pattern. It is preferable to process the wiring pattern on both sides. Whether or not all the wiring patterns are divided into several wiring regions depends on the distribution of the wiring density of the wiring patterns. For example, the wiring pattern is divided into a high-density wiring area and a wiring area each having a wiring width and a wiring interval of 50 μm or less, and the wiring pattern is divided in consideration of the difference in thermal expansion from the printed circuit board and the handling convenience. What is necessary is just to divide suitably, setting a size to about 10-65 mm.

  As a method for forming the via hole, a conventionally known method can be used. For example, a via hole penetrating the wiring pattern and the heat resistant resin film is formed at a predetermined position of the wiring pattern by laser processing or the like. The diameter of the via hole is preferably reduced within a range that does not hinder the conductivity in the hole, and is usually 100 μm or less, preferably 50 μm or less. The via hole is filled with a conductive metal such as copper by plating, vapor deposition, sputtering, etc., or a conductive paste is pressed and dried using a mask having a predetermined opening pattern, and the inside of the hole is made conductive to form an interlayer. Make electrical connections.

  In the semi-additive method, a thick wiring film is formed on the surface of the metal film of the heat-resistant resin film with a metal base layer by a wet plating method only at the place where the wiring pattern is to be provided, and then the metal film is classified as an unnecessary metal film by soft etching. In this wiring method, the base layer and the metal seed layer are removed. Prepare a heat-resistant resin film with a metal base layer, and form a photosensitive resist film by laminating screen printing or dry film on the metal film, then expose and develop the resist film so that the location of the wiring pattern is exposed Is patterned so as to remain. After exposure and development of the resist, a thick wiring pattern is formed by a wet plating method, and then a metal film unnecessary for the wiring pattern is removed by soft etching (chemical etching). The formation of via holes is the same as in the subtractive method. In addition, when forming a wiring pattern by a semi-additive method, you may use the heat resistant resin film with a metal base layer which has not formed the metal film by the wet-plating method.

  So far, the description has focused on a method for producing a heat-resistant resin film substrate with a metal base layer in which a metal seed layer and a metal base layer are formed on both sides of the long heat-resistant resin film of the long resin film. In the present invention, the metal seed layer and the metal base layer are not limited to the sputtering film formation on both surfaces of the resin film, and it is needless to say that an oxide film, a nitride film, or the like can be used for the sputtering film formation. Further, the vacuum film forming means of the roll-to-roll type vacuum double-sided film forming apparatus of the present invention is not limited to the sputtering cathode), and film forming means under various reduced pressure atmospheres such as vapor deposition can be used.

  Examples of the present invention will be specifically described below.

  Using the heat-resistant resin film manufacturing apparatus with a double-sided metal base layer of the present invention shown in FIG. 5, the long heat-resistant resin film 152 has a width of 500 mm, a length of 200 m, and a thickness of 25 μm, manufactured by Ube Industries, Ltd. A heat-resistant polyimide film “UPILEX S (registered trademark)” was used.

  For the sputtering cathodes 184 and 167, nickel-chromium targets (manufactured by Sumitomo Metal Mining Co., Ltd.), which are targets for the metal seed layer, are used. , 175, 176, 177, 178 were copper targets (manufactured by Sumitomo Metal Mining Co., Ltd.) which are targets for the metal base layer.

First, it was evacuated to 5 Pa using a dry pump, and then evacuated to 1 × 10 ⁻³ Pa using a turbo molecular pump and a cryocoil, and 200 sccm of Ar gas was introduced in the vicinity of each sputtering cathode. At a film conveyance speed of 2 m / min, the metal seed layer sputtering cathodes 184 and 167 are 5 kW, and the metal base layer sputtering cathodes 183, 182, 181, 164, 163, 162, 161, 168, 169, 170, 175 A DC sputtering power of 8 kW was applied to 176, 177, and 178. Assuming that the rotation speed of the can roll 155 with respect to the film conveyance speed of 2 m / min is 100%, the can roll 159 is set to 100.2%, the can roll 173 is set to 100.4%, and the can roll 179 is set to 100.6%. The reason for setting in this manner is that the heat resistant resin film with a metal base layer tends to be stretched between the long heat resistant resin film and the film forming conditions. Of course, if it is a heat-resistant resin film with a metal base layer that tends to shrink, the deceleration setting may be used.

