JP5568743B2 - Atomizing device constant temperature water circulation system, atomizing device, and wiring forming device - Google Patents

Description

  The present invention relates to a constant temperature water circulation system of an atomization device used for a mist jet type open repair device or the like.

  The atomizing device is a device used for a wiring forming device for forming a wiring on a semiconductor chip, for example, a mist jet type open repair device. In such an atomizing apparatus, in order to form wiring, it has an ultrasonic oscillator for generating mist obtained by atomizing the raw material of the wiring, pure water or the like as a transmission medium of the vibration and a heating medium of the raw material Use liquid. A container storing the raw material of the wiring is immersed in a storage tank in which a liquid such as pure water is stored and an ultrasonic oscillator is attached, the raw material is warmed by the liquid in the storage tank, and the liquid is passed through the liquid by the ultrasonic oscillator. The raw material is atomized by ultrasonic vibration.

  Furthermore, in order to maintain the performance of the atomizer, a constant temperature circulation pump device is connected to the storage tank, and the liquid in the storage tank is circulated to control the temperature.

  In addition, as an example of such a constant temperature circulation pump apparatus connected to the storage tank, for example, there is a cooling device for a molding die disclosed in Patent Document 1 and a PH maintenance system in a water piping path disclosed in Patent Document 2.

Japanese Patent Laid-Open No. 6-170849 JP 2005-288383 A

  However, when a liquid is used as a vibration transmission medium of an ultrasonic oscillator used for generating mist, the liquid easily evaporates and decreases due to the ultrasonic vibration. Due to the structure of the process section of the constant temperature circulation pump device, it is difficult to seal the path, so that the liquid as the transmission medium gradually evaporates and decreases. And if this is left unattended, there is a problem that the atomization apparatus will be deteriorated in performance or damaged.

  In order to solve this problem, conventionally, when the pure water in the tank is reduced, the operator replenishes liquid such as pure water.

  However, in this case, it is necessary to frequently replenish pure water, and it is necessary to stop the apparatus each time. Furthermore, due to the replenishment of pure water, the uniformity of the temperature distribution in the storage tank cannot be maintained. For this reason, there exists a problem that work efficiency is bad.

  Also, in Patent Documents 1 and 2, there is no function of efficiently replenishing the decrease in liquid without changing the temperature of the liquid, and the apparatus can be maintained in a good state for a long time. There is a problem that you can not.

  The present invention has been made in view of such problems, and an object thereof is to provide a constant temperature water circulation system for an atomization device that can extend a maintenance cycle and maintain a good state of the device for a long period of time at a low cost. To do.

The constant temperature water circulation system of the atomization apparatus according to the present invention includes: (1) a constant temperature bath having an ultrasonic oscillator in the stored constant temperature water, and a material storage container that contains the material to be atomized therein and is immersed in the constant temperature bath. And a constant temperature circulation pump device that circulates the constant temperature water connected to the constant temperature bath via a return pipe and a supply pipe, and (2) the return pipe via a water supply pipe in which a water supply valve is arranged in the middle. wherein a water supply device for performing water supply to compensate for the decrease of the constant-temperature water in the constant temperature bath, (3) a constant temperature of the constant temperature circulating pump device, the constant temperature bath heated to a constant temperature water circulated in the water supply time for A temperature adjusting device that maintains the water at a set temperature and cools the constant temperature water circulated during non-water supply to maintain the constant temperature water in the constant temperature bath at a set temperature ; (4) the water supply device supplies the water supply during water supply; Open the valve and Constant temperature water is supplied to the inflow side, and the constant temperature water is heated and adjusted by the temperature adjusting device, and then supplied into the constant temperature bath. The atomizing device and the wiring forming device incorporate the constant temperature water circulation system.

  Since the water supply device supplies the constant temperature water to the inflow side of the constant temperature circulation pump device and adjusts the temperature of the constant temperature water by the temperature adjustment device, the constant temperature water in the constant temperature bath is supplied to the constant temperature bath. The set temperature and the set amount can be maintained, and the atomization apparatus can be maintained in a good state.

It is a schematic block diagram which shows the principal part of the wiring formation apparatus used for formation of wiring etc. on a semiconductor chip, repair of a wiring missing part, etc. It is a schematic block diagram which shows the atmospheric plasma generator for purification. It is a schematic block diagram which shows the atomization apparatus which concerns on embodiment of this invention. It is a schematic block diagram which shows the constant temperature water circulation system which concerns on embodiment of this invention.

