JP5413576B2 - Liquid ejecting head and liquid ejecting apparatus - Google Patents

Description

  The present invention relates to a liquid ejecting head, a manufacturing method thereof, and a liquid ejecting apparatus.

  For example, in a liquid ejecting apparatus such as an ink jet printer, a liquid ejecting head including a piezoelectric element is known for ejecting liquid droplets such as ink. Such a liquid ejecting head can change the pressure in the pressure chamber formed below the piezoelectric element, for example, by displacing the piezoelectric element by a drive signal or the like. As a result, droplets such as ink supplied from the nozzle holes into the pressure chamber can be ejected. Such a liquid jet head has a structure in which the piezoelectric layer is covered with an upper electrode for the purpose of protecting the piezoelectric layer of the piezoelectric element that is weak against external factors such as moisture (patent) Reference 1). In such a liquid ejecting head, the piezoelectric element forms, for example, a lower electrode layer on a vibration plate, and a precursor is applied thereon to crystallize the piezoelectric layer. In the piezoelectric layer thus formed, for example, it is difficult to stably crystal- grow the piezoelectric layer at the interface of the end portion (for example, on the tapered side surface) of the lower electrode layer. As a result, the structural strength of the piezoelectric layer at the end of the lower electrode layer may be different from the structural strength of the piezoelectric layer that has crystal-grown on the upper surface of the lower electrode layer, for example. Therefore, when the piezoelectric element is displaced, physical destruction such as cracks may occur at the end of the lower electrode layer, which may reduce the reliability of the piezoelectric element.

JP 2005-88441 A

  An object of the present invention is to provide a liquid ejecting head having a piezoelectric element with high reliability.

  An object of the present invention is to provide a method of manufacturing a liquid jet head having a highly reliable piezoelectric element.

  One object of the present invention is to provide a liquid ejecting apparatus having the liquid ejecting head.

(1) A liquid jet head according to the present invention includes:
A pressure chamber plate having a pressure chamber communicating with a nozzle hole for injecting liquid;
A vibration plate formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; A diaphragm having a first region that overlaps the pressure chamber;
A first conductive layer having a top surface extending in a first direction and one end surface in the first direction in the first region;
A piezoelectric layer formed to cover the first conductive layer;
A second conductive layer formed to cover the piezoelectric layer in the first region in a second direction orthogonal to the first direction;
Have
In the first direction in the first region, the second conductive layer has two end faces;
The two end surfaces of the second conductive layer are disposed so as to overlap the upper surface of the first conductive layer.

  In the description of the present invention, the word “upper” is, for example, “forms another specific thing (hereinafter referred to as“ B ”)“ above ”a specific thing (hereinafter referred to as“ A ”)”. Etc. In the description according to the present invention, in the case of this example, the case where B is directly formed on A and the case where B is formed on A via another are included. The word “upward” is used. Similarly, the term “below” includes a case where B is directly formed under A and a case where B is formed under another through A.

  According to the present invention, it is possible to provide a liquid ejecting head having a highly reliable piezoelectric element.

(2) The liquid jet head according to the present invention is
A pressure chamber plate having a plurality of pressure chambers in communication with nozzle holes for injecting liquid;
A vibration plate formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; A diaphragm having a first region overlapping each of the plurality of pressure chambers,
In the plurality of first regions, a first conductive layer having an upper surface extending in the first direction and one end surface in the first direction,
A piezoelectric layer formed to cover each of the plurality of first conductive layers;
A second conductive layer continuously formed so as to cover the plurality of piezoelectric layers in the first region in a second direction orthogonal to the first direction;
Have
In the first direction in the first region, the second conductive layer has two end faces;
The two end surfaces of the second conductive layer are disposed so as to overlap the upper surface of the first conductive layer.

  According to the present invention, it is possible to provide a liquid ejecting head having a highly reliable piezoelectric element.

(3) In the liquid jet head according to the present invention,
The first conductive layer includes a first conductive portion formed in the first region and a second conductive portion extending from the first conductive portion to one side in the first direction outside the first region. And a third conductive part extending from the first conductive part to the opposite side of the second conductive part,
The end surface in the first direction of the third conductive portion may be the end surface of the first conductive layer.

(4) In the liquid jet head according to the present invention,
The first conductive layer includes a first conductive portion formed in the first region and a second conductive portion extending from the first conductive portion to one side in the first direction outside the first region. And having
The end surface in the first direction of the first conductive portion may be the end surface of the first conductive layer.

(5) In the liquid jet head according to the present invention,
The width of the second conductive layer in the first region in the first direction may be smaller than the width of the first conductive portion of the first conductive layer in the first direction.

(6) In the liquid jet head according to the present invention,
The end surface of the first conductive layer may be a tapered side surface.

(7) In the liquid jet head according to the present invention,
The second conductive layer has an opening that overlaps the end surface of the first conductive layer,
Of the two end surfaces of the second conductive layer, an end surface of the first conductive layer on the side where the end surface is formed may constitute a part of the opening.

(8) In the liquid jet head according to the present invention,
The piezoelectric layer is spaced apart from the second conductive layer and has an opening located on the second conductive portion of the first conductive layer,
A third conductive layer formed to cover at least the opening;
A fourth conductive layer electrically connected to the third conductive layer;
May further be included.

(9) A liquid ejecting apparatus according to the present invention includes:
Any one of the above liquid jet heads is provided.

  According to the present invention, it is possible to provide a liquid ejecting apparatus having a liquid ejecting head having a highly reliable piezoelectric element.

(10) A method for manufacturing a liquid jet head according to the present invention includes:
Forming a pressure chamber plate having a pressure chamber;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps the pressure chamber on the surface;
Forming a first conductive layer in the first region so as to have an upper surface extending in a first direction and one end surface in the first direction;
Forming a piezoelectric layer so as to cover the first conductive layer;
Forming a second conductive layer so as to cover the piezoelectric layer in the first region in a second direction orthogonal to the first direction;
Have
In the step of forming the second conductive film, the second conductive layer has two end faces in the first direction in the first region,
The two end surfaces of the second conductive layer are formed so as to overlap the upper surface of the first conductive layer.

  According to the present invention, it is possible to provide a method of manufacturing a liquid jet head having a highly reliable piezoelectric element.

