JP5093651B2 - Work information management system - Google Patents

Description

  The present invention relates to a work information management system that includes an information management device that receives and manages monitoring information from a plurality of monitoring devices that monitor the operation of a plurality of working devices that respectively perform predetermined work. The present invention relates to a system suitable for a case where the apparatus is a polishing apparatus that flattens the surface of an object to be polished such as a semiconductor wafer.

  Since semiconductor wafers are manufactured through a number of manufacturing processes, it is required to proceed these processes efficiently and smoothly under computer management, and various manufacturing methods and systems have been proposed (for example, , See Patent Document 1). In addition, it is conventionally known that a work apparatus such as a polishing apparatus for polishing a semiconductor wafer or the like takes measures such that the operation can be smoothly performed by monitoring the operation thereof (see, for example, Patent Document 2). Conventionally, when trouble occurs in such devices, it is difficult to analyze and take countermeasures at the work site. Therefore, information related to the trouble is sent from the work site to the engineer department, and the engineer department analyzes the information. A procedure is taken to think about a countermeasure method, and this countermeasure method is fed back to the site to take countermeasures.

JP 2004-336024 A JP 2002-219645 A

  However, each time a trouble occurs, sending trouble information from the site to the engineer department and thinking about trouble analysis and countermeasures, it takes time for the analysis and judgment of the countermeasures, and there is a problem that a response delay occurs. is there.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a work information management system that can quickly take a trouble countermeasure at a work site when trouble occurs in a work device.

In order to solve the above-described problem, a work information management system according to the present invention includes a plurality of work devices each performing a predetermined work, and a plurality of work devices provided to the plurality of work devices, respectively, for monitoring the operation of the work devices. A monitoring device; and an information management device that is connected to the plurality of monitoring devices so as to be able to exchange information, and that receives and manages monitoring information from the monitoring device, and each of the plurality of monitoring devices and the information A communication device for exchanging information by connecting to a management device via a communication line, and when the monitoring device finds a trouble in the work device, the trouble information is transmitted to the information management device via the communication device. Configured to send to. In addition, the information management device includes a trouble information database for storing a trouble example in the work device and a method for dealing with the trouble in association with each other, and a specific operation related file relating to the operation unique to the work device, and is transmitted from the monitoring device . Analyzing trouble information to determine whether or not the trouble example stored in the trouble information database, and when there is a trouble example, send the coping method to the monitoring device via the communication device, When there is no corresponding example in the trouble example stored in the trouble information database, the information management device has accessed the specific operation related file and has been transmitted this time from the distributed file group related to the operation of the work device. Search data related to new trouble information, trouble analysis and countermeasures Transmitting said data to a predetermined sector performing seek law, the trouble information database together with the information management apparatus transmits to the working monitoring device via the communication device receiving the Action from the predetermined sector It is configured to store as a new trouble example and a countermeasure method.

In this work information management system, it is preferable that the specific operation related file includes a device setting initial file and a log file related to device operation and operation as the distributed file group.
Further, in this work information system, the predetermined department performs trouble analysis when no trouble example is stored in the trouble example stored in the trouble information database, finds a countermeasure, and sends the analysis result to the information management apparatus. Preferably, the engineering department is a sending-back engineering department, and the engineering department is configured to include means for communicating with the information management apparatus.
Further, in this work information management system, the work device is configured by a plurality of work units, and the predetermined work is performed by combining work by the plurality of work units. An example of a trouble stored in the trouble information database and a method for solving the trouble are configured to monitor each work of the work unit and monitor the presence or absence of a trouble. The trouble contents are preferably stored in association with each other.
Further, in this work information management system, for example, the work device holds an object holding unit that holds an object to be polished, and an object to be polished that holds a polishing pad and is held by the object holding unit. A polishing unit that abuts a polishing pad on a surface and moves the polishing pad relative to the polishing pad, and a dressing unit that performs dressing of the polishing surface of the polishing pad using a dressing tool. The related file preferably includes a unit log file and a polishing log file, which are log files related to device operation and operation, as the distributed file group.

