JP5465568B2 - Piezoelectric oscillator - Google Patents

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device.

An example of a piezoelectric oscillator used in an electronic device is a crystal oscillator.
A crystal oscillator, which is an example of a piezoelectric oscillator, mainly includes, for example, an element mounting member, a piezoelectric vibration element, a lid member, and an integrated circuit element.

As the element mounting member, for example, an insulating material such as ceramics is used.
The element mounting member is composed of, for example, a substrate portion and two frame portions, and one concave space is formed on each of the main surfaces.
Further, the element mounting member is provided with an integrated circuit element mounting pad and a measurement terminal on the bottom surface of one concave space, that is, one main surface of the substrate portion.
Further, the element mounting member is externally attached to the main surface on which one recessed space is formed, that is, the surface of one frame facing the surface where one frame forming the one recessed space is in contact with the substrate. A connection terminal is provided.
The element mounting member is provided with two pairs of piezoelectric vibration element mounting pads on the bottom surface of the other recessed space, that is, on the other main surface of the substrate portion.
The element mounting member is provided with internal wiring for electrically connecting the integrated circuit element mounting pad and the piezoelectric vibration element mounting pad, the external connection terminal, or the measurement terminal.

The substrate part is provided in a rectangular flat plate shape, for example.
The substrate portion is provided with an integrated circuit element mounting pad and a measurement terminal on one main surface.
The substrate portion is provided with a piezoelectric vibration element mounting pad on the other main surface.

For example, two frame portions are provided, and are provided in a frame-shaped flat plate shape. Further, the frame portions are provided on both main surfaces of the substrate portion, respectively, to form a recessed space.
Here, one frame part is provided in one main surface of the board | substrate part, and forms one recessed space. Moreover, the other frame part is provided in the other main surface of the board | substrate part, and forms the other recessed part space.

For example, ten integrated circuit element mounting pads are provided.
Further, for example, five integrated circuit element mounting pads are provided along one long side of the bottom surface of one recess space, and five are provided along the other long side. That is, the integrated circuit element mounting pads are provided on the bottom surface of one of the recess spaces in a matrix of 2 rows × 5 columns.
The integrated circuit element mounting pad is provided at a position facing an integrated circuit element connection terminal provided in the integrated circuit element described later, and is electrically connected to the integrated circuit element connection terminal by, for example, a conductive material such as solder. Has been.
The two predetermined integrated circuit element mounting pads are electrically connected to a piezoelectric vibration element mounting pad described later via internal wiring. Further, the two predetermined integrated circuit element mounting pads are electrically connected to measurement terminals, which will be described later, via internal wiring.
The predetermined four other integrated circuit element mounting pads are electrically connected to external connection terminals, which will be described later, through internal wiring.

Here, one main surface of the element mounting member is a main surface in which one concave space is formed.
The external connection terminal is provided on the main surface on which one recessed space is formed, that is, on the surface of one frame portion facing the surface where one frame portion forming the one recessed space contacts the substrate portion. . In other words, the external connection terminal is provided on one main surface of the element mounting member.
For example, four external connection terminals are provided, one at each of the four corners of one main surface of the element mounting member.
The external connection terminals are electrically connected to the other four integrated circuit element mounting pads and the internal wiring of the element mounting member.

For example, two measurement terminals are provided as a pair.
Further, when viewed from the opening side of one concave space, that is, from one main surface side of the element mounting member, a part of the measurement terminal is exposed without being hidden by the main surface of the integrated circuit element. It is in a state. Therefore, when viewed from the opening side of one of the recessed spaces, the measuring terminal is in a state where the space between the frame portion provided on one main surface of the substrate portion and the integrated circuit element is exposed.
The measurement terminal is electrically connected to two predetermined integrated circuit element mounting pads and a piezoelectric vibration element mounting pad described later. Accordingly, by contacting the measurement probe to the measurement terminal, it is possible to measure the electrical characteristics of the piezoelectric vibration element mounted on the piezoelectric vibration element mounting pad, which will be described later, such as the series resonance resistance value and the stability of the vibration frequency. it can.

