JP5311779B2 - LED light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a LED light-emitting device moving a focusing position of a lens face. <P>SOLUTION: A plurality of stepped pins 13A, 13B are provided on a lens body 11. These stepped pins 13A, 13B have at least one step each, and at least one pair of stepped pins whose shape of step and dimension are same are arranged at the positions facing each other with lens surface 12 sandwiched. At least two kinds of pins have different numbers of steps. A plurality of holes 2A, 2B engaging with stepped pins 13A, 13B of the lens body 11, are provided on a substrate 1. Stepped pins 13A, 13B of the lens body 11 engages with holes 2A, 2B having diameters corresponding to predetermined diameters of stepped pins to determine a focusing position of lens face. Holes engaged with stepped pins are changed by rotating the lens body, thereby the focusing position of lens face moves. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an LED light-emitting device, and more particularly, to an LED light-emitting device that includes a lens and has improved light collecting properties.

  Today, LEDs (Light Emitting Diodes) are in the field of computers such as personal computers, communications equipment such as facsimiles and mobile phones, office equipment such as copiers and printers, and household appliances such as refrigerators and microwave ovens. It has been used for products in various fields.

  Further, since the LED is small, it has been used as a flash light source of a mobile phone with a camera function by adding a light collecting function such as a lens. As a conventional structure of an LED light-emitting device that uses a lens and an LED in combination as a flash light source, for example, an LED light-emitting device having a structure shown in Patent Document 1 below can be cited.

JP 2004-327955 A

  21 and 22 are a cross-sectional view of a main part of the LED lamp disclosed in Patent Document 1 and a plan view of a light emitter mounted on a circuit board. The LED lamp 141 disclosed in Patent Document 1 is provided with a light emitter 127 on a circuit board 122, a reflective frame body having a reflective surface 133 by forming a mortar-shaped recess 132 so as to surround the outer peripheral area of the light emitter 127. 131 is provided, and a lens body 144 provided with a convex surface 146 serving as a lens is provided thereon. In addition, an air layer 140 is provided between the lens body 144 and the light emitter 127, and an air hole 145 connected to the air layer 140 is provided.

  The light emitter 127 provided on the circuit board 122 is provided with three LED elements 128a, 128b, and 128c. The LED element 128a is provided with an anode electrode A1, a cathode electrode K1, and a bonding wire provided on the circuit board 122. Similarly, the LED element 128b is connected to the anode electrode A2 and the cathode electrode K2 disposed on the circuit board 122 via bonding wires, and the LED element 128c is connected to the anode electrode A3 disposed on the circuit board 122. The cathode electrode K3 is connected via a bonding wire. The three LED elements 128a, 128b, and 128c are sealed with a transparent resin material 129.

  According to Patent Document 1, by making such a configuration, the light emitted from the three LED elements has a light emission luminance in the front direction of the light emitter 127 due to reflection from the reflection surface 133 of the reflection frame 131. Furthermore, since the light is condensed by the convex surface 146 of the lens body 144, the amount of radiated light in the front direction can be increased. Further, it is said that by providing the air layer 140 under the lens body 144, the light condensing property can be further improved by the change in the refractive index.

  By the way, an LED lamp used as a flash light source is required to illuminate a lighting body (referred to as an object to be illuminated, hereinafter referred to as a lighting body) brighter. For this reason, the light emitted from the lens of the LED lamp has a lamp structure in which light having light distribution characteristics such as parallel light emitted in parallel toward the illuminating body and condensed light condensed on the illuminating body is emitted. It is necessary to adopt a structure that takes into account the positional relationship between the focal position of the lens and the position where the light emitter is disposed. Under the structure of Cited Document 1, if the position of the lens body 144 in the focal direction is greatly deviated from the position of the light emitter 127, the light distribution characteristics are deteriorated.

  In addition, target light distribution characteristics are often not obtained due to differences in LED structure or LED mounting structure. In such a case, the target distribution according to the LED structure or LED mounting structure is not achieved. It was necessary to prepare individual lens bodies capable of obtaining optical characteristics. Since the lens body is formed by an injection molding method, it is necessary to individually manufacture the mold of the lens body. For this reason, it is necessary to prepare a large number of molds for the lens body, and there is a problem that the cost of the mold becomes very high.

  The present invention has been made in view of the above problems, and is an LED light-emitting device including a lens body that can be used for general purposes without being significantly affected by differences in the structure of the LED and the mounting structure of the LED. The purpose is to find the structure and minimize the mold type to reduce the mold cost, and to obtain the emitted light with the desired light distribution characteristics and to illuminate the illuminating body brightly is there.

As a means for solving the above-mentioned problems, the LED light emitting device according to claim 1 of the present invention is characterized in that a light emitting side of an LED formed by providing a light emitting layer made of a light emitting element and a sealing resin on a substrate. A lens body having a lens surface at the top of the
In the LED light emitting device that mounts the substrate on the motherboard,
A stepped stepped pin provided on the lens body;
The substrate, provided on one of the motherboard or reflective frame, and a plurality of holes,
The focal position of the lens surface is determined by engaging a predetermined pin diameter of the stepped pin and the hole that matches the pin diameter.

  According to the present invention, if the focal position of the lens surface can be varied by providing lens focal position variation means on the substrate and the lens body or on the mother board and the lens body, the focal position of the lens surface and the light emitting layer of the LED can be changed. The positional relationship with the position of can be freely controlled. In other words, by freely controlling the focal position of the lens surface, it becomes possible to increase the amount of emitted light with the light distribution characteristic of condensing in the front direction of the lens surface, and the effect of increasing the luminous intensity in the front direction of the lens. Born. And the illumination body can be illuminated brightly.

The LED light emitting device according to claim 2 of the present invention is characterized in that the reflective frame is provided between the substrate and the lens body, has a mortar-shaped hollow portion, and an inner peripheral surface is a reflective surface. None is characterized in the kite.

  According to the present invention, the outer peripheral area of the light emitting element is surrounded by the reflection frame, and the reflection frame is disposed adjacent to the lens body. The light emitting element is surrounded by the reflecting surface of the reflecting frame, and the lens body is adjacent to the reflecting surface, so that the light incident on the reflecting surface of the reflecting frame by the light emitted from the light emitting element is reflected by the reflecting surface and the lens body. Is incident on the lens surface. The amount of light that is lost is greatly reduced, and the light utilization efficiency is increased, and the amount of light that is collected is increased to increase the luminous intensity.

  According to the present invention, the reflection frame and the lens body have an adjacent arrangement structure, and the substrate and the lens body have an arrangement structure separated by sandwiching the reflection frame. By providing the lens focal point position changing means in the adjacent component parts of the reflecting frame and the lens body instead of the substrate, the structure of the changing means itself is stabilized, and the obtained quality is also stable. In addition, there is an advantage that the structure of the fluctuation means itself can be reduced in size. In addition, it is possible to unitize the reflection frame and the lens body in assembling the LED light-emitting device, thereby producing effects such as quality stability and yield improvement.

According to the invention, consisting of a stepped plurality of stepped pin provided on lenses body, substrate or motherboard to the stepped pin engaging, or a plurality of holes provided in the reflective frame. The focal position of the lens surface is determined by engaging a predetermined pin diameter of the stepped pin with a hole that matches the pin diameter. The stepped pin is simple in shape and can be formed easily because it can be formed integrally with the lens body at the time of injection molding. Further, since the holes provided in the substrate, the mother board, and the reflection frame are simple in shape, they can be easily formed. For example, when the substrate is formed of a MID (Molding Interconnect Device) substrate, it can be integrally formed including the holes. Also when it is provided on the reflection frame, it can be integrally formed including the holes by an injection molding method or the like. In either case, the formation is easy, and the cost can be reduced. In addition, since the focus position is determined by selecting a hole that matches a predetermined pin diameter and engaging the pin with the hole, the working method is simple. Since the structure is simple, a lens focal position variation structure can be obtained at a low cost.

