JP5392693B2 - Test contact - Google Patents

Description

  The present invention relates to a test contact for accurately inspecting electrical characteristics (voltage, current, resistance, frequency, etc.) of an electronic component such as a semiconductor component.

  After many semiconductor parts are created on a Si wafer in a process called a pre-process, they are separated into individual pieces in a process called a post-process, and have undergone processes such as electrical property inspection, property classification, marking, and appearance inspection. After that, they are packed in a tape or container tube and shipped.

  Such semiconductor components are held by a holding mechanism and conveyed by a conveyance mechanism in a process after being separated into individual pieces, and various processes are performed in each process processing unit provided along the conveyance path. The

  Among such process processes, in electrical characteristic inspection for measuring and inspecting the voltage, current, resistance or frequency of a semiconductor component, a plate-like metal (hereinafter referred to as “contact”) is brought into contact with the electrode of the semiconductor component. There are a method of performing (see Patent Document 1) and a method of performing by inserting a semiconductor component into a socket (see Patent Document 2).

  In the method of performing electrical inspection by contacting a contact with an electrode of a semiconductor component, the electrode part of the semiconductor component is usually covered with an oxidized insulating film. Make contact with the exposed part. In order to expose the conductive portion, it is necessary to move the contact and destroy the insulating film when the semiconductor component hits the contact.

On the other hand, in the technique of inserting a semiconductor component into a socket and conducting an electrical inspection, bent plates are arranged inside the socket, and a cushioning material is attached to make contact with the conductor of the substrate.
JP 2001-345359 A JP 7-5229 A

  By the way, in the method of performing electrical inspection by bringing a contact into contact with an electrode of a semiconductor component, such a contact is simply obtained by arranging the contacts horizontally or vertically as shown in the horizontal contact in FIG. 5 or the laminated contact in FIG. Since the metal does not move even when pressed against the semiconductor component, the insulating film cannot be destroyed.

  In the method of conducting electrical inspection by inserting a semiconductor component into a socket, a socket and a buffer material are provided and contacts are arranged vertically and pressed against the conductor of the substrate. Since the conductor of the wire is thin, it is damaged and cannot be inspected.

  Furthermore, lead-free solder components are progressing based on recent environmental protection measures, but lead-free components have a high tin content. Such oxidation of tin further deteriorates the yield during testing. Further, since the oxide film of lead-free solder is hard, it is difficult to remove the oxide film with a conventional contact.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and the object thereof is to accurately bring the contact into contact with the electrode of the semiconductor component on which the insulating oxide film is formed. An object of the present invention is to provide a test contact that can perform an accurate electrical measurement inspection and can improve the yield.

In order to achieve the above object, according to the first aspect of the present invention, there is provided a test contact for inspecting electrical characteristics of an electronic component by bringing the contact into contact with an electrode of the electronic component, wherein the contact is made of an elongated plate having elasticity. A bent portion that bends the distal end portion of the plate-like body in the contact direction with the electrode is formed on the distal end side of the plate-like body, and the contact has the bent portion as a boundary, An inclined portion that is inclined in the contact direction and a horizontal portion that is longer than the inclined portion that extends in a direction intersecting with the inclined direction of the inclined portion are formed, and a tip portion of the inclined portion is in contact with the surface of the electrode. with an inclination angle in contact Te, the horizontal portion is opposite to its deflection in the horizontal portion suppresses the auxiliary plate is provided, the bent portion in the portion where the auxiliary plate is provided in the plate-like body Part of the Spaced apart from the bent portion than the length from the inclined tip from parts, and characterized in that the supporting point of the plate-like body and the auxiliary plate is prevented from moving in the opposite direction as the tilt direction is provided you.

  In the aspect as described above, when the semiconductor component is pressed against the contact by providing a bent portion at the tip of the contact so as to be inclined toward the side where the electronic component is inserted, the tip of the contact Moves while contacting the electrode of the semiconductor component. Thereby, the oxide insulating film of the electrode portion can be scratched to break the oxide insulating film, and an accurate electrical measurement inspection can be performed.