  Hereinafter, the constant temperature water circulation system of the atomization apparatus which concerns on embodiment of this invention is demonstrated, referring an accompanying drawing. An atomization apparatus is an apparatus used for the wiring formation apparatus which forms the wiring on a semiconductor chip, the wiring on a liquid crystal display, etc., for example. There are various types of wiring forming apparatuses such as a mist jet type open repair apparatus.

  First, a wiring forming apparatus to which the atomizing apparatus of the present invention is applied will be described. FIG. 1 is a schematic configuration diagram showing a main part of a wiring forming apparatus used for forming wiring on a semiconductor chip, wiring on a liquid crystal display, repairing a wiring missing portion, and the like.

The wiring forming apparatus 1 includes a purifying atmospheric plasma generator 2 that removes oxide on the insulating substrate 14 by a chemical reaction with a plasma gas, a paste material adhering device 3 that supplies a paste material onto the insulating substrate 14, And an oxygen radical molecule injection device 4 that irradiates oxygen radical molecules to the paste material supplied onto the insulating substrate 14 by the paste material attaching device 3 . Purification of a atmospheric plasma generating unit 2, as shown in FIG. 2, a dielectric tube 8 next inlet 8a of a gas from the top gas source 6 or 7, the lower end becomes the plasma injection port 8b, the dielectric In order to apply an alternating voltage or a pulsed voltage between a pair of electrodes 9 and 9 which are arranged in the longitudinal direction of the tube 8 with a distance d1 between each other and are respectively disposed around the dielectric tube 8. Power supply device 10.

  The reducing gas G1 and the carrier gas Ca can be guided to the gas inlet 8a of the dielectric tube 8 via the opening / closing valve 12. As shown in FIG. 2, the dielectric tube 8 has its plasma injection port 8b directed to the surface of the insulating substrate 14 on which the wiring pattern 13 is to be formed.

  When the opening / closing valve 12 is opened, the reducing gas G1 from the reducing gas source 6 together with the carrier gas Ca from the carrier gas source 7 is directed toward the plasma injection port 8b in the dielectric tube 8 (atmospheric plasma injection nozzle). Guided. In the flow path of the dielectric tube 8 through which the reducing gas G1 is guided, a pair of electrodes 9 and 9 to which a voltage from the power supply device 10 is applied cause a discharge due to a dielectric barrier discharge in a region corresponding to the distance d1 between both electrodes. A space region is formed. Therefore, the reducing gas G1 guided from the gas inlet 8a of the dielectric tube 8 toward the plasma injection port 8b is put into a plasma state in the process of passing through the discharge space region. As a result, a plasma gas using the reducing gas G1 as a plasma source is injected onto the insulating substrate. By the injection of the plasma gas from the dielectric tube 8, the oxide remaining in the portion irradiated with the plasma gas is effectively removed by a chemical reaction with the plasma gas.

  The dielectric tube 8 of the purifying atmospheric plasma generator 2 can be automatically moved along a desired pattern using a known automatic control mechanism (not shown).

  The paste material is supplied to the region on the insulating substrate 14 that has been purified by the injection of the atmospheric plasma gas using the reducing gas G1 as a gas source, from the nozzle 15 of the paste material deposition apparatus 3. By causing the nozzle 15 of the paste material adhering device 3 to follow the purifying atmospheric plasma generator 2, the paste material is sequentially linear (straight or curved) on the purified region on the insulating substrate 14. Can be fed and attached.

  As will be described later, the paste material is deposited on the insulating substrate 14 by spraying the paste material in a mist state (atomized state) with a nozzle using a method similar to the ink jet method (hereinafter referred to as mist jet). Apply). In the mist jet process, a linear wiring can be formed by setting the spray from the nozzle 15 to a narrowed spray in which, for example, the mist comes out spirally.

  In order to make paste material into a mist state (mist state), the atomization apparatus 17 mentioned later is applied.

  The wiring pattern 13 formed linearly on the insulating substrate 14 by the paste material is irradiated with oxygen radical molecules by the oxygen radical molecule injection device 4.

