JP5120320B2 - Package structure, printed circuit board on which the package structure is mounted, and electronic apparatus having the printed circuit board - Google Patents

Description

  The present invention generally relates to fixing a substrate, and more particularly to fixing a package substrate having a heat dissipation mechanism. The present invention is suitable not only for fixing a heat sink and a BGA (Ball Grid Array) package, but also for fixing a package such as an LGA (Land Grid Array) or PGA (Pin Grid Array). The present invention also relates to a printed circuit board (for example, a mother board) on which such a package substrate is mounted and an electronic device (for example, a server) including the printed circuit board.

  With the recent spread of electronic devices, the demand for supplying high-performance and small electronic devices is increasing. In order to satisfy such a requirement, a BGA package has been conventionally proposed. A BGA package is a type of package substrate that is connected to a printed circuit board (sometimes called a "system board" or "motherboard") by soldering. Compared to QFP (Quad Flat Package) with Gullwing type leads on four sides, the BGA package realizes a narrower lead pitch and multiple pins (multiple leads) without increasing the package size, It is intended to achieve high performance and miniaturization of electronic devices by increasing the package density.

  A BGA package generally includes an IC or LSI that functions as a CPU, and the amount of heat generated increases as the performance of the CPU improves. Therefore, in order to thermally protect the CPU, a cooling device called a heat sink is thermally connected to the CPU via a heat spreader. The heat sink includes cooling fins, and dissipates the CPU by natural cooling in the vicinity of the CPU.

  Hereinafter, a conventional BGA package will be described with reference to FIG. Here, FIG. 12 is a schematic cross-sectional view for explaining a conventional BGA package 1000. As shown in FIG. 12, a ceramic package substrate 1400 on which an LSI 1100 is mounted via a bump 1200 and an underfill 1300 is mounted on a printed circuit board 1600 via a BGA 1500, and via a heat spreader 1700 having a lid (Lid) structure. A heat sink (not shown) is thermally connected. The LSI 1100 and the heat spreader 1700 are bonded by a bonding layer 1800.

  Thus, in the conventional BGA package 1000, the LSI 1100 is mounted on the ceramic package substrate 1400. This is because the LSI 1100 and the ceramic have a thermal expansion coefficient close to each other, so that the LSI 1100 and the package substrate 1400 are not warped when the LSI 1100 is mounted. Note that the underfill 1300 is in direct contact with the package substrate 1400, but the difference in thermal expansion between the LSI 1100 and the package substrate 1400 becomes dominant because the thickness of the underfill 1300 is thin. In such a configuration, since the package substrate 1400 and the LSI 1100 having substantially the same coefficient of thermal expansion are used, the stress generated between them due to thermal expansion and contraction is very small.

  On the other hand, a heat spreader 1700 is attached to the back surface of the LSI 1100 via a bonding layer 1800. However, even if a material having a high thermal conductivity (Cu or the like) is used for the heat spreader 1700, the heat transfer efficiency of the entire package is improved. I could not. In many cases, the bonding layer 1800 between the LSI 1100 and the heat spreader 1700 must be made of a resin having a low thermal conductivity, a silicon-based adhesive, or a bonding material in the form of a sheet or paste. This is because it becomes a gap. Although it is conceivable to use a metal having high thermal conductivity such as solder for the bonding layer 1800, the difference in coefficient of thermal expansion between the LSI 1100 and the heat spreader 1700 causes a strong thermal stress between the two as the temperature of the LSI 1100 rises. Since the layer 1800 and / or the LSI 1100 is destroyed, it cannot be easily performed.

  In view of this, a proposal has been made to provide a BGA package having high heat transfer efficiency by avoiding thermal stress generated between the LSI 1100 and the heat spreader by using a liquid having high thermal conductivity such as a liquid metal for the bonding layer 1800 (for example, , See Patent Document 1). FIG. 13 is a schematic cross-sectional view for explaining the manufacture of the BGA package 2000 using a liquid metal for the bonding layer. In the BGA package 2000, the LSI 2100 shown in FIG. 13 (a) is etched to form a recess 2200 as shown in FIG. 13 (b). Next, the liquid metal 2300 is injected into the recess 2200 and sealed with the heat conductive coating 2400. Since the chemical properties of the liquid metal 2300 are likely to cause chemical reactions such as hydroxylation and oxidation, the liquid metal 2300 is corroded, so that it is completely separated from the air and the substrate by the heat conductive coating 2400.

  As another conventional technique, there is a BGA package structure in which a coolant is brought into contact with the upper surface of the LSI and the coolant is circulated.