The piezoelectric vibration element mounting pads are provided, for example, in pairs, and two are provided side by side along the other main surface of the substrate portion, that is, one short side of the bottom surface of the other recessed space. Yes.
Here, the other main surface of the element mounting member is a main surface in which the other recessed space is formed.
Therefore, the piezoelectric vibration element mounting pad is provided on the bottom surface of the other recessed space provided on the other main surface of the element mounting member.
The piezoelectric vibration element mounting pad is electrically connected to two predetermined integrated circuit element mounting pads and the internal wiring of the element mounting member.
The piezoelectric vibration element mounting pad is electrically connected to the measurement terminal via the internal wiring of the element mounting member.
The piezoelectric vibration element mounting pad is provided at a position facing a lead electrode of the piezoelectric vibration element described later, and is electrically connected to the lead electrode of the piezoelectric vibration element by, for example, a conductive adhesive.

In the element mounting member, one concave space is formed on one main surface, and an integrated circuit element mounting pad and a measurement terminal are provided on the bottom surface of the one concave space.
Further, the element mounting member is provided with external connection terminals at four corners of one main surface.
The element mounting member has the other concave space formed on the other main surface, and a piezoelectric vibration element mounting pad is provided on the bottom surface of the other concave space.
The element mounting member is electrically connected to two pairs of piezoelectric vibration element mounting pads via a predetermined two integrated circuit element mounting pads and two pairs of measurement terminals via internal wiring of the element mounting member. Has been.

The integrated circuit element is, for example, an IC circuit element having an oscillation circuit function.
The integrated circuit element has, for example, a plurality of integrated circuit element connection terminals on one main surface.
For example, ten integrated circuit element connection terminals are provided, and five integrated circuit element connection terminals are provided along both long sides of the integrated circuit element. That is, five integrated circuit connection terminals are provided side by side along one long side, and five are provided side by side along the other long side. In other words, the integrated circuit element connection terminals are provided in a matrix of 2 rows × 5 columns.
The integrated circuit element connection terminal is provided at a position facing the integrated circuit element mounting pad, and is electrically connected to the integrated circuit element mounting pad by, for example, a conductive material such as solder.
That is, the integrated circuit element is mounted in one recessed space of the element mounting member by electrically connecting the integrated circuit element connection terminal and the integrated circuit element mounting pad.

The piezoelectric vibration element includes, for example, a piezoelectric piece, an excitation electrode, and a lead electrode.
The piezoelectric piece is made of, for example, quartz and is provided in a rectangular flat plate shape.
Two pairs of excitation electrodes are provided. One excitation electrode is provided on one main surface of the piezoelectric piece. The other excitation electrode is provided on the other main surface of the piezoelectric piece at a position facing the one excitation electrode.
There are two pairs of routing electrodes. One lead-out electrode has one end connected to one excitation electrode, and the other end is the other main surface of the piezoelectric piece and is located at the edge of one short side. The other lead-out electrode has one end connected to the other excitation electrode, and the other end is one main surface of the piezoelectric piece and is located at the edge of the one end. .
Further, the lead-out electrode is provided at a position facing the piezoelectric vibration element mounting pad provided on the element mounting member, and is electrically connected to the piezoelectric vibration element mounting pad by, for example, a conductive adhesive.
That is, the piezoelectric vibration element is mounted on the bottom surface of the other recessed space of the element mounting member by electrically connecting the routing electrode and the piezoelectric vibration element mounting pad of the element mounting member.

The lid member is made of, for example, metal and is provided in a rectangular flat plate shape.
The lid member has the same size as the main surface of the element mounting member.
The lid member is joined to the other main surface of the element mounting member in which the other recessed space is formed to hermetically seal the other recessed space. That is, the lid member is joined to the element mounting member to hermetically seal the piezoelectric vibration element mounted on the bottom surface of the other recessed space.

