JP5416012B2 - Gas processing equipment - Google Patents

Description

  The present invention relates to a gas processing apparatus that purifies harmful gas contained in a gas to be processed.

  2. Description of the Related Art Conventionally, a technique for purifying harmful gas contained in exhaust gas by creating a plasma state by performing high voltage discharge in the exhaust gas is known. In recent years, this technology is being applied to a purification device for purifying factory exhaust and an air purifier for purifying indoor air for the purpose of deodorization.

  Plasma that is in a thermally non-equilibrium state, that is, in which the electron temperature is much higher than the temperature of the gas or ion (non-equilibrium plasma (hereinafter simply referred to as plasma)) is the ion or radical produced by electron collision. Promotes a chemical reaction that does not occur at room temperature, and is considered useful in hazardous gas treatment as a medium that can efficiently remove or decompose harmful gases. The key to practical use is to improve the energy efficiency during processing and to convert it into a completely safe product after processing with plasma.

In general, plasma at atmospheric pressure is generated by gas discharge or electron beam. There are nitrogen oxides (NOx), sulfur oxides (SOx), chlorofluorocarbons, CO ₂ , volatile organic solvents (VOC), etc. that are currently being considered for application. Above all, NOx is contained in the exhaust gas of a car, so that it needs to be put into practical use immediately.

The phenomenon in discharge plasma (plasma generated by gas discharge) in NOx removal is that ions and radicals generated primarily by electron collision cause an initial reaction, and N ₂ , H ₂ O, It is thought that it is converted into each particle such as NH ₄ NO ₃ .

Further, when the harmful gas is, for example, acetaldehyde or formaldehyde, the harmful gas is converted into CO ₂ and H ₂ O by passing plasma. In this case, ozone (O ₃ ) is generated as a by-product.

  FIG. 4 illustrates a main part of a conventional gas processing apparatus using discharge plasma (for example, see Patent Document 1). In the figure, reference numeral 1 denotes a duct (ventilation path) through which a processing target gas (air containing toxic gas) GS flows. Inside the duct 1, a discharge electrode 2 and a ground electrode 3 are arranged along the direction in which the processing target gas GS passes. Are disposed alternately, and a honeycomb structure 4 having a large number of through-holes 4a called cells is disposed between the electrodes 2 and 3. Reference numeral 5 denotes a high voltage power source. The honeycomb structure 4 is formed of an insulator such as ceramics, and Patent Document 2 also has an example of its use.

  The discharge electrode 2 is formed of a metal mesh, a fine wire, a needle-like body, or the like. Each discharge electrode 2 is connected to the + pole of the high voltage power supply 5 by a conducting wire 6. The ground electrode 3 is formed of a metallic mesh or the like. Each ground electrode 3 is connected to the negative pole of the high voltage power supply 5 by a conducting wire 7.

  In this gas processing apparatus, the gas GS to be processed is caused to flow through the duct 1, and a high voltage (several kV to several tens kV) from the high voltage power supply 5 is applied between the discharge electrode 2 and the ground electrode 3. Thereby, plasma is generated in the through-holes 4a of the honeycomb structures 4, and harmful gases contained in the processing target gas GS are decomposed into harmless substances by ions and radicals generated in the plasma.

However, the gas processing apparatus having such a configuration has the following problems.
(1) Although a large number of honeycomb structures 4 are provided, a technique for generating uniform plasma without variations has not been established, and variations in the performance of the honeycomb structures 4 occur. For example, impedance values may be different even in the same honeycomb structure 4, and impedance values may be different in one honeycomb structure 4, for example, at the top and bottom thereof, so that uniform plasma can be generated as a whole. Therefore, the gas processing capacity becomes unstable. Further, since plasma is generated only through the through holes 4a, the amount of plasma generated is small and the gas processing capacity is low.

  (2) The honeycomb structure 4 has a characteristic of low impedance when moisture is absorbed and high impedance when dried. When the honeycomb structure 4 becomes low impedance, the flowing current increases and the discharge electrode 2 and the ground electrode 3 When the high voltage value applied between them decreases and the honeycomb structure 4 becomes high impedance, the flowing current decreases and the high voltage value applied between the discharge electrode 2 and the ground electrode 3 increases. The high voltage power supply 5 that can obtain a high voltage value that can secure a desired plasma generation amount with respect to such a change in the high voltage value is very expensive including the man-hours required for its design.

