JP5087354B2 - Clean container manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a clean container with an IC tag that is filled with a chemical, a high-purity solvent, and the like and molded from a high-purity resin composition used for storage or transportation.

  Clean containers used for storage, transportation and storage filled with industrial chemicals such as semiconductor and liquid crystal manufacturing chemicals, pharmaceutical-related chemicals, and solutions of high-purity solvents are made of metal and glass, so they have excellent chemical resistance. At the same time, it has been replaced by a container made of a resin composition with little damage. There is a blow molding method as a typical production method for molding a container from this resin composition.

  In the blow molding method, the resin composition is melted, formed into a cylinder, formed by air blowing in a molding die, cooled and molded into a container. In this method, a similar container can be produced as long as conditions such as properties of the resin composition, processing temperature, processing speed, or external environment do not change.

  In particular, it is important to keep the quality of a clean container filled with chemicals or the like constant so that foreign substances do not enter the solution from the container. Therefore, product lots are determined based on the lot number of the raw material, the production date and time, etc., and the production information is managed based on the lot number that assumes the same quality within the same lot. For example, when a defect occurs in a manufactured container, a defect may occur in a container having the same lot number, and therefore the range where the defect occurs can be specified from the lot number.

  The lot number is displayed on the container by a seal or a stamp by molding. However, the seal may peel off and fall off. For this reason, it is common to display on a container by the marking by shaping | molding. For example, Patent Document 1 discloses an in-mold detachable marking device that is mounted in a molding die and stamps a lot number or the like.

  The types of chemicals used to manufacture semiconductors and liquid crystals are constantly increasing. Since there are many types, there are accidents in which chemicals and the like are erroneously sent to semiconductor manufacturing equipment. For this reason, reliable recording of solution information in a clean container is highly desired. However, the number of characters that can be engraved is limited. Even if the number of characters that can be engraved is increased, the molding apparatus must be stopped when changing the information on the engraved chemicals.

  In recent years, solution information or the like is written on a non-contact type IC tag and attached to a container. For example, Patent Document 2 discloses a packaging material with a non-contact type IC chip in which a non-contact type IC chip (IC tag) is embedded in a container. Such an IC tag has a remarkably large amount of information that can be stored compared to the amount of information of stamped characters. Further, information can be added and changed even after the IC tag is molded.

JP 2006-335010 A Japanese Patent Laid-Open No. 2003-26225

  In the marking by the lot pin (the marking device) disclosed in Patent Document 1, it is necessary to stop the molding device every time the lot number changes. The amount of information that can be described is also small.

  The conventional container with an IC tag disclosed in Patent Document 2 does not need to stop the molding apparatus and has a large amount of information that can be recorded, but has the following problems. That is, when the molding apparatus is installed in the outside air, dust and chemical substances in the air are mixed into the raw material of the container main body and the lid, and the component purity of the molded container is deteriorated. For this reason, the cleanliness of the solution filled in the container is deteriorated. Further, when the IC tag is integrated into the container, impurities are mixed into the container raw material from the portion of the IC tag that contacts the container, and the component purity of the container deteriorates. For this reason, the cleanliness of the solution filled in the container is deteriorated.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a clean container manufacturing method capable of integrating an IC tag with a clean container without deteriorating the component purity of the clean container. .

The method for producing a clean container according to claim 1, which has been made to achieve the above object, is added in a clean room having an air cleanliness measured in accordance with JIS B 9920 of class 7 or less. In the process of molding and processing a polyolefin resin composition or polyethylene terephthalate resin composition having no purity and at least 99% purity into a container, an integrated circuit that processes and stores data and a non-connected data connected to the integrated circuit An IC tag comprising a transmission / reception antenna that transmits and receives by contact, and is entirely coated with a polyolefin-based resin composition or polyethylene terephthalate resin composition that is polyethylene or polypropylene with no additives and a purity of at least 99% , integrated into the container by in-mold molding, or insert molding And wherein the door.

