JP5038378B2 - 薬液供給装置および薬液供給方法 - Google Patents
薬液供給装置および薬液供給方法 Download PDFInfo
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- JP5038378B2 JP5038378B2 JP2009257828A JP2009257828A JP5038378B2 JP 5038378 B2 JP5038378 B2 JP 5038378B2 JP 2009257828 A JP2009257828 A JP 2009257828A JP 2009257828 A JP2009257828 A JP 2009257828A JP 5038378 B2 JP5038378 B2 JP 5038378B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B13/00—Pumps specially modified to deliver fixed or variable measured quantities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/06—Pumps having fluid drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/08—Machines, pumps, or pumping installations having flexible working members having tubular flexible members
- F04B43/084—Machines, pumps, or pumping installations having flexible working members having tubular flexible members the tubular member being deformed by stretching or distortion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/08—Machines, pumps, or pumping installations having flexible working members having tubular flexible members
- F04B43/10—Pumps having fluid drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/12—Machines, pumps, or pumping installations having flexible working members having peristaltic action
- F04B43/14—Machines, pumps, or pumping installations having flexible working members having peristaltic action having plate-like flexible members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B9/00—Piston machines or pumps characterised by the driving or driven means to or from their working members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Reciprocating Pumps (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Devices For Dispensing Beverages (AREA)
Description
11 吐出ノズル
12 ポンプ
14 ベローズ
14a ダイヤフラム
14b チューブ
14c ピストン
15 ポンプ室
21 吸入流路
22 吐出流路
23 循環流路
24 流入部
25 流出部
26 膨張収縮部
31 流路開閉弁(吸入弁手段)
32 流路開閉弁(吐出弁手段)
33 流路開閉弁(循環弁手段)
34 流路開閉弁(戻し弁手段)
Claims (5)
- ポンプ部材により膨張収縮するポンプ室が設けられたポンプに接続され、薬液容器内の薬液を前記ポンプ室に案内する吸入流路と、
前記ポンプと吐出ノズルとの間に接続され、前記ポンプ室内の薬液を前記吐出ノズルに吐出する吐出流路と、
前記ポンプ室から供給された薬液を一時的に貯留する膨張収縮部が設けられるとともに流入部と流出部とがそれぞれ前記ポンプに接続され、前記ポンプ室から供給された薬液を前記ポンプ室に戻す循環流路とを有し、
前記循環流路を介して前記ポンプ室に戻される薬液を濾過するフィルタを前記循環流路に設け、
前記薬液容器内の薬液の前記循環流路における循環動作と、前記循環流路内の濾過された薬液の前記吐出ノズルへの吐出動作とを前記ポンプにより行うことを特徴とする薬液供給装置。 - 請求項1記載の薬液供給装置において、前記膨張収縮部は弾性変形自在のタンク部材により膨張収縮室を形成するタンクであることを特徴とする薬液供給装置。
- 請求項1または2記載の薬液供給装置において、前記ポンプ室を収縮させて前記ポンプ室内の薬液を前記吐出ノズルに吐出するときに前記吐出流路を開く吐出弁手段と、前記ポンプ室を膨張させて前記薬液容器内の薬液を前記ポンプ室内に案内するときに前記吸入流路を開く吸入弁手段と、前記ポンプ室内の薬液を前記循環流路に供給するときに前記循環流路の前記流入部を開く循環弁手段と、前記フィルタにより濾過された薬液を前記ポンプ室に戻すときに前記循環流路の前記流出部を開く戻し弁手段とを有することを特徴とする薬液供給装置。
- ポンプ内に装着されたポンプ部材により区画されて膨張収縮するポンプ室と薬液容器を接続する吸入流路と、前記ポンプ室から供給された薬液を一時的に貯留する膨張収縮部が設けられるとともに前記ポンプ室から供給された薬液を前記ポンプ室に戻す循環流路と、前記ポンプ室と吐出ノズルを接続する吐出流路とを有し、前記薬液容器内の薬液を前記吐出ノズルに吐出する薬液供給方法であって、
前記吸入流路を開放した状態のもとで前記ポンプ室を膨張させて前記薬液容器内の薬液を前記ポンプ室に案内する吸入工程と、
前記循環流路の流入部を開放した状態のもとで前記ポンプ室を収縮させて前記ポンプ室から供給された薬液をフィルタにより濾過する濾過工程と、
前記循環流路の流出部を開放した状態のもとで前記ポンプ室を膨張させて前記循環流路から戻される濾過された薬液を前記ポンプ室に吸入する戻し工程と、
前記吐出流路を開放した状態のもとで前記ポンプ室を収縮させて前記ポンプ室内の濾過された薬液を前記吐出ノズルに吐出する吐出工程とを有し、