(3) Since the discharge electrode 2 and the ground electrode 3 are provided for each of the honeycomb structures 4, the number of parts is large, the structure is complicated, and the cost is high.
(4) Since the honeycomb structure 4 is disposed in the duct 1 along the passing direction of the gas GS to be treated (direction from the inlet to the outlet of the duct 1), the direction orthogonal to the gas flow of the honeycomb structure 4 The dimension of is longer and the dimension parallel to the gas flow is shorter. For this reason, when the flow rate of the gas flow is high, the time during which the gas GS to be processed is exposed to the plasma inside the honeycomb structure 4 is short, and the gas processing capacity is reduced.

(5) Since the moisture in the honeycomb structure 4 is consumed when the plasma discharge is generated in the honeycomb structure 4, the moisture in the gas GS to be processed in the duct 1 is used in order to further perform the plasma discharge. Is preferably supplied into the honeycomb structure 4. However, since moisture is immediately consumed by the discharge at the discharge surface of the honeycomb structure 4 located between the electrodes, it is necessary to supply moisture from the side surface of the honeycomb structure 4 where the discharge of the honeycomb structure 4 does not occur. However, since the side surface of the honeycomb structure 4 is parallel to the flow direction of the processing target gas GS, the moisture of the processing target gas GS is difficult to be sucked from this side surface. As a result, the honeycomb structure 4 is replenished with water. Difficult to increase gas processing capacity.

  Therefore, the present applicant has proposed a gas processing apparatus having a structure as shown in FIG. 5 as a solution to the problems of the conventional gas processing apparatus described above (see Patent Document 3). In this gas processing apparatus, intervals G (G1 to G3) are provided along a direction orthogonal to the passing direction of the processing target gas GS from the inlet to the outlet of the duct 1, and a large number of through holes (round holes) 4a are formed. A plurality of honeycomb structures 4 (4-1 to 4-4) are arranged.

  Reference numeral 8 denotes a first electrode disposed outside the honeycomb structure 4-1 located at one end in a direction orthogonal to the passing direction of the processing target gas GS among the honeycomb structures 4-1 to 4-4. Reference numeral 9 denotes a second electrode disposed outside the honeycomb structure 4-4 located at the other end of the honeycomb structures 4-1 to 4-4 in the direction orthogonal to the passing direction of the processing target gas GS. A high voltage from a high voltage power source (high voltage source) 5 is applied between the first electrode 8 and the second electrode 9. By applying this high voltage, plasma is generated in the through-holes 4a of the honeycomb structure 4 and the space 10 (10-1 to 10-3) between the honeycomb structures 4, and the ions and radicals generated in the plasma The harmful gas contained in the processing target gas GS is decomposed into harmless substances.

  In this gas processing apparatus, the time during which the gas GS to be processed is exposed to plasma in the through holes 4a of the honeycomb structures 4 and the spaces 10 between the honeycomb structures 4 can be increased, and the opportunity for gas decomposition is increased. In addition, plasma is not generated on the upstream surface (uppermost surface) 4b of each honeycomb structure 4 facing in the passage direction of the processing target gas GS, and the process target gas GS is in contact with the flow of the processing target gas GS. Since the fluid pressure in the GS passage direction is received, moisture in the processing target gas GS enters the honeycomb structure 4 from this surface (hereinafter, this surface is referred to as a gas flow facing surface) 4b, and the honeycomb structure 4 Activates plasma generation in Thereby, a processing capability improves and it can prevent the fall of the gas processing capability in a high-speed flow.

JP 2000-140562 A JP 2001-276561 A JP 2008-194669 A JP 2004-089708 A

  However, although the gas processing apparatus disclosed in Patent Document 3 has the excellent effects as described above, the honeycomb structure 4 is replenished with moisture of the gas GS to be processed into the honeycomb structure 4. Since there is only one gas flow facing surface 4b to be used and the area of the gas flow facing surface 4b is limited, no more water can be replenished from the gas flow facing surface 4b. I can't hope.

  In Patent Document 4, moisture is fed into the space between the metal electrode and the honeycomb electrode by a humidifier, thereby increasing the moisture concentration in the gas to be treated and activating the plasma discharge to increase the gas purification capability. A gas purification apparatus is shown. However, when the technique shown in Patent Document 4 is applied to the gas processing apparatus shown in FIG. 5, moisture is consumed by plasma discharge in the space 10 between the honeycomb structures 4. It needs to be fed in and consumes a lot of power to keep the humidifier running.