  Since the purifying atmospheric plasma generator 2 and the oxygen radical molecule injector 4 have substantially the same configuration, the detailed configuration of the oxygen radical molecule injector 4 is not shown.

  The fundamental difference between the two devices 2 and 4 is that the atmospheric plasma generator used as the oxygen radical molecule injector 4 is different from the atmospheric plasma generator 2 for purification that uses the reducing gas source 6 as the plasma gas source. As a plasma gas source, an oxidizing gas source such as oxygen or air is used.

  When plasma using such an oxidizing gas as a plasma source is sprayed onto the insulating substrate 14, oxygen radicals contained in the plasma chemically react with the organic binder in the paste material of the wiring portion immediately after being attached. Produce. As a result, the organic binder is removed mainly by a chemical reaction with oxygen radicals. When the organic binder is removed from the wiring portion formed of the paste material described above, the nano metal particles in the wiring portion come into contact with each other. When this mutual contact occurs, as described above, the nanometal particles are bonded by the surface energy of the nanometal particles, and the wiring pattern 13 is formed.

  Next, the atomization device 17 will be described. The atomizing device 17 is used in the paste material adhering device 3 of the wiring forming device 1. FIG. 3 is a schematic configuration diagram showing the paste material adhering device 3 including the atomizing device 17.

  The paste material adhering device 3 includes an atomizing device 17, a mist flow converting device 18, and a nozzle 15 (see FIG. 1).

  The mist flow conversion device 18 converts the mist flow of the paste material atomized by the atomization device 17 so that the flow diameter becomes a predetermined flow diameter and so that the mist flow rotates in a spiral shape. The mist flow after such conversion is jetted from the nozzle 15 onto the insulating substrate 14 (see FIG. 1).

  The atomization device 17 mainly includes an atomization unit 20 and a solvent supply unit 21.

  The atomization unit 20 is connected to the mist flow converter 18 via the communication pipe 23, and supplies the atomized mist flow of the paste solvent to the mist flow converter 18.

The atomization unit 20 includes a thermostatic chamber 25 in which a thermostatic liquid 24 that is constant temperature water of a predetermined temperature such as pure water is accommodated, and the thermostatic liquid 24 includes the paste material (for example, gold nano paste) described above. A material container 27 containing a mixture 26 (paste solvent) of a solvent (diluent; for example, xylene) for dissolving the paste material is immersed . The material container 27 is installed, for example, inclined, and an ultrasonic oscillator 28 is provided in the thermostatic chamber 25 and in the vicinity of the lowest position of the material container 27. The ultrasonic oscillator 28 supplies the energy for atomization to the mixture 26 via the constant temperature liquid 24 and the material container 27 by the ultrasonic vibration and atomizes the mixture 26. That is, in the process of generating mist, the mixture 26 as a paste solvent is irradiated with ultrasonic waves by the ultrasonic oscillator 28 through the constant temperature liquid 24, and the ultrasonic energy is used to promote mist formation. Here, the constant temperature liquid 24 functions as an ultrasonic vibration transmission medium and a raw material heating medium.

  The upper opening of the material container 27 is closed by a lid 29. The lid 29 has a fluid inlet 30 and a fluid outlet 31. The fluid outlet 31 is provided so that the central axis of the material container 27 passes, and the inner side of the material container 27 is connected to the inner pipe 32 extending in the axial direction to the middle. The outside of the material container 27 is connected to a communication pipe 23 connected to the mist flow converter 18. The fluid introduction port 30 is provided so that the introduced fluid is directed toward the central axis of the material storage container 27, and is connected to a communication pipe 34 connected to the solvent replenishment unit 21 on the outer side of the material storage container 27. The inside of the material container 27 is connected to the discharge opening 35.

  Accordingly, the carrier gas and the solvent mixed gas (mixed gas) supplied from the solvent replenishment unit 21 are introduced into the material container 27 from the fluid inlet 30, descend around the inner pipe 32, It is introduced into the inner pipe 32 from the opening at the lowermost end, and is supplied to the mist flow converter 18 side through the inner pipe 32, the fluid outlet 31 and the communication pipe 23 in order. At this time, the gas of the mixture 26 atomized by the ultrasonic vibration energy is also taken into this flow and introduced into the inner tube 32 from the opening at the lowermost end of the inner tube 32, and the inner tube 32, the fluid outlet 31 and the communication are communicated. The gas is supplied to the mist flow converter 18 side through the pipe 23 sequentially.