The method for manufacturing a clean container according to claim 2 is the method according to claim 1, wherein the IC tag is configured to be entirely covered with the same polyolefin-based resin composition as the container. And

Method for producing a clean container according to claim 3, claim 1 or has been described in 2, wherein the container is made from the container body and lid, integrating the IC tag to the container body and / or lid It is characterized by doing.

  According to the method for manufacturing a clean container according to claim 1, a polyolefin resin composition having a purity of at least 99% with no additive added in a clean room having an air cleanliness measured in accordance with JIS B 9920 of class 7 or less. In the process of molding an object into a container, the IC tag is integrated into the container. Thereby, the IC tag can be integrated without impurities such as dust and chemical substances in the air being mixed into the container, and deterioration of the component purity of the clean container can be prevented.

The IC tag is entirely coated with a polyolefin resin composition or polyethylene terephthalate resin composition which is polyethylene or polypropylene having no additive and a purity of at least 99% . Thereby, impurities from the IC tag are not mixed into the container raw material. For this reason, deterioration of the component purity of the clean container can be reliably prevented.

The IC tag is integrated into the container by in-mold molding or insert molding. Thereby, an IC tag can be integrated in arbitrary positions, such as the inside of a container wall, or a wall surface.

The container may be from the container body and lid, when integrating the IC tag to the container body and / or lid, for example, the shape of the container body and the lid, the size, or by the management situation of container information, integrated IC tags The target to be converted can be arbitrarily selected. For example, when manufacturing information needs to be managed for each of the container body and the lid, the IC tag can be integrated and managed for each.

Preferred form for carrying out the invention

  Hereinafter, preferred embodiments of the present invention will be described in detail, but the scope of the present invention is not limited to these embodiments.

  As shown in FIG. 1, a clean container manufactured by applying the present invention includes, for example, a container main body 1 and a lid 2 that can be attached to and detached from the input / output port of the container main body 1.

  As shown in FIG. 1, an IC tag 4 is attached to the container body 1 integrally with a cylindrical body.

  FIG. 2 shows an example in which the IC tag 4 is attached to the body portion of the container body 1. FIG. 2A shows an example in which the IC tag 4 is integrated so as to coincide with the outer wall surface of the container body 1. FIG. 2B shows an example in which the container body 1 is embedded and integrated in the wall. FIG. 2C shows an example in which the container body 1 is integrated so as to coincide with the inner wall surface of the container body 1. In any state shown in FIGS. 2A, 2B, and 2C, the IC tag 4 can wirelessly communicate with the transmission / reception unit 32 in a non-contact manner.

  As shown in FIG. 3, the IC tag 4 includes an integrated circuit 20 that processes and stores data, and a transmission / reception antenna 21 that is connected to the integrated circuit 20 and transmits and receives data in a contactless manner. The whole is covered with a polyolefin-based resin composition having no additive and having a purity of at least 99%, similar to that of the lid 2. As shown in FIGS. 2 (a) and 2 (c), the IC tag 4 is formed in a flexible thin label shape when integrated with the outer wall surface or inner wall surface of the container body 1. Is done. Moreover, as shown in FIG.2 (b), when it embeds inside the wall of the container main body 1, since flexibility is not required, you may form thickly.

  The container body 1 and the lid 2 are molded in a clean room in which the air cleanliness measured based on JIS B 9920 is maintained at class 7 or lower. For this reason, foreign materials such as dust and chemicals in the air do not enter the raw material.

  Both the container body 1 and the lid 2 are molded using as a raw material a polyolefin resin composition having a purity of at least 99% without additives such as antioxidants, lubricants, antiblocking agents, and antistatic agents. The

  As typical examples of the polyolefin resin composition, polyethylene, polypropylene, or polyethylene terephthalate is well known. In particular, it is preferable to use polyethylene resin for the container body 1 and the lid 2 used for semiconductors and liquid crystal manufacturing chemicals. In the production of semiconductors and liquid crystals, particularly high-purity chemicals are used. This is because polyethylene resin has high chemical stability and less elution of impurities into chemicals.