  The present invention has been made in order to solve such problems, and the object of the present invention is to provide a gas treatment capable of further improving the gas treatment capacity by directly supplying moisture to the honeycomb structure. To provide an apparatus.

In order to achieve such an object, according to the present invention, at least one of the honeycomb structures is a target honeycomb structure for water replenishment, and the processing target gas passage direction of the target honeycomb structure (from the inlet of the ventilation path) A water supply means for supplying water to the inside of the target honeycomb structure is provided in contact with the upstream gas flow facing surface facing the flow in the direction toward the outlet .

  For example, in the present invention, the water replenishing means includes a water storage tank and a thin tube disposed between the water storage tank and the gas flow facing surface of the target honeycomb structure. In this case, the capillaries replenish moisture in the water storage tank into the target honeycomb structure by a capillary phenomenon or a negative pressure phenomenon of the blower fan. When such a thin tube is used, moisture can be replenished without supplying electric power as in a humidifier, thus saving energy. Further, when water is consumed by plasma discharge, water is replenished according to the consumed amount.

  In the present invention, if the honeycomb structures are arranged at intervals in a direction orthogonal to the direction in which the gas to be processed passes, the ventilation paths that do not cause plasma discharge are generated for all honeycomb structures. Moisture can be replenished stably from the upstream side toward the gas flow facing surface, and the water is replenished to the downstream side of the honeycomb structure along the gas flow through the honeycomb structure.

  In the present invention, moisture is replenished directly to the honeycomb structure, and moisture is transmitted from there to the inside of the honeycomb structure, so that it is difficult for the moisture to be easily consumed by plasma discharge in the space between the honeycomb structures.

  According to the present invention, at least one of the honeycomb structures is a target honeycomb structure for water replenishment, and the target honeycomb structure is in contact with the gas flow facing surface facing the processing target gas flow. Since a moisture replenishing means for replenishing moisture is provided inside the structure, moisture is directly replenished to the honeycomb structure, and moisture is not easily consumed by plasma discharge in the space between the honeycomb structures. As a result, the gas processing capacity can be further improved.

It is a figure which shows the principal part of one Embodiment (Embodiment 1) of the gas processing apparatus which concerns on this invention. It is a figure which shows the principal part of other embodiment (Embodiment 2) of the gas processing apparatus which concerns on this invention. It is a figure which shows the principal part of another embodiment (Embodiment 3) of the gas processing apparatus which concerns on this invention. It is a figure which illustrates the principal part of the conventional gas processing apparatus using discharge plasma. It is a figure which shows the principal part of the gas processing apparatus shown by patent document 3. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Embodiment 1]
FIG. 1 is a diagram showing a main part of an embodiment (Embodiment 1) of a gas processing apparatus according to the present invention. 5, the same reference numerals as those in FIG. 5 denote the same or equivalent components as those described with reference to FIG. 5, and the description thereof will be omitted.

Also in this embodiment, similarly to the gas processing apparatus shown in FIG. 5, along a direction orthogonal to the passage direction of the untreated gas GS (direction from the inlet of the duct 1 to the outlet), a plurality of honeycomb structures The body 4 is arranged in the duct 1 with a gap.

  In this example, a gap G1 is provided between the honeycomb structures 4-1 and 4-2, and a gap G2 is provided between the honeycomb structures 4-3 and 4-4. ˜4-4 are arranged in the duct 1.

  In addition, adjacent honeycomb structures 4-1 and 4-2 among the plurality of honeycomb structures 4 in the duct 1 serve as a first honeycomb structure group, and honeycombs positioned at both ends of the first honeycomb structure group. Outside the structures 4-1 and 4-2, an electrode 8 is arranged as a first electrode, and an electrode 9 is arranged as a second electrode.

  Similarly, adjacent honeycomb structures 4-3 and 4-4 among the plurality of honeycomb structures 4 in the duct 1 are set as the second honeycomb structure group, and are positioned at both ends of the second honeycomb structure group. Outside the honeycomb structures 4-3 and 4-4, the electrode 9 as the first electrode and the electrode 11 as the second electrode are arranged.