  The solvent replenishment unit 21 is connected to the carrier gas source via the communication pipe 41 and is connected to the atomization unit 20 via the communication pipe 34. The solvent supply unit 21 obtains a mixed gas of a carrier gas (for example, nitrogen gas) that is an inert gas supplied from a carrier gas source and a gas obtained by atomizing (vaporizing) the solvent, and supplies the mixed gas to the atomizing unit 20. Supply (supplement solvent).

The solvent replenishment unit 21 has a thermostatic chamber 43 in which a constant temperature liquid 42 such as pure water is accommodated. The constant temperature liquid 42 includes a solvent 44 in the liquid state (the same as the solvent in the mixture 26). A solvent storage container 45 containing (there is) is immersed . The solvent storage container 45 is installed, for example, at an inclination, and an ultrasonic oscillator 46 is provided in the thermostatic chamber 43 and in the vicinity of the lowest position of the solvent storage container 45. The ultrasonic oscillator 46 supplies the atomizing energy to the liquid solvent 44 via the constant temperature liquid 42 and the solvent storage container 45 by the ultrasonic vibration to atomize the liquid solvent 44.

  The upper opening of the solvent container 45 is closed by a lid 47. The lid 47 has a fluid inlet 48 and a fluid outlet 49. The fluid outlet 49 is provided so that the central axis of the solvent storage container 45 passes through, and is connected to an internal tube 50 that extends in the axial direction halfway on the inner side of the solvent storage container 45. On the outside side of the storage container 45, it is connected to a communication pipe 34 connected to the atomizing section 20. The fluid introduction port 48 is provided so that the introduction fluid is directed toward the central axis of the solvent storage container 45, and is connected to the communication pipe 23 connected to the carrier gas source on the outside of the solvent storage container 45. The inside of the container 45 is connected to the discharge opening 51.

  Accordingly, the carrier gas supplied from the carrier gas source is introduced into the solvent storage container 45 from the fluid introduction port 48, descends around the inner tube 50, and passes through the inner tube 50 from the opening at the lowermost end of the inner tube 50. And is supplied to the atomizing section 20 side through the inner pipe 50, the fluid outlet 49 and the communication pipe 34 in order. At this time, the gas of the solvent 44 atomized by the ultrasonic vibration energy is also taken into this flow and introduced into the inner tube 50 from the opening at the lowermost end of the inner tube 50, and the inner tube 50, the fluid outlet 49 and the communication are communicated. The gas is supplied to the atomizing unit 20 side through the pipe 34 sequentially.

  In the atomization device 17, the carrier gas supplied from the carrier gas source is mixed with a small amount of the solvent 44 that has been atomized (vaporized) by passing through the solvent supply unit 21, and this mixed gas is mixed with the atomization unit 20. Is mixed with the atomized (vaporized) paste material (and a mixture of the solvent) and thereby includes a mist stream (including the vaporized solvent) containing the carrier gas and the atomized paste material. Is supplied to the mist flow converter 18.

  The constant temperature baths 25 and 43 are connected to constant temperature water circulation systems 51 (see FIG. 4) for keeping the constant temperature liquids 24 and 42 contained therein at a constant temperature and water volume. The constant temperature water circulation system 51 includes a constant temperature circulation pump device 52 and a water supply device 53.

  The constant temperature circulation pump device 52 shown in FIG. 4 is a device for supplying the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 to the atomizing device while maintaining the set temperature. In order to stabilize the generation of mist, it is important to control the temperature of the constant temperature liquids 24 and 42 (pure water), which are ultrasonic energy transmission media. That is, in order to prevent temperature non-uniformity in the thermostatic chambers 25 and 43 and suppress an increase in water temperature due to the ultrasonic energy of the ultrasonic oscillators 28 and 46, the constant temperature liquids 24 and 42 are maintained at a set temperature while cooling. There is a need. For this reason, the constant-temperature circulation pump device 52 performs temperature adjustment while circulating the constant-temperature liquids 24 and 42 in the constant-temperature tanks 25 and 43. Specifically, the constant-temperature circulation pump device 52 includes a device main body 55, a return pipe 56, a supply pipe 57, a temperature sensor 58, and a control unit 59.

