JP5425998B2 - Substrate holding member, substrate transfer arm, and substrate transfer device - Google Patents

Description

  The present invention relates to a substrate transfer device that transfers a substrate in a coating film forming apparatus or the like, a substrate transfer arm provided in the substrate transfer device, and a substrate holding member attached to the substrate transfer arm.

  In a photolithography process in a semiconductor device manufacturing process, for example, a resist coating process for applying a resist solution on a substrate such as a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and exposing the resist film to a predetermined pattern An exposure process and a development process for developing the exposed resist film are performed to form a predetermined resist pattern on the wafer.

  As an apparatus capable of performing such a series of processes automatically, there is a coating film forming apparatus in which a processing unit capable of delivering a wafer via an interface unit and an exposure apparatus are combined. The processing unit stacks, for example, a coating unit, a developing unit, a cleaning unit, and a heating / cooling system unit in a shelf shape, delivers a wafer between the units, and performs a series of processes in a predetermined order. In order to deliver a wafer between such units, the processing unit includes a substrate transfer device for transferring the wafer.

  The substrate transfer device is extendable and includes a substrate transfer arm that can move forward and backward inside each unit, and the substrate transfer arm transfers wafers between the units. The substrate transfer arm has a restricting portion that abuts against the wafer end surface when holding the wafer and restricts wafer displacement, and an inclined surface that is inclined in a horizontal direction from the surface where the restricting portion abuts the wafer end surface. In some cases, a substrate holding member including an inclined portion that comes into contact with the end surface of the wafer when the wafer is held is attached (for example, see Patent Document 1).

  In addition, the substrate holding member including the inclined portion is provided with an inclined portion having an inclined surface with a smaller inclination angle from the horizontal plane above the regulating portion having a surface with a large inclination angle from the horizontal plane, and the wafer end surface is inclined. In some cases, the wafer is guided to the lower regulating portion while abutting against the inclined surface of the portion, and the wafer can be aligned in a state where the end surface of the wafer is in contact with the regulating portion (see, for example, Patent Document 2). .

JP 2003-282670 A JP 2004-273847 A

  However, the substrate transfer arm provided with the substrate holding member as described above and the substrate transfer apparatus provided with the substrate transfer arm have the following problems.

  First, there is a problem that the substrate holding member is worn by an impact when the wafer is transferred. In recent years, the diameter of the wafer has increased, and the wafer transfer speed has increased. Since the inertia of the wafer is large, when the substrate transfer arm is extended or contracted, the wafer is pressed against the substrate holding member with a strong force, and the substrate holding member may receive an impact from the wafer. As described above, since the substrate holding member receives an impact from the wafer every time the expansion and contraction operation is performed, there is a problem that the amount of wear of the substrate holding member is large at a position where the wafer contacts the substrate holding member.

  In addition, there is a problem that the chemical solution attached to the wafer to be transported comes into contact with the substrate holding member, so that the substrate holding member and the wafer to be transported thereafter are contaminated. In a state where a chemical solution such as a resist is applied to the upper surface of the wafer, the chemical solution such as a resist is likely to adhere to the upper surface side of the end surface. When the wafer is transported in a state where a chemical solution such as a resist is attached to the upper surface side of the end face, the chemical solution such as a resist is likely to adhere to the substrate holding member. When the chemical solution adheres to the substrate holding member, it adheres to the upper surface side of the end face of the wafer to be transported in the state of the chemical solution or in the state of being dried to form particles, and the subsequent wafer is contaminated. Contamination of the wafer causes various defects in the exposure or development process, resulting in a reduction in manufacturing yield.

  In addition, if the surface where the restricting portion and the inclined portion are in contact with the end surface of the wafer is substantially perpendicular to the horizontal plane, the wafer is easily detached from the substrate transfer arm during delivery, and the alignment is accurate when delivering the wafer. There was a problem that I could not.

  On the other hand, when the inclination angle from the horizontal plane of the inclined surface where the inclined portion comes into contact with the end surface of the wafer is reduced, the wafer may jump out of the substrate holding member when the wafer rides on the inclined portion. It was. As described above, since the inertia of the wafer is large and the speed of the expansion / contraction operation of the substrate transfer arm is high, when the wafer moves out of a predetermined position and moves onto the inclined portion by the expansion / contraction operation of the substrate transfer arm, the subsequent substrate transfer arm During the expansion / contraction operation, the wafer may further move outward from the substrate transfer arm and jump out.

  The present invention has been made in view of the above points, and provides a substrate holding member, a substrate transport arm, and a substrate transport device having functions of reducing wear, preventing contamination, improving alignment accuracy, or preventing popping out. Objective.

  In order to solve the above-described problems, the present invention is characterized by the following measures.

  A first invention is a substrate holding member that is attached to a substrate transfer arm of a substrate transfer device and holds the substrate by placing the peripheral edge of the substrate, and is a back surface that holds the substrate in contact with the back surface of the substrate A holding portion, an end surface abutting portion that abuts on an end surface of the substrate, and a substrate holding member main body portion to which the back surface holding portion and the end surface abutting portion are attached and can be integrally attached to the substrate transport arm. The end surface abutting portion is attached to the substrate holding member main body so as to be deformable in a radial direction of the substrate to be placed.

  According to a second aspect of the present invention, in the substrate holding member according to the first aspect, the horizontal cross section of the end surface abutting portion is formed in a thin shape.

According to a third aspect of the present invention, in the substrate holding member according to the second aspect of the invention, the end surface abutting portion is a lower portion and includes a restricting portion including a contact portion having a large inclination angle from a horizontal plane, and an upper portion. And an inclined portion including an inclined surface with a small inclination angle from a horizontal plane, wherein the restricting portion contacts the substrate at the contact portion.
It is characterized by that.

  According to a fourth aspect of the present invention, in the substrate holding member according to the third aspect of the present invention, the substrate holding member further includes a corner near the boundary between the restricting portion and the inclined portion.

  5th invention is the board | substrate holding member which concerns on 3rd invention or 4th invention, The thickness of the said control part and the said inclination part is in the range of 0.5 mm-1.5 mm, It is characterized by the above-mentioned. To do.

  According to a sixth aspect of the present invention, in the substrate holding member according to the first aspect, the horizontal cross section of the end surface abutting portion is formed in a zigzag shape.

  According to a seventh aspect of the present invention, in the substrate holding member according to the sixth aspect, the end surface contact portion deforms the zigzag horizontal section when a force is applied from the end surface of the substrate to the end surface contact portion. It is characterized by that.

  An eighth invention is a substrate transfer arm to which a substrate holding member according to any one of the first to seventh inventions is attached.

  A ninth aspect of the invention is a substrate transfer apparatus including the substrate transfer arm according to the eighth aspect of the invention.

  According to the present invention, the substrate holding member, the substrate transfer arm, and the substrate transfer apparatus can be provided with functions of reducing the amount of wear, preventing contamination, improving alignment accuracy, or preventing popping out.