(11) A method of manufacturing a liquid jet head according to the present invention includes:
Forming a pressure chamber plate having a plurality of pressure chambers;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps each of the plurality of pressure chambers,
Forming a first conductive layer in each of the plurality of first regions so as to have an upper surface extending in a first direction and one end surface in the first direction;
Forming each of the piezoelectric layers so as to cover the plurality of first conductive layers;
Forming a second conductive layer continuously so as to cover the piezoelectric layer in the first region in a second direction orthogonal to the first direction;
Have
In the step of forming the second conductive film, the second conductive layer has two end faces in the first direction in the first region,
The two end surfaces of the second conductive layer are formed so as to overlap the upper surface of the first conductive layer.

  According to the present invention, it is possible to provide a method of manufacturing a liquid jet head having a highly reliable piezoelectric element.

(12) In the method of manufacturing a liquid jet head according to the invention,
The step of forming the first conductive layer includes the step of forming a first conductive portion in the first region,
In the step of forming the second conductive film, the width of the second conductive layer in the first region in the first direction is made smaller than the width of the first conductive part in the first direction. May be.

(13) In the method of manufacturing a liquid jet head according to the invention,
The step of forming the first conductive layer includes:
Forming a conductive layer on the first region;
Forming an etching protective film on the conductive layer;
Etching the conductive layer after forming the etching protection film,
The etching protective film may be made of a material that forms the piezoelectric layer.

(14) In the method of manufacturing a liquid jet head according to the invention,
The step of forming the piezoelectric layer includes
Forming a piezoelectric layer before etching so as to cover at least the first conductive film;
Forming a conductive mask layer on the piezoelectric layer before the etching process;
Etching the piezoelectric layer after forming the mask layer,
The mask layer may be made of a material that forms the second conductive layer.

FIG. 3 is an exploded perspective view schematically illustrating the liquid ejecting head according to the embodiment. FIG. 3 is a plan view schematically showing a main part of the liquid jet head according to the embodiment. Sectional drawing which shows the principal part in the IIB-IIB line | wire of FIG. 2 (A) typically. Sectional drawing which shows the principal part in the IIC-IIC line | wire of FIG. 2 (A) typically. FIG. 9 is a cross-sectional view schematically illustrating a modification example of a main part of the liquid jet head according to the embodiment. FIG. 9 is a cross-sectional view schematically illustrating a modification example of a main part of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 3 is a perspective view schematically illustrating the liquid ejecting apparatus according to the embodiment.

  An example of an embodiment to which the present invention is applied will be described below with reference to the drawings. However, the present invention is not limited only to the following embodiments. The present invention includes any combination of the following embodiments and modifications thereof.

1. Liquid Ejecting Head Hereinafter, the liquid ejecting head according to the embodiment will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view of a liquid jet head 300 according to this embodiment.

  As shown in FIG. 1, the liquid jet head 300 according to this embodiment includes a pressure chamber plate 10 having a pressure chamber 11, a vibration plate 30 formed above the pressure chamber plate 10, and a vibration plate 30. The formed piezoelectric element 100, the nozzle plate 20 formed below the pressure chamber plate 10, and a sealing plate 90 that seals the piezoelectric element 100 are included.

  The pressure chamber plate 10 has a pressure chamber 11 as shown in FIG. As shown in FIG. 1, the pressure chamber plate 10 has a wall portion 12 that constitutes a side wall of the pressure chamber 11. The pressure chamber plate 10 may have a reservoir 15 that communicates with the pressure chamber 11 via the supply path 13 and the communication path 14. A through hole (not shown) may be formed in the reservoir 15, and liquid may be supplied into the reservoir 15 from the outside through the through hole. According to this, by supplying the liquid to the reservoir 15, the liquid can be supplied to the pressure chamber 11 through the supply path 13 and the communication path 14. The shape of the pressure chamber 11 is not particularly limited. The shape of the pressure chamber 11 may be, for example, a parallelogram in a plan view or a rectangle. The number of the pressure chambers 11 is not particularly limited, and may be one or a plurality. The material of the pressure chamber plate 10 is not particularly limited. The pressure chamber plate 10 may be formed of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like.

  As shown in FIG. 1, the nozzle plate 20 is formed below the pressure chamber 10. The nozzle plate 20 is a plate-like member and has a nozzle hole 21. The nozzle hole 21 is formed so as to communicate with the pressure chamber 11. The shape of the nozzle hole 21 is not particularly limited as long as the liquid can be discharged. Through the nozzle hole 21, the liquid in the pressure chamber 11 can be discharged toward the lower side of the nozzle plate 20, for example. Moreover, the number of the nozzle holes 21 is not specifically limited, One may be sufficient and multiple may be provided. The material of the nozzle plate 20 is not particularly limited. The nozzle plate 20 may be made of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like.

  The diaphragm 30 is formed above the pressure chamber plate 10 as shown in FIG. Therefore, the diaphragm 30 is formed above the pressure chamber 11 and the wall portion 12. The vibration plate 30 is a plate-like member, and has a first surface 31 that faces the pressure chamber plate 10 and a second surface 32 that is a surface opposite to the first surface 31. The structure and material of the diaphragm 30 are not particularly limited. For example, the diaphragm 30 may be formed of a laminate of a plurality of films as shown in FIG. At this time, the diaphragm 30 may be a laminated body of a plurality of films made of, for example, an insulating film such as zirconium oxide or silicon oxide, a metal film such as nickel, and a polymer material film such as polyimide. The diaphragm 30 constitutes a vibration part. In other words, the piezoelectric element 100 described later can be vibrated (displaced) by being displaced. Thereby, the volume of the pressure chamber 11 formed below can be changed.

  The piezoelectric element 100 of the liquid jet head 300 according to the present embodiment is formed on the second surface 32 of the diaphragm 30 as shown in FIG. Hereinafter, the details of the piezoelectric element 100 of the liquid jet head 300 according to the present embodiment will be described with reference to FIGS.