In the piezoelectric oscillator, an integrated circuit element is mounted on the bottom surface of a recessed space formed on one main surface of the element mounting member.
In addition, the piezoelectric oscillator has a piezoelectric vibration element mounted on the bottom surface of the recessed space formed on the other main surface of the element mounting member, and is hermetically sealed with a lid member.
When viewed from one main surface side of the element mounting member, the piezoelectric oscillator has an integrated circuit element mounted inside the frame, that is, in one recessed space, and a part of the measurement terminals is integrated. It is not hidden by the main surface of the circuit element and is exposed.
Such a piezoelectric oscillator has, for example, a series resonance resistance value or vibration frequency even after an integrated circuit element is mounted by bringing a measurement probe or the like into contact with a part of the exposed measurement terminal. It has a structure capable of measuring electrical characteristics such as stability (see, for example, Patent Document 1).

In addition, when an integrated circuit element is mounted on an element mounting member, there is a piezoelectric oscillator having a structure in which all measurement terminals are exposed without being hidden by the integrated circuit element.
This piezoelectric oscillator is different from the above-described piezoelectric oscillator in the structure of the frame portion on one main surface side and the position where the measurement terminal is provided.

The element mounting member includes a substrate portion and two frame portions.
One frame portion is provided on each main surface of the substrate portion.
One frame part is provided along the edge part of one main surface of the board | substrate part, and forms one recessed part space. Moreover, this one frame part has a structure in which a part along both short sides is missing. In other words, this one frame part is two wall parts, and it is in the state where each was provided along each long side.
Similarly to the one frame portion, the other frame portion is provided along the edge portion of the other main surface of the substrate portion to form the other recessed space.
Two pairs of measurement terminals are provided one by one along the short side of one main surface of the substrate portion at a position where the frame portion provided on the one main surface side is absent. Further, since the two pairs of measurement terminals are electrically connected to the two predetermined integrated circuit element mounting pads, they are electrically connected to the two pairs of piezoelectric vibration element mounting pads.
Therefore, the measurement terminal has the same width as the frame portion.
Here, the width of the measurement terminal is the width of the measurement terminal in a direction parallel to the long side of the element mounting member.
In addition, the width of the frame portion, when viewed from the opening of one of the recessed spaces, is a predetermined one side on the recessed space side and the predetermined one side in the frame forming the opening of the one recessed space. A distance from a predetermined other side on the outer edge side that is parallel and close to the predetermined one side.

Therefore, in the piezoelectric oscillator, the integrated circuit element is mounted on the bottom surface of the recessed space formed on one main surface of the element mounting member.
In addition, the piezoelectric oscillator has a piezoelectric vibration element mounted on the bottom surface of the recessed space formed on the other main surface of the element mounting member, and is hermetically sealed with a lid member.
Further, when viewed from one main surface side of the element mounting member, the piezoelectric oscillator has an integrated circuit element mounted inside the frame portion, that is, in one recessed space, and the measurement terminal is connected to one frame portion. It is provided in the lacked part and exposed. That is, the measurement terminal is provided between a predetermined one side on one concave space side of the element mounting member and a predetermined other side parallel to the predetermined side and on the outer edge side of the element mounting member. .
Even after mounting an integrated circuit element, such a piezoelectric oscillator is provided in a portion lacking one of the frame portions by bringing a measurement probe or the like into contact with an exposed measurement terminal. For example, it has a structure capable of measuring electrical characteristics such as a series resonance resistance value and stability of vibration frequency (see, for example, Patent Document 2).

JP 2003-163540 A JP 2010-41902 A

However, in the conventional piezoelectric oscillator, the measurement terminal is exposed only at a portion between one frame portion provided on one main surface of the substrate portion and the integrated circuit element. Therefore, when the size of the piezoelectric oscillator is reduced, the exposed area of the measurement terminal is small, and the distance between the integrated circuit element and the one frame portion may be narrow.
For this reason, when measuring the electrical characteristics of a piezoelectric vibration element, the conventional piezoelectric oscillator has a measurement probe exposed because the measurement probe does not enter between the integrated circuit element and one frame. There is a risk that it is impossible to make contact with a part of the terminal for use, and the mounted integrated circuit element must be peeled off and measured.
In other words, in such a piezoelectric oscillator, the measurement probe cannot be brought into contact with the measurement terminal, the measurement terminal does not function, and the mounted integrated circuit element is not peeled off. May not be measured.