It is a top view which shows the whole structure of the coating film forming apparatus provided with the board | substrate conveyance apparatus which concerns on the 1st Embodiment of this invention. It is a schematic perspective view which shows the whole structure of the coating film forming apparatus provided with the substrate conveying apparatus which concerns on the 1st Embodiment of this invention. 1 is a perspective view showing an overall configuration of a substrate transfer apparatus according to a first embodiment of the present invention. It is a perspective view which shows the board | substrate conveyance arm with which the board | substrate conveyance apparatus which concerns on the 1st Embodiment of this invention is equipped. It is a perspective view which shows the board | substrate holding member attached to the board | substrate conveyance arm which concerns on the 1st Embodiment of this invention. It is a side view of the substrate holding member concerning a 1st embodiment of the present invention. The side surface which shows the state which the end surface of the board | substrate has ridden on the inclination part of the R-shaped part of the board | substrate holding member which concerns on the 1st Embodiment of this invention, and the state which the end surface of the board | substrate contact | abutted to the control part of the R-shaped part FIG. It is a side view which shows the state in which the end surface of the board | substrate is riding on the inclination part of the conventional board | substrate holding member. It is a side view which shows the state by which the board | substrate with which the chemical | medical solution was apply | coated is hold | maintained at the board | substrate holding member which concerns on the 1st Embodiment of this invention. It is a side view which shows the state by which the board | substrate with which the chemical | medical solution was apply | coated is hold | maintained at the conventional board | substrate holding member. It is a side view which shows the state which the chemical | medical solution and the particle have adhered to the board | substrate holding member which concerns on the 1st Embodiment of this invention. It is a side view which shows the state which the chemical | medical solution and the particle have adhered to the conventional board | substrate holding member. It is a side view which shows the state by which the board | substrate is prevented from jumping out by the overhang part in the board | substrate holding member which concerns on the 1st Embodiment of this invention. It is a side view which shows the state which the board | substrate protruded from the board | substrate holding member in the conventional board | substrate holding member. It is a side view which shows the state by which the board | substrate with which the chemical | medical solution was apply | coated is hold | maintained at the board | substrate holding member which concerns on the modification of the 1st Embodiment of this invention. It is a perspective view which shows the board | substrate holding member attached to the board | substrate conveyance arm which concerns on the 2nd Embodiment of this invention. It is an expansion perspective view of the end surface contact part vicinity of the board | substrate holding member which concerns on the 2nd Embodiment of this invention. It is an expansion perspective view near the end surface contact portion of the conventional substrate holding member. It is the expansion perspective view which looked at the end surface contact part vicinity of the board | substrate holding member which concerns on the modification of the 2nd Embodiment of this invention from the downward side. It is a perspective view which shows the board | substrate holding member attached to the board | substrate conveyance arm which concerns on the 3rd Embodiment of this invention. It is an expansion perspective view of the contact part vicinity of the back surface holding part of the board | substrate holding member which concerns on the 3rd Embodiment of this invention. It is an expansion perspective view of the contact part vicinity of the back surface holding part of the conventional board | substrate holding member. It is an expansion perspective view of the contact part vicinity of the back surface holding part of the board | substrate holding member which concerns on the 1st modification of the 3rd Embodiment of this invention. It is a top view of the contact part vicinity of the back surface holding part of the board | substrate holding member which concerns on the 2nd modification of the 3rd Embodiment of this invention.

Next, a mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
First, the substrate transfer apparatus, the substrate transfer arm, and the substrate holding member according to the first embodiment will be described with reference to FIGS.

  Initially, the coating film forming apparatus provided with the board | substrate conveyance apparatus which concerns on this Embodiment is demonstrated. FIG. 1 is a plan view showing the overall configuration of a coating film forming apparatus provided with a substrate transfer apparatus according to the present embodiment, and FIG. 2 is a schematic perspective view thereof.

  The coating film forming apparatus includes a carrier block B1, a processing unit B2, an interface unit B3, an exposure device B4, and shelf units U1 and U2.

  The carrier block B1 is a carrier block for carrying in and out a carrier C in which, for example, 25 wafers W are stored. The carrier block B1 includes a carrier placement portion 21 on which the carrier C is placed and a delivery means 22.

  The transfer means 22 takes out the wafer W from the carrier C and can move left and right, back and forth, move up and down, vertically so as to transfer the taken wafer W to the processing unit B2 provided on the back side of the carrier block B1. It is configured to be rotatable around an axis.

  A substrate transfer device 3 is provided at the center of the processing unit B2, and for example, when viewed from the carrier block B1 so as to surround the substrate transfer device 3, the coating unit 23 and the developing unit 24 are on the right side, and the left side is on the left side. Shelf units U1 and U2 in which heating / cooling units and the like are stacked in multiple stages are arranged on the cleaning unit 25, the front side, and the back side, respectively. The coating unit 23 is a unit that applies a resist solution to the wafer W. The developing unit 24 is a unit that performs a developing process by depositing a developing solution on the exposed wafer W and keeping the state as it is for a predetermined time. The cleaning unit 25 is a unit for cleaning the wafer W before applying the resist solution.

  The shelf units U1 and U2 are configured by stacking a plurality of units. For example, as shown in FIG. 2, in addition to the heating unit 26 and the cooling unit 27, the wafer W delivery unit 28 and the like are assigned vertically. . The substrate transfer device 3 is configured to be movable up and down, reciprocated and rotatable about a vertical axis, and has a role of transferring the wafer W between the shelf units U1 and U2, the coating unit 23, the developing unit 24, and the cleaning unit 25. . However, in FIG. 2, the delivery means 22 and the board | substrate conveyance apparatus 3 are not shown for convenience.

The processing unit B2 is connected to the exposure apparatus B4 via the interface unit B3. The interface unit B3 includes a delivery unit 29. The delivery unit 29 is configured to be movable up and down, to the left and right, to the front and back, and to be rotatable about a vertical axis, for example, between the processing block B2 and the exposure apparatus B4. Next, the flow of the wafer W in the coating film forming apparatus will be described. First, the carrier C is carried into the carrier mounting portion 21 from the outside, and the wafer W is taken out from the carrier C by the transfer means 22. The wafers W are transferred from the transfer means 22 to the substrate transfer device 3 via the transfer unit 28 of the shelf unit U1, and sequentially transferred to a predetermined unit. For example, a predetermined cleaning process is performed in the cleaning unit 25, heat drying is performed in one of the heating units 26, the temperature is adjusted to a predetermined temperature in the cooling unit 27, and a coating film is formed in the coating unit 23. A coating process of a resist solution in which components are dissolved in a solvent is performed.

  The wafer W is pre-baked by one of the heating units 26 and then adjusted to a predetermined temperature by one of the cooling units 27. Next, the substrate is transferred to the transfer means 29 of the interface unit B3 by the substrate transfer device 3 via the transfer unit 28 of the shelf unit U2, and is transferred to the exposure device B4 by the transfer means 29 to perform a predetermined exposure process. Thereafter, the wafer W is transferred to the processing unit B2 via the interface unit B3, and post-exposure baking processing is performed in one of the heating units 26. Next, after cooling to a predetermined temperature by the cooling unit 27 and adjusting the temperature, the developer is accumulated in the developing unit 24 and a predetermined development process is performed. The wafer W on which the predetermined pattern is formed in this manner is returned, for example, into the original carrier C via the substrate transfer device 3 and the delivery means 22 of the carrier block B1.

  Next, the substrate transfer apparatus 3 will be described with reference to FIG. FIG. 3 is a perspective view showing the overall configuration of the substrate transfer apparatus according to the present embodiment.