  FIG. 2A is a plan view illustrating only the pressure chamber plate 10, the vibration plate 30, and the piezoelectric element 100, which are the main parts of the liquid ejecting head 300, for convenience. 2B is a cross-sectional view taken along the line IIB-IIB in the main part shown in FIG. 2C is a cross-sectional view taken along the line IIC-IIC of the main part shown in FIG. FIG. 2D is a cross-sectional view schematically showing a modification of the main part of the liquid jet head 300. FIG. 3A to FIG. 3C are plan views schematically showing modifications of the main part of the liquid ejecting head 300.

  Details of the structure of the piezoelectric element 100 will be described below.

  As shown in FIG. 2A to FIG. 2C, the piezoelectric element 100 includes a first conductive layer 40 formed on the diaphragm 30 so as to extend in the first direction 200, in short, A piezoelectric layer 50 formed to cover the first conductive layer 40 and a second conductive layer 60 formed to cover at least a part of the piezoelectric layer 50 are included.

  As shown in FIG. 2A, the diaphragm 30 has a first region 33 (a bold broken line portion in FIG. 2A) on the second surface 32 (see FIG. 2B). The first region 33 is a region that overlaps the pressure chamber 11 on the second surface 32. As shown in FIG. 2A, the first region 33 is formed for each pressure chamber 11. The first region 33 has the same shape as that of the pressure chamber 11 in plan view. In addition, as shown in FIG. 2B, a region overlapping the wall portion 12 of the pressure chamber plate 10 between the adjacent first regions 33 is defined as a second region 34.

  As shown in FIG. 2A, the first conductive layer 40 is formed to extend in the first direction 200 in the first region 33. As shown in FIG. 2A, the first direction 200 is one direction on the second surface 32 and the longitudinal direction of the first region 33. A direction orthogonal to the first direction 200 is defined as a second direction 210. As shown in FIG. 2A, the first conductive layer 40 has an end surface 41 that is one end surface in the first direction 200 outside the first region 33. The end face 41 is a side face in the first direction 200 of the first conductive layer 40. The end surface 41 may be a tapered side surface. Further, although not shown, the end surface 41 may be in the first region 33. Further, as shown in FIG. 2B, the first conductive layer 40 has both end portions in the second direction 210 in the first region 33. In addition, as illustrated in FIG. 2B, the first conductive layer 40 has an upper surface 42. As shown in FIG. 2A, the first conductive layer 40 includes a first conductive portion 43 formed in the first region 33 and a first side 33a that is one short side of the first region 33. With the second conductive portion 44 extending continuously from the first region 33 to the outside of the first region 33 and the first side 33b, which is the other short side of the first region 33, as the boundary. The third conductive portion 45 continuously extends from the inside of the region 33 to the outside of the first region 33. Therefore, when the end surface 41 is formed outside the first region 33, the end surface 41 is an end portion of the third conductive portion 45. When the end surface 41 is formed in the first region 33, the end surface 41 is an end portion of the first conductive portion 43. The first conductive layer 40 forms a lower electrode in the piezoelectric element 100. The structure and material of the first conductive layer 40 are not particularly limited. For example, the first conductive layer 40 may be formed as a single layer. Alternatively, the first conductive layer 40 may be formed of a stacked body of a plurality of films. The first conductive layer 40 may be a metal layer including any of platinum (Pt), iridium (Ir), gold (Au), and the like, for example.

As shown in FIG. 2A, the piezoelectric layer 50 is formed so as to cover the first conductive layer 40 in the first region 33. As shown in FIG. 2B, the piezoelectric layer 50 has both end portions in the second direction 210 in the first region 33. That is, the piezoelectric layer 50 has a width larger than the width of the first conductive layer 40 and narrower than the width of the first region 33 in the second direction 210. As illustrated in FIG. 2A, the piezoelectric layer 50 continuously extends along the first direction 200 even outside the first region 33, and the second conductive portion 44 of the first conductive layer 40. And it is formed so as to cover the third conductive portion 45. The shape of the piezoelectric layer 50 is not particularly limited. As shown in FIG. 2B, the piezoelectric layer 50 has an upper surface 51 above the first conductive layer 40 and has a tapered side surface 52 continuous with the upper surface 51. It may be. Further, as shown in FIG. 2D, the side surface 52 does not reach the second surface 32 of the diaphragm 30 and is formed continuously from the first region 33 to the second region 34. The surface 53 may be continuous. The surface 53 is a surface having a height lower than that of the upper surface 51, and the height of the surface 53 can be adjusted to a desired height. In other words, the rigidity of the piezoelectric actuator 110 can be adjusted by adjusting the thickness of the piezoelectric layer 50 having the surface 53 to a desired thickness. The piezoelectric layer 50 is made of a polycrystalline body having piezoelectric characteristics, and can vibrate when a voltage is applied to the piezoelectric element 100. The structure and material of the piezoelectric layer 50 are not particularly limited as long as they have piezoelectric characteristics. The piezoelectric layer 50 may be formed of a known piezoelectric material, for example, lead zirconate titanate (Pb (Zr, Ti) O ₃ ), bismuth sodium titanate ((Bi, Na) TiO ₃ ) or the like. It may be used.

  In addition, as shown in FIGS. 2A and 2C, the piezoelectric layer 50 has a part of the second conductive portion 43 exposed on the second conductive portion 43 of the first conductive layer 40. Such an opening 54 is provided. The position of the opening 54 is not particularly limited as long as it is located on the second conductive portion 43 and separated from the second conductive layer 60 described later. The shape of the opening 54 is not particularly limited as long as the first conductive layer 40 as the second conductive portion can be exposed.