  The apparatus main body 55 includes a pump and a temperature adjusting device (both not shown), and adjusts the temperature of the thermostatic liquids 24 and 42 with the temperature adjusting device while circulating the thermostatic liquids 24 and 42 with the pump. .

  One end of the return pipe 56 communicates with the constant temperature baths 25 and 43, and the other end communicates with the inflow side of the pump. The outflow side of the pump communicates with the temperature adjusting device, and feeds the constant temperature liquids 24 and 42 taken from the constant temperature baths 25 and 43 to the temperature adjusting device.

  One end of the supply pipe 57 communicates with the outflow side of the temperature adjusting device, and the other end communicates with the thermostats 25 and 43.

  The temperature sensor 58 is a sensor for measuring the temperature of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43. The temperature sensor 58 is attached in the thermostatic baths 25 and 43 so as to be immersed in the thermostatic liquids 24 and 42. The temperature sensor 58 is connected to the control unit 59 and transmits the measured temperature information of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 to the control unit 59.

  The controller 59 is a device for controlling the temperature of the constant temperature liquids 24 and 42 and controlling the water level of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43. The control unit 59 is connected to a temperature sensor 58, a water level sensor 64, which will be described later, a pump of the apparatus main body 55, and a temperature adjustment device. The control unit 59 takes in the temperature information of the constant temperature liquids 24 and 42 from the temperature sensor 58 and controls the temperature adjustment device based on the temperature information and the temperature information of the constant temperature liquid on the water supply device 53 side.

  The water supply device 53 is a device for keeping the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 at a constant amount of water. The water supply device 53 includes a water supply tank 61, a pressurizing mechanism (not shown), a water supply pipe 62, a water supply valve 63, a water level sensor 64, and a control unit 59.

  The water supply tank 61 is a tank in which the constant temperature liquids 24 and 42 are stored. The water supply tank 61 is connected to a pressurizing mechanism in a state where the inside is sealed.

  The pressurizing mechanism is a device for pressurizing the inside of the water supply tank 61. The pressurizing mechanism pressurizes the inside of the water supply tank 61 and pushes the constant temperature liquids 24 and 42 into the return pipe 56 of the constant temperature circulation pump device 52.

  One end of the water supply pipe 62 is connected to the water supply tank 61, and the other end is connected to the return pipe 56 of the constant temperature circulation pump device 52. The constant temperature liquids 24 and 42 in the water supply tank 61 are supplied to the constant temperature circulation pump device 52. The return pipe 56 on the side is replenished.

  The water supply valve 63 adjusts the amount of the constant-temperature liquid to the return pipe 56 on the inflow side of the constant-temperature circulation pump device 52 in accordance with the decrease in the constant-temperature liquids 24 and 42 in the constant-temperature tanks 25 and 43 measured by the water level sensor 64. It is a solenoid valve that adjusts the supply amount. The water supply valve 63 is provided in the middle of the water supply pipe 62 and is controlled to be opened and closed by the control unit 59 so that the constant temperature liquids 24 and 42 are appropriately replenished to the return pipe 56.

  The water level sensor 64 is a sensor for measuring the water level of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43. The water level sensor 64 is provided in the constant temperature baths 25 and 43, measures the water level of the constant temperature liquids 24 and 42, and transmits the water level information to the control unit 59.

  The control part 59 controls the whole and adjusts the water levels of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 together with the temperature adjustment. Specifically, the control unit 59 is connected to each of the water level sensor 64 and the water supply valve 63 so as to compensate for the decrease in the water level and the decrease in the temperature. That is, the control unit 59 increases the amount of the constant temperature liquids 24 and 42 based on the water level information from the water level sensor 64 and the constant temperature liquids 24 and 42 in the water supply tank 61 corresponding to the decrease amount to the set temperature. The amount of heat required for the operation is calculated, and the opening time of the water supply valve 63 and the heating amount of the temperature adjusting device are controlled.

  The constant temperature water circulation system of the atomization device configured as described above operates as follows.

