JP5497469B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device in which a light emitting element such as an LED is mounted, and more particularly to a technique for improving characteristics in a light emitting device in which a light emitting element is sealed with resin.

  In a light emitting device mounted with a semiconductor light emitting element such as an LED, the light emitting element is usually sealed with a resin in order to protect the light emitting element. In many cases, a wavelength conversion material that converts the wavelength of light emitted from the light emitting element and a filler that is a viscosity modifier are added to the sealing material. In the case of sealing a light emitting element with a resin, it is important to prevent bubbles from being mixed into the resin and to keep the thickness constant so as not to disturb the light emitting characteristics of the light emitting element. In particular, when the resin contains a wavelength conversion material, variation in thickness causes variation in emission color (color unevenness), so control of the resin film thickness is important.

  As a method of sealing the light emitting element with a resin, for example, a concave portion (cup-shaped portion) that also serves as a reflecting member is formed on a portion of the substrate on which the light emitting element is to be mounted, and the light emitting element is mounted on the bottom surface, A method of filling the resin with a sealing resin, a resin potting for dripping and curing the resin on the light emitting element mounted on the substrate, or a method of printing the resin by masking a part other than the light emitting element is employed. . The technique of filling the recess with the sealing resin is mainly applied to a light-emitting element that is mounted on a substrate by wire bonding (Patent Document 1). In the case where a resin is provided after mounting a light emitting element on a substrate, for example, in the case of flip chip mounting, resin potting or printing is usually used.

However, resin potting and printing methods remain difficult to control the film thickness of the resin when high viscosity resin is used, causing color unevenness and difficult to remove bubbles from the resin. Problems such as a reduction in luminous efficiency due to bubbles have been raised.
On the other hand, Patent Document 2 discloses a substrate on which a light emitting element is mounted in a resin in a recess after injecting a resin having a relatively low viscosity into the recess of the sheet in which the recess corresponding to the light emitting element is formed. A method for sealing the light emitting element by immersing the light emitting element and curing the resin has been proposed.

JP 2006-48934 A Japanese Patent Laid-Open No. 2008-60166

However, the technique described in Patent Document 2 has the following problems.
Since the element mounting surface of the substrate is immersed in the recess and turned upside down at the time of manufacture, the quality of the molded state cannot be judged until the resin curing process is completed. Therefore, for example, it is difficult to detect in advance the positional deviation between the recess and the element, the presence of dust or bubbles mixed between the two. In addition, in order to reduce the viscosity of the resin, it is necessary to suppress the filler content, and since the resin component increases, the thermal expansion is larger than that of the high-viscosity resin, which affects the member attached to the resin. This leads to separation of the resin and the member and damage to the member. In addition, the low-viscosity resin makes it difficult to control the amount dripped into the recess, and if the resin overflows from the recess, the resin travels on the circuit board, causing light guide or reflection by the resin, and the characteristics of the light emitting device. Adversely affects. On the other hand, if the amount of resin is insufficient, air will exist between the upper surface filled with resin in the recesses and the sheet covering the recesses, which may expand when exposed to high temperatures and cause peeling or damage In addition, there is a high possibility of entrapment of bubbles in the resin.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a light-emitting device in which the film thickness of a sealing resin is easily controlled and bubbles are prevented from being mixed into a sealing material. Accordingly, it is an object of the present invention to provide a light emitting device that has no color unevenness and has high luminous efficiency. In addition, the present invention is capable of using a high-viscosity resin, and solves problems when using a low-viscosity resin, that is, difficulty in managing the amount used, fear of peeling or damage due to thermal expansion, etc. An object is to provide an apparatus and a method for manufacturing the same.

In order to solve the above problems, according to the present invention, a light-emitting device having the following features and a method for manufacturing the same are provided.
A method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device comprising a substrate, one or more light emitting elements mounted on the substrate, and a sealing material covering the light emitting elements. A step (1) of dropping the resin composition on the light emitting element of the substrate on which the element is mounted, and a transparent member in which a concave portion having a certain depth is formed, and the concave portion dripping the resin composition. A step (2) of covering the entire top surface of the light emitting element with the resin composition, and a step (3) of curing the resin composition to form a sealing material are pressed so as to cover the subsequent light emitting element. .