  The container body 1 is blow molded by a blow molding device in a clean room. The IC tag 4 is integrated with the container body 1 in the process of blow molding.

  As shown in FIGS. 2 (a) and 2 (c), when integrated with the outer wall surface or the inner wall surface of the container body 1, a label-like IC is formed on the inner wall of the mold of the blow molding device before the raw material is injected. Tag 4 is inserted. Thereby, the IC tag 4 is integrally molded and attached to the wall surface of the container body 1 by in-mold molding.

As shown in FIG. 2 (b), in the case of integrating the inside of the wall of the container main body 1, it was covered with the same kind of material as the container raw material in the mold of the blow molding device before the raw material injection . A card-like IC tag 4 is inserted. As a result, the IC tag 4 is integrated inside the wall of the container body 1 by insert molding.

  Since the IC tag 4 is entirely covered with a polyolefin resin composition of the same level as that of a clean container, impurities are not mixed into the container body 1 from the IC tag 4. For this reason, the component purity of the container main body 1 does not deteriorate. As shown in FIG. 2 (c), when the IC tag 4 is molded on the inner surface of the container body 1, the IC tag 4 is entirely covered with a high-purity polyolefin resin composition without additives. Therefore, impurities are not mixed into the solution from the IC tag 4.

  As the composition for covering the IC tag 4, it is most preferable to use the same composition as the composition for molding the container body 1. For example, when the container body 1 is molded from polyethylene, it is preferable to coat the IC tag 4 with the same polyethylene. By using the same composition, mixing of different polyolefin resin components into the container body 1 is prevented. Moreover, since it is the same composition, it does not deviate after molding.

  Even if the composition for molding the container body 1 and the composition for covering the IC tag 4 are different, the polyolefin resin has high chemical stability, so the purity of the container body 1 is hardly deteriorated. Preferred combinations are shown below. When the container body 1 is polyethylene, the IC tag 4 is Polypropylene, 2. It is preferable to combine in the order of polyethylene terephthalate. When the container body 1 is polypropylene, the IC tag 4 is Polyethylene, 2. It is preferable to combine in the order of polyethylene terephthalate. When the container body 1 is polyethylene terephthalate, the IC tag 4 is Polyethylene, 2. It is preferable to combine in the order of polypropylene.

  The lid 2 is injection molded by an injection molding apparatus.

  Manufacturing information such as a lot number of a clean container is recorded in the IC tag 4 before or after being embedded in the container body 1. In addition, when the solution to be filled in the clean container is determined in advance, the solution information such as the type of the solution can be recorded together with the production information.

  In the above-described embodiment, the example in which the IC tag 4 is integrated with the container body 1 has been described. However, the IC tag 4 may be integrated with the lid 2 as shown in FIG.

  The lid 2 is injection molded by an injection molding apparatus in a clean room. The IC tag 4 is integrated with the lid 2 during the injection molding process. Similarly to the integration into the main body container 1, the IC tag 4 can be integrated with, for example, the outer wall surface, the inside, or the inner wall surface of the top surface portion of the lid 2.

  When integrating with the outer wall surface or the inner wall surface of the lid 2, the label-like IC tag 4 is inserted into the inner wall of the mold of the injection molding apparatus before the raw material is injected. Thereby, the IC tag 4 is integrally molded on the wall surface of the lid 2 by in-mold molding.

  In the case of integrating the inside of the wall of the lid 2, the IC tag 4 is inserted into the mold of the injection molding apparatus before the raw material is injected. Thereby, the IC tag 4 is integrally formed inside the wall of the lid 2 by insert molding.

  Since the IC tag 4 is coated with a high-purity polyolefin resin composition without additives, impurities are not mixed into the lid 2 from the IC tag 4. For this reason, the component purity of the lid 2 does not deteriorate. Moreover, even if it is integrated with the inner wall surface of the lid 2, no impurities are mixed into the solution.