JP-A-60-84848

  In order to further improve the performance of the BGA package, it is considered to use a resin instead of ceramic for the package substrate. Since the resin substrate is thinner than the ceramic substrate, it can be expected to have improved electrical characteristics than the ceramic substrate.

  However, since the thermal expansion coefficients of the resin package substrate and the LSI are different, thermal stress is generated between the two as the LSI temperature rises. In particular, since the resin substrate has a large difference in thermal expansion coefficient from the LSI, the LSI warps, and the heat spreader bonded to the back of the LSI is also affected by the warp generated at the bonding of the package substrate and the LSI. Warping occurs. Then, as shown in FIGS. 14 and 15, the bonding layer 1800 is peeled off, the thermal connection between the LSI 1100 and a heat sink (not shown) is cut, and the LSI 1100 is damaged by heat. Of course, the physical LSI 1100, the bonding layer 1800, and the heat spreader 1700 may be damaged due to warpage of the LSI 1100. Here, FIG. 14 is a schematic cross-sectional view of a BGA package for explaining a conventional problem. FIG. 14 (a) shows a case where the LSI is hot, and FIG. 14 (b) shows a case where the LSI is cold. Shows the case. FIG. 15 is an enlarged cross-sectional view showing a state in which the thermal connection between the LSI and the heat spreader is cut by peeling off the bonding layer.

  On the other hand, BGA packages that use liquid metal for the bonding layer require fine processing technology such as etching and advanced processing technology such as thermal conductive film deposition and liquid metal sealing. On the other hand, a thermally conductive coating of the same size does not have a heat diffusing capability, and an improvement in cooling performance cannot be desired for an LSI that generates more heat as the performance improves. In addition, as described above, the LSI warpage may occur due to the difference in thermal expansion coefficient between the resinous package substrate and the LSI, which may damage the thermally conductive coating. Furthermore, the thermal conductive film may be damaged by the expansion of the liquid metal. Therefore, as shown in FIG. 16, the BGA package 2000 is mounted on the package substrate 2600 as an integrated structure so that the LSI 2100 in which the liquid metal 2300 is sealed with the heat conductive coating 2400 is surrounded by the cooling fins 2500. Although it is conceivable to reduce damage to the film 2400, the structure becomes large and complicated. Further, there remains a problem with respect to the thermal conductivity of the joint between the heat conductive coating 2400 and the heat sink 2500.

  Therefore, the present invention provides a package structure capable of improving the reliability by preventing the breakage of the joint portion between the package substrate and the LSI and the joint portion between the LSI and the heat spreader with a simple configuration, and a printed board on which the same is mounted. An exemplary object is to provide an electronic apparatus having such a printed circuit board.

A package structure according to one aspect of the present invention is a package structure that can be mounted on an external printed circuit board, and includes a package substrate on which a heat generating circuit element is mounted, and heat from the heat generating circuit element. A heat spreader that transmits to a heat sink for radiating the element, and a joining member that seals between the heat-generating circuit element and the heat spreader, and forms a sealed space in cooperation with the heat-generating circuit element and the heat spreader. the anda liquid metal sealed in the sealing space, the joining member is made of copper or aluminum nitride to connect the heat spreader and the heat generating resistance circuit elements in the outer periphery of the exothermic circuit element material The heat spreader has a concavo-convex shape larger than the surface connected to the bonding member on the surface forming the sealing space. Characterized in that it has. According to such a package structure, the exothermic circuit element, the heat spreader, and the liquid metal sealed in the sealing space formed by the joining member, and the exothermic circuit element and the heat spreader are thermally connected by the joining member, It is possible to block the thermal stress caused by the heat generation of the conductive circuit element and realize high thermal conductivity. Further, the thermal stress applied to the joining member can be minimized. Further, the surface area of the heat spreader that contacts the liquid metal can be increased. The heat spreader includes a first member connected to the joining member and a second member that is divided from the first member. The heat spreader includes a first member having a bottom connected to the joining member, a second member having a convex cross section having a convex portion on the heat-generating circuit element side while being fitted to the first member. You may have. Thereby, it is possible to form a sealing structure for sealing the liquid metal with a simple configuration. The bottom of the first member preferably has a thickness of 200 μm or more and 1 mm or less in order to function as a leaf spring . Before SL spreader may be formed of an elastic member. The package substrate may include a plurality of the exothermic circuit elements. The package substrate is made of resin. As described above, the resin substrate provides lower cost, higher performance, and easier processing than the ceramic substrate, but the configuration of the present invention is particularly preferable because of the difference in thermal expansion coefficient with the exothermic circuit element. is there.