  First, in the atomization apparatus, the carrier gas supplied from the carrier gas source is introduced into the solvent storage container 45 from the fluid introduction port 48, descends around the inner pipe 50, and opens at the lowermost end of the inner pipe 50. To the inside of the internal pipe 50 and supplied to the atomizing section 20 side through the internal pipe 50, the fluid outlet 49 and the communication pipe 34 in this order. At this time, the gas of the solvent 44 atomized by the ultrasonic vibration energy is also taken into this flow and introduced into the inner tube 50 from the opening at the lowermost end of the inner tube 50, and the inner tube 50, the fluid outlet 49 and the communication are communicated. The gas is supplied to the atomizing unit 20 side through the pipe 34 sequentially.

  The mixed gas (mixed gas) of the carrier gas and the solvent supplied from the solvent replenishment unit 21 is introduced into the material container 27 from the fluid introduction port 30, descends around the inner pipe 32, and is the lowermost end of the inner pipe 32. Is introduced into the inner pipe 32 from the opening and supplied to the mist flow converter 18 side through the inner pipe 32, the fluid outlet 31 and the communication pipe 23 in this order. At this time, the gas of the mixture 26 atomized by the ultrasonic vibration energy is also taken into this flow and introduced into the inner tube 32 from the opening at the lowermost end of the inner tube 32, and the inner tube 32, the fluid outlet 31 and the communication are communicated. The gas is supplied to the mist flow converter 18 side through the pipe 23 sequentially.

Then, by the injection of plasma gas from the dielectric tube 8 onto the insulating substrate 14, the oxide remaining in the portion irradiated with the plasma gas is removed by a chemical reaction with the plasma gas. Thereafter, the mixed gas is injected from the nozzle 15 toward the surface of the insulating substrate 14.

  On the other hand, in the constant temperature water circulation system 51, the temperature of the constant temperature liquids 24 and 42 is constantly monitored by the control unit 59 during the processing operation. The constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 are circulated by the pump of the apparatus main body 55, and when the temperature of the constant temperature liquids 24 and 42 rises above the set temperature, it is cooled by the temperature adjusting device of the apparatus main body 55. , Adjusted to the set temperature. In addition, although not usually, when the temperature of the constant temperature liquids 24 and 42 falls below the set temperature, it is heated by the temperature adjusting device and adjusted to the set temperature.

  On the other hand, the water level sensor 64 measures the water level of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43. The temperature sensor 58 measures the temperature of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43.

Based on the water level information from the water level sensor 64, the control unit 59 constantly monitors the water levels of the thermostatic liquids 24 and 42 in the thermostatic baths 25 and 43, and when the water level decreases, the control liquids 24 and 42 are monitored. refill. In this case, first, the amount of decrease in the constant temperature liquids 24 and 42 is calculated based on the water level information from the water level sensor 64, and the opening time of the water supply valve 63 is calculated. Furthermore, the temperature of the thermostatic liquid 24 and 42 of the measured at temperature sensor 58 in the thermostatic chamber 25, 43, and the difference between the temperature of the thermostatic liquid in the water supply tank 61, a thermostatic of a thermostat 25, 43 The amount of heat required to heat the constant temperature liquid in the water supply tank 61 to be replenished to the set temperature is calculated from the reduced amounts of the liquids 24 and 42.

Next, the water supply valve 63 is opened for the calculated opening time, and the constant temperature liquids 24 and 42 in the water supply tank 61 are supplied to the return pipe 56. At the same time, by controlling the temperature adjustment device of the apparatus main body 55, by adding the heat amount in normal control heating the constant temperature liquid 24 and 42, the temperature drop caused by the constant temperature liquid to be newly replenished Heat up to the set temperature.

  Thus, the constant temperature liquid that has been newly replenished and heated to the set temperature is supplied into the constant temperature baths 25 and 43 via the supply pipe 57.

  As described above, in the atomization device 17, the carrier gas supplied from the carrier gas source is not directly introduced into the atomization unit 20, but the carrier gas supplied from the carrier gas source is introduced into the solvent supply unit 21. Since the mixed gas of the carrier gas and the atomized solvent is introduced into the atomization unit 20, the following effects can be achieved.

  It is easy to control the mixing ratio in the mixture (mixed gas) of the atomized paste material and the atomized solvent inside the material container 27. Since the solvent replenishment unit 21 that atomizes only the solvent exists, it is easy to control the mixing ratio to a predetermined value by controlling the ultrasonic vibrator 46 in the solvent container 45. As a result, the coating accuracy of the wiring material (paste material) in the wiring forming apparatus using the atomizing device 17 can be increased.