Further, in the conventional piezoelectric oscillator, the measurement terminal is provided in a part of one of the frame portions provided on one main surface of the substrate portion, which is missing. That is, in the conventional piezoelectric oscillator, the measurement terminal is provided in the width of one frame portion. Therefore, when miniaturized, the conventional piezoelectric oscillator has a risk that the width of one frame portion is narrowed and the area of the measurement terminal is small.
For this reason, when measuring the electrical characteristics of a piezoelectric vibration element, a conventional piezoelectric oscillator must have a measurement probe in contact with a measurement terminal having a small area, which may require labor and time for measurement. is there.
That is, in such a piezoelectric oscillator, even if the measurement terminal is used, it takes time and labor to measure the electrical characteristics of the piezoelectric vibration element, and thus the productivity may be deteriorated.

  Accordingly, an object of the present invention is to provide a piezoelectric oscillator capable of easily measuring the electrical characteristics of a piezoelectric vibration element after the integrated circuit element is mounted.

In order to solve the above-mentioned problems, a substrate portion and two frame portions are formed, recessed spaces are formed on both main surfaces, and a plurality of integrated circuit element mounting pads and two pairs of measurements are formed on the bottom surface of the one recessed space. An element mounting member provided with a pair of piezoelectric vibration element mounting pads on the bottom surface of the other concave space, a piezoelectric vibration element mounted on the piezoelectric vibration element mounting pad, A lid member for hermetically sealing the piezoelectric vibration element, and the plurality of integrated circuit element mounting pads are provided at the center of the bottom surface of one of the recess spaces, and the two pairs of piezoelectric vibration elements are mounted A pad and two predetermined integrated circuit element mounting pads are electrically connected, and the two pairs of measurement terminals are the two pairs of piezoelectric vibration element mounting pads and / or the two predetermined integrated circuits. Circuit element mounting package To be electrically connected, the measuring terminal, wherein so as not to face the principal surface of the integrated circuit element mounted on an integrated circuit device mounting pads, one of a plurality of said integrated circuit device mounting pads are provided One side is provided on each side of the central portion of the bottom surface of the concave space, and the predetermined one side and the predetermined one side on the one concave space side in the frame portion forming the one concave space The width of the measurement terminal is formed wider than the width of the frame portion when the distance from the predetermined other side on the outer edge side that is parallel to the predetermined one side is the width of the frame portion. It is characterized by that.

Such a piezoelectric oscillator is composed of an element mounting member that includes a substrate portion and a frame portion that is provided along the edges of both main surfaces of the substrate portion, and in which a recessed space is formed, and is mounted on the element mounting member. And a lid member that hermetically seals the mounted piezoelectric vibration element. In addition, such a piezoelectric oscillator is provided at a position where the measurement terminal does not face the main surface of the integrated circuit element. In addition, in such a piezoelectric oscillator, in one frame portion forming one recessed space, a predetermined one side on the one recessed space side and an outer edge side that is parallel to the predetermined one side and close to the predetermined one side When the distance from the other predetermined side is the width of the frame portion, the width of the measurement terminal is wider than the width of the frame portion.
In other words, when viewed from the main surface side on which the integrated circuit element is mounted, such a piezoelectric oscillator is provided at a position where the integrated circuit element and the measurement terminal do not overlap with each other to form one concave space. The distance between the frame portion and the integrated circuit element is wider than the distance between the frame portion of the conventional piezoelectric oscillator and the integrated circuit element. In such a piezoelectric oscillator, the width of the measurement terminal is wider than the width of the frame portion.
Therefore, in such a piezoelectric oscillator, the measurement probe can be easily brought into contact with the measurement terminal, so that the electrical characteristics of the piezoelectric vibration element can be easily measured after the integrated circuit element is mounted. .