  In the present embodiment, the electrode 9 is a common electrode that serves as both the second electrode of the first honeycomb structure group and the first electrode of the second honeycomb structure group. The second electrode of the honeycomb structure group and the first electrode of the second honeycomb structure group may be independent electrodes.

  In the present embodiment, the high voltage power source (high voltage source) 5 is provided between the electrodes 8 and 9 of the first honeycomb structure group and between the electrodes 9 and 11 of the second honeycomb structure group. The electrodes 8 and 11 are connected to the positive pole of the high voltage power supply 5 by the conductive wire 12, and the electrode 9 is connected to the negative pole of the high voltage power supply 5 by the conductive wire 13. ing.

  The honeycomb structure 4 is formed of an insulator such as ceramics, and has a large number of through holes (cells) 4a through which the processing target gas GS passes. The number of through holes 4a per unit area of each honeycomb structure 4 is made equal. Moreover, the shape of each honeycomb structure 4 is made equal, and the electrodes 8, 9, and 11 are made into a metal mesh so that the gas GS to be processed passes.

In the present embodiment, the honeycomb structures 4-1 to 4-4 are all the target honeycomb structures for water replenishment, and the gas flow facing surfaces (upstream side) of the honeycomb structures 4-1 and 4-4 Gas flow facing surface) 4b is provided with water supply ports 14-1 and 14-2 of the narrow tube 14 in contact with each other, and the gas flow facing surfaces of the honeycomb structures 4-2 and 4-3 (upstream gas flow facing surfaces). Water supply ports 15-1 and 15-2 of the thin tube 15 are provided in contact with 4b. The water inlet 14-3 of the narrow tube 14 is immersed in the water stored in the first tank (water tank) 16. The water inlet 15-3 of the thin tube 15 is immersed in the water stored in the second tank (water tank) 17.

  In this gas processing apparatus, the gas GS to be processed is caused to flow into the duct 1, and a high voltage from the high voltage power supply 5 is applied between the electrodes 8 and 9 and between the electrodes 9 and 11. As a result, plasma is generated in the through holes 4a of the honeycomb structure 4 and the space 10 (10-1, 10-2) between the honeycomb structures 4, and the gas to be processed is generated by the ions and radicals generated in the plasma. The harmful gas contained in GS is decomposed into harmless substances.

  In the present embodiment, plasma is generated not only in the through holes 4 a of the honeycomb structure 4 but also in the space 10 between the honeycomb structures 4. For this reason, in addition to the molecular decomposition effect of the harmful gas in the through hole 4a, the molecular decomposition effect of the harmful gas in the space 10 between the honeycomb structures 4 is added, and further, the molecular decomposition effect in the through hole 4a and the honeycomb Due to the synergistic effect with the molecular decomposition effect in the space 10 between the structures 4, decomposition of harmful gases into harmless substances is promoted, and gas processing capacity is increased. Further, in the space 10 between the honeycomb structures 4, an electric field spreads from the edge surface of the opposing through-hole 4a, and a large amount of uniform plasma is generated.

  In this embodiment, since the honeycomb structures 4 are arranged at intervals along the direction orthogonal to the passing direction of the processing target gas GS, they are arranged along the passing direction of the processing target gas GS. Compared to the case, the time during which the processing target gas GS is exposed to plasma in the through holes 4a of the honeycomb structures 4 and the spaces 10 between the honeycomb structures 4 becomes longer. As a result, the opportunity for gas decomposition is increased, the gas processing capacity is improved, and it is possible to prevent the gas processing capacity from being lowered in a high-speed flow.

  In this embodiment, a high voltage from the high-voltage power source 5 is individually applied between the electrodes 8 and 9 of the first honeycomb structure group and between the electrodes 9 and 11 of the second honeycomb structure group. Therefore, the potentials in the spaces 10-1 and 10-2 can be stably maintained in a high electric field state, and plasma can be stably generated.

  Furthermore, in this embodiment, during the gas treatment in which the gas to be treated GS flows in the duct 1, the moisture in the tank 16 and the tank 17 is directly supplied into the honeycomb structures 4-1 to 4-4. . That is, moisture in the tank 16 is sucked up through the thin tube 14 due to a capillary phenomenon or a negative pressure phenomenon of a blower fan (not shown) that feeds the processing target gas GS, and the honeycomb structures 4-1 and 4-4 face each other. It reaches the surface 4b and is replenished into the honeycomb structures 4-1 and 4-4 from the gas flow facing surface 4b. Further, the moisture in the tank 17 is sucked up through the thin tubes 15 and reaches the gas flow facing surface 4b of the honeycomb structures 4-2 and 4-3, and the honeycomb structures 4-2 and 4-3 from the gas flow facing surface 4b. It is replenished inside.