  Thus, according to the above-described method for producing a clean container, a polyolefin resin composition having a purity of at least 99% with no additive added in a clean room having an air cleanliness measured in accordance with JIS B 9920 of class 7 or lower. The IC tag 4 is integrated with the container body 1 or the lid 2 in the process of molding the object into the container. Thereby, the IC tag 4 can be integrally formed without mixing impurities such as dust and chemicals in the air into the clean container, and deterioration of the component purity of the clean container can be prevented. Further, since manufacturing information of the container body 1 and / or the lid 2 such as a lot number can be recorded on the IC tag 4 before or after molding, it is not necessary to stop the molding apparatus even when the manufacturing information is changed. Since a lot of information can be recorded on the IC tag 4, solution information such as the type of solution to be filled can be recorded in addition to the manufacturing information. Further, solution information such as a production lot of the solution for filling the solution in the clean container, the production date of the solution, or the expiration date of the solution can be additionally recorded. Furthermore, other arbitrary information can be recorded.

  In addition, according to this method for manufacturing a clean container, the IC tag 4 is covered with a polyolefin resin similar to that of the clean container. Thereby, impurities from the IC tag 4 are not mixed into the raw material of the container body 1 and the lid 2. For this reason, deterioration of the component purity of the clean container can be reliably prevented.

  Further, according to this method for manufacturing a clean container, the IC tag 4 is integrated with the container body 1 and / or the lid 2 by in-mold molding or insert molding. Thereby, the IC tag 4 can be integrated at an arbitrary position such as the inside of the wall of the container body 1 or the lid 2 (inside the container structure) or the outer wall surface or the inner wall surface of the container body 1 or the lid 2.

  Further, according to this clean container manufacturing method, the clean container is composed of the container body 1 and the lid 2, and the IC tag 4 is integrated with the container body 1 and / or the lid 2. Accordingly, for example, when the container body 1 has a complicated shape and the IC tag 4 cannot be integrated, the object to be integrated with the IC tag 4 in the shape and size of the container, such as being integrated with the lid 2. You can choose arbitrarily. In addition, for example, when manufacturing information needs to be managed for each of the container body 1 and the lid 2, the IC tag 4 is integrated with the management status of the information, such as attaching and managing the IC tag 4 to each. You can choose arbitrarily.

  Next, a usage example of a clean container manufactured by applying the present invention will be described. Hereinafter, the same reference numerals are given to the same components as those already described, and the description thereof will be omitted.

  FIG. 5 shows a clean container (container body 1), a liquid feeding section 30 for feeding a solution from the clean container, and a transmission / reception section 32.

  It is assumed that the clean container is filled with a solution, and the IC tag 4 is recorded with solution information indicating the type of the solution when the clean container is manufactured or when the solution is filled.

  The liquid feeding unit 30 sends the solution filled in the clean container to, for example, a semiconductor manufacturing device (not shown). An IC tag 31 having the same function as the IC tag 4 is attached to the liquid feeding unit 30. The IC tag 31 stores solution information indicating the type of solution to be fed from the liquid feeding unit 30.

  The transmission / reception unit 32 is disposed at a position where it can wirelessly communicate with both the IC tag 4 of the clean container and the IC tag 31 of the liquid feeding unit 30. The transmission / reception unit 32 is connected to a liquid supply control unit (not shown).

  When the clean container is set in the liquid feeding unit 30, the transmitting / receiving unit 32 reads the solution information recorded in the IC tag 4 of the clean container before starting the liquid feeding. Further, the transmission / reception unit 32 reads the solution information recorded in the IC tag 31 of the liquid feeding unit 30. The liquid feeding control unit causes the liquid feeding unit 30 to start liquid feeding when the solution information of the clean container read by the transmission / reception unit 32 and the solution information of the liquid feeding unit 30 match each other. If the solution information does not match each other, the solution is not sent. For this reason, even when a clean container filled with a solution different from the solution to be fed is set in the liquid feeding unit 30, liquid feeding is not started, and erroneous liquid feeding can be reliably prevented. .