  The substrate transfer device 3 includes a substrate holding arm 31 that holds the wafer W, a base 32 that supports the substrate holding arm 31 so as to be movable back and forth, and a pair of guide rails 33 and 34 that support the base 32 so that it can be raised and lowered. The connecting members 35 and 36 for connecting the upper and lower ends of the guide rails 33 and 34, respectively, and the guide rail 33 for driving the frame body composed of the guide rails 33 and 34 and the connecting members 35 and 36 to be rotatable about the vertical axis. , 34 is provided with a rotation drive part 37 integrally attached to the connecting member 36 at the lower end, and a rotating shaft part 38 provided on the connecting member 35 at the upper end of the guide rails 33, 34.

  Each of the substrate transfer arms 31 has a three-stage configuration so as to hold the wafer W, and the base end portion of the substrate transfer arm 31 slides along a guide groove 32 a provided in the longitudinal direction of the base 32. It can be done. The forward / backward movement of the arm 31 and the upward / downward movement of the base 32 due to the sliding movement are driven by separate drive units (not shown). Accordingly, the two drive parts (not shown), the guide groove 32a, the guide rails 33 and 34, and the rotation drive part 37 constitute a drive mechanism that drives the arm 31 so as to be rotatable about a substantially vertical axis, and to be movable up and down and back and forth. The drive mechanism is driven and controlled by a control unit (not shown) based on the conveyance program.

  Next, the substrate holding arm 31 will be described with reference to FIG. FIG. 4 is a perspective view showing a substrate transfer arm provided in the substrate transfer apparatus according to the present embodiment.

  For example, as shown in FIG. 4, the inner edge 30 of the substrate holding arm 31 is formed by a part of a circular arc having a diameter of 300 mm, and the periphery of the wafer W is positioned at four positions of the inner edge 30 of the substrate transfer arm 31. Four substrate holding members 4 for holding are provided. In the example shown in FIG. 4, four wafers W are held at positions where the center position of the arc of the inner edge 30 of the substrate transfer arm 31 and the center position of the wafer W are aligned and held on the substrate transfer arm 31. The substrate holding member 4 is attached.

  In this embodiment, an example in which four substrate holding members 4 are attached to four positions of the substrate transfer arm 31 is shown, but the substrate holding member 4 is within a range in which the wafer W can be held. What is necessary is just to be attached and it may be attached to the position of three places or five places or more.

  In addition, when the substrate holding member 4 is attached to any position of the inner edge 30 of the substrate transfer arm 31, a polygonal shape formed by connecting all the substrate holding members 4 to which the centers of the held wafers W are attached. It is desirable to be inside.

  Next, the substrate holding member will be described with reference to FIGS. FIG. 5 is a perspective view showing a substrate holding member attached to the substrate transfer arm according to the present embodiment. FIG. 6 is a side view of the substrate holding member according to the present embodiment.

  The substrate holding member 4 is configured, for example, as shown in FIG. The substrate holding member 4 holds the wafer (substrate) by placing the periphery of the wafer (substrate), and contacts the back surface of the wafer (substrate) to hold the wafer (substrate). The end surface abutting portion 6 that abuts the end surface of the wafer (substrate), the back surface holding portion 5 and the end surface abutting portion 6 are attached to the substrate transport arm 31 integrally with the back surface holding portion 5 and the end surface abutting portion 6. And a substrate holding member main body 7 which can be attached.

  The substrate holding member main body 7 is a member having an arc shape substantially equal to the curvature of the inner edge 30 of the substrate transfer arm 31 since it is attached to the inner edge 30 having the arc shape of the substrate transfer arm 31. The substrate holding member main body portion 7 has an arc shape, and is provided with an upper surface portion 71 in contact with the upper surface of the inner edge 30 of the substrate transport arm 31 and an arc shape integrally with the upper surface portion 71. It comprises a side part 72 provided so as to cover the side face. As shown in FIG. 5, the upper surface portion 71 is provided with a plurality of through holes 73, which are screwed to a screw thread provided on the upper surface of the substrate transfer arm 31 using, for example, screws.

  The back surface holding part 5 protrudes from the side surface part 72 of the substrate holding member main body part 7 having an arc shape toward the center side in the radial direction of the wafer (substrate) to be placed (the center side of the substrate transfer arm 31). And a contact portion 52 attached to the upper surface of the back surface holding portion main body 51 and contacting the back surface of the wafer (substrate). Further, the back surface holding part main body part 51 and the contact part 52 may be formed integrally with the substrate holding member main body part 7. The contact part 52 is provided so as to protrude upward from the back surface holding part main body part 51. In the example shown in FIG. 5, the back surface holding part 5 is provided at one place at a substantially center in the direction along the inner edge 30 of the substrate transfer arm 31 of the substrate holding member main body part 7.

  As shown in FIG. 6, the end surface contact portion 6 has an R shape, an R shape portion 8 that contacts the end surface of the wafer (substrate) and regulates the deviation of the wafer (substrate), and an R shape portion 8. And an overhang part 81 formed in a bowl shape on the upper side. In the example shown in FIG. 5, the R-shaped portion 8 and the overhang portion 81 are provided at two locations on both ends in the direction along the inner edge 30 of the substrate transport arm 31 of the substrate holding member main body portion 7.

  The R-shaped portion 8 includes a regulating portion 61 having a lower portion that has a large inclination angle and a surface that contacts the wafer, and an inclined portion 62 that is an upper portion and has an inclined surface having a small inclination angle. From the surface of the restricting portion 61 that contacts the wafer to the inclined surface of the inclined portion 62, the inclination angle from the horizontal plane continuously decreases along the direction from the lower side to the upper side. Further, both the surface of the restricting portion 61 that contacts the wafer and the inclined surface of the inclined portion 62 are substantially flat surfaces, and the inclination angle of the inclined surface of the inclined portion 62 from the horizontal plane is the surface of the surface of the restricting portion 61 that contacts the wafer. It may be formed continuously so as to have a smooth shape with no angle near the boundary between the restricting portion 61 and the inclined portion 62, which is smaller than the inclined angle from the horizontal plane.

  The inclination angle (first inclination angle) from the horizontal plane of the surface with which the wafer abuts at the lower end of the restricting portion 61 is θ1, and the inclination angle (second inclination angle) from the horizontal plane of the inclined surface at the upper end of the inclined portion 62 is θ2. And At this time, θ1 and θ2 can be 90 ° or less, and θ1> θ2. More preferably, θ1 can be set to 80 ° to 90 °, θ2 can be set to 40 ° to 80 °, and θ1> θ2.

  Further, the R-shaped portion 8 may be a curved surface having a predetermined curvature from the lower side to the upper side. Alternatively, the R-shaped portion 8 may be a curved surface in which the curvature is not constant from the lower side to the upper side, and the curvature decreases along the direction from the lower side to the upper side.

  Alternatively, after the curvature of the R-shaped portion 8 once increases from the lower side to the upper side in the restricting portion 61 and the curvature reaches a maximum near the boundary between the restricting portion 61 and the inclined portion 62, the inclined portion 62 In this case, the curvature may decrease toward the upper side.