  A printed circuit board having the above-described package structure and an electronic device having such a printed circuit board also constitute one aspect of the present invention.

According to another aspect of the present invention, there is provided a package structure manufacturing method , comprising: a heat spreader that transfers heat from a heat generating circuit element mounted on a package substrate to a heat sink for dissipating the heat generating circuit element, a first member connected to said heating element through a member fitted to said first member, have a second member forming a sealed space between the exoergic circuit elements the surface which is to form the sealing space has a heat spreader to have a large unevenness than the surface to be connected to the joining member, a manufacturing method of a mountable package structure to an external printed circuit board, the heating and connecting through the joint member consists of said first member and said heat generating resistance circuit elements in the outer periphery of the sexual circuit elements of a material made of copper or aluminum nitride, wherein the connection step A step of injecting a liquid metal between the exothermic circuit element and the first member connected in the step, and a step of fitting the second member into the first member and injecting in the injection step. Sealing the liquid metal in the sealing space. According to this manufacturing method, it is possible to form a liquid metal sealing structure without requiring an advanced processing technique, and it is possible to prevent an increase in the size of the sealing structure.

  Further objects and other features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  ADVANTAGE OF THE INVENTION According to this invention, the package structure which can prevent the destruction of the junction part of a package board | substrate and LSI, and the junction part of LSI and a heat spreader, although it is a simple structure, can improve reliability, and a printed circuit board carrying the same In addition, an electronic device having such a printed circuit board can be provided.

It is a schematic perspective view of the electronic device of this invention. It is a schematic perspective view which shows the internal structure of the electronic device shown in FIG. It is a schematic sectional drawing of the package module shown in FIG. FIG. 4 is a schematic top view of an LSI showing a connection state with a heat spreader in the package module shown in FIG. 3. It is a schematic sectional drawing which shows an example of the package module shown in FIG. It is a schematic sectional drawing which shows an example of the package module shown in FIG. FIG. 5 is a schematic top view of an LSI showing another connection state between the LSI shown in FIG. 4 and a heat spreader. It is a schematic sectional drawing which shows an example of the package module shown in FIG. It is a schematic sectional drawing which shows an example of the package module shown in FIG. It is a schematic sectional drawing of the package module which has a multichip type package substrate. It is a flowchart for demonstrating the manufacturing method of the package module of this invention. It is a schematic sectional drawing for demonstrating the conventional BGA package. It is a schematic sectional drawing for demonstrating manufacture of the BGA package which used the liquid metal for the joining layer. It is a schematic sectional drawing which shows the problem of the conventional BGA package. It is an expanded sectional view showing the state where the thermal connection of LSI and heat spreader was cut off by peeling of the bonding layer. FIG. 14 is a schematic cross-sectional view of the BGA package shown in FIG. 13 integrated with a cooling fin.

  Hereinafter, a package module 100, a printed circuit board 200 on which the package module 100 is mounted, and an electronic device 300 on which the printed circuit board 200 is mounted will be described with reference to the accompanying drawings. Here, FIG. 1 is a schematic perspective view of the electronic apparatus 300. FIG. 2 is an external perspective view of a system board as a printed circuit board 200 mounted on the electronic device 300. In the following description, the reference numbers with uppercase alphabets are summarized by reference numbers without alphabets.

  As shown in FIG. 1, the electronic apparatus 300 of the present embodiment is illustratively embodied as a rack-mount type UNIX server. The electronic device 300 is screwed to a rack (not shown) by a pair of mounting portions 302, and the printed circuit board 200 shown in FIG.

  The housing 310 is provided with a fan module 320. The fan module 320 forcibly cools the heat sink 190 connected to the heat spreader 150 (described later) by rotating an internal cooling fan to generate an air flow. The fan module 320 has a power unit (not shown) and a propeller unit (not shown) fixed to the power unit. Since the power unit typically can use any structure known in the art, such as a rotating shaft, a bearing provided around the rotating shaft, a bearing house, and a magnet constituting a motor, Then, detailed explanation is omitted. The propeller portion has a desired number of rotor blades formed at a desired angle. The rotor blades are arranged conformally or non-equally and have a desired dimension. The power unit and the propeller unit may be split or not split.

  As shown in FIG. 2, the printed circuit board 200 includes a package module 100, an LSI module 210 around the package module 100, a plurality of block plates 220 for inserting a memory card 240, and external devices such as a hard disk and a LAN. And a connector 230.