前記薬液容器内の薬液の前記循環流路における循環動作と、前記循環流路内の濾過された薬液の前記吐出ノズルへの吐出動作とを前記ポンプにより行うことを特徴とする薬液供給方法。 - 請求項4記載の薬液供給方法において、前記膨張収縮部は弾性変形自在のタンク部材により膨張収縮室を形成するタンクであることを特徴とする薬液供給方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009257828A JP5038378B2 (ja) | 2009-11-11 | 2009-11-11 | 薬液供給装置および薬液供給方法 |
KR1020127011781A KR20120089712A (ko) | 2009-11-11 | 2010-07-13 | 약액 공급장치 및 약액 공급방법 |
PCT/JP2010/061831 WO2011058792A1 (ja) | 2009-11-11 | 2010-07-13 | 薬液供給装置および薬液供給方法 |
CN201080046913.7A CN102576660B (zh) | 2009-11-11 | 2010-07-13 | 药液供给装置以及药液供给方法 |
US13/505,795 US8728330B2 (en) | 2009-11-11 | 2010-07-13 | Chemical liquid supply device and chemical liquid supply method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009257828A JP5038378B2 (ja) | 2009-11-11 | 2009-11-11 | 薬液供給装置および薬液供給方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011101851A JP2011101851A (ja) | 2011-05-26 |
JP5038378B2 true JP5038378B2 (ja) | 2012-10-03 |
Family
ID=43991456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009257828A Expired - Fee Related JP5038378B2 (ja) | 2009-11-11 | 2009-11-11 | 薬液供給装置および薬液供給方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8728330B2 (ja) |
JP (1) | JP5038378B2 (ja) |
KR (1) | KR20120089712A (ja) |
CN (1) | CN102576660B (ja) |
WO (1) | WO2011058792A1 (ja) |
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TW201206543A (en) * | 2010-03-01 | 2012-02-16 | Fujimi Inc | Liquid filtration method |
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JP5565482B2 (ja) | 2012-02-16 | 2014-08-06 | 東京エレクトロン株式会社 | 液処理方法及びフィルタ内の気体の除去装置 |
JP5741549B2 (ja) * | 2012-10-09 | 2015-07-01 | 東京エレクトロン株式会社 | 処理液供給方法、処理液供給装置及び記憶媒体 |
JP5453561B1 (ja) * | 2012-12-20 | 2014-03-26 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び液処理用記憶媒体 |
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JP6020416B2 (ja) * | 2013-11-01 | 2016-11-02 | 東京エレクトロン株式会社 | 処理液供給装置及び処理液供給方法 |
JP6032190B2 (ja) * | 2013-12-05 | 2016-11-24 | 東京エレクトロン株式会社 | 処理液供給装置、処理液供給方法及び記憶媒体 |
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JP7021913B2 (ja) * | 2017-11-16 | 2022-02-17 | 株式会社ディスコ | 液体供給ユニット |
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KR100985861B1 (ko) * | 2008-09-24 | 2010-10-08 | 씨앤지하이테크 주식회사 | 반도체용 슬러리 공급장치 및 슬러리 공급방법 |
JP5038378B2 (ja) * | 2009-11-11 | 2012-10-03 | 株式会社コガネイ | 薬液供給装置および薬液供給方法 |
-
2009
- 2009-11-11 JP JP2009257828A patent/JP5038378B2/ja not_active Expired - Fee Related
-
2010
- 2010-07-13 US US13/505,795 patent/US8728330B2/en not_active Expired - Fee Related
- 2010-07-13 WO PCT/JP2010/061831 patent/WO2011058792A1/ja active Application Filing
- 2010-07-13 KR KR1020127011781A patent/KR20120089712A/ko not_active Application Discontinuation
- 2010-07-13 CN CN201080046913.7A patent/CN102576660B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011101851A (ja) | 2011-05-26 |
KR20120089712A (ko) | 2012-08-13 |
US20120241469A1 (en) | 2012-09-27 |
CN102576660B (zh) | 2015-07-29 |
CN102576660A (zh) | 2012-07-11 |
US8728330B2 (en) | 2014-05-20 |
WO2011058792A1 (ja) | 2011-05-19 |
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