Alternatively, the cross-sectional shape along the radial direction of the wafer on which the R-shaped portion 8 is placed may include a shape that is approximately represented by a quadratic curve. For example, assuming that the horizontal direction in the cross section along the radial direction of the wafer on which the R-shaped portion 8 is placed is the x-axis and the vertical direction is the y-axis, on the outer peripheral side in the radial direction of the wafer to be placed The direction to go is the positive direction of the x axis, and the upper side in the vertical direction is the positive direction of the y axis. At this time, a part of the cross-sectional shape of the R-shaped portion 8 may include a shape approximately represented by x = ay ² + b (a and b are constants). Furthermore, a shape represented by a cycloid curve and a fastest descent curve may be included.

  The overhang portion 81 is a portion provided on the upper side of the R-shaped portion 8 and formed in a bowl shape. The upper portion of the inclined portion 62 on the upper side of the R-shaped portion 8 and the portion of the wafer to be placed from the portion on the radially outer peripheral side (outer peripheral side of the substrate transfer arm 31) of the wafer to be placed. It is formed so as to project in a bowl shape toward the center side in the radial direction (the center side of the substrate transport arm 31).

  Here, as shown in FIG. 6, in the cross section, the horizontal distance along the radial direction of the wafer to be placed between the lower end of the restricting portion 61 and the upper end of the inclined portion 62 is D1, and the inclined portion 62 Let D2 be the horizontal distance along the radial direction of the wafer to be placed between the upper end of the overhanging portion and the portion where the overhanging portion 81 protrudes most. In the present embodiment, for example, D1 can be 3 mm to 10 mm, and D2 can be 0.3 mm to 2 mm.

  Further, assuming that the height of the R-shaped portion 8 is H1 and the height of the overhang portion 81 is H2, for example, H1 can be 5 mm to 15 mm, and H2 can be 1 mm to 4 mm.

  In addition, as the four substrate holding members 4 attached to the substrate transfer arm 31, all four members may be the same shape. Further, for some of the four, members having different shapes as described later in any of the other embodiments and modifications may be mixed and used.

  The material of the substrate holding member 4 is PBI (polybenzimidazole), PEEK (polyetheretherketone), PEEK with carbon (polyetheretherketone), AURUM (Aurum (trade name: manufactured by Mitsui Chemicals)) ) Etc. can be used.

  Further, the four substrate holding members 4 can be attached to four locations on the inner edge 30 of the substrate transfer arm 31 that are substantially equally spaced apart from each other, as shown in FIG. Alternatively, if the center of the inner edge 30 of the substrate transfer arm 31 is included in a quadrilateral formed by connecting the back surface holding portions 5 of the four substrate holding members 4, any of the inner edges 30 of the substrate transfer arm 31 is selected. Can be provided in position.

  Next, with reference to FIGS. 7 to 12, functions of reducing the amount of wear, preventing contamination, improving alignment accuracy, or preventing popping out of the substrate holding member according to the present embodiment will be described.

  First, the effect of improving the alignment accuracy of the substrate holding member according to the present embodiment will be described with reference to FIGS. FIG. 7A is a side view showing a state in which the end surface of the substrate rides on the inclined portion of the R-shaped portion of the substrate holding member according to the present embodiment. FIG. 7B shows a state in which the end face of the substrate is in contact with the restricting portion of the R-shaped portion of the substrate holding member according to the present embodiment. FIG. 8 is a side view showing a state in which the end face of the substrate rides on the inclined portion of the conventional substrate holding member.

  When holding the wafer W in each processing unit of the processing unit B2 using the substrate transfer arm 31 to which the substrate holding member 4 according to the present embodiment is attached, delivery means such as lifting pins of a predetermined processing unit A case where the wafer W is received from will be described as an example. In this case, the substrate transfer arm 31 is positioned at a predetermined position on the lower side of the wafer W held by a plurality of, for example, four elevating pins, and the elevating pins are lowered to move the substrate conveying arm 31 from the elevating pins. The wafer W is transferred so that the periphery of the wafer W is positioned on each of the four substrate holding members 4. In the following, a case where four substrate holding members 4 are provided substantially uniformly on the inner edge 30 of the substrate transport arm 31 will be described. That is, the four substrate holding members 4 are provided so as to face each other with the substrate holding member 4 spaced apart from each other centering on the center of the wafer to be placed (center of the substrate transfer arm 31).

  As shown in FIG. 7A, the center of the wafer W is eccentric from the center of the substrate transfer arm 31, and in one substrate holding member 4, one end of the wafer W is inclined by the R-shaped portion 8 of the end surface abutting portion 6. In some cases, the sheet is delivered while being in contact with the portion 62. In such a state, one end of the wafer W is not in contact with the restriction portion 61 of the R-shaped portion 8 of the end surface contact portion 6 of the substrate holding member 4 and the contact portion 52 of the back surface holding portion 5. Further, in the substrate holding member 4 that faces the substrate holding member 4 across the center of the wafer, the other end of the wafer W is located on both the inclined portion 62 and the regulating portion 61 of the R-shaped portion 8 of the end surface abutting portion 6. It is not in contact but is in contact with the contact portion 52 of the back surface holding portion 5. When the wafer W is delivered in such a state, one end of the wafer W moves while sliding down toward the center of the substrate holding arm 31 along the inclined surface of the inclined portion 62 due to its own weight. Thereafter, as shown in FIG. 7B, the center of the wafer W moves to a position that substantially coincides with the center of the substrate transfer arm 31, and the back surface of the wafer W is held by the back surface holding portion 5 of each substrate holding member 4. The end surface of the wafer W is brought into contact with the restricting portion 61 of the R-shaped portion 8 of the end surface abutting portion 6 of each substrate holding member 4, and the wafer W is held in a state where the position in the horizontal direction is restricted. With the wafer thus positioned, the wafer W is transferred to the next unit or the next process.

  In the present embodiment, the surface of the R-shaped portion 8 on which the wafer abuts continuously decreases in the inclination angle from the horizontal plane along the direction from the lower side to the upper side. Therefore, as shown in FIGS. 7A and 7B, the wafer W that has once started to slide down the inclined surface of the inclined portion 62 gradually moves to the inclined surface of the inclined portion 62 without stopping on the way. It is possible to surely move to a position where it slides down and comes into contact with the restricting portion 61.

  On the other hand, the conventional substrate holding member 104 cannot reliably move the wafer to the position where it comes into contact with the restricting portion. As shown in FIG. 8, a conventional substrate holding member 104 having no R-shaped portion will be described. The conventional substrate holding member 104 includes a back surface holding portion 105 including a back surface holding portion main body portion 151 and a contact portion 152, and an end surface contact portion 106 including a lower regulating portion 161 and an upper inclined portion 162. . However, the conventional substrate holding member 104 has a corner E between the regulating portion 161 and the inclined portion 162. Therefore, the wafer W may stop at the corner portion E when it is guided and moved to a position where it comes into contact with the restriction portion 161 again after the wafer W is detached from the restriction portion 161 and rides on the inclined portion 162. Thus, the substrate holding member according to the present embodiment can improve the alignment accuracy when delivering the wafer W to be held, as compared with the conventional substrate holding member.