  The package module 100 functions as a BGA package on which the LSI 102 is mounted and connected to the printed circuit board 200 via the BGA 120. More specifically, as shown in FIGS. 2 and 3, the package module 100 includes a package substrate 110, a BGA 120, a reinforcing metal 130, a joining member 140, a heat spreader 150, a liquid metal 160, and a heat sink. 190. Here, FIG. 3 is a schematic sectional view of the package module 100 shown in FIG. However, in FIG. 3, the heat sink 190 shown in FIG. 2 is omitted.

  The package substrate 110 has a thickness of about 500 μm to 1 mm and is made of resin. Compared with a ceramic substrate having a thickness of about 2 mm to 3 mm, the resin substrate has the advantages of being excellent in electrical characteristics because it is thin, cheaper than ceramic, and easy to process.

  The package substrate 110 has an LSI 102 functioning as a CPU mounted on the top surface, and a BGA 120 and a capacitor and other circuit components 108 mounted on the bottom surface. The package substrate 110 of this embodiment is a single chip type on which one LSI 102 is mounted.

  While the thickness of the package substrate 110 is about 500 μm, the thickness of the underfill 106 described later is about 100 μm. Therefore, the package substrate 110 is more than the difference in thermal expansion between the package substrate 110 and the underfill 106. And the thermal expansion difference between the LSI 102 becomes dominant.

  The LSI 102 is a heat-generating circuit element, and is soldered to the package substrate 110 by bumps 104 as terminals. A flip chip (bump) is provided between the LSI 102 and the package substrate 110 in order to guarantee the connection reliability of the bumps 104. The resin underfill 106 that is generally used for the chip) is filled, and the bumps 104 are sealed.

  The BGA 120 is configured as a ball-shaped solder bump (solder ball), and is arranged in a grid pattern at a connection portion with the printed circuit board 200 on the bottom surface of the package substrate 110. In other words, the BGA 120 functions as a terminal and is firmly connected to the printed circuit board 200 by solder balls (soldering). The BGA package is not connected by leads provided on four sides as in the QFP package, but is connected by the BGA 120. Therefore, the BGA package can reduce the pitch between terminals and arrange many terminals. This achieves higher density without increasing the size of the package and contributes to higher performance and smaller size. When the circuit component 108 is present on the bottom surface of the package substrate 110 as in the present embodiment, the BGA 120 may have solder bumps arranged in a substantially square shape having a substantially square hollow shape, or when the circuit component 108 is not present. The solder bump may be disposed on the entire bottom surface of the package substrate 110.

  The reinforcing metal 130 is provided on the upper surface of the package substrate 110 and has a function of reinforcing the package substrate 110. Specifically, the reinforcing metal 130 corrects the twist of the package substrate 110. The reinforcing metal 130 is made of, for example, aluminum or copper, and has a substantially square shape having a substantially square hollow. However, whether to provide the reinforcing metal 130 is optional.

  The bonding member 140 has a function of sealing between the LSI 102 and a heat spreader 150 to be described later and forming a sealing space CA in cooperation with the LSI 102 and the heat spreader 150. The joining member 140 has a substantially rectangular shape according to the outer shape of the LSI 102 and has a hollow shape. The joining member 140 has dimensions of about 20 μm to 200 μm in height and about 2 mm to 6 mm in width.

The joining member 140 is made of, for example, a solid metal such as aluminum nitride or copper having high thermal conductivity, and connects the LSI 102 and a heat spreader 150 described later on the outer periphery of the LSI 102. In other words, the bonding member 140 solid-bonds (metal bonds) the LSI 102 and the heat spreader 150. By limiting the position where the bonding member 140 is installed to the outer periphery of the LSI 102, it is possible to minimize the load of thermal stress applied to the LSI 102. Further, since the material is made of a material having high thermal conductivity, the bonding member 140 does not become a temperature gap between the LSI 102 and the heat spreader 150, and excellent thermal conductivity can be realized.

  The joining member 140 may be an adhesive sheet or an adhesive. However, the adhesive sheet or adhesive is used when the calorific value of the LSI 102 is small or when the thermal expansion coefficients of the two members to be bonded (here, the package substrate 110 and the heat spreader 150) are close. This is because if there is a difference in thermal expansion coefficient, the bonding function may be lost due to warping (sealing of the sealing space CA may be impaired).