When the work management system has the configuration described in any of the above paragraphs (0007), the specific operation related file is a communication and operator log file, error code file, trouble, and the like as the distributed file group. It is preferable to further have a recording file.

  According to the work information management system configured as described above, when trouble is detected in the work device by the monitoring device, the trouble information transmitted to the information management device via the communication device is transmitted to the information management device. And when a trouble example corresponding to the trouble information database is stored, a coping method is transmitted, so that it is possible to take a quick trouble countermeasure based on this coping method. In addition, when there is no relevant example in the trouble example stored in the trouble information database, the trouble information is analyzed and the outside is requested to take a countermeasure, and the found countermeasure is transmitted via the communication device. Since this is done, it is possible to take measures based on this. In this case, it may be time-consuming for external trouble analysis and preparation of countermeasures. However, since the countermeasure method for the trouble example thus created is newly stored, It is possible to quickly deal with trouble cases.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. First, a case where the work information management system according to the present invention is configured using a CPM apparatus (hereinafter simply referred to as “polishing apparatus 1”) for flatly polishing a semiconductor wafer as a work apparatus will be described as an example. The overall configuration of this work information management system is shown in FIG. 1, and as can be seen from this figure, this system is configured by connecting a host system 500 and a plurality of client systems 700 by a communication network 600. The host system 500 is connected to the engineering department 570 so that information can be exchanged.

  Each client system 700 may be a plurality of CMP apparatuses 1 provided in a single manufacturing factory or a CMP apparatus 1 provided in a plurality of manufacturing factories. For this reason, the communication network 600 may be any of various forms such as an in-house LAN, the Internet, and a dedicated line. Each of the client systems 700 includes a CMP apparatus 1. The CMP apparatus 1 includes a control apparatus 400 that controls the operation and monitors troubles. First, a configuration example of the CMP apparatus 1 will be described. This will be described below with reference to FIGS.

  A CMP apparatus 1 (hereinafter referred to as a polishing apparatus 1) whose overall configuration is shown in plan view in FIG. 3 is a “polishing apparatus” that precisely polishes a semiconductor wafer in a three-stage polishing process. The cassette index unit 100, the wafer cleaning unit 200, the polishing unit 300, and a control device 400 (see FIGS. 4 and 5) for controlling the operation of this polishing apparatus constitute an integrated clean chamber. It is divided into small chambers.

The cassette index unit 100 includes a wafer placement table 120 on which cassettes (also referred to as carriers) C _{1 to} C ₄ holding a plurality of wafers are placed, an aligner mechanism 130 that orients wafer notches or oriental flats in a certain direction, An unprocessed wafer in the cassette is taken out and loaded into the cleaning machine temporary storage table 211 of the cleaning unit 200, and a first transfer robot 150 or the like for storing the processed wafer cleaned by the cleaning unit 200 in the cassette is provided. Yes.

  The first transfer robot 150 is a multi-joint arm type robot having two multi-joint arms. The swivel base 152 is mounted on a base 151 so as to be able to freely rotate horizontally and move up and down. The two articulated arms 153a and 153b attached to the A arm 155a and the B arm 155b (B arm 155b is offset below the A arm 155a, and is attached to the tip of each arm in a telescopic manner. In the upper and lower sides). At the tip of the A arm 155a and the B arm 155b, a holding part that supports and holds the wafer from the back side is formed. The base 151 is provided with a linear moving device, and is configured to be horizontally movable along a linear guide 160 disposed on the floor surface.

  The wafer cleaning unit 200 has a four-chamber configuration of a first cleaning chamber 210, a second cleaning chamber 220, a third cleaning chamber 230, and a drying chamber 240, and a polished wafer is transferred from the first cleaning chamber 210 to the second cleaning chamber. The polishing process liquid (slurry), polishing wear powder, and the like, which are sequentially sent in the order of 220 → third cleaning chamber 230 → drying chamber 240 and adhered to the polishing processing unit 300, are removed and cleaned.