The method for manufacturing a light emitting device according to the present invention includes a step of forming a plurality of metal bumps on the substrate before step (1) in the manufacturing method, and bonding the light emitting element to a part of the metal bumps. Flip-chip mounting, and in the step (2), the transparent member is fixed to bumps other than the bumps to which the light emitting element is bonded among the plurality of bumps.

  The light emitting device of the present invention includes a substrate, one or more light emitting elements mounted on the substrate, a sealing material that covers the light emitting elements, and a transparent member that covers the one or more light emitting elements and the sealing material. And the substrate includes element bumps for bonding the light emitting elements, and transparent member bumps for bonding the transparent member to a region where the element bumps are not formed. A part of the facing end surface is bonded to the transparent member bump, and a gap is formed between the unbonded end surface and the substrate.

In the light emitting device of the present invention, preferably, the transparent member is glass. In addition, either one of the sealing material and the transparent member includes a wavelength conversion material that converts the wavelength of light emitted from the light emitting element.
In the light emitting device of the present invention, preferably, a white resin is filled in a gap between the substrate side surface of the light emitting element and the substrate.

According to the method for manufacturing a light emitting device of the present invention, the sealing material is formed by covering the resin dropped on the upper surface of the light emitting element with a transparent member and pressing the resin. Even when air bubbles are mixed in the process, an abnormality can be found through the transparent member, so that it can be quickly processed, and as a result, a light emitting device with excellent quality can be manufactured. According to the method for manufacturing a light emitting device of the present invention, the difference between the depth of the concave portion of the transparent member (the sum of the depth of the concave portion and the height of the bump when bonding to the bump) and the height from the substrate surface of the light emitting element. Thus, since the film thickness of the sealing material is determined, the film thickness is easy.
According to the light emitting device of the present invention, since the gap is formed between the transparent member and the base material, an underfill can be easily formed between the substrate and the light emitting element even after the sealing material is formed. it can. In addition, since the film thickness of the sealing resin on the top and side surfaces of the light-emitting element is controlled by the gap between the light-emitting element and the transparent member, fluctuations in the optical path length such as light guide and reflection due to excess resin are suppressed. Is done.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st embodiment of the light-emitting device of this invention, (a) is a top view, (b) is the sectional view on the AA 'line of (a), (c) is BB of (a). FIG. FIGS. 2A and 2B are diagrams illustrating a modified example of the light emitting device of FIG. 1, in which FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along the line AA ′ in FIG. FIG. It is a top view which shows 2nd embodiment of the light-emitting device of this invention. It is a top view which shows 2nd embodiment of the light-emitting device of this invention. It is a figure which shows each process of 1st embodiment of the manufacturing method of the light-emitting device of this invention. It is a figure explaining each process of 2nd embodiment of the manufacturing method of the light-emitting device of this invention. It is a figure which shows the light-emitting device manufactured by 2nd embodiment, (a) is a top view, (b) is the sectional view on the AA 'line of (a), (c) is the principal part of (b). FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First embodiment of light emitting device>
1A and 1B are diagrams showing a first embodiment of a light emitting device according to the present invention, in which FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along the line AA ′ in FIG. Is a cross-sectional view taken along the line BB ′ of FIG.
As shown in the figure, a light emitting device 10 according to this embodiment includes a substrate 11, a light emitting element 15 electrically and mechanically connected to a metal bump 12 formed on the substrate 11, and a seal that covers the light emitting element 15. A material 17 and a cover 19 are provided.

  The substrate 11 has a conductor pattern for wiring of the light emitting element 15 formed on one surface, and metal bumps 12 for fixing the light emitting element 15 and metal bumps 13 for fixing the cover 19 on the other surface (upper surface). Is formed. Hereinafter, when distinguishing the two, the former is called an element bump, and the latter is called a cover bump. The material constituting the element bumps 12 and the cover bumps 13 may be the same material or different materials, but the same material and the same height are used in order to facilitate bump formation on the substrate. As the material of the metal bumps 12 and 13, for example, gold, gold alloy, Al, solder, Cu or the like is used, and gold having high purity of 99.0% or more is preferably used.