  In this case, since the honeycomb structures 4-1 to 4-4 are arranged at intervals in a direction orthogonal to the passage direction of the processing target gas GS, the honeycomb structures 4-1 to 4-4 are disposed inside the honeycomb structures 4-1 to 4-4. The replenished moisture travels along the gas flow, travels through the honeycomb structures 4-1 to 4-4, and is replenished to the downstream side of the honeycomb structures 4-1 to 4-4. Further, moisture is directly supplied to the honeycomb structures 4-1 to 4-4, and moisture is transmitted from the honeycomb structures 4-1 to 4-4 to the honeycomb structures 4-1 to 4-4. Moisture is not easily consumed by plasma discharge. Thereby, the improvement of gas processing capacity is achieved.

  Further, in the present embodiment, the water supply to the honeycomb structures 4-1 to 4-4 is performed through the thin tubes 14 and 15 due to the capillary phenomenon or the negative pressure phenomenon of the blower fan. Water can be replenished without supplying power to the battery, which saves energy. Further, when moisture is consumed by plasma discharge, moisture is replenished according to the consumed amount, and moisture necessary for stabilizing plasma discharge can be efficiently supplied. Further, as the air volume increases, the inside of the gas processing apparatus becomes negative pressure, so that the amount of water supplied from the tanks 16 and 17 also increases, contributing to the improvement of gas processing efficiency.

[Embodiment 2]
In Embodiment 1, the adjacent honeycomb structures 4-1 and 4-2 among the plurality of honeycomb structures 4 arranged at intervals along the direction orthogonal to the passing direction of the processing target gas GS One honeycomb structure group, and the adjacent honeycomb structures 4-3 and 4-4 as second honeycomb structure groups, so that a high voltage is individually applied to the first and second honeycomb structure groups. However, as shown in FIG. 2, only one group of honeycomb structures may be arranged in the duct 1.

  In the example shown in FIG. 2, the honeycomb structures 4-1, 4-2, 4-3, and 4-4 are placed in the duct 1 at intervals along a direction orthogonal to the passage direction of the processing target gas GS. The first electrode 8 is disposed outside the honeycomb structure 4-1 disposed at one end of the honeycomb structures 4-1 to 4-4, and the honeycomb structure 4- disposed at the other end. The second electrode 9 is disposed outside the electrode 4, and a high voltage from the high voltage power supply 5 is applied between the first electrode 8 and the second electrode 9.

[Embodiment 3]
Further, as shown in FIG. 3, the honeycomb structures 4-1, 4-2, 4-3, and 4-4 are arranged in the duct 1 at intervals along the passage direction of the processing target gas GS, Among the honeycomb structures 4-1 to 4-4, the first electrode 8 is disposed outside the honeycomb structure 4-1 disposed at one end, and the outside of the honeycomb structure 4-4 disposed at the other end. Alternatively, the second electrode 9 may be disposed, and a high voltage from the high voltage power supply 5 may be applied between the first electrode 8 and the second electrode 9.

  In this case, for example, the honeycomb structure 4-1 is a target honeycomb structure for water replenishment, the water supply port 14-1 of the narrow tube 14 is provided in contact with the gas flow facing surface 4b of the honeycomb structure 4-1, and the tank The moisture in 16 is replenished to the inside of the honeycomb structure 4-1. Note that not only the honeycomb structure 4-1 but also the honeycomb structure 4-2 may be the target honeycomb structure for water replenishment, and the water in the tank 16 may be replenished in the same manner. All of 4-1 to 4-4 may be the target honeycomb structure for water replenishment.

  In the first to third embodiments described above, the honeycomb structure 4 may be provided with a catalyst function for decomposing ozone, and a catalyst for decomposing ozone is provided at a downstream position in the passing direction of the processing target gas GS. It may be.