  Although various known methods can be used for the configuration of each cleaning chamber, in this embodiment, ultrasonic cleaning is applied as double-side cleaning with a rotating brush as rough cleaning in the first cleaning chamber 210 and intermediate cleaning in the second cleaning chamber 220. Surface pencil cleaning under shaking, spinner cleaning with pure water as finish cleaning in the third cleaning chamber 230, and drying processing in the drying chamber 240 are performed in a nitrogen atmosphere. The cleaning process is performed on the polished wafer, and the unprocessed wafer passes through the wafer cleaning unit 200 and is carried into the polishing unit 300 via the cleaning machine temporary table 211.

The polishing unit 300 is an area where polishing is performed, and a disk-shaped index table 340 is provided at the center. The index table 340 is equally divided into four sections every 90 degrees, and the wafer rotating device 20 (FIG. 4, FIG. 4) having vacuum suction chuck mechanisms V ₁ , V ₂ , V ₃ , and V ₄ for holding each wafer by vacuum suction. 5) is provided, and the entire table is rotated every 90 degrees by the operation of the built-in stepping motor. Around the index table 340, three polishing stages of a first polishing stage 310, a second polishing stage 320, and a third polishing stage 330 so as to surround from the outer periphery corresponding to the positioning stop position of the table, and vacuum suction A transfer stage 350 is formed in which an unprocessed wafer is carried into the chuck mechanism, and a processed wafer that has been polished is taken out of the vacuum suction chuck mechanism and transferred.

The wafer rotating device 20 provided in the index table 340 includes a rotating table provided with a vacuum chucking mechanism for vacuum-sucking and holding the wafer from the back surface as will be described later, and a wafer that is sucked and held by rotating the rotating table. Are provided with a wafer rotation drive device that rotates the index table 340 at a high speed in a horizontal plane, a chuck cleaning mechanism that supplies pure water to the chuck to wash away the slurry used during polishing, and the like. The chuck diameter of the vacuum chucking mechanism V _{1 to} V ₄ is slightly smaller than the wafer diameter, and the outer peripheral edge of the wafer is moved when the wafer is loaded into or unloaded from the vacuum chucking mechanism. It is configured to be grippable. For this reason, the wafer is loaded onto the chuck mechanism and sucked and held so that it can be rotated at high speed and stopped and held by the wafer rotation driving device.

  Each of the three polishing stages of the first polishing stage 310, the second polishing stage 320, and the third polishing stage 330 has a polishing arm 311 that can swing in the horizontal direction and move up and down in the vertical direction with respect to the index table 340. , 321, 331 are provided. A wafer polishing apparatus having a polishing head that is suspended from the polishing arm and is rotatable at high speed in a horizontal plane is attached to the tip of each polishing arm. A polishing pad for flat polishing is provided.

As shown in FIG. 5, each of the first to third polishing stages 310, 320, and 330 includes a polishing station ST1 that performs chemical mechanical polishing (CMP) on the wafer surface, and a dress station ST2 that performs dressing of the polishing pad. And a measuring station ST3 for measuring the surface profile of the polishing pad. The polishing station ST1 includes vacuum suction chuck mechanisms V ₁ , V ₂ , V ₃ , and V ₄ that are positioned on the first to third polishing stages 310, 320, and 330 according to the index rotation of the index table 340. The dressing station ST2 includes a dressing tool 30 provided in each of the first to third polishing stages 310, 320, and 330, and the measuring station ST3 includes first to third polishing stations ST3. Each of the polishing stages 310, 320, and 330 is provided with a pad shape measuring device 50.