  As the light emitting element 15, an LED chip made of a known material is used. Specific examples of the material include group III-nitrogen compound (InGaAlN) semiconductors such as gallium nitride compound semiconductors, zinc oxide compound (ZnMgO) semiconductors, zinc selenide compound (ZnMgSeSTe) semiconductors, and silicon carbide. Compound (SiGeC) semiconductors are exemplified.

  Some LED chips have two electrodes (pad portions) necessary for wire bonding of a semiconductor layer on one side, and others have electrodes formed on both sides. In the embodiment, the one in which electrodes are formed on the surface (the lower surface in the figure) to be bonded to the metal bump 12 is used. By bonding the electrode and the element bump 12, the electrode is fixed on the substrate 11 and electrically connected.

  The cover 19 has a function of molding the sealing material 17 of the light emitting element 15 and functions as a protective material for protecting the light emitting element 15 covered with the sealing material 17, and is transparent. In addition, it is made of a material having good heat resistance and dimensional stability. The material of the cover 19 is not particularly limited as long as it has the above characteristics, but glass, hard plastic such as acrylic resin or polycarbonate can be used. Glass is particularly preferable from the viewpoints of dimensional stability, heat resistance, and the like.

  It is preferable that the cover 19 and the bump 13 are joined via metal plating applied to the cover 19 side. Accordingly, even when a thermal history or the like is received, the strong bonding between the cover 19 and the substrate 11 is maintained. The metal plating can be realized, for example, by forming a metal thin film layer in advance on the joint surface of the cover 19 with the bump.

  As shown in FIGS. 1A to 1C, the cover 19 has a recess having a shape corresponding to the shape of the light emitting element 15, and the difference between the depth of the recess and the height of the light emitting element 15 is in between. It becomes the thickness of the sandwiched sealing material 17. That is, the difference obtained by subtracting the height from the substrate 11 to the upper surface of the light emitting element 15 from the sum of the depth of the concave portion of the cover 19 and the height of the cover bump 13 is the thickness of the sealing material 17. If the height of the cover bump 13 is constant and the depth of the concave portion of the cover 19 is constant, the thickness of the sealing material 17 can be always constant. Such a shape of the cover 19 can be formed, for example, by forming a concave portion having a constant depth in a transparent member (thin plate or sheet) having a constant thickness.

  In the illustrated embodiment, the concave portion of the cover 19 has a quadrangular planar shape, and is fixed to the substrate 11 by the cover bumps 13 at the four corners of the quadrangle, and the portion corresponding to the side is not fixed. There is a gap. The gap functions as an air escape path when the resin to be the sealing material 17 is molded by the cover 19 and absorbs excess resin from between the light emitting element 15 and the cover 19. It has a function. In addition, although the figure showed the case where the bottom of a recessed part was flat, it is good also as a shape which curves or bends. Thereby, the sealing material 17 having a lens function can be obtained.

As the sealing material 17, it is preferable to use a highly viscous resin composition having thixotropic properties. Specifically, an epoxy resin, a silicone resin, a polydimethylsiloxane derivative having an epoxy group, an oxetane resin, an acrylic resin, a cycloolefin resin, or the like can be used as a resin. The sealing material 17 may include a wavelength conversion material that converts the wavelength of light emitted from the light emitting element 15 in addition to the resin. Specifically, a phosphor such as a nitride or oxynitride phosphor, a YAG phosphor, a BAM phosphor (aluminate blue phosphor), or a SiAlON phosphor is used as the wavelength conversion material. These phosphors are appropriately selected according to the emission wavelength of the light emitting element 15 and the design emission wavelength of the light emitting device. For example, by combining a light emitting element that emits blue light or ultraviolet light having a wavelength of 350 nm to 550 nm with a phosphor such as a YAG phosphor, a BAM phosphor, or a SiAlON phosphor, a light emitting device whose emission color is white or blue to green Can be obtained. By using a phosphor such as CaSiAlN ₃ , a light emitting device having an emission color of yellow to red can be obtained.