  After 500 m double-sided film formation, the conveyance of the long heat-resistant resin film is stopped, the introduction of Ar gas is stopped, and each pump is stopped and then vented (open to the atmosphere), and the heat-resistant polyimide film of the unwinding roll 189 The end portion of the film was removed, and all the films were taken up on a take-up roll 188 and then removed.

  Then, as shown in FIG. 7, a part of the obtained heat-resistant resin film with a double-sided metal base layer is cut out, and a first film-formed surface (a copper metal seed layer formed on one surface of the film and Metal base layer) and the second film-forming surface (copper metal seed layer and metal base layer formed on the other surface of the film) are partially etched, and the metal seed layer formed on each surface As a result of measuring the thickness of the nickel-chromium layer and the thickness of the copper layer of the metal base layer with a fluorescent X-ray film thickness meter, the thickness of the nickel-chromium layer is about 15 nm on both the first film-forming surface and the second film-forming surface. The film thickness of the copper layer was about 150 nm.

In addition, the heat-resistant resin film manufacturing apparatus with double-sided metal base layer of the present invention shown in FIG. 5 is installed in a two-story structure, and the unwinding roll chamber 150 and the differential pressure chamber 151 are wound in a clean room on the second floor. The take-up roll chamber 187 and the differential pressure chamber 186 were installed in a class 1000 clean room on the first floor. The film forming chambers 153, 157, 171, and 185 that generate a large amount of dust during cleaning were installed in a class 10000 clean room. Since the unwinding roll chamber and the winding roll chamber are in the same vertical direction of the apparatus, it is easy to separate the clean room, and it is also easy to attach and remove the film from the unwinding roll chamber and the winding roll chamber. It was.
Thus, by separating the clean room, it was possible to avoid bringing a large amount of dust into the unwinding roll chamber and the winding roll chamber when cleaning the film forming chamber.

  Using the heat-resistant resin film manufacturing apparatus with a double-sided metal base layer of the present invention shown in FIG. 6, the long heat-resistant resin film 202 has a width of 500 mm, a length of 200 m, and a thickness of 25 μm, manufactured by Ube Industries, Ltd. A heat-resistant polyimide film “UPILEX S (registered trademark)” was used.

  For the sputtering cathodes 211 and 214, a nickel-chromium target (manufactured by Sumitomo Metal Mining Co., Ltd.), which is a metal seed layer target, is used, and the sputtering cathodes 210, 209, 208, 215, 216, 217, 223, 224, 225, and 226 are used. , 230, 231, 232, and 233 were copper targets (manufactured by Sumitomo Metal Mining Co., Ltd.), which are targets for the metal base layer.

First, it was evacuated to 5 Pa using a dry pump, and then evacuated to 1 × 10 ⁻³ Pa using a turbo molecular pump and a cryocoil, and 200 sccm of Ar gas was introduced in the vicinity of each sputtering cathode. At a film conveying speed of 2 m / min, the metal seed layer sputtering cathodes 211 and 214 have 5 kW, the metal base layer sputtering cathodes 210, 209, 208, 215, 216, 217, 223, 224, 225, 226, 230, DC sputtering power of 8 kW was applied to 231, 232 and 233. Assuming that the rotation speed of the can roll 205 with respect to the film conveyance speed of 2 m / min is 100%, the can roll 218 is set to 100.2%, the can roll 227 is set to 100.4%, and the can roll 235 is set to 100.6%. The reason for setting in this manner is that the heat resistant resin film with a metal base layer tends to be stretched between the long heat resistant resin film and the film forming conditions.

  After 500 m double-sided film formation, the conveyance of the long heat-resistant resin film is stopped, the introduction of Ar gas is stopped, and each pump is stopped and vented (open to the atmosphere), and the heat-resistant polyimide film of the unwinding roll 240 is stopped. The film was removed after the film was wound on the take-up roll 241.