  Also, when an auxiliary plate is not provided on the horizontal surface of the contact, when the electrode of the semiconductor component comes into contact with the contact tip, the contact tends to bend in the longitudinal direction based on its fulcrum, and the contact tip is the oxide insulation of the electrode. Hard to move in the direction of scratching the membrane. On the other hand, when the auxiliary plate is provided on the horizontal plane, the longitudinal direction is difficult to bend based on the fulcrum, and the tip of the contact is easily moved in the direction of scratching the oxide insulating film of the electrode.

  According to a second aspect of the present invention, in the first aspect of the present invention, the contact is made of any one of copper and its alloy, stainless steel, tungsten and its alloy, and a cemented carbide.

  In the above embodiment, the contact is usually made of copper and its alloy. However, when the solder adheres significantly, a material such as stainless steel, tungsten and its alloy, cemented carbide, etc., which is hard to adhere to solder is used. By doing so, it is possible to prevent the accuracy of the electrical characteristic inspection from being lowered.

  According to the present invention as described above, the contact can be accurately brought into contact with the electrode of the semiconductor component on which the insulating oxide film is formed, the accurate electrical measurement inspection can be performed, and the yield can be improved. Test contacts that can be provided.

  Next, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to FIGS.

(1) Embodiment [Configuration]
As shown in FIG. 1, the test contact 1 in the embodiment of the present invention is formed with a bent portion 12 at an angle of 50 degrees at a position of 5 mm from the tip of the contact 11 made of a single plate. An auxiliary plate 14 is provided on a horizontal portion 13 that forms a horizontal plane on the base side from the bent portion 12. The tip of the contact 11 is in contact with the electrode E of the semiconductor component C, so that the electrical inspection of the semiconductor component C is performed.

  More specifically, as shown in FIGS. 2A and 2B, the test contact 1 bends a single plate at a position 5 mm from the tip so that the tip side has an inclined surface of 50 degrees. Then, the bent portion 12 is formed, and the auxiliary plate 14 is placed on the horizontal portion 13 that forms a horizontal plane on the base side of the bent portion with the bent portion 12 as a boundary, and tightened with a screw or the like. However, you may join by adhesion | attachment or welding.

  As the metal material used for the contact 11, copper and its alloy are usually used. In addition, stainless steel, tungsten and its alloys, and cemented carbide are used. This is because when the electrical inspection is repeated by bringing the contact 11 into contact with the electrode of the semiconductor component, solder scraps adhere to the surface of the contact 11 and the accuracy of the inspection is lowered. It is what was used. Usually, copper and its alloys are used, but when solder adhesion is remarkable, stainless steel, tungsten and its alloys, and cemented carbide are used.

  The auxiliary plate 14 may be made of the same material as the metal used for the contact 11 or may be made of an insulating material. The material to be used is not limited as long as it has an effect of suppressing the bending of the contact 11.

[Function and effect]
In the test contact 1 of the present embodiment as described above, as shown in FIGS. 3A and 3B, the tip portion of the contact 11 is bent from the bent portion 12 to be inclined, thereby providing an inclined surface. When the component C is pressed against the contact 11, the tip of the contact 11 moves while contacting the electrode E of the semiconductor component C. Thus, the oxide insulating film of the electrode E can be scratched to break the oxide insulating film, and an accurate electrical measurement inspection can be performed.

  4A, when the auxiliary plate 14 is not provided in the horizontal portion 13, when the electrode E of the semiconductor component C contacts the tip of the contact 11, the contact 11 is based on the fulcrum. The longitudinal direction is easy to bend, and the tip of the contact 11 is difficult to move in the direction of scratching the oxide insulating film of the electrode E. On the other hand, as shown in FIG. 4B, when the auxiliary plate 14 is provided in the horizontal portion 13, the longitudinal direction is difficult to bend based on the fulcrum, and the tip portion of the contact 11 forms the oxide insulating film of the electrode E. It becomes easy to move in the direction of scratching.