  In Embodiment 1 described above, the number of honeycomb structures 4 in one honeycomb structure group is two, but the number may be further increased. Further, the number of honeycomb structure groups is not limited to two, and the number may be further increased. The same applies to Embodiments 2 and 3, and the number of honeycomb structures may be two or more.

  In Embodiment 1 described above, a high voltage from a single high-voltage power supply 5 is individually applied to the first honeycomb structure group and the second honeycomb structure group. You may make it apply the high voltage from a voltage power supply separately. For example, by changing the value of the applied high voltage, changing the type of applied high voltage (AC, DC, etc.), or changing the frequency of the applied high voltage, the first honeycomb structure group and the first It is possible to change the kind of decomposable harmful gas by changing the amount of plasma generated in the two honeycomb structure groups.

  Moreover, in Embodiment 1-3 mentioned above, ozone may be generated in large quantities as a by-product, and you may make it divert as an ozone generator.

The gas processing apparatus of the present invention can also be applied to so-called reforming for generating a hydrogen-containing gas from hydrocarbons or the like for the purpose of efficiently generating hydrogen used in a fuel cell or the like. For example, in the case of octane (substance relatively close to the average molecular weight of gasoline) C ₈ H ₁₈ , when supplied to this gas treatment device, the chemical reaction represented by the following formula (1) is promoted, and as a result, hydrogen gas is efficiently generated. can do.
C ₈ H ₁₈ + 8H ₂ O + 4 (O ₂ + 4N ₂ ) → 8CO ₂ + 17H ₂ + 16N ₂ ... (1)

  DESCRIPTION OF SYMBOLS 1 ... Duct (ventilation path), 4 (4-1 to 4-4) ... Honeycomb structure, 4a ... Through-hole (cell), 4b ... Gas flow opposing surface, 5 ... High voltage power supply, 8, 9, 11 ... Electrode, 10 (10-1, 10-2, 10-3) ... space, G (G1, G2, G3) ... interval, GS ... gas to be processed, 14, 15 ... capillary, 14-1, 14-2, 15-1, 15-2 ... water supply port, 14-3, 15-3 ... water inlet, 16, 17 ... tank (water tank).

Claims (4)

A plurality of honeycomb structures having a large number of through-holes that are arranged at intervals in the ventilation path and through which the gas to be processed flowing through the ventilation path passes;
A first electrode disposed outside the honeycomb structure disposed at one end of the plurality of honeycomb structures;
A second electrode disposed outside the honeycomb structure disposed at the other end of the plurality of honeycomb structures;
And a high voltage source for generating a plasma in the space between the through hole and the honeycomb structure a high voltage is applied, wherein the honeycomb structure between the second electrode and the first electrode, the air passage In the gas processing apparatus in which the direction from the inlet to the outlet is the passing direction of the processing target gas ,
At least one of the honeycomb structures is a target honeycomb structure for water replenishment, and is in contact with an upstream gas flow facing surface facing the flow in the processing target gas flow direction of the target honeycomb structure, A gas treatment apparatus comprising a moisture replenishing means for replenishing moisture inside the target honeycomb structure. A plurality of honeycomb structures having a large number of through-holes that are arranged at intervals in the ventilation path and through which the gas to be processed flowing through the ventilation path passes;
A plurality of adjacent honeycomb structures among the plurality of honeycomb structures are used as one group of honeycomb structures, and the first and second arranged outside the honeycomb structures located at both ends of the honeycomb structures . Electrodes,
And a high voltage source for generating a plasma in the space between the through hole and the honeycomb structure a high voltage is applied, wherein the honeycomb structure between the second electrode and the first electrode, the air passage In the gas processing apparatus in which the direction from the inlet to the outlet is the passing direction of the processing target gas ,
At least one of the honeycomb structures is a target honeycomb structure for water replenishment, and is in contact with an upstream gas flow facing surface facing the flow in the processing target gas flow direction of the target honeycomb structure, A gas treatment apparatus comprising a moisture replenishing means for replenishing moisture inside the target honeycomb structure. In the gas treatment device according to claim 1 or 2,
The said honeycomb structure is arrange | positioned at intervals in the direction orthogonal to the passage direction of the said process target gas. The gas processing apparatus characterized by the above-mentioned. In the gas treatment equipment according to any one of claims 1-3,
The hydration means is
A gas processing apparatus comprising: a water storage tank; and a thin tube disposed between the water storage tank and a gas flow facing surface of the target honeycomb structure.

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