The feature of the LED light-emitting device according to claim 2 of the present invention, the stepped pin, the same shape shape of the stepped portion, in the same dimension stepped pin across the center of the lens surface facing It is characterized by having at least one pair at the positions to be operated.

  According to the present invention, the lens focal position is supported at at least two locations, and the parallelism between the lens body and the substrate, the lens body and the mother board, or the lens body and the reflection frame is maintained. For this reason, the lens focal position does not easily move, and the lens surface of the lens body does not tilt or deviate laterally with respect to the vertical direction of the light emitting layer. Condensing characteristics can be obtained in a stable state at all times.

The LED light emitting device according to claim 4 of the present invention is characterized in that the stepped pins have at least two types of stepped pins having different numbers of stepped portions.

  According to the present invention, there are at least two types of stepped portions having different number of stepped portions. For example, there are two types of stepped pins including a stepped pin having one stepped portion and a stepped pin having two stepped portions. In this case, two lens focus positions are obtained: a position set by a single stepped pin and a position set by a two stepped pin. That is, it is possible to set the lens focal position by changing it to two places. Further, if there are three types with different number of stepped portions, the lens focal position can be changed to three locations. Since the focal position can be changed, a general-purpose lens body can be obtained regardless of the LED structure, the LED mounting structure, and the like.

The LED light emitting device according to claim 5 of the present invention is characterized in that the lens body is directed in a predetermined direction and the stepped pin of the lens body is engaged with the hole of the substrate, the motherboard or the reflection frame. As a result, the first focal position of the lens surface is determined, and the stepped pin of the lens body and the hole of the substrate, the motherboard or the reflection frame are engaged in a direction in which the lens body is rotated 90 ° from a predetermined direction. and it is characterized in the Turkey Kemah second focal point of the lens surface by engaged.

  According to the present invention, two focal positions that can be changed are obtained. Since the amount of change that can be changed is determined by the step size of the step portion, the setting of the amount of change can be freely determined. The lens body can be commonly used for two types having different LED structures and LED mounting structures. Further, when there are two focal positions that can be varied, the number of stepped pins may be small, so that effects such as ease of manufacturing and stability in terms of quality are obtained.

Further, the LED light emitting device according to claim 6 of the present invention is characterized in that the stepped pin of the lens body has three or more types of stepped pins having different numbers of stepped portions, and sequentially forms a predetermined angle in a circular shape. The board, the mother board, or the reflection frame has holes that respectively engage with the three or more stepped pins, and the lens body is stepped in a predetermined direction. By engaging a pin and a hole in the substrate, the motherboard or the reflection frame, a first focal position of the lens surface is determined, and a stepped pin of the lens body is rotated in a direction rotated by a predetermined angle. A second focal position of the lens surface is determined by engaging the hole of the substrate, the motherboard or the reflection frame, and the lens body is sequentially rotated by a predetermined angle to step the pin of the lens body, and the substrate , It is characterized in that the obtained three or more focus positions can vary by engaging the serial motherboard or the reflective frame of holes.

  According to the present invention, a plurality of variable focal positions can be obtained. Fluctuations within a very small range are possible, and it is possible to deal with a wide variety of LED structures and LED mounting structures.

According to a seventh aspect of the present invention, the LED light emitting device is characterized in that at least one of the light emitting elements is mounted on the substrate.

  According to the present invention, even one light emitting element can be applied, and even when a plurality of light emitting elements are used. Increasing the number of light emitting elements increases the amount of emitted light that is collected and emitted from the lens surface, increasing the luminous intensity and increasing the brightness.

  As described above, the operations and effects under the configuration of each invention have been described in detail. However, according to the present invention, the lens body can be used for general purposes without being affected by the structure of the LED or the mounting structure of the LED. Can do. And the effect of the cost reduction of a metal mold | die is produced. In addition, the light condensing characteristic of the lens is enhanced to obtain a bright light emitting device with high luminous intensity. In addition, secondary effects such as inventory reduction can be produced.

  The best mode for carrying out the invention (hereinafter referred to as an embodiment) will be described below with reference to the drawings.

(First embodiment)
Initially, the LED light-emitting device which concerns on 1st Embodiment of this invention is demonstrated using FIGS. 1 is a plan view of the LED light-emitting device according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view of the main part of the LED light-emitting device in FIG. 1, FIG. 3 is a plan view of the LED in FIG. 1 is a rear view of the lens body, FIG. 5 is an explanatory diagram schematically illustrating the operation and effect of the LED light emitting device according to the first embodiment, and FIG. 6 is a cross-sectional view of the main part when the focal position is changed. Is shown.

  As shown in FIG. 2, the LED light emitting device 20-1 according to the first embodiment includes an LED 10 provided with a light emitting layer 5 on a substrate 1, and a convex lens surface provided on the light emitting side (upper surface side) of the LED 10. And a lens body 11 having 12.

  As shown in FIGS. 1 and 4, the lens body 11 has a regular tetragonal shape, and a convex spherical lens surface 12 is provided on the light emitting side surface of the upper surface, and the lower surface (back surface) side. At the four corners, two types of stepped pins including a first stepped pin 13A and a second stepped pin 13B are provided. The first stepped pins 13A have a pair facing each other with the lens surface 12 in between. Similarly, the second stepped pins 13B have a pair facing each other with the lens surface 12 in between. A pair of first stepped pins 13A provided opposite to each other has the same shape and the same dimensions, and a pair of second stepped pins 13B has the same shape and the same dimensions. And two types of stepped pins each consisting of a pair are arranged at the same interval.

As shown in FIG. 2, the first stepped pin 13A is formed from the first step 13a1, the second step 13a2, and the third step 13a3 from the lower surface (back surface) side of the lens body 11. They are connected with different pin diameters and protrude from the lower surface side. On the other hand, the second stepped pin 13B includes a first step portion 13b1 and a second step portion 13b2, and protrudes from the lower surface side with different pin diameters.
The step (length) dimension of the first step 13a1 of the first step pin 13A is the same as the step (length) dimension of the first step 13b1 of the second step pin 13B. In addition, the pin diameter of the third step portion 13a3 of the first stepped pin 13A and the pin diameter of the second step portion 13b2 of the second stepped pin 13B have the same dimensions.

  The lens body 11 provided with the lens surface 12, a pair of first stepped pins 13A, and a pair of second stepped pins 13B is excellent in heat resistance, impact resistance, light resistance, etc., such as acrylic resin and polycarbonate resin. It can be formed by an injection molding method using a transparent resin. Moreover, it can also form with a silicon resin, and the lens body 11 using a silicon resin can obtain a long-life lens body with high long-term reliability.

  Next, the LED 10 has a configuration in which the light emitting layer 5 is provided on the substrate 1, and as shown in FIG. 3, three light emitting elements 6a, 6b, and 6c are mounted on the substrate 1 via an insulating adhesive. Has been. In the first embodiment, the three light emitting elements 6a, 6b, and 6c use white light emitting elements. However, the light emitting elements are not limited to white and may have other light emitting colors. Moreover, you may use the light emitting element of three types of red (R), green (G), and blue (B). When R, G, and B light emitting elements are used, white light emission is obtained by color mixture. The light emitting element is preferably selected according to the specification. In addition, the number of light emitting elements may be set according to the required brightness.