  Next, with reference to FIG. 9 and FIG. 10, an operation and effect that can prevent contamination due to the chemical solution adhering from the wafer in the substrate holding member according to the present embodiment will be described. FIG. 9 is a side view showing a state where a substrate coated with a chemical is held on the substrate holding member according to the present embodiment. FIG. 10 is a side view showing a state where a substrate coated with a chemical is held on a conventional substrate holding member. Note that the overhang portion 81 is not shown in FIG.

  In the substrate holding member 4 according to the present embodiment, as shown in FIG. 9, the surface on which the regulating portion 61 on the lower side of the R-shaped portion 8 contacts the end surface of the wafer W is a surface perpendicular to the horizontal plane (from the horizontal plane). The inclined surface is inclined from the surface having an inclination angle of 90 °. Therefore, there is almost no possibility that the chemical solution PR adhering to the upper surface of the wafer W will adhere to the restricting portion 61.

  On the other hand, in the conventional substrate holding member 104, there is a possibility that the chemical solution PR applied to the upper surface of the wafer W adheres to the regulation part 61. In the conventional substrate holding member 104, as shown in FIG. 10, since the surface of the lower regulating portion 161 that contacts the end surface of the wafer W is substantially perpendicular to the horizontal plane, the chemical solution PR applied to the upper surface of the wafer W , It will adhere to the regulating part 161. Thus, the substrate holding member according to the present embodiment can prevent the chemical solution from the wafer from adhering as compared with the conventional substrate holding member.

  Next, with reference to FIG. 11 and FIG. 12, a description will be given of the operation and effect that the wafer to be transferred is not contaminated in the substrate holding member according to the present embodiment. FIG. 11 is a side view showing a state in which chemicals and particles are attached to the substrate holding member according to the present embodiment. FIG. 12 is a side view showing a state where chemicals and particles are attached to a conventional substrate holding member. In addition, about FIG. 11, the overhang part 81 is not illustrated.

  As shown in FIG. 11, the substrate holding member 4 according to the present embodiment is configured so that the inclination continuously changes between the lower regulating portion 61 and the upper inclined portion 62 of the R-shaped portion 8. It is formed, and there is no corner between the restricting portion 61 and the inclined portion 62. Accordingly, even when the chemical liquid adheres to the inclined surface of the inclined portion 62 when the wafer W rides on the inclined portion 62, the deposit A, which is a particle or the like generated by drying the chemical liquid or the chemical liquid, is It is easy to slide down to the lower end, and the deposit A which is a chemical liquid or particles generated by drying the chemical liquid is difficult to remain on the inclined surface of the inclined portion 62. Therefore, there is almost no possibility that the deposit A adheres to the wafer to be transported thereafter.

  On the other hand, in the conventional substrate holding member 104, there is a possibility that adhered matter may adhere to the wafer to be transported thereafter. As shown in FIG. 12, in the conventional substrate holding member 104, since there is a corner E between the restricting portion 161 and the inclined portion 162, the chemical solution or the chemical solution attached to the inclined surface of the inclined portion 162 is dried and generated. The deposit A, which is a particle or the like, is likely to remain in the corner E. If the deposit A remains on the corner E, the deposit A is likely to adhere to the wafer when the next wafer to be transported is guided and moved from the inclined portion 162 to the regulating portion 161. As described above, the substrate holding member according to the present embodiment is less likely to be contaminated with the wafer to be transferred as compared with the conventional substrate holding member.

  Next, with reference to FIG. 13 and FIG. 14, an operation and effect that can prevent the wafer W from jumping out of the substrate holding member in the substrate holding member according to the present embodiment will be described. FIG. 13 is a side view showing a state where the substrate is prevented from jumping out by the overhang portion in the substrate holding member according to the present embodiment. FIG. 14 is a side view showing a state in which the substrate protrudes from the substrate holding member in the conventional substrate holding member.

  In the present embodiment, as shown in FIG. 13, an overhang portion 81 is provided above the R-shaped portion 8. Therefore, for example, even when the wafer W that has traveled on the inclined portion 62 during the delivery of the wafer is further subjected to a force toward the outer peripheral side of the substrate transfer arm 31 due to the expansion / contraction operation of the substrate transfer arm 31, the end surface of the wafer W is over. It is locked by the hang part 81 and does not move further to the outer peripheral side of the substrate transfer arm 31.

  On the other hand, in the conventional substrate holding member 104, the end surface of the wafer that has run on the inclined portion 162 is not locked. As shown in FIG. 14, in the conventional substrate holding member 104, the overhang portion is not provided above the inclined portion 162. For this reason, for example, when the wafer W that has traveled on the inclined portion 162 during the delivery of the wafer further receives a force in the outer peripheral side direction of the substrate transfer arm 31, it is easily detached from the substrate transfer arm 31.

  Therefore, the substrate holding member according to the present embodiment can prevent the wafer from jumping out of the substrate holding member as compared with the conventional substrate holding member.

  In the present embodiment, the surface where the restricting portion 61 of the R-shaped portion 8 contacts the end surface of the wafer W is an inclined surface inclined from a surface perpendicular to the horizontal plane. However, the restricting portion 61 and the inclined portion 62 are formed smoothly and continuously from the lower side to the upper side, and the inclination angle of the inclined surface of the inclined portion 62 from the horizontal plane decreases along the direction from the lower side to the upper side. If so, the surface where the restricting portion 61 contacts the end surface of the wafer W may be a surface perpendicular to the horizontal plane. When the surface where the restricting portion 61 contacts the end surface of the wafer W is a surface perpendicular to the horizontal surface, the surface where the restricting portion 61 contacts the end surface of the wafer W is an inclined surface inclined from the surface perpendicular to the horizontal surface. Compared to the above, the possibility of the chemical solution is increased. However, since the restricting portion 61 and the inclined portion 62 are formed smoothly and continuously, the adhering substance A such as particles attached to the chemical solution or the chemical solution attached from the wafer W riding on the inclined portion 62 has an R shape. It is easy to slide down to the lower end of the part 8. Therefore, it is possible to reduce the amount of chemicals and particles attached to the next wafer to be transported.

Moreover, in this Embodiment, the example in which both the R-shaped part 8 and the overhang part 81 were provided was shown. However, both the R-shaped portion 8 and the overhang portion 81 may not be provided, and only one of them may be provided. When only the R-shaped portion 8 is provided, it has functions of reducing the amount of wear, preventing contamination, and improving alignment accuracy. Further, when only the overhang portion 81 is provided, it has a function of preventing popping out.
(Modification of the first embodiment)
Next, a modified example of the substrate holding member according to the first embodiment will be described with reference to FIG.

  FIG. 15 is a side view showing a state in which a substrate coated with a chemical is held on a substrate holding member according to this modification. In addition, about FIG. 15, the overhang part 81 is not illustrated.

  The substrate holding member according to this modification is a plane in which, in the substrate abutting portion, the surface on which the lower regulating portion wafer abuts and the inclined surface of the upper inclined portion are inclined at different inclination angles from the horizontal plane. And it is different from the substrate holding member according to the first embodiment in that the R-shaped portion is not integrally formed.