The configuration of each of the stations ST1 to ST3 is shown in FIG. 5 by taking the first polishing stage 310 as an example. The configuration of the first polishing stage 310 will be described as a representative example. The polishing station ST1 is a work station that performs surface polishing of the semiconductor wafer W using the wafer polishing apparatus 10 provided at the lower end of the polishing arm 311. Each section of the index table 340 includes a wafer rotating device 20 including a rotating table 22 on which the wafer W is placed and a rotation driving device 21 that rotates the rotating table 22. The wafer rotating device 20 swings the polishing arm 311. Thus, it is configured to be positioned below the wafer polishing apparatus 10 moved to the polishing station ST1. The rotation drive device 21 receives the control signal from the polishing control unit 71 that constitutes a part of the control device 400 and rotates the turntable 22. A vacuum suction chuck mechanism (V _{1 to} V ₄ ) is provided on the upper surface of the turntable 22, and the semiconductor wafer W is sucked and held on the turntable 22 by this vacuum suction chuck mechanism.

  When performing CMP polishing, the wafer polishing apparatus 10 moves to the polishing station ST1 and is positioned above the wafer rotating apparatus 20 so as to face the rotating table 22 vertically as shown in the figure. The wafer polishing apparatus 10 includes a rotating shaft 11 that extends vertically downward from the lower surface of the front end of the polishing arm 311, and a polishing head 12 that is attached to the lower end of the rotating shaft 11. A disk-like support plate 13 having a polishing pad 15 attached to the lower surface with a double-sided tape or the like is attached to the lower surface of the polishing head 12 by vacuum suction. For this reason, the vacuum suction is released, and the polishing pad 15 can be removed from the polishing head 12 together with the support plate 13 and replaced.

  The polishing pad 15 is made of foamed polyurethane or the like and has a plurality of grooves 15a having a predetermined depth. The shape of the polishing pad 15 is not only a simple disk but also a thin donut with a hole in the center. Etc. are formed. In this embodiment, the polishing pad 15 is a thin donut shape. The rotating shaft 11 of the wafer polishing apparatus 10 is driven by a motor (not shown), and the driving of the motor is controlled by a polishing control unit 71 that constitutes a part of the control device 400. Then, with the polishing pad 15 in contact with the surface of the semiconductor wafer W from above, both the turntable 22 and the wafer polishing apparatus 10 are rotated under the control of the polishing control unit 71, and the wafer polishing apparatus 10. The entire surface of the semiconductor wafer W is polished by the polishing pad 15 by swinging and moving in a horizontal direction with respect to the turntable 22. Note that the position of the wafer polishing apparatus 10, that is, the position where the polishing pad 15 contacts the wafer W can be changed and adjusted.

  The wafer polishing apparatus 10 is configured to be movable to the dressing station ST2. In the dressing station ST2, dressing of the polishing pad 15 attached to the lower surface of the wafer polishing apparatus 10 is performed by the dressing apparatus 30 provided here ( This is referred to as a polishing pad adjusting step). The dressing device 30 includes a dress drive device 31, a drive shaft 32 extending upward from the dress drive device 31, and a disk-shaped dress tool 35 supported on the top of the drive shaft 32 via a gimbal mechanism 33. The dress driving device 31 incorporates a motor that rotationally drives the drive shaft 32 and an actuator that applies a pressing force to the drive shaft 32 in the vertical direction, and a dress control unit 72 that controls the operation of the motor and the actuator. A part of the control device 400).

  The upper surface of the dressing tool 35 is the dressing surface, and the lower surface (pad surface) of the polishing pad 15 of the wafer polishing apparatus 10 that has moved to the dressing station ST2 and the dressing surface of the dressing tool 35 face each other as shown in the figure. . In this state, the driving shaft 32 is moved upward by the dress driving device 31 so that the dress surface of the dressing tool 35 comes into contact with the pad surface of the polishing pad 15, and the actuator is controlled by the dress control unit 72. Thus, the contact force at this time is set to be a predetermined force, the motor is driven, and the dressing tool 35 is rotated. At the same time, the wafer polishing apparatus 10 is also rotated and dressed on the polishing surface of the polishing pad 15 by the dress tool 35.