  The substrate 1 is provided with electrodes. Each of the three light emitting elements is provided with an anode electrode for conducting with the anode electrode of the light emitting element and a cathode electrode for conducting with the cathode electrode of the light emitting element. An anode electrode 3A1 and a cathode electrode 3K1 are formed on the light emitting element 6a, and are connected via a bonding wire 7. Similarly, an anode electrode 3A2 and a cathode electrode 3K2 are formed on the light emitting element 6b, and an anode electrode 3A3 and a cathode electrode 3K3 are formed on the light emitting element 6c. And it is connected via the bonding wire 7.

  The three light emitting elements 6a, 6b, 6c connected to the respective electrodes via the bonding wires 7 are sealed with a sealing resin 8. The three light emitting elements 6a, 6b and 6c, the bonding wire 7 and the sealing resin 8 constitute the light emitting layer 5.

The substrate 1 is made of glass epoxy resin, BT resin, or the like. In the first embodiment, the substrate 1 has a regular square shape having the same size as the lens body 11. In addition to the electrodes described above, a pair of holes 2A and 2B are provided at the four corners to face each other. The hole 2A is a hole that engages with the pin diameter of the second step portion 13a2 of the first stepped pin 13A provided in the lens body 11, and has a hole diameter with an appropriate engagement allowance. The hole 2B is a hole that engages with the pin diameter of the second stepped portion 13b2 of the second stepped pin 13B provided in the lens body 11, and has a hole diameter with an appropriate engagement allowance. The hole 2B also engages with the pin diameter of the third step portion 13a3 of the first stepped pin 13A.
Engagement methods such as engagement by adhesion alignment and engagement by fitting can be taken, but from the viewpoint of workability and stability of quality, the engagement method by adhesion alignment is more preferable.
In addition, if the board | substrate 1 is comprised with a MID board | substrate, the hole 2A, 2B can be formed by injection molding.

  Next, assembly of the lens body 11 and the substrate 1 will be described with reference to FIG. The pair of first stepped pins 13 </ b> A of the lens body 11 is engaged with the pair of holes 2 </ b> A of the substrate 1. This is because the pin diameter of the second step portion 13a2 of the first stepped pin 13A is dimensioned to engage with the hole 2A. The pair of second stepped pins 13 </ b> B of the lens body 11 is engaged with the pair of holes 2 </ b> B of the substrate 1. This is because the pin diameter of the second stepped portion 13b2 of the second stepped pin 13B is dimensioned to engage with the hole 2B. Thus, the pair of first stepped pins 13A of the lens body 11 engages with the pair of holes 2A of the substrate 1, and the pair of second stepped pins 13B engages with the pair of holes 2B of the substrate 1. To do. And the lens body 11 and the board | substrate 1 are fixed at four places of four corners.

  The operation and effect of the LED light emitting device having the above configuration will be described with reference to FIG. In FIG. 5, P indicates the focal position of the lens surface 12. In the first embodiment, the focal position P is set so as to be located at the position of the light emitting layer 5. The line indicated by the arrow indicates the path of the emitted light emitted from the focal position P located at the site of the light emitting layer 5. When the light is emitted from the lens surface 12, the light is emitted as a parallel light beam. When the focal position P of the lens surface 12 comes to the site of the light emitting layer 5, the amount of parallel rays emitted from the lens surface 12 increases. And the emitted amount of a parallel ray increases, the luminous intensity in the front direction of the lens surface 12 is raised, brightness increases, and the illumination body (illuminated object) is illuminated brightly.

  Generally, in order to illuminate an illuminating body more brightly, it is necessary to collect a large amount of light on the illuminating body. The method of giving can be taken. In the first embodiment, by bringing the focal position of the lens surface to the site of the light emitting layer, a large amount of parallel light appears, and by increasing the parallel light emitted from the lens surface 12, the luminous intensity is increased and the brightness is increased. To increase.

  The first stepped pin 13A and the second stepped pin 13B provided on the lens body 11 are preferably brought away from the position of the light emitting layer 5, and in that sense, in the first embodiment, The lens body 11 is provided at four corners. The degree of influence of reflected light from the first stepped pin 13A and the second stepped pin 13B is made as small as possible.

  In FIG. 5, h1 indicates the step (length) dimension of the first step 13a1 of the first step pin 13A and the first step 13b1 of the second step pin 13B. The step (length) dimension of 13a1 and the step (length) dimension of step 13b1 are the same. Thereby, the lens body 11 is arranged in parallel with the substrate 1 and the light emitting layer 5, and the center of the lens surface 12 is arranged at the center position of the light emitting layer 5. Since the lens body 11 is arranged in parallel with the light emitting layer 5, the inclination of the lens surface 12 does not occur, normal refraction occurs at the lens surface 12, and parallel light is emitted in the front direction of the lens surface 12. Further, since the center of the lens surface 12 is arranged at the center position of the light emitting layer 5, the amount of light incident on the lens surface 12 is increased, and the light use efficiency is improved.

  The focal position of the lens surface 12 is determined by the radius of curvature of the spherical surface, the refractive index of the material of the lens body 11, and the like. The positional relationship between the focal position of the lens surface 12 and the position of the light emitting layer 5 is related to the step size h1 of the step portion 13a1 and the step portion 13b1 under the structure shown in FIG. The step size h1 is appropriately set in consideration of the structure and processing accuracy of the LED, the amount of fluctuation of the focal length described later, and the like.

  The focal position of the lens surface 12 can be changed by changing the hole of the substrate 1 engaged with the first stepped pin 13A and the second stepped pin of the lens body 11. The state when the focal position is changed will be described with reference to FIG.

  When the lens body 11 shown in FIG. 2 is rotated by 90 °, an arrangement structure of the lens body 11 shown in FIG. 6 is obtained. In FIG. 6, the first stepped pin 13 </ b> A of the lens body 11 is disposed on the hole 2 </ b> B side of the substrate 1, and the second stepped pin 13 </ b> B is disposed on the hole 2 </ b> A side of the substrate 1. The pin diameter of the third step portion 13a3 of the first stepped pin 13A is engaged with the hole 2B of the substrate 1. On the other hand, the second stepped pin 13B on the hole 2A side is in a free state in a floating state because the pin diameter of the second stepped portion 13b is smaller than the hole diameter of the hole 2A.

  However, there are a pair of first stepped pins 13A that engage with the holes 2B of the substrate 1 as shown in FIG. 4, and the holes 2B are also arranged diagonally as shown in FIG. Therefore, the lens body 11 is fixed and supported at two locations diagonally to the substrate 1. For this reason, reliable fixing is obtained by being supported at two places, and the parallelism between the lens body 11 and the substrate 1 and the light emitting layer 5 is maintained.

In FIG. 6, h2 indicates the step (height) dimension of the second step portion 13a2 of the first stepped pin 13A. The focal position P of the lens surface 12 is higher than the structure shown in FIG. 5 by a distance h2 from the light emitting layer 5. When the focal position P is at a position above the light emitting layer 5, a lot of light refracted by the lens surface 12 appears toward the central axis of the lens surface 12. That is, the amount of light collected on the central axis of the lens surface 12 increases. In this case, although the distance relationship with the illuminating body is affected, the brightness of the illuminating body increases when the amount of collected light is condensed on the illuminating body.
Even if the LED has a different structure, outgoing light having light distribution characteristics such as parallel rays and condensed rays can be obtained by appropriately setting the dimension of h2 and setting the focal position.

