JP5259024B1 - Elastic wave device and electronic component - Google Patents

Abstract

  An elastic wave device capable of maintaining the hermeticity of a vibration space for a long time is provided. Therefore, the acoustic wave device 1 includes the element substrate 3, the excitation electrode 5 positioned on the main surface 3a of the element substrate 3, the frame portion 2 positioned on the main surface of the element substrate 3 so as to surround the excitation electrode 5, and the frame A structure including a cover 9 including a lid portion 4 having a hanging portion 4a that overlaps with the portion 2 and closes the frame portion 2 and is continuous from the upper side of the inner wall of the frame portion 2 and covers at least a part of the inner wall. And

Description

  The present invention relates to an acoustic wave device such as a surface acoustic wave (SAW) device or a piezoelectric thin film resonator (FBAR) and an electronic component using the same.

  A so-called wafer level package (WLP: Wafer Level Package) type acoustic wave device for the purpose of downsizing and the like is known. This WLP type acoustic wave device has a piezoelectric substrate, an excitation electrode provided on the piezoelectric substrate, and a cover for sealing the excitation electrode (see, for example, Patent Document 1).

  The cover includes an annular frame portion surrounding the excitation electrode disposed on the upper surface of the piezoelectric substrate and a lid portion disposed on the upper surface of the frame portion so as to close the opening of the frame portion. In this way, the opening of the frame portion is closed by the lid portion, so that a vibration space that is an area surrounded by the inner wall of the frame portion and the lower surface of the lid portion is secured on the excitation electrode.

  Although the frame part and the cover part constituting the cover are often formed of the same material, the frame part and the cover part are slightly formed between the frame part and the cover part when the frame part and the cover part are formed through different processes. Gaps may be formed.

  When a gap is formed between the frame part and the lid part, the atmosphere in the vibration space is changed by connecting the outside of the cover and the vibration space through the gap. For example, if moisture in the outside air enters the vibration space through the gap, it causes corrosion of the excitation electrode. If the excitation electrode corrodes, the electrical characteristics of the acoustic wave device will deteriorate.

  Therefore, it is desirable to provide an acoustic wave device that can maintain the hermeticity of the vibration space for a long time even when the cover is configured by a frame portion and a lid portion.

JP 2008-227748 A

An elastic wave device according to an aspect of the present invention includes an element substrate, an excitation electrode positioned on the main surface of the element substrate, a frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and the with closing the said frame portion overlaps the frame portion, elasticity and a cover including a lid portion having a hanging portion which covers at least a portion of the inner wall continuous side or we on the inner wall of the frame part It is a wave apparatus , Comprising: The side wall of the said cover part is located inside the outer wall of the said frame part .

  Also, an electronic component as one aspect of the present invention includes a mounting substrate and the elastic wave device mounted via a conductive bonding material in a state where the main surface of the element substrate faces the main surface of the mounting substrate And a mold resin that covers the acoustic wave device.

  The elastic wave device having the above-described configuration is provided with a hanging part that covers at least a part of the inner wall from the upper side of the inner wall of the frame part. Since the infiltration path of moisture and the like from the outside air to the vibration space becomes long, the airtightness of the vibration space can be maintained in a normal state for a long time.

(A) is a top view of the SAW device concerning the 1st embodiment of the present invention, and (b) is a top view in the state where the lid part of the SAW device of Drawing 1 (a) was removed. It is sectional drawing in the II-II line | wire of Fig.1 (a). FIG. 3 is an enlarged view of a region indicated by III in FIG. 2. It is sectional drawing of the electronic component which concerns on embodiment of this invention. (A) to (d) are cross-sectional views for explaining a method of manufacturing the electronic component of FIG. (A) to (c) is a cross-sectional view showing a continuation of FIG. It is an expanded sectional view which shows the modification of the SAW apparatus shown in FIG. It is sectional drawing which shows the SAW apparatus which concerns on 2nd Embodiment. It is sectional drawing which shows the SAW apparatus which concerns on 3rd Embodiment. It is sectional drawing which shows the SAW apparatus which concerns on 4th Embodiment. FIGS. 9A to 9C are cross-sectional views illustrating a method for manufacturing a SAW device according to the fourth embodiment. FIGS. 9A to 9C are cross-sectional views for explaining a method of manufacturing a SAW device according to the fourth embodiment, and show a process following FIG. It is sectional drawing for demonstrating the reason a microprotrusion is formed in the internal peripheral surface of a 2nd through-hole. It is sectional drawing which shows the modification of the SAW apparatus which concerns on 4th Embodiment. It is a top view of the SAW device concerning a 5th embodiment. It is a fragmentary sectional view in the XVI-XVI line of FIG. It is sectional drawing of the reference | standard analysis model used for simulation. It is sectional drawing of the analysis model used for simulation. It is a fragmentary sectional view showing the modification of the SAW device concerning a 5th embodiment. It is a top view which shows the modification of the SAW apparatus which concerns on 5th Embodiment. It is sectional drawing of the SAW apparatus which concerns on 6th Embodiment. It is an enlarged view of the area | region E shown in FIG. (A) And (b) is an expanded sectional view which shows another modification of the SAW apparatus shown in FIG. (A) to (c) is an enlarged cross-sectional view showing a SAW device according to a seventh embodiment.

  Hereinafter, a SAW device according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  In the second and subsequent embodiments, the same or similar components as those already described are denoted by the same reference numerals as those already described, and illustrations and descriptions may be omitted.

<First Embodiment>
(Configuration of SAW device, etc.)
FIG. 1A is a plan view of the SAW device 1 according to the first embodiment of the present invention, and FIG. 1B is a plan view of the SAW device 1 with the lid 4 removed. FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

  The SAW device 1 includes an element substrate 3, an excitation electrode 5 provided on the first main surface 3a of the element substrate 3, a pad 7 provided on the first main surface 3a and connected to the excitation electrode 5, The cover 9 covers the excitation electrode 5 and exposes the pad 7, and the back surface portion 11 is provided on the second main surface 3 b of the element substrate 3.

  Signals are input to the SAW device 1 via any of the plurality of pads 7. The input signal is filtered by the excitation electrode 5 or the like. Then, the SAW device 1 outputs the filtered signal via any of the plurality of pads 7. The specific configuration of each member is as follows.

  The element substrate 3 is constituted by a piezoelectric substrate. Specifically, for example, the element substrate 3 is composed of a single crystal substrate having piezoelectricity, such as a lithium tantalate single crystal or a lithium niobate single crystal. The element substrate 3 is formed in a rectangular parallelepiped shape, for example, and has a first main surface 3a and a second main surface 3b which are rectangular and parallel to each other and are flat. The size of the element substrate 3 may be set as appropriate. For example, the thickness (Z direction) is 0.2 mm to 0.5 mm, and the length of one side (X direction or Y direction) is 0.5 mm. ~ 3mm.

  The excitation electrode 5 is formed on the first main surface 3a. The excitation electrode 5 is a so-called IDT (InterDigital Transducer) and has a pair of comb-like electrodes. Each comb-like electrode has a bus bar extending in the propagation direction of the surface acoustic wave on the element substrate 3 and a plurality of electrode fingers extending from the bus bar in a direction orthogonal to the propagation direction of the surface acoustic wave. The two comb-like electrodes are provided so that their electrode fingers mesh with each other.

  Since FIG. 1 and the like are schematic diagrams, a pair of comb-like electrodes having several electrode fingers is shown, but in practice, a plurality of pairs of combs having a larger number of electrode fingers are shown. Toothed electrodes may be provided. Further, a ladder-type SAW filter in which a plurality of excitation electrodes 5 are connected by a system such as series connection or parallel connection may be configured, or a plurality of excitation electrodes 5 are arranged in the propagation direction of a surface acoustic wave. A mode SAW resonator filter may be configured.