  The wafer polishing apparatus 10 can be moved from the dressing station ST2 to the measuring station ST3. When dressing (adjustment process) of the pad surface of the polishing pad 15 is performed at the dressing station ST2, the wafer polishing apparatus 10 is moved to the measuring station ST3. Then, the profile of the pad surface is measured to judge whether the polishing pad 15 is good or bad. Therefore, the measurement station ST3 is provided with a pad shape measuring device 50, and the pad shape measuring device 50 measures the profile of the polishing pad.

  The pad shape measuring instrument 50 includes a sensor holding unit 51 and a measurement sensor 52 held by the sensor holding unit 51, and the measurement sensor 52 is moved in a horizontal plane with respect to the sensor holding unit 51 by an internal moving mechanism. The measurement sensor 52 is composed of an optical (that is, non-contact type) displacement sensor including a light emitting element and a light receiving element. Measure distance. Therefore, according to the pad shape measuring instrument 50, the relative height in the region on the pad surface of the polishing pad 15 is calculated, and the profile or the like is measured. In this embodiment, the measurement sensor 52 is an optical displacement sensor. However, this is only an example, and an ultrasonic displacement sensor or the like may be used as long as it is a non-contact type. As long as there is a probe, a probe may be used.

  In order to perform the profile measurement of the polishing pad 15 performed as described above, the measurement control unit 73 (which constitutes a part of the control device 400) is provided. The measurement control unit 73 moves the measurement sensor 52 and A distance measurement is performed. The result measured by the pad shape measuring instrument 50 in this way is sent to the measurement control unit 73 to perform profile measurement and judge whether the polishing pad 15 is good or bad based on the measurement result.

For this reason, for example, when performing the polishing process in the first polishing stage 310, the vacuum suction chuck mechanism V _{4 in which} the polishing arm 311 is swung and the wafer polishing apparatus 10 holds the wafer on the upper surface of the turntable 22 of the polishing station ST1 by suction. The wafer polishing apparatus 10 and the turntable 22 are rotated relative to each other, the polishing arm 311 is lowered, the polishing pad 15 is pressed onto the wafer W, and the polishing arm is supplied while slurry is supplied from the center of the polishing pad 15. By swinging and reciprocating 311, the surface Ws of the wafer W sucked and held on the turntable 22 is polished flat.

  Each polishing stage 310, 320, 330 is equipped with an optical end point detector for detecting the processing state of the wafer being polished, and the reflected light from the wafer surface being polished is detected in real time. Yes.

  The transfer stage 350 is provided with a second transfer robot 360 and a third transfer robot 370 that transfer wafers, and an A temporary placement table 381 and a B temporary placement table 382 that mediate delivery of wafers between these transfer robots. Has been. The second transfer robot 360 is an articulated arm type robot similar to the first transfer robot 150 described above, and is provided with two articulated arms swingably mounted on a turntable 362 that can be horizontally swung and moved up and down. 363a and 363b, and an A arm 365a and a B arm 365b which are attached to the distal ends of the multi-joint arms so as to be extendable and contractable. The A arm 365a and the B arm 365b are arranged so as to be offset in the vertical direction, and a holding portion for supporting the wafer from the back side and holding it by suction is formed at the tip of both arms.

  The third transfer robot 370 is swingable in the horizontal direction with respect to the index table 340 and vertically swingable in the vertical direction, and horizontally swingable with respect to the swing arm at the tip of the swing arm. The rotation arm 372 is attached to the rotation arm 372, and the A clamp 375a and the B clamp 375b are suspended from both ends of the rotation arm 372 and grip the outer peripheral end of the wafer. The A clamp 375a and the B clamp 375b are disposed at the end of the rotation arm at the same distance from the rotation center of the rotation arm 372. The state shown in FIG. 3 shows the standby posture of the third transfer robot 370. A temporary placement table 381 for placing an unprocessed wafer on the lower side of the A clamp 375a and the B clamp 375b in the drawing, and the polishing, respectively. A B temporary placement table 382 on which a processed wafer is placed is provided.