  Then, as shown in FIG. 7, a part of the obtained heat-resistant resin film with a double-sided metal base layer is cut out, and a first film-formed surface (a copper metal seed layer formed on one surface of the film and Metal base layer) and the second film-forming surface (copper metal seed layer and metal base layer formed on the other surface of the film) are partially etched, and the metal seed layer formed on each surface As a result of measuring the thickness of the nickel-chromium layer and the thickness of the copper layer of the metal base layer with a fluorescent X-ray film thickness meter, the thickness of the nickel-chromium layer is about 15 nm on both the first film-forming surface and the second film-forming surface. The film thickness of the copper layer was about 150 nm.

6 is installed in a two-story structure, and the unwinding roll chamber 200 and the differential pressure chamber 201 are wound in a clean room on the second floor. The take-up roll chamber 239 and the differential pressure chamber 238 were installed in a class 1000 clean room on the first floor. The film forming chambers 203, 242, 241, and 237 that generate a large amount of dust during cleaning were installed in a class 10000 clean room. Since the unwinding roll chamber and the winding roll chamber are in the same vertical direction of the apparatus, it is easy to separate the clean room, and it is also easy to attach and remove the film from the unwinding roll chamber and the winding roll chamber. It was.
Thus, by separating the clean room, it was possible to avoid bringing a large amount of dust into the unwinding roll chamber and the winding roll chamber when cleaning the film forming chamber.
[Comparative example]
As in the example, the conventional heat-resistant resin film manufacturing apparatus with a double-sided metal base layer shown in FIG. 3 was used, and the long heat-resistant resin film 142 had a width of 500 mm, a length of 200 m, and a thickness of 25 μm. A long heat-resistant polyimide film “UPILEX S (registered trademark)” manufactured by Co., Ltd. was used.

  A nickel-chromium target (manufactured by Sumitomo Metal Mining Co., Ltd.) is used for the sputtering cathodes 141 and 124 of the metal seed layer, and copper is used for the sputtering cathodes 140, 138, 139, 127, 129, 128, 130, 131 of the metal base layer. A target (manufactured by Sumitomo Metal Mining Co., Ltd.) was used.

  First, the gas was evacuated to 5 Pa using a dry pump, then evacuated to 1 × 10 −3 Pa using a turbo molecular pump and a cryocoil, and 200 sccm of Ar gas was introduced in the vicinity of each sputtering cathode. DC sputtering power of 5 kW for metal seed layer sputtering cathodes 141 and 124, and 6 kW for metal base layer sputtering cathodes 140, 138, 139, 127, 129, 128, 130, 131 at a film transport speed of 2 m / min. Was applied. If the rotational speed of the can roll 104 with respect to the long heat resistant polyimide film conveying speed of 2 m / min is 100%, the can roll 108 is 100.2%, the can roll 120 is 100.4%, and the can roll 116 is 100.6%. Set to increase. The reason for this setting is that the heat-resistant resin film with a metal base layer tends to be stretched under the long heat-resistant resin film and the film-forming conditions.

  After 500 m double-sided film formation, the film transport is stopped, Ar gas introduction is stopped, each pump is stopped and vented (open to the atmosphere), and the end of the long heat-resistant polyimide film of the unwinding roll 143 Was removed, and all the films were wound up on a winding 132 roll and then removed.

  Then, as shown in FIG. 7, a part of the obtained heat-resistant resin film with a double-sided metal base layer is cut out, and a first film-formed surface (a metal made of nickel-chromium formed on one surface of the film). The seed layer 120 and the metal base layer made of copper) and the second film-forming surface (the metal seed layer 120 made of nickel-chromium and the metal base layer 130 made of copper formed on the other surface of the film) are partially formed. As a result of etching and measuring the film thickness of the nickel-chromium layer and the metal base layer copper layer which are metal seed layers formed on the respective surfaces with a fluorescent X-ray film thickness meter, On the second film formation surface, the nickel-chromium layer thickness was about 15 nm and the copper layer thickness was about 150 nm.