  The pad 7 is formed on the first main surface 3a. The planar shape of the pad 7 may be set as appropriate. For example, the planar shape is a circle. The number and arrangement position of the pads 7 are appropriately set according to the configuration of the filter constituted by the excitation electrodes 5. In the SAW device 1, the case where the six pads 7 are arranged along the outer periphery of the 1st main surface 3a is illustrated.

  The excitation electrode 5 and the pad 7 are connected by a wiring 15. The wiring 15 is formed on the first main surface 3 a and connects the bus bar of the excitation electrode 5 and the pad 7. The wiring 15 may be three-dimensionally crossed with not only a portion formed on the first main surface 3a but also two wirings 15 through which different signals flow with an insulator interposed therebetween.

  The excitation electrode 5, the pad 7, and the wiring 15 are made of the same conductive material, for example. The conductive material is, for example, an Al alloy such as Al or an Al—Cu alloy. Moreover, the excitation electrode 5, the pad 7, and the wiring 15 are formed with the same thickness, for example, and these thicknesses are 100-500 nm, for example. Further, when the wires 15 are three-dimensionally crossed, the wires 15 on the first main surface 3a side are formed of, for example, an Al—Cu alloy, and the wires 15 disposed thereon via an insulator are, for example, sequentially from the bottom. It is formed by wiring having a multilayer structure of Cr / Ni / Au or Cr / Al. When the wiring on the upper side of the three-dimensional wiring is formed of Cr / Ni / Au, the adhesiveness between the uppermost Au and the resin is relatively weak, so the cover 9 made of resin is not laminated on the three-dimensional wiring. It is good to do so. Thereby, peeling of the cover 9 can be suppressed. On the other hand, when the wiring on the upper side of the three-dimensional wiring is formed of Cr / Al, the cover 9 may be laminated on the three-dimensional wiring.

  In addition to the layer of the same material and the same thickness as the excitation electrode 5, the pad 7 is provided with a connection reinforcing layer 6 for the purpose of improving the connectivity with the conductive bonding material. The connection reinforcing layer 6 includes, for example, a nickel layer superimposed on the pad 7 and a gold layer superimposed on the nickel layer.

  The cover 9 has, for example, a protruding portion 9a that protrudes between adjacent pads 7, and the planar shape excluding the protruding portion 9a is generally rectangular. In other words, the cover 9 can be regarded as a shape that is cut out so that the pad 7 is exposed from a rectangle having a size that covers the pad 7.

  The cover 9 is provided on the first main surface 3 a, the frame portion 2 surrounding the excitation electrode 5 in a plan view of the first main surface 3 a, and the lid portion 4 that overlaps the frame portion 2 and closes the opening of the frame portion 2. And have. A vibration space 21 is formed by the space surrounded by the first main surface 3a, the frame portion 2 and the lid portion 4 so as not to hinder the vibration of the SAW excited by the excitation electrode 5.

  The planar shape of the vibration space 21 may be set as appropriate, but the SAW device 1 has a substantially rectangular shape. Note that the cover 9 may be regarded as having a shape in which a concave portion constituting the vibration space 21 is formed on the lower surface side.

  The frame portion 2 is configured by forming one or more openings serving as the vibration spaces 21 in a layer having a substantially constant thickness. The thickness of the frame part 2 (height of the vibration space 21) is, for example, several μm to 30 μm. The lid portion 4 is constituted by a layer having a substantially constant thickness. The thickness of the lid part 4 is, for example, several μm to 30 μm.

  The lid portion 4 has a planar shape substantially the same as the planar shape of the frame portion 2, for example, and is formed so that the lid portion 4 is slightly smaller than the frame portion 2. In other words, the frame portion 2 is sized so that a portion along the outer periphery of the frame portion 2 slightly protrudes from the lid portion 4 when viewed in plan.

  The frame part 2 and the cover part 4 may be formed of the same material, or may be formed of different materials. In this application, for convenience of explanation, the boundary between the frame 2 and the lid 4 is clearly shown as a boundary line. However, in an actual product, the frame 2 and the lid 4 are integrally formed of the same material. May be.

  The cover 9 (the frame portion 2 and the lid portion 4) is made of a photosensitive resin. The photosensitive resin is, for example, a urethane acrylate-based, polyester acrylate-based, or epoxy acrylate-based resin that is cured by radical polymerization of an acryl group or a methacryl group. In addition, a polyimide resin or the like can also be used.

  The back surface portion 11 includes, for example, a back electrode that covers substantially the entire second main surface 3b of the element substrate 3, and an insulating protective layer that covers the back electrode. The back surface electrode discharges the charge charged on the surface of the element substrate 3 due to a temperature change or the like. Damage to the element substrate 3 is suppressed by the protective layer. In the following, illustration and description of the back surface portion 11 may be omitted.

  FIG. 3 is an enlarged view of region III in FIG.

A protective layer 8 is disposed on the first main surface 3 a of the element substrate 3, and a cover 9 is disposed on the protective layer 8. The protective layer 8 covers the excitation electrode 5 and contributes to prevention of oxidation of the excitation electrode 5. The protective layer 8 is made of, for example, silicon oxide (such as SiO ₂ ), aluminum oxide, zinc oxide, titanium oxide, silicon nitride, or silicon. The thickness of the protective layer 8 is, for example, about 1/10 (10 to 30 nm) of the thickness of the excitation electrode 5 or 200 nm to 1500 nm, which is thicker than the excitation electrode 5.

  The pad 7 or the connection reinforcing layer 6 is exposed from the protective layer 8. In FIG. 3, the opening for exposing the connection reinforcing layer 6 of the protective layer 8 has the same shape and area as the connection reinforcing layer 6, but the opening is larger than the connection reinforcing layer 6. Alternatively, it may be small (a portion around the opening of the protective layer 8 may cover the outer peripheral portion of the connection reinforcing layer 6).

  As shown in the figure, the SAW device 1 has a lid portion 4 having a hanging portion 4a. The hanging part 4a is a part of the lid part 4 that is continuous from the upper side of the inner wall 2a of the frame part 2 and covers at least a part of the inner wall 2a. In the SAW device 1, the hanging part 4 a covers almost the upper half of the inner wall 2 a of the frame part 2. By providing such a hanging part 4 a on the lid part 4, the contact area between the lid part 4 and the frame part 2 increases, so that peeling between the lid part 4 and the frame part 2 can be suppressed. In addition, when external moisture enters from the boundary portion between the lid portion 4 and the frame portion 2, the hanging portion 4 a is in contact with the inner wall of the frame portion 2 as indicated by a white arrow in the intrusion route. Since it becomes longer by that amount, it becomes difficult for moisture to enter the vibration space 21. Therefore, corrosion of the excitation electrode 5 and the like in the vibration space can be suppressed, and the electrical characteristics of the SAW device 1 can be stabilized over a long period of time.

  The hanging part 4a is formed in, for example, an annular shape when viewed in plan. That is, the inner wall 2 a is covered so as to go around along the inner wall 2 a of the frame portion 2. As a result, it is possible to further enhance the effect of preventing moisture from entering between the lid portion 4 and the frame portion 2.

  The hanging part 4a can be formed, for example, by adjusting conditions such as temperature when the lid part 4 is attached to the frame part 2. For example, heating may be performed at a somewhat high temperature in order to attach the resin lid portion 4 and the resin frame portion 2 to each other, but the temperature at that time is slightly higher than usual, and the temperature holding time is longer than usual. By adjusting the temperature and holding time, such as slightly longer, a part of the resin lid part 4 hangs down along the inner wall 2a of the frame part 2, and the part becomes solid, thereby forming a sag part 4a. it can. As the hanging part 4a is formed, a minute recess 4b may be formed in a region directly above the hanging part 4a in the upper surface of the lid part 4.