For this reason, the swing arm 371 of the third transfer robot 370 is swung and the swivel arm 372 is swung so that either the A clamp 375a or the B clamp 375b can be used as the vacuum suction chuck mechanism V _{1 of the} index table 340. At this position, the swing arm 371 is lowered, and the wafer on the chuck mechanism is clamped by the A clamp 375a or B clamp 375b to receive it, or a new wafer is mounted on the chuck mechanism. Can be held.

  Since the polishing liquid containing slurry is attached to the wafer after polishing, the polishing apparatus 1 carries out the arm and clamp for loading the wafer W before polishing and the wafer W after polishing. Used separately from the arm and clamp. That is, of the A and B arms offset vertically, the upper A arm 365a is used as a loading arm for the unprocessed wafer W, the lower B arm 365b is used as a loading arm, and the A clamp 375a is loaded. The clamp C and the B clamp 375b are defined and operated as a carry-out clamp.

The control device 400 controls the operation of the polishing device 1 configured as described above based on a preset control program. Then, based on FIG. 4, the structure of the grinding | polishing control apparatus in grinding | polishing station ST1 of the 1st grinding | polishing stage 310 is demonstrated as an example of control by the control apparatus 400. FIG. The turntable 22 is a disc-shaped turntable having substantially the same diameter as the wafer W, and is attached to the upper end of a rotary shaft 21 a extending in the vertical direction of the rotary drive device 21 and held in a substantially horizontal posture. The vacuum suction chuck mechanism V ₄ described above is provided on the upper surface of the turntable 22, and the controller 400 controls the wafer suction mechanism 22 a and operates the chuck mechanism V ₄ to move the wafer W to the turntable 22. It can be detachably attached to the upper surface side. The rotating shaft 21a is driven to rotate about a vertical axis by using a rotation driving device 21 configured to have an electric motor (not shown), and the control device 400 controls the wafer rotating mechanism 21b to rotate. The base 22 can be rotated in a horizontal plane.

  As described above, the polishing head 12 is attached to the lower end portion of the rotating shaft 11 that extends downward from the tip portion of the polishing arm 311. The rotating shaft 11 is driven to rotate around a vertical axis by using a polishing head rotating mechanism 11a configured with an electric motor (not shown), whereby the polishing head 12 is rotated to polish the polishing pad. 15 can be rotated in a horizontal plane. Further, the polishing head 12 is three-dimensionally operated by operating the polishing arm 311 using a polishing head moving mechanism 11b having a plurality of electric motors (not shown), that is, parallel in the vertical and horizontal directions. Can be moved.

The polishing head 12 is formed with a vacuum chamber 12a in which the lower surface of the polishing head 12 is opened, and one end of an air supply passage 18 extending through the rotating shaft 11 and the polishing head 12 communicates with the vacuum chamber 12a. . Note that the other end of the air supply passage 18 (consisting vacuum suction chuck mechanism V ₄ This) pad suction mechanism 18a is connected. On the other hand, the support plate 13 includes a pet portion 13b to which the polishing pad 15 is attached and a carrier portion 13a that holds the pet portion 13b. With the upper surface of the carrier portion 13 a pressed against the lower surface of the polishing head 12, the control device 400 controls the pad suction mechanism 18 a so that the polishing head 12 holds the polishing pad 15 via the support plate 13.

  A space is formed at the center of the polishing pad 15, and a polishing agent supply passage 19 that extends vertically in the wafer polishing apparatus 10 with the polishing pad 15 attached to the polishing head 12 via a support plate 13. Then, an abrasive (polishing liquid) is supplied onto the surface to be polished Ws of the wafer W. The supply of the abrasive is performed by controlling the abrasive supply device 19a by the control device 400.