  The sealing material 17 may further contain additives such as silica, titanium oxide, and alumina as a viscosity modifier, and dyes and diffusing agents.

  The sealing material 17 preferably has a viscosity before curing (viscosity of the resin composition for forming a sealing material) of 200 Pa · s (Pascal second) or more and 400 Pa · s or less, and 260 Pa · s to 360 Pa · s. More preferably, it is s. By setting it as such a viscosity range, since the resin amount contained in the resin composition can be relatively reduced, the thermal expansion coefficient or shrinkage ratio of the resin is lowered, and peeling during thermal shock is suppressed. Moreover, at the time of manufacture of the light-emitting device of this invention, it can harden | cure in the state in which the shape of resin before hardening does not change a lot.

  The viscosity of the encapsulant-forming resin composition can be adjusted by the content ratio of the resin contained in the encapsulant-forming resin composition and other materials, particularly the viscosity modifier and the phosphor. Specifically, when a phosphor is included, the phosphor concentration is preferably 30 to 70 wt%, more preferably 50 to 60 wt%, and the viscosity modifier concentration is preferably 0 to 15 wt%, more preferably 0. ˜5 wt%.

  Note that the wavelength conversion material described above may be added to the cover 19 instead of the sealing material 17 or together with the sealing material 17.

  Since the light emitting device of the present embodiment has a structure in which the light emitting element 15 is covered with the cover 19 with the sealing material 17 interposed therebetween, there is no variation in the film thickness of the sealing material 17. Further, since the cover 19 has a structure in which the cover 19 is partially fixed to the base material 11 by the same bump 13 as the element bump 12 for joining the light emitting element 15, there is an influence such as expansion of the material due to heat. It is hard to receive.

  In the light emitting device of the present embodiment, an underfill can be provided between the light emitting element 15 and the substrate 11 using the gap between the cover 19 and the substrate 11. An example of a light emitting device having an underfill is shown in FIG. The light-emitting device shown in FIG. 2 has an underfill 20 between the substrate-side surface of the light-emitting element and a white resin layer 21 made of the same material as the underfill around the side surface of the cover 19. A wall structure 31 for forming the white resin layer 21 is formed on the outer periphery of the cover 19. The other configuration is the same as that of the light emitting device of FIG.

  As a material for the underfill 20 and the white resin layer 21, a resin containing a white pigment such as titanium oxide, zinc oxide, zirconia oxide, or barium sulfate can be used. As the resin, the same material as the resin used for the sealing material 17 can be used. The underfill 20 and the white resin layer 21 can be formed by filling a white pigment between the cover 19 and the wall structure 31.

  The light emitting device of FIG. 2 has the underfill 20 and the white resin layer 21 made of white resin, thereby preventing light absorption by the substrate and preventing light leakage from the side surface of the light emitting device. . As a result, the front luminance and the light emission efficiency can be improved.

<Second embodiment of light emitting device>
1 and 2 show an embodiment of a light-emitting device in which a single light-emitting element is mounted. The light-emitting device of the present invention is a light-emitting device in which a plurality of light-emitting elements are mounted on a substrate (multi-mount light-emitting device). Device). An embodiment of such a multi-mount light emitting device is shown in FIGS. 3 shows a light-emitting device in which a plurality of light-emitting elements 151 to 154 are arranged in a line, and FIG. 4 shows a light-emitting device in which a plurality of light-emitting elements 155 to 158 are arranged in a matrix.

  In the case of a multi-mount light emitting device, one cover 19 is provided for an array of a plurality of light emitting elements formed on a substrate. For this reason, a plurality of cover bumps 13 are provided in a predetermined arrangement around the element bumps 12 on the substrate 11, and a cover 19 is fixed to the cover bumps 13.

  In these multi-mount light-emitting devices, as in the first embodiment, an underfill can be provided between the light-emitting element and the substrate, or a white resin layer can be provided on the outer periphery of the side surface of the cover 19.