  As shown in FIG. 15, in the substrate holding member 4a according to this modification, the restricting portion 61a is inclined from a plane perpendicular to the horizontal plane. That is, the inclination angle of the restricting portion 61a from the horizontal plane is smaller than 90 °. Therefore, there is almost no possibility that the chemical solution PR adhering to the upper surface of the wafer W will adhere to the restricting portion 61a, and there is almost no possibility of adhering to the wafer held by the substrate holding member 4a thereafter. Assuming that the inclination angle of the restricting portion 61a from the horizontal plane is θ3, θ3 is preferably 90 ° or less, and more preferably 80 ° or more and 90 ° or less. Further, assuming that the inclination angle of the inclined portion 62a from the horizontal plane is θ4, θ4 is preferably 80 ° or less, and more preferably 40 ° or more and 80 ° or less.

  On the other hand, as described with reference to FIG. 10, in the conventional substrate holding member 104, when the surface of the regulating portion 161 that contacts the end surface of the wafer W is perpendicular to the horizontal plane, the chemical solution attached to the upper surface of the wafer W is It will adhere to the regulating part 161.

  Therefore, the substrate holding member according to this modification can prevent the chemical solution from the wafer from adhering as compared with the conventional substrate holding member.

Note that, in the substrate holding member according to this modification as well, an overhang portion may be provided above the inclined portion, similarly to the substrate holding member according to the first embodiment.
(Second Embodiment)
Next, a substrate transfer apparatus, a substrate transfer arm, and a substrate holding member according to a second embodiment will be described with reference to FIGS.

  FIG. 16 is a perspective view showing a substrate holding member attached to the substrate transfer arm according to the present embodiment. FIG. 17 is an enlarged perspective view of the vicinity of the end surface contact portion of the substrate holding member according to the present embodiment. FIG. 18 is an enlarged perspective view of the vicinity of the end surface contact portion of the conventional substrate holding member.

  In the substrate transfer apparatus according to the present embodiment, the end surface contact portion where the substrate holding member attached to the substrate transfer arm contacts the end surface of the wafer (substrate) can be deformed in the radial direction of the wafer (substrate) to be placed. The difference from the substrate transfer apparatus according to the first embodiment is that it is attached to the substrate holding member main body.

  Regarding the substrate transfer apparatus and the substrate transfer arm according to the present embodiment, the portions other than the substrate holding member are the same as the substrate transfer apparatus and the substrate transfer arm according to the first embodiment described with reference to FIGS. The description is omitted here. In the following text, the same reference numerals are given to the parts described above, and the description may be omitted (the same applies to the following modified examples and embodiments).

  For example, the four substrate holding members 4b provided on the substrate transfer arm are configured as shown in FIG. As in the first embodiment, the substrate holding member 4b holds the wafer (substrate) by placing the periphery of the wafer (substrate), and comes into contact with the back surface of the wafer (substrate). A back surface holding portion 5 that holds the substrate), an end surface contact portion 6b that contacts the end surface of the wafer (substrate), a back surface holding portion 5 and an end surface contact portion 6b, and the back surface holding portion 5 and the end surface contact portion. 6b and a substrate holding member main body 7 which can be attached to the substrate transfer arm 31 integrally.

  Similar to the first embodiment, the substrate holding member main body portion 7 has an arc shape, and is provided with an upper surface portion 71 in contact with the upper surface of the inner edge 30 of the substrate transfer arm 31 and an arc shape integrally with the upper surface portion 71. And a side surface portion 72 provided so as to cover the side surface of the inner edge 30 of the substrate transfer arm 31. Also in the present embodiment, the upper surface portion 71 is provided with a plurality of through holes 73 as shown in FIG. 16, and is screwed to a screw thread provided on the upper surface of the substrate transfer arm 31, for example, using screws. The

  The back surface holding portion 5 is provided on the side surface portion 72 of the substrate holding member main body portion 7 having an arc shape so as to protrude toward the center side in the radial direction of the wafer to be placed (the center side of the substrate transfer arm 31). And a contact portion 52 attached to the upper surface of the back surface holding portion main body 51 and contacting the back surface of the wafer (substrate). Further, the contact portion 52 is provided so as to protrude upward from the back surface holding portion main body portion 51.

  As shown in FIG. 17, unlike the first embodiment, the end surface abutting portion 6b is a portion on the lower side and including a contact portion 63b with a large inclination angle from the horizontal plane that abuts the wafer. A portion 61b and an inclined portion 62b which is an upper portion and includes an inclined surface having a small inclination angle from the horizontal plane. Unlike the first embodiment, a corner E may be provided in the vicinity of the boundary between the restricting portion 61b and the inclined portion 62b. In the example illustrated in FIG. 16, the end surface abutting portions 6 b are provided at two positions on both ends of the substrate holding member main body portion 7.

  In the present embodiment, the end surface contact portion 6b is attached to the substrate holding member main body portion 7 so as to be deformable in the radial direction of the wafer W to be placed. Specifically, as shown in FIG. 17 as an example, the horizontal cross section of the end surface abutting portion 6b is formed in a thin shape. In the example shown in FIG. 17, the restricting portion 61b of the end surface contact portion 6b is also formed in a thin shape, and the inclined portion 62b provided above the restricting portion 61b is also formed in a thin shape. When the thickness of the restricting portion 61b and the inclined portion 62b is T1, for example, T1 can be set to 0.5 mm to 1.5 mm.

  In the case of the substrate holding member 4b according to the present embodiment, as shown in FIG. 17, the horizontal sections of the restricting portion 61b and the inclined portion 62b are formed so as to have a thin wall shape. It can be deformed in the radial direction of the wafer. Therefore, even when a force is applied in a horizontal direction from the end surface of the wafer to the restricting portion 61b due to the expansion / contraction operation of the substrate transfer arm 31, the restricting portion 61b and the inclined portion 62b are deformed. The force with which the end surface of the wafer is brought into contact with the contact portion 63b is small.

  On the other hand, in the case of the conventional board | substrate holding member 104 which has the control part 161 and the inclination part 162 as shown in FIG. 18, the horizontal cross section of the control part 161 and the inclination part 162 is a thick shape. Therefore, when the wafer is held, when a horizontal force is applied from the end surface of the wafer W to the contact portion 163 of the restricting portion 161 by the expansion / contraction operation of the substrate transfer arm 31, the restricting portion 161 is hardly deformed. The force with which the end surface of the wafer is brought into contact with the contact portion 163 of the restricting portion 161 is large.

  Therefore, according to the board | substrate holding member which concerns on this Embodiment, the amount of wear of a control part can be reduced compared with the conventional board | substrate holding member.

In the substrate holding member according to the present embodiment, an overhang portion of the substrate holding member according to the first embodiment may be provided.
(Modification of the second embodiment)
Next, a modification of the substrate holding member according to the second embodiment will be described with reference to FIG.

  FIG. 19 is an enlarged perspective view of the vicinity of the end surface contact portion of the substrate holding member according to the present modification as viewed from below.

  The substrate holding member 4c according to this modification is different from the substrate holding member 4b according to the second embodiment in that the horizontal cross section of the end surface abutting portion 6c is formed in a zigzag shape.