  Further, by recording the expiration date of the solution in the IC tag 4 of the clean container, it is possible to reliably prevent the use of the expired solution.

  In this case, it is preferable that a device for automatically removing the lid 2 of the clean container is attached to the transmission / reception unit 32. In this case, even if the IC tag 4 is integrated with the lid 2, the lid 2 is automatically removed when the transmitter / receiver 32 starts liquid feeding after communication.

  Next, another use example of the clean container manufactured by applying the present invention will be described with reference to FIG.

  FIG. 6 shows a conveyance path 35 that automatically conveys a clean container filled with a solution, for example, in a conveyance zone. The conveyance path 35 is branched into three branch paths at a branch point 36. A liquid feeding unit 30 is disposed at each end of the branch path. Each of the liquid feeding sections 30 feeds different solutions.

  A transmission / reception unit 32 is installed in front of the branch point 36 of the conveyance path 35. The transmission / reception unit 32 is connected to a branch control unit (not shown). The branch control unit selects a branch so that the clean container follows any branch path at the branch point.

  In the IC tag 4 of the clean container, solution information indicating the type of solution that is filled is recorded. When this clean container is transported in the transport path 35 and reaches the transmission / reception unit 32, the transmission / reception unit 32 wirelessly communicates with the IC tag 4 and reads the solution information of the clean container. Based on the read solution information, the branch control unit selects a branch path connected to the liquid feeding unit 30 to which the solution in the clean container is to be fed. For this reason, it is possible to reliably prevent the clean container from being transported to the correct branch path at the branch point 36 and transported to the wrong branch path. Thereby, erroneous liquid feeding can also be reliably prevented.

  Although the example in which the IC tag 4 is integrated with the cylindrical wall of the container body 1 has been described, the IC tag 4 may be integrated with the bottom surface of the container body 1. The shape of the container body 1 may be any shape such as a rectangular tube shape or a box shape. Moreover, although the example in which the IC tag 4 is integrated with the top surface portion of the lid 2 has been described, for example, when the shape of the lid 2 is large, it may be integrated with the cylindrical portion of the lid 2. Further, the outer shape of the lid 2 may be square.

It is a perspective view which shows the clean container manufactured by applying this invention. It is an expanded sectional view which shows the trunk | drum of the clean container manufactured by applying this invention. It is a top view which shows the IC tag which comprises a clean container. It is a perspective view which shows another clean container manufactured by applying this invention. It is the schematic which shows the usage method of the clean container manufactured by applying this invention. It is the schematic which shows another usage method of the clean container manufactured by applying this invention.

Explanation of symbols

  1 is a container body, 2 is a lid, 4 and 31 are IC tags, 20 is an integrated circuit, 21 is a transmission / reception antenna, 30 is a liquid feeding unit, 32 is a transmission / reception unit, 35 is a transport path, and 36 is a branch point.

Claims (3)

Process of molding a polyolefin-based resin composition or a polyethylene terephthalate resin composition having a purity of at least 99% with no additive added into a container in a clean room with an air cleanliness measured in accordance with JIS B 9920 of class 7 or lower so,
Polyolefin resin composition comprising an integrated circuit for processing and storing data and a transmission / reception antenna connected to the integrated circuit for transmitting and receiving the data in a non-contact manner, and having no additive and having a purity of at least 99% polyethylene or polypropylene Or an IC tag that is entirely covered with a polyethylene terephthalate resin composition ,
A method for producing a clean container, which is integrated into a container by in-mold molding or insert molding . The method of manufacturing a clean container according to claim 1, wherein the IC tag is configured to be entirely covered with the same resin composition as the container. The method for producing a clean container according to claim 1 or 2, wherein the container comprises a container body and a lid, and the IC tag is integrated with the container body or / and the lid.

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