<First Embodiment of Manufacturing Method>
Next, a first embodiment of a method for manufacturing a light emitting device of the present invention will be described.
FIGS. 5A to 5F are diagrams illustrating steps of the method for manufacturing the light emitting device. The materials and elements used in each step of the illustrated manufacturing method are the same as those described in the embodiments of the light emitting device of the present invention unless otherwise specified, and the description thereof is omitted.

  First, as shown in FIG. 5A, metal bumps 12 and 13 for elements and covers are mounted on a substrate 11 on which an electric circuit (not shown) is formed (step S1). A plurality of element bumps 12 are provided in a predetermined arrangement in a region where the light emitting elements are mounted (element mounting region), and the cover bumps 13 include four rectangular corners surrounding the element mounting region, and the number of sides as necessary. It is provided in the place. As a method for forming the metal bumps, known methods such as bump bonding made from wires forming the bumps and electroforming can be adopted, and the height of the metal bumps is made constant for both the element and the cover. As an example, the height of the metal bump is 20 ± 5 μm.

  Next, as shown in FIG. 5B, mounting is performed on the element bump, and the light emitting element is bonded to the substrate (step S2). If the thickness of the element is 110 μm and the bump height is the same as in the above example, the height of the element mounting is 130 ± 5 μm.

A highly viscous resin composition is dropped on the mounted light emitting element with a dispenser (FIG. 5C, step S3). The viscosity of the resin composition before curing is preferably 200 to 400 Pa · s, more preferably 260 to 360 Pa · s. By setting the viscosity of the resin composition in such a range, it is possible to suppress the mixing of bubbles as much as possible, and the resin spreads from the upper surface of the light emitting element due to its own weight or wraps around the lower side of the light emitting element 15 when pressed. Can be prevented. Moreover, since the content of the phosphor contained in the resin composition can be increased, for example, 50% by weight or more, the film thickness can be reduced. The amount to be dropped is appropriately selected depending on the difference between the inner size of the cover and the size of the light emitting element. For example, the inside size of the cover is 1.12 (mm) x 1.12 (mm) x 0.155 (mm) depth, and the size of the light-emitting element is 1.12 (mm) x 1. In the case of 12 (mm) × height 0.115 (mm), the height is about 1.01 to ^0.4 cm ³ . Accordingly, the upper surface and side surfaces of the light emitting element can be completely covered with the resin, and the resin that wraps around the lower side of the light emitting element can be minimized.

  On the other hand, processing such as cutting, sandblasting, etching, or the like is performed on one surface of a sheet (thin plate) such as glass having a certain thickness to form a recess, and a glass cover 19 is prepared. The depth of the recess is a depth obtained by adding the design thickness of the resin as the sealing material to the thickness of the light emitting element, and the shape is a shape that generates a clearance substantially equal to the thickness of the resin between the light emitting element. In the case where a plurality of light emitting elements are mounted, the shape and size can cover the array of the plurality of light emitting elements. When a plastic sheet such as acrylic or polycarbonate is used as the cover material, it is possible to produce a concave cover by molding instead of forming the concave portion by cutting or the like. Further, the cover is preferably subjected to metal plating at the joint portion with the metal bump 13.

  The cover prepared in this manner is placed on the light emitting element or its array on which the resin composition is dropped in step S3 of FIG. 5C, and the resin is crushed as shown in FIGS. 5D and 5E. Press until the end of the side surface of the cover comes into contact with the cover bump (step S4). The purpose of pressing is to bring the cover into contact with the metal bump, and the pressure is not particularly limited, but 100 gf per bump to be joined is appropriate. At this time, since the space between the cover 19 and the substrate 11 is a space other than the portion where the cover bumps 13 are present, air existing between the cover and the light emitting element can be released. Even if the resin composition is dripped in a large amount or the resin composition is thermally expanded, even if the resin composition is pushed downward between the side surface portion of the cover and the light emitting element, the excess resin composition is removed from the cover. The space between the substrate and the substrate can be absorbed, and the wraparound to the lower portion of the light emitting element can be prevented.