  The heat spreader 150 is disposed between the package substrate 110 and the heat sink 190, and is connected to the LSI 102 by the bonding member 140. The heat spreader 150 has a function of transferring heat from the LSI 102 to the heat sink 190, and is made of copper, aluminum carbide, aluminum, aluminum silicon carbide (silicon-containing aluminum), silicon carbide, or the like having high thermal conductivity. As shown in FIG. 3, the heat spreader 150 is divided into two parts including a first member 152 connected to the joining member 140 and a second member 154 that is divided from the first member 152. It has a structure. Thereby, it becomes possible to form the sealing space CA which seals the liquid metal 160 which will be described later, and the enlargement of the sealing structure can be prevented.

  In the first member 152, the bottom 152 a that is joined to the joining member 140 has a substantially square shape similar to the shape of the package substrate 110 and has a hollow portion 152 b. The shape of the hollow portion 152b is also substantially square according to the outer shape of the bonding member 140 (LSI 102), and accommodates a convex portion 154a of the second member 154 described later. However, the hollow portion 152b does not store the convex portion 154a of the second member 154 in close contact, but stores it with a gap between the convex portion 154a. Parts.

  A fitting portion 152 c into which the second member 154 is fitted is provided on the bottom portion 152 a of the first member 152. The fitting portion 152c is provided so as to protrude from the bottom portion 152a. When the second member 154 is fitted, a gap is formed between the bottom portion 152a and the second member 154, and the gap is formed. A part of the sealing space CA is configured. As a result, the surface area (volume) of the sealed space CA increases, and the heat conduction efficiency can be increased. Since the sealing space CA needs to have a thickness of about 100 μm, the fitting portion 152c is preferably provided so as to protrude from the bottom portion 152a by about 100 μm.

  The second member 154 has a convex portion 154a on the LSI 102 side and has a convex cross section. The convex portion 154a of the second member 154 has a height of about 0.5 mm to 2.0 mm. The second member 154 is fitted to the first member 152 such that the convex portion 154a is housed in the hollow portion 152b. In other words, the second member 154 has a function like a lid with respect to the first member 152 to define the sealing space CA and seal the liquid metal 160. Thereby, as will be described later, it is possible to realize a sealing structure for sealing the liquid metal 160 in the sealing space CA with a simple configuration without requiring an advanced processing technique.

  As shown in FIG. 9, the heat spreader 150 has an uneven shape 152d on the surfaces of the first member 152 and the second member 154 forming the sealing space CA (that is, the surface containing the liquid metal 160). By forming 154b, the surface area in contact with the liquid metal 160 described later can be increased, and the heat conduction efficiency can be improved. Here, FIG. 9 is a schematic sectional view of the package module 100 having the heat spreader 150 in which the uneven shapes 152d and 154b are formed.

  The liquid metal 160 is sealed in a sealing space CA formed in cooperation with the LSI 102, the bonding member 140, and the heat spreader 150. The liquid metal 160 is a metal that is liquid at room temperature, such as indium or potassium, for example, and has a function of connecting the LSI 102, the heat spreader 150, and the first member 152 and the second member 154 in the heat spreader 150 with high thermal conductivity. Have

  The liquid metal 160 is completely separated from the package substrate 110 and the outside air (air), and can prevent chemical reactions such as hydroxylation and oxidation due to chemical properties. Thereby, the heat conductivity fall by corrosion of the liquid metal 160 can be prevented, and high heat conductivity can be maintained.

  Further, since the liquid metal 160 has fluidity, it can absorb thermal stress generated by the difference in thermal expansion coefficient between the LSI 102 and the heat spreader 150. In other words, the liquid metal 160 has a function of blocking the thermal stress of the LSI 102. For example, even when the LSI 102 is warped due to the difference in thermal expansion coefficient between the LSI 102 and the package substrate 110, the warping of the heat spreader 150 is not transmitted to the heat spreader 150 by the liquid metal 160 having fluidity. Can be prevented. Further, the liquid metal 160 is not damaged by the warp of the LSI 102, and the thermal connection with the heat spreader 150 (and the heat sink) is maintained.

  The heat sink 190 has a base and cooling fins. The base is a flat plate made of a highly thermally conductive material such as aluminum, copper, aluminum nitride, artificial diamond, or plastic, and is joined to the heat spreader 150. The heat sink 190 is manufactured by sheet metal processing, aluminum die casting, or other methods, and may be formed by, for example, injection molding if it is made of plastic. A cooling fin is comprised from many plate-shaped fins which aligned, for example. The cooling fin has a convex shape and increases the surface area, thereby increasing the heat dissipation effect. However, the shape of the cooling fin is not limited to a plate shape, and an arbitrary arrangement shape such as a pin shape or a curved shape can be adopted. Further, the cooling fins do not have to be aligned horizontally at regular intervals, and may be arranged radially or inclined with respect to the base. The number of cooling fins can also be set arbitrarily. The cooling fin is preferably formed of a highly thermally conductive material such as aluminum, copper, aluminum nitride, artificial diamond, or plastic. The cooling fin is formed by molding, press-fitting, brazing, welding, injection molding, or the like.