It is sectional drawing which shows an example of the piezoelectric oscillator which concerns on embodiment of this invention. It is a conceptual diagram which shows an example at the time of seeing from the side in which the integrated circuit element of the piezoelectric oscillator which concerns on embodiment of this invention is mounted.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

  A piezoelectric oscillator according to an embodiment of the present invention will be described. As shown in FIG. 1, the piezoelectric oscillator 100 according to the embodiment of the present invention mainly includes an element mounting member 110, an integrated circuit element 120, a piezoelectric vibration element 130, and a lid member 140.

As shown in FIG. 1, the element mounting member 110 includes a substrate portion 110a and two frame portions 110b and 110c. Recessed spaces 111 and 112 are formed on both main surfaces, respectively.
In addition, as shown in FIGS. 1 and 2, the element mounting member 110 is provided with an external connection terminal 116 on one main surface.
Further, as shown in FIGS. 1 and 2, the element mounting member 110 is provided with an integrated circuit element mounting pad 113 and a measurement terminal 114 on the bottom surface of one concave space 111 on one main surface.
As shown in FIG. 1, the element mounting member 110 is provided with a piezoelectric vibration element mounting pad 115 on the bottom surface of the other concave space 112 of the other main surface.
The element mounting member 110 is provided with an internal wiring (not shown) that electrically connects the integrated circuit element mounting pad 113 and the piezoelectric vibration element mounting pad 115, the external connection terminal 116, or the measurement terminal 114. ing.

  For example, as illustrated in FIGS. 1 and 2, the substrate portion 110 a is provided in a rectangular flat plate shape.

Two frame portions 110b and 110c are provided.
The frame portions 110b and 110c have a flat frame shape.
In addition, when the space side of the frame parts 110b and 110c is set to the inner side, the distance between the predetermined one side on the inner side and the predetermined other one side outside the predetermined one side that is parallel to the predetermined one side Is the width.
One frame portion 110b is provided along the edge portion of one main surface of the substrate portion 110a to form one recessed space 111. Further, as shown in FIG. 2, the width W of one frame portion 110b is a distance between a predetermined one side T1 on the concave space 111 side and a predetermined other side T2 on the outer edge that is parallel to and close to the predetermined one side T1. is there.
The other frame portion 110c is provided along the edge portion of the other main surface of the substrate portion 110a similarly to the one frame portion 110b, and forms the other recessed space 112.

Here, one main surface of the element mounting member 110 is one frame portion 110b opposite to the main surface on which one concave space 111 is formed, that is, the surface where one frame portion 110b and the substrate portion 110a are in contact. Of the face.
The other main surface of the element mounting member 110 is the main surface on which the other recessed space 112 is formed, that is, the other frame portion 110c facing the surface where the other frame portion 110c and the substrate portion 110a are in contact. Say the face.

For example, as shown in FIG. 2, six integrated circuit element mounting pads 113 are provided.
Further, for example, as shown in FIG. 2, the integrated circuit element mounting pads 113 are provided in a matrix of 2 rows × 3 columns at the center of the bottom surface of one of the recessed spaces 111. That is, as shown in FIG. 2, the integrated circuit element mounting pads 113 are provided on the bottom surface of one of the recessed spaces 111 so as to form a matrix between the measurement terminals 114 described later.
Further, as shown in FIG. 1, the integrated circuit element mounting pad 113 is provided at a position facing an integrated circuit element connection terminal 121 provided in the integrated circuit element 120 described later.
Further, as shown in FIG. 1, the integrated circuit element mounting pad 113 is electrically connected to an integrated circuit element connection terminal 121 provided in the integrated circuit element 120 described later by a conductive material D such as solder, for example. ing.
The two predetermined integrated circuit element mounting pads 113 are electrically connected to a piezoelectric vibration element mounting pad 115 described later via an internal wiring. Further, the two predetermined integrated circuit element mounting pads 113 are electrically connected to the measurement terminals 114 via internal wiring.
Also. The other four predetermined integrated circuit element mounting pads 113 are electrically connected to an external connection terminal 116, which will be described later, through an internal wiring.

