JP5227396B2 - スマートカードヒートシンク - Google Patents
スマートカードヒートシンク Download PDFInfo
- Publication number
- JP5227396B2 JP5227396B2 JP2010506164A JP2010506164A JP5227396B2 JP 5227396 B2 JP5227396 B2 JP 5227396B2 JP 2010506164 A JP2010506164 A JP 2010506164A JP 2010506164 A JP2010506164 A JP 2010506164A JP 5227396 B2 JP5227396 B2 JP 5227396B2
- Authority
- JP
- Japan
- Prior art keywords
- smart card
- heat sink
- card socket
- contact plate
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000630 rising effect Effects 0.000 claims description 7
- 230000006870 function Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
- G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (6)
- スマートカードを受け容れるスロットを有するフレームであり、該スロットが少なくとも、左側壁と、右側壁と、前記左側壁及び前記右側壁の間に延在するクロスバーとによって定義され、前記クロスバーは平坦でありかつ上側面と下側面を有する、フレーム;並びに
スマートカードヒートシンクであり、
少なくとも一部が前記クロスバーと接する接触板であり、前記一部が前記クロスバーと前記スロットとの間に位置付けられる接触板、
前記接触板から上方に、前記上側面が向いている方向に延びる立ち上がり部、及び、
前記接触板から上方に、前記上側面が向いている方向に延び、前記立ち上がり部の向かい側に位置付けられるフック、
を有するスマートカードヒートシンク;
を有するスマートカードソケットであって:
前記スマートカードヒートシンクが、曲げられた単一のシートで形成される、
スマートカードソケット。 - 前記接触板は、接触面を有し、
前記接触板は、前記クロスバーと前記スロットに挿入されたスマートカードとの間に配置され、
前記接触面は、前記スマートカードの熱伝導面に熱的に接続される、
請求項1のスマートカードソケット。 - 前記ヒートシンクは、ほぼJ字型の断面形状を有する、
請求項2のスマートカードソケット。 - 前記立ち上がり部は、前記フックが前記接触板から上方に延びる距離よりも大きな距離だけ、前記接触板から上方に延びる、
請求項3のスマートカードソケット。 - 前記立ち上がり部は、前記スマートカードソケットの一部との干渉によって、前記スマートカードソケットに対する前記ヒートシンクの動きを抑える、
請求項4のスマートカードソケット。 - 前記フックは、前記スマートカードソケットの一部との干渉によって、前記スマートカードソケットに対する前記ヒートシンクの動きを抑える、
請求項4のスマートカードソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92768907P | 2007-05-04 | 2007-05-04 | |
US60/927,689 | 2007-05-04 | ||
PCT/US2007/014461 WO2008136803A1 (en) | 2007-05-04 | 2007-06-20 | Smart card heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010526369A JP2010526369A (ja) | 2010-07-29 |
JP5227396B2 true JP5227396B2 (ja) | 2013-07-03 |
Family
ID=39110380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010506164A Expired - Fee Related JP5227396B2 (ja) | 2007-05-04 | 2007-06-20 | スマートカードヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US8172619B2 (ja) |
EP (1) | EP2145284B1 (ja) |
JP (1) | JP5227396B2 (ja) |
CN (1) | CN101663673B (ja) |
WO (1) | WO2008136803A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5639185B2 (ja) | 2009-12-09 | 2014-12-10 | トムソン ライセンシングThomson Licensing | 微小穿孔を有するセットトップボックス |
JP5687717B2 (ja) | 2010-02-25 | 2015-03-18 | トムソン ライセンシングThomson Licensing | 隠れクイックリリーススナップを備えた小形多層放射冷却ケース |
EP2572562B1 (en) | 2010-05-19 | 2018-05-09 | Thomson Licensing | Set-top box having dissipating thermal loads |
EP2684375B8 (en) | 2011-03-09 | 2017-12-13 | Thomson Licensing | Set top box or server having snap-in heat sink and smart card reader |
CN103703875B (zh) | 2011-07-14 | 2016-10-12 | 汤姆逊许可公司 | 具有扣合式散热器和智能卡读卡器、带有用于保持散热器的固定部件的机顶盒 |
US9390299B1 (en) * | 2015-02-25 | 2016-07-12 | Echostar Technologies L.L.C. | High data transfer smart card reader with heat sink |
US9760742B2 (en) | 2015-06-26 | 2017-09-12 | Echostar Technologies L.L.C. | Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader |
JP6625004B2 (ja) * | 2016-04-14 | 2019-12-25 | キヤノン株式会社 | カード型記録装置およびスロット装置 |
US10043043B1 (en) | 2017-02-07 | 2018-08-07 | DISH Technologies L.L.C. | Integrated circuit card reader with improved heat dissipation |
US11792957B2 (en) * | 2021-08-10 | 2023-10-17 | Dell Products L.P. | System for cooling of computing components of an information handling system |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5783752U (ja) * | 1980-11-07 | 1982-05-24 | ||
FR2541018A1 (fr) | 1983-02-16 | 1984-08-17 | Radiotechnique Compelec | Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee |
JPH0363951U (ja) * | 1989-10-25 | 1991-06-21 | ||
TW387627U (en) * | 1996-11-30 | 2000-04-11 | Hon Hai Prec Ind Co Ltd | Electronic card connector |
US5892216A (en) * | 1997-04-21 | 1999-04-06 | Airborn, Inc. | Smart card reader with electrostatic discharge protection |
JPH118484A (ja) * | 1997-06-16 | 1999-01-12 | Nec Corp | 電子機器の放熱構造 |
TW324560U (en) * | 1997-06-25 | 1998-01-01 | Hon Hai Prec Ind Co Ltd | Connector shield device |
US6109530A (en) | 1998-07-08 | 2000-08-29 | Motorola, Inc. | Integrated circuit carrier package with battery coin cell |
CN2354172Y (zh) * | 1998-09-18 | 1999-12-15 | 全人兴业有限公司 | 中央处理器散热片扣合装置 |
JP3315969B2 (ja) * | 2000-05-09 | 2002-08-19 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
JP4251452B2 (ja) * | 2002-03-06 | 2009-04-08 | タイコ・エレクトロニクス・コーポレイション | トランシーバモジュール組立体のイジェクタ機構 |
JP3920256B2 (ja) | 2003-10-02 | 2007-05-30 | 日本航空電子工業株式会社 | カード用コネクタ |
-
2007
- 2007-06-20 JP JP2010506164A patent/JP5227396B2/ja not_active Expired - Fee Related
- 2007-06-20 EP EP07796323.9A patent/EP2145284B1/en not_active Not-in-force
- 2007-06-20 WO PCT/US2007/014461 patent/WO2008136803A1/en active Application Filing
- 2007-06-20 US US12/450,411 patent/US8172619B2/en not_active Expired - Fee Related
- 2007-06-20 CN CN200780052843.4A patent/CN101663673B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8172619B2 (en) | 2012-05-08 |
EP2145284B1 (en) | 2013-04-17 |
EP2145284A1 (en) | 2010-01-20 |
JP2010526369A (ja) | 2010-07-29 |
CN101663673B (zh) | 2016-09-07 |
US20100073881A1 (en) | 2010-03-25 |
WO2008136803A1 (en) | 2008-11-13 |
CN101663673A (zh) | 2010-03-03 |
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