  The structure shown in FIG. 6 is a structure in the arrangement direction obtained by rotating the lens body 11 just 90 ° with respect to the arrangement direction of the lens body 11 shown in FIG. 2, and the focal position P shown in FIG. Assuming that the focal position is 1, the second focal position P is obtained by rotating the lens body 11 by 90 ° and assembling the lens body 11 and the substrate 1 as shown in FIG. As described above, two focal positions shown in FIGS. 5 and 6 can be obtained by rotating the lens body 11 by 90 ° and assembling the lens body 11 and the substrate 1 together.

  The amount by which the focal position P can be changed is determined by the step size h2 of the second step portion 13a2 of the first stepped pin 13A. The step size h2 is set in consideration of the structure of the LED to be applied, processing accuracy, target light distribution characteristics, and the like.

  As described above, in the first embodiment, the lens body 11 is provided with a pair of two types of stepped pins 13A and 13B, and the substrate 1 has two types of holes that engage with the stepped pins 13A and 13B. By providing 2A and 2B and changing the assembling direction of the lens body 11, the focal position of the lens surface 12 can be varied in two places. That is, the two types of stepped pins 13A and 13B of the lens body 11 and the two types of holes 2A and 2B of the substrate 1 serve as lens focal position changing means that can change the focal position of the lens surface 12.

  In addition, by making the above configuration, the focal position of the lens surface can be changed to two locations, and one type of lens body can be applied to two different structures of LEDs. That is, the lens body can be shared. Therefore, it is not necessary to make two types of lens bodies, and the cost of the lens body molding die can be reduced. In addition, by sharing parts, it is possible to reduce inventory. Furthermore, since the amount of emitted parallel light increases, the luminous intensity in the front direction of the lens surface is increased, and bright illumination is obtained. Further, since the shape of the stepped pin and the shape of the hole are very simple (simple), it is easy to manufacture a mold and parts by injection molding, and stability in terms of quality can be obtained. Further, the assembly of the lens body and the substrate can be performed by a static bonding operation, so that the operation is easy.

In the first embodiment, the LED is configured by using three light emitting elements. However, the number of light emitting elements is not particularly limited to three, and may be one or two, or four or more. It ’s good. When a large number is used, the brightness is increased and the brightness is increased. Further, in the first embodiment, each of the three light emitting elements has a configuration in which an anode electrode and a cathode electrode are provided on the substrate. However, one anode electrode and one cathode electrode are provided. It is also possible to adopt a configuration in which electrodes are shared by taking a parallel connection method.
FIG. 6 shows the engagement structure with the substrate 1 shown in FIG. 5 at a position where the lens body 11 is rotated by 90 °. In the case where an LED having a different structure is used, the first structure is used. A board provided with a hole engaging with the pin diameter of the third stepped portion 13a3 of the stepped pin 13A and a hole engaging with the pin diameter of the second stepped portion 13b2 of the second stepped pin 13B. Use it. That is, since the pin diameter of the third step portion 13a3 of the first stepped pin 13A and the pin diameter of the second step portion 13b2 of the second stepped pin 13B are the same size, A substrate provided with holes at four corners may be used. By fixing the substrate and the lens body 11 at the four corners, a stable engagement structure having a stronger fixing force than that shown in FIG. 6 can be obtained.

(Second Embodiment)
Next, an LED light emitting device according to a second embodiment of the present invention will be described with reference to FIG. In addition, FIG. 7 has shown principal part sectional drawing of the LED light-emitting device based on 2nd Embodiment of this invention. The LED light-emitting device of 2nd Embodiment makes the structure which provided the reflective frame in the LED light-emitting device 20-1 of 1st Embodiment mentioned above.
In FIG. 7, components having the same specifications as the components in the first embodiment are denoted by the same reference numerals. From FIG. 7, the LED light emitting device 20-2 of the second embodiment has a ring-shaped reflection having a reflecting surface 15 </ b> C having a tapered slope so as to surround the light emitting layer 5 between the lens body 11 and the substrate 1. A frame 15 is provided. The lens body 11 is disposed on the upper side of the reflection frame 15 and fixed to the substrate 1.
Since the lens body 11, the substrate 1, and the like have been described in detail in the first embodiment, description thereof will be omitted here, and the description will be made mainly with the reflection frame 15.

The reflection frame 15 in the second embodiment has a ring shape with a mortar-shaped hollow portion 15D at the center, and the inner peripheral surface has a reflection surface 15C having a tapered slope.
The reflective frame 15 is formed by an injection molding method using a resin having excellent heat resistance, impact resistance, light resistance, moisture resistance, chemical resistance, such as acrylic resin, polycarbonate resin, polyethylene terephthalate resin, and the like on the inner peripheral surface. Is provided with a highly reflective metal film such as Al or Ag to finish the reflective surface 15C with a high reflectance.
The reflection frame 15 is bonded and fixed to the substrate 1 with an insulating adhesive or the like.

  The light emitting layer 5 of the LED 10 is disposed in the center of the hollow portion 15D. The reflection frame 15 has a function of causing the light emitted from the light emitting layer 5 to be incident on the reflection frame 15 and the light reflected from the lens body 11 to be reflected on the reflection surface 15 </ b> C and incident on the lens body 11.

  By providing the reflection frame 15, the amount of emitted light emitted in the front direction of the lens surface 12 is increased in each stage, and the effect of increasing the brightness by increasing the light use efficiency is obtained.

(Third embodiment)
Next, an LED light-emitting device according to a third embodiment of the present invention will be described with reference to FIGS. 8 is a plan view of the LED light-emitting device according to the third embodiment of the present invention, FIG. 9 is a cross-sectional view taken along the line BB in FIG. 8, FIG. 10 is a cross-sectional view taken along the line CC in FIG. ) Is a rear view of the lens body, FIG. 11B is a plan view of the reflecting frame, and FIG. 12 is a cross-sectional view of the main part when the focal position is changed.

  As shown in FIG. 10, the LED light emitting device 40 according to the third embodiment includes an LED 30 provided with a light emitting layer 25 on a substrate 21, and a mortar-shaped hollow portion 35 </ b> D disposed on the outer periphery of the light emitting layer 25. Thus, the inner peripheral surface is constituted by a reflecting frame 35 having a reflecting surface 35C, and a lens body 31 having a convex spherical lens surface 32 provided on the upper portion of the reflecting frame 35.

  The lens body 31 has a regular tetragonal shape as shown in FIGS. 8, 10 and 11A, and has a convex spherical lens surface 32 on the light emitting side on the upper surface side. The first stepped pins 33A and the second stepped pins 33B are provided at the same interval along the four outer sides on the back surface (lower surface) side. The first stepped pins 33A have a pair (two in total) opposed diagonally across the lens surface 32, and the second stepped pins 33B also faced across the lens surface 32 in three pairs ( There are a total of 6). A pair of first stepped pins 33A provided facing each other has the same shape and the same dimensions, and similarly, three pairs of second stepped pins 33B provided facing each other have the same shape and the same. It has dimensions.

  As shown in FIG. 9, the first stepped pin 33 </ b> A has three steps: a first step 33 a 1, a second step 33 a 2, and a third step 33 a 3. It has a connected shape with different pin diameters. On the other hand, the second stepped pin 33B has a shape having a first step 33b1 and a second step 33b2. The first step 33a1 of the first stepped pin 33A and the first step 33b1 of the second stepped pin 33B have the same step (length) size. The pin diameter of the third step portion 33a3 of the first stepped pin 33A and the pin diameter of the second step portion 33b2 of the second stepped pin 33B are the same. The first stepped pin 33A and the second stepped pin 33B are integrally formed when the lens body 31 is molded by injection molding.