  Unlike the heat spreader 1700 having a lid structure in the conventional BGA package 1000 shown in FIG. 12, the package module 100 is not bonded to the package substrate 110. Further, as shown in FIG. 4, since the package module 100 is connected to the LSI 102 and the heat spreader 150 by the joining member 140 and the liquid metal 160, the excellent characteristics of both are obtained while compensating for the weak points of the solid joining and the liquid joining. High thermal conductivity that can be utilized to the maximum. Thereby, as shown in FIGS. 14 and 15, the package module 100 has good thermal and structural characteristics without disconnecting the thermal connection between the LSI and the heat spreader due to peeling of the bonding layer. The joined state can be maintained. For example, in the conventional BGA package, the thermal resistance of the junction is about 0.2 ° C./W, but in the package module 100 of the present embodiment, the thermal resistance of the junction is 1/10 of 0.02 ° C. / The heat transfer efficiency can be improved by reducing to about W. Here, FIG. 4 is a schematic top view of the LSI 102 showing the connection state with the heat spreader 150 in the package module 100 shown in FIG.

  Further, the liquid metal 160 may cause thermal expansion due to heat generated by the LSI 102. The thermally expanded liquid metal 160 presses the LSI 102, the bonding member 140, and the heat spreader 150, and breaks and breaks the thermal connection. In view of this, the package module 100 is provided with a tolerance portion 170 that allows thermal expansion of the liquid metal 160.

  As an example of the allowing part 170, as shown in FIG. 5, it is embodied as a gas (gas layer) 170A sealed in a sealing space CA. Since the gas 170A has elasticity, the thermal expansion of the liquid metal 160 can be buffered. Thereby, the thermally expanded liquid metal 160 can prevent breakage and thermal disconnection due to pressing of the LSI 102, the bonding member 140, and the heat spreader 150. In FIG. 5, the gas 170 </ b> A exists in the vicinity of the fitting portion 152 c of the first member 152, but the gas 170 </ b> A can move in the liquid metal 160, and the heat of the liquid metal 160 Needless to say, the expansion space CA may exist anywhere as long as expansion can be buffered. Here, FIG. 5 is a schematic cross-sectional view of the package module 100 having the allowing portion 170A.

  The gas 170A is made of, for example, nitrogen, argon, helium, etc., which are inert gases. Therefore, even if the gas 170A is sealed in the sealed space CA, a chemical reaction such as oxidation and hydroxylation does not occur in the liquid metal 160, and high thermal conductivity is maintained. In addition, the amount (volume) of the gas 170A required for that is about 3 cc.

  Further, as another example of the allowance portion 170, as shown in FIG. 6, it is embodied as an elastic member 170B provided in the sealing space CA. Since the elastic member 170B has an elastic force, the thermal expansion of the liquid metal 160 can be buffered. Thereby, the thermally expanded liquid metal 160 can prevent breakage and thermal disconnection due to pressing of the LSI 102, the bonding member 140, and the heat spreader 150. In FIG. 6, the elastic member 170B is disposed in the vicinity of the fitting portion 152c of the first member 152. However, as long as the thermal expansion of the liquid metal 160 can be buffered, anywhere in the sealed space CA is present. Needless to say, it may exist. The elastic member 170B is made of, for example, a buffer rubber such as an O-ring or a gel. The elastic member 170B has dimensions of a diameter φ of about 20 mm to 30 mm and a cross section φ of about 0.5 mm to 1.0 mm. In addition, by configuring the elastic member 170B with a halogen-based material, even when it is installed in the sealed space CA, the liquid metal 160 does not undergo oxidation and hydroxylation chemical reactions, and high thermal conductivity is maintained. The Here, FIG. 6 is a schematic cross-sectional view of the package module 100 having the allowance portion 170B.

  Furthermore, as another example of the permissible portion 170, as shown in FIG. 7, it is embodied as an arc-shaped notch 170C provided on the convex portion 154a of the second member 154. The notch 170 </ b> C can buffer the thermal expansion of the liquid metal 160. Thereby, the thermally expanded liquid metal 160 can prevent breakage and thermal disconnection due to pressing of the LSI 102, the bonding member 140, and the heat spreader 150. The notch 170C requires a diameter of about 2 mm to 4 mm. In addition, the concentrated stress due to the liquid metal 160 can be relieved by forming the notches 170 </ b> C at the outer peripheral angles (four corners) of the convex portion 154 a of the second member 154. Here, FIG. 7 is a schematic top view of the LSI 102 showing another connection state between the LSI 102 and the heat spreader 150 shown in FIG.