  When chemical mechanical polishing (CMP) of the wafer W is performed by the polishing apparatus 1 configured as described above, the control apparatus 400 displays various control results by the polishing control unit 71, the dress control unit 72, and the measurement control unit 73. Monitor. For example, the polishing control unit 71 monitors the rotation control content of the wafer W by the wafer rotation mechanism 21b and the rotation control content of the polishing pad 15 by the polishing head rotation mechanism 11b, and the dress control unit 72 performs the dress control by the dress driving device 31. The rotation control content of the tool 35 is monitored, the profile of the polishing pad 15 measured by the measurement control unit 73 is monitored, and the presence or absence of abnormality is monitored. The control device 400 also performs various types of monitoring in the cassette index unit 100, the wafer cleaning unit 200, and the polishing unit 300 constituting the polishing apparatus 1, and if any abnormality or trouble is found during the operation, the abnormality is detected. Alternatively, information regarding the trouble is transmitted to the host system 500 via the communication network 600.

  The internal configuration of the host system 500 is shown in detail in FIG. 2, and this host system 500 is a group of files related to the operation unique to the CMP apparatus (for example, initial file for apparatus setting, log file for communication / unit / operator, error code, etc. CMP-specific operation-related file 510 having a table file, a trouble recording file, a polishing log file, and related files), a trouble handling database 520 storing a trouble example and a coping method for the trouble, and a communication network 600, a trouble analysis application 530 that analyzes the trouble information transmitted via the server 600 and searches for a countermeasure, a trouble registration display 541 that registers a new trouble example and a countermeasure, a trouble analysis result, and a countermeasure Or presents, unit error rate analysis, and a display generating apparatus for generating a result display 542 or the like to and view device performance analysis results (not shown).

  As described above, when an abnormality or trouble in the polishing operation is discovered by the control device 400 and information related to the abnormality or trouble is transmitted to the host system 500 via the communication network 600, the trouble analysis application 530 first causes a trouble. The coping database 520 is accessed, and it is searched whether or not a trouble example identical or similar to the trouble found this time is registered and stored in the database 520. If the same or similar trouble example is registered as a result of the search, a result display 542 for displaying the search result, that is, a troubleshooting method, a unit error occurrence rate analysis result related to the trouble, and a device performance analysis result is displayed. The information of the result display 542 is transmitted to the control device 400 of the client system 700 from which the trouble information has been transmitted via the communication network 600.

  Although not shown, the client system 700 is provided with a display device (for example, a computer display) that displays the result display 542 transmitted in this way. On the client system 700 side, the result displayed on the display device is provided. By looking at the display 542, it is possible to perform an appropriate and quick trouble handling process.

  On the other hand, as a result of the trouble analysis application 530 accessing the trouble handling database 520 and performing a search, if a trouble example that is the same as or similar to the trouble found this time is not found in the database 520, the CMP-specific operation related file 510 To retrieve data related to the trouble information transmitted this time from a group of distributed files (data) related to the operation of the CMP apparatus, and search for trouble analysis and countermeasures. At this time, the trouble information is sent to the engineering department 570, the trouble is analyzed in the engineering department 570, a coping method is found, and the analysis result is sent back to the host system 500.

  The trouble coping method found in this way includes a new trouble example and coping method in the trouble coping database 520 by the trouble analysis application 530 together with trouble case information associated with the operation file data of the CMP apparatus related to the trouble example. Is newly registered. The newly registered information is transmitted as a new trouble registration display 541 to the control device 400 of the client system 700 from which the trouble information has been transmitted via the communication network 600. On the client system 700 side, an appropriate and quick trouble handling process can be performed by looking at the new trouble registration display 542 displayed on the display device.

