JP5415370B2 - 光硬化型樹脂組成物およびそれを用いた光学部品 - Google Patents
光硬化型樹脂組成物およびそれを用いた光学部品 Download PDFInfo
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- JP5415370B2 JP5415370B2 JP2010158038A JP2010158038A JP5415370B2 JP 5415370 B2 JP5415370 B2 JP 5415370B2 JP 2010158038 A JP2010158038 A JP 2010158038A JP 2010158038 A JP2010158038 A JP 2010158038A JP 5415370 B2 JP5415370 B2 JP 5415370B2
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- 239000011342 resin composition Substances 0.000 title claims description 57
- 230000003287 optical effect Effects 0.000 title claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 59
- 229920000647 polyepoxide Polymers 0.000 claims description 59
- -1 oxetane compound Chemical class 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 19
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 7
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 5
- 125000000129 anionic group Chemical group 0.000 claims description 3
- 125000002091 cationic group Chemical group 0.000 claims description 3
- 239000000463 material Substances 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000001723 curing Methods 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 150000002921 oxetanes Chemical class 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 150000003138 primary alcohols Chemical class 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- MQOOPAYPXFMXGW-UHFFFAOYSA-N 1-(3-ethyloxetan-3-yl)-4-[(3-ethyloxetan-3-yl)methoxy]-3,3-dimethylbutan-2-ol Chemical compound C1OCC1(CC)CC(O)C(C)(C)COCC1(CC)COC1 MQOOPAYPXFMXGW-UHFFFAOYSA-N 0.000 description 1
- ZVVZJRGGIIJWBL-UHFFFAOYSA-N 1-(3-ethyloxetan-3-yl)-5-[(3-ethyloxetan-3-yl)methoxy]pentan-2-ol Chemical compound C1OCC1(CC)CC(O)CCCOCC1(CC)COC1 ZVVZJRGGIIJWBL-UHFFFAOYSA-N 0.000 description 1
- ALADOYDDKFXPNF-UHFFFAOYSA-N 1-[(3-ethyloxetan-3-yl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CCC1(COC1)CN2C(=O)NC(=O)NC2=O ALADOYDDKFXPNF-UHFFFAOYSA-N 0.000 description 1
- MKNOYISMZFDLQP-UHFFFAOYSA-N 3-[1-[2-(oxetan-3-yl)butoxy]butan-2-yl]oxetane Chemical compound C1OCC1C(CC)COCC(CC)C1COC1 MKNOYISMZFDLQP-UHFFFAOYSA-N 0.000 description 1
- WWJKCARUHXVBFE-UHFFFAOYSA-N 3-ethyl-1-(3-ethyloxetan-3-yl)-3-[(3-ethyloxetan-3-yl)methoxymethyl]heptan-2-ol Chemical compound C1OCC1(CC)CC(O)C(CC)(CCCC)COCC1(CC)COC1 WWJKCARUHXVBFE-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- YJCMPXJZAZXTTN-UHFFFAOYSA-N 3-ethyl-3-[[2-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=CC=C(OCC2(CC)COC2)C=1OCC1(CC)COC1 YJCMPXJZAZXTTN-UHFFFAOYSA-N 0.000 description 1
- FHFOJGCIXOUQMZ-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=CC(OCC2(CC)COC2)=CC=1OCC1(CC)COC1 FHFOJGCIXOUQMZ-UHFFFAOYSA-N 0.000 description 1
- UIKLBTKZWQVZIR-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxymethyl]-2-bicyclo[2.2.1]heptanyl]methoxymethyl]oxetane Chemical compound C1C2CCC1C(COCC1(CC)COC1)C2COCC1(CC)COC1 UIKLBTKZWQVZIR-UHFFFAOYSA-N 0.000 description 1
- OUOXFTBHVIBCEI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=C(OCC2(CC)COC2)C=CC=1OCC1(CC)COC1 OUOXFTBHVIBCEI-UHFFFAOYSA-N 0.000 description 1
- NXHOXSAEFJONFO-UHFFFAOYSA-N 3-ethyl-3-[[4-[4-[(3-ethyloxetan-3-yl)methoxy]phenyl]phenoxy]methyl]oxetane Chemical group C=1C=C(C=2C=CC(OCC3(CC)COC3)=CC=2)C=CC=1OCC1(CC)COC1 NXHOXSAEFJONFO-UHFFFAOYSA-N 0.000 description 1