  On the other hand, the LSI 102 and the package substrate 110 may be deformed (strained) due to thermal stress. When the LSI 102 and the package substrate 110 are deformed, the joining member 140 is peeled off or the heat spreader 150 is damaged, so that the thermal connection is disconnected. Therefore, as shown in FIG. 8, the bottom portion 152a of the first member 152 is formed into a foil plate shape, so that deformation due to thermal stress of the LSI 102 and the package substrate 110 can be dealt with. In other words, by imparting a leaf spring function to the bottom 152a of the first member 152, the deformation of the LSI 102 and the package substrate 110 can be absorbed, and the peeling of the bonding member 140 and the damage of the heat spreader 150 can be prevented. . In order to give the bottom part 152a of the first member 152 the function of the leaf spring, the bottom part 152a is preferably configured with a thickness of 200 μm or more and 1 mm or less. This is because if the thickness of the bottom 152a is smaller than 200 μm, the sealing space CA cannot be sufficiently sealed by the pressure of the liquid metal 160, and if it is larger than 1 mm, the function of a leaf spring cannot be provided. Here, FIG. 8 is a schematic cross-sectional view of the package module 100 showing a state in which the bottom 152a of the first member 152 having the function of a leaf spring absorbs deformation of the LSI 102 and the package substrate 110.

  Furthermore, by configuring the heat spreader 150 from an elastic member, it is possible to cope with thermal expansion of the liquid metal 160 and deformation of the LSI 102 and the package substrate 110 due to thermal stress.

  Up to now, the single-chip package substrate 110 on which one LSI 102 is mounted has been described as an example. However, as shown in FIG. 10, the present invention is a multi-chip type on which a plurality of LSIs 102 are mounted. The package substrate 110A is not excluded. In such a case, the hollow portion 152b of the first member 152 and the convex portion 154a of the second member 154 may be provided according to the plurality of LSIs 102. Here, FIG. 10 is a schematic cross-sectional view of a package module having a multi-chip type package substrate 110A.

  Hereinafter, a manufacturing method 800 of the package module 100 will be described with reference to FIG. Here, FIG. 11 is a flowchart for explaining the manufacturing method 800 of the package module 100 of the present invention.

  First, the LSI 102 is soldered to the package substrate 110 with the bumps 104, and the underfill 106 is filled between the LSI 102 and the package substrate 110 (step 802). Next, the LSI 102 and the first member 152 as the heat spreader 150 are connected via the bonding member 140 (step 804). At this time, the bonding member 140 is provided on the outer periphery of the LSI 102 as described above.

  Next, the liquid metal 160 is injected between the LSI 102 connected in step 804 and the first member 152 (step 806). At this time, the liquid metal 160 in an amount that fills the sealing space CA to be formed (that is, the volume of the sealing space CA) is injected. Then, the second member 154 as the heat spreader 150 is fitted into the first member 152, and the liquid metal 160 injected in step 806 is sealed in the sealing space CA (step 808).

  According to the manufacturing method 800, the package module 100 in which the liquid metal 160 is sealed in the sealing space CA can be manufactured without requiring advanced processing technology such as fine processing technology such as etching. In addition, since the LSI 102, the bonding member 140, and the heat spreader 150 cooperate to form the sealing space CA, the sealing structure does not increase in size and contributes to downsizing of the electronic device 300.

  In operation, the electronic device 300 is inexpensive because it uses the resin package substrate 110, and since it is thin, it can provide high electrical characteristics such as noise. The bonding member 140 and the LSI 102, and the liquid metal 160 sealed in the sealing space CA formed by the bonding member 140 and the heat spreader 150 prevent the thermal connection between the LSI 102 and the heat spreader 150 from being cut by thermal stress. Since high thermal conductivity can be achieved, the heat generated in the LSI 102 is appropriately radiated by the heat sink 190. The cooling fins of the heat sink 190 are cooled by a cooling fan built in the fan module 320. Therefore, the electronic device 300 can maintain the stability of the operation of the LSI 102. In addition, by making the heat spreader 150 into a two-part structure, it is possible to realize a sealing structure that seals the liquid metal 160 while being simple and small.