    Note that the conventional heat-resistant resin film manufacturing apparatus with a double-sided metal base layer shown in FIG. 3 is installed in a one-storied room, unwinding roll chamber 100, differential pressure chamber 101, film forming chambers 102, 106, 114, 118, winding All including the take-up roll chamber 131, the differential pressure chamber 130, and the connection chamber 111 were installed in a class 1000 clean room. Since the winding roll chamber 112 is located in the middle part of the heat-resistant resin film manufacturing apparatus with a double-sided metal base layer sandwiched between the film forming chamber 102 and the film forming chamber 114, it is difficult to separate the clean room. Furthermore, it is difficult to remove the heat-resistant resin film with a double-sided metal base layer from the winding roll chamber. Thus, since the clean room could not be separated, the clean room was contaminated with a large amount of dust during the cleaning of the film forming chamber.

"Evaluation"
The sputtering apparatus for heat-resistant resin film with double-sided metal base layer produced in Example 1 and Example 2 of the present invention was compared with the heat-resistant resin film with metal base layer produced in Comparative Example of the prior art.

  First, 10 heat-resistant resin films with a double-sided metal base layer were cut into 100 mm squares, and the number of pinholes of 10 μm or more was observed with a 30-fold actual microscope. As a result, the heat-resistant resin film with double-sided metal base layer formed in Example 1 and Example 2 of the present invention had an average of 2 pinholes, and the heat-resistant double-sided metal base layer with film formed in the comparative example of the prior art The number of pinholes in the conductive resin film was 4 on average. Since the pinhole is presumed to be after the dust attached to the film has been peeled off after film formation, the sputtering apparatus for heat-resistant resin film with double-sided metal base layer of the present invention is more defective than the prior art. It was possible to form a heat-resistant resin film with a double-sided metal base layer with a small amount of metal. In the sputtering apparatus for a heat-resistant resin film with a double-sided metal base layer according to the prior art, in which the clean room where the heat-resistant resin film is taken in and out is contaminated with dust when the film forming chamber is cleaned, defects tend to increase.

  And the sputtering device for heat-resistant resin film with double-sided metal base layer according to the present invention can efficiently produce high-quality double-sided metal base layer-containing heat-resistant resin film, and because there are few defects, Can handle high density.

The sputtering apparatus for heat-resistant resin film with double-sided metal base layer according to the present invention can efficiently produce high-quality heat-resistant resin film with double-sided metal base layer and has few defects. It can respond to conversion. The heat-resistant resin film with a metal base layer obtained from the heat-resistant resin film with a metal base layer has industrial applicability that can be applied to flexible wiring such as liquid crystal televisions and mobile phones.

DESCRIPTION OF SYMBOLS 1 Unwind roll chamber 2, 10 Differential pressure chamber 3 1st film-forming chamber 4, 6, 14, 12 Drive roll 5, 13 Can roll 8 Connection chamber 7, 15, 16, 28 Free roll 9 Take-up roll chamber 11 1st 2 Film forming chambers 17, 18, 19, 20, 22, 23, 24, 25 Sputtering cathode 21 Winding roll 26 Long heat resistant resin film 27 Unwinding roll

51 Unwinding roll chamber 52, 72 Differential pressure chamber 53 Long heat resistant resin film 54 First film forming chamber 55, 57, 68, 70 Drive roll 56, 69 Can roll 59, 60, 61, 62, 64, 65, 66, 67 Sputtering cathode 58, 63 Free roll 71 Second film forming chamber 75 Unwinding roll 73 Winding roll chamber 74 Winding roll

100 Unwinding roll chamber 101, 113 Differential pressure chamber 103, 105, 107, 109, 115, 117, 119, 121 Driving roll 104, 108, 116, 120 Can roll 110, 122, 123, 137 Free roll 112 Winding roll Chamber 102 First film forming chamber 106 Second film forming chamber 111 Connection chamber 114 Fourth film forming chamber 118 Third film forming chamber 124, 125, 126, 127, 128, 129, 130, 131, 133, 134, 135, 136, 138, 139, 140, 141 Sputtering cathode 132 Winding roll 142 Long heat resistant resin film 143 Unwinding roll