  The outer wall 2b of the frame portion 2 is inclined so as to go outward as it goes toward the first main surface 3a of the element substrate 3. The angle α of the outer wall 2b of the frame part 2 with respect to the first main surface 3a is, for example, about 80 °. The lower end of the outer wall 2b is separated from the connection reinforcing layer 6 (or the pad 7 when there is no connection reinforcing layer 6). The distance is, for example, 40 μm to 65 μm.

  Similar to the outer wall 2b of the frame part 2, the side wall 4c of the lid part 4 may or may not be inclined so as to go outward as it goes to the first main surface 3a of the element substrate 3. The angle β with respect to the main surface 3a of the outer wall 4b of the lid 4 may be the same as, for example, the angle α, may be increased, or may be decreased. Further, the side wall 4 c of the lid part 4 is located slightly inside the outer wall 2 b of the frame part 2. In other words, the lid 4 is made slightly smaller than the frame 2 when viewed in plan. For example, the side wall 4 c of the lid part 4 is located several μm to several tens of μm inside the outer wall 2 b of the frame part 2.

  FIG. 4 is a cross-sectional view showing a part of the electronic component 51 on which the SAW device 1 is mounted.

  The electronic component 51 includes a mounting substrate 53, a pad 55 provided on the mounting surface 53 a of the mounting substrate 53, a conductive bonding material 57 disposed on the pad 55, and a mounting surface via the conductive bonding material 57. The SAW device 1 mounted on 53a and a mold resin 59 for sealing the SAW device 1 are provided.

  In addition, the electronic component 51 includes, for example, an IC or the like mounted on the mounting substrate 53 and sealed together with the SAW device 1 by the mold resin 59 to form a module.

  The mounting substrate 53 is configured by, for example, a printed wiring board. The printed wiring board may be a rigid board or a flexible board. The printed wiring board may be a single-layer board, a two-layer board, or a multilayer board having two or more layers. Moreover, the base material, insulating material, and conductive material of the printed wiring board may be selected from appropriate materials.

  The conductive bonding material 57 is in contact with both the pad 7 of the SAW device 1 and the pad 55 of the mounting substrate 53. The conductive bonding material 57 is formed of a metal that is melted by heating and bonded to the pad 7. The conductive bonding material 57 is made of, for example, solder. The solder may be a solder using lead such as Pb—Sn alloy solder, or lead-free solder such as Au—Sn alloy solder, Au—Ge alloy solder, Sn—Ag alloy solder, Sn—Cu alloy solder, etc. It may be.

  The mold resin 59 is mainly composed of, for example, an epoxy resin, a curing material, and a filler. The mold resin 59 not only covers the SAW device 1 from the back surface portion 11 side and the side, but also fills the space between the SAW device 1 and the mounting substrate 53. Specifically, the mold resin 59 is also filled between the upper surface of the cover 9 and the mounting surface 53 a of the mounting substrate 53 and around the conductive bonding material 57.

  The conductive bonding material 57 has a shape in which an approximately spherical shape such as a conductor bump is crushed by the pad 7 and the pad 55. That is, the conductive bonding material 57 has two planes in contact with the pad 7 and the pad 55 and an outer peripheral surface connecting the two planes. The two planes and the outer peripheral surface are circular in a plan view, and the outer peripheral surface is a side surface. When viewed, the center side has a curved shape protruding outward.

  The area of the plane in contact with the pad 7 and the pad 55 of the conductive bonding material 57 is preferably equal to or less than the area of the pad 7 and the pad 55.

  The side wall 2b of the frame part 2 and the side wall 4b of the lid part 4 are not in contact with the conductive bonding material 57 over the entirety. Therefore, a gap between the outer wall of the cover 9 (the frame portion 2 and the lid portion 4) and the conductive bonding material 57 is formed from the upper surface to the lower surface of the cover 9, and the gap is filled with the mold resin 59.

  Thus, the side wall 2b of the frame portion 2 and the side wall 4b of the lid portion 4 are not in contact with the conductive bonding material 57 over the whole, and the mold resin is not between the side walls and the conductive bonding material 57. Since it is filled, the conductive bonding material 57 is not easily affected by the shape of the outer wall of the cover 9. As a result, for example, the corners between the outer wall of the cover 9 and the upper surface of the cover are prevented from forming a shape that is likely to cause stress concentration in the conductive bonding material 57, and cracks in the conductive bonding material 57 are generated. Is suppressed. These effects are particularly remarkable when the mold resin 59 is filled between the conductive bonding material 57 and the outer wall of the cover 9 from the upper surface to the lower surface of the cover 9 as in the embodiment. Become.

  Further, as described above, the outer wall 2b of the frame portion 2 constituting the cover 9 is inclined so as to expand toward the main surface 3a of the element substrate 3, and the mold resin 59 is in contact with the inclined outer wall 2b. ing.

  Therefore, for example, between the inclined outer wall 2 b and the conductive bonding material 57, the mold resin 59 easily flows from the upper surface side to the lower surface side of the cover 9, and the formation of a cavity in the mold resin 59 is suppressed. If there is a cavity in the mold resin 59, when the heat is applied during reflow, the cavity expands, which may cause a mounting failure of the SAW device 1, but the formation of the cavity is suppressed. Occurrence of a bad mounting failure or the like is suppressed.

  Moreover, since the outer wall 4c of the cover part 4 is located inside the outer wall 2b of the frame part 2, the effect similar to the effect by the inclination of the outer wall 2b of the frame part 2 mentioned above is anticipated. That is, the mold resin 59 easily flows from the upper surface side to the lower surface side of the cover 9 between the outer wall of the cover 9 and the conductive bonding material 57.

(Method for manufacturing SAW device)
FIG. 5A to FIG. 6C are cross-sectional views (corresponding to the line III-III in FIG. 1) for explaining a method for manufacturing the SAW device 1 and the electronic component 51. The manufacturing process proceeds in order from FIG. 5 (a) to FIG. 6 (c).

  The steps of FIG. 5A to FIG. 6A corresponding to the method for manufacturing the SAW device 1 are realized in a so-called wafer process. That is, a thin film formation, a photolithography method, or the like is performed on the mother substrate that becomes the element substrate 3 by being divided, and then a large number of SAW devices 1 are formed in parallel by dicing. The However, in FIG. 5A to FIG. 6A, only the portion corresponding to one SAW device 1 is shown. In addition, although the shape of the conductive layer and the insulating layer changes with the progress of the process, a common code may be used before and after the change.

  As shown in FIG. 5A, first, the excitation electrode 5, the pad 7, and the wiring 15 are formed on the main surface 3 a of the element substrate 3. Specifically, first, a metal layer is formed on the main surface 3a by a thin film forming method such as a sputtering method, a vapor deposition method or a CVD (Chemical Vapor Deposition) method. Next, the metal layer is patterned by a photolithography method using a reduction projection exposure machine (stepper) and an RIE (Reactive Ion Etching) apparatus. Excitation electrode 5, wiring 15 and pad 7 are formed by patterning.

  When the excitation electrode 5 and the like are formed, the protective layer 8 is formed as shown in FIG. Specifically, first, a thin film to be the protective layer 8 is formed by an appropriate thin film forming method. The thin film forming method is, for example, a sputtering method or CVD. Next, a part of the thin film is removed by RIE or the like so that the pad 7 is exposed. Thereby, the protective layer 8 is formed.