  Thus, when a new trouble that is not registered in the trouble handling database 520 occurs, for example, the engineering department 570 needs to analyze the trouble and find a trouble dealing method. However, since the new troubleshooting method created in this way is newly registered in the troubleshooting database 520 in the host system 500, not only the client system 700 to which the troubleshooting information has been transmitted thereafter but also other methods. When a similar trouble occurs in the client system 700, a trouble processing method corresponding to this trouble example can be found easily and quickly from the trouble processing database 520, and a quick and accurate trouble response can be taken.

It is a block diagram which shows the whole structure of the work management system which concerns on this invention. It is a block diagram which shows the structure of the host system 500 which comprises this work management system. It is a top view which shows the whole structure of the grinding | polishing apparatus used as the management object of the said work management system. It is a block diagram which shows the structure of grinding | polishing station ST1 of the 1st grinding | polishing stage 310 in the said grinding | polishing apparatus. It is a schematic explanatory drawing which shows the structure of the 1st grinding | polishing stage 310 in the said grinding | polishing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Polishing device W Wafer 10 Wafer polishing device 12 Polishing head 15 Polishing pad 20 Wafer rotation device 30 Dressing device 31 Dressing drive device 35 Dressing tool 300 Polishing part 400 Control device 500 Host system 510 CMP specific operation related file 520 Trouble handling database 530 Trouble Analysis application 570 Engineering department 600 Communication network 700 Client system

Claims (6)

A plurality of work devices that perform predetermined work; a plurality of monitoring devices that are provided in each of the plurality of work devices and that monitor the operation of the work devices; and are connected to the plurality of monitoring devices in an exchangeable manner, and the monitoring A work information management system comprising an information management device for receiving and managing monitoring information from the device,
A communication device for exchanging information by connecting each of the plurality of monitoring devices to the information management device via a communication line, and when trouble is found in the work device by the monitoring device, Configured to transmit to the information management device via the communication device;
The information management device comprises a trouble information database for associating and storing trouble examples in the work device and methods for dealing with them, and a specific operation related file relating to the operation specific to the work device, and analyzing the trouble information transmitted from the monitoring device To determine whether or not the trouble example stored in the trouble information database, and when there is a corresponding trouble example, send the coping method to the monitoring device via the communication device,
When there is no corresponding example in the trouble examples stored in the trouble information database,
The information management device accesses the specific operation related file, searches data related to the new trouble information transmitted this time from the distributed file group related to the operation of the work device, and searches for trouble analysis and a countermeasure method. Send the data to the designated department to perform,
The information management device is configured to receive the coping method from the predetermined department , transmit it to the monitoring device via the communication device, and store a new trouble example and a coping method in the trouble information database. A work information management system characterized by that. The work information management system according to claim 1, wherein the specific operation related file includes an initial file for device setting and a log file related to device operation and operation as the distributed file group . The predetermined department is an engineering department that performs trouble analysis and finds a coping method when there is no corresponding example in the trouble examples stored in the trouble information database, and sends back the analysis result to the information management apparatus, The work information management system according to claim 1 or 2, wherein the engineering department is configured to include means for communicating with the information management apparatus . The work device includes a plurality of work units, and the predetermined work is performed by combining work by the plurality of work units. The monitoring device monitors each work of the plurality of work units. Is configured to monitor for trouble,
Trouble Examples and workarounds stored in the trouble information database, any of claims 1 to 3, characterized in that it is stored in association with the plurality of working units and the trouble contents constituting the work device work information management system according to any. The working device holds an object holding unit for holding an object to be polished, and holds the polishing pad and moves the polishing pad in contact with the surface to be polished of the object to be polished held by the object holding unit. A polishing unit that polishes the surface to be polished, and a dressing unit that dresses the polishing surface of the polishing pad using a dressing tool, and the specific operation related file operates as the distributed file group. and work information management system according to any one of claims 1 to 4, characterized in that it comprises a unit log file and polishing log file is associated log file on the operation. 6. The work information management system according to claim 2, wherein the specific operation related file further includes a communication and operator log file, an error code file, and a trouble recording file as the distributed file group. .

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