  As shown in FIG. 2A, the second conductive layer 60 is formed so as to cover the piezoelectric layer 50 in the first region 33 in the second direction 210. As shown in FIG. 2A, in the first direction 200 in the first region 33, the second conductive layer 60 has an end face 61 and an end face 62 which are two end faces (FIG. 2A). ) In bold lines). The end surface 61 and the end surface 62 are disposed so as to overlap the upper surface 42 of the first conductive layer 40. The two end surfaces 61 and 62 are end surfaces in the first direction 200 formed in the first region 33 when the second conductive layer 60 is patterned. The end surface 61 is an end surface on the side where the end surface 41 of the first conductive layer 40 is formed, and the end surface 62 is an end surface on the side where the opening 54 is formed. Further, as shown in FIG. 2A, the width of the second conductive layer 60 in the first direction 200 in the first region 33 is the first width of the first conductive portion 43 of the first conductive layer 40. Less than the width in direction 200. As shown in FIG. 2A, the second conductive layer 60 may be continuously formed in the second direction 210 so as to cover the plurality of piezoelectric layers 50, respectively. Further, as shown in FIG. 2B, the second conductive layer 60 is formed by continuously connecting the upper surface 51 and the side surface 52 of the piezoelectric layer 50 in a part of the piezoelectric layer 50 in the second direction 210. Can be covered. As shown in FIG. 2A, the end surface 61 may be continuously formed on the plurality of piezoelectric layers 50. The end surface 62 may constitute a part of the opening 63. Although not shown, the end face 62 may be formed continuously so as to pass over the plurality of piezoelectric layers 50 without forming the opening 63. The opening 63 may overlap the end surface 41 of the first conductive layer 40. As shown in FIGS. 2A and 2C, the opening 63 may overlap the end face 41 of the third conductive portion 45 of the first conductive layer 40. Here, although not shown, when the third conductive portion 45 is not formed, the opening 63 can overlap the end surface 41 of the first conductive portion 45.

  As shown in FIGS. 2B and 2C, the second conductive layer 60 has an end surface 61 and an end surface 62 overlapping the upper surface 42 of the first conductive layer 40 in the first region 33. To be formed. As a result, a partial region of the piezoelectric layer 50 in the first region 33 is sandwiched between the first conductive portion 42 and the second conductive layer 60 of the first conductive layer 40. At this time, a region sandwiched between the first conductive layer 40 and the second conductive layer 60 in the piezoelectric layer 50 is defined as a drive region 55. As shown in FIG. 2C, the position of one end 55 a in the first direction 200 of the drive region 55 can be defined by the position of the end face 61 of the second conductive layer 60. In addition, the position of the other end 55 b in the first direction 200 of the drive region 55 can be defined by the position of the end face 62 of the second conductive layer 60. That is, the drive region 55 can be formed on the upper surface 42 of the first conductive portion 43 of the first conductive layer 40. In other words, the drive region 55 is not formed on the end surface 41 of the first conductive layer 40. As shown in FIGS. 2A and 2C, the second conductive layer 60 may be formed so as not to overlap the first side 33 a of the first region 33. The structure and material of the second conductive layer 60 are not particularly limited. For example, the second conductive layer 60 may be formed as a single layer. Alternatively, the second conductive layer 60 may be formed of a stacked body of a plurality of films. The second conductive layer 60 is made of a conductive layer, and constitutes an upper electrode in the piezoelectric element 100. The second conductive layer 60 may be a metal layer including, for example, platinum (Pt), iridium (Ir), gold (Au), and the like. Although not shown, the second conductive layer 60 may be connected to, for example, a ground circuit or the like via a wiring or continuously. The second conductive layer 60 can completely cover the portion including the drive region 55 of the piezoelectric layer 50 in the second direction 210. According to this, since the piezoelectric layer 50 in the drive region 55 can be protected from the influence of external factors such as moisture in the atmosphere (humidity), the reliability of the piezoelectric actuator 110 can be improved.

  As shown in FIGS. 2A and 2C, the third conductive layer 67 may be formed to cover at least the opening 54. The third conductive layer 67 may be formed so as to cover at least the second conductive portion 43 (first conductive layer 40) in the opening 54 (not shown). The structure and material of the third conductive layer 67 are not particularly limited. The third conductive layer 67 may be a layer having conductivity and may be the same as the second conductive layer 60. By forming the third conductive layer 67, the surface of the second conductive portion 43 of the first conductive layer 40 in the opening 54 can be protected in the manufacturing process. Details thereof will be described later in the manufacturing method. Further, since the third conductive layer 67 is not an essential component of the piezoelectric element 100 in the present embodiment, even if the third conductive layer 67 is not formed on the first conductive layer 40 in the opening 54. Good (not shown).

  As shown in FIGS. 2A and 2C, the fourth conductive layer 70 is formed so as to be electrically connected to the third conductive layer 67. That is, the fourth conductive layer 70 is electrically connected to the first conductive part 42 via the second conductive part 43. The fourth conductive layer 70 may be formed so as to cover at least the opening 54. The shape of the fourth conductive layer 70 is not particularly limited as long as it is formed at least in the opening 54. The structure and material of the fourth conductive layer 70 are not particularly limited. For example, the fourth conductive layer 70 may be formed as a single layer. Alternatively, the fourth conductive layer 70 may be formed of a stacked body of a plurality of films. The fourth conductive layer 70 is made of a conductive layer, and constitutes a lead wire to the lower electrode in the piezoelectric element 100. The fourth conductive layer 70 may be a metal layer including, for example, gold (Au), nickel-chromium alloy (Ni-Cr), platinum (Pt), iridium (Ir), and the like. Although not shown, the fourth conductive layer 70 may be connected to an external drive circuit. As a result, the first conductive layer 40 can be electrically connected to, for example, an external drive circuit via the fourth conductive layer 70.

  FIG. 3 is a diagram illustrating a modification of the piezoelectric element 100 of the liquid jet head 300 according to the present embodiment. A modification of the piezoelectric element 100 of the liquid jet head 300 according to the present embodiment will be described below with reference to the drawings.

  As shown in FIG. 3, a modification of the piezoelectric element 100 is an electrical insulation formed so as to cover at least a part of the piezoelectric layer 50 where the second conductive layer 60 is not formed above. A protective film 80 made of a film is included. Further, the protective film 80 may be formed so as to overlap with at least a part of the drive region 55.

  As shown in FIG. 3, the protective film 80 may be formed so as to cover at least a part of the portion of the piezoelectric layer 50 where the second conductive layer is not formed above. As shown in FIG. 3, the protective film 80 may be formed so as to overlap the end surface 61 and the end surface 62 of the second conductive layer 60. In other words, the protective film 80 may be formed so as to overlap the end portion 55a and the end portion 55b of the drive region 55. The material of the protective film 80 is not particularly limited. The protective film 80 is, for example, an electrical insulating film and has only to have a moisture barrier property. The protective film 80 may be formed of, for example, an inorganic insulating film such as aluminum oxide, or an organic insulating film that is a polymer material film such as polyimide.