  In the case of the substrate holding member 4c according to this modification, as shown in FIG. 19, since the horizontal cross sections of the restricting portion 61c and the inclined portion 62c are formed in a zigzag shape, the rigidity is small and the radial direction of the wafer to be placed It can be deformed. Therefore, even if a force is applied in the horizontal direction from the end surface of the wafer to the restricting portion 61c by the expansion / contraction operation of the substrate transfer arm 31, the restricting portion 61c and the inclined portion 62c are deformed. The force with which the end face of the wafer is brought into contact with the contact portion is small.

  On the other hand, as described with reference to FIG. 18, in the case of the conventional substrate holding member 104, the horizontal cross sections of the restricting portion 161 and the inclined portion 162 are not zigzag but thick. Therefore, when a horizontal force is applied from the end surface of the wafer to the contact portion 163 of the restricting portion 161 by the expansion / contraction operation of the substrate transfer arm 31, the restricting portion 161 is hardly deformed and the contact portion 163 of the restricting portion 161 is not deformed. The force with which the end face of the wafer is brought into contact is large.

Therefore, according to the board | substrate holding member which concerns on this modification, the abrasion amount of a control part can be reduced compared with the conventional board | substrate holding member.
(Third embodiment)
Next, a substrate transfer apparatus, a substrate transfer arm, and a substrate holding member according to a third embodiment will be described with reference to FIGS.

  FIG. 20 is a perspective view showing a substrate holding member attached to the substrate transfer arm according to the present embodiment. FIG. 21A is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion of the substrate holding member according to the present embodiment. FIG. 21B is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion when the back surface holding portion of the substrate holding member according to the present embodiment is worn. FIG. 22A is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion of the conventional substrate holding member. FIG. 22B is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion when the back surface holding portion of the conventional substrate holding member is worn.

  In the substrate transfer apparatus according to the present embodiment, the substrate holding member attached to the substrate transfer arm has a back surface holding portion that holds the substrate in contact with the back surface of the wafer (substrate) in the radial direction of the wafer (substrate) to be placed. 2 differs from the substrate transfer apparatus according to the first embodiment in that it has an abutting portion whose vertical cross-sectional shape is convex and the substrate abutting portion does not have an R-shaped portion.

  Regarding the substrate transfer apparatus and the substrate transfer arm according to the present embodiment, the portions other than the substrate holding member are the same as the substrate transfer apparatus and the substrate transfer arm according to the first embodiment described with reference to FIGS. The description is omitted here.

  The four substrate holding members 4d provided on the substrate transfer arm are configured as shown in FIG. 20, for example. As in the first embodiment, the substrate holding member 4d holds the wafer (substrate) by placing the peripheral edge of the wafer (substrate), and contacts the back surface of the wafer (substrate). A back surface holding portion 5d for holding the substrate), an end surface contact portion 6d that contacts the end surface of the wafer (substrate), a back surface holding portion 5d and an end surface contact portion 6d, and the back surface holding portion 5d and the end surface contact portion. 6d and a substrate holding member body 7 that can be attached to the substrate transfer arm 31 integrally.

  Similar to the first embodiment, the substrate holding member main body portion 7 has an arc shape, and is provided with an upper surface portion 71 in contact with the upper surface of the inner edge 30 of the substrate transfer arm 31 and an arc shape integrally with the upper surface portion 71. And a side surface portion 72 provided so as to cover the side surface of the inner edge 30 of the substrate transfer arm 31. Also in the present embodiment, the upper surface portion 71 is provided with a plurality of through holes 73 as shown in FIG. 20, and is screwed to a screw thread provided on the upper surface of the substrate transfer arm 31, for example, using screws. The

  Unlike the first embodiment, the end surface abutting portion 6d is a lower portion, a restricting portion 61d that is a portion including a surface with a large inclination angle from the horizontal plane and a wafer abutting, and an upper portion. And an inclined portion 62d, which is a portion including an inclined surface with a small inclination angle from the horizontal plane. Unlike the first embodiment, a corner E may be provided in the vicinity of the boundary between the restricting portion 61d and the inclined portion 62d. In the example shown in FIG. 20, the end surface abutting portions 6 d are provided at two positions on both ends of the substrate holding member main body portion 7.

  The back surface holding portion 5d is provided on the side surface portion 72 of the substrate holding member main body portion 7 having an arc shape so as to protrude toward the center side in the radial direction of the wafer to be placed (the center side of the substrate transfer arm 31). And a contact portion 52d attached to the upper surface of the back surface holding portion main body 51 and contacting the back surface of the wafer (substrate). Further, the contact part 52d is provided so as to protrude upward from the back surface holding part main body part 51.

  In the case of the substrate holding member 4d according to the present embodiment, as shown in FIG. 21 (a), the substrate holding member 4d has an abutting portion 52d whose longitudinal section along the radial direction of the wafer to be placed is convex. Further, as shown in FIG. 21B, when the wafer to be placed is displaced due to the expansion / contraction operation of the substrate transfer arm 31 and inclines from the horizontal plane and comes into contact with the back surface holding portion 5d, it comes into contact with wear. A plane PF1 is formed in the portion 52d. In the present embodiment, the longitudinal sectional shape along the radial direction of the wafer on which the contact portion 52d is placed is a convex shape, and the width along the direction orthogonal to the radial direction of the wafer on which the contact portion 52d is placed is small. Therefore, the area of the plane PF1 is small. If the area of the flat surface PF1 formed on the contact portion 52d due to wear is small, the frictional resistance that the wafer receives from the flat surface PF1 when the misaligned wafer is guided and moved again is small, so the wafer contacts the restriction portion 61d. It is easily guided and moved to the position to be performed.

  On the other hand, in the case of the conventional substrate holding member, as shown in FIG. 22A, the wafer to be mounted is placed on the contact portion 152 formed on the back surface holding portion main body 151 of the back surface holding portion 105 and contacting the wafer. The longitudinal cross-sectional shape along the radial direction of W is not a convex shape but a rectangle. Therefore, the area of the plane PF0 formed on the contact portion 152 due to wear when the wafer to be placed is displaced due to the expansion / contraction operation of the substrate transfer arm 31 and inclines from the horizontal plane and contacts the back surface holding portion 105. Is big. When the contact portion 152 has a bowl shape as shown in FIG. 22A, a wide plane PF0 as shown in FIG. 22B is formed in the contact portion 152 due to wear. When a wide flat surface PF0 is formed due to wear, the frictional resistance that the wafer receives from the flat surface PF0 increases when the misaligned wafer is guided and moved again. It becomes difficult to be done.

Therefore, according to the substrate holding member according to the present embodiment, the amount of wear of the substrate holding member can be reduced as compared with the conventional substrate holding member, and abuts on the regulating portion from the state of riding on the inclined portion. It can be easily guided to the state.
(First modification of the third embodiment)
Next, a first modification of the substrate holding member according to the third embodiment will be described with reference to FIG.

  FIG. 23A is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion of the substrate holding member according to this modification. FIG. 23B is an enlarged perspective view of the vicinity of the contact portion of the back surface holding portion when the back surface holding portion of the substrate holding member according to this modification is worn.

  The substrate holding member according to this modification is the third embodiment in that the back surface holding portion 5e has a plurality of contact portions whose convex sections are convex along the radial direction of the wafer (substrate) to be placed. It differs from the substrate holding member according to the embodiment.