  When the protective layer 8 is formed, as shown in FIG. 5C, a thin film made of a photosensitive resin, which becomes the frame portion 2, is formed. The thin film is formed, for example, by attaching a film. The film includes, for example, a base film 31 and a resin layer 17 that becomes the frame portion 2 attached to the base film 31. After the resin layer 17 is brought into close contact with the protective layer 8, the base film 31 is peeled off as indicated by the arrow y1. In addition, the thin film used as the frame part 2 may be formed by the thin film formation method similar to the protective layer 8, and may be formed by a spin coat method etc. in addition.

  When the thin film to be the frame portion 2 is formed, as shown in FIG. 5D, a region along the outer periphery of the element substrate 3 on which the thin film on the excitation electrode 5 and the pad 7 are arranged by a photolithography method or the like. The thin film is removed. The thin film is also removed with a constant width on the dicing line. In this way, the frame portion 2 is formed. In addition, when the thin film used as the frame part 2 is formed by sticking a film, the process of peeling the base film 31 may be performed after the exposure process of photolithography.

  When the frame part 2 is formed, as shown in FIG. 6A, a thin film made of a photosensitive resin, which becomes the lid part 4, is formed. The thin film is formed, for example, by attaching a film. The film includes, for example, a base film 32 and a resin layer 18 that becomes the lid 4 attached to the base film 32. And the resin layer 18 and the frame part 2 are adhere | attached by heating the resin layer 18 in the state in which the base film 32 was stuck. Adhesion between the resin layer 18 and the frame portion 2 is performed, for example, by placing the element substrate 3 on a stage 29 heated to about 40 ° C. to 50 ° C., and rotating the roller 30 similarly heated to about 40 ° C. to 50 ° C. However, it is performed by pressing against the resin layer 18 to which the base film 32 is attached. At this time, if the temperature of the stage 29 and the roller 30, the rotational speed of the roller, etc. are set to predetermined conditions, the softened resin layer 18 can be dripped along the inner wall 2a of the frame portion 2, and this drooping A part becomes the drooping part 4a. The shape of the hanging part 4a can be controlled to some extent by adjusting the temperature of the stage 29 and the roller 30, the holding time on the stage 29, the rotational speed of the roller, and the like. For example, when epoxy acrylate is used as the material of the frame part 2 and the resin layer 18 and the thicknesses of both the frame part 2 and the resin layer 18 are 30 μm, the stage 29 and the roller 30 are several times higher than the temperature during normal bonding. When the temperature is raised from 42 ° C. to about 45 ° C., the drooping portion 4a covering the upper half of the inner wall 2a of the frame portion 2 can be formed.

  Thereafter, the base film 32 is peeled off, and the region along the outer periphery of the resin layer 18 to be the lid portion 4 is removed by a photolithography method or the like as shown in FIG. 6B, and the lid portion 4 having the hanging portion 4a is formed. It is formed. Further, the thin film is removed with a constant width on the dicing line. By forming the lid portion 4, a vibration space 21 including a space surrounded by the protective layer 8, the frame portion 2, and the lid portion 4 is formed. Note that the method of forming the vibration space 21 is not limited to this, for example, a sacrificial layer is formed in advance on a portion where the vibration space 21 is to be formed, and a resin serving as a cover is formed so as to cover the sacrificial layer, Finally, it may be formed by removing the sacrificial layer.

  When the lid portion 4 is formed, the SAW device 1 is cut out from the wafer and mounted on the mounting substrate 53 as shown in FIG. Prior to mounting the SAW device 1, the pad 55 and the conductive bonding material 57 are provided on the mounting surface 53 a of the mounting substrate 53. If the conductive bonding material 57 is a conductor bump before the SAW device 1 is bonded, for example, a spherical or hemispherical surface is obtained by utilizing the effect of surface tension by vapor deposition, plating, or printing. It is formed in a shape.

  The SAW device 1 is arranged with the upper surface of the cover 9 facing the mounting surface 53a. The conductive bonding material 57 contacts the pad 7 on the SAW device 1 side and supports the SAW device 1. Thereafter, the SAW device 1 and the mounting substrate 53 are temporarily heated by being passed through a reflow furnace or the like, and the conductive bonding material 57 and the pad 7 are fixed by melting and solidification of the conductive bonding material 57.

  Thereafter, the SAW device 1 is covered with the mold resin 59. The mold resin 59 is supplied around the SAW device 1 by, for example, a transfer molding method or a printing method. The mold resin 59 supplied to the periphery of the SAW device 1 flows between the upper surface of the cover 9 and the mounting surface 53a by the applied pressure, and further, between the side surface of the cover 9 and the conductive bonding material 57. Flows in. And the electronic component 51 is manufactured as shown in FIG.

(Modification)
FIG. 7 is an enlarged cross-sectional view showing a modified example of the SAW device 1 in the first embodiment. 7 corresponds to the part shown in FIG.

  The SAW device 1 according to this modification is different from the SAW device 1 shown in FIG. 1 in the shape of the hanging portion 4a. Specifically, in the SAW device 1 according to the modification, the lower end of the hanging portion 4 a reaches the first main surface 3 a of the element substrate 3. Thus, since the contact area of the drooping part 4a and the inner wall 2a of the frame part 2 increases because the lower end of the drooping part 4a reaches the first main surface 3a, the adhesive strength between the lid part 4 and the frame part 2 is increased. At the same time, the moisture intrusion path between the lid portion 4 and the frame portion 2 becomes longer, so that moisture hardly enters the vibration space 21. Further, even when the frame portion 2 is peeled off from the element substrate 3, moisture enters from the lower end of the outer wall 2 b of the frame portion 2 to the vibration space 21 as much as the lower end of the hanging portion 4 a is in contact with the element substrate 3. The route becomes longer. Therefore, it is also possible to suppress moisture from entering the vibration space 21 and suppress corrosion of the excitation electrode 5 and the like.

  FIG. 23 is an enlarged cross-sectional view showing another modified example of the SAW device 1 in the first embodiment, and is an enlarged cross-sectional view of a portion corresponding to the portion shown in FIG.

  First, in the modification shown in FIG. 23A, the hanging part 4 a is also provided on the outer wall side of the frame part 2. That is, the SAW device 1 shown in FIG. 23A is continuous from the upper side of the inner wall 2a of the frame part 2 and from the upper side of the hanging part 4a covering a part of the inner wall 2a and the outer wall 2b of the frame part 2. It has a hanging part 4a that covers a part of the outer wall 2b.

  By forming the hanging part 4a not only on the inner wall 2a side but also on the outer wall 2b side in this way, the contact area between the frame part 2 and the lid part 4 is further increased, so that the frame part 2 and the lid part 4 are peeled off. The suppression effect can be improved. In addition, since the portion between the frame portion 2 and the lid portion 4 that can serve as a moisture intrusion path from the outside becomes longer, the effect of suppressing moisture intrusion into the vibration space 21 is also improved.

  On the other hand, in the modification shown in FIG. 23B, the hanging part 4 a is provided only on the outer wall side of the frame part 2 and is not provided on the inner wall side of the frame part 2. Thus, when the hanging part 4 a is provided only on the outer wall side of the frame part 2, the frame part 2 and the lid part 4 are the same as the above-described SAW device 1 provided with the hanging part 4 a only on the inner wall side of the frame part 2. Can be prevented and moisture can be prevented from entering the vibration space 21. In particular, when the distance between the excitation electrode 5 and the inner wall 2a of the frame portion 2 is short, if the hanging portion 4a is formed on the inner wall 2a side, the hanging portion 4a is likely to come into contact with the excitation electrode 5, so that FIG. By forming the hanging portion 4a only on the outer wall 2b side of the frame portion 2 as in the SAW device shown, the frame portion 2 and the lid portion 4 are peeled off and the vibration space is prevented while the contacting of the hanging portion 4a to the excitation electrode 5 is prevented. Intrusion of moisture into 21 can be suppressed.