  With the above operation, the yield of the entire test contact 1 is improved. According to the results of the implementation by the present inventor, in the case of a flat contact arranged horizontally in the past, 300 out of 10000 tests were defective and the test yield was 3%. In the case of the contact, the test failure was 0 out of 10,000 tests, and the test yield was 0%.

  In addition, since the inclined surface can be provided simply by bending the distal end portion of the flat contact 11 from the bent portion 12, it can be produced easily and inexpensively. Furthermore, as compared with the case where the semiconductor component C is inserted into the socket and the electrical characteristic inspection is performed, the cushioning material and the substrate are unnecessary, and the device life, which is the usable time of the unit, can be extended.

  In the conventional test contacts shown in FIGS. 5 and 6, for example, some contacts are arranged horizontally or vertically and a dielectric is interposed between them. In such a conventional test contact, Due to the presence of dielectric, it is not suitable for electrical property inspection in high frequency devices. On the other hand, the test contact 1 of the present embodiment has a simple configuration in which a flat contact arranged horizontally is bent, and does not use a dielectric, so that it can cope with the electrical characteristic inspection of a high-frequency device. .

  If the electrical inspection is repeated by bringing the contact 11 into contact with the electrode E of the semiconductor component C, solder scraps adhere to the contact 11 and the inspection accuracy decreases. Therefore, in the present embodiment, copper and its alloy are usually used as the metal material of the contact 11, but in the case where solder scrap adhesion is remarkable, stainless steel (SUS), tungsten and its alloy, cemented carbide, etc. By using a material that hardly adheres to solder, it is possible to prevent the accuracy of the electrical property inspection from being lowered.

(2) Other Embodiments The present invention is not limited to the embodiment described above, and includes the following embodiments. The inclination of the contact is merely an optimum example, and the bent portion is formed so that the inclination is formed in the direction in which the semiconductor component is held and lowered by the holding mechanism, that is, in the range where the upper side of the contact becomes an obtuse angle. do it.

  The specific dimensions of the test contacts shown in the above embodiment are all arbitrary. In particular, the size of the insulating spherical resin can be changed as appropriate in accordance with the standard of the semiconductor component to be processed.

The side view which shows the structure of the test contact in embodiment of this invention. The schematic diagram (a) and (b) which show the manufacturing process of the test contact in embodiment of this invention. The schematic diagram (a) and (b) which shows the effect | action at the time of the electrical property test | inspection of the test contact in embodiment of this invention. The schematic diagram (a) and (b) which compared the effect | action at the time of the electrical property test | inspection of the test contact in embodiment of this invention with a prior art. The schematic diagram which shows the structure of the horizontal contact in the conventional test contact. The schematic diagram which shows the structure of the lamination | stacking contact in the conventional test contact.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Test contact 11 ... Contact 12 ... Bending part 13 ... Horizontal part 14 ... Auxiliary board C ... Semiconductor component E ... Electrode

Claims (2)

In the test contact that inspects the electrical characteristics of the electronic component by contacting the contact with the electrode of the electronic component,
The contact consists of an elongated plate-like body having elasticity,
On the tip side of the plate-like body, a bent portion is formed that bends the tip of the plate-like body in the contact direction with the electrode,
The contact is formed with an inclined portion inclined in the contact direction with the bent portion as a boundary, and a horizontal portion longer than the inclined portion extending in a direction intersecting the inclined direction of the inclined portion,
The tip of the inclined portion is in contact with the surface of the electrode with an inclination angle,
The horizontal portion is provided with an auxiliary plate that suppresses bending of the horizontal portion,
The portion of the plate-like body on the side opposite to the bent portion in the portion where the auxiliary plate is provided, at a position farther from the bent portion than the length from the bent portion to the tip of the inclined portion. A test contact, characterized in that a fulcrum for preventing the rod and the auxiliary plate from moving in the direction opposite to the inclination direction is provided .   2. The test contact according to claim 1, wherein the contact is made of any one of copper and an alloy thereof, stainless steel, tungsten and an alloy thereof, and a cemented carbide.

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