As shown in FIGS. 1 and 2, the external connection terminal 116 has a main surface in which one recessed space 111 is formed, that is, one frame portion 110 b and one substrate portion 110 a forming one recessed space 111. It is provided on the surface of one of the frame portions 110b that faces the surface that contacts the surface. In other words, the external connection terminal 116 is provided on one main surface of the element mounting member 110 as shown in FIGS. 1 and 2.
For example, as shown in FIG. 2, four external connection terminals 116 are provided, and one external connection terminal 116 is provided at each of the four corners of one main surface of the element mounting member 110.
The external connection terminal 116 is electrically connected to the other four integrated circuit element mounting pads 113 via the internal wiring of the element mounting member 110.

For example, as shown in FIGS. 1 and 2, the measurement terminals 114 are provided in pairs.
The measurement terminal 114 is electrically connected to two predetermined integrated circuit element mounting pads 113 and a piezoelectric vibration element mounting pad 115 described later. In other words, the measurement terminal 114 can measure the electrical characteristics of the piezoelectric vibration element 130 of the piezoelectric oscillator 100.
Further, the measurement terminal 114 has a width P wider than the width W of the frame portion 110b.
Here, the width P of the measurement terminal 114 is a width in a direction parallel to the long side of the element mounting member 110. That is, in FIG. 2, the width P of the measurement terminal 114 is the long side length of the measurement terminal 114.
Here, the case where the width P of the measurement terminal 114 is the long side length of the measurement terminal 114 is described. However, if the width is parallel to the long side of the element mounting member, the short side length is used. It may be.
When the width P of the measurement terminal 114 is narrower than the width W of the frame portion 110b, the area of the measurement terminal 114 becomes small as in the case of the conventional piezoelectric oscillator, and the measurement probe can be contacted. The measurement terminal 114 may not function.
For this reason, the measurement terminal 114 has a width P wider than the width W of the frame portion 110b.

For example, two pairs of the piezoelectric vibration element mounting pads 115 are provided, and two of the piezoelectric vibration element mounting pads 115 are provided along one short side of the other main surface of the substrate portion 110a, that is, the bottom surface of the other recessed space 112. It has been. In other words, two piezoelectric vibration element mounting pads 115 are provided side by side along one short side of the bottom surface of the other recessed space 112 provided on the other main surface of the element mounting member 110.
In addition, the piezoelectric vibration element mounting pad 115 is electrically connected to two predetermined integrated circuit element mounting pads 113 via the internal wiring of the element mounting member 110.
The piezoelectric vibration element mounting pad 115 is electrically connected to the measurement terminal 114 via the internal wiring of the element mounting member 110.
Further, as shown in FIG. 1, the piezoelectric vibration element mounting pad 115 is provided at a position facing a routing electrode 133 of the piezoelectric vibration element 130 described later. For example, the lead electrode of the piezoelectric vibration element 130 is formed by the conductive adhesive S. 133 is electrically connected.

As shown in FIGS. 1 and 2, the element mounting member 110 has one concave surface 111 formed on one main surface, and the integrated circuit element mounting pad 113 and the measurement surface on the bottom surface of the one concave space 111. Terminal 114 is provided.
In addition, as shown in FIG. 2, the element mounting member 110 is provided with external connection terminals 116 at four corners of one main surface.
Further, as shown in FIG. 1, the element mounting member 110 has the other concave surface 112 formed on the other main surface, and a piezoelectric vibration element mounting pad 115 is provided on the bottom surface of the other concave space 112. Yes.
Further, the element mounting member 110 has two pairs of piezoelectric vibration element mounting pads 115 that are electrically connected to each other through a predetermined two integrated circuit element mounting pads 113 and two pairs of measurement terminals 114 and internal wiring of the element mounting member 110. Connected.