The LED 30 has a configuration in which a light emitting layer 25 is provided on a substrate 21. The light emitting layer 25 in the third embodiment is formed of the same specifications as the light emitting layer of the first embodiment described above. That is, three light emitting elements emitting white light are mounted on the substrate 21 via an insulating adhesive, and the substrate 21 includes anode electrodes for the light emitting elements, anode electrodes connected to the cathode electrodes, and cathode electrodes. Three pairs are provided, each connected to an electrode via three light emitting elements and bonding wires. And three light emitting elements are sealed with sealing resin.
The light emitting layer 25 is disposed so as to be positioned at the center of the mortar-shaped hollow portion 35D of the reflection frame 35.

The reflection frame 35 is formed by an injection molding method with a resin having excellent heat resistance, impact resistance, light resistance, moisture resistance, chemical resistance and the like such as acrylic resin, polycarbonate resin, and polyethylene terephthalate resin. As shown in FIG. 11 (b), a mortar-shaped hollow portion 35D is provided at the center portion, and the inner peripheral surface is finished to a reflective surface 35C having a high reflectivity. Further, along the four outer sides, two types of holes 35A and 35B having different hole diameters are provided at the same positions as the first stepped pin 33A and the second stepped pin 33B provided on the lens body 31. .
There are a pair (two in total) of the holes 35A facing two diagonal corners, and three pairs (total of six) of the holes 35B are provided. The hole 35A is a hole that engages with the pin diameter of the second stepped portion 33a2 of the first stepped pin 33A of the lens body 31 with an appropriate engagement margin, and the hole 35B is 2 of the second stepped pin 33B. It is a hole that engages with the pin diameter of the stepped portion 33b2 with an appropriate engagement allowance. Further, the hole 35B engages with the pin diameter of the third step portion 33a3 of the first stepped pin 33A with an appropriate engagement allowance.
The reflection frame 35 is fixed on the substrate 21 via an insulating adhesive.

  In the third embodiment, the lens body 31 is assembled and fixed to the reflection frame 35. As shown in FIG. 9, the lens body 31 and the reflection frame 35 are fixed by engaging the first stepped pin 33A and the hole 35A with the pin diameter of the second stepped portion 33a2 and the hole 35A. The second stepped pin 33B and the hole 35B are fixed by engaging the pin diameter of the second stepped portion 33b2 and the hole 35B. That is, all the eight stepped pins are engaged with the holes. At this time, although not shown, the focal position of the lens surface 32 of the lens body 31 is structured to be located at or near the light emitting layer 25. By adopting an arrangement structure in which the focal position of the lens surface 32 is positioned at or near the light emitting layer 25, the emitted light of parallel rays from the lens surface 32 is increased.

  By making such a structure, the light reflected by the reflecting surface of the reflecting frame 35 enters the lens surface 32, so that the light use efficiency is further enhanced. And since the light quantity of the parallel light rays radiate | emitted from the lens surface 32 also increases, illumination still brighter than the illumination brightness in the above-mentioned 1st Embodiment is obtained.

  The focal position of the lens surface 32 can be changed by changing the hole of the reflection frame 35 engaged with the first stepped pin 33A and the second stepped pin 33B of the lens body 31. FIG. 12 shows a structure in which the lens body 31 is rotated by 90 ° and the lens body 31 and the reflection frame 35 are engaged. That is, the structure of the lens body 31 shown in FIG. 9 at the same location as in FIG. 9 when only the lens body 31 is rotated in the 90 ° direction and engaged with the reflection frame 35 is shown.

  In FIG. 12, when the lens body 31 is rotated by 90 °, the position of the first stepped pin 33A comes to the position of the hole 35B on the left side in the drawing. Then, the pin diameter of the third step 33a3 is engaged with the hole 35B. The second stepped pin 33B comes in the center hole 35B in the figure. Since the hole 35B is a hole in which the pin diameter of the second stepped portion 33b2 of the second stepped pin 33B is engaged, it engages with the pin of the stepped portion 33b2 partially inserted. The second stepped pin 33B comes at the position of the right hole 35A in the drawing. The hole 35A has a diameter that engages with the pin diameter of the second stepped portion 33a2 of the first stepped pin 33A, so that the hole is larger than the pin diameter of the second stepped portion 33b2 of the second stepped pin 33B. It has become. For this reason, the second stepped portion 33b2 of the second stepped pin 33B is arranged in a free state floating in the air without being held in the hole 35A.

  From the above, the engagement position between the lens body 31 and the reflection frame 35 is the same as that of the structure of FIG. 9 by the step size of the second step portion 33a2 of the first step pin 33A, and the reflection frame 35. The lens body 31 is fixedly supported by the reflection frame 35. Although there are six engagement points between the stepped pin and the hole, the lens body 31 is in a parallel state since it is closely and closely engaged at two positions on the diagonal of the pair of first stepped pins 33A. Stable fixation is performed.

  Further, compared with the structure of FIG. 9, the lens body 31 is fixed at a position raised upward from the reflection frame 35 by the step size of the second step portion 33a2 of the first stepped pin 33A. Although not shown, the focal position of the lens surface 32 moves upward by the step size of the step portion 33a2. That is, assuming that the focal position of the lens surface 32 in the structure of FIG. 9 is the first focal position, the second focal position of the lens surface 32 at the position where the lens body 31 is assembled by rotating 90 ° is the first focal position. The position fluctuates upward from the focal position by the step size of the step portion 33a2.

  In the third embodiment, the reflecting frame 35 is provided and the reflecting frame 35 and the lens body 31 are engaged with each other. Reflected light from the reflection surface of the reflection frame 35 enters the lens body 31, refracts at the lens surface 32, and is condensed and emitted. Since the reflecting frame 35 and the lens body 31 are close to each other, most of the reflected light from the reflecting surface is incident on the lens surface 32, so that the amount of light lost is reduced and the light utilization efficiency is increased. In addition, the amount of parallel light is increased and the brightness of the illumination is increased.

  Moreover, the manufacturing method of LED light-emitting device 40 in 3rd Embodiment can take the following two methods. The first method is a method of assembling and fixing the lens body 31 by engaging and fixing the lens body 31 to the reflection frame 35 attached and fixed to the substrate 21 of the LED 30. The second method is a method of pasting and fixing the reflection frame 35, which has the lens body 31 engaged and fixed in advance, to the substrate 21 of the LED 30. From the viewpoint of quality such as the parallelism of the lens body 31 and workability, it can be said that the second method is preferable to the first method. That is, the lens body 31 is assembled to the reflection frame 35 to form a unit, and the unit is attached to the LED 30 to form the LED light-emitting device 40. Thus, it is possible to produce effects such as ease of work and improved yield. .

  In addition, even when the focal position is changed, the engagement structure at six positions can be taken, and stable and strong fixation can be obtained. In the third embodiment, two first stepped pins 33A and six second stepped pins 33B have a total of eight engaging structures. Thus, there is no problem even if the structure has four stepped pins.

  In the third embodiment, the two types of stepped pins 33A and 33B of the lens body 31 and the two types of holes 35A and 35B of the reflection frame 35 that engage with the two types of stepped pins make the lens body 31 90 °. By rotating and changing the assembling position, the focal position fluctuates and two positions are obtained. That is, it functions as a lens focal position changing means for changing the focal position of the lens surface 32.