150 Unwinding roll chamber 151, 186 Differential pressure chamber 152 Long heat resistant resin film 153 First film forming chamber 154, 156, 158, 160, 166, 172, 174, 180 Drive roll 155, 159, 173, 179 Can roll 161, 162, 163, 164, 167, 168, 169, 170, 175, 176, 177, 178, 179, 180, 181, 182 Sputtering cathode 157 Second deposition chamber 160, 165 Free roll 171 Third deposition chamber 185 Fourth film forming chamber 187 Winding roll chamber 188 Winding roll 189 Unwinding roll

200 Unwinding roll chamber 201, 238 Differential pressure chamber 202 Long heat-resistant resin film 203 First film forming chamber 204, 206, 213, 219, 222, 228, 234, 236 Drive roll 205, 218, 227, 235 Can roll 207, 212, 220, 221, 227, 229 Free rolls 208, 209, 210, 211, 214, 215, 216, 217, 223, 224, 225, 226, 230, 231, 232, 233 Sputtering cathode 237 Fourth component Film chamber 239 Winding roll chamber 240 Winding roll 241 Winding roll 242 Second film forming chamber 241 Third film forming chamber

300 heat resistant resin film 301 metal seed layer 302 metal base layer 303 metal film

400 heat resistant resin film 401 metal seed layer 402 metal base layer

Claims (8)

The long resin film unwound from the unwinding roll in the unwinding roll chamber is transported via a film-forming chamber that can withstand a reduced pressure atmosphere by a roll-to-roll method, and is wound around the winding roll in the winding roll chamber. In addition, the unwinding roll chamber and the winding roll chamber are provided with a load lock mechanism capable of blocking the atmosphere from the film forming chamber, and the film forming chamber on the long resin film conveyance path in the film forming chamber has a vacuum forming mechanism. In a roll-to-roll type vacuum double-sided film forming apparatus provided with two or more can rolls facing a film means and having a refrigerant circulating therein,
The unwinding chamber and the winding chamber are arranged only on the outer wall on one side of the film forming chamber, and the unwinding chamber is above or below the winding chamber in the vertical direction of the film forming chamber. The room for attaching the unwinding roll to the unwinding chamber and the room for taking out the winding roll from the winding chamber are different from the room where the film forming chamber is installed and the atmosphere is released to the atmosphere. A roll-to-roll vacuum double-sided film deposition system characterized by Wherein the two or more can roll, the conveyance path of the long resin film, closest to the can roll to the unwinding roll, the position of the upper or lower than the closest can roll to the take-up roll characterized in that there, roll-to-roll system vacuum double-sided film-forming apparatus according to claim 1. Conveying path of the long resin film, in turn deposited by vacuum film forming means facing the can roll on one side of the long resin film, another vacuum film forming means facing the other can roll wherein the but are arranged at a position for forming a film on the other surface of the long resin film, a roll-to-roll method a vacuum double-sided film-forming apparatus according to claim 2. Said two or more can roll, characterized in that nearly as rotation speed toward the downstream of the conveying path is the faster control, roll-to-roll according to any one of claims 1 to 3 Vacuum double-sided film forming system. Said two or more can roll, characterized in that nearly as rotation speed toward the downstream of the conveying path is slower control, roll-to-roll according to any one of claims 1 to 3 Vacuum double-sided film forming system. The vacuum film forming means, characterized in that a sputtering cathode, roll-to-roll system vacuum double-sided film-forming apparatus according to any one of claims 1 to 5. Opening of the unwinding roll chamber and the take-up roll chamber with the load lock mechanism is characterized by being located in a clean room, roll-to-roll method according to any one of claims 1 to 6 Vacuum double-sided film forming equipment. A heat-resistant resin film manufacturing apparatus with a double-sided metal base layer in which a metal base layer is formed by vacuum film formation on both sides of the heat-resistant resin film,
A heat-resistant resin film with a double-sided metal base layer, wherein the roll-to-roll type vacuum double-sided film forming apparatus according to any one of claims 1 to 7 forms a heat-resistant resin film with a metal base layer. apparatus.

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