When metal plating is applied to the bump bonding portion of the cover 19, the bonding portion between the cover 10 and the metal bump is pressurized and ultrasonic waves are applied to firmly bond the two. For example, the pressurization is a load of 100 gf per bump, and the application condition of ultrasonic waves is a frequency of 60 kHz and 500 mw for 0.5 seconds.
Finally, the resin sandwiched between the cover and the light emitting element is cured to integrate the substrate 11, the light emitting element 15, the resin (sealing material) 17, and the cover 19 as shown in FIG. Step S5). The conditions for curing the resin vary depending on the resin. For example, when the resin is a silicone resin, the resin is cured by heating at 150 ° C. for 4 hours. Thereby, a light emitting device as shown in FIGS. 1 to 3 is obtained.

  As described above, according to the method for manufacturing a light emitting device of this embodiment, a resin composition in which bumps similar to bumps for bonding a light emitting element to a substrate are provided on the substrate and dropped onto the light emitting element is provided. By pressing until the cover in which the concave portion having the predetermined depth is in contact with the bump, the light emitting device sealed with the resin having the predetermined thickness can be manufactured with high reproducibility. As a result, it is possible to manufacture a light-emitting device that does not vary from product to product.

  Further, according to the method for manufacturing the light emitting device of the present embodiment, the resin composition dripped on the light emitting element is covered with the cover by pressing the resin composition from above, so that bubbles are not easily mixed in. Even if foreign matter is mixed between the cover and the light emitting element, or if the cover and the light emitting element are misaligned, the foreign object or misalignment can be confirmed through the transparent cover, so proceed to the subsequent steps. Necessary measures such as removal of foreign substances can be performed before.

  Note that although the method for manufacturing one light emitting device is shown in the drawing, the manufacturing method of this embodiment can be applied to a case where a plurality of light emitting devices are manufactured simultaneously. In that case, after forming metal bumps in the mounting regions of the plurality of light emitting elements on the substrate and the regions surrounding the respective element mounting regions (step S1), the metal bumps (elements) formed in the element mounting region Each light emitting element is mounted on each bump (step S2).

  On the other hand, a recess corresponding to the element mounting region of the substrate is formed in a cover material having the same size as the substrate, for example, a glass plate. The method described with reference to FIG. Metal plating is applied to the area other than the recesses on the surface where the recesses are formed, if necessary.

  Next, a resin composition serving as a sealing material is dropped on the plurality of light emitting elements mounted on the substrate (step S3), and the cover prepared as described above is covered so that each recess covers each light emitting element. The peripheral portion of the recess is bonded to a metal bump (cover bump) formed in the outer peripheral region of the element mounting region (step S4). As a result, a certain resin layer free from bubbles is formed between the inner surface of the concave portion of the cover and the light emitting element. The resin composition is cured to integrate the cover, the resin, the light emitting element, and the substrate to obtain an array of a plurality of light emitting devices on the substrate (step S5).

  Finally, the individual light emitting devices are separated by dicing or the like, and the same light emitting device as that in FIG. 1 is obtained.

  The manufacturing method described above can be similarly applied to a manufacturing method of a multi-mount light emitting device. In the case of multi-mounting, the element mounting area of the bump formed on the substrate is compatible with multi-mounting, and the size of the recess formed in the cover corresponds to the arrangement of a plurality of light emitting elements. Except for the differences, this embodiment is the same as the first embodiment, and the simultaneous manufacture of a plurality of light emitting devices can be applied in the same manner as a light emitting device in which a single light emitting element is mounted.

<Second Embodiment of Manufacturing Method>
Next, as a second embodiment of the method for manufacturing a light emitting device of the present invention, a method for manufacturing a light emitting device having a white resin layer around the underfill and the cover between the light emitting element and the substrate will be described.

  Also in this embodiment, steps S1 to S5 shown in FIGS. 5A to 5F are the same as those in the first embodiment, and thereafter, a step of forming an underfill and a white resin layer is added. . The added steps will be described by taking a manufacturing method of the multi-mount light emitting device as an example.