(Fourth embodiment)
Next, an LED light-emitting device according to a fourth embodiment of the present invention will be described with reference to FIGS. 13 is a cross-sectional view of the main part of the LED light emitting device according to the third embodiment of the present invention, and FIG. 14 is a plan view of the main part of the motherboard in FIG. FIG. 15 is a cross-sectional view of the main part of an application example of the fourth embodiment applied to the structure of another light emitting device by changing the assembly position of the lens body shown in FIG.

  In the LED light emitting device 60 of the fourth embodiment, as shown in FIG. 13, the LED 50 composed of the substrate 41 and the light emitting layer 45 is attached to the lower surface 57E side of the motherboard 57 provided with the opening holes 57C. A lens body 51 having a convex spherical lens surface 52 is attached. The light emitting layer 45 of the LED 50 is arranged at the center of the opening hole 57C of the mother board 57, and the lens surface 52 of the lens body 51 is arranged above the opening hole 57C, that is, above the light emitting layer 45. . The board 41 and the mother board 57 are attached via soldering or the like. The lens body 51 and the mother board 57 are attached by engaging the first stepped pins 53A and the second stepped pins 53B provided on the lens body 51 with the holes 57A and 57B provided on the mother board 57. It is fixed.

  The central portion of the light emitting layer 45 is disposed substantially at the central portion of the opening hole 57 </ b> C, and the central portion of the light emitting layer 45 is disposed on the axis of the central portion of the lens surface 52. Further, the focal position of the lens surface 52 having a convex spherical shape is located at the position of the light emitting layer 45 or in the vicinity thereof.

The lens body 51 has a configuration similar to the configuration of the lens body in the first embodiment described above. That is, it has a square shape and has a lens surface 52 that is a convex spherical surface on the light exit surface side. Further, a pair of first stepped pins 53A are diagonally opposed to the four corners on the back side (lower surface side), and similarly, a pair of second stepped pins 53B are diagonally opposed. Have.
The stepped pin 53A includes a first step 53a1, a second step 53a2, and a third step 53a3. The second stepped pin 53B includes a first step portion 53b1 and a second step portion 53b2.
The pin diameter of the third step portion 53a3 of the first stepped pin 53A here is the same as the pin diameter of the second step portion 53b2 of the second stepped pin 53B. Further, the step (length) dimensions of the first step 53a1 of the first stepped pin 53A and the first step 53b1 of the second stepped pin 53B are the same.

  Next, as shown in FIG. 14, the mother board 57 is provided with opening holes 57C in which the light emitting layer 45 of the LED 50 is disposed, and a pair of holes 57A and four holes around the opening hole 57C are formed in a regular square shape. A pair of holes 57B are provided. The pair of holes 57A are holes through which the pin diameter of the second stepped portion 53a2 of the first stepped pin 53A engages, and the pair of holes 57B are the second stepped portion 53b2 of the second stepped pin 53B. The pin diameter is a hole that engages. The hole 57B is also a hole in which the pin diameter of the third step portion 53a3 of the first stepped pin 53A can be engaged.

  In FIG. 13, the pin diameter of the second stepped portion 53b2 of the pair of first stepped pins 53A of the lens body 51 engages with the pair of holes 57A of the mother board 57, and a pair of second stepped pins 53B. The lens portion 51 is assembled and fixed to the mother board 57 by engaging the pin diameter of the second step portion 53b2 with the pair of holes 57B. In FIG. 13, P indicates the focal position of the lens surface 52. In a state in which the lens body 51 is fixed to the mother board 57, the focal position P of the lens surface 52 is located at a position of the light emitting layer 45 or a position in the vicinity thereof.

In the fourth embodiment, the light emitting layer 45 has the same specifications as the light emitting layer used in the first embodiment. In the LED light emitting device 60 having the above-described configuration, since the focal position of the lens surface 52 is at or near the position of the light emitting layer 45, the amount of parallel light emitted from the lens surface 52 increases, and the lens The brightness in the front direction of the surface 12 is increased and the brightness is increased.
In the case where the lens body 51 cannot be disposed on the LED, the same effect as that of the structure disposed on the LED can be obtained by adopting the above structure.

  Next, as an application of the fourth embodiment, an application example applied to the structure of another light emitting device by changing the assembly position of the lens body 51 will be described with reference to FIG. In the LED light emitting device 80 shown in FIG. 15, an LED 70 including a substrate 61 and a light emitting layer 65 is provided on the upper surface side of a motherboard 77. The motherboard 77 is provided with a lens body 51. The lens body 51 here is assembled to the mother board 77 by rotating the lens body 51 shown in FIG.

The motherboard 77 corresponds to the pair of first stepped pins 53A and the pair of second stepped pins 53B that are located away from the LEDs 70 and before the lens body 51 is rotated in the 90 ° direction. A pair of holes 77A and 77B are provided at the positions.
Here, when the lens body 51 is rotated by 90 °, the first stepped pin 53A of the lens body 51 comes to the hole 77B. Further, the second stepped pin 53B comes at the hole 77A.
The pin diameter of the third step portion 53a3 of the first stepped pin 53A of the lens body 51 is engaged with the hole 77B.
On the other hand, the second stepped pin 53B comes to the portion of the hole 77A. Since the pin diameter of the second stepped portion 53b2 of the second stepped pin 53B is smaller than the hole diameter of the hole 77A, the second stepped pin 53B is provided. The attached pin 53B is not held in the hole 77A and is in a free state.
The pin diameter of the third stepped portion 53a3 of the first stepped pin 53A of the lens body 51 is engaged with the hole 77B. Since this hole 77B has a pair at two locations facing each other, two holes are provided. The pair of first stepped pins 53A of the lens body 51A is fixed to the mother board 77 by 77B. By supporting and fixing the lens body 51 at two locations, the lens body 51 is maintained in parallel with the mother board 77 and the light emitting layer 65 provided on the substrate 61 is also maintained in parallel.
The motherboard 77 shown in FIG. 15 has a pair of holes 77A and 77B, but has four holes 77B and a pair of first stepped pins 53A and a pair of first holes 77B. A structure for engaging the two stepped pins 53B may be adopted. When fixed at four places, a stronger support structure for the lens body 51 is obtained.

  In FIG. 15, P indicates the focal position of the lens surface 52. The focal position P of the lens surface 52 in the structure shown in FIG. 15 is different from the focal position P of the lens surface 52 in the structure shown in FIG. 13 in the stepped portion 53a2 of the second stepped portion 53a2 of the first stepped pin 53A. The position fluctuates upward by the (length) dimension. Even if the LED is arranged on the upper surface side of the mother board, the lens as shown in FIG. 15 is set by setting the step (length) dimension of the second step portion 53a2 of the first stepped pin 53A. The focal position of the surface can be brought to the position of the light emitting layer or a position in the vicinity thereof.

  As described above, the focal position can be changed by setting the step (length) dimension of the second step 53a2 to an appropriate value even if the LED mounting structure is different. It is possible to use the lens body in common. Further, since it is not necessary to newly provide a lens body, the mold cost can be reduced. In addition, secondary effects such as shortened delivery time and inventory reduction are also produced.

  Further, in the structure of FIG. 15, it is possible to adopt a structure in which the ring-shaped reflection frame described in the second embodiment is disposed between the LED 70 and the lens body 51.

(Fifth embodiment)
Next, an LED light-emitting device according to a fifth embodiment of the present invention will be described with reference to FIGS. 16 is a plan view of an LED light emitting device according to a fifth embodiment of the present invention, FIG. 17 is a cross-sectional view of the main part of the LED light emitting device in FIG. 16, and FIG. 18 is a rear view of the lens body in FIG. FIG. 18A is a plan view of the lens body, and FIG. 18B is a plan view of the substrate. 19 is a cross-sectional view of the main part when the position of the lens body in FIG. 16 is rotated by 30 °, and FIG. 20 is the main part when the position of the lens body in FIG. FIG.