As shown in FIG. 1, the piezoelectric vibration element 130 is mainly composed of a piezoelectric piece 131, an excitation electrode 132, and a routing electrode 133.
The piezoelectric piece 131 is made of, for example, a piezoelectric material and is provided in a rectangular flat plate shape.
For example, as shown in FIG. 1, the excitation electrodes 132 form a pair. One excitation electrode 132 is provided on one main surface of the piezoelectric piece 131. The other excitation electrode 132 is provided on the other main surface of the piezoelectric piece 131 at a position facing one excitation electrode.
The routing electrodes 132 are, for example, a pair of two.
The routing electrode 133 has one end connected to the predetermined excitation electrode 132 and the other end positioned at the end of the main surface of the piezoelectric piece 131 where the predetermined excitation electrode 132 is not provided. . That is, one lead electrode 133 has one end connected to one excitation electrode 132 and the other end located at the end of the other main surface of the piezoelectric piece 131. The other routing electrode 133 has one end connected to the other excitation electrode 132 and the other end positioned at the end of one main surface of the piezoelectric piece 131.
Further, as shown in FIG. 1, the lead-out electrode 133 is provided at a position facing the piezoelectric vibration element mounting pad 115 provided on the element mounting member 110. For example, the lead electrode 133 is mounted by the conductive adhesive S. The pad 115 is electrically connected.
The piezoelectric vibration element 130 is mounted on the piezoelectric vibration element mounting pad 115 by electrically connecting the routing electrode 133 and the piezoelectric vibration element mounting pad 115.

The lid member 140 is provided in a rectangular flat plate shape, for example.
Further, as shown in FIG. 1, the lid member 140 is connected to the element mounting member 110, and thereby serves to hermetically seal the piezoelectric vibration element 130 mounted in the other recessed space 112.

The integrated circuit element 120 is, for example, an IC circuit element having a function of an oscillation circuit.
Moreover, the integrated circuit element 120 is provided with a plurality of integrated circuit element connection terminals 121 on one main surface, for example.
For example, six integrated circuit element connection terminals 121 are provided, and three integrated circuit element connection terminals 121 are provided side by side along both long sides of the integrated circuit element 120. That is, three integrated circuit connection terminals 121 are provided side by side along one long side, and are provided side by side along the other long side, in other words, a matrix of 3 rows × 2 columns. Is provided.
Further, as shown in FIG. 1, the integrated circuit element connection terminal 121 is provided at a position facing the integrated circuit element mounting pad 113, and is electrically connected to the integrated circuit element mounting pad 113 by a conductive material D such as solder. It is connected.
That is, the integrated circuit element 120 is mounted in the one recessed space 111 of the element mounting member 110 by electrically connecting the integrated circuit element connection terminal 121 and the integrated circuit element mounting pad 113.

Therefore, in such a piezoelectric oscillator 100, the integrated circuit element 120 is mounted on the bottom surface of the one recessed space 111 formed on one main surface of the element mounting member 110.
Further, in such a piezoelectric oscillator 100, the piezoelectric vibration element 130 is mounted on the bottom surface of the other recessed space 112 formed on the other main surface of the element mounting member 110 and hermetically sealed by the lid member 140. .
Further, when viewed from one main surface side of the element mounting member 110, such a piezoelectric oscillator 100 has the integrated circuit element 120 mounted in the one frame portion 110b, and the measurement terminal 114 has the integrated circuit element. The structure is exposed without being hidden by 120.
In the piezoelectric oscillator 100, the width P of the integrated circuit element mounting pad is larger than the width W of the frame portion.
In the piezoelectric oscillator 100, two predetermined integrated circuit element mounting pads 113 are electrically connected to the measurement terminal 114 and the piezoelectric vibration element mounting pad 115.
Further, in the piezoelectric oscillator 100, other predetermined four integrated circuit element mounting pads 113 are electrically connected to the external connection terminals 116.