  In addition, since the solvent is replenished almost always little by little to the atomizing unit 20, compared with the case where the carrier gas supplied from the carrier gas source is directly introduced into the atomizing unit 20, stable mixing is performed from the atomizing unit 20. The time during which gas can be output can be extended.

  For example, when the carrier gas supplied from the carrier gas source is directly introduced into the atomization unit 20, the solvent needs to be replenished every 5 hours. It improved every 20 hours. If the daily operation time of the wiring forming apparatus is 8 hours, when the carrier gas supplied from the carrier gas source is directly introduced into the atomizing unit 20, it is only necessary to insert the solvent before starting the operation. However, the maintenance operation of temporarily stopping the operation and inserting the solvent was necessary. However, if the atomizing device 17 is applied, the operation can be guaranteed for one day only by inserting the solvent before the operation is started. it can.

  Further, the constant-temperature water circulation system 51 calculates the amount of decrease in the constant-temperature liquids 24 and 42 and the amount of heat necessary to raise the constant-temperature liquids 24 and 42 in the water supply tank 61 to the set temperature. By controlling the opening time of the water supply valve 63 and the heating amount of the temperature adjusting device, the temperature of the constant temperature liquids 24 and 42 in the constant temperature baths 25 and 43 is kept almost constant while minimizing the change. In order to replenish the decreased amount of the temperature and temperature constant liquids 24 and 42, the temperature constant liquids 24 and 42 in the temperature constant baths 25 and 43 can be maintained at the set temperature and the set amount, and the atomizing device 17 can be improved. Can be maintained in a state. Thereby, it is possible to extend the maintenance cycle in combination with the atomizing device 17 and maintain a good state of the device for a long time. As a result, since the wiring forming device 1, the atomizing device 17 and the constant temperature water circulation system 51 perform the processing operation in cooperation with each other, the labor of the operator can be saved and the efficiency of the processing operation can be improved. The running cost can be reduced.

  Further, since the bulky device related to the constant temperature water circulation system 51 is not attached around the constant temperature baths 25 and 43, access to the fogging process equipment is not hindered, and the surroundings of the constant temperature baths 25 and 43 are simplified. It is possible to increase the degree of freedom of design.

[Modification]
In the said embodiment, although the structural example which connected the constant temperature water circulation system 51 to the atomization apparatus 17 provided with the atomization part 20 and the solvent replenishment part 21 was demonstrated, this invention is not limited to this, The fog of another structure It may also be a device. If it is the atomization apparatus of the structure which has the atomization part 20 at least, the constant temperature water circulation system 51 of this invention is applicable. Thereby, there can exist an effect | action and effect similar to the said embodiment.

  Moreover, in the said embodiment, the heater pipe for liquefaction prevention which prevents the solvent in the middle of the transportation currently atomized (vaporized) to the communicating pipe 34 which connected the solvent replenishment part 21 and the atomization part 20 is liquefied. May be wound. The ultrasonic oscillator may not be provided inside the thermostatic chamber 43, and the temperature of the thermostatic liquid 42 may be set higher than that in the above-described embodiment to actively vaporize (volatilize) the solvent 44 in the liquid state. Also in this case, the same operations and effects as in the above embodiment can be obtained.

  In the above embodiment, the temperature sensor is not provided in the water supply tank 61, but the temperature sensor is also provided in the water supply tank 61 to measure the temperature of the thermostatic liquid in the water supply tank 61, and the thermostat 25, You may make it grasp | ascertain correctly the difference with the preset temperature of the liquid 24,42 for constant temperature in 43. FIG. Also in this case, the same operations and effects as in the above embodiment can be obtained.

  In the above embodiment, the water level sensor 64 calculates the amount of decrease in the constant temperature liquids 24 and 42 and sets the opening time of the water supply valve 63, while the water level sensor 64 measures the water level of the constant temperature liquids 24 and 42. The water supply valve 63 may be opened until the set water level is reached.

  In the above embodiment, the water supply tank 61 is provided with a pressurizing mechanism. However, since the normal return pipe 56 has a negative pressure, the pressurizing mechanism may not be provided. Also in this case, the same operations and effects as in the above embodiment can be obtained.