  It should be noted that the position where the hanging part 4a is formed depends on, for example, the rotation speed or temperature of the roller 30 such that the rotation speed of the roller 30 shown in FIG. 6A is decreased at the position where the hanging part 4a is formed. It can be controlled by adjusting etc.

<Second Embodiment>
FIG. 8 is a cross-sectional view corresponding to FIG. 2 showing the SAW device 101 of the second embodiment. The SAW device 101 has a reinforcing layer 22 disposed on the upper surface of the cover 9.

  The reinforcing layer 22 is for reinforcing the strength of the cover 9 (particularly the lid portion 4). The reinforcing layer 22 is formed over a relatively wide range of the cover 9. For example, the reinforcing layer 22 is formed over substantially the entire upper surface of the cover 9. Therefore, the reinforcing layer 22 covers the entire vibration space 21 in a plan view, extends to the outside of the vibration space 21, and is supported by the frame portion 2 together with the lid portion 4.

  Since the SAW device 101 has the hanging portion 4a, a minute recess 4b is formed in the upper surface of the cover 9 in a region immediately above the hanging portion 4a. The reinforcing layer 22 is formed on the inner surface of the minute recess 4b. It is formed in contact. Therefore, the contact area between the reinforcing layer 22 and the upper surface of the cover 9 is increased, and the peeling of the reinforcing layer 22 from the cover 9 can be suppressed.

  The reinforcing layer 22 is made of a material having a Young's modulus higher than that of the cover 9. For example, the cover 9 is made of a resin having a Young's modulus of 0.5 to 1 GPa, whereas the reinforcing layer 22 is made of a metal having a Young's modulus of 100 to 250 GPa. The thickness of the reinforcing layer 22 is, for example, 1 to 50 μm.

  The reinforcing layer 22 includes, for example, a base layer that is located directly on the upper surface of the cover 9 and a metal portion that overlaps the base layer. The underlayer is formed of, for example, copper, titanium, or a laminate of these. The thickness of the underlayer is, for example, 300 nm to 1 μm when the underlayer is made of copper, and 10 nm to 100 nm when the underlayer is made of titanium. The metal part is made of, for example, copper.

<Third Embodiment>
FIG. 9 is a cross-sectional view corresponding to FIG. 2 showing the SAW device 201 of the third embodiment.

  The SAW device 201 has a sealing film 23 that covers from the outer wall 2 b of the frame portion 2 to the side wall 4 c of the lid portion 4.

  Thus, by providing the sealing film 23 covering the outer wall 2b of the frame part 2 to the side wall 4c of the lid part 4, the vibration space 21 such as moisture that can enter from between the frame part 2 and the lid part 4 is introduced into the vibration space 21. The invasion suppressing effect can be further enhanced.

  As the sealing film 23, for example, an insulating material such as silicon oxide or silicon nitride, or a metal material such as copper can be used. In the SAW device 201, the sealing film 23 is formed of a metal material, and is continuously formed not only from the outer wall 2 b of the frame portion 2 to the side wall 4 c of the lid portion 4 but also to the upper surface of the cover 9. As a result, the sealing film 23 can also be used as the reinforcing layer 22 of the SAW device 101 in the second embodiment.

  In addition, since the side wall 4c of the lid part 4 is positioned on the inner side of the outer wall 2b of the frame part 2, there is a step in the portion between the outer wall 2b of the frame part 2 and the side wall 4c of the lid part 4, It becomes easy to form the sealing film 23 having a sufficient thickness on the portion between the outer wall 2 b of the frame portion 2 and the side wall 4 c of the lid portion 4.

<Fourth Embodiment>
FIG. 10 is a cross-sectional view corresponding to FIG. 2 showing the SAW device 301 of the fourth embodiment. The SAW device 301 has a terminal 25. The terminal 25 is located on the pad 7 in a state of being electrically connected to the pad 7. Further, the terminal 25 penetrates the cover 9 in the vertical direction, and the end portion not connected to the pad 7 is exposed from the upper surface of the cover 9. The terminal 7 is formed by plating using copper or the like, for example.

  In addition, when the terminal 25 penetrating the cover 9 is provided and the reinforcing layer 22 is also provided, the entire reinforcing layer 22 is preferably covered with the insulating film 24. Thereby, when the SAW device 301 is mounted on the mounting substrate, the reinforcing layer 22 and the terminal 25 can be prevented from being short-circuited.

  A method for manufacturing the SAW device 301 will be described with reference to FIGS. Among the manufacturing steps of the SAW device 301, the steps up to the formation of the frame 2 (the steps shown in FIGS. 5A to 5C) are the same as the manufacturing steps of the SAW device 1, The description of the part is omitted, and the process of forming the frame part 2 will be described below.

  First, as shown in FIG. 11A, in the SAW device 301, since the columnar terminal 25 needs to be formed, the first through hole 33 is formed on the pad 7 on which the columnar terminal 25 is formed. As described above, the resin layer 17 to be the frame portion 2 is patterned.

  Subsequently, as illustrated in FIG. 11B, the resin layer 18 that becomes the lid portion 4 is bonded to the frame portion 2 and the hanging portion 4 a is formed. This process is basically the same as the process of the SAW device 1 shown in FIG. Here, a photosensitive negative resist is used as the resin layer 18.

  Next, as shown in FIG. 11C, the resin layer 18 is exposed through the mask 40. The mask 40 has a transparent substrate 38 and a light shielding portion 39 formed in a predetermined pattern on the lower surface of the transparent substrate 38.

  Since the resin layer 18 is a negative type, a portion of the resin layer 18 that is not exposed by the light-shielding portion 38 is removed by development after exposure. Therefore, the light shielding portion 38 is disposed at a position corresponding to the position where the resin layer 18 is to be removed when the position of the mask 40 is set, and has a shape corresponding to the shape of the portion to be removed. In this embodiment, a light shielding part 39 disposed immediately above the first through hole 33 and a light shielding part 39 disposed immediately above the region between the first through hole 33 and the vibration space 21 are provided. Yes.

  Here, the reason why the light shielding part 39 is provided also in the portion directly above the region between the first through hole 33 and the vibration space 21 will be described in comparison with the case where such a light shielding part 39 is not provided.

  When exposure is performed using a mask 40 not provided with a light shielding portion 39 in a portion immediately above the region between the first through hole 33 and the vibration space 21, and then development processing is performed, as shown in FIG. In some cases, the minute protrusions 26 are formed on the inner peripheral surface of the second through hole 34 for arranging the upper portion of the terminal 25.

  Although the mechanism by which such fine protrusions 26 are formed is not clear, it is presumed that the following phenomenon occurs in the exposure process to the resin layer 18.

  FIG. 13A is a cross-sectional view showing a process of performing exposure using a mask 40 in which a light shielding portion 39 is not provided in a portion immediately above a region between the first through hole 33 and the vibration space 21. As shown in FIG. 13A, a part of the exposure light L is scattered at the lower end of the hanging part 4a, and a part of the scattered light is a part directly above the first through hole 33 in the resin layer 18. It is considered that Then, a portion that is not originally exposed is exposed, and it is assumed that when the development process is performed thereafter, the minute protrusions 26 shown in FIG. 13B are formed.

  If such a minute protrusion 26 exists on the inner peripheral surface of the second through hole 34, the minute protrusion 26 becomes an obstacle when a plating base film is formed on the inner peripheral surface of the second through hole 34 by sputtering or the like. Thus, a portion where the plating base film is not formed is formed. Since the plating does not grow on the portion where the plating base film does not exist, the shape of the terminal 25 becomes distorted, which causes a mounting defect or the like.