  First, the LED light emitting device 100 according to the fifth embodiment includes an LED 90 formed by providing a light emitting layer 85 on a rectangular substrate 81 and a lens body 91 provided on the LED 90. Then, as shown in FIG. 16, the lens body 91 here has a circular shape and is assembled to a square substrate 81 of the LED 90.

As shown in FIG. 17, the lens body 91 has a convex spherical lens surface 92 on the light emitting surface side which is the upper surface side. Further, on the back surface (lower surface) side, as shown in the back view of FIG. 18A, the first stepped pin 93A, the second stepped pin 93B, and the third stepped pin along the outer periphery. The three types of stepped pins 93C are clockwise (the order in which the first stepped pin 93A, the second stepped pin 93B, and the third stepped pin 93C are arranged is a clock when viewed from the back side of the lens body 91. Although they are arranged around, they are arranged counterclockwise when viewed from the light exit side of the lens body 91). There are a total of four first stepped pins 93A facing each other across the lens surface 92. Similarly, the second stepped pins 93B are also facing two pairs, and the third stepped pins 93C are also There are two pairs facing each other.

As shown in FIG. 17, the first stepped pin 93 </ b> A is a four-stepped stepped pin, a first stepped portion 93 a 1, a second stepped portion 93 a 2, a third stepped portion 93 a 3, A fourth step 93a4 is provided, and each step has a different pin diameter.
The second stepped pin 93B is a three-stepped stepped pin having a first stepped portion 93b1, a second stepped portion 93b2, and a third stepped portion 93b3. Each step has a different pin diameter.
The third stepped pin 93C is a two-stepped stepped pin having a first stepped portion 93c1 and a second stepped portion 93c2, and each stepped portion has a different pin diameter. I am doing.

The first stepped portions 93a1, 93b1, and 93c1 of the first stepped pins 93A, the second stepped pins 93B, and the third stepped pins 93C have the same step size (stepped portion length). The first stepped pin 93A has a step size up to the second step portion 93a2 (the step size of the first step portion 93a1 and the step size of the second step portion 93a2 are added). Is the same step size as the second stepped portion 93b2 of the second stepped pin 93B.
In addition, the pin diameter of the third stepped portion 93a3 of the first stepped pin 93A is the same as the pin diameter of the second stepped portion 93b2 of the second stepped pin 93B. The pin diameter of the fourth stepped portion 93a4 of the pin 93A, the pin diameter of the third stepped portion 93b3 of the second stepped pin 93B, and the second stepped portion 93c2 of the third stepped pin 93C. The pin diameter is the same.

On the other hand, on the substrate 81 of the LED 90 having the light emitting layer 85, as shown in FIG. 18B, the first stepped pin 93A, the second stepped pin 93B, and the third step of the lens body 91 are provided. Three types of holes 82A, 82B, and 82C that engage with the attached pins 93C are sequentially provided at 30 ° angular intervals counterclockwise.
The hole 82A is engaged (fitted) with the pin diameter of the second stepped portion 93a2 of the first stepped pin 93A with an appropriate engagement allowance.
Further, the hole 82B engages (fits) with the pin diameter of the second stepped portion 93b2 of the second stepped pin 93B with an appropriate engagement allowance. The hole 82B also engages with the pin diameter of the third stepped portion 93a3 of the first stepped pin 93A.
The hole 82C engages (fits) with the pin diameter of the second stepped portion 93c2 of the third stepped pin 93C with an appropriate engagement allowance. The hole 82C also engages with the pin diameter of the fourth stepped portion 93a4 of the first stepped pin 93A and the pin diameter of the third stepped portion 93b3 of the second stepped pin 93B.

  As shown in FIG. 17, the lens body 91 and the substrate 81 configured as described above have the first stepped pin 93A of the lens body 91 in the hole 82A of the substrate 81 and the second stepped pin 93B in the hole 82B. In addition, the third stepped pin 93C is engaged with the hole 82C, and all the 12 stepped pins and holes are engaged and fixed. The lens body 91 is supported by the substrate 81 while maintaining parallelism with the substrate 81.

  And the focal position of the lens surface 92 of the lens body 91 is the first stepped portion 93a1, 93b1, each of the first stepped pin 93A, the second stepped pin 93B, and the third stepped pin 93C. By setting the step size of 93c1, it is set to a position where a desired light distribution characteristic can be obtained.

  In the LED light emitting device 100 having the above-described configuration, the focal position of the lens surface 92 is changed by assembling the substrate 81 and the lens body 91 by changing the position of the stepped pin of the lens body 91 that engages with the hole of the substrate 81. Can be made. When the focal position of the lens surface 92 in the engagement structure of the stepped pin and the hole shown in FIG. 17 is the first focal position, the position of the stepped pin of the lens body 91 that engages with the hole of the substrate 81 is shown in FIG. By changing as shown in FIG. 20, the second focal position and the third focal position can be obtained.

  In the assembly structure of the lens body 91 and the substrate 81 shown in FIG. 19, the substrate 81 is left as it is, the lens body 91 at the position shown in FIG. 17 is rotated by 30 °, and the substrate 81 is rotated at 30 °. The structure assembled is shown. Since the three types of stepped pins of the lens body 91 and the three types of holes of the substrate 81 are provided at 30 ° angular intervals, 30 ° is a predetermined angle for rotation.

When the lens body 91 is rotated 30 ° from the position shown in FIG. 17, the first stepped pin 93 </ b> A of the lens body 91 comes to the position of the hole 82 </ b> B of the substrate 81 as shown in FIG. 19. Further, the second stepped pin 93B comes to the position of the hole 82C, and the third stepped pin 93C comes to the position of the hole 82A.
In the first stepped pin 93A, the pin diameter of the third stepped portion 93a3 is engaged with the hole 82B. The second stepped pin 93B is engaged with the hole 82C in the pin diameter of the third stepped portion 93b3. Since the pin diameter of the second stepped portion 93c2 is smaller than the hole 82A, the third stepped pin 93C is in a free state in which it floats without being engaged.
Thus, the first stepped pin 93A and the hole 82B are engaged, and the second stepped pin 93B and the hole 82C are engaged. Since there are two pairs of the first stepped pins 93A and the second stepped pins 93B, the engagement at a total of eight points can be obtained.
Since the step size to the second step portion 93a2 of the first stepped pin 93A and the step size to the second step portion 93b2 of the second stepped pin 93B are the same size. The parallelism of the lens body 91 is maintained. Further, the fixing strength is also maintained by the fixing support at eight places.

  The second focal position of the lens surface in the case where the above-described assembly structure at the position where the lens body 91 is rotated by 30 ° is compared with the first focal position in the assembly structure of FIG. The focal position is raised upward by the step size of the second stepped portion 93a2 of the stepped pin 93A (this is the same as the stepped size of the second stepped portion 93b2 of the second stepped pin 93B). fluctuate.

  Next, in the assembly structure of the lens body 91 and the substrate 81 shown in FIG. 20, the lens body 91 is further rotated by 30 ° from the position shown in FIG. The structure assembled | attached with the board | substrate 81 in the shown position is shown.