  First, as shown in FIGS. 6A and 6B, a wall structure 31 is provided with a predetermined clearance outside the light emitting device manufactured in step S5. The wall structure 31 is formed, for example, by bonding a frame made of ceramics or the like to the substrate 11 (step 6). A gap (clearance) 33 between the wall structure 31 and the cover 19 is, for example, 400 μm.

  Next, a white resin for underfill is injected from between the wall structure 31 and the cover 19 of the light emitting device 10 using a dispenser device. For example, the white resin is injected by starting the discharge of the resin in a state where the tip of the dispenser discharge needle 35 is positioned closest to the substrate 11 in the gap between the wall structure 31 and the cover 19. The height of the tip is gradually raised while moving the tip of the tip in a direction substantially parallel to the substrate along the gap. That is, the needle tip is moved in a spiral shape with a small pitch. The arrow in FIG. 6A indicates such horizontal movement of the needle 35, and the arrow in FIG. 6B indicates vertical movement in conjunction with the horizontal movement. By moving the needle tip in this way, the resin discharged from the needle tip is first spread below the light emitting element 15 and then filled so as to cover the side surface of the cover 19. When the upper end of the cover 19 is finally covered with resin, the injection is completed. By finally curing the filled resin, as shown in FIGS. 7A to 7C, a light emitting device 10 'in which the underfill 20 and the white resin layer 21 are formed is obtained.

  According to the present invention, it is possible to provide a light-emitting device that includes a sealing material that has a controlled film thickness and does not contain bubbles or the like on the light-emitting element, has no color unevenness, and improves the light-emitting efficiency of the light-emitting element. . In addition, it is possible to provide a light emitting device having excellent durability against heat history.

DESCRIPTION OF SYMBOLS 10, 10 '... Light-emitting device (cover bump), 15 ... Light-emitting element (LED chip), 17 ... Sealing material, 19 ... Cover, 20, 21 ... White resin layer .

Claims (7)

A manufacturing method of a light emitting device comprising a substrate, one or more light emitting elements mounted on the substrate, and a sealing material covering the light emitting elements,
Dropping (1) a resin composition on the light emitting element of the substrate on which the light emitting element is mounted;
A step (2) of pressing the transparent member in which the concave portion is formed so that the concave portion covers the light emitting element after the resin composition is dropped, and covering the entire upper surface of the light emitting element with the resin composition;
And (3) forming a sealing material by curing the resin composition ,
Before the step (1), the method includes a step of forming a plurality of metal bumps on the substrate, and a step of bonding the light emitting element to a part of the metal bumps and performing flip chip mounting.
Wherein in step (2), the bumps other than the bump formed by joining the light emitting element among the plurality of bumps, the method of manufacturing the light emitting device characterized that you fix the transparent member. A method of manufacturing a light emitting device according to claim 1 ,
The resin composition includes a resin, a phosphor, and, if necessary, a viscosity modifier, and has a viscosity before curing of 200 Pa · s (Pascal second) to 400 Pa · s. Production method. A method for manufacturing a light emitting device according to claim 2 ,
The resin composition contains 30 to 70% by weight of the phosphor and 0 to 15% by weight of the viscosity modifier. A light-emitting device comprising a substrate, one or more light-emitting elements mounted on the substrate, a sealing material that covers the light-emitting elements, and a transparent member that covers the one or more light-emitting elements and the sealing material. And
The substrate includes an element bump for bonding the light emitting element and a transparent member bump for bonding the transparent member to a region where the element bump is not formed, and the transparent member is an end surface facing the substrate. A part of the light-emitting device is bonded to the transparent member bump, and has a gap between the unbonded end surface and the substrate. The light-emitting device according to claim 4 ,
The light-emitting device, wherein the transparent member is glass. The light-emitting device according to claim 4 or 5 ,
One of the sealing material and the transparent member includes a wavelength conversion material that converts a wavelength of light emitted from the light emitting element. The light-emitting device according to any one of claims 4 to 6 ,
A light-emitting device, wherein a white resin is filled in a gap between the substrate-side surface of the light-emitting element and the substrate.

Images