  As shown in FIG. 3, the protective film 80 is formed after the third conductive layer 67 is formed and before the fourth conductive layer 70 is formed. By forming the protective film 80 before forming the fourth conductive layer 70, when forming the fourth conductive layer 70 by etching, at least part of the portion where the second conductive layer is not formed above Can be prevented from being subjected to chemical process damage by an etchant or the like. Details will be described later in the manufacturing process. Further, the protective film 80 can prevent physical damage to the piezoelectric layer 50 in which the second conductive layer 60 is not formed upward, damage due to moisture in the atmosphere, and the like.

  Further, by forming the protective film 80 so as to overlap the end portions 55a and 55b of the drive region 55, the protective film 80 is formed on the end portions 55a and 55b of the drive region 55. It can act as a weight that suppresses vibration. In other words, excessive vibration of the piezoelectric layer 50 can be suppressed at the end portions 55a and 55b. In the region of the end portion 55a and the end portion 55b, when excessive vibration (displacement) occurs, physical damage such as cracks may occur in surrounding members. Therefore, the vibration can be suppressed by forming the protective film 80. Moreover, since the protective film 80 can cover the end surface 61 of the second conductive layer 60, the second conductive layer 60 can be prevented from peeling off. As described above, the reliability of the piezoelectric element 100 can be further improved by the protective film 80.

  With any one of the above configurations, the configuration of the piezoelectric element 100 can be obtained.

  As shown in FIG. 1, the liquid ejecting head 300 according to this embodiment may include a sealing plate 90 that can seal the piezoelectric element 100. The sealing plate 90 has a sealing region 91 that can seal the piezoelectric element 100 in a predetermined space region. The sealing region 91 may be a spatial region that does not hinder the vibration motion of the piezoelectric element 100. The structure and material of the sealing plate 90 are not particularly limited. For example, the sealing plate 90 may be formed from, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like. In addition, the liquid ejecting head 300 may include a housing (not shown) that is made of, for example, various resin materials and various metal materials and can accommodate the above-described configuration.

  With any one of the configurations described above, the configuration of the liquid jet head 300 according to the present embodiment can be obtained.

  The liquid ejecting head 300 according to the present embodiment has, for example, the following characteristics.

  According to the liquid ejecting head 300 according to the present embodiment, the end surface 61 and the end surface 62 of the second conductive layer 60 are disposed so as to overlap the upper surface 42 of the first conductive layer 40 in the first region 33. Is done. Further, the width of the second conductive layer 60 in the first direction 200 in the first region 33 is smaller than the width of the first conductive portion 43 of the first conductive layer 40 in the first direction 200. According to this, the drive region 55 is formed so as to overlap the upper surface 42 of the first conductive layer 40. In other words, in the first direction 200, the position of one end 55b of the drive region 55 is defined not by the position of the end face 41 of the first conductive layer 40 but by the position of the end face 62 of the second conductive layer 60. can do.

  As described above, for example, because the end face 41 has a tapered side surface, the piezoelectric layer 50 grown on the end face 41 may grow abnormally and lack structural strength. . In contrast, the piezoelectric layer 50 formed on the upper surface 42 excluding the end surface 41 of the first conductor 40 has a stable structural strength because the crystal growth is easily controlled. In the liquid ejecting head 300 according to the present embodiment, the drive region 55 can be formed on the upper surface 42 excluding the end surface 41 of the first conductive layer 40. Therefore, when the piezoelectric element 100 is driven, a crack or the like is generated. Hard to cause physical destruction. As a result, the reliability of the piezoelectric element 100 is improved, and the life cycle of the piezoelectric element 100 can be extended.

  As described above, according to the liquid ejecting head 300 according to the present embodiment, it is possible to provide a liquid ejecting head including the piezoelectric element 100 having high reliability.

2. Hereinafter, a method for manufacturing a liquid jet head according to the present embodiment will be described with reference to the drawings.

  4 to 11 are cross-sectional views illustrating a method for manufacturing the liquid jet head 300 according to the present embodiment.

  As shown in FIGS. 4 to 11, the method of manufacturing the liquid jet head according to the present embodiment includes a step of forming the pressure chamber plate 10 having the pressure chamber 11, and a vibration plate formed above the pressure chamber plate 10. 30 having a first surface 31 facing the pressure chamber plate 10 and a second surface 32 opposite to the first surface 31, and overlapping the pressure chamber 11 on the second surface 32. Forming the diaphragm 30 having the first region 33, the upper surface 42 extending in the first direction 200, and one end surface 41 in the first direction 200 in the first region 33. The first region 33 in the step of forming the first conductive layer 40, the step of forming the piezoelectric layer 50 so as to cover the first conductive layer 40, and the second direction 210 orthogonal to the first direction 200. The second conductive layer 60 so as to cover the piezoelectric layer 50 in FIG. And forming the second conductive film 60, the second conductive layer 60 includes two end faces 61, which are two end faces, in the first direction 200 in the first region 33. The second conductive layer has an end surface 62, and the end surface 61 and the end surface 62 of the second conductive layer are formed so as to overlap the upper surface 42 of the first conductive layer 40.

  The method for manufacturing the liquid jet head according to the present embodiment differs depending on whether the material used for forming the pressure chamber plate 10 and the nozzle plate 20 is single crystal silicon or the like, and the case where stainless steel or the like is used. Hereinafter, a method for manufacturing a liquid jet head in the case of using single crystal silicon will be described as an example. Therefore, the manufacturing method of the liquid jet head according to the present embodiment is not particularly limited to the following manufacturing method. When nickel, stainless steel, stainless steel, or the like is used as a material, a process such as a known electroforming method is included. May be. Further, the process after each step is not limited to the manufacturing method described below.

  First, as shown in FIG. 4A, the diaphragm 30 is formed on the prepared substrate 1 made of single crystal silicon. As shown in FIG. 4A, a region where the pressure chamber 11 of the substrate 1 is formed is a region 11a in a manufacturing process described later. The diaphragm 30 is formed by a known film forming technique. As shown in FIG. 4A, for example, the diaphragm 30 is formed by forming an elastic layer 30a constituting an elastic plate by a sputtering method or the like and then forming an insulating layer 30b on the elastic layer 30a by a sputtering method or the like. Also good. For example, the elastic layer 30a may use zirconium oxide, and the insulating layer 30b may use silicon oxide. Here, a region that overlaps the region 11 a on the second surface 32 is defined as a first region 33.