  On the other hand, as shown in FIG. 11 (c), if a light shielding part 39 is provided immediately above the region between the first through hole 33 and the vibration space 21, the exposure light scattered at the lower end part of the hanging part 4a. Even if a part of the light L is directed to the region directly above the first through-hole 33, the portion inside the region directly above the first through-hole 33 that is not exposed before reaching the first through-hole 33 (in FIG. 11C) Since the region T) surrounded by the dotted line is exposed and used for exposure of the region T, it is difficult to reach the region directly above the first through hole 33. As a result, exposure to the region immediately above the first through-hole 33 due to scattered light is suppressed, and the minute protrusions 26 are less likely to be formed.

  Thereafter, by performing development processing, as shown in FIG. 12A, the second through hole 34 connected to the first through hole 33 is formed, and the cover 9 including the lid portion 4 and the frame portion 2 is formed. Complete. Further, since the illuminance of exposure to the region T by the scattered light is relatively weak, the region T is not sufficiently exposed, and the groove 12 is formed. In order to prevent the groove portion 12 from being formed, the width of the light shielding portion 39 corresponding to the region T in FIG. 11C may be made smaller than a predetermined dimension. This is because by making the width of the light shielding portion 39 smaller than a predetermined dimension, the entire region T is exposed even by weak exposure with scattered light.

  Next, as shown in FIG. 12B, a plating resist layer 41 is formed. The plating resist layer 41 is patterned so as to have openings in portions where the terminals 25 are to be formed and portions where the reinforcing layer 22 is to be formed. Before forming the plating resist layer 41, a plating base film is formed on the upper surface of the lid portion 4, the inner peripheral surfaces of the first through hole 33 and the second through hole 34, and the bottom surface of the first through hole. . The plating base film is formed by, for example, a sputtering method.

  Next, as shown in FIG. 12C, the terminal 25 and the reinforcing layer 22 are formed by plating.

  Specifically, first, a plating treatment is performed on the plating base film exposed from the plating resist layer 41 to grow the plating. Then, the upper surface of the grown plating is flattened by chemical mechanical polishing (CMP) or the like, and the plating resist layer 41 is removed. Thereby, the terminal 25 and the reinforcing layer 22 are completed.

  The plating method may be selected as appropriate, but the electroplating method is preferable. This is because the electroplating method has a high degree of freedom in the height of the columnar terminals 25 and has good adhesion to the plating base film.

  Finally, an insulating film 24 that covers the reinforcing layer 22 is formed. The insulating film 24 can be formed, for example, by applying a negative photosensitive resin to the upper surface of the cover 9 by spin coating or the like, and then performing exposure / development processing and patterning. The insulating film 24 may be filled in the groove 12. The SAW device 301 is completed through the above steps.

(Modification)
FIG. 14 is a cross-sectional view showing a modification of the SAW device 301 in the fourth embodiment. In this modification, a groove 12 is formed in a portion of the upper surface of the cover 9 that is located between the terminal 25 and the vibration space 21 when the cover 9 is viewed in plan, and a part of the reinforcing layer 22 is formed in the groove 12. Is to fit. In this way, by fitting a part of the reinforcing layer 22 into the groove portion 12, peeling of the reinforcing layer 22 from the cover 9 can be suppressed. For example, as shown in FIG. 11C, the groove 12 for fitting the reinforcing layer 22 is formed by performing exposure using a mask 40 provided with a light shielding portion 39 at a position where the groove 12 is to be formed. be able to.

<Fifth Embodiment>
FIG. 15 is a plan view showing a SAW device 401 according to the fifth embodiment. In FIG. 15, the outer periphery of the vibration space 21 (the inner wall 2a of the frame portion) is indicated by a dotted line.

  The SAW device 401 has a recess 10 in a predetermined region of the main surface 3 a of the element substrate 3. As shown in FIG. 15, the recess 10 is provided so as to be exposed from the frame portion 2 when viewed in plan.

  16 is a partial cross-sectional view taken along line XVI-XVI in FIG. In the SAW device 401, the concave portion 10 is provided at a position just in contact with the outer wall 2b of the frame portion 2 when viewed in plan.

  It has been confirmed by simulation that the stress applied to the cover 9 can be reduced by providing the concave portion 10 on the main surface 3a of the element substrate 3 when the ambient temperature changes.

  FIG. 17 shows a reference analysis model S of the SAW device used for the simulation. The reference analysis model S is a simple model obtained by cutting out a part of a solid formed with the rotational symmetry axis A as a rotation axis. The material of the element substrate 3 is a lithium tantalate single crystal, and the cover 9 has a coefficient of thermal expansion at −40 ° C. of 38.5 ppm / ° C. (actual value) and a coefficient of thermal expansion at 85 ° C. of 50 ppm / ° C. (actual value). Material. The dimensions of each part are as shown in FIG. The SAW device of the reference analysis model S was formed with various recesses 10 or notches 13 as analysis models A to E.

  The analysis model A is obtained by forming the recess 10 shown in FIG. 16 in the reference analysis model S, and the recess 10 is formed at a position in contact with the outer wall 2 b of the frame 2. The analysis model B is obtained by forming the concave portion 10 shown in FIG. 18A in the reference analysis model S. The concave portion 10 is partially located below the frame portion 2 and the remaining portion is the frame portion 2. To the outside area. The analysis model C is obtained by forming the concave portion 10 shown in FIG. 18B in the reference analysis model S, and the entire concave portion 10 is located below the frame portion 2. The analysis model D is obtained by forming the recess 10 shown in FIG. 18C in the reference analysis model S, and the entire recess 10 is exposed from the frame 2. The analysis model E is a reference analysis model S in which notches 13 but notches 13 are formed. The notch 13 is formed so that the corner of the element substrate 3 is notched to the side surface starting from the portion of the outer wall 2b of the frame 2 that contacts the main surface of the element substrate 3.

  For each of these analysis models, when the environmental temperature was changed from 85 ° C. to −40 ° C., the maximum principal stress applied to the cover 9 was examined by simulation using a finite element method. The results are shown in Table 1. Table 1 also shows the depth d and width w dimensions of the recess 10 or the notch 13 provided in each analysis model.

  As can be seen from the results shown in this table, the maximum principal stress applied to the cover 9 is smaller than that of the reference analysis model S in the analysis model A, analysis model B, analysis model D, and analysis model E other than the analysis model C. It was. On the other hand, the analysis model C has a maximum principal stress larger than that of the reference analysis model S.

  Considering from this result, a part of the main surface 3a of the element substrate 3 is partly viewed in plan view in a region outside the portion located at the lower end of the inner wall 2a of the frame portion 2 that partitions the vibration space 21. A recess 10 that is located under the frame 2 or is entirely located outside the frame 2 or a notch 13 that extends from the vicinity of the lower end of the outer wall 2 b of the frame 2 to the side surface of the element substrate 3. It can be said that the stress applied to the cover 9 when a large temperature change occurs can be reduced. By reducing the stress applied to the cover 9 in this way, it is possible to suppress peeling of the cover 9 from the element substrate 3.

  The reason why the stress applied to the cover 9 can be reduced by forming the recess 10 or the notch 13 in this way is not necessarily clear, but one reason is that the thermal stress is relaxed. It is thought that. In the SAW device, when the element substrate 3 is formed of a piezoelectric material and the cover 9 is formed of resin, the cover 9 is changed according to the temperature change of the surrounding environment due to the difference in thermal expansion coefficient between the element substrate 3 and the cover 9. Thermal stress is generated. At this time, for example, if the concave portion 10 is provided as shown in FIG. 16, the element substrate 3 also follows the contraction indicated by the white arrow S1 of the cover 9 (frame part 2) as indicated by the white arrow S2. It is considered that the thermal stress of the cover 9 is reduced by some deformation.