  Although preferred embodiments of the present invention and variations thereof have been described in detail hereinabove, the present invention is not limited to these embodiments and variations, and is defined by the appended claims. Various modifications and changes can be made without departing from the spirit and scope of the present invention. For example, the electronic device of the present invention is not limited to a rack mount type server but can be applied to a bookshelf type, and is not limited to a server, and is not limited to a personal computer, network device, PDA, or other peripheral device. Is also applicable. The package module of the present invention is also applicable to an LGA package that is connected to a printed circuit board via an LGA (Land Grid Array) socket without soldering. Furthermore, the package module of the present invention can be applied to a heat-generating circuit element that does not function as a CPU, such as a chip set.

100 package module 102 LSI
104 Bump 106 Underfill 108 Circuit component 110 Package substrate 120 BGA
130 Reinforcing metal 140 Joining member 150 Heat spreader 152 First member 154 Second member 160 Liquid metal 170 Allowable portion 190 Heat sink 200 Printed circuit board 300 Electronic device CA Sealing space

Claims (10)

A package structure that can be mounted on an external printed circuit board,
A package substrate having a heat generating circuit element mounted thereon;
A heat spreader that transfers heat from the exothermic circuit element to a heat sink for dissipating the exothermic circuit element;
A sealing member that seals between the heat-generating circuit element and the heat spreader, and forms a sealed space in cooperation with the heat-generating circuit element and the heat spreader;
A liquid metal sealed in the sealing space;
Have
The joining member is made of a material made of copper or aluminum nitride that connects the exothermic circuit element and the heat spreader at the outer periphery of the exothermic circuit element ,
The package structure , wherein the heat spreader has a larger uneven shape on a surface forming the sealing space than a surface connected to the joining member . The heat spreader is
A first member connected to the joining member;
A second member divided from the first member;
The package structure according to claim 1, wherein: The heat spreader is
A first member having a bottom connected to the joining member;
A second member having a convex cross section having a convex portion on the exothermic circuit element side while being fitted to the first member,
The package structure according to claim 1, wherein:   The package structure according to claim 3, wherein the bottom of the first member has a thickness of 200 μm to 1 mm.   The package structure according to claim 1, wherein the heat spreader is formed of an elastic member.   The package structure according to claim 1, wherein the package substrate includes a plurality of the heat generating circuit elements.   The package structure according to claim 1, wherein the package substrate is made of resin. A printed circuit board with a package structure,
The package structure is
A package substrate having a heat generating circuit element mounted thereon;
A heat spreader that transfers heat from the exothermic circuit element to a heat sink for dissipating the exothermic circuit element;
A sealing member that seals between the heat-generating circuit element and the heat spreader, and forms a sealed space in cooperation with the heat-generating circuit element and the heat spreader;
A liquid metal sealed in the sealing space;
Have
The joining member is made of a material made of copper or aluminum nitride that connects the exothermic circuit element and the heat spreader at the outer periphery of the exothermic circuit element ,
The printed board according to claim 1, wherein the heat spreader has a larger uneven shape on a surface forming the sealing space than a surface connected to the bonding member . An electronic device having a printed circuit board mounted with a package structure ,
The package structure is
A package substrate having a heat generating circuit element mounted thereon;
A heat spreader that transfers heat from the exothermic circuit element to a heat sink for dissipating the exothermic circuit element;
A sealing member that seals between the heat-generating circuit element and the heat spreader, and forms a sealed space in cooperation with the heat-generating circuit element and the heat spreader;
A liquid metal sealed in the sealing space;
Have
The joining member is made of a material made of copper or aluminum nitride that connects the exothermic circuit element and the heat spreader at the outer periphery of the exothermic circuit element ,
The electronic apparatus according to claim 1, wherein the heat spreader has a larger uneven shape on a surface forming the sealing space than a surface connected to the bonding member . A heat spreader for transferring heat from a heat generating circuit element mounted on a package substrate to a heat sink for dissipating the heat generating circuit element, the first member being connected to the heat generating element via a joining member When fitted to the first member, on a surface have a second member forming the sealing space, to form the sealed space between the exoergic circuit elements, and the joining member has a heat spreader to have a large unevenness of the connection surfaces, a method for producing a mountable package structure to an external printed circuit board,
And connecting through the joint member consists of said first member and said heat generating resistance circuit elements in the outer periphery of the exothermic circuit element of a material made of copper or aluminum nitride,
Injecting a liquid metal between the exothermic circuit element and the first member connected in the connection step;
And a step of fitting the second member into the first member and sealing the liquid metal injected in the injection step in the sealing space.