When the lens body 91 is further rotated by 30 ° from the position shown in FIG. 19, the first stepped pin 93 </ b> A of the lens body 91 comes to the position of the hole 82 </ b> C of the substrate 81 as shown in FIG. 20. Further, the second stepped pin 93B comes to the position of the hole 82A, and the third stepped pin 93C comes to the position of the hole 82B.
In the first stepped pin 93A, the pin diameter of the fourth stepped portion 93a4 is engaged with the hole 82C. The pin diameter of the third stepped portion 93b3 of the second stepped pin 93B is smaller than the hole 82A, and the pin diameter of the second stepped portion 93c2 of the third stepped pin 93C is smaller than the hole 82B. , A free state of floating without engaging.
Thus, only the first stepped pin 93A engages with the hole 82C. Since there are two pairs of the first stepped pins 93A, engagement and fixing at four positions at 90 ° intervals can be obtained.
The parallelism and fixing strength of the lens body 91 are held by engaging and fixing at four locations.

  The third focal position of the lens surface when the lens body 91 is further rotated by 30 ° in the assembly structure shown in FIG. 20 is compared with the second focal position in the assembly structure of FIG. The focal position fluctuates upward by the step size of the third step portion 93a3 of the first stepped pin 93A.

17, 19, and 20, the focal position of the lens surface 92 can be changed to three locations by rotating the lens body 91 from a predetermined position twice by 30 ° twice and assembling with the substrate 81. explained.
The variation in the focal position of the lens surface 92 can be further increased by further increasing the number of stepped pins having different shapes of the lens body 91.

  And it becomes possible to respond | correspond with several types of LED from which a structure differs with one type of lens body. It is not necessary to provide a lens body for each LED having a different structure, and the cost reduction effect of the mold can be obtained. In addition, secondary effects such as shortening of work number and inventory reduction can be obtained.

  In the fifth embodiment, the structure for assembling the lens body and the substrate is shown. However, as shown in the third embodiment, the structure for assembling the reflecting frame and the lens body using the reflecting frame is shown. Alternatively, as shown in the above-described fourth embodiment, a structure for assembling with a mother board may be taken.

  As described above, the lens surface of the lens body is described as a convex spherical lens from the first embodiment to the fifth embodiment, but the present invention can be similarly applied even when a Fresnel lens is used as the lens body. When a Fresnel lens is used, an effect of reducing the thickness can be obtained.

It is a top view of the LED light-emitting device which concerns on 1st Embodiment of this invention. It is principal part sectional drawing of the LED light-emitting device in FIG. It is a top view of LED in FIG. It is a reverse view of the lens body in FIG. It is explanatory drawing shown typically which demonstrates the effect | action and effect of the LED light-emitting device which concerns on 1st Embodiment. It is principal part sectional drawing when a focus position is changed. It is principal part sectional drawing of the LED light-emitting device which concerns on 2nd Embodiment of this invention. It is a top view of the LED light-emitting device which concerns on 3rd Embodiment of this invention. It is BB sectional drawing in FIG. It is CC sectional drawing in FIG. FIG. 11A is a rear view of the lens body and FIG. 11B is a plan view of the reflection frame. The principal part sectional drawing when changing a focus position is shown. It is principal part sectional drawing of the LED light-emitting device which concerns on 3rd Embodiment of this invention. It is a principal part top view of the motherboard in FIG. It is principal part sectional drawing of the application example of 3rd Embodiment applied to the structure of another light-emitting device by changing the assembly position of the lens body shown in FIG. It is a top view of the LED light-emitting device which concerns on 5th Embodiment of this invention. It is principal part sectional drawing of the LED light-emitting device in FIG. FIG. 18A is a rear view of the lens body and FIG. 18B is a plan view of the substrate. It is principal part sectional drawing when the position of the lens body in FIG. 16 is rotated 30 degrees and assembled | attached. It is principal part sectional drawing when the position of the lens body in FIG. 19 is further rotated 30 degrees, and it assembled | attached. It is principal part sectional drawing of the LED lamp shown by patent document 1 as a prior art. It is a top view of the light-emitting body mounted in the circuit board in FIG.

Explanation of symbols

1, 21, 41, 61, 81 Substrate 2A, 2B, 35A, 35B, 57A, 57B, 77A, 77B, 82A, 82B, 82C Hole 3A1, 3A2, 3A3 Anode electrode 3K1, 3K2, 3K3 Cathode electrode 5, 25, 45, 65, 85 Light emitting layer 6a, 6b, 6c Light emitting element 7 Bonding wire 8 Sealing resin 10, 30, 50, 70, 90 LED
11, 31, 51, 91 Lens bodies 12, 32, 52, 92 Lens surfaces 13A, 33A, 53A, 93A First stepped pins 13B, 33B, 53B, 93B Second stepped pins 93C Third stepped Pins 13a1, 13b1, 33a1, 33b1, 53a1, 53b1, 93a1, 93b1, 93c1 First step 13a2, 13b2, 33a2, 33b2, 53a2, 53b2, 93a2, 93b2, 93c2 Second step 13a3, 33a3 , 53a3, 93a3, 93b3 Third step portion 93a4 Fourth step portion 15, 35 Reflective frame 15C, 35C Reflective surface 15D, 35D Hollow portion 20-1, 20-2, 40, 60, 80, 100 LED Light emitting device 57, 77 Mother board 57C Open hole 57D Upper surface 57E Lower surface

Claims (7)

Provided with a lens body having a lens surface on the light emitting side of an LED formed by providing a light emitting layer made of a light emitting element and a sealing resin on a substrate,
In the LED light emitting device that mounts the substrate on the motherboard,
A stepped stepped pin provided on the lens body;
The substrate, provided on one of the motherboard or reflective frame, and a plurality of holes,
The LED light-emitting device, wherein a focal position of the lens surface is determined by engaging a predetermined pin diameter of the stepped pin and the hole that matches the pin diameter.
The reflection frame is provided between the lens body and the substrate, LED light-emitting device according to claim 1, the inner peripheral surface has a conical hollow portion and wherein the kite forms a reflective surface. The stepped pin, the same shape shape of the stepped portion, LED light emission according to claim 1 or 2, characterized in that it comprises at least a pair in positions of the same size are opposed across the center of the lens surface apparatus. The LED light emitting device according to claim 1 or 3 , wherein the stepped pins include at least two types of stepped pins having different numbers of stepped portions. A first focal position of the lens surface is determined by engaging a stepped pin of the lens body with a hole of the substrate, the mother board or the reflecting frame with the lens body facing a predetermined direction, and the lens body is a stepped pin of said lens body at 90 ° rotated direction from a predetermined direction, said substrate, and Turkey Kemah second focal point of the lens surface by engaging the motherboard or the reflective frame of holes The LED light-emitting device according to claim 1 , wherein the LED light-emitting device is a light-emitting device. The lens body has three or more stepped pins with different number of stepped portions, and is sequentially arranged in a circular shape at a predetermined angle, and the substrate, the motherboard or the reflection frame has the three types of stepped pins. By having a hole that engages with each of the above stepped pins, the stepped pin of the lens body and the hole of the substrate, the mother board, or the reflecting frame are engaged with the lens body facing a predetermined direction. A first focal position of the lens surface is determined, and the lens body is engaged with a stepped pin of the lens body and a hole of the substrate, the motherboard or the reflection frame in a direction rotated by a predetermined angle. The second focal position of the surface is determined, and the lens body is sequentially rotated by a predetermined angle to engage the stepped pin of the lens body with the hole of the substrate, the motherboard or the reflection frame. LED light-emitting device according to any one of claims 1 to 5, characterized in that dynamic can focus position is obtained 3 or more. The light emitting device LED light emitting device according to any one of claims 1 to 6, characterized in that at least one mounted on the substrate.

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