  After forming the diaphragm 30, as shown in FIG. 4B, a conductive layer is formed on the second surface 32 of the diaphragm 30, and then patterned by etching to form the first conductive layer 40. The Here, the first conductive layer 40 is patterned into a desired shape so as to overlap the region 11a. When the first conductive layer 40 is patterned, as shown in FIG. 4B, one end face 41 in the first direction 200 is formed to have a tapered side face. Thereby, the end surface 41 is formed. Further, after the first conductive layer 40 is patterned, the upper surface 42 is also formed at the same time. The position of the end surface 41 may be outside the first region 33 or may be inside the first region 33 although not shown. Note that the detailed configuration of the first conductive layer 40 has been described above, and will be omitted. The first conductive layer 40 may be formed by a known film formation technique. For example, a conductive layer (not shown) may be formed by stacking platinum, iridium, or the like by a sputtering method or the like, and the first conductive layer 40 may be formed by etching the conductive layer into a predetermined shape. Here, in the first conductive layer 40, a portion formed in the first region 33 is a first conductive portion 43, which is a portion formed outside the first region 33, and is a portion of the first region 33. A portion formed so as to extend from one side 33 a may be used as the second conductive portion 44. Further, when the end face 41 is formed outside the first region 33, a portion formed so as to extend from the second side 33 b of the first region 33 is referred to as a third conductive portion 45.

  Here, as shown in FIG. 4C, an etching protective film 50a may be formed on the conductive layer before the conductive layer for forming the first conductive layer 40 is patterned by etching. Good. The etching protective film 50a is a piezoelectric body made of the same piezoelectric material as the piezoelectric layer 50 described later. The etching protective film 50a may be formed at least in a region where the first conductive layer 40 to be patterned into a desired shape is formed. According to this, in the etching process of patterning the first conductive layer 40, the surface of the first conductive layer 40 can be protected from chemical damage caused by the etchant used.

  Next, as illustrated in FIG. 5A, the piezoelectric layer 50 b is formed so as to cover the first conductive layer 40. The piezoelectric layer 50 is formed by patterning the piezoelectric layer 50b. Details will be described later. The piezoelectric layer 50b may be formed by a known film formation technique. The piezoelectric layer 50b may be formed, for example, by applying a precursor, which is a known piezoelectric material, onto the second surface 32 and performing a heat treatment. The precursor to be used is not particularly limited as long as it is subjected to a polarization treatment after firing by heat treatment and generates piezoelectric characteristics. For example, a precursor such as lead zirconate titanate may be used. When the etching protective film 50a is formed, the etching protective film 50a is formed of the same piezoelectric material as that of the piezoelectric layer 50b (piezoelectric layer 50). 50b can be integrated.

  Here, for example, when the piezoelectric pair layer 50b (piezoelectric layer 50) is formed of lead zirconate titanate, an intermediate titanium layer 50c made of titanium is formed on the second surface 32 as shown in FIG. After forming the entire surface, a precursor which is a piezoelectric material may be applied. According to this, when the piezoelectric layer 50b is crystal-grown by heat treatment of the precursor, the interface for crystal growth of the precursor can be unified with the intermediate titanium layer 50c. In other words, the piezoelectric layer 50b that grows crystals on the vibration plate 30 can be eliminated. Thereby, the controllability of crystal growth of the piezoelectric layer 50b can be enhanced, and the piezoelectric layer 50b can be a piezoelectric crystal with higher orientation. The intermediate titanium layer 50c can be taken into the crystal of the piezoelectric layer 50b during the heat treatment.

  Next, as shown in FIG. 6A, before the piezoelectric layer 50b is patterned into a desired shape by etching, a conductive mask layer 60a is formed so as to cover the piezoelectric layer 50b. Good. The mask layer 60a is a metal layer formed from the same material as a conductive layer 60b described later. As shown in FIG. 6B, after forming the mask layer 60a, the piezoelectric layer 50b is patterned by etching, and the piezoelectric layer 50 is patterned to a desired formation. Here, since the mask layer 60a functions as a hard mask in the etching process by forming the mask layer 60a, the tapered side surface 52 is easily formed in the piezoelectric layer 50 as shown in FIG. 6B. be able to. The detailed configuration of the piezoelectric layer 50 has been described above, and will not be described.

  As shown in FIG. 6C, when the piezoelectric layer 50 is etched, an opening 54 for exposing the first conductive layer 40 is formed on the second conductive portion 43 of the first conductive layer 40 at the same time. The The opening 54 is formed on the second conductive portion 43 so as to be separated from the second conductive layer 60.

  As shown in FIG. 7, a conductive layer 60 b is formed so as to cover the piezoelectric layer 50 and the opening 54. Therefore, the conductive layer 60 b is formed of the same material as the second conductive layer 60. The conductive layer 60b may be formed by a known film formation technique. For example, the conductive layer 60b may be formed by stacking platinum, iridium, or the like by a sputtering method or the like. When the mask layer 60a is formed, since the mask layer 60a uses the same material as the conductive layer 60b, the mask layer 60a can be integrated with the conductive layer 60b.

  Next, as shown in FIG. 8A, the conductive layer 60b is patterned into a desired shape by etching, so that the second conductive layer 60 is formed. In the step of patterning the second conductive layer 60, as shown in FIG. 8A, in the first direction 200, the end face 61 and the end face 62 of the second conductive layer 60 are within the first region 33. The first conductive layer 40 is patterned so as to overlap the upper surface 42. When the end surface 62 is an end portion constituting the opening portion 63, the opening portion 63 may be patterned so as to overlap the end surface 41 of the first conductive layer 40. As shown in FIG. 8B, in the second direction 210, the second conductive layer 60 is formed so as to cover the piezoelectric layer 50. The second conductive layer 60 is continuously formed so as to cover each of the plurality of piezoelectric layers 50. According to this, when the second conductive layer 60 is connected to a ground circuit or the like via, for example, a wiring (not shown), the second conductive layer 60 is used as a common upper electrode of the piezoelectric element 100. Can do. Note that the detailed configuration of the second conductive layer 60 has been described above, and is omitted. As described above, by patterning the second conductive layer 60, the drive region 55 of the piezoelectric layer 50 can be defined on the upper surface 42 of the first conductive layer 40 from the arrangement of the end surfaces 61 and 62. .