  In the case of the substrate holding member according to this modified example, the back surface holding portion 5e is a contact portion in which the longitudinal sectional shape along the radial direction of the wafer (substrate) to be placed is convex as shown in FIG. There are a plurality of 52e. That is, the load applied to each contact portion 52e is small because the load when placing the wafer is distributed to the plurality of contact portions 52e. Therefore, as shown in FIG. 23B, even if the wafer to be placed is displaced due to the expansion / contraction operation of the substrate transfer arm 31 and is inclined from the horizontal plane and comes into contact with the back surface holding portion 5e, it is formed by wear. The area of the plane PF2 is small. If the area of the plane PF2 formed by wear is small, the frictional resistance that the wafer receives from the plane PF2 when the misaligned wafer is guided and moved again is small, so that the wafer can be easily brought into contact with the restricting portion. Guided move.

  On the other hand, in the case of the conventional substrate holding member, as described with reference to FIGS. 22A and 22B, the longitudinal sectional shape along the radial direction of the wafer W on which the contact portion 152 is placed has a convex shape. It is not a shape but a rectangle. Therefore, when the wafer to be placed is displaced, the area of the plane PF0 formed on the contact portion 152 due to wear is large. If the area of the plane PF0 is large, the frictional resistance that the wafer receives from the plane PF0 when the misaligned wafer is guided and moved again increases, so that the wafer is less likely to be guided and moved to a position where it comes into contact with the restricting portion. .

  Therefore, according to the substrate holding member according to the present modification, the amount of wear of the substrate holding member can be reduced as compared with the conventional substrate holding member, and the state in which the substrate holding member is in contact with the regulating portion from the state of riding on the inclined portion Can be easily guided and moved.

Further, in the case of the substrate holding member according to this modification, since there are a plurality of contact portions, the load when placing the wafer can be distributed, which is more than the case of the substrate holding member according to the third embodiment. Furthermore, the amount of wear of the substrate holding member can be reduced. Alternatively, depending on the state where the wafer is placed, when the contact portions do not contact all of the plurality of contact portions, the amount of wear of the contact portions that do not contact can be reduced.
(Second modification of the third embodiment)
Next, a second modification of the substrate holding member according to the third embodiment will be described with reference to FIG.

  FIG. 24 is a plan view of the vicinity of the contact portion of the back surface holding portion of the substrate holding member according to this modification.

  The substrate holding member according to this modification has a contact portion row in which the back surface holding portion is formed by arranging a plurality of contact portions whose convex shape is another longitudinal section along the radial direction of the wafer (substrate) to be placed. Is different from the first modification of the third embodiment in that it has a plurality.

  As shown in FIG. 24, the back surface holding portion 5f of the substrate holding member according to this modification has a plurality of contact portions 52f having a convex shape in one longitudinal section along the radial direction of the wafer to be placed. In addition, the contact portion row 53f formed by arranging the contact portions 52f is a contact portion row that is independent of the contact portion row 53f, and the other vertical cross-sectional shape along the radial direction of the wafer to be placed is convex. A contact portion row 54f is formed by arranging a plurality of contact portions 52f. Each contact portion 52f shown in the plan view of FIG. 24 has a hemispherical shape, for example, and has a convex curved surface as an upper surface.

  Also in the case of the substrate holding member according to this modification, since the back surface holding portion 5f has a plurality of contact portions 52f, the load when placing the wafer can be distributed, and the back surface holding portion 5f of the substrate holding member can be dispersed. The amount of wear can be reduced. Alternatively, when the wafer does not contact all of the plurality of contact portions 52f, the amount of wear of the contact portions 52f that do not contact can be reduced.

  However, the substrate holding member according to the present modification has a larger number of contact portions 52f than the first modification of the third embodiment. By having a large number of contact portions 52f, it is possible to further disperse the load when placing the wafer, or to increase the number of contact portions 52f that the wafer does not contact, so that the contact portions 52f are worn. The amount to do can be further reduced.

  In this modification, the contact portions 52f are arranged in a lattice pattern in the radial direction of the wafer to be placed and in the circumferential direction of the wafer to be placed. A plurality of dots may be provided in each of the radial direction and the circumferential direction of the wafer to be placed.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

  The present invention can be applied not only to a coating film forming apparatus or a resist coating apparatus but also to a developing apparatus, a substrate cleaning apparatus, a film forming apparatus, an etching apparatus, and other various apparatuses. In addition, the present invention can be applied to an apparatus including a step of transporting a semiconductor substrate, a glass substrate, and other various substrates.

21 Carrier placing portion 22 Delivery means 23 Coating unit 24 Development unit 25 Cleaning unit 26 Heating unit 27 Cooling unit 28 Delivery unit 29 Delivery means 3 Substrate transport device 30 Inner edge 31 Substrate transport arm 32 Base 32a Guide grooves 33 and 34 Guide rail 35, 36 Connecting member 37 Rotation drive part 38 Rotating shaft part 4, 4a to 4d Substrate holding member 5, 5d to 5f Back surface holding part 51 Back surface holding part main body part 52, 52d to 52f Abutting part 6, 6a to 6d End face contact Contact portion 61, 61a to 61d Restriction portion 62, 62a to 62d Inclined portion 7 Substrate holding member main body portion 71 Upper surface portion 72 Side surface portion 73 Through hole 8 R-shaped portion 81 Overhang portion A Deposit B1 Carrier block B2 Processing portion B3 Interface Part B4 Exposure apparatus C Carrier D1, D2 Horizontal distance H1, H2 Height PF0, PF1, PF2 Flat surface PR Chemical solution U1, U2 Shelf unit W Wafer θ1, θ2, θ3, θ4 Inclination angle

Claims (9)

A substrate holding member that is attached to a substrate transfer arm of a substrate transfer device and holds the substrate by placing the periphery of the substrate,
A back surface holding portion for holding the substrate in contact with the back surface of the substrate;
An end surface abutting portion that abuts the end surface of the substrate;
A substrate holding member main body portion to which the back surface holding portion and the end surface contact portion are attached, and can be attached to the substrate transfer arm integrally;
The substrate holding member, wherein the end surface abutting portion is attached to the substrate holding member main body so as to be deformable in a radial direction of a substrate to be placed.   The substrate holding member according to claim 1, wherein a horizontal section of the end surface abutting portion is formed in a thin shape. The end surface contact portion is a lower portion and includes a restriction portion including a contact portion having a large inclination angle from the horizontal plane, and an upper portion and an inclination portion including an inclined surface having a small inclination angle from the horizontal plane. Have
The substrate holding member according to claim 2, wherein the restricting portion contacts the substrate at the contact portion.   The substrate holding member according to claim 3, further comprising a corner near a boundary between the restricting portion and the inclined portion.   The thickness of the said control part and the said inclination part exists in the range of 0.5 mm-1.5 mm, The board | substrate holding member of Claim 3 or Claim 4 characterized by the above-mentioned.   The substrate holding member according to claim 1, wherein a horizontal section of the end surface abutting portion is formed in a zigzag shape.   7. The substrate holding member according to claim 6, wherein the end surface contact portion deforms the zigzag horizontal section when a force is applied from the end surface of the substrate to the end surface contact portion.   A substrate transfer arm to which the substrate holding member according to any one of claims 1 to 7 is attached.   A substrate transfer apparatus comprising the substrate transfer arm according to claim 8.

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