JP5210281B2 - 電子放出素子、それを備えた表示装置及び撮像装置 - Google Patents
電子放出素子、それを備えた表示装置及び撮像装置 Download PDFInfo
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- JP5210281B2 JP5210281B2 JP2009237394A JP2009237394A JP5210281B2 JP 5210281 B2 JP5210281 B2 JP 5210281B2 JP 2009237394 A JP2009237394 A JP 2009237394A JP 2009237394 A JP2009237394 A JP 2009237394A JP 5210281 B2 JP5210281 B2 JP 5210281B2
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- 238000003384 imaging method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 60
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 description 24
- 239000010408 film Substances 0.000 description 15
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000005094 computer simulation Methods 0.000 description 9
- 230000005684 electric field Effects 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
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- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
- Cold Cathode And The Manufacture (AREA)
Description
2、22 カソード母線(カソード電極)
3、27 エミッタ(電子放出部)
4、24 ゲート電極
5 エレクトレット
6、32 アノード電極(透明電極)
20 冷陰極基板
21 基板
23 絶縁層
25 フォーカス電極
26 開口部
30 アノード基板
31 基板(透光性基板)
33 蛍光体
40 スペーサ
41 X線源
42 グリッド電極
43 X線
Claims (3)
- 基板上に順次形成されたカソード電極、絶縁層、ゲート電極及びフォーカス電極と、前記フォーカス電極の表面から前記カソード電極に至る開口部と、該開口部によって露出されたカソード電極上に形成され電子を放出する電子放出部とを備えた電子放出素子であって、
前記フォーカス電極は、電荷が注入されエレクトレットとして機能する誘電体であるシリコン酸化膜と、前記シリコン酸化膜の表面を被覆するシリコン窒化膜とで形成されたものであり、
前記開口部は、前記フォーカス電極において前記電子の進行方向に沿って開口長が長くなるテーパ形状に形成されたものであることを特徴とする電子放出素子。 - 請求項1に記載の電子放出素子と、透光性を有する透光性基板と、該透光性基板の一方の面上に順次形成された透明電極及び蛍光体とを備え、前記電子放出素子が前記蛍光体に対向配置されたことを特徴とする表示装置。
- 請求項1に記載の電子放出素子と、透光性を有する透光性基板と、該透光性基板の一方の面上に順次形成された透明電極及び光電変換膜とを備え、前記電子放出素子が前記光電変換膜に対向配置されたことを特徴とする撮像装置。
Priority Applications (1)
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JP2009237394A JP5210281B2 (ja) | 2009-10-14 | 2009-10-14 | 電子放出素子、それを備えた表示装置及び撮像装置 |
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JP2009237394A JP5210281B2 (ja) | 2009-10-14 | 2009-10-14 | 電子放出素子、それを備えた表示装置及び撮像装置 |
Publications (2)
Publication Number | Publication Date |
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JP2011086454A JP2011086454A (ja) | 2011-04-28 |
JP5210281B2 true JP5210281B2 (ja) | 2013-06-12 |
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JP2009237394A Expired - Fee Related JP5210281B2 (ja) | 2009-10-14 | 2009-10-14 | 電子放出素子、それを備えた表示装置及び撮像装置 |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528103A (en) * | 1994-01-31 | 1996-06-18 | Silicon Video Corporation | Field emitter with focusing ridges situated to sides of gate |
JP2748901B2 (ja) * | 1995-09-28 | 1998-05-13 | 日本電気株式会社 | 冷陰極駆動回路およびこれを用いた電子ビーム装置 |
JP2005056589A (ja) * | 2003-08-01 | 2005-03-03 | Nippon Hoso Kyokai <Nhk> | 電子放出素子及び電界放出型表示装置 |
KR20050058617A (ko) * | 2003-12-12 | 2005-06-17 | 삼성에스디아이 주식회사 | 전계방출소자와, 이를 적용한 표시소자 및 그 제조방법 |
JP4603300B2 (ja) * | 2004-06-28 | 2010-12-22 | 日本放送協会 | 冷陰極装置及び電界放出型ディスプレイ |
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