  In the step of patterning the second conductive layer 60, the conductive layer 60b may be patterned so as to cover at least the opening 54 as shown in FIG. In other words, the third conductive layer 67 may be formed by not removing the conductive layer 60b formed above the opening 54. According to this, for example, when a resist is applied, an exposure process and a development process are performed to form a resist film, and etching is performed using the resist film as a mask, an organic alkali developer, an organic stripping solution, a cleaning solution, or the like is used. . Accordingly, by not removing the conductive layer 60b formed above the opening 54 (in other words, by forming the third conductive layer 67), the surface of the first conductive layer 40 in the opening 54 is The possibility of overetching can be eliminated. In addition, it is possible to prevent the exposed portion of the first conductive layer 40 in the opening 54 from being exposed to an organic stripping solution, a cleaning solution, or the like after being etched, and thus being chemically damaged. In the manufacturing method according to the present embodiment, the third conductive layer 67 is not an essential component, and the third conductive layer 67 may not be formed by removing the conductive layer 60 b in the opening 54.

  As a modification of the manufacturing method according to the present embodiment, as shown in FIG. 9, in the piezoelectric layer 50, the second conductive layer 60 is protected so as to cover at least a part of the portion not formed above. A film 80 may be formed. The protective film 80 may be formed by a known film formation technique. The protective film 80 may be formed by, for example, forming a photosensitive resin film such as polyimide by a coating method or the like and patterning the film into a desired shape. As shown in FIG. 9, the protective film 80 may be formed so as to overlap with at least a part of the drive region 55.

  Next, as shown in FIG. 10A, a fourth conductive layer 70 is formed so as to cover at least the opening 54. In the case where the third conductive layer 67 is formed, the fourth conductive layer 70 may be formed so as to be electrically connected to the third conductive layer 67. The fourth conductive layer 70 may be formed by a known film formation technique. For example, a conductive layer (not shown) is formed by laminating gold, nickel-chromium alloy, or the like by a sputtering method, and the fourth conductive layer 70 is formed by etching the conductive layer into a predetermined shape. May be. Here, when the conductive layer is etched, the protective film 80 and the protective film 80 can be used as a resist layer. The fourth conductive layer 70 may be connected to an external drive circuit (not shown).

  10B, when the protective film 80 is formed, in the step of forming the fourth conductive layer 70 by etching, the second conductive layer 60 of the piezoelectric layer 50 is directed upward. The portion that is not formed can be protected from chemical damage caused by an etchant or the like. More specifically, after the conductive layer for the fourth conductive layer 70 is formed by sputtering or the like, the conductive layer is etched to obtain the fourth conductive layer 70 having a desired shape. Here, the protective film 80 is formed on at least a part of the portion of the piezoelectric layer 50 where the second conductive layer 60 is not formed above, for example, the piezoelectric layer adjacent to the drive region 55. Since 50 is not chemically damaged by the etchant or the like, the reliability of the piezoelectric element 100 can be improved.

  As shown in FIG. 11A, the sealing plate 90 in which the sealing region 91 is formed is mounted from above the piezoelectric element 100. Here, the piezoelectric element 100 can be sealed in the sealing region 91. The sealing plate 90 may seal the piezoelectric element 100 with an adhesive, for example. Next, as shown in FIG. 11B, the substrate 1 is thinned to a predetermined thickness, and the pressure chambers 11 and the like are partitioned. For example, a mask (not shown) is formed on the surface opposite to the surface on which the vibration plate 30 is formed so as to be patterned into a desired shape on the substrate 1 having a predetermined thickness, and is etched. The pressure chamber 11, the wall 12, the supply path 13, the communication path 14, and the reservoir 15 are partitioned (not shown). As described above, the pressure chamber plate 10 having the pressure chamber 11 below the diaphragm 30 can be formed. After the pressure chamber plate 11 is formed, as shown in FIG. 11C, the nozzle plate 20 having the nozzle holes 21 is joined to a predetermined position by, for example, an adhesive. As a result, the nozzle hole 21 communicates with the pressure chamber 11.

  The liquid jet head 300 can be manufactured by any of the above methods. As described above, the manufacturing method of the liquid ejecting head 300 is not limited to the above-described manufacturing method, and the pressure chamber plate 10 and the nozzle plate 20 may be integrally formed using an electroforming method or the like.

  The method for manufacturing a liquid jet head according to this embodiment has the following features, for example.

  According to the method of manufacturing the liquid ejecting head 300 according to the present embodiment, the drive region 55 can be formed on the upper surface 42 of the first conductive layer 40, so that the piezoelectric element 100 is repeatedly displaced. Even if it exists, physical destruction, such as a crack, does not occur easily. As a result, the reliability of the piezoelectric element 100 is improved, and the life cycle of the piezoelectric element 100 can be extended.

  As described above, according to the liquid ejecting head 300 according to the present embodiment, it is possible to provide a liquid ejecting head including the piezoelectric element 100 having high reliability.

3. Liquid ejecting apparatus Next, the liquid ejecting apparatus according to the present embodiment will be described. The liquid ejecting apparatus according to this embodiment includes the liquid ejecting head according to the present invention. Here, a case where the liquid ejecting apparatus 1000 according to the present embodiment is an ink jet printer will be described. FIG. 12 is a perspective view schematically showing the liquid ejecting apparatus 1000 according to this embodiment.

  The liquid ejecting apparatus 1000 includes a head unit 1030, a driving unit 1010, and a control unit 1060. Further, the liquid ejecting apparatus 1000 includes an apparatus main body 1020, a paper feeding unit 1050, a tray 1021 on which the recording paper P is set, a discharge port 1022 for discharging the recording paper P, and an operation arranged on the upper surface of the apparatus main body 1020. A panel 1070.