  In the analysis model D shown in FIG. 18C, the interval between the edge of the recess 10 on the frame 2 side and the outer wall 2b of the frame 2 is 4 μm. However, when the interval is larger than 4 μm, the cover 9 The effect of relieving the stress generated by is reduced. From this, if the recessed part 10 or the notch part 13 is formed in the vicinity of the frame part 2, more specifically, the edge on the frame part 2 side is in contact with the frame part 2, the stress relaxation effect is enhanced. It is considered possible.

  The cross-sectional shape of the recess 10 is not limited to a rectangular shape as shown in FIGS. 16 and 18 (a) to (c), and may be a triangular shape as shown in FIG. 19 (a). As shown in FIG. 19B, the bottom may have an arc shape. Further, the cross-sectional shape of the cutout portion 13 is not limited to a triangular shape as shown in FIG. 18 (d), and for example, as shown in FIG. It may be what was.

  Further, as shown in FIG. 15, when the planar shape of the element substrate 3 is rectangular, there is a tendency that cracks are likely to occur in the frame portion 2 on the short side of the element substrate 3. Although the cause for this is not clear, since a large stress tends to be applied to the short side of the element substrate 3 when the element substrate 3 is warped, the shrinkage stress of the lid portion 4 is applied to that portion, so that the lid One factor is considered to be that a crack occurs starting from the edge of the portion 4. Therefore, when the planar shape of the element substrate 3 is rectangular, if the concave portion 10 or the notch portion 13 is formed on the short side of the main surface 3a of the element substrate 3, the stress applied to the frame portion 2 is reduced. As a result, the occurrence of cracks in the frame 2 can be suppressed.

  In addition, the formation position of the recessed part 10 or the notch part 13 is not restricted to what was shown in FIG. 15, For example, as shown in FIG. 20, you may form in each edge | side of the main surface 3a. In addition, it may be formed in a frame shape along the outer periphery of the main surface 3a of the element substrate 3 or may be formed by mixing both the recess 10 and the notch 13.

  Such recesses 10 and notches 13 are formed in the above-described method of manufacturing the SAW device, for example, at the stage where the protective layer 8 shown in FIG. 5B is formed, the frame shown in FIG. At the stage where the portion 2 is formed or before the assembly of the wafer-like element substrate 3 before the cutting of the element substrate 3 in FIG. 6C, the main substrate of the element substrate 3 is obtained using a dicing blade or the like. It can be formed by making a cut in the surface 3a.

<Sixth Embodiment>
FIG. 21 is a cross-sectional view showing a SAW device 501 of the sixth embodiment, and FIG. 22 is an enlarged view of a region E shown in FIG.

  The SAW device 501 in the sixth embodiment has an extending portion 14 at the lower end portion of the cover 9 (frame portion 2). The extending portion 14 extends along the main surface 3 a of the element substrate 3 on the outer surface side and the inner surface side of the joint portion of the cover 9 with the element substrate 3. In other words, the elongated portion 14 extends from the inner wall 2a toward the vibration space 21 on the inner wall 2a side of the frame portion 2, and extends from the outer wall 2b to the outer periphery of the element substrate 3 on the outer wall 2b side of the frame portion 2. It stretches toward. The extending portion 14 is provided over substantially the entire circumference of the lower end portion of the cover 9, but is not provided in the vicinity of the wiring 15.

  By forming the extending portion 14 as described above, an infiltration path of moisture or the like to the vibrating space 21 between the cover 9 and the main surface 3a is increased by the amount of the extending portion 14, and thus the airtightness of the vibrating space 21 is increased. Sex can be maintained in a normal state for a long time. Therefore, corrosion of the excitation electrode 5 and the like in the vibration space can be suppressed, and the electrical characteristics of the SAW device 1 can be stabilized over a long period of time.

  The extending portion 14 is made of the same material as that of the cover 9, for example, and is formed integrally with the cover 9. If the extending portion 14 is formed integrally with the cover 9 in this way, the contact area on the main surface 3a side of the cover 9 can be considered to be increased by the amount of the extending portion 14, and thus the element substrate 3 of the cover 9 is moved to. The adhesion of the cover 9 can be improved, and the peeling of the cover 9 from the element substrate 3 can be suppressed. Note that the elongated portion 14 may be formed of a material different from that of the cover 9.

  From the viewpoint of lengthening the infiltration path for moisture or the like from the outside, it is also conceivable to increase the width of the frame 2 as it is. However, the thick part such as the frame part 2 needs to be separated from the excitation electrode 5 and the element substrate 3 by a predetermined distance, and cannot be simply increased. This is because, on the excitation electrode 5 side, if a large thickness like the frame portion 2 touches the excitation electrode 5, the vibration of the excitation electrode 5 is greatly affected, resulting in deterioration of electrical characteristics. Since the portion of the substrate 3 is a wafer dicing line on the outer peripheral side of the substrate 3, if the thick frame portion 2 is present on the dicing line, chipping occurs in the element substrate 3 or the like when the wafer is cut. It is because it becomes easy to do. Furthermore, as will be described later, when the SAW device 501 is mounted on another mounting substrate and the entire SAW device 501 is covered with an exterior resin, the outer wall of the cover 9 is located near the outer periphery of the element substrate 2. In addition, the exterior resin is less likely to enter between the SAW device 1 and the main surface of the mounting substrate, and there is a problem that a gap is easily formed in that portion.

  On the other hand, since the extension part 14 is formed so as to extend from the lower end part of the cover 9, it is assumed that the extension part 14 touches the excitation electrode 5 or extends to the vicinity of the outer periphery of the element substrate 3. The above problems are suppressed. In particular, if the extension portion 14 is formed so that the thickness gradually decreases as it goes outward, even if the tip of the extension portion 14 touches the excitation electrode 5, the electrical characteristics are not greatly affected. Even if it extends to the vicinity of the outer periphery, it is possible to more effectively suppress the chipping of the element substrate 3 and the like during wafer dicing. Furthermore, when the SAW device 501 is mounted on another mounting substrate and covered with an exterior resin, the formation of a gap between the SAW device 1 and the mounting substrate can be suppressed. The thickest portion of the elongated portion 14, that is, the thickness of the connecting portion with the cover 9 is, for example, 1/30 to 1/10 of the thickness of the frame portion 2. Specifically, when the thickness of the frame portion 2 is 30 μm, the size of the thickest portion of the elongated portion 14 is 1.5 μm. In addition, the horizontal width of the extending portion 14 is, for example, about 40 μm.

  The cross-sectional shape of the elongated portion 14 is not limited to the triangular shape shown in FIG. 22, and the outer periphery may be an arc shape, a trapezoidal shape, a rectangular shape, or the like.

<Seventh Embodiment>
24A to 24C are enlarged cross-sectional views of a portion corresponding to FIG. 3, showing the SAW device 601 of the seventh embodiment.

  In each of the SAW devices 601 shown in FIGS. 24A to 24C, an uneven portion is formed on the upper surface of the frame portion 2. On the other hand, the lower surface of the lid portion 4 is formed with an uneven portion that fits into the uneven portion formed in the frame portion 2, and when the lid portion 4 overlaps the frame portion 2, It fits in 2 uneven parts.

  Also by forming such uneven portions on the frame 2 and the lid 4, the contact area between the lid 4 and the frame 2 is increased in the same manner as the hanging part 4 a in the SAW device 1 of the first embodiment described above. Therefore, it is possible to suppress the peeling between the lid portion 4 and the frame portion 2 and to prevent moisture from entering the vibration space 21 from the outside.

  As shown in FIG. 24A, in order to form a relatively large recess on the upper surface of the frame portion 2, for example, the upper surface of the frame portion 2 is dry-etched at the stage of forming the frame portion 2 (FIG. 5D). Alternatively, it may be cut by wet etching.