The piezoelectric oscillator 100 according to the embodiment of the present invention includes the substrate portion 110a and the frame portions 110b and 110c provided along the edges of both main surfaces of the substrate portion 110a, and the recessed spaces 111 and 112 are formed. An element mounting member 110 formed, a piezoelectric vibration element 130 mounted on the element mounting member 110, and a lid member 140 that hermetically seals the mounted piezoelectric vibration element 130 are provided. The piezoelectric oscillator 100 according to the embodiment of the present invention is provided at a position where the measurement terminal 114 does not face the main surface of the integrated circuit element 120. In addition, in the piezoelectric oscillator 100 according to the embodiment of the present invention, in one frame portion 110b forming the one recessed space 111, the predetermined one side T1 on the one recessed space 111 side and the predetermined one side. When the distance W from the predetermined other side T2 on the outer edge side that is parallel to T1 and close to one side of the predetermined T1 is the width W of the frame portion 110b, the width P of the measuring terminal 114 is greater than the width W of the frame portion 110b. It is getting wider.
That is, when viewed from the main surface side where the integrated circuit element 120 is mounted, the piezoelectric oscillator 100 according to the embodiment of the present invention is provided at a position where the integrated circuit element 120 and the measurement terminal 114 do not overlap. Thus, the distance between the frame portion 110b forming the recessed space 111 and the integrated circuit element 120 is wider than the distance between the frame portion of the conventional piezoelectric oscillator and the integrated circuit element. In the piezoelectric oscillator 100 according to the embodiment of the present invention, the width P of the measurement terminal 114 is wider than the width W of the frame portion 110b.
For this reason, the piezoelectric oscillator 100 according to the embodiment of the present invention can easily bring the measurement probe into contact with the measurement terminal 114. Therefore, after the integrated circuit element 120 is mounted, the piezoelectric vibration element 130 is provided. Electrical characteristics can be easily measured.

  In the piezoelectric oscillator 100 according to the embodiment of the present invention, the integrated circuit element 120 is provided in one frame portion 110b. Therefore, when provided on a wiring board of an electronic device, the piezoelectric oscillator 100 according to the embodiment of the present invention has a structure in which the integrated circuit element 120 is sealed in one concave space 111. For this reason, the piezoelectric oscillator 100 according to the embodiment of the present invention can suppress external influences such as temperature and humidity of the piezoelectric oscillator as compared with the related art.

  Here, the case where six integrated circuit element connection terminals are provided is described, but the number of integrated circuit connection terminals is, for example, eight as long as the integrated circuit element functions as a piezoelectric oscillator. Or 10 pieces.

  In this example, the case where the integrated circuit element mounting pad and the external connection terminal, the piezoelectric vibration element mounting pad, or the measurement terminal is connected by the internal wiring is described. If possible, pattern wiring may be provided on the surface of the element mounting member, for example.

DESCRIPTION OF SYMBOLS 100 Piezoelectric oscillator 110 Element mounting member 110a Board | substrate part 110b, 110c Frame part 111,112 Recessed space 113 Integrated circuit element mounting pad 114 Measurement terminal 115 Piezoelectric vibration element mounting pad 120 Integrated circuit element 121 Integrated circuit element connection terminal 130 Piezoelectric vibration element 131 Piezoelectric piece 132 Excitation electrode 133 Leading electrode 140 Lid member D Conductive material S Conductive adhesive W Frame width P Measurement terminal width T1, T2 One side of frame

Claims (1)

It is composed of a substrate portion and two frame portions, and a concave space is formed on both main surfaces, a plurality of integrated circuit element mounting pads and two pairs of measurement terminals are provided on the bottom surface of one of the concave spaces, An element mounting member in which two pairs of piezoelectric vibration element mounting pads are provided on the bottom surface of the recess space;
A piezoelectric vibration element mounted on the piezoelectric vibration element mounting pad;
A lid member for hermetically sealing the piezoelectric vibration element;
With
The plurality of integrated circuit element mounting pads are provided at the center of the bottom surface of one of the recessed spaces,
The two pairs of piezoelectric vibration element mounting pads and the predetermined two integrated circuit element mounting pads are electrically connected,
The two pairs of measurement terminals are electrically connected to the two pairs of piezoelectric vibration element mounting pads or / and the two predetermined integrated circuit element mounting pads;
The center of the bottom surface of one of the recessed spaces in which the plurality of integrated circuit element mounting pads are provided so that the measurement terminal does not face the main surface of the integrated circuit element mounted on the integrated circuit element mounting pad One on each side of the unit,
In the frame portion forming the one recessed space, a predetermined one side on the one recessed space side and a predetermined other side on the outer edge side that is parallel to the predetermined one side and close to the predetermined one side When the distance is the width of the frame,
A piezoelectric oscillator, wherein a width of the measurement terminal is formed wider than a width of the frame portion.

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