  The head unit 1030 includes, for example, an ink jet recording head (hereinafter also simply referred to as “head”) configured from the liquid ejecting head 300 described above. The head unit 1030 further includes an ink cartridge 1031 that supplies ink to the head, and a transport unit (carriage) 1032 on which the head and the ink cartridge 1031 are mounted.

  The drive unit 1010 can reciprocate the head unit 1030. The drive unit 1010 includes a carriage motor 1041 serving as a drive source for the head unit 1030, and a reciprocating mechanism 1042 that reciprocates the head unit 1030 in response to the rotation of the carriage motor 1041.

  The reciprocating mechanism 1042 includes a carriage guide shaft 1044 whose both ends are supported by a frame (not shown), and a timing belt 1043 extending in parallel with the carriage guide shaft 1044. The carriage guide shaft 1044 supports the carriage 1032 while allowing the carriage 1032 to freely reciprocate. Further, the carriage 1032 is fixed to a part of the timing belt 1043. When the timing belt 1043 is caused to travel by the operation of the carriage motor 1041, the head unit 1030 is reciprocated by being guided by the carriage guide shaft 1044. During this reciprocation, ink is appropriately discharged from the head, and printing on the recording paper P is performed.

  The control unit 1060 can control the head unit 1030, the drive unit 1010, and the paper feed unit 1050.

  The paper feeding unit 1050 can feed the recording paper P from the tray 1021 to the head unit 1030 side. The paper feed unit 1050 includes a paper feed motor 1051 serving as a driving source thereof, and a paper feed roller 1052 that rotates by the operation of the paper feed motor 1051. The paper feed roller 1052 includes a driven roller 1052a and a drive roller 1052b that face each other up and down across the feeding path of the recording paper P. The drive roller 1052b is connected to the paper feed motor 1051. When the paper supply unit 1050 is driven by the control unit 1060, the recording paper P is sent so as to pass below the head unit 1030.

  The head unit 1030, the drive unit 1010, the control unit 1060, and the paper feed unit 1050 are provided inside the apparatus main body 1020.

  The liquid ejecting apparatus 1000 can include the liquid ejecting head 300 according to the present invention. As described above, the liquid ejecting head 300 according to the present invention can include a highly reliable piezoelectric element. Therefore, a highly reliable liquid ejecting apparatus 1000 can be obtained.

  In the above-described example, the case where the liquid ejecting apparatus 1000 is an ink jet printer has been described. However, the printer of the present invention can also be used as an industrial liquid ejecting apparatus. As the liquid (liquid material) discharged in this case, various functional materials adjusted to an appropriate viscosity with a solvent or a dispersion medium, or those containing metal flakes or the like can be used.

  Although the embodiments of the present invention have been described in detail as described above, it will be readily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Board | substrate, 10 Pressure chamber board, 11 Pressure chamber, 11a area | region, 12 Wall part, 13 Supply path,
14 communication path, 15 reservoir, 20 nozzle plate, 21 nozzle hole, 30 vibration plate,
31 1st surface, 32 2nd surface, 33 1st area | region, 33a 1st edge | side,
33b second side, 40 first conductive layer, 41 end face, 42 upper surface, 43 first conductive part,
44 second conductive portion, 45 third conductive portion, 50 piezoelectric layer, 50a etching protective film,
50b piezoelectric layer, 50c intermediate titanium layer, 51 upper surface, 52 side surface, 53 surface,
54 opening, 55 driving region, 55a end, 55b end, 60 second conductive layer,
60a conductive layer, 60b conductive layer, 61 end face 62 end face,
63 opening, 67 third conductive layer, 70 fourth conductive layer, 80 protective film,
90 sealing plate, 91 sealing region, 100 piezoelectric element,
200 first direction, 210 second direction, 300 liquid ejecting head,
1000 liquid ejecting apparatus, 1010 driving unit, 1020 apparatus main body, 1021 tray,
1022 discharge port, 1030 head unit, 1031 ink cartridge,
1032 carriage, 1041 carriage motor, 1042 reciprocating mechanism,
1043 Timing belt, 1044 Carriage guide shaft, 1050 Paper feed unit,
1051 paper feed motor, 1052 paper feed roller, 1060 control unit,
1070 Operation panel

Claims (7)

A pressure chamber plate having a plurality of pressure chambers in communication with nozzle holes for injecting liquid;
A vibration plate formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; A diaphragm having a first region overlapping each of the plurality of pressure chambers,
In the plurality of first regions, a first conductive layer having an upper surface extending in the first direction and one end surface in the first direction,
A piezoelectric layer formed to cover each of the plurality of first conductive layers;
A second conductive layer continuously formed so as to cover the plurality of piezoelectric layers in the first region in a second direction orthogonal to the first direction;
Have
In the first direction in the first region, the second conductive layer has two end faces;
The two end faces of the second conductive layer are disposed so as to overlap the upper surface of the first conductive layer ;
The second conductive layer has an opening that overlaps the end surface of the first conductive layer, and of the two end surfaces of the second conductive layer, the end surface of the first conductive layer. A liquid ejecting head in which an end surface on a side on which is formed constitutes a part of the opening . In claim 1,
The first conductive layer includes a first conductive portion formed in the first region and a second conductive portion extending from the first conductive portion to one side in the first direction outside the first region. And a third conductive part extending from the first conductive part to the opposite side of the second conductive part,
The liquid ejecting head, wherein an end surface of the third conductive portion in the first direction is the end surface of the first conductive layer. In claim 1,
The first conductive layer includes a first conductive portion formed in the first region and a second conductive portion extending from the first conductive portion to one side in the first direction outside the first region. And having
The liquid ejecting head, wherein an end surface in the first direction of the first conductive portion is the end surface of the first conductive layer. In any one of Claims 1 thru | or 3,
The liquid ejecting head, wherein a width of the second conductive layer in the first region in the first direction is smaller than a width of the first conductive portion of the first conductive layer in the first direction. In any one of Claims 1 thru | or 4,
The liquid ejecting head, wherein the end surface of the first conductive layer is a tapered side surface. In claim 2 or claim 3,
The piezoelectric layer is spaced apart from the second conductive layer and has an opening located on the second conductive portion of the first conductive layer,
A third conductive layer formed to cover at least the opening;
A fourth conductive layer electrically connected to the third conductive layer;
Further including a liquid jet head. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1 .

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