  In the embodiment, the constant temperature water circulation system 51 is provided in each of the two constant temperature baths 25 and 43, but may be provided only in one of them.

  The constant temperature water circulation system of the atomization device of the present invention is an atomization device attached to various devices such as a wiring forming device for forming wiring on a semiconductor chip or wiring on a liquid crystal display, a mist jet type open repair device, etc. Can be applied to.

  1: wiring formation device, 2: purification atmospheric plasma generation device, 3: paste material adhesion device, 4: oxygen radical molecule injection device, 6: reducing gas source, 7: carrier gas source, 8: dielectric tube, 9: Electrode, 10: Power supply device, 12: Open / close valve, 13: Wiring pattern, 14: Insulating substrate, 15: Nozzle, 17: Atomizer, 18: Mist flow converter, 20: Atomizer, 21: Solvent replenisher 24: constant temperature liquid, 25: constant temperature bath, 26: mixture, 27: material container, 28: ultrasonic oscillator, 29: lid, 30: fluid inlet, 31: fluid outlet, 32: inner tube, 34: communication pipe, 35: discharge opening, 41: communication pipe, 42: constant temperature liquid, 43: constant temperature bath, 44: solvent 45: solvent storage container, 46: ultrasonic oscillator, 47: lid, 48: fluid introduction Mouth, 49: Fluid outlet, 50: Inner tube, 51: Release Opening, 52: constant temperature circulation pump device, 53: water supply device, 55: device main body, 56: return piping, 57: supply piping, 58: temperature sensor, 59: control unit, 61: water supply tank, 62: water supply tube, 63 : Water supply valve, 64: Water level sensor.

Claims (4)

A constant temperature bath having an ultrasonic oscillator in the stored constant temperature water, a material storage container in which the material to be atomized is stored and immersed in the constant temperature bath, and connected to the constant temperature bath via a return pipe and a supply pipe A constant-temperature circulation pump device that circulates the constant-temperature water, and a water supply device that supplies water to compensate for the decrease in the constant-temperature water in the constant-temperature tank with respect to the return pipe via a water supply pipe in which a water supply valve is arranged in the middle And
The constant temperature circulating pump device, to heat the constant-temperature water that is circulated to the water supply time with keeping the constant-temperature water in the constant temperature bath at a set temperature, a constant-temperature water circulated in the non-water when cooled in the thermostatic chamber constant temperature Equipped with a temperature control device to keep the water at the set temperature ,
The water supply device, to supply to the thermostat after the constant-temperature water was heated adjusted by said temperature adjusting device by supplying constant-temperature water on the inflow side of the constant temperature circulating pump device by opening the water supply valve to the water supply during A constant temperature water circulation system of an atomizer characterized by that. In the constant-temperature water circulation system of the atomization apparatus of Claim 1,
The water supply device is provided in the thermostat bath and includes a water level sensor that measures the water level of the thermostatic water in the thermostat bath, according to the amount of decrease in the thermostatic water in the thermostat bath measured by the water level sensor, wherein by controlling the opening of the water supply valve, the thermostatic circulating pump device constant-temperature water circulation system of the atomization device comprising a benzalkonium adjusting the supply amount of the constant-temperature water to the inflow side of the. An atomizing section for atomizing a paste material and a paste solvent mixed with a solvent that dissolves the paste material by immersing the paste solvent in a constant temperature bath containing constant temperature water;
A solvent replenishment unit for supplying a gas mixture obtained by immersing the solvent in a thermostatic chamber containing constant temperature water and atomizing the mixture and a carrier gas supplied from a carrier gas source to the atomization unit; A constant temperature water circulation system that is connected to either one or both of the constant temperature baths and that maintains constant temperature water contained therein, at a constant temperature and amount of water;
An atomization apparatus using the constant temperature water circulation system according to claim 1 or 2 as the constant temperature water circulation system. A purification atmospheric plasma generator for removing oxide on the substrate by a chemical reaction with plasma gas, a paste material adhering device for spraying and adhering the paste material on the substrate in an atomized state by an atomizer, and this An oxygen radical molecule injection device that irradiates oxygen radical molecules to the paste material attached on the substrate with the paste material attachment device;
The wiring formation apparatus using the atomization apparatus of Claim 3 as said atomization apparatus.

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