  In order to form a comparatively large convex part on the upper surface of the frame part 2 as shown in FIG.24 (b), the frame part 2 should just be made into 2 layer structure, for example. Specifically, the first layer below the convex portion is formed by the photolithography method or the like in the same manner as the case of forming the normal frame portion 2 (FIG. 5D), and then the upper layer of the first layer is formed. The second layer to be a convex portion may be formed by a photolithography method or the like.

  In order to form relatively small irregularities on the upper surface of the frame part 2 as shown in FIG. 24C, for example, in the stage of forming the frame body 2 (FIG. 5D), oxygen is formed on the upper surface of the frame body 2. An ashing process may be performed using plasma or the like.

  The uneven portion of the lid portion 4 that fits into the uneven portion formed on the upper surface of the frame portion 2 is, for example, the rotation of the roller 30 at the stage of attaching a thin film to be the lid portion 4 to the frame portion 2 (FIG. 6A). It can be formed by setting the speed, temperature, temperature of the stage 29, etc. to predetermined conditions.

  24A to 24C show an example in which the cross-sectional shape of the concavo-convex portion is a rectangular shape, but the cross-sectional shape of the concavo-convex portion is not limited to this, for example, a triangular shape, a trapezoidal shape, an arc shape, etc. Any shape is possible. The depth of the concave portion in the concave and convex portion (height of the convex portion) is, for example, 10% to 10% of the thickness of the frame portion 2 when relatively large concave and convex portions are formed as shown in FIGS. 60%, specifically 1 μm to 20 μm. Further, when relatively small irregularities are formed as shown in FIG. 24C, it can be considered that the upper surface of the frame portion 2 is roughened, and the arithmetic operation of the upper surface of the roughened frame portion 2 is performed. The average roughness (arithmetic average roughness when measured with a laser microscope) is 0.5 μm to 2 μm.

  Further, the concavo-convex portions formed on the upper surface of the frame portion 2 may be formed so as to be evenly scattered on the upper surface of the frame portion 2 when the frame portion 2 is viewed in plan, or the concave portions are formed in the frame portion 2. You may form so that it may become a continuous groove | channel along the upper surface of this.

  The SAW device 1 according to the first embodiment also has a shape in which the frame-side uneven portion formed on the upper surface of the frame portion 2 and the lid-side uneven portion formed on the lower surface of the lid portion 4 are fitted. Can also be seen. That is, since the hanging part 4 a is formed on the lid part 4, a relatively large concave part is formed on the lower surface of the lid part 4, and a convex part that fits into the concave part is formed on the upper surface of the frame part 2. Can be seen.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects, and the above-described embodiments may be combined as appropriate. For example, with respect to the SAW device 1 of the first embodiment in which the hanging portion 4a is formed, an uneven portion is formed on the upper surface of the frame portion 2 like the SAW device 601 according to the sixth embodiment, and the lid portion 4 You may form the uneven | corrugated | grooved part which fits in the uneven | corrugated | grooved part of the frame part 2 in the lower surface of this.

  The elastic wave device is not limited to the SAW device. For example, the acoustic wave device may be a piezoelectric thin film resonator.

  In the acoustic wave device, the protective layer 8 and the back surface portion 11 are not essential requirements and may be omitted.

DESCRIPTION OF SYMBOLS 1 ... Elastic wave apparatus 2 ... Frame part 3 ... Element board | substrate 4 ... Cover part 4a ... Drop-down part 5 ... Excitation electrode 6 ... Connection reinforcement | strengthening layer 7 ... Pad 9 ... Cover 10 ... Recess

Claims (11)

An element substrate;
An excitation electrode located on the main surface of the element substrate;
Frame portion located on the main surface of the element substrate so as to surround the該励vibration electrodes, and with closing the said frame portion overlapping the said frame portion, at least the inner wall continuous side or we on the inner wall of the frame part An elastic wave device including a cover including a lid portion having a hanging portion covering a part thereof,
The elastic wave device in which the side wall of the lid part is located inside the outer wall of the frame part .   The elastic wave device according to claim 1, wherein a lower end of the hanging portion reaches a main surface of the element substrate.   3. The acoustic wave device according to claim 1, further comprising a metal reinforcing layer disposed on a main surface of the lid portion opposite to the element substrate and having an outer periphery located on the frame portion.   4. The acoustic wave device according to claim 1, wherein an outer wall of the frame portion is inclined so as to go outward as it goes toward a main surface of the element substrate. 5. An element substrate;
An excitation electrode located on the main surface of the element substrate;
A frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and the frame portion is closed to overlap the frame portion, and is connected to the upper side of the inner wall of the frame portion or the upper side of the outer wall. An elastic wave device comprising: a cover including a lid portion having a hanging portion covering at least a part of the outer wall;
The outer wall of the frame portion is inclined so as to go outward as it goes to the main surface of the element substrate.
An elastic wave device further comprising a sealing film covering at least an outer wall of the frame portion and a side wall of the lid portion. The elastic wave device according to any one of claims 1 to 5, wherein the lid portion is formed of the same material as the frame portion . An element substrate;
An excitation electrode located on the main surface of the element substrate;
A frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and a frame portion overlapping the frame portion
A cover that includes a lid portion that closes the frame portion and includes a hanging portion that covers at least a part of the inner wall or the outer wall from the upper side or the upper side of the inner wall of the frame portion;
An elastic wave device including a metal reinforcing layer disposed on a main surface of the lid portion opposite to the element substrate and having an outer periphery positioned on the frame portion;
A pad electrically connected to the excitation electrode, located in a portion of the main surface of the element substrate where the lid portion overlaps the frame portion;
A terminal extending from the pad through the frame and the lid and exposed on a main surface of the lid opposite to the element substrate;
The lid portion has a groove portion provided in a portion located between the terminal and the inner wall of the frame portion on the main surface opposite to the element substrate when viewed in plan, is fitted wait though that elastic wave device portion of the reinforcing layer. An element substrate;
An excitation electrode located on the main surface of the element substrate;
A frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and the frame portion is closed to overlap the frame portion, and is connected to the upper side of the inner wall of the frame portion or the upper side of the outer wall. An elastic wave device comprising: a cover including a lid portion having a hanging portion covering at least a part of the outer wall;
The element substrate is located in a region outside the lower end of the inner wall of the frame portion of the main surface, partly located below the frame portion when viewed in plan, or entirely outside the frame portion. position elastic wave device that has a recess for. An element substrate;
An excitation electrode located on the main surface of the element substrate;
A frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and the frame portion is closed to overlap the frame portion, and is connected to the upper side of the inner wall of the frame portion or the upper side of the outer wall. An elastic wave device comprising: a cover including a lid portion having a hanging portion covering at least a part of the outer wall;
The element substrate is elastic wave device that has a notch which extends from the vicinity of the lower end of the outer wall of the frame portion of the main surface to the side surface. An element substrate;
An excitation electrode located on the main surface of the element substrate;
A frame portion positioned on the main surface of the element substrate so as to surround the excitation electrode, and the frame portion is closed to overlap the frame portion, and is connected to the upper side of the inner wall of the frame portion or the upper side of the outer wall. An elastic wave device comprising: a cover including a lid portion having a hanging portion covering at least a part of the outer wall;
The frame portion, the junction of the at least one of the element substrate of the inner wall side and the outer wall, though that elastic wave device has an extension extending along the main surface of the element substrate. A mounting board;
The acoustic wave device according to any one of claims 1 to 10, which is mounted via a conductive bonding material in a state where the main surface of the element substrate faces the main surface of the mounting substrate,
An electronic component comprising: a mold resin that covers the acoustic wave device.

Images