- DCOXQQBTTNZJBI-UHFFFAOYSA-N 3-ethyl-3-[[4-[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]phenyl]methoxymethyl]oxetane Chemical group C=1C=C(C=2C=CC(COCC3(CC)COC3)=CC=2)C=CC=1COCC1(CC)COC1 DCOXQQBTTNZJBI-UHFFFAOYSA-N 0.000 description 1
- YHPAMUSAWICJEZ-UHFFFAOYSA-N 3-ethyl-3-[[6-[(3-ethyloxetan-3-yl)methoxy]-2,2,3,3,4,4,5,5-octafluorohexoxy]methyl]oxetane Chemical compound C1OCC1(CC)COCC(F)(F)C(F)(F)C(F)(F)C(F)(F)COCC1(CC)COC1 YHPAMUSAWICJEZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1525—Four-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(A)1分子中に2個以上のエポキシ基を有し、60℃以上で液状のエポキシ樹脂。
(B)1分子中に2個以上のエポキシ基を有し、単独で屈折率1.6以上を有する固形エポキシ樹脂。
(C)下記の一般式(1)で表されるオキセタン化合物。
(A)1分子中に2個以上のエポキシ基を有し、60℃以上で液状のエポキシ樹脂。
(B)1分子中に2個以上のエポキシ基を有し、単独で屈折率1.6以上を有する固形エポキシ樹脂。
(C)下記の一般式(1)で表されるオキセタン化合物。
常温(25℃)で液状の脂環式エポキシ樹脂(ダイセル化学社製、セロキサイド2021P)
ビスフェノールA型液状エポキシ樹脂(エポキシ価:185g/eq.、粘度10000mPa・s)
ビスフェノールA型固形エポキシ樹脂(エポキシ価:172g/eq.、粘度4400mPa・s、溶融温度45℃)
ビスフェノールF型液状エボキシ樹脂(エポキシ価:163g/eq.、粘度2170mPa・s)
フルオレン型エポキシ樹脂(オンコートEX1040、長瀬産業社製、屈折率:約1.63、常温(25℃)で固形、溶融開始温度:70℃)
前記一般式(1)中、n=4で示されるオキセタン化合物
3−メチル−3−ヒドロキシメチルオキセタン
3−エチル−3−フェノキシメチルオキセタン
4,4’−ビス[(3−エチル−3−オキセタニル)メトキシメチル]ビフェニル
下記の構造式(2)で表されるアニオン成分とカチオン成分とからなる、トリアリールスルホニウム塩系光重合開始剤
上記各成分を、後記の表1〜表4に示す割合で配合した後、加熱溶融混合することにより、実施例および比較例の光硬化型樹脂組成物を調製した。なお、比較例1は、実施例1と対比するために設けたものであり、後記の表1および表3に示すように、比較例1における各成分の配合組成は、オキセタン化合物の種類が異なること以外は、実施例1と同じである。後記の表1〜表4に示すように、他の比較例も、その番号と同じ番号の実施例と対比するために設けたものである。
光硬化型樹脂組成物(液状樹脂)を1×1.5×0.5cmの透明成型型に流し込み、UVを16000mJ照射し硬化させた後、型から外し150℃で1時間の加熱処理を行った。このようにして得られた成形物(硬化物)の表面を、グラインダーにより研磨し、屈折率計(アタゴ社製)を用いて、上記成形物(硬化物)の25℃での屈折率を測定した。
光源に水銀ランプ(浜松ホトニクス社製、LC−8、365nmでの照度が30mW/cm2になるよう設定)を用いたUVレオメーター(Rheologica社製、15mmφのアルミ製パラレルプレート使用)によるゲルタイムを測定し、硬化性の評価を行った。上記UVレオメーターによるゲルタイムは、上記各光硬化型樹脂組成物の粘弾性を25℃で測定した際の弾性項(G′)の105Pa到達時間とした。
5gに計量した光硬化型樹脂組成物(液状樹脂)をアルミシャーレにとり、これを、25℃,60%の恒温恒湿槽に入れて30分間放置した。そして、恒温恒湿槽に入れる前(槽投入前)と、恒温恒湿槽に入れて放置した後(槽放置後)との樹脂組成物中の水分量(含有率)を、カールフィッシャー容量滴定方式自動水分量測定装置(KF−07型、三菱化学社製)により測定した。また、この測定値より、恒温恒湿槽に放置したことによる水分量増加率(吸水率)を算出した。
Claims (5)
- エポキシ樹脂、オキセタン化合物および光重合開始剤が含有されている光硬化型樹脂組成物であって、エポキシ樹脂として下記の(A)および(B)成分が併含され、かつ、オキセタン化合物として下記の(C)成分が含有され、光重合開始剤として下記の(D)成分が含有され、樹脂組成物中の全樹脂量100重量%に対して、(A)成分の割合が40〜85重量%、(B)成分の割合が10〜45重量%、(C)成分の割合が5〜15重量%の範囲であり、全樹脂量100重量部に対し、(D)成分の割合が0.05〜5重量部の範囲であることを特徴とする光硬化型樹脂組成物。
(A)1分子中に2個以上のエポキシ基を有し、60℃以上で液状のエポキシ樹脂。
(B)1分子中に2個以上のエポキシ基を有し、単独で屈折率1.6以上を有する固形エポキシ樹脂。
(C)下記の一般式(1)で表されるオキセタン化合物。
- 上記(B)成分が、フルオレン型エポキシ樹脂である請求項1記載の光硬化型樹脂組成物。
- 光学レンズ用である請求項1または2記載の光硬化型樹脂組成物。
- 請求項1または2記載の光硬化型樹脂組成物の硬化体からなり、屈折率1.55以上であることを特徴とする光学部品。
- 光学レンズである請求項4記載の光学部品。
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SG2011050192A SG177842A1 (en) | 2010-07-12 | 2011-07-11 | Photocurable resin compostion and optical component using the same |
US13/179,625 US8557891B2 (en) | 2010-07-12 | 2011-07-11 | Photocurable resin composition and optical component using the same |
CN201110201082.2A CN102344543B (zh) | 2010-07-12 | 2011-07-12 | 光固化性树脂组合物及利用其的光学部件 |
TW100124644A TWI504626B (zh) | 2010-07-12 | 2011-07-12 | 光硬化樹脂組合物及使用其之光學元件 |
KR1020110068821A KR20120006456A (ko) | 2010-07-12 | 2011-07-12 | 광경화형 수지 조성물 및 그